CN112850012A

CN112850012A - Automatic chip transfer equipment

Info

Publication number: CN112850012A
Application number: CN202011608066.0A
Authority: CN
Inventors: 高亚红; 蔡晓峰; 邓敏; 吴培结; 高宝
Original assignee: Unimos Microelectronics(shanghai) Ltd
Current assignee: Unimos Microelectronics(shanghai) Ltd
Priority date: 2020-12-30
Filing date: 2020-12-30
Publication date: 2021-05-28
Anticipated expiration: 2040-12-30
Also published as: CN112850012B

Abstract

The invention relates to the technical field of chips and discloses automatic chip transfer equipment. The chip automatic transfer device of the invention comprises: the chip transfer device is provided with a chip feeding station and a material receiving station, the grabbing moving device grabs a chip on the chip feeding device and places the chip feeding station, the material pipe on the material pipe placing frame is loaded by the material pipe feeding device and placed at the material receiving station, and the chip on the chip feeding station is transferred to the material pipe at the material receiving station by the chip transfer device. The automatic chip transfer equipment is controlled by the controller, the chip is automatically transferred from the chip tray to the material pipe, the chip is not damaged in the transfer process, and the product quality is ensured; and the equipment adopts a double-station design, so that the production efficiency is greatly improved.

Description

Automatic chip transfer equipment

Technical Field

The embodiment of the invention relates to the technical field of chips, in particular to automatic chip transfer equipment.

Background

The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous process of the wafer is cut into small chips (Die) after the dicing process, then the cut chips are pasted on the corresponding small island of the plate-shaped member (substrate or Lead frame) by conductive silver adhesive, and then the bonding pads (Bond Pad) of the chips are connected to the corresponding pins (Lead) of the plate-shaped member by using superfine metal (gold, silver, aluminum and copper) wires or conductive resin, and the required circuit is formed.

The processed chip needs to be placed on a machine table device for performance detection. The chip in production is placed in the chip charging tray, and the chip is required to be transferred and placed into the material pipe before performance detection is carried out, so that the performance of the chip is tested through the machine equipment.

However, in the prior art, the chip is transferred into the material tube manually, the production efficiency is low, and the chip is easily damaged due to the abnormality of chip bending, colloid cracking and the like during manual tube loading.

Disclosure of Invention

The invention aims to provide automatic chip transfer equipment, which automatically transfers chips in a chip tray into a material pipe so as to solve the problems in the background technology.

The embodiment of the invention provides automatic chip transfer equipment, which comprises: the device comprises a machine table, a chip tray, a material pipe tray, a tray placing frame, a material pipe placing frame, a chip feeding device, a material pipe feeding device, a grabbing and moving device, a chip transferring device and a controller;

the chip feeding device, the material pipe feeding device, the grabbing and moving device and the chip transferring device are arranged on the machine table and are respectively and electrically connected with the controller;

the chip tray is used for placing chips, and the chips are distributed on the chip tray in a matrix manner;

the material pipe tray is provided with a plurality of rectangular grooves, and the rectangular grooves correspond to the number of rows of chips on the chip tray;

the tray placing frame is arranged on the chip feeding device and used for stacking the chip trays;

the chip feeding device is used for moving the chip trays on the tray placing frame to a chip discharging station one by one;

the chip transfer device is arranged on two sides of the chip blanking station, and a chip feeding station and a material pipe receiving station are respectively arranged on two ends of the chip transfer device;

the material pipe placing frame is arranged on the machine table and used for placing material pipes;

the material pipe feeding devices are arranged on two sides of the chip feeding device and are positioned at one end of a material pipe receiving station of the chip transfer device;

the material pipe tray is arranged on the material pipe feeding device, and the material pipe feeding device is used for enabling the material pipe tray to receive the material pipes on the material pipe placing frame, enabling the material pipes to be flatly laid in the rectangular grooves and enabling the material pipes on the material pipe tray to move to the material pipe receiving station;

the grabbing and moving device is used for grabbing the chips of the chip blanking station and placing the grabbed chips to the chip feeding station;

the chip transfer device is used for transferring the chips on the chip loading station into the material pipe at the material receiving station of the material pipe.

Based on the scheme, the automatic chip transfer equipment comprises a machine table, a chip tray, a tray rack, a material pipe rack, a chip feeding device, a material pipe feeding device, a grabbing moving device, a chip transfer device and a controller, wherein the chip feeding device, the material pipe feeding device, the grabbing moving device and the chip transfer device are arranged on the machine table, the chip transfer device is arranged on two sides of a chip blanking station of the chip feeding device, a chip feeding station and a material pipe receiving station are respectively arranged at two ends of the chip transfer device, the material pipe feeding device moves a material pipe to the material pipe receiving station, the grabbing moving device grabs the chip to the chip feeding station, and the chip transfer device transfers the chip on the chip feeding station to the material pipe at the material pipe receiving station. The automatic chip transfer equipment is controlled by the controller, the chip is automatically transferred from the chip tray to the material pipe, the chip is not damaged in the transfer process, and the product quality is ensured; and the equipment adopts a double-station design, so that the production efficiency is greatly improved.

In one possible solution, the chip transfer device includes: a base and a cover plate;

the base is arranged on a first support of the machine table, and the cover plate covers the base;

the base is provided with a plurality of rectangular slideways, the rectangular slideways correspond to the rectangular grooves one by one, and the rectangular slideways form a chip feeding station and a material receiving station of the material pipe at two ends of the base respectively;

the base is in one side of chip material loading station is equipped with a plurality of gas connectors, gas connector with the rectangle is slided and is linked together, gas connector is used for being connected with high-pressure gas source.

In one possible solution, the chip transfer device further includes: a blocking mechanism;

a plurality of through holes corresponding to the rectangular slide rails are formed in one side, close to the material receiving station, of the cover plate;

the blocking mechanism includes: the device comprises a first cylinder, a first pressure plate and a plurality of stop rods;

the first air cylinder and the first pressing plate are arranged above the cover plate, the first pressing plate is connected with the first air cylinder, and the first air cylinder is used for driving the first pressing plate to lift;

the plurality of stop levers are arranged on the first pressing plate, and the first pressing plate enables the plurality of stop levers to respectively extend into the through holes when descending, so that the plurality of stop levers are used for pressing the chips in the rectangular slide way.

In one possible aspect, the chip loading apparatus includes: the device comprises a conveying mechanism, a first jacking mechanism and a first clamping mechanism;

the conveying mechanism includes: the conveying device comprises a conveying support, a first servo motor, a driving roller, a driven roller and a conveying belt;

the conveying support is arranged on the machine table, and the material tray placing frame is arranged on the conveying support;

the driving roller and the driven roller are respectively arranged at two ends of the conveying bracket and are in transmission connection through the conveying belt;

the first servo motor is arranged on the conveying support and is in transmission connection with the driving roller, and the first servo motor is used for driving the conveying belt to rotate;

the first clamping mechanism is arranged on the conveying support and used for clamping the chip material tray on the second layer of the material tray placing frame;

the first jacking mechanism is arranged on the conveying support and located below the material tray placing frame, the first jacking mechanism is used for bearing the bottommost chip material tray and placing the bearing chip material tray on the conveying belt, and the conveying belt moves the chip material tray to the chip blanking station when rotating.

In one possible approach, the first jacking mechanism includes: a second cylinder and a first jacking plate;

the first lifting plate is connected with the second cylinder, the second cylinder enables the first lifting plate to bear and support the chip tray when the second cylinder extends out, and the second cylinder enables the chip tray to be placed on the conveying belt when the second cylinder retracts;

first fixture is equipped with four, is located respectively four angle departments of charging tray rack, first fixture includes: a third cylinder and a first insert plate;

the first inserting plate is connected with the third cylinder, and the third cylinder is used for enabling the first inserting plate to be inserted into the chip tray above the lowest layer on the tray placing frame when extending out.

In one possible solution, the chip feeding apparatus further includes: a fixing mechanism;

the two fixing mechanisms are respectively arranged at two sides of the chip blanking station;

the fixing mechanism includes: a fourth cylinder and a clamping plate;

the clamping plate is connected with the fourth cylinder, and the fourth cylinder enables the clamping plate to clamp the chip tray when extending out, so that the chip tray is fixed on the chip blanking station.

In one possible solution, the chip feeding apparatus further includes: an empty tray collection mechanism;

empty charging tray collection mechanism sets up delivery support's end includes: the collecting rack, the second jacking mechanism and the second clamping mechanism;

the second climbing mechanism sets up the below of collecting the work or material rest includes: a fifth cylinder and a second jacking plate;

the second jacking plate is connected with the fifth cylinder, and the fifth cylinder is used for jacking the chip tray onto the collecting rack by the second jacking plate when extending out;

second fixture is equipped with four, is located respectively four corners department of collecting the work or material rest, second fixture includes: a sixth cylinder and a second insert plate;

the second picture peg with the sixth cylinder is connected, the sixth cylinder is used for making when stretching out the second picture peg inserts collect the bottommost on the work or material rest in the chip charging tray.

In one possible solution, the chip feeding apparatus further includes: a first sensor, a second sensor, and a third sensor;

the first sensor is arranged at the bottom end of the tray placing frame;

the second sensor is arranged on the conveying support and is positioned at the chip blanking station;

the third sensor is arranged at the top end of the collecting rack;

the first sensor, the second sensor and the third sensor are respectively electrically connected with the controller.

In one possible solution, the grasping and moving device includes: the device comprises a second servo motor, a first screw rod, a third servo motor, a second screw rod, a vacuum pump, a first sliding plate, a second sliding plate, a fixing plate and a plurality of vacuum suckers;

the second servo motor and the first screw rod are arranged on a third support of the machine table, and the first screw rod is connected with the second servo motor;

the first sliding plate is slidably arranged on the third support, the first sliding plate is meshed with the first screw rod, and the second servo motor is used for driving the first sliding plate to slide left and right;

the third servo motor and the second screw rod are arranged on the first sliding plate, and the second screw rod is connected with the third servo motor;

the second sliding plate is slidably arranged on the first sliding plate, the second sliding plate is meshed with the second screw rod, and the third servo motor is used for driving the second sliding plate to lift;

the vacuum pump and the fixing plate are arranged on the second sliding plate;

the vacuum chucks are arranged on the fixing plate and connected with the vacuum pump through a connecting hose, the number of the vacuum chucks corresponds to that of the rectangular grooves, the vacuum chucks are used for sucking chips on the chip blanking station and placing the sucked chips on the chip blanking station.

In one possible solution, the material pipe feeding device comprises: the fourth servo motor, the third screw rod, the third sliding plate, the seventh cylinder, the eighth cylinder, the ninth cylinder and the push plate;

the ninth cylinder is arranged on the second support of the machine table, and a movable rod of the seventh cylinder is used for supporting the material pipe on the material pipe placing frame when extending out;

the fourth servo motor and the third screw rod are arranged on a second bracket of the machine table, and the third screw rod is connected with the fourth servo motor;

the third sliding plate is slidably arranged on the second bracket and is engaged on the third screw rod;

the eighth cylinder is arranged on the third sliding plate, the material pipe tray is arranged on the third sliding plate in a penetrating mode through a sliding rod, and the material pipe tray is connected with the eighth cylinder;

the fourth servo motor is used for driving the material pipe tray to slide, and the material pipes on the material pipe placing frame are embedded into the rectangular grooves when the material pipe tray passes through the material pipe placing frame;

the eighth cylinder is used for driving the material pipe tray to lift, so that the material pipe is placed on the second support when the material pipe tray descends;

the push plate is connected with the ninth cylinder, and the ninth cylinder is used for enabling the push plate to push the material pipe to the material receiving station when extending out.

In a possible solution, the material pipe feeding device further includes: a pipe pressing mechanism;

pipe pressing mechanism sets up and is being close to material pipe connects material station department includes: a tenth cylinder and a second platen;

the second pressing plate is connected with the tenth air cylinder, the tenth air cylinder is used for driving the second pressing plate to lift, and the second pressing plate is used for pressing the material pipe at the material receiving station when descending.

In a possible solution, the material pipe feeding device further includes: a fourth sensor and a fifth sensor;

the fourth sensor is arranged at the bottom end of the material pipe placing frame;

the fifth sensor is arranged at the bottom of the rectangular groove;

the fourth sensor and the fifth sensor are respectively electrically connected with the controller.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic view of a feed tube according to the present invention;

FIG. 2 is an enlarged view taken at A in FIG. 1 in the present invention;

FIG. 3 is a schematic diagram of an automatic chip transfer apparatus according to an embodiment of the present invention;

FIG. 4 is a schematic view of a chip tray in an embodiment of the invention;

FIG. 5 is a schematic view of a material pipe tray according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a chip transfer device according to an embodiment of the invention;

FIG. 7 is an enlarged view of the front end of the chip transfer device in an embodiment of the present invention;

FIG. 8 is an enlarged rear end view of the chip transfer device in an embodiment of the present invention;

FIG. 9 is a schematic view of a chip loading apparatus according to an embodiment of the present invention;

FIG. 10 is an enlarged view of the front end of the chip loading device in an embodiment of the present invention;

FIG. 11 is an enlarged view of the rear end of the chip loading device in the embodiment of the present invention;

FIG. 12 is a schematic view of a grasping and moving device according to an embodiment of the present invention;

FIG. 13 is an enlarged view of a portion of the grasping and moving device in the embodiment of the present invention;

fig. 14 is a schematic view of a material pipe feeding device in an embodiment of the invention;

FIG. 15 is an enlarged view of the front end of the material pipe feeding device in the embodiment of the invention;

fig. 16 is an enlarged view of the rear end of the material pipe feeding device in the embodiment of the invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The technical solution of the present invention will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.

Like the description in the background of the application, the chip in production is placed in the chip charging tray, shifts the chip before carrying out the performance testing and places the material intraductal to carry out the performance test to the chip through board equipment.

The inventor of this application discovers, among the prior art, shifts the chip and relies on the manual work to go on in the material pipe, and production efficiency is low, and produces chip hook, colloid when artifical tubulation unusual such as collapse easily, causes the damage of chip.

In order to solve the above problems, the inventor of the present application proposes a technical solution of the present application, and specific embodiments are as follows:

as shown in fig. 1 to 16, the automatic chip transfer apparatus of the present embodiment is used for transferring chips placed in a chip tray into a material tube 100. As shown in fig. 1 and 2, the material tube 100 is a hollow strip, and a placement groove for inserting chips is provided inside the material tube.

As shown in fig. 3, the automatic chip transfer apparatus includes: the device comprises a machine table 1, a chip tray 21, a material pipe tray 22, a tray placing frame 31, a material pipe placing frame 32, a chip feeding device 4, a material pipe feeding device 5, a grabbing and moving device 6, a chip transfer device 7 and a controller.

A first support 11, a second support 12 and a third support 13 are arranged on the table top of the machine table 1.

The chip tray 21 is provided with a plurality of accommodating grooves 211, the accommodating grooves 211 are arranged on the chip tray 21 in a matrix manner, and the chips are placed in the accommodating grooves 211 of the chip tray, so that the chips are placed on the chip tray 21 in a matrix manner. The four corners of the bottom of the chip tray 21 are provided with slots.

The top surface of the material pipe tray 22 is provided with a plurality of rectangular grooves 221, the plurality of rectangular grooves 221 are arranged in parallel on the material pipe tray at equal intervals, and the depth of each rectangular groove 221 corresponds to the thickness of a material pipe. The number of the rectangular grooves 221 on the tube tray 22 corresponds to the number of the accommodating grooves 211 on the chip tray 21. In this embodiment, the chip tray is provided with eleven rows of receiving grooves 211, and correspondingly, the material tube tray is provided with eleven rectangular grooves 221.

The chip feeding device 4 is arranged on the table top of the machine table 1 and is positioned in the middle of the table top of the machine table. The tray placing frame 31 comprises four angle steels, the angle steels are arranged on the chip feeding device 4, and chip trays (full trays) 21 with chips placed are stacked on the tray placing frame 31 in sequence.

The chip feeding device 4 receives and supports the lowermost chip tray 21 on the tray placing frame 31, and simultaneously clamps and fixes the uppermost chip tray 21, and then the chip feeding device 4 moves the received lowermost chip tray 21 to the chip discharging station of the chip feeding device 4.

Chip transfer device 7 is equipped with two, and two chip transfer devices 7 set up respectively on the first support 11 of board 1, and two chip transfer devices 7 are mirror symmetry's the setting in the left and right sides of chip unloading station of chip loading attachment 4. A chip feeding station 701 and a material receiving station 702 are respectively arranged at the front end and the rear end of the chip transfer device 7.

The number of the material pipe feeding devices 5 is also two, the two material pipe feeding devices 5 are arranged on the second support 12 of the machine table 1, and the two material pipe feeding devices 5 are arranged on the left side and the right side of the chip feeding device 4 in a mirror symmetry manner and are respectively arranged at one end (rear end) of the material pipe receiving station 702 close to the chip transfer device 7.

The material pipe placing frame 32 is arranged on the second support 12 of the machine table 1 and comprises two rectangular channel steels which are arranged oppositely, and the empty material pipe 100 is sequentially stacked between the two rectangular channel steels of the material pipe placing frame 32.

The material pipe trays 22 are arranged on the material pipe feeding device 5, the material pipe feeding device 5 drives the material pipe trays 22 to move, and when the material pipe trays 22 pass below the material pipe placing frame 32, the material pipes at the lowest layer on the material pipe placing frame 32 sequentially fall and are embedded into the rectangular grooves 221 of the material pipe trays 22. After the eleven rectangular grooves 221 of the tube tray are filled with tubes, the tube feeding device 5 supports and fixes the tubes in the tube placing rack 32, moves the tubes on the tube tray 22 to the tube receiving station 702 of the chip transfer device 7, and finally pushes the tubes (full tubes) filled with chips to the tube collecting area of the machine table 1, and the full tubes are collected by the tube collecting mechanism.

The two grabbing and moving devices 6 are also arranged, and the two grabbing and moving devices 6 are symmetrically arranged on the third support 13 of the machine table 1 and are positioned above the chip feeding device 4 and the chip transferring device 7. The two grabbing and moving mechanisms 6 alternately grab the chips on the chip tray 21 at the chip unloading station, grab the whole column of chips (eleven chips) on the chip tray 21 at each grabbing time, and alternately place the grabbed chips on the chip loading stations 701 of the chip transfer devices 7 at the left side and the right side.

The chip transfer device 7 moves eleven chips placed on the chip loading station 701 to eleven material tubes positioned at the material tube receiving station 702, and completes automatic transfer of the chips from the chip tray 21 to the material tube 100.

The chip feeding device 4, the material pipe feeding device 5, the grabbing and moving device 6 and the chip transferring device 7 are electrically connected with a controller respectively, and the controller controls each device mechanism to execute corresponding preset actions according to preset programs.

Through the above, it is not difficult to find that the chip automatic transfer equipment of the embodiment, through setting up the board, the chip charging tray, the material pipe tray, the charging tray rack, the material pipe rack, the chip loading attachment, the material pipe loading attachment, snatch the mobile device, chip transfer device and controller, the chip loading attachment, the material pipe loading attachment, snatch the mobile device and chip transfer device sets up on the board, the chip transfer device sets up the both sides at chip unloading station of chip loading attachment, the both ends of chip transfer device are equipped with chip loading station and material pipe receiving station respectively, material pipe loading attachment removes the material pipe to material pipe receiving station, snatch the mobile device and snatch the chip and get the chip loading station, the chip transfer device makes the chip on the chip loading station shift to the material pipe that material pipe received the material station and locate. The automatic chip transfer equipment is controlled by the controller, chips are automatically transferred from the chip tray to the material pipe, the chips cannot be damaged in the transfer process, and the product quality is guaranteed; and the equipment adopts a double-station design, so that the production efficiency is greatly improved.

Optionally, as shown in fig. 6, 7, and 8, in the automatic chip transfer device in this embodiment, the chip transfer device 7 includes: a base 71 and a cover 72.

The base 71 is disposed on the first support 11 of the machine platform 1, the top surface of the base 71 is provided with a plurality of recessed rectangular slideways 711 at equal intervals, the number of the plurality of rectangular slideways 711 on the base 71 corresponds to the number of the plurality of rectangular grooves 221 (eleven) on the material pipe tray 22, that is, the number of the rectangular slideways 711 corresponds to the number of rows of chips on a chip tray. The side wall of one side of the rectangular slideway is an inclined plane.

The cover plate 72 covers the top surface of the base 71, and the length of the cover plate 72 is smaller than that of the rectangular slide 711, so that the rectangular slide 711 forms a chip feeding station 701 at the front end of the base 71, and a material receiving pipe station 702 is formed at the rear end of the base. The rectangular slideway 711 penetrates through the base 71 at the rear end, so that the end part of the material pipe can be conveniently inserted into the rectangular slideway 711.

The base 71 is provided with a plurality of gas connectors 712 at one side of the chip loading station 701, the gas connectors 712 are communicated with the rectangular slide 711 of the base 71, and the gas connectors 712 are connected with an external high-pressure gas source.

In this embodiment, the grabbing and moving mechanism grabs an entire column (eleven) of chips on a chip tray, places the grabbed chips in eleven rectangular slideways of a chip feeding station respectively, the material tube feeding device moves eleven material tubes to a material tube receiving station, end faces of the material tubes are abutted to the cover plate and embedded in the rectangular slideways of the base, high-pressure gas is introduced through a high-pressure gas source to blow the chips to slide along the rectangular slideways of the base, and the eleven chips move into the eleven material tubes along the rectangular slideways respectively.

Further, in the automatic transfer apparatus in this embodiment, the chip transfer device 7 further includes: a blocking mechanism 73.

The cover plate 72 is provided with a plurality of (eleven) through holes 721 at one end close to the material receiving station 702 of the material pipe, and the through holes 721 are in one-to-one correspondence with the rectangular slideways 711 on the base 71.

The blocking mechanism 73 includes: a first cylinder 731, a first presser plate 732, and a stopper 733.

The first cylinder 731 is disposed on the first bracket 11 and above the cover plate 72, and the first cylinder 731 is electrically connected to the controller. The first pressing plate 732 is connected to the movable rods of the first cylinder 731, the blocking rods 733 are disposed on the first pressing plate 732, and the number of the blocking rods 733 corresponds to the number of the through holes 721 of the cover plate 72 one-to-one. The first air cylinder drives the first pressing plate and the stop lever to lift, and the stop lever extends into the through hole of the cover plate when falling and compresses the chip in the rectangular slide way of the base.

In this embodiment, after the chip was filled to the material pipe, when shifting out, the pin compressed tightly the chip in the rectangle slide, when preventing that the material pipe from shifting out, the chip roll-off base in the rectangle slide of base.

Optionally, as shown in fig. 9, 10, and 11, in the automatic chip transfer apparatus in this embodiment, the chip loading device 4 includes: a conveying mechanism 41, a first jacking mechanism 42 and a first clamping mechanism 43.

The conveying mechanism 41 includes: a transport carriage 411, a first servo motor 412, a drive roller 413, a driven roller 414, and a conveyance belt 415.

The conveying support 411 is arranged on the table top of the machine table 1, and the tray placing frame 31 is arranged on the conveying support 411 and is positioned at the front end (head end) of the conveying support 411.

The driving roller 413 and the driven roller 414 are respectively arranged at the head end and the tail end of the conveying bracket 411 and are in transmission connection through a conveying belt 415.

The first servo motor 412 is disposed at the end (rear end) of the conveying bracket 411, and is in transmission connection with the driving roller 413, and the first servo motor 412 is electrically connected with the controller, the first servo motor 412 drives the conveyor belt 415 to rotate through the driving roller 413 and the driven roller 414, and the conveyor belt drives the chip tray to move when rotating.

The first clamping mechanism 43 is arranged at the head end of the conveying support 411, and the first clamping mechanism 43 clamps and fixes the second layer of chip trays 21 above the lowest layer on the tray placing frame during working, so that the second layer and the chip trays 21 above the second layer are fixed on the tray placing frame 31.

The first jacking mechanism 42 is arranged at the head end of the conveying bracket 411 and is positioned below the tray placing frame 31. The first jacking mechanism 42 receives and supports the bottommost chip tray on the tray placing frame 31 when ascending, and after the first clamping mechanism 43 fixes the chip tray above the bottommost layer, the first jacking mechanism 42 places the chip tray on the conveying belt. The chip material tray is moved to a chip blanking station by the conveying belt, the first jacking mechanism ascends again to accept and support the chip material tray on the material tray placing frame after the chip material tray is moved away, the first clamping mechanism resets, then the first jacking mechanism drives the chip material tray to descend to the original position, the first clamping mechanism clamps the chip material tray on the second layer again, and the actions are repeated so that the chip material trays on the material tray placing frame are placed on the conveying belt from bottom to top in sequence.

Further, in the automatic chip transfer apparatus in this embodiment, the first jacking mechanism 42 includes: a second cylinder 421 and a first lifting plate 422.

The second cylinder 421 is disposed on the conveying bracket 411 and electrically connected to the controller. The first lifting plate 422 is connected to a movable rod of the second cylinder 421. When the movable rod of the second cylinder 421 extends, the first lifting plate 422 rises to receive and support the lowermost chip tray on the tray placing frame, and when the second cylinder 421 retracts, the first lifting plate 422 drives the lowermost chip tray to descend, so that the chip tray is placed on the conveying belt.

The number of the first clamping mechanisms 43 is four, and the four first clamping mechanisms 43 are respectively arranged on two sides of the conveying bracket 411 and located at four corners of the tray placing frame 31.

The first clamping mechanism 43 includes: a third cylinder 431 and a first insert plate 432.

The first inserting plate 432 is connected with a movable rod of the third air cylinder 431, and the third air cylinder 431 drives the first inserting plate 432 to stretch. When the first inserting plate 432 extends out, the first inserting plate is inserted into a slot of a second layer of chip tray 21 positioned above the lowest layer on the tray placing frame 31, so that the second layer and the upper chip tray are clamped and fixed on the tray placing frame; when the first board 432 is retracted, the chip tray slides down.

Further, in the automatic chip transferring apparatus in this embodiment, the chip feeding device 4 further includes: a securing mechanism 44.

Two fixing mechanisms 44 are arranged, and the two fixing mechanisms 44 are arranged on the conveying support 411 and are respectively positioned at the left side and the right side of the chip blanking station.

The fixing mechanism 44 includes: a fourth cylinder 441 and a clamp plate 442.

The clamp plate 442 is connected to a movable rod of the fourth cylinder 441, and the fourth cylinder 441 drives the clamp plate 442 to extend and retract. When the conveyor belt 415 drives the chip tray 21 to move to the chip blanking station, the conveyor belt stops rotating, the fourth cylinder 441 drives the clamping plate 442 to extend, and the clamping plate 442 clamps the chip tray 21 at the chip blanking station from the left side and the right side. The two grabbing and moving mechanisms 6 alternately grab the chips on the chip material tray, and after every two grabbing rows (twenty-two rows) of chips, the first servo motor drives the chip material tray to move forwards to a fixed position through the conveyor belt so as to grab the chips in the subsequent chip material tray.

Further, in the automatic chip transferring apparatus in this embodiment, the chip feeding device 4 further includes: empty charging tray collection mechanism.

Empty charging tray collection mechanism sets up at transfer gantry 411's end, includes: a collection frame 451, a second lift-up mechanism 452, and a second clamping mechanism 453.

The collecting frame 451, the second lifting mechanism 452, and the second clamping mechanism 453 have structures and functions similar to those of the tray placing frame 31, the first lifting mechanism 42, and the first clamping mechanism 43, and are used for collecting empty chip trays 21.

The collecting frame 451 is provided on the conveying holder 411.

The second climbing mechanism 452 is disposed below the collecting frame 451, and includes: a fifth cylinder 4521 and a second lift plate 4522.

The second lifting plate 4522 is connected with a movable rod of a fifth cylinder 4521, and the fifth cylinder drives the second lifting plate to ascend.

The second clamping mechanisms 453 are four and are respectively disposed at four corners of the collecting frame 451. The second clamping mechanism 453 includes: a sixth cylinder 4531 and a second insert plate 4532.

The second plate 4532 is connected with a movable rod of a sixth cylinder 4531, and the sixth cylinder 4531 drives the second plate 4532 to extend and retract.

In this embodiment, the conveyer belt drives empty chip charging tray and removes to collecting work or material rest department, and fifth cylinder drives the second jacking board and rises, with empty chip charging tray jacking to collecting on the work or material rest. The sixth cylinder drives the second inserting plate to extend out, the second inserting plate is inserted into a slot of the bottommost chip tray on the collecting rack, then the second jacking plate descends to prepare for jacking the next empty chip tray, so that the chip trays are stacked on the collecting rack from bottom to top, and collection of the empty chip trays is facilitated.

Further, in the automatic chip transferring apparatus in this embodiment, the chip feeding device 4 further includes: a first sensor 461, a second sensor 462 and a third sensor 463.

The first sensor 461 is arranged on the conveying bracket, is positioned at the bottom end of the tray placing frame, and is electrically connected with the controller. On the chip charging tray on the charging tray rack was moved the conveyer belt from bottom to top in proper order, the chip charging tray of first sensor response charging tray rack bottom, when first sensor response can not reach the chip charging tray, with signal transmission to the controller, remind the operator to add the chip charging tray on the charging tray rack.

The second sensor 462 is arranged on the conveying bracket, is positioned at the chip blanking station and is electrically connected with the controller. The conveyer belt drives the chip charging tray to move to the chip unloading station, and the second sensor sends the signal to the controller when sensing the chip charging tray, and controller control conveyer belt stops, and the fourth cylinder of simultaneously control fixed establishment stretches out, fixes the chip charging tray.

The third sensor 463 is disposed at the top end of the collecting rack 451 and electrically connected to the controller. Empty chip charging tray superposes the number of piles on collecting the work or material rest, and when third sensor sensed the chip charging tray, sent the signal to the controller, reminded the operative employee and will collect the empty charging tray on the work or material rest and shift out.

Optionally, as shown in fig. 12 and 13, in the automatic chip transfer apparatus in this embodiment, the grabbing and moving device 6 includes: a second servo motor 611, a first screw rod, a third servo motor 612, a second screw rod 622, a vacuum suction cup 63, a vacuum pump 64, a first sliding plate 651, a second sliding plate 652 and a fixing plate 66.

The second servo motor 611 and a first lead screw (not shown in the figure) are disposed on the third bracket 13 of the machine 1, and one end of the first lead screw is in transmission connection with the second servo motor 611.

The first sliding plate 651 is slidably engaged with the sliding rail of the third bracket 13, the first sliding plate 651 is engaged with the first screw rod through a threaded hole, and the second servo motor 611 is used for driving the first sliding plate 651 to slide left and right on the third bracket 13.

The third servo motor 612 and the second lead screw 622 are arranged on the first sliding plate 651, and the top end of the second lead screw 622 is in transmission connection with the second servo motor 612.

The second sliding plate 652 is slidably engaged with the sliding rail of the first sliding plate 651, the second sliding plate 652 is engaged with the second lead screw 622 through a threaded hole, and the third servo motor 612 drives the second sliding plate 652 to slide up and down on the first sliding plate 651.

The vacuum pump 64 and the fixing plate 66 are disposed on the second sliding plate 652, the vacuum chucks 63 are disposed in a plurality of numbers, the number of the vacuum chucks 63 corresponds to the number of the rectangular grooves 221 on the tube tray 22 (eleven), the vacuum chucks 63 are disposed on the fixing plate 66, the vacuum chucks 63 are connected to the vacuum pump 64 through connection hoses, and the vacuum pump is electrically connected to the controller.

In this embodiment, snatch the chip on the chip charging tray of the chip unloading station department of two sets of vacuum chuck alternant absorption of mobile device, absorb chip (eleven) of whole column on the chip charging tray at every turn, left vacuum chuck places eleven chips that absorb in the eleven rectangular slide of the chip material loading station of left side base, and the vacuum chuck on right side places eleven chips that absorb in the eleven rectangular slide of the chip material loading station of right side base.

Optionally, as shown in fig. 14, 15, and 16, in the automatic chip transfer apparatus in this embodiment, the material tube feeding device 5 includes: a fourth servo motor 51, a third screw rod, a third sliding plate 52, a seventh air cylinder 531, an eighth air cylinder 532, a ninth air cylinder 533 and a push plate 54.

The machine table 1 is provided with a material pipe collecting area 14 between the material pipe feeding device 5 and the chip feeding device 4.

The material tube placing frame 32 is arranged on the second support 12 of the machine table 1, and the seventh cylinder 531 is arranged in a groove of the second support 12, is located below the material tube placing frame 32, and is electrically connected with the controller. The movable rod of the seventh cylinder 531 supports the material tube placed in the material tube placing frame 32 when extending out, so that the material tube in the material tube placing frame cannot fall down.

A fourth servo motor 51 and a third screw (not shown in the figure) are arranged on the second bracket of the machine table, and one end of the third screw is in transmission connection with the fourth servo motor 51.

The third sliding plate 52 is slidably engaged with the sliding rail of the second bracket 12, the third sliding plate 52 is engaged with the third screw rod through a threaded hole, and the fourth servo motor 51 drives the third sliding plate 52 to slide left and right on the third bracket 12.

The eighth cylinder 532 is arranged at the bottom of the third sliding plate 52, the material pipe tray 22 is slidably arranged on the third sliding plate 52 through a sliding rod, and two sides of the bottom of the material pipe tray 22 are connected with the movable rod of the eighth cylinder 532.

The fourth servo motor 51 drives the material pipe tray to slide, and when the material pipe tray passes through the lower part of the material pipe placing frame, the material pipes on the material pipe placing frame sequentially fall and are embedded into the rectangular grooves of the material pipe tray.

After the material tube tray is filled with eleven material tubes (eleven tubes), the material tube tray is moved to the rear end of the material tube receiving station of the chip transfer device, and the eighth cylinder 532 drives the material tube tray 22 to descend, so that eleven material tubes on the material tube tray are placed on the second support. And in the moving process of loading empty tubes, the tube tray sequentially pushes the tubes filled with the chips on the second support to a tube collecting area 14 of the machine table, and the tubes filled with the chips are collected by a tube collecting mechanism.

The ninth cylinder 533 is disposed on the second bracket, and the push plate 54 is connected to the movable rod of the ninth cylinder 533. When the movable rod of the ninth cylinder drives the push plate to extend out, the push plate pushes eleven empty material pipes to eleven rectangular slideways of the base, the material pipes reaching the chip transfer device receive material stations, and chips at the chip feed stations are transferred to the placing grooves of the material pipes along the rectangular slideways under the blowing of high-pressure gas.

Further, in the automatic chip transferring apparatus in this embodiment, the material tube feeding device 5 further includes: and a pipe pressing mechanism 55.

The pipe pressing mechanism 55 is arranged on the second support and close to the pipe receiving station of the chip transfer device. The pipe pressing mechanism 55 includes: a tenth cylinder 551 and a second pressure plate 552.

The tenth air cylinder 551 is provided on the second support, and the second pressure plate 552 is connected to the movable rod of the tenth air cylinder 551. When the empty material pipe is pushed to the material pipe receiving station of the chip transfer device, the tenth air cylinder drives the second pressing plate to descend, and the second pressing plate presses eleven material pipes at the material pipe receiving station fixedly, so that the material pipes are kept stable when receiving chips.

Further, in the automatic chip transferring apparatus in this embodiment, the material tube feeding device 5 further includes: a fourth sensor 561 and a fifth sensor 562.

The fourth sensor 561 sets up in the bottom of material pipe rack 32, with controller electric connection, and fourth sensor 561 sends the signal to the controller when sensing the bottom of material pipe rack and not having the material pipe, reminds the operator to add the filling tube in the material pipe rack.

The bottoms of the rectangular grooves 221 of the feeding pipe tray are provided with grooves, and the fifth sensor 562 is arranged in the rectangular grooves of the feeding pipe tray. The material pipe tray passes through the material pipe placing frame, the empty material pipes fall into the rectangular grooves of the material pipe tray, if the fifth sensor does not sense the material pipes, the controller controls the material pipe tray to return, the material pipes are received again, and the eleven rectangular grooves are filled with the material pipes.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An automatic chip transfer apparatus, comprising: the device comprises a machine table, a chip tray, a material pipe tray, a tray placing frame, a material pipe placing frame, a chip feeding device, a material pipe feeding device, a grabbing and moving device, a chip transferring device and a controller;

2. The chip automatic transfer apparatus according to claim 1, wherein the chip transfer device comprises: a base and a cover plate;

3. The chip automatic transfer apparatus according to claim 2, wherein the chip transfer device further comprises: a blocking mechanism;

4. The apparatus for automatically transferring a chip according to claim 1, wherein the chip loading means comprises: the device comprises a conveying mechanism, a first jacking mechanism and a first clamping mechanism;

5. The apparatus according to claim 4, wherein the first lift mechanism comprises: a second cylinder and a first jacking plate;

6. The chip automatic transfer apparatus according to claim 4, wherein the chip feeding device further comprises: a fixing mechanism;

the fixing mechanism includes: a fourth cylinder and a clamping plate;

7. The chip automatic transfer apparatus according to claim 6, wherein the chip feeding device further comprises: an empty tray collection mechanism;

8. The chip automatic transfer apparatus according to claim 7, wherein the chip feeding device further comprises: a first sensor, a second sensor, and a third sensor;

the first sensor is arranged at the bottom end of the tray placing frame;

the third sensor is arranged at the top end of the collecting rack;

9. The apparatus for automatically transferring a chip according to claim 1, wherein the grasping and moving means comprises: the device comprises a second servo motor, a first screw rod, a third servo motor, a second screw rod, a vacuum pump, a first sliding plate, a second sliding plate, a fixing plate and a plurality of vacuum suckers;

the vacuum pump and the fixing plate are arranged on the second sliding plate;

10. The automatic chip transfer apparatus according to claim 1, wherein the tube loading device comprises: the fourth servo motor, the third screw rod, the third sliding plate, the seventh cylinder, the eighth cylinder, the ninth cylinder and the push plate;

11. The automatic chip transfer apparatus according to claim 10, wherein the tube loading device further comprises: a pipe pressing mechanism;

12. The automatic chip transfer apparatus according to claim 10, wherein the tube loading device further comprises: a fourth sensor and a fifth sensor;

the fifth sensor is arranged at the bottom of the rectangular groove;