CN215356747U

CN215356747U - Laser cutting equipment

Info

Publication number: CN215356747U
Application number: CN202023287094.5U
Authority: CN
Inventors: 张伟; 熊胜亮; 柳啸; 杨楚风; 陈畅; 王亭入; 安珂; 尹建刚; 高云峰
Original assignee: Han s Laser Technology Industry Group Co Ltd
Current assignee: Shenzhen Hans Semiconductor Equipment Technology Co Ltd
Priority date: 2020-12-30
Filing date: 2020-12-30
Publication date: 2021-12-31
Anticipated expiration: 2030-12-30

Abstract

The utility model belongs to the technical field of laser processing, and relates to laser cutting equipment which comprises a rack, a transmission mechanism, a cleaning device, a gluing device, a feeding and discharging assembly, a base body, a moving platform, a laser processing assembly and a material box lifting mechanism, wherein the transmission mechanism, the cleaning device, the gluing device and the feeding and discharging assembly are arranged on the rack, the base body is arranged on the rack, and the moving platform, the laser processing assembly and the material box lifting mechanism are arranged on the base body. This laser cutting equipment has rubber coating and washing dual function through making belt cleaning device, and through transmission device, the motion platform, go up the coordination between spare parts such as unloading subassembly, ensure to put the longer material of rubber coating time in belt cleaning device and glue and wash, put the material that the rubber coating time is shorter and glue in the rubber coating device, wash in belt cleaning device, wait time in the middle of so saving, let the linking of the manufacturing procedure of each material inseparabler, in order to add man-hour to a plurality of materials simultaneously, can improve the utilization ratio in this laser cutting machine washing chamber effectively, in order when guaranteeing the cutting quality, improve laser cutting machine's productivity.

Description

Laser cutting equipment

Technical Field

The utility model relates to the technical field of laser processing, in particular to laser cutting equipment.

Background

In the production of high-speed electronic components, low dielectric constant films and copper materials have been increasingly used as wafer materials, but these wafers are difficult to cut with a common diamond blade. Generally, a laser grooving technology of cold working is adopted for cutting, specifically, short pulse laser is focused on the surface of a wafer and then irradiated, the laser pulse is continuously absorbed by a low dielectric constant film, but after absorbing a certain degree of heat energy, the low dielectric constant film is instantly vaporized, and due to the principle of interaction, the heat energy of a chip is consumed by the vaporized substance, so that the cold working of micro-heat influence is realized. In order to improve the production efficiency and effectively prevent the processing quality problem caused by the poor factors of collapse, surface layer falling and the like, furthermore, a short pulse laser is usually adopted to etch in the cutting channel to form a groove; and then, a diamond blade is used for carrying out full cutting processing on the middle area of the groove, so that the wafer is cut into a plurality of small crystal grains.

At present, a wafer laser grooving process generally comprises three procedures of wafer gluing, wafer laser grooving and wafer cleaning, and after the wafer enters a laser grooving machine, gluing, grooving and cleaning are sequentially carried out. In practical applications, the three processes can be performed simultaneously, that is, a machine usually has three wafers, one wafer is coated with glue, the other wafer is grooved, and the other wafer is cleaned, so that the machine capacity finally depends on the wafer with the longest time in the whole process. Specifically, for a wafer with a small crystal grain, although the gluing time is short, the laser grooving time is longest; on the contrary, for some wafers with larger dies, laser grooving takes relatively little time, but the glue coating time of the wafer is longest. In order to improve the overall productivity of the machine, the gluing time is usually shortened, but the gluing time is difficult to shorten due to the requirement of ensuring the quality of subsequent wafer laser grooving, namely, the grooving quality is difficult to be ensured quickly.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model aims to provide laser cutting equipment, which is used for solving the technical problem that the cutting quality and the productivity of the existing cutting equipment are difficult to ensure at the same time.

In order to solve the technical problems, the following technical scheme is adopted:

the laser cutting equipment comprises a rack, a base body arranged on the rack, a moving platform, a laser processing assembly and a material box lifting mechanism which are arranged on the base body, and a transmission mechanism, a correction assembly, a supporting assembly, a cleaning device, a gluing device and a feeding and discharging assembly which are arranged on the rack;

the moving platform is provided with a feeding station and a processing station and is used for transferring materials on the feeding station and the processing station;

the laser processing assembly is used for carrying out laser cutting on the material on the processing station of the moving platform;

the material box lifting mechanism is used for conveying materials between the initial position of the material box and the working table surface of the correction assembly;

the conveying mechanism is positioned in an area enclosed among the cleaning device, the gluing device and the moving platform and is used for conveying materials in the material box conveyed by the material box lifting mechanism to the supporting assembly and/or the correcting assembly;

the cleaning device can be used for connecting materials with the correction assembly, and is used for gluing and cleaning one part of materials and cleaning the other part of materials;

the gluing device can be connected with the supporting component to glue another part of materials;

the feeding and discharging assembly is used for conveying the glued materials to a feeding station of the moving platform from the correcting assembly or the supporting assembly and conveying the cut materials to be cleaned;

wherein the gluing time of one part of the material is longer than that of the other part of the material.

In some embodiments, the support assembly, the gluing device, the cleaning device, the correction assembly and the magazine are arranged side by side in sequence in a direction towards the front of the operator.

Alternatively, in other embodiments, the calibration assembly, the cleaning device, the gluing device, the support assembly and the initial position of the magazine are arranged side by side in sequence in a direction towards the front of the operator.

In some embodiments, the cleaning device comprises a support, a cavity, a carrying platform, a moving assembly and a swing arm assembly, wherein the support is arranged on the rack, the cavity is arranged on the support and encloses a cavity, and an opening communicated with the cavity is formed in the bottom of the cavity;

the carrying platform is arranged on the moving assembly, the moving assembly and the cavity are mutually independent and are arranged on one side close to the opening of the cavity, and the moving assembly is arranged on the rack; the moving assembly is used for driving the carrying platform to lift and rotate in the containing cavity;

the swing arm assembly is arranged in the containing cavity of the cavity assembly and used for cleaning and gluing materials.

In some embodiments, the moving assembly includes a lifting structure and a rotating structure, the rotating structure is disposed on an output end of the lifting structure, and the lifting structure is configured to drive the rotating structure to lift and lower along a center line direction of the stage; the carrying platform is arranged at the output end of the rotating structure, and the rotating structure is used for driving the carrying platform to rotate in the containing cavity.

In some embodiments, the cleaning device further comprises a tubing assembly disposed on the cavity; the swing arm assembly comprises a swing arm mechanism and a cleaning nozzle assembly and a gluing nozzle assembly which are arranged on the swing arm mechanism, the cleaning nozzle assembly and the gluing nozzle assembly are connected with the pipeline assembly, the cleaning nozzle assembly is used for cleaning materials through cleaning liquid transmitted by the pipeline assembly, and the gluing nozzle assembly is used for gluing the materials through glue liquid transmitted by the pipeline assembly.

Or in other embodiments, the gluing device is further used for cleaning materials, and the gluing device and the cleaning device are identical in structure and are symmetrically arranged.

In some embodiments, the loading and unloading assembly is a multi-axis robot.

In some embodiments, the laser machining assembly is located on a side of the laser cutting apparatus proximate to an operator; the magazine lifting mechanism is laterally positioned between the laser processing assembly and the magazine initial position.

In some embodiments, the laser processing assembly comprises a light path assembly, a vision mechanism, and a laser, the light path assembly is located on an end of the motion platform away from the loading and unloading assembly, and the laser is located on a side of the laser cutting apparatus near an operator; the vision mechanism is positioned around the processing station of the moving platform.

Compared with the prior art, the laser cutting equipment provided by the embodiment of the utility model mainly has the following beneficial effects:

this laser cutting equipment is through making belt cleaning device have the dual function of gluing and washing, and through transmission device, the motion platform, go up the coordination between spare parts such as unloading subassembly, ensure that this laser cutting equipment can put the longer material of rubber coating time in belt cleaning device and carry out the rubber coating and wash, put the material that the rubber coating time is shorter and glue in the rubber coating device, wash in belt cleaning device, this characteristic that has the rubber coating and washs dual function in this make full use of belt cleaning device, save middle latency, let the linking of the manufacturing procedure of each material inseparabler, in order to add man-hour to a plurality of materials, can improve the utilization ratio in this laser cutting machine washing chamber effectively, and in order when guaranteeing the cutting quality, improve laser cutting machine's productivity. Generally, the automatic production process of the laser cutting machine is simple and practical, the cutting quality is good, and the productivity is high.

Drawings

In order to illustrate the solution of the utility model more clearly, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are some embodiments of the utility model, and that other drawings may be derived from these drawings by a person skilled in the art without inventive effort. Wherein:

fig. 1 is a schematic plan view of a laser cutting apparatus according to an embodiment of the present invention, in which a feeding and discharging assembly is a four-axis robot;

FIG. 2 is a simplified plan view of various components of a laser cutting apparatus according to one embodiment of the present invention;

FIG. 3 is a schematic perspective view of a cleaning device of the laser cutting apparatus of FIG. 1;

FIG. 4 is a schematic perspective view of the cleaning apparatus of FIG. 3 at another angle;

fig. 5 is a schematic perspective view of a glue spreading device of the laser cutting apparatus of fig. 1.

The reference numbers in the drawings are as follows:

10. laser cutting equipment; 20. a magazine; 21. a magazine initial position; 22. a wafer; 30. an operator;

100. a frame; 200. a base body;

300. a motion platform; 310. a feeding station; 320. a processing station; 330. a blanking station; 400. a laser processing assembly; 410. an optical path component; 420. a vision mechanism; 430. a laser; 500. a magazine lifting mechanism;

600. a transport mechanism; 700. a correction component; 800. a support assembly;

900. a cleaning device; 910. a support; 920. a cavity; 921. a cavity; 922. an opening; 930. a stage; 940. a moving assembly; 941. a lifting structure; 942. a rotating structure; 950. a swing arm assembly; 951. a swing arm mechanism; 952. cleaning the nozzle assembly; 953. a glue nozzle assembly; 960. a tubing assembly; 970. a door curtain assembly;

1000. a gluing device; 1100. a loading and unloading assembly 1110 and a loading manipulator; 1120. unloading manipulator.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model, e.g., the terms "length," "width," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc., refer to an orientation or position based on that shown in the drawings, are for convenience of description only and are not to be construed as limiting of the present disclosure.

The terms "including" and "having," and any variations thereof, in the description and claims of this invention and the description of the above figures are intended to cover non-exclusive inclusions; the terms "first," "second," and the like in the description and in the claims, or in the drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential order. The meaning of "plurality" is two or more unless specifically limited otherwise.

In the description and claims of the present invention and in the description of the above figures, when an element is referred to as being "fixed" or "mounted" or "disposed" or "connected" to another element, it may be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.

Furthermore, reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the utility model. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

It should be noted that the laser cutting apparatus 10 can perform operations such as glue coating (to protect the die from being damaged during the laser grooving), grooving (to form a groove by laser etching), and cleaning (to clean the protecting liquid and impurities generated by the laser grooving with the cleaning liquid) on a certain wafer 22, and can also perform operations such as glue coating, grooving, and cleaning on three wafers 22 at the same time. In addition, in practice, the laser cutting apparatus 10 may be a laser grooving machine, such as a laser grooving machine for wafers 22 with the same size grain size, or laser grooving for wafers 22 with different size grain sizes, or other suitable cutting apparatus.

An embodiment of the present invention provides a laser cutting device 10, as shown in fig. 1 and fig. 2, the laser cutting device 10 includes a rack 100 and a base 200 installed on the rack 100, the laser cutting device 10 further includes a moving platform 300 installed on the base 200, a laser processing assembly 400 and a magazine lifting mechanism 500, because the moving platform 300, the laser processing assembly 400 and the like belong to relatively precise instruments, specifically in this embodiment, in order to improve the overall stability, the base 200 may preferably be a marble base 200, that is, the base 200 may be made of marble material.

As further shown in fig. 1 and 2, the laser cutting apparatus 10 further includes a conveying mechanism 600, a correcting assembly 700, a supporting assembly 800, a cleaning device 900, a glue spreading device 1000, and a loading and unloading assembly 1100 mounted on the frame 100. As shown in fig. 2, the moving platform 300 has a loading station 310 and a processing station 320, wherein the moving platform 300 is mainly used for transferring materials at the loading station 310 and the processing station 320. Specifically, in this embodiment, as shown in fig. 2, the moving platform 300 further has a blanking station 330, so that the moving platform 300 can transfer the material (e.g., the wafer 22) after being glued to the processing station 320 from the feeding station 310 for laser cutting by the laser processing assembly 400, and after the laser cutting is completed, the feeding and blanking assembly 1100 can transfer the material on the processing station 320 to the blanking station 330, and if the blanking station 330 is not provided, the material can be directly transferred to the cleaning device 900 or the gluing device 1000 with a cleaning function for cleaning. It should be noted that the motion platform 300 is preferably a three-dimensional motion platform 300, which is beneficial to increase the overall carrying speed, so as to increase the processing efficiency of the laser cutting apparatus 10, i.e. to increase the productivity thereof.

In the present embodiment, the laser processing assembly 400 is mainly used for laser cutting the material (e.g., the glued wafer 22) on the processing station 320 of the motion platform 300. The magazine lifting mechanism 500 is primarily used to transfer material between the magazine home position 21 and the work surface of the corrector assembly 700. Generally, there is a certain height difference between the initial position 21 of the magazine and the working platform of the calibration assembly 700, and it can be understood that to ensure the material is delivered to the working platform of the laser cutting machine, the magazine lifting mechanism 500 is used to drive the wafer 22 in the magazine 20 to rise to the working platform of the calibration assembly 700, and then to descend back to the initial position of the magazine lifting mechanism 500 to stand by. In particular, in this embodiment, the table of the calibration mechanism is typically the table of the level laser cutting apparatus 10 for ease of operation.

As shown in fig. 1 and 2, in order to increase the carrying speed and ensure the compactness of the whole structure, the transmission mechanism 600 is located in the area enclosed between the cleaning device 900, the gluing device 1000 and the moving platform 300, and the transmission mechanism 600 is mainly used for transmitting the materials in the magazine 20 transmitted by the magazine lifting mechanism 500 to the support assembly 800 and/or the correcting assembly 700. Correspondingly, the loading and unloading assembly 1100 is mainly used for conveying the glued material from the calibration assembly 700 or the support assembly 800 to the loading station 310 of the motion platform 300, and for conveying the cut material to be cleaned. It is understood that after the transfer mechanism 600 transfers the material to the support assembly 800 or the calibration assembly 700, the material is subsequently transferred mainly by the loading and unloading assembly 1100 and the moving platform 300. Thus, the range of motion of the loading and unloading assembly 1100 can be reduced to a certain extent, and the stability of the whole operation and the compactness of the structure are ensured.

In addition, in this embodiment, the cleaning device 900 can interface materials with the calibration assembly 700 for gluing and cleaning a portion of the materials and for cleaning another portion of the materials. That is, the cleaning device 900 has both a cleaning function and a glue application function. Correspondingly, the gluing device 1000 can interface the material with the support assembly 800 for gluing another portion of the material. Wherein the gluing time of one part of the materials is longer than that of the other part of the materials.

It can be understood that, according to the length of the material gluing time, the conveying mechanism 600 can selectively convey the material with longer gluing time to the calibration assembly 700 so as to be handed over to the cleaning device 900 for direct gluing, and then after the gluing is completed, the material is transferred to the processing station 320 for cutting processing, and then the material is conveyed to the cleaning device 900 for cleaning; or, the conveying mechanism 600 may selectively convey the material with shorter gluing time to the supporting assembly 800, so as to be handed over to the gluing device 1000 for gluing, and then, after the gluing is completed, the material is transferred to the processing station 320 for cutting and processing, and then the material is conveyed to the cleaning device 900 for cleaning, that is, in the automatic processing process of the material, the laser cutting machine may fully utilize the characteristic of the double functions of gluing and cleaning in the cleaning device 900, save the intermediate waiting time, make the connection of the processing procedures of the materials more compact, and process a plurality of materials at the same time, so as to effectively improve the utilization rate of the cleaning cavity of the laser cutting machine, thereby improving the productivity of the laser cutting machine while ensuring the cutting quality. Generally, the automatic production process of the laser cutting machine is simple and practical, the cutting quality is good, and the productivity is high.

In order to make the technical solution of the present invention better understood by those skilled in the art, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to fig. 1 to 5.

In some embodiments, as shown in fig. 1 and 2, the support assembly 800, the gluing device 1000, the cleaning device 900, the correction assembly 700 and the magazine home position 21 are arranged side by side in sequence, in a direction towards the front of the operator 30.

Alternatively, in other embodiments, the calibration assembly 700, the cleaning device 900, the gluing device 1000, the support assembly 800 and the magazine home position 21 are arranged side by side in sequence in a direction toward the front of the operator 30. It is understood that the positions of the glue applicator 1000 and the cleaning device 900 can be interchanged according to specific situations, but the automated production flow of materials such as the wafer 22 will be changed accordingly after the positions are interchanged, but the final effect is very similar.

In some embodiments, as shown in fig. 3 and 4, in order to enable the cleaning device 900 to have dual functions of cleaning and gluing, the cleaning device 900 includes a support 910, a cavity 920, a carrier 930, a moving assembly 940 and a swing arm assembly 950, the support 910 is disposed on the rack 100, the cavity 920 is disposed on the support 910 and encloses a cavity 921, and an opening 922 communicating with the cavity 921 is formed at the bottom of the cavity 920. The carrier 930 is disposed on the moving assembly 940 and located in the cavity 921 for carrying a material, such as a wafer 22. I.e., wafer 22, is placed on stage 930 for cleaning or glue application. As shown in fig. 3 and 4, the moving element 940 is disposed on the rack 100 at a side close to the opening 922 of the cavity 920. The swing arm assembly 950 is disposed within the cavity 921 of the cavity 920 assembly. In this embodiment, the moving assembly 940 is mainly used to drive the carrier 930 to perform lifting and rotating motions in the cavity 921; the swing arm assembly 950 is mainly used for cleaning and gluing materials.

It can be understood that, because the cavity 920 is disposed on the support 910, and the moving component 940 is disposed on the rack 100, that is, the cavity 920 may be supported by a frame body, and the moving component 940 is supported by another frame body, there is no connection relationship between the two, in short, the moving component 940 and the cavity 920 are independent from each other, so that it can be effectively avoided that the moving component 940 drives the carrier 930 to cause the vibration of the cavity 920 to be transmitted to the cavity 920 in the lifting or rotating process, thereby effectively avoiding the influence on the precision of some precision devices mounted on the cavity 920 due to the vibration, and further avoiding further increasing the vibration, which is beneficial to reducing the vibration of the whole machine. Generally, the cleaning device 900 is simple in structure and good in damping effect.

Further, in some embodiments, as shown in fig. 3 and fig. 4, the moving assembly 940 includes a lifting structure 941 and a rotating structure 942, wherein the rotating structure 942 is disposed on an output end of the lifting structure 941, and the lifting structure 941 is configured to drive the rotating structure 942 to lift along a central line direction of the stage 930; the carrier 930 is disposed on an output end of the rotating structure 942, and the rotating structure 942 is configured to drive the carrier 930 to rotate in the cavity 921. It is understood that the carrier 930 can be lifted and lowered within the cavity 921 by the lifting mechanism 941 to interface with the calibration assembly 700 (or support assembly 800 if a glue application assembly) to perform material, such as a wafer 22.

Further, in some embodiments, as shown in fig. 3 and 4, in order to provide the cleaning device 900 with dual functions of cleaning and gluing, the cleaning device 900 further includes a pipe assembly 960, wherein the pipe assembly 960 is disposed on the cavity 920 and may be composed of a plurality of pipes, such as a pipe for conveying glue solution, a pipe for conveying cleaning solution, and the like. As shown in fig. 3 and 4, the swing arm assembly 950 includes a swing arm mechanism 951, and a cleaning nozzle assembly 952 and a glue nozzle assembly 953 both disposed on the swing arm mechanism 951, wherein the cleaning nozzle assembly 952 and the glue nozzle assembly 953 are connected to the pipe assembly 960, the cleaning nozzle assembly 952 is used for cleaning the material by the cleaning liquid transmitted by the pipe assembly 960, and the glue nozzle assembly 953 is used for gluing the material by the glue liquid transmitted by the pipe assembly 960. It is understood that, in practical use, the control switches of the pipes in the pipe assembly 960 can be directly controlled to realize the operation of the cleaning nozzle assembly 952 and the glue nozzle assembly 953 according to practical needs.

As shown in fig. 3 and 4, the cleaning device 900 further includes a door curtain assembly 970, wherein the door curtain assembly 970 is disposed on the cavity 920 and is mainly used for reducing as much as possible the influence of the aerosol generated when the cleaning device 900 cleans the material on the devices inside and outside the cavity 920.

Further, in some embodiments, as shown in fig. 3 to 5, the glue applying device 1000 is also used for cleaning the material, that is, in this embodiment, the glue applying device 1000 has both the glue applying function and the cleaning function as the cleaning device 900. In order to simplify the overall structure of the laser cutting machine, the glue spreading device 1000 and the cleaning device 900 are identical in structure and are symmetrically arranged. It should be noted that, when the glue applying apparatus 1000 also has the dual functions of cleaning and applying glue, the supporting component 800 disposed around the glue applying apparatus 1000 may have a correction function in addition to the supporting function. Accordingly, the calibration assembly 700 disposed around the cleaning device 900 may have a supporting function in addition to the calibration function. It should be noted that if the gluing device 1000 only has a gluing function, only the gluing nozzle assembly 953 may be disposed on the swing arm mechanism 951 of the swing arm assembly 950.

Further, in some embodiments, the loading and unloading assembly 1100 may be a multi-axis robot, wherein the multi-axis robot may be a six-axis robot, a four-axis robot, or the like. Specifically, in the present embodiment, as shown in fig. 1 and 2, the loading and unloading assembly 1100 includes a loading robot 1110 and an unloading robot 1120, which may also be referred to as a four-axis robot. The feeding manipulator 1110 is arranged near the feeding station 310 of the motion platform 300 and is mainly used for transferring the glued material to the feeding station 310 of the motion platform 300; correspondingly, the blanking manipulator 1120 is disposed near the blanking station 330 of the moving platform 300, and is mainly used for transferring the cut material from the processing station 320 of the moving platform 300 to the blanking station 330, or directly transferring the cut material to the cleaning device 900 for cleaning, or transferring the cut material to the gluing device 1000 with a cleaning function for cleaning.

It can be understood that, in this embodiment, the transportation speed of the material can be improved to a certain extent by adopting the multi-axis robot, the productivity of the laser cutting machine is favorably improved, and in addition, the general occupied area of the multi-axis robot is smaller, so that the overall compactness of the laser cutting machine is also improved.

In some embodiments, as shown in fig. 2, to further improve the overall compactness of the laser cutting machine, the laser machining assembly 400 is located on the side of the laser cutting apparatus 10 near the operator 30; the magazine elevator 500 is located laterally between the laser machining assembly 400 and the magazine home position 21.

In some embodiments, as shown in fig. 1 and fig. 2, in particular, the laser processing assembly 400 includes a light path assembly 410, a vision mechanism 420 and a laser 430, wherein, to further improve the compactness of the laser cutting apparatus 10, the light path assembly 410 is located at an end of the moving platform 300 far from the loading and unloading assembly 1100, and the laser 430 is located at a side of the laser cutting apparatus 10 close to the operator 30, so as to facilitate the operator 30 to observe the cutting condition; the vision mechanism 420 is located around the processing station 320 of the motion platform 300.

As can be seen from the above, in the present embodiment, the laser cutting apparatus 10 is capable of processing three wafers 22 simultaneously, wherein the glue coating time of the first wafer 22 (with smaller crystal grains) is shorter than the glue coating time of the second wafer 22 (with larger crystal grains), the cleaning device 900 has the functions of cleaning and glue coating, the glue coating device 1000 has the function of glue coating as an example, and the working principle thereof is described:

1) the operator 30 places the magazine 20 at the original position of the magazine 20, and the magazine lifting mechanism 500 lifts the magazine 20 up to the work surface of the correcting assembly 700;

2) the transmission mechanism 600 clamps and transmits the first wafer 22 to the support assembly 800, the lifting structure 941 of the glue coating apparatus 1000 lifts the carrier 930 and the support assembly 800 to join the first wafer 22, and the glue coating apparatus 1000 coats the first wafer 22 with glue;

3) the transmission mechanism 600 clamps and transmits the second wafer 22 to the calibration assembly 700, after the calibration assembly 700 calibrates the wafer 22, the lifting structure 941 of the cleaning device 900 lifts the carrier 930 to connect the second wafer 22 with the calibration assembly 700, and the cleaning device 900 applies glue to the second wafer 22; as can be appreciated, at this time, the first wafer 22 and the second wafer 22 are respectively coated with glue in the glue coating device 1000 and the cleaning device 900;

4) after the first wafer 22 is glued, the supporting assembly 800 is connected to the glued first wafer 22 from the gluing device 1000, and the feeding manipulator 1110 in the loading and unloading assembly 1100 takes out the glued first wafer 22 from the supporting assembly 800 and conveys the first wafer 22 to the loading station 310 of the motion platform 300; the motion platform 300 transfers the glued first wafer 22 from the loading station 310 to the processing station 320; the vision mechanism 420 performs vision photographing on the first wafer 22 on the processing station 320, and after the precise alignment of the moving platform 300 is completed, the laser 430 and the optical path component 410 cooperate to perform laser cutting and slotting on the first wafer 22;

5) after the first wafer 22 is vacated from the gluing device 1000, the transmission mechanism 600 may clamp and transmit the third wafer 22 to the supporting assembly 800, the lifting structure 941 of the gluing device 1000 lifts the carrier 930 and the supporting assembly 800 to interface the third wafer 22, and the gluing device 1000 glues the third wafer 22;

6) after the first wafer 22 is vacated from the gluing device 1000, and when a third wafer 22 is glued in the gluing device 1000, the transfer mechanism 600 may transfer the second wafer 22, which is glued in the cleaning device 900, onto the support assembly 800 (which is the case where the loading and unloading assembly 1100 is the loading robot 1110 and the unloading robot 1120 in this embodiment), prepare for the grooving operation, and vacate the cleaning position of the cleaning device 900 for the first wafer 22;

7) after the first wafer 22 is subjected to laser grooving, the feeding manipulator 1120 of the feeding and discharging assembly 1100 conveys the grooved first wafer 22 to the carrying platform 930 of the cleaning device 900, and the cleaning device 900 cleans the grooved first wafer 22; the feeding manipulator 1110 of the loading and unloading assembly 1100 can transport the second wafer 22 to the loading station 310 of the moving platform 300, and the moving platform 300 transfers the second wafer 22 to the processing station 320 from the loading station 310; the vision mechanism 420 performs vision photographing on the second wafer 22 on the processing station 320, and after the precise alignment of the moving platform 300 is completed, the laser 430 and the optical path component 410 cooperate to perform laser cutting and grooving on the second wafer 22;

8) after the first cut wafer 22 is cleaned, the lifting structure 941 of the cleaning device 900 transfers the wafer 22 to the calibration assembly 700, and the transmission mechanism 600 transmits the first processed wafer 22 from the calibration assembly 700 to the magazine 20;

9) subsequently, after the second wafer 22 is subjected to laser grooving, the feeding manipulator 1120 of the feeding and discharging assembly 1100 conveys the grooved second wafer 22 to the carrying platform 930 of the cleaning device 900, and the cleaning device 900 cleans the grooved second wafer 22; at this time, the feeding manipulator 1110 of the loading and unloading assembly 1100 may transport the third wafer 22 after being glued by the gluing device 1000 to the loading station 310 of the motion platform 300, and the motion platform 300 transfers the third wafer 22 after being glued from the loading station 310 to the processing station 320; the vision mechanism 420 performs vision photographing on the third wafer 22 on the processing station 320, and after the precise alignment of the moving platform 300 is completed, the laser 430 and the optical path component 410 cooperate to perform laser cutting and grooving on the third wafer 22;

10) the transmission mechanism 600 clamps and transmits the fourth wafer 22 to the support assembly 800, the lifting structure 941 of the glue coating apparatus 1000 lifts the carrier 930 and the support assembly 800 to join the fourth wafer 22, and the glue coating apparatus 1000 coats the fourth wafer 22 with glue;

11) after the second wafer 22 is cleaned, the lifting structure 941 of the cleaning device 900 transfers the wafer 22 to the calibration assembly 700, and the transmission mechanism 600 transmits the second wafer 22 after being processed from the calibration assembly 700 to the magazine 20;

12) subsequently, after the laser grooving of the third wafer 22 is completed, the discharging manipulator 1120 of the loading and unloading assembly 1100 conveys the grooved third wafer 22 to the carrier 930 of the cleaning device 900, and the cleaning device 900 cleans the grooved third wafer 22; at this time, the feeding manipulator 1110 of the loading and unloading assembly 1100 may transport the fourth wafer 22 after being glued by the gluing device 1000 to the loading station 310 of the motion platform 300, and the motion platform 300 transfers the fourth wafer 22 after being glued from the loading station 310 to the processing station 320; the vision mechanism 420 performs vision photographing on the fourth wafer 22 on the processing station 320, and after the precise alignment of the moving platform 300 is completed, the laser 430 and the optical path component 410 cooperate to perform laser cutting and grooving on the fourth wafer 22;

13) the transmission mechanism 600 clamps and transmits the fifth wafer 22 to the support assembly 800, the lifting structure 941 of the glue coating apparatus 1000 lifts the carrier 930 and the support assembly 800 to join the fifth wafer 22, and the glue coating apparatus 1000 coats the fifth wafer 22 with glue;

14) after the third wafer 22 is completely cleaned, the lifting structure 941 of the cleaning apparatus 900 transfers the third wafer 22 to the calibration assembly 700, and the transmission mechanism 600 transmits the third wafer 22, which is completely processed, from the calibration assembly 700 to the magazine 20, so as to complete the processing of the third wafer 22.

It should be noted that, the above-mentioned whole production flow of gluing, slotting and cleaning for the three wafers 22 is completed, and the subsequent wafers 22 can be executed circularly according to the process steps of the third wafer 22. In the laser cutting machine, a plurality of wafers 22 can be produced at the same time. In addition, when the gluing device also has gluing and cleaning functions, the steps can be adjusted according to actual conditions. On the whole, this laser cutting machine's production flow is simple and practical, and cutting quality is good and the productivity is high, and overall structure is simple and compact.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. The laser cutting equipment is characterized by comprising a rack and a base body arranged on the rack, the laser cutting equipment further comprises a motion platform, a laser processing assembly and a material box lifting mechanism which are arranged on the base body, and the laser cutting equipment further comprises a transmission mechanism, a correction assembly, a supporting assembly, a cleaning device, a gluing device and a feeding and discharging assembly which are arranged on the rack;

2. Laser cutting device according to claim 1, characterized in that the support assembly, the gluing means, the cleaning means, the correction assembly and the magazine initial position are arranged side by side in succession, in a direction towards the front of the operator.

3. Laser cutting device according to claim 1, characterized in that the correction assembly, the cleaning device, the gluing device, the support assembly and the magazine initial position are arranged side by side in succession in the direction of the front of the operator.

4. The laser cutting equipment as claimed in claim 1, wherein the cleaning device comprises a support, a cavity, a carrying platform, a moving assembly and a swing arm assembly, the support is arranged on the rack, the cavity is arranged on the support and encloses to form a cavity, and an opening communicated with the cavity is formed in the bottom of the cavity;

5. The laser cutting device according to claim 4, wherein the moving assembly comprises a lifting structure and a rotating structure, the rotating structure is arranged at an output end of the lifting structure, and the lifting structure is used for driving the rotating structure to lift along a central line direction of the carrier; the carrying platform is arranged at the output end of the rotating structure, and the rotating structure is used for driving the carrying platform to rotate in the containing cavity.

6. The laser cutting apparatus of claim 4, wherein the cleaning device further comprises a tubing assembly disposed on the cavity; the swing arm assembly comprises a swing arm mechanism and a cleaning nozzle assembly and a gluing nozzle assembly which are arranged on the swing arm mechanism, the cleaning nozzle assembly and the gluing nozzle assembly are connected with the pipeline assembly, the cleaning nozzle assembly is used for cleaning materials through cleaning liquid transmitted by the pipeline assembly, and the gluing nozzle assembly is used for gluing the materials through glue liquid transmitted by the pipeline assembly.

7. The laser cutting equipment according to any one of claims 4 to 6, wherein the gluing device is further used for cleaning materials, and the gluing device and the cleaning device are identical in structure and are symmetrically arranged.

8. The laser cutting apparatus of claim 1, wherein the loading and unloading assembly is a multi-axis robot.

9. The laser cutting apparatus of claim 8, wherein the laser machining assembly is located on a side of the laser cutting apparatus proximate an operator; the magazine lifting mechanism is laterally positioned between the laser processing assembly and the magazine initial position.

10. The laser cutting apparatus of claim 9, wherein the laser processing assembly comprises a light path assembly, a vision mechanism, and a laser, the light path assembly is located on an end of the motion platform away from the loading and unloading assembly, and the laser is located on a side of the laser cutting apparatus near an operator; the vision mechanism is positioned around the processing station of the moving platform.