CN111063628A - Chip bonding device - Google Patents
Chip bonding device Download PDFInfo
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- CN111063628A CN111063628A CN201811204204.1A CN201811204204A CN111063628A CN 111063628 A CN111063628 A CN 111063628A CN 201811204204 A CN201811204204 A CN 201811204204A CN 111063628 A CN111063628 A CN 111063628A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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Abstract
The invention discloses a chip bonding device. The chip bonding device comprises a chip separation unit, a first chip transmission unit, a chip position compensation unit, a second chip transmission unit and a bonding unit; the chip separation unit bears a first carrier with a plurality of chips and separates the chips from the first carrier; the chip position compensation unit comprises a compensation table, and the compensation table comprises a plurality of chip placement positions, a plurality of chip compensation positions and a plurality of chip connection positions; the first chip transmission unit sequentially puts the obtained chips to each chip placement position; the compensation platform moves the chip of each chip placement position to a chip compensation position to sequentially perform position compensation, and then moves the chip placement position to a chip connection position; and the second chip transmission unit acquires a plurality of chips from the chip cross-connecting position at one time and transfers the chips to the bonding unit to finish bonding operation. According to the technical scheme, the plurality of chips are bonded with the second slide glass at one time, so that the problem of low bonding efficiency in the prior art is solved, and the yield is effectively improved.
Description
Technical Field
The embodiment of the invention relates to a chip packaging technology, in particular to a chip bonding device.
Background
With the development of scientific technology, electronic products are increasingly developed towards lightness, thinness and miniaturization. Compared with the wafer-to-wafer bonding technology (wafer-to-wafer), the chip-to-wafer bonding technology (C2W) can test the performance of the chip in advance and remove the bad chips, so that the chip-to-wafer bonding technology has higher yield and lower product cost, and has greater advantages in multi-layer wafer bonding application, and the application of the chip bonding technology is increasing.
With the continuous development of chip bonding technology, the defects of yield and precision of chip bonding become more and more prominent, and the prior art generally adopts the sequential picking and placing and bonding of a single chip, so that the improvement of yield while ensuring high bonding precision has become the object of the industry efforts. The prior art has difficulty in improving the yield due to the speed limit of the movement mechanism.
Disclosure of Invention
The embodiment of the invention provides a chip bonding device, which aims to improve the chip bonding efficiency and the yield.
An embodiment of the present invention provides a chip bonding apparatus, including: the chip separation unit, the first chip transmission unit, the chip position compensation unit, the second chip transmission unit and the bonding unit;
the chip separation unit is used for bearing a first carrier with a plurality of chips and separating the chips from the first carrier when the first chip transmission unit acquires the chips;
the chip position compensation unit comprises a compensation table, and the compensation table comprises a plurality of chip placement positions, a plurality of chip compensation positions and a plurality of chip connection positions;
the first chip transmission unit sequentially puts the obtained chips to each chip placement position;
the compensation table is used for moving the chip of each chip placement position to the chip compensation position to sequentially perform position compensation and then moving the chip placement position to the chip connection position;
the second chip transmission unit is used for acquiring the plurality of chips on the compensation table from the chip cross-connecting position at one time, transferring the chips to the bonding unit and completing bonding operation with a second slide glass positioned on the bonding unit.
The embodiment of the invention provides a chip bonding device, which comprises a chip separation unit, a first chip transmission unit, a chip position compensation unit, a second chip transmission unit and a bonding unit, wherein the chip separation unit is used for separating chips from the chips; a first chip carrying a plurality of chips is carried by the chip separation unit, and the chips are separated from the first chip carrying when the first chip transmission unit obtains the chips; the chip position compensation unit comprises a compensation table, and the compensation table comprises a plurality of chip placement positions, a plurality of chip compensation positions and a plurality of chip connection positions; sequentially placing the obtained chips to each chip placing position through a first chip transmission unit; moving the chip of each chip placement position to a chip compensation position through a compensation table to sequentially perform position compensation, and then moving to a chip connection position; and acquiring a plurality of chips on the compensation table from the chip cross-connecting position at one time through the second chip transmission unit, transferring the chips to the bonding unit, and completing bonding operation with a second slide glass positioned on the bonding unit. Through once with a plurality of chips and second slide glass bonding, solve prior art and adopt the order of single chip to get when putting and bonding problem that bonding efficiency is low, effectively improve the productivity.
Drawings
Fig. 1 is a schematic structural diagram of a chip bonding apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic top view of the die bonding apparatus shown in FIG. 1;
fig. 3 is a schematic structural diagram of a first chip transmission unit according to an embodiment of the present invention;
FIG. 4 is a schematic top view of the first chip transfer unit shown in FIG. 3;
fig. 5 is a schematic partial structure diagram of a chip position compensation unit according to an embodiment of the present invention;
FIG. 6 is a schematic top view of the chip compensation unit shown in FIG. 5;
fig. 7 is a schematic structural diagram of an array nozzle unit according to an embodiment of the present invention;
FIG. 8 is a schematic bottom view of the array nozzle unit shown in FIG. 7;
FIG. 9 is a schematic structural diagram of another chip bonding apparatus provided in an embodiment of the present invention;
fig. 10 is a schematic flowchart of a chip bonding method according to an embodiment of the present invention.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. It should be noted that the terms "upper", "lower", "left", "right", and the like used in the description of the embodiments of the present invention are used in the angle shown in the drawings, and should not be construed as limiting the embodiments of the present invention. In addition, in this context, it is also to be understood that when an element is referred to as being "on" or "under" another element, it can be directly formed on "or" under "the other element or be indirectly formed on" or "under" the other element through an intermediate element. The terms "first," "second," and the like, are used for descriptive purposes only and not for purposes of limitation, and do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The specific meanings of the above-described terms in the present invention can be understood in specific cases by those skilled in the art.
Fig. 1 is a schematic structural diagram of a chip bonding apparatus according to an embodiment of the present invention, and fig. 2 is a schematic top view of the chip bonding apparatus shown in fig. 1. Referring to fig. 1 and 2, the chip bonding apparatus includes a chip separation unit 10, a first chip transfer unit 20, a chip position compensation unit 30, a second chip transfer unit 40, and a bonding unit 50; the chip separation unit 10 is configured to carry a first carrier sheet 102 with a plurality of chips 101, and separate the chips 101 from the first carrier sheet 102 when the first chip transfer unit 10 obtains the chips 101; the chip position compensation unit 30 includes a compensation stage 301, and the compensation stage 301 includes a plurality of chip placement bits 3011, a plurality of chip compensation bits 3012, and a plurality of chip handover bits 3013; the first chip transmission unit 20 sequentially places the obtained chips 101 at each chip placement position 3011; the compensation table 301 is used for moving the chip 101 of each chip placement position 3011 to a chip compensation position 3012 for position compensation in sequence, and then moving to a chip connection position 3013; the second chip transfer unit 40 is used for acquiring a plurality of chips 101 on the compensation table 301 from the chip handover position 3013 at a time, and transferring the chips to the bonding unit 50 to complete bonding operation with the second carrier 501 located in the bonding unit 50.
With reference to fig. 1 and fig. 2, a bonding process of the chip bonding apparatus according to the embodiment of the present invention is briefly described: placing a first carrier sheet 102 with a plurality of single chips 101 cut thereon on a chip separation unit 10, placing a second carrier sheet 501 with a plurality of bonding grooves on a bonding unit 50, and taking one chip 101 from the first carrier sheet 102 at a time by a first chip transfer unit 20 and conveying the chip 101 to a preset station of a chip placement position 3011 of a compensation station 301; repeating the above steps, placing all the preset stations (for example, 9 stations, forming a 3 × 3 array) of the chip placement position 3011 on the chip 101; the compensation stage 301 moves a preset station where the upper chip 101 is placed to the chip compensation position 3012, calculates the position of each chip 101, and performs position compensation on each chip 101 (for example, forming an equidistant 3 × 3 array); the plurality of chips 101 after the position compensation is completed are moved to the chip handover position 3013, the second chip transfer unit 40 is provided with a transfer structure corresponding to the plurality of chips 101 after the position compensation, and the transfer structure transfers the plurality of chips 101 to the bonding unit at a time to complete the bonding operation with the second carrier 501.
According to the technical scheme of the embodiment, a first carrier with a plurality of chips is borne by a chip separation unit, and the chips are separated from the first carrier when the first chip transmission unit acquires the chips; the chip position compensation unit comprises a compensation table, and the compensation table comprises a plurality of chip placement positions, a plurality of chip compensation positions and a plurality of chip connection positions; sequentially placing the obtained chips to each chip placing position through a first chip transmission unit; moving the chip of each chip placement position to a chip compensation position through a compensation table to sequentially perform position compensation, and then moving to a chip connection position; and acquiring a plurality of chips on the compensation table from the chip cross-connecting position at one time through the second chip transmission unit, transferring the chips to the bonding unit, and completing bonding operation with a second slide glass positioned on the bonding unit. Through once with a plurality of chips and second slide glass bonding, solve prior art and adopt the order of single chip to get when putting and bonding problem that bonding efficiency is low, effectively improve the productivity.
With continued reference to fig. 1, optionally, the chip detachment unit 10 includes a detachment station 103, an ejection mechanism 104, and a first visual alignment unit 105; the first visual alignment unit 105 is used to acquire a first image of the chip 101 on the first slide 102; the separating table 103 is used for driving the first slide 102 to move according to the first image so as to enable the chip to be obtained to correspond to the position of the ejecting mechanism 104; the ejection mechanism 104 is used to eject the chip to be acquired from the first slide 102 to separate the chip to be acquired from the first slide 102.
It is understood that the first carrier sheet 102 includes a blue film and a plurality of chips 101 adhered to the blue film, and since the blue film has strong adhesion to the chips 101 and is not easy to directly remove the chips 101 from the blue film, the ejection mechanism 104 is required to eject the chips 101 to separate the chips to be obtained from the first carrier sheet 102. The first visual alignment unit 105 may be a CCD camera, alignment marks may be disposed on the chip 101 and the separation stage 103, a first image of the chip 101 on the first carrier 102 is acquired by the first visual alignment unit 105, and the separation stage 103 drives the chip to be acquired to move above the ejection mechanism 104 according to the first image, so that the ejection mechanism 104 ejects the chip to be acquired.
Fig. 3 is a schematic structural diagram of a first chip transfer unit according to an embodiment of the present invention, and fig. 4 is a schematic top view of the first chip transfer unit shown in fig. 3. Referring to fig. 1 to 4, alternatively, the first chip transfer unit 20 includes a first driving mechanism 201 and a first suction nozzle 202; the first driving mechanism 201 comprises a rotating shaft 2011 and a side arm 2012, and the first suction nozzle 202 is connected with the side of the side arm 2012 departing from the rotating shaft 2011; the first suction nozzle 202 is used to suck up the chip 101 from the chip separation unit 10 and place the chip 101 at the chip placement position 3011.
Referring to fig. 3 and 4, the rotation shaft 2011 of the first driving mechanism 201 may rotate to move the first suction nozzle 202 between the chip separation unit and the chip position compensation unit; the rotating shaft 2011 can also extend and retract up and down to allow the first nozzle 202 to pick up or drop off a chip. The process of the first chip transfer unit 20 transferring the chip 101 to the chip placement bit 3011 is as follows: the rotation shaft 2011 of the first driving mechanism 201 performs a rotation motion to move the first suction nozzle 202 to a position right above the chip 101, at this time, the first suction nozzle 202 descends along the z direction to enable the first suction nozzle 202 to be in contact with and adsorbed by the chip 101, then the rotation shaft 2011 of the first driving mechanism 201 rises along the z direction and rotates the side arm 2012 to the chip placing position 3011, at this time, the compensation table 301 performs x, y and Rz adjustment to enable the chip 101 on the first suction nozzle 202 to be correctly placed at a predetermined station on the compensation table 301, and the above operations are repeated until all the plurality of predetermined stations on the compensation table 301 are placed with the chip 101.
Fig. 5 is a schematic diagram illustrating a partial structure of a chip position compensation unit according to an embodiment of the present invention, and fig. 6 is a schematic diagram illustrating a top view of the chip position compensation unit illustrated in fig. 5. Alternatively, referring to fig. 1, 5 and 6, the chip position compensation unit 30 further includes a second vision alignment unit 302 and a second suction nozzle 303 corresponding to the chip compensation position; the second visual alignment unit 302 is used for acquiring a second image of the chip at the chip compensation position; the second suction nozzle 303 is used for sucking up the chip located at the chip compensation position, and after the compensation platform completes position compensation according to the second image, the second suction nozzle 303 puts the chip back to the chip compensation position.
Optionally, the chip position compensation unit includes a plurality of compensation stages.
It will be appreciated that the yield of die bonding can be further improved by providing a plurality of compensation stations, each provided with a plurality of die placement sites, a plurality of die compensation sites and a plurality of die interface sites.
Optionally, with continued reference to fig. 2, the chip position compensation unit includes four compensation stages.
It should be noted that the number of the specific compensation tables may be set according to actual requirements, and the number of the compensation tables is not limited in the embodiment of the present invention.
Optionally, the compensation stage includes nine chip placement positions, nine chip compensation positions, and nine chip connection positions, and the nine chip placement positions, the nine chip compensation positions, and the nine chip connection positions are arranged in the same array shape.
Illustratively, the chip compensation station shown in fig. 6 includes 9 preset stations arranged in a 3 × 3 manner, and the compensation table can drive the preset stations to translate and rotate. Referring to fig. 1, 2 and 5, the process of chip position compensation is: the compensation platform 301 moves from the chip placement position 3011 to the chip compensation position 3012, the second vision alignment unit 302 collects a second image of the chip 101 on the compensation platform 301, the compensation platform 301 moves the chip 101, which has just collected the image, below the second suction nozzle 303, the second suction nozzle 303 descends along the z direction, so that the second suction nozzle 303 contacts and adsorbs the chip 101, then the second suction nozzle 303 ascends along the z direction, the compensation platform 301 performs position compensation according to the second image calculation result of the chip 101, after the compensation is completed, the second suction nozzle 303 descends along the z direction, the chip 101 is placed on the chip compensation position 3012 of the compensation platform 301, the above steps are repeated until the positions of all 9 chips 101 on the compensation platform 301 are completely compensated.
With continued reference to fig. 1 and 2, optionally, the second chip transfer unit 40 includes a first motion stage 401 and an array nozzle unit 402; the array suction nozzle unit 402 is configured to suck up a plurality of chips 101 at a time from the chip interface 3013 and release the plurality of chips 101 to a bonding slot on the second carrier 501 when the first moving stage 401 moves to the bonding unit 50, so as to complete a bonding operation.
It is understood that the first moving stage 401 can move the array nozzle unit 402 between the chip interface 3013 and the bonding unit 50 to transport a plurality of chips 101 at a time to complete the bonding operation. Fig. 7 is a schematic structural diagram of an array nozzle unit according to an embodiment of the present invention, and fig. 8 is a schematic bottom view of the array nozzle unit shown in fig. 7. Referring to fig. 7 and 8, the array nozzle unit 402 includes a plurality of third nozzles 4021, in this embodiment, the preset stations of the chip on the chip placement position 3011, the chip compensation position 3012 and the chip cross-connection position 3013 are 3 × 3 arrays, and the third nozzles 4021 correspond to the chip positions. In this embodiment, a plurality of x, y, Rz compensation stages 301 having an outline length and width dimension of 40mm × 40mm, an accuracy of ± 0.5 μm, and a stroke of 12mm are used, so that the position of a 3 × 3 array chip is first adjusted, and then the array chip is transferred and bonded at a time by the array nozzle unit 402, and the yield is greatly improved by the way of the advanced adjustment and batch bonding by the compensation stages 301. Although the second carrier 501 is generally circular, the bonding at the edge portion may not be performed at a portion of the array chips, resulting in a yield loss of 9 times that of the single chip bonding, but the yield is still improved by more than 6 times. Because the distance between the array nozzle units 402 is made according to the existing chip distance, when a new chip distance occurs, the array nozzle units 402 with different chip distances need to be customized according to the chip distance to meet the working condition requirements of different chip distances.
Alternatively, each nozzle of the array nozzle unit includes an air bag structure formed of a rubber material.
It should be noted that, in the prior art, the scheme of batch bonding is to precisely place the chips on a layer of thermal release film, and then bond the chips to the bonding grooves of the second carrier in batches. In this embodiment, the adopted array suction nozzle unit is composed of an array suction nozzle, the suction nozzle may be made of rubber, and the suction nozzle is easily compressed in the overall height direction, so that the difference of the bonding force caused by the non-uniform thickness of the chip is controllable. In addition, each suction nozzle of the array suction nozzle unit can be formed to pass through the air bag structure, when the air bag structure adsorbs the chip, the force is irrelevant to the height direction, namely when the chip is higher, the air bag structure expands in the transverse direction, and the chips with different heights can be adsorbed by the same adsorption force, so that the array suction nozzle unit can be compatible with the chips with larger thickness and inconsistent.
With continued reference to fig. 1, optionally, the second chip transfer unit 40 further includes a third visual alignment unit 403, the third visual alignment unit 403 moves along with the array nozzle unit 402, the third visual alignment unit 403 is used for aligning the array nozzle unit 402 with the plurality of chips 101 located at the chip interface position when the array nozzle unit 402 sucks up the chip 101, and is also used for aligning the array nozzle unit 402 with the bonding slot when the array nozzle unit 402 releases the chip 101.
Illustratively, referring to fig. 1 and 2, the third visual alignment unit 403 is located at the right side of the array nozzle unit 402 in the present embodiment, and the work process of the array nozzle unit 402 carrying a plurality of chips to the bonding unit 50 at a time to complete the bonding operation is as follows: after the compensation table 301 moves to the chip handover position 3012, the first motion table 401 carries the third visual alignment unit 403 to move above the compensation table 301, the position of the chip 101 on the compensation table 301 is observed, after the deviation of the chip position is calculated, the first motion table 401 carries the array suction nozzle unit 402 to move above the compensation table 301 with the adjusted position, the array suction nozzle unit 402 descends along the z direction, so that the array suction nozzle unit 402 contacts and adsorbs the chip 101, then the array suction nozzle unit 402 ascends along the z direction, then the first motion table 401 carries the third visual alignment unit 403 to move above the bonding groove of the second slide 501, image acquisition is performed on the bonding groove, after the deviation of the position is calculated, the first motion table 401 drives the array suction nozzle unit 402 to move above the bonding groove of the second slide 501, position deviation compensation in the x and y directions is performed, then the array suction nozzle unit 402 descends along the z direction, the chip 101 is bonded into the bonding slot of the second carrier 501.
Fig. 9 is a schematic structural diagram of another chip bonding apparatus according to an embodiment of the present invention. Referring to fig. 9, the die bonding apparatus further includes: a fourth vision alignment unit 404 located above the chip interface position, for aligning the array nozzle unit 402 with the plurality of chips 101 located at the chip interface position when the array nozzle unit 402 sucks up the chips 101; and a fifth vision alignment unit 405 above the bonding slot for aligning the array nozzle unit 402 with the bonding slot when the array nozzle unit 402 releases the chip 101.
It can be understood that the difference between the chip bonding apparatus shown in fig. 9 and fig. 1 is that the third visual alignment unit 403 is eliminated, the fourth visual alignment unit 404 and the fifth visual alignment unit 405 are provided, the steps are similar to the previous steps, by respectively providing the fourth visual alignment unit 404 and the fifth visual alignment unit 405, after the array suction nozzle unit 402 leaves the compensation stage 301, the fifth visual alignment unit 405 can synchronously acquire the image of the bonding groove on the second slide 501, and the first moving stage 401 can directly drive the array suction nozzle unit 402 to move above the bonding groove of the second slide 501 according to the image acquired by the fifth visual alignment unit 405 to perform the bonding operation, so that the yield can be further improved.
With continued reference to fig. 1 or 9, optionally, the bonding unit 50 includes a second moving stage 502, the second moving stage 502 is used for carrying a second slide 501 and performing focusing and leveling, and the second slide 501 includes a plurality of bonding grooves; the second moving stage 502 is also configured to rotate around the axis so that the bonding slot corresponds to the chip 101 sucked up by the array nozzle unit 402.
It can be understood that when the chip 101 is bonded to the second carrier 501, the chip 101 is required to correspond to the bonding groove, and the bonding operation is completed after the chip 101 is precisely aligned to the bonding groove and the chip 101 by the translation and rotation of the second motion stage.
With continued reference to fig. 1 or fig. 9, optionally, the chip bonding apparatus provided by the embodiment of the present invention further includes a first chip magazine 60 and a first robot 70, wherein the first chip magazine 60 is used for placing a first chip 102; the first robot 70 is used to take the first slide 102 out of the first magazine 60 and transport it to the chip separation unit 10.
With continued reference to fig. 1 or fig. 9, optionally, the chip bonding apparatus provided in the embodiment of the present invention further includes a second magazine 80 and a second robot 90, wherein the second magazine 80 is used for placing a second slide 501; the second robot 90 is used to retrieve and transport a second slide 501 from the second slide magazine 80 to the bonding unit 50.
It is understood that the first robot 70 and the second robot 90 may employ a structure similar to the first chip transfer unit for acquiring the first chip 102 and the second chip 501, respectively.
Fig. 10 is a schematic flow chart of a chip bonding method according to an embodiment of the present invention, where the chip bonding method according to the embodiment is executed by any one of the chip bonding apparatuses provided in the embodiments, and specifically includes the following steps:
and step 110, the first chip transmission unit sequentially obtains a plurality of chips from the first slide glass and places the chips to a chip placement position of the compensation table.
And step 120, the compensation table moves the chip of each chip placement position to a chip compensation position to perform position compensation in sequence, and then moves the chip placement position to a chip connection position.
And step 130, the second chip transmission unit acquires a plurality of chips on the compensation table from the chip cross joint position at a time, transfers the chips to the bonding unit, and completes bonding operation between the chips and a second slide glass positioned in the bonding unit.
The bonding process of the chip bonding method provided by the embodiment of the invention comprises the following steps: placing a first slide glass cut into a plurality of single chips on a chip separation unit, placing a second slide glass provided with a plurality of bonding grooves on a bonding unit, and obtaining one chip from the first slide glass by a first chip transmission unit at a time and conveying the chip to a preset station of a chip placement position of a compensation table; repeating the steps, and placing the chips on all preset stations (for example, 9 stations to form a 3 × 3 array) of the chip placement positions; the compensation table moves a preset station on which the chip is placed to a chip compensation position, calculates the position of each chip, and performs position compensation on each chip (for example, forming an equidistant 3 x 3 array); and moving the plurality of chips after the position compensation to a chip joint position, wherein the second chip transmission unit is provided with a transmission structure corresponding to the plurality of chips after the position compensation, and the transmission structure transfers the plurality of chips to the bonding unit at one time to complete bonding operation with the second slide glass.
According to the technical scheme of the embodiment, the obtained chips are sequentially placed to each chip placing position through the first chip transmission unit; moving the chip of each chip placement position to a chip compensation position through a compensation table to sequentially perform position compensation, and then moving to a chip connection position; and acquiring a plurality of chips on the compensation table from the chip cross-connecting position at one time through the second chip transmission unit, transferring the chips to the bonding unit, and completing bonding operation with a second slide glass positioned on the bonding unit. Through once with a plurality of chips and second slide glass bonding, solve prior art and adopt the order of single chip to get when putting and bonding problem that bonding efficiency is low, effectively improve the productivity.
Optionally, the chip separation unit includes a separation table, an ejection mechanism, and a first visual alignment unit, and the first chip transport unit includes a first driving mechanism and a first suction nozzle; the first driving mechanism comprises a rotating shaft and a side arm, and the first suction nozzle is connected with one side of the side arm, which is far away from the rotating shaft; the first chip transmission unit obtains a plurality of chips from the first slide glass in proper order to put the chip that the compensation platform put the position and include:
a first vision alignment unit acquires a first image of a chip on a first slide;
the separating table drives the first slide glass to move according to the first image so as to enable the chip to be obtained to correspond to the position of the ejection mechanism;
the ejection mechanism ejects the chip to be obtained from the first carrier so as to separate the chip to be obtained from the first carrier;
the first suction nozzle rotates to the position above the chip to be obtained along the rotating shaft so as to suck the chip to be obtained;
the first suction nozzle rotates to the position above the chip placing position along the rotating shaft so as to place the chip to be obtained at the chip placing position.
Optionally, the chip position compensation unit further includes a second visual alignment unit and a second suction nozzle corresponding to the chip compensation position; the chip that compensation platform put the position with every chip removes to chip compensation position and carries out position compensation in proper order, and it includes to remove to chip handing-over position again:
the second visual alignment unit acquires a second image of the chip at the chip compensation position;
the second suction nozzle sucks up the chip at the chip compensation position, and after the compensation platform completes position compensation according to the second image, the second suction nozzle puts the chip back to the chip compensation position;
and the compensation table moves the chip after the position compensation to a chip cross-connecting position.
Optionally, the second chip transfer unit includes a first motion stage and an array nozzle unit; the second chip transmission unit acquires a plurality of chips on the compensation table from the chip transfer position at a time, and transfers the chips to the bonding unit, including:
the array suction nozzle unit sucks up a plurality of chips at a time from the chip cross connection position;
the first moving table drives the array suction nozzle unit to move to the bonding unit.
Optionally, the chip bonding apparatus further includes a first chip library, a first manipulator, a second chip library, and a second manipulator; before first chip transmission unit obtains a plurality of chips from first slide glass in proper order to put the chip of compensation platform and place the position, still include:
the first mechanical arm takes the first slide out of the first slide warehouse and conveys the first slide to the chip separation unit;
the second robot takes the second slide from the second magazine and transports it to the bonding unit.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (14)
1. A chip bonding apparatus, comprising: the chip separation unit, the first chip transmission unit, the chip position compensation unit, the second chip transmission unit and the bonding unit;
the chip separation unit is used for bearing a first carrier with a plurality of chips and separating the chips from the first carrier when the first chip transmission unit acquires the chips;
the chip position compensation unit comprises a compensation table, and the compensation table comprises a plurality of chip placement positions, a plurality of chip compensation positions and a plurality of chip connection positions;
the first chip transmission unit sequentially puts the obtained chips to each chip placement position;
the compensation table is used for moving the chip of each chip placement position to the chip compensation position to sequentially perform position compensation and then moving the chip placement position to the chip connection position;
the second chip transmission unit is used for acquiring the plurality of chips on the compensation table from the chip cross-connecting position at one time, transferring the chips to the bonding unit and completing bonding operation with a second slide glass positioned on the bonding unit.
2. The chip bonding apparatus according to claim 1, wherein the chip separation unit includes a separation stage, an ejection mechanism, and a first visual alignment unit;
the first visual alignment unit is used for acquiring a first image of a chip on the first slide;
the separation table is used for driving the first slide glass to move according to the first image so as to enable the chip to be obtained to correspond to the position of the ejection mechanism;
the ejection mechanism is used for ejecting the chip to be obtained from the first carrier so as to separate the chip to be obtained from the first carrier.
3. The die bonding apparatus of claim 1, wherein the first chip transport unit includes a first driving mechanism and a first suction nozzle;
the first driving mechanism comprises a rotating shaft and a side arm, and the first suction nozzle is connected with one side of the side arm, which is far away from the rotating shaft;
the first suction nozzle is used for sucking the chip from the chip separation unit and placing the chip at the chip placing position.
4. The die bonding apparatus of claim 1, wherein the die position compensation unit comprises a plurality of compensation stages.
5. The die bonding apparatus of claim 4, wherein the die position compensation unit comprises four compensation stages.
6. The die bonding apparatus of claim 1, wherein the compensation station comprises nine die placement sites, nine die compensation sites, and nine die interface sites, the nine die placement sites, the nine die compensation sites, and the nine die interface sites being arranged in the same array shape.
7. The die bonding apparatus of claim 1, wherein the die position compensation unit further comprises a second vision alignment unit and a second suction nozzle corresponding to the die compensation position;
the second visual alignment unit is used for acquiring a second image of the chip positioned at the chip compensation position;
and the second suction nozzle is used for sucking up the chip positioned at the chip compensation position, and after the compensation platform completes position compensation according to the second image, the second suction nozzle puts the chip back to the chip compensation position.
8. The chip bonding apparatus according to claim 1, wherein the second chip transfer unit includes a first motion stage and an array nozzle unit;
the array suction nozzle unit is used for sucking up a plurality of chips from the chip connection position at one time and releasing the plurality of chips to the bonding groove on the second carrier when the first moving table moves to the bonding unit so as to complete bonding operation.
9. The die bonding apparatus of claim 8, wherein the second die transfer unit further comprises a third vision alignment unit, the third vision alignment unit moves along with the array nozzle unit, the third vision alignment unit is used for aligning the array nozzle unit with the plurality of dies located at the die interface position when the array nozzle unit sucks up the dies, and is also used for aligning the array nozzle unit with the bonding slot when the array nozzle unit releases the dies.
10. The die bonding apparatus of claim 8, further comprising:
the fourth visual alignment unit is positioned above the chip connection position and used for aligning the array suction nozzle unit and a plurality of chips positioned at the chip connection position when the array suction nozzle unit sucks up the chips;
and the fifth visual alignment unit is positioned above the bonding groove and used for aligning the array suction nozzle unit and the bonding groove when the array suction nozzle unit releases the chip.
11. The die bonding apparatus of claim 8, wherein the bonding unit comprises a second motion stage for carrying a second carrier and performing focusing and leveling, the second carrier comprising a plurality of bonding slots;
the second motion table is also used for rotating around an axis so that the bonding groove corresponds to the chip sucked by the array suction nozzle unit.
12. The die bonding apparatus of claim 8, wherein each nozzle of the array nozzle unit includes a bladder structure formed of a rubber material.
13. The bonding device of claim 1, further comprising a first magazine for holding the first slide and a first robot;
the first manipulator is used for taking the first slide out of the first slide warehouse and conveying the first slide to the chip separation unit.
14. The bonding device of claim 1, further comprising a second magazine for holding the second slide and a second robot;
the second robot is configured to remove the second slide from the second magazine and transport the second slide to the bonding unit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811204204.1A CN111063628A (en) | 2018-10-16 | 2018-10-16 | Chip bonding device |
| TW108137116A TW202017092A (en) | 2018-10-16 | 2019-10-15 | Chip bonding device including a chip separation unit, a first chip transfer unit, a chip position compensation unit, a second chip transfer unit and a bonding unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811204204.1A CN111063628A (en) | 2018-10-16 | 2018-10-16 | Chip bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111063628A true CN111063628A (en) | 2020-04-24 |
Family
ID=70296561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811204204.1A Pending CN111063628A (en) | 2018-10-16 | 2018-10-16 | Chip bonding device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111063628A (en) |
| TW (1) | TW202017092A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112271150A (en) * | 2020-10-28 | 2021-01-26 | 厦门乾照半导体科技有限公司 | Repairing equipment and repairing method for Micro-LED array |
| CN112563178A (en) * | 2021-02-23 | 2021-03-26 | 宁波群芯微电子有限责任公司 | Chip transfer manipulator |
| CN113013067A (en) * | 2021-03-01 | 2021-06-22 | 东莞市中麒光电技术有限公司 | Transfer method with detection and chip repair functions |
-
2018
- 2018-10-16 CN CN201811204204.1A patent/CN111063628A/en active Pending
-
2019
- 2019-10-15 TW TW108137116A patent/TW202017092A/en unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112271150A (en) * | 2020-10-28 | 2021-01-26 | 厦门乾照半导体科技有限公司 | Repairing equipment and repairing method for Micro-LED array |
| CN112563178A (en) * | 2021-02-23 | 2021-03-26 | 宁波群芯微电子有限责任公司 | Chip transfer manipulator |
| CN112563178B (en) * | 2021-02-23 | 2021-06-29 | 宁波群芯微电子有限责任公司 | Chip transfer manipulator |
| CN113013067A (en) * | 2021-03-01 | 2021-06-22 | 东莞市中麒光电技术有限公司 | Transfer method with detection and chip repair functions |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202017092A (en) | 2020-05-01 |
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