CN111816591B - Chip loading system and chip loading method - Google Patents

Abstract

The invention discloses a chip loading system and a chip loading method, belonging to the technical field of semiconductor packaging. The system of the present invention includes a wafer platform, an intermediate transfer platform, guide rails, a heater, a first welding head and a second welding head, the intermediate transfer platform includes a disk and a collection frame, the disk is arranged in the collection frame, and the A blowing pipe is arranged on the top; a carrier is arranged on the guide rail. The method of the present invention is to use the first welding head to move the chip from the wafer stage to the transfer station, correct the angle of the chip on the transfer station, and use the blowing pipe and the collection frame to remove the silicon chips on the surface of the chip, and then use the second welding head The chip is moved to the carrier, and the chip is soldered to the carrier by the heater. In order to overcome the disadvantages of silicon chips remaining on the chip surface and easily damaged chips in the chip loading process of the prior art, the present invention can remove the silicon chips on the chip surface, avoid damage to the chip and the suction nozzle, and further reduce the damage to the chip. Correct the installation angle to achieve accurate installation of the chip.

Description

A film loading system and film loading method

technical field

The invention belongs to the technical field of semiconductor packaging, and more specifically relates to a chip loading system and a chip loading method.

Background technique

The chip loader is the key equipment in the semiconductor packaging production line, and it has a very wide range of applications in chip packaging. With the advancement of technology, the loading accuracy of the loading machine is developing towards the sub-micron level, which in turn supports the so-called micro-assembly technology in the industry. In the prior art, the chip loading machine is mainly composed of a wafer table, a thimble base, a welding head and a track. The steps of using the chip loading machine for loading are as follows:

Step 1: The thimble in the thimble base lifts up a single chip on the wafer stage; Step 2: The welding head picks up the lifted chip; Step 3: The welding head picks up the chip and installs the chip on the track on the chip carrier (lead frame or substrate); step 4: track heating, and combine the chip with the chip carrier through high temperature. For the above-mentioned prior art chip loading machine and its loading process, there are the following deficiencies: 1. When using a high-temperature-resistant suction nozzle to suck chips, there are silicon chips on the surface of the chip, and the high-temperature-resistant suction nozzle has high hardness and is easy to squeeze Destroy the surface circuit of the chip; 2. When using a low-hardness nozzle, high temperature will damage the low-hardness nozzle. 3. The chip will have a rotation angle during the loading process, and the correction angle cannot be verified during the loading process.

In view of the above problems, the prior art also provides some solutions. For example, the name of the invention is: a relay-type quick film taking, film loading device and its film loading machine (application date: July 21, 2017 ; Application No. 201710604150.7), the scheme realizes the taking and loading of the film by using the first rotating arm and the second rotating arm, and uses a driving device to drive the turntable to move along the X and Y directions and drive the turntable to rotate in a circle, so that the The mounting angle of the chip is corrected. However, the disadvantage of this solution is that it does not solve the problem of residual silicon shavings on the chip surface.

To sum up, how to remove silicon shavings on the chip surface and avoid damage to the chip during the chip loading process is an urgent problem to be solved in the prior art.

Contents of the invention

1. The problem to be solved

In order to overcome the disadvantages of silicon chips remaining on the surface of the chip and easily damaged chips in the chip loading process of the prior art, the present invention proposes a chip loading system and a chip loading method, which can remove the silicon chips on the chip surface and avoid chip damage. And the suction nozzle is damaged during the loading process, and the installation angle of the chip can be corrected further, so as to realize the accurate installation of the chip.

2. Technical solution

In order to solve the above problems, the technical scheme adopted in the present invention is as follows:

A film loading system of the present invention comprises: a wafer table, a thimble base is arranged under the wafer table; An air blowing pipe is arranged above the disc; a guide rail is provided with a carrier for carrying chips; a heater is used for heating the carrier; a first welding head is used for removing the chip from the wafer The platform is moved to the transfer platform; the second welding head is used to move the chip from the transfer platform to the carrier.

Furthermore, a motor is also included, and the motor is connected with the transfer platform through a transmission belt.

Furthermore, a vacuum hole is provided on the disk, and a vacuum device is provided under the disk, and the vacuum hole is connected with the vacuum device.

Furthermore, it also includes a camera, which is connected to the motor, and the camera is used to take images of the chip and calculate the rotation angle of the chip, and then control the motor to adjust the installation angle of the chip according to the rotation angle.

Furthermore, the vacuum device is arranged at the bottom of the collection frame, and the inside of the collection frame is connected with the vacuum device, and the surface of the collection frame is provided with fine holes.

Furthermore, several vacuum holes are provided on the heater.

A film loading method of the present invention adopts the above-mentioned film loading system, comprising the following steps:

S100, heating the carrier, and at the same time using the first welding head to move the chip from the wafer stage to the disk of the transfer stage;

S200, blowing air on the chips on the disc with the air blowing pipe, so that the silicon chips on the chips are separated from the surface of the chips and fall into the collection frame;

S300, use the camera to capture the image of the chip and calculate the rotation angle of the chip, and then the camera controls the motor to adjust the installation angle of the chip according to the rotation angle;

S400, using the second welding head to move the chip from the disc to the carrier, while the heater continues to heat the carrier and weld the chip to the carrier;

The above steps are repeated until each unit of the carrier is soldered with a chip, and then the carrier with the chip is moved to the discharge place by using the guide rail.

Furthermore, the specific process of heating the carrier in step S100 is: firstly, the vacuum hole of the heater is used to absorb the carrier, and then the heater is used to heat the carrier.

Further, in step S100, the specific process of using the first welding head to move the chip from the wafer stage to the disc of the transfer stage is as follows: firstly use the thimble base to lift the chip from the wafer stage, and then use the first The welding head picks up the chips and moves them to the disc, then turns on the vacuum and sucks the chips through the vacuum holes of the disc.

3. Beneficial effect

Compared with the prior art, the beneficial effects of the present invention are:

(1) A chip loading system of the present invention, by setting the first welding head and the second welding head, can avoid damage to the chip and suction nozzle during the chip loading process; further through the camera and motor, the mounting angle of the chip can be adjusted Correction is carried out to achieve accurate installation of the chip; in addition, by setting the collection frame and blowing pipe, the problem of silicon residue on the surface of the chip can be solved, thereby ensuring the quality of the produced product.

(2) A loading method of the present invention can avoid damage to the chip and suction nozzle during the loading process, and can correct the installation angle of the chip, and can process two chips simultaneously during the loading process , thereby greatly improving the efficiency of film loading.

Description of drawings

Fig. 1 is a schematic structural view of a loading system of the present invention;

Fig. 2 is the front view of the transfer platform of the present invention;

Fig. 3 is a top view of the intermediate transfer platform of the present invention.

Reference numerals: 100, wafer stage; 110, thimble base; 200, transfer stage; 210, disc; 211, vacuum hole; 212, vacuum device; 220, collection frame; 230, blowing pipe; 300, guide rail; 310, carrier; 320, heater; 410, first welding head; 420, second welding head; 500, motor; 510, transmission belt; 600, camera.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, rather than all the embodiments; moreover, each embodiment is not relatively independent, and can be combined with each other according to needs, so as to achieve better effects. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

In order to further understand the content of the present invention, the present invention will be described in detail in conjunction with the accompanying drawings and embodiments.

Example 1

As shown in FIG. 1 , a loading system of the present invention includes a wafer stage 100 , an intermediate transfer stage 200 , a guide rail 300 , a first welding head 410 and a second welding head 420 , and a thimble is provided below the wafer stage 100 . The base 110 can lift up the chips placed on the wafer stage 100 through the ejector base 110 , so that the first bonding head 410 can pick up the chips. The first welding head 410 is used to move the chip from the wafer stage 100 to the transfer stage 200. In this embodiment, the first welding head 410 adopts a low-hardness suction nozzle, that is, the suction nozzle head is made of soft materials such as rubber, that is, the first welding head 410 adopts a soft material such as rubber. The head 410 will not cause damage to the surface of the chip, thereby avoiding damage to the chip.

As shown in FIG. 2 and FIG. 3 , the intermediate transfer station 200 of the present invention includes a disk 210 and a collection frame 220 , the disk 210 can place chips, and the material of the disk 210 in this embodiment is metal. It is worth noting that a vacuum hole 211 is provided on the disk 210, and a vacuum device 212 is provided below the disk 210. The vacuum device 212 is connected to the vacuum hole 211, that is, after the vacuum device 212 is turned on, the disk 210 can pass through the vacuum The hole 211 absorbs the chip, so that the second bonding head 420 can absorb the chip. It is worth further explaining that the disk 210 is set in the collection frame 220, and the top of the disk 210 is provided with an air blowing pipe 230, through which the silicon chips on the surface of the chip can be blown off, and the falling silicon chips can be collected by the collection frame 220. further, the vacuum device 212 is arranged at the bottom of the collection frame 220, the inside of the collection frame 220 is connected with the vacuum device 212, and the surface of the collection frame 220 is provided with pores, which can be absorbed by the pores on the surface of the collection frame 220. The falling silicon shavings can prevent the silicon shavings from sticking to other components, thereby ensuring the quality of the produced products.

In addition, the intermediate transfer platform 200 of the present invention can be rotated. Specifically, the film loading system of the present invention also includes a motor 500 and a camera 600. The motor 500 is connected to the camera 600. The motor 500 is connected to the intermediate transfer platform 200 through a transmission belt 510; 600 takes pictures of the chip to obtain the chip image, compares the angle of the chip image with the reference image, calculates the rotation angle of the chip, and then controls the motor 500 to adjust the installation angle of the chip according to the rotation angle of the chip, that is, the camera 600 sends the control command to the motor 500, the motor 500 drives the transfer stage 200 to rotate through the transmission belt 510, and then can realize the correction of the mounting angle of the chip.

The second welding head 420 of the present invention is used to move the chip after the installation angle is corrected from the transfer platform 200 to the carrier 310, and the carrier 310 is arranged on the guide rail 300. The head 420 picks up the chip on the disc 210 and moves the chip onto the carrier 310 . Further, the system of the present invention also includes a heater 320, the heater 320 is used to heat the carrier 310, specifically, the guide rail 300 moves the carrier 310 to the surface of the heater 320, and the heater 320 is provided with several vacuum holes 211 , the carrier 310 can be adsorbed through the vacuum hole 211; the heater 320 heats the carrier 310, and when the second welding head 420 moves the chip to the carrier 310, the heater 320 continues to heat the carrier 310 and solders the chip to the carrier 310 . In this embodiment, the second welding head 420 adopts a high-temperature-resistant suction nozzle, so that the problem that the heater 320 causes damage to the second welding head 420 can be avoided.

The system of the present invention can avoid damage to chips and suction nozzles during the loading process by setting the first welding head 410 and the second welding head 420; further, through the camera 600 and the motor 500, the installation angle of the chip can be corrected, In this way, the chip can be installed accurately; in addition, by setting the collecting frame 220 and the air blowing pipe 230, the problem of silicon dust remaining on the chip surface can be solved, thereby ensuring the quality of the produced product.

A kind of film loading method of the present invention adopts above-mentioned a kind of film loading system, and concrete steps are as follows:

S100, heating the carrier 310, specifically, using the guide rail 300 to move the carrier 310 to the heater 320, the heater 320 absorbs the carrier 310 through the vacuum hole 211 and heats the carrier 310, so that the carrier 310 can reach the temperature for loading condition;

At the same time, the first welding head 410 is used to move the chip from the wafer stage 100 to the disk 210 of the transfer stage 200; specifically, the ejector base 110 is used to lift the chip from the wafer stage 100, and then The first bonding head 410 picks up the chip and moves the chip onto the disc 210 , and then turns on the vacuum 212 to absorb the chip through the vacuum hole 211 of the disc 210 .

S200, use the air blowing tube 230 to blow air on the chip on the disc 210, so that the silicon chips on the chip are separated from the chip surface and fall into the collection frame 220, and the collection frame 220 absorbs the fallen silicon through the pores on its surface shavings, so as to avoid silicon shavings from getting on other parts.

S300. Use the camera 600 to take pictures of the chip and identify the rotation angle of the calculation chip. The camera 600 controls the motor 500 to adjust the installation angle of the chip according to the rotation angle; Comparing the angle with the reference image, and calculating the rotation angle of the chip, and then controlling the motor 500 to adjust the installation angle of the chip according to the rotation angle of the chip, that is, the camera 600 sends a control command to the motor 500, and the motor 500 drives the transfer platform through the transmission belt 510 200 rotation to realize the correction of the chip installation angle.

S400, using the second welding head 420 to move the chip from the disc 210 to the carrier 310, specifically, first turn off the vacuum 212 and the blowing pipe 230, and then the second welding head 420 picks up the chip and moves it to the carrier 310 being heated, At this time, the heater 320 continues to heat the carrier 310 and solders the chip to the carrier 310;

The above steps are repeated until each unit on the carrier 310 is soldered with a chip, then the vacuum hole 211 of the heater 320 is closed, and the carrier 310 with chips is moved to the discharge place through the guide rail 300 . It is worth noting that when the chip is performing step S400, another chip can be loaded, that is, steps S100, S200 and S300 can be performed on another chip, thereby shortening the loading time of the entire chip and greatly improving Loading efficiency.

A chip loading method of the present invention can avoid damage to chips and suction nozzles during the chip loading process, and can correct the mounting angle of the chip, and can process two chips simultaneously during the chip loading process, thereby greatly The efficiency of film loading is improved.

The present invention has been described in detail above with reference to specific exemplary embodiments. However, it should be understood that various modifications and changes can be made without departing from the scope of the present invention as defined in the appended claims. The detailed description and drawings are to be regarded as illustrative only and not restrictive, and any such modifications and variations, if any, are intended to fall within the scope of the invention as described herein. In addition, the background art is intended to illustrate the research and development status and significance of the present technology, and is not intended to limit the present invention or the application and the application field of the present invention.

Claims (8)

1. A film loading system, characterized in that, comprising: A wafer stage (100), a thimble base (110) is provided below the wafer stage (100); The intermediate transfer platform (200), the intermediate transfer platform (200) comprises a disc (210) and a collection frame (220), the disc (210) is arranged in the collection frame (220), and the disc (210) The top is provided with air blowing pipe (230); a guide rail (300), the guide rail (300) is provided with a carrier (310), and the carrier (310) is used to carry the chip; a heater (320), the heater (320) is used to heat the carrier (310); The first welding head (410), the first welding head (410) is used to move the chip from the wafer stage (100) to the transfer stage (200), and the first welding head (410) adopts a low-hardness suction nozzle; The second welding head (420), the second welding head (420) is used to move the chip from the transfer platform (200) to the carrier (310), and the second welding head (420) adopts a high temperature resistant suction nozzle; The motor (500) is connected with the relay stage (200) through the transmission belt (510), and also includes a camera (600), the camera (600) is connected with the motor (500), and the camera (600) is used to take images of the chip and calculate The rotation angle of the chip, and then control the motor (500) according to the rotation angle to adjust the installation angle of the chip. 2. A film loading system according to claim 1, characterized in that a vacuum hole (211) is provided on the disk (210), and a vacuum device (212) is provided below the disk (210), The vacuum hole (211) is connected with a vacuum device (212). 3. The film loading system according to claim 2, characterized in that, the vacuum device (212) is arranged at the bottom of the collection frame (220). 4. A film loading system according to claim 3, characterized in that the inside of the collection frame (220) is connected to a vacuum (212), and the surface of the collection frame (220) is provided with fine holes. 5. The film loading system according to any one of claims 1-4, characterized in that, the heater (320) is provided with several vacuum holes (211). 6. A film loading method, characterized in that, adopting a film loading system according to any one of claims 1 to 5, comprising the following steps: S100, heating the carrier (310), and simultaneously using the first welding head (410) to move the chip from the wafer stage (100) to the disc (210) of the transfer stage (200); S200, using the air blowing pipe (230) to blow air on the chip on the disc (210), so that the silicon chips on the chip are separated from the surface of the chip and fall into the collection frame (220); S300, using the camera (600) to capture the chip image and calculate the rotation angle of the chip, and then the camera (600) controls the motor (500) according to the rotation angle to adjust the installation angle of the chip; S400, using the second welding head (420) to move the chip from the disc (210) to the carrier (310), while the heater (320) continues to heat the carrier (310) and solder the chip to the carrier (310); The above steps are repeated until each unit of the carrier (310) is welded with a chip, and then the carrier (310) with the chip is moved to the discharge place by using the guide rail (300). 7. A method for loading sheets according to claim 6, characterized in that, the specific process of heating the carrier (310) in step S100 is: first utilize the vacuum hole (211) of the heater (320) to adsorb the carrier ( 310), and then use the heater (320) to heat the carrier (310). 8. A chip loading method according to claim 6 or 7, characterized in that, in step S100, the first welding head (410) is used to move the chip from the wafer stage (100) to the transfer stage (200) The concrete process of disc (210) is: First use the thimble base (110) to lift the chip from the wafer stage (100), then use the first welding head (410) to pick up the chip and move the chip to the disc (210), and then turn on the vacuum (212 ) and absorb the chips through the vacuum holes (211) of the disk (210).

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