JP2010099733A - Laser beam machining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus, in which a liquid resin is spin-coated on the surface of a workpiece combined with an annular frame through an adhesive tape and, subsequently, the frame is attached to a pad by an action of negative pressure and transferred, and then the frame is securely and promptly taken away from the pad at a place to which the frame is transferred. <P>SOLUTION: A pad 54, which is attached to a frame 4 by suction, is firmly fixed to a lower edge of a housing 71 communicated to a negative pressure source 83 and a positive pressure source 84 through a pipe 81 and piping 82. A pusher 73 is arranged so as to advance or retreat in the housing 71, and an upper and lower atmosphere of the pusher 73 in the housing 71 is divided into a high-pressure chamber 75 on the side of the pad 54 and a low-pressure chamber 76 on the side of the pipe 81 with rings 74 prepared in the pusher 73. By sending air into the high-pressure chamber 75 in the housing 71 from the positive pressure source 84 and causing internal pressure in the high-pressure chamber 75 to rise, the pusher 73 is made to descend and the frame 4 is pressed with the pusher 73 to force the frame 4 apart from the pad 54. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a laser processing apparatus that irradiates a workpiece such as a semiconductor wafer with a laser beam to perform groove processing, cutting processing, and the like, and in particular, has a function of applying a water-soluble resin to a processing surface of a workpiece before laser processing. The present invention relates to a laser processing apparatus.

  In the manufacturing process of semiconductor devices, a large number of rectangular areas are defined on the surface of a disk-shaped semiconductor wafer by dividing lines arranged in a grid pattern, and electronic circuits such as ICs and LSIs are formed on the surface of these rectangular areas. After forming and then performing necessary processing such as polishing after grinding the back surface, all the division lines are cut, that is, diced to obtain a large number of semiconductor chips. The semiconductor chip thus obtained is packaged by resin sealing and widely used in various electric / electronic devices such as mobile phones and PCs (personal computers).

  For semiconductor wafer dicing, a method of cutting a cutting blade rotated at a high speed was generally used, but in recent years, laser dicing has been put into practical use in which a laser beam is irradiated to melt the wafer while it is melted. ing. In the case of such laser dicing, there has been a problem that droplets of transpiration components called debris adhere to the surface of the wafer when the laser beam is irradiated, thereby degrading the quality. Therefore, if the present applicant irradiates the surface of the wafer with a laser beam and irradiates the surface with a laser beam, the debris adheres to the resin and does not directly adhere to the wafer surface, thereby ensuring the quality. (Patent Document 1).

JP 2004-322168 A

  In the above-mentioned patent document, a wafer is integrated on the inside of an annular frame via a dicing tape (adhesive tape), and a liquid resin having water solubility is applied to the wafer surface while rotating the wafer while holding the wafer on a spinner table. A technique of dropping and uniformly coating is disclosed. However, when the liquid resin is dropped onto the surface of the wafer integrated with the frame by so-called spin coating, the resin may be scattered and adhered to the surface of the frame on the outer peripheral side of the wafer by centrifugal force.

  The wafer is sent to the laser dicing process after resin coating, but usually the wafer is transported by adsorbing the frame to the pad with the closed space formed between the pad and the frame in contact with the frame under negative pressure. A transport means is used to move the arm that supports the frame, and after transporting to the target location, the frame is detached from the pad by sending air to the suction part of the pad to make positive pressure. ing. However, when the resin adheres to the frame as described above, the resin partially adheres to the pad, and air leakage may occur even if air is sent to the adsorption portion. In this case, pressure until the frame is detached cannot be obtained, and troubles such as the frame not being detached from the pad occur. Therefore, an improvement measure has been demanded.

  The present invention has been made in view of the above circumstances, and after coating a liquid resin by spin coating on the surface of a work integrated with an annular frame via an adhesive tape, the frame is applied to a pad by negative pressure action. It is an object of the present invention to provide a laser processing apparatus that can reliably and promptly remove the frame from the pad at the transport destination when sucking and transporting, and can prevent troubles.

  The laser processing apparatus of the present invention includes a holding unit that holds a workpiece integrally held via an adhesive tape inside an annular frame, and performs laser processing by irradiating the workpiece held by the holding unit with a laser beam. Laser processing means to be applied, a spinner table that holds and rotates the work, a resin supply means that supplies liquid water-soluble resin to the work surface of the work before laser processing held by the spinner table, and is held by the spinner table A laser processing apparatus having a conveying unit that sucks and holds a frame integral with the workpiece and conveys the workpiece to a predetermined conveying destination via the frame, and the negative pressure generating unit operates as the conveying unit. A pad for adsorbing and holding the frame, a pressing member for pressing the frame held by the pad so as to be detached from the pad, and the pressing member Driving means for driving the pressing direction, and characterized in that it comprises at least a moving means for moving the spinner table to the transport destination pad.

  In the laser processing apparatus of the present invention, the spinner table holding the workpiece is rotated, resin is supplied to the rotating workpiece, and the resin is spin-coated on the workpiece. The workpiece whose surface is coated with resin is transported to a predetermined transport destination by the transport means. When the transport destination is the holding means, the workpiece is held by the holding means, and laser processing is performed by laser beam irradiation by the laser processing means. Even if the above-mentioned debris is generated during laser processing, the debris adheres to the coating resin and does not directly adhere to the work surface of the work, so that the work quality is ensured.

  In the conveying means of the present invention, the negative pressure generating means operates to cause the pad to attract and hold the frame, and the pad is moved by the moving means, so that the work is conveyed to the conveying destination together with the frame. When the pressing member is actuated by the driving means at the transport destination, the pressing member presses the frame, and the frame is forcibly detached from the pad.

  Here, when the resin scatters and adheres to the frame at the time of spin coating, and the pad is in the state of adsorbing the resin when adsorbing the frame, the means for separating the frame from the pad by air pressure as in the past is When the resin is partially attached to the surface, there is a problem that air leaks and does not come off. However, in the present invention, the frame is not pressed by the air pressure, but is pressed by the pressing member, so that the insufficient action does not occur as in the prior art, and the frame can be reliably and quickly detached from the pad. it can.

Hereinafter, specific embodiments of the present invention will be given.
The driving means is a positive pressure generating means for pressing the pressing member by the positive pressure action of air. In this configuration, it is preferable that the negative pressure generating unit and the positive pressure generating unit have the same air flow path with respect to the pad because the configuration is simple.

  Further, the air flow passage is provided with a valve member for restricting the flow direction of the air flowing through the air flow path in one direction according to the operating state of the negative pressure generating means and the positive pressure generating means. And

  Further, as a more specific form, the end of the same air flow path is constituted by a cylindrical housing, the pad is provided at the front end of the housing, and the pressing member is provided in the housing. And a pressure receiving portion that receives positive pressure when positive pressure is generated by the positive pressure generating means, and a pressing portion that contacts the frame and presses the frame when positive pressure is generated And a connecting portion that connects the pressure receiving portion and the pressing portion, and a biasing member that biases the pressing member in a direction to retract from the frame is provided in the housing. The valve member is disposed between the inner wall of the housing and the pressure receiving portion of the pressing member.

  The valve member is an elastic V-shaped ring fixed around the pressure receiving portion of the pressing member, and is opened when positive pressure is generated and pressed against the inner wall of the housing, and closed when negative pressure is generated. Thus, a space is formed between the pressure receiving portion and the inner wall of the housing.

  The workpiece in the present invention is not particularly limited. For example, a semiconductor wafer such as a silicon wafer, an adhesive member such as DAF (Die Attach Film) provided on the back surface of the wafer for chip mounting, or a package of a semiconductor product. Ceramic, glass, sapphire, silicon-based substrates, various electronic components, various drivers such as LCD drivers for controlling and driving liquid crystal display devices, and various processing materials that require micron-order accuracy.

  According to the present invention, the frame integrated with the workpiece is sucked and held by the negative pressure action with the pad of the transport means and transported to the transport destination, and then the frame is forcibly pressed by the pressing member and separated from the pad. There is an effect that the frame can be reliably and promptly detached from the pad, and troubles during transportation can be prevented.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows the entire laser processing apparatus 10 of one embodiment, and FIG. 2 shows the back side. The apparatus 10 uses a semiconductor wafer (hereinafter abbreviated as wafer) 1 shown in FIG. 3 as a workpiece, and is a laser dicing apparatus for dicing the wafer 1 by automatic control.

(1) Wafer The wafer 1 will be described first with reference to FIG. 3. This wafer 1 is a disk-shaped material made of a single crystal material such as silicon, and an orientation flat as a crystal orientation mark is formed on a part of the outer peripheral portion. 1a is formed. A large number of rectangular chips 3 are partitioned on the surface (processed surface) of the wafer 1 by division lines 2 formed in a lattice pattern. On the surface of each chip 3, electronic circuits such as IC and LSI (not shown) are formed. The wafer 1 is diced into individual chips 3 by laser processing of all the division lines 2 by the laser processing apparatus 10. In addition, the dicing in this case includes groove processing for forming a groove having a predetermined depth to the middle of the thickness in addition to a full cut that penetrates and cuts completely in the thickness direction. The wafer in the case where the groove is processed is diced into a large number of chips 3 by further cutting the remaining thickness of the groove in a later process or by applying stress to cleave it.

  When the wafer 1 is supplied to the laser processing apparatus 10, the wafer 1 is supported inside the annular frame 4 via the adhesive tape 5 as shown in FIG. 3. The frame 4 has rigidity made of a plate material such as metal. The adhesive tape 5 has an adhesive surface on one side, and the frame 4 and the wafer 1 are attached to the adhesive surface. A frame 4 (hereinafter referred to as a frame 6 with a wafer) that supports a wafer 1 via an adhesive tape 5 is stored in a wafer storage cassette 9 shown in FIG. 1 with the wafer 1 facing upward. In the cassette 9, a large number of frames 6 with wafers are stacked horizontally and vertically and stored.

(2) Laser processing apparatus (2-1) Overall configuration Reference numeral 11 in FIGS. 1 and 2 denotes a cabinet. Laser processing means 19 is disposed inside the cabinet 11. As the laser processing means 19, one having a configuration in which a laser oscillated by a laser oscillator such as a YAG laser oscillator or a YVO4 laser oscillator is condensed by a lens and irradiated is used. 1 and 2 show an irradiation unit that is a part of the laser processing means 19 and irradiates a laser beam downward.

  A touch panel type operation display panel 12 is provided on one end side of the cabinet 11 in the Y direction (front side in FIG. 1), and this operation display panel 12 is used for various settings related to automatic operation of laser processing. Done. The operation display panel 12 is also provided with a function for displaying the internal operation status. On the top plate of the cabinet 11 above the operation display panel 12, an indicator lamp 13 for displaying an operation state or issuing a warning is attached.

  A base 14 is provided on the side surface 11 a side of the cabinet 11. The center on the base 14 is set to a wafer attachment / detachment position where the wafer 1 is attached to and detached from the disk-shaped chuck table (holding means) 20. The chuck table 20 is reciprocated in the X direction between a wafer attachment / detachment position on the base 14 and a processing position by the laser processing means 19 in the cabinet 11. The chuck table 20 shown in FIG. 2 is positioned at the machining position. A cassette base 15 is disposed on the front side in the Y direction in FIG. 1 at the wafer attaching / detaching position, and a spinner device 60 is disposed on the far side in the Y direction on the opposite side.

  The cassette 9 containing a large number of frames 6 with wafers is set on a cassette table 15. The cassette base 15 is an elevator type that can be raised and lowered, and by moving up and down, the frame 6 with one wafer in the cassette is positioned at a drawing position with a certain height.

  The wafer-attached frame 6 in the cassette 9 set on the cassette table 15 is moved from the drawing position to the chuck table 20 and held. The chuck table 20 is of a generally known vacuum chuck type, and is supported on a rectangular base table 21 so as to be rotatable about the Z direction (vertical direction) as a rotation axis. It is rotated in one direction or both directions by a rotational drive mechanism (not shown).

  A rectangular recess 16 extending in the X direction is provided as a moving space for the base table 21 from the wafer attachment / detachment position on the base 14 to the processing position by the laser processing means 19 in the cabinet 11. The base table 21 is reciprocated in the X direction by a reciprocating means (not shown) provided on the bottom surface of the recess 16, so that the chuck table 20 is reciprocated in the X direction together with the base table 21. . Bellows-like covers 17 are attached to both ends of the base table 21 in the X direction. These covers 17 prevent dust and the like from falling into the recesses 16 and expand and contract following the movement of the base table 21.

  When the chuck table 20 is operated in a vacuum, the wafer 1 is attracted and held on the upper surface of the chuck table 20 by a negative pressure effect caused by suction of the upper air. The outer diameter of the chuck table 20 is substantially the same as that of the wafer 1, and the entire wafer 1 is held in a concentric manner in close contact with the upper surface of the chuck table 20. The frame 4 around the wafer 1 is held and held by a plurality of clamps 22 attached to the outer peripheral surface of the chuck table 20.

  The spinner device 60 has a spinner table 61 on which the frame 6 with a wafer is held. The spinner table 61 is a vacuum chuck type similar to the chuck table 20 described above, and adsorbs and holds the frame 6 with a wafer on the upper surface by a negative pressure action. A plurality of clamps 62 that hold and hold the frame 4 are attached to the outer peripheral surface of the spinner table 61. The spinner table 61 is rotated by a rotation drive mechanism (not shown), and is set in a wafer delivery position where the upper surface of the base 14 and the height position are substantially the same by the lifting mechanism (not shown) and inside the base 14 below. It can be moved up and down between the processing positions.

  In the spinner apparatus 60, before the laser processing, a resin coating process for applying a water-soluble resin to the processing surface of the wafer 1 and a cleaning process for cleaning the wafer 1 after the laser processing are performed. The spinner device 60 includes a resin supply nozzle that drops liquid water-soluble resin onto the center of the surface of the wafer 1 held by the spinner table 61, and a cleaning water nozzle that supplies cleaning water to the resin applied to the wafer 1. In addition, an air ejection nozzle that ejects air onto the wafer 1 to dry the wafer 1 is provided (not shown).

Next, a conveyance system for conveying the frame 6 with a wafer will be described with reference to FIG.
The single wafer-attached frame 6 housed in the cassette 9 and positioned at the pull-out position by the raising / lowering operation of the cassette table 15 is pulled out horizontally by the gripping mechanism 30 in the Y direction, and above the wafer attachment / detachment position. Are received by a pair of positioning bars 35 extending in the Y direction. The gripping mechanism 30 is provided with a clamp portion 33 that grips the frame 4 at the tip of an arm 32 that is reciprocated in the Y direction by a linear guide 31 provided on the side surface 11 a of the cabinet 11. The pair of positioning bars 35 operate so as to approach and separate from each other in synchronism with the X direction, and the intermediate position between them is always aligned with the center of the chuck table 20.

  The wafer-attached frame 6 is gripped by the clamp portion 33 of the gripping mechanism 30 and placed in a state of being spanned between the two positioning bars 35 by the movement of the arm 32. Then, the positioning bars 35 come close to each other and come into contact with the outer peripheral edge of the frame 4 to thereby position the frame 6 with a wafer in the X direction. The positioning in the Y direction is performed by moving the arm 32. As a result, the wafer 1 is centered (positioned in the X and Y directions) concentrically with the chuck table 20.

  Next, the frame 4 supported by the positioning bar 35 is held by the upper first transfer mechanism 40. Thereafter, the positioning bar 35 is separated, and the frame 6 with a wafer is held only by the first transfer mechanism 40. The The first transport mechanism 40 has an H-shaped bracket 43 fixed to the tip of an extendable arm 42 that is reciprocated in the Y direction along a linear guide 41 provided on the side surface 11 a of the cabinet 11. A pad 44 is provided at the end, and the frame 4 is held horizontally on the lower surface of each pad 44. The pad 44 adsorbs and holds the frame 4 in contact with the pad 44 by a negative pressure action by air suction, and separates the frame 4 downward by a positive pressure action of ejecting air from the pad 44.

  The frame 6 with a wafer held by the first transport mechanism 40 moves to the back side in the Y direction after the telescopic arm 42 is contracted upward, and then the frame 4 is detached from the pad 44 after the telescopic arm 42 extends downward. As a result, the wafer-mounted frame 6 is placed concentrically on the spinner table 61 of the spinner apparatus 60.

  The wafer-attached frame 6 held on the spinner table 61 is transferred to the positioning bar 35 or the chuck table 20 by the second transfer mechanism (transfer means) 50. The second transport mechanism 50 has the same configuration as the first transport mechanism 40, and is an extendable arm that is reciprocated in the Y direction along a linear guide 51 provided below the linear guide 41 on the side surface 11a of the cabinet 11. (Moving means) An H-shaped bracket 53 is fixed to the tip of 52, and pads 54 are provided at four ends of the bracket 53. The frame 4 is held horizontally on the lower surface of each pad 54. Is done. The pad 54 sucks and holds the frame 4 by a negative pressure action by air suction. The frame 4 is detached from the pad 54 by a pusher (pressing member) 73 described later. The pad 54 of the second transport mechanism 50 and the mechanism related to the holding / removal of the frame 4 by the pad 54 are according to the present invention and will be described in detail later.

  According to the second transport mechanism 50, the telescopic arm 52 extends and the frame 4 of the frame 6 with the wafer is attracted and held by the pad 54, and then the telescopic arm 52 contracts and then moves forward in the Y direction. When the frame 4 is detached from the pad 54, the frame 6 with a wafer is placed on the positioning bar 35 or the chuck table 20. The gripping mechanism 30 holds the frame 6 with the wafer in the cassette 9 by gripping the frame 4 of the frame 6 with the wafer placed on the positioning bar 35 and moving the arm 32 to the front side in the Y direction. To do.

  As shown in FIG. 2, the transfer system, the wafer attachment / detachment position, and the space above the spinner device 60 are covered with cover members 11b and 11c. In FIG. 1, these cover members 11b and 11c are not shown in order to show the inside of the cover members 11b and 11c.

(2-2) Operation of Laser Processing Apparatus Next, an operation of performing laser processing on the division line 2 of the wafer 1 by the laser processing apparatus 10 will be described. FIG. 5 shows the process of the operation. In FIG. 5, C / T is the chuck table 20.

(2-2-1) Resin Application Process One frame 6 with a wafer, which is stored in the cassette 9 and positioned at the pull-out position by the raising / lowering operation of the cassette table 15, is pulled out by the gripping mechanism 30 and mounted on the positioning bar 35. After being positioned and positioned in the X and Y directions, the first transfer mechanism 40 is concentric with the spinner table 61 of the spinner device 60 that has been previously operated under a negative pressure and that is lifted to the wafer transfer position and waiting. Placed on. The frame 6 with a wafer is attracted and held by a spinner table 61, and at the same time, the frame 4 is held by a clamp 62.

  Next, the spinner table 61 is lowered to the processing position, the spinner table 61 is rotated at the processing position, and the wafer 1 rotates. A liquid water-soluble resin is dropped from the resin supply nozzle onto the center of the surface of the wafer 1. The The dropped resin spreads to the outer peripheral side by the action of centrifugal force, spreads over the entire surface of the wafer 1, and is spin-coated to form a protective film made of resin. Note that the rotation speed and rotation speed of the spinner table 61 at the time of spin coating are set such that the resin sufficiently covers the surface of the wafer 1. For example, the rotation speed is about 500 to 3000 rpm, and the rotation time is 30 to 120 seconds. It is said to be about. Moreover, the film thickness of resin is made into about 0.1-10 micrometers, for example.

  Next, the spinner table 61 stops rotating and rises to the wafer delivery position, and the negative pressure operation is stopped. Next, the frame 6 with the wafer is transported to the chuck table 20 by the second transport mechanism 50 and held on the chuck table 20.

(2-2-2) Laser Processing Step Next, the chuck table 20 holding the frame 6 with the wafer is moved to a processing position in the cabinet 11 by moving the base table 21. At this processing position, the laser processing unit 19 irradiates the division line 2 of the wafer 1 with a laser beam to perform laser processing, and the wafer 1 is diced.

  Here, when the wafer 1 is irradiated with a laser beam, the above-mentioned debris may occur. However, the debris adheres to the surface of the protective film made of the applied resin and does not directly adhere to the surface of the wafer 1. This ensures the quality of the chip 3.

  In the dicing, for example, the laser beam is irradiated onto the division line 2 while the chuck table 20 is processed and fed in the X direction, and the laser beam irradiation position is moved to the division line 2 by moving the laser processing means 19 in the Y direction. This is performed by an operation of alternately repeating the indexing and feeding. When the wafer 1 is fully cut by laser processing, the wafer 1 is divided into a large number of chips 3, but the chips 3 remain attached to the adhesive tape 5 and the form of the wafer 1 is maintained. When the laser processing is performed on all the division lines 2 and the dicing of the wafer 1 is completed, the chuck table 20 returns to the wafer attaching / detaching position, and the frame 6 with the wafer is sent to the cleaning process.

(2-2-3) Cleaning Step The wafer-attached frame 6 on which the wafer 1 has been diced is transferred again from the chuck table 20 at the wafer attachment / detachment position to the spinner device 60 by the first transfer mechanism 40 and waits at the wafer delivery position. It is adsorbed and held on the spinner table 61.

  Subsequently, the spinner table 61 is lowered to the processing position, starts rotating, and cleaning water is supplied from the cleaning water nozzle to the resin (protective film). When the cleaning water is supplied, the water-soluble resin melts, and the protective film made of the resin is washed away from the surface of the wafer 1 and removed. When the resin is removed, the rotation of the spinner table 61 is continued, and air is ejected from the air ejection nozzle onto the surface of the wafer 1 to dry the wafer 1. When the wafer 1 is dried, the cleaning is completed, and the spinner table 61 is raised to the wafer delivery position.

(2-2-4) Storage in cassette Each process of forming a protective film by resin coating on the surface of the wafer 1, dicing the wafer 1 by laser processing, and cleaning the wafer 1 to remove the protective film as described above. The wafer-attached frame 6 that has passed through is transferred from the spinner table 61 to the positioning bar 35 by the second transport mechanism 50, and then returned to the cassette 9 by the gripping mechanism 30.

  The above series of operations is performed on all the wafers 1 in the cassette 9. When all the wafers 1 in the cassette 9 have been diced, the cassette 9 is transported to the next chip pick-up process, and each chip 3 is picked up from the adhesive tape 5 to obtain individual chips 3.

(3) Second transport mechanism (3-1) Configuration The above is the outline of the overall configuration and operation of the laser processing apparatus 10 of the present embodiment. Next, the pad 54 of the second transport mechanism 50 according to the present invention and A mechanism related to the holding / removal of the frame 4 by the pad 54 will be described.

  FIG. 4 shows a state in which the frame 4 of the frame 6 with a wafer is attracted and held by each pad 54 provided at the end of the bracket 53. The pad 54 is fixed to the lower end surface of a cylindrical housing (air flow path) 71 having a hexagonal cross section disposed in a state where the axial direction is along the vertical direction. As shown in FIG. 6, a pipe (air flow path) 81 is coaxially fixed to the upper end of the housing 71, and the housing 71 is fixed to the lower surface of the end portion of the bracket 53 via the pipe 81.

  The pipe 81 and the inside of the housing 71 are in communication, and the housing 71 and the inside of the pad 54 are also in communication. As shown in FIG. 6, an air pipe (air flow path) 82 is connected to the pipe 81. The piping 82 is provided for each pad 54 as shown in FIG. These pipes 82 are gathered into one and then branched and connected to a negative pressure source (negative pressure generating means) 83 and a positive pressure source (driving means, positive pressure generating means) 84 as shown in FIG. ing. The negative pressure source 83 is a vacuum pump or the like, and the positive pressure source 84 is a compressor or the like.

  As shown in FIG. 7, the pad 54 is cylindrical and has a shape in which the central portion in the axial direction is buckled. The pad 54 is made of elastic rubber or the like, and can be elastically deformed in the vertical direction by buckling. It is a thing. The pad 54 is disposed coaxially with the housing 71, and the upper end surface is fixed to the outer peripheral portion of the lower end surface of the housing 71. In the center of the lower end portion of the housing 71, a hole 71a that connects the interior of the housing 71 and the pad 54 is formed. A coil spring (biasing member) 72 is coaxially disposed on the bottom inside the housing 71. The bottom surface of the coil spring 72 is fixed to the bottom of the housing 71. A pusher 73 whose outer shape is formed in a funnel shape is inserted into the coil spring 72.

  In the pusher 73, a conical portion (connecting portion) 73b having a smaller diameter as it goes downward is formed at the lower end of the disc portion (pressure receiving portion) 73a at the upper end, and the outer diameter is constant at the lower end of the conical portion 73b. A straight pin portion (pressing portion) 73c is formed, and the lower end of the disc portion 73a is engaged with and fixedly attached to the upper end of the coil spring 72. Therefore, the pusher 73 moves in the vertical direction integrally with the elastic deformation of the coil spring 72 in the vertical direction.

  When the coil spring 72 is in a free state, the pusher 73 has a conical portion 73b inside the coil spring 72 as shown in FIG. 7A, and a pin portion 73c passes through the hole 71a and its lower end is the lower end of the pad 54. It is located above. 7C, when the pusher 73 descends against the elastic force of the coil spring 72, the lower end portion of the pin portion 73c protrudes downward from the lower end of the pad 54. .

  An inner peripheral side portion of a ring (valve member) 74 having a V-shaped cross section is fixed around the disc portion 73 a of the pusher 73. The ring 74 is a sealing material made of elastic rubber or the like. Normally, the edge on the outer peripheral side is in contact with the inner wall of the housing 71 in an open state as shown in FIG. The inside of the housing 71 is partitioned above and below the ring 74 and the disk portion 73 a of the pusher 73 when the ring 74 is opened and is in contact with the inner wall of the housing 71. Here, the upper internal space is referred to as a high pressure chamber 75, and the lower internal space is referred to as a low pressure chamber 76.

  When the negative pressure source 83 is operated, the ring 74 sucks the air in the high pressure chamber 75 in the housing 71 so that the outer peripheral edge is on the inner peripheral side as shown in FIG. To be in close contact with the inner peripheral edge and closed. Then, since a space is created between the ring 74 and the inner wall of the housing 71, the high pressure chamber 75 communicates with the pad 54 via the low pressure chamber 76 and the hole 71a, and the air in the pad 54 is sucked and negative pressure is generated. It becomes a state.

  On the other hand, when the positive pressure source 84 is operated, the high pressure chamber 75 in the housing 71 is increased in internal pressure to become positive pressure, so that the outer peripheral edge receiving the pressure bends and opens to the outer peripheral side, It contacts the inner wall of the housing 71. When the internal pressure of the high pressure chamber 75 is further increased in this open state, the pressure is received by the disk portion 73a of the pusher 73 and the ring 74 itself, and the pusher 73 descends downward to press the frame 4 as described later. Propulsive force is generated.

  The pusher 73 moves up and down according to the pressure state of the high pressure chamber 75 in the housing 71, and the ring 74 slides on the inner wall of the housing 71 along with this. Therefore, the ring 74 is preferably made of a material having high slidability.

(3-2) Operation Hereinafter, an operation of adsorbing and detaching the frame 4 of the frame 6 with a wafer by the pad 54 of the second transport mechanism 50 having the above configuration will be described. When adsorbing the frame 4, the negative pressure source 83 is operated to bring the lower end of the pad 54 into contact with the frame 4 as shown in FIG. Then, first, the air in the high pressure chamber 75 in the housing 71 is sucked to close the ring 74, and a space is created between the ring 74 and the inner wall of the housing 71. As a result, the high pressure chamber 75 and the low pressure chamber 76 communicate with each other, the air in the pad 54 is sucked, the inside of the pad 54 becomes negative pressure, and the frame 4 is adsorbed to the pad 54.

  Next, in order to detach the frame 4 from the pad 54, the operation of the negative pressure source 83 is stopped and the positive pressure source 84 is operated. Then, air flows from the pipe 82 through the pipe 81 and flows into the housing 71 into the high pressure chamber 75, the high pressure chamber 75 becomes positive pressure, and the ring 74 opens to contact the inner wall of the housing 71. Furthermore, when the air flows in, the internal pressure of the high pressure chamber 75 increases, and the pusher 73 descends against the elastic force of the coil spring 72 when the disc portion 73a of the pusher 73 receives a high pressure.

  As a result, the lower end surface of the pin portion 73 c of the pusher 73 presses the frame 4, and the pad 54 is detached from the frame 4. When the frame 4 is detached from the pad 54 as described above, the frame 4 is smoothly detached when the telescopic arm 52 is raised while being synchronized with the pusher 73 being lowered. After the frame 4 is detached from the pad 54, the introduction of air from the positive pressure source 84 is stopped. When the introduction of air is stopped, the pusher 73 is raised by the elastic force of the coil spring 72 and returns to the original state shown in FIG.

(3-3) Effect In this embodiment, when the frame 4 that is attracted and held by the pad 54 is generated by generating a negative pressure, the frame 4 is pressed by the pusher 73 that protrudes in the direction of the frame 4 by air pressure. As a result, the frame 4 is forcibly detached from the pad 54. The second transport mechanism 50 holds the wafer-attached frame 6 immediately after the resin is spin-coated on the wafer 1 on the pad 54, but the resin scatters and adheres to the surface of the frame 4 during the spin-coating, Resin may be sandwiched between the frame 4 and the resin may partially contact the pad 54.

  In this case, the conventional means for detaching the frame 4 from the pad 54 only by air pressure has caused a problem that air leaks and does not detach, but in this embodiment, the pusher 73 is directly attached to the frame 4. In addition, the frame 4 is mechanically pressed and the frame 4 is forcibly separated from the pad 54, so that the frame 4 can be reliably and promptly detached from the pad 54.

  In the above-described embodiment, the present invention is applied to the pad 54 of the second transport mechanism 50. The reason is that the second transport mechanism 50 is configured to remove the frame 6 with a wafer immediately after the resin is applied to the wafer 1. This is because the resin is not sufficiently cured and the viscosity remains, the resin is likely to adhere to the pad 54, and it is often difficult to separate the frame 4 from the pad 54. On the other hand, in the first transport mechanism 40, after the laser processing, the wafer-attached frame 6 in which the resin is applied to the wafer 1 is transported to the spinner table 61. At this time, the resin is sufficiently cured, and the pad 54 becomes the resin. It is difficult to adhere even if it comes into contact, and the frame 4 can be smoothly detached from the pad 54.

  However, since there are times when the wafer-attached frame 6 on which the resin is applied to the wafer 1 is transported, the pad 44 of the first transport mechanism 40 is configured in the same manner as in the above-described embodiment, and the pusher 73 causes the frame 4 to be Of course, it is also possible to adopt a configuration in which the Alternatively, when the wafer-mounted frame 6 on which the resin is applied to the wafer 1 is transferred, the wafer 1 is transferred by the second transfer mechanism 50 including the pad 54 with the pusher 73, and the pusher 73 is not provided before the resin application. A conveyance form in which the frame 6 with a wafer is conveyed by the first conveyance mechanism 40 may be adopted.

1 is an overall perspective view of a laser processing apparatus according to an embodiment of the present invention. It is a whole perspective view of the back side of the laser processing apparatus. It is a perspective view which shows the state by which the semiconductor wafer to which laser processing is given by one Embodiment is hold | maintained at the flame | frame via the adhesive tape. It is a perspective view which shows the state by which the flame | frame of the frame with a wafer was adsorb | sucked and hold | maintained at the pad. It is a chart figure which shows the operation process of the laser processing by a laser processing apparatus. It is a figure which shows the perspective view of the support structure of a pad, and an air flow path. It is sectional drawing which shows the effect | action of adsorption | suction of the flame | frame by a pad, and detachment | leave.

Explanation of symbols

1 ... wafer (work)
DESCRIPTION OF SYMBOLS 4 ... Frame 5 ... Adhesive tape 10 ... Laser processing apparatus 19 ... Laser processing means 20 ... Chuck table (holding means)
50. Second transport mechanism (transport means)
52 ... telescopic arm (moving means)
54 ... Pad 60 ... Spinner device 61 ... Spinner table 71 ... Housing (air flow path)
72 ... Coil spring (biasing member)
73 ... pusher (pressing member)
73a ... disc part (pressure receiving part)
73b ... Conical part (connecting part)
73c ... Pin part (pressing part)
74 ... Ring (valve member)
75 ... High pressure chamber 76 ... Low pressure chamber 81 ... Pipe (air flow path)
82 ... Piping (air flow path)
83 ... Negative pressure source (negative pressure generating means)
84 ... Positive pressure source (driving means, positive pressure generating means)

Claims (6)

Holding means for holding the work integrally held via an adhesive tape inside the annular frame;
Laser processing means for performing laser processing by irradiating the workpiece held by the holding means with a laser beam;
A spinner table that rotates while holding the workpiece;
Resin supply means for supplying a liquid water-soluble resin to the processed surface of the workpiece before laser processing held by the spinner table;
Conveying means for adsorbing and holding the frame integrated with the work held by the spinner table, and conveying the work to a predetermined conveyance destination via the frame;
A laser processing apparatus comprising:
The conveying means includes a pad for adsorbing and holding the frame by operating a negative pressure generating means;
A pressing member for pressing the frame held by the pad so as to be detached from the pad;
Driving means for driving the pressing member in the pressing direction;
Moving means for moving the pad from the spinner table to the transport destination;
A laser processing apparatus comprising at least:   The laser processing apparatus according to claim 1, wherein the driving unit is a positive pressure generating unit that presses the pressing member by a positive pressure action of air.   The laser processing apparatus according to claim 2, wherein an air flow path of the negative pressure generating unit and the positive pressure generating unit with respect to the pad is the same.   The air flow path is provided with a valve member that restricts the flow direction of the air flowing through the air flow path in one direction according to the operating state of the negative pressure generation means and the positive pressure generation means. The laser processing apparatus according to claim 3. The end of the same air flow path is constituted by a cylindrical housing, and the pad is provided at the tip of the housing,
The pressing member is provided in the housing so as to be capable of moving forward and backward along the axial direction of the housing, and a pressure receiving portion that receives a positive pressure when the positive pressure is generated by the positive pressure generating means, and when the positive pressure is generated, A pressing portion that contacts the frame and presses the frame; and a connecting portion that connects the pressure receiving portion and the pressing portion;
A biasing member that biases the pressing member in a direction to retract from the frame is provided in the housing.
The laser processing apparatus according to claim 4, wherein the valve member is disposed between an inner wall of the housing and the pressure receiving portion of the pressing member.   The valve member is an elastic V-shaped ring fixed around the pressure receiving portion of the pressing member, and is opened when positive pressure is generated and is pressed against the inner wall of the housing, and is closed when negative pressure is generated. The laser processing apparatus according to claim 5, wherein a space is formed between the pressure receiving portion and the inner wall of the housing.

Images