CN109530246A - The material collecting device of IC chip test machine - Google Patents
The material collecting device of IC chip test machine Download PDFInfo
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- CN109530246A CN109530246A CN201910012109.XA CN201910012109A CN109530246A CN 109530246 A CN109530246 A CN 109530246A CN 201910012109 A CN201910012109 A CN 201910012109A CN 109530246 A CN109530246 A CN 109530246A
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- expects pipe
- receiving mechanism
- chip
- ejector sleeve
- empty
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- 239000000463 material Substances 0.000 title claims abstract description 101
- 238000012360 testing method Methods 0.000 title claims abstract description 44
- 230000007246 mechanism Effects 0.000 claims abstract description 98
- 230000000903 blocking effect Effects 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 4
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 7
- 206010057071 Rectal tenesmus Diseases 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 208000012271 tenesmus Diseases 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted
- B07C2501/0063—Using robots
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a kind of material collecting devices of IC chip test machine, including sorting mechanism and receiving mechanism, the sorting mechanism includes artificial the first receiving mechanism for placing empty expects pipe and automatic the second receiving mechanism for placing empty expects pipe, the sorting mechanism includes splicing platform, the splicing platform has material receiving end and discharge end, the material receiving end can be connected to mechanism for testing, the discharge end can be connected to first material collection structure and second receiving mechanism, first receiving mechanism includes expects pipe seat and expects pipe pressing plate, the sky expects pipe is placed in the expects pipe seat, the expects pipe pressing plate is connected to the expects pipe seat and can compress the empty expects pipe, second receiving mechanism includes blank pipe feed bin, ejector sleeve sliding block and clamp system.The present invention picks up the IC chip for completing test by splicing platform, and is classified and put to the first receiving mechanism or the second receiving mechanism, and automation sorting rewinding improves the speed of sorting rewinding and saves human cost.
Description
Technical field
The invention belongs to technical field of automation equipment, fill more particularly, to a kind of sorting rewinding for IC chip test
It sets.
Background technique
IC chip (Integrated Circuit integrated circuit) be by a large amount of microelectronic component (transistor, resistance,
Capacitor etc.) formed integrated circuit be placed on one piece of modeling base, be made into chip piece, now nearly all chip seen all may be used
To be called IC chip, IC chip has to pass through stringent test before factory, and test item includes IC chip
Various performance parameters, such as electric current and voltage, the test of such electrical property need to access IC chip test macro, and test is completed
It needs to sort out IC chip according to the performance graduation tested out afterwards, there are many manner of packings of IC chip, such as expects pipe packaging
Type, such packaging are as shown in Figure 8: IC chip 2009 is accommodated in the empty expects pipe 3009 of tubulose, and when test needs will be in expects pipe
Chip take out tested one by one, IC chip is packed into empty expects pipe, in the prior art, screening installation again after the completion of test
Receiving mechanism is all manually to be packed into empty expects pipe, artificial again after expects pipe is full to replace, but the IC chip after actual test sorting, excellent
Number of chips be most, so the frequency that the expects pipe for being packed into excellent IC chip replaces empty expects pipe can be very high, other sky material
Pipe replacement is then that the period is longer, thus if the expects pipe of excellent chip also passes through and is accomplished manually at this time, it can be very troublesome, it influences
The speed of testing, sorting, and waste of manpower resource.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of material collecting devices of IC chip test machine, are connect by splicing platform
The IC chip of test is taken into, and is classified and is put to the first receiving mechanism or the second receiving mechanism, automation sorting rewinding mentions
Height sorts the speed of rewinding and saves human cost.
In order to solve the above technical problems, a technical solution of use of the invention is as follows:
A kind of material collecting device of IC chip test machine, sorting mechanism and receiving mechanism including being located at rewinding bottom plate, with IC
The transmission direction of chip defines, and the sorting mechanism is located at the upstream of the receiving mechanism, and the rewinding bottom plate is to be obliquely installed；
The sorting mechanism includes artificial the first receiving mechanism for placing sky expects pipe and automatic the second receipts for placing empty expects pipe
Expect mechanism, the sorting mechanism includes splicing platform, and the splicing platform has material receiving end and discharge end, and the splicing platform passes through sliding rail
Be slidably coupled to the rewinding bottom plate, by the sliding of the splicing platform, the material receiving end can with for testing the IC
The mechanism for testing of chip is connected to, and the discharge end can be connected to first material collection structure and second receiving mechanism；
First receiving mechanism includes expects pipe seat and expects pipe pressing plate, and the sky expects pipe is placed in the expects pipe seat, described
Expects pipe pressing plate is connected to the expects pipe seat and can compress the empty expects pipe, the discharge end can be clamped in first rewinding
The empty expects pipe of mechanism is connected to；
Second receiving mechanism includes blank pipe feed bin, ejector sleeve sliding block and clamp system, and the sky expects pipe superposition is placed in
The blank pipe feed bin, the ejector sleeve sliding block are used to release the empty expects pipe in the blank pipe feed bin, the sky after release
Expects pipe is fixedly clamped by the clamp system, and the discharge end can connect with the empty expects pipe for being clamped in second material collection structure
It is logical.
It further says, the splicing platform includes being fixedly connected on the splicing material path of substrate, and the IC chip connects in described
Expect sliding transmission in material path, the splicing material path is equipped with the material platform material blocking rod that can stop the IC chip transmission, the material platform
Bearing seat is articulated in the middle part of material blocking rod, one end of the material platform material blocking rod can extend into the splicing material path, and the other end is set
There is the actuator of its swing of driving.
It further says, there is the groove that can clamp the empty expects pipe in one end of the ejector sleeve sliding block and is hinged with clamping
Block, the gripping block are equipped with the clamping driving unit for driving its rotation, and the sky expects pipe is held in the groove, the folder
Tight driving unit drives the gripping block to rotate and pushes against in the side wall of the empty expects pipe, to clamp the empty expects pipe.
It further says, the ejector sleeve sliding block is equipped with 2, and 2 ejector sleeve sliding blocks are fixedly connected on connecting plate, the company
Fishplate bar is connected to rewinding bottom plate by guide post and guide post sliding block, and the ejector sleeve sliding block can be slided by the guide post and guide post sliding block
It is dynamic.
It further says, the ejector sleeve sliding block is equipped with driving cylinder and drive link, the drive link are rotatably connected
In the rewinding bottom plate, one end of the drive link and the driving cylinder are hinged, and the other end has long lumbar hole, the company
Fishplate bar is equipped with connection pin shaft, and the connection pin shaft is set in the long lumbar hole, drives the driving by the driving cylinder
Connecting rod, and then the connecting plate can be driven to move.
It further says, second receiving mechanism is equipped with ejector sleeve cylinder, and the ejector sleeve cylinder can push the empty material
Pipe slides along its length, after the ejector sleeve sliding block is used to release the empty expects pipe in the blank pipe feed bin, passes through institute
It states ejector sleeve cylinder and pushes it into completion pinching action in the clamp system.
It further says, the rewinding bottom plate is equipped with expects pipe collecting bin, and second receiving mechanism can will receive Man Suoshu
The expects pipe of IC chip is pushed into the expects pipe collecting bin.
Further say, the connectivity part of first receiving mechanism and the splicing platform be equipped with detect whether to get stuck to penetrating
Type photoelectric sensor.
It further says, the splicing platform drives its sliding by leather belt driving mechanism.
It further says, the tilt angle of the rewinding bottom plate are as follows: the angle with horizontal plane is 40 ° -55 °.
Beneficial effects of the present invention:
One, the present invention picks up the IC chip for completing to test by splicing platform, and classified put to the first receiving mechanism or
Second receiving mechanism connects mark platform by sliding rail and is installed on rewinding bottom plate, have cracking movement speed, and automates sorting and receive
Material improves the speed of sorting rewinding and saves human cost, and the first receiving mechanism is the rewinding of several artificial placement sky expects pipes
Mechanism, chip performance grade is lower or undesirable chip for collecting, and the period that empty expects pipe needs replacing is longer, artificial to replace
It can meet the requirements, without the cost of automatic material receiving, the second receiving mechanism is the automatic receiving mechanism for placing empty expects pipe, for receiving
Excellent IC chip is taken, since the quantity of high-class product is most, the replacement cycle is short, and pipe is put in the replacement of automation can be improved rewinding speed
Degree, the setting of two kinds of receiving mechanisms meet rewinding rate also save the cost；
Two, splicing platform is equipped with material platform material blocking rod, and material path is blocked when splicing platform is mobile, and material platform is moved to connected state
The run action of Shi Fangkai, cylinder and spring driven material platform material blocking rod is quick, improves the speed of sorting；
Three, one end of pusher sliding block is hinged with gripping block, and clamping, which is located at, after clamping driving unit driving gripping block rotation pushes away
Expect the empty expects pipe in the groove of sliding block, empty expects pipe is pushed to predetermined position by pusher slide block movement, then by ejector sleeve cylinder along material
The length direction of pipe pushes empty expects pipe, after empty expects pipe is pushed into gripping means grips, clamps driving unit and retracts, gripping block due to
The rotation tenesmus of the reason of self gravity, clamping driving unit stretches out again at this time pushes gripping block to rotate to clamped condition, works as material
After pipe is filled, clamping device unclamps, and pusher slide unit can be released again at this time, is released the expects pipe filled by gripping block,
Expects pipe falls into expects pipe collecting bin, reciprocal with this, completes automatic material receiving movement.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention and the accompanying drawings.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the material collecting device of test machine of the invention；
Fig. 2 is the structural schematic diagram of sorting mechanism of the invention；
Fig. 3 is the structural schematic diagram of splicing platform of the invention；
Fig. 4 is the structural schematic diagram of the first receiving mechanism of the invention；
Fig. 5 is the structural schematic diagram of the second receiving mechanism of the invention；
Fig. 6 is the structural schematic diagram of the ejector sleeve sliding block of the second receiving mechanism；
Fig. 7 is the A direction view of Fig. 5；
Fig. 8 is the schematic diagram of the expects pipe storing mode of IC chip；
Each section label is as follows in attached drawing:
IC chip 2009；
Rewinding bottom plate 3001；
Sorting mechanism 3002, splicing platform 30021, substrate 300211, splicing material path 300212, material receiving end 3002121, discharging
End 3002122, material platform material blocking rod 300213, bearing seat 300214, backgauge driving cylinder 3002151, reset spring 3002152,
Belt 300216, servo motor 300217, sliding rail 300218；
Receiving mechanism 3003, the first receiving mechanism 30031, expects pipe seat 300311, expects pipe pressing plate 300312, elastic slice
300313, the second receiving mechanism 30032, blank pipe feed bin 300321, ejector sleeve sliding block 300322, groove 3003221, clamp system
300323, gripping block 300324, clamping driving unit 300325, connecting plate 300326, connection pin shaft 3003261, driving cylinder
300327, drive link 300328, long lumbar hole 3003281, ejector sleeve cylinder 300329；
Expects pipe collecting bin 3004；
Discharge material path 3005；
Empty expects pipe 3009 and angle α.
Specific embodiment
The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawing, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
Embodiment: a kind of material collecting device of IC chip test machine, as shown in Fig. 1 to Fig. 7: including being located at rewinding bottom plate 3001
Sorting mechanism 3002 and receiving mechanism 3003, defined with the transmission direction of IC chip 2009, the sorting mechanism is located at described
The upstream of receiving mechanism, the rewinding bottom plate are to be obliquely installed；
The sorting mechanism includes artificial the first receiving mechanism 30031 for placing empty expects pipe 3009 and places empty expects pipe automatically
The second receiving mechanism 30032, the sorting mechanism includes splicing platform 30021, and the splicing platform has 3002121 He of material receiving end
Discharge end 3002122, the splicing platform are slidably coupled to the rewinding bottom plate by sliding rail 300218, pass through the splicing platform
Sliding, the material receiving end can be connected to, the discharge end with the mechanism for testing (not shown go out) for testing the IC chip
It can be connected to first material collection structure and second receiving mechanism；
The splicing platform drives its sliding by belt 300216 and 300217 driving mechanism of servo motor.
The movement of splicing platform are as follows: after the IC chip completes test by mechanism for testing, splicing platform sliding, by its material receiving end
It is connected to the mechanism for testing, IC chip circulates to splicing platform, and then splicing platform is by sliding its discharge end and the first rewinding
Mechanism or the second material collection structure are connected to and are put into the IC chip being connected to, and then IC chip flows into empty expects pipe, complete rewinding work；
In the present embodiment, after the IC chip completes test, be discharged from the discharge material path 3005 of mechanism for testing, connect mark platform with
The discharge material path is connected to splicing；
As shown in Figure 3: the splicing platform 30021 includes being fixedly connected on the splicing material path 300212 of substrate 300211, institute
IC chip is stated in sliding transmission in the splicing material path, the splicing material path is equipped with the material platform that can stop the IC chip transmission
Material blocking rod 300213 is articulated with bearing seat 300214 in the middle part of the material platform material blocking rod, and one end of the material platform material blocking rod can
The splicing material path is protruded into, and the other end is equipped with the actuator for driving it to swing；
In the present embodiment, the actuator includes the backgauge driving cylinder 3002151 positioned at the material platform material blocking rod side
With the reset spring 3002152 for being located at the material platform material blocking rod other side.
As shown in Figure 4: first receiving mechanism includes expects pipe seat 300311 and expects pipe pressing plate 300312, the sky expects pipe
It is placed in the expects pipe seat, the expects pipe pressing plate is connected to the expects pipe seat and can compress the empty expects pipe, the discharge end
It can be connected to the empty expects pipe for being clamped in first receiving mechanism；
In the present embodiment, the expects pipe pressing plate is equipped with elastic slice 300313, and the elastic slice compresses the empty expects pipe, can stablize
While compression, moreover it is possible to sky expects pipe be prevented to be subject to crushing.
As shown in Fig. 5 to Fig. 7: second receiving mechanism includes blank pipe feed bin 300321, ejector sleeve sliding block 300322 and folder
Tight mechanism 300323, the sky expects pipe superposition are placed in the blank pipe feed bin, and the ejector sleeve sliding block is used for the blank pipe feed bin
The interior empty expects pipe is released, and the empty expects pipe after release is fixedly clamped by the clamp system, and the discharge end can be with
It is clamped in the empty expects pipe connection of second material collection structure.
In the present embodiment, the clamp system includes a fixed block and a movable block being driven by the cylinder, empty expects pipe
It is placed in the fixed block, then is driven by the cylinder the movable block and is adjacent to the fixed block, to clamp the empty expects pipe.
There is the groove 3003221 that can clamp the empty expects pipe in one end of the ejector sleeve sliding block and is hinged with gripping block
300324, the gripping block is equipped with the clamping driving unit 300325 for driving its rotation, in the present embodiment, the clampings driving list
Member is finger cylinder (aciculiform cylinder), and the sky expects pipe is held in the groove, described in the clamping driving unit driving
Gripping block is rotated and is pushed against in the side wall of the empty expects pipe, to clamp the empty expects pipe.
The ejector sleeve sliding block is equipped with 2, and 2 ejector sleeve sliding blocks are fixedly connected on connecting plate 300326, the connecting plate
It is connected to rewinding bottom plate by guide post and guide post sliding block, the ejector sleeve sliding block can be slided by the guide post and guide post sliding block.
The ejector sleeve sliding block is equipped with driving cylinder 300327 and drive link 300328, the drive link are rotatably connected
In the rewinding bottom plate, one end of the drive link and the driving cylinder are hinged, and the other end has long lumbar hole
3003281, the connecting plate is equipped with connection pin shaft 3003261, and the connection pin shaft is set in the long lumbar hole, by described
It drives cylinder to drive the drive link, and then the connecting plate can be driven to move.
Second receiving mechanism is equipped with ejector sleeve cylinder 300329, and the ejector sleeve cylinder can push the empty expects pipe along it
Length direction sliding passes through the ejector sleeve after the ejector sleeve sliding block is used to release the empty expects pipe in the blank pipe feed bin
Cylinder, which pushes it into, completes pinching action in the clamp system.
The rewinding bottom plate is equipped with expects pipe collecting bin 3004, and second receiving mechanism can will receive the full IC chip
Expects pipe is pushed into the expects pipe collecting bin.
The connectivity part of first receiving mechanism and the splicing platform is equipped with and detects whether the correlation type photoelectric sensing to get stuck
Device.
The tilt angle of the rewinding bottom plate are as follows: the angle α with horizontal plane is 40 ° -55 °.
In the present embodiment, devices illustrated is double-station mechanism, that is, connecing mark platform tool, there are two splicing material path, the rows of mechanism for testing
It there are two material material path is set, but is not limited to, station quantity can be arranged single or multiple according to demand.
The course of work and working principle of the invention is as follows:
Sub-material movement are as follows: splicing platform picks up the IC chip for completing test, and is classified and put to the first receiving mechanism or the
Two receiving mechanisms connect mark platform by sliding rail and are installed on rewinding bottom plate, have cracking movement speed, if the first receiving mechanism is
The dry artificial receiving mechanism for placing empty expects pipe, for collecting, chip performance grade is lower or undesirable chip, empty expects pipe need
The period of replacement is longer, and artificial replacement can be met the requirements, and without the cost of automatic material receiving, the second receiving mechanism is automatic places
The receiving mechanism of empty expects pipe, for collecting excellent IC chip, since the quantity of high-class product is most, the replacement cycle is short, automation
Replacement put pipe and can be improved material recovering speed, the setting of two kinds of receiving mechanisms meets rewinding rate also save the cost；
Splicing platform is equipped with material platform material blocking rod, blocks material path when splicing platform is mobile, material platform be moved to connected state (with
First receiving mechanism or the connection of the second receiving mechanism) Shi Fangkai；
The automatic material receiving of second receiving mechanism acts are as follows: one end of pusher sliding block is hinged with gripping block, clamps driving unit
The empty expects pipe being located in the groove of pusher sliding block is clamped after driving gripping block rotation, pusher slide block movement pushes to empty expects pipe pre-
Positioning is set, then pushes empty expects pipe, after empty expects pipe is pushed into gripping means grips, folder along the length direction of expects pipe by ejector sleeve cylinder
Tight driving unit is retracted, and gripping block rotates tenesmus due to self gravity, is clamped driving unit at this time and is stretched out promotion again
Gripping block is rotated to clamped condition, and after expects pipe is filled, clamping device unclamps, and pusher slide unit can be released again at this time, is led to
Gripping block to be crossed to release the expects pipe filled, expects pipe falls into expects pipe collecting bin, and it is reciprocal with this, complete automatic material receiving movement.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure transformation made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant technical fields,
Similarly it is included within the scope of the present invention.
Claims (10)
1. a kind of material collecting device of IC chip test machine, it is characterised in that: the sorting mechanism including being located at rewinding bottom plate (3001)
(3002) and receiving mechanism (3003) it, is defined with the transmission direction of IC chip (2009), the sorting mechanism is located at the rewinding
The upstream of mechanism, the rewinding bottom plate are to be obliquely installed；
The sorting mechanism includes artificial the first receiving mechanism (30031) for placing sky expects pipe (3009) and places empty expects pipe automatically
The second receiving mechanism (30032), the sorting mechanism includes splicing platform (30021), and the splicing platform has material receiving end
(300211) and discharge end (300212), the splicing platform is slidably coupled to the rewinding bottom plate by sliding rail, by described
The sliding of splicing platform, the material receiving end can be connected to the mechanism for testing for testing the IC chip, and the discharge end can
It is connected to first material collection structure and second receiving mechanism；
First receiving mechanism includes expects pipe seat (300311) and expects pipe pressing plate (300312), and the sky expects pipe is placed in described
Expects pipe seat, the expects pipe pressing plate are connected to the expects pipe seat and can compress the empty expects pipe, the discharge end can be clamped in
The empty expects pipe of first receiving mechanism is connected to；
Second receiving mechanism includes blank pipe feed bin (300321), ejector sleeve sliding block (300322) and clamp system (300323),
The sky expects pipe superposition is placed in the blank pipe feed bin, and the ejector sleeve sliding block is used for the empty expects pipe in the blank pipe feed bin
Release, the empty expects pipe after release is fixedly clamped by the clamp system, the discharge end can be clamped in described second
The empty expects pipe of material collection structure is connected to.
2. the material collecting device of IC chip test machine according to claim 1, it is characterised in that: the splicing platform (30021)
Splicing material path (300212) including being fixedly connected on substrate (300211), the IC chip are passed in sliding in the splicing material path
Defeated, the splicing material path is equipped with the material platform material blocking rod (300213) that can stop the IC chip transmission, the material platform material blocking rod
Middle part be articulated with bearing seat (300214), one end of the material platform material blocking rod can extend into the splicing material path, and the other end
Equipped with the actuator for driving it to swing.
3. the material collecting device of IC chip test machine according to claim 1, it is characterised in that: one end of the ejector sleeve sliding block
There is the groove (3003221) that can clamp the empty expects pipe and be hinged with gripping block (300324), the gripping block, which is equipped with, drives
The clamping driving unit (300325) of its rotation is moved, the sky expects pipe is held in the groove, the clamping driving unit
It drives the gripping block to rotate and pushes against in the side wall of the empty expects pipe, to clamp the empty expects pipe.
4. the material collecting device of IC chip test machine according to claim 1 or 3, it is characterised in that: the ejector sleeve sliding block is set
There are 2,2 ejector sleeve sliding blocks are fixedly connected on connecting plate (300326), and the connecting plate is connected by guide post and guide post sliding block
It is connected to rewinding bottom plate, the ejector sleeve sliding block can be slided by the guide post and guide post sliding block.
5. the material collecting device of IC chip test machine according to claim 4, it is characterised in that: the ejector sleeve sliding block, which is equipped with, to be driven
It takes offence cylinder (300327) and drive link (300328), the drive link is rotationally connected with the rewinding bottom plate, the drive
One end of dynamic connecting rod and the driving cylinder are hinged, and the other end has long lumbar hole (3003281), and the connecting plate is equipped with connection
Pin shaft (3003261), the connection pin shaft are set in the long lumbar hole, drive the driving to connect by the driving cylinder
Bar, and then the connecting plate can be driven to move.
6. the material collecting device of IC chip test machine according to claim 1, it is characterised in that: second receiving mechanism is set
Have ejector sleeve cylinder (300329), the ejector sleeve cylinder can push the empty expects pipe to slide along its length, and the ejector sleeve is sliding
After block is used to release the empty expects pipe in the blank pipe feed bin, the clamp system is pushed it by the ejector sleeve cylinder
Interior completion pinching action.
7. the material collecting device of IC chip test machine according to claim 1, it is characterised in that: the rewinding bottom plate is equipped with material
The expects pipe for receiving the full IC chip can be pushed into the expects pipe collecting bin by pipe collecting bin (3004), second receiving mechanism.
8. the material collecting device of IC chip test machine according to claim 1, it is characterised in that: first receiving mechanism with
The connectivity part of the splicing platform is equipped with the correlation type photoelectric sensor for detecting whether to get stuck.
9. the material collecting device of IC chip test machine according to claim 1, it is characterised in that: the splicing platform passes through belt
Driving mechanism drives its sliding.
10. the material collecting device of IC chip test machine according to claim 1, it is characterised in that: the rewinding bottom plate inclines
Rake angle are as follows: the angle with horizontal plane is 40 ° -55 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910012109.XA CN109530246A (en) | 2019-01-07 | 2019-01-07 | The material collecting device of IC chip test machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910012109.XA CN109530246A (en) | 2019-01-07 | 2019-01-07 | The material collecting device of IC chip test machine |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110026358A (en) * | 2019-05-20 | 2019-07-19 | 福州派利德电子科技有限公司 | IC chip test braider substandard products collection device and method |
| CN110125050A (en) * | 2019-05-17 | 2019-08-16 | 福州派利德电子科技有限公司 | IC chip test braider non-defective unit collection device and method |
| CN112850012A (en) * | 2020-12-30 | 2021-05-28 | 紫光宏茂微电子(上海)有限公司 | Automatic chip transfer equipment |
| CN113019999A (en) * | 2021-05-24 | 2021-06-25 | 天津金海通半导体设备股份有限公司 | IC receiving device |
| CN113955233A (en) * | 2021-11-11 | 2022-01-21 | 安徽耐科装备科技股份有限公司 | Double-layer material pipe charging device |
| CN114950991A (en) * | 2020-11-30 | 2022-08-30 | 深圳市华力宇电子科技有限公司 | Detection mechanism and corresponding IC chip detection device |
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| CN110125050A (en) * | 2019-05-17 | 2019-08-16 | 福州派利德电子科技有限公司 | IC chip test braider non-defective unit collection device and method |
| CN110125050B (en) * | 2019-05-17 | 2021-03-26 | 福州派利德电子科技有限公司 | Integrated circuit chip testing taping machine good product collecting device and method |
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| CN114950990A (en) * | 2020-11-30 | 2022-08-30 | 深圳市华力宇电子科技有限公司 | Receiving mechanism and corresponding IC chip detection device |
| CN112850012A (en) * | 2020-12-30 | 2021-05-28 | 紫光宏茂微电子(上海)有限公司 | Automatic chip transfer equipment |
| CN112850012B (en) * | 2020-12-30 | 2022-06-03 | 紫光宏茂微电子(上海)有限公司 | Automatic chip transfer equipment |
| CN113019999B (en) * | 2021-05-24 | 2021-08-31 | 天津金海通半导体设备股份有限公司 | IC receiving device |
| CN113019999A (en) * | 2021-05-24 | 2021-06-25 | 天津金海通半导体设备股份有限公司 | IC receiving device |
| CN113955233A (en) * | 2021-11-11 | 2022-01-21 | 安徽耐科装备科技股份有限公司 | Double-layer material pipe charging device |
| CN116605639A (en) * | 2023-07-19 | 2023-08-18 | 江苏海纳电子科技有限公司 | Material receiving equipment for chip test |
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