TW202015186A - Chip mounting device and chip mounting method capable of realizing the parallel operation mode of at least two picking hands and at least two mounting hands - Google Patents

Abstract

The invention discloses a chip mounting device and a chip mounting method, wherein the chip mounting device includes: a feeding unit, a chip transfer unit and a chip bonding unit. The feeding unit includes a material component and at least two picking hands, wherein the material component is configured to carry chips, and the at least two picking hands are configured to pick up chips from the material component alternately. The chip transfer unit includes a rotatable turntable, on which a plurality of chip adsorption areas are provided to adsorb chips provided by the at least two picking hands. The chip bonding unit includes a mounting table and at least two mounting hands, wherein the at least two mounting hands are configured to alternately acquire chips from the chip adsorption areas and bond the chips to a substrate of the mounting table. With the chip mounting device and chip mounting method of the present invention, it is able to realize the parallel operation mode of at least two picking hands and at least two mounting hands, improve the mounting efficiency, facilitate the process of chip packaging, and improve the chip yield.

Description

Wafer placement equipment and wafer placement method

Embodiments of the present invention relate to chip packaging technology, for example, to a chip mounting device and a chip mounting method.

The integrated circuit (IC) industry is the high-speed growth point of the current global economic development. Among them, the advancement of semiconductor manufacturing processes and the rapid growth of the market demand for wafers place high demands on the production efficiency of wafers. Among them, wafers The efficiency of packaging directly affects the speed of wafer production.

In order to improve the efficiency of chip packaging, generally by designing and improving the packaging structure and packaging method or optimizing the packaging equipment, including chip mounting equipment. In the related art, wafer placement equipment may include linear transmission and turntable transmission. Among them, the linear transmission method transfers the wafer to be bonded by a conveyor belt, and the robot picks up and places the chip. The placement equipment of the linear transmission method has a large space and large transmission distance, and the placement efficiency is relatively high. Low; and the turntable transfer method is usually to set the manipulator on the turntable, the manipulator rotates to pick up, transfer, and attach the wafer. The placement method can only attach one wafer at a time, the placement efficiency is low, and it is not conducive to the machine The hand adjusts the posture when picking up the wafer. At the same time, the turntable has a complicated structure and a large volume, and the requirements on the movement axis are also high.

The invention provides a wafer placement device and a wafer placement method, so as to realize high-efficiency placement, and promote wafer packaging efficiency and production efficiency.

In a first aspect, an embodiment of the present invention provides a wafer placement device, including: a feed unit, a wafer transfer unit, and a wafer bonding unit;

The feeding unit includes a material element and at least two pickers, the material element is configured to carry a wafer, and the at least two pickers are configured to alternately pick up the wafer from the material assembly;

The wafer transfer unit includes a rotatable turntable. The rotatable turntable is provided with a plurality of wafer adsorption areas. The wafer adsorption area is configured to adsorb the wafers provided by the at least two wafer pickers;

The wafer bonding unit includes a mounting table and at least two mounting hands, the at least two mounting hands are configured to alternately acquire the wafer from the wafer adsorption area and bond the wafer to the substrate on the mounting table on.

In some embodiments, the at least two pickers include a first picker and a second picker, and the at least two pickers include a first picker and a second picker;

The wafer placement equipment also includes a wafer alignment unit. The wafer alignment unit includes a pickup alignment camera, a first slice alignment camera, a second slice alignment camera, and a first patch alignment camera And the second patch alignment camera;

Wherein, the aforementioned pick-up alignment camera is located above the aforementioned material assembly, and the aforementioned pick-up alignment camera is configured to determine the position of the aforementioned wafer on the aforementioned material element;

The first film-taking registration camera and the second film-taking registration camera are both configured to determine the position of the wafer to be taken on the rotatable turntable;

The first patch alignment camera is configured to determine the position of the wafer obtained by the first patch hand on the placement table, and the second patch alignment camera is configured to determine the second The position of the wafer to be placed on the placement table by the wafer obtained by the placement.

In some embodiments, the rotatable turntable includes a first picking position corresponding to the first picker, a second picking position corresponding to the second picker, a first picking position corresponding to the first picker, and Corresponding to the second picking position of the second patch hand; wherein, the first picking position is below the first picking registration camera, and the second picking position is below the second picking registration camera ;

The rotatable turntable is configured to sequentially move each of the wafer adsorption areas to the first wafer placement position, the second wafer placement position, the first wafer placement position, and the second wafer placement position by rotation; A film picker and the second film picker are also configured to place the wafers alternately on the wafer adsorption area corresponding to the first film placement position and the second film placement position;

The first placement hand and the second placement hand are configured to alternately pick up the wafer from the wafer suction area corresponding to the first and second wafer picking locations, and alternately place the wafer on the wafer On the substrate on the placement table.

In some embodiments, the plurality of wafer adsorption areas are arranged at equal intervals around the center of the rotatable turntable, the first film taking position and the second film placing position are symmetrical about the center of the rotatable turntable, and the first A film position and the second film position are symmetrical about the center of the rotatable turntable.

In some embodiments, the rotatable turntable includes a wafer stage and a rotary motor connected to the central axis of the wafer stage, the rotary motor is configured to drive the wafer stage to rotate;

The wafer stage includes a stage and an air path slip ring located inside the stage, the plurality of wafer adsorption areas are provided on the stage, and the air path slip ring is configured to supply vacuum and Positive pressure gas.

In some embodiments, each wafer adsorption area of the stage is provided with an adsorption hole, and a plurality of adsorption channels respectively communicating with the plurality of adsorption holes are provided inside the stage, the plurality of adsorption channels and the gas The slip ring is on.

In some embodiments, the aforementioned material component is located below the aforementioned wafer stage;

The feeding unit also includes a third picker and a fourth picker. The third picker and the fourth picker are configured to alternately pick up and turn over the wafers on the material element. The first picker and the picker The second picker is respectively configured to pick up the wafers of the third picker and the fourth picker and alternately place the wafers on the wafer suction area corresponding to the first picking position and the second picking position .

In some embodiments, the wafer bonding unit also includes a gantry frame, the first placement hand and the second placement hand are disposed on the gantry frame, the gantry frame is configured according to the first film taking position, the first The two picking positions and the position to be patched drive the first patch hand and the second patch hand to move.

In some embodiments, a patch avoidance area is provided between two adjacent wafer adsorption areas, and the patch table is located below the rotatable turntable;

The wafer bonding unit also includes a gantry frame, the first placement hand and the second placement hand are disposed on the gantry frame, and the gantry frame is configured according to the first film taking position, the second film taking position, and the foregoing The position of the patch drives the first patch hand and the second patch hand to move longitudinally, the first patch hand and the second patch hand alternately place the chip patch on the patch table through the patch avoidance area On the substrate.

In some embodiments, the first slice-taking camera is configured to determine the deflection angle of the wafer on the first slice-taking bit, and the second film-taking camera is configured to determine the front The deflection angle of the wafer on the second chip-taking location, the gantry is also configured to drive the first chip mounter and the aforesaid deflection angle of the wafer on the first chip-taking location or the second chip-taking location The second patch hand rotates.

In some embodiments, the aforementioned carrier includes a hanging portion and a bearing portion, and the thickness of the aforementioned bearing portion is less than or equal to 5 mm.

In some embodiments, the first film alignment camera, the second film alignment camera, the first chip alignment camera, and the second chip alignment camera are fixedly mounted on the same substrate.

In some embodiments, the aforementioned placement table includes a support table, a first motion table, and a first adsorption table that are sequentially stacked;

The aforementioned supporting table is configured to carry the aforementioned first moving table, the aforementioned first adsorption table and the aforementioned substrate;

The aforementioned first moving stage is configured to move the aforementioned substrate to align the to-be-patched area on the aforementioned substrate with the to-be-patched position;

The aforementioned first adsorption stage is configured to adsorb the aforementioned substrate.

In some embodiments, the aforementioned material element includes a second moving table, a second adsorption table, and a thimble unit that are sequentially stacked;

The aforementioned second moving stage is configured to move the wafer to be picked to the picking position;

The aforementioned second adsorption stage is configured to adsorb the aforementioned wafer to be taken;

The thimble unit is configured to disengage the wafer to be taken at the picking position from the second suction stage.

In the second aspect, an embodiment of the present invention also provides a wafer placement method, which uses, for example, According to any one of the foregoing wafer placement equipment of the first aspect, comprising:

At least two wafer pickers alternately pick up wafers from the material components and place the aforementioned wafers on multiple wafer adsorption areas of the rotatable turntable;

The rotation of the rotatable turntable drives the plurality of wafer adsorption areas on the rotatable turntable to move;

At least two placement hands alternately pick up the wafers from the plurality of wafer suction areas and place the wafers on the substrate on the placement table.

In some embodiments, the at least two pickers include a first picker and a second picker, the at least two pickers include a first picker and a second picker, and the rotatable turntable includes a corresponding first picker A first filming position of the filming hand, a second filming position corresponding to the second filming hand, a first filming position corresponding to the first filming hand, and a second filming position corresponding to the second filming hand;

The aforementioned chip mounting method also includes:

During the first time, the first wafer picker picks up the wafer from the material element, and the second wafer picker places the wafer picked up from the material element in the wafer suction area corresponding to the second wafer release position , The first placement hand picks up the wafer from the wafer suction area corresponding to the first pick-up location, and the second placement hand picks up the wafer pick-up area corresponding to the second pick-up location The wafer chip is placed on the substrate on the wafer table;

During the second time, the first wafer picker places the wafer picked up from the material assembly in the wafer suction area corresponding to the first wafer release position, and the second wafer picker picks the wafer from the material element , The first placement hand picks the wafer pick-up from the wafer suction area corresponding to the first pick-up location on the substrate on the placement table, and the second placement hand picks from the second Pick the wafer on the wafer suction area corresponding to the wafer bit.

In the present invention, at least two pickers are provided in the feeding unit and at least two pickers are provided in the wafer bonding unit, and the at least two pickers alternately pick up the wafer from the material component and place it in the rotatable wafer transfer unit. On the wafer adsorption area of the turntable, at least two placement hands alternately take wafers from the rotated wafer adsorption area and attach them to the substrate on the placement table, which solves the problem of a single picker and a single picker The problem of low placement efficiency of the tandem operation mode of the patch. The parallel operation mode of at least two pickers and at least two pickers can double the placement speed, improve the placement efficiency, and promote the process of chip packaging , To help increase the yield of wafers.

10‧‧‧Feeding unit

11‧‧‧Material components

12‧‧‧ film picker

20‧‧‧chip transfer unit

21‧‧‧rotatable turntable

22‧‧‧Carrier

23‧‧‧rotating motor

30‧‧‧ Wafer bonding unit

31‧‧‧SMT

32‧‧‧SMT

33‧‧‧gantry

40‧‧‧chip alignment unit

41‧‧‧ Retrieval registration camera

42‧‧‧Camera registration

43‧‧‧ SMD alignment camera

44‧‧‧Substrate

100‧‧‧chip

111‧‧‧Second sports platform

112‧‧‧Second adsorption station

113‧‧‧ thimble unit

121‧‧‧ First picker

122‧‧‧Second film picker

123‧‧‧ third picker

124‧‧‧ Fourth film picker

200‧‧‧substrate

211‧‧‧ Wafer adsorption area

212‧‧‧ Patch avoidance zone

221‧‧‧ stage

222‧‧‧Pneumatic slip ring

311‧‧‧support table

312‧‧‧The first sports platform

313‧‧‧First adsorption station

321‧‧‧ First SMT

322‧‧‧ Second SMT

421‧‧‧The first registration camera

422‧‧‧Second registration camera

431‧‧‧The first patch alignment camera

432‧‧‧Second patch alignment camera

2011‧‧‧ First release

2012‧‧‧Second release

2021‧‧‧ First selection

2022‧‧‧Second selection

2211‧‧‧Adsorption hole, hanging part

2212‧‧‧Adsorption channel, bearing part

FIG. 1 is a schematic structural diagram of a wafer placement device provided by an embodiment of the present invention.

[FIG. 2] is a top view of the rotatable turntable in the wafer mounting apparatus shown in FIG.

[Fig. 3] is a right side view of the wafer mounting apparatus shown in Fig. 1.

FIG. 4 is a schematic plan view of the wafer mounting apparatus shown in FIG. 1.

[FIG. 5] is a partial structural schematic diagram of another wafer placement device provided by an embodiment of the present invention.

Fig. 6 is a timing control diagram of the patch provided by the embodiment of the present invention.

7 is a bottom view of a film alignment camera and a chip alignment camera provided by an embodiment of the present invention.

[Figure 8] is a schematic structural diagram of a rotatable turntable provided by an embodiment of the present invention.

9 is a schematic cross-sectional structure diagram of a stage provided by an embodiment of the present invention.

FIG. 10 is a schematic structural diagram of yet another wafer placement device provided by an embodiment of the present invention.

[Fig. 11] is a right side view of the wafer mounting apparatus shown in Fig. 10.

Fig. 12 is a schematic structural diagram of a stage provided by an embodiment of the present invention.

[FIG. 13] is a flowchart of a wafer placement method provided by an embodiment of the present invention.

FIG. 14 is a flowchart of another wafer placement method provided by an embodiment of the present invention.

The present invention will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. In addition, it should also be noted that, in order to facilitate description, the drawings only show parts, but not all structures related to the present invention.

FIG. 1 is a schematic structural diagram of a wafer placement device provided by an embodiment of the present invention, FIG. 2 is a top view of a rotatable turntable in the wafer placement device shown in FIG. 1, and FIG. 3 is a view of the wafer placement device shown in FIG. Right view, referring to FIGS. 1-3, the wafer placement equipment includes: a feed unit 10, a wafer transfer unit 20, and a wafer bonding unit 30; the feed unit 10 includes a material element 11 and at least two pickers 12, material elements 11 is configured to carry the wafer 100, and at least two wafer pickers 12 are configured to pick up the wafer 100 alternately from the material element 11; the wafer transfer unit 20 includes a rotatable turntable 21 on which a plurality of wafer suction areas are provided 211. The wafer adsorption area 211 is configured to adsorb the wafer 100 provided by at least two pickers 12; the wafer bonding unit 30 includes a mount table 31 and at least two pickers 32, and at least two pickers 32 are configured to alternate from The wafer adsorption area 211 picks up the wafer 100 and bonds the wafer 100 to the substrate 200 on the mounting table 31.

The following briefly introduces the placement method of the placement equipment with reference to FIG. 1. The placement method includes: at least two pickers 12 alternately pick up the wafer 100 from the material element 11 and place the wafer 100 on the rotatable turntable 21 Multiple wafer adsorption areas 211; rotatable turntable 21 rotates, with The plurality of wafer suction areas 211 on the movable and rotatable turntable 21 move; at least two placement hands 32 alternately pick up the wafer 100 from the plurality of wafer suction areas 211 and place the wafer 100 on the substrate 200 on the placement table 31 . It should be noted that, in the step of picking and placing by each picker and the step of picking and placing by each picker, corresponding to each action, the rotatable turntable 21 rotates once at a preset angle to turn the rotatable The turntable 21 has been removed by the position where the wafer picker placed the wafer, and the position where the wafer has been placed is moved to the pick position of the pick and place hand. Taking the rotatable turntable shown in FIG. 2 as including 12 suction areas 211 as an example The angle of each rotation of the rotatable turntable 21 is 30°.

It should be noted that when the picker 12 and the picker 32 pick and place the wafer and the picker, the movement process includes horizontal and vertical movements, and the horizontal movement may include adjustment in two dimensions of X and Y. The picker 12 and picker 32 It can be set as a suction hand in the form of a suction wafer, and whether the vacuum 100 is used to realize the pickup and release operation of the wafer 100. The number of picker 12 and picker 32 should be not less than two for alternating pick and place movements. Of course, picker 12 and picker 32 can be increased to 3 or 4, etc., by 3 or The four picking hands and the picking hands 32 alternately pick and place, which can reduce the interval between two picking hands or two picking hands and increase the picking speed. In addition, the number of pickers and pickers can be set to be the same or different according to the picker picking speed and the picker picking speed ratio.

In the wafer pick-and-place equipment provided by the embodiment of the present invention, by providing at least two pickers in the feeding unit and at least two pickers in the wafer bonding unit, the pickers alternately pick up the wafers from the material components. And placed on the wafer adsorption area of the rotatable turntable of the wafer transfer unit, and at least two placement hands alternately fetch wafers from the rotated wafer adsorption area and attach them to the substrate on the placement table, so that at least two One picker can carry out alternate pick-and-place operations at the same time, and at least two pickers also perform pick-and-place operations at the same time, which solves the problem of picking and placing of single picker and single picker The problem of low placement efficiency of the tandem operation mode has realized the parallel operation mode of at least two pickers and at least two pickers, which doubles the placement speed, improves the placement efficiency, and promotes the process of chip packaging , To help increase the yield of wafers. In addition, the placement hand and the wafer transfer unit are separately provided, which is convenient for the placement hand to adjust the posture when picking up the wafer and grab the center of the wafer, which is helpful for accurate placement.

Continuing to refer to FIG. 1, optionally, the placement table 31 includes a support table 311, a first motion table 312, and a first suction table 313 that are sequentially stacked; the support table 311 is configured to carry the first motion table 312, the first suction The stage 313 and the substrate 200; the first moving stage 312 is configured to move the substrate to align the region to be patched on the position to be patched; the first adsorption stage 313 is configured to adsorb the substrate 200. Optionally, the material element 11 includes a second motion table 111, a second suction table 112, and a thimble unit 113 that are stacked in sequence, the second motion table 111 is configured to move the wafer to be taken to the reclaim position, and the second suction table 112 is configured to attract the wafer 100 to be taken; the ejector unit 113 is configured to disengage the wafer to be taken from the second suction stage 112 at the picking position.

The material component 11 and the placement table 31 may have a position movement function. In some embodiments, when the picker picks the film from the material component 11, the wafer to be taken on the material element 11 needs to be moved to the position of the chip to be taken in advance , So that the film picker performs film picking, wherein the first motion table 111 can move horizontally and vertically. For the placement hand to place the wafer on the substrate on the placement table 31, the second movement table 312 moves horizontally to move the position to be placed to the target placement position.

4 is a schematic top view of the wafer pick-and-place apparatus shown in FIG. 1. Referring to FIGS. 1 and 4, at least two pickers include a first picker 121 and a second picker 122, and at least two pickers include a first picker The wafer hand 321 and the second placement hand 322; the wafer placement equipment also includes a wafer alignment unit 40, and the wafer alignment unit 40 includes a pickup alignment camera 41, a first slice alignment camera 421, and a second slice pair Camera 422, first patch alignment camera 431 and second patch alignment camera 432, take the pair The bit camera 42 includes a first film register camera 421 and a second film register camera 422, and the chip register camera 43 includes a first chip register camera 431 and a second chip register camera 432; The material alignment camera 41 is located above the material element 11 and is configured to determine the position of the wafer 100 on the material element 11; the first film alignment camera 421 and the second film alignment camera 422 are respectively configured to determine rotatable The position of the wafer 100 to be fetched on the turntable 21; the first patch alignment camera 431 and the second patch alignment camera 432 are respectively configured to determine that the wafer 100 acquired by the first patch hand 321 and the second patch 322 is The position to be placed on the placement table 31.

200 shown in FIG. 1 is the wafer substrate placed on the placement table 31, the first placement hand 321 and the second placement hand alternately pick up the wafer 100 on the wafer adsorption area 211 on the rotatable turntable 21, and place it to The wafer substrate 200 on the mounting table 31 is at a position to be mounted. In addition, referring to FIG. 1, the second pick-up registration camera 422 and the second pick-up registration camera 432 are located behind the first pick-up registration camera 421 and the first pick-up registration camera 431, respectively. Is shown with a dotted line.

The determination of the position of the wafer by the bit camera and the position of the to-be-placed patch can be determined according to the images of the collected wafer and the wafer substrate, and according to the alignment marks on the wafer and the wafer substrate. With reference to FIGS. 1 and 4, taking the first picker 121 and the first picker 321 as examples, a brief introduction to the working process of the wafer pick-and-place equipment including the wafer register unit: the pick register camera 41 Determine the position of each wafer by the alignment mark on the wafer that has been divided into wafers on the material element 11; the first wafer picker 121 picks up the wafer and places it on the wafer suction area 211 of the rotatable turntable 21; The rotatable turntable 21 rotates to move a plurality of wafer adsorption areas 211, the first wafer alignment camera 421 is located in a certain wafer adsorption area 211; the first wafer alignment camera 421 is on the wafer adsorption area 211 The position of the wafer is determined, and the first placement hand 321 picks up the wafer; the first placement alignment camera 431 determines the position of the wafer to be placed on the wafer substrate 200 on the placement table 31 by the first The placement hand 321 attaches the wafer to the wafer substrate 200. The wafer alignment unit can detect the position of the wafer during the picking and placing of the wafer, and ensure that the picker and the picker can pick up the center position of the wafer when picking up the wafer, effectively preventing the wafer from falling off.

The alignment camera in the wafer alignment unit can be accurately driven by a gantry and other devices to determine the position of the wafer and the position of the wafer to be mounted. It can also be fixed by an alignment camera, which is supported by the material carrying the wafer The components and the placement table move precisely to determine the position of the wafer and the position of the wafer to be placed.

In order to improve the efficiency of picking and placing wafers and patches by pickers and pickers in the case of determining the position of the wafer and the position to be placed, the embodiments of the present invention also provide for the movement methods of pickers and pickers and pick and place movements FIG. 5 is a partial structural schematic diagram of another wafer placement device provided by an embodiment of the present invention. Referring to FIG. 5, in the wafer placement device, a rotatable turntable includes corresponding to the first picking hand 121, The first picking position 2011, the second picking position 2012, the first picking position 2021 and the second picking position 2022 of the second picking hand 122, the first picking hand 321, and the second picking hand 322; The film taking position 2021 and the second film taking position 2022 are located below the first film taking registration camera and the second film taking registration camera; the rotatable turntable 21 is configured to rotate a plurality of wafer adsorption areas 211 to move to the first release in sequence Position 2011, second position 2012, first position 2021 and second position 2022; first position 121 and second position 122 are also configured to alternately place the wafer 100 on the first position On the wafer adsorption area 100 corresponding to the bit 2011 and the second film placement position 2012; the first placement hand 321 and the second placement hand 322 are configured to alternately correspond to the first placement position 2021 and the second placement position 2022 The wafer 100 is picked up on the wafer adsorption area 211, and the wafer 100 is alternately mounted on the substrate 200 on the mounting table.

The wafer placement equipment has fixed the first placement position 2011 and the second placement position 2012. The first film picking position 2021 and the second film picking position 2022. At this time, the first film picker 121, the second film picker 122, the first film picker 321 and the second film picker 322 can fix the film placement position and the film picking position The position of the first picking hand 121, the second picking hand 122, the first picking hand 321 and the second picking hand 322 is reduced, and the placement efficiency can be improved to a certain extent. It should be noted that the positions of the first film-taking position 321 and the second film-taking position 322 depend on the positions of the first film-positioning camera and the second film-positioning camera, so that the first film-positioning camera And the second film-taking registration camera confirm the positions of the wafers on the first film-taking position 321 and the second film-taking position 322.

For the placement device shown in FIG. 5, an embodiment of the present invention also provides a placement method. FIG. 6 is a timing control diagram of the placement provided by the embodiment of the present invention. The following continues reference to FIG. 1, FIG. 5, and FIG. 6, Describe the placement method of the placement equipment: where the picking action and the picking action of the picker and picker represent the actions of picking and placing wafers, respectively, the picking and picking operations are carried out in the first picker and second picker At the same time as the placement action, it is necessary to use the positioning camera to determine the position. One cycle of the placement process may include two time periods. In the first time, the first picker 121 picks up the wafer 100 from the material element 11 and the second picker 122 picks up the wafer 100 from the material element 11 Placed in the wafer suction area 211 corresponding to the second placement position 2012, the first placement hand 321 picks up the wafer 100 from the wafer suction area 211 corresponding to the first placement position 2021, and the second placement hand 322 will The wafer 100 picked up on the wafer suction area 211 corresponding to the second chip picking position 2022 is mounted on the substrate 200 on the mounting table 31; within the second time, the first chip picker 121 will pick up the material element 11 The wafer 100 is placed in the wafer adsorption area 211 corresponding to the first placement position 2011, the second picker 122 picks up the wafer 100 from the material element 11, the first picker 321 will correspond to the first picking position 2021 The wafer 100 picked up on the wafer suction area 211 is mounted on the substrate 200 on the mounting table 31, and the second placement hand 322 picks up the wafer 100 from the wafer suction area 211 corresponding to the second pick-up location 2022. need It is explained that, between the first time and the second time, the rotatable turntable 21 rotates at a preset angle to satisfy that the wafer adsorption area 211 enters the first film placement position 2011, the second film placement position 2012, and the first In the film taking position 2021 and the second film taking position 2022, taking the 12 wafer adsorption areas shown in FIG. 2 as an example, the rotatable turntable 21 rotates 60° in one cycle including two time periods, and A wafer is alternately placed in the adjacent two wafer adsorption areas, and the placement hand alternately picks up the two wafers on the adjacent two wafer adsorption areas and places it alternately on the substrate on the placement table on. The placement method highly synchronizes the pick and place movement of the first picker, the second picker, the first picker and the second picker, realizing the alternation of pick and place actions and ensuring the improvement of wafer picking efficiency .

Continuing to refer to FIG. 5, optionally, a plurality of wafer adsorption areas 211 are arranged at equal intervals around the center of the rotatable turntable 21, the first film taking position 2011 and the second film taking position 2022, the first film taking position 2021 and The second film taking positions 2012 are respectively symmetrical about the center of the rotatable turntable 21.

In addition, after fixing the positions of the first picking position 2011, the second picking position 2012, the first picking position 2021 and the second picking position 2022, correspondingly, the first picking position alignment camera and the second pick position The position of the position camera has also been determined, and because the placement table can move the position, the position of the first placement camera and the second placement camera can also be fixed, so the first placement registration can be set The camera, the second chip alignment camera, the first chip alignment camera and the second chip alignment camera are fixedly installed on the same substrate. 7 is a bottom view of a film alignment camera and a chip alignment camera provided by an embodiment of the present invention. Referring to FIG. 7, the first film alignment camera 421, the second film alignment camera 422, and the first The SMT camera 431 and the second SMT camera 432 are compactly laid out on the same substrate 44 and will be manufactured using a constant expansion steel material with a low expansion coefficient to ensure that the wafer alignment unit will not The temperature drift between each camera is too large due to changes in the ambient temperature of the machine.

For the structure of the rotatable turntable in the wafer transfer unit, embodiments of the present invention provide A rotatable turntable. FIG. 8 is a schematic structural diagram of a rotatable turntable provided by an embodiment of the present invention. Referring to FIG. 8, the rotatable turntable 21 includes a wafer stage 22 and a rotary motor 23 connected to the central axis of the wafer stage 22. The motor 23 is configured to drive the wafer stage 22 to rotate; the wafer stage 22 includes a carrier 221 and an air path slip ring 222 inside the carrier 221, and a plurality of wafer adsorption areas are provided on the carrier 221, and the air path slip ring 222 It is configured to supply vacuum and positive pressure gas to the wafer adsorption area.

9 is a schematic cross-sectional structure diagram of a stage provided by an embodiment of the present invention. Referring to FIGS. 8 and 9, each wafer adsorption area of the stage 221 is provided with at least one adsorption hole 2211, and the interior of the stage 221 is provided with A plurality of adsorption channels 2212 connected to the plurality of adsorption holes 2211 are connected to the gas path slip ring 222.

In order to reduce the horizontal movement distance of the first picker and the second picker and the horizontal movement distance of the first picker and the second picker, an embodiment of the present invention also provides a wafer placement device, and FIG. 10 is an embodiment of the present invention FIG. 11 is a right side view of the wafer mounting equipment shown in FIG. 10. Referring to FIGS. 5, 10, and 11, optionally, the material assembly 11 is located below the wafer stage 22. The feeding unit also includes a third picker 123 and a fourth picker 124. The third picker 123 and the fourth picker 124 are flip pickers, and the first picker 121 and the second picker 122 are translation pickers. The third picker 123 and the fourth picker 124 are configured to alternately pick up the wafer 100 on the material element 11 and turn it over, and the first picker 121 and the second picker 122 are configured to pick up the third picker 123 and the first The wafers 100 on the four picking hands 124 are alternately translated and placed on the wafer adsorption area 211 corresponding to the first loading position 2011 and the second loading position 2022.

Since the third picker 123 and the fourth picker 124 are alternately picking, the first picker 121 and the second picker 122 are also picking and placing alternately, so that time can be fully utilized. In space, the material element 11 is arranged below the wafer stage 22, and the third film taking hand 123 and the fourth The wafer picker 124 realizes the vertical displacement of the wafer, and then the first wafer picker 121 and the second wafer picker 122 realize the horizontal displacement of the wafer to ensure that the horizontal distance between the first wafer picker 121 and the second wafer picker 122 is shortened, which can be improved The efficiency of taking the film.

With continued reference to FIGS. 5, 10 and 11, optionally, the wafer bonding unit 30 also includes a gantry frame 33, the first placement hand 321 and the second placement hand 322 are disposed on the gantry frame 33, and the gantry frame 33 is configured In order to drive the first placement hand 321 and the second placement hand 322 to move horizontally and/or vertically according to the first placement position 2021, the second placement position 2022, and the position to be placed.

It should be noted that although the wafer placement equipment uses two placement hands, only one gantry 33 can be used to realize the alternate movement control of the two placement hands, without the need to set up separate horizontal consoles, thus optimizing the entire wafer The space layout of the placement equipment reduces the space size of the equipment. In addition, in order to ensure the shortest stroke of the second sports platform, two patch hands can be set up to be responsible for different patch areas, and the horizontal fine adjustment function of the patch hands can be realized by the gantry to meet the requirements of the patch with different spacing.

In order to reduce the horizontal displacement distance of the placement hand between the placement table and the rotatable turntable, referring to FIG. 5, FIG. 10 and FIG. 11, the placement table 31 can be arranged below the receiving table 22, and in order to ensure that the placing hand After picking up the wafer on the wafer stage 22, it will not be blocked by the wafer stage 22 when it is placed on the wafer stage 31, and the wafer stage 31 and wafer stage 22 can be selected to be displaced in the horizontal direction, and the displacement distance determines the placement hand The horizontal displacement distance. The vertical movement distance of the patch hand is related to the height and thickness of the stage. Continue to refer to FIG. 7. Optionally, the stage 221 includes a hanging portion 2211 and a bearing portion 2212, and the thickness of the bearing portion 2212 is less than or equal to 5 mm.

FIG. 12 is a schematic structural diagram of a carrier provided by an embodiment of the present invention. Referring to FIGS. 5 and 10 to 12, a chip avoidance region 212 may be provided between two adjacent wafer adsorption regions 211 on the carrier; The gantry 33 is configured according to the first film taking position 2021, the second film taking position 2022 and the to-be-posted The film position drives the first placement hand 321 and the second placement hand 322 to move longitudinally. The first placement hand 321 and the second placement hand 322 alternately place the wafer 100 on the placement table 31 through the placement avoidance zone 212 Bottom 200.

It should be noted that the stage structure shown in FIG. 12 is only used as an example, and the shape of the patch avoidance area 212 can also be set to a circle, a rectangle, a polygon, etc. The first patch hand 321 and the second patch hand 322 are selected from this The chip avoidance area 212 is passed through to mount the wafer 100 on the chip stage 31 below the stage 221. Obviously, the structure and placement method of the stage 221 provided in this embodiment can avoid the horizontal displacement of the placement hand, shorten the placement time of the placement hand, and improve the placement efficiency of the wafer.

Continuing to refer to FIGS. 5, 10 and 12, optionally, the first film alignment camera 421 and the second film alignment camera 422 are also configured to determine the first film acquisition position 2011 and the second film acquisition respectively In the deflection angle of the wafer 100 on the bit 2022, the gantry 33 is also configured to drive the first placement hand 321 and the second placement hand 322 to rotate according to the deflection angle.

It should be noted that the first placement hand 321 and the second placement hand 322 have at least three degrees of freedom small-stroke movement, can move two degrees of freedom horizontally to pick up the wafer, and the longitudinal movement completes the placement action, and the first placement hand When the second picker places the wafer on the stage, the posture of the wafer is not fixed, and there may be a certain deflection angle. Therefore, the deflection angle of the wafer needs to be adjusted before the picker places the chip. , You can more accurately adjust the posture of the wafer to ensure the accuracy of the wafer bonding.

An embodiment of the present invention also provides a wafer mounting method. FIG. 13 is a flowchart of a wafer mounting method provided by an embodiment of the present invention. Referring to FIG. 13, the wafer mounting method uses any wafer provided by the embodiment of the present invention SMT equipment, including:

S110. At least two pickers alternately pick up the wafer from the material component and place the wafer in a rotatable manner On multiple wafer adsorption areas of the turntable;

S120. The rotatable turntable rotates to drive the movement of multiple wafer adsorption areas on the rotatable turntable;

S130. At least two placement hands alternately pick up the wafers from the multiple wafer suction areas and place the wafers on the substrate on the placement table.

It should be noted that, during the normal placement process, the action of at least two pickers and at least two pickers may alternately pick and place wafers, and the pick and place of at least two pickers, at least two There are at least two alternative methods for picking and placing of the pick and place hand; in the alternate method shown in the timing diagram of FIG. 6, taking the picking hand as an example, after the first picking hand sucks the film, the second picking hand performs the picking again Movement, then the first picker is performing the release action, and finally the second picker performs the suction action, and a cycle is completed; of course, the first picker's suction action and the second picker's release action can also be completed The actions are performed simultaneously, that is, in a cycle, while the first picker sucks the tablet, the second picker performs the picking action, and then the first picker performs the picking action, while the second picker performs the picking action. Similarly, the method of alternately placing and placing the hands may be alternately picking and placing, or simultaneous picking and placing.

The wafer placement method provided by the embodiment of the present invention uses at least two pick hands to alternately pick up wafers from the material components and place the wafers on multiple wafer adsorption areas of the rotatable turntable; at least two pick hands alternately from multiple Picking up the wafer on the wafer adsorption area and placing the wafer on the substrate on the placement table, which solves the problem of low placement efficiency of the single pick hand and single pick hand pick and place and the tandem operation mode of the patch. The parallel operation mode of at least two picking hands and at least two picking hands doubles the picking speed, improves picking efficiency, promotes the process of chip packaging, and helps increase the yield of chips.

14 is a flowchart of another wafer placement method provided by an embodiment of the present invention. Referring to FIG. 14, optionally, in a wafer placement device, at least two wafer pickers include a first wafer picker and a first Two pickers, at least two pickers include the first picker and the second picker; the rotatable turntable includes the first picker corresponding to the first picker, the second picker, the first picker, and the second picker, respectively Position, second placement position, first placement position and second placement position; wafer placement methods include:

S210. In the first time, the first picker picks up the wafer from the material component, the second picker puts the wafer picked up from the material component in the wafer adsorption area corresponding to the second pick-up location, and the first picker Pick up the wafer from the wafer suction area corresponding to the first chip picking position, and the second pick and place hand will pick the wafer picked up from the wafer picking area corresponding to the second chip picking position on the substrate on the mounting table ;

S210. In the second time, the first picker places the wafer picked up from the material component in the wafer adsorption area corresponding to the first pick-up location, the second picker picks the wafer from the material component, and the first picker Place the wafer picked up from the wafer suction area corresponding to the first chip picking position on the substrate on the mounting table, and the second pick hand picks up the wafer from the wafer suction area corresponding to the second chip picking position .

10‧‧‧Feeding unit

11‧‧‧Material components

12‧‧‧ film picker

20‧‧‧chip transfer unit

21‧‧‧rotatable turntable

30‧‧‧ Wafer bonding unit

31‧‧‧SMT

32‧‧‧SMT

40‧‧‧chip alignment unit

41‧‧‧ Retrieval registration camera

42‧‧‧Camera registration

43‧‧‧ SMD alignment camera

100‧‧‧chip

111‧‧‧Second sports platform

112‧‧‧Second adsorption station

113‧‧‧ thimble unit

121‧‧‧ First picker

122‧‧‧Second film picker

200‧‧‧substrate

311‧‧‧support table

312‧‧‧The first sports platform

313‧‧‧First adsorption station

321‧‧‧ First SMT

322‧‧‧ Second SMT

421‧‧‧The first registration camera

422‧‧‧Second registration camera

431‧‧‧The first patch alignment camera

432‧‧‧Second patch alignment camera

Claims (16)

A wafer placement device, characterized by comprising: a feeding unit, a wafer transmission unit and a wafer bonding unit, wherein; The feeding unit includes a material element and at least two pickers, the material element is configured to carry a wafer, and the at least two pickers are configured to alternately pick up the wafer from the material assembly; The wafer transfer unit includes a rotatable turntable. The rotatable turntable is provided with a plurality of wafer adsorption areas. The wafer adsorption area is configured to adsorb the wafers provided by the at least two wafer pickers; The wafer bonding unit includes a mounting table and at least two mounting hands, the at least two mounting hands are configured to alternately acquire the wafer from the wafer adsorption area and bond the wafer to the substrate on the mounting table on. The wafer placement equipment as described in item 1 of the patent application range, wherein the at least two pickers include a first picker and a second picker, and the at least two pickers include a first picker and a second picker ; The wafer placement equipment also includes a wafer alignment unit. The wafer alignment unit includes a pickup alignment camera, a first slice alignment camera, a second slice alignment camera, and a first patch alignment camera And the second patch alignment camera; Wherein, the aforementioned pick-up alignment camera is located above the aforementioned material assembly, and the aforementioned pick-up alignment camera is configured to determine the position of the aforementioned wafer on the aforementioned material element; The first film-taking registration camera and the second film-taking registration camera are both configured to determine the position of the wafer to be taken on the rotatable turntable; The first patch alignment camera is configured to determine the position of the wafer obtained by the first patch hand on the placement table, and the second patch alignment camera is configured to determine the second The wafer obtained by the patch is placed at a position to be placed on the placement table. The wafer placement equipment as described in item 2 of the patent application range, wherein the rotatable turntable includes a first picking position corresponding to the first picker, a second picking position corresponding to the second picker, corresponding to the foregoing The first picking position of the first picker and the second picking position corresponding to the second picker; Wherein, the first film-taking position is located under the first film-taking camera, and the second film-taking position is under the second film-taking camera; The rotatable turntable is configured to sequentially move each of the wafer adsorption areas to the first wafer placement position, the second wafer placement position, the first wafer placement position, and the second wafer placement position by rotation; A film picker and the second film picker are also configured to place the wafers alternately on the wafer adsorption area corresponding to the first film placement position and the second film placement position; The first placement hand and the second placement hand are configured to alternately pick up the wafer from the wafer suction area corresponding to the first and second wafer picking locations, and alternately place the wafer on the wafer On the substrate on the placement table. The wafer placement equipment as described in item 3 of the patent application range, wherein the plurality of wafer adsorption areas are arranged at equal intervals around the center of the rotatable turntable, the first film taking position and the second film taking position Regarding the center symmetry of the rotatable turntable, the first film placement position and the second film taking position are symmetrical about the center of the rotatable turntable. The wafer mounting apparatus as described in item 3 of the patent application range, wherein the rotatable turntable includes a wafer stage and a rotary motor connected to the central axis of the wafer stage, the rotary motor is configured to drive the wafer stage to rotate ; The wafer stage includes a stage and an air path slip ring located inside the stage, the plurality of wafer adsorption areas are provided on the stage, and the air path slip ring is configured to supply vacuum and positive pressure to the plurality of wafer adsorption areas Pressure gas. The wafer placement equipment as described in item 5 of the patent application scope, wherein each wafer suction area of the stage is provided with suction holes, and a plurality of suction holes respectively communicating with the plurality of suction holes are provided inside the stage In the adsorption channel, the plurality of adsorption channels are in communication with the air slip ring. The wafer placement equipment as described in item 5 of the patent application scope, wherein the aforementioned material component is located below the aforementioned wafer stage; The feeding unit also includes a third picker and a fourth picker. The third picker and the fourth picker are configured to alternately pick up and turn over the wafers on the material element. The first picker and the picker The second picker is respectively configured to pick up the wafers of the third picker and the fourth picker and alternately place the wafers on the wafer suction area corresponding to the first picking position and the second picking position . The wafer placement equipment as described in item 3 of the patent application scope, wherein, The wafer bonding unit also includes a gantry frame, the first placement hand and the second placement hand are disposed on the gantry frame, and the gantry frame is configured according to the first film taking position, the second film taking position, and the foregoing The position of the patch is to drive the first patch hand and the second patch hand to move. The wafer placement equipment as described in item 3 of the patent application scope, wherein a placement avoidance area is provided between two adjacent wafer adsorption areas, and the placement table is located below the rotatable turntable; The wafer bonding unit also includes a gantry frame, the first placement hand and the second placement hand are disposed on the gantry frame, and the gantry frame is configured according to the first film taking position, the second film taking position, and the foregoing The position of the patch drives the first patch hand and the second patch hand to move longitudinally. The first placement hand and the second placement hand alternately place the wafer on the substrate on the placement table through the placement avoidance area. The wafer pick-and-place apparatus as described in item 8 or 9 of the patent application range, wherein the first fetch alignment camera is configured to determine the deflection angle of the wafer on the first fetch location, and the second fetch The chip alignment camera is configured to determine the deflection angle of the wafer on the second chip acquisition location, and the gantry is also configured to be based on the deflection of the wafer on the first chip acquisition location or the second chip acquisition location The angle drives the first patch hand and the second patch hand to rotate. According to the wafer placement equipment described in item 5 of the patent application scope, wherein the stage includes a hanging portion and a bearing portion, and the thickness of the bearing portion is less than or equal to 5 mm. The wafer pick-and-place equipment described in item 2 of the patent application scope, wherein the first pick-up registration camera, the second pick-up registration camera, the first pick-up registration camera and the second pick-up pair The position camera is fixed on the same substrate. The wafer placement equipment as described in item 1 of the patent application scope, wherein the placement table includes a support table, a first motion table, and a first suction table that are stacked in sequence; The aforementioned supporting table is configured to carry the aforementioned first moving table, the aforementioned first adsorption table and the aforementioned substrate; The aforementioned first moving stage is configured to move the aforementioned substrate to align the to-be-patched area on the aforementioned substrate with the to-be-patched position; The aforementioned first adsorption stage is configured to adsorb the aforementioned substrate. The wafer placement equipment as described in item 1 of the patent application scope, wherein the aforementioned material elements include a second motion table, a second suction table and a thimble unit that are sequentially stacked; The aforementioned second moving stage is configured to move the wafer to be picked to the picking position; The aforementioned second adsorption stage is configured to adsorb the aforementioned wafer to be taken; The thimble unit is configured to disengage the wafer to be taken at the picking position from the second suction stage. A chip mounting method, which is characterized in that it uses the chip mounting equipment as described in any one of items 1 to 14 of the patent application scope, which includes: At least two wafer pickers alternately pick up wafers from the material components and place the aforementioned wafers on multiple wafer adsorption areas of the rotatable turntable; The rotation of the rotatable turntable drives the plurality of wafer adsorption areas on the rotatable turntable to move; At least two placement hands alternately pick up the wafers from the plurality of wafer suction areas and place the wafers on the substrate on the placement table. The wafer placement method as described in item 15 of the patent application range, wherein the at least two pickers include a first picker and a second picker, and the at least two pickers include a first picker and a second picker The rotatable turntable includes a first picking position corresponding to the first picker, a second picking position corresponding to the second picker, a first picking position corresponding to the first picker, and a second sticker corresponding to the first picker The second position of the film player; The aforementioned chip mounting method also includes: During the first time, the first wafer picker picks up the wafer from the material element, and the second wafer picker places the wafer picked up from the material element in the wafer suction area corresponding to the second wafer release position , The first placement hand picks up the wafer from the wafer suction area corresponding to the first pick-up location, and the second placement hand picks up the wafer pick-up area corresponding to the second pick-up location The wafer chip is placed on the substrate on the wafer table; During the second time, the first wafer picker places the wafer picked up from the material assembly in the wafer suction area corresponding to the first wafer release position, and the second wafer picker picks the wafer from the material element , The first placement hand picks the wafer pick-up from the wafer suction area corresponding to the first pick-up location on the substrate on the placement table, and the second placement hand picks from the second Pick the wafer on the wafer suction area corresponding to the wafer bit.

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