CN116460453A - Wafer cutting automation equipment - Google Patents
Wafer cutting automation equipment Download PDFInfo
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- CN116460453A CN116460453A CN202310242540.XA CN202310242540A CN116460453A CN 116460453 A CN116460453 A CN 116460453A CN 202310242540 A CN202310242540 A CN 202310242540A CN 116460453 A CN116460453 A CN 116460453A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 42
- 238000004140 cleaning Methods 0.000 claims abstract description 49
- 238000009501 film coating Methods 0.000 claims abstract description 37
- 239000007888 film coating Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 34
- 238000001179 sorption measurement Methods 0.000 claims description 44
- 230000009471 action Effects 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 239000008367 deionised water Substances 0.000 claims description 10
- 229910021641 deionized water Inorganic materials 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 8
- 210000002489 tectorial membrane Anatomy 0.000 claims description 5
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000003028 elevating effect Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 30
- 238000011068 loading method Methods 0.000 abstract description 14
- 230000010354 integration Effects 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 96
- 230000006870 function Effects 0.000 description 10
- 229910000831 Steel Inorganic materials 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000005507 spraying Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 238000003698 laser cutting Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/901—Devices for picking-up and depositing articles or materials provided with drive systems with rectilinear movements only
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Dicing (AREA)
Abstract
The invention aims to provide the wafer cutting automation equipment which has the advantages of simple and optimized structure, higher integration level, stronger compatibility, effectively improved processing efficiency and capability of realizing the full coverage function. The invention comprises a frame, a feeding module, a loading and unloading module, a cleaning module, a film coating module, a carrying module, a wafer platform and a laser module, wherein the cleaning module is arranged adjacent to the film coating module, the feeding module, the cleaning module and the film coating module are distributed along a straight line, the loading and unloading module and the carrying module are arranged above the cleaning module and the film coating module, the wafer platform is arranged at one side of the cleaning module and the film coating module, the wafer platform is positioned below the laser module, the loading and unloading module transfers the wafer of the feeding module to the film coating module, the carrying module transfers the wafer coated with the film to the wafer platform, and then transfers the cut wafer to the cleaning module, and the loading and unloading module transfers the cleaned wafer to the feeding module for material collection. The invention is applied to the technical field of wafer processing.
Description
Technical Field
The invention is applied to the technical field of wafer processing, and particularly relates to wafer cutting automation equipment.
Background
With the rapid development of modern technology, the 3C products and various electrical appliances are rapidly popularized, and the demands of conductor chips and integrated circuit boards are increasing. Wafers are important semi-finished raw materials for processing into semiconductor chips. Wafers are composed of pure silicon and are generally classified into 8 inch and 12 inch specifications. After the wafer is cut, a small chip is divided into a plurality of small chips, and the small chips are subjected to other processing and packaging test to form the daily-seen chips. The wafer is the basis of the chip industry, and the processing quality of the wafer directly influences the quality of the chip. The larger the wafer, the more chips can be fabricated per wafer, and thus the lower the manufacturing cost, so current wafer size expansion and chip process reduction are two mainlines of technological advancement in the integrated circuit industry. As the feature size of chip processing becomes smaller, the feature size requirement of wafer processing becomes more and more precise, and thus, the wafer automated processing equipment with high precision, high speed and high stability has become an essential production element for the current high-end semiconductor chip manufacturers. The main process flow of wafer cutting comprises the following steps: stretching, cutting and UV irradiation. The stretching sheet belongs to the preparation work before cutting, and is formed by sticking a layer of blue film on the back of a wafer, and stretching and tightening the blue film on a metal ring, so that the subsequent cutting is facilitated. Whereas UV irradiation is a subsequent process with the cut being completed in order to facilitate subsequent film tearing.
The existing wafer cutting and processing equipment mainly comprises two types of laser cutting and diamond saw blade grinding wheel cutting. The diamond saw blade grinding wheel cutting adopts an impeller to drive a steel knife or a resin knife and the like attached with diamond to rotate for cutting through grinding, so that a large amount of fine dust can be generated, and the diamond saw blade grinding wheel cutting wheel needs to be continuously washed by clean water in the cutting process so as to avoid polluting crystal grains. The scheme not only needs to be additionally provided with a clean water flushing system and increases the cost, but also the quantity of diamonds attached to the blade can directly influence the cutting effect, the cutting quality is far less than stable and consistent laser cutting, and the blade cutting easily enables hard and brittle wafers to generate a collapse mouth, so that the product quality is influenced. The cutting device mainly comprises a contact-slicing system cutting device and a non-contact-laser system cutting device. Compared with slicing cutting, laser cutting has less dust generation, and can effectively control the influence of particles in air on the cutting effect, thereby ensuring the processing quality. And the laser cutting production quality is stable, the equipment is simple and efficient, and the efficiency is higher than that of slicing cutting.
However, most of the existing laser cutting processing equipment needs to stretch the film on the wafer before cutting, namely, a layer of blue film is attached to the back of the wafer, so that the later cutting is facilitated, long early-stage preparation work is needed, residual silica residues are required to be cleaned after the cutting is completed, stations of each station are separated and independent, stacking is needed after one procedure is completed, the buffer memory is fed again, a great amount of labor and equipment cost are obviously consumed, the process is too lengthy, the improvement of the working efficiency is not facilitated, and the high-speed production is not facilitated. In addition, the equipment is troublesome to debug and use, the optical equipment is extremely high in requirement, and the operation and maintenance are extremely difficult. As disclosed in CN214687335U, a wafer cutting machine is disclosed, after a wafer is cut by a cutting wheel, the wafer frame and the wafer in the wafer frame are cleaned by using high-speed flow of high-pressure gas, however, more dust is generated in slicing cutting, a clean water flushing system is added, the processing cost is increased, the stability of the cutting quality is poor, and the wafer which is hard and brittle is easily broken by cutting with a blade, so that the product quality is affected. The equipment functions are single, and systematic processing cannot be realized, so that the wafer cutting automation equipment which has the advantages of simple and optimized structure, higher integration level, stronger compatibility and capability of effectively improving processing efficiency and realizing full coverage function is necessary.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects of the prior art, and provides wafer cutting automation equipment which has the advantages of simple and optimized structure, higher integration level, stronger compatibility, effectively improved processing efficiency and capability of realizing a full-coverage function.
The technical scheme adopted by the invention is as follows: the invention comprises a frame, a feeding module, a loading and unloading module, a cleaning module, a film coating module, a carrying module, a wafer platform and a laser module, wherein the cleaning module is arranged adjacent to the film coating module, the feeding module, the cleaning module and the film coating module are distributed along a straight line, the loading and unloading module and the carrying module are arranged above the cleaning module and the film coating module, the wafer platform is arranged at one side of the cleaning module and the film coating module, the wafer platform is positioned below the laser module, the loading and unloading module transfers the wafer of the feeding module to the film coating module, the carrying module transfers the wafer after film coating to the wafer platform, and then transfers the cut wafer to the cleaning module, and the loading and unloading module transfers the cleaned wafer to the feeding module for material collection.
One preferable scheme is, the feed module includes the lifting module, the action end of lifting module sets up the locating plate, be provided with the magazine on the locating plate, the feed opening has been seted up to the side of magazine, the feed opening orientation wash the module.
One preferred scheme is, wafer cutting automation equipment still includes the mounting bracket, with the length of mounting bracket is the X direction, with the width of mounting bracket is the Y direction, go up the unloading module and include along X direction driven first straight line module, first straight line module sets up the side body end of mounting bracket, the action end of first straight line module is provided with along vertical direction driven actuating cylinder, actuating cylinder's action end is connected with the material arm along the horizontal direction, the material arm is located wash the module with the top of tectorial membrane module, the end of material arm is provided with the clamping jaw, the clamp of clamping jaw gets the mouth directional the feed module.
One preferable scheme is, wash the module with the tectorial membrane module all is located the below of mounting bracket, wash the module with the tectorial membrane module all includes elevating system, first adsorption platform, is located first rotating electrical machines below the first adsorption platform and be located the second rotating electrical machines in the first adsorption platform outside, elevating system's action end with first adsorption platform is connected, the output shaft of first rotating electrical machines with the bottom transmission of first adsorption platform is connected, the output shaft of second rotating electrical machines is provided with a plurality of nozzles, the peripheral wall of first adsorption platform is provided with the water proof cover.
One preferable scheme is, the transport module includes along Y direction driven second straight line module, the second straight line module sets up the top of mounting bracket, the action end of second straight line module is provided with the mounting panel, the tow sides of mounting panel all are provided with along Y direction driven third straight line module, the action end of third straight line module is provided with along vertical direction driven fourth straight line module, the action end of fourth straight line module is provided with a plurality of suction nozzles.
The wafer platform comprises an XY axis moving platform and a second adsorption platform, the second adsorption platform is arranged at the action end of the XY axis moving platform, a plurality of positioning assemblies are arranged at the lateral end of the second adsorption platform, each positioning assembly comprises a swinging rotary cylinder, a pressing block is arranged at the action end of each swinging rotary cylinder, and the pressing blocks are in press fit with the second adsorption platform.
One preferable scheme is, the laser module sets up the side of frame top is held, the top of frame is provided with laser emitter, laser module includes along the fifth sharp module of vertical direction driven, the action end of fifth sharp module is provided with industry camera, laser range finder and laser eyepiece, laser emitter passes through the external mirror in proper order the laser eyepiece reflection extremely the upper surface of wafer platform, industry camera laser range finder and the mutual signal of telecommunication cooperation of laser emitter.
The preferred scheme is that the number of the nozzle groups of the cleaning module is two, and deionized water and compressed air are sprayed respectively; the number of the nozzle groups of the film coating module is three, and the film coating solution, deionized water and compressed air are sprayed respectively.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic perspective view of the feeding module;
FIG. 3 is a schematic perspective view of the loading and unloading module;
FIG. 4 is a schematic perspective view of the cleaning module and the film coating module;
FIG. 5 is a schematic perspective view of the handling module;
FIG. 6 is a schematic perspective view of the XY axis moving stage of the wafer stage;
fig. 7 is a schematic perspective view of a second adsorption platform of the XY axis moving platform of the wafer platform;
fig. 8 is a schematic perspective view of the laser module.
Detailed Description
As shown in fig. 1, in this embodiment, the present invention includes a frame 1, a feeding module 2, a loading and unloading module 3, a cleaning module 4, a film coating module 5, a carrying module 6, a wafer platform 7 and a laser module 8, wherein the cleaning module 4 is disposed adjacent to the film coating module 5, the feeding module 2, the cleaning module 4 and the film coating module 5 are distributed along a straight line, the loading and unloading module 3 and the carrying module 6 are disposed above the cleaning module 4 and the film coating module 5, the wafer platform 7 is disposed at one side of the cleaning module 4 and the film coating module 5, the wafer platform 7 is disposed below the laser module 8, the loading and unloading module 3 transfers the wafer of the feeding module 2 to the film coating module 5, the carrying module 6 transfers the wafer of the film coating to the wafer platform 7, and transfers the cut wafer to the cleaning module 4, and the loading and unloading module 3 transfers the cleaned wafer to the feeding module 2. The feeding module 2 is used for driving the wafer to move to a designated height, the feeding and discharging module 3 is used as a manipulator for moving the wafer between the feeding module 2 and the coating module 5, and is also used as a manipulator for moving the wafer between the feeding module 2 and the cleaning module 4, the coating module 5 sprays quantitative coating solution on the wafer, the solution is uniformly coated on the whole wafer by using the rotating centrifugal force of the wafer, deionized water is sprayed on the outer steel ring of the wafer, redundant coating solution on the steel ring is cleaned, and finally the steel ring of the wafer is air-dried, so that the coating of the wafer is completed; the laser module 8 is used for carrying out laser scribing on the wafer on the upper surface of the wafer platform 7, and the cleaning module 4 is used for cleaning dust generated by the production and cutting of the wafer and ensuring the processing quality; the handling module 6 is used as a manipulator for moving the wafer between the wafer platform 7 and the film covering module 5, and is also used as a manipulator for moving the wafer between the wafer platform 7 and the cleaning module 4.
As shown in fig. 2, in this embodiment, the feeding module 2 includes a lifting module 21, a positioning plate 22 is disposed at an action end of the lifting module 21, a material box 23 is disposed on the positioning plate 22, a material opening 24 is disposed at a side of the material box 23, and the material opening 24 faces the cleaning module 4. The positioning plate 22 is used for positioning the material box 23, the material box 23 is stacked with a plurality of wafers, the lifting module 21 is used as a power source for lifting the positioning plate 22, and the material feeding and discharging module 3 is used for feeding materials from the material opening 24.
As shown in fig. 3, in this embodiment, the wafer cutting automation apparatus further includes a mounting rack 9, with the length of the mounting rack 9 is in the X direction, with the width of the mounting rack 9 is in the Y direction, the loading and unloading module 3 includes a first linear module 31 driven along the X direction, the first linear module 31 is disposed at a lateral end of the mounting rack 9, a driving cylinder 32 driven along the vertical direction is disposed at an action end of the first linear module 31, a material taking arm 33 along the horizontal direction is connected to an action end of the driving cylinder 32, the material taking arm 33 is located above the cleaning module 4 and the film covering module 5, a clamping jaw 34 is disposed at an end of the material taking arm 33, and a clamping opening of the clamping jaw 34 is pointed to the material feeding module 2.
As shown in fig. 4, in this embodiment, the cleaning module 4 and the film covering module 5 are both located below the mounting rack 9, the cleaning module 4 and the film covering module 5 each include a lifting mechanism 41, a first adsorption platform 42, a first rotating motor 43 located below the first adsorption platform 42, and a second rotating motor 44 located outside the first adsorption platform 42, an actuating end of the lifting mechanism 41 is connected with the first adsorption platform 42, an output shaft of the first rotating motor 43 is in transmission connection with a bottom of the first adsorption platform 42, a plurality of nozzles 45 are disposed on an output shaft of the second rotating motor 44, and a water-proof cover 46 is disposed on a peripheral wall of the first adsorption platform 42. The waterproof cover 46 is used for preventing easy splashing, the first adsorption platform 42 is used for adsorbing a wafer, the lifting mechanism 41 is used for driving the first adsorption platform 42 to lift, the first rotary motor 43 drives the first adsorption platform 42 to rotate, the solution is uniformly coated on the whole wafer by using the rotary centrifugal force of the wafer, the second rotary motor 44 is used for driving the nozzle 45 to keep away and rotate the nozzle to the upper part of the wafer, the nozzle 45 is used for spraying the solution or airing a steel ring of the wafer, the cleaning module 4 and the structure of the film coating module 5 have universality, the film coating and cleaning function structure are basically consistent, the sprayed solution is different only during spraying, the function universality and the structure interchange can be realized, the maintenance and the replacement are simpler and the time is saved.
As shown in fig. 5, in this embodiment, the handling module 6 includes a second linear module 61 driven along the Y direction, the second linear module 61 is disposed at the top of the mounting rack 9, an actuating end of the second linear module 61 is provided with a mounting plate 62, both front and back sides of the mounting plate 62 are provided with a third linear module 63 driven along the Y direction, an actuating end of the third linear module 63 is provided with a fourth linear module 64 driven along the vertical direction, and an actuating end of the fourth linear module 64 is provided with a plurality of suction nozzles 65. The second linear module 61 drives the mounting plate 62 to move in the Y direction.
As shown in fig. 6 and 7, in this embodiment, the wafer stage 7 includes an XY axis moving stage 71 and a second adsorption stage 72, the second adsorption stage 72 is disposed at an action end of the XY axis moving stage 71, the second adsorption stage 72 is provided with a rotary DD motor, a bottom of the second adsorption stage 72 is in transmission connection with an output shaft of the rotary DD motor, and has a function of rotating around a Z axis, so as to implement angle adjustment of the second adsorption stage 72, a lateral end of the second adsorption stage 72 is provided with a plurality of positioning assemblies 73, the positioning assemblies 73 include a swinging rotary cylinder 74, a pressing block 75 is disposed at an action end of the swinging rotary cylinder 74, and the pressing block 75 is in press fit with the second adsorption stage 72. The XY axis moving platform 71 drives the second adsorption platform 72 to move in the X axis direction or in the Y axis direction, the XY axis moving platform 71 cooperates with the laser module 8 to cut the wafer, the swinging rotary cylinder 74 drives the pressing block 75 to rotate, the pressing block 75 cooperates with the second adsorption platform 72 in a pressing manner, and the wafer is prevented from shifting in the high-speed rotation process.
As shown in fig. 8, in this embodiment, the laser module 8 is disposed at a lateral end above the frame 1, a laser emitter 81 is disposed at the top of the frame 1, the laser module 8 includes a fifth linear module 82 driven along a vertical direction, an industrial camera 83, a laser range finder 84 and a laser eyepiece 85 are disposed at an action end of the fifth linear module 82, the laser emitter 81 sequentially passes through an external mirror and the laser eyepiece 85 and reflects to an upper surface of the wafer platform 7, and the industrial camera 83, the laser range finder 84 and the laser emitter 81 are mutually electrically matched. The industrial camera 83 is used for visual guidance, the laser range finder 84 is used for detecting the height from the tray, and the laser eyepiece 85 is used for adjusting the laser direction. The wafer cutting automation equipment has high 'intelligent' and high automation design, equipment is provided with various sensors to detect the running state of the equipment, a laser processing platform is provided with visual guidance and laser ranging guidance, and compared with the traditional laser processing scheme, the wafer cutting automation equipment has the functions of laser power monitoring, self-calibration and beam shaping, can realize automatic focusing of laser processing, can be compatible with different product non-processing requirements, and greatly reduces the processing cost of wafer materials. Vision and laser range finding guide cooperate with the high-precision wafer platform, automatic adjustment of material positions and angles can be realized, and therefore high-precision, high-efficiency and high-automation production is realized.
As shown in fig. 1 and fig. 4, in this embodiment, the number of the nozzle groups of the cleaning module 4 is two, and deionized water and compressed air are sprayed respectively; the number of nozzle groups of the film coating module 5 is three, and the film coating solution, deionized water and compressed air are sprayed respectively.
In this embodiment, the wafer dicing automation apparatus has the characteristics of high integration and high compatibility. The three functions of film coating, laser processing and cleaning are integrated into one device, so that a T-shaped structure is formed, the device is highly integrated, the module is simplified, and the whole set of wafer basic processing can be completed by one device. The full-automatic feeding and discharging device is used for realizing the compatible production of 8-inch and 12-inch wafers, and the manpower, the device cost and the device occupied area are greatly saved. The equipment adopts a high-precision product and is matched with a high-precision laser processing system, so that the processing precision can reach the micron level. The laser processing blowing module is matched with the film covering and cleaning function group, so that dust on the surface of the wafer can be effectively controlled, and the processing quality is ensured. The whole equipment adopts the modularized design, can be compatible with the switching of wafer hardware, has high-efficiency and convenient maintenance of optical path debugging, has wide industrial application prospect, can effectively improve the processing efficiency, and can realize the full coverage function.
The working principle of the invention is as follows: the method comprises the steps that a material box is placed in a locating plate by manual feeding, the locating plate is driven by a lifting module to move to a specified height, a wafer in the material box is clamped by a feeding and discharging module through a clamping jaw, slides on a track to the upper side of a film coating module, the wafer is placed on a first adsorption platform and is fixed through vacuum adsorption, a nozzle of the film coating module sprays quantitative film coating solution to the wafer, a first rotating motor uniformly coats the whole wafer with the solution by utilizing the rotary centrifugal force of the wafer, the nozzle of the film coating module is aligned with a steel ring outside the wafer to spray deionized water, redundant film coating solution on the steel ring is cleaned, compressed air is sprayed out from the nozzle of the film coating module after cleaning is finished, the steel ring of the wafer is air-dried, and then film coating work is completed; the carrying module moves the wafer to the second adsorption platform to detect height measurement, focusing, visual positioning and the like, controls the second adsorption platform to move through the XY axis moving platform, and controls the second adsorption platform to rotate and correct through the rotation DD motor. The laser module is matched with the XY axis moving platform to finish scribing and cutting of the wafer, the carrying module moves the wafer after laser processing to the cleaning module, the functional structure of the cleaning module is basically consistent with that of the film covering module, the spraying solution sprayed by the nozzle of the cleaning module is different when spraying, the spraying solution is deionized water and compressed air, the spraying is stopped after the deionized water on the wafer is air-dried, the cleaning work is further finished, and the cleaning module returns the cleaned wafer to the material box.
Claims (8)
1. Wafer cutting automation equipment, including frame (1), its characterized in that: the wafer cutting automation equipment further comprises a feeding module (2), an upper material discharging module (3), a cleaning module (4), a film covering module (5), a carrying module (6), a wafer platform (7) and a laser module (8), wherein the cleaning module (4) is arranged adjacent to the film covering module (5), the feeding module (2), the cleaning module (4) and the film covering module (5) are distributed along a straight line, the upper material discharging module (3) and the carrying module (6) are arranged above the cleaning module (4) and the film covering module (5), the wafer platform (7) is arranged on one side of the cleaning module (4) and the film covering module (5), the wafer platform (7) is arranged below the laser module (8), the upper material discharging module (3) is used for carrying the wafer of the feeding module (2) to the film covering module (5), the carrying module (6) is used for carrying the wafer (4) to transfer the wafer (7) to the wafer module (4), and then the wafer platform (4) is used for carrying the wafer (4) to clean the wafer module (4).
2. The automated wafer dicing apparatus of claim 1, wherein: the feeding module (2) comprises a lifting module (21), a positioning plate (22) is arranged at the action end of the lifting module (21), a material box (23) is arranged on the upper surface of the positioning plate (22), a material opening (24) is formed in the lateral side of the material box (23), and the material opening (24) faces the cleaning module (4).
3. The automated wafer dicing apparatus of claim 1, wherein: the wafer cutting automation equipment further comprises a mounting frame (9), the length of the mounting frame (9) is in the X direction, the width of the mounting frame (9) is in the Y direction, the feeding and discharging module (3) comprises a first linear module (31) driven in the X direction, the first linear module (31) is arranged at the lateral end of the mounting frame (9), a driving cylinder (32) driven in the vertical direction is arranged at the action end of the first linear module (31), a material taking arm (33) driven in the horizontal direction is connected at the action end of the driving cylinder (32), the material taking arm (33) is located above the cleaning module (4) and the film covering module (5), a clamping jaw (34) is arranged at the tail end of the material taking arm (33), and a clamping mouth of the clamping jaw (34) points to the material feeding module (2).
4. A wafer dicing automation apparatus according to claim 3, wherein: the cleaning module (4) and the tectorial membrane module (5) are all located the below of mounting bracket (9), the cleaning module (4) with tectorial membrane module (5) all include elevating system (41), first adsorption platform (42), be located first rotating electrical machines (43) of first adsorption platform (42) below and be located second rotating electrical machines (44) in the outside of first adsorption platform (42), the action end of elevating system (41) with first adsorption platform (42) are connected, the output shaft of first rotating electrical machines (43) with the bottom transmission of first adsorption platform (42) is connected, the output shaft of second rotating electrical machines (44) is provided with a plurality of nozzles (45), the peripheral wall of first adsorption platform (42) is provided with waterproof cover (46).
5. A wafer dicing automation apparatus according to claim 3, wherein: the carrying module (6) comprises a second linear module (61) driven along the Y direction, the second linear module (61) is arranged at the top of the mounting frame (9), a mounting plate (62) is arranged at the action end of the second linear module (61), third linear modules (63) driven along the Y direction are arranged on the front surface and the back surface of the mounting plate (62), fourth linear modules (64) driven along the vertical direction are arranged at the action end of the third linear modules (63), and a plurality of suction nozzles (65) are arranged at the action end of the fourth linear modules (64).
6. The automated wafer dicing apparatus of claim 1, wherein: the wafer platform (7) comprises an XY axis moving platform (71) and a second adsorption platform (72), the second adsorption platform (72) is arranged at the action end of the XY axis moving platform (71), a plurality of positioning assemblies (73) are arranged at the lateral ends of the second adsorption platform (72), each positioning assembly (73) comprises a swinging rotary cylinder (74), a pressing block (75) is arranged at the action end of each swinging rotary cylinder (74), and the pressing blocks (75) are in press fit with the second adsorption platform (72).
7. The automated wafer dicing apparatus of claim 1, wherein: the laser module (8) is arranged at the lateral end above the frame (1), a laser emitter (81) is arranged at the top of the frame (1), the laser module (8) comprises a fifth linear module (82) driven along the vertical direction, an industrial camera (83), a laser range finder (84) and a laser eyepiece (85) are arranged at the action end of the fifth linear module (82), the laser emitter (81) sequentially passes through an external reflector, the laser eyepiece (85) reflects to the upper surface of the wafer platform (7), and the industrial camera (83), the laser range finder (84) and the laser emitter (81) are matched with each other in an electric signal.
8. The automated wafer dicing apparatus of claim 4, wherein: the number of the nozzle groups of the cleaning module (4) is two, and deionized water and compressed air are sprayed respectively; the number of the nozzle groups of the film coating module (5) is three, and the film coating solution, deionized water and compressed air are sprayed respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202310242540.XA CN116460453A (en) | 2023-03-14 | 2023-03-14 | Wafer cutting automation equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310242540.XA CN116460453A (en) | 2023-03-14 | 2023-03-14 | Wafer cutting automation equipment |
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| CN116460453A true CN116460453A (en) | 2023-07-21 |
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| CN202310242540.XA Pending CN116460453A (en) | 2023-03-14 | 2023-03-14 | Wafer cutting automation equipment |
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Cited By (1)
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| CN117324788A (en) * | 2023-10-25 | 2024-01-02 | 法特迪精密科技（苏州）有限公司 | Wafer laser cutting machine and wafer driving method |
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