CN110977073B - Method for brushing tin at fixed points of soldering tin points - Google Patents
Method for brushing tin at fixed points of soldering tin points Download PDFInfo
- Publication number
- CN110977073B CN110977073B CN202010006122.7A CN202010006122A CN110977073B CN 110977073 B CN110977073 B CN 110977073B CN 202010006122 A CN202010006122 A CN 202010006122A CN 110977073 B CN110977073 B CN 110977073B
- Authority
- CN
- China
- Prior art keywords
- substrate
- steel mesh
- axis
- origin
- coordinates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The invention provides a method for brushing tin at a fixed point of a soldering tin point, which comprises the following steps: preparing a substrate, wherein more than two bonding pads are arranged on the substrate, obtaining a substrate picture, establishing a substrate bonding pad coordinate system for the substrate picture, and setting the center of the bonding pad positioned at one corner of the substrate picture as the origin of coordinates of the substrate; determining the angle of a connecting line between a diagonal point of the coordinate origin of the substrate and the coordinate origin of the substrate; the method comprises the steps that after a steel mesh is placed on a substrate, a steel mesh picture is obtained, openings are formed in the steel mesh, and the position of each opening in the steel mesh picture in a substrate bonding pad coordinate system is determined; determining whether the center of an opening corresponding to the substrate bonding pad of the origin of coordinates is superposed with the origin of coordinates; if the angle deviation value is not within the range of +/-A degrees, the substrate is aligned with the steel mesh through the rotating device, and the substrate can be ensured to be aligned with the steel mesh.
Description
Technical Field
The invention relates to the technical field of tin brushing, in particular to a method for brushing tin at a fixed point of a soldering tin point.
Background
The light emitting diode, namely the LED, is a commonly used light emitting device, because of the advantages of energy saving and environmental protection, the light emitting diode is widely applied to the illumination field and the display field, in recent years, with the development of the LED display technology, the mini LED can realize the subarea dimming which cannot be realized by the traditional LCD television and computer display due to the ultra-small size of the mini LED, the mini LED can realize the backlight effect by using the ultra-small size LED lamp banks with extremely large quantity, the dimming subarea number can be more finely made by stepping, the effect of high dynamic display and high contrast is achieved, the optical distance can be shortened to reduce the thickness of the whole machine to meet the thinning requirement, and the light emitting diode is researched by various large display manufacturers at home and abroad.
The Mini LED is generally fixed to a substrate by a chip, and the chip and a bonding pad on the substrate have small sizes, which makes it difficult to solder the chip to the substrate, and requires a precision-accurate machine with high cost, and the current fixing method of the flip chip to the substrate is adopted, for example, chinese patent application No. CN200310115459.8, publication No. 2007.02.21, which discloses a flip chip packaging method, comprising the following steps: providing a substrate, wherein the substrate is provided with a conductive welding pad at least partially exposed on the surface of the substrate; providing a printing screen plate which is not stained with solder, enabling the substrate to be in contact with the printing screen plate, forming a soldering paste through an opening on the printing screen plate to cover the conductive welding pad, and reflowing the soldering paste to form a conical pre-soldering paste; separating the printing screen plate and the substrate to form a glue filling material with silicon dioxide filling materials on the substrate; attaching a chip having a conductive bump to the substrate, wherein the conductive bump is aligned with the pre-solder paste; when the structure finishes underfill filling, the silicon dioxide filler cannot be sunk into soldering tin joints in flip chip packaging, so that the reliability of the soldering tin joints in the flip chip packaging is improved, but the structure does not show that the alignment of the printing screen and the bonding pad on the substrate is ensured, and the alignment of the printing screen and the bonding pad is increased for the ultra-small size of the mini LED; however, if the printing screen plate and the bonding pad are not aligned, the coating of the solder paste is easily inaccurate, the connection between the chip and the substrate is unreliable, and potential safety hazards exist.
Disclosure of Invention
The invention aims to provide a method for brushing tin at a soldering point in a fixed point mode.
In order to achieve the purpose, the method for brushing tin at the fixed points of the soldering tin points comprises the following steps:
a) preparing a substrate, wherein more than two bonding pads are arranged on the substrate, obtaining a substrate picture, establishing a substrate bonding pad coordinate system for the substrate picture, and setting the center of the bonding pad positioned at one corner of the substrate picture as the origin of coordinates of the substrate;
b) determining an angle alpha between a connecting line between a diagonal point of the coordinate origin of the substrate and the X axis;
c) the method comprises the steps that after a steel mesh is placed on a substrate, a steel mesh picture is obtained, openings are formed in the steel mesh, and the position of each opening in the steel mesh picture in a substrate bonding pad coordinate system is determined;
d) determining whether the center of the opening corresponding to the substrate bonding pad of the origin of coordinates is superposed with the origin of coordinates, if so, performing step e); otherwise, aligning the coordinate origin with the opening center corresponding to the substrate pad of the coordinate origin through the moving device;
e) determining an angle beta between a connecting line of the center of a diagonal opening on the steel mesh and the origin of coordinates and the X axis;
f) by comparing the degree difference between beta and alpha, if the beta-alpha is within the range of +/-A degrees, within the acceptance range, after the steel mesh and the substrate are clamped by the clamping device, brushing tin; if the angle is not within the range of +/-A DEG, the substrate is aligned with the steel mesh through the rotating device. According to the method, before tin brushing, a steel mesh is placed on a substrate, a substrate picture is obtained firstly, then a substrate pad coordinate system is determined, then the position of an opening in the steel mesh in the substrate pad coordinate system is determined after the steel mesh is covered, then whether the position of the origin of coordinates on the substrate is aligned with the position of an opening corresponding to the pad in the steel mesh or not is determined, then adjustment is carried out to ensure that the origin of coordinates of the substrate is aligned with the origin of coordinates of the steel mesh, then whether the inclination angle between the pads at the opposite corners of the substrate is within a preset range or not is determined, if yes, rotation is carried out to enable the substrate to be aligned with the steel mesh, and the accuracy of tin soldering is improved.
Further, the step f) specifically comprises that if the beta-alpha is smaller than-A degrees, the steel mesh is rotated counterclockwise by the angle value of beta-alpha through the rotating device, so that the steel mesh is rotated to the range of +/-A degrees; in the above, the steel mesh and the substrate can be kept aligned by judging that the two included angle differences are negative values and then rotating counterclockwise.
Further, the step f) specifically includes rotating the steel mesh clockwise by the rotating device to the | β - α | if the β - α is greater than + a °, so as to rotate the steel mesh to the range of ± a °; in the above, the steel mesh and the substrate can be kept aligned by judging that the two included angle differences are positive values and then rotating clockwise.
Furthermore, the moving device is provided with an X-axis moving device and a Y-axis moving device, and the X-axis moving device and the Y-axis moving device are respectively arranged on one side of two adjacent edges of the steel mesh; the X-axis moving device comprises an X-axis driving cylinder, an X-axis driving shaft and an X-axis gripper, and the X-axis driving cylinder drives the X-axis gripper through the X-axis driving shaft; the Y-axis moving device comprises a Y-axis driving cylinder, a Y-axis driving shaft and a Y-axis gripper, the Y-axis driving cylinder drives the Y-axis gripper through the Y-axis driving shaft, and the X-axis moving device and the Y-axis moving device are respectively driven to move the steel mesh according to an X-axis coordinate difference value and a Y-axis coordinate difference value between the origin of coordinates and the opening center corresponding to the substrate bonding pad of the origin of coordinates; above setting, through set up X axle and Y axle mobile device respectively in the both sides of steel mesh, move X axle and Y axle and realize the origin alignment.
Further, rotary device includes driving motor, motor shaft and rotatory fixed block, and driving motor passes through the rotatory fixed block of motor shaft drive, the size of rotatory fixed block and the big or small phase-match of steel mesh upper shed, when the steel mesh needs to rotate, in the rotatory fixed block embedding steel mesh opening of driving motor drive, through the rotation fixed block and mesh cooperation realize the rotation of steel mesh, above setting, through setting up rotatory fixed block in the opening of steel mesh, one side alright convenient rotation, on the other hand does not need extra clamping device, simple structure.
Furthermore, clamping device includes die clamping cylinder, cylinder axle and presss from both sides tight tongs, and die clamping cylinder passes through cylinder axle drive and presss from both sides tight tongs, and after the position setting of steel mesh and base plate was correct, die clamping cylinder drive presss from both sides tight tongs and presss from both sides tight steel mesh and base plate, brushes tin, above setting, through setting up clamping device, prevents to brush the removal between tin in-process base plate and the steel mesh.
Further, the step b) specifically comprises: determining diagonal coordinates (x, y) of a coordinate origin of the substrate, and obtaining degrees of alpha according to alpha = arc/x; the inclination angle is calculated through the coordinate values of the diagonal points, and the calculation method is simple.
Further, step e) specifically includes: determining central coordinates (a, b) of a diagonal opening on the steel mesh from the origin of coordinates, and deriving the degree of β from β = arctanb/a; the inclination angle is calculated through the coordinate values of the diagonal points, and the calculation method is simple.
Furthermore, the welding pads are arranged on the substrate in a matrix manner; the openings are arranged on the steel mesh in a matrix manner; the soldering tin of a plurality of pads can be realized, and the matrix arrangement, simple structure is reliable.
Further, the step c) specifically comprises: the method comprises the steps of obtaining a steel mesh picture after a steel mesh is placed on a substrate, determining the distance from the center of each opening on the steel mesh picture to the center of a substrate pad corresponding to each opening, and determining each opening on a substrate pad coordinate system according to the distance from the center of the substrate pad corresponding to each opening; in the method, the distance between two points is firstly identified on the picture, so that the opening is mapped onto the substrate pad coordinate system according to the distance between the bright points, and the method is simple and reliable.
Drawings
FIG. 1 is a schematic diagram of a substrate of the present invention in a substrate pad coordinate system.
FIG. 2 is a schematic diagram of the steel mesh of the present invention in a substrate pad coordinate system.
Fig. 3 is a schematic view showing that β is larger than α in the steel net of the present invention.
Fig. 4 is a schematic view showing that β is smaller than α in the steel net of the present invention.
Fig. 5 is a schematic diagram of a mobile device according to the present invention.
Fig. 6 is a schematic view of the clamping device and the rotating device of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 to 6, a method for brushing solder points at fixed points,
the method comprises the following steps:
a) preparing a substrate, wherein more than two bonding pads 12 are arranged on the substrate 1, and the bonding pads 12 are arranged on the substrate 1 in a matrix manner; acquiring a substrate picture, establishing a substrate pad coordinate system for the substrate picture 1, specifically, establishing the substrate pad coordinate system through the existing image algorithm after acquiring the substrate picture, and setting the center of a pad positioned at one corner of the substrate picture as the origin of coordinates of the substrate; in the embodiment, the center of the pad at the starting point is determined as the origin of coordinates of the substrate;
b) determining an angle alpha between a connecting line between a diagonal point of the coordinate origin of the substrate 1 and the coordinate origin of the substrate and the X axis; in the embodiment, the degree of α is determined by determining the diagonal coordinates (x, y) of the coordinate origin of the substrate, and the degree of α is obtained according to α = arc/x;
c) the steel mesh picture is obtained after the steel mesh 2 is placed on the substrate, the steel mesh 2 is provided with openings 22, and the openings 22 are arranged on the steel mesh 2 in a matrix manner; determining the position of each opening 22 on the steel mesh picture in the substrate pad coordinate system; specifically, after the steel mesh 2 is placed on the substrate 1, a steel mesh picture is obtained, the distance from the center of each opening 22 on the steel mesh picture to the center of the substrate pad corresponding to each opening is determined, and each opening 22 is determined on a substrate pad coordinate system according to the distance from the center of the substrate pad corresponding to each opening 22; the center of the opening can be determined by recognizing a frame shape in image recognition, then a metal block is recognized in the frame shape and determined as the center of the bonding pad, and then the distance between the two points is determined according to the recognized points; the image recognition frame shape and the metal block are the existing image recognition method;
d) determining whether the center of the opening 22 corresponding to the substrate pad of the coordinate origin is superposed with the coordinate origin, if so, performing step e); otherwise, the coordinate origin is aligned with the center of the opening 22 corresponding to the substrate pad of the coordinate origin by the moving device 4;
e) determining an angle beta between a connecting line of the center of the diagonal opening of the steel mesh 2 and the origin of coordinates and the X axis; in the present example, the degree of β is determined by determining the center coordinates (a, b) of the diagonal opening to the origin of coordinates on the steel mesh, which is derived from β = arctanb/a;
f) by comparing the degree difference between beta and alpha, if beta-alpha is within the range of +/-A degrees, within the acceptance range, after the steel mesh 2 and the substrate 1 are clamped by the clamping device 3, brushing tin; if not within the range of ± a °, the substrate 1 is aligned with the steel net 2 by the rotating means 5.
The value of A in this example is 5.
As shown in fig. 5, step c) specifically includes moving the X and Y axes of the steel mesh 2 by the moving device 4 so that the origin of coordinates B of the steel mesh 2 coincides with the origin of coordinates a of the substrate 1.
As shown in fig. 4, the step e) specifically includes rotating the steel mesh 2 counterclockwise by the angle | β - α | value through the rotating device 5 if β - α is smaller than-a °, so that the steel mesh 2 rotates to the range of ± a °.
As shown in fig. 3, step e) specifically includes rotating the steel mesh 2 clockwise by the angle value of | β - α | through the rotating device 5 if β - α is greater than + a °, so as to rotate the steel mesh 2 to the range of ± a °.
As shown in fig. 5, the moving device is provided with an X-axis moving device 41 and a Y-axis moving device 42, the X-axis moving device 41 and the Y-axis moving device 42 are respectively disposed on one side of two adjacent edges of the steel mesh 2, in this embodiment, the substrate 1 is placed on a placing table (not shown in the figure), the X-axis moving device and the Y-axis moving device are disposed on the placing table on two sides of the steel mesh, the X-axis moving device 41 includes an X-axis driving cylinder 411, an X-axis driving shaft 412 and an X-axis gripper 413, and the X-axis driving cylinder 411 drives the X-axis gripper 413 through the X-axis driving shaft 412; the Y-axis moving device 42 comprises a Y-axis driving cylinder 421, a Y-axis driving shaft 422 and a Y-axis gripper 423, the Y-axis driving cylinder 421 drives the Y-axis gripper 423 through the Y-axis driving shaft 422, and the X-axis moving device and the Y-axis moving device are respectively driven to move the steel mesh according to the X-axis coordinate difference and the Y-axis coordinate difference between the origin of coordinates and the opening center corresponding to the substrate pad of the origin of coordinates; in this embodiment, since the coordinates of the opening 22 in the substrate pad coordinate system are determined, the difference between the coordinates and the corresponding substrate pad can be used to determine the difference between the X-axis coordinates and the Y-axis coordinates, if the difference between the X-axis coordinates is negative, the X-axis moving device moves the absolute value of the difference between the X-axis coordinates to the positive direction of the X-axis, and if the difference between the X-axis coordinates is positive, the X-axis moving device moves the difference between the X-axis coordinates to the negative direction of the X-axis.
As shown in fig. 6, the rotating device 5 includes a driving motor 51, a motor shaft 52 and a rotating fixing block 53, the driving motor 51 drives the rotating fixing block 53 through the motor shaft 52, the size of the rotating fixing block 53 matches with the size of the opening 22, when the steel mesh 2 needs to rotate, the driving motor 51 drives the rotating fixing block 53 to be embedded into the mesh 22, and the rotating fixing block 53 cooperates with the mesh 22 to realize the rotation of the steel mesh 2, in this embodiment, the driving motor 51 of the rotating device 5 is fixed right above the placing table.
As shown in fig. 6, the clamping device 3 includes a clamping cylinder 31, a cylinder shaft 32 and a clamping hand 33, the clamping cylinder 31 drives the clamping hand 33 through the cylinder shaft 32, when the positions of the steel mesh 2 and the substrate 1 are correctly set, the clamping cylinder 31 drives the clamping hand 33 to clamp the steel mesh 2 and the substrate 1 for tin brushing, in this embodiment, the clamping device 3 is fixed on the side of the placing table opposite to the moving device 4, and two clamping hands 33 are provided, one clamping hand 33 is used for clamping the top edge of the steel mesh, and the other clamping hand 33 is used for clamping the bottom edge of the substrate.
According to the method, before tin brushing, the steel mesh 2 is placed on the substrate 1, a substrate picture is obtained firstly, then a substrate pad coordinate system is determined, then the steel mesh 2 is covered, then the position of the opening 22 in the steel mesh in the substrate pad coordinate system is determined, then whether the position of the origin of coordinates on the substrate 1 is aligned with the position of the opening 22 corresponding to the pad 12 in the steel mesh is determined according to whether the position of the origin of coordinates on the substrate 1 is aligned with the position of the origin of coordinates on the steel mesh 2, then adjustment is carried out to ensure that the origin of coordinates on the substrate 1 is aligned with the origin of coordinates on the steel mesh 2, then whether the inclination angle between the pads at the opposite corners of the substrate 1 is within a preset range with the inclination angle of the steel mesh 2 is determined, if so that the substrate 1 is aligned with the steel mesh 2, and the accuracy of tin soldering is improved.
Claims (9)
1. A method for brushing tin at a fixed point of a soldering tin point is characterized in that: the method comprises the following steps:
a) preparing a substrate, wherein more than two bonding pads are arranged on the substrate, obtaining a substrate picture, establishing a substrate bonding pad coordinate system for the substrate picture, and setting the center of the bonding pad positioned at one corner of the substrate picture as the origin of coordinates of the substrate;
b) determining an angle alpha between a connecting line between a diagonal point of the coordinate origin of the substrate and the X axis;
c) the method comprises the steps of obtaining a steel mesh picture after a steel mesh is placed on a substrate, wherein the steel mesh is provided with openings, determining the position of each opening on the steel mesh picture in a substrate pad coordinate system, determining the distance from the center of each opening on the steel mesh picture to the center of a substrate pad corresponding to each opening, and determining each opening on the substrate pad coordinate system according to the distance from each opening to the center of the substrate pad;
d) determining whether the center of the opening corresponding to the substrate bonding pad of the origin of coordinates is superposed with the origin of coordinates, if so, performing step e); otherwise, aligning the coordinate origin with the opening center corresponding to the substrate pad of the coordinate origin through the moving device;
e) determining an angle beta between a connecting line of the center of a diagonal opening on the steel mesh and the origin of coordinates and the X axis;
f) by comparing the degree difference between beta and alpha, if the beta-alpha is within the range of +/-A degrees, within the acceptance range, after the steel mesh and the substrate are clamped by the clamping device, brushing tin; if the angle is not within the range of +/-A degrees, the steel mesh is rotated to be within the range of +/-A degrees through the rotating device, and the substrate is aligned with the steel mesh.
2. The method for spot-soldering a solder dot as claimed in claim 1, wherein: and f), specifically, if the beta-alpha is smaller than-A degrees, rotating the steel mesh counterclockwise by the angle value beta-alpha through the rotating device to enable the steel mesh to rotate to the range of +/-A degrees.
3. The method for spot-soldering a solder dot as claimed in claim 1, wherein: the step f) specifically comprises that if the beta-alpha is larger than +/-A degrees, the steel mesh is rotated clockwise by the rotating device to form the steel mesh with the beta-alpha to be rotated to the range of +/-A degrees.
4. The method for spot-soldering a solder dot as claimed in claim 1, wherein: the moving device is provided with an X-axis moving device and a Y-axis moving device, and the X-axis moving device and the Y-axis moving device are respectively arranged on one side of two adjacent edges of the steel mesh; the X-axis moving device comprises an X-axis driving cylinder, an X-axis driving shaft and an X-axis gripper, and the X-axis driving cylinder drives the X-axis gripper through the X-axis driving shaft; the Y-axis moving device comprises a Y-axis driving cylinder, a Y-axis driving shaft and a Y-axis gripper, the Y-axis driving cylinder drives the Y-axis gripper through the Y-axis driving shaft, and the X-axis moving device and the Y-axis moving device are respectively driven to move the steel mesh according to an X-axis coordinate difference value and a Y-axis coordinate difference value between the origin of coordinates and the opening center corresponding to the substrate bonding pad of the origin of coordinates.
5. A method of spot-soldering a solder dot as claimed in claim 2 or 3, characterized in that: the rotating device comprises a driving motor, a motor shaft and a rotating fixing block, the driving motor drives the rotating fixing block through the motor shaft, the size of the rotating fixing block is matched with the size of an upper opening of the steel mesh, when the steel mesh needs to rotate, the driving motor drives the rotating fixing block to be embedded into the opening of the steel mesh, and the rotating fixing block is matched with the mesh to realize rotation of the steel mesh.
6. The method for spot-soldering a solder dot as claimed in claim 1, wherein: the clamping device comprises a clamping cylinder, a cylinder shaft and a clamping hand, the clamping cylinder drives the clamping hand through the cylinder shaft, and when the positions of the steel mesh and the substrate are correctly set, the clamping cylinder drives the clamping hand to clamp the steel mesh and the substrate for brushing tin.
7. The method for spot-soldering a solder dot as claimed in claim 1, wherein: the step b) specifically comprises the following steps: diagonal coordinates (x, y) of the origin of coordinates of the substrate are determined, and the degree of α is obtained from α = arctany/x.
8. The method for spot-soldering a solder dot as claimed in claim 1, wherein: the step e) specifically comprises: the central coordinates (a, b) of the diagonal opening to the origin of coordinates on the steel mesh are determined, and the degree of β is given as β = arctanb/a.
9. The method for spot-soldering a solder dot as claimed in claim 1, wherein: the welding pads are arranged on the substrate in a matrix manner; the openings are arranged in a matrix on the steel mesh.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010006122.7A CN110977073B (en) | 2020-01-03 | 2020-01-03 | Method for brushing tin at fixed points of soldering tin points |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010006122.7A CN110977073B (en) | 2020-01-03 | 2020-01-03 | Method for brushing tin at fixed points of soldering tin points |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110977073A CN110977073A (en) | 2020-04-10 |
| CN110977073B true CN110977073B (en) | 2022-04-01 |
Family
ID=70080737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010006122.7A Active CN110977073B (en) | 2020-01-03 | 2020-01-03 | Method for brushing tin at fixed points of soldering tin points |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110977073B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103287073A (en) * | 2013-06-08 | 2013-09-11 | 太仓市同维电子有限公司 | Method for achieving rapid counterpoint of PCB and steel mesh in printing machine |
| CN103769707A (en) * | 2014-01-23 | 2014-05-07 | 无锡江南计算技术研究所 | BGA (ball grid array) ball-mounting method |
| CN105427237A (en) * | 2015-11-25 | 2016-03-23 | 长春乙天科技有限公司 | Steel mesh image registration and detection method for large-format optical measurement system |
| CN106643500A (en) * | 2016-12-28 | 2017-05-10 | 华中科技大学 | Calibration and alignment method of printing platform of solder paste printer |
-
2020
- 2020-01-03 CN CN202010006122.7A patent/CN110977073B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103287073A (en) * | 2013-06-08 | 2013-09-11 | 太仓市同维电子有限公司 | Method for achieving rapid counterpoint of PCB and steel mesh in printing machine |
| CN103769707A (en) * | 2014-01-23 | 2014-05-07 | 无锡江南计算技术研究所 | BGA (ball grid array) ball-mounting method |
| CN105427237A (en) * | 2015-11-25 | 2016-03-23 | 长春乙天科技有限公司 | Steel mesh image registration and detection method for large-format optical measurement system |
| CN106643500A (en) * | 2016-12-28 | 2017-05-10 | 华中科技大学 | Calibration and alignment method of printing platform of solder paste printer |
Non-Patent Citations (1)
| Title |
|---|
| 锡膏印刷机误差与锡膏印刷质量检测技术研究;冼志军;《中国优秀硕士学位论文全文数据库(电子期刊) 工程科技I辑》;20151215(第12期);第1-19页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110977073A (en) | 2020-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102577002B1 (en) | Apparatus and method for manufacturing the display apparatus | |
| CN106272426A (en) | Solar battery sheet series welding anterior optic location and angle sensing device and detection method | |
| CN103336381B (en) | A kind of method of stereoscopic film laminating contraposition | |
| CN201946238U (en) | LED lattice display panel | |
| US20020124399A1 (en) | Component holding head, component mounting apparatus using same, and component mounting method | |
| WO2019184628A1 (en) | Workpiece alignment mounting apparatus and method thereof | |
| CN113035763A (en) | High-precision chip transfer method | |
| CN110977073B (en) | Method for brushing tin at fixed points of soldering tin points | |
| CN102116947B (en) | Liquid crystal display manufacturing device and method of manufacturing liquid crystal display by using the same | |
| CN1151101A (en) | Process for compensating for position of camera in chip mount system and process for mounting chips using compensation method | |
| US10692783B2 (en) | Systems and methods for bonding semiconductor elements | |
| CN115206816A (en) | Method for heating and welding chip by heating plate | |
| CN116313993A (en) | Crystal supply device and real-time correction method | |
| JP2798832B2 (en) | Component mounting device | |
| JP2560042B2 (en) | Semiconductor wafer mounting device | |
| KR20070047575A (en) | Die bonding apparatus | |
| TWI695325B (en) | Mark recognition device, mark recognition method and false pressure alignment equipment | |
| JP2004151653A (en) | Electro-optic device, method and device for manufacturing electro-optic device and electronic equipment | |
| JP4142233B2 (en) | Component adsorption head, component mounting apparatus and component mounting method using the same | |
| JPH01103850A (en) | Device for attracting frame for semiconductor wafer mount | |
| CN109817092A (en) | A kind of polaroid alignment device and alignment method | |
| JPH1022332A (en) | Ic disposal device in flip chip mounting facility | |
| CN218388522U (en) | Joining device | |
| CN210694101U (en) | VCM mobile phone camera module | |
| JP2007329255A (en) | Apparatus and method of manufacturing thin display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |