JP3243190B2 - Apparatus and method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for manufacturing a semiconductor device, and more particularly to a die bonding step of die bonding a semiconductor chip cut from a semiconductor wafer by dicing onto a lead frame or an envelope. What is used.

[0002]

2. Description of the Related Art Conventionally, in a die bonding step of die bonding a semiconductor chip onto a lead frame, a wafer having a plurality of semiconductor chips formed thereon is attached to a dicing sheet, and the wafer is diced to form a semiconductor chip. After cutting, one of the semiconductor chips is pushed up with a pin and peeled off from the dicing sheet. And
The semiconductor chip is picked up, picked up, positioned, and then fixed on a lead frame.

FIG. 10 schematically shows a conventional apparatus (die bonder) used in a die bonding step. That is, in this die bonder, for example, a lead frame (not shown) is supplied via the frame loader 101 and is transported on the transport feeder 102. Then, in the course of the transportation, the adhesive for bonding the semiconductor chips from the dispenser 103 is supplied through the supply nozzle 104, and is further transported to the lead position a.

On the other hand, a dicing sheet 106 fixed to a wafer table 105 is positioned at the bonding position a.
It is cut from the wafer 107 attached on top,
Semiconductor chip 1 detected by position detection mechanism 108
09 is pushed up by a push-up device (to be described later) 110.

Then, the pushed-up semiconductor chip 109 is picked up and picked up by a pick-up head 111, and the position thereof is corrected by a position correcting table 112. Then, the semiconductor chip 109 is sucked and supplied by a die bonding collet 113. You.

Then, the semiconductor chip 109 supplied to the bonding position a is bonded to the bed of the lead frame waiting at the position a via an adhesive by the pressure of the die bonding collet 113.

[0007] The lead frame to which the semiconductor chip 109 is bonded is further transported on the transport feeder 102 and stored in the end frame magazine 114. FIG. 11 schematically shows the push-up device 110 described above.

The push-up device 110 converts the wafer 107 into a semiconductor chip 1 by a dicing process, for example.
The backup holder 121 is configured to be movably provided below the wafer table 105 for fixing the dicing sheet 106 that has been cut into pieces 09.

The backup holder 121 sucks the lower surface of the dicing sheet 106 on the upper surface thereof, and raises the push-up pins 123 accompanying the upward movement of the pin holder 122, thereby causing the semiconductor chip 1 to move upward.
09 is pushed up.

FIG. 12 shows the push-up device 110 described above.
This shows the operation when the semiconductor chip 109 is pushed up. By the way, when pushing up the semiconductor chip 109,
First, the backup holder 121 performs push-up 1
It is moved directly below one semiconductor chip 109. And
The inside of the backup holder 121 is set to a negative pressure by the vacuum operation. As a result, the dicing sheet 106 is sucked by a predetermined vacuum force and is sucked on the upper surface of the backup holder 121.

In this state, the pin holder 122
It is moved upward at a predetermined speed and a predetermined acceleration.
Then, the semiconductor chip 109 is pushed up to a position at a certain height by the push-up pins 123 by moving the pin holder 122 to a position at a certain height.

At this time, the pushed semiconductor chip 1
The dicing sheet 106 immediately below 09 is stretched,
The semiconductor chip 109 is peeled off from the back surface. Thereafter, the pushed up semiconductor chip 109 is easily picked up by the pickup head 111,
After the position is corrected by the position correction table 112, the position is fixed on the lead frame by the die bonding collet 113.

As described above, in the conventional die bonder, the back surface of the semiconductor chip 109, which is the non-element formation surface, adhered to the dicing sheet 106 is pushed up by the push-up pins 123, and the element (pattern), which is the front surface of the semiconductor chip 109, is formed. 3) The formation surface 109a is picked up by the pickup head 111, or is held by being sucked and held by the die bonding collet 113.

However, in recent years, in the field of semiconductor device manufacturing, the surface of a semiconductor chip on which an element pattern has been formed is attached to a dicing sheet as the size of an envelope is reduced and the diameter of a wafer is increased. Technology is being developed.

FIG. 13 shows an example of a wafer in which the surface of a semiconductor chip on which an element pattern is formed is attached to a dicing sheet. This wafer 1 is formed, for example, after forming a plurality of element patterns 2 on its surface,
Along the mutual dicing line of each element pattern 2,
A cutting groove 3 is formed at a predetermined depth from the surface of the wafer 1.

After attaching the dicing sheet 4 to the front surface of the wafer 1, the back surface thereof is ground to a depth not less than the depth of the cut groove 3, and the semiconductor chip 5 having a predetermined thickness is cut. Form.

As a result, a plurality of semiconductor chips 5 are obtained in which the element forming surfaces (surfaces) on which the element patterns 2 are formed are adhered to the dicing sheet 4. However, in the case where the surface of the semiconductor chip 5 which is the element forming surface is attached to the dicing sheet 4, there is a problem that it cannot be used with a conventional die bonder.

That is, in the die bonder in which the back surface of the semiconductor chip 109, which is the non-element formation surface, is pushed up by the push-up pins 123, the surface 109a of the semiconductor chip 109 opposite to the pushed-up surface is picked up to correct the position. Die bonding on a lead frame is performed.

For this reason, in the case where the surface of the semiconductor chip 5 on which the element patterns 2 are formed is attached to the dicing sheet 4, the surface of the semiconductor chip 5 is pushed up, so that die bonding is performed as it is. In addition, the element formation surface is bonded to the lead frame, so that subsequent steps such as wire bonding cannot be performed.

Further, there is a high possibility that the element pattern 2 on the surface of the semiconductor chip 5 will be damaged by rubbing with a correction table or the like. As described above, it is basically impossible to perform the die bonding of the semiconductor chip 5 having the surface adhered to the dicing sheet 4 by the conventional die bonder. A special mechanism was needed to reverse the front and back.

[0021]

As described above, in the prior art, the back surface of the semiconductor chip, which is the non-element forming surface, which is stuck to the dicing sheet, is pushed up by push-up pins, and the back surface is opposite to the pushed-up back surface. Since the surface of the semiconductor chip was picked up and the position was corrected and die bonding was performed on the lead frame, it could not be used for die bonding of the semiconductor chip with the surface attached to the dicing sheet. there were.

Therefore, according to the present invention, a semiconductor chip having a surface adhered to a dicing sheet can be die-bonded without requiring any special mechanism, so that the structure can be simplified and the cost can be reduced. It is an object of the present invention to provide a simple semiconductor device manufacturing apparatus and manufacturing method.

[0023]

In order to achieve the above object, in a semiconductor device manufacturing apparatus according to the present invention, a semiconductor chip having an element forming surface adhered to an adhesive sheet is attached to the semiconductor chip. At the same time as pushing up through the sheet, pushing up means for joining on the chip mounting device is provided.

In the apparatus for manufacturing a semiconductor device according to the present invention, a holding means for holding an adhesive sheet adhered to an element forming surface of a semiconductor chip, and the semiconductor chip is pushed up from the element forming surface side. A push-up means for peeling off the pressure-sensitive adhesive sheet; and a transport means for transporting the chip mounting device to which the semiconductor chip is bonded, with the bonding portion down, above the push-up position by the push-up means. At the same time, the semiconductor chip is pushed up by means and joined to the joint of the chip mounter.

In the method of manufacturing a semiconductor device according to the present invention, a semiconductor chip having an element forming surface attached to an adhesive sheet is pushed up by the pushing means via the adhesive sheet, and the chip is mounted. It is designed to be joined on a vessel.

Further, in the method of manufacturing a semiconductor device according to the present invention, the step of holding the adhesive sheet stuck to the element forming surface of the semiconductor chip by the holding means, and in this state, the semiconductor chip is pushed up by the push-up means. And peeling off from the pressure-sensitive adhesive sheet from the element forming surface side and, at the same time, bonding to the bonding portion of the chip mounting device conveyed by the conveying means above the protruding position.

According to the apparatus and method for manufacturing a semiconductor device of the present invention, the semiconductor chip having the element forming surface attached thereto can be peeled off from the adhesive sheet and can be directly bonded to the chip mounting device. . This not only does not require a special mechanism for turning the semiconductor chip upside down, but also eliminates the need for a head and a collet for die bonding the semiconductor chip.

[0028]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 schematically shows a configuration of a die bonding apparatus (die bonder) according to a first embodiment of the present invention. Here, a case where a semiconductor chip is die-bonded to a lead frame as a chip mounting device will be described.

That is, this die bonder is, for example,
A frame loader 11 that supplies a lead frame LF as a chip mounting device, a transport feeder (transporting unit) 12 that transports the lead frame LF supplied by the frame loader 11 downwardly on a bed that is a joint thereof,
A die bonding mechanism 13 for bonding the semiconductor chip 5 on the bed of the lead frame LF in the middle of the transport path of the transport feeder 12 (bonding position), and the semiconductor chip 5 bonded by the die bonding mechanism 13 It comprises a frame magazine 14 for accommodating the lead frame LF.

The die bonding mechanism 13 is, for example, a ring-shaped wafer table (holding means) 30 for fixing a dicing sheet (adhesive sheet) 4 attached to the wafer 1, and is provided movably below the wafer table 30. A backup holder (to be described in detail later) 31 having a pin holder as a push-up means;
A recognizing device 32 for discriminating the position of the semiconductor chip 5 and non-defective / defective products;
A pressure block 33 for applying pressure to F is provided.

Here, the wafer 1 is, for example, as shown in FIG.
As shown in FIG. 3, after a plurality of element patterns 2 are formed on the surface, and a cutting groove 3 is formed at a predetermined depth along a dicing line of each element pattern 2, a dicing sheet 4 is attached. While attached, the back side,
The semiconductor chips 5 having a predetermined thickness are formed by grinding at a depth greater than the depth of the cut groove 3.

That is, each element forming surface (surface) of the semiconductor chip 5 on which the element patterns 2 are formed is in a state of being attached to the dicing sheet 4. In the lead frame LF, an adhesive (not shown) is provided in advance at a position of a bed to which the semiconductor chip 5 is bonded. As the adhesive, for example, a paste-like or film-like thermosetting resin or a thermoplastic resin is used so that the lead frame LF does not peel off when being transported downward.

The die bonding mechanism 13 is, for example, based on the result of the recognition device 32,
One of the semiconductor chips 5 to be joined on the F can be positioned directly below the bed of the lead frame LF, which stands by at the joining position.

The wafer table 30 is, for example,
Based on the result of the recognition device 32, the position (orientation) of the semiconductor chip 5 bonded on the lead frame LF can be corrected.

For example, the recognizing device 32 discriminates a non-defective / defective product of the semiconductor chip 5 at each bonding time, or preliminarily discriminates a non-defective / defective product in the entire wafer 1. The position of the semiconductor chip 5 corresponding to the result may be managed as data.

The pressure block 33 has a heating function (heating means) for semi-curing or completely curing the adhesive provided on the bed of the lead frame LF at the time of joining, for example. ing.

FIG. 2 shows the backup holder 31 described above.
FIG. In this case, the backup holder 31 has a plurality of holes 31a and grooves 3 on its upper surface.
1b is provided. In addition, the backup holder 31
, A pin holder 31c is provided movably up and down.

The interior of the backup holder 31 is set to a negative pressure in advance when the semiconductor chip 5 is joined. Above the pin holder 31c, push-up pins 31d for pushing up the semiconductor chip 5 are arranged corresponding to the positions of the holes 31a on the backup holder 31, respectively.

The push-up pin 31d is connected to the pin holder 3
1c, the backup holder 31
One semiconductor chip 5 protrudes from the upper hole 31a from the front side through the dicing sheet 4 and is separated from the dicing sheet 4 at that time.

In this case, the push-up pins 31d do not break through the dicing sheet 4 when the semiconductor chips 5 are pushed up, and the adhesive pins 34d attach the pushed-up semiconductor chips 5 to the bed of the lead frame LF. The distal end portion is formed to have a hemispherical shape so that a crimping force required for bonding through the via is obtained.

Next, the operation of the backup holder 31 for die bonding will be described. For example, when the semiconductor chip 5 is bonded onto the lead frame LF, first, the lead frame LF supplied by the frame loader 11 is transported on the transport feeder 12 with the bed, which is the bonding portion, facing downward, and in the middle thereof. Is sent to the joining position.

On the other hand, after a plurality of element patterns 2 are formed on the surface of the wafer 1, a cutting groove 3 is formed at a predetermined depth along a dicing line of each element pattern 2, and then a dicing sheet is formed on the surface. A wafer 1 on which a semiconductor chip 5 having a predetermined thickness is formed by grinding the back surface of the wafer 1 to which the wafer 4 is attached is set on a wafer table 30.

Then, the position of the die bonding mechanism 13 and the angle of the wafer table 30 are controlled so that one of the semiconductor chips 5 whose position and quality has been determined by the recognition device 32 accurately corresponds to the bonding position.

After the backup holder 31 is made to correspond to the position of the semiconductor chip 5, the inside of the backup holder 31 is set to a negative pressure, and the back surface of the dicing sheet 4 is backed up through the holes 31a and the grooves 31b. The suction is performed on the upper surface of the holder 31 (FIG. 2A).

In this state, the semiconductor chip 5 is moved upward by the pin holder 31c and moved to a position at a fixed height, so that the push-up pins 31d are moved.
Is pushed up to a fixed height position.

At this time, the semiconductor chip 5 pushed up
The dicing sheet 4 on its surface is stretched and peeled off, and waits at the joining position on the transport feeder 12.
It is joined to the bed of the lead frame LF via an adhesive 34 (FIG. 2B).

At this time, the pressure block 33 is locally heated, and the adhesive 34 is cured in accordance with the bonding of the semiconductor chip 5 to the lead frame LF, whereby the semiconductor chip 5 is placed on the lead frame LF. Securely joined.

In this manner, the semiconductor chip 5 is pushed up from the surface on which the element pattern 2 is formed, and
The lead frame LF after the back surface of the semiconductor chip 5 is bonded is further transported on the transport feeder 12 with the downward movement of the pin holder 31c, guided to the terminal side, and stored in the frame magazine 14. You.

Next, another embodiment of the present invention will be described. FIG. 3 shows an example in which the die bonding apparatus (die bonder) according to the second embodiment of the present invention is configured to die-bond a semiconductor chip to a package (envelope) as a chip mounting device. Things.

In the case of this die bonder, a coating mechanism for coating the die bonder according to the first embodiment with an adhesive on the back surface (non-element formation surface) side of the semiconductor chip 5 to be die-bonded on the package P. (Applying means)
41 are provided.

That is, this die bonder is, for example,
The package P is supplied by the frame loader 11, and the package P supplied by the frame loader 11 is transferred to the transport feeder 12 with its joining portion facing downward.
Before the semiconductor chip 5 is bonded onto the package P, the adhesive is applied from the dispenser 41a to the back surface of the semiconductor chip 5 by the application mechanism 41.

FIG. 4 schematically shows the coating mechanism 41 described above. The coating mechanism 41, for example, in a state where the dicing sheet 4 is fixed on the wafer table 30, pastes the adhesive 4 on the back surface of the semiconductor chip 5 to which the front surface is attached via a number of nozzles 42.
3 is applied.

In this case, the adhesive 43 may be applied to each of the semiconductor chips 5 to be joined, or may be applied to all the semiconductor chips 5 determined to be non-defective in one wafer. May be.

FIG. 5 is a diagram for explaining such a die bonding operation. After the adhesive 43 is applied to the back surface of the semiconductor chip 5 as described above, the position of the die bonding mechanism 13 and the angle of the wafer table 30 are controlled so that the semiconductor chip 5 accurately corresponds to the bonding position. .

Thereafter, the series of operations in the first embodiment described above are performed in the same manner, whereby the semiconductor chip 5 is pushed up from the surface on which the element pattern 2 is formed, and at the same time, the semiconductor chip 5 is directly Are obtained, the back surface of which is bonded via the adhesive 43.

As described above, the semiconductor chip to which the surface is adhered is peeled off from the dicing sheet and, at the same time, can be directly joined to the lead frame or the package.

That is, by pushing up the front surface of the semiconductor chip, the back surface of the semiconductor chip is joined to the mounting portion on the lead frame or package. As a result, the semiconductor chip whose surface is attached to the dicing sheet can be securely die-bonded without requiring a special mechanism for turning the semiconductor chip upside down and a conventional head or collet. . Therefore, the structure can be simplified and the cost can be reduced, and in particular, it is indispensable for a new process technology accompanying a reduction in the size and thickness of the envelope, an increase in the diameter of the wafer, and an improvement in the bending stress of the chip. It cannot be done.

In the first and second embodiments, the case where the tip of the push-up pin has a hemispherical shape has been described as an example. However, the present invention is not limited to this case. To the push-up pin 3 as shown in FIG.
1d may be any shape that does not break the dicing sheet when the semiconductor chip is pushed up, and that can provide a crimping force necessary for bonding the pushed up semiconductor chip.

Further, the present invention is not limited to the case where the adhesive is cured at the same time as the bonding of the semiconductor chip. For example, the adhesive may be cured by heat after the bonding. Of course, various modifications can be made without departing from the scope of the present invention.

[0060]

As described in detail above, according to the present invention, a semiconductor chip having a surface attached to a dicing sheet can be die-bonded without requiring any special mechanism, thereby simplifying the structure. In addition, it is possible to provide a semiconductor device manufacturing apparatus and a manufacturing method capable of reducing cost.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of a die bonder according to a first embodiment of the present invention.

FIG. 2 is a schematic view similarly illustrating an operation relating to die bonding.

FIG. 3 is a schematic diagram showing a configuration of a die bonder according to a second embodiment of the present invention.

FIG. 4 is a schematic view similarly illustrating an operation of applying an adhesive.

FIG. 5 is a schematic view similarly illustrating an operation relating to die bonding.

FIG. 6 is a schematic diagram showing another configuration of the push-up pin.

FIG. 7 is a schematic diagram showing another configuration of the push-up pin.

FIG. 8 is a schematic diagram showing another configuration of the push-up pin.

FIG. 9 is a schematic diagram showing another configuration of the push-up pin.

FIG. 10 is a schematic configuration diagram of a die bonder shown to explain a conventional technique and its problems.

FIG. 11 is a schematic configuration diagram showing a push-up device.

FIG. 12 is a schematic view similarly illustrating the operation of the push-up device.

FIG. 13 is a schematic view showing an example of a wafer in which a surface of a semiconductor chip on which an element pattern is formed is attached to a dicing sheet.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Wafer 2 ... Element pattern 3 ... Cutting groove 4 ... Dicing sheet 5 ... Semiconductor chip 11 ... Frame loader 12 ... Transport feeder 13 ... Die bond mechanism 14 ... Frame magazine 30 ... Wafer table 31 ... Backup holder 31a ... Hole 31b ... Groove 31c ... Pin holder 31d ... Push-up pin 32 ... Recognition device 33 ... Pressure block 34,43 ... Adhesive 41 ... Coating mechanism 42 ... Nozzle LF ... Lead frame P ... Package

Continuation of front page (56) References JP-A-4-367250 (JP, A) JP-A-61-210650 (JP, A) JP-A-62-204539 (JP, A) JP-A-53-100765 (JP) JP-A-54-19363 (JP, A) JP-A-54-84975 (JP, A) JP-A-61-112345 (JP, A) JP-A-61-116846 (JP, A) (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/52 H01L 21/68 H01L 21/78

Claims (14)

(57) [Claims] 1. A semiconductor chip having an element forming surface attached to an adhesive sheet without breaking the adhesive sheet.
It pushed up through said adhesive sheet at the same time, the adhesive
Means the push-up bonding the semiconductor chip on the chip mounting unit via a provided on the chip mounting unit, via the chip mounting device
Curing the adhesive by heating the adhesive
And a heating means for causing the semiconductor device to be manufactured. 2. The apparatus according to claim 1, wherein the chip mounting device is a lead frame or an envelope. 3. The semiconductor device manufacturing apparatus according to claim 1, further comprising an application unit for applying the adhesive to the non-element forming surface side of the semiconductor chip. 4. A holding means for holding an adhesive sheet stuck on the element formation surface of the semiconductor chip, the semiconductor chip pushed up from the side of the element-formed surface without destroying the adhesive sheet, the said semiconductor chip means the push-up is peeled from the adhesive sheet, to a position above the push-up by the push-up means and transporting means for said semiconductor chip to the chip mounting unit which is bonded through an adhesive, to convey the the joint portion in the bottom, the Provided on the chip mounter, and via the chip mounter
Curing the adhesive by heating the adhesive
And a heating means for causing the semiconductor chip to be pushed up by the pushing up means and to be joined to a joining portion of the chip mounting device. 5. The semiconductor chip has a cutting groove of a predetermined depth formed along a dicing line provided in a lattice pattern on a surface of a semiconductor wafer on which a plurality of semiconductor chips are formed, and a surface of the semiconductor wafer is formed. 5. The semiconductor device manufacturing apparatus according to claim 4, wherein the semiconductor wafer is separated and divided into chips by removing a predetermined thickness of the back surface side of the semiconductor wafer after attaching an adhesive sheet to the semiconductor wafer. . 6. The apparatus according to claim 4, wherein the chip mounting device is a lead frame or an envelope. 7. A front side of the non-element forming surface side of the semiconductor chip.
5. The semiconductor device manufacturing apparatus according to claim 4, further comprising an application unit for applying the adhesive. 8. A semiconductor chip having an element forming surface adhered on an adhesive sheet without breaking the adhesive sheet.
The pushing means is pushed up through the adhesive sheet by the pushing means, and at the same time, the heating means provided on the chip mounting device is provided.
Bonding between the semiconductor chip and the chip mounter via
By heating and curing the agent, through the adhesive
The method of manufacturing a semiconductor device, characterized in that said semiconductor chip so as to bond onto said chip mounting apparatus Te. 9. The method according to claim 8, wherein the chip mounting device is a lead frame or an envelope. 10. The method of manufacturing a semiconductor device according to claim 8, wherein the adhesive is applied to a non-element forming surface side of the semiconductor chip by an application unit. 11. In this state step of holding the means for holding the pressure-sensitive adhesive sheet stuck on the element formation surface of the semiconductor chip, the element formation surface side of the semiconductor chip by means pushing-up without destroying the adhesive sheet At the same time as being pushed up and peeled from the pressure-sensitive adhesive sheet, at the joint of the chip mounting device conveyed by the conveying means above this pushed-up position
Bonding the semiconductor chip with an adhesive, and connecting the semiconductor chip with a heating means provided on the chip mounter.
A process for curing the adhesive by heating the adhesive.
A method for manufacturing a semiconductor device, comprising: 12. The semiconductor chip, wherein a cutting groove having a predetermined depth is formed along a dicing line provided in a grid pattern on a surface of the semiconductor wafer on which a plurality of semiconductor chips are formed, and a surface of the semiconductor wafer is formed. 12. The method for manufacturing a semiconductor device according to claim 11, wherein the semiconductor wafer is separated and divided into chips by removing a predetermined thickness of the back surface side of the semiconductor wafer after attaching an adhesive sheet to the semiconductor device. . 13. The method according to claim 11, wherein the chip mounting device is a lead frame or an envelope. 14. The method according to claim 11, wherein the adhesive is applied to a non-element forming surface side of the semiconductor chip by an application unit.