CN212421825U - Full-automatic cutting and cleaning integrated machine for wafer - Google Patents

Full-automatic cutting and cleaning integrated machine for wafer Download PDF

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Publication number
CN212421825U
CN212421825U CN202020538024.3U CN202020538024U CN212421825U CN 212421825 U CN212421825 U CN 212421825U CN 202020538024 U CN202020538024 U CN 202020538024U CN 212421825 U CN212421825 U CN 212421825U
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wafer
cleaning
cutting
placing
material taking
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CN202020538024.3U
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戚孝峰
周鹏程
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Zhengfeng Semiconductor Technology Suzhou Co ltd
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Zhengfeng Semiconductor Technology Suzhou Co ltd
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Abstract

The utility model relates to a full automatic cutout of wafer washs all-in-one, it includes the organism, is provided with the wafer cutting in the organism and places the dish, and one side of organism is provided with the wafer and places the magazine, is provided with first feeding agencies and second feeding agencies in the organism, and second feeding agencies extends to first feeding agencies and the top that the dish was placed in the wafer cutting. The utility model discloses when wasing the wafer, place the wafer in the standing groove in the wafer box of placing the magazine, place the magazine with the wafer again and place on the blowing board, make the arm of getting the material slide in the organism, make the arm of getting the material drive the pneumatic finger of Y type and remove the one side that the magazine was placed to the wafer, make the pneumatic finger of Y type press from both sides and get the wafer, make the arm of getting the material again and drive the wafer and remove to the below of second feeding agencies, second feeding agencies can drive the wafer and remove the wafer cutting and place a set upper end, thereby can realize the automatic feeding to the wafer.

Description

Full-automatic cutting and cleaning integrated machine for wafer
Technical Field
The utility model belongs to the technical field of the technique of wafer processing production facility and specifically relates to a full automatic cutout of wafer washs all-in-one.
Background
Silicon semiconductor integrated circuits are used more and more widely, wherein the silicon semiconductor integrated circuits all need to use wafers, and the wafers used for the silicon semiconductor integrated circuits are processed in the early stage. The traditional wafer processing is purely manual operation, that is, a worker uses a cutting machine (a diamond cutting machine, a laser cutting machine, etc.) to process a wafer, and the existing wafer processing technology has the following problems due to manual operation: firstly, the processing precision is low, the distance between the cut wafers is large, and the uniformity is poor; secondly, the material of the wafer which can be cut is single, and the applicability is poor; thirdly, the rejection rate is high, the material consumption is large, and the production efficiency is low; and fourthly, the precision requirement on the work in the machining process is high, and meanwhile, the labor intensity is high, and the body of a worker is easily injured. Thus, a semi-automatic wafer cutting machine exists in the prior art.
For example, patent publication No. CN 204621370U's utility model patent specifically discloses a semi-automatic wafer scribing cutting machine, which comprises a frame, work dish and cutting mechanism, the work dish is located the frame, and cutting mechanism is located the top of work dish, and the frame is provided with the rotary driving mechanism who drives work dish rotary motion, drives the X axle actuating mechanism of rotary driving mechanism along X axle motion and drives the Y axle actuating mechanism of X axle actuating mechanism along Y axle motion, is provided with the portal frame in the frame, and the portal frame is installed and is used for driving the Z axle actuating mechanism of cutting mechanism along Z axle motion.
Although the technical scheme can realize automatic cutting of the wafer, the wafer is placed on the cutting disc manually in the machining process by one piece, and the positioning device is reused for manually clamping the wafer, so that the operation is more complicated in the cutting process, and the production efficiency is lower.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a not enough to prior art exists, the utility model aims at providing a full automatic cutout of wafer washs all-in-one, and unloading in the automation that can realize the wafer is gone up to this cutting machine to can improve the cutting efficiency of wafer.
The above object of the present invention is achieved by the following technical solutions:
a full-automatic cutting and cleaning integrated machine for a wafer comprises a machine body, wherein a cutting device is arranged in the machine body, a wafer cutting and placing disc is arranged in the machine body and is arranged below the cutting device, a wafer placing table is arranged on one side of the machine body, a material placing plate is connected in the wafer placing table in a sliding mode and slides in the vertical direction, a wafer placing material box is placed on the material placing plate, and a plurality of placing grooves which are parallel to each other are horizontally arranged in the wafer placing material box;
the machine body is internally provided with a first material taking mechanism, the first material taking mechanism is arranged on one side of the wafer cutting and placing disc, the first material taking mechanism comprises a material taking arm connected with the machine body in a sliding mode and a Y-shaped pneumatic finger fixedly connected with the material taking arm, and the Y-shaped pneumatic finger is arranged towards the wafer placing material box;
and a second material taking mechanism is arranged in the machine body and extends to the upper part of the first material taking mechanism and the upper part of the wafer cutting and placing disc.
By adopting the technical scheme, when the wafer is cleaned, the wafer is placed in the placing groove in the wafer placing material box, the wafer placing material box is placed on the material placing plate, the material taking arm slides in the machine body, the material taking arm drives the Y-shaped pneumatic finger to move to one side of the wafer placing material box, the Y-shaped pneumatic finger enables the Y-shaped pneumatic finger to clamp the wafer, the material taking arm drives the wafer to move to the position below the second material taking mechanism, the second material taking mechanism can drive the wafer to move to the upper end of the wafer cutting placing plate, and the cutting device can cut the wafer, so that the automatic feeding of the wafer can be realized, and the cutting efficiency of the wafer can be improved.
The present invention may be further configured in a preferred embodiment as: the second material taking mechanism comprises a first electric guide rail fixedly connected with the machine body, a moving arm connected with the first electric guide rail in a sliding mode, a first air cylinder fixedly connected with the moving arm and a moving frame fixedly connected with a piston rod of the first moving air cylinder, the piston rod of the first air cylinder is arranged towards the first material taking mechanism, and the moving frame is connected with a plurality of vacuum adsorption tubes.
Through adopting above-mentioned technical scheme, when carrying the wafer, start first electronic guide rail, make the moving arm remove on first electronic guide rail, thereby the moving arm can drive first cylinder and move the frame and remove, when removing the frame and remove the wafer top, start first cylinder, and utilize the vacuum adsorption pipe to adsorb the wafer, thereby can make the moving arm drive the wafer and remove, realize the automatic feeding of wafer, can improve the work efficiency of wafer cutting.
The present invention may be further configured in a preferred embodiment as: and an elastic sucker is connected below the vacuum adsorption tube.
Through adopting above-mentioned technical scheme, when vacuum adsorption tube adsorbs the wafer, the elastic chuck can with the wafer butt, can play certain cushioning effect to the wafer when absorbing the wafer to can avoid the phenomenon that the wafer takes place wearing and tearing.
The present invention may be further configured in a preferred embodiment as: and a static eliminator is arranged in the frame and is arranged on one side of the wafer placing box.
By adopting the technical scheme, when the material taking arm drives the wafer to move, the static eliminator is started, and can blow a large amount of positive and negative ions to the surface of the wafer, so that static electricity on the surface of the wafer can be neutralized, dust is prevented from being adhered to the surface of the wafer due to the static electricity, and the quality of the wafer is ensured.
The present invention may be further configured in a preferred embodiment as: the wafer cleaning device is arranged in the machine body and comprises a cleaning tank, a cleaning disc and a cleaning arm, wherein the cleaning tank is arranged on one side of the wafer cutting placing disc, the cleaning disc is arranged in the cleaning tank, the cleaning arm is arranged on one side of the cleaning disc, a cleaning nozzle is arranged on the cleaning arm, and the cleaning disc is arranged below the first material taking mechanism and the second material taking mechanism.
Through adopting above-mentioned technical scheme, after cutting the wafer, can shift the wafer to wasing the dish upper end, wash the washing arm of dish one side and can wash the wafer on wasing the dish to can guarantee the quality of wafer with the remaining dust clean up in wafer upper end.
The present invention may be further configured in a preferred embodiment as: the cleaning device comprises a cleaning tank, and is characterized in that a first motor is fixedly connected in the cleaning tank, a rotating shaft is fixedly connected to an output shaft of the first motor, and the rotating shaft is rotatably arranged in the cleaning tank in a penetrating mode and fixedly connected with a cleaning arm.
Through adopting above-mentioned technical scheme, when wasing the wafer, start first motor, first motor drives the pivot and rotates, can drive the cleaning arm rotation when the pivot rotates, and when the pivot drove the cleaning arm pivoted, the cleaning arm can swing, and wobbling cleaning arm can carry out abundant washing to the wafer, guarantees the cleaning performance to the wafer.
The present invention may be further configured in a preferred embodiment as: and a plurality of vacuum adsorption holes are formed in the wafer cutting and placing disc.
Through adopting above-mentioned technical scheme, when cutting the wafer, utilize the wafer cutting to place the vacuum adsorption pore pair wafer of dish upper end and adsorb to the wafer to can guarantee that the wafer is comparatively stable at the in-process of cutting.
The present invention may be further configured in a preferred embodiment as: the material placing plate is fixedly connected with a limiting clamping plate, and the limiting clamping plate is in clamping fit with the wafer placing box.
Through adopting above-mentioned technical scheme, when the magazine was placed to the wafer and blowing board matched with mutually, spacing cardboard can place the magazine to the wafer and carry out spacing fixed to can place the magazine to the wafer and fix spacing, guarantee that the wafer places the stability of magazine.
To sum up, the utility model discloses a following at least one useful technological effect:
1. when a wafer is cleaned, the wafer is placed in a placing groove in a wafer placing box, the wafer placing box is placed on a material placing plate, a material taking arm slides in a machine body, the material taking arm drives a Y-shaped pneumatic finger to move to one side of the wafer placing box, the Y-shaped pneumatic finger is driven by the material taking arm to clamp the wafer, the material taking arm drives the wafer to move to the position below a second material taking mechanism, the second material taking mechanism can drive the wafer to move to the upper end of a wafer cutting placing plate, and a cutting device can cut the wafer, so that the automatic feeding of the wafer can be realized, and the cutting efficiency of the wafer can be improved;
2. when the wafer is conveyed, the first electric guide rail is started, the moving arm moves on the first electric guide rail, so that the moving arm can drive the first air cylinder and the moving frame to move;
3. when the material taking arm drives the wafer to move, the static eliminator is started, and can blow a large amount of positive and negative ions to the surface of the wafer, so that static electricity on the surface of the wafer can be neutralized, dust is prevented from being adhered to the surface of the wafer due to the static electricity, and the quality of the wafer is ensured;
4. after the wafer is cut, the wafer can be transferred to the upper end of the cleaning disc, and the cleaning arm on one side of the cleaning disc can clean the wafer on the cleaning disc, so that the residual dust on the upper end of the wafer can be cleaned up, and the quality of the wafer is guaranteed.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a cutting and cleaning integrated machine;
FIG. 2 is a schematic view of the internal structure of the housing;
fig. 3 is a schematic structural diagram of a first material taking mechanism and a second material taking mechanism;
FIG. 4 is a schematic diagram showing the detailed structure of the wafer cleaning apparatus;
FIG. 5 is a schematic view of the structure of the lower part of the wafer cleaning apparatus.
In the figure, 1, a machine body; 2. a wafer placing table; 3. a material placing plate; 4. a wafer placing box; 5. a placement groove; 6. a limiting clamping plate; 7. cutting the wafer and placing the wafer; 8. a first material taking mechanism; 81. a material taking arm; 82. a Y-shaped pneumatic finger; 83. a second motorized rail; 9. a second material taking mechanism; 91. a first motorized rail; 92. a moving arm; 93. a first cylinder; 94. a movable frame; 95. a vacuum adsorption tube; 96. an elastic sucker; 10. a wafer cleaning device; 101. a cleaning tank; 102. cleaning the arm; 103. cleaning the spray head; 104. cleaning the disc; 11. a first motor; 12. a rotating shaft; 13. a static eliminator.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to the figure 1, for the utility model discloses a full automatic cutout of wafer washs all-in-one, including organism 1, one side of organism 1 is provided with the wafer and places platform 2, the wafer is placed platform 2 internal slipping and is connected with blowing board 3, blowing board 3 slides in the vertical direction, blowing board 3 can go up and down through cylinder hydro-cylinder or screw nut, it places magazine 4 to place the wafer on blowing board 3, the wafer is placed magazine 4 internal level and is provided with a plurality of standing grooves 5 that are parallel to each other, fixedly connected with spacing cardboard 6 on the blowing board 3, spacing cardboard 6 places magazine 4 looks joint cooperation with the wafer, when placing the wafer, place the wafer in standing groove 5, place magazine 4 with the wafer again and place on blowing board 3, make blowing board 3 cooperate with spacing cardboard 6.
Referring to fig. 2, a wafer cutting placing plate 7 is arranged in the machine body 1, and a cutting device (not shown in the figure) is arranged in the machine body 1, and the cutting device comprises an automatic feed structure and a cutting tool bit, so that multi-angle and multi-direction cutting of the cutting tool bit can be realized. The wafer cutting placing plate 7 is arranged below the cutting device, a plurality of vacuum adsorption holes are formed in the wafer cutting placing plate 7, when the wafer is cut, the wafer cutting placing plate 7 can absorb the wafer, the wafer is more stable in cutting, one side of the wafer placing box 4 is provided with a first material taking mechanism 8, a second material taking mechanism 9 is arranged in the machine body 1, a wafer cleaning device 10 is further arranged in the machine body 1, the first material taking mechanism 8 and the second material taking mechanism 9 are mutually matched to realize transfer of the wafer, the wafer is moved to the wafer cutting placing plate 7 and is matched with the wafer cleaning device 10, and therefore automatic feeding, discharging and automatic cleaning of the wafer can be achieved.
Referring to fig. 3, the first material taking mechanism 8 is disposed on one side of the wafer cutting and placing tray 7, the first material taking mechanism 8 includes a material taking arm 81 connected with the machine body 1 in a sliding manner and a Y-shaped pneumatic finger 82 fixedly connected with the material taking arm 81, the Y-shaped pneumatic finger 82 is disposed towards the wafer placing box 4, a second electric guide rail 83 is fixedly connected in the machine body 1, the material taking arm 81 is connected with the second electric guide rail 83, the second electric guide rail 83 is started when the wafer needs to be moved, the second electric guide rail 83 drives the Y-shaped pneumatic finger 82 to move to one side of the wafer, the Y-shaped pneumatic finger 82 is started, the Y-shaped pneumatic finger 82 clamps the wafer, the wafer is transferred, and therefore automatic movement of the wafer can be guaranteed.
Referring to fig. 3, the second material taking mechanism 9 extends to the first material taking mechanism 8 and above the wafer cutting placement tray 7, the second material taking mechanism 9 includes a first electric guide rail 91 fixedly connected with the machine body 1, a moving arm 92 connected with the first electric guide rail 91 in a sliding manner, a first air cylinder 93 fixedly connected with the moving arm 92 and a moving frame 94 fixedly connected with a piston rod of the first moving air cylinder, the first electric guide rail 91 is arranged on one side of the wafer cutting placement tray 7 and the first material taking mechanism 8, the piston rod of the first air cylinder 93 is arranged towards the first material taking mechanism 8, the moving frame 94 is connected with a plurality of vacuum adsorption tubes 95, and an elastic suction cup 96 is connected below the vacuum adsorption tubes 95.
When the material taking arm 81 is connected with the wafer, the first electric guide rail 91 is started, the moving arm 92 moves on the first electric guide rail 91, so that the moving arm 92 can drive the first air cylinder 93 and the moving frame 94 to move, when the moving frame 94 moves to the upper side of the wafer, the first air cylinder 93 is started, the vacuum adsorption tube 95 is used for adsorbing the wafer, the moving arm 92 can drive the wafer to move, and automatic feeding of the wafer is achieved.
Referring to fig. 4 and 5, wafer cleaning device 10 is including setting up at the washing tank 101 of wafer cutting placing disc 7 one side, set up washing dish 104 in washing tank 101 and set up the washing arm 102 in washing dish 104 one side, be provided with washing shower nozzle 103 on the washing arm 102, washing dish 104 sets up in the below of first feeding agencies 8 and second feeding agencies 9, the first motor 11 of fixedly connected with in organism 1, the output shaft fixedly connected with pivot 12 of first motor 11, pivot 12 rotate wear to establish in washing tank 101 and with washing arm 102 fixed connection, after cutting the wafer, can shift the wafer to washing dish 104 upper end, the washing arm 102 of washing dish 104 one side can wash the wafer on the washing dish 104, thereby can be with the remaining dust clean up in wafer upper end.
Referring to fig. 4, a static eliminator 13 is arranged in the frame, the static eliminator 13 is arranged on one side of the wafer placing box 4, when the material taking arm 81 drives the wafer to move, the static eliminator 13 is started, and the static eliminator 13 can blow a large amount of positive and negative ions to the surface of the wafer, so that static electricity on the surface of the wafer can be neutralized, and dust is prevented from being adhered to the surface of the wafer due to the static electricity.
The implementation principle of the embodiment is as follows: when cleaning the wafer, the wafer is placed in the placing groove 5 in the wafer placing box 4, then the wafer placing box 4 is placed on the placing plate 3, the material taking arm 81 slides in the machine body 1, the material taking arm 81 drives the Y-shaped pneumatic finger 82 to move to one side of the wafer placing box 4, the pneumatic Y-shaped pneumatic finger 82 drives the Y-shaped pneumatic finger 82 to clamp the wafer, the material taking arm 81 drives the wafer to move to the lower side of the second material taking mechanism 9, the second material taking mechanism 9 can drive the wafer to move to the upper end of the wafer cutting placing plate 7, the cutting device can cut the wafer, so that automatic feeding of the wafer can be realized, after the wafer is cut, the wafer can be placed in the wafer cleaning device 10 to be cleaned by using the first material taking mechanism 8 and the second material taking mechanism 9, after cleaning, the first material taking mechanism 8 and the second material taking mechanism 9 return the wafer to the wafer placing material box 4, so that automatic blanking of the wafer is realized, and the cutting efficiency of the wafer can be improved.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims (8)

1. The utility model provides a full automatic cutout of wafer washs all-in-one, includes organism (1), be provided with cutting device in organism (1), it places dish (7) to be provided with the wafer cutting in organism (1), the wafer cutting is placed dish (7) and is set up in cutting device's below, its characterized in that: a wafer placing table (2) is arranged on one side of the machine body (1), a material discharging plate (3) is connected in the wafer placing table (2) in a sliding manner, the material discharging plate (3) slides in the vertical direction, a wafer placing material box (4) is placed on the material discharging plate (3), and a plurality of placing grooves (5) which are parallel to each other are horizontally arranged in the wafer placing material box (4);
a first material taking mechanism (8) is arranged in the machine body (1), the first material taking mechanism (8) is arranged on one side of the wafer cutting and placing disc (7), the first material taking mechanism (8) comprises a material taking arm (81) connected with the machine body (1) in a sliding mode and a Y-shaped pneumatic finger (82) fixedly connected with the material taking arm (81), and the Y-shaped pneumatic finger (82) is arranged towards the wafer placing material box (4);
a second material taking mechanism (9) is arranged in the machine body (1), and the second material taking mechanism (9) extends to the upper portion of the first material taking mechanism (8) and the upper portion of the wafer cutting and placing disc (7).
2. The full-automatic cutting and cleaning integrated machine for the wafer as claimed in claim 1, wherein: second feeding agencies (9) including with organism (1) fixed connection first electronic guide rail (91), with first electronic guide rail (91) the removal arm (92) of sliding connection, with removal arm (92) fixed connection's first cylinder (93) and with first removal cylinder piston rod fixed connection's removal frame (94), the piston rod of first cylinder (93) sets up towards first feeding agencies (8), be connected with a plurality of vacuum adsorption pipes (95) on removal frame (94).
3. The full-automatic cutting and cleaning integrated machine for the wafer as claimed in claim 2, wherein: an elastic sucker (96) is connected below the vacuum adsorption tube (95).
4. The full-automatic cutting and cleaning integrated machine for the wafer as claimed in claim 1, wherein: the machine body (1) is internally provided with a static eliminator (13), and the static eliminator (13) is arranged on one side of the wafer placing box (4).
5. The full-automatic cutting and cleaning integrated machine for the wafer as claimed in claim 1, wherein: the wafer cleaning device is characterized in that a wafer cleaning device (10) is arranged in the machine body (1), the wafer cleaning device (10) comprises a cleaning tank (101) arranged on one side of a wafer cutting placing disc (7), a cleaning disc (104) arranged in the cleaning tank (101) and a cleaning arm (102) arranged on one side of the cleaning disc (104), a cleaning spray head (103) is arranged on the cleaning arm (102), and the cleaning disc (104) is arranged below the first material taking mechanism (8) and the second material taking mechanism (9).
6. The full-automatic cutting and cleaning integrated machine for the wafer as claimed in claim 5, wherein: the cleaning machine is characterized in that a first motor (11) is fixedly connected in the machine body (1), an output shaft of the first motor (11) is fixedly connected with a rotating shaft (12), and the rotating shaft (12) is rotatably arranged in the cleaning tank (101) in a penetrating mode and is fixedly connected with a cleaning arm (102).
7. The full-automatic cutting and cleaning integrated machine for the wafer as claimed in claim 1, wherein: the wafer cutting and placing disc (7) is provided with a plurality of vacuum adsorption holes.
8. The full-automatic cutting and cleaning integrated machine for the wafer as claimed in claim 1, wherein: the material placing plate (3) is fixedly connected with a limiting clamping plate (6), and the limiting clamping plate (6) is in clamping fit with the wafer placing box (4).
CN202020538024.3U 2020-04-13 2020-04-13 Full-automatic cutting and cleaning integrated machine for wafer Active CN212421825U (en)

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Application Number Priority Date Filing Date Title
CN202020538024.3U CN212421825U (en) 2020-04-13 2020-04-13 Full-automatic cutting and cleaning integrated machine for wafer

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Application Number Priority Date Filing Date Title
CN202020538024.3U CN212421825U (en) 2020-04-13 2020-04-13 Full-automatic cutting and cleaning integrated machine for wafer

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112466793A (en) * 2021-02-01 2021-03-09 四川晶辉半导体有限公司 Chip wafer scribing device
CN114346474A (en) * 2022-01-17 2022-04-15 深圳市陆芯半导体有限公司 Full-automatic laser wafer cutting device and cutting method
CN115178557A (en) * 2022-07-18 2022-10-14 东莞科卓机器人有限公司 Wafer cutting machine belt cleaning device
WO2023045131A1 (en) * 2021-09-23 2023-03-30 江苏亚电科技有限公司 Wafer static eliminating device having sorting function
CN116117237A (en) * 2022-12-20 2023-05-16 苏州镁伽科技有限公司 Chip unloading method, chip unloading device, dicing saw, readable storage medium and electronic apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112466793A (en) * 2021-02-01 2021-03-09 四川晶辉半导体有限公司 Chip wafer scribing device
WO2023045131A1 (en) * 2021-09-23 2023-03-30 江苏亚电科技有限公司 Wafer static eliminating device having sorting function
CN114346474A (en) * 2022-01-17 2022-04-15 深圳市陆芯半导体有限公司 Full-automatic laser wafer cutting device and cutting method
CN115178557A (en) * 2022-07-18 2022-10-14 东莞科卓机器人有限公司 Wafer cutting machine belt cleaning device
CN116117237A (en) * 2022-12-20 2023-05-16 苏州镁伽科技有限公司 Chip unloading method, chip unloading device, dicing saw, readable storage medium and electronic apparatus

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