TWI698961B - Wafer placement equipment and wafer placement method - Google Patents

Abstract

The present invention discloses a wafer placement equipment and a wafer placement method. The aforementioned wafer placement equipment includes: a feeding unit, a wafer transfer unit, and a wafer bonding unit; the feeding unit includes a material component and at least two chip pickers, and the material component It is configured to carry wafers, and the aforementioned at least two chip pickers are configured to pick up wafers alternately from the material element; the wafer transfer unit includes a rotatable turntable, and the rotatable turntable is provided with a plurality of wafer adsorption areas, and the wafer adsorption areas are configured to adsorb The chip is provided by the aforementioned at least two pick-up hands; the chip bonding unit includes a placement table and at least two placement hands, and the at least two placement hands are configured to alternately take the wafers from the aforementioned wafer adsorption area and bond the wafers to On the substrate on the placement table. The chip placement equipment and the chip placement method provided by the present invention realize the parallel operation mode of at least two picking hands and at least two placement hands, improve placement efficiency, help promote the process of chip packaging and increase the yield of chips .

Description

Chip placement equipment and chip placement method

The embodiment of the present invention relates to a chip packaging technology, for example, to a chip placement equipment and a chip placement method.

The integrated circuit (IC) industry is a fast-growing point of current global economic development. Among them, the progress of semiconductor manufacturing technology and the rapid growth of market demand for wafers have put forward high requirements for wafer production efficiency. The efficiency of packaging directly affects the production speed of wafers.

In order to improve the efficiency of chip packaging, generally by designing and improving the packaging structure and packaging method or optimizing packaging equipment, including chip mounter equipment. In the related art, the chip placement equipment can include linear transmission and turntable transmission. Among them, the linear transmission method uses a conveyor belt to transfer the wafers to be bonded, and picks up and mounts them by a robot. The linear transmission method has a large space size, a long transmission distance, and a relatively high placement efficiency. Low; and the turntable transmission method usually sets the manipulator on the turntable, and the manipulator rotates to pick up, transmit and attach the chip. This placement method can only attach one chip at a time, and the placement efficiency is low, and it is not conducive to the machine When the hand picks up the wafer, the posture is adjusted. At the same time, the structure of the turntable is complex and the volume is large, and the requirements for the motion axis are also high.

The invention provides a chip placement equipment and a chip placement method to achieve high-efficiency placement and promote chip packaging efficiency and production efficiency.

In a first aspect, an embodiment of the present invention provides a wafer placement equipment, including: a feeding unit, a wafer transfer unit, and a wafer bonding unit;

The aforementioned material supply unit includes a material element and at least two pick-up hands, the aforementioned material element is configured to carry wafers, and the aforementioned at least two pick-up hands are configured to alternately pick up the aforementioned wafers from the aforementioned material component;

The aforementioned wafer transfer unit includes a rotatable turntable, the aforementioned rotatable turntable is provided with a plurality of wafer adsorption areas, and the aforementioned wafer adsorption area is configured to adsorb the aforementioned wafers provided by the aforementioned at least two chip pickers;

The wafer bonding unit includes a placement table and at least two placement hands, and the at least two placement hands are configured to alternately obtain the wafer from the wafer adsorption area and bond the wafer to the substrate on the placement table on.

In some embodiments, the aforementioned at least two picking hands include a first picking hand and a second picking hand, and the aforementioned at least two patching hands include a first patching hand and a second patching hand;

The aforementioned chip placement equipment also includes a chip alignment unit, and the aforementioned chip alignment unit includes a pick-and-align camera, a first pick-and-align camera, a second pick-and-align camera, and a first pick-and-align camera And the second patch camera;

Wherein, the reclaiming and positioning camera is located above the material component, and the reclaiming and positioning camera is configured to determine the position of the wafer on the material component;

Both the first film-taking and alignment camera and the second film-taking and alignment camera are configured to determine the position of the wafer to be taken on the rotatable turntable;

The first placement and alignment camera is configured to determine the position to be placed on the placement stage of the chip obtained by the first placement hand, and the second placement and alignment camera is configured to determine the second The position of the chip to be placed on the placement stage of the chip obtained by placement.

In some embodiments, the rotatable turntable includes a first placement position corresponding to the first pickup hand, a second placement position corresponding to the second pickup hand, a first pickup position corresponding to the first placement hand, and Corresponding to the second pick-up position of the aforementioned second placement hand; wherein the aforementioned first pick-up location is located under the aforementioned first pick-and-alignment camera, and the aforementioned second pick-up location is located under the aforementioned second pick-and-alignment camera ；

The rotatable turntable is configured to sequentially move each of the wafer suction regions to the first placement position, the second placement position, the first pickup position, and the second pickup position by rotation; A pick-up hand and the second pick-up hand are also configured to alternately place the wafers on the wafer suction area corresponding to the first placement position and the second placement position;

The first placement hand and the second placement hand are configured to alternately pick up the wafer from the wafer suction area corresponding to the first pick position and the second pick position, and alternately place the wafer on the On the substrate on the placement table.

In some embodiments, the plurality of wafer adsorption areas are arranged in an equally spaced circle around the center of the rotatable turntable, the first picking position and the second placement position are symmetrical about the center of the rotatable turntable, and the first A film placement position and the second film taking position are symmetrical about the center of the rotatable turntable.

In some embodiments, the aforementioned rotatable turntable includes a holding table and a rotating motor connected to the central axis of the aforementioned holding table, and the aforementioned rotating motor is configured to drive the aforementioned holding table to rotate;

The slide table includes a carrier and a gas slip ring located inside the carrier. The carrier is provided with the plurality of wafer adsorption zones, and the gas slip ring is configured to supply vacuum to the plurality of wafer adsorption zones. Positive pressure gas.

In some embodiments, each of the wafer adsorption areas of the stage is provided with an adsorption hole, and the interior of the stage is provided with a plurality of adsorption channels respectively connected to the plurality of adsorption holes, and the plurality of adsorption channels are connected to the gas The slip ring is turned on.

In some embodiments, the aforementioned material component is located below the aforementioned sheet platform;

The aforementioned feeding unit also includes a third pickup hand and a fourth pickup hand, the third pickup hand and the fourth pickup hand are configured to alternately pick up the wafers on the material element and turn them over, the first pickup hand and the aforementioned fourth pickup hand The second pick-up hand is respectively configured to pick up the aforementioned wafers on the aforementioned third pick-up hand and the aforementioned fourth pick-up hand and alternately shift and place them on the aforementioned wafer suction area corresponding to the aforementioned first placement position and the aforementioned second placement position. .

In some embodiments, the chip attaching unit also includes a gantry, the first placement hand and the second placement hand are arranged on the gantry, and the gantry is configured to be based on the first picking position and the second The second pick-up position and the position to be placed drive the first placement hand and the second placement hand to move.

In some embodiments, a patch avoidance area is provided between two adjacent wafer adsorption areas, and the patch table is located below the rotatable turntable;

The chip bonding unit also includes a gantry, the first placement hand and the second placement hand are arranged on the gantry, and the gantry is configured according to the first picking position, the second picking position and the aforementioned The position to be placed drives the first placement hand and the second placement hand to move longitudinally, the first placement hand and the second placement hand alternately place the chip on the placement stage through the placement avoidance area On the substrate.

In some embodiments, the first fetching and alignment camera is configured to determine the deflection angle of the wafer on the first fetching position, and the second fetching and alignment camera is configured to determine the According to the deflection angle of the chip on the second picking position, the gantry is also configured to drive the first placement hand and the aforementioned chip according to the deflection angle of the chip on the first picking position or the second picking position The second patch hand rotates.

In some embodiments, the aforementioned carrier includes a suspension part and a carrying part, and the thickness of the aforementioned carrying part is less than or equal to 5 mm.

In some embodiments, the first pick-and-align camera, the second pick-and-align camera, the first patch-alignment camera, and the second patch-alignment camera are fixedly mounted on the same substrate.

In some embodiments, the aforementioned placement table includes a support table, a first movement table, and a first suction table that are stacked in sequence;

The aforementioned support table is configured to carry the aforementioned first movement table, the aforementioned first suction table, and the aforementioned substrate;

The aforementioned first movement stage is configured to move the aforementioned substrate so that the area to be mounted on the aforementioned substrate is aligned with the position to be mounted;

The first adsorption stage is configured to adsorb the substrate.

In some embodiments, the aforementioned material element includes a second movement table, a second suction table, and a thimble unit stacked in sequence;

The aforementioned second movement stage is configured to move the wafer to be picked to the picking position;

The aforementioned second adsorption stage is configured to adsorb the aforementioned wafer to be taken;

The ejector pin unit is configured to release the wafer to be picked up at the picking position from the second suction stage.

In the second aspect, the embodiment of the present invention also provides a chip mounting method, which adopts such as Any one of the aforementioned chip placement equipment of the first aspect includes:

At least two picking hands alternately pick up wafers from the material components and place the aforementioned wafers on multiple wafer adsorption areas of the rotatable turntable;

The rotation of the aforementioned rotatable turntable drives the movement of the aforementioned multiple wafer adsorption areas on the aforementioned rotatable turntable;

At least two placement hands alternately pick up the wafer from the plurality of wafer adsorption areas and place the wafer on the substrate on the placement stage.

In some embodiments, the aforementioned at least two picking hands include a first picking hand and a second picking hand, the aforementioned at least two picking hands include a first picking hand and a second picking hand; the aforementioned rotatable turntable includes a corresponding first picking hand and a second picking hand. The first placement position of the film handler, the second placement position corresponding to the aforementioned second pickup handler, the first placement location corresponding to the aforementioned first placement handler, and the second placement location corresponding to the aforementioned second placement handler;

The aforementioned chip placement method also includes:

In the first time, the first pick-up hand picks up the wafer from the material element, and the second pick-up hand places the wafer picked up from the material element in the wafer suction area corresponding to the second placement position. , The first placement hand picks up the wafer from the wafer suction area corresponding to the first picking bit, and the second picking hand picks up the wafer from the wafer suction area corresponding to the second picking bit The aforementioned chip is placed on the substrate on the aforementioned placement table;

In the second time, the first pick-up hand places the wafer picked up from the material component in the wafer suction area corresponding to the first placement position, and the second pick-up hand picks up the wafer from the material component , The first placement hand will place the wafer picked up from the wafer suction area corresponding to the first pickup location on the substrate on the placement stage, and the second placement hand will be connected to the second Pick up the aforementioned wafer on the aforementioned wafer suction area corresponding to the chip taking position.

In the present invention, at least two picking hands are provided in the feeding unit and at least two placement hands are provided in the wafer bonding unit. The at least two picking hands alternately pick up the wafers from the material components and place them on the rotatable of the wafer transfer unit. On the wafer suction area of the turntable, at least two placement hands alternately pick up the wafers from the rotated wafer suction area and attach them to the substrate on the placement table, which solves the problem of single picking and single picking The serial operation mode of the patch is the problem of low patch efficiency. The parallel operation mode of at least two picking hands and at least two placement hands can double the speed of placement, improve placement efficiency, and promote the process of chip packaging , Which helps to increase wafer yield.

10‧‧‧Feeding unit

11‧‧‧Material components

12‧‧‧ Film picker

20‧‧‧Chip transfer unit

21‧‧‧Rotating turntable

22‧‧‧Table

23‧‧‧Rotating Motor

30‧‧‧Chip bonding unit

31‧‧‧Placement table

32‧‧‧Patch Hand

33‧‧‧Gantry

40‧‧‧Chip Alignment Unit

41‧‧‧Reclaiming and positioning camera

42‧‧‧Film taking and registration camera

43‧‧‧SMD registration camera

44‧‧‧Substrate

100‧‧‧chip

111‧‧‧Second Sports Platform

112‧‧‧Second Adsorption Station

113‧‧‧Thimble unit

121‧‧‧First picker

122‧‧‧Second film picker

123‧‧‧third picker

124‧‧‧Fourth picker

200‧‧‧Substrate

211‧‧‧ Wafer adsorption area

212‧‧‧ Patch Avoidance Area

221‧‧‧ Stage

222‧‧‧Air slip ring

311‧‧‧Support Table

312‧‧‧The first sports platform

313‧‧‧The first adsorption station

321‧‧‧First placement hand

322‧‧‧Second placement hand

421‧‧‧First pick-up registration camera

422‧‧‧Second pick-up registration camera

431‧‧‧The first patch camera

432‧‧‧Second patch camera

2011‧‧‧First place

2012‧‧‧Second position

2021‧‧‧First pick position

2022‧‧‧Second Picking Position

2211‧‧‧Adsorption hole, suspension part

2212‧‧‧Adsorption channel, carrying part

[Fig. 1] is a schematic diagram of the structure of a chip placement equipment provided by an embodiment of the present invention.

[Figure 2] is a top view of the rotatable turntable in the wafer placement equipment shown in Figure 1;

[Fig. 3] is a right side view of the wafer placement equipment shown in Fig. 1.

[Fig. 4] is a schematic top view of the wafer placement equipment shown in Fig. 1.

[Fig. 5] is a schematic diagram of a partial structure of another chip placement equipment provided by an embodiment of the present invention.

[Figure 6] is a timing control diagram of the patch provided by the embodiment of the present invention.

[Fig. 7] is a bottom view of the film taking and alignment camera and the patch alignment camera provided by the embodiment of the present invention.

[Figure 8] is a schematic structural diagram of a rotatable turntable provided by an embodiment of the present invention.

[Figure 9] is a schematic cross-sectional structure diagram of a carrier provided by an embodiment of the present invention.

[Figure 10] is a schematic structural diagram of yet another wafer placement equipment provided by an embodiment of the present invention.

[Fig. 11] is a right side view of the wafer placement equipment shown in Fig. 10.

[Figure 12] is a schematic structural diagram of a carrier provided by an embodiment of the present invention.

[Fig. 13] is a flowchart of a chip placement method provided by an embodiment of the present invention.

Fig. 14 is a flowchart of another chip placement method provided by an embodiment of the present invention.

The present invention will be further described in detail below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for ease of description, only a part of the structure related to the present invention is shown in the drawings instead of all of the structure.

1 is a schematic structural diagram of a wafer placement equipment provided by an embodiment of the present invention, FIG. 2 is a top view of a rotatable turntable in the wafer placement equipment shown in FIG. 1, and FIG. 3 is a schematic view of the wafer placement equipment shown in FIG. Right view, referring to Figures 1-3, the wafer placement equipment includes: a feeding unit 10, a wafer transfer unit 20, and a wafer bonding unit 30; the feeding unit 10 includes a material component 11 and at least two chip pickers 12, and a material component 11 is configured to carry wafers 100, and at least two chip pickers 12 are configured to alternately pick up wafers 100 from material components 11; the wafer transfer unit 20 includes a rotatable turntable 21 on which a plurality of wafer adsorption areas are provided 211. The wafer adsorption area 211 is configured to adsorb the wafer 100 provided by at least two pick-up hands 12; the wafer bonding unit 30 includes a placement table 31 and at least two placement hands 32, and the at least two placement hands 32 are configured to alternate from The wafer adsorption area 211 picks up the wafer 100 and attaches the wafer 100 to the substrate 200 on the placement stage 31.

The following is a brief introduction to the placement method of the placement equipment with reference to FIG. 1. The placement method includes: at least two pickup hands 12 alternately pick up the wafer 100 from the material element 11 and place the wafer 100 on the rotatable turntable 21 Multiple wafer adsorption areas 211; the rotatable turntable 21 rotates, with The multiple wafer suction areas 211 on the movable rotatable turntable 21 move; at least two placement hands 32 alternately pick up the wafer 100 from the multiple wafer suction areas 211 and place the wafer 100 on the substrate 200 on the placement table 31 . It should be noted that in the steps of picking and placing by each picker and the steps of picking and placing by each pick and place, after each action, the rotatable turntable 21 rotates once at a preset angle to turn the rotatable The position on the turntable 21 where the wafer has been placed by the pickup hand is moved, and the position where the wafer has been placed is moved to the pickup position of the placement hand. Take the rotatable turntable shown in FIG. 2 including 12 adsorption areas 211 as an example , The angle of each rotation of the rotatable turntable 21 is 30°.

It should be noted that the movement process of the picking hand 12 and the placement hand 32 when picking and placing the chip and placement includes horizontal and vertical movement. The horizontal movement can include the adjustment of the X and Y dimensions. The picking hand 12 and the placement hand 32 It can be set as a suction hand of the sucking method, and the picking and releasing operation of the wafer 100 can be realized by whether the vacuum is applied or not. The number of picking hands 12 and placement hands 32 should not be less than two to perform alternate picking and placing actions. Of course, you can also increase the number of picking hands 12 and placement hands 32 to 3 or 4, etc., by 3 or The 4 picking hands and patching hands 32 alternately pick and place, which can reduce the interval between the alternate actions of the two picks or the two patch hands, and increase the patching speed. In addition, the number of picking hands and patching hands can be set to be the same or different according to the picking speed of the picking hand and the patching speed ratio of the patching hand.

According to the chip placement equipment provided by the embodiment of the present invention, by providing at least two pick-up hands in the feeding unit and at least two pick-and-place hands in the wafer bonding unit, the at least two pick-up hands alternately pick up wafers from the material components, And placed on the wafer suction area of the rotatable turntable of the wafer transfer unit, and at least two placement hands alternately pick up the wafers from the rotated wafer suction area and attach them to the substrate on the placement table so that at least two A single picking hand can alternately pick and place wafers at the same time, and at least two placement hands can also alternate placement operations at the same time, solving a single picking hand and a single placement hand picking and placing and patching The problem of low placement efficiency in tandem operation mode has realized the parallel operation mode of at least two picking hands and at least two placement hands, doubling the placement speed, improving placement efficiency, and promoting the process of chip packaging , Which helps to increase wafer yield. In addition, the placement of the placement hand and the wafer transfer unit are separately arranged to facilitate the placement of the placement hand to adjust the posture when picking up the wafer, grab the center of the wafer, and help precise placement.

Continuing to refer to FIG. 1, optionally, the placement table 31 includes a supporting table 311, a first moving table 312, and a first suction table 313 stacked in sequence; the supporting table 311 is configured to carry the first moving table 312, the first suction The table 313 and the substrate 200; the first moving table 312 is configured to move the substrate to make the area to be mounted on the substrate to be aligned with the position to be mounted; the first suction table 313 is configured to adsorb the substrate 200. Optionally, the material element 11 includes a second movement table 111, a second suction table 112, and a thimble unit 113 stacked in sequence. The second movement table 111 is configured to move the wafer to be picked to the picking position, and the second suction table 112 is configured to adsorb the wafer 100 to be picked up; the ejector pin unit 113 is configured to separate the wafer to be picked from the second suction stage 112 at the picking position.

The material component 11 and the placement table 31 themselves can have a position moving function. In some embodiments, when the picker takes a piece from the material component 11, it is necessary to move the wafer to be taken on the material component 11 to the position to be taken in advance , So that the fetching hand performs fetching, wherein the first movement stage 111 can move horizontally and longitudinally. When the placement hand attaches the wafer to the substrate on the placement table 31, the second moving table 312 moves horizontally to move the placement position to the target placement position.

4 is a schematic top view of the chip placement equipment shown in FIG. 1. Referring to FIGS. 1 and 4, at least two picking hands include a first picking hand 121 and a second picking hand 122, and at least two picking hands include a first picking hand. The chip mounter 321 and the second mounter 322; the chip mounter also includes a wafer alignment unit 40, and the wafer alignment unit 40 includes a picking and alignment camera 41, a first picking and alignment camera 421, and a second picking pair Position camera 422, first patch registration camera 431, and second patch registration camera 432 The positioning camera 42 includes a first pick-and-alignment camera 421 and a second pick-and-alignment camera 422, and the patch and alignment camera 43 includes a first patch and alignment camera 431 and a second patch and alignment camera 432; The material alignment camera 41 is located above the material element 11 and is configured to determine the position of the wafer 100 on the material element 11; the first pick-and-align camera 421 and the second pick-and-align camera 422 are respectively configured to determine the rotatable The position of the wafer 100 to be taken on the turntable 21; the first placement camera 431 and the second placement camera 432 are respectively configured to determine that the chip 100 acquired by the first placement hand 321 and the second placement 322 is Placement position on the placement table 31 to be placed.

200 shown in FIG. 1 is a wafer substrate placed on the placement table 31. The first placement hand 321 and the second placement hand alternately pick up the wafer 100 on the wafer suction area 211 on the rotatable turntable 21 and place it to The wafer substrate 200 on the placement stage 31 is at the position to be placed. In addition, referring to FIG. 1, the second pick-and-align camera 422 and the second patch-alignment camera 432 are located behind the vertical paper surface of the first pick-and-align camera 421 and the first patch-alignment camera 431, respectively. Shown in dotted lines.

The location of the wafer and the location to be attached to the location camera can be determined based on the images of the wafer and wafer substrate, and the location mark on the wafer and wafer substrate. 1 and 4, taking the first picking hand 121 and the first placement hand 321 as examples, the working process of the chip placement equipment including the chip alignment unit is briefly introduced: the picking alignment camera 41 The position of each wafer is determined by the alignment mark on the wafer that has been divided into wafers on the material component 11; the wafer is picked up by the first picker 121 and placed on the wafer suction area 211 of the rotatable turntable 21; The rotatable turntable 21 rotates to move the multiple wafer adsorption areas 211. The first pick-up and alignment camera 421 is located in a certain wafer adsorption area 211; the first pick-up and alignment camera 421 is on the wafer adsorption area 211 The position of the wafer is determined by the first placement hand 321; the first placement camera 431 determines the position to be placed on the wafer substrate 200 on the placement table 31, and the first placement The placement hand 321 attaches the chip to the wafer substrate 200. The wafer alignment unit can detect the position of the wafer during the picking and placement and placement of the wafer, ensuring that the picker and placement hand can absorb the center position of the wafer when picking up the wafer, effectively avoiding the drop of the wafer.

The alignment camera in the wafer alignment unit can be accurately driven by a gantry and other devices to determine the position of the wafer and the position of the chip to be mounted. The alignment camera can also be fixed by the material carrying the wafer. The components and placement table move accurately to determine the position of the wafer and the position of the wafer to be placed.

In order to improve the efficiency of picking and placing chips and placement by the picker and placement hand when determining the position of the chip and the location to be placed, the embodiment of the present invention also provides 5 is a schematic diagram of a partial structure of another wafer placement equipment provided by an embodiment of the present invention. Referring to FIG. 5, in the wafer placement equipment, the rotatable turntable includes first picking hands 121, The first placement position 2011, the second placement position 2012, the first placement position 2021 and the second placement position 2022 of the second picking hand 122, the first placement hand 321 and the second placement hand 322; The picking position 2021 and the second picking position 2022 are located below the first picking and registration camera and the second picking and registration camera; the rotatable turntable 21 is configured to rotate a plurality of wafer adsorption areas 211 to move to the first place in sequence Position 2011, second placement position 2012, first pickup position 2021, and second pickup position 2022; first pickup hand 121 and second pickup hand 122 are also configured to alternately place wafer 100 in first placement Position 2011 and the second placement position 2012 corresponding to the wafer suction area 100; the first placement hand 321 and the second placement hand 322 are configured to alternate from the first picking position 2021 and the second picking position 2022 corresponding The wafer 100 is picked up on the wafer adsorption area 211, and the wafer 100 is alternately attached to the substrate 200 on the placement stage.

The chip placement equipment has fixed the first placement position 2011 and the second placement position 2012, the first picking position 2021 and the second picking position 2022, at this time the first picking hand 121, the second picking hand 122, the first picking hand 321 and the second picking hand 322 can fix the placement and picking positions , The first picking hand 121, the second picking hand 122, the first patching hand 321, and the second patching hand 322 are reduced to determine the position of the placement and picking, which can improve the placement efficiency to a certain extent. It should be noted that the positions of the first pickup position 321 and the second pickup position 322 depend on the positions of the first pickup and registration camera and the second pickup and registration camera to facilitate the first pickup and registration camera And the second pick-up alignment camera confirms the positions of the wafers on the first pick-up location 321 and the second pick-up location 322.

For the patching device shown in FIG. 5, the embodiment of the present invention also provides a patching method. FIG. 6 is a timing control diagram of patching provided by the embodiment of the present invention. Refer to FIG. 1, FIG. 5, and FIG. 6 below. The placement method of the placement equipment is described: Among them, the sucking action and the placement action of the picking hand and the placement hand respectively represent the actions of picking up and placing the chip, and the first and second placement hands perform the suction and At the same time as the patching action, it is necessary to use the alignment camera to determine the position. One cycle of the placement process may include two time periods. In the first time, the first picker 121 picks up the wafer 100 from the material component 11, and the second picker 122 picks up the wafer 100 from the material component 11. Placed in the wafer suction area 211 corresponding to the second placement position 2012, the first placement hand 321 picks up the wafer 100 from the wafer suction area 211 corresponding to the first pickup position 2021, and the second placement hand 322 will The wafer 100 picked up on the wafer suction area 211 corresponding to the second picking bit 2022 is placed on the substrate 200 on the placement table 31; in the second time, the first picking hand 121 will pick up the material component 11 Place the wafer 100 in the wafer suction area 211 corresponding to the first placement position 2011, the second picking hand 122 picks up the wafer 100 from the material component 11, and the first placement hand 321 will correspond to the first picking position 2021 The wafer 100 picked up on the wafer suction area 211 of the wafer is mounted on the substrate 200 on the placement stage 31, and the second placement hand 322 picks up the wafer 100 from the wafer suction area 211 corresponding to the second picking position 2022. need It is explained that between the first time and the second time, the rotatable turntable 21 rotates at a preset angle to satisfy that the wafer adsorption area 211 enters the first placement position 2011, the second placement position 2012, and the first In the picking position 2021 and the second picking position 2022, taking the 12 wafer adsorption areas shown in FIG. 2 as an example, the rotatable turntable 21 rotates 60° in one cycle including two time periods, and A wafer was alternately placed in two adjacent wafer adsorption areas, and the placement hand picked up two wafers on the adjacent two wafer adsorption areas alternately and placed them on the substrate on the placement table alternately on. The placement method highly synchronizes the pick-and-place wafer actions of the first pick-up hand, second pick-up hand, first pick-up hand, and second pick-and-place hand, realizes the alternation of pick-and-place actions, and ensures the improvement of chip placement efficiency .

Continuing to refer to FIG. 5, optionally, a plurality of wafer adsorption areas 211 are arranged in an equally spaced circle around the center of the rotatable turntable 21, the first picking position 2011 and the second placing position 2022, the first placing position 2021 and The second film taking positions 2012 are respectively symmetrical about the center of the rotatable turntable 21.

In addition, after fixing the first position 2011, the second position 2012, the first position 2021, and the second position 2022, correspondingly, the first position alignment camera and the second position The position of the positioning camera has also been determined, and since the placement table can be moved, the positions of the first placement registration camera and the second placement registration camera can also be fixed, so the first pick-and-place registration can be set The camera, the second pick-up and alignment camera, the first and second patch and alignment cameras are fixedly mounted on the same substrate. FIG. 7 is a bottom view of the film taking and alignment camera and the patch and alignment camera provided by the embodiment of the present invention. Referring to FIG. 7, the first film taking and alignment camera 421, the second film taking and alignment camera 422, and the first The placement camera 431 and the second placement camera 432 are compactly laid out on the same substrate 44, and will be made of low-expansion constant steel material to ensure that the chip positioning unit will not The temperature drift between each camera is too large due to the change of the environment temperature of the machine.

For the structure of the rotatable turntable in the wafer transfer unit, the embodiment of the present invention provides A rotatable turntable. FIG. 8 is a schematic structural diagram of a rotatable turntable provided by an embodiment of the present invention. Referring to FIG. 8, the rotatable turntable 21 includes a carrier table 22 and a rotating motor 23 connected to the center axis of the carrier table 22. The motor 23 is configured to drive the carrier table 22 to rotate; the carrier table 22 includes a carrier 221 and a gas slip ring 222 located inside the carrier 221. The carrier 221 is provided with a plurality of wafer adsorption areas, the gas slip ring 222 It is configured to supply vacuum and positive pressure gas to the wafer adsorption zone.

9 is a schematic cross-sectional structure diagram of a stage provided by an embodiment of the present invention. Referring to FIGS. 8 and 9, each wafer adsorption area of the stage 221 is provided with at least one suction hole 2211, and the interior of the stage 221 is provided with The plurality of suction channels 2212 are connected by the plurality of suction holes 2211, and the plurality of suction channels 2212 are connected with the air slip ring 222.

In order to reduce the horizontal movement distance of the first pick-up hand and the second pick-up hand and the horizontal movement distance of the first placement hand and the second placement hand, the embodiment of the present invention also provides a chip placement equipment. FIG. 10 is an embodiment of the present invention. A schematic structural diagram of another wafer placement equipment is provided. FIG. 11 is a right side view of the wafer placement equipment shown in FIG. 10. Referring to FIG. 5, FIG. 10, and FIG. 11, optionally, the material assembly 11 is located under the wafer stage 22 ; The feeding unit also includes a third pickup hand 123 and a fourth pickup hand 124, the third pickup hand 123 and the fourth pickup hand 124 are flip pickup hands, and the first and second pickup hands 121 and 122 are translation pickup hands. The third pickup hand 123 and the fourth pickup hand 124 are configured to alternately pick up the wafer 100 on the material element 11 and turn it over. The first pickup hand 121 and the second pickup hand 122 are configured to pick up the third pickup 123 and the The wafer 100 on the four pick-up hand 124 is alternately translated and placed on the wafer suction area 211 corresponding to the first placement position 2011 and the second placement position 2022.

Since the third pick-up hand 123 and the fourth pick-up hand 124 alternately pick and place, the first pick-up hand 121 and the second pick-up hand 122 are also alternately picking and placing, so that the time can be fully utilized. In space, the material element 11 is arranged below the stage 22, and the third pick 123 and the fourth The picking hand 124 realizes the longitudinal displacement of the wafer, and then the first picking hand 121 and the second picking hand 122 realize the horizontal displacement of the wafer to ensure that the horizontal distance between the first picking hand 121 and the second picking hand 122 is shortened, thereby increasing The efficiency of fetching.

5, 10 and 11, optionally, the chip bonding unit 30 also includes a gantry 33, the first placement hand 321 and the second placement hand 322 are arranged on the gantry 33, the gantry 33 is configured In order to drive the first placement hand 321 and the second placement hand 322 to move horizontally and/or vertically according to the first picking position 2021, the second picking position 2022 and the position to be placed.

It should be noted that although the chip placement equipment uses two placement hands, it only needs one gantry 33 to realize the alternate movement control of the two placement hands, and there is no need to set a horizontal console separately, thus optimizing the entire chip The space layout of the placement equipment reduces the space size of the equipment. And in order to ensure that the stroke of the second motion table is as short as possible, two placement hands can be set to be responsible for different placement areas, and the horizontal fine-tuning function of the placement hands can be realized by the gantry to meet the placement requirements of different spacing.

In order to reduce the horizontal displacement distance of the placement hand between the placement table and the rotatable turntable, referring to Figures 5, 10 and 11, the placement table 31 can be set under the placement table 22, and to ensure that the placement hand is After picking up the wafer on the stage 22, it will not be blocked by the stage 22 when it is placed on the stage 31. The stage 31 and stage 22 can be set in a horizontal position. The offset distance determines the placement hand The horizontal displacement distance. As for the longitudinal movement distance of the placement hand, it is related to the height and thickness of the carrier. Continue referring to FIG. 7. Optionally, the carrier 221 includes a suspension portion 2211 and a bearing portion 2212, and the thickness of the bearing portion 2212 is less than or equal to 5 mm.

12 is a schematic structural diagram of a carrier provided by an embodiment of the present invention. Referring to FIGS. 5 and 10 to 12, on the carrier, a patch avoidance area 212 can be provided between two adjacent wafer adsorption areas 211; The gantry 33 is configured according to the first pick-up position 2021, the second pick-up position 2022, and the The chip position drives the first placement hand 321 and the second placement hand 322 to move longitudinally. The first placement hand 321 and the second placement hand 322 alternately place the chip 100 on the substrate on the placement table 31 through the placement avoidance area 212. 200 on the bottom.

It should be noted that the stage structure shown in FIG. 12 is only used as an example. The shape of the patch avoidance area 212 can also be set to a circle, a rectangle, a polygon, etc., and the first patch hand 321 and the second patch hand 322 The placement avoidance area 212 passes through to place the wafer 100 on the placement stage 31 below the stage 221. Obviously, the structure of the stage 221 and the placement method provided in this embodiment can avoid the horizontal displacement of the placement hand, shorten the placement time of the placement hand, and improve the chip placement efficiency.

Continuing to refer to FIGS. 5, 10, and 12, optionally, the first fetching alignment camera 421 and the second fetching alignment camera 422 are also configured to determine the first fetching position 2011 and the second fetching position respectively For the deflection angle of the chip 100 on the bit 2022, the gantry 33 is also configured to drive the first placement hand 321 and the second placement hand 322 to rotate according to the deflection angle.

It should be noted that the first placement hand 321 and the second placement hand 322 have at least 3 degrees of freedom and small stroke movement, can move and pick up the chip with two degrees of freedom horizontally, and move vertically to complete the placement action, and the first picker And when the second picker puts the wafer on the stage, the posture of the wafer is not fixed, and there may be a certain deflection angle. Therefore, it is necessary to adjust the deflection angle of the wafer before the placement hand mounts, so the placement hand has a rotation function , The posture of the wafer can be adjusted more accurately to ensure the accuracy of wafer bonding.

The embodiment of the present invention also provides a chip attaching method. FIG. 13 is a flowchart of a chip attaching method provided by an embodiment of the present invention. Referring to FIG. 13, the chip attaching method uses any chip provided by the embodiment of the present invention. Mounting equipment, including:

S110. At least two picking hands alternately pick up the wafer from the material component and place the wafer on the rotatable On multiple wafer adsorption areas of the turntable;

S120. The rotatable turntable rotates to drive the multiple wafer adsorption areas on the rotatable turntable to move;

S130. At least two placement hands alternately pick up wafers from multiple wafer adsorption areas and place the wafers on the substrate on the placement stage.

It should be noted that during the normal placement process, the alternate picking and placing actions of at least two picking hands and at least two picking hands can be synchronized, and the picking and placing of at least two picking hands and at least two picking hands There are also at least two alternate picking and placing methods for the placement hand; in the alternate manner shown in the timing diagram of Figure 6, taking the picking hand as an example, after the first picking hand sucks the film, the second picking hand then puts the film Action, and then the first picker is performing the action of placing the film, and finally the second picking hand performs the action of sucking the film, thus completing a cycle; of course, it can also be the sucking action of the first picking hand and the second picking hand of the film The actions are performed at the same time, that is, in a cycle, while the first pick-up hand sucks the film, the second pick-up hand performs the film-feeding action, and then the first pick-up hand performs the film-feeding action, and the second pick-up hand performs the film suction action at the same time. Similarly, the alternate method for the placement of the hands can also be alternate pick and place, or simultaneous pick and place.

According to the chip placement method provided by the embodiment of the present invention, at least two picking hands alternately pick up wafers from a material element and place the wafers on multiple wafer suction areas of a rotatable turntable; at least two placement hands alternately pick up wafers from multiple Pick up the wafer from the wafer adsorption area and place the wafer on the substrate on the placement table, which solves the problem of low placement efficiency in the tandem operation mode of single pickup hand and single placement hand picking and placing and placement. The parallel operation mode of at least two picking hands and at least two placement hands doubles the placement speed, improves placement efficiency, promotes the process of chip packaging, and helps to increase the yield of chips.

14 is a flowchart of another chip placement method provided by an embodiment of the present invention. Referring to FIG. 14, optionally, for the chip placement equipment, at least two chip picking hands include a first chip picking hand and a second chip picking hand. Two picking hands, at least two picking hands include the first picking hand and the second picking hand; the rotatable turntable contains the first picking hand, the second picking hand, the first picking hand, and the second picking hand respectively. Position, second placement position, first take position and second take position; the chip placement method includes:

S210. In the first time, the first pick-up hand picks up the wafer from the material component, and the second pick-up hand places the wafer picked up from the material component in the wafer suction area corresponding to the second placement position, and the first placement hand Pick up the wafer from the wafer suction area corresponding to the first pick-up location, and the second placement hand will place the wafer picked up from the wafer suction area corresponding to the second pick-up location on the substrate on the placement stage ；

S210. In the second time, the first pick-up hand places the wafer picked up from the material component in the wafer suction area corresponding to the first placement position, the second pick-up hand picks up the wafer from the material component, and the first placement hand Place the wafer picked up from the wafer suction area corresponding to the first pick-up location on the substrate on the placement stage, and the second placement hand picks up the wafer from the wafer suction area corresponding to the second pick-up location .

10‧‧‧Feeding unit

11‧‧‧Material components

12‧‧‧ Film picker

20‧‧‧Chip transfer unit

21‧‧‧Rotating turntable

30‧‧‧Chip bonding unit

31‧‧‧Placement table

32‧‧‧Patch Hand

40‧‧‧Chip Alignment Unit

41‧‧‧Reclaiming and positioning camera

42‧‧‧Film taking and registration camera

43‧‧‧SMD registration camera

100‧‧‧chip

111‧‧‧Second Sports Platform

112‧‧‧Second Adsorption Station

113‧‧‧Thimble unit

121‧‧‧First picker

122‧‧‧Second film picker

200‧‧‧Substrate

311‧‧‧Support Table

312‧‧‧The first sports platform

313‧‧‧The first adsorption station

321‧‧‧First placement hand

322‧‧‧Second placement hand

421‧‧‧First pick-up registration camera

422‧‧‧Second pick-up registration camera

431‧‧‧The first patch camera

432‧‧‧Second patch camera

Claims (16)

A chip placement equipment, characterized in that it includes: a feeding unit, a wafer transfer unit and a wafer bonding unit, wherein; The aforementioned feeding unit includes a material element and at least two pick-up hands, the aforementioned material element is configured to carry wafers, and the aforementioned at least two aforementioned pick-up hands are configured to alternately pick up the aforementioned wafers from the aforementioned material component; The aforementioned wafer transfer unit includes a rotatable turntable, the aforementioned rotatable turntable is provided with a plurality of wafer adsorption areas, and the aforementioned wafer adsorption area is configured to adsorb the aforementioned wafers provided by the aforementioned at least two chip pickers; The wafer bonding unit includes a placement table and at least two placement hands, and the at least two placement hands are configured to alternately obtain the wafer from the wafer adsorption area and bond the wafer to the substrate on the placement table on. As for the chip placement equipment described in item 1 of the scope of patent application, wherein the at least two pickup hands include a first pickup hand and a second pickup hand, and the at least two placement hands include a first placement hand and a second placement hand. ； The aforementioned chip placement equipment also includes a chip alignment unit, and the aforementioned chip alignment unit includes a pick-and-align camera, a first pick-and-align camera, a second pick-and-align camera, and a first pick-and-align camera And the second patch camera; Wherein, the reclaiming and positioning camera is located above the material component, and the reclaiming and positioning camera is configured to determine the position of the wafer on the material component; Both the first film-taking and alignment camera and the second film-taking and alignment camera are configured to determine the position of the wafer to be taken on the rotatable turntable; The first placement and alignment camera is configured to determine the position to be placed on the placement stage of the chip obtained by the first placement hand, and the second placement and alignment camera is configured to determine the second The position of the chip to be placed on the placement stage of the chip obtained by placement. For the wafer placement equipment described in item 2 of the scope of patent application, the rotatable turntable includes a first placement position corresponding to the first pickup hand, a second placement position corresponding to the second pickup hand, and The first picking position of the first placement hand and the second picking position corresponding to the aforementioned second placement hand; Wherein, the first film taking position is located below the first film taking and registration camera, and the second film taking position is located below the second film taking and registration camera; The rotatable turntable is configured to sequentially move each of the wafer suction regions to the first placement position, the second placement position, the first pickup position, and the second pickup position by rotation; A pick-up hand and the second pick-up hand are also configured to alternately place the wafers on the wafer suction area corresponding to the first placement position and the second placement position; The first placement hand and the second placement hand are configured to alternately pick up the wafer from the wafer suction area corresponding to the first pick position and the second pick position, and alternately place the wafer on the On the substrate on the placement table. As for the wafer placement equipment described in item 3 of the scope of patent application, wherein the plurality of wafer suction regions are arranged circumferentially at equal intervals around the center of the rotatable turntable, and the first pickup position and the second placement position Regarding the center symmetry of the rotatable turntable, the first film placement position and the second film taking position are symmetric about the center of the rotatable turntable. For the wafer placement equipment described in item 3 of the scope of patent application, wherein the rotatable turntable includes a wafer stage and a rotating motor connected to the center axis of the wafer stage, and the rotating motor is configured to drive the wafer stage to rotate ； The aforementioned wafer stage includes a stage and a pneumatic slip ring located inside the stage. The stage is provided with the plurality of wafer adsorption areas, and the pneumatic slip ring is configured to supply vacuum and positive to the plurality of wafer adsorption areas. Pressure gas. As for the wafer placement equipment described in item 5 of the scope of patent application, wherein each of the wafer suction regions of the stage is provided with suction holes, and the stage is provided with a plurality of suction holes respectively connected to the plurality of suction holes. The adsorption channel, the plurality of adsorption channels are connected to the gas slip ring. Such as the chip placement equipment described in item 5 of the scope of patent application, wherein the aforementioned material components are located under the aforementioned wafer stage; The aforementioned feeding unit also includes a third pickup hand and a fourth pickup hand, the third pickup hand and the fourth pickup hand are configured to alternately pick up the wafers on the material element and turn them over, the first pickup hand and the aforementioned fourth pickup hand The second pick-up hand is respectively configured to pick up the aforementioned wafers on the aforementioned third pick-up hand and the aforementioned fourth pick-up hand and alternately shift and place them on the aforementioned wafer suction area corresponding to the aforementioned first placement position and the aforementioned second placement position. . Such as the chip placement equipment described in item 3 of the scope of patent application, in which, The chip bonding unit also includes a gantry, the first placement hand and the second placement hand are arranged on the gantry, and the gantry is configured according to the first picking position, the second picking position and the aforementioned The position to be patched drives the first patching hand and the second patching hand to move. For the wafer placement equipment described in item 3 of the scope of patent application, wherein a placement avoidance area is provided between two adjacent wafer adsorption areas, and the placement table is located below the rotatable turntable; The chip bonding unit also includes a gantry, the first placement hand and the second placement hand are arranged on the gantry, and the gantry is configured according to the first picking position, the second picking position and the aforementioned The position to be placed drives the first placement hand and the second placement hand to move longitudinally. The first placement hand and the second placement hand alternately place the chip on the substrate on the placement stage through the placement avoidance area. For the chip placement equipment described in item 8 or 9 of the scope of patent application, wherein the first fetching and alignment camera is configured to determine the deflection angle of the chip on the first fetching position, and the second fetching position The chip alignment camera is configured to determine the deflection angle of the chip on the second chip taking position, and the gantry is also configured to determine the deflection angle of the chip on the first chip taking position or the second chip taking position. The angle drives the first placement hand and the second placement hand to rotate. For the chip placement equipment described in item 5 of the scope of patent application, wherein the carrier includes a suspension part and a carrying part, and the thickness of the carrying part is less than or equal to 5 mm. As for the chip placement equipment described in item 2 of the scope of patent application, wherein the first pickup and alignment camera, the second pickup and alignment camera, the first placement and alignment camera, and the second placement pair The camera is fixedly mounted on the same substrate. For the wafer placement equipment described in item 1 of the scope of patent application, wherein the placement table includes a support table, a first movement table, and a first suction table that are stacked in sequence; The aforementioned support table is configured to carry the aforementioned first movement table, the aforementioned first suction table, and the aforementioned substrate; The aforementioned first movement stage is configured to move the aforementioned substrate so that the area to be mounted on the aforementioned substrate is aligned with the position to be mounted; The first adsorption stage is configured to adsorb the substrate. As for the chip placement equipment described in item 1 of the scope of patent application, the aforementioned material components include a second movement table, a second suction table, and a thimble unit stacked in sequence; The aforementioned second movement stage is configured to move the wafer to be picked to the picking position; The aforementioned second adsorption stage is configured to adsorb the aforementioned wafer to be taken; The ejector pin unit is configured to release the wafer to be picked up at the picking position from the second suction stage. A chip placement method, characterized in that it uses the chip placement equipment described in any one of items 1 to 14 in the scope of the patent application, which includes: At least two picking hands alternately pick up wafers from the material components and place the aforementioned wafers on multiple wafer adsorption areas of the rotatable turntable; The rotation of the aforementioned rotatable turntable drives the movement of the aforementioned multiple wafer adsorption areas on the aforementioned rotatable turntable; At least two placement hands alternately pick up the wafer from the plurality of wafer adsorption areas and place the wafer on the substrate on the placement stage. For the chip placement method described in item 15 of the scope of patent application, wherein the at least two pickup hands include a first pickup hand and a second pickup hand, and the at least two placement hands include a first placement hand and a second placement hand. ; The aforementioned rotatable turntable includes a first placement position corresponding to the first pickup hand, a second placement position corresponding to the second pickup hand, a first pickup position corresponding to the first placement hand, and the second sticker The second film pick position of the film player; The aforementioned chip placement method also includes: In the first time, the first pick-up hand picks up the wafer from the material element, and the second pick-up hand places the wafer picked up from the material element in the wafer suction area corresponding to the second placement position. , The first placement hand picks up the wafer from the wafer suction area corresponding to the first picking bit, and the second picking hand picks up the wafer from the wafer suction area corresponding to the second picking bit The aforementioned chip is placed on the substrate on the aforementioned placement table; In the second time, the first pick-up hand places the wafer picked up from the material component in the wafer suction area corresponding to the first placement position, and the second pick-up hand picks up the wafer from the material component , The first placement hand will place the wafer picked up from the wafer suction area corresponding to the first pickup location on the substrate on the placement stage, and the second placement hand will be connected to the second Pick up the aforementioned wafer on the aforementioned wafer suction area corresponding to the chip taking position.

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