CN209515617U - A kind of device for adhering chip - Google Patents
A kind of device for adhering chip Download PDFInfo
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- CN209515617U CN209515617U CN201920407763.6U CN201920407763U CN209515617U CN 209515617 U CN209515617 U CN 209515617U CN 201920407763 U CN201920407763 U CN 201920407763U CN 209515617 U CN209515617 U CN 209515617U
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- rotating disk
- chip
- cooling fin
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- clamping piece
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Abstract
It include rotating disk mechanism and several manipulator mechanisms the utility model relates to a kind of device for adhering chip, several manipulator mechanisms are arranged around rotating disk mechanism.Manipulator mechanism include set a roof beam in place, laterally driven part, connecting plate, zigzag tread patterns part and clamping piece.It sets a roof beam in place and is connect with laterally driven part, laterally driven part is drivingly connected by connecting plate and zigzag tread patterns part, and zigzag tread patterns part and clamping piece are drivingly connected.Rotating disk mechanism includes that pedestal, rotary drive, rotating disk and several placing grooves, pedestal are connect with rotary drive, and rotary drive and rotating disk are drivingly connected, and the center of circle that several placing grooves revolve around it disk is connect with rotating disk.Wherein a manipulator mechanism is used for driving chip, and another manipulator mechanism is for driving the cooling fin for being coated with silicone grease, and for another manipulator mechanism for driving the cooling fin for being pasted with chip, rotating disk mechanism work plays linking.The stickup of chip and cooling fin is by the device completion for adhering chip, and labeling rates are fast, qualification rate is high.
Description
Technical field
The utility model relates to chip manufacture technical fields, more particularly to a kind of device for adhering chip.
Background technique
Various chips are integrated in printed circuit board, chip is the core part for realizing printed circuit board function.With electricity
The power of the progress of sub- technology, chip is increasing, is also significantly increased so as to cause the calorific value of chip.Chip is in the course of work
In the excessively high chip that will lead to of temperature be burned.Currently, solving the problems, such as that the major way of chip cooling is by chip and cooling fin
It is pasted together, accelerates the transmission speed of chip heat by cooling fin, thus temperature when reducing chip operation, and then solve
The certainly heat dissipation problem of chip.
The application work of traditional chip and cooling fin is completed by manual operation.Chip is completed by manually
Paste operation with cooling fin will cause problem following aspects: firstly, cost of labor is high, increase chip and heat dissipation
The stickup cost of piece.Secondly, manually-operated fault is more, it is low with the qualification rate that cooling fin is pasted to easily lead to chip.In addition, artificial
The speed of operation is slow, sticking efficiency is low.
Utility model content
Based on this, it is necessary to provide a kind of device for adhering chip.
A kind of device for adhering chip includes: rotating disk mechanism and several manipulator mechanisms, several mechanical mobile phones
Structure is arranged around the rotating disk mechanism.
The manipulator mechanism include set a roof beam in place, laterally driven part, connecting plate, zigzag tread patterns part and clamping piece.The frame
Beam is connect with the laterally driven part, and the laterally driven part is drivingly connected by the connecting plate and the zigzag tread patterns part,
The zigzag tread patterns part and the clamping piece are drivingly connected.
The rotating disk mechanism includes pedestal, rotary drive, rotating disk and several placing grooves, the pedestal and the rotation
Turn actuator connection, the rotary drive and the rotating disk are drivingly connected, and several placing grooves are around the rotating disk
The center of circle connect with the rotating disk.
The clamping piece is gripper cylinder in one of the embodiments, and the gripper cylinder is provided with a pair of of clamping limb.
What the pair of clamping limb was opposite in one of the embodiments, is provided with protective layer on one side.
The clamping piece is vacuum generator in one of the embodiments, and the vacuum generator is provided with vacuum suction
Mouth.
The laterally driven part is rodless cylinder in one of the embodiments,.
The zigzag tread patterns part is to have bar cylinder in one of the embodiments,.
The slot bottom of the placing groove is provided with vacuum chuck fixture in one of the embodiments,.
The two sidewalls correspondence of the placing groove offers grasp opening in one of the embodiments,.
The rotating disk is uniformly provided with several mounting holes, the placing groove around the center of circle in one of the embodiments,
Slot bottom on the outside of be provided with mounting seat, the mounting seat is inserted in the mounting hole and connect with the rotating disk.
The device for adhering chip further includes several transport mechanisms, the transmission in one of the embodiments,
Mechanism is belt conveyor, and the belt conveyor includes conveyer belt, drive roll, driven roller and drum drive motor,
The drive roll is drivingly connected by the conveyer belt and the driven roller, and the drum drive motor and the active are rolled
Cylinder is drivingly connected.Several transport mechanisms are arranged in a one-to-one correspondence with several manipulator mechanisms respectively.
The above-mentioned device for adhering chip during the work time, wherein a manipulator mechanism be used for driving chip,
For driving the cooling fin for being coated with silicone grease, the another manipulator mechanism is pasted with another manipulator mechanism for driving
The cooling fin of chip.The laterally driven part in the manipulator mechanism for driving cooling fin can be drivingly connected plate to cooling fin
Top, connect with connecting plate zigzag tread patterns part driving clamping piece close to cooling fin, the clamping piece can clamp cooling fin
Firmly.And then, the zigzag tread patterns part drives the withdrawal of the clamping piece, and the laterally driven part drives clamping piece to hold
For cooling fin close to rotating disk mechanism, the zigzag tread patterns part drives cooling fin close to the placing groove, and the clamping piece will be unclamped and be dissipated
Backing is placed in cooling fin in the placing groove.At this point, the rotary drive will drive the rotation disc spins, so that
Gelled placing groove must be placed close to the manipulator mechanism for being used for driving chip.At the same time, it is used for driving chip
The manipulator mechanism in laterally driven part connecting plate can be driven to the top of chip, the zigzag tread patterns being connect with connecting plate
Part can drive clamping piece close to chip, and the gripping member clamps chip.And then, the zigzag tread patterns part drives the clamping
The withdrawal of part, the laterally driven part drive clamping piece to hold chip close to rotating disk mechanism, and the zigzag tread patterns part drives core
Piece is close to carry in the placing groove of cooling fin, and the clamping piece unclamps chip, to realize the stickup of chip and cooling fin.
The rotating disk continues to rotate, and the placing groove that carry the cooling fin after pasting with chip will be close to glue for driving with chip
The manipulator mechanism of cooling fin after patch.At this point, for driving the manipulator mechanism for the cooling fin for being pasted with chip
This will be driven to be pasted with the cooling fin of chip and leave the placing groove.In this way, the device for adhering chip completes a core
The adhering processes of piece and cooling fin, the device for adhering chip repeat this process, if with complete to several chips with
The application work of dry cooling fin.The process that chip is pasted with cooling fin is completed by the device for adhering chip, without artificial
The qualification rate that operation, chip and cooling fin are pasted is high, and the device for adhering chip dramatically improves enterprise pair
The production efficiency of chip manufacture processing.
Detailed description of the invention
Fig. 1 is the structural schematic diagram in one embodiment for the device of adhering chip；
Fig. 2 is the enlarged diagram in Fig. 1 embodiment for the part device M of adhering chip；
Fig. 3 is another structural schematic diagram in one embodiment for the device of adhering chip.
Specific embodiment
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing to this
The specific embodiment of utility model is described in detail.Many details are explained in the following description in order to abundant
Understand the utility model.But the utility model can be implemented with being much different from other way described herein, this field
Technical staff can do similar improvement without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific embodiment opened.
In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside",
The orientation or positional relationship of the instructions such as " clockwise ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " is based on the figure
Orientation or positional relationship is merely for convenience of describing the present invention and simplifying the description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to the utility model
Limitation.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.The meaning of " plurality " is at least two, such as two in the description of the present invention,
It is a, three etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be
Mechanical connection, is also possible to be electrically connected；It can be directly connected, two can also be can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside element, unless otherwise restricted clearly.For the common skill of this field
For art personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down "
It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special
Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only
Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with
It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be with
It is directly to another element or may be simultaneously present centering elements.Term as used herein " vertically ", " level
", "upper", "lower", "left", "right" and similar statement for illustrative purposes only, be not offered as being uniquely to implement
Mode.
It is a kind of device 10 for adhering chip in one embodiment, for pasting also referring to Fig. 1 to Fig. 3
The device 10 of chip includes rotating disk mechanism 100 and several manipulator mechanisms 200, and several manipulator mechanisms 200 are around described
Rotating disk mechanism 100 is arranged.The device 10 for adhering chip is used to complete the application work of chip and cooling fin, wherein one
The manipulator mechanism 200 is used to drive the cooling fin for being coated with silicone grease to rotating disk mechanism 100, another manipulator mechanism
200 paste into rotating disk mechanism 100 with cooling fin for driving chip, and the another manipulator mechanism 200 is pasted for driving
There is the cooling fin of chip to leave the rotating disk mechanism 100.The rotating disk mechanism 100 is used as a hinge, plays the work of linking
With.
Specifically, the manipulator mechanism 200 includes set a roof beam in place 210, laterally driven part 220, connecting plate (not shown), longitudinal direction
Actuator 230 and clamping piece 240.Described set a roof beam in place 210 connect with the laterally driven part 220, and the laterally driven part 220 is logical
It crosses the connecting plate and the zigzag tread patterns part 230 is drivingly connected, the laterally driven part 220 is for driving the zigzag tread patterns
230 transverse shifting of part.The zigzag tread patterns part 230 is drivingly connected with the clamping piece 240, and the zigzag tread patterns part 230 is used for
The clamping piece 240 is driven to vertically move.The laterally driven part 220 drives the transverse shifting of the connecting plate, the longitudinal direction
Actuator 230 drives the longitudinal movement of the clamping piece 240.In the different manipulator mechanisms 200, the clamping piece
240, which have each served as clamping, is coated with the cooling fin of silicone grease, clamps chip and clamps the effect for being pasted with the cooling fin of chip.
The rotating disk mechanism 100 includes pedestal (not shown), rotary drive (not shown), rotating disk 110 and several
Placing groove 120.The pedestal is connect with the rotary drive, and the rotary drive and the rotating disk 110 are drivingly connected,
The rotary drive is for driving the rotating disk 110 to rotate.Several placing grooves 120 are around the rotating disk 110
The center of circle is connect with the rotating disk 110, and several placing grooves 120 are used to accept cooling fin and chip.In the present embodiment,
The rotary drive is driving motor.The work of the operation frequency of the rotary drive and several manipulator mechanisms 200
Match as progress, so that the position of several placing grooves 120 in the rotating disk 110 and several manipulator mechanisms 200
It can correspond.
The above-mentioned device 10 for adhering chip during the work time, wherein a manipulator mechanism 200 is for driving
Chip, another manipulator mechanism 200 for driving the cooling fin for being coated with silicone grease, use by the another manipulator mechanism 200
The cooling fin of chip is pasted in driving.Laterally driven part 220 in the manipulator mechanism 200 for driving cooling fin will
Plate is drivingly connected to the top of cooling fin, the driving clamping piece 240 of zigzag tread patterns part 230 connect with connecting plate close to cooling fin,
The clamping piece 240 can clamp cooling fin.And then, the zigzag tread patterns part 230 drives the receipts of the clamping piece 240
It returns, the cooling fin that the laterally driven part 220 drives clamping piece 240 to hold is close to rotating disk mechanism 100, the zigzag tread patterns part
230 drive cooling fin close to the placing groove 120, and the clamping piece 240 will unclamp cooling fin, and cooling fin is made to be placed in described put
It sets in slot 120.At this point, the rotary drive will drive the rotating disk 110 to rotate, so that placing gelled placement
Slot 120 is close to the manipulator mechanism 200 for being used for driving chip.At the same time, for the mechanical mobile phone of driving chip
Laterally driven part 220 in structure 200 can drive connecting plate to the top of chip, 230 meeting of zigzag tread patterns part connecting with connecting plate
Drive clamping piece 240 close to chip, the gripping member clamps chip.And then, the zigzag tread patterns part 230 drives the folder
The withdrawal of gripping member 240, the laterally driven part 220 drives clamping piece 240 to hold chip close to rotating disk mechanism 100, described vertical
It being driven in the close placing groove 120 that carry cooling fin of chip to actuator 230, the clamping piece 240 unclamps chip, with
Realize the stickup of chip and cooling fin.The rotating disk 110 continues to rotate, and carries putting for the cooling fin after pasting with chip
Setting slot 120 will be close to for driving the manipulator mechanism 200 with the cooling fin after chip stickup.At this point, viscous for driving
The manipulator mechanism 200 for posting the cooling fin of chip will drive this to be pasted with the cooling fin of chip and leave the placing groove
120.In this way, the device 10 for adhering chip completes the adhering processes of a chip and cooling fin, it is described for pasting core
The device 10 of piece repeats this process, to complete the application work to several chips and several cooling fins.Chip and cooling fin are viscous
The process of patch for the device 10 of adhering chip by completing, and without human intervention, the qualification rate that chip and cooling fin are pasted is high,
The device 10 for adhering chip dramatically improves the production efficiency that enterprise handles chip manufacture.
Chip or cooling fin are clamped for the ease of user, referring to Fig. 3, the clamping in one of the embodiments,
Part 240 is gripper cylinder, and the gripper cylinder is provided with a pair of of clamping limb 241.Gripper cylinder is also known as pneumatic-finger or finger
Cylinder can be divided into Y type gripping finger and flat pattern gripping finger according to pattern.Gripper cylinder is the prior art, and details are not described herein again for principle.This
In embodiment, the model MHZL2-10D of gripper cylinder.For the clamping piece 240 during clamping, gripper cylinder passes through one
The two sides of cooling fin or chip are held on to clamping wall.Each manipulator mechanism 200 respectively corresponds clamping and is coated with silicone grease
Cooling fin, chip and the cooling fin for being pasted with chip.Gripper cylinder is easy to control, and job stability is high, is avoided that chip
Or cooling fin is fallen off in clamping process.In this way, facilitating user clamps chip or cooling fin, the use is improved
In the job stability of the device 10 of adhering chip.
It is the pair of in one of the embodiments, in order to be protected in clamping process to cooling fin or chip
Clamping limb 241 it is opposite be provided with protective layer on one side.Further, in the present embodiment, the protective layer is elastic rubber.
In another embodiment, the protective layer is flexible plastic.In yet another embodiment, the protective layer is sponge.It is pressing from both sides
During holding, due to the fragile structure of cooling fin and chip, easily damaged by a pair of of clamping limb 241, the setting of the protective layer
Play the role of buffer protection.It is damaged in clamping process in this way, avoiding chip or cooling fin, the protective layer is to chip
Or cooling fin plays the role of protection.
The clamping piece 240 clamps cooling fin or chip for convenience, described in one of the embodiments,
Clamping piece 240 is vacuum generator, and the vacuum generator is provided with vacuum slot.Vacuum generator is produced using positive pressure gas source
The small-sized vacuum component of one kind of raw negative pressure, vacuum generator is the prior art, and details are not described herein again for principle.The present embodiment
In, the model ZX1-W05 of vacuum generator.Vacuum generator is small in size, light weight, look good with vacuum slot to chip or
Person's cooling fin implements absorption, to play the role of clamping chip or cooling fin.Vacuum generator structure is simple, and installs
It is convenient.In this way, the clamping piece 240 is facilitated to clamp cooling fin or chip, the installation of the clamping piece 240 is improved
Convenience.
In order to facilitate connecting plate described in user's driving, the laterally driven part 220 is no bar in one of the embodiments,
Cylinder.Further, in the present embodiment, the rodless cylinder is magnetic coupling formula rodless cylinder.In another embodiment, described
Rodless cylinder is mechanical rodless cylinder.Magnetic coupling formula rodless cylinder and mechanical rodless cylinder are the prior art, principle this
Place repeats no more.In the present embodiment, the model CDY1S15H-300B of rodless cylinder.Rodless cylinder structure is simple, is easy control
System.User is by driving the laterally driven part 220 to control the connecting plate transverse shifting, so as to adjust the clamping piece 240
Lateral position.In this way, facilitating connecting plate described in user's driving, and then the transverse direction of the clamping piece 240 is adjusted convenient for user
Position.
In order to facilitate the longitudinal movement of clamping piece 240 described in user's control, in one of the embodiments, longitudinal drive
Moving part 230 is to have bar cylinder.Further, in the present embodiment, described to have bar cylinder for single-acting cylinder.In another implementation
It is described to have bar cylinder for blow cylinder in example.Having bar cylinder is the prior art, and details are not described herein again for principle.In the present embodiment,
There is model SCJ-50 × 50-50-S of bar cylinder.There is bar air cylinder structure simple, is easy to control.User is described vertical by driving
The clamping piece 240 is controlled to actuator 230 to vertically move so that the clamping piece 240 it is close, far from cooling fin or core
Piece.In this way, facilitating the longitudinal movement of clamping piece 240 described in user's control, and then the clamping piece 240 is adjusted convenient for user
Lengthwise position.
In order to which cooling fin is firmly seated in the placing groove 120, the placing groove in one of the embodiments,
120 slot bottom is provided with vacuum chuck fixture.Vacuum chuck fixture is connected by gas-guide tube and vacuum pump, starting vacuum pump so that
Negative pressure is generated in vacuum chuck fixture, extraneous workpiece will be crushed on vacuum chuck fixture under atmospheric pressure, thus
Play the effect fixed to extraneous absorption of workpieces.Vacuum chuck fixture is the prior art, and details are not described herein again for principle.The rotation
When rotating at high speed, the cooling fin being placed in the placing groove 120 will receive centrifugal action to turntable 110, be thrown out of described
The possibility of rotating disk 110.The vacuum chuck fixture is the work that the cooling fin being placed in the placing groove 120 plays absorption
With enabling cooling fin to be close to the slot bottom of the placing groove 120, avoid cooling fin quilt in 110 high speed rotation of rotating disk
It throws away.The position of cooling fin can remain unchanged in 110 rotary course of rotating disk.In this way, cooling fin can be firmly
It is placed in the placing groove 120, to ensure that the accuracy that the clamping piece 240 clamps cooling fin, improves
The job stability of the device 10 for adhering chip.
The cooling fin for being pasted with chip is taken out from the placing groove 120 for the ease of the clamping piece 240, is please joined together
Fig. 1 and Fig. 2 are read, the two sidewalls correspondence of the placing groove 120 offers grasp opening 121 in one of the embodiments,.It is described
Opening up for grasp opening 121 provides grasping part for the pair of clamping limb 241, and the pair of clamping limb 241 can pass through
The grasp opening 121 clamps the cooling fin for being pasted with chip being placed in the placing groove 120.In this way, described
The opening up of grasp opening 121 facilitates the clamping piece 240 and takes out the cooling fin for being pasted with chip from the placing groove 120,
Improve the efficiency that the clamping piece 240 clamps cooling fin.
The placing groove 120 is replaced in order to facilitate user, referring to Fig. 1, the rotating disk in one of the embodiments,
110 are uniformly provided with several mounting holes 111 around the center of circle, and mounting seat is provided on the outside of the slot bottom of the placing groove 120, and (figure is not
Show), the mounting hole 111 is adapted with the mounting seat, the mounting seat be inserted in the mounting hole 111 with it is described
Rotating disk 110 connects.The specification size of cooling fin is had nothing in common with each other, in order to be adapted to the cooling fin of different size, the placing groove 120
Also there are a variety of different specifications.The connection of the placing groove 120 and the rotating disk 110 be it is detachable, more in order to user
Change the placing groove 120.Secondly, when user needs that the placing groove 120 is repaired or replaced, the placing groove 120
Detachable connection relationship with the rotating disk 110 is that the maintenance replacement of user is provided convenience.In this way, facilitating user more
The placing groove 120 is changed, the scope of application of the device 10 for adhering chip is improved.
It is described for gluing in one of the embodiments, also referring to Fig. 1 and Fig. 2 in order to transmit chip and cooling fin
The device 10 of patch chip further includes several transport mechanisms 300, and the transport mechanism 300 is belt conveyor, the belt conveying
Machine includes conveyer belt 310, drive roll (not shown), driven roller (not shown) and drum drive motor (not shown), institute
It states drive roll and is drivingly connected by the conveyer belt 310 with the driven roller, the drum drive motor and the active
Drum driven connection；Several transport mechanisms 300 are arranged in a one-to-one correspondence with several manipulator mechanisms 200 respectively.Wherein
For one belt conveyor for conveying chip close to the rotating disk mechanism 100, another belt conveyor is coated with silicone grease for conveying
Cooling fin close to the rotating disk mechanism 100, another belt conveyor is used to convey described in the cooling fin for being pasted with chip leaves
Rotating disk mechanism 100.Wherein a manipulator mechanism 200 clamps the cooling fin on the belt conveyor into placing groove 120.
Another manipulator mechanism 200 clamps the cooling fin in chip and the placing groove 120 on another belt conveyor
Mutually paste.The another manipulator mechanism 200 clamp be pasted in the placing groove 120 chip cooling fin it is defeated to another belt
Machine is sent, the cooling fin that the conveying of this belt conveyor is pasted with chip leaves.In this way, each transport mechanism 300 is for several institutes
It states manipulator mechanism 200 and conveys chip or cooling fin respectively, improve the running effect of the device 10 for adhering chip
Rate.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of device for adhering chip characterized by comprising rotating disk mechanism and several manipulator mechanisms, Ruo Gansuo
Manipulator mechanism is stated to be arranged around the rotating disk mechanism；
The manipulator mechanism include set a roof beam in place, laterally driven part, connecting plate, zigzag tread patterns part and clamping piece；It is described set a roof beam in place with
The laterally driven part connection, the laterally driven part is drivingly connected by the connecting plate and the zigzag tread patterns part, described
Zigzag tread patterns part and the clamping piece are drivingly connected；
The rotating disk mechanism includes pedestal, rotary drive, rotating disk and several placing grooves, and the pedestal and the rotation are driven
Moving part connection, the rotary drive and the rotating disk are drivingly connected, circle of several placing grooves around the rotating disk
The heart is connect with the rotating disk.
2. a kind of device for adhering chip according to claim 1, which is characterized in that the clamping piece is clamping gas
Cylinder, the gripper cylinder are provided with a pair of of clamping limb.
3. a kind of device for adhering chip according to claim 2, which is characterized in that the pair of clamping limb is opposite
Be provided with protective layer on one side.
4. a kind of device for adhering chip according to claim 1, which is characterized in that the clamping piece is vacuum hair
Raw device, the vacuum generator are provided with vacuum slot.
5. a kind of device for adhering chip according to claim 1, which is characterized in that the laterally driven part is nothing
Bar cylinder.
6. a kind of device for adhering chip according to claim 1, which is characterized in that the zigzag tread patterns part is to have
Bar cylinder.
7. a kind of device for adhering chip according to claim 1, which is characterized in that the slot bottom of the placing groove is set
It is equipped with vacuum chuck fixture.
8. a kind of device for adhering chip according to claim 3, which is characterized in that the two sidewalls of the placing groove
Correspondence offers grasp opening.
9. a kind of device for adhering chip according to claim 1, which is characterized in that the rotating disk surrounds the center of circle
Several mounting holes are uniformly provided with, are provided with mounting seat on the outside of the slot bottom of the placing groove, the mounting seat is inserted in institute
It states in mounting hole and is connect with the rotating disk.
10. a kind of device for adhering chip according to claim 1, which is characterized in that further include several conveyers
Structure, the transport mechanism are belt conveyor, and the belt conveyor includes conveyer belt, drive roll, driven roller and rolling
Cylinder driving motor, the drive roll are drivingly connected by the conveyer belt and the driven roller, the drum drive motor
It is drivingly connected with the drive roll；Several transport mechanisms are arranged in a one-to-one correspondence with several manipulator mechanisms respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920407763.6U CN209515617U (en) | 2019-03-28 | 2019-03-28 | A kind of device for adhering chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920407763.6U CN209515617U (en) | 2019-03-28 | 2019-03-28 | A kind of device for adhering chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209515617U true CN209515617U (en) | 2019-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920407763.6U Active CN209515617U (en) | 2019-03-28 | 2019-03-28 | A kind of device for adhering chip |
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| Country | Link |
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| CN (1) | CN209515617U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113192849A (en) * | 2021-05-11 | 2021-07-30 | 中科长光精拓智能装备(苏州)有限公司 | Chip bonding method |
-
2019
- 2019-03-28 CN CN201920407763.6U patent/CN209515617U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113192849A (en) * | 2021-05-11 | 2021-07-30 | 中科长光精拓智能装备(苏州)有限公司 | Chip bonding method |
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Address after: 516000 Huaan Road, 32 Zhongkai High-tech Zone, Huizhou City, Guangdong Province Patentee after: Huizhou xiwensi Technology Co., Ltd Address before: 516000 Huaan Road, 32 Zhongkai High-tech Zone, Huizhou City, Guangdong Province Patentee before: HUIZHOU SEVENUS INDUSTRIAL Co.,Ltd. |
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Denomination of utility model: A device for sticking chips Effective date of registration: 20201204 Granted publication date: 20191018 Pledgee: Huizhou Huicheng Branch of Industrial and Commercial Bank of China Ltd. Pledgor: Huizhou xiwensi Technology Co., Ltd Registration number: Y2020980008834 |