CN208722850U - A kind of chip patch device - Google Patents
A kind of chip patch device Download PDFInfo
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- CN208722850U CN208722850U CN201821616509.9U CN201821616509U CN208722850U CN 208722850 U CN208722850 U CN 208722850U CN 201821616509 U CN201821616509 U CN 201821616509U CN 208722850 U CN208722850 U CN 208722850U
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Abstract
The utility model discloses a kind of chip patch devices, and wherein the chip patch device includes: feed unit, chip transmission unit and chip fitting unit；Feed unit includes material component and at least two take piece hand, and for material component for carrying chip, at least two take piece hand for alternately picking up chip from material component；Chip transmission unit includes a rotatable turntable, and multiple chip adsorption zones are provided on rotatable turntable, and chip adsorption zone is used to adsorb at least two chips for taking piece hand to provide；Chip fitting unit includes paster table and at least two patch hands, and at least two patch hands are for alternately obtaining chip from chip adsorption zone and chip being conformed to the substrate on the paster table.Chip patch device provided by the utility model realizes at least two parallel methods of operation for taking piece hand and at least two patch hands, improves patch efficiency, peomotes the process of chip package and improves the yield of chip.
Description
Technical field
The utility model embodiment is related to chip encapsulation technology more particularly to a kind of chip patch device.
Background technique
Integrated circuit (integrated circuit, IC) industry is the rapid growth point of current global economy development,
In, the progress of semiconductor fabrication process and market propose very high the rapid growth of chip demand to the production efficiency of chip
Requirement, wherein the efficiency of chip package directly affects the speed of production of chip.
It is general by designing and improving encapsulating structure and packaging method or optimization encapsulation in order to improve chip package efficiency
Equipment, including chip patch device.It may include linear transport and carousel transmission side in existing chip patch device
Formula.Wherein, chip to be fit is transmitted by linear transport mode by conveyer belt, and is picked up by manipulator and patch
Operation, the patch device mechanism bulk of the linear transport mode is big, long transmission distance, and patch efficiency is lower；And turntable
Formula transmission mode is usually that manipulator is arranged on turntable, by manipulator rotation pickup, transmission and fitting chip, the patch side
Formula can only once be bonded a chip, patch low efficiency, and be unfavorable for adjusting posture, while turntable knot when manipulator picks up chip
Structure is complicated, volume is big, and the requirement to kinematic axis is also higher.
Utility model content
The utility model provides a kind of chip patch device, to realize expeditiously patch, promote chip package efficiency and
Production efficiency.
In a first aspect, the utility model embodiment provides a kind of chip patch device, comprising: feed unit, chip pass
Defeated unit and chip are bonded unit；
The feed unit includes material component and at least two take piece hand, and the material component is used to carry chip, until
Take piece hand for alternately picking up the chip from the material component described in two few；
The chip transmission unit includes a rotatable turntable, and multiple chip absorption are provided on the rotatable turntable
Area, the chip adsorption zone are used to adsorb described at least two chips for taking piece hand to provide；
The chip fitting unit includes paster table and at least two patch hands, and at least two patch hands are for replacing
The chip is obtained from the chip adsorption zone and chip fitting is located on the substrate on the paster table.
Optionally, piece hand is taken to take piece hand and second to take piece hand, at least two patch handbags including first described at least two
Include the first patch hand and the second patch hand；
The chip patch device further includes chip bit cell, the chip bit cell include feeding contraposition camera,
First takes piece contraposition camera, second to take piece contraposition camera, the first patch contraposition camera and the second patch contraposition camera；
Wherein, the feeding contraposition camera is located above the material component, for determining the institute on the material component
State the position of chip；
Described first takes piece contraposition camera and described second that piece contraposition camera is taken to be respectively used to determine the rotatable turntable
On the chip to be taken position；
The first patch contraposition camera and second patch contraposition camera are respectively used to determine the first patch hand
With second patch obtain the chip on the paster table to patch location.
Optionally, the rotatable turntable includes respectively corresponding described first piece hand, described second is taken to take piece hand, described the
First film releasing position of one patch hand and the second patch hand, the second film releasing position, first take piece position and second to take piece position；Wherein,
Described first takes piece position and described second that piece position is taken to take piece contraposition camera and described second that piece is taken to align camera positioned at described first
Lower section；
The rotatable turntable is successively moved to first film releasing position, described for rotating multiple chip adsorption zones
Second film releasing position, described first take piece position and described second to take piece position；Described first takes piece hand and described second that piece hand is taken also to use
It is placed on the corresponding chip adsorption zone in first film releasing position and second film releasing position in by chip alternating；
The first patch hand and the second patch hand from described first for alternately taking piece position and described second to take piece
The chip is picked up on the corresponding chip adsorption zone in position, and alternately by the chip patch in the substrate on the paster table
On.
Optionally, the multiple chip adsorption zone around the center of the rotatable turntable, equally arrange by circumference, institute
Stating first takes piece position and second film releasing position, first film releasing position and described second to take piece position respectively about described rotatable
The central symmetry of turntable.
Optionally, the rotatable turntable includes wafer-supporting platform and the rotating electric machine with the middle axis connection of the wafer-supporting platform, institute
Rotating electric machine is stated for driving the wafer-supporting platform to rotate；
The wafer-supporting platform includes microscope carrier and the gas circuit slip ring inside the microscope carrier, is provided with multiple cores on the microscope carrier
Piece adsorption zone, the gas circuit slip ring are used to supply vacuum and barotropic gas for the multiple chip adsorption zone.
Optionally, at least one adsorption hole is provided on each chip adsorption zone of the microscope carrier, inside the microscope carrier
The multiple sorption channels be connected respectively with the adsorption hole are provided with, the multiple sorption channel is connected with the gas circuit slip ring.
Optionally, the material component is located at below the wafer-supporting platform；
The feed unit further includes that third takes piece hand and the 4th to take piece hand, and the third takes piece hand and the described 4th to take piece
Hand is that overturning takes piece hand, and described first takes piece hand and described second that piece hand is taken to take piece hand for translation, and the third takes piece hand and institute
State the 4th take piece hand for alternately pick up the chip on the material component and overturn, described first takes piece hand and institute
Stating second takes piece hand to take piece hand and the described 4th to take the chip of piece on hand and alternate translatory for picking up the third respectively
It is placed on the corresponding chip adsorption zone in first film releasing position and second film releasing position.
Optionally, the chip fitting unit further includes a portal frame, the first patch hand and the second patch hand
It is arranged on the portal frame, the portal frame is used to take piece position, described second to take piece position and described wait paste according to described first
Piece position drives the first patch hand and the second patch hand to be horizontally moved and/or vertically move.
Optionally, it is equipped with patch between the two neighboring chip adsorption zone and avoids area, the paster table can described in
The lower section of revolving-turret；
The chip fitting unit further includes a portal frame, and the first patch hand and the second patch hand are arranged in institute
State on portal frame, the portal frame be used for according to described first take piece position, described second take piece position and it is described to patch location drive
It moves the first patch hand and the second patch hand is vertically moved, the first patch hand and the second patch hand are handed over
Area is avoided by the chip patch on the substrate on the paster table for by the patch.
Optionally, described first take piece contraposition camera and described second that piece contraposition camera is taken to be also used to determine described the respectively
One takes piece position and described second takes the deviation angle of the chip on piece position, and the portal frame is also used to be driven according to the deviation angle
The first patch hand and the second patch hand are rotated.
Optionally, the microscope carrier includes suspension part and supporting part, and the thickness of the supporting part is less than or equal to 5mm.
Optionally, described first piece contraposition camera, described second is taken to take piece contraposition camera, first patch contraposition camera
It is fixedly installed on same substrate with second patch contraposition camera.
Optionally, the paster table includes the supporting table for stacking gradually setting, the first sports platform and the first absorptive table；
The supporting table is for carrying first sports platform, first absorptive table and the substrate；
First sports platform makes to wait for patch location to patch regional alignment on the substrate for moving the substrate；
First absorptive table is for adsorbing the substrate.
Optionally, the material component includes the second sports platform, the second absorptive table and thimble unit for stacking gradually setting；
Second sports platform to coring piece for that will be moved to feeding position；
Second absorptive table is described to coring piece for adsorbing；
The thimble unit is used to make described to coring piece disengaging second absorptive table on the feeding position.
Utility model the utility model is by taking piece hand in feed unit setting at least two, in chip fitting unit setting
At least two patch hands take piece hand alternately to pick up chip from material component, and are placed on chip transmission unit by least two
Rotatable turntable chip adsorption zone on, and alternately obtained from the chip adsorption zone after rotation by least two patch hands
Chip simultaneously conforms on the substrate on paster table, solves the serial operation for individually taking piece hand and single patch hand to pick and place with patch
The lower problem of mode patch efficiency realizes at least two parallel methods of operation for taking piece hand and at least two patch hands, can
So that patch speed is double, patch efficiency is improved, promotes the process of chip package, helps to improve the yield of chip.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of chip patch device provided by the embodiment of the utility model；
Fig. 2 is the top view of rotatable turntable in chip patch device shown in FIG. 1；
Fig. 3 is the right view of chip patch device shown in FIG. 1；
Fig. 4 is the schematic top plan view of chip patch device shown in FIG. 1；
Fig. 5 is the partial structural diagram of another chip patch device provided by the embodiment of the utility model；
Fig. 6 is the timing control figure of patch provided by the embodiment of the utility model；
Fig. 7 is the bottom view provided by the embodiment of the utility model for taking piece contraposition camera and patch contraposition camera；
Fig. 8 is a kind of structural schematic diagram of rotatable turntable provided by the embodiment of the utility model；
Fig. 9 is a kind of the schematic diagram of the section structure of microscope carrier provided by the embodiment of the utility model；
Figure 10 is the structural schematic diagram of another chip patch device provided by the embodiment of the utility model；
Figure 11 is the right view of chip patch device shown in Figure 10；
Figure 12 is a kind of structural schematic diagram of microscope carrier provided by the embodiment of the utility model；
Figure 13 is a kind of flow chart of chip pasting method provided by the embodiment of the utility model；
Figure 14 is the flow chart of another chip pasting method provided by the embodiment of the utility model.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples.It is understood that herein
Described specific embodiment is used only for explaining the utility model, rather than the restriction to the utility model.It further needs exist for
It is bright, part relevant to the utility model is illustrated only for ease of description, in attached drawing rather than entire infrastructure.
Fig. 1 is a kind of structural schematic diagram of chip patch device provided by the embodiment of the utility model, and Fig. 2 is shown in Fig. 1
Chip patch device in rotatable turntable top view, Fig. 3 is the right view of chip patch device shown in FIG. 1, with reference to figure
1-3, the chip patch device include: feed unit 10, chip transmission unit 20 and chip fitting unit 30；Feed unit 10 wraps
It includes material component 11 and at least two and takes piece hand 12, for material component 11 for carrying chip 100, at least two take piece hand 12 to be used for
Chip 100 is alternately picked up from material component 11；Chip transmission unit 20 includes a rotatable turntable 21, rotatable turntable 21
On be provided with multiple chip adsorption zones 211, chip adsorption zone 211 is used to adsorb at least two chips 100 for taking the offer of piece hand 12；
It includes paster table 31 and at least two patch hands 32 that chip, which is bonded unit 30, and at least two patch hands 32 from chip for alternately inhaling
Attached area 211 obtains chip 100 and conforms to chip 100 on the substrate 200 on paster table 31.
Below with reference to Fig. 1, the pasting method of the patch device is simply introduced, which includes: at least two
It is a to take piece hand 12 alternately to pick up chip 100 from material component 11 and chip 100 is placed in multiple cores of rotatable turntable 21
On piece adsorption zone 211；Rotatable turntable 21 rotates, and drives multiple chip adsorption zones 211 on rotatable turntable 21 mobile；At least
Two patch hands 32 alternately pick up chip 100 and by 100 patch of chip on paster table 31 from multiple chip adsorption zones 211
On substrate 200.It should be noted that the step of being picked and placed each the step of taking piece hand to be picked and placed and each patch hand
In, after each corresponding movement, rotatable turntable 21 is then once rotated with predetermined angle, by rotatable turntable 21
It is removed by the position for taking piece hand to placed chip, and takes piece position for what the position that placed chip moved to patch hand
It sets, by taking rotatable turntable shown in Fig. 2 includes 12 adsorption zones 211 as an example, the angle that rotatable turntable 21 rotates every time is
30°。
Wherein, take piece hand 12 and patch hand 32 when picking and placing chip and patch, moving process includes horizontal and longitudinal fortune
Dynamic, horizontal movement may include the adjusting of two dimensions of X and Y, and piece hand 12 and patch hand 32 is taken to may be configured as the absorption of suction piece mode
Hand, using whether logical vacuum to realize the pickup of chip 100 and discharges operation.Take the quantity of piece hand 12 and patch hand 32 should not
Less than two, to carry out alternate pick-and-place movement, it is of course also possible to increase, to take piece hand 12 and patch hand 32 be 3 or 4 etc.,
It takes piece hand and patch hand 32 to be alternately carried out pick-and-place by 3 or 4, can be further reduced two and take piece hand or two patches
Interval between piece hand alternating movement increases patch speed.Furthermore it is possible to according to taking piece hand to take piece speed and patch hand sticker piece speed
Ratio is spent, takes the quantity of piece hand and patch hand to select identical to be arranged or is selected as difference.
Chip patch device provided by the embodiment of the utility model, by taking piece hand in feed unit setting at least two,
At least two patch hands are set in chip fitting unit, take piece hand alternately to pick up chip from material component by least two, and
It is placed on the chip adsorption zone of the rotatable turntable of chip transmission unit, and by least two patch hands alternating after rotation
Chip adsorption zone on obtain and chip and conform on the substrate on paster table so that at least two take piece hand that can be handed over simultaneously
Alternately pick and place chip operation, also while alternately patch operates at least two patch hands, solves and individually takes piece hand and single
The problem that patch hand picks and places and the serial arithmetic mode patch efficiency of patch is lower, realizes at least two and takes piece hand and at least two
The parallel method of operation of a patch hand, keeps patch speed double, improves patch efficiency, promotes the process of chip package, has
Help improve the yield of chip.In addition to this, patch hand and chip transmission unit are individually arranged, are picked up convenient for patch hand
Posture is adjusted when chip, grab chips center facilitates accurate patch.
It continues to refer to figure 1, optionally, paster table 31 includes supporting table 311, the first sports platform 312 for stacking gradually setting
With the first absorptive table 313；Supporting table 311 is for carrying the first sports platform 312, the first absorptive table 313 and substrate 200；First
Sports platform 312 be used for move substrate make thereon wait for patch location to patch regional alignment；First absorptive table 313 is for adsorbing lining
Bottom 200.Optionally, material component 11 includes the second sports platform 111, the second absorptive table 112 and thimble list for stacking gradually setting
Member 113, the second sports platform 111 to coring piece for that will be moved to feeding position, and the second absorptive table 112 is for adsorbing to coring piece
100；Thimble unit 113 is used to make to be detached from the second absorptive table 112 to coring piece on feeding position.
Material component 11 and paster table 31 itself can have position locomotive function, specifically, take piece hand from material component
When taking piece on 11, need that piece position to be taken will be moved to coring piece on material component 11 in advance, to take piece hand to be taken
Piece, wherein the first sports platform 111 can carry out horizontal and longitudinal movement.For patch hand by chip patch in paster table 31
On substrate when, the second sports platform 312 is then horizontally moved, and target patch location will be moved to patch location.
Fig. 4 is the schematic top plan view of chip patch device shown in FIG. 1, and with reference to Fig. 1 and Fig. 4, at least two take piece handbag
Including first takes piece 121 and second to take piece hand 122, and at least two patch hands include the first patch hand 321 and the second patch hand 322；
Chip patch device further includes chip bit cell 40, and chip bit cell 40 takes piece pair including feeding contraposition camera 41, first
Position camera 421, second take piece contraposition camera 422, the first patch contraposition camera 431 and the second patch contraposition camera 432；Wherein,
Feeding contraposition camera 41 is located at 11 top of material component, for determining the position of the chip 100 on material component 11；First takes piece
Contraposition camera 421 and second takes piece contraposition camera 422 to be respectively used to determine the position of chip 100 to be taken on rotatable turntable 21
It sets；First patch contraposition camera 431 and the second patch contraposition camera 432 are respectively used to determine the first patch hand 321 and the second patch
Piece 322 obtain chip 100 on paster table 31 to patch location.
200 wafer substrate to be placed on paster table 31 shown in Fig. 1, the first patch hand 321 and the second patch hand alternating
Chip 100 on rotatable turntable 21 on chip adsorption zone 211 is picked up, and the wafer substrate 200 on patch to paster table 31
To in patch location.In addition, second takes piece contraposition camera 422 and the second patch contraposition camera 432 to be located at reference to Fig. 1
First takes the rear of the vertical paper of piece contraposition camera 421 and the first patch contraposition camera 431, therefore is shown in broken lines in figure.
Aligning the determination of camera progress chip position and the determination to patch location can serve as a contrast according to acquisition chip and wafer
The image at bottom is determined according to the alignment mark on chip and wafer substrate.Below with reference to Fig. 1 and Fig. 4, piece hand is taken with first
121 and first for patch hand 321, is simply situated between to the course of work for including the chip patch device of chip bit cell
It continues: firstly, feeding contraposition camera 41 is determined each by the alignment mark being divided on the wafer of chip on material component 11
The position of chip；Then it takes piece hand 121 to pick up chip by first and is placed on the chip adsorption zone 211 of rotatable turntable 21；
And then rotatable turntable 21 is rotated, and keeps multiple chip adsorption zones 211 mobile, first takes piece contraposition camera 421 to align Mr. Yu
One chip adsorption zone 211；Then piece contraposition camera 421 is taken to carry out the position of the chip on the chip adsorption zone 211 by first
It determines, the pickup of chip is carried out by the first patch hand 321；It is determined on paster table 31 finally, the first patch contraposition camera 431 passes through
In wafer substrate 200 to patch location, will be on chip patch to wafer substrate 200 by the first patch hand 321.Chip contraposition is single
Member can during the pick-and-place of chip and patch detection chip position, guarantee take piece hand and patch hand when picking up chip,
Can absorption chip center, effectively avoid situations such as falling off of chip.
Contraposition camera in chip bit cell can carry out the accurate driving of position using devices such as portal frames, to carry out
The determination to patch location of chip position and chip also can be set contraposition camera and fix, by the material group of carrying chip
Part and paster table carry out that accurate position is mobile, with determine chip position and chip to patch location.
In order to which in the case where determining chip position and to patch location, raising takes piece hand and patch hand to pick and place chip and patch
The efficiency of piece, for taking, piece hand and patch hand are picked and placed and the move mode of patch, the utility model embodiment additionally provide one kind
Chip patch device, Fig. 5 are the partial structural diagram of another chip patch device provided by the embodiment of the utility model, ginseng
Fig. 5 is examined, in the chip patch device, rotatable turntable includes respectively corresponding first piece hand 121, second is taken to take piece hand 122, first
First film releasing position 2011 of patch hand 321 and the second patch hand 322, the second film releasing position 2012, first take piece position 2021 and second
Take piece position 2022；Wherein, first take piece position 2021 and second that piece position 2022 is taken to take piece contraposition camera and second to take piece positioned at first
Align the lower section (not shown) of camera；Rotatable turntable 21 is successively moved to for rotating multiple chip adsorption zones 211
One film releasing position 2011, the second film releasing position 2012, first take piece position 2021 and second to take piece position 2022；First takes piece hand 121 and
Two take piece hand 122 to be also used to chip 100 being alternately placed in the corresponding chip in the first film releasing position 2011 and the second film releasing position 2012
On adsorption zone 100；First patch hand 321 and the second patch hand 322 from first for alternately taking piece position 2021 and second to take piece position
Chip 100 is picked up on 2022 corresponding chip adsorption zones 211, and alternately by 100 patch of chip in the substrate 200 on paster table
On.
The chip patch device is due to securing the first film releasing position 2011, the second film releasing position 2012, first taking piece position 2021
Piece position 2022 is taken with second, first piece hand 121, second is taken to take piece hand 122, the first patch hand 321 and the second patch hand 322 at this time
Film releasing position can be fixed and take piece position, reduce first and piece hand 121, second is taken to take piece hand 122,321 and of the first patch hand
Second patch hand 322 carries out film releasing and the position of piece is taken to judge, can improve patch efficiency to a certain extent.It should be noted that
Take piece position 321 and second that the position of piece position 322 is taken to take piece contraposition camera and second that piece is taken to align phase depending on first for first
The position of machine, in order to first take piece contraposition camera and second take piece contraposition camera take piece position 321 and second to take piece position to first
The position of chip is confirmed on 322.
For patch device shown in fig. 5, the utility model embodiment additionally provides a kind of pasting method, and Fig. 6 is this reality
With the timing control figure for the patch that new embodiment provides, continue with reference to Fig. 1, Fig. 5 and Fig. 6, to the patch of the patch device
Piece method is specifically described: where the movement of the suction piece of piece hand and patch hand and film releasing movement is taken to respectively represent pickup and placement
The movement of chip needs to utilize contraposition camera while the first patch hand and the second patch hand carry out suction piece and patch acts
Position is carried out to determine.It may include two periods in a cycle of the patch process, within first time, first takes piece hand
121 pick up chip 100 from material component 11, and second takes piece hand 122 to be placed in the chip 100 picked up from material component 11
Chip adsorption zone 211 corresponding with the second film releasing position 2012, the first patch hand 321 take the corresponding chip in piece position 2021 from first
Chip 100 is picked up on adsorption zone 211, the second patch hand 322 will take on the corresponding chip adsorption zone 211 in piece position 2022 from second
100 patch of chip of pickup is on the substrate 200 on paster table 31；Within the second time, first takes piece hand 121 will be from material group
The chip 100 picked up on part 11 is placed in chip adsorption zone 211 corresponding with the first film releasing position 2011, second take piece hand 122 from
Chip 100 is picked up on material component 11, the first patch hand 321 will take the corresponding chip adsorption zone 211 in piece position 2021 from first
For 100 patch of chip of upper pickup on the substrate 200 on paster table 31, the second patch hand 322 takes 2022 pairs of piece position from second
Chip 100 is picked up on the chip adsorption zone 211 answered.It should be noted that between first time and the second time, rotatable turn
Platform 21 carries out the rotation of predetermined angle, and to meet, chip adsorption zone 211 is corresponding to enter the first film releasing position 2011, the second film releasing position
2012, it first takes piece position 2021 and second takes in piece position 2022, by taking 12 chip adsorption zones shown in Fig. 2 as an example, it includes
In a cycle including two periods, rotatable turntable 21 has rotated 60 °, and hands in two adjacent chip adsorption zones
For placed a piece of chip, while patch hand has alternately picked up two chips on two adjacent chip adsorption zones, and by its
Alternately patch is on the substrate on paster table.The pasting method takes piece hand, second to take piece hand, the first patch hand and for first
The altitude measurement of the pick-and-place chip of two patch hands synchronizes, and realizes the alternating of pick-and-place movement, ensure that chip patch efficiency
It improves.
With continued reference to Fig. 5, optionally, multiple chip adsorption zones 211 are equally justified around the center of rotatable turntable 21
Week arrangement, first take piece position 2011 and the second film releasing position 2022, the first film releasing position 2021 and second take piece position 2012 respectively about
The central symmetry of rotatable turntable 21.
In addition, when fix the first film releasing position 2011, the second film releasing position 2012, first piece position 2021 and second be taken to take piece position
Behind 2022 positions, accordingly, first takes piece contraposition camera, second to take the position of piece contraposition camera also it has been determined that and due to patch
Piece platform can carry out position movement, therefore, the first patch can be aligned to camera and the second patch contraposition camera position also be fixed, therefore
Settable first takes piece contraposition camera, second to take piece contraposition camera, the first patch contraposition camera and the second patch contraposition camera solid
Dingan County is loaded on same substrate.Fig. 7 is provided by the embodiment of the utility model piece contraposition camera and patch contraposition camera to be taken to face upward
View can take piece contraposition camera 421, second that piece contraposition camera 422, the first patch is taken to align camera 431 with reference to Fig. 7 by first
With the second patch contraposition 432 compact layout of camera on same substrate 44, and will using low-expansion invar material into
Row production guarantees that chip bit cell in operation process, will not cause between each camera because of board variation of ambient temperature
Temperature drift is excessive.
For the structure of the rotatable turntable in chip transmission unit, the utility model embodiment provides a kind of rotatable
Turntable, Fig. 8 is a kind of structural schematic diagram of rotatable turntable provided by the embodiment of the utility model, with reference to Fig. 8, rotatable turntable
21 include wafer-supporting platform 22 and the rotating electric machine 23 with the middle axis connection of wafer-supporting platform 22, and rotating electric machine 23 is for driving 22 turns of wafer-supporting platform
It is dynamic；Wafer-supporting platform 22 includes microscope carrier 221 and the gas circuit slip ring 222 inside microscope carrier 221, is provided with multiple chips on microscope carrier 221
Adsorption zone, gas circuit slip ring 222 are used to supply vacuum and barotropic gas for chip adsorption zone.
Fig. 9 is a kind of the schematic diagram of the section structure of microscope carrier provided by the embodiment of the utility model, with reference to Fig. 8 and Fig. 9, microscope carrier
Be provided at least one adsorption hole 2211 on 221 each chip adsorption zone, microscope carrier 221 be internally provided with respectively with adsorption hole 2211
Multiple sorption channels 2212 of conducting, multiple sorption channels 2212 are connected with gas circuit slip ring 222.
Further, in order to reduce first take piece hand and second take piece hand move horizontally distance and the first patch hand and
Second patch hand moves horizontally distance, and the utility model embodiment additionally provides a kind of chip patch device, and Figure 10 is this reality
With the structural schematic diagram for another chip patch device that new embodiment provides, Figure 11 is chip patch device shown in Figure 10
Right view, with reference to Fig. 5, Figure 10 and Figure 11, optionally, material component 11 is located at 22 lower section of wafer-supporting platform；Feed unit further includes
Three take piece hand 123 and the 4th takes piece hand 124, and third takes piece hand 123 and the 4th that piece hand 124 is taken to take piece hand for overturning, and first takes piece
Hand 121 and second takes piece hand 122 to take piece hand for translation, third take piece hand 123 and the 4th take piece hand 124 for alternately pickup material
Chip 100 on component 11 is simultaneously overturn, and first takes piece hand 121 and second that piece hand 122 is taken to take piece for picking up third respectively
Hand 123 and the 4th takes chip 100 and alternate translatory on piece hand 124 to be placed in the first film releasing position 2011 and the second film releasing position 2022
On corresponding chip adsorption zone 211.
Due to third take piece hand 123 and the 4th take piece hand 124 alternating take piece during, first takes piece hand 121 and
Two take piece hand 122 also alternately picking and placing, so as to make full use of the time.And piece spatially is being held into the setting of material component 11
The lower section of platform 22 takes piece hand 123 and the 4th that piece hand 124 is taken to realize the longitudinal displacement of chip, then takes piece by first using third
Hand 121 and second takes piece hand 122 to realize the displacement of chip level, further ensures first and piece hand 121 and second is taken to take piece hand
The shortening of 122 horizontal distance, so as to further improve the efficiency for taking piece.
With continued reference to Fig. 5, Figure 10 and Figure 11, optionally, it further includes a portal frame 33, the first patch that chip, which is bonded unit 30,
Hand 321 and the second patch hand 322 are arranged on portal frame 33, and portal frame 33 is used to take piece position 2021, second to take piece according to first
Position 2022 and the first patch hand 321 and the second patch hand 322 is driven to be horizontally moved and/or vertically move to patch location.
Wherein, although the chip patch device uses two patch hands, a portal frame 33 is only needed to can be realized pair
The mobile control of the alternating of two patch hands, without horizontal console is respectively set, thus optimizes entire chip patch and sets
Standby space layout reduces the bulk of equipment.And in order to guarantee that the second sports platform stroke is short as far as possible, settable two
Patch hand is responsible for different Chip Areas, is realized by portal frame to the WidFin function of patch hand, meets the patch of different spacing
Piece requirement.
Further, in order to reduce horizontal displacement distance of the patch hand between paster table and rotatable turntable, with reference to figure
5, Figure 10 and Figure 11, settable paster table 31 are located at the lower section of wafer-supporting platform 22, and in order to guarantee that patch hand is picked up from wafer-supporting platform 22
It after coring piece, is not blocked, may be selected paster table 31 and wafer-supporting platform 22 in water by wafer-supporting platform 22 when being placed on paster table 31
It square shifts to install upwards, dislocation distance is to determine the horizontal displacement distance of patch hand.And the movement for patch hand longitudinal direction
Distance, then related with the height of microscope carrier and thickness, with continued reference to Fig. 7, optionally, microscope carrier 221 includes suspension part 2211 and carrying
The thickness in portion 2212, supporting part 2212 is less than or equal to 5mm.
Figure 12 is a kind of structural schematic diagram of microscope carrier provided by the embodiment of the utility model, with reference to Fig. 5, Figure 10-12, more into
One step, patch, which is equipped with, on microscope carrier, between settable two neighboring chip adsorption zone 211 avoids area 212；Portal frame 33 is used for
Piece position 2021, second is taken to take piece position 2022 and to patch location the first patch hand 321 of driving and the second patch hand 322 according to first
Vertically moved, the first patch hand 321 and the second patch hand 322 alternately through patch evacuation area 212 by 100 patch of chip in
On substrate 200 on paster table 31.
Wherein, stage structure shown in Figure 12 is given for example only, and wherein the shape in patch evacuation area 212 may be arranged as
Round, rectangle and polygon etc., the first patch hand 321 and the second patch hand 322 are passed through from patch evacuation area 212 to incite somebody to action
100 patch of chip is on the paster table 31 of 221 lower section of microscope carrier.Obviously, the structure and patch of the microscope carrier 221 provided in this embodiment
Method can carry out horizontal displacement to avoid patch hand, further shorten the patch time of patch hand, improve chip
Patch efficiency.
With continued reference to Fig. 5, Figure 10 and Figure 12, optionally, first takes piece contraposition camera 421 and second that piece is taken to align camera
422 are also used to determine that first takes piece position 2011 and second to take the deviation angle of chip 100 on piece position 2022 respectively, and portal frame 33 is also used
It is rotated according to the deviation angle the first patch hand 321 of driving and the second patch hand 322.
Wherein, the first patch hand 321 and the second patch hand 322 at least have the movement of 3 small strokes of freedom degree, Neng Goushui
Patch movement is completed in the mobile pickup chip of flat two-freedom and longitudinal movement, and first takes piece hand and second that piece hand is taken to exist
When chip is placed on microscope carrier, the posture of chip is simultaneously not fixed, it is understood that there may be certain deviation angle, it is therefore desirable in patch hand
The deviation angle of chip is adjusted before patch, therefore patch hand is set and has rotation function, can more accurately adjust the posture of chip,
Guarantee the Anawgy accuracy of chip.
The utility model embodiment additionally provides a kind of chip pasting method, and Figure 13 is provided by the embodiment of the utility model
A kind of flow chart of chip pasting method, with reference to Figure 13, which uses provided by the embodiment of the utility model
It anticipates a kind of chip patch device, comprising:
S110, at least two take piece hand alternately to pick up chip from material component and chip are placed in rotatable turntable
On multiple chip adsorption zones；
S120, the rotation of rotatable turntable, drive multiple chip adsorption zones on rotatable turntable mobile；
S130, at least two patch hands alternately pick up chip and by chip patch in paster table from multiple chip adsorption zones
On substrate on.
Wherein, during normal patch, at least two take the alternating of piece hand and at least two patch hands to pick and place chip
Movement can be synchronization and carry out ground, and at least two take the pick-and-place of piece hand, the pick-and-place of at least two patch hands alternately
Mode also include at least two kinds；In alternation method as illustrated in the time chart of FIG. 6, for taking piece hand, first takes piece hand to inhale
After piece, second takes piece hand to carry out film releasing movement again, then first take piece hand carry out film releasing movement, finally by second take piece hand into
The movement of row suction piece, so far completes a cycle；It is of course also possible to which first is taken, the suction piece of piece hand is acted and second takes putting for piece hand
Piece movement carries out simultaneously, i.e., in one cycle, first while take piece hand suction piece, and second takes the progress film releasing movement of piece hand, after
And first takes piece hand carrying out film releasing movement, while taking piece hand to carry out suction piece movement by second.Similarly, for the friendship of patch hand
It is also possible to alternately pick and place for ways of carrying out, is also possible to be picked and placed simultaneously.
Chip pasting method provided by the embodiment of the utility model takes piece hand alternately from material component by least two
It picks up chip and chip is placed on multiple chip adsorption zones of rotatable turntable；At least two patch hands are alternately from multiple cores
Chip is picked up on piece adsorption zone and chip patch is individually taken into piece hand and single patch hand in solving on the substrate on paster table
The problem lower with the serial arithmetic mode patch efficiency of patch is picked and placed, at least two is realized and takes piece hand and at least two patches
The parallel method of operation of hand, keeps patch speed double, improves patch efficiency, promotes the process of chip package, helps to mention
The yield of high chip.
Figure 14 is the flow chart of another chip pasting method provided by the embodiment of the utility model, optional with reference to Figure 14
Ground, in chip patch device, at least two take piece hand to take piece hand and second to take piece hand, at least two patch hands including first
Including the first patch hand and the second patch hand；Rotatable turntable includes respectively corresponding first piece hand, second is taken to take piece hand, the first patch
First film releasing position of piece hand and the second patch hand, the second film releasing position, first take piece position and second to take piece position；At this point, chip patch
Method includes:
S210, within first time, first takes piece hand to pick up chip from material component, and second takes piece hand will be from material group
The chip picked up on part is placed in chip adsorption zone corresponding with the second film releasing position, and the first patch hand takes piece position corresponding from first
Chip adsorption zone on pick up chip, the second patch hand will take the chip picked up on the corresponding chip adsorption zone in piece position from second
Patch is on the substrate on paster table；
S210, within the second time, first takes piece hand to be placed in the chip picked up from material component and the first film releasing
The corresponding chip adsorption zone in position, second takes piece hand to pick up chip from material component, and the first patch hand will take piece position from first
For the chip patch picked up on corresponding chip adsorption zone on the substrate on paster table, the second patch hand takes piece position right from second
Chip is picked up on the chip adsorption zone answered.
Note that above are only the preferred embodiment and institute's application technology principle of the utility model.Those skilled in the art's meeting
Understand, the utility model is not limited to specific embodiment described here, is able to carry out for a person skilled in the art various bright
Aobvious variation, readjustment and substitution is without departing from the protection scope of the utility model.Therefore, although passing through above embodiments
The utility model is described in further detail, but the utility model is not limited only to above embodiments, is not departing from
It can also include more other equivalent embodiments in the case that the utility model is conceived, and the scope of the utility model is by appended
Scope of the claims determine.
Claims (14)
1. a kind of chip patch device characterized by comprising feed unit, chip transmission unit and chip are bonded unit；
The feed unit includes material component and at least two take piece hand, and the material component is for carrying chip, at least two
Take piece hand for alternately picking up the chip from the material component described in a；
The chip transmission unit includes a rotatable turntable, is provided with multiple chip adsorption zones on the rotatable turntable,
The chip adsorption zone is used to adsorb described at least two chips for taking piece hand to provide；
The chip fitting unit includes paster table and at least two patch hands, and at least two patch hands are for alternately from institute
Chip adsorption zone is stated to obtain the chip and conform to the chip on the substrate on the paster table.
2. chip patch device according to claim 1, which is characterized in that piece hand is taken to take described at least two including first
Piece hand and second takes piece hand, and at least two patch hands include the first patch hand and the second patch hand；
The chip patch device further includes chip bit cell, and the chip bit cell includes feeding contraposition camera, first
Piece contraposition camera, second is taken to take piece contraposition camera, the first patch contraposition camera and the second patch contraposition camera；
Wherein, the feeding contraposition camera is located above the material component, for determining the core on the material component
The position of piece；
Described first take piece contraposition camera and described second take piece contraposition camera be respectively used to determine on the rotatable turntable to
The position of the chip taken；
The first patch contraposition camera and second patch contraposition camera are respectively used to determine the first patch hand and institute
State the second patch acquisition the chip on the paster table to patch location.
3. chip patch device according to claim 2, which is characterized in that the rotatable turntable includes respectively corresponding institute
Stating first takes piece hand, described second that the first film releasing position of piece hand, the first patch hand and the second patch hand, second is taken to put
Piece position, first take piece position and second to take piece position；Wherein, described first take piece position and described second that piece position is taken to take positioned at described first
Piece aligns camera and described second and takes the lower section of piece contraposition camera；
The rotatable turntable is successively moved to first film releasing position, described second for rotating multiple chip adsorption zones
Film releasing position, described first take piece position and described second to take piece position；Described first take piece hand and described second take piece hand be also used to by
The chip is alternately placed on the corresponding chip adsorption zone in first film releasing position and second film releasing position；
The first patch hand and the second patch hand from described first for alternately taking piece position and described second to take piece position right
The chip is picked up on the chip adsorption zone answered, and alternately by the chip patch on the substrate on the paster table.
4. chip patch device according to claim 3, which is characterized in that the multiple chip adsorption zone can described in
Equally circumference is arranged at the center of revolving-turret, and described first takes piece position and second film releasing position, first film releasing position
Take piece position respectively about the central symmetry of the rotatable turntable with described second.
5. chip patch device according to claim 3, which is characterized in that the rotatable turntable include wafer-supporting platform and with
The rotating electric machine of the middle axis connection of the wafer-supporting platform, the rotating electric machine is for driving the wafer-supporting platform to rotate；
The wafer-supporting platform includes microscope carrier and the gas circuit slip ring inside the microscope carrier, and multiple chips are provided on the microscope carrier and are inhaled
Attached area, the gas circuit slip ring are used to supply vacuum and barotropic gas for the multiple chip adsorption zone.
6. chip patch device according to claim 5, which is characterized in that on each chip adsorption zone of the microscope carrier
It is provided at least one adsorption hole, the microscope carrier is internally provided with the multiple sorption channels be connected respectively with the adsorption hole, institute
Multiple sorption channels are stated to be connected with the gas circuit slip ring.
7. chip patch device according to claim 5, which is characterized in that the material component is located under the wafer-supporting platform
Side；
The feed unit further includes that third takes piece hand and the 4th to take piece hand, and the third takes piece hand and the described 4th to take the piece hand to be
Overturning takes piece hand, and described first takes piece hand and described second that piece hand is taken to take piece hand for translation, and the third takes piece hand and described the
Four take piece hand for alternately pick up the chip on the material component and overturn, described first takes piece hand and described the
Two take piece hand to take piece hand and the described 4th to take the chip of piece on hand and alternate translatory placement for picking up the third respectively
In on the corresponding chip adsorption zone in first film releasing position and second film releasing position.
8. chip patch device according to claim 3, it is characterised in that:
The chip fitting unit further includes a portal frame, and the first patch hand and the second patch hand are arranged in the dragon
On door frame, the portal frame be used for according to described first take piece position, described second take piece position and it is described to patch location drive institute
It states the first patch hand and the second patch hand is horizontally moved and/or vertically moves.
9. chip patch device according to claim 3, it is characterised in that:
It is equipped with patch between the two neighboring chip adsorption zone and avoids area, the paster table is located under the rotatable turntable
Side；
The chip fitting unit further includes a portal frame, and the first patch hand and the second patch hand are arranged in the dragon
On door frame, the portal frame be used for according to described first take piece position, described second take piece position and it is described to patch location drive institute
It states the first patch hand and the second patch hand is vertically moved, the first patch hand and the second patch hand are alternately logical
Patch evacuation area is crossed by the chip patch on the substrate on the paster table.
10. chip patch device according to claim 8 or claim 9, which is characterized in that described first takes piece contraposition camera and institute
Stating second takes piece contraposition camera to be also used to determine that described first takes piece position and described second to take the inclined of the chip on piece position respectively
To angle, the portal frame is also used to drive the first patch hand and the second patch hand to be revolved according to the deviation angle
Turn.
11. chip patch device according to claim 5, which is characterized in that the microscope carrier includes suspension part and supporting part,
The thickness of the supporting part is less than or equal to 5mm.
12. chip patch device according to claim 2, which is characterized in that described first takes piece contraposition camera, described the
Two take piece contraposition camera, first patch contraposition camera and second patch contraposition camera to be fixedly installed in same substrate
On.
13. chip patch device according to claim 1, which is characterized in that the paster table includes stacking gradually setting
Supporting table, the first sports platform and the first absorptive table；
The supporting table is for carrying first sports platform, first absorptive table and the substrate；
First sports platform makes to wait for patch location to patch regional alignment on the substrate for moving the substrate；
First absorptive table is for adsorbing the substrate.
14. chip patch device according to claim 1, which is characterized in that the material component includes stacking gradually to set
The second sports platform, the second absorptive table and the thimble unit set；
Second sports platform to coring piece for that will be moved to feeding position；
Second absorptive table is described to coring piece for adsorbing；
The thimble unit is used to make described to coring piece disengaging second absorptive table on the feeding position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821616509.9U CN208722850U (en) | 2018-09-30 | 2018-09-30 | A kind of chip patch device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821616509.9U CN208722850U (en) | 2018-09-30 | 2018-09-30 | A kind of chip patch device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208722850U true CN208722850U (en) | 2019-04-09 |
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ID=65983041
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821616509.9U Active CN208722850U (en) | 2018-09-30 | 2018-09-30 | A kind of chip patch device |
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| Country | Link |
|---|---|
| CN (1) | CN208722850U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110176425A (en) * | 2019-05-05 | 2019-08-27 | 南宁聚信众信息技术咨询有限公司 | It is a kind of to grab firm energy-saving chip picking-up apparatus |
| CN110970322A (en) * | 2018-09-30 | 2020-04-07 | 上海微电子装备（集团）股份有限公司 | Chip mounting equipment and chip mounting method |
| CN110970322B (en) * | 2018-09-30 | 2024-07-09 | 上海微电子装备（集团）股份有限公司 | Chip mounting equipment and chip mounting method |
-
2018
- 2018-09-30 CN CN201821616509.9U patent/CN208722850U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110970322A (en) * | 2018-09-30 | 2020-04-07 | 上海微电子装备（集团）股份有限公司 | Chip mounting equipment and chip mounting method |
| CN110970322B (en) * | 2018-09-30 | 2024-07-09 | 上海微电子装备（集团）股份有限公司 | Chip mounting equipment and chip mounting method |
| CN110176425A (en) * | 2019-05-05 | 2019-08-27 | 南宁聚信众信息技术咨询有限公司 | It is a kind of to grab firm energy-saving chip picking-up apparatus |
| CN110176425B (en) * | 2019-05-05 | 2021-12-10 | 深圳市迪科贝科技有限公司 | Energy-saving chip picking equipment firm in grabbing |
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