TWI708534B - Chip attaching equipment and chip attaching method - Google Patents

Abstract

The present invention discloses a wafer placement equipment and a wafer placement method. The aforementioned wafer placement equipment includes: a feeding unit, a wafer transfer unit, and a wafer bonding unit; the feeding unit includes a material assembly and a pickup hand, and the pickup hand is configured to Pick up the wafer on the material assembly; the wafer transfer unit includes a rotatable turntable, and the rotatable turntable is provided with multiple wafer adsorption areas and multiple placement avoidance holes, and the wafer adsorption area is configured to adsorb the wafers provided by the pick-up hand; wafer bonding unit It includes a placement table and a placement hand, and the placement hand is configured to pick up the wafer from the wafer adsorption area and pass the placement avoidance hole to attach the wafer to the substrate on the placement table. The chip placement equipment and placement method provided by the embodiments of the present invention can eliminate the horizontal displacement required when the placement hand moves from the wafer transfer unit to the wafer bonding unit, effectively shorten the placement time, and improve the placement speed and efficiency. Promote the process of chip packaging and help increase chip yield.

Description

Chip attaching equipment and chip attaching method

The embodiment of the present invention relates to chip packaging technology, for example, to a chip placement equipment and a chip placement method.

The integrated circuit (IC) industry is a fast-growing point of current global economic development. Among them, the advancement of semiconductor manufacturing technology and the rapid growth of market demand for chips have put forward high requirements on the production efficiency of chips. Among them, chip packaging The efficiency directly affects the production speed of wafers.

In order to improve the efficiency of chip packaging, generally by designing and improving the packaging structure and packaging methods or optimizing packaging equipment, including chip placement equipment. In the related art, the chip placement equipment can include linear transmission and turntable transmission. Among them, the linear transmission method uses a conveyor belt to transfer the wafers to be bonded, and picks up and mounts them by a robot. The linear transmission method of placement equipment has a large space size, a long transmission distance, and higher placement efficiency. Low; and the turntable transmission method is usually to set the manipulator on the turntable. By directly transferring the turntable from the source of the chip to the target position for placement, it will cause the turntable diameter to be too large, and the turntable drive motor will have a heavy load and the speed cannot be increased. Yield; and it is not conducive to the manipulator to adjust the posture when picking up the chip.

In order to improve the efficiency of chip packaging, generally by designing and improving the packaging structure and packaging methods or optimizing packaging equipment, including chip placement equipment. The invention provides a chip placement equipment and a chip placement method to realize high-efficiency placement and promote chip packaging efficiency and production efficiency.

In a first aspect, an embodiment of the present invention provides a wafer placement equipment, including: a feeding unit, a wafer transfer unit, and a wafer bonding unit;

The aforementioned material supply unit includes a material component and a take-out hand, the aforementioned material component is configured to carry a wafer, and the aforementioned take-up hand is configured to pick up a wafer from the aforementioned material component;

The aforementioned wafer transfer unit includes a rotatable turntable, and the aforementioned rotatable turntable is provided with a plurality of wafer adsorption areas and a plurality of patch avoidance holes, and the aforementioned wafer adsorption area is configured to adsorb the aforementioned wafers provided by the aforementioned picker;

The wafer bonding unit includes a placement table and a placement hand, the placement hand is located above the rotatable turntable, the placement table is located below the rotatable turntable, and the placement hand is configured to pick up the wafer from the wafer suction zone , And stick the wafer to the substrate on the mount stage through the patch escape hole.

In some embodiments, the aforementioned wafer transfer unit further includes a placement alignment component; the aforementioned rotatable turntable includes a hollow shaft and a turntable connected to the aforementioned hollow shaft, and the turntable is provided with the plurality of wafer adsorption areas and the plurality of stickers. Piece avoidance hole

The aforementioned patch alignment component includes a patch alignment camera, a beam splitter, a first mirror, a second mirror, and a third mirror;

Wherein, the patch alignment camera is located in the inner space of the hollow shaft, the beam splitter and the first mirror are located on the side of the turntable close to the hollow shaft, and the second mirror and the third mirror are located in the aforementioned The turntable is away from the side of the hollow shaft; and in the axial direction of the hollow shaft, the patch alignment camera, the beam splitter, and the second mirror are arranged in order from top to bottom;

The patch alignment camera is configured to determine the position of the wafer on the wafer adsorption area of the turntable based on the beam splitter and the first mirror; the patch alignment camera is further configured to determine the position of the wafer on the wafer adsorption area of the turntable according to the beam splitter and the first mirror The second mirror and the aforementioned third mirror determine the position to be mounted on the substrate on the mounting stage.

In some embodiments, the aforementioned patch alignment component further includes a first light source and a second light source;

The first light source ring is sleeved on the first reflector, the first light source ring is configured to illuminate the wafer adsorption area on the turntable; the second light source ring is sleeved on the third reflector, and the second light source is It is configured to illuminate the area to be mounted of the substrate on the mounting table.

6mm；前述轉盤的厚度與前述第三反射鏡在垂直前述轉盤的方向上的尺寸的和為L2，其中，L2

6mm。 In some embodiments, the sum of the thickness of the turntable and the size of the second reflector in a direction perpendicular to the turntable is L1, where L1

6mm; the sum of the thickness of the aforementioned turntable and the size of the aforementioned third mirror in the direction perpendicular to the aforementioned turntable is L2, where L2

6mm.

In some embodiments, the aforementioned feeding unit further includes a reclaiming and positioning component, the aforementioned reclaiming and positioning component includes a reclaiming and positioning camera, and the aforementioned reclaiming and positioning camera is located in the aforementioned object. Above the material assembly, the aforementioned material retrieving alignment is configured to determine the position of the aforementioned wafer on the aforementioned material assembly.

In some embodiments, the aforementioned material component is located below the aforementioned rotatable turntable;

The aforementioned pickup hand includes a first pickup swing arm and a second pickup swing arm; the first pickup swing arm is configured to pick up the wafer on the material assembly and turn it over, and the second pickup swing arm is configured to Pick up the aforementioned wafer on the aforementioned first piece-taking swing arm and place it on the aforementioned wafer suction area.

In some embodiments, the wafer bonding unit further includes a first frame, the placement hand is disposed on the first frame, and the first frame is configured to drive the placement hand to move longitudinally to pick up the wafer from the wafer adsorption area The chip is pasted to the substrate on the placement stage through the patch escape hole.

In some embodiments, the placement component is further configured to determine the deflection angle of the wafer to be placed on the turntable, and the first frame is further configured to drive the placement hand to rotate according to the deflection angle.

In some embodiments, the plurality of wafer suction regions and the plurality of patch avoiding holes are alternately arranged.

In some embodiments, the plurality of wafer adsorption regions and the plurality of patch avoiding holes are arranged in a circle at equal intervals around the center of the rotatable turntable.

In some embodiments, the aforementioned placement table includes a support table and a first movement table that are sequentially stacked;

The aforementioned support table is configured to carry the aforementioned first movement table and the aforementioned substrate;

The aforementioned first movement stage is configured to move the area to be mounted on the substrate to the position to be mounted;

The aforementioned material component includes a second movement table and a thimble unit;

The aforementioned second movement stage is configured to move the wafer to be picked to the picking position;

The ejector pin unit is configured to eject the wafer to be picked up at the picking position, so that the wafer to be picked is separated from the second moving table.

In some embodiments, the reclaiming and positioning component is further configured to determine the deflection angle of the wafer to be retrieved on the material component, and the second motion stage is further configured to rotate the wafer according to the deflection angle.

In some embodiments, the aforementioned feeding unit further includes a first library, a first robot, a second library, and a second robot. The first library is configured to provide wafers, and the first robot is configured To pick up the wafer from the first library and place it on the material assembly; the second library is configured to provide substrates, and the second robot is configured to pick up the substrates from the second library and place them On the aforementioned placement table.

In a second aspect, an embodiment of the present invention further provides a chip placement method using the chip placement equipment as described in any one of the first aspect, including:

The picker picks up the wafer from the material assembly and places the aforementioned wafer on the wafer suction area of the rotatable turntable;

The aforementioned rotatable turntable rotates, and the multiple wafer adsorption areas and multiple patch avoidance holes on the aforementioned rotatable turntable move;

The placement hand picks up the wafer from the wafer suction area and passes through the placement escape hole to attach the wafer to the substrate on the placement stage.

In some embodiments, the aforementioned pick-up hand includes a first pick-up hand swing arm and a second pick-up swing arm; the aforementioned placement table includes a first movement table; the aforementioned material component contains a second movement table; the aforementioned chip placement method includes multiple A patch period, each of the foregoing patch period includes a first sub period, a second sub period, and a third sub period that are sequentially set;

In the first sub-period, the second motion stage moves the wafer to be picked up to the picking position, the placement hand passes through the placement escape hole, and the wafer is attached to the substrate on the placement stage;

In the second sub-period, the first fetching swing arm picks up the wafer from the material assembly and turns it over, the rotatable turntable rotates, and the first motion stage moves the area to be mounted on the substrate to the position to be mounted;

In the third sub-period, the second pick-up swing arm picks up the wafer from the first pick-up swing arm and places it on the wafer suction area of the rotatable turntable, and the placement hand picks up the wafer from the wafer suction area.

In the present invention, a feeding unit, a wafer transfer unit and a wafer bonding unit are arranged in the wafer placement equipment; wherein the feeding unit includes a material assembly and at least one pick-up hand, and the wafer transfer unit includes a rotatable turntable on the turntable A plurality of wafer suction areas and a plurality of patch avoidance holes are provided. The wafer bonding unit includes a placement table and at least one placement hand. At least one placement hand picks up the wafer from the wafer suction area and passes through the placement avoidance hole to attach the wafer Bonding to the substrate on the placement table can eliminate the horizontal displacement required when the placement hand moves from the wafer transfer unit to the wafer bonding unit, effectively shortening the placement time, improving the placement speed and efficiency, and promoting the chip packaging The process helps increase the yield of wafers. In addition, the placement hand is set above the aforementioned rotatable turntable, The placement table is arranged below the rotatable turntable, which can ensure a more compact space between the units of the placement equipment and reduce the space size of the wafer placement equipment.

10‧‧‧Chip

11‧‧‧Feeding unit

12‧‧‧Chip transfer unit

13‧‧‧Chip bonding unit

20‧‧‧Substrate

111‧‧‧Material components

112‧‧‧Flicker

120‧‧‧Rotating turntable

131‧‧‧Placement table

132‧‧‧Patch Hand

[Fig. 1] is a schematic structural diagram of a chip placement equipment provided by Embodiment 1 of the present invention.

[Figure 2] is a top view of the rotatable turntable in the wafer placement equipment shown in Figure 1.

[Fig. 3] is a schematic structural diagram of another chip placement equipment provided by Embodiment 1 of the present invention.

[Fig. 4] is a schematic diagram of the structure of a chip placement equipment provided by the second embodiment of the present invention.

[Figure 5] is a top view of the rotatable turntable in the wafer placement equipment shown in Figure 4;

[Figure 6] is a left side view of the wafer placement equipment shown in Figure 4.

[Fig. 7] is a partial enlarged view of the wafer placement equipment shown in Fig. 6.

[Figure 8] is a working sequence diagram of the chip placement equipment provided by the second embodiment of the present invention.

[Fig. 9] is a flowchart of a chip attaching method provided in the third embodiment of the present invention.

Fig. 10 is a flowchart of another chip bonding method provided by an embodiment of the present invention.

The present invention will be further described in detail below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be further noted that, for the convenience of description, only the Invention-related part but not all of the structure.

Example one

FIG. 1 is a schematic structural diagram of a wafer placement equipment provided by Embodiment 1 of the present invention. FIG. 2 is a top view of a rotatable turntable in the wafer placement equipment shown in FIG. 1. Referring to FIGS. 1 and 2, the wafer placement equipment It includes: a feeding unit 11, a wafer transfer unit 12, and a wafer bonding unit 13; the feeding unit 11 includes a material assembly 111 and at least one take-out hand 112, the material assembly 111 is configured to carry the wafer 10, and at least one take-out hand 112 is configured In order to pick up the wafer 10 from the material assembly 111; the wafer transfer unit 12 includes a rotatable turntable 120. The rotatable turntable 120 is provided with a plurality of wafer adsorption areas 121 and a plurality of patch avoidance holes 122. The wafer adsorption area 121 is configured as Adsorb the wafer 10 provided by at least one picker 112; the wafer bonding unit 13 includes a placement table 131 and at least one placement hand 132, the placement hand 132 is located above the rotatable turntable 120, and the placement table 131 is located below the rotatable turntable 120 At least one placement hand 132 is configured to pick up the wafer 10 from the wafer adsorption area 121 and pass through the placement escape hole 122 to attach the wafer 10 to the substrate 20 on the placement stage 131.

In some embodiments, when the placement hand 132 picks up the wafer and the placement, the movement process is only a longitudinal movement. After picking up the wafer 10, the rotatable turntable 120 can rotate so that the placement avoidance hole 122 is located under the placement hand 132. At this time, the placement hand 132 passes through the placement escape hole 122 to place the substrate 20 on the placement stage 131 under the rotatable turntable 120.

Hereinafter, referring to FIG. 1, the placement method of the placement equipment is briefly introduced. The placement method includes: at least one pickup hand 112 picks up the wafer 10 from the material assembly 111 and places the wafer 10 on the wafer suction of the rotatable turntable 120 Area 121; the rotatable turntable 120 rotates, the multiple wafer adsorption areas 121 and the multiple patch avoidance holes 122 on the rotatable turntable 120 move At least one placement hand 132 picks up the wafer 10 from the wafer adsorption area 121 and passes through the placement avoidance hole 122 to attach the wafer 10 to the substrate 20 on the placement stage 131.

It should be noted that in the two steps of the picker 112 placing the wafer 10 to the wafer suction area 121 and the placement hand 132 picking up the wafer 10 from the wafer suction area 121, the rotatable turntable 120 needs to be stationary, so the two steps can be performed simultaneously . In addition, in a placement cycle, after the picker 112 places the wafer 10 to the wafer adsorption area 121 or after the picker 132 picks up the wafer 10 from the wafer adsorption area 121, the rotatable turntable 120 rotates at a preset angle to The wafer suction area 121 where the wafer 10 has been placed on the rotating turntable 120 is removed, and at the same time, the wafer suction area 121 where the wafer 10 has been placed is moved to the picking position of the placement hand 132. The rotatable turntable 120 shown in FIG. 2 contains 4 Take one wafer adsorption area 121 and four patch avoidance holes 122 as an example. In two adjacent cycles, between the steps of two picking hands 112 placing the wafer 10 to the wafer adsorption area 120, the rotatable turntable 120 needs to rotate 90° . In addition, when the placement hand 132 places the picked wafer 10 through the placement avoidance hole 122 onto the substrate 20, the rotatable turntable 120 is also in a static state, that is, in two adjacent cycles, the rotatable turntable 120 cannot Rotate directly by 90°, and need to rotate 45° first to ensure that the placement hand 132 passes through the patch avoidance hole 122 and is placed on the substrate 20. After the placement hand 132 returns to its original position, the rotating turntable 120 can continue to rotate 45° to The pick-up hand 112 places the wafer 10 on the wafer suction area 121 and the placement hand 132 picks up the wafer 10 from the wafer suction area 121.

It should be noted that the number of picking hands 112 and placement hands 132 can be set to one or multiple. For example, two picking hands and two placement hands can be set, and the two picking hands alternately pick and place chips. , The two placement hands alternately pick up the chip and pass through the placement avoidance hole to place the chip on the substrate, so that the speed of picking and placement can be reversed Times to improve placement efficiency. In some embodiments, two picking hands 112 and two placement hands 132 can be set to work in parallel. While the two picking hands 112 are alternately picking up and placing wafers, the two picking hands are also alternately picking up and placing wafers. Step through the patch avoidance hole to patch.

The chip placement equipment provided in the first embodiment of the present invention is provided by the chip placement equipment with a feeding unit, a wafer transfer unit, and a wafer bonding unit; wherein the feeding unit includes a material component and at least one picker and a wafer transfer unit It includes a rotatable turntable. The rotatable turntable is provided with multiple wafer suction areas and multiple patch avoidance holes. The wafer bonding unit includes a placement table and at least one placement hand. At least one placement hand picks up the wafer from the wafer suction area and Passing through the patch avoidance hole to attach the wafer to the substrate on the placement table, the horizontal displacement required when the placement hand moves from the wafer transfer unit to the wafer bonding unit can be eliminated, effectively shortening the placement time and improving Mounting speed and efficiency promote the process of chip packaging and help increase chip yield. In addition, placing the placement hand above the rotatable turntable and the placement table below the rotatable turntable can ensure a more compact space between the units of the placement equipment and reduce the space size of the wafer placement equipment.

Continuing to refer to FIG. 2, in some embodiments, multiple wafer adsorption areas and multiple patch avoidance holes are alternately arranged. In some embodiments, multiple wafer adsorption areas and multiple patch avoidance holes surround the rotatable turntable. The centers are arranged circumferentially at equal intervals. In some embodiments, the number of the multiple wafer adsorption areas and the number of patch avoiding holes are both greater than or equal to two.

The rotatable turntable shown in FIG. 2 includes four wafer adsorption areas and four patch avoidance holes arranged alternately, and they are arranged in an equally spaced circle around the center of the rotatable turntable 120. Refer to FIGS. 1 and 2, correspondingly In particular, the picking and placement actions of the placement hand need to be coordinated with the rotatable turntable 120 to improve the placement efficiency of the placement hand. At the first moment, the rotatable turntable rotates a wafer adsorption area with the wafer to the placement hand. Fang; At the second moment, the placement hand picks up the chip Action: At the third moment, the rotatable turntable rotates 45° clockwise to move the adjacent patch avoidance holes below the placement hand; at the fourth moment, the placement hand passes through the patch avoidance hole to place the chip on the rotatable On the substrate below the turntable. By alternately arranging the wafer suction area and patch avoidance holes, the rotation angle of the rotatable turntable can be reduced, and the patching time can be shortened. At the same time, in order to reduce the angle of rotation of the rotatable turntable, the number of wafer adsorption areas and patch avoidance holes greater than or equal to 2 can be provided on the rotatable turntable. The wafer adsorption areas are alternately arranged with the patch avoidance holes, so the wafer The number of suction areas and patch avoidance holes are the same.

The first embodiment of the present invention further provides a wafer placement equipment. FIG. 3 is a schematic structural diagram of another wafer placement equipment provided by the first embodiment of the present invention. Referring to FIG. 3, the wafer placement equipment includes a feeding unit 11 and a wafer transfer The unit 12 and the wafer bonding unit 13; the feeding unit 11 includes a material assembly 111 and at least one pick-up hand 112, the material assembly 111 is configured to carry the wafer 10, and at least one pick-up hand 112 is configured to pick up the wafer 10 from the material assembly 111 The wafer transfer unit 12 includes a rotatable turntable 120, the rotatable turntable 120 is provided with a plurality of wafer adsorption areas 121 and a plurality of patch avoidance holes 122, the wafer adsorption area 121 is configured to absorb at least one wafer hand 112 provided 10; the wafer bonding unit 13 includes a placement table 131 and at least one placement hand 132, the placement hand 132 is located above the rotatable turntable 120, the placement table 131 is located below the rotatable turntable 120, at least one placement hand 132 is configured as Pick up the wafer 10 from the wafer suction area 121 and pass through the placement avoiding hole 122, and attach the wafer 10 to the substrate 20 on the placement table 131; wherein, the material assembly 111 is located under the rotatable turntable 120; at least one pickup hand 112 includes a first pickup swing arm 1121 and a second pickup swing arm 1122; the first pickup swing arm 1121 is configured to pick up the wafer 10 on the material assembly 111 and turn it over, and the second pickup swing arm 1122 is configured as Pick up the wafer 10 on the first pick-up swing arm 1121 and place it on the wafer suction Attached to area 121.

In some embodiments, the material assembly 111 is placed under the rotatable turntable 120, and the wafer 10 on the material assembly 111 can be moved to a level with the rotatable turntable 120 by vertical flipping by the first fetching swing arm 1121 Position, the second picking swing arm 1122 picks up the wafer 10 for lateral displacement, and places it on the wafer suction area 121 of the rotatable turntable 120, which can reduce the horizontal distance between the feeding unit and the wafer transfer unit, and can make the wafer placement equipment The structure is more compact, and the space is smaller; in addition, since the first film-taking swing arm 1121 and the second film-taking swing arm 1122 can move in parallel, the lateral movement of the second film-taking swing arm 1122 becomes smaller, which can be done to a certain extent. Reduce the time of picking and improve the efficiency of patching. It should be noted here that the first pick-up swing arm 1121 may also have a longitudinal translation function to fine-tune the longitudinal position of the wafer to facilitate the transfer of the wafer between the first pick-up swing arm and the second pick-up swing arm.

3, optionally, the feeding unit further includes a first library 1131, a first manipulator 1141, a second library 1132, and a second manipulator 1142. The first library 1131 is configured to provide the wafer 10, The first robot arm 1141 is configured to pick up the wafer 11 from the first wafer library 1131 and place it on the material assembly 111; the second wafer library 1132 is configured to provide the substrate 20, and the second robot arm 1142 is configured to pick up the wafer 11 from the second wafer The library 1132 picks up the substrate 20 and places it on the placement table 131.

Example two

4 is a schematic structural diagram of a wafer placement equipment provided by the second embodiment of the present invention, FIG. 5 is a top view of the rotatable turntable in the wafer placement equipment shown in FIG. 4, and FIG. 6 is the wafer placement equipment shown in FIG. 4 Figure 7 is a partial enlarged view of the wafer placement equipment shown in Figure 6, referring to Figures 4-7, in the wafer placement equipment, the wafer transfer unit further includes a placement alignment component; The rotatable turntable includes a hollow shaft 1201 and a turntable 1202 connected to the hollow shaft 1201. The turntable 1202 is provided with a plurality of wafer adsorption areas 121 and a plurality of patch avoidance holes 122; the patch alignment component 123 includes a patch alignment camera 1231 , Beam splitter 1232, first mirror 1233, second mirror 1234, and third mirror 1235; among them, the patch camera 1231 is located in the inner space of the hollow shaft 1201, and the beam splitter 1232 and the first mirror 1233 are located The turntable 1202 is close to the hollow shaft 1201, the second mirror 1234 and the third mirror 1235 are located on the side of the turntable 1202 away from the hollow shaft 1201; and in the axial direction of the hollow shaft 1201, the patch alignment camera 1231 The mirror 1232 and the second mirror 1234 are arranged in order from top to bottom; the patch alignment camera 1231 is configured to determine the position of the wafer 10 on the wafer adsorption area 121 of the turntable 1202 according to the beam splitter 1234 and the first mirror 1233; further It is configured to determine the position to be mounted on the substrate 20 on the mounting stage 131 according to the beam splitter 1232, the second mirror 1234, and the third mirror 1235.

In some embodiments, as shown in FIG. 5, the turntable 1202 of the rotatable turntable is provided with 6 wafer adsorption areas and 6 patch avoidance holes arranged alternately. Between each process, the turntable 1202 only needs to rotate 30 °, reduce the rotation angle of the turntable 1202, which helps to speed up the placement speed. The hollow shaft 1201 of the rotatable turntable is provided with a placement registration camera 1231. The placement registration camera 1231 has both the wafer adsorption area 121 on the turntable 1202 and the position acquisition function of the substrate 20 on the placement stage 131. Referring to the dashed light path shown in FIG. 7, the image of the wafer adsorption area 121 on the turntable 1232 enters the patch registration camera 1231 through the first mirror 1233 and the beam splitter 1232 in turn, that is, through the patch registration camera 1231 can determine the position of the wafer on the wafer adsorption area 121 on the turntable 1232. When the wafer rotates and moves below the placement hand 132, it can ensure that the placement hand 132 can accurately pick up the wafer; refer to the dotted light path in Figure 4 , The image of the position to be attached to the substrate 20 on the placement stage 131 sequentially enters the placement registration camera 1231 through the third mirror 1235, the second reflection mirror 1234, and the beam splitter 1232, that is, through the placement camera 1231 may determine the to-be-attached position of the substrate 20 on the placement stage 131 to ensure that the placement hand 132 can attach the picked-up wafer to the to-be-attached position of the substrate 20. Wherein, the substrate 20 is provided with a patch slot. After the patch alignment camera 1231 determines the location of the patch slot, the placement hand 132 mounts the wafer 10 in the patch slot.

It should be noted that the position of the first mirror 1233 and the patch registration camera 1231 are relatively fixed, that is, when the turntable 1202 rotates, the position of the first mirror 1233 is fixed, and the position of the wafer that rotates below the first mirror 1233 is determined; The position of the second mirror 1234 is also relatively fixed with the position of the patch registration camera 1231, and the third mirror 1235 is arranged on the turntable 1202 and rotates synchronously with the turntable 1202. The third mirror 1235 is located on the turntable 1202 for the wafer adsorption Above the area, the number of third mirrors 1235 is the same as the number of wafer adsorption areas. When each wafer adsorption area rotates below the placement hand, the third mirror 1235 is also located under the placement hand and facing The substrate. At this time, the third mirror 1235 can reflect the image of the position to be mounted on the substrate, and the second mirror 1234 and the beam splitter 1232 enter the alignment camera 1231 to determine the position to be mounted .

The chip placement equipment provided in the second embodiment of the present invention is provided with a feeding unit, a wafer transfer unit, and a wafer bonding unit in the wafer placement device; wherein the feeding unit includes a material component and at least one pick-up hand and a wafer transfer unit It includes a rotatable turntable. The rotatable turntable is provided with multiple wafer suction areas and multiple patch avoidance holes. The wafer bonding unit includes a placement table and at least one placement hand. At least one placement hand picks up the wafer from the wafer suction area and Pass the patch avoidance hole to attach the wafer to the substrate on the placement table, eliminating the need for placement hands from the wafer transfer unit The horizontal displacement required when moving to the chip bonding unit can effectively shorten the placement time, increase the placement speed and efficiency, promote the process of chip packaging, and help improve the yield of the chip. In addition, placing the placement hand above the rotatable turntable and the placement table below the rotatable turntable can ensure a more compact space between the units of the placement equipment and reduce the space size of the wafer placement equipment. The chip placement equipment provided in the second embodiment of the present invention is provided with a placement alignment component, which includes a placement alignment camera, a beam splitter, a first reflector, a second reflector, and a third reflector, and only one The placement alignment camera uses two lights to determine the position of the wafer on the wafer adsorption area and the position to be placed on the substrate, which makes the structure of the chip placement equipment more simplified and compact, and reduces the size of the whole machine.

With continued reference to FIG. 4, the placement table includes a supporting table 1311 and a first moving table 1312 that are sequentially stacked; the supporting table 1311 is configured to carry the first moving table 1312 and the substrate 20; the first moving table 1312 is configured to Move the area to be mounted on the substrate 20 to the position to be mounted; the material assembly includes a second moving table 1111 and an ejector unit 1112; the second moving table 1111 is configured to move the wafer to be taken to the reclaiming position; the ejector unit 1112 It is configured to eject the wafer 10 to be picked up at the picking position, so that the wafer 10 to be picked is separated from the second moving table. In addition, it should be noted that since the second moving stage 1111 carries the wafers to be picked up, the wafers to be picked up are carried on the carrier film and formed by wafer dicing. The wafers are moved from the first library to the second moving stage. When 1111 is mounted, the carrier film is moved to the second motion stage 1111 together with the multiple wafers formed by the division. In order to facilitate the ejector unit 1112 to lift the chip to be taken up by the carrier film, so that the wafer is separated from the carrier film, the carrier film needs to be removed. The film is expanded to increase the tension of the supporting film. Therefore, it is necessary to provide a second movement stage 111 to further have the function of film expansion.

Similarly, the feeding unit of the wafer bonding equipment provided in the second embodiment of the present invention is also provided with a first swing arm 1121 and a second swing arm 1122, a first swing arm 1121 and a second swing arm The working principle of 1122 will not be repeated here. As shown in FIG. 4, the feeding unit further includes a reclaiming and positioning component. The reclaiming and positioning component includes a reclaiming and positioning camera 1151. The reclaiming and positioning camera 1151 is located above the material component 111 and is configured to determine the material component 11 The location of the wafer 10. It should be noted that the reclaiming and positioning camera 1151 should be set directly above the wafer to be taken, and when the first swing arm 1121 is set, the rotation axis of the swing arm needs to be set at the reclaiming and positioning camera 1151 and the wafer to be taken. In addition to the connection, it is ensured that the reclaiming and positioning camera 1151 can face the wafer 10 on the material assembly 11, and the position of the wafer 10 can be determined more accurately.

FIG. 8 is a working sequence diagram of the wafer placement equipment provided in the second embodiment of the present invention. The working process of the wafer placement equipment provided in the second embodiment of the present invention will be briefly introduced with reference to FIG. 4, FIG. 5 and FIG. 8. The placement method of the placement equipment includes multiple placement cycles, and each placement cycle includes a first sub-period, a second sub-period, and a third sub-period that are sequentially set.

Wherein, in the first sub-period, the second motion stage 1111 moves the wafer 10 to be picked up to the picking position. At this time, the picking and positioning assembly can measure the position of the wafer to be picked to determine the position of the wafer to be picked; , The placement hand 132 passes through the placement avoiding hole 122 to attach the wafer 10 to the substrate 20 on the placement stage 131;

In the second sub-period, the first pick-up swing arm 1121 picks up the wafer 10 from the material assembly 111 and turns it over. At this time, the first pick-up swing arm 1121 moves the wafer 10 to a position horizontal to the rotatable turntable; the rotatable turntable 120 rotate 30° to move the vacant wafer suction area on the rotatable turntable 120 to the position where the second pick swing arm 1122 places the wafer, and wait for the second pick swing arm 1122 to place the wafer 10; at the same time, the first movement stage 1312 Move the area to be mounted on the substrate 10 to the position to be mounted. This step is used to remove the area that has been mounted and move the position to be mounted to the mounting hand 132 Below, the first sports platform 1312 is waiting for patch;

In the third sub-period, the second pick-up swing arm 1122 picks up the wafer 10 from the first pick-up swing arm 1121 and places it on the wafer suction area 121 of the rotatable turntable 120, and at the same time, the placement hand 132 picks up the wafer 10 from the wafer suction area 121 The wafer 10, in addition, after the placement hand 132 picks up the wafer 10 from the wafer adsorption area 121, the placement alignment component needs to perform placement preparations, that is, determine the position to be placed on the substrate 20, and when the determination is completed , The rotatable turntable 120 rotates by 30° to remove the wafer adsorption area 121, and move the patch avoiding hole 122 to the bottom of the placement hand 132, and wait for the placement hand 132 to patch.

In the placement method of the wafer placement equipment provided in the second embodiment of the present invention, multiple processes are performed synchronously in each placement cycle, and the processes of wafer picking, wafer transfer, and wafer placement are performed in parallel, so that the wafer can be minimized. The placement time improves the chip placement efficiency.

In some embodiments, in the patch alignment component, a first light source and a second light source may be further provided; the first light source is sleeved on the first reflector and is configured to illuminate the wafer adsorption area on the turntable; and the second light source The ring is sleeved on the third reflector and is configured to illuminate the to-be-attached area of the substrate on the placement stage.

By arranging the first light source and the second light source on the first reflector and the third reflector, it is possible to illuminate the chip adsorption area corresponding to the first reflector and the area to be mounted on the substrate corresponding to the third reflector. The auxiliary placement camera obtains a clearer image to ensure the precise determination of the position to be placed on the wafer and the substrate on the wafer adsorption area.

6mm；前述轉盤的厚度與前述第三反射鏡在垂直前述轉盤的方向上的尺寸的和為 L2，其中，L2

6mm。 With continued reference to Figures 4 and 6, optionally, the sum of the thickness of the turntable and the size of the second reflector in the direction perpendicular to the turntable is L1, where L1

6mm; the sum of the thickness of the aforementioned turntable and the size of the aforementioned third mirror in the direction perpendicular to the aforementioned turntable is L2, where L2

6mm.

By setting the overall thickness of the turntable and the second reflector in the vertical direction of the turntable not to exceed 6mm, and the overall thickness of the turntable and the third reflector in the vertical direction of the turntable not to exceed 6mm, the lining of the turntable to the placement table 131 can be reduced. The distance of the bottom 20 can reduce the longitudinal movement distance of the placement hand 132, which can reduce the placement time to a certain extent and improve the placement efficiency.

4, in some embodiments, the chip bonding unit further includes a first frame 133, at least one placement hand 132 is disposed on the first frame 133, the first frame 133 is configured to drive the placement hand 132 longitudinal movement, from The wafer suction area picks up the wafer and passes through the patch avoiding hole to attach the wafer to the substrate on the placement stage.

Optionally, referring to 4 and FIG. 5, the placement alignment component is further configured to determine the deflection angle of the wafer 10 to be placed on the turntable 1202, and the first frame 133 is further configured to drive the placement hand 132 to rotate according to the deflection angle. .

It should be noted that when the feeding unit places the wafer on the wafer suction area 121 of the turntable 1202, the attitude of the wafer is not fixed, and there may be a certain deflection angle. Therefore, the deflection of the wafer before the placement of the chip is required. The angle is adjusted. Therefore, the placement hand 132 not only needs to have a vertical movement ability, but also needs to have a rotation function. In addition, the placement hand can also be set to have a certain horizontal displacement ability to ensure that the placement hand can pass through the patch avoidance hole more accurately to perform placement.

In addition to determining the deflection angle of the wafer when the placement hand picks up the chip and the placement hand, the first picking swing arm also needs to determine and adjust the deflection angle of the wafer when picking the chip. Referring to FIG. 4, optionally, the reclaiming and positioning assembly is further configured to determine the deflection angle of the wafer to be retrieved on the material assembly, and the second moving stage 1111 is further configured to rotate the wafer according to the deflection angle.

Example three

The third embodiment of the present invention further provides a chip attaching method, which adopts any chip attaching equipment provided in the embodiment of the present invention. FIG. 9 is a flowchart of a wafer attaching method provided by the third embodiment of the present invention. 1 and Figure 9, the patch method includes:

S110. At least one chip picker picks up the wafer from the material assembly and places the wafer on the wafer suction area of the rotatable turntable;

S120. The rotatable turntable rotates, and the multiple wafer adsorption areas and multiple patch avoidance holes on the rotatable turntable move;

S130. At least one placement hand picks up the wafer from the wafer adsorption area and passes through the placement avoiding hole to attach the wafer to the substrate on the placement stage.

The chip placement method provided in the third embodiment of the present invention adopts the chip placement equipment provided in the embodiment of the present invention, by providing a feeding unit, a wafer transfer unit and a wafer bonding unit in the chip placement equipment; wherein the feeding unit Including material components and at least one picker. The wafer transfer unit includes a rotatable turntable. The rotatable turntable is provided with multiple wafer suction areas and multiple patch avoidance holes. The wafer bonding unit includes a placement table and at least one placement handle. , At least one placement hand picks up the wafer from the wafer suction area and passes through the placement avoidance hole to attach the wafer to the substrate on the placement stage, which saves the placement of the placement hand when moving from the wafer transfer unit to the wafer bonding unit The required horizontal displacement can effectively shorten the placement time, increase the placement speed and efficiency, promote the process of chip packaging, and help increase the yield of the chip.

The third embodiment of the present invention also provides a wafer bonding method for the wafer bonding equipment shown in the second embodiment of the present invention. FIG. 10 is a flowchart of another wafer bonding method provided by an embodiment of the present invention. Refer to FIGS. 4 and Figure 10, the placement method includes multiple placement cycles, Each patch cycle includes a first sub-period, a second sub-period, and a third sub-period that are sequentially set. The foregoing method may include:

S210. In the first sub-period, the second motion stage moves the wafer to be picked to the picking position, and the placement hand passes through the placement escape hole to bond the wafer to the substrate on the placement table;

S220. In the second sub-period, the first fetching swing arm picks up the wafer from the material assembly and turns it over, the rotatable turntable rotates, and the first motion stage moves the area to be mounted on the substrate to the position to be mounted;

S230. In the third sub-period, the second pick-up swing arm picks up the wafer from the first pick-up swing arm and places it on the wafer suction area of the rotatable turntable, and the placement hand picks up the wafer from the wafer suction area.

10‧‧‧Chip

11‧‧‧Feeding unit

12‧‧‧Chip transfer unit

13‧‧‧Chip bonding unit

20‧‧‧Substrate

111‧‧‧Material components

112‧‧‧Flicker

120‧‧‧Rotating turntable

131‧‧‧Placement table

132‧‧‧Patch Hand

Claims (13)

A chip placement equipment, which is characterized by comprising: a feeding unit, a wafer transfer unit, and a wafer bonding unit; the aforementioned feeding unit includes a material assembly and a pickup hand, the aforementioned material assembly is configured to carry a wafer, and the aforementioned pickup hand is It is configured to pick up wafers from the aforementioned material components; the aforementioned wafer transfer unit includes a rotatable turntable, the aforementioned rotatable turntable is provided with a plurality of wafer adsorption areas and a plurality of patch avoidance holes, and the aforementioned wafer adsorption area is configured to adsorb the aforementioned chip picker The chip is provided; the chip bonding unit includes a placement table and a placement hand, the placement hand is located above the rotatable turntable, the placement table is located below the rotatable turntable, and the placement hand is configured from the wafer The suction zone picks up the wafer, and passes the patch avoidance hole to attach the wafer to the substrate on the placement stage; the wafer transfer unit further includes a placement alignment component; the rotatable turntable includes a hollow shaft and The turntable is connected to the hollow shaft. The turntable is provided with the plurality of wafer adsorption areas and the plurality of patch avoidance holes; the patch alignment component includes a patch alignment camera, a beam splitter, a first mirror, and a first mirror. Two mirrors and a third mirror; wherein the patch alignment camera is located in the inner space of the hollow shaft, the beam splitter and the first mirror are located on the side of the turntable near the hollow shaft, and the second reflector The mirror and the third mirror are located on the side of the turntable away from the hollow shaft; and in front In the axial direction of the hollow shaft, the patch alignment camera, the beam splitter, and the second mirror are arranged in order from top to bottom; the patch alignment camera is configured according to the beam splitter and the first mirror Determine the position of the wafer on the wafer suction area of the turntable; the placement camera is further configured to determine the placement of the substrate on the placement stage based on the beam splitter, the second mirror, and the third mirror. Patch location. As for the chip placement equipment described in the first item of the scope of patent application, the sum of the thickness of the turntable and the size of the second mirror in the direction perpendicular to the turntable is L1, where L1

6mm; the sum of the thickness of the aforementioned turntable and the size of the aforementioned third mirror in the direction perpendicular to the aforementioned turntable is L2, where L2

6mm. As for the chip placement equipment described in item 1 of the scope of patent application, the aforementioned feeding unit further includes a reclaiming and positioning component, the aforementioned reclaiming and positioning component includes a reclaiming and positioning camera, and the aforementioned reclaiming and positioning camera is located in the aforementioned Above the material component, the aforementioned reclaiming and positioning camera is configured to determine the position of the aforementioned wafer on the aforementioned material component. As for the chip placement equipment described in item 1 of the scope of patent application, wherein the aforementioned material components are located under the aforementioned rotatable turntable; the aforementioned pick-up hand includes a first pick-up swing arm and a second pick-up swing arm; the aforementioned first pick-up swing arm The swing arm is configured to pick up the wafer on the material assembly and turn it over, and the second pick swing arm is configured to pick up the wafer on the first pick swing arm and place it on the wafer adsorption area. As for the chip placement equipment described in claim 1, wherein the chip attaching unit further includes a first frame, the placement hand is provided on the first frame, and the first frame is configured to drive the placement hand Moving in the longitudinal direction, picking up the wafer from the wafer adsorption area and pasting the wafer escape hole to attach the wafer to the substrate on the placement stage. As for the chip placement equipment described in item 5 of the scope of patent application, wherein the placement alignment component is further configured to determine the deflection angle of the chip to be placed on the turntable, and the first frame is further configured to The deflection angle drives the placement hand to rotate. As described in the first item of the scope of patent application, the chip placement equipment, wherein the plurality of wafer suction regions and the plurality of placement avoiding holes are alternately arranged. For the wafer placement equipment described in item 7 of the scope of patent application, wherein the plurality of wafer suction regions and the plurality of placement avoiding holes are arranged circumferentially at equal intervals around the center of the rotatable turntable. As for the wafer placement equipment described in item 3 of the scope of patent application, the placement table includes a supporting table and a first movement table stacked in sequence; the supporting table is configured to carry the first movement table and the substrate The first movement table is configured to move the area to be mounted on the substrate to the position to be placed; the material component includes a second movement table and a thimble unit; the second movement table is configured to move the wafer to be taken To the reclaiming position; the aforementioned ejector unit is configured to eject the aforementioned wafer to be taken at the aforementioned reclaiming position, so that the front The to-be-fetched wafer is separated from the aforementioned second motion stage. As for the chip placement equipment described in item 9 of the scope of patent application, the aforementioned material picking and positioning component is further configured to determine the deflection angle of the wafer to be taken on the aforementioned material component, and the aforementioned second motion stage is further configured to The aforementioned deflection angle rotates the aforementioned wafer. As for the chip placement equipment described in item 1 of the scope of patent application, wherein the aforementioned feeding unit further includes a first library, a first manipulator, a second library, and a second manipulator, and the first library is configured To provide wafers, the first robot is configured to pick up the wafers from the first library and place them on the material assembly; the second library is configured to provide substrates, and the second robot is configured to The second library picks up the substrate and places it on the placement table. A chip placement method using the chip placement equipment described in any one of items 1 to 11 in the scope of the patent application, which includes: a picking hand picks up a wafer from a material assembly and places the aforementioned wafer on a rotatable turntable. On the adsorption area; the rotatable turntable rotates, the multiple wafer adsorption areas and multiple patch avoidance holes on the rotatable turntable move; the placement hand picks up the wafer from the wafer adsorption area and passes through the patch avoidance hole to move The aforementioned wafer is attached to the substrate on the aforementioned placement stage. As for the chip placement method described in item 12 of the scope of patent application, wherein the aforementioned pick-up hand includes a first pick-up swing arm and a second pick-up swing arm; the aforementioned placement table includes a first movement table; The material assembly includes a second motion stage; the foregoing chip placement method includes multiple placement cycles, and each of the foregoing placement cycles includes a first sub-period, a second sub-period, and a third sub-period set in sequence; in the first sub-period Inside, the second motion stage moves the wafer to be picked up to the picking position, the placement hand passes through the placement escape hole, and the wafer is attached to the substrate on the placement stage; in the second sub-cycle , The aforementioned first take-out swing arm picks up the wafer from the material assembly and turns it over, the aforementioned rotatable turntable rotates, the aforementioned first movement table moves the area to be mounted on the substrate to the position to be mounted; in the third sub-period The second pick-up swing arm picks up the wafer from the first pick-up swing arm and places it on the wafer suction area of the rotatable turntable, and the placement hand picks up the wafer from the wafer suction area.

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