CN216288363U

CN216288363U - Vacuum suction pen

Info

Publication number: CN216288363U
Application number: CN202122816146.1U
Authority: CN
Inventors: 张志文; 马兰秀; 高建
Original assignee: Beijing Yandong Microelectronic Technology Co ltd
Current assignee: Beijing Yandong Microelectronic Technology Co ltd
Priority date: 2021-11-17
Filing date: 2021-11-17
Publication date: 2022-04-12
Anticipated expiration: 2031-11-17

Abstract

The application discloses a vacuum suction pen, which comprises a main body, a connecting pipe and a sucker, wherein the main body, the connecting pipe and the sucker are sequentially communicated, the sucker comprises a first umbrella-shaped structure and a second umbrella-shaped structure which are connected, and an included angle between the edge of the first umbrella-shaped structure and an axis is larger than an included angle between the edge of the second umbrella-shaped structure and the axis; the main body is used for being communicated with a vacuum system, so that the first umbrella-shaped structure can deform under the action of negative pressure and is attached to the surface of the wafer. According to the vacuum suction pen, the sucker at the picking end is designed into a two-section umbrella-shaped structure, so that the contact area between the sucker and a wafer is increased, and the pressure applied to the wafer is reduced; and the wafer is uniformly stressed, and the problems of edge breakage, breakage and the like are not easy to occur. The vacuum suction pen is particularly suitable for picking and transferring thinned wafers.

Description

Vacuum suction pen

Technical Field

The utility model relates to the technical field of semiconductor wafer processing, in particular to a vacuum suction pen.

Background

In semiconductor wafer design and manufacture, the back side of the wafer is usually used as an electrode of a device, such as the anode or cathode of a diode, the collector of a triode, the drain of a MOS transistor, etc. In specific applications, many devices have very high requirements on resistance, and it is particularly desirable to have as small a bulk resistance as possible, and reducing the bulk resistance by reducing the wafer thickness is a common approach at present. However, the thinned wafer is easily scratched, cracked or even broken in the moving process. For operators, picking up and transferring thinned wafers are difficult, and the difficulty is higher and higher as the size of the wafers is increased. Although integrated equipment combination, new mechanical arms and tool fixtures are continuously developed and popularized, the application of the new technical means on the traditional production line brings about a great increase of modification cost, so that the new technical means is difficult to be widely applied to the traditional production line.

The thinned wafer is relatively brittle in physical characteristics, and is prone to causing abnormal damages such as edge breakage and chipping. The edge of the wafer clamped by the traditional metal tweezers or plastic tweezers is easy to scratch the wafer, and the wafer is cracked when the wafer is serious. And the larger the wafer size, the higher the rate of wafer damage caused by the tweezers. Therefore, a vacuum suction pen is mostly adopted to pick up the thinned wafer on the current production line. To avoid contamination, the vacuum chuck does not directly contact the wafer backside during backside processing (e.g., backside metallization), but rather contacts the wafer front side. However, the conventional vacuum suction pen is easy to scratch the front surface of the wafer, so that the normal performance of the die is affected and even the die fails.

Therefore, it is desirable to design a vacuum suction pen that can solve the above problems and is economical and simple.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a vacuum suction pen, which is used for solving the defects of the existing wafer picking device and enabling the picking and transferring operations of wafers, particularly thinned wafers, and the like to be conveniently and safely completed.

In order to achieve the purpose, the utility model provides a vacuum suction pen, which comprises a main body, a connecting pipe and a sucker which are sequentially communicated, wherein the sucker comprises a first umbrella-shaped structure and a second umbrella-shaped structure which are connected, and an included angle between the edge of the first umbrella-shaped structure and an axis is larger than an included angle between the edge of the second umbrella-shaped structure and the axis; the main body is used for being communicated with a vacuum system, so that the first umbrella-shaped structure can deform under the action of negative pressure and is attached to the surface of the wafer.

Preferably, the edge of the first umbrella structure is at an angle of 45 ° to 60 ° to the axis; the edge of the second umbrella structure 112 is at an angle of 30 to 45 to the axis.

Preferably, the inner surface of the first umbrella-shaped structure for adhering to the surface of the wafer is provided with a plurality of protrusions.

Preferably, the plurality of projections are in a single ring or multiple rings arrangement.

Preferably, the second umbrella-shaped structure comprises a connecting part, and the second umbrella-shaped structure is detachably connected with the connecting pipe through the connecting part.

Preferably, the port diameter of the first umbrella structure which is not connected with the second umbrella structure is 20mm to 50 mm.

Preferably, the stiffness of the first umbrella structure is less than or equal to the stiffness of the second umbrella structure.

Preferably, the included angle between the axes of the two ends of the connecting pipe is 15-60 °; alternatively, an angle between a length direction of the connection pipe and a length direction of the main body is 15 ° to 60 °.

Preferably, the connecting pipe comprises at least two sections of rigid pipes, and the two adjacent sections of rigid pipes are connected through a corrugated pipe.

Preferably, a switch is provided on the main body to control communication or disconnection between the main body and the vacuum system.

Preferably, a negative pressure gear adjusting button is arranged on the main body.

According to the vacuum suction pen provided by the utility model, the sucking disc at the picking end is designed into a two-section umbrella-shaped structure, the included angle between the first umbrella-shaped structure close to the wafer and the axis is larger than the included angle between the second umbrella-shaped structure far away from the wafer and the axis, and the first umbrella-shaped structure can deform under the action of a vacuum system to enable the inner surface of the first umbrella-shaped structure to be attached to the surface of the wafer; on the other hand, the contact area between the sucker and the wafer is controllable, the wafer can be uniformly stressed, and the problems of edge breakage, breakage and the like are not easy to occur. In addition, through the structure, the wafer is convenient to absorb and release by the vacuum suction pen, the mechanical damage to the surface of the wafer is avoided, and the scratch and other problems are reduced. Therefore, the vacuum suction pen provided by the utility model is simple in structure, convenient to use and especially suitable for picking and transferring thinned wafers.

Furthermore, the connecting pipe is specially arranged, so that the connecting pipe has a certain inclination angle or a certain bending angle, or the bending angle of the connecting pipe is further adjustable, the vacuum suction pen is further convenient to use, and the damage to the wafer caused by the vacuum suction pen in the process of picking up the wafer can be avoided to a certain extent.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings.

FIG. 1 illustrates a front view of a vacuum wand provided in accordance with a first embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a suction cup of a vacuum wand according to a first embodiment of the present invention;

FIG. 3 illustrates a front view of a vacuum wand provided in accordance with a second embodiment of the present invention;

fig. 4 illustrates a bottom view of a vacuum wand provided in accordance with a second embodiment of the present invention.

Detailed Description

The technical solution of the present invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by like reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. In addition, certain well known components may not be shown.

For convenience of description, in the following description, a direction in which the vacuum wand faces the wafer is defined as "front", and a direction in which the vacuum wand faces away from the wafer is defined as "rear". Of course, the above definitions are for convenience only and in accordance with the ordinary and customary usage, and are not intended to limit the scope of the claims.

The present invention may be embodied in various forms, some specific embodiments of which will be described below. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Fig. 1 illustrates a front view of a vacuum wand provided in a first embodiment of the present invention, which includes a suction cup 110, a connection tube 120, and a main body 130, as shown in fig. 1. The rear end of the main body 130 communicates with an external vacuum system (not shown) through a hose 140, for example, and the front end of the main body 130 is connected to and communicates with the suction cup 110 through a connection pipe 120.

The main body 130 is, for example, a handle, and the inside of the main body 130 is, for example, hollow in design, so that an external vacuum system can be connected to the suction cup 110 via the hose 140, the main body 130, and the connection pipe 120 to form an air passage. The main body 130 is provided with a switch 131 to control the on/off of the air passage. For example, when the switch 131 is pressed, the air passage is connected, and when the switch 131 is lifted, the air passage is disconnected. The above-mentioned switch is generally provided at a front end portion of the main body 130 to facilitate the operation.

Further, a button 132 may be transversely disposed behind the switch 131, and the button 132 is a shift adjustment button to adjust the suction force of the vacuum system, i.e., the suction force of the chuck 110 on the wafer. Specifically, the button 132 is, for example, a column-shaped button that can be pushed, the button 132 transversely penetrates through the left and right sides of the main body 130, that is, the extending direction of the button 132 is perpendicular to the movable direction of the switch 131, the length of the button 132 is greater than the diameter of the main body 130, a stop (not shown) connected to the button 132 is arranged inside the main body 130, when the button 132 is at different positions, the stop inside the main body 130 blocks the air passage inside the main body 130 to different degrees, and the position of the button 132 is switched by pushing the portion of the button 132 protruding out of the main body 130, so as to realize gear shifting.

The connection tube 120 may be made of a material having a certain rigidity, such as a metal material. The connection tube 120 is inclined or curved to facilitate picking up wafers from a wafer storage container such as a cassette. Specifically, the length direction of the connection tube 120 and the length direction of the main body 130 have an included angle therebetween, such as 15 ° to 60 °, and further such as 15 ° to 45 °, that is, the inclination angle of the connection tube 120 relative to the main body 130 is 15 ° to 60 °, and further such as 15 ° to 45 °. Alternatively, as shown in fig. 1, the connection pipe 120 is a bent pipe having a corner, and the corner θ may be 15 ° to 60 °, and further 15 ° to 45 °. For example, the connection tube 120 has a two-segment structure, and a corner is formed at a connection position between the two segments, or the connection tube 120 is integrally formed and bent at a suitable position to form the corner. It will be appreciated that the corners preferably have a curvature, i.e. the corners are chamfered.

The suction cup 110 includes a two-stage umbrella structure with different angles, one end (i.e. front end) of the suction cup 110 has a trumpet-shaped wide-angle opening with a diameter of 20mm to 50mm, and further 35mm to 50mm, and the other end (i.e. rear end) has a connection portion 113 connected to the connection pipe 120.

Fig. 2 is a schematic structural diagram illustrating a chuck in a vacuum wand according to a first embodiment of the present invention, and as shown in fig. 2, the chuck 110 includes a first umbrella-shaped structure 111 and a second umbrella-shaped structure 112, wherein a front end of the first umbrella-shaped structure 111 is used for adsorbing a wafer, a front end of the second umbrella-shaped structure 112 is connected to the first umbrella-shaped structure 111, and the second umbrella-shaped structure 112 is connected to a connecting pipe 120 through a connecting portion 113 at a rear end of the second umbrella-shaped structure.

The angle a between the edge of the first umbrella structure 111 and the axis is larger than the angle β between the edge of the second umbrella structure 112 and the axis. Or, the first umbrella-shaped structure 111 and the second umbrella-shaped structure 112 correspond to the side surfaces of the two circular truncated cones, respectively, and an included angle α between the side surface of the circular truncated cone corresponding to the first umbrella-shaped structure 111 and a generatrix of the circular truncated cone is larger than an included angle β between the side surface of the circular truncated cone corresponding to the second umbrella-shaped structure 112 and the generatrix of the circular truncated cone. Through the arrangement, the contact area between the suction cup 110, specifically the inner surface of the first umbrella-shaped structure 111 and the wafer is large enough, stable and controllable, that is, on the premise of reducing the pressure of the vacuum suction pen to the wafer in the suction state, the wafer can be firmly and reliably adsorbed by the first umbrella-shaped structure 111, and the wafer falling and even the fragment can be avoided. In addition, when a wafer is sucked, because the included angle between the first umbrella-shaped structure 111 and the surface of the wafer is smaller, the wafer is more easily deformed under the action of negative pressure and is attached to the wafer, and therefore the wafer is sucked quickly; and similarly, the wafer can be rapidly released.

In this embodiment, the size of the first umbrella structure 111 may be determined according to the size of the wafer, and it can be understood that the larger the size of the wafer is, the larger the size of the first umbrella structure 111 should be, so as to provide a sufficiently large contact area and suction force. In a specific implementation process, the length of the circular truncated cone side surface corresponding to the first umbrella-shaped structure 111 may be 3mm to 7 mm.

The suction cup 110 is made of, for example, a flexible antistatic material, and includes a material having a certain flexibility, such as nitrile rubber or silicone rubber containing an antistatic agent component, so that when a wafer is sucked, the first umbrella-shaped structure 111 can be spread as much as possible, so that the inner surface of the first umbrella-shaped structure is sufficiently attached to the surface of the wafer, a sufficiently large contact area between the first umbrella-shaped structure and the wafer is ensured, and firm suction is realized. In the specific implementation process, the hardness of the first umbrella-shaped structure 111 can be controlled to be equal to or slightly less than that of the second umbrella-shaped structure 112, so that on the premise of ensuring that the first umbrella-shaped structure 111 is fully attached to the wafer, the suction cup 110 still has certain hardness and structural strength, and the suction cup 110 is prevented from being deformed greatly, which is not only unfavorable for actually controlling and operating the vacuum suction pen, but also may affect the adsorption force between the vacuum suction pen and the wafer. In the specific implementation process, the hardness of the first umbrella-shaped structure 111 and the second umbrella-shaped structure 112 can be adjusted by respectively selecting appropriate materials or controlling the thickness of the walls of the two (i.e. the thickness of the side surface of the truncated cone), and the like.

In this embodiment, the included angle α between the edge of the first umbrella-shaped structure 111 and the axis may be determined according to the material, the size and thickness of the wafer to be picked up, the size of the first umbrella-shaped structure 111, and other factors. If the first umbrella-shaped structure 111 is softer and is easy to deform, the included angle α can be correspondingly reduced; on the contrary, if the first umbrella-shaped structure 111 is hard and relatively hard to deform, the included angle α can be increased appropriately. If the size of the wafer to be picked up is larger, the size of the first umbrella-shaped structure 111 can be increased appropriately, and the included angle α can be decreased appropriately. In a specific implementation, the included angle α may be 45 ° to 60 °.

In addition to the sufficient contact between the first umbrella-shaped structure 111 and the wafer and the controllable contact area by adjusting the size, material, and angle α of the first umbrella-shaped structure 111, the contact area may also be adjusted and controlled by adjusting the angle β between the edge of the second umbrella-shaped structure 112 and the axis. In particular embodiments, the angle β between the edge of the second umbrella structure 112 and the axis may be controlled to be in the range of 30 ° to 45 °.

Further, the connection portion 113 and the connection tube 120 are detachably connected, for example, the connection portion 113 is sleeved outside the connection tube 120. Because sucking disc 110 can take place deformation when absorbing and releasing the wafer, easily cause fatigue and loss, so this sucking disc 110 can regard as the loss piece to change regularly, through setting connecting portion 113 and connecting pipe 120 to dismantling the connected mode, can realize the quick convenient change demand of sucking disc 110. Of course, the connection portion 113 and the connection pipe 120 should be hermetically connected.

Fig. 3 and 4 show a front view and a bottom view, respectively, of a vacuum wand provided in a second embodiment of the present invention, which has a structure similar to that of the first embodiment, the vacuum wand of the second embodiment including: similarly, one end (i.e., the rear end) of the main body 230 is connected to an external vacuum system (not shown) through a hose 240, and the other end (i.e., the front end) of the main body 230 is connected to and communicates with a connection part 213 at the rear end of the suction cup 210 through the connection pipe 220. The main body 230 is provided with a switch 231 for controlling the on-off of the air path, and a button 232 is transversely arranged behind the switch 231, wherein the button 232 is, for example, a gear adjusting button to adjust the suction force of the vacuum suction.

The second embodiment is different from the first embodiment in that the suction cup 210 and the connection pipe 220, wherein the connection pipe 220 includes two sections of rigid pipes, such as two sections of metal pipes, and the two sections of rigid pipes are connected by a corrugated pipe 221 to allow free adjustment of the bending angle of the connection pipe 220. Of course, the strength of the bellows 221 is required to ensure that the vacuum suction pen has sufficient strength and support when sucking or releasing the wafer, and that the vacuum suction pen does not deform or substantially deform during the entire operation. In addition, the connection pipe 220 is not limited to a metal material, and other materials may be used as long as they have certain structural strength and rigidity and are not easily deformed.

Fig. 4 shows an inner structure of the chuck 210, and specifically, the inner surface of the chuck 210 is provided with a plurality of protrusions 214, and the plurality of protrusions 214 are located inside the first umbrella-shaped structure to increase the friction coefficient with the wafer and prevent the sucked wafer from slipping off.

The plurality of protrusions 214 are, for example, arranged in a ring shape, and the plurality of protrusions 214 in the embodiment shown in fig. 4 are only distributed in a single ring shape, but in other embodiments, the plurality of protrusions 214 may be designed in a plurality of concentric ring shapes according to design requirements of the chuck 210, especially the size of the first umbrella structure, the size of the wafer, and the like; further, the protrusions 214 on different rings are staggered. Alternatively, the plurality of protrusions 214 may be arranged in other ways, such as a plurality of protrusions 214 divided into a plurality of groups, each group of protrusions 214 being arranged in a ring, and the rings formed by the protrusions 214 of different groups not being concentrically arranged.

In the specific implementation process, the deformation amount of the sucker under different suction forces can be changed by changing the thickness of the wall of the umbrella-shaped structure of the sucker, so that the required contact area and the suction force are realized, and the wafer picking requirements of different specifications are met.

According to the vacuum suction pen provided by the utility model, the sucking disc at the picking end is designed into a two-section umbrella-shaped structure, the included angle between the first umbrella-shaped structure close to the wafer and the axis is larger than the included angle between the second umbrella-shaped structure far away from the wafer and the axis, and the first umbrella-shaped structure can deform to enable the inner surface of the first umbrella-shaped structure to be attached to the surface of the wafer, so that when the wafer is sucked under the action of an external vacuum system, on one hand, the sucking disc has a larger contact area with the wafer, so that the pressure born by the wafer is reduced, and the mechanical damage to the wafer is avoided; on the other hand, the wafer is uniformly stressed, and the problems of edge breakage, breakage and the like are not easy to occur. Moreover, compared with the sucker adopting the one-section umbrella-shaped structure, the sucker adopting the two-section umbrella-shaped structure can control and stabilize the adsorption area (contact area) between the sucker and the wafer, ensure that the wafer can be firmly adsorbed, and avoid the wafer falling and even the fragment. In addition, through the structure, the wafer is convenient to absorb and release by the vacuum suction pen, the mechanical damage to the surface of the wafer is avoided, and the scratch and other problems are reduced. Therefore, the vacuum suction pen provided by the utility model has the advantages of simple structure, convenience in operation and low cost, and is particularly suitable for picking and transferring thinned wafers.

In the above description, technical details such as position combinations and connection modes of the respective components are not described in detail. It will be appreciated by those skilled in the art that the desired connection relationships, etc., may be formed by various technical means. In addition, in order to have the same function, those skilled in the art may also design a structure that is not exactly the same as the structure described above. In addition, although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination.

The embodiments of the present invention have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the utility model, and these alternatives and modifications are intended to fall within the scope of the utility model.

Claims

1. A vacuum suction pen is characterized by comprising a main body, a connecting pipe and a sucker which are sequentially communicated, wherein the sucker comprises a first umbrella-shaped structure and a second umbrella-shaped structure which are connected, and an included angle between the edge of the first umbrella-shaped structure and an axis is larger than an included angle between the edge of the second umbrella-shaped structure and the axis; the main body is used for being communicated with a vacuum system, so that the first umbrella-shaped structure can deform under the action of negative pressure and is attached to the surface of the wafer.

2. The vacuum wand of claim 1, wherein the edge of the first umbrella-like structure is angled from 45 ° to 60 ° from the axis; the angle between the edge of the second umbrella structure 112 and the axis is 30 ° to 45 °.

3. A vacuum wand as claimed in claim 1 or claim 2, wherein the inner surface of the first umbrella-like structure for engaging the surface of the wafer is provided with a plurality of protrusions.

4. The vacuum wand of claim 3, wherein the plurality of protrusions are arranged in a single ring or multiple rings.

5. The vacuum wand of claim 1 or 2, wherein the second umbrella structure comprises a connecting portion by which the second umbrella structure is detachably connected to the connecting tube.

6. The vacuum wand of claim 1 or 2, wherein the port of the first umbrella not connected to the second umbrella has a diameter of 20mm to 50 mm.

7. The vacuum wand of claim 1 or 2, wherein the first umbrella structure has a stiffness less than or equal to the stiffness of the second umbrella structure.

8. The vacuum wand of claim 1, wherein the angle between the axes of the two ends of the connecting tube is 15 ° to 60 °; or, an included angle between the length direction of the connecting pipe and the length direction of the main body is 15-60 degrees.

9. The vacuum wand of claim 1, wherein the connecting tube comprises at least two sections of rigid tubes, and two adjacent sections of rigid tubes are connected by a bellows.

10. The vacuum wand of claim 1, wherein a switch is provided on the main body to control communication or disconnection between the main body and the vacuum system.