CN113192849B - Chip bonding method - Google Patents
Chip bonding method Download PDFInfo
- Publication number
- CN113192849B CN113192849B CN202110512904.2A CN202110512904A CN113192849B CN 113192849 B CN113192849 B CN 113192849B CN 202110512904 A CN202110512904 A CN 202110512904A CN 113192849 B CN113192849 B CN 113192849B
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- chip
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- conversion table
- carrier tape
- flexible carrier
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000006243 chemical reaction Methods 0.000 claims abstract description 29
- 230000008275 binding mechanism Effects 0.000 claims abstract description 11
- 238000000926 separation method Methods 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 8
- 238000004806 packaging method and process Methods 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a chip bonding method, which comprises the following steps: ejecting a chip on the wafer downwards by using a chip taking device so that the chip falls on a first layer of the conversion table; the first layer and the second layer of the conversion table rotate at different speeds, when the conversion table rotates to the position of the flexible carrier tape to be pasted, the first layer of the conversion table is overlapped with the chip separation hole of the second layer, and the chip can sequentially pass through the chip separation holes of the first layer and the second layer of the conversion table and fall on the position of the flexible carrier tape to be pasted; and the chip is attached to the position of the flexible carrier tape to be pasted with the chip through the chip binding mechanism. The method for attaching the face-up chip can simplify the attaching process of the face-down chip, improve the chip attaching efficiency, and is beneficial to improving the packaging quality of the chip and the yield of the chip.
Description
Technical Field
The invention relates to the technical field of chip manufacturing, in particular to a chip laminating method.
Background
Over the years, chips continue to evolve toward smaller form factors, chip packaging techniques play an important role in chip performance, and new packaging techniques continue to emerge at an alarming rate. The chip packaging technology is an effective means for connecting the semiconductor chip and the electronic system, can improve the electronic performance of the chip, and is convenient to install and transport. Along with the development of chip technology, the difficulty of chip bonding and packaging is also increased continuously, and the bonding precision and the production efficiency of the chip are directly influenced by the packaging mode of the chip. Meanwhile, chip packaging equipment is upgraded, and the whole process of the traditional flip chip production mode needs to be subjected to the processes of picking, overturning, butting, binding and the like, so that the higher and higher capacity requirements can not be met gradually.
Disclosure of Invention
Aiming at the defects or the improvement requirements of the prior art, the invention provides a chip bonding method which is a forward chip bonding method, simplifies the bonding process of a flip chip and improves the chip bonding efficiency.
In order to achieve the purpose, the invention provides a chip bonding method, which comprises the following steps:
s1, ejecting the chip on the wafer downwards by using the chip extractor, and enabling the chip to fall on the first layer of the conversion table;
s2, the first layer and the second layer of the conversion table rotate at different speeds, and when the conversion table rotates to the position of the flexible carrier tape to be pasted with the chip, the first layer of the conversion table and the chip separation hole of the second layer coincide, so that the chip can sequentially pass through the chip separation holes of the first layer and the second layer of the conversion table and fall on the position of the flexible carrier tape to be pasted with the chip;
and S3, attaching the chip to the position of the flexible carrier tape to be pasted with the chip by using a chip binding mechanism.
Further, the chip bonding method further comprises the following steps:
s4, before the chip is attached, the adhesive dots for attachment are transmitted to the position of the flexible carrier tape to be attached with the chip, so that the chip is attached to the position of the flexible carrier tape to be attached with the chip binding mechanism in a matching mode.
Further, the rotating speed of the conversion table is matched with the conveying speed of the glue dots so as to match the chip to complete the attaching.
Compared with the existing flip chip mounting method, the method is a forward chip mounting method, can simplify the chip attaching process, improves the chip mounting efficiency, and is beneficial to improving the chip packaging quality and the chip yield.
Drawings
FIG. 1 is a schematic diagram illustrating steps performed in a particular embodiment of a method for die attachment according to the present invention;
FIG. 2 is a schematic diagram of an apparatus used in conjunction with a method of die attachment in accordance with an embodiment of the present invention;
fig. 3 is a schematic view of a transfer table in an apparatus used in conjunction with a chip bonding method according to an embodiment of the present invention.
Wherein the reference numerals include: the chip bonding device comprises a conversion table 1, a chip separation hole 101, a chip taking device 2, a chip binding mechanism 3, a wafer 4, a glue dot 5, a glue spraying machine 6, a flexible carrier tape 7 and a chip 8.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 shows a flowchart of a chip bonding method according to the present invention, in which a chip bonding method is used to cooperate with a chip bonding apparatus according to an embodiment of the present invention, fig. 2 shows a schematic diagram of an apparatus used in the chip bonding method according to the embodiment of the present invention, and fig. 3 shows a schematic diagram of a transfer table in the apparatus used in the chip bonding method according to the embodiment of the present invention.
The chip bonding apparatus in an embodiment includes: the chip bonding device comprises a conversion table 1, a chip separation hole 101, a chip taking device 2, a chip binding mechanism 3, a wafer 4, a glue dot 5, a glue spraying machine 6 and a flexible carrier tape 7.
As shown in fig. 2, the wafer extractor 2 is located above the wafer 4, and is used for pushing down the chips 8 on the wafer 4; the wafer 4 is positioned below the chip picker 2 and used for providing chips 8 for attaching; the conversion table 1 is positioned below the wafer 4 and used for transferring the taken-down chip 8 to a position to be pasted of the flexible carrier tape 7, a plurality of chip separation holes 101 are formed in the conversion table 1, the conversion table 1 is at least of a double-layer structure, and all layers can rotate relatively; the chip disengaging hole 101 is positioned on the conversion table 1 and used for positioning the chip 8 in the attaching process; the chip binding mechanism 3 is positioned above the conversion table 1 and used for attaching the chip 8 to the position of the flexible carrier tape 7 to be pasted with the chip to finish attaching; the glue sprayer 6 is positioned above the flexible carrier tape 7 and used for spraying glue dots 5 used for adhering the chips 8; the glue dots 5 are positioned on the flexible carrier tape 7 and used for attaching the chip 8; the flexible carrier tape 7 is located below the converting table 1 and is used for conveying glue dots 5 required for attaching the chip 8 and the chip 8 after the attachment is completed.
The embodiment of the invention provides a chip bonding method, which comprises the following steps:
s1, the ejector pin type sheet picker 2 or the pen type sheet picker 2 is used to eject the chip 8 on the wafer 4 downward, so that the chip falls on the first layer of the converting table 1. In other embodiments, other types of the sheet extractor 2 may be selected as long as the chips 8 on the wafer 4 can be ejected downward, which is not limited in the present invention.
S2, the first layer and the second layer of the converting table 1 rotate at different speeds to prevent the chip 8 from falling from the chip releasing hole 101 of the converting table 1 when not being transported to the position of the flexible carrier tape 7 to be mounted, when the converting table 1 rotates to a position above the position of the flexible carrier tape 7 to be mounted, the first layer of the converting table 1 coincides with the chip releasing hole 101 of the second layer, and at this time, the chip 8 is directly above the position of the flexible carrier tape 7 to be mounted, and the chip 8 can sequentially pass through the chip releasing holes 101 of the first layer and the second layer of the converting table 1 to fall on the position of the flexible carrier tape 7 to be mounted. As shown in fig. 3, the positioning of the chip 8 and the position of the flexible carrier tape 7 to be mounted is performed by using the centrifugal force and the shape of the chip release hole 101, when the chip 8 falls into the chip release hole 101 of the first layer of the converting table 1, the first layer and the second layer of the converting table 1 rotate at different speeds, and the positioning of the chip 8 and the position of the flexible carrier tape 7 to be mounted is performed by using the shape of the chip release hole 101 of the first layer and the second layer of the converting table 1; when the chip 8 does not fall into the position of the chip detachment hole 101 in the first layer of the conversion table 1, the chip 8 falls into the chip detachment hole 101 in the first layer of the conversion table 1 by using the centrifugal force generated when the conversion table 1 rotates, and then the positioning of the chip 8 and the position of the flexible carrier tape 7 to be attached is completed by using the shape of the chip detachment hole 101.
And S3, when the chip 8 sequentially passes through the first layer chip disengaging hole 101 and the second layer chip disengaging hole 101 of the conversion table 1, attaching the chip 8 to the position, to be attached, of the flexible carrier tape 7 through the chip binding mechanism 3.
In a preferred embodiment of the present invention, the method further comprises the following steps:
s4, before the chip 8 is attached, the glue dots 5 are transmitted to the position, to be attached, of the flexible carrier tape 7, so that the chip 8 is attached to the position, to be attached, of the flexible carrier tape 7 by matching with the chip binding mechanism 3.
Before the chip 8 is attached, the glue spraying machine 6 is utilized to spray glue dots 5 on the flexible carrier tape 7, the flexible carrier tape 7 transmits the glue dots 5 to the position right below the overlapping position of the first layer of the conversion table 1 and the chip detachment hole 101 of the second layer, and the chip 8 is attached to the position, to be attached, of the flexible carrier tape 7 through the chip binding mechanism 3.
In a preferred embodiment of the present invention, the method further comprises the following steps:
the rotating speed of the converting table 1 is matched with the conveying speed of the glue dots 5, when the chips 8 sequentially pass through the first layer chip separating holes 101 and the second layer chip separating holes 101 of the converting table 1, the glue dots 5 on the flexible carrier tape 7 when the chips 8 fall down are already conveyed to the position right below the chips 8, and therefore the chips 8 are matched to finish attaching.
The chip bonding method provided by the invention is a normal mounting method, is different from the traditional flip chip production mode, does not need the processes of chip picking, overturning, butting and the like, can simplify the chip bonding process, improves the productivity, and is also suitable for large-scale industrialization.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are exemplary and should not be taken as limiting the invention. Variations, modifications, substitutions and alterations of the above-described embodiments may be made by those of ordinary skill in the art without departing from the scope of the present invention.
The above embodiments of the present invention should not be construed as limiting the scope of the present invention. Any other corresponding changes and modifications made according to the technical idea of the present invention should be included in the protection scope of the claims of the present invention.
Claims (3)
1. A chip attaching method is characterized by comprising the following steps:
s1, ejecting the chip on the wafer downwards by using the chip extractor, and enabling the chip to fall on the first layer of the conversion table;
s2, the first layer and the second layer of the conversion table rotate at different speeds, and when the conversion table rotates to the position of the flexible carrier tape to be pasted with the chip, the first layer of the conversion table and the chip separation hole of the second layer coincide, so that the chip can sequentially pass through the chip separation holes of the first layer and the second layer of the conversion table and fall on the position of the flexible carrier tape to be pasted with the chip;
and S3, attaching the chip to the position of the flexible carrier tape to be pasted with the chip by using a chip binding mechanism.
2. The chip bonding method according to claim 1, further comprising the steps of:
s4, before the chip is attached, the adhesive dots for attachment are transmitted to the position of the flexible carrier tape to be attached with the chip, so that the chip is attached to the position of the flexible carrier tape to be attached with the chip binding mechanism in a matching mode.
3. The method of die attachment according to claim 2,
the rotating speed of the conversion table is matched with the transmission speed of the glue dots so as to match the chip to complete the attachment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110512904.2A CN113192849B (en) | 2021-05-11 | 2021-05-11 | Chip bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110512904.2A CN113192849B (en) | 2021-05-11 | 2021-05-11 | Chip bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113192849A CN113192849A (en) | 2021-07-30 |
| CN113192849B true CN113192849B (en) | 2022-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110512904.2A Active CN113192849B (en) | 2021-05-11 | 2021-05-11 | Chip bonding method |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6205745B1 (en) * | 1998-05-27 | 2001-03-27 | Lucent Technologies Inc. | High speed flip-chip dispensing |
| CN202535650U (en) * | 2012-02-22 | 2012-11-14 | 钟啸风 | Reversing device for surface mounted elements |
| CN203941938U (en) * | 2014-05-28 | 2014-11-12 | 阿博建材（昆山）有限公司 | A kind of shedding mechanism of LED chip |
| CN110970321A (en) * | 2018-09-30 | 2020-04-07 | 上海微电子装备（集团）股份有限公司 | Chip mounting equipment and chip mounting method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207320082U (en) * | 2017-09-19 | 2018-05-04 | 合肥中科芯微电子有限公司 | A kind of conveying device of Die Bonder |
| CN209515617U (en) * | 2019-03-28 | 2019-10-18 | 惠州市西文思实业有限公司 | A kind of device for adhering chip |
-
2021
- 2021-05-11 CN CN202110512904.2A patent/CN113192849B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6205745B1 (en) * | 1998-05-27 | 2001-03-27 | Lucent Technologies Inc. | High speed flip-chip dispensing |
| CN202535650U (en) * | 2012-02-22 | 2012-11-14 | 钟啸风 | Reversing device for surface mounted elements |
| CN203941938U (en) * | 2014-05-28 | 2014-11-12 | 阿博建材（昆山）有限公司 | A kind of shedding mechanism of LED chip |
| CN110970321A (en) * | 2018-09-30 | 2020-04-07 | 上海微电子装备（集团）股份有限公司 | Chip mounting equipment and chip mounting method |
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| Publication number | Publication date |
|---|---|
| CN113192849A (en) | 2021-07-30 |
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| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20210730 Assignee: Suzhou Heyu Finance Leasing Co.,Ltd. Assignor: Guangjingtuo intelligent equipment (Suzhou) Co.,Ltd. Contract record no.: X2024980002253 Denomination of invention: Chip bonding method Granted publication date: 20220222 License type: Exclusive License Record date: 20240301 |
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| EE01 | Entry into force of recordation of patent licensing contract | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Chip bonding method Granted publication date: 20220222 Pledgee: Suzhou Heyu Finance Leasing Co.,Ltd. Pledgor: Guangjingtuo intelligent equipment (Suzhou) Co.,Ltd. Registration number: Y2024980006332 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |