CN113013067A - Transfer method with detection and chip repair functions - Google Patents
Transfer method with detection and chip repair functions Download PDFInfo
- Publication number
- CN113013067A CN113013067A CN202110228418.8A CN202110228418A CN113013067A CN 113013067 A CN113013067 A CN 113013067A CN 202110228418 A CN202110228418 A CN 202110228418A CN 113013067 A CN113013067 A CN 113013067A
- Authority
- CN
- China
- Prior art keywords
- chip
- adapter plate
- interposer
- placement
- distance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 49
- 238000001514 detection method Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000008439 repair process Effects 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 230000002159 abnormal effect Effects 0.000 claims abstract description 24
- 230000003287 optical effect Effects 0.000 claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 2
- 230000007246 mechanism Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000003993 interaction Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a transfer method with detection and chip repair functions, which is characterized in that before an electrode of a chip on an adapter plate is aligned and welded with a bonding pad on a substrate, the adapter plate which has completed chip transfer is detected by using an optical detection device to obtain whether the chip is missed or a chip with abnormal placement on the adapter plate, if the chip is missed, a new chip is repaired at the position of the missed chip; if the chip with abnormal placement exists, taking out the chip with abnormal placement from the adapter plate, and fixing the chip on the corresponding position of the adapter plate again after the chip with abnormal placement is adjusted correctly; and aligning the electrodes of the chip on the adapter plate with the bonding pads on the substrate and welding and fixing the electrodes. The invention can avoid the situations of core leakage on the substrate or poor welding between the chip electrode and the pad electrode and the like caused by core leakage, abnormal placement and the like when the chip is transferred to the adapter plate.
Description
Technical Field
The invention relates to the technical field of LED chip transfer, in particular to a transfer method with the functions of detecting and repairing a chip.
Background
The Mini-LED and the Micro-LED have the advantages of low power consumption, high brightness, good light-emitting efficiency, lightness, thinness and the like, and become the mainstream trend of future display technologies.
At present, in the process of manufacturing Mini-LED and Micro-LED, the process of transferring the chip in huge quantity is involved. In the conventional process, after the chip is transferred to the adapter plate, the adapter plate and the substrate are usually directly aligned, and finally, the chip electrode and the bonding pad are welded and fixed. However, due to the problems of uneven adhesion on the interposer, chip leakage, die-up, chip offset, etc. are likely to occur when transferring the chip to the interposer, which in turn leads to the occurrence of chip leakage on the substrate, or the occurrence of poor contact between the chip electrode and the pad, or cold solder joint, etc. Therefore, a large amount of time is required for rework, and the work efficiency is low.
Therefore, it is necessary to provide a transferring method for detecting and repairing chips to solve the above problems.
Disclosure of Invention
The invention aims to provide a transfer method with chip detection and repair functions, so as to avoid the situations of chip leakage on a substrate or poor welding between a chip electrode and a pad electrode and the like caused by chip leakage, abnormal placement and the like when a chip is transferred to an adapter plate, and improve the yield of products.
In order to achieve the above object, the present invention provides a transferring method for detecting and repairing a chip, comprising the following steps:
(1) providing a substrate with a bonding pad on the surface and an adapter plate coated with adhesive;
(2) transferring the chip array to the plane where the adhesive of the adapter plate is located;
(3) detecting the adapter plate after the chip transfer is completed by using an optical detection device to obtain whether the adapter plate is missing a chip or has a chip with abnormal placement, if not, executing the step (5), otherwise, executing the step (4);
(4) repairing a new chip at the position of the missing chip and/or taking out the chip with abnormal placement from the adapter plate and adjusting the chip correctly, and then fixing the chip at the corresponding position of the adapter plate again;
(5) and aligning the electrode of the chip on the adapter plate with the bonding pad on the substrate and welding and fixing the electrode and the bonding pad.
Preferably, the "placement anomaly" includes placement position deviation and placement angle deflection, when a chip is placed on the interposer in a position deviation manner, the chip is correctly corresponding to the interposer by translating the interposer or the chip with the placement anomaly, and when the chip is placed on the interposer in a position deflection manner, the chip is correctly corresponding to the interposer by rotating the interposer or the chip with the placement anomaly.
Preferably, a support platform is adopted to fix the adapter plate, the side of the adapter plate, on which the chip is fixed, faces away from the support platform, in the step (4), the support platform is used to bear the distance corresponding to the offset of the translation and the placement position of the adapter plate, so that the chip with abnormal placement is correctly corresponding to the adapter plate, and the support platform is used to bear the angle corresponding to the deflection of the rotation and the placement angle of the adapter plate, so that the chip with abnormal placement is correctly corresponding to the adapter plate.
Preferably, in the step (4), the chip placed abnormally is taken out of the adapter plate by using a suction nozzle structure.
Preferably, the step (2) is specifically: the chip is taken by adopting a transfer structure with a pressure detection piece, the chip is carried to move towards the adapter plate for a preset distance, the pressure between the chip and the transfer structure is detected by the pressure detection piece, and if a preset pressure value is sensed, the transfer structure is driven to return to the original state; if the preset pressure value is not sensed, the chip is carried to continue to move towards the adapter plate until the pressure detection piece senses the preset pressure value, and then the transfer structure is driven to return to the original state.
Preferably, "the carrier chip moves toward the interposer by a predetermined distance" specifically includes: carrying a chip to move a first distance towards the adapter plate at a first speed, wherein the first distance corresponds to a position point of the chip when the chip is not in contact with the adhesive of the adapter plate; and carrying the chip at a second speed and continuously moving the chip towards the adapter plate for a second distance, wherein the second speed is less than the first speed, and the preset distance is equal to the sum of the first distance and the second distance.
Preferably, the transfer structure carries a chip through a thimble, and the thimble is provided with the pressure detection piece.
Preferably, before step (5), further comprising: and detecting the thickness of the bonding pad by using an optical detection device, and adjusting the distance between the adapter plate and the substrate according to the thickness of the bonding pad so as to ensure that the electrodes of each chip are respectively in stable contact with the corresponding bonding pad on the substrate.
Preferably, before step (5), further comprising: and carrying out patterning treatment on the substrate, and forming a black patterned layer around the bonding pad of the substrate so as to facilitate the optical detection device to identify the position of the bonding pad.
Preferably, the adhesive is a UV adhesive, and after the step (5), the chip is separated from the interposer by irradiating the adhesive with ultraviolet light.
Compared with the prior art, before the electrodes of the chips on the adapter plate are aligned and welded with the bonding pads on the substrate, the optical detection device is used for detecting the adapter plate which has completed chip transfer to obtain whether the chips are missed or abnormally placed on the adapter plate, and if the chips are missed, new chips are added at the positions of the missed chips; if the chip with abnormal placement exists, taking out the chip with abnormal placement from the adapter plate, and fixing the chip on the corresponding position of the adapter plate again after the chip with abnormal placement is adjusted correctly; and aligning the electrodes of the chip on the adapter plate with the bonding pads on the substrate and welding and fixing the electrodes. The invention can avoid the situations of core leakage on the substrate, poor welding between the chip electrode and the pad electrode and the like caused by core leakage, abnormal placement and the like when the chip is transferred to the adapter plate, thereby improving the product yield, reducing the rework frequency and greatly improving the operation efficiency.
Drawings
Fig. 1 is a flow chart of the operation of the adapter plate of the present invention.
FIG. 2 is a schematic diagram of the front and rear interposer of the repair chip of the present invention.
FIG. 3 is a schematic diagram of the chip repairing process according to the present invention.
Fig. 4 is a process diagram of transferring a chip to an interposer according to an embodiment of the present invention.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, and thus, are not to be construed as limiting the scope of the present invention.
The embodiment discloses a transfer method for detecting and repairing a chip, which comprises the following steps:
(1) providing a substrate (PCB board, not shown) and an interposer 1, wherein the substrate has a pad on a surface thereof, and the interposer 1 is coated with an adhesive.
(2) The chip array is transferred to the plane of the adhesive of the interposer 1.
(3) The optical detection device is used for detecting the adapter plate 1 which finishes the chip transfer so as to obtain whether the adapter plate 1 has a missing chip or chips 6 'and 6' with abnormal placement (as shown in (a) in fig. 2), if not, step (5) is executed, otherwise, step (4) is executed.
(4) After a new chip 60 is added to the missing chip position 10 and/or the abnormally placed chips 6', 6 ″ are removed from the interposer 1 and properly aligned, the chips are again fixed to the corresponding positions of the interposer 1 (see (b) in fig. 2).
(5) And aligning the electrodes of the chip on the adapter plate 1 with the bonding pads on the substrate and welding and fixing the electrodes.
Wherein the placement anomaly comprises a placement position offset and a placement angle deflection. When the placement position of the chip on the interposer 1 is shifted (as shown in fig. 2 (a)), the interposer 1 or the chip 6 'is translated to make the chip 6' correspond correctly to the interposer 1, and when the placement angle of the chip on the interposer 1 is deflected (as shown in fig. 2 (a)), the interposer 1 or the chip 6 "is rotated to make the chip 6" correspond correctly to the interposer 1. In some embodiments, there is also a chip plane misplacement (the surface adhered with the adhesive of the interposer 1 is not a plane (top surface) facing away from the chip electrodes, including the situations of chip top and bottom surface reversed, chip standing, etc.), at this time, optionally, the chip is taken out of the interposer 1 and a new chip is added at the corresponding position; or, the chip is taken out from the adapter plate 1 and is fixed on the corresponding position of the adapter plate 1 again after being adjusted correctly.
Specifically, as shown in fig. 1, the interposer 1 with the transferred chips is conveyed to enter the optical detection area 2, and then detected by the optical detection device, and if the interposer 1 is detected to have missing chips or chips 6' and 6 ″ with abnormal placement, the interposer 1 is conveyed to enter the repair area 3 for repair. And after the repair is finished, outputting the adapter plate 1, and then performing alignment welding on the electrode of the chip 6 on the adapter plate 1 and the bonding pad on the substrate.
As shown in fig. 3, in this embodiment, the suction nozzle mechanism 4 is used to take out the chips 6', 6 ″ abnormally placed on the interposer 1 and place the chip 6 on the interposer 1, and the interposer 1 to be repaired is fixed by the support platform 5 with the side of the interposer 1 to which the chip is fixed facing away from the support platform 5. The support platform 5 is a vacuum platform, which fixes the adapter plate 1 by negative pressure and can drive the adapter plate 1 to move or rotate. If the chip missing on the adapter plate 1 is detected, a new chip is sucked by the suction nozzle mechanism 4 and is placed at the chip missing position 10; if the chip 6' with the placement position offset exists on the adapter plate 1, the chip 6' with the placement position offset is sucked up by the suction nozzle mechanism 4, and then the support platform 5 is used for bearing the adapter plate 1 to translate for a distance corresponding to the placement position offset, so that the chip 6' with the placement position offset corresponds to the adapter plate 1 correctly. If the chip 6 'with the deflection placing angle on the adapter plate 1 is detected, the support platform 5 is used for bearing the adapter plate 1 to rotate by an angle corresponding to the deflection of the placing angle, so that the chip 6' with the deflection placing angle is correctly corresponding to the adapter plate 1. Finally, the patch board 1 after completion of repair is shown in fig. 2 (b).
Specifically, the adhesive on the interposer 1 is a UV adhesive, and after step (5), the chip 6 is separated from the interposer 1 by irradiating the UV adhesive with ultraviolet light.
Referring to fig. 4, (a) shows a schematic diagram of the chip 6 in an initial state in one embodiment. (a) In the illustrated embodiment, the interposer 1 is disposed above the transfer structure, and the adhesive of the interposer 1 is disposed in a downward plane. The transfer structure comprises a blue film platform, the blue film platform comprises a blue film 8 and a chip adjusting mechanism, the blue film 8 bears a chip 6 to be transferred, the blue film platform is arranged in parallel with the adapter plate 1, and meanwhile, the chip adjusting mechanism can adjust the position of the chip 6 on the blue film 8 (in the prior art, see chinese patent CN 209389053U).
In this embodiment, the chip 6 to be transferred is borne by the transfer structure with the pressure detection member 7 to rise by a preset distance, and if the pressure detection member 7 senses a preset pressure value, it indicates that the chip 6 has been normally transferred to the interposer 1, and the chip 6 does not need to be borne to continue rising, and at this time, the transfer structure is driven to fall back to the original state. If the preset pressure value is not sensed, the chip 6 is not normally transferred to the adapter plate 1, at the moment, the chip 6 is borne by the transfer structure to continuously rise until the pressure detection piece 7 senses the preset pressure value, and then the transfer structure is driven to descend to the original position. Of course, the positional relationship between the interposer 1 and the transfer structure is not limited to the case illustrated in the present embodiment, and likewise, the chip 6 is not limited to being transferred to the interposer 1 by moving the carrier chip 6 upward toward the interposer 1. Whether the chip 6 normally transfers to the adapter plate 1 is confirmed through the pressure between the pressure detection piece 7 detection chip 6 and the transfer structure, when the problem of chip 6 thickness difference or blue membrane 8 deformation leads to still unable normal contact adapter plate 1 and produce predetermined interact power towards the chip 6 after the adapter plate 1 motion preset distance, bear chip 6 and continue to carry out distance compensation towards the adapter plate 1 motion, finally make chip 6 normally transfer to adapter plate 1, can effectively avoid appearing adapter plate 1 core leakage scheduling problem, thereby avoid situations such as base plate core leakage, the chip 6 transfer yield has been improved.
As a preferred embodiment, the chip 6 to be transferred is first carried at a first speed and raised by a first distance corresponding to the point where the chip 6 does not contact the adhesive of the interposer 1 (as shown in fig. 4 (b)). And then, carrying the chip 6 to be transferred at a second speed and continuously rising for a second distance, and simultaneously detecting the pressure between the chip 6 and the transfer structure in real time through the pressure detection part 7, wherein the second speed is less than the first speed, and the preset distance is equal to the sum of the first distance and the second distance. By making the chip 6 approach the interposer 1 at a first speed and then making the chip 6 contact the interposer 1 at a second speed, which is lower, the interaction force is generated, which takes into account the time consumed for driving the chip 6 to rise and better controls the interaction force between the chip 6 and the interposer 1.
Specifically, after the chip 6 to be transferred is carried at the second speed and continuously rises for the second distance, if there is no problem such as warpage of the interposer 1, thickness difference of the chip 6, or deformation of the blue film 8, the pressure detection member 7 will sense a preset pressure value, and at this time, the state of the chip 6 is as shown in (d) of fig. 4. If there are problems such as warpage of the interposer 1, thickness difference of the chip 6, or deformation of the blue film 8, the pressure detector 7 will not sense the preset pressure value, and at this time, the state of the chip 6 is as shown in fig. 4 (c). Then, further, the chip 6 to be transferred is carried by the transfer structure at a third speed less than the first speed and continues to rise for distance compensation until the pressure detection member 7 senses a preset pressure value, at which time, the state of the chip 6 is as shown in fig. 4 (d). In this way, normal transfer of the chip 6 to the interposer 1 is ensured. Alternatively, the third speed may be lower than the second speed or equal to the second speed.
In this embodiment, the transfer structure has a thimble 9, the thimble 9 is disposed under the blue film platform, and the blue film platform is supported upward by the thimble 9 to carry the chip 6 disposed on the blue film platform. The pressure detecting element 7 is disposed on the thimble 9, but should not be limited thereto. Incidentally, the transfer structure is a crystal discharging machine commonly used in the field, and before the chip 6 is transferred, a pressure detection member 7 is mounted on the thimble 9 in advance, and the pressure detection member 7 is in communication connection with the control system, and how to perform program setting to realize distance compensation according to whether the pressure detection member 7 senses a preset pressure value can be configured by a person skilled in the art according to specific requirements.
Further, before the electrodes of the chips 6 on the interposer 1 are aligned with the pads on the substrate, the thickness of the pads is detected by an optical detection device, and the distance between the interposer 1 and the substrate is adjusted according to the thickness of the pads so that the electrodes of the chips 6 are in stable contact with the corresponding pads on the substrate.
Before the electrodes of the chip 6 on the interposer 1 are aligned with the pads on the substrate, the substrate is patterned to form a black patterned layer around the pads of the substrate so that the optical inspection apparatus can recognize the positions of the pads.
In addition, in an embodiment, a first identification code is further pasted on the substrate in advance, a second identification code matched with the first identification code is pasted on the adapter plate 1, the optical detection device further collects information of the first identification code when detecting the adapter plate 1, and the transfer structure further collects information of the second identification code so as to check whether the current adapter plate 1 is matched with the substrate, so that it is ensured that the electrode of the chip 6 on the current adapter plate 1 is matched with the bonding pad of the current substrate.
The optical detection device may be a CCD detection device, and how to achieve the chip placement anomaly information acquisition and the pad thickness detection on the interposer 1 by using the CCD detection device is the prior art and is not described herein again.
In summary, before the electrodes of the chips 6 on the interposer 1 are aligned and welded with the pads on the substrate, the interposer 1 with chips transferred is first detected by an optical detection device to obtain whether chips are missing or chips 6', 6 with abnormal placement are present on the interposer 1, and if chips are missing, a new chip is repaired at the position 10 of the missing chip; if the chip 6 'and 6 ″ with abnormal placement exists, taking out the chip 6' and 6 ″ with abnormal placement from the adapter plate 1, adjusting the chip 6 'and 6 ″ correctly, and fixing the chip 6' and 6 ″ on the corresponding position of the adapter plate 1 again; then, the electrodes of the chip 6 on the interposer 1 are aligned with the pads on the substrate and soldered. The invention can avoid the situations of core leakage on the substrate, poor welding between the electrode of the chip 6 and the electrode of the bonding pad and the like caused by core leakage, abnormal placement and the like when the chip 6 is transferred to the adapter plate 1, improve the yield of products, reduce the rework frequency and greatly improve the operation efficiency.
The above disclosure is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, so that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
Claims (10)
1. A transfer method for detecting and repairing chips at the same time is characterized by comprising the following steps:
(1) providing a substrate with a bonding pad on the surface and an adapter plate coated with adhesive;
(2) transferring the chip array to the plane where the adhesive of the adapter plate is located;
(3) detecting the adapter plate after the chip transfer is completed by using an optical detection device to obtain whether the adapter plate is missing a chip or has a chip with abnormal placement, if not, executing the step (5), otherwise, executing the step (4);
(4) repairing a new chip at the position of the missing chip and/or taking out the chip with abnormal placement from the adapter plate and adjusting the chip correctly, and then fixing the chip at the corresponding position of the adapter plate again;
(5) and aligning the electrode of the chip on the adapter plate with the bonding pad on the substrate and welding and fixing the electrode and the bonding pad.
2. The transfer method according to claim 1, wherein the "placement anomaly" includes a placement position deviation and a placement angle deflection, and when a placement position of a chip on the interposer deviates, the chip is correctly corresponded to the interposer by translating the interposer or the chip with the placement anomaly, and when the placement angle of a chip on the interposer deviates, the chip is correctly corresponded to the interposer by rotating the interposer or the chip with the placement anomaly.
3. The transfer method according to claim 2, wherein a support platform is used to fix the interposer and the side of the interposer where the chip is fixed faces away from the support platform, and in step (4), the support platform is used to support the interposer to translate a distance corresponding to a placement offset so that the chip with abnormal placement corresponds to the interposer correctly, and the support platform is used to support the interposer to rotate an angle corresponding to a placement angle deflection so that the chip with abnormal placement corresponds to the interposer correctly.
4. The transfer method according to claim 1, wherein in the step (4), the chip placed abnormally is taken out of the interposer using a suction nozzle structure.
5. The transfer method according to claim 1, wherein the step (2) is specifically: the chip is taken by adopting a transfer structure with a pressure detection piece, the chip is carried to move towards the adapter plate for a preset distance, the pressure between the chip and the transfer structure is detected by the pressure detection piece, and if a preset pressure value is sensed, the transfer structure is driven to return to the original state; if the preset pressure value is not sensed, the chip is carried to continue to move towards the adapter plate until the pressure detection piece senses the preset pressure value, and then the transfer structure is driven to return to the original state.
6. The transfer method according to claim 5, wherein the step of moving the carrier chip toward the interposer by a predetermined distance is specifically as follows:
carrying a chip to move a first distance towards the adapter plate at a first speed, wherein the first distance corresponds to a position point of the chip when the chip is not in contact with the adhesive of the adapter plate;
and carrying the chip at a second speed and continuously moving the chip towards the adapter plate for a second distance, wherein the second speed is less than the first speed, and the preset distance is equal to the sum of the first distance and the second distance.
7. The transfer method of claim 5, wherein said transfer structure carries a chip by a thimble on which said pressure sensing element is disposed.
8. The transfer method according to claim 1, characterized by, before step (5), further comprising:
and detecting the thickness of the bonding pad by using an optical detection device, and adjusting the distance between the adapter plate and the substrate according to the thickness of the bonding pad so as to ensure that the electrodes of each chip are respectively in stable contact with the corresponding bonding pad on the substrate.
9. The transfer method according to claim 8, further comprising, before step (5):
and carrying out patterning treatment on the substrate, and forming a black patterned layer around the bonding pad of the substrate so as to facilitate the optical detection device to identify the position of the bonding pad.
10. The transfer method according to claim 1, wherein the adhesive is a UV adhesive, and after step (5), the chip is separated from the interposer by irradiating the adhesive with ultraviolet light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110228418.8A CN113013067B (en) | 2021-03-01 | 2021-03-01 | Transfer method with detection and repair chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110228418.8A CN113013067B (en) | 2021-03-01 | 2021-03-01 | Transfer method with detection and repair chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113013067A true CN113013067A (en) | 2021-06-22 |
| CN113013067B CN113013067B (en) | 2023-05-23 |
Family
ID=76402087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110228418.8A Active CN113013067B (en) | 2021-03-01 | 2021-03-01 | Transfer method with detection and repair chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113013067B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113921663A (en) * | 2021-09-29 | 2022-01-11 | 东莞市中麒光电技术有限公司 | LED display module repairing method |
| CN114345742A (en) * | 2021-12-31 | 2022-04-15 | 苏州汇川控制技术有限公司 | Method, apparatus, device and medium for detecting chip mounting position |
| CN116364818A (en) * | 2023-06-02 | 2023-06-30 | 惠科股份有限公司 | Preparation method of LED lamp panel, LED lamp panel and display device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1518855A (en) * | 2001-08-08 | 2004-08-04 | ���µ�����ҵ��ʽ���� | Apparatus and method for mounting electronic parts |
| CN202738378U (en) * | 2011-08-04 | 2013-02-13 | 松下电器产业株式会社 | Installing part checking device |
| CN103107248A (en) * | 2011-11-15 | 2013-05-15 | 华新丽华股份有限公司 | Die bonding device and die bonding method |
| CN107134422A (en) * | 2016-02-29 | 2017-09-05 | 上海微电子装备（集团）股份有限公司 | Chip bonding device and method |
| CN109473532A (en) * | 2018-11-20 | 2019-03-15 | 合肥京东方光电科技有限公司 | A kind of production method of Micro LED display base plate |
| CN109830453A (en) * | 2019-03-21 | 2019-05-31 | 深圳中科四合科技有限公司 | A kind of method and apparatus of chip flood tide transfer |
| CN111063628A (en) * | 2018-10-16 | 2020-04-24 | 上海微电子装备（集团）股份有限公司 | Chip bonding device |
| CN111128813A (en) * | 2020-01-20 | 2020-05-08 | 福州大学 | Mu LED mass transfer method |
| CN112055890A (en) * | 2018-04-30 | 2020-12-08 | 科锐公司 | Apparatus and method for electronic die mass transfer |
-
2021
- 2021-03-01 CN CN202110228418.8A patent/CN113013067B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1518855A (en) * | 2001-08-08 | 2004-08-04 | ���µ�����ҵ��ʽ���� | Apparatus and method for mounting electronic parts |
| CN202738378U (en) * | 2011-08-04 | 2013-02-13 | 松下电器产业株式会社 | Installing part checking device |
| CN103107248A (en) * | 2011-11-15 | 2013-05-15 | 华新丽华股份有限公司 | Die bonding device and die bonding method |
| CN107134422A (en) * | 2016-02-29 | 2017-09-05 | 上海微电子装备（集团）股份有限公司 | Chip bonding device and method |
| CN112055890A (en) * | 2018-04-30 | 2020-12-08 | 科锐公司 | Apparatus and method for electronic die mass transfer |
| CN111063628A (en) * | 2018-10-16 | 2020-04-24 | 上海微电子装备（集团）股份有限公司 | Chip bonding device |
| CN109473532A (en) * | 2018-11-20 | 2019-03-15 | 合肥京东方光电科技有限公司 | A kind of production method of Micro LED display base plate |
| CN109830453A (en) * | 2019-03-21 | 2019-05-31 | 深圳中科四合科技有限公司 | A kind of method and apparatus of chip flood tide transfer |
| CN111128813A (en) * | 2020-01-20 | 2020-05-08 | 福州大学 | Mu LED mass transfer method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113921663A (en) * | 2021-09-29 | 2022-01-11 | 东莞市中麒光电技术有限公司 | LED display module repairing method |
| CN114345742A (en) * | 2021-12-31 | 2022-04-15 | 苏州汇川控制技术有限公司 | Method, apparatus, device and medium for detecting chip mounting position |
| CN116364818A (en) * | 2023-06-02 | 2023-06-30 | 惠科股份有限公司 | Preparation method of LED lamp panel, LED lamp panel and display device |
| CN116364818B (en) * | 2023-06-02 | 2023-11-24 | 惠科股份有限公司 | Preparation method of LED lamp panel, LED lamp panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113013067B (en) | 2023-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113013067A (en) | Transfer method with detection and chip repair functions | |
| CN113013068B (en) | Chip transfer method for improving transfer yield | |
| CN113035763B (en) | High-precision chip transfer method | |
| CN113130728B (en) | LED chip mass transfer method | |
| KR20100009208A (en) | Combination equipment for exfoliation and position, and fabricating method of liquid crystal display using the same | |
| KR101307081B1 (en) | System for multi-mounting Tape Carrier Package onto LCD | |
| JP6116827B2 (en) | Semiconductor device manufacturing method and semiconductor device manufacturing apparatus | |
| JP3596492B2 (en) | Bonding method | |
| CN115206816A (en) | Method for heating and welding chip by heating plate | |
| JP2018029171A (en) | Electronic component mounting device | |
| KR20020084127A (en) | Component mounting apparatus and component mounting method, and recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel | |
| JP2010212394A (en) | Method and apparatus for inspecting component mounting substrate and component mounting apparatus | |
| CN116779732A (en) | Micro-LED chip batch transfer device and batch transfer welding method | |
| JP4394603B2 (en) | Method and apparatus for crimping TAB parts to liquid crystal panels | |
| JPH0675199A (en) | Apparatus for production of liquid crystal panel, positioning device and working device | |
| JP5021394B2 (en) | ACF pasting device and flat panel display manufacturing device | |
| JP5017041B2 (en) | Component mounting method and apparatus | |
| JP2002299384A (en) | Method and apparatus for bonding chip | |
| JP3967310B2 (en) | Component mounting apparatus and mounting method | |
| CN110977073B (en) | Method for brushing tin at fixed points of soldering tin points | |
| JP2009010123A (en) | Apparatus for mounting electronic component and method of manufacturing electronic component | |
| JP5325669B2 (en) | ACF sticking device | |
| KR20130034792A (en) | Module bonding apparatus for producing a plate type display | |
| CN117794096A (en) | Mounting device and substrate manufacturing device | |
| CN117116801A (en) | Mass transfer device, mass transfer method, display panel and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |