CN117457567B

CN117457567B - Wafer waxless polishing feeding equipment and flexible sucker thereof

Info

Publication number: CN117457567B
Application number: CN202311780495.XA
Authority: CN
Inventors: 蒋继乐; 寇明虎; 高超; 黄少华
Original assignee: Beijing Tesidi Semiconductor Equipment Co ltd
Current assignee: Beijing Tesidi Semiconductor Equipment Co ltd
Priority date: 2023-12-22
Filing date: 2023-12-22
Publication date: 2024-03-01
Anticipated expiration: 2043-12-22
Also published as: CN117457567A

Abstract

The application discloses a wafer waxless polishing feeding device and a flexible sucker thereof, wherein the flexible sucker comprises a flexible framework and a flexible sealing flaring piece; the flexible framework is fixedly arranged on the outer side of the flexible sealing flaring piece to support the flexible sealing flaring piece, the rigidity of the flexible sealing flaring piece is smaller than the rigidity of the flexible framework and the rigidity of the wafer, the composite rigidity of the flexible sealing flaring piece and the flexible framework is smaller than the rigidity of the wafer, when the wafer is attached to the wax-free pad of the ceramic disc, the lower pressure applied to the flexible framework acts on the wafer through the flexible sealing flaring piece so as to press the wafer on the wax-free pad, and then the flexible sucker is driven to drive the wafer to rotate so as to press out bubbles between the wafer and the wax-free pad. The invention solves the problems that in the related art, the manual operation of attaching the wafer to the ceramic disc has lower efficiency, and bubbles exist between the wafer and the ceramic disc, so that the wafer cannot be tightly and stably attached to the ceramic disc, and further the subsequent polishing operation is affected.

Description

Wafer waxless polishing feeding equipment and flexible sucker thereof

Technical Field

The application relates to the technical field of wafer processing, in particular to a wafer waxless polishing feeding device and a flexible sucker thereof.

Background

In the process of processing semiconductor materials, silicon chips, sapphire, silicon carbide and gallium arsenide are used as base materials of commonly used semiconductor devices and wafers, and in the process of manufacturing semiconductor devices, polishing treatment is required to be carried out on the wafers in a plurality of procedures, and the quality of the polishing technology directly influences the quality of the surfaces of the wafers and the performances of the semiconductor devices. At present, the wax-free polishing technology is to attach the wafer to the ceramic disc through water, and then send the ceramic disc attached with the wafer into a polishing machine for polishing.

In carrying out the present application, the inventors have found that the prior art has at least the following drawbacks:

in the prior art, the wafer is attached to the ceramic disc for manual operation, the efficiency is low, and bubbles exist between the wafer and the ceramic disc, so that the wafer cannot be tightly and stably attached to the ceramic disc, and further the follow-up polishing operation is affected.

Disclosure of Invention

The main aim of the application is to provide a no wax polishing feeding equipment of wafer and flexible sucking disc thereof to solve among the correlation technique with the manual operation of wafer laminating on ceramic dish, the inefficiency, and there is the bubble between wafer and the ceramic dish, lead to the unable inseparable laminating of wafer on ceramic dish steadily, and then influence the problem of follow-up polishing operation.

In order to achieve the above-mentioned purpose, the application provides a flexible sucking disc of wafer no wax polishing feeding equipment, includes: a flexible backbone and a flexible seal flare; wherein,

the flexible framework is fixedly arranged on the outer side of the flexible sealing flaring piece to support the flexible sealing flaring piece, and the inner side of the flexible sealing flaring piece is used for contacting a wafer and adsorbing the wafer under the negative pressure;

the rigidity of the flexible sealing flaring piece is smaller than the rigidity of the flexible framework and the rigidity of the wafer, the combined rigidity of the flexible sealing flaring piece and the flexible framework is smaller than the rigidity of the wafer, when the wafer is attached to the wax-free pad of the ceramic disc, the lower pressure applied to the flexible framework acts on the wafer through the flexible sealing flaring piece so as to press the wafer on the wax-free pad, and then the flexible sucker is driven to drive the wafer to rotate so as to press out air bubbles between the wafer and the wax-free pad.

Further, the relationship between the stiffness of the flexible seal flare, the stiffness of the flexible backbone, and the resultant stiffness is as follows:

；

wherein,for the purpose of synthetic stiffness->Rigidity of flaring for flexible seal, +.> ₁ Poisson's ratio for flexible seal flare, +. > ₁ For flexible sealing the material thickness of the flaring> ₁ For the elastic modulus of the flexible sealing flare, +.> ₁ An outer diameter of the flaring member being a flexible seal;

is the rigidity of the flexible framework-> ₂ Poisson's ratio for flexible skeleton, +.> ₂ Is the material thickness of the flexible framework-> ₂ Is the elastic modulus of the flexible framework +.> ₂ Is the outer diameter of the flexible framework.

Further, the total rigidity of the flexible sucker is the sum of the rigidity of the gas enclosed in the flexible sealing flaring piece when the flexible sealing flaring piece adsorbs the wafer and the synthetic rigidity, and the total rigidity of the flexible sucker is smaller than the rigidity of the wafer.

Further, the rigidity of the gas enclosed in the flexible sealing flaring piece when the flexible sealing flaring piece adsorbs the waferThe method comprises the following steps:

；

the total rigidity of the flexible sucker is as follows:；

wherein R is a thermodynamic constant, n is the molecular number of the gas,temperature of gas, +.>Is the height of the gas; />Is the total rigidity of the flexible sucker.

Further, when the wafer is attached to the wax-free pad of the ceramic disc, the total rigidity of the flexible sucker is smaller than the rigidity of the wafer under the action of the downward pressure.

Further, the diameter of the open end of the flexible skeleton is smaller than that of the open end of the flexible sealing flaring piece.

Further, the thickness of the edge of the flexible framework gradually decreases from inside to outside.

Further, the outer edge of the flexible skeleton is tilted towards the direction away from the flexible sealing flaring piece, so that a distance is formed between the outer edge of the flexible skeleton and the flexible sealing flaring piece.

Further, the flexible sucker further comprises a shell and a negative pressure air passage, wherein the negative pressure air passage is arranged in the shell, and the flexible framework and the flexible sealing flaring piece are arranged at the lower end of the shell;

the first end of the negative pressure air passage is communicated with a negative pressure air source through the air passage, and the second end of the negative pressure air passage is communicated with the flexible sealing flaring piece.

According to another aspect of the present application, a wafer wax-free polishing feeding device is provided, including the flexible sucker described above.

In the embodiment of the application, the flexible framework and the flexible sealing flaring piece are arranged; the flexible framework is fixedly arranged on the outer side of the flexible sealing flaring piece to support the flexible sealing flaring piece, and the inner side of the flexible sealing flaring piece is used for contacting the wafer and adsorbing the wafer under the negative pressure; the rigidity of the flexible sealing flaring piece is smaller than the rigidity of the flexible framework and the rigidity of the wafer, the composite rigidity of the flexible sealing flaring piece and the flexible framework is smaller than the rigidity of the wafer, when the wafer is attached to the non-wax pad of the ceramic disc, the lower pressure applied to the flexible framework acts on the wafer through the flexible sealing flaring piece so as to press the wafer on the non-wax pad, then the flexible sucker is driven to drive the wafer to rotate, so that bubbles between the wafer and the non-wax pad are pressed out, on one hand, the aim of adjusting the integral rigidity of the flexible sucker by utilizing the flexible framework covered on the outer side of the flexible sealing flaring piece is fulfilled, the purposes that the flexible sucker can not damage the wafer, and stably transfer the lower pressure and the rotating force when the wafer is pressed on the non-wax pad of the ceramic disc are fulfilled, the technical effect that the wafer is pressed on the non-wax pad of the ceramic disc by utilizing the flexible sucker and the wafer is simultaneously driven to rotate so as to discharge the bubbles between the wafer and the non-wax pad is solved, and the problem that the wafer cannot be attached to the wafer in a compact operation due to the follow-up operation is solved;

On the other hand, because the structure characteristics of the flexible sucker can meet the requirement of pressing down the wafer and driving the wafer to rotate, the flexible sucker can be matched with automatic production equipment for use, such as automatic wafer pasting operation of the wafer by matching with a mechanical arm, so that automatic wafer pasting of the wafer can be realized, the production efficiency is improved, and the problem of manual operation of pasting the wafer on the ceramic disk in the related technology and lower efficiency is solved.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the application and to provide a further understanding of the application with regard to the other features, objects and advantages of the application. The drawings of the illustrative embodiments of the present application and their descriptions are for the purpose of illustrating the present application and are not to be construed as unduly limiting the present application. In the drawings:

FIG. 1 is a schematic diagram of a wafer bonding apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of another embodiment of a wafer bonding apparatus according to the present invention;

FIG. 3 is a schematic view of a transfer mechanism according to an embodiment of the present invention;

FIG. 4 is a schematic side view of a transfer mechanism according to an embodiment of the present invention;

FIG. 5 is a schematic view of a transport member according to an embodiment of the present invention;

FIG. 6 is a schematic cross-sectional structural view of a transfer member according to an embodiment of the present invention;

FIG. 7 is a schematic structural view of a wafer waxless polishing feeding device according to an embodiment of the invention;

fig. 8 is a schematic structural view of a wafer wax-free polishing pretreatment mechanism in accordance with an embodiment of the present invention;

fig. 9 is a schematic structural view of a cleaning mechanism in an embodiment according to the present invention;

FIG. 10 is a schematic view of the first tilting mechanism and the lifting and transferring mechanism in the embodiment of the present invention;

FIG. 11 is a schematic diagram of an active flip assembly according to an embodiment of the present invention;

FIG. 12 is a schematic view of a driven flip assembly in accordance with an embodiment of the present invention;

FIG. 13 is a schematic view showing the structure of a cleaning mechanism in the embodiment of the present invention;

fig. 14 is a schematic structural view of a lifting jig in the embodiment of the invention.

The device comprises a 33 conveying mechanism, a 331 ceramic disc feeding station, a 332 wafer pasting station, a 3320 ceramic disc driving roller, a 333 ceramic disc blanking station, a 334 conveying roller, a 34 clamping mechanism, a 35 limiting mechanism, a 36 mechanical arm assembly, a 361 mechanical arm, a 362 adsorbing part, a 3620 first adsorbing assembly, a 36201 shovel-shaped part, a 36202 adsorbing groove, a 3621 second adsorbing assembly, a 36210 flexible framework, a 36211 flexible sealing flaring part, a 36212 shell, a 363 transferring part, a 364 negative pressure air channel, a 365 rotating connecting part, a 3651 air channel, a 37 blocking, a 38 positioning mechanism, a 39 centering station, a 390 centering groove, a 391 wafer releasing groove, a 392 centering surface, a 40 lifting rotating mechanism, a 401 lifting platform, a 402 rotating platform and a 403 supporting platform.

Detailed Description

In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

As shown in fig. 1, an embodiment of the present application provides, as shown in fig. 1 to 4, a wafer bonding apparatus, including:

the conveying mechanism 33 is used for conveying the ceramic disc 6, and the conveying mechanism 33 comprises a ceramic disc feeding station 331, a wafer pasting station 332 and a ceramic disc discharging station 333 which are sequentially distributed, wherein a groove and a wax-free pad are arranged on the ceramic disc 6, and the wax-free pad is attached in the groove;

The lifting and rotating mechanism 40 is corresponding to the wafer pasting station 332 and is used for lifting and rotating the ceramic disc 6 positioned at the wafer pasting station 332;

the positioning mechanism 38 is electrically connected with a rotation operation end which outputs rotation motion in the lifting rotation mechanism 40, the positioning mechanism 38 is used for acquiring groove position information of the ceramic disc 6 on the lifting rotation mechanism 40, and the rotation operation end can control the ceramic disc 6 to rotate based on the groove position information so as to enable the ceramic disc 6 to be in a set position;

the mechanical arm assembly 36 is used for transferring the wafer from the clamping plug 37 to the mounting position of the ceramic disc 6, wherein the mounting position corresponds to the set position, and the wafer is pressed in the groove for mounting operation.

In this embodiment, the wafer bonding apparatus mainly includes a conveying mechanism 33, a lifting and rotating mechanism 40, a positioning mechanism 38 and a mechanical arm assembly 36, where each mechanism and assembly corresponds to different processes in the wafer bonding. The conveying mechanism 33 is mainly used for sequentially conveying the ceramic discs 6 to each station, and in this embodiment, the number of stations corresponding to the conveying mechanism 33 is approximately three, namely a ceramic disc feeding station 331, a wafer pasting station 332 and a ceramic disc discharging station 333, and corresponding conveying rollers 334 are respectively arranged on each station to realize conveying of the ceramic discs 6.

It should be noted that, in this embodiment, the ceramic disc 6 entering the wafer bonding apparatus is that the groove of the ceramic disc 6 has been cleaned in advance by the ceramic disc pretreatment mechanism and no wax pad is disposed in the groove. The pretreated ceramic disk 6 may be transported to the ceramic disk loading station 331 by other mechanisms, and the ceramic disk 6 is transported to the wafer bonding station 332 by the transport roller 334 in the ceramic disk loading station 331, and the ceramic disk 6 will be subjected to wafer bonding operation at the wafer bonding station 332.

Since pressure is required to be applied to the ceramic disc 6 during wafer bonding, in order to better support the ceramic disc 6 and enable the wafer to be bonded in the respective grooves circumferentially distributed on the ceramic disc 6, as shown in fig. 4, a lifting and rotating mechanism 40 is arranged in the wafer bonding station 332 in this embodiment. In this embodiment, the lifting and rotating mechanism 40 mainly includes a lifting portion and a rotating portion, where the lifting portion is responsible for lifting and the rotating portion is responsible for rotating, and the lifting portion and the rotating portion are connected in series, that is, the rotating portion is mounted on a lifting end of the lifting portion, the lifting portion drives the lifting portion, the ceramic disc 6 is located on the rotating portion, and the rotating portion drives the ceramic disc to rotate. In the present embodiment, when the ceramic disc 6 is transferred onto the rotating part, the rotating part and the ceramic disc 6 can be driven to rise together and separate from the transfer roller 334 by the action of the lifting part. After reaching the wafer mounting height, the rotating portion can drive the ceramic disc 6 to rotate so as to cooperate with the mechanical arm assembly 36 to mount the wafer into each groove. Moreover, since the grooves on the ceramic disk 6 are not necessarily located at the set position (i.e., the position where the robot arm assembly 36 performs the bonding operation) when the ceramic disk 6 is transferred to the wafer bonding station 332, the grooves are also required to be located at the set position by rotating the ceramic disk 6 by the rotating portion.

In this embodiment, wafer bonding operations are performed by the robotic arm assembly 36. Specifically, the wafers are stored in the stoppers 37 at specific positions before being pasted, and a plurality of wafers can be stored in the same stopper 37, so as to save space, as shown in fig. 1, the wafers can be vertically stacked, and to avoid interference between adjacent wafers when the wafers are taken, a certain distance can be kept between the wafers, and in particular, the wafers can be realized by arranging a plurality of vertically distributed supporting plates in the stoppers 37. Wafers may be stored one by one on a pallet, with the pallet maintaining a spacing between adjacent wafers for the robot arm assembly 36 to grasp the wafers. The above description of the structure of the stopper 37 and the manner of storing the wafers is not limiting. To improve the productivity, at least two stoppers 37 may be provided on the patch device as shown in fig. 1.

The mechanical arm assembly 36 in this embodiment performs functions including gripping the wafer in the chuck 37, transferring the wafer into the recess of the ceramic disk 6, and applying a certain pressure to the wafer to adhere to the wax-free pad in the recess. The structure of the mechanical arm assembly 36 can be designed according to the above functions, for example, when the wafer in the chuck 37 is grasped, the wafer can be realized by a clamping mechanism or an adsorption mechanism in the mechanical arm assembly 36, the wafer can be transported into the groove of the ceramic disk 6 by a multi-axis mechanical arm in the mechanical arm assembly 36, and the wafer can be adhered to the wax-free pad in the groove by applying a certain pressure to the wafer by the multi-axis mechanical arm in the mechanical arm assembly 36 or a separate pressing mechanism or an additionally configured rotary pressing mechanism. In this embodiment, the specific structure of the mechanical arm assembly 36 is not limited, as long as the desired function can be achieved, and the above description of the partial structure of the mechanical arm assembly 36 is not limited.

Since the grooves on the ceramic disk 6 need to be rotated to the set position by the rotating portion in the lifting and rotating mechanism 40 before wafer bonding, the current position of the grooves on the ceramic disk 6 needs to be acquired so that the positions of the grooves can be rotationally adjusted based on the current position. To achieve the objective, as shown in fig. 1, the wafer bonding apparatus in this embodiment further includes a positioning mechanism 38, where the positioning mechanism 38 can be at least electrically connected to a rotation operation end (a driving end of a rotation portion) in the lifting rotation mechanism 40, current groove position information of the ceramic disc 6 on the lifting rotation mechanism 40 can be obtained through the positioning mechanism 38, and according to a set adjustment mode, the rotation operation end can control the rotation of the ceramic disc 6 based on the groove position information, so that the ceramic disc 6 and the groove are both in a set position.

It should be noted that, since the grooves on the ceramic disc 6 are uniformly arranged, the central angles between adjacent grooves are uniform, that is, when the ceramic disc 6 is at the set position before the first wafer is pasted, the next groove can be at the set position by directly controlling the rotation of the ceramic disc 6 by the corresponding central angle after the first pasting. Of course, to improve the positioning accuracy, the positioning mechanism 38 may still be used to obtain the groove position information in this process. In one embodiment of the positioning mechanism 38, the position of the groove may be directly identified by a visual identification technology, or a marker may be formed on the ceramic disc 6, and the position of the marker may be detected to calculate the groove of the groove, which is not limited herein, and may be designed according to requirements.

After each groove on the ceramic disc 6 is fully covered with a wafer, the lifting and rotating mechanism 40 drives the ceramic disc 6 to descend so that the ceramic disc 6 is positioned on the conveying roller 334 in the wafer pasting station 332, the conveying roller 334 conveys the ceramic disc 6 to the ceramic disc blanking station 333 for blanking, and meanwhile, the next ceramic disc 6 is conveyed to the wafer pasting station 332 for continuing wafer pasting.

The purpose of carrying out wafer paster operation by the mutual cooperation of the mechanical arm assembly 36 and the lifting rotary mechanism 40 is achieved in this embodiment to the wafer paster process has been realized carrying out to the high efficiency, improves the automaticity of wafer production, increases production efficiency's technical effect, and then has solved in the correlation technique and has laminated the wafer and need the manual work inefficiency on ceramic plate 6, and degree of automation is poor, has reduced the problem of the production beat of whole wafer.

In one embodiment of wafer bonding by the robotic arm assembly 36, the mechanism by which the robotic arm assembly 36 grips the wafer from the chuck 37 is different from the mechanism by which the wafer is pressed into the recess of the ceramic disc 6 for the bonding operation. The wafer is thus removed from the chuck 37 by one mechanism and transferred to an intermediate position, and then is again grasped from the intermediate position by another mechanism and transferred into the recess of the ceramic tray 6 and subjected to the bonding operation. In order to accurately place the wafer into the recess, it is necessary to align the center of the wafer with the center of the recess when placing the wafer, in other words, the center of the mechanism on the robot arm assembly 36 responsible for secondarily gripping the wafer is aligned with the center of the wafer.

For this reason, as shown in fig. 2 and 3, the patch device in this embodiment further includes a centering station 39, the centering station 39 is fixedly disposed on one side of the conveying mechanism 33, a centering groove 390 is disposed on the centering station 39, and a centering surface 392 that is attached to the circumferential contour of the wafer is formed on the inner wall of the centering groove 390;

the robot arm assembly 36 is used to transfer the wafer from the chuck 37 into the centering groove 390, and to transfer the wafer in the centering groove 390 to the bonding position of the ceramic disk 6, and to perform the bonding operation on the wafer.

Specifically, in this embodiment, the centering station 39 is additionally configured, and the centering station 39 is provided with a through centering groove 390, so that when the wafer is placed in the centering groove 390, the center of the wafer will be aligned with the center of the centering surface 392 because the lateral inner wall of the centering groove 390 is the centering surface 392 that is attached to the circumferential contour of the wafer. The secondary grabbing position of the mechanical arm assembly 36 can be set according to the circle center of the centering surface 392, so that the grabbing mechanism of the mechanical arm assembly 36 is aligned with the circle center of the wafer when grabbing the wafer, and the wafer can be smoothly placed in the groove of the ceramic disc 6. Taking a wafer as an example, the centering surface 392 is an arc surface matching a section of circumferential profile of the wafer.

It will be appreciated that when the mechanism of the robot arm assembly 36 that grips the wafer from the chuck 37 is the same as the mechanism that places the wafer into the recess, there may be a situation where the center of the wafer is not aligned with the center of the gripping mechanism, mainly because the center of the wafer is not in the set position when placed in the chuck 37. Therefore, the wafer can be accurately placed in the groove of the ceramic disc 6 after being centered by the centering station 39 by grabbing and transferring the wafer to the centering station 39 in the transferring process.

In one embodiment of the mechanical arm assembly 36, as shown in fig. 1 and 5, the mechanical arm assembly 36 includes a mechanical arm 361 and a transferring member 363, the transferring member 363 is disposed at an end of the mechanical arm 361, the mechanical arm 361 is configured to drive the transferring member 363 to rotate and translate, the mechanical arm 361 may be a multi-degree-of-freedom mechanical arm, and a degree of freedom of movement of the mechanical arm 361 may be adjusted according to a movement path.

Since the wafer is fragile, the wafer is easily damaged when a conventional chucking apparatus is used, and for this reason, the adsorbing portion 362 is provided on the transporting member 363 in the present embodiment, and the adsorbing portion 362 is used for adsorbing and releasing the wafer. The wafer can be stably grasped in a vacuum adsorption mode, and damage to the surface of the wafer can be avoided.

Since there is a difference in the movement modes of grabbing the wafer from the chuck 37 and attaching the wafer to the recess, in this embodiment, the adsorption portion 362 is divided into a first adsorption component 3620 and a second adsorption component 3621, which are respectively located at two ends of the transfer component 363, and the two adsorption components respectively perform the wafer picking-up and placing the wafer in the chuck 37 in the centering station 39 and the wafer adsorbing the centering station 39 and placing the wafer in the recess of the ceramic disc 6 for the attaching operation.

Specifically, as shown in fig. 5, the adsorption portion 362 in the present embodiment includes a first adsorption assembly 3620 disposed at a first end of the transport member 363 and a second adsorption assembly 3621 disposed at a second end of the transport member 363;

the first adsorption component 3620 is used for being inserted into the clamping plug 37 and adsorbing the wafer, and the second adsorption component 3621 is used for adsorbing the wafer positioned in the centering groove 390 and transferring the wafer to the position of the ceramic disc 6 for carrying out the pasting operation.

It is understood that the first suction assembly 3620 can suction the wafer from above or below the wafer, and the second suction assembly 3621 can only suction the wafer from above the wafer because the second suction assembly 3621 needs to press the wafer into the groove, and the first suction assembly 3620 and the second suction assembly 3621 can be suction cups.

In order to facilitate wafer holding while wafer holding from the chuck 37, in this embodiment, the first suction assembly 3620 preferably holds the wafer from the lower side of the wafer, and can simultaneously hold the wafer after the wafer holding, thereby improving the stability in the process of wafer holding and wafer transferring. To satisfy that the first suction unit 3620 sucks the wafer from the lower side of the wafer, a space is maintained between adjacent wafers in the chuck 37 by the pallet, and the first suction unit 3620 can enter the lower side of the wafer through the space to suck and grasp the wafer.

In order to facilitate the first adsorption component 3620 to place the wafer on the centering station 39, as shown in fig. 3, in this embodiment, a wafer release slot 391 is further provided on the centering station 39, the wafer release slot 391 is located below the centering slot 390, the opening of the wafer release slot 391 is smaller than the opening of the centering slot 390, and the wafer is located above the wafer release slot 391 after being placed in the centering slot 390;

as shown in fig. 5, the first adsorption assembly 3620 includes a shovel 36201 and an adsorption tank 36202 provided on the shovel 36201, the adsorption tank 36202 being in communication with a negative pressure air source through an air passage;

the spade 36201 is configured to be inserted into the chuck 37 and to adsorb the wafer from below the wafer through the adsorption groove 36202, and the spade 36201 is configured to be inserted into the wafer release groove 391 to place the wafer in the centering groove 390.

Specifically, the width of the spade 36201 is smaller than the diameter of the wafer and matches the width of the wafer release slot 391. When the wafer is to be grasped, the mechanical arm 361 drives the transfer piece 363 to move, so that the shovel piece 36201 is driven to move into the plug 37 and approach the wafer from the lower side of the wafer to be grasped. At this time, the suction groove 36202 on the shovel 36201 generates negative pressure by the negative pressure air source, the wafer is fixed on the shovel 36201 by suction, and the shovel 36201 is driven by the mechanical arm 361 to separate from the clamping plug 37 and move to the centering station 39. The shovel 36201 can be inserted into the wafer release slot 391 at the centering station 39, and simultaneously, the wafer is placed into the centering slot 390, then the negative pressure air source acts to separate the wafer from the shovel 36201, and finally, the mechanical arm 361 drives the transferring member 363 to move, so that the second adsorption component 3621 grabs the wafer positioned in the centering slot 390 and transfers the wafer into the groove of the ceramic disc 6 for wafer pasting operation.

As shown in fig. 5, the shovel 36201 has a C-shaped opening, and the front ends of the arms on both sides thereof have a lead-in slope, so that the insertion into the stopper 37 is facilitated. In addition, after the opening with the C-shape, the contact area between the spade 36201 and the wafer is reduced when the wafer is grasped, and the contact with the wafer is reduced when the wafer is stably supported by the two side support arms and the rear end, so that the damage to the surface of the wafer in the moving process can be avoided.

In order to press the wafer into the groove and apply a certain pressing force to the wafer at least through the process of adsorbing and fixing the wafer without the wax pad, and the wafer is driven to rotate while the wafer is pressed down when the bubbles between the wafer and the wax-free cloth are discharged, as shown in fig. 5 and 6, the embodiment provides a flexible sucker for the chip mounting operation of the wafer, the flexible sucker comprises: a flexible backbone 36210 and flexible seal flares 36211; wherein,

the flexible framework 36210 is fixedly arranged on the outer side of the flexible sealing flaring piece 36211 to support the flexible sealing flaring piece 36211, and the inner side of the flexible sealing flaring piece 36211 is used for contacting a wafer and adsorbing the wafer under the negative pressure;

the stiffness of the flexible seal flare 36211 is less than the stiffness of the flexible backbone 36210 and the stiffness of the wafer such that the amount of deformation of the flexible backbone 36210 is less than the amount of deformation of the flexible seal flare 36211 during the process of the flexible seal flare 36211 attracting the wafer and wafer patch. When the wafer is attached to the wax-free pad of the ceramic disc 6, the lower pressure applied to the flexible skeleton 36210 acts on the wafer through the flexible sealing flaring piece 36211 to press the wafer onto the wax-free pad, and then the flexible sucker is driven to drive the wafer to rotate so as to press out air bubbles between the wafer and the wax-free pad.

Specifically, the flexible suction cup may be used as the second suction unit 3621 in the above embodiment, and may be used in combination with the robot 361. Specifically, when the wafer is grasped from the centering station 39, the flexible suction cup is moved over the wafer by the mechanical arm 361 and the flexible seal flare 36211 is brought into close contact with the upper surface of the wafer, and then negative pressure is generated in the flexible seal flare 36211 by the negative pressure air source so as to suction and fix the wafer on the flexible seal flare 36211. In order to better adsorb the wafer, the flexible sealing flaring member 36211 needs to meet a certain deformation amount, and in order to prevent the wafer from shaking during the transferring process, and in the subsequent pressing and rotating processes, the flexible sucker can stably transmit the corresponding pressing force and rotating force, and the flexible sucker needs to have a certain rigidity. For this reason, in this embodiment, the flexible skeleton 36210 is covered on the outer side of the flexible seal flaring member 36211, and the flexible skeleton 36210 can be deformed by being pressed but has a stiffness larger than that of the flexible seal flaring member 36211, so that the deformation amount of the flexible skeleton 36210 is smaller than that of the flexible seal flaring member 36211 when the wafer is sucked, thereby stably sucking and fixing the wafer under the cooperation of the flexible skeleton 36210 and the flexible seal flaring member 36211, and stably transmitting the downward pressure and the rotational force to the wafer.

On this basis, in order to avoid the flexible suction cup damaging the wafer, the overall rigidity of the flexible suction cup needs to be smaller than that of the wafer, i.e. the combined rigidity of the flexible sealing flaring 36211 and the flexible skeleton 36210 is smaller than that of the wafer.

The embodiment achieves the technical effects that the flexible framework 36210 covered on the outer side of the flexible sealing flaring piece 36211 is utilized to adjust the overall rigidity of the flexible sucker, so that the flexible sucker can not damage a wafer, and can stably transmit the downward pressure and the rotation force when the wafer is pressed on the non-wax pad of the ceramic disc 6, thereby realizing the technical effects that the wafer can be pressed on the non-wax pad of the ceramic disc 6 by utilizing the flexible sucker and simultaneously the wafer can be driven to rotate by utilizing the flexible sucker to discharge the air bubbles between the wafer and the non-wax pad to improve the bonding degree, and further solving the problem that the air bubbles exist between the wafer and the ceramic disc 6 during the surface mounting operation in the related art, so that the wafer cannot be tightly and stably bonded on the ceramic disc 6, and further the follow-up polishing operation is affected;

on the other hand, because the structure characteristics of the flexible sucker can meet the requirement of pressing down the wafer and driving the wafer to rotate, the flexible sucker can be matched with automatic production equipment for use, such as automatic wafer pasting operation of the wafer by matching with a mechanical arm 361, so that automatic wafer pasting of the wafer can be realized, the production efficiency is improved, and the problem of manual operation of pasting the wafer on the ceramic disk in the related technology and lower efficiency is solved.

To facilitate the installation and use of the flexible suction cup, in one embodiment, as shown in fig. 5 and 6, the flexible suction cup further includes a housing 36212 and a negative pressure air channel 364; the shell 36212 is fixedly arranged at the second end of the transferring piece 363, the negative pressure air passage 364 is arranged in the shell 36212, and the first end of the negative pressure air passage 364 is communicated with a negative pressure air source through the air passage; the flexible backbone 36210 and the flexible seal flare 36211 are both disposed at the lower end of the housing 36212, and the second end of the negative pressure air passage 364 is in communication with the flexible seal flare 36211.

In one embodiment, the relationship between the stiffness of the flexible seal flare 36211 in the flexible suction cup, the stiffness of the flexible backbone 36210, and the resultant stiffness is as follows:

；

wherein,for the purpose of synthetic stiffness->Stiffness of the flare 36211 for flexible sealing, +.> ₁ Poisson's ratio for flexible seal flare 36211,> ₁ for flexible sealing the material thickness of the flare 36211, < >> ₁ For the elastic modulus of the flexible sealing flare 36211, +.> ₁ An outer diameter of the flexible seal flare 36211;

for the rigidity of the flexible backbone 36210, +.> ₂ Poisson's ratio for flexible backbone 36210, +.> ₂ Is the material thickness of flexible backbone 36210, +.> ₂ Is the elastic modulus of the flexible backbone 36210 +.> ₂ Is the outer diameter of flexible backbone 36210.

In addition, since the inner sealing area of the flexible sealing flare 36211 has gas when the wafer is sucked, the rigidity of the gas in the area also affects the rigidity of the flexible sealing flare 36211, and thus the total rigidity of the flexible suction cup. Thus, in this embodiment, the total stiffness of the flexible suction cup is the sum of the stiffness and the resultant stiffness of the gas enclosed in the flexible seal flare 36211 by the flexible seal flare 36211 when the wafer is sucked, and is less than the wafer stiffness, taking into account the stiffness of the gas in the interior enclosed area.

In one embodiment, the flexible seal flare seals the stiffness of the gas within the flexible seal flare when the wafer is suckedThe method comprises the following steps:

；

the total rigidity of the flexible sucker is as follows:；

On the basis of the above embodiment, further considering that when a downward pressure is applied to the flexible chuck, and the flexible chuck is then applied to the wafer, the gas in the inner enclosed area of the flexible seal flaring 36211 is squeezed to cause an increase in stiffness, and the total stiffness of the flexible chuck is the sum of the stiffness of the gas in the current inner enclosed area and the resultant stiffness. In order to ensure that the wafer is not damaged, the total rigidity of the flexible sucker is smaller than the rigidity of the wafer under the action of the downward pressure when the wafer is attached to the wax-free pad of the ceramic disc 6. Specifically, when the structure of the flexible sucker is determined, the total rigidity of the flexible sucker can be enabled to meet the requirement by adjusting the downward pressure. In determining the downforce, the overall stiffness can be made to meet the requirements by adjusting the structural composition of the flexible suction cup.

On this basis, in order to further improve the adsorption stability to the wafer, as shown in fig. 6, the edge of the flexible skeleton 36210 does not extend to the edge of the flexible sealing flaring member 36211 and keeps a certain distance, that is, the diameter of the opening end of the flexible skeleton 36210 is smaller than that of the opening end of the flexible sealing flaring member 36211, so that the edge of the flexible sealing flaring member can be deformed better to facilitate improving the adsorption stability to the wafer. The flexible sealing flaring member 36211 can be made of silicone rubber, so that the flexible skeleton 36210 can better generate a certain amount of deformation, the thickness of the edge of the flexible skeleton 36210 gradually decreases from inside to outside, and one end, which is close to the edge of the flexible sealing flaring member 36211, is thinner, so that the deformation of the flexible sealing flaring member 36211 can be matched.

On this basis, as shown in fig. 6, the edge of the flexible skeleton 36210 is tilted towards the direction away from the flexible sealing flaring piece, so that a space is reserved between the edge of the flexible skeleton 36210 and the outer side of the flexible sealing flaring piece 36211, and the flexible sealing flaring piece 36211 is convenient to expand outwards when the wafer is adsorbed.

After the wafer is adsorbed by the centering station 39, the mechanical arm 361 continues to act to transfer the wafer into the groove on the ceramic disc 6, in which the wax pad is arranged, at this time, the mechanical arm 361 can drive the second adsorption component 3621 to press down, and the pressure acts on the flexible framework 36210 and the flexible sealing flaring piece 36211, and then acts on the wafer. Due to the existence of the flexible framework 36210, the downward force of the mechanical arm 361 can be better transferred to the wafer, so that the wafer can be pressed into the groove.

In order to stably adsorb the wafer on the wax-free pad in the groove, it is necessary to exhaust the air between the wafer and the wax-free pad as much as possible. To this end, as shown in fig. 6, the second adsorption assembly 3621 in this embodiment further includes a rotary connecting member 365, a first end of the rotary connecting member 365 is rotatably connected to the housing 36212, a second end of the rotary connecting member 365 is fixedly connected to the flexible skeleton 36210, a gas channel 3651 communicating with the negative pressure air channel 364 and the flexible sealing flaring member 36211 is provided in the rotary connecting member 365, and the rotary connecting member 365 can be driven to rotate.

After the wafer is pressed on the wax-free pad of the groove, in order to exhaust air between the wafer and the wax-free pad, the flexible skeleton 36210, the flexible sealing flaring piece 36211 and the wafer are driven to synchronously rotate by the rotary connecting piece 365, so that bubbles between the wafer and the wax-free pad are extruded (the operation can simulate manual pasting operation), and the wafer is firmly adsorbed on the ceramic disc 6. The inside of the rotary connector 365 is provided hollow in this embodiment, thereby forming a gas passage 3651. The outside at rotary connecting piece 365 can realize the transmission connection with the motor through the mode of cup jointing the gear, utilizes the motor to drive rotary connecting piece 365 rotation.

In one embodiment of the positioning mechanism 38, the positioning mechanism 38 includes a visual inspection assembly for visually inspecting the wax-free pad on the ceramic disk 6 to determine the groove position information of the ceramic disk 6, and the rotational operation end can control the rotation of the ceramic disk 6 based on the position information to bring the groove to a set position.

In this embodiment, the visual inspection assembly may employ the image recognition positioning technology in the related art, on the basis of which positioning balls capable of being visually recognized may be arranged at specific positions on the ceramic disc 6, and the position information of the grooves on the ceramic disc 6 may be better determined by recognizing the positions of the positioning balls.

In one embodiment of the elevating rotation platform 402, as shown in fig. 3 and 4, the elevating rotation mechanism 40 includes an elevating platform 401, a rotation platform 402, and a support platform 403;

the lifting platform 401 is arranged below the wafer pasting station 332, the supporting platform 403 is arranged at the wafer pasting station 332, and the rotating platform 402 is arranged between the supporting platform 403 and the lifting platform 401;

when the transfer mechanism 33 transfers the wafer to the wafer bonding station 332, the ceramic disk 6 corresponds up and down to the support platform 403.

In this embodiment, the lifting platform 401, the rotating platform 402 and the supporting platform 403 are sequentially connected in series from bottom to top, the lifting platform 401 can drive the rotating platform 402 and the supporting platform 403 to synchronously lift, and the rotating platform 402 can drive the supporting platform 403 to rotate. When the transfer mechanism 33 transfers the wafer to the wafer bonding station 332, the ceramic disc 6 is located above the support platform 403, and at this time, the lifting platform 401 drives the support platform 403 to lift and raise the ceramic disc 6 to a set height, and the rotating platform 402 drives the support platform 403 to rotate, so as to complete the subsequent wafer bonding operation. In this embodiment, the lifting platform 401 may adopt various lifting structures, such as a cylinder lifting structure, a scissor lifting structure, etc., and the rotating platform 402 generally includes a rotating motor and a corresponding transmission structure, and the supporting platform 403 is driven to rotate by the cooperation of the rotating motor and the transmission structure. It should be noted that the specific structural descriptions of the respective platforms are not limited.

In one embodiment, the lifting platform 401 comprises a lifting cylinder, the rotating platform 402 comprises a rotating motor, and the supporting platform 403 is configured as a cross-shaped carrying platform;

the rotating motor is arranged at the output end of the lifting cylinder, and the cross bearing table is arranged at the output end of the rotating motor;

a ceramic disc driving roller 3320 is arranged in the wafer pasting station 332, and the ceramic disc driving roller 3320 is arranged around the cross-shaped bearing table and can rotate in a driving manner.

As shown in fig. 3, in the present embodiment, when the ceramic disk 6 is transferred to the wafer bonding station 332, the ceramic disk driving roller 3320 is supported, and the ceramic disk driving roller 3320 needs to avoid the lifting movement range of the cross-shaped carrying table in layout. When the ceramic disc 6 arrives on the ceramic disc driving roller 3320, the lifting cylinder drives the rotating motor and the cross-shaped bearing table to lift the ceramic disc 6 to a set height by the cross-shaped bearing table, and then the rotating motor drives the cross-shaped bearing table to rotate, so that the ceramic disc 6 is driven to rotate. After the wafer pasting is completed, the lifting cylinder drives the ceramic disk 6 to drop on the ceramic disk driving roller 3320, and then the ceramic disk driving roller 3320 rotates to convey the ceramic disk 6 to the ceramic disk blanking station 333. In this embodiment, the ceramic disc driving roller 3320 located at the wafer pasting station 332 and the driving rollers located at the ceramic disc feeding station 331 and the discharging station can be kept in linkage or can act independently, and can be realized through a belt pulley during linkage, and a specific linkage mode can be designed according to actual requirements, so that the embodiment does not limit the operation. The ceramic disc drive roller 3320 in this embodiment acts as a transfer roller in the wafer bonding station 332.

As shown in fig. 3 and 4, since the wafer needs to be pressed down during the wafer bonding process, in order to ensure the stability of the ceramic disc 6, the bonding apparatus in this embodiment further includes clamping mechanisms 34 disposed at two sides of the wafer bonding station 332, where the clamping mechanisms 34 are used to clamp two sides of the ceramic disc 6 after lifting the ceramic disc 6 to fix the ceramic disc 6.

In this embodiment, the clamping mechanisms 34 are arranged in two and distributed on two sides of the ceramic disc 6, and when the ceramic disc 6 is lifted to a set height, the clamping mechanisms 34 correspond to the clamping mechanisms 34, and the clamping mechanisms 34 act to clamp the ceramic disc 6, so that the ceramic disc 6 cannot displace in the subsequent wafer pasting process. In one embodiment of the clamping mechanism 34, the clamping mechanism 34 is a cylinder clamp, the two cylinder clamps are symmetrically arranged, and clamping and releasing of the ceramic disc 6 are achieved through cylinder actions.

Since the ceramic disc 6 is stopped at the wafer bonding station 332 for wafer bonding operation, in order to enable the ceramic disc 6 to be accurately conveyed to a specific position on the whole conveying line, as shown in fig. 3, the bonding apparatus in this embodiment further includes a plurality of groups of limiting mechanisms 35, wherein one group of limiting mechanisms 35 is disposed between the ceramic disc feeding station 331 and the wafer bonding station 332, for limiting the ceramic disc 6 of the ceramic disc feeding station 331 from entering the wafer bonding station 332 during wafer bonding;

One group of limiting mechanisms 35 is arranged at the wafer pasting station 332 and is used for limiting the ceramic disk 6 conveyed into the wafer pasting station 332 to the position corresponding to the lifting and rotating mechanism 40, so that the lifting and rotating mechanism 40 can accurately lift the ceramic disk 6;

one group of limiting mechanisms 35 is arranged at the ceramic disc blanking station 333 and used for limiting the ceramic disc 6 after being pasted to a blanking position, thereby ensuring that the ceramic disc 6 conveyed to the blanking position can be accurately blanked.

In one embodiment of the limiting mechanism 35, the limiting mechanism 35 comprises at least two lifting bars which are arranged oppositely, and limiting and passing of the ceramic disc 6 are realized through lifting of the lifting bars.

To facilitate ceramic disc blanking, the patch device in this embodiment further includes a lifting mechanism disposed at a blanking position (not shown in the figure) of the ceramic disc blanking station 333 for lifting and conveying the ceramic disc 6 into the material box. The specific structure of the lifting mechanism can be designed according to the blanking process of the ceramic disc 6, in one embodiment, the blanking process of the ceramic disc 6 mainly comprises lifting and translating to the material box, and therefore the corresponding lifting mechanism comprises a lifting component for realizing lifting and a translating component for realizing translating. The lifting component can also be a lifting cylinder, and the translation component can also be a moving piece with translation capability, which is arranged on the lifting mechanism. Of course, the mechanical arm 361 can also be directly used to grasp the ceramic disc 6, so that the ceramic disc 6 can be directly transported from the ceramic disc blanking station 333 to the material box.

As shown in fig. 7, according to another aspect of the present invention, there is provided a wafer waxless polishing feeding device 41, including the wafer bonding device 410 and the wafer waxless polishing pretreatment mechanism 412.

The wafer wax-free polishing pretreatment mechanism 412 is used for pretreating the ceramic disk 6, including cleaning the ceramic disk 6, and transferring the cleaned ceramic disk 6 to a ceramic disk loading station 331 in the wafer bonding apparatus 410.

In one embodiment, as shown in fig. 8 to 11, the wafer wax-free polishing pretreatment mechanism 412 includes a lift conveyor 1, a first inverting mechanism 2, a cleaning mechanism 3, and a second inverting mechanism 4;

as shown in fig. 10, the elevating and conveying mechanism 1 includes an elevating portion 102 for elevating the ceramic disk 6 in the material box 5 and a conveying portion 101 for conveying the ceramic disk 6 to the first tilting mechanism 2;

the first turnover mechanism 2 is used for turning over the ceramic disc 6 so that the end surface of the ceramic disc 6 provided with the groove and the non-wax pad is downwards arranged, wherein the non-wax pad is attached in the groove;

the cleaning mechanism 3 comprises a plurality of cleaning tanks 7 and a hoisting mechanism 31, and ultrasonic equipment for carrying out ultrasonic cleaning on the end face of the ceramic disc 6 provided with the non-wax pad is arranged at the bottom of the cleaning tanks 7; the lifting mechanism 31 is used for transferring the ceramic disc 6 between the first turnover mechanism 2 and the cleaning tanks 7, between any two adjacent cleaning tanks 7 and between the cleaning tanks 7 and the second turnover mechanism 4;

And the second turnover mechanism 4 is used for turning over the ceramic disc 6 so that the end face of the ceramic disc 6 provided with the wax-free pad is upwards, and therefore the ceramic disc 6 is convenient to be attached to the wax-free pad.

In this embodiment, a plurality of ceramic trays 6 are stored vertically in the magazine 5 before the ceramic trays 6 are fed. The lower extreme of material box 5 has the opening, is provided with the layer board on the inner wall of its both sides, and the layer board of each side all sets up to a plurality ofly and along vertical evenly distributed. The plurality of ceramic disks 6 may be stored one by one on each pallet with a certain spacing between vertically adjacent ceramic disks 6 to provide a lifting space for the ceramic disks 6 when removed.

The wafer waxless polishing pretreatment mechanism mainly comprises a lifting conveying mechanism 1, a first turnover mechanism 2, a cleaning mechanism 3 and a second turnover mechanism 4, wherein each mechanism corresponds to different working procedures in the feeding of a ceramic disc 6. The lifting and conveying mechanism 1 mainly comprises a lifting part 102 and a conveying part 101, wherein the lifting part 102 is responsible for realizing lifting, the conveying part 101 is responsible for horizontal movement, and the lifting and conveying part 102 and the conveying part 101 are connected in series. The lifting part 102 gradually approaches the ceramic disc 6 at the lowest end in the material box 5 in the lifting process, and continuously lifts up after contacting with the lower surface of the ceramic disc 6, so that the ceramic disc 6 is lifted and separated from the supporting plate in the material box 5. Then, the conveying part 101 acts to drive the ceramic disk 6 to horizontally move to the station corresponding to the first turnover mechanism 2. In this embodiment, the specific configuration of the elevating conveyor 1 is not limited, and any structure having linear motion output capability may be formed in series, and a manner of using an elevating cylinder in combination with a linear conveyor rail may be used.

In one embodiment, the conveying part 101 includes a linear guide rail, a slider, a horizontal screw drive mechanism, and the lifting part 102 includes a frame, a cylinder, and a top plate. The horizontal screw transmission mechanism is arranged on the linear guide rail, the sliding seat is in sliding connection with the linear guide rail and is fixedly connected with a screw nut in the horizontal screw transmission mechanism, and the screw transmission mechanism can drive the sliding seat to linearly move along the sliding rail. The frame is fixed on the slide, and the cylinder is installed on the frame, and the upper end at the cylinder is installed to the roof, but a plurality of guide bars can be arranged between the roof frame to promote the stability that the roof goes up and down, roof then is used for bearing ceramic dish 6.

The first tilting mechanism 2 is mainly used for clamping and tilting the conveyed ceramic disc 6 by 180 degrees. The purpose of turning over the ceramic disc 6 in this embodiment is to set the end surface of the ceramic disc 6 provided with the groove and the wax-free pad downward, so that the groove and the wax-free pad can be cleaned more thoroughly when the ceramic disc enters the cleaning tank 7 to be cleaned ultrasonically later. Depending on the function to be fulfilled by the first tilting mechanism 2, it also comprises a two-part structure, one of which is responsible for clamping the ceramic disc 6 and the other of which is responsible for tilting. The structure responsible for clamping the ceramic disc 6 in this embodiment is capable of clamping the ceramic disc 6 by a relative horizontal movement and releasing the ceramic disc 6 by a relative horizontal movement. The structure responsible for overturning is driven by a motor to rotate around the horizontal shaft in the forward direction and the reverse direction. In this embodiment, the specific structure is not limited, and any structure with corresponding motion output capability may be used to form in series, and a mode of matching the clamping cylinder with the rotating motor is used.

The cleaning mechanism 3 is used for ultrasonically cleaning the overturned ceramic disc 6, and mainly comprises a plurality of cleaning tanks 7 and a hoisting mechanism 31, wherein corresponding ultrasonic equipment is arranged in each cleaning tank 7, and adjacent cleaning tanks 7 are isolated. The embodiment can carry out ultrasonic cleaning for a plurality of times on the ceramic disc 6 by arranging a plurality of cleaning tanks 7, and further improves the cleaning degree of the ceramic disc 6. The lifting mechanism 31 is used for transferring the ceramic disc 6, the transferring path of which approximately comprises grabbing the ceramic disc 6 which is turned over on the first turning mechanism 2, moving the ceramic disc 6 to the position above the first cleaning tank 7, then lowering the ceramic disc 6 into the cleaning tank 7 and releasing the ceramic disc 6 for ultrasonic cleaning, then clamping and lifting the ceramic disc 6, and simultaneously moving to the position above the next cleaning tank 7, and repeating the steps to enable the ceramic disc 6 to finish ultrasonic cleaning in each cleaning tank 7 in sequence. After the cleaning is completed, the ceramic disc 6 is transported to a station corresponding to the second turnover mechanism 4, and the ceramic disc 6 is released. According to the transferring process of the lifting mechanism 31 to the ceramic disc 6, the lifting mechanism 31 comprises a clamping structure, a lifting and lowering structure and a translation structure for the ceramic disc 6, and the three structures can be sequentially connected in series.

As shown in fig. 9, in order to facilitate better support of the ceramic disc 6 during cleaning, a support 28 is installed in the cleaning tank 7, and the support 28 may be at least three, preferably four, and symmetrically distributed on both sides of the cleaning tank 7.

The second turnover mechanism 4 is used as a structure of the tail end of the whole process and is used for turning the ceramic disc 6 after the cleaning is completed by 180 degrees, so that the end face of the ceramic disc 6, which is provided with the wax-free pad, is upward, and the ceramic disc 6 is convenient to be attached to the wax-free pad. In this embodiment, the second tilting mechanism 4 is similar to the first tilting mechanism 2 in structure, and the actions performed by the second tilting mechanism are substantially identical, so that a detailed description is omitted herein.

In this embodiment, lift transport mechanism 1, first tilting mechanism 2, wiper mechanism 3 and second tilting mechanism 4 accessible PLC realize automated control, thereby reach and carried out taking of ceramic dish 6 with automaticly, wash and transport, realize the no wax polishing material loading process of wafer high efficiency, and in this process through the setting of first tilting mechanism 2 make the ceramic dish 6 have recess and the one side that does not have the wax pad down when wasing, can improve the cleaning degree when wasing, simultaneously the ceramic dish 6 after can overturn the washing again through second tilting mechanism 4 makes the one side that has recess and does not have the wax pad up again, be convenient for follow-up directness take ceramic dish 6 carry out the paster, still make ceramic dish 6 can further improve abluent clean degree when wasing through the arrangement of a plurality of washing tanks 7 in addition.

In one embodiment of the first flipping mechanism 2, the first flipping mechanism 2 includes a clamping portion for clamping the fixed ceramic disc 6 and a flipping portion for flipping the clamping portion to flip the ceramic disc 6. In this embodiment, the clamping portion may be two linearly moving members arranged opposite to each other, for example, two clamping cylinders arranged opposite to each other or a screw transmission structure arranged opposite to each other. The holding portion may be disposed on the turning portion so that it can be turned by the turning portion while holding the ceramic disc 6.

Specifically, as shown in fig. 10, in one embodiment, the turnover part includes a driving turnover component 8 and a driven turnover component 9 that are disposed opposite to each other, where the driving turnover component 8 and the driven turnover component 9 are disposed above the lifting part 102, so as to drive the ceramic disc 6 located on the lifting part 102 to act. Further, as shown in fig. 11, the driving turnover assembly 8 and the driven turnover assembly 9 each include a base 10 and a turnover frame 13, a bearing seat 11 is fixed on the base 10, a bearing is installed in the bearing seat 11, a connecting shaft 12 is sleeved in the bearing, a first end of the connecting shaft 12 is fixedly connected with the turnover frame 13, and a second end is in transmission connection with the driving mechanism. A clamping portion is provided on the roll-over stand 13, which can be driven toward and away from the ceramic disc 6 to clamp and release the ceramic disc 6.

As shown in fig. 11, in one embodiment of the clamping portion, the clamping portion includes a slide block 14, a guide rail 15, a telescopic drive mechanism 16, and a clamp block 17;

the telescopic driving mechanism 16 is fixedly arranged on the roll-over stand 13, the clamping block 17 is connected with the telescopic end of the telescopic driving mechanism 16, and the clamping block 17 is provided with a groove (not shown in the figure) for connecting the edge of the ceramic disc 6;

the guide rail 15 is arranged on the side surface of the roll-over stand 13, a first end of the sliding block 14 is fixedly connected with the clamping block 17, and a second end of the sliding block is in sliding connection with the guide rail 15.

In this embodiment, the guide rails 15 are installed on two sides of the roll-over stand 13, the guide rails 15 on each side are provided with slidable sliding blocks 14, the front ends of the two sliding blocks 14 are fixed with clamping blocks 17, the telescopic driving mechanism 16 can be installed in the middle of the roll-over stand 13, and the output end of the telescopic driving mechanism is connected with the middle of the clamping blocks 17, so that the clamping blocks 17 can be uniformly stressed during movement, and the ceramic disc 6 clamped by the clamping blocks 17 can be uniformly stressed. In order to enable the clamping block 17 to clamp the ceramic disc 6 more stably, a groove with a certain depth is formed on one side, facing the ceramic disc 6, of the clamping block 17, and the groove can be clamped with the edge of the ceramic disc 6, so that the ceramic disc 6 can be supported while the ceramic disc 6 is clamped, and displacement of the ceramic disc 6 in the overturning process can be avoided. The telescopic driving mechanism 16 in this embodiment may be implemented by any structure having a linear motion output, for example, a cylinder or a screw driving mechanism.

As shown in fig. 11, the active overturning assembly 8 further includes a first driving mechanism 18, where the first driving mechanism 18 is fixedly disposed on the base 10, and an output end of the first driving mechanism 18 is in transmission connection with the connecting shaft 12 and is used for driving the connecting shaft 12 to rotate. The first driving mechanism 18 in this embodiment may have different structures according to different driving modes, and in one embodiment, the first driving mechanism 18 includes a motor, a driving pulley, a driven pulley, and a belt. A motor mounting frame is fixed on the base 10, a motor is fixed on the motor mounting frame and is in transmission connection with a driving belt pulley, a driven belt pulley is fixed at the second end of the connecting shaft 12, and the driven belt pulley is connected with the driving belt pulley through a belt. Because the clamping parts are arranged on the turnover frames 13 of the driving turnover assembly 8 and the driven turnover assembly 9, when the clamping parts on two sides clamp the ceramic disc 6, the turnover frames 13 of the driving turnover assembly 8 are driven by a motor to rotate around the axis of the connecting shaft 12, so that the two clamping parts, the turnover frames 13 in the driven turnover assembly 9 and the ceramic disc 6 can be driven to synchronously rotate.

Since the driven turnover assembly 9 is driven by the driving turnover assembly 8, and the driven turnover assembly does not have a function of limiting the rotation of the turnover frame 13, after the ceramic disc 6 is released, the turnover frame 13 of the driven turnover assembly 9 may rotate, so that the subsequent clamping part is deviated and cannot clamp the next ceramic disc 6. In order to enable the roll-over stand 13 of the driven roll-over assembly 9 to be in a set position after releasing the ceramic disc 6, a structure capable of restraining the roll-over stand 13 needs to be arranged in the driven roll-over assembly 9.

Specifically, as shown in fig. 12, a bearing housing 11 is fixed to a base 10 in the driven roll-over module 9 in the present embodiment, and the bearing housing 11 is hinged to a corresponding roll-over stand 13 through a bearing. The two sides of the bearing seat 11 are respectively fixed with a connecting arm, the end parts of the connecting arms are provided with positioning holes 20, and the positioning holes 20 on the two sides are symmetrical along the axis of the connecting shaft 12. Meanwhile, a positioning pin 19 corresponding to the positioning hole 20 is arranged on the sliding block 14 corresponding to the driven overturning assembly 9, and the positioning pin 19 can be inserted and matched into the positioning hole 20.

Specifically, before clamping the ceramic disc 6, the slider 14 is positioned at the initial position, and the positioning pin 19 is inserted into the connecting hole at one side of the connecting shaft 12, so that the roll-over stand 13 does not rotate. When clamping the ceramic disc 6, the sliding block 14 moves towards the ceramic disc 6 so that the positioning pin 19 is separated from the positioning hole 20 on one side of the connecting shaft 12, and after overturning, the position of the positioning pin 19 changes to the other side of the connecting shaft 12 and corresponds to the positioning hole 20 on the other side of the connecting shaft 12 front and back. When the ceramic disc 6 is released, the sliding block 14 retreats, and the positioning pin 19 retreats synchronously to be inserted into the positioning hole 20, so that the roll-over stand 13 still cannot rotate.

As a structure for holding the ceramic disk 6 and transferring the ceramic disk 6, as shown in fig. 8 and 13, the lifting mechanism 31 includes a lifting frame 311, a plurality of lifting jigs 312, a first slide rail 314, and a first driving device 22 in this embodiment; wherein,

The first sliding rail 314 is arranged on the frame 29, the first sliding rail 314 extends along the distribution direction of the cleaning tank 7, the lifting frame 311 is slidably arranged on the first sliding rail 314, and the first driving device 22 is used for driving the lifting frame 311 to linearly move on the first sliding rail 314;

the lifting fixtures 312 are sequentially arranged on the lifting frame 311 along the distribution direction of the cleaning tanks 7 and are used for transferring the ceramic discs 6 between the first turnover mechanism 2 and the cleaning tanks 7, between any two adjacent cleaning tanks 7 and between the cleaning tanks 7 and the second turnover mechanism 4;

in particular, it should be noted that the cleaning device includes a frame 29 made of a profile, and the frame 29 is used as a mounting base for each mechanism, and the material box 5, the lifting and conveying mechanism 1, the first turnover mechanism 2, the lifting mechanism 31, the cleaning tank 7 and the second turnover mechanism 4 are all mounted on the frame. The entire lifting mechanism 31 is located above the cleaning tank 7. The first sliding rails 314 in the hoisting mechanism 31 are arranged on the frame along the distribution direction of the cleaning tank 7, and the first sliding rails 314 may be provided in two symmetrical ways. The hoisting frame 311 is mounted on the first sliding rail 314, the hoisting frame 311 is of a substantially flat plate structure, and two sides of the hoisting frame 311 are slidably connected with the corresponding first sliding rail 314. The first driving device 22 is mounted on the lifting frame 311, and is capable of driving the lifting frame 311 to move along the first sliding rail 314. To make the movement of the lifting frame 311 accurate, a guide belt groove 23 is installed at the upper end of the lifting frame 311 in this embodiment, a guide belt is assembled in the guide belt groove 23, and a first end of the guide belt is fixed to the frame and the other end is fixed to an end of the guide belt groove 23.

In one embodiment, the first driving device 22 may include a driving motor and a roller, the roller is mounted on the first sliding rail 314, and the driving motor can drive the roller to rotate, so as to drive the lifting frame 311 to move along the first sliding rail 314. In another embodiment, the first driving device 22 may include a driving motor, a gear and a rack, where the rack may be fixed on the rack, and the gear is meshed with the rack and is in driving connection with the driving motor, and the lifting frame 311 can be driven to move along the first sliding rail 314 by the driving motor driving the gear to rotate. It should be noted that the above description of the first driving device 22 in this embodiment is not limited to the above, and may be implemented by a suitable structure according to practical requirements.

As shown in fig. 13, a lifting jig 312 is mounted on the lower surface of the lifting frame 311, and the lifting jig 312 mainly clamps, releases and lifts the ceramic disc 6, and according to its function, the lifting jig 312 generally includes a portion having a lifting function and a portion having a clamping function, and both may be mounted in series. As shown in fig. 14, in one embodiment, the lifting clamp 312 includes a first lateral mounting plate 3120, a vertical mounting plate 3121, and a second lateral mounting plate 3122, the first lateral mounting plate 3120 being secured to the lifting frame 311, the vertical mounting plate 3121 being secured to the first lateral mounting plate 3120. A vertical screw transmission mechanism is arranged on the vertical mounting plate 3121, a driving mechanism corresponding to the screw transmission mechanism is arranged on the first transverse mounting plate 3120, and the screw in the screw transmission mechanism is driven to rotate by driving the screw fixed shaft through the cooperation of a motor and a belt wheel. The second transverse mounting plate 3122 is fixed to the nut slider of the screw drive mechanism, and the lifting of the second transverse mounting plate is controlled by the rotation of the screw.

Clamping means may be arranged on the second transverse mounting plate 3122, in particular clamping means may be clamping jaws 3123 mounted at both ends of the second transverse mounting plate 3122, the clamping of the ceramic discs 6 being achieved by a relative movement of the two clamping jaws 3123 on the second transverse mounting plate 3122 and the release of the ceramic discs 6 being achieved by a relative movement. The movement driving of the two clamping jaws 3123 can be achieved by configuring two cylinders or two linear movement mechanisms.

In the present embodiment, the lifting frame 311 substantially reciprocates from the initial position to the position corresponding to the first tilting mechanism 2. Specifically, the number of the cleaning tanks 7 is four, and the number of the lifting jigs 312 is also four. At the time of the first loading, the initial position of the lifting frame 311 is the position of each lifting jig 312 corresponding to each cleaning tank 7. After the first ceramic disc 6 is turned over by the first turning mechanism 2, the lifting frame 311 moves from the initial position to the position corresponding to the first turning mechanism 2, at this time, the first lifting clamp 312 corresponds to the ceramic disc 6 on the first turning mechanism 2, the first lifting clamp 312 acts to clamp and lift the first ceramic disc 6, then the lifting frame 311 returns to the initial position, at this time, the first lifting clamp 312 corresponds to the first cleaning tank 7, the lifting clamp 312 acts to place the ceramic disc 6 into the cleaning tank 7, and in this process, the lifting transfer mechanism and the first turning mechanism 2 continuously act to complete the taking out and turning of the second ceramic disc 6. The lifting frame 311 returns to the position corresponding to the first turnover mechanism 2 from the initial position again, at this time, the first lifting clamp 312 and the second lifting clamp 312 synchronously act, the first lifting clamp 312 clamps the ceramic disc 6 on the first turnover mechanism 2 currently, the second lifting clamp 312 clamps the ceramic disc 6 in the first cleaning tank 7 and synchronously lifts the two ceramic discs 6, then the lifting frame 311 returns to the initial position again, at this time, the second ceramic disc 6 corresponds to the first cleaning tank 7, the first ceramic disc 6 corresponds to the second cleaning tank 7, and then both the two ceramic discs 6 are placed in the corresponding cleaning tanks 7.

After all the cleaning tanks 7 are internally provided with the ceramic discs 6, the ceramic discs 6 in the cleaning tanks 7 at the tail ends need to be transported to the second turnover mechanism 4 after the cleaning is completed. In one embodiment, the number of lifting jigs 312 is one more than the number of cleaning tanks 7, and when the lifting frame 311 is located at the initial position, the lifting jigs 312 at the end correspond to the position of the second tilting mechanism 4, so that the lifting jigs 312 at the end can transfer the ceramic discs 6 in the cleaning tanks 7 at the end to the second tilting mechanism 4 during the reciprocating movement of the lifting frame 311.

The arrangement of the lifting frame 311 and the lifting clamp 312 in this embodiment enables the taking, cleaning and transferring of the ceramic disc 6 to be performed continuously, and further improves the cleaning efficiency of the ceramic disc 6.

In one embodiment, to reduce the use of lifting fixtures 312, the number of lifting fixtures 312 of the present embodiment corresponds to the number of cleaning tanks 7. As shown in fig. 9 and 13, in this embodiment, in order to realize the transfer of the ceramic disc 6 in the end cleaning tank 7 to the second tilting mechanism 4, the lifting mechanism 31 further includes a transfer frame 313, a second driving device 26, and a second slide rail 27;

the second sliding rail 27 is fixedly arranged on the lifting frame 311 and is positioned at one end of the first sliding rail far away from the first turnover mechanism 2;

The second sliding rail 27 is not parallel to the first sliding rail, the transport frame 313 is slidably mounted on the second sliding rail 27, and the second driving device 26 is used for driving the transport frame 313 to linearly move on the second sliding rail 27;

one lifting jig 312 farthest from the first tilting mechanism 2 among the plurality of lifting jigs 312 is provided as a transfer jig 24, and the transfer jig 24 is provided on a transfer frame 313 for transferring the ceramic disk 6 in the last cleaning tank 7 to the second tilting mechanism 4 and transferring the ceramic disk 6 in the last cleaning tank 7 to the last cleaning tank 7.

In particular, it should be noted that, when the transfer of the ceramic disc 6 at the end to the second turnover mechanism 4 is still achieved by the reciprocating motion of the lifting frame 311, the number of lifting fixtures 312 is large, and meanwhile, the lateral length of the lifting frame 311 is long, which results in an increase in the lateral occupied area of the whole apparatus. While simply reducing the number of lifting jigs 312, the ceramic disk 6 at the end cannot be transferred to the second tilting mechanism 4 by only the reciprocating movement of the lifting frame 311. For this purpose, in order to reduce the number of lifting jigs 312 and reduce the lateral length of the device, a movable transporting frame 313 is additionally configured on the basis of the lifting frame 311 to assist the lifting jigs 312 at the end to move independently with respect to the lifting frame 311, and the moving direction of the movable transporting frame 313 is different from the moving direction of the lifting frame 311, and the moving direction thereof may be the lateral direction of the lifting frame 311.

In the present embodiment, as shown in fig. 13, a transfer frame 313, a second driving device 26 and a second sliding rail 27 are additionally disposed on the basis of the disposition of the lifting frame 311, and the second sliding rail 27 determines the moving direction of the transfer frame 313, so that the second sliding rail 27 is not parallel to the first sliding rail in order to reduce the lateral occupied length, and preferably, the second sliding rail 27 is perpendicular to the first sliding rail in order to reduce the lateral occupied length maximally. The transport frame 313 is slidably connected to the second sliding rail 27, and the second driving device 26 mounted on the transport frame 313 is used for walking along the second sliding rail 27, so as to drive the lifting clamp 312 at the tail end to move from the position of the cleaning tank 7 at the tail end to the position corresponding to the second turning mechanism 4.

In this embodiment, since the transfer frame 313 and the second sliding rail 27 are still integrally mounted on the lifting frame 311, that is, the whole body needs to reciprocate along with the lifting frame 311, in the process of performing one reciprocation of the lifting frame 311, the transfer frame 313 needs to independently perform one reciprocation, that is, the lifting clamp 312 driving the end moves from the cleaning tank 7 to the position corresponding to the second turnover mechanism 4, and moves from the position corresponding to the second turnover mechanism 4 to the position corresponding to the cleaning tank 7. Specifically, when the lifting jig 312 (i.e., the transfer jig 24) at the end releases the held ceramic disk 6 into the cleaning bath 7 at the end for ultrasonic cleaning when the lifting jig 311 returns to the initial position, the transfer jig 24 holds the ceramic disk 6, transfers the ceramic disk 6 to the position corresponding to the second tilting mechanism 4 via the transfer jig 313 and releases the ceramic disk 6 before the lifting jig 311 moves again, and then moves to the position corresponding to the cleaning bath 7 via the transfer jig 313.

In another embodiment, the process of moving the transfer jig 24 from the position corresponding to the second tilting mechanism 4 to the position corresponding to the rinse tank 7 may be performed in synchronization with the process of moving the lifting frame 311 again, and it is only necessary to ensure that the transfer jig 24 moves to the position corresponding to the penultimate rinse tank 7 while the lifting frame 311 moves to the first lifting jig 312 moves to the position corresponding to the first tilting mechanism 2. In this manner, the frequency of movement of the lifting frame 311 is further increased, so that the cleaning efficiency of the ceramic disk 6 is further improved.

Corresponding to the present embodiment, the cleaning time of the same ceramic disk 6 in the end cleaning tank 7 will be smaller than the cleaning time in the other cleaning tanks 7, and at the same time, since the ceramic disk 6 has been subjected to the cleaning a plurality of times before the ultrasonic cleaning in the end cleaning tank 7, the cleaning effect can be satisfied even if the cleaning time is short.

The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modifications, equivalent substitutions, improvements, or the like, which are within the spirit and principles of the present application, are intended to be included within the scope of the present application.

Claims

1. The utility model provides a flexible sucking disc of wafer no wax polishing material loading equipment which characterized in that includes: a flexible backbone and a flexible seal flare; wherein,

2. The flexible suction cup of claim 1, wherein a total stiffness of the flexible suction cup is a sum of a stiffness of a gas enclosed within the flexible seal flare when the flexible seal flare is suctioned to a wafer and the resultant stiffness, the total stiffness of the flexible suction cup being less than the wafer stiffness.

3. The flexible suction cup of claim 2, wherein the flexible suction cup has a total stiffness less than the wafer stiffness under a downward force when the wafer is attached to the wax free pad of the ceramic disk.

4. The flexible suction cup of claim 1, wherein the relationship between the stiffness of the flexible sealing flare, the stiffness of the flexible backbone, and the resultant stiffness is as follows:

；

wherein,for the purpose of synthetic stiffness->Rigidity of flaring for flexible seal, +.> ₁ Poisson's ratio for flexible seal flare, +.> ₁ For flexible sealing the material thickness of the flaring> ₁ For the elastic modulus of the flexible sealing flare, +.> ₁ An outer diameter of the flaring member being a flexible seal;

5. The flexible suction cup of claim 2, wherein the flexible seal flare seals the stiffness of the gas within the flexible seal flare when wafers are suckedThe method comprises the following steps:

；

the total rigidity of the flexible sucker is as follows:；

wherein R is a thermodynamic constant, n is the molecular number of the gas, Temperature of gas, +.>Is gaseousHeight of the steel plate; />Is the total rigidity of the flexible sucker.

6. The flexible suction cup as claimed in any one of claims 1 to 5, wherein the open end diameter of the flexible backbone is smaller than the open end diameter of the flexible sealing flare.

7. The flexible suction cup as claimed in claim 6, wherein the edge thickness of the flexible skeleton is tapered from inside to outside.

8. The flexible suction cup of claim 7, wherein an outer edge of the flexible backbone is tilted in a direction away from the flexible sealing flare such that a gap is formed between the outer edge of the flexible backbone and the flexible sealing flare.

9. The flexible suction cup of claim 1, further comprising a housing and a negative pressure air channel, the negative pressure air channel being disposed within the housing, the flexible backbone and the flexible sealing flare each being disposed at a lower end of the housing;

10. A wafer wax-free polishing feeding device comprising a flexible suction cup according to any one of claims 1 to 9.