CN114918562A - Wafer cutting machine and cutting method - Google Patents
Wafer cutting machine and cutting method Download PDFInfo
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- CN114918562A CN114918562A CN202210619493.1A CN202210619493A CN114918562A CN 114918562 A CN114918562 A CN 114918562A CN 202210619493 A CN202210619493 A CN 202210619493A CN 114918562 A CN114918562 A CN 114918562A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a wafer cutting machine, which comprises a frame, a material box lifting device, a cleaning and gluing device and a track contraction device, the material box lifting device comprises a material box and a first lifting mechanism, the material box is provided with a multi-layer placing area, the track shrinking device comprises a first track, a second track and a shrinking mechanism, a positioning area is formed between the first track and the second track, the first carrying device comprises a first translation mechanism and a clamping mechanism, the first translation mechanism drives the clamping mechanism to translate back and forth between the placing area and the positioning area, the second carrying device comprises a second translation mechanism and a fixing mechanism, the second translation mechanism drives the fixing mechanism to translate back and forth between the positioning area and the cutting device, the cleaning and gluing device comprises a working platform, a second lifting mechanism and a working cavity used for cleaning and gluing the workpiece, and the second lifting mechanism drives the working platform to lift back and forth between the working cavity and the positioning area. The invention greatly improves the processing efficiency.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a wafer cutting machine and a cutting method.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be fabricated on a silicon wafer to form an integrated circuit product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon with the purity as high as 99.999999999 percent.
In the prior art, the cutting and processing process of the wafer workpiece does not require manual work, the automation degree is not high enough, and the processing efficiency is often not high enough, so that the actual processing requirement can not be well met. The present invention improves upon the above-described deficiencies.
Disclosure of Invention
In order to overcome the defects of the background art, the invention provides the wafer cutting machine and the cutting method, the structural design is reasonable, the cutting process of the wafer workpiece does not need manual intervention, the automation degree is high, the processing efficiency is greatly improved, and the actual processing requirements can be better met.
The invention provides a wafer cutting machine which comprises a rack, wherein one side of the rack is provided with a magazine lifting device, one side of the magazine lifting device, which is close to the middle part of the rack, is sequentially provided with a cleaning and gluing device, a track contraction device, a first carrying device and a second carrying device from bottom to top, the other side of the rack is provided with a cutting device for carrying out laser cutting on a workpiece, the cutting device comprises a positioning platform and a light path system, the magazine lifting device comprises a magazine and a first lifting mechanism for driving the magazine to lift, the magazine is provided with a multi-layer placing area which is longitudinally arranged, the track contraction device comprises a first track, a second track and a contraction mechanism, the contraction mechanism is provided with the first track and the second track which are parallel to each other side by side, the contraction mechanism drives the first track and the second track to mutually close to or far away from each other, and a positioning area for centering and positioning the workpiece is formed between the first track and the second track, the first carrying device comprises a first translation mechanism and a clamping mechanism used for clamping workpieces, the first translation mechanism drives the clamping mechanism to perform reciprocating translation between the placing area and the positioning area, the second carrying device comprises a second translation mechanism and a fixing mechanism used for fixing the workpieces, the second translation mechanism drives the fixing mechanism to perform reciprocating translation between the positioning area and the positioning platform, the cleaning and gluing device comprises a working platform, a second lifting mechanism and a working chamber used for cleaning and gluing the workpieces, a fixing position used for fixing the workpieces is arranged on the working platform, and the second lifting mechanism drives the working platform to perform reciprocating lifting between the working chamber and the positioning area.
Preferably, the fixing mechanism adopts an adsorption mode to adsorb and fix a workpiece, the fixing mechanism comprises a connecting frame and a single sucker assembly, one side of the connecting frame is connected with the second translation mechanism, the other side of the connecting frame is provided with a cylinder support plate, two sides of the cylinder support plate are respectively provided with the single sucker assembly, the single sucker assembly comprises a material sucking cylinder, a sucker frame and vacuum suckers, the material sucking cylinder is fixedly arranged on the cylinder support plate and drives the sucker frame to lift, the bottom of the sucker frame is fixedly provided with a plurality of vacuum suckers, and adsorption nozzles of the vacuum suckers are positioned on the same plane and jointly form an adsorption area.
Preferably, the plurality of vacuum chucks in the single-chuck assembly are divided into a plurality of groups of vacuum chucks for adsorbing workpieces with different specifications, and the distances from each vacuum chuck in each group of vacuum chucks to the center of the adsorption area are equal.
Preferably, the location district includes that first location places the position and the position is placed to the second location, first location is placed the position and is established directly over the working chamber, shrink mechanism includes track foundatin plate, sliding connection subassembly and actuating mechanism, first orbital one end is passed through sliding connection subassembly with track foundatin plate sliding connection, the orbital one end of second is also passed through sliding connection subassembly with track foundatin plate sliding connection, the actuating mechanism drive first track and second track are in slide on the track foundatin plate and make first track and second track be close to each other or keep away from.
Preferably, it still includes shell, water collector, removable cover, rotary mechanism, rubber coating mechanism and washing subassembly to wash the rubber coating device, top in the shell has set firmly the water collector, the top of water collector is equipped with removable cover, the bottom of water collector is equipped with the leakage fluid dram, forms between water collector and the removable cover the working chamber, the working chamber is equipped with the washing subassembly, second elevating system includes the support of activity from top to bottom, is equipped with on the support rotary mechanism, rotary mechanism include work platform and rotary mechanism drive work platform are in the work intracavity is rotatory, still is equipped with in the shell rubber coating mechanism, rubber coating mechanism includes the gluing head and drives the gluing head is in work platform's top reciprocating swing's rubber coating swing arm subassembly.
Preferably, the cleaning and gluing device further comprises a telescopic mechanism for driving the movable cover plate to stretch, the telescopic mechanism comprises an upper cover plate, guide rails, sliders, a cylinder module and a connecting assembly, the upper cover plate comprises a fixed plate and an extension plate, the fixed plate is fixedly arranged at the top of the shell, a round hole is formed in the middle of the fixed plate, one side of the fixed plate is connected with the extension plate, two mutually parallel guide rails and two guide rails are symmetrically arranged on two sides of the round hole on the upper cover plate, one end of each guide rail is fixedly arranged on the fixed plate, the other end of each guide rail is fixedly arranged on the extension plate, a cover plate for covering the round hole is arranged in the middle of the movable cover plate, mounting plates in L shapes are respectively arranged on two sides of the cover plate, the bottoms of the two mounting plates are fixedly provided with the sliders matched with the guide rails, and the cylinder module is fixedly arranged at the top of one side of the shell, be equipped with between cylinder module and the removable cover coupling assembling, the cylinder module passes through coupling assembling and drives the removable cover flexible on the upper cover plate.
Preferably, the cleaning and gluing device further comprises a water pumping steam component, the water pumping steam component comprises a water pumping steam pipe, and the shell is fixedly provided with the water pumping steam pipe and the water pumping steam pipe is communicated with the working cavity.
Preferably, fixture includes linking arm and clamping jaw assembly, the one end of linking arm is connected first translation mechanism, the other end of linking arm is connected with clamping jaw assembly, clamping jaw assembly include the last clamping piece and the lower clamping piece of relative activity, go up the clamping area that forms between clamping piece and the lower clamping piece and be used for pressing from both sides the work piece.
The invention also provides a wafer cutting method, which comprises the following steps:
the material box is lifted in place by the material box lifting device;
clamping the workpiece to be processed in the placing area through the first conveying device, moving the workpiece to be processed to a position right above the cleaning and gluing device, and then placing the workpiece to a positioning area of the rail contraction device;
the rail contraction device drives the first rail and the second rail to approach each other through a contraction mechanism, and the workpiece is centered and positioned;
the cleaning and gluing device drives the working platform to ascend to a positioning area through the second lifting mechanism, takes a workpiece and then descends to the tool cavity, the workpiece is cleaned and glued in the working cavity, and the working platform and the workpiece are driven to ascend together through the second lifting mechanism after the cleaning and gluing are finished;
the second carrying device takes the cleaned and glued workpiece and transports the workpiece to the positioning platform;
carrying out laser cutting on the workpiece through a positioning platform and a light path system;
the second carrying device takes the processed workpiece from the positioning platform and transports the workpiece to a positioning area of the track contraction device;
the rail contraction device drives the first rail and the second rail to approach each other through the contraction mechanism, and the workpiece is centered and positioned again;
the first carrying device clamps the processed workpiece and puts the processed workpiece back to the placing area of the material box.
Preferably, the wafer cutting method further adopts a parallel working mode, and comprises the following steps:
the first workpiece is subjected to laser cutting through the positioning platform and the optical path system, and meanwhile, the second workpiece can be conveyed to the cleaning and gluing device for cleaning and gluing;
the second carrying device takes the cleaned and glued workpiece to be transported to the positioning platform through one single sucker component, the second carrying device firstly takes the laser-cut workpiece through the other single sucker component when reaching the positioning platform, then the cleaned and glued workpiece is placed on the positioning platform to be subjected to laser cutting, and then the second carrying device transports the laser-cut workpiece to a positioning area of the track contraction device to be subjected to centering positioning.
In conclusion, the beneficial effects of the invention are as follows:
1. the cleaning and gluing device, the track shrinking device, the first carrying device and the second carrying device are sequentially arranged from bottom to top, the structural design is reasonable, the carrying, positioning and cleaning and gluing work can be conveniently and orderly carried out, the whole structural design of the wafer cutting machine is reasonable, manual intervention is not needed in the cutting and processing process of the wafer workpiece, the automation degree is high, the processing efficiency is greatly improved, and the actual processing requirement can be better met;
2. the second carrying device adopts two single sucker assemblies, so that two workpieces can be simultaneously adsorbed to be carried, one workpiece to be processed can also be adsorbed to a specified processing position, the processed workpiece is firstly adsorbed to vacate the processing position, and then the carried workpiece to be processed is placed on the processing position to be processed, so that the actual processing requirement can be better met, and the carrying efficiency is also well improved while the second carrying device is convenient to carry by adopting the two single sucker assemblies;
3. the cleaning and gluing device comprises a driving telescopic mechanism for stretching the movable cover plate, the movable cover plate can be automatically opened or closed, the sealing performance of the working chamber can be improved when the movable cover plate is closed, the workpiece can be cleaned and glued better, the cleaning and gluing device further comprises a water pumping steam assembly, the water pumping steam assembly can be used for rapidly drying the working chamber after the cleaning and gluing are completed, and the actual requirement can be better met.
The invention will be further explained with reference to the drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a perspective view of the overall structure of the present invention;
FIG. 2 is a side view of a portion of the structure of the present invention;
FIG. 3 is a schematic perspective view of the magazine lifting mechanism of the present invention;
FIG. 4 is a perspective view of a second transporting device of the present invention;
FIG. 5 is a schematic perspective view of the top side of the track retraction device of the present invention;
FIG. 6 is a perspective view of the underside of the track retraction device of the present invention;
FIG. 7 is a perspective view of the cleaning and gluing device of the present invention;
FIG. 8 is a schematic top view of the interior of the working chamber of the present invention;
FIG. 9 is a perspective view of the glue mechanism of the present invention;
FIG. 10 is a schematic perspective view of a rotary mechanism disposed on a support according to the present invention;
FIG. 11 is a perspective view of the first transporting device of the present invention;
figure 12 is a perspective view of a jaw assembly of the present invention;
the mark in the figure is: 1-a machine frame, 2-a material box lifting device, 3-a cleaning and gluing device, 4-a track shrinking device, 5-a first carrying device, 6-a second carrying device, 7-a cutting device, 8-a positioning platform, 9-an optical path system, 10-a first lifting mechanism, 11-a placing area, 12-a first track, 13-a second track, 14-a shrinking mechanism, 15-a first translation mechanism, 16-a clamping mechanism, 17-a second translation mechanism, 18-a fixing mechanism, 19-a working platform, 20-a second lifting mechanism, 21-a working chamber, 22-a connecting frame, 23-a single sucker component, 24-an air cylinder carrier plate, 25-a material sucking air cylinder, 26-a sucker frame, 27-a vacuum sucker and 28-a sucker, 29-reinforcing ribs, 30-a first positioning placement position, 31-a second positioning placement position, 32-a track base plate, 33-a sliding connection assembly, 34-a driving mechanism, 35-a driving wheel, 36-a driven wheel, 37-a driving belt, 38-a driving motor, 39-a fixed seat, 40-a pressing block connector, 41-a movable groove, 42-a shell, 43-a water pan, 44-a movable cover plate, 45-a rotating mechanism, 46-a gluing mechanism, 47-a cleaning assembly, 48-a bracket, 49-a gluing head, 50-a gluing swing arm assembly, 51-a telescopic mechanism, 52-an upper cover plate, 53-an air cylinder module, 54-a connection assembly, 55-a water pumping pipe, 56-a connection arm and 57-a clamping jaw assembly, 58-upper clamping piece, 59-lower clamping piece, 60-clamping opening, 61-limiting piece, 62-buffer spring, 63-workpiece, 64-guide rod, 65-ball guide sleeve and 66-spring groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to fig. 1 to 12 in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the implementation objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be described in more detail below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in fig. 1 to 12, the wafer cutting machine disclosed in this embodiment includes a frame 1, a magazine lifting device 2 is disposed on one side of the frame 1, a cleaning and gluing device 3, a track shrinking device 4, a first carrying device 5 and a second carrying device 6 are sequentially disposed on one side of the magazine lifting device 2 close to the middle of the frame 1 from bottom to top, a cutting device 7 for laser cutting a workpiece 63 is disposed on the other side of the frame 1, the cutting device 7 includes a positioning platform 8 and a light path system 9, the magazine lifting device 2 includes a magazine and a first lifting mechanism 10 for driving the magazine to lift, the magazine has a multi-layer placement area 11 arranged longitudinally, the track shrinking device 4 includes a first track 12, a second track 13 and a shrinking mechanism 14, the first track 12 and the second track 13 which are parallel to each other are disposed on the shrinking mechanism 14 side by side, the contraction mechanism 14 drives the first rail 12 and the second rail 13 to approach or separate from each other, a positioning area for centering and positioning the workpiece 63 is formed between the first rail 12 and the second rail 13, the first carrying device 5 comprises a first translation mechanism 15 and a clamping mechanism 16 for clamping the workpiece 63, the first translation mechanism 15 drives the clamping mechanism 16 to translate back and forth between the placing area 11 and the positioning area, the second carrying device 6 comprises a second translation mechanism 17 and a fixing mechanism 18 for fixing the workpiece 63, the second translation mechanism 17 drives the fixing mechanism 18 to translate back and forth between the positioning area and the positioning platform 8, the cleaning and gluing device 3 comprises a working platform 19, a second lifting mechanism 20 and a working chamber 21 for cleaning and gluing the workpiece 63, and the working platform 19 is provided with a fixing position for fixing the workpiece 63, the second lifting mechanism 20 drives the working platform 19 to reciprocate between the working cavity 21 and the positioning area.
In the above technical solution, the positioning platform 8 is adopted to cut and position the wafer workpiece 63, which is beneficial to ensuring the precision of laser cutting, the optical path system 9 mainly comprises a laser device, which is responsible for ensuring that a focused light spot is focused on a designated position of the workpiece 63 to be processed, the cutting device 7 composed of the positioning platform 8 and the optical path system 9 can well perform laser cutting on the wafer workpiece 63, a plurality of wafer workpieces 63 are respectively placed in the multiple layers of placing areas 11 longitudinally arranged on the magazine, and the plurality of wafer workpieces 63 are arranged in layers along the vertical direction, so that the clamping mechanism 16 of the first carrying device 5 can be conveniently taken out of or put back the wafer workpiece 63 from the placing area 11 when the first lifting mechanism 10 drives the magazine to lift, the track shrinking device 4 can well perform centering and positioning on the wafer workpiece 63 by arranging the first track 12 and the second track 13 which are parallel to each other and driving the two tracks to shrink through the shrinking mechanism 14, the automatic material taking and conveying device is convenient for accurately taking materials for cleaning and gluing by a cleaning and gluing device 3, and is also convenient for accurately clamping a processed workpiece 63 by a clamping mechanism 16 and then correctly putting back a material box, the clamping mechanism 16 and a fixing mechanism 18 can well take the workpiece 63 for conveying, the first translation mechanism 15 drives the clamping mechanism 16 to reciprocate between a placing area 11 and a positioning area, so that the workpiece 63 to be processed can be conveniently clamped from the material box and conveyed to the positioning area of a track shrinking device 4, the processed workpiece 63 can be conveniently taken out from the positioning area and then put back the material box, the second translation mechanism 17 drives the fixing mechanism 18 to reciprocate between the positioning area and the positioning platform 8, the cleaned and glued workpiece 63 can be conveyed to the positioning platform 8 for cutting and processing, the cut workpiece 63 can also be conveyed to the positioning area and then put back the material box, and when the track shrinking device 4 completes centering and positioning on the wafer 63, the second lifting mechanism 20 drives the working platform 19 to ascend to the positioning area for taking the workpiece 63 Descend the frock chamber behind piece 63, wash the rubber coating to work piece 63 in working chamber 21, wash behind the rubber coating and rise together with work piece 63 through second elevating system 20 drive work platform 19, just then just can transport locating platform 8 through second handling device 6 after will washing the rubber coating and cut processing, wash rubber coating device 3 in this embodiment, track constriction device 4, supreme arranging in proper order from the bottom is followed to first handling device 5 and second handling device 6, and reasonable structural design can be convenient for carry, location and washing rubber coating work go on in an orderly manner, foretell wafer cutting machine overall structure reasonable in design, wafer work piece 63's cutting course of working does not need manual intervention, degree of automation is high, machining efficiency is greatly improved, thereby can satisfy the actual processing demand better. In the specific implementation of this embodiment, the positioning platform 8 preferably adopts a three-axis platform, the three-axis platform mainly comprises marble, an XY linear motor and a hollow rotating platform, and the positioning platform 8 is responsible for ensuring the precision of laser processing; the optical path system 9 mainly comprises a laser, a lens mounting frame and a Z-axis lifting table, the optical path system 9 is responsible for ensuring that a focusing light spot is focused to a specified position of a workpiece 63 to be processed, and the three-axis platform and the optical path system 9 can refer to the prior art and are not further described herein. In this embodiment, the workpiece is a wafer workpiece, and the two workpieces are not distinguished.
As a preferred technical solution, the fixing mechanism 18 adopts an adsorption manner to adsorb and fix the workpiece 63, the fixing mechanism 18 includes a connecting frame 22 and a single suction cup assembly 23, one side of the connecting frame 22 is connected to the second translation mechanism 17, the other side is provided with a cylinder support plate 24, two sides of the cylinder support plate 24 are respectively provided with one single suction cup assembly 23, the single suction cup assembly 23 includes a material suction cylinder 25, a suction cup frame 26 and vacuum suction cups 27, the material suction cylinder 25 is fixedly arranged on the cylinder support plate 24, the material suction cylinder 25 drives the suction cup frame 26 to move up and down, the bottom of the suction cup frame 26 is fixedly provided with a plurality of vacuum suction cups 27, and the adsorption nozzles of the plurality of vacuum suction cups 27 are located on the same plane and jointly form an adsorption area. In this embodiment, the material suction cylinder 25 drives the chuck holder 26 and the vacuum chuck 27 on the chuck holder 26 to lift together, so as to facilitate the wafer workpiece 63 to be adsorbed to the adsorption area for transportation, a plurality of chucks can achieve a better adsorption and fixation effect, and the second translation mechanism 17 can drive the two single chuck assemblies 23 to translate together through the connecting frame 22, so as to facilitate the better transportation of the workpiece 63. Two single sucking disc subassemblies 23 that second handling device 6 adopted are the design of double suction cups, can adsorb two work pieces 63 simultaneously and carry, also can adsorb one and wait to process work piece 63 to appointed processing station, adsorb the work piece 63 that accomplishes processing earlier and vacate the processing station, will carry the work piece 63 that waits to process that comes again and put the processing station and process, just so can satisfy the actual processing demand better from this, can know to adopt the design of double suction cups also to improve handling efficiency well when making things convenient for second handling device 6 to carry.
Preferably, the plurality of vacuum chucks 27 in the single chuck assembly 23 are divided into a plurality of groups of vacuum chucks 27 for sucking workpieces 63 with different specifications, and the distances from the vacuum chucks 27 in each group of vacuum chucks 27 to the center of the sucking area are equal. In the embodiment, the plurality of vacuum chucks 27 in the single chuck assembly 23 are divided into a plurality of groups of vacuum chucks 27, the distances from the different groups of vacuum chucks 27 to the center of the suction area are different, each group of vacuum chucks 27 can be used for sucking a workpiece 63 with a specification and a size, so as to better meet the actual processing requirement, and when sucking a workpiece 63 with a larger size, the vacuum chucks 27 used for sucking the workpiece 63 with a smaller size can be sucked together to better suck and fix the workpiece 63 with a larger size. When the embodiment is specifically implemented, the material suction cylinder 25 adopts a slide cylinder, the suction cup frame 26 comprises a suction cup support plate 28 and a reinforcing rib 29, one end of the suction cup support plate 28 is fixedly arranged at the bottom of the slide cylinder, the reinforcing rib 29 is fixedly arranged on the side surface of the slide, the bottom of the reinforcing rib 29 is fixedly arranged at the top of the suction cup support plate 28, the multiple groups of vacuum suction cups 27 are integrally distributed in an X shape, and the suction cup support plate 28 can well support and install the groups of vacuum suction cups 27.
As a preferred technical scheme, the locating area includes that first location places position 30 and second location and places position 31, first location places position 30 and establishes directly over working chamber 21, shrink mechanism 14 includes track foundatin plate 32, sliding connection subassembly 33 and actuating mechanism 34, the one end of first track 12 is passed through sliding connection subassembly 33 with track foundatin plate 32 sliding connection, the one end of second track 13 is also passed through sliding connection subassembly 33 with track foundatin plate 32 sliding connection, actuating mechanism 34 drives first track 12 and second track 13 are in slide on the track foundatin plate 32 and make first track 12 and second track 13 be close to each other or keep away from. In this embodiment, the first positioning placing position 30 is arranged right above the working chamber 21, the wafer workpiece 63 can be well centered and positioned before the wafer workpiece 63 enters the working chamber 21, the second positioning placing position 31 is arranged on one side of the first positioning placing position 30, the wafer workpiece 63 can be conveniently placed in temporary transition for centering and positioning, the actual positioning requirement can be better met by arranging two positioning placing positions in the positioning area, the first rail 12 and the second rail 13 can be stably close to or far away from each other by being connected with the rail base plate 32 in a sliding mode, the driving mechanism 34 can conveniently drive the first rail 12 and the second rail 13 to be close to or far away from each other, and centering and positioning of the wafer workpiece 63 are further achieved. In the specific implementation of this embodiment, the driving mechanism 34 includes a driving wheel 35, a driven wheel 36, a transmission belt 37, a driving motor 38, a fixing seat 39 and a pressing block connector 40, the driving wheel 35 and the driven wheel 36 are respectively disposed at two sides of the bottom of the track base plate 32, the transmission belt 37 is connected between the driving wheel 35 and the driven wheel 36, the driving motor 38 is fixedly disposed at the bottom of the track base plate 32 through the fixing seat 39, the driving wheel 35 is disposed on an output shaft of the driving motor 38, a driven wheel 36 shaft is further fixedly disposed on the track base plate 32, the driven wheel 36 is mounted on the driven wheel 36 shaft, the driven wheel 36 is rotatably connected with the driven wheel 36 shaft, the transmission belt 37 is provided with two clamping positions, when the transmission belt 37 rotates, the two clamping positions are close to or far away from each other, one clamping position is fixedly provided with the pressing block connector 40, the other clamping position is also fixedly provided with the pressing block connector 40, the track base plate 32 is provided with two movable grooves 41 adapted to the pressing block connector 40, the two pressing block connecting pieces 40 penetrate through the movable groove 41 and then are respectively fixedly connected to the bottoms of the first rail 12 and the second rail 13, specifically, the driving wheel 35 and the driven wheel 36 can well support the transmission belt 37 to rotate, and because the two clamping positions are to be close to or far away from each other when the transmission belt 37 rotates, the two clamping positions are respectively arranged at two sides of the transmission belt 37, the pressing block connecting piece 40 in the embodiment comprises a first pressing block and a second pressing block which are in threaded connection, the clamping position of the transmission belt 37 is clamped and fixed between the first pressing block and the second pressing block, one pressing block in the pressing block connecting piece 40 upwards penetrates through the movable groove 41 and then is fixed to the bottom of the first rail 12 or the bottom of the second rail 13, so that the transmission belt 37 can drive the first rail 12 and the second rail 13 to be close to or far away from each other through the two pressing block connecting pieces 40 when rotating, and further the centering and the positioning of the wafer workpiece 63 can be conveniently realized, the transmission belt 37 of the embodiment adopts a synchronous belt, and the driving motor 38 adopts a speed reducer assembly, so that the actual action requirement can be well met.
As a preferable technical solution, the cleaning and gluing device 3 further comprises a housing 42, a water receiving tray 43, a movable cover plate 44, a rotating mechanism 45, a gluing mechanism 46 and a cleaning assembly 47, the top in the shell 42 is fixedly provided with the water pan 43, the top of the water pan 43 is provided with the movable cover plate 44, the bottom of the water pan 43 is provided with a liquid outlet, the working chamber 21 is formed between the water pan 43 and the movable cover plate 44, the cleaning assembly 47 is arranged in the working chamber 21, the second lifting mechanism 20 comprises a bracket 48 which can move up and down, the bracket 48 is provided with the rotating mechanism 45, the rotating mechanism 45 comprises the working platform 19, the rotating mechanism 45 drives the working platform 19 to rotate in the working cavity 21, the shell 42 is also provided with the glue coating mechanism 46, the gluing mechanism 46 comprises a gluing head 49 and a gluing swing arm assembly 50 which drives the gluing head 49 to swing back and forth above the working platform 19. In this embodiment, the top of the water pan 43 is provided with the movable cover plate 44, which can be opened or closed conveniently, the wafer workpiece 63 can be put in or taken out when the water pan is opened, the working chamber 21 can be closed after the water pan is closed, the wafer workpiece 63 can be cleaned and coated conveniently, the bottom of the water pan 43 is provided with the liquid outlet for discharging the waste liquid at the bottom of the water pan 43 in time, the water pan 43 of this embodiment is in a square box shape, the working chamber 21 can be well formed between the water pan 43 and the movable cover plate 44, the wafer workpiece 63 can be cleaned conveniently by arranging the cleaning assembly 47 in the working chamber 21, the cleaning assembly 47 of this embodiment adopts the atomizing nozzle to spray water mist for cleaning, which can have a good cleaning effect on the wafer workpiece 63 in the working chamber 21, the wafer workpiece 63 can be taken into the working chamber 21 through the fixed position of the working platform 19, the rotating mechanism 45 can drive the wafer workpiece 63 to rotate together when the working platform 19 is driven to rotate, the gluing head 49 is a gluing mixing head in the embodiment, the gluing mixing head is connected with a plurality of non-return joints, mixing of various liquids can be achieved, and cutting fluid for gluing can be formed conveniently through mixing, because the gluing swing arm assembly 50 can drive the gluing head 49 to swing back and forth above the working platform 19, when the wafer workpiece 63 is placed on a fixed position of the working platform 19 and the wafer workpiece 63 is driven to rotate, the gluing swing arm assembly 50 can enable the gluing head 49 to slowly move from the upper side of the center of the wafer workpiece 63 to the upper side of the edge of the wafer workpiece 63, so that the cutting fluid sprayed out of the gluing head 49 can be sprayed on the upper surface of the wafer workpiece 63 in a circle from inside to outside, the cutting fluid can be uniformly sprayed on the upper surface of the wafer workpiece 63, the gluing effect is good, and actual production requirements can be well met. In the embodiment, the fixing position of the working platform 19 preferably adopts an adsorption fixing manner to adsorb and fix the wafer workpiece 63, which can refer to the prior art and will not be further described herein. In the specific implementation of this embodiment, it is preferable to provide two glue applying mechanisms 46, which are respectively and fixedly disposed on the left and right sides of the housing 42, and the two glue applying mechanisms 46 can be used alternatively, and one of the glue applying mechanisms 46 can be used as a spare, so as to better meet the actual production requirements.
As a preferred technical scheme, the cleaning and gluing device 3 further comprises a telescopic mechanism 51 driving the movable cover plate 44 to stretch, the telescopic mechanism 51 comprises an upper cover plate 52, guide rails, sliding blocks, a cylinder module 53 and a connecting assembly 54, the upper cover plate 52 comprises a fixing plate and an extension plate, the fixing plate is fixedly arranged at the top of the shell 42, a round hole is formed in the middle of the fixing plate, one side of the fixing plate is connected with the extension plate, the upper cover plate 52 is fixedly provided with two parallel guide rails, the two guide rails are symmetrically arranged on two sides of the round hole, one end of each guide rail is fixedly arranged on the fixing plate, the other end of each guide rail is fixedly arranged on the extension plate, the middle of the movable cover plate 44 is provided with a covering plate for covering the round hole, two sides of the covering plate are respectively provided with an L-shaped mounting plate, the bottoms of the two mounting plates are fixedly provided with the sliding blocks matched with the guide rails, the cylinder module 53 is fixedly arranged at the top of one side of the shell 42, the connecting assembly 54 is arranged between the cylinder module 53 and the movable cover plate 44, and the cylinder module 53 drives the movable cover plate 44 to extend and retract on the upper cover plate 52 through the connecting assembly 54. In actual use, the movable cover plate 44 needs to be frequently opened or closed, when the movable cover plate 44 is closed, the sealing performance of the working chamber 21 can be improved, and the workpiece 63 can be conveniently cleaned and glued, the telescopic mechanism 51 for driving the movable cover plate 44 to stretch and retract is arranged, the structural design is reasonable, the movable cover plate 44 can be automatically opened or closed, the automation degree is greatly improved, the upper cover plate 52 comprises a fixed plate and an extension plate, when the movable cover plate 44 moves to the upper part of the fixed plate, the circular hole in the middle of the fixed plate can be well covered by the cover plate, the sealing performance in the cleaning and gluing process can be improved, when the movable cover plate 44 leaves the upper part of the fixed plate, the movable cover plate 44 can slide to and fro on two guide rails by arranging mounting plates and sliding blocks on two sides of the cover plate, and by arranging the cylinder module 53 and the connecting assembly 54, the movable cover plate 44 can be conveniently driven to slide and retract on the upper cover plate 52, thereby achieving automatic opening or closing of the flap 44. The cylinder module 53 of this embodiment preferably employs a magnetic couple type rodless cylinder, which can achieve automatic opening or closing of the movable cover 44.
As a preferred technical solution, the cleaning and gluing device 3 further includes a water vapor pumping assembly, the water vapor pumping assembly includes a water vapor pumping pipe 55, the shell 42 is fixedly provided with the water vapor pumping pipe 55, and the water vapor pumping pipe 55 is communicated with the working chamber 21. Can produce a large amount of steam liquid drops in the washing rubber coating in-process working chamber 21, this embodiment can realize the drying of working chamber 21 fast after the completion of washing rubber coating through setting up the steam subassembly that draws water, can satisfy actual demand better, specifically, draws water remaining steam in the working chamber 21 through the steam pipe 55 that draws water that communicates working chamber 21, and the steam pipe 55 that draws water is connected air exhauster equipment, can conveniently draw water the steam operation. The exhaust fan device belongs to the prior art and is not specifically described herein.
Preferably, the clamping mechanism 16 comprises a connecting arm 56 and a clamping jaw assembly 57, one end of the connecting arm 56 is connected with the first translation mechanism 15, the other end of the connecting arm 56 is connected with the clamping jaw assembly 57, the clamping jaw assembly 57 comprises an upper clamping piece 58 and a lower clamping piece 59 which are relatively movable, and a clamping area for clamping the workpiece 63 is formed between the upper clamping piece 58 and the lower clamping piece 59. In this embodiment, the first translating mechanism 15 can conveniently drive the connecting arm 56 to translate, and the connecting arm 56 can drive the clamping jaw assemblies 57 to translate together when translating, so as to facilitate the clamping of the wafer workpiece 63 in the clamping area of the clamping jaw assemblies 57 for transportation, and the upper clamping piece 58 and the lower clamping piece 59 which are relatively movable can facilitate the clamping of the wafer workpiece 63 between the upper clamping piece 58 and the lower clamping piece 59. In the specific implementation of this embodiment, a clamping opening 60 is formed at one side of the clamping area, a limiting member 61 for clamping and limiting is disposed at the other side of the clamping area, preferably, the other end of the connecting arm 56 is slidably connected to the clamping jaw assembly 57, and a buffer spring 62 for reducing clamping collision is disposed between the connecting arm 56 and the clamping jaw assembly 57, a direction of relative sliding between the connecting arm 56 and the clamping jaw assembly 57 is parallel to a driving translation direction of the first translation mechanism 15, when clamping, the wafer workpiece 63 enters the clamping area from the clamping opening 60, and the wafer workpiece 63 will collide against the limiting member 61 in the process of entering the clamping area, so that the clamping jaw assembly 57 and the connecting arm 56 will slide relatively, the buffer spring 62 disposed between the connecting arm 56 and the clamping jaw assembly 57 can buffer relative movement between the clamping jaw assembly 57 and the connecting arm 56, and further can effectively reduce collision of the limiting member 61 on the wafer workpiece 63 during clamping the wafer 63, can well protect the fragile wafer workpiece 63. In the specific implementation of this embodiment, the connecting arm 56 and the clamping jaw assembly 57 are slidably connected by a guide rod 64 and a ball guide sleeve 65, the buffer spring 62 is disposed in the spring groove 66, and the connecting arm 56 is provided with a stopper abutting against one end of the buffer spring 62.
The embodiment also discloses a wafer cutting method, which comprises the following steps:
s1, lifting the magazine to the proper position through the magazine lifting device 2; in the step, the magazine is lifted to the right position by the magazine lifting device 2, so that the wafer workpiece 63 can be conveniently taken out from the placing area 11, and the processed workpiece 63 can be conveniently placed back to the original placing area 11.
S2, the first carrying device 5 is used for clamping the workpiece 63 to be processed in the placing area 11, moving the workpiece 63 to the position right above the cleaning and gluing device 3, and then placing the workpiece 63 to the positioning area of the track shrinking device 4; in the step, the workpiece 63 is placed at the first positioning placing position 30 of the positioning area, and the first positioning placing position 30 is positioned right above the working cavity 21, so that the working platform 19 can be conveniently lifted to take the positioned workpiece 63.
S3, the rail contraction device 4 drives the first rail 12 and the second rail 13 to approach each other through the contraction mechanism 14, and the workpiece 63 is centered and positioned;
s4, the cleaning and gluing device 3 drives the working platform 19 to ascend to a positioning area through the second lifting mechanism 20, takes the workpiece 63 out of the positioning area, descends to the tool cavity, cleans and glues the workpiece 63 in the working cavity 21, and drives the working platform 19 and the workpiece 63 to ascend together through the second lifting mechanism 20 after cleaning and gluing;
s5, the second carrying device 6 takes the cleaned and glued workpiece 63 and transports the workpiece 63 to the positioning platform 8;
s6, carrying out laser cutting on the workpiece 63 through the positioning platform 8 and the optical path system 9;
s7, the second carrying device 6 takes the processed workpiece 63 from the positioning platform 8 and transports the workpiece 63 to the positioning area of the track shrinking device 4;
s8, the rail contraction device 4 drives the first rail 12 and the second rail 13 to approach each other through the contraction mechanism 14, and centering and positioning are carried out on the workpiece 63 again;
s9, the first transfer device 5 picks up the processed workpiece 63 and returns it to the magazine placement area 11.
The steps are the whole process of cutting the single wafer workpiece 63, the process design is reasonable, the whole cutting and machining process of the wafer workpiece 63 does not need manual intervention, the automation degree is high, the machining efficiency is greatly improved, and therefore the actual machining requirements can be better met.
Preferably, the positioning platform 8 and the optical path system 9 are used for laser cutting of the first workpiece 63, and simultaneously, the second workpiece 63 can be conveyed to the cleaning and gluing device 3 for cleaning and gluing. The laser cutting process consumes the longest time in the specific implementation process, and then the cleaning and gluing process, and the time consumed by the laser cutting process is about three times that consumed by the cleaning and gluing process, so the wafer cutting method of the embodiment also adopts a parallel working mode to improve the overall processing efficiency, the parallel working mode can respectively place a plurality of wafer workpieces 63 in different processing processes for processing, the number of the simultaneously processed wafer workpieces 63 can be adjusted and matched according to the actual processing time of each process, and the parallel working mode includes but is not limited to:
the second workpiece 63 can be conveyed to the cleaning and gluing device 3 for cleaning and gluing in the process of waiting for the cutting device 7 to perform laser cutting on the first workpiece 63, and the second workpiece 63 is cleaned and glued when the laser cutting of the first workpiece 63 is not completed and waits to be conveyed to the cutting device 7 for laser processing;
when the cleaning and gluing device 3 cleans and glues the first workpiece 63, the second workpiece 63 can be conveyed to the second positioning and placing position 31 of the positioning area to wait, and when the second conveying device 6 takes away the cleaned and glued workpiece 63, the workpiece 63 located at the second positioning and placing position 31 is moved to the first positioning and placing position 30 to be centered and positioned, and then cleaning and gluing are carried out.
Owing to adopted the parallel work mode, this embodiment second handling device 6 has adopted two single sucking disc subassemblies 23 to transport work piece 63 to because the triaxial platform of reality only sets up a processing station usually and places and treat the processing work piece, second handling device 6 adopts two sucking disc designs of two single sucking disc subassemblies 23 can improve handling efficiency well, for example: the second carrying device 6 takes the cleaned and glued workpiece 63 through one single sucker assembly 23 and transports the workpiece to the three-axis platform, when the workpiece reaches the three-axis platform, the second carrying device 6 firstly takes the laser-cut workpiece 63 through the other single sucker assembly 23, then the cleaned and glued workpiece 63 is placed on the three-axis platform for laser cutting, then the second carrying device 6 transports the laser-cut workpiece 63 to a positioning area of the track contraction device 4 for centering and positioning, and finally the positioned processed workpiece 63 is placed back to the initial placing area 11 of the workpiece 63 through the first carrying device 5.
The fixing manner or the fixing connection manner that is not described in this embodiment may be threaded connection or welding, and other existing connection manners may also be adopted according to specific positions, and both threaded connection and welding belong to the prior art, and are not described in detail herein.
The parts not referred to in the present embodiment are the same as or can be implemented by the prior art, and are not further described herein.
The skilled person should understand that: although the invention has been described in terms of the above specific embodiments, the inventive concept is not limited thereto, and any modification applying the inventive concept is intended to be included within the scope of the patent claims.
Claims (10)
1. A wafer cutting machine is characterized by comprising a rack, wherein a magazine lifting device is arranged on one side of the rack, a cleaning and gluing device, a track shrinking device, a first carrying device and a second carrying device are sequentially arranged on one side, close to the middle of the rack, of the magazine lifting device from bottom to top, a cutting device for laser cutting of a workpiece is arranged on the other side of the rack, the cutting device comprises a positioning platform and a light path system, the magazine lifting device comprises a magazine and a first lifting mechanism for driving the magazine to lift, the magazine is provided with a multi-layer placing area which is longitudinally arranged, the track shrinking device comprises a first track, a second track and a shrinking mechanism, the first track and the second track which are parallel to each other are arranged on the shrinking mechanism side by side, and the shrinking mechanism drives the first track and the second track to be close to or far away from each other, be formed with the locating area that is used for centering the location to the work piece between first track and the second track, first handling device includes first translation mechanism and is used for pressing from both sides the fixture of getting the work piece, first translation mechanism drive fixture is in place reciprocal translation between district and the locating area, second handling device includes second translation mechanism and the fixed establishment who is used for fixed work piece, the drive of second translation mechanism fixed establishment is in reciprocal translation between locating area and the locating platform, it includes work platform, second elevating system and is used for washing the rubber coated working chamber of rubber coating to the work piece to wash the rubber coating device, the last fixed position that is used for fixed work piece that is equipped with of work platform, the drive of second elevating system work platform is in reciprocal lift between work chamber and the locating area.
2. The wafer cutting machine as claimed in claim 1, wherein the fixing mechanism is configured to fix the workpiece by suction, the fixing mechanism includes a connecting frame and a single sucker assembly, one side of the connecting frame is connected to the second translating mechanism, the other side of the connecting frame is provided with a cylinder support plate, one single sucker assembly is respectively disposed on each side of the cylinder support plate, the single sucker assembly includes a material suction cylinder, a sucker frame and a vacuum sucker, the material suction cylinder is configured on the cylinder support plate, the material suction cylinder drives the sucker frame to move up and down, the bottom of the sucker frame is configured with a plurality of vacuum suckers, and suction nozzles of the plurality of vacuum suckers are located on the same plane and jointly form a suction area.
3. The wafer cutting machine according to claim 2, wherein the plurality of vacuum chucks in the single chuck assembly are divided into a plurality of groups of vacuum chucks for sucking workpieces of different specifications, and the distances from the respective vacuum chucks in each group of vacuum chucks to the center of the sucking area are equal.
4. The wafer cutting machine according to claim 2 or 3, wherein the positioning region includes a first positioning place and a second positioning place, the first positioning place is disposed right above the working chamber, the retracting mechanism includes a track base plate, a sliding connection assembly and a driving mechanism, the sliding connection assembly is slidably connected to the track base plate through one end of the first track, the sliding connection assembly is slidably connected to the track base plate through one end of the second track, and the driving mechanism drives the first track and the second track to slide on the track base plate and make the first track and the second track close to or far away from each other.
5. The wafer cutting machine according to claim 1, wherein the cleaning and gluing device further comprises a housing, a water pan, a movable cover plate, a rotating mechanism, a gluing mechanism and a cleaning assembly, the top of the inside of the shell is fixedly provided with the water receiving tray, the top of the water receiving tray is provided with the movable cover plate, the bottom of the water receiving tray is provided with a liquid outlet, a working cavity is formed between the water receiving tray and the movable cover plate, the cleaning component is arranged in the working cavity, the second lifting mechanism comprises a bracket which can move up and down, the bracket is provided with the rotating mechanism, the rotating mechanism comprises the working platform and drives the working platform to rotate in the working cavity, the shell is also internally provided with the glue coating mechanism, the gluing mechanism comprises a gluing head and a gluing swing arm component which drives the gluing head to swing above the working platform in a reciprocating mode.
6. The wafer cutting machine according to claim 5, wherein the cleaning and gluing device further comprises a telescopic mechanism driving the movable cover plate to extend and retract, the telescopic mechanism comprises an upper cover plate, guide rails, sliding blocks, a cylinder module and a connecting assembly, the upper cover plate comprises a fixed plate and an extension plate, the fixed plate is fixedly arranged at the top of the housing, a round hole is formed in the middle of the fixed plate, the extension plate is connected to one side of the fixed plate, the upper cover plate is fixedly provided with two parallel guide rails, the two guide rails are symmetrically arranged on two sides of the round hole, one end of each guide rail is fixedly arranged on the fixed plate, the other end of each guide rail is fixedly arranged on the extension plate, a cover plate for covering the round hole is arranged in the middle of the movable cover plate, L-shaped mounting plates are respectively arranged on two sides of the cover plate, the sliding blocks matched with the guide rails are fixedly arranged at the bottoms of the two mounting plates, the cylinder module is fixedly arranged at the top of one side of the shell, the connecting assembly is arranged between the cylinder module and the movable cover plate, and the cylinder module drives the movable cover plate to stretch out and draw back on the upper cover plate through the connecting assembly.
7. The wafer cutting machine according to claim 6, wherein the cleaning and gluing device further comprises a water vapor pumping assembly, the water vapor pumping assembly comprises a water vapor pumping pipe, the water vapor pumping pipe is fixedly arranged on the housing, and the water vapor pumping pipe is communicated with the working chamber.
8. The wafer cutting machine according to claim 1, wherein the clamping mechanism includes a connecting arm and a clamping jaw assembly, one end of the connecting arm is connected to the first translating mechanism, the other end of the connecting arm is connected to the clamping jaw assembly, the clamping jaw assembly includes an upper clamping piece and a lower clamping piece which are movable relative to each other, and a clamping area for clamping the workpiece is formed between the upper clamping piece and the lower clamping piece.
9. A wafer cutting method is characterized by comprising the following steps:
the material box is lifted in place by the material box lifting device;
clamping a workpiece to be processed in the placing area through the first conveying device, moving the workpiece to be processed to a position right above the cleaning and gluing device, and then placing the workpiece to a positioning area of the track shrinking device;
the rail contraction device drives the first rail and the second rail to approach each other through a contraction mechanism, and the workpiece is centered and positioned;
the cleaning and gluing device drives the working platform to ascend to a positioning area through the second lifting mechanism, takes a workpiece and then descends to the tool cavity, the workpiece is cleaned and glued in the working cavity, and the working platform and the workpiece are driven to ascend together through the second lifting mechanism after the cleaning and gluing are finished;
the second carrying device takes the cleaned and glued workpiece and transports the workpiece to the positioning platform;
carrying out laser cutting on the workpiece through the positioning platform and the optical path system;
the second carrying device takes the processed workpiece from the positioning platform and transports the workpiece to a positioning area of the track contraction device;
the rail contraction device drives the first rail and the second rail to approach each other through the contraction mechanism, and the workpiece is centered and positioned again;
the first carrying device clamps the processed workpieces and puts the workpieces back to the placing area of the material box.
10. The wafer dicing method according to claim 9, wherein the wafer dicing method further adopts a parallel operation mode, and comprises:
the second workpiece can be carried to the cleaning and gluing device for cleaning and gluing while the first workpiece is subjected to laser cutting through the positioning platform and the optical path system;
the second carrying device takes the cleaned and glued workpiece to be transported to the positioning platform through one single sucker component, the second carrying device firstly takes the laser-cut workpiece through the other single sucker component when reaching the positioning platform, then the cleaned and glued workpiece is placed on the positioning platform to be subjected to laser cutting, and then the second carrying device transports the laser-cut workpiece to a positioning area of the track contraction device to be subjected to centering positioning.
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| CN202210619493.1A CN114918562A (en) | 2022-05-31 | 2022-05-31 | Wafer cutting machine and cutting method |
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| CN202210619493.1A CN114918562A (en) | 2022-05-31 | 2022-05-31 | Wafer cutting machine and cutting method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115662926A (en) * | 2022-12-28 | 2023-01-31 | 苏州镭明激光科技有限公司 | Automatic slotting equipment, slotting method and full-cutting system |
| CN116417391A (en) * | 2023-06-09 | 2023-07-11 | 沈阳和研科技股份有限公司 | Full-automatic wafer feeding machine |
| CN116460453A (en) * | 2023-03-14 | 2023-07-21 | 珠海市申科谱工业科技有限公司 | Wafer cutting automation equipment |
| CN117276161A (en) * | 2023-11-22 | 2023-12-22 | 和研半导体设备(沈阳)有限公司 | Wafer processing system and method |
| CN117798795A (en) * | 2024-02-29 | 2024-04-02 | 沈阳和研科技股份有限公司 | Dicing saw |
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2022
- 2022-05-31 CN CN202210619493.1A patent/CN114918562A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115662926A (en) * | 2022-12-28 | 2023-01-31 | 苏州镭明激光科技有限公司 | Automatic slotting equipment, slotting method and full-cutting system |
| CN116460453A (en) * | 2023-03-14 | 2023-07-21 | 珠海市申科谱工业科技有限公司 | Wafer cutting automation equipment |
| CN116417391A (en) * | 2023-06-09 | 2023-07-11 | 沈阳和研科技股份有限公司 | Full-automatic wafer feeding machine |
| CN116417391B (en) * | 2023-06-09 | 2023-09-05 | 沈阳和研科技股份有限公司 | Full-automatic wafer feeding machine |
| CN117276161A (en) * | 2023-11-22 | 2023-12-22 | 和研半导体设备(沈阳)有限公司 | Wafer processing system and method |
| CN117276161B (en) * | 2023-11-22 | 2024-02-02 | 和研半导体设备(沈阳)有限公司 | Wafer processing system and method |
| CN117798795A (en) * | 2024-02-29 | 2024-04-02 | 沈阳和研科技股份有限公司 | Dicing saw |
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