CN108701633A - Transfer tool model and the element processor with the transfer tool model - Google Patents

Transfer tool model and the element processor with the transfer tool model Download PDF

Info

Publication number
CN108701633A
CN108701633A CN201780012722.0A CN201780012722A CN108701633A CN 108701633 A CN108701633 A CN 108701633A CN 201780012722 A CN201780012722 A CN 201780012722A CN 108701633 A CN108701633 A CN 108701633A
Authority
CN
China
Prior art keywords
transfer tool
pick
loading part
rotary shaft
tool model
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780012722.0A
Other languages
Chinese (zh)
Inventor
柳弘俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JT Corp
Original Assignee
JT Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JT Corp filed Critical JT Corp
Publication of CN108701633A publication Critical patent/CN108701633A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles

Abstract

The present invention relates to element processors, are related to the loading part pickup device from the wafer central for being mounted with multiple element etc. in more detail and unload element.The invention discloses a kind of element processors, including:Loading part workbench (200) receives loading part (60) from the loading part card lock portion (100) for the multiple loading parts (60) for being mounted with attachment multiple element (1) and moves the loading part (60) in the horizontal direction;Uninstalling portion (300), separate configuration in the horizontal direction respectively from the loading part workbench (200), and it is provided with unloading component (70), wherein the uninstalling portion part (70) is from loading part (60) receiving element (1) and loads the element (1);Transfer tool model (500), in take-off location (P1) from the loading part (60) pickup device (1), element (1) is unloaded to the unloading component (20) in the unloading position (P2) of each uninstalling portion (300).

Description

Transfer tool model and the element processor with the transfer tool model
Technical field
The present invention relates to element processors, are related to transferring tool model in more detail and have the transfer tool model Element processor, the transfer module from the loading parts such as wafer central for being mounted with multiple element pickup device and unloads member Part.
Background technology
In general, the semiconductor elements such as DRAM, flash memory, LSI, LED (hereinafter referred to as " element "), is completed It completes to launch to market after Sawing Process, technology of the package etc. after semiconductor technology.
In addition, with the diversification of the terminal structures such as the lead frame of element, BGA, the type of chip also becomes diversification.
Moreover with the development of the hand works such as nanometer technology, semiconductor element is being in whole size than existing The trend that element is reduced significantly.
In addition, according to the development of smart mobile phone and the ultrathin trend of smart mobile phone, suitable for smart mobile phone, intelligence In the case of wrist-watch etc., the size for being not only element also requires thickness to minimize.
In order to meet above-mentioned trend and requirement, such as registered patent the 10-1088205th, semiconductor element makes With following described WL-CSP (Wafer level chip scale pacake, wafer chip level chip-scale package):In wafer Individual component is packaged by Sawing Process after level execute encapsulation technique, to replace utilizing bonder after Sawing Process Pass through the execute encapsulations techniques such as injection molding.
On the other hand, when forming WL-CSP elements, in the case where forming miniaturized component, ball end is formed in wafer level There are significant limitations for son, therefore there are problems that being difficult executive component manufacturing process.
Accordingly, for the element of completion semiconductor technology, it is proposed that so-called Fan-Out WLP techniques specifically execute saw Injection molding is executed to individual component after cutting process, forms terminal etc..
On the other hand, such as, SD memories, mobile phone SD memories, such as LSI for collecting CPU semi-conductor market in, With intensified competition, very there is an urgent need to save element manufacturing cost and finally improve productivity.
In addition, being to execute technique in dust free room, and execute each technique in dust free room for the production of semiconductor The processing speed of device has with productivity directly to be contacted, therefore for being unloaded without technology of the package or in wafer level before The element processor raising device processing speed for carrying element is also extremely important.
Especially, when producing semiconductor, the element processor for unloading element in wafer level improves device processing Speed is also extremely important.
But the structure that the element processor of element is unloaded in wafer level is as follows:From completion semiconductor technology and saw After the wafer central pickup device of cutting process, it is loaded into the loading part such as carried, to unload element from wafer central.
Here, from wafer central pickup device, by the way that element to be placed on to the treating capacity of loading part (such as, carrying), certainly Determine the processing speed (in general, calculating processing number (UPH) hourly) of element processor.
Specifically, for the processing speed of element processor, by by video camera recognition component and wafer central with pick up Component pick-up efficiency on the wafer centrals such as the position correction of device, the efficiency of backward loading part loading member of pickup is taken to determine.
In addition, for the processing speed of element processor, by picking up from the wafer central pickup device for being attached with multiple element Accuracy, pickup velocity is taken to determine processing speed.
On the other hand, element processor has the following problems:Even if processing speed is fast, if the space that device occupies is big, Then in the presence of the occupancy efficiency that can reduce device.
Invention content
(solving the problems, such as)
As described above in order to solve the problems, such as, the purpose of the present invention is to provide can be from the rapid pickup device of wafer with aobvious The transfer tool model for writing the processing speed for improving device and the element processor with the transfer tool model.
(means solved the problems, such as)
The present invention is proposed to reach purpose present invention as described above, at a kind of element Device is managed, including:Loading part workbench 200, from the loading part card for the multiple loading parts 60 for being mounted with attachment multiple element 1 Lock portion 100 receives loading part 60 and moves the loading part 60 in the horizontal direction;Uninstalling portion 300, from the loading part Workbench 200 separates configuration in the horizontal direction respectively, and is provided with unloading component 70, wherein the uninstalling portion part 70 is from loading 60 receiving element 1 of component simultaneously loads the element 1;Tool model 500 is transferred, in take-off location P1 from the loading part 600 Element 1 is taken, element 1 is unloaded to the unloading component 20 in the unloading position P2 of each uninstalling portion 300.
The transfer tool model 500 may include:The first rotary driving part 10 with the first rotary shaft 11;Multiple pickups Device 20 is combined along radial direction with first rotary shaft 11, and simultaneously along the configuration of the circumferencial direction of first rotary shaft 11 It is pivoted about with first rotary shaft 11;Second rotary driving part 30 has vertical with first rotary shaft 11 The second rotary shaft 31, and centered on second rotary shaft 31 by first rotary driving part 10 with it is described second revolve Second rotary driving part 30 rotated centered on shaft 31.
The setting number of the multiple pick-up 20 is preferably 2n (n is natural number).
The transfer tool 500 may include:First transfer tool 510, in take-off location P1 pickup devices 1;Second transfer Tool 520 unloads element 1 from the first transfer 510 receiving element of tool in unloading position P2.
The first rotary shaft 11 and the second rotary shaft 31 of the first transfer tool 510 transfer tool with second respectively 520 the first rotary shaft 11 and the second rotary shaft 31 are mutually parallel configuration, the pick-up of connection the first transfer tool 510 The dummy line L of the rotation center O for the pick-up 20 that 20 rotation center O transfers tool 520 with described second is moved with described first Send the first rotary shaft 11 and the second rotary shaft 31 of tool 510 vertical, from the pick-up 20 of the first transfer tool 510 to described The pick-up 20 of second transfer tool 520 conveys the reception and registration position P3 of element 1 that can be located at the described first pickup for transferring tool 510 Between the rotation center O of the pick-up 20 of the rotation center O of device 20 and the second transfer tool 520.
The first transfer tool 510 and the second transfer tool 520 mutually removably combine.
The first transfer tool 510 and the second transfer tool 520 can be separated from each other and move, described In the case of overturning being not necessarily to when unloading component loading member, the first transfer tool 510 and the second transfer tool 520 In pickup device 1 successively in order the take-off location P1, and then element 1 can be loaded into unloading component in unloading position P2 70。
The present invention may also include image acquiring device 90, and setting obtains described in the second transfer tool, 520 side The back side image for the element 1 that pick-up 20 picks up.
The present invention may also include image acquiring device 80, and setting is obtained in the first transfer tool, 510 side by first The back side image for the element 1 that the pick-up 20 of transfer tool 510 picks up.
The uninstalling portion 300 is provided at least two, the shifting near the loading part workbench 200 Tool model 500 is sent to may be provided at least two, to correspond respectively at least two uninstalling portion 300.
At least two uninstalling portion 300 may include mutually relatively setting centered on the loading part workbench 200 The first uninstalling portion 300 and the second uninstalling portion 300 set, at least two transfers tool model 500 may include:First transfer Tool model 500 transfers element 1 between the loading part workbench 200 and first uninstalling portion 300;And the Two transfer tool models 500, transfer element 1 between the loading part workbench 200 and second uninstalling portion 300.
At least two uninstalling portion 300 may include:First uninstalling portion 300 is base with the loading part workbench 200 Quasi- setting is in 200 front of the loading part workbench;At least one second uninstalling portion 300, with the loading part workbench At least side in the left side and right side of the loading part workbench 200 is set on the basis of 200;Described at least two move The tool model 500 is sent to include:First transfer tool model 500, in the loading part workbench 200 and first unloading Element 1 is transferred between portion 300;Second transfer tool model 500, is unloaded in the loading part workbench 200 and described second Element 1 is transferred between load portion 300.
The loading part 60 includes the band of attachment multiple element 1, and the transfer tool 500 may include:Multiple pick-ups 20, pick up the element 1 for being attached to the loading part 60 successively in order in the take-off location P1;Pick-up moving portion is Making the multiple pick-up 20, pickup is attached to the element 1 of the loading part 60 successively in order, by moving in rotation and At least one of linear movement move mode is moved to the take-off location P1 in order;And it may include the first linear movement At least one of portion 623 and the second linear movement portion 622, wherein the First Line moving portion 623 is linear along X-direction The mobile transfer tool model 500, second linear movement portion 622 described in Y direction linear movement along transferring tool mould Block 500.
The transfer tool model 500 may also include at least one image acquiring device, obtains and passes through the pick-up 20 The back side image of the element 1 of pickup.
Element processor according to the present invention, the image obtained by described image acquisition device are stored in composition control unit A part memory, and each pick-up 20 complete pickup device 1 after be moved to the unloading position P2 or When person is used to convey the reception and registration position of element to other transfer tool models, control unit can be made to complete image analysis.
(The effect of invention)
Transfer tool model according to the present invention and element processor with the transfer tool model have as follows Advantage:By such as, the multiple pick-ups of wafer central rotated centered on the rotary shaft parallel with the upper surface of loading part are constituted Tool model is transferred, and then when executing placement and pickup device, disposably can pick up and place a large amount of element, therefore Element discharge rate can be significantly improved.
Especially, transfer tool model according to the present invention and the element processor with the transfer tool model have Following advantage:From being attached with such as, blue film, wafer central multiple element loading part pickup device when, individually Pickup device, wherein by multiple to be picked up with what is such as, rotated centered on the parallel rotary shaft of the upper surface of loading part of wafer central It takes device to constitute transfer module, and then during the pickup of executive component and placement, disposably can pick up and place and is big The element of amount, therefore element discharge rate can be significantly improved.
In addition, being to move according to transfer tool model according to the present invention and the element processor with the transfer module It send tool model to be composed of a pair, i.e., is made of the first transfer tool model and the second transfer tool model, Jin Er Element can be loaded into the unloading component of such as band and disk after pickup and flip element, plurality of pick-up with it is all Such as, it is rotated centered on the parallel rotary shaft of the upper surface of loading part of wafer central.
Specifically, in the case where needing flip element, it, will be by first by the first transfer tool model pickup device The element of transfer tool model pickup is received to be loaded into such as by the second transfer tool model, the unloading component of band and disk, into And element can be loaded into after pickup and flip element such as, the unloading component of band and disk.
Here, the first transfer tool model and the second transfer tool model separably combine, member is not being needed In the case that part is overturn, the first transfer tool model and the second one in the block of tool mould of transfer are only used, is needing to overturn In the case of element, be combined with each other the first transfer tool model and second transfer tool model, and then pickup and Element can be loaded into such as after flip element, the unloading component of band and disk.
In addition, with the discrete state setting first transfer tool model and the second transfer tool model, and then needing It, will be by the member of the first transfer tool model pickup by the first transfer tool model pickup device in the case of wanting flip element Part is received and is loaded into such as, the unloading component of band and disk by the second transfer tool model, and then in pickup and flip element Element can be loaded into later such as, the unloading component of band and disk.
At this point, in the case where not needing flip element, the first transfer tool model and the second transfer tool model can Independently movement carrys out pickup device, so as to which element is loaded into unloading component.
Needle pin component according to the present invention and the element processor with the needle pin component have the following advantages:Logical When crossing pick-up pickup device, the needle pin main body by being provided with needle pin component makes the band for being attached with element rise for the first time, passes through Needle pin component makes 2 risings of band for being attached with element, and then when by pick-up pickup device, can make the band for being attached with element It is more rapid to rise, and then component pick-up speed can be significantly improved.
In addition, needle pin component according to the present invention and element processor with the needle pin component are with following excellent Point:When by pick-up pickup device, forms vacuum pressure in needle pin component and be tightly attached to the band for being attached with element above, at this It can only be pressurizeed to upside element to be picked up by the pressurization of needle pin component under one state, therefore being capable of steadily executive component Picking task.
Description of the drawings
Fig. 1 is the plan view for the concept for showing element processor according to the present invention.
Fig. 2 a and Fig. 2 b are the exemplary solids that the loading part used in the element processor of Fig. 1 is shown respectively Figure and sectional view.
Fig. 3 is another exemplary stereogram for the loading part for showing to use in the element processor of Fig. 1.
Fig. 4 is the sectional view in IV-IV direction in Fig. 1.
Fig. 5 a are the concept maps of the concept for the transfer tool model for showing that the element processor in Fig. 1 is arranged.
Fig. 5 b are to show that the solid of the concept of the transfer tool model of first embodiment is arranged in the element processor in Fig. 1 Figure.
Fig. 6 is the side view of the transfer tool model of diagram 6.
Fig. 7 is the front elevation for the transfer tool model for showing Fig. 6.
Fig. 8 a are the sides of the transfer tool model of the second embodiment for the transfer tool model modified example for being shown as Fig. 6 Face figure.
Fig. 8 b are the partial plans of the operational process for the transfer tool model for showing Fig. 8 a.
Fig. 9 a are the transfer tool models of the 3rd embodiment of the modified example for the transfer tool model for being shown as Fig. 6 Side view.
Fig. 9 b are the partial plans of the operational process for the transfer tool model for showing Fig. 9 a.
Figure 10 is the plan view of the variation for the element processor for showing Fig. 1.
Specific implementation method
Hereinafter, transfer tool model according to the present invention as described below and element processor with reference to the accompanying drawings.
As shown in Figure 1, element processor according to the present invention includes at least one transfer tool model, the transfer tool Module in take-off location P1 from 60 pickup device 1 of loading part for being mounted with multiple element 1, and in unloading position P2 by element 1 It is offloaded at least one unloading component 70.
Here, element processor according to the present invention may include:Loading part workbench 200, from being mounted with, attachment is multiple The 60 loading part card lock portion 100 of multiple loading parts of element 1 receives loading part 60, and moves loading part in the horizontal direction 60;Uninstalling portion 300 is spaced apart in the horizontal direction from loading part workbench 200, and is provided with from loading part 60 and receives And the uninstalling portion 70 of loading member 1.
Structure of the loading part card lock portion 100 as the multiple loading parts 60 for being mounted with attachment multiple element 1, can With various structures.
Here, being loaded into there are many elements of the loading part 60, specifically there is the completion semiconductor work under wafer state The element of skill and Sawing Process, the element classified by other element processor by visual inspection etc. under wafer state.
Especially, for the element 1, specifically not with the existing element Jing Guo packaging technology after semiconductor technology Together, it is not necessarily to the so-called wafer scale element etc. of packaging technology, can become the element 1 there are many element.
On the other hand, as shown in Fig. 2 a and Fig. 2 b, the loading part 60 as be mounted with complete semiconductor technology with And the structure of the element 1 of Sawing Process, including it is attached with the band 61 of element 1 and the frame parts 62 of fixed band 61.
In addition, for the band 61, as long as capableing of the component of attached component 1, any part all can be used, and can be with Use so-called adhesive tape.
The frame parts 62 can have various structures, specifically as the structure for the fixed band 61 for being attached with element 1 It can be just like circular rings, Q-RING shown in Fig. 3 etc. shown in Fig. 2 a and 2b.
On the other hand, for the unloading component 70, as long as the structure of loading member, any structure can use, And it can be used to launch to market or execute other techniques and the various parts that load temporarily, specifically have as shown in Figure 1 Band and disk (carrier band and cover strip), the plate with adhesive tape as shown in Figure 3, the multiple insertions for being formed with loading member 1 The pallet etc. of slot.
In addition, the unloading component 70 can be used other than the component of interim loading member 1 for chip erector The component of skill, packaging technology specifically has the substrate of such as PCB of such as installation elements 1, band (strip), for manufacturing chip Lead frame (Lead Frame) etc..
The loading part card lock portion 100 is as the structure for loading multiple loading parts 60, as long as can be upper and lower The structure of loading part 60 is laminated, there can be any structure.
The loading part workbench 200 can have various structures, and have following structure:From loading part card lock portion 100 reception loading parts 60 simultaneously move loading part 60 in the horizontal direction.
As an example, the loading part workbench 200 can have various structures, specifically there is X-Y table, X-Y- θ Workbench etc., and 200 structure of loading part workbench is as follows:By wafer central loading part (not shown) from loading part Card lock portion 100 receives loading part 60, and moves loading part 60 in the horizontal direction, so that transfer tool model 500 picks up Element 1.
In addition, the loading part workbench 200 can also be moved with upper and lower directions.That is, Z-direction.
In addition, as shown in Fig. 6 to Fig. 9 a, needle pin component preferably is set in the downside of the loading part workbench 200 600, and then in take-off location P1 successful pickup elements.
The needle pin component 600 can have various structures, and have following structure:In take-off location P1 pick-ups 200 Pressed loading component 60 when taking element 1, for example, the bottom surface of the band 61 of wafer central, raises to 20 side of pick-up and be attached with element 1 Band 61.
It, can as long as the needle pin component 600 includes needle pin component 615 and drives upside down the structure in portion as an example With with any structure, wherein needle pin component 615 is moved up and down in the downside of loading part 60, and the portion of driving upside down is along the vertical direction Mobile needle pin component 615.
On the other hand, image acquiring unit 890 is preferably set, is obtained in the upside of pick-up 20 in the take-off location P1 Take the image for the element 1 for being loaded into loading part 60.
Structure of the described image acquisition unit 890 as the image for obtaining the element 1 for being loaded into loading part 60, can have more Kind structure, specifically there is scanner, video camera etc..
In addition, described image acquisition unit 890 can be flexibly applied to grasp the position by 20 pickup device 1 of pick-up, inspection Look into the upper surface of element 1 etc..
Especially, aftermentioned transfer tool model 500 has multiple pick-ups 20, and preferably several pick-ups 20 are complete Portion's pickup device 1, and obtain the image of multiple element 1.
Accordingly, described image acquisition unit 890 is preferably close to loading part 60, and in order to prevent with transfer tool model 500 interfere, and may be configured as to move horizontally or vertically moving in the top of loading part workbench 200.
On the other hand, the loading part loading part (not shown) is for from the loading part card lock portion 100 to dress It carries component working platform 200 and conveys loading part 60, as long as and it exports loading part 60 from loading part card lock portion 100 and incites somebody to action Derived loading part 60 is conveyed to the structure of loading part workbench 200, can have any structure.
As an example, the loading part loading part can have various structures, specifically have by clamping device linearly to drive Dynamic device is constituted, or the linear actuating device by propeller and for linear movement propeller is constituted.
The uninstalling portion 300 can have various structures, and have following structure:From loading part workbench 200 along water Square to separate be arranged, and be provided with from loading part 60 receive and loading member 1 unloading component 70.
Especially, the uninstalling portion 300 is determined according to the structure of the unloading component 70 of band and disk (carrier band and cover strip) etc. Its structure.
As an example, as shown in Fig. 1 and Fig. 4, the uninstalling portion 300 may include:Uncoiling roller portion 311, along length Degree direction forms after the pocket 71 for being mounted with element 1 and loading member and constitutes unloading with the carrier band sealed with (not shown) In the case of component 70, one end is rotatably disposed in wind the carrier band for waiting for loading member 1;Winding up roller 312 is rotatably disposed in another One end, and wound by the carrier band with sealing after loading member;Guide portion (not shown) is carried, the movement of carrier band is guided, So that the carrier band being unfolded from uncoiling roller portion 311 passes through " loaded " position.
Here, as shown in figure 4, the uninstalling portion 70 can form more emptying apertures 22 in the bottom surface of the pocket 71 equipped with element 1.
In addition, when the unloading component 70 is located at " loaded " position, formed in the setting of lower section straight of unloading component 70 true The vacuum of pneumatics presses generating means 24, being capable of steadily loading member 1 when being loaded by aftermentioned transfer tool model 500.
Here, as shown in figure 4, in the case that the unloading component 70 is carrier band, by order to guide the alar part of carrier band by The guiding of a pair of of roller member 78 of setting and the support member 79 of fixed roller member, may be guided the movement of the carrier band.
As another example of the uninstalling portion 300, the feelings as the plate (with reference to Fig. 3) for being attached with unloading component 70 Condition, uninstalling portion 300 may include:Plate loading part positioned at one end and loads and is attached with the plate of multiple element 1;X-Y table, In " loaded " position movement and support plate, and then by transferring 500 receiving element 1 of tool model;Pallet moving portion (not shown), Plate is conveyed from tray loading portion to X-Y table.
Here, as shown in figure 3, the plate as the structure similar with loading part 60, including:It is attached with element 1 Band;The frame parts of the marks such as LOT numbers, classification grade is indicated while fixed band.Alternatively, as loading member 1 is formed Normalized pallet can be used according to the type of element 1 in the pallet of multiple insertion grooves.That is, JEDEC pallets.
On the other hand, as shown in Figure 1, the uninstalling portion 300 only by element 1 is loaded into carrier band structure 1 310 and Element 1 is loaded into plate structure 2 it is equal in a kind of structure constitute, either structure 1 and structure 2 include 2 or Entire infrastructure.
In addition, at least two identical structures can certainly be arranged in the uninstalling portion 300, specifically have and load element 1 In the structure 1 310 of carrier band, element 1 is loaded into the structure 2 etc. of plate.
For example, at least two structures 1 that element 1 is loaded into carrier band can be arranged in the uninstalling portion 300, as shown in Figure 1, example As 4 structures 1 can also be arranged in parallel.
On the other hand, in order to which from loading part 60, unloading element, the uninstalling portion 300 are preferably in loading part work rapidly Make 200 attachment of platform setting at least two.
That is, as shown in Fig. 1 and Figure 10, element processor according to the present invention may include at least two uninstalling portion 300, point It is not configured from loading part workbench 200 with horizontal direction interval, and simultaneously loading member 1 is received from loading part 60.
At this point, the transfer tool model 500 corresponds respectively at least two uninstalling portion 300, and it is arranged at least two Uninstalling portion 300 is arranged at least two, and then in take-off location P1 from 60 pickup device 1 of loading part, and in each uninstalling portion 300 unloading position P2 unloads element 1 to unloading component 20.
On the other hand, various configurations structure can be had according to configuration at least two uninstalling portion 300.
As an example, as shown in Figure 1, at least two uninstalling portion 300 may include be with loading part workbench 200 The first uninstalling portion 300 and the second uninstalling portion 300 that center is mutually oppositely arranged.
At this point, at least two transfers tool model 500 may include:It is unloaded in loading part workbench 200 and first The first transfer tool model 500 of element 1 is transferred between load portion 300;In loading part workbench 200 and the second uninstalling portion The second transfer tool model 500 of element 1 is transferred between 300.
As another example, as shown in Figure 10, at least two uninstalling portion 300 may include:With loading part workbench The first uninstalling portion 300 in the front of loading part workbench 200 is set on the basis of 200;It is base with loading part workbench 200 More than one second uninstalling portion of side 300 of at least side in the left side and right side of loading part workbench 200 is arranged in standard.
At this point, at least two transfers tool model 500 may include:It is unloaded in loading part workbench 200 and first First transfer tool model 500 of transfer element 1 between load loading part 300;It is unloaded in loading part workbench 200 and second The second transfer tool model 500 of element 1 is transferred between portion 300.
It is described to transfer processing speed of the tool model 500 according to structure determination device, and have the following structure:In pickup position P1 is set from 60 pickup device 1 of loading part for loading multiple element 1, and element 1 is unloaded to unloading component 70 in unloading position P2.
Accordingly, as shown in Fig. 5 a to Fig. 8 b, transfer tool model 500 according to a first embodiment of the present invention may include:Tool There is the first rotary driving part 10 of the first rotary shaft 11;It is combined with the first rotary shaft 11 along radial direction and with the first rotary shaft Multiple pick-ups 20 that 11 circumferencial direction is configured and rotated centered on the first rotary shaft 11;With vertical with the first rotary shaft 11 Straight the second rotary shaft 31, and be with the second rotary shaft 31 by the first rotary driving part 10 centered on the second rotary shaft 31 Second rotary driving part 30 of heart rotation.
First rotary driving part 10, can be by as the structure with the first rotary shaft 11 for combining multiple pick-ups 20 Rotation motor is constituted.
Here, first rotary shaft 11 as by rotation make multiple pick-ups 20 rotate structure, preferably with dress It carries the upper surface of component 60 or the upper surface of unloading component 70 is parallel and vertical with Z axis.
Especially, first rotary shaft 11 can be vertical with Z axis, i.e., parallel with X-axis or Y-axis, more preferably and X-axis Configured in parallel.
Then, the direction of rotation of first rotary shaft 11 can unidirectional or bidirectional rotation etc., according to pick-up 20 The control of direction of rotation can carry out the rotation in various directions.
The multiple pick-up 20 can have various structures, and have following structure:It is rotated along radial direction and first Axis 11 combines, and is configured by the circumferencial direction of the first rotary shaft 11 and rotated centered on the first rotary shaft 11.
The pick-up 20 can be by vacuum pressure from 60 pickup device 1 of loading part.
As an example, the pick-up 20 may include:Interconnecting piece is pressed from the external air for receiving air pressure;It is arranged at end It holds and the pick-up head of pickup device 1 is picked up or released to the air pressure for pressing interconnecting piece to convey by air.
In addition, the multiple pick-up 20 with the first rotary shaft 11 when connecting, it may include rotary supporting part 13.
The rotary supporting part 13 can have as the structure of multiple pick-ups 20 is supported in conjunction with multiple pick-ups 20 Various structures.
As an example, the rotary supporting part 13 can have and (the registered patent 10- of rotary driving part 320 No. 1338182) similar structure.
On the other hand, the setting number of the multiple pick-up 20 is different according to the setting number of unloading component 70, And it can be made of 2n (n is natural number) as an example.
In addition, it is necessary to be carried out to the upper surface of loading part 60 or the upper surface of unloading component 70 for the multiple pick-up 20 Linear movement, and then progress operation can be easy in pickup and placing element 1.
Accordingly, the multiple pick-up 20 can be along radial direction linear movement for the first rotary shaft 11, and can lead to Crossing radial direction moving portion (not shown) can be along radial direction linear movement.
The linear drives are as at least one in the radial direction linear movement pick-up 20 of the first rotary shaft 11 Partial structure can have various structures, specifically have by being contacted along radius with electric and pneumatic brake, with pick-up 20 It pressurizes to set direction and at least part of tank component etc. in linear movement pick-up 20.
In addition, the multiple pick-up 20 is configured centered on the first rotary shaft 11 with 180 °, 90 °, 60 ° etc. of isogonism.
On the other hand, the multiple pick-up 20 is rotated centered on the first rotary shaft 11, and then in order to pickup Device 20 smoothly conveys the rotation of vacuum pressure, while empty by the way that the air of air pressure can be conveyed to press rotary joint that can be received from outside Air pressure.
Second rotary driving part 30 can have various structures, and have following structure:With with the first rotary shaft 11 the second vertical rotary shafts 31, and the first rotary driving part 10 is rotated centered on the second rotary shaft 31.
Second rotary driving part 30, can as the structure with the second rotary shaft 31 and the second rotary shaft 11 of rotation It is made of rotation motor.
In addition, second rotary driving part 30 is by aftermentioned linear movement portion, so that second rotary driving part 30 can move along the x-axis and Y-axis at least one direction movement on the move.
Second rotary shaft 31 has various structures, and has following structure:Support the first rotary driving part 10 into And the first rotary driving part 10 is set to rotate by rotating.
Here, second rotary shaft 31 can the first rotary driving part 10 of variously-shaped support, and combine support the The support member 33 of one rotary driving part 10, and then the first rotary driving part 10 can be supported.
On the other hand, in order to smoothly correct the element 1 picked up by pick-up 20 the directions θ error, i.e., with Z axis be rotation The error of the rotation angle of shaft, second rotary shaft 31 are preferably the rotation center O by multiple pick-ups 20.
On the other hand, the transfer tool model 500 may also include 1 back side image of element for obtaining and being picked up by pick-up 20 Image acquiring device 80,90.
As shown in Fig. 5 a, Fig. 6, described image acquisition device 80,90 is calculated as the back side image for obtaining element 1 by picking up The structure of the horizontal error of the element 1 of the pickup of device 20 is taken, there can be the various structures such as scanner, video camera.
Here, the back side image that described image acquisition device 80,90 can also be flexibly applied to analysis element 1 is come to element 1 The back side executes visual inspection.
In view of stopping the rotation of pick-up 20 in pickup device, combining the case where transferring tool model with as described below Lower and other component interference, the installation position for described image acquisition device 80,90 are preferably with the rotation of pick-up 20 On the basis of direction pickup device either loading member when with compared to the pick-up positioned at take-off location P1 or unloading position P2 20 further to the opposite position of the pick-up 20 of rear side setting.
Specifically, in pickup device either loading member by picking up positioned at take-off location P1 or unloading position P2 When device 20 being taken to be known as No. 1, in the case where 4 pick-up 20 are arranged in rear cis-position position, it is located at No. 2, No. 3 and No. 4 pick-ups, Being preferably located at No. 2 or No. 4, (setting that the case where No. 3 pick-ups had better not improve the second rotary driving part 30 is high Degree), more preferably it is located at No. 4 pick-ups.
As shown in Figure 1, according to the transfer tool model 500 of first embodiment with structure as described above, such as In take-off location P1 on the loading part 60 of wafer central after pickup device 1, it is moved to spaced from loading part 60 Component 70 is unloaded, element 1 is loaded into unloading position P2.
Accordingly, the transfer tool model 500 is on the basis of the configuration direction of " loaded " position P1 and unloading position P2, example Such as with Y direction, furtherly along X-direction and Y direction linear movement.
In addition, the transfer tool model 500 may be provided with multiple, specifically mutually it is oppositely disposed in a pair etc..
For this purpose, the element processor may include:In order to transfer the Linear Driving of tool model 500, support and along X-axis side The first linear moving portion 623 of tool model 500 is transferred to linear movement;It supports and linear with Y direction linear movement first Second linear movement portion 622 of moving portion 623.
The first linear moving portion 623 can have various structures, and have following structure:In order to transfer tool model 500 Linear Driving supports and transfers tool model 500 along X-direction linear movement.
Second linear movement portion 622 is as support and along the knot of the first linear moving portion 623 of Y direction linear movement Structure can have various structures, can specifically have guide rail etc..
The first linear moving portion 623 and the second linear movement portion 622 also may make up X-Y robots certainly.
On the other hand, the transfer tool model 500 is preferably pick-up 20 pickup device all in take-off location P1 1。
Then, the transfer tool model 500 is in order in the smooth loading members of unloading position P2 and positioned at unloading position P2 When, it is preferably vertical with the unloading moving direction of component 70 as the first rotary shaft 11 of the rotary shaft of pick-up 20.
In addition, for the transfer tool model 500, in the case of multiple unloading 70 configured in parallel of component, in order to The smooth loading members of unloading position P2 and positioned at unloading position P2 when, the first rotary shaft 11 of the rotary shaft as pick-up 20 can It is parallel with the unloading moving direction of component 70.
On the other hand, when being loaded into unloading component 70 after pickup device 1, there are elements 1 to be reversed loading, that is, exists It is necessary to overturn loading.
Accordingly, transfer tool model is with transfer tool model according to first embodiment, that is, the structure of Fig. 5 a to Fig. 7 is Basic structure can carry out various modifications, and multiple basic structures are specifically arranged.Here, transfer according to first embodiment When tool model combines, at least part in the structure of deformable Fig. 5 a to Fig. 7.
For example, as shown in Fig. 8 a and 8b, transfer tool model 500 according to a second embodiment of the present invention may include having First transfer tool model 510 of the structure shown in Fig. 5 a to Fig. 7 is moved with second in the structure shown in Fig. 5 a to Fig. 7 Send tool model 520.
That is, as shown in Fig. 8 a and Fig. 8 b, transfer tool model 500 according to the second embodiment of the present invention may include: First transfer tool 510, as transfer tool model according to first embodiment, in take-off location P1 pickup devices 1;Second moves Tool 520 is sent, as transfer tool model according to first embodiment, from 510 receiving element 1 of the first transfer tool and is being unloaded Position P2 unloads element 1.
At this point, the first rotary shaft 11 and the second rotary shaft 31 of the first transfer tool 510 are transferred with second respectively The first rotary shaft 11 and the second rotary shaft 31 of tool 520 are mutually parallel configuration.
In addition, the transfer tools 520 of rotation center O and second of the pick-up 20 of connection the first transfer tool 510 The first rotary shaft 11 and the second rotary shaft 31 of the transfer tools 510 of the dummy line L of the rotation center O of pick-up 20 and first are hung down Directly.
In addition, conveying member to the pick-up 20 of the second transfer tool 520 from the pick-up 20 of the first transfer tool 510 The reception and registration position P3 of part 1, positioned at the rotation center O of pick-up 20 and the picking up for the second transfer tool 520 of the first transfer tool 510 It takes between the rotation center O of device 20.
Then, the first transfer tool 510 and the second transfer tool 520 constitute one as the state being fixed to each other Module.
Here, tool 520 is transferred for the first transfer tool 510 and second, without flip element the case where Under, one in the first transfer tool 510 of separation and the second transfer tool 520 uses as transfer tool model, is needing In the case of wanting flip element, make as transfer tool model in conjunction with the first transfer tool 510 and the second transfer tool 520 With.
It is obtained in addition, at least one of the first transfer tool 510 and second transfer tool 520 further include image Device 90, the image acquiring device 90 obtain the back side image of the element 1 picked up by pick-up 20.From passing through image acquiring device The site error in element 1 to be unloaded unloading position P2 can be calculated in 90 acquisition images.
As described above, it is considered that the member to be unloaded in unloading position P2 can be calculated by obtaining image by image acquiring device 90 The site error of part 1, described image acquisition device 90 are preferably arranged on 520 side of the second transfer tool.
At this point, the image acquiring device that setting is separated with image acquiring device 90 can be added in 510 side of the first transfer tool 80, and the image acquiring device 80 for being provided separately can be flexibly applied to obtain and be moved by first compared to calculating position error The back side image for the element 1 that the pick-up 20 of tool 510 picks up is sent, is passed through and is analyzed image and realize visual inspection.
In addition, positioned at the pick-up 20 for conveying the first transfer tool 510 and second of position P3 to transfer tool 520 It is arranged with being spaced suitable distance by experiment etc., so that element 1 is smoothly conveyed with falling off without damaged and nothing.
In addition, in order to smoothly convey element to the pick-up 20 of the second transfer tool 520, preferably in the reception and registration position P3 makes the pick-up 20 of the first transfer tool 510 can be to 20 linear movement of pick-up of the second transfer tool 520.
That is, transferring the pick-up 20 of tool 510 to the pick-up of the second transfer tool 520 in the reception and registration position P3 first 20 linear movements, and then the executable pick-up 20 to the second transfer tool 520 smoothly conveys element.
On the other hand, as shown in Fig. 8 a to Fig. 9 b, tool 520 is transferred for the first transfer tool 510 and second Bonding position, preferably connection take-off location P1 and unloading position P2 straight line, that is, configured in order with Y direction First transfer tool 510 and second transfers tool 520.
As shown in Fig. 8 b and Fig. 9 b, moved if configuring the first transfer tool 510 and second in order with Y direction Tool 520 is sent, then displacement distance minimum is improved to the reception and registration speed of element 1, and then the processing speed of device can be improved, Middle displacement distance is after 510 pickup device of the first transfers of take-off location P1 tool by 520 receiving element of the second transfer tool It is moved to the distance of element unloading position P2.
Can be arranged according to the transfer tool model 500 of second embodiment with structure as described above it is at least one, such as A pair of can be set shown in Fig. 1.
At this point, according to the transfer tool model of the second embodiment, be identical with the first embodiment with " loaded " position P1 with And on the basis of the configuration direction of unloading position P2, such as with Y direction, furthermore along X-direction and Y direction line Property movement.
On the other hand, as the another party for overturning loading member 1 when being loaded into unloading component 70 after pickup device 1 Method is used to overturn the method loaded, setting first is separated in the structure of transfer tool model according to second embodiment Transfer tool 510 and second transfers tool 520.
That is, as shown in Fig. 9 a and Fig. 9 b, transfer tool model according to a third embodiment of the present invention may include:First moves Tool 510 is sent, as the transfer tool model of the first embodiment different from second embodiment, in take-off location P1 pickup devices 1, and moved between take-off location P1 and reception and registration position P2;Second transfer tool 520, as according to first embodiment Tool model is transferred, element is unloaded from the first transfer 510 receiving element 1 of tool model and in unloading position P2 conveying position P3 1, and moved between conveying position P3 and unloading position P2.
At this point, the first rotary shaft 11 and the second rotary shaft 31 of the first transfer tool 510 are transferred with second respectively The first rotary shaft 11 and the second rotary shaft 31 of tool 520 are mutually parallel configuration.
In addition, the first transfer tool 510 is transferred to convey element to the second transfer tool 520 close to second When tool 520, the pick-up 20 of the transfer tools 520 of rotation center O and second of the pick-up 20 of connection the first transfer tool 510 Rotation center 0 dummy line L with first transfer tool 510 the first rotary shaft 11 and the second rotary shaft 31 it is vertical.
On the other hand, described that position P3 is conveyed to transfer tool to second as from the pick-up 20 of the first transfer tool 510 520 pick-up 20 conveys the position of element 1, and the rotation center O and second for being located at the pick-up 20 of the first transfer tool 510 is moved Between the rotation center O for sending the pick-up 20 of tool 520.
Especially, the reception and registration position P3 is between " loaded " position P1 and unloading position P2.
In addition, as shown in figure 9b, the first transfer tool 510 is connecing to convey element to the second transfer tool 520 When nearly second transfer tool 520, the first transfer tool 510 and second transfers tool 520 in state as illustrated in fig. 9.
Here, as described in the second embodiment, conveyed position P3 first transfer the pick-up 20 of tool 510 in order to Smoothly convey element to the pick-up 20 of the second transfer tool 520, can preferably make the pick-up 20 of the first transfer tool 510 to 20 linear movement of pick-up of second transfer tool 520.
That is, pickup of the pick-up 20 of the first transfer tool 510 to the second transfer tool 520 in the reception and registration position P3 20 linear movement of device, and then can smoothly execute and convey element to the pick-up 20 of the second transfer tool 520.
On the other hand, comprehensive embodiment as described above, the invention discloses following structures.
Background according to the present invention, such as, wafer central is when from 60 pickup device 1 of loading part, because of needle pin component The limitation of structure just has recognized the need to the problem of picking up each element 1 respectively one by one, wherein loading member 60 from beginning It includes the band for being attached to multiple element 1 to include.
Because this element 1 pick up quantity limitation, limitation from the loading part 60 of such as wafer central to such as band and Disk (T&R unloading component 70) unloads the speed of element.Then, for restriction element discharge rate, semiconductor element etc. is reduced Speed of production, and then to improve yield play the role of limitation.
Accordingly, transfer tool model according to the present invention is characterized in that, is picked up from loading part 60 in take-off location P1 At least two element 1 preferably picks up multiple element 1, is moved to unloading position P2 later to unloading positioned at unloading position P2 It carries component 70 and unloads element 1, wherein loading part 60 includes the band of attachment multiple element 1.Here, for the take-off location P1, by 2 transfer tool models from unloading element 1 to unloading component 70 successively in order of loading part 60, Can the take-off location P1 be replaced by the reception and registration position of other transfer tool models.
The transfer tool model is characterized in that including multiple pick-ups 20, in order pickup device 1 successively, and then is picking up Fetch bit sets P1 and specifically picks up at least two elements 1 in the part of setting needle pin component 600.
Can be the transfer work shown in Fig. 5 a to Fig. 6 as specific embodiment for transferring tool model as described above Has module.
In addition, as described above, including multiple pick-ups 20 transfer tool model another example in, as long as one A support construction object be arranged multiple pick-ups 20 and each pick-up 20 can the structure of pickup device 1 successively in order, tool There is any structure.
On the other hand, as described above, including the transfer tool model of multiple pick-ups 20, it is located in each pick-up 20 and picks up When P1 is set in fetch bit, in order in the effective pickup device 1 in part for being provided with needle pin component 600, preferably to needle pin component 600 The pick-up 20 is set to linear movement.
In addition, as described above, the transfer tool model including multiple pick-ups 20 makes preferably after pickup device 1 Multiple pick-ups 20 are moved to unloading position P2 as a module or convey position.
On the other hand, as described above, the transfer tool model including multiple pick-ups 20 may also include image acquiring device, The image acquiring device calculates the horizontal error of the element picked up by each pick-up 20 after pickup device 1, and in order to Surface visual inspection of element etc. obtains the back side image of the element 1 picked up by pick-up 20.
Described image acquisition device 90 can have various structures according to function, and have the following structure:Pickup device 1 it The horizontal error of the element picked up by each pick-up 20 is calculated afterwards, in order to which surface visual inspection of element etc. is obtained by pick-up The back side image of the element 1 of 20 pickups.
As an example, the element 1 picked up by each pick-up 20 may occur in which what pick-up 20 picked up in pick process The horizontal error of element 1 can not be properly attached to unloading component 70, therefore beyond horizontal error allowable range It may occur in which and bad problem is installed.
Here, horizontal error refers to the error in the directions X-Y for the element 1 that pick-up 20 picks up in pick process, to base The rotation error in the quasi- directions X-Y, i.e. θ errors etc..
Accordingly, it is necessary to confirm to the horizontal error of the element 1 of pick-up 20 in pick process, especially whether have rotation Error, and then correct the error when being installed to unloading component 70 and carry out installation elements 1.
Therefore, described image acquisition device is picked up to calculate to calculate after pickup device 1 by each pick-up 20 The horizontal error of element 1 can obtain the back side image of the element 1 picked up by pick-up 20.Here, the back side refers to by pick-up 20 The opposing face of the one side of the element 1 of pickup
In addition, in order to which visual inspection is individually performed to 1 back side of element while calculated level error, i.e., whether there are cracks, 2D inspections of pad formation state etc. etc., described image acquisition device can obtain the back view of the element 1 picked up by pick-up 20 Picture.
On the other hand, described image acquisition device can be provided separately with transfer tool model, or be regarded to perform effectively Feel and check, preferably constitutes the same module with transfer tool model.
Especially, described image acquisition device has as follows excellent in the case of constituting a module with transfer tool model Point:
First, as described above, transfer tool model according to the present invention is characterized in that including multiple pick-ups 20, in order to pick up The element 1 for taking at least two, in take-off location P1 specifically in the part pickup device 1 for being provided with needle pin component 600.
But pick up the element 1 and obtain the image of element 1, especially image and analysis chart are being obtained parallel As in the case of, there are problems that the speed for obtaining 1 image of element can reduce the pickup velocity of element 1.
Accordingly, transfer tool model according to the present invention is moved to after each pick-up 20 completes pickup device 1 and unloads When carrying position P2 or conveying the reception and registration position of elements for transferring modules to other, obtained by each by image acquiring device The back side image for the element 1 that pick-up 20 picks up, further executes image analysis.
Here, for obtaining image by described image acquisition device, according to the specification of image to be obtained, that is, differentiate Rate, depth of field etc., image acquisition speed has no effect on the pickup velocity of element 1, and transfer tool model according to the present invention can be simultaneously The multiple pick-ups 20 of row distinguish the back side image of acquisition element 1 after pickup device and pickup.
Here, for the image obtained by described image acquisition device, it is contemplated that it is slow to be also possible to image analysis speed, It is saved in the memory etc. for constituting a control unit part, unloading position is moved to after each pick-up 20 completes pickup device 1 When setting P2 or conveying the reception and registration position of elements for transferring tool models to other, control unit completes image analysis.
That is, transfer tool model according to the present invention and the element with transfer tool model handle gas, it can Include image acquiring device as a module.
Then, transfer tool model according to the present invention and the element processor with transfer tool model, are picked up Position P1 pickup devices are picked up by the way that at least one of moving in rotation and linear movement are mobile to the movement of image acquiring device side The pick-up 20 for taking element 1, to obtain image to the element 1 of pickup.Here, for described image acquisition process, according to image Acquisition speed can also be moved to unloading position P2 after pickup device or certainly for being transferred to other transfer tool models It is executed when the reception and registration position of element.
Then, transfer tool model according to the present invention and the element processor with transfer tool model, parallel Component pick-up and pickup after obtain 1 back side image of element after, be stored in constitute a control unit part memory, and When being moved to unloading position P2 or conveying the reception and registration position of elements for transferring tool models to other, make control unit completion figure As analysis.
Especially, compared to calculated level error, the case where visual inspection, requires sufficient image processing speed, parallel After distinguishing the back side image that pickup device and pickup obtain element 1 later by multiple pick-ups 20, it is stored in composition control The memory etc. of portion's part processed is moved to unloading position P2 after each pick-up 20 completes the pickup of element 1 or is used for When conveying the reception and registration position of element to other transfer tool models, control unit is made to complete image analysis.
If as described above, being moved to unloading position P2 after parallel element pickup and acquisition image, the completion pickup of element 1 Or execute image analysis when for conveying the reception and registration position of element to move to other transfer tool models, then have without setting Other vision inspection device or module is come the advantages of unloading element and execute visual inspection.
It further says, the present invention picks up and obtains image in parallel element and completes mobile after element 1 picks up Shi Jinhang image analyses then also have the advantages that significantly improve the discharge rate of element.
As described above, parallel element picks up and obtains image and in movement after completing the pickup of element 1 for scheming The structure of the transfer tool model shown in Fig. 5 a can be used as the transfer tool model analyzed.
At this point, the transfer tool model is preferably to pick up the direction side rotated later in each pick-up 20 image is arranged Acquisition device 80,90.
Specifically, in Fig. 5 a and Fig. 5 b, when being rotated in a clockwise direction after 20 pickup device 1 of each pick-up, Preferably image acquiring device 80,90 is located at left side on the basis of the rotary shaft O of pick-up 20.
On the other hand, described image acquisition device 80,90 is according to purpose (calculated level error, the vision inspection for obtaining image Look into) preferably setting at least two.
Here, due to comparatively quickly executing the calculating to horizontal error, preferably with the rotary shaft O of pick-up 20 And on the basis of the direction of rotation of rotary shaft O, compared to the image acquiring device 80 for visual inspection for calculating water The image acquiring device 90 of flat error is further disposed at rear side.
That is, for the preferably following setting image acquiring device 80 of the pick-up 20 of pickup device 1, pass through first The image acquiring device 80 for being used in visual inspection is passed through in rotation, later by the image acquiring device for calculated level error 90。
On the other hand, as described above, at least one image acquiring device 80,90, in particular for the image of visual inspection Acquisition device 80 is preferably moved with together with transfer tool model.
On the other hand, structure of the described image acquisition device 80,90 as the back side image for obtaining element 1, can have more Kind structure, specifically there is scanner, video camera etc..
More than, but be a part for the preferred embodiment that explanation can be realized by the present invention, therefore it is known that it is of the invention Range must not be limited by above-described embodiment, technological thought and the basic technological thought of present invention mentioned above should be all It is included in the scope of the present invention.

Claims (15)

1. a kind of element processor, which is characterized in that including:
Loading part workbench (200), from the loading part card for the multiple loading parts (60) for being mounted with attachment multiple element (1) Lock portion (100) receives loading part (60) and moves the loading part (60) to horizontal direction;
Uninstalling portion (300) separates configuration from the loading part workbench (200), and is provided with and unloads in the horizontal direction respectively Component (70) is carried, wherein the uninstalling portion part (70) is from loading part (60) receiving element (1) and loads the element (1);
Tool model (500) is transferred, in take-off location (P1) from the loading part (60) pickup device (1), in each unloading The unloading position (P2) in portion (300) unloads element (1) to the unloading component (20).
2. element processor according to claim 1, which is characterized in that
The transfer tool model (500) includes:
The first rotary driving part (10) with the first rotary shaft (11);
Multiple pick-ups (20) combine along radial direction and first rotary shaft (11), and along first rotary shaft (11) circumferencial direction is configured and is pivoted about with first rotary shaft (11);
Second rotary driving part (30) has second rotary shaft (31) vertical with the first rotary shaft (11), with described the The institute for rotating first rotary driving part (10) centered on second rotary shaft (31) centered on two rotary shafts (31) State the second rotary driving part (30).
3. element processor according to claim 2, which is characterized in that
The setting number of the multiple pick-up (20) is 2n, and n is natural number.
4. element processor according to claim 1, which is characterized in that
The transfer tool model (500) includes:
First transfer tool (510), in take-off location (P1) pickup device (1);
Second transfer tool (520) unloads element from described first transfer tool (510) receiving element in unloading position (P2) (1)。
5. element processor according to claim 4, which is characterized in that
The first rotary shaft (11) and the second rotary shaft (31) of the first transfer tool (510) transfer tool with second respectively (520) the first rotary shaft (11) and the second rotary shaft (31) is mutually parallel configuration,
The rotation center (O) and described second for connecting the pick-up (20) of the first transfer tool (510) transfer tool (520) Pick-up (20) rotation center (O) dummy line (L) with it is described first transfer tool (510) the first rotary shaft (11) with And second rotary shaft (31) vertically,
From the pick-up (20) of the first transfer tool (510) member is conveyed to the pick-up (20) of the second transfer tool (520) The reception and registration position (P3) of part (1) is located at the rotation center (O) and described for the pick-up (20) that described first transfers tool (510) Between the rotation center (O) of the pick-up (20) of two transfer tools (520).
6. element processor according to claim 4, which is characterized in that
The first transfer tool (510) and the second transfer tool (520) be combined with each other, and detachable.
7. element processor according to claim 4, which is characterized in that
The first transfer tool (510) and the second transfer tool (520) are separated from each other and move,
In the case of in the unloading component loading member without overturning, the first transfer tool (510) and described the Two transfer tools (520) in the take-off location (P1) pickup device (1) successively in order, and then unloading position (P2) will be first Part (1) is loaded into unloading component (70).
8. element processor according to claim 4, which is characterized in that further include:
Image acquiring device (90), setting are obtained and are picked up by the pick-up (20) in second transfer tool (520) side Element (1) back side image.
9. element processor according to claim 8, which is characterized in that further include:
Image acquiring device (80), setting are obtained in first transfer tool (510) side by the first transfer tool (510) Pick-up (20) pickup element (1) back side image.
10. element processor as claimed in any of claims 1 to 9, which is characterized in that
The uninstalling portion (300) is provided at least two near the loading part workbench (200),
The transfer tool model (500) is provided at least two, to correspond respectively at least two uninstalling portion (300).
11. element processor according to claim 10, which is characterized in that
At least two uninstalling portion (300) includes mutually being oppositely arranged centered on the loading part workbench (200) The first uninstalling portion (300) and the second uninstalling portion (300),
Described at least two, which transfer tool model (500), includes:First transfer tool model (500), in the loading part work Make to transfer element (1) between platform (200) and first uninstalling portion (300);And second transfer tool model (500), Element (1) is transferred between the loading part workbench (200) and second uninstalling portion (300).
12. element processor according to claim 10, which is characterized in that
At least two uninstalling portion (300) includes:
First uninstalling portion (300) is arranged on the basis of the loading part workbench (200) in the loading part workbench (200) front;At least one second uninstalling portion (300) is arranged on the basis of the loading part workbench (200) in the dress The left side and at least side in right side for carrying component working platform (200);
Described at least two, which transfer tool model (500), includes:First transfer tool model (500), in the loading part work Make to transfer element (1) between platform (200) and first uninstalling portion (300);Second transfer tool model (500), described Element (1) is transferred between loading part workbench (200) and second uninstalling portion (300).
13. according to the element processor described in any one in claim 1 to 7, which is characterized in that
The loading part (60) includes the band of attachment multiple element (1),
The transfer tool model (500) includes:
Multiple pick-ups (20) pick up the member for being attached to the loading part (60) in the take-off location (P1) successively in order Part (1);Pick-up moving portion is attached to the members of the loading part (60) to make the multiple pick-up (20) pick up in order Part (1) is moved to the pickup position by least one of moving in rotation and linear movement move mode successively in order It sets (P1);
At least one of first linear moving portion (623) and the second linear movement portion (622), wherein the First Line moves Dynamic portion (623) along tool model (500) is transferred described in X-direction linear movement, second linear movement portion (622) is along Y-axis Dimension linear moves the transfer tool model (500).
14. element processor according to claim 13, which is characterized in that
The transfer tool model (500) further includes at least one image acquiring device, passes through the pick-up for obtaining (20) back side image of the element (1) picked up.
15. element processor according to claim 14, which is characterized in that
The image obtained by described image acquisition device is stored in the memory for constituting a control unit part, and described Each pick-up (20) completes pickup device (1) and is moved to the unloading position (P2) later or for transferring tool to other When module conveys the reception and registration position of element, control unit completes image analysis.
CN201780012722.0A 2016-01-07 2017-01-06 Transfer tool model and the element processor with the transfer tool model Pending CN108701633A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20160002136 2016-01-07
KR10-2016-0002136 2016-01-07
PCT/KR2017/000230 WO2017119786A1 (en) 2016-01-07 2017-01-06 Transfer tool module and device handler having same

Publications (1)

Publication Number Publication Date
CN108701633A true CN108701633A (en) 2018-10-23

Family

ID=59274106

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780012722.0A Pending CN108701633A (en) 2016-01-07 2017-01-06 Transfer tool model and the element processor with the transfer tool model

Country Status (4)

Country Link
KR (1) KR102633105B1 (en)
CN (1) CN108701633A (en)
TW (1) TWI668172B (en)
WO (1) WO2017119786A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110127280A (en) * 2019-06-03 2019-08-16 杭州点钢电子商务有限公司 A kind of optical property measurement device for LED encapsulation
CN113246512A (en) * 2020-02-07 2021-08-13 株式会社大镐技术 Lens and mold transfer system

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102430018B1 (en) * 2017-12-20 2022-08-05 엘지디스플레이 주식회사 Transfer head assembly and light emitting device transfer apparatus
WO2021091478A1 (en) * 2019-11-08 2021-05-14 Semiconductor Technologies & Instruments Pte Ltd Component handler

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10125743A (en) * 1996-10-24 1998-05-15 Sony Corp Apparatus for testing semiconductor devices
US20050062463A1 (en) * 2003-09-18 2005-03-24 Kim Seong Bong Sorting handler for burn-in tester
US20090129899A1 (en) * 2007-11-16 2009-05-21 Chi Wah Cheng Handling system for inspecting and sorting electronic components
WO2009142446A2 (en) * 2008-05-21 2009-11-26 주식회사 아이피에스 Vacuum processing system, buffer module used therein and tray transferring method of the vacuum processing system
CN102142386A (en) * 2009-12-24 2011-08-03 宰体有限公司 Device processor
US20120107436A1 (en) * 2010-11-02 2012-05-03 Young-Jin Hwang Semiconductor package molding system and molding method thereof
WO2013129873A1 (en) * 2012-02-29 2013-09-06 (주)제이티 Apparatus for testing elements
KR20140144121A (en) * 2013-06-07 2014-12-18 (주)제이티 Device Handler
KR20150057372A (en) * 2013-11-19 2015-05-28 (주)제이티 Device handler
KR20150122031A (en) * 2014-04-22 2015-10-30 (주)제이티 Transfer tool module, needle pin assembly, and device handler having the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100627300B1 (en) * 2005-04-01 2006-09-25 엘에스전선 주식회사 Pickup movement apparatus capable of adjusting
KR101711497B1 (en) * 2010-10-29 2017-03-02 삼성전자주식회사 Apparatus for mouning semiconductor chip
KR101338182B1 (en) * 2011-03-18 2013-12-09 (주)제이티 Apparatus for sorting led device
KR102104051B1 (en) * 2013-09-10 2020-04-23 (주)제이티 Device handler
KR101496796B1 (en) * 2014-03-07 2015-02-27 (주)제이티 Device handler and method for handling device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10125743A (en) * 1996-10-24 1998-05-15 Sony Corp Apparatus for testing semiconductor devices
US20050062463A1 (en) * 2003-09-18 2005-03-24 Kim Seong Bong Sorting handler for burn-in tester
US20090129899A1 (en) * 2007-11-16 2009-05-21 Chi Wah Cheng Handling system for inspecting and sorting electronic components
WO2009142446A2 (en) * 2008-05-21 2009-11-26 주식회사 아이피에스 Vacuum processing system, buffer module used therein and tray transferring method of the vacuum processing system
CN102142386A (en) * 2009-12-24 2011-08-03 宰体有限公司 Device processor
US20120107436A1 (en) * 2010-11-02 2012-05-03 Young-Jin Hwang Semiconductor package molding system and molding method thereof
WO2013129873A1 (en) * 2012-02-29 2013-09-06 (주)제이티 Apparatus for testing elements
KR20140144121A (en) * 2013-06-07 2014-12-18 (주)제이티 Device Handler
KR20150057372A (en) * 2013-11-19 2015-05-28 (주)제이티 Device handler
KR20150122031A (en) * 2014-04-22 2015-10-30 (주)제이티 Transfer tool module, needle pin assembly, and device handler having the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110127280A (en) * 2019-06-03 2019-08-16 杭州点钢电子商务有限公司 A kind of optical property measurement device for LED encapsulation
CN113246512A (en) * 2020-02-07 2021-08-13 株式会社大镐技术 Lens and mold transfer system
CN113246512B (en) * 2020-02-07 2023-11-24 株式会社大镐技术 Lens and mold transfer system

Also Published As

Publication number Publication date
TW201805220A (en) 2018-02-16
KR102633105B1 (en) 2024-02-02
KR20170082992A (en) 2017-07-17
TWI668172B (en) 2019-08-11
WO2017119786A1 (en) 2017-07-13

Similar Documents

Publication Publication Date Title
CN108701633A (en) Transfer tool model and the element processor with the transfer tool model
TWI666720B (en) A bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bonding
US20110215134A1 (en) Rotary die bonding apparatus and methodology thereof
CN110178210A (en) Element processor
TWI500098B (en) Sticky crystal machine
TWI613738B (en) Method for manufacturing die bonder and semiconductor device
US8167524B2 (en) Handling system for inspecting and sorting electronic components
CN205920952U (en) Chip paster equipment
KR101217505B1 (en) Apparatus for bonding a die and the method for bonding a semiconductor chip by using the same
EP3425662B1 (en) Flip chip bonding device and bonding method
CN107895705B (en) Chip inversion mounting equipment
CN109390249A (en) Semiconductor manufacturing apparatus
KR102231146B1 (en) Transfer tool module, needle pin assembly, and device handler having the same
KR102191261B1 (en) Universal chip placement-bonding apparatus and method
CN108450019A (en) Element processor
TWI624900B (en) Flip device handler
CN108605431B (en) Component packaging apparatus and method thereof
KR102579224B1 (en) Flip device handler having the same
US9575117B2 (en) Testing stacked devices
CN117497434B (en) Chip flip-chip equipment and method thereof
KR102658410B1 (en) Transfer tool, and flip device having the same
KR20110024967A (en) Die bonder apparatus and transferring tool for die bonder apparatus
KR20180081404A (en) Transfer tool module and device handler having the same
KR102355615B1 (en) Device handler
KR20110051301A (en) Device handler

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
AD01 Patent right deemed abandoned

Effective date of abandoning: 20230929

AD01 Patent right deemed abandoned