CN214815772U - Wafer laser processing device - Google Patents
Wafer laser processing device Download PDFInfo
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- CN214815772U CN214815772U CN202023288615.9U CN202023288615U CN214815772U CN 214815772 U CN214815772 U CN 214815772U CN 202023288615 U CN202023288615 U CN 202023288615U CN 214815772 U CN214815772 U CN 214815772U
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Abstract
The utility model belongs to the technical field of laser beam machining, a wafer laser beam machining device is related to, including frame and rack-mounted aligning gear, supporting mechanism, rubber coating belt cleaning device, multiaxis robot and buffer memory device, still including rack-mounted pedestal and install motion platform, laser beam machining subassembly and magazine elevating system on the pedestal. This wafer laser beam machining device is through adopting the multiaxis robot, and with parts such as motion platform, the laser beam machining subassembly, magazine elevating system, the aligning gear, supporting mechanism, rubber coating belt cleaning device, multiaxis robot and buffer memory device around the multiaxis robot setting, and rationally arrange the position of each part according to this wafer laser beam machining device's work flow, the structure of having guaranteed this wafer laser beam machining device on the whole is fairly simple compact, and transport speed obtains promoting, and the production step obtains simplifying, does benefit to and improves production efficiency and productivity.
Description
Technical Field
The utility model relates to a laser beam machining technical field especially relates to a wafer laser beam machining device.
Background
In the production of high-speed electronic components, low dielectric constant films and copper materials have been increasingly used as wafer materials, but these wafers are difficult to cut with a common diamond blade. Generally, a laser grooving technology of cold working is adopted for cutting, specifically, short pulse laser is focused on the surface of a wafer and then irradiated, the laser pulse is continuously absorbed by a low dielectric constant film, but after absorbing a certain degree of heat energy, the low dielectric constant film is instantly vaporized, and due to the principle of interaction, the heat energy of a chip is consumed by the vaporized substance, so that the cold working of micro-heat influence is realized. In order to improve the production efficiency and effectively prevent the processing quality problem caused by the poor factors of collapse, surface layer falling and the like, furthermore, a short pulse laser is usually adopted to etch in the cutting channel to form a groove; and then, a diamond blade is used for carrying out full cutting processing on the middle area of the groove, so that the wafer is cut into a plurality of small crystal grains.
At present, a wafer laser grooving process generally comprises three procedures of wafer gluing, wafer laser grooving and wafer cleaning, and after the wafer enters a laser grooving machine, gluing, grooving and cleaning are sequentially carried out. Obviously, the processes are orderly executed, and the processes are necessarily spread out in a large area, so that the overall occupied area of the laser grooving machine is large, the overall structure is necessarily complex, and the improvement of the productivity is not facilitated.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide a wafer laser beam machining device for it is big to solve current wafer laser grooving machine area, and the more complicated unfavorable technical problem who promotes the productivity of structure.
In order to solve the technical problems, the following technical scheme is adopted: the embodiment of the utility model provides a wafer laser processing device, this wafer laser processing device includes the frame and installs the pedestal in the frame, wafer laser processing device still includes motion platform, laser beam machining subassembly and magazine elevating system installed on the pedestal, wafer laser processing device still includes the aligning gear, the supporting mechanism, rubber coating belt cleaning device, multiaxis robot and the buffer memory device installed in the frame;
the moving platform is provided with a loading and unloading station and a processing station and is used for transferring the wafer on the loading and unloading station and the processing station;
the laser processing assembly is positioned on one side of the wafer laser processing device close to an operator and is used for carrying out laser processing on the wafer on the processing station of the moving platform;
the material box lifting mechanism is laterally positioned between the laser processing assembly and the material box initial position and is used for conveying the wafer between the material box initial position and the correction station of the correction mechanism;
the correcting mechanism is positioned on the periphery of the initial position of the material box and between the gluing and cleaning device and the initial position of the material box;
in the direction facing the front of the operator, the supporting mechanism, the gluing cleaning device and the material box are sequentially arranged side by side at initial positions; the gluing and cleaning device can be connected with the correction mechanism and the supporting mechanism to connect and connect wafers and is used for gluing and cleaning the wafers;
the multi-axis robot is arranged between the processing station and the gluing and cleaning device; the moving range of the mechanical arm of the multi-axis robot comprises the positions of the correction mechanism, the support mechanism, the buffer device and the loading and unloading station of the moving platform;
the caching device is located in an area enclosed among the multi-axis robot, the gluing and cleaning device and the processing station.
In some embodiments, the gluing and cleaning device comprises a gluing device and a cleaning device, wherein the gluing device is used for gluing the wafer, and the cleaning device is used for cleaning the wafer; in the direction facing the front of an operator, the supporting mechanism, the gluing device, the cleaning device and the material box are sequentially arranged side by side at initial positions;
or in the direction towards the front of the operator, the supporting mechanism, the cleaning device, the gluing device and the material box are sequentially arranged side by side at initial positions.
Or in other embodiments, the gluing and cleaning device comprises a gluing device and a cleaning device, and both the gluing device and the cleaning device can be used for connecting and connecting the wafer with the supporting mechanism and the correcting mechanism and are used for gluing and cleaning the wafer; the gluing device and the cleaning device are arranged side by side between the support mechanism and the initial position of the magazine in a direction towards the front of the operator.
In some embodiments, the wafer laser processing apparatus further includes a transmission mechanism mounted on the frame, the transmission mechanism is located in an area enclosed among the buffer device, the glue coating and cleaning device and the motion platform, and the transmission mechanism is configured to transmit the wafer in the magazine to a calibration station of the calibration mechanism.
In some embodiments, the laser processing assembly comprises a laser optical path assembly and a vision mechanism, the laser optical path assembly is positioned in an area enclosed between the motion platform and the magazine lifting mechanism and is positioned on one side of the wafer laser processing device close to an operator; the vision mechanism is located at a position between the laser optical path assembly and the motion platform.
In some embodiments, the holder is a marble holder.
In some embodiments, the motion platform is a three-dimensional motion platform.
In some embodiments, the caching apparatus is a caching station.
In some embodiments, the multi-axis robot is a six-axis robot.
Alternatively, in other embodiments, the multi-axis robot is a four-axis robot.
Compared with the prior art, the embodiment of the utility model provides a wafer laser beam machining device mainly has following beneficial effect:
this wafer laser beam machining device is through adopting the multiaxis robot, and with the multiaxis robot setting in the frame, install motion platform, laser beam machining subassembly and magazine elevating system on the pedestal, and with motion platform, the laser beam machining subassembly, magazine elevating system, the aligning gear, the supporting mechanism, rubber coating belt cleaning device, spare parts such as multiaxis robot and buffer memory device set up around the multiaxis robot, and rationally arrange respective position according to this wafer laser beam machining device's work flow, guaranteed this wafer laser beam machining device's structure fairly simple compactness on the whole, and transport speed obtains promoting, do benefit to and improve production efficiency and productivity.
Drawings
In order to illustrate the solution of the present invention more clearly, the drawings needed for describing the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:
fig. 1 is a schematic plan view of parts of a wafer laser processing apparatus according to an embodiment of the present invention;
fig. 2 is a schematic plan view of a wafer laser processing apparatus according to an embodiment of the present invention, in which the multi-axis robot is a six-axis robot.
The reference numbers in the drawings are as follows:
10. a wafer laser processing device; 20. a magazine; 21. a magazine initial position; 30. an operator;
100. a frame; 200. a base body;
300. a motion platform; 310. a loading and unloading station; 320. a processing station; 400. a laser processing assembly; 410. a laser optical path assembly; 420. a vision mechanism; 500. a magazine lifting mechanism;
600. a correction mechanism; 700. a support mechanism; 800. a gluing and cleaning device; 810. a gluing device; 820. a cleaning device; 900. a multi-axis robot; 910. a range of motion; 1000. a cache device; 1100. and a transmission mechanism.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the description is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention, for example, the terms "length," "width," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or position illustrated in the drawings, which are for convenience of description only and are not to be construed as limiting of the present disclosure.
The terms "including" and "having," and any variations thereof, in the description and claims of this invention and the description of the above figures are intended to cover non-exclusive inclusions; the terms "first," "second," and the like in the description and in the claims, or in the drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order. The meaning of "plurality" is two or more unless specifically limited otherwise.
In the description and claims of the present invention and in the description of the above figures, when an element is referred to as being "fixed" or "mounted" or "disposed" or "connected" to another element, it can be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
Furthermore, reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
It should be noted that the wafer laser processing apparatus 10 can not only perform operations such as gluing, grooving, and cleaning on a wafer, but also perform operations such as gluing, grooving, and cleaning on three wafers simultaneously. In addition, the wafer laser processing apparatus 10 is actually used not only for laser processing a wafer but also for processing other suitable products.
The embodiment of the utility model provides a wafer laser beam machining device 10, as shown in fig. 1 and fig. 2, this wafer laser beam machining device 10 includes frame 100 and the pedestal 200 of installing on frame 100, and wafer laser beam machining device 10 is still including installing motion platform 300, laser beam machining subassembly 400 and magazine elevating system 500 on pedestal 200. Because the motion platform 300 and the laser processing assembly 400 are all relatively precise instruments, in this embodiment, in order to improve the overall stability, the base 200 is a marble base 200, that is, the base 200 is made of marble material.
As further shown in fig. 1 and 2, the wafer laser processing apparatus 10 further includes a correcting mechanism 600, a supporting mechanism 700, a glue applying and cleaning device 800, a multi-axis robot 900, and a buffer device 1000, which are mounted on the frame 100. It can be understood that the multi-axis robot 900 is mounted on the frame 100, rather than on the housing as in the prior art, so that on one hand, the center of gravity of the multi-axis robot 900 is lower, and on the other hand, the multi-axis robot 900 and the frame 100 vibrate at the same frequency, that is, the multi-axis robot 900 and the frame 100 can be kept relatively still as much as possible, and therefore, during the process of transporting a wafer, the stability of the wafer can be ensured to be better, which is favorable for improving the stability of the entire wafer laser processing apparatus 10.
As shown in fig. 1, the motion platform 300 has a loading and unloading station 310 and a processing station 320, wherein the motion platform 300 is mainly used for transferring the wafer on the loading and unloading station 310 and the processing station 320. In other words, the moving platform 300 is mainly used for transporting the glued wafer from the loading and unloading station 310 to the processing station 320 for laser processing by the laser processing assembly 400, and also for transporting the wafer processed by the laser processing assembly 400 from the processing station 320 to the loading and unloading station 310 for returning to the tray. Particularly, in the present embodiment, the motion platform 300 is preferably a three-dimensional motion platform 300, which is beneficial to increase the overall carrying speed, so as to effectively improve the processing efficiency, i.e. the throughput, of the wafer laser processing apparatus 10.
As shown in fig. 1 and 2, the laser processing assembly 400 is located on a side of the wafer laser processing apparatus 10 near the operator 30, so as to facilitate the operator's observation of the particular processing situation. The laser processing assembly 400 is generally used to laser process a wafer (in this embodiment, the wafer is generally a glued wafer) on the processing station 320 of the motion stage 300.
As further shown in fig. 1 and 2, on the front side of the wafer laser processing apparatus 10, the magazine lifting mechanism 500 is located between the laser processing assembly 400 and the magazine home position 21, and the magazine lifting mechanism 500 is disposed laterally, that is, not facing the operator 30, but facing the magazine 20. The pod lift mechanism 500 is mainly used to transfer the wafer between the pod initial position 21 and the calibration station (not shown) of the calibration mechanism 600. It is understood that the initial position 21 of the magazine and the calibration station of the calibration mechanism 600 are generally different in height, and in order to ensure that the wafer is transferred to the working table of the wafer laser processing apparatus 10, the magazine lifting mechanism 500 is required to lift the wafer in the magazine 20 to the calibration station and then to descend back to the initial position of the magazine lifting mechanism 500 for standby.
As shown in fig. 1 and 2, in order to calibrate the wafer in the magazine 20 as soon as possible and then enter the glue coating process, the calibration mechanism 600 is located at the periphery of the initial position 21 of the magazine and between the glue coating and cleaning device 800 and the initial position 21 of the magazine. As further shown in fig. 1, the support mechanism 700, the glue application cleaning device 800, the correction mechanism 600, and the magazine home position 21 are arranged side by side in this order in a direction toward the front of the operator 30. In the present embodiment, the glue cleaning apparatus 800 can interface with the calibration mechanism 600 and the supporting mechanism 700 to perform glue application and cleaning on the wafer. Specifically, after the glue coating and cleaning device 800 joins the wafer with the supporting mechanism 700, the wafer may be coated with glue; correspondingly, after the glue cleaning device 800 and the calibration mechanism 600 are connected, the wafer after glue coating and laser processing can be cleaned.
As shown in fig. 1 and 2, in order to make the structure of the wafer laser processing apparatus 10 more compact, the multi-axis robot 900 is disposed between the processing station 320 and the glue cleaning apparatus 800, and the movable range 910 (i.e., the range enclosed by the dotted line in fig. 1) of the arm of the multi-axis robot 900 includes the positions of the calibration mechanism 600, the support mechanism 700, the buffer device 1000, and the loading/unloading station 310 of the moving platform 300. In addition, the buffer device 1000 is located in the area enclosed among the multi-axis robot 900, the glue cleaning device 800, and the processing station 320. Specifically, in this embodiment, the caching device 1000 is a caching platform.
It can be understood that, by adopting the multi-axis robot 900, because the occupied area for installing the robot is small, but the range of motion 910 of the robot arm of the multi-axis robot 900 is large, and the carrying speed is high, so that it is very beneficial to ensure the simple and compact structure of the whole and to improve the carrying speed.
It should be noted that the multi-axis robot 900 may be a four-axis robot, and in this embodiment, the multi-axis robot 900 may be a six-axis robot. In the case where the multi-axis robot 900 is a six-axis robot, the entire structure of the wafer laser processing apparatus 10 can be more compact than in the case of a four-axis robot.
It should be noted that, in this embodiment, the multi-axis robot 900 may be configured to take out the wafer to be processed from the calibration mechanism 600 and transfer the taken wafer onto the supporting mechanism 700, so that the glue cleaning apparatus 800 performs glue coating on the wafer; the multi-axis robot 900 may also be configured to take out the wafer after the glue coating from the supporting mechanism 700, and transfer the taken wafer to the buffer device 1000; the multi-axis robot 900 may also be used to transport the wafers on the buffer device 1000 to the loading/unloading station 310 of the motion platform 300; the multi-axis robot 900 may also be used to take a laser processed wafer from the loading/unloading station 310 of the motion stage 300 and transfer the wafer to the alignment mechanism 600, so that the glue cleaning device 800 can clean the processed wafer.
In summary, compared with the prior art, the wafer laser processing apparatus 10 has at least the following advantages: this wafer laser processing device 10 is through adopting multiaxis robot 900, and set up multiaxis robot 900 on frame 100, install motion platform 300, laser beam machining subassembly 400 and magazine elevating system 500 on pedestal 200, and with components such as motion platform 300, laser beam machining subassembly 400, magazine elevating system 500, correction mechanism 600, supporting mechanism 700, rubber coating belt cleaning device 800, multiaxis robot 900 and buffer device 1000 around multiaxis robot 900, and rationally arrange respective position according to this wafer laser processing device 10's work flow, guaranteed this wafer laser processing device 10's structure simple compactness relatively on the whole, and handling speed obtains promoting, do benefit to and improve production efficiency and productivity.
In order to make the technical solution of the present invention better understood, the technical solution of the embodiment of the present invention will be clearly and completely described below with reference to fig. 1 and fig. 2.
In some embodiments, as shown in fig. 1 and 2, to realize that the glue cleaning apparatus 800 can both glue and clean, the glue cleaning apparatus 800 includes a glue applying apparatus 810 and a cleaning apparatus 820, wherein the glue applying apparatus 810 can be used for applying glue to the wafer, and correspondingly, the cleaning apparatus 820 can be used for cleaning the wafer. The support mechanism 700, the glue application device 810, the cleaning device 820, and the magazine home position 21 are arranged side by side in this order in a direction toward the front of the operator 30. Alternatively, the support mechanism 700, the cleaning device 820, the glue applying device 810, and the magazine home position 21 are arranged side by side in this order in a direction toward the front of the operator 30. That is, the positions of the glue applying device 810 and the cleaning device 820 can be interchanged according to specific situations, and only after the positions are interchanged, the wafer automation production process will be changed correspondingly, but the final achieved effect is very similar.
Alternatively, in other embodiments, as shown in fig. 1 and 2, in order to realize that the glue cleaning apparatus 800 can both perform gluing and cleaning, and further improve the overall production efficiency, the glue cleaning apparatus 800 includes a glue applying apparatus 810 and a cleaning apparatus 820, wherein the glue applying apparatus 810 and the cleaning apparatus 820 can both interface with the supporting mechanism 700 and the calibration mechanism 600, and both can be used for gluing and cleaning the wafer. Specifically, the glue applicator 810 can interface with the support mechanism 700 to apply glue to the wafer, and the glue applicator 810 can interface with the alignment mechanism 600 to clean the glued and grooved wafer. The same applies to the cleaning device 820. It should be noted that the wafer handover structure may adopt a conventional handover structure, or may also adopt a self-created structure, which is not a protection point of the present application, and thus is not described in detail.
As further shown in fig. 1 and 2, the glue application device 810 and the cleaning device 820 are arranged side by side between the support mechanism 700 and the magazine home position 21 in a direction toward the front of the operator 30. It will be appreciated that the positions of the gluing device 810 and the cleaning device 820 may be interchanged between the support mechanism 700 and the initial magazine position 21.
In some embodiments, as shown in fig. 1 and fig. 2, in order to increase the carrying speed and effectively increase the throughput of the whole wafer laser processing apparatus 10, the wafer laser processing apparatus 10 further includes a transmission mechanism 1100 mounted on the frame 100, wherein the transmission mechanism 1100 is located in an area enclosed between the buffer device 1000, the glue cleaning device 800 and the motion platform 300, and the transmission mechanism 1100 is used for transmitting the wafer in the magazine 20 to the calibration station of the calibration mechanism 600. It is understood that after the wafer is transferred to the alignment mechanism 600 by the transfer mechanism 1100, the wafer is subsequently transferred mainly by the multi-axis robot 900 and the motion platform 300, so that the movable range 910 of the multi-axis robot 900 can be reduced to some extent by the arrangement of the transfer mechanism 1100, and the stability of the overall operation and the compactness of the structure can be ensured.
In some embodiments, as shown in fig. 1 and 2, the laser processing assembly 400 includes a laser light path assembly 410 and a vision mechanism 420, wherein the laser light path assembly 410 is located in the area enclosed between the motion platform 300 and the magazine lift mechanism 500 and is located on the side of the wafer laser processing apparatus 10 near the operator 30. Specifically, in this embodiment, laser light path assembly 410 is disposed alongside magazine 20. The vision mechanism 420 is located at a position between the laser light path assembly 410 and the processing station 320 of the motion platform 300. Of course, in practice, the position of the vision mechanism 420 and the laser light path assembly 410 can be interchanged, which is determined by the actual situation.
It is to be understood that, in an embodiment of the present invention, taking the glue applying device 810 for applying glue and the cleaning device 820 for cleaning as an example, the working principle of the wafer laser processing device 10, that is, the automatic production flow of the wafer, is substantially as follows:
1) the operator 30 places the magazine 20 at the original position of the magazine 20, and the magazine lifting mechanism 500 lifts the magazine 20 to the plane where the working platform of the wafer correcting mechanism 600 is located;
2) the conveying mechanism 1100 clamps and conveys the wafer to the correcting mechanism 600, after the correcting mechanism 600 corrects the wafer, the multi-axis robot 900 takes out the corrected wafer from the correcting mechanism 600 and carries the wafer to the supporting mechanism 700, and the gluing device 810 glues the wafer after the wafer is cross-jointed from the supporting mechanism 700;
3) after the wafer is coated with the glue, the supporting mechanism 700 is connected to the coated wafer from the glue coating device 810, and the multi-axis robot 900 takes out the coated wafer from the supporting mechanism 700 and carries the coated wafer to the buffer device 1000;
4) the multi-axis robot 900 takes out the glued wafer from the buffer device 1000 and carries the glued wafer to the loading and unloading station 310 of the moving platform 300, and the moving platform 300 transfers the glued wafer from the loading and unloading station 310 to the processing station 320;
5) after the vision mechanism 420 of the laser processing assembly 400 and the motion platform 300 are aligned cooperatively, the laser optical path assembly 410 performs laser processing (e.g., cutting along a scribe line) on the wafer after the glue is applied to the processing station 320;
6) after the laser processing is completed, the motion platform 300 transfers the cut wafer from the processing station 320 to the loading and unloading station 310, the multi-axis robot 900 takes out the cut wafer from the loading and unloading station 310 and carries the cut wafer to the correcting mechanism 600, and the cleaning device 820 cleans the cut wafer after the wafer is handed over from the correcting mechanism 600 to the wafer;
7) after the wafer is cleaned, the alignment mechanism 600 is transferred from the cleaning device 820 to the cleaned wafer, and the transfer mechanism 1100 transfers the wafer from the alignment mechanism 600 to the cassette 20.
It should be noted that, the above-mentioned whole production process of completing the gluing, slotting and cleaning for one wafer, other wafer production processes can be executed circularly according to the above steps, in the wafer laser processing device 10, a plurality of wafers can be produced at the same time, and as a whole, the production steps of the wafer laser processing device 10 are simplified, the production efficiency is improved, and the structure is simple and compact.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A wafer laser processing device is characterized by comprising a rack and a base arranged on the rack, the wafer laser processing device further comprises a motion platform, a laser processing assembly and a material box lifting mechanism which are arranged on the base, and the wafer laser processing device further comprises a correcting mechanism, a supporting mechanism, a gluing and cleaning device, a multi-axis robot and a caching device which are arranged on the rack;
the moving platform is provided with a loading and unloading station and a processing station and is used for transferring the wafer on the loading and unloading station and the processing station;
the laser processing assembly is positioned on one side of the wafer laser processing device close to an operator and is used for carrying out laser processing on the wafer on the processing station of the moving platform;
the material box lifting mechanism is laterally positioned between the laser processing assembly and the material box initial position and is used for conveying the wafer between the material box initial position and the correction station of the correction mechanism;
the correcting mechanism is positioned on the periphery of the initial position of the material box and between the gluing and cleaning device and the initial position of the material box;
in the direction facing the front of the operator, the supporting mechanism, the gluing cleaning device and the material box are sequentially arranged side by side at initial positions; the gluing and cleaning device can be connected with the correction mechanism and the supporting mechanism to connect and connect wafers and is used for gluing and cleaning the wafers;
the multi-axis robot is arranged between the processing station and the gluing and cleaning device; the moving range of the mechanical arm of the multi-axis robot comprises the positions of the correction mechanism, the support mechanism, the buffer device and the loading and unloading station of the moving platform;
the caching device is located in an area enclosed among the multi-axis robot, the gluing and cleaning device and the processing station.
2. The wafer laser processing device according to claim 1, wherein the glue cleaning device comprises a glue coating device and a cleaning device, the glue coating device is used for coating glue on the wafer, and the cleaning device is used for cleaning the wafer; in the direction facing the front of an operator, the supporting mechanism, the gluing device, the cleaning device and the material box are sequentially arranged side by side at initial positions;
or in the direction towards the front of the operator, the supporting mechanism, the cleaning device, the gluing device and the material box are sequentially arranged side by side at initial positions.
3. The wafer laser processing device as claimed in claim 1, wherein the glue coating and cleaning device comprises a glue coating device and a cleaning device, and the glue coating device and the cleaning device can be used for connecting and connecting the wafer with the supporting mechanism and the correcting mechanism and are used for coating and cleaning the wafer; the gluing device and the cleaning device are arranged side by side between the support mechanism and the initial position of the magazine in a direction towards the front of the operator.
4. The wafer laser processing device according to claim 1, further comprising a transmission mechanism mounted on the frame, wherein the transmission mechanism is located in an area enclosed among the buffer device, the glue applying and cleaning device and the motion platform, and the transmission mechanism is used for transmitting the wafer in the magazine to the correction station of the correction mechanism.
5. The wafer laser processing apparatus of claim 1, wherein the laser processing assembly includes a laser light path assembly and a vision mechanism, the laser light path assembly being located in an area enclosed between the motion platform and the magazine lifting mechanism and on a side of the wafer laser processing apparatus near an operator; the vision mechanism is located at a position between the laser optical path assembly and the motion platform.
6. The wafer laser processing apparatus of claim 1, wherein the holder is a marble holder.
7. The wafer laser processing apparatus of claim 1, wherein the motion stage is a three-dimensional motion stage.
8. The wafer laser processing apparatus of claim 1, wherein the buffer apparatus is a buffer stage.
9. The wafer laser processing apparatus according to any one of claims 1 to 8, wherein the multi-axis robot is a six-axis robot.
10. The wafer laser processing apparatus according to any one of claims 1 to 8, wherein the multi-axis robot is a four-axis robot.
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| CN202023288615.9U CN214815772U (en) | 2020-12-30 | 2020-12-30 | Wafer laser processing device |
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| CN202023288615.9U CN214815772U (en) | 2020-12-30 | 2020-12-30 | Wafer laser processing device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115662926A (en) * | 2022-12-28 | 2023-01-31 | 苏州镭明激光科技有限公司 | Automatic slotting equipment, slotting method and full-cutting system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115662926A (en) * | 2022-12-28 | 2023-01-31 | 苏州镭明激光科技有限公司 | Automatic slotting equipment, slotting method and full-cutting system |
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Effective date of registration: 20220810 Address after: 518000 101, building 6, Wanyan Industrial Zone, Qiaotou community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's Semiconductor Equipment Technology Co.,Ltd. Address before: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |