JPH10209248A - Push-up device in die bonder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a push-up device in a die bonder capable of precisely vacuum-chucking semiconductor chips into a collet and enhanicing a manfuacting yield and quanlity of the die bonding. SOLUTION: In a push-up device in a die bonder in which a semiconductor chip 2 sticking to a mount sheet 5 is pushed up separated, and the separated semiconductor chip 2 is vacuum-chucked by a collet 1 and die-bonded, the semiconductor chip 2 sticking to the mount sheet 5 pushed up by a push-up pin 3 is synchronously lifted up in a state of vacuum-chucking by the push-up pin 3 and collet 1, and the semiconductor chip 2 is separated from the mount sheet 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a push-up device in a die bonder, and more particularly to a push-up device in a die bonder for reliably separating and separating a semiconductor chip from a mount sheet by a push-up pin and adsorbing the semiconductor chip to a collet.

[0002]

2. Description of the Related Art In recent years, semiconductor chips have been diversified and various chip sizes have been manufactured, but such semiconductor chips are generally transported in a form adhered on an adhesive sheet. When mounting on a lead frame, it is common to peel it off from the adhesive sheet with a push-up device and perform die bonding. Hereinafter, a conventional push-up device in this type of die bonder will be described with reference to the drawings. FIG. 2 is a side view schematically showing a configuration of a main part of a push-up device in a conventional die bonder and an outline of operation steps thereof. In the drawing, 1 is a collet, 2 is a semiconductor chip, 3 is a push-up pin, 4 is an ejector, 5 shows a 5-mount sheet. In the operation, first, as shown in FIG. 2A, the mount sheet 5 to which the semiconductor chip 2 is adhered is transported onto the ejector 4 and stopped. The transport direction is the left-right direction in the drawing. The collet 1 for adsorbing the semiconductor chip 2 is lowered as shown in FIG. 2B, and a plurality (for example, four) of push-up pins of the semiconductor chip 2 adhered to the mounting sheet 5 as shown in FIG. 3, the semiconductor chip 2 is peeled off from the mounting sheet 5 by pushing up to the position of the collet 1 as shown in FIG. 3 (d), and at the same time, the semiconductor chip 2 is vacuum-adsorbed inside the collet 1; ), The collet 1 on which the semiconductor chip 2 is adsorbed is raised and moved to a predetermined position, mounted on a lead frame (not shown), and the push-up pins 3 are lowered. .

[0003]

However, in such a conventional configuration, semiconductor chips have been diversified and increased in size in recent years, and when a semiconductor chip of various sizes is die-bonded, the adhesiveness of a mounting sheet has to be increased. Forces are applied unevenly to the peeling direction of the semiconductor chip, which not only makes it difficult to stably mount the semiconductor chip inside the collet, but also leaves a certain gap when removing the semiconductor chip from the mounting sheet. The semiconductor chip is misaligned in the collet (Fig. 1 (d),
(See (e)), causing damage to the surface of the semiconductor chip and deteriorating the positional accuracy when the semiconductor chip is mounted on a lead frame.

An object of the present invention is to solve the above-mentioned conventional problems, and to provide a push-up device in a die bonder capable of accurately adsorbing a semiconductor chip inside a collet and improving the yield and quality of die bonding. With the goal.

[0005]

SUMMARY OF THE INVENTION A push-up device in a die bonder according to the present invention pushes up and peels off a semiconductor chip adhered to a mount sheet, and sucks up the peeled-off semiconductor chip with a collet to die-bond it. The semiconductor chip adhered to the mounting sheet pushed up by the push-up pins is synchronously lifted while being held between the push-up pins and the collet, and the semiconductor chip is separated from the mount sheet.

According to the present invention, there is provided a push-up device in a die bonder capable of accurately adsorbing a semiconductor chip inside a collet and improving the yield and quality of die bonding.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a push-up device in a die bonder according to the present invention will be described below with reference to the drawings. Note that the same reference numerals are used for the same parts as those of the conventional one. FIG. 1 is a side view schematically showing a configuration of a main part and an outline of operation steps in an embodiment of a push-up device in a die bonder of the present invention.
Reference numeral 3 denotes a push-up pin, 4 denotes an ejector, and 5 mount sheets, and these components are the same as those of the above-described conventional one.

Next, the operation will be described. First, Fig. 1 (a)
As shown in (2), the mount sheet 5 to which the semiconductor chip 2 is adhered is conveyed and stopped at a predetermined position on the ejector 4. At this time, the inside of the ejector 4 is made negative pressure, and the mount sheet 5 is fixed at a predetermined position of the ejector 4. The transport direction is the left-right direction in the drawing. Next, as shown in FIG. 2B, the collet 1 for adsorbing the semiconductor chip 2 is lowered to approach several hundred μm. Next, as shown in FIG. 3C, the semiconductor chip 2 adhered to the mounting sheet 5 is pushed up to a position where the semiconductor chip 2 is coupled to the inside of the collet 1 by a plurality of (for example, four) pushing pins 3, and from the inside of the collet 1. It is adsorbed by the vacuum pressure. By raising the push-up pin 3 and the collet 1 in this state while synchronizing with each other, the semiconductor chip 2 is separated from the mounting sheet 5 in a stable state as shown in FIG. Absorb and finally the same figure
The collet 1 which adsorbs the semiconductor chip 2 as shown in FIG.
Is raised and moved to a predetermined position, and is mounted on a lead frame (not shown), and at the same time, the push-up pin 3 is lowered and returns to the state shown in FIG. Prepare.

As described above, according to the present embodiment, the semiconductor chip is pushed up to the position where it is coupled into the collet, and is lifted up by the push-up pin while being sucked into the collet. Because it is configured, the semiconductor chip is peeled off from the mounting sheet in a stable state, and at the same time, is firmly adsorbed inside the collet, damaging the semiconductor chip surface as in the past, and mounting it on the lead frame In this case, the problem that the positional accuracy is lowered is solved, and the yield and quality of die bonding can be improved.

[0010]

As described above, according to the present invention, the semiconductor chip can be accurately attracted to the inside of the collet, so that the productivity can be improved and the yield and quality of die bonding can be improved. The effect is obtained.

[Brief description of the drawings]

FIG. 1 is a side view schematically showing a configuration of main parts and an outline of operation steps in an embodiment of a push-up device in a die bonder of the present invention.

FIG. 2 is a side view schematically showing a configuration of a main part of a push-up device in a conventional die bonder and an outline of operation steps thereof.

[Explanation of symbols]

1. Collet, 2. Semiconductor chip, 3. Push-up pin, 4. Ejector, 5. Mounting sheet.

Claims (1)

[Claims] 1. A push-up device for a die bonder which pushes up and peels off a semiconductor chip adhered to a mount sheet, adsorbs the peeled-off semiconductor chip with a collet and die-bonds the semiconductor chip to a mount sheet pushed up by push-up pins. A push-up device for a die bonder, comprising: means for synchronously associating a semiconductor chip that has been adhered with the push-up pin and a collet to lift the semiconductor chip from a mount sheet.