CN112271150A - Repairing equipment and repairing method for Micro-LED array - Google Patents
Repairing equipment and repairing method for Micro-LED array Download PDFInfo
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- 238000003491 array Methods 0.000 claims description 2
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- 238000005516 engineering process Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 5
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- 238000005411 Van der Waals force Methods 0.000 description 1
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- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
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- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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Abstract
The invention provides a repairing device and a repairing method of a Micro-LED array, wherein the repairing device repairs the multi-core problem or the few-core problem of the Micro-LED array on a temporary substrate in an electromagnetic force or vacuum adsorption mode, and improves the positioning precision and the convenience of operation by arranging an X-direction driving shaft, a Y-direction driving shaft and a Z-direction driving shaft and designing a rotatable objective table, so that the cost and the difficulty of mass transfer are reduced, and the yield of chips is improved.
Description
Technical Field
The invention relates to the technical field of mass transfer of Micro-LED chips, in particular to a repairing device and a repairing method of a Micro-LED array.
Background
The Micro-LED technology is a new generation of display technology, and the Micro-LED chip has the advantages of low power consumption, high brightness, high luminous efficiency, short response time, long service life, high reliability, ultrahigh resolution, ultrahigh color saturation and the like.
Due to the small size of Micro-LEDs, the biggest difficulty in applying Micro-LED technology to the display field is the massive transfer technology.
At present, the mainstream mass transfer technology mainly comprises a stamp-up stamping method, and mainly utilizes models such as electrostatic force, magnetic force, van der waals force and the like to grab and release the Micro-LED; the fluid self-assembly method is characterized in that a Micro-LED chip falls into a corresponding well of a substrate mainly through the flow of fluid; the Rollprinting transfer method mainly realizes mass transfer by a printing technology; and a Selective Release method of Selective Release using a patterned laser.
Compared with the other three methods, the patterning laser method does not need to pass through a picking or cutting link, does not need to design a specific substrate, and can effectively improve the mass transfer efficiency.
Referring to fig. 1, fig. 1 is a diagram illustrating the number of Micro-LEDs after a mass transfer in the prior art. The existing laser transfer technology generally releases the Micro-LED chip 11 onto a temporary substrate 12, and then bonds the Micro-LED chip with the TFT substrate, and during this process, a multi-core or few-core phenomenon of the Micro-LED chip array often occurs, which affects the yield of subsequent bonding and increases the cost and difficulty of mass transfer.
Disclosure of Invention
In view of the above, in order to solve the above problems, the present invention provides a repairing apparatus and a repairing method for a Micro-LED array, and the technical solution is as follows:
a repair device for a Micro-LED array, the repair device comprising:
the device comprises a bearing table, a plurality of light source modules and a plurality of light source modules, wherein the bearing table is provided with at least two object stages, one object stage is used for placing a temporary substrate containing a Micro-LED chip array, and the other object stage is used for placing a standby substrate containing standby Micro-LED chips;
an X-direction drive shaft provided on the stage;
the fixing frame is arranged on the X-direction driving shaft and comprises a vertical fixing part and a horizontal fixing part, one end of the vertical fixing part is arranged on the X-direction driving shaft, and the other end of the vertical fixing part is connected with the horizontal fixing part, so that the horizontal fixing part is positioned above the bearing table;
a Y-direction drive shaft provided on the horizontal fixing portion, an extending direction of the X-direction drive shaft being perpendicular to an extending direction of the Y-direction drive shaft;
a Z-direction drive shaft disposed on the Y-direction drive shaft, an extending direction of the Y-direction drive shaft being perpendicular to an extending direction of the Z-direction drive shaft;
the chip grabbing device is arranged on the Z-direction driving shaft;
the space positions of the image acquisition device and the chip grabbing device are controlled by controlling the X-direction driving shaft, the Y-direction driving shaft and the Z-direction driving shaft;
the image acquisition device is used for acquiring a multi-core position or a few-core position in the Micro-LED chip array on the temporary substrate;
the chip grabbing device is used for transferring the Micro-LED chips at the multi-core position in the Micro-LED chip array on the temporary substrate to the standby substrate, or transferring the standby Micro-LED chips on the standby substrate to the position with few cores in the Micro-LED chip array on the temporary substrate.
Optionally, in the above repairing apparatus, the stage has a rotation shaft for rotating within a range of 90 °.
Optionally, in the repairing apparatus, an electromagnetic force device is disposed inside the stage and is used for fixing the Micro-LED chip.
Optionally, in the repair apparatus, the stage has a plurality of vacuum suction holes for fixing the temporary substrate and the spare substrate.
Optionally, in the repairing apparatus, the chip gripping device has a rotating disc and a plurality of suction heads of different models;
the rotary disc is used for selecting suction heads of different models.
Optionally, in the above repairing apparatus, the suction head is a vacuum suction head.
Optionally, in the repairing device, the suction head is a magnetic suction head.
Optionally, in the above repairing apparatus, the image capturing device is a CCD camera.
A method of repairing a Micro-LED array, the method comprising:
controlling the image acquisition device to detect and position the Micro-LED chip array on the temporary substrate;
judging whether the Micro-LED chip array on the temporary substrate has a multi-core condition or a few-core condition;
when the Micro-LED chip array on the temporary substrate has a few-core condition, controlling the image acquisition device to position the standby Micro-LED chip on the standby substrate, moving the chip grabbing device to the position of a certain standby Micro-LED chip on the standby substrate, grabbing the standby Micro-LED chip and placing the standby Micro-LED chip at the few-core position of the Micro-LED chip array on the temporary substrate;
and when the Micro-LED chip array on the temporary substrate has a multi-core condition, moving the chip grabbing device to a certain multi-core position on the temporary substrate, and grabbing redundant Micro-LED chips and placing the redundant Micro-LED chips at the vacant positions on the standby substrate.
Optionally, in the repairing method, before controlling the image capturing device to detect and position the array of Micro-LED chips on the temporary substrate, the repairing method further includes:
controlling the image acquisition device to perform pre-detection and positioning on the Micro-LED chip array on the temporary substrate;
the stage is controlled to rotate so that the row direction of the Micro-LED chip array is parallel to the Y-direction drive shaft and the column direction is parallel to the X-direction drive shaft.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a Micro-LED array repairing device, which comprises: the device comprises a bearing table, a plurality of light source modules and a plurality of light source modules, wherein the bearing table is provided with at least two object stages, one object stage is used for placing a temporary substrate containing a Micro-LED chip array, and the other object stage is used for placing a standby substrate containing standby Micro-LED chips; an X-direction drive shaft provided on the stage; the fixing frame is arranged on the X-direction driving shaft and comprises a vertical fixing part and a horizontal fixing part, one end of the vertical fixing part is arranged on the X-direction driving shaft, and the other end of the vertical fixing part is connected with the horizontal fixing part, so that the horizontal fixing part is positioned above the bearing table; a Y-direction drive shaft provided on the horizontal fixing portion, an extending direction of the X-direction drive shaft being perpendicular to an extending direction of the Y-direction drive shaft; a Z-direction drive shaft disposed on the Y-direction drive shaft, an extending direction of the Y-direction drive shaft being perpendicular to an extending direction of the Z-direction drive shaft; the chip grabbing device is arranged on the Z-direction driving shaft; the space positions of the image acquisition device and the chip grabbing device are controlled by controlling the X-direction driving shaft, the Y-direction driving shaft and the Z-direction driving shaft; the image acquisition device is used for acquiring a multi-core position or a few-core position in the Micro-LED chip array on the temporary substrate; the chip grabbing device is used for transferring the Micro-LED chips at the multi-core position in the Micro-LED chip array on the temporary substrate to the standby substrate, or transferring the standby Micro-LED chips on the standby substrate to the position with few cores in the Micro-LED chip array on the temporary substrate.
The repairing device solves the problem of repairing few cores or multiple cores in the process of transferring the Micro-LED chip in a huge amount, and reduces the cost and difficulty of transferring the huge amount.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a graph illustrating the number of Micro-LEDs after a mass transfer in the prior art;
FIG. 2 is a schematic structural diagram of a repairing apparatus for a Micro-LED array according to an embodiment of the present invention;
FIG. 3 is a schematic partial structural view of a repairing apparatus for a Micro-LED array according to an embodiment of the present invention;
FIG. 4 is a schematic flow chart illustrating a repairing method for a Micro-LED array according to an embodiment of the present invention;
FIG. 5 is a schematic flow chart illustrating another repairing method for a Micro-LED array according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a repairing apparatus for a Micro-LED array according to an embodiment of the present invention.
Referring to fig. 3, fig. 3 is a schematic partial structural diagram of a repairing apparatus for a Micro-LED array according to an embodiment of the present invention.
The repair apparatus includes:
a carrier 10, wherein the carrier 10 has at least two stages, one stage 13 is used for placing a temporary substrate 12 containing an array 11 of Micro-LED chips, and the other stage 14 is used for placing a spare substrate 16 containing spare Micro-LED chips 15;
an X-direction drive shaft 17 provided on the stage 10;
a fixing frame 18 provided on the X-direction driving shaft 17, the fixing frame 18 including a vertical fixing portion 181 and a horizontal fixing portion 182, one end of the vertical fixing portion 181 being provided on the X-direction driving shaft 17, and the other end being connected to the horizontal fixing portion 182, so that the horizontal fixing portion 182 is located above the carrier table 10;
a Y-direction drive shaft 19 provided on the horizontal fixing portion 182, an extending direction of the X-direction drive shaft 17 being perpendicular to an extending direction of the Y-direction drive shaft 19;
a Z-direction drive shaft 20 provided on the Y-direction drive shaft 19, an extending direction of the Y-direction drive shaft 19 being perpendicular to an extending direction of the Z-direction drive shaft 20;
an image pickup device 21 provided on the Y-direction drive shaft 19, and a chip gripper 22 provided on the Z-direction drive shaft 20;
wherein the spatial positions of the image capturing device 21 and the chip gripper 22 are controlled by controlling the X-direction drive shaft 17, the Y-direction drive shaft 19, and the Z-direction drive shaft 20;
the image acquisition device 21 is used for acquiring a multi-core position or a few-core position in the Micro-LED chip array 11 on the temporary substrate 12;
the chip gripper 22 is used to transfer Micro-LED chips at multi-core positions in the array of Micro-LED chips 11 on the temporary substrate 12 to the spare substrate 16, or to transfer spare Micro-LED chips 15 on the spare substrate 16 to less-core positions in the array of Micro-LED chips 11 on the temporary substrate 12.
In this embodiment, the Micro-LED chip 11 is transferred onto one of the stages 13 after being released onto the temporary substrate 12 using a patterned laser method.
Another stage 14 is used to place a spare substrate 16 containing spare Micro-LED chips 15, which spare substrate 16 also has free areas.
Scanning the Micro-LED chip array 11 on the temporary substrate 12 through an image acquisition device 21, and determining a multi-core position and a few-core position on the temporary substrate 12.
The X-direction drive shaft 17 and the Y-direction drive shaft 19 are controlled to position the chip gripper 22 to a multi-core position, and the Z-direction drive shaft 20 is controlled to position the chip gripper 22 close to the excess Micro-LED chips, pick up the excess Micro-LED chips and place them on the spare substrate 16.
And controlling the X-direction driving shaft 17 and the Y-direction driving shaft 19 to position the chip grabbing device 22 to the standby Micro-LED chip 15, and controlling the Z-direction driving shaft 20 to make the chip grabbing device 22 close to the standby Micro-LED chip 15, pick up the standby Micro-LED chip 15 and place the chip grabbing device at the chip-less position on the temporary substrate 12.
Further, according to the above embodiment of the present invention, the stages 13 and 14 have a rotation axis for rotating within a range of 90 °.
In this embodiment, the rotation axis is used to drive the stage to rotate within 90 ° to control the direction of the Micro-LED chip array, so that the row direction of the Micro-LED chip array is parallel to the Y-direction driving axis, and the column direction is parallel to the X-direction driving axis, thereby further improving the positioning accuracy.
Further, according to the above embodiment of the present invention, electromagnetic force devices are disposed inside the object stages 13 and 14 for fixing the Micro-LED chip.
In this embodiment, after the electromagnetic force device is turned on, the spare Micro-LED chip can be fixed at the position with less core, and the stability of the Micro-LED chip is increased to prevent the Micro-LED chip from being shifted.
And when the redundant Micro-LED chips need to be grabbed, closing the electromagnetic force device.
Further, according to the above embodiment of the present invention, the stages 13 and 14 have a plurality of vacuum suction holes for fixing the temporary substrate and the spare substrate.
In this embodiment, by providing a plurality of vacuum suction holes, the stability between the substrate and the stage is further improved, and the substrate is prevented from being positionally displaced.
Further, according to the above embodiment of the present invention, as shown in fig. 2, the chip gripper 22 has a rotating disk and a plurality of suction heads of different models;
the rotary disc is used for selecting suction heads of different models.
In this embodiment, by providing suction heads of different models, the versatility of the repair device can be further improved.
Optionally, the tip is a vacuum tip.
Optionally, the suction head is a magnetic suction head.
Further, according to the above embodiment of the present invention, the image capturing device 21 includes, but is not limited to, a CCD camera.
According to the above description, the multi-core problem or the few-core problem of the Micro-LED array on the temporary substrate is repaired by the repairing equipment in an electromagnetic force or vacuum adsorption mode, the positioning precision and the convenience of operation are improved by arranging the X-direction driving shaft, the Y-direction driving shaft and the Z-direction driving shaft and designing the rotatable objective table, the cost and the difficulty of mass transfer are reduced, and the yield of chips is improved.
Further, based on all the above embodiments of the present invention, in another embodiment of the present invention, a repairing method for a Micro-LED array is further provided, referring to fig. 4, and fig. 4 is a schematic flow chart of the repairing method for a Micro-LED array according to the embodiment of the present invention.
The repairing method comprises the following steps:
s101: and controlling the image acquisition device to detect and position the Micro-LED chip array on the temporary substrate.
S102: and judging whether the Micro-LED chip array on the temporary substrate has a multi-core condition or a few-core condition.
When there is a low core situation for the array of Micro-LED chips on the temporary substrate,
s103: and controlling the image acquisition device to position the standby Micro-LED chip on the standby substrate.
S104: and moving the chip grabbing device to the position of a certain standby Micro-LED chip on the standby substrate.
S105: and grabbing and placing the standby Micro-LED chip at a core-less position of the Micro-LED chip array on the temporary substrate.
When there is a multi-core situation for the array of Micro-LED chips on the temporary substrate,
s106: and moving the chip grabbing device to a certain multi-core position on the temporary substrate.
S107: excess Micro-LED chips are grabbed and placed at the vacant locations on the spare substrate.
Further, based on the above embodiment of the present invention, referring to fig. 5, fig. 5 is a schematic flow chart of another repairing method for a Micro-LED array according to an embodiment of the present invention.
Before controlling the image acquisition device to detect and position the array of Micro-LED chips on the temporary substrate, the repairing method further comprises the following steps:
s108: and controlling the image acquisition device to perform pre-detection and positioning on the Micro-LED chip arrays on the temporary substrate and the standby substrate.
S109: the stage is controlled to rotate so that the row direction of the Micro-LED chip array is parallel to the Y-direction drive shaft and the column direction is parallel to the X-direction drive shaft.
The repairing device and the repairing method for the Micro-LED array provided by the present invention are described in detail above, and the principle and the implementation of the present invention are explained herein by applying specific examples, and the description of the above examples is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include or include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A Micro-LED array repair apparatus, comprising:
the device comprises a bearing table, a plurality of light source modules and a plurality of light source modules, wherein the bearing table is provided with at least two object stages, one object stage is used for placing a temporary substrate containing a Micro-LED chip array, and the other object stage is used for placing a standby substrate containing standby Micro-LED chips;
an X-direction drive shaft provided on the stage;
the fixing frame is arranged on the X-direction driving shaft and comprises a vertical fixing part and a horizontal fixing part, one end of the vertical fixing part is arranged on the X-direction driving shaft, and the other end of the vertical fixing part is connected with the horizontal fixing part, so that the horizontal fixing part is positioned above the bearing table;
a Y-direction drive shaft provided on the horizontal fixing portion, an extending direction of the X-direction drive shaft being perpendicular to an extending direction of the Y-direction drive shaft;
a Z-direction drive shaft disposed on the Y-direction drive shaft, an extending direction of the Y-direction drive shaft being perpendicular to an extending direction of the Z-direction drive shaft;
the chip grabbing device is arranged on the Z-direction driving shaft;
the space positions of the image acquisition device and the chip grabbing device are controlled by controlling the X-direction driving shaft, the Y-direction driving shaft and the Z-direction driving shaft;
the image acquisition device is used for acquiring a multi-core position or a few-core position in the Micro-LED chip array on the temporary substrate;
the chip grabbing device is used for transferring the Micro-LED chips at the multi-core position in the Micro-LED chip array on the temporary substrate to the standby substrate, or transferring the standby Micro-LED chips on the standby substrate to the position with few cores in the Micro-LED chip array on the temporary substrate.
2. The prosthetic device of claim 1 wherein the stage has a rotational axis for rotation within a 90 ° range.
3. The repair device according to claim 1, wherein the stage is internally provided with electromagnetic force means for fixing the Micro-LED chip.
4. The repair apparatus of claim 1 wherein the stage has a plurality of vacuum chucking holes formed therein for holding the temporary substrate and the spare substrate.
5. The repair apparatus as claimed in claim 1, wherein the chip gripping device has a rotating disk and a plurality of suction heads of different models;
the rotary disc is used for selecting suction heads of different models.
6. The repair device according to claim 4, wherein the suction head is a vacuum suction head.
7. The repair device according to claim 4, wherein the suction head is a magnetic suction head.
8. The prosthetic device of claim 1 wherein the image capture means is a CCD camera.
9. A repairing method of a Micro-LED array is characterized by comprising the following steps:
controlling the image acquisition device to detect and position the Micro-LED chip array on the temporary substrate;
judging whether the Micro-LED chip array on the temporary substrate has a multi-core condition or a few-core condition;
when the Micro-LED chip array on the temporary substrate has a few-core condition, controlling the image acquisition device to position the standby Micro-LED chip on the standby substrate, moving the chip grabbing device to the position of a certain standby Micro-LED chip on the standby substrate, grabbing the standby Micro-LED chip and placing the standby Micro-LED chip at the few-core position of the Micro-LED chip array on the temporary substrate;
and when the Micro-LED chip array on the temporary substrate has a multi-core condition, moving the chip grabbing device to a certain multi-core position on the temporary substrate, and grabbing redundant Micro-LED chips and placing the redundant Micro-LED chips at the vacant positions on the standby substrate.
10. The repair method according to claim 9, wherein before controlling the image capturing device to detect and position the array of Micro-LED chips on the temporary substrate, the repair method further comprises:
controlling the image acquisition device to perform pre-detection and positioning on the Micro-LED chip arrays on the temporary substrate and the standby substrate;
the stage is controlled to rotate so that the row direction of the Micro-LED chip array is parallel to the Y-direction drive shaft and the column direction is parallel to the X-direction drive shaft.
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| CN202011175086.3A CN112271150A (en) | 2020-10-28 | 2020-10-28 | Repairing equipment and repairing method for Micro-LED array |
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| CN202011175086.3A CN112271150A (en) | 2020-10-28 | 2020-10-28 | Repairing equipment and repairing method for Micro-LED array |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022222148A1 (en) * | 2021-04-23 | 2022-10-27 | 重庆康佳光电技术研究院有限公司 | Chip transfer method and apparatus, display backplane, and display |
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| CN111063628A (en) * | 2018-10-16 | 2020-04-24 | 上海微电子装备（集团）股份有限公司 | Chip bonding device |
| CN210040133U (en) * | 2019-06-10 | 2020-02-07 | 义乌臻格科技有限公司 | Huge detection system for photoelectric performance of micro surface-emitting photoelectric chip array |
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| WO2022222148A1 (en) * | 2021-04-23 | 2022-10-27 | 重庆康佳光电技术研究院有限公司 | Chip transfer method and apparatus, display backplane, and display |
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