JP2002313883A - Electronic device transport device - Google Patents

Electronic device transport device

Info

Publication number
JP2002313883A
JP2002313883A JP2001119864A JP2001119864A JP2002313883A JP 2002313883 A JP2002313883 A JP 2002313883A JP 2001119864 A JP2001119864 A JP 2001119864A JP 2001119864 A JP2001119864 A JP 2001119864A JP 2002313883 A JP2002313883 A JP 2002313883A
Authority
JP
Japan
Prior art keywords
opening
electronic device
suction
air
suction surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001119864A
Other languages
Japanese (ja)
Inventor
Hironori Tsugane
浩典 津金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anritsu Corp
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Priority to JP2001119864A priority Critical patent/JP2002313883A/en
Publication of JP2002313883A publication Critical patent/JP2002313883A/en
Pending legal-status Critical Current

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

PROBLEM TO BE SOLVED: To constitute a transport head to be simple, small and light without blowing a peripheral electronic device. SOLUTION: A suction opening 3 formed in the transport head 1 is connected to an air source through a single air path port 2, and it transmits positive and negative pneumatics to a suction face 1b, sucks the electronic device W and holds the electronic device W at the suction face 1b. At the time of suction, a come-out stop member 5 restricts the shift of a removal pin 4. The electronic device W is removed from the suction face 1b by vacuum destruction. At that time, an engagement part 4a is brought into contact with a step 1c by the shift of the removal pin 4, and air jetted from the suction face 1b is interrupted. Jet quantity from the suction 1b is reduced. Then, the tip 4b of the removal pin 4 protrudes from the suction face 1b and it securely removes the electronic device W.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子デバイスを搬
送ヘッドに吸着し搬送する電子デバイス搬送装置に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device transport apparatus which transports an electronic device by sucking the device onto a transport head.

【0002】[0002]

【従来の技術】電子デバイスの検査装置等には、電子デ
バイスを待機箇所から1個ずつ測定箇所へ搬送させ、測
定後に排出箇所へ搬送させる電子デバイス搬送装置が設
けられる。このような電子デバイス搬送装置としては、
従来、搬送ヘッドに吸着口を設けて電子デバイスを吸着
し、搬送後に、電子デバイスを吸着口から離脱させる構
成のものがある。
2. Description of the Related Art An electronic device inspection apparatus or the like is provided with an electronic device transport device that transports electronic devices one by one from a standby location to a measurement location and transports the electronic devices to a discharge location after measurement. As such an electronic device transport device,
2. Description of the Related Art Conventionally, there is a configuration in which a suction port is provided in a transfer head to suck an electronic device, and after the transfer, the electronic device is separated from the suction port.

【0003】しかしながら、上記構成のものでは、電子
デバイスの離脱時に吸着口から吹き出される余分な空気
によって待機箇所、及び排出箇所における所望する電子
デバイス以外、周囲の他の電子デバイスを吹き飛ばすこ
とがあり、電子デバイス搬送の自動化に支障を生じるこ
とがあった。近年の小型軽量化された電子デバイスは吹
き飛ばされやすい。
[0003] However, in the above-described configuration, there may be a case where excess air blown out from the suction port when the electronic device is detached blows off other electronic devices besides the desired electronic device at the standby and discharge locations. In some cases, there is a problem in automation of electronic device transportation. Recent small and lightweight electronic devices are easily blown away.

【0004】図4は、従来の他の搬送ヘッド(特開平7
−33247号公報)を示す側断面図である。この搬送
ヘッド50は、ヘッド下面に複数の吸着パッド51が設
けられ、真空吸着により光ディスクを吸着した状態で搬
送する。吸着パッド51の中心部には、エアシリンダ5
3により突出自在な押し出し用ピン52が設けられてい
る。搬送後、吸着パッド51の真空破壊と同時にエアシ
リンダ53を伸張させ押し出し用ピン52を突出させる
ことにより、光ディスクを吸着パッド51から離すこと
ができる。
FIG. 4 shows another conventional transport head (Japanese Patent Laid-Open No.
FIG. The transport head 50 is provided with a plurality of suction pads 51 on the lower surface of the head, and transports the optical disk while sucking the optical disk by vacuum suction. At the center of the suction pad 51, an air cylinder 5
A push-out pin 52 that can be protruded by 3 is provided. After the conveyance, the optical disk can be separated from the suction pad 51 by extending the air cylinder 53 and projecting the pushing pin 52 simultaneously with the vacuum breaking of the suction pad 51.

【0005】図5は、従来の他の搬送ヘッド(特許第2
648118号公報)を示す側断面図である。この搬送
ヘッド60は、ヘッド下面に吸着口61が設けられ、真
空継手(吸着空路)62を介しての真空吸着により半導
体チップを吸着した状態で搬送する。吸着口61部分に
は、チップ押さえロッド63が突出自在に設けられ、こ
のチップ押さえロッド63は、高圧エア継手(圧縮空
路)64を介しての圧縮空気により突出する。搬送後、
空着口61内部を大気圧に戻し、高圧エア継手64側か
ら圧縮空気を供給することによりチップ押さえロッド6
3を突出させることにより、半導体チップを離脱させる
ことができる。なお、チップ押さえロッド63は、内部
のスプリング65で上方に付勢されており、圧縮空気の
非供給時には、上方に退避している。
FIG. 5 shows another conventional transport head (Patent No. 2).
648118). The transfer head 60 is provided with a suction port 61 on the lower surface of the head, and transfers the semiconductor chip in a state in which the semiconductor chip is sucked by vacuum suction through a vacuum joint (suction air path) 62. A tip holding rod 63 is provided at the suction port 61 so as to be freely protruded. The tip holding rod 63 is protruded by compressed air via a high-pressure air joint (compression air path) 64. After transport,
The inside of the emptying port 61 is returned to the atmospheric pressure, and compressed air is supplied from the high-pressure air joint 64 side, so that the tip holding rod 6
By projecting 3, the semiconductor chip can be detached. The tip holding rod 63 is urged upward by an internal spring 65, and is retracted upward when compressed air is not supplied.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、図4記
載のものは、搬送ヘッド50内部にエアシリンダ53を
備えており、搬送ヘッド50が重く、搬送ヘッド50の
移動機構に移動負荷がかかるため移動機構が大型化し
た。
However, the apparatus shown in FIG. 4 has an air cylinder 53 inside the transfer head 50, and the transfer head 50 is heavy, and the transfer mechanism of the transfer head 50 is subjected to a moving load. The mechanism has become larger.

【0007】また、図5記載のものについても、搬送ヘ
ッド60内部に所定長のチップ押さえロッド63、スプ
リング65等を有しており、搬送ヘッド60が重く、搬
送ヘッド60の移動機構に移動負荷がかかるため移動機
構が大型化した。加えて、吸着空路と圧縮空路の異なる
2系統の空路を有するため、電磁弁を含めてそれぞれの
空路を構成する部品点数が多くなり、また、電磁弁の切
替と空気の供給排出に特別な制御が必要となった。これ
により全体構成が複雑で保守、点検が容易に行えず、コ
スト高となる。
5 also has a tip holding rod 63 and a spring 65 of a predetermined length inside the transfer head 60, so that the transfer head 60 is heavy, and the transfer mechanism of the transfer head 60 has a moving load. However, the moving mechanism is enlarged. In addition, since there are two different air paths, an adsorption air path and a compression air path, the number of parts constituting each air path including the solenoid valve increases, and special control for switching of the solenoid valve and supply and discharge of air is performed. Was needed. As a result, the overall configuration is complicated, maintenance and inspection cannot be performed easily, and the cost increases.

【0008】本発明は、上記課題を解決するためになさ
れたものであり、周囲の電子デバイスを吹き飛ばすこと
なく、搬送ヘッドを簡単で小型軽量に構成できる電子デ
バイス搬送装置を提供することを目的としている。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to provide an electronic device transport apparatus which can configure a transport head simply, compactly and lightly without blowing away electronic devices in the vicinity. I have.

【0009】[0009]

【課題を解決するための手段】上記目的を達成するた
め、本発明の電子デバイス搬送装置は、筒状の搬送用ヘ
ッド(1)にて電子デバイス(W)を空気圧によって吸
着させ、前記搬送用ヘッドを移動させることにより前記
電子デバイスを搬送する電子デバイス搬送装置におい
て、前記筒状の搬送用ヘッドは、一端部に電子デバイス
を吸着するための吸着面(1b)と、前記吸着面に開口
し、前記開口から他端部まで単一の空気路を形成してエ
ア源と接続され、前記エア源による正または負の空気圧
を前記吸着面に吸着される前記電子デバイスに伝えるた
めの吸着用開口部(3)と、前記エア源により印加され
る正または負の空気圧によって前記吸着用開口部内で移
動し、前記正の空気圧のときは前記吸着用開口部内を閉
塞させ前記電子デバイスを離脱させ、前記負の空気圧の
ときは前記吸着用開口部内を開放させ前記電子デバイス
を吸着させる開閉用部材(4,14)と、を備えたこと
を特徴とする。
In order to achieve the above object, an electronic device transport apparatus according to the present invention comprises a cylindrical transport head (1) for adsorbing an electronic device (W) by air pressure, and In the electronic device transport apparatus that transports the electronic device by moving a head, the cylindrical transport head has an adsorbing surface (1b) for adsorbing the electronic device at one end and an opening on the adsorbing surface. A suction opening for forming a single air passage from the opening to the other end and being connected to an air source, and transmitting positive or negative air pressure from the air source to the electronic device to be suctioned to the suction surface; And (3) moving in the suction opening by the positive or negative air pressure applied by the air source, and closing the suction opening when the positive air pressure is applied to the electronic device. It is disengaged, and when the negative air pressure, characterized in that it comprises a and a closing member (4, 14) for adsorbing the electronic device is opened the suction opening portion.

【0010】また、前記吸着用開口部(3)内には、前
記エア源による負の空気圧の印加時に前記開閉用部材
(4,14)の移動を規制する抜け止め部(5)と、前
記吸着面と前記抜け止め部との間に段差部(1c)とを
備え、前記開閉用部材は、所定長さ(L2)を有する棒
状に形成され、前記吸着用開口部(3)内で移動する離
脱用ピン(4)であり、該離脱用ピンは、前記吸着面と
前記段差部との長さ(L1)より長く(L2)形成さ
れ、前記エア源による正の空気圧の印加時に前記段差部
に接触して前記吸着面(1b)からの空気の吹き出しを
遮断する係合部(4a)を有し、前記吸着用開口部の閉
塞時に前記電子デバイス(W)を押し出すよう所定長さ
(L4)だけ前記吸着面から先端(4b)が突出するよ
うに構成してもよい。
In the suction opening (3), a retaining portion (5) for restricting the movement of the opening / closing member (4, 14) when a negative air pressure is applied by the air source, A step (1c) is provided between the suction surface and the retaining portion, and the opening / closing member is formed in a rod shape having a predetermined length (L2) and moves within the suction opening (3). A detachable pin (4) formed to be longer (L2) than the length (L1) between the suction surface and the stepped portion, and the detached pin is formed when the positive air pressure is applied by the air source. An engagement portion (4a) for contacting the suction portion to block the blowing of air from the suction surface (1b), and the electronic device (W) is pushed out by a predetermined length to push the electronic device (W) when the suction opening is closed. The tip (4b) may protrude from the suction surface by L4).

【0011】また、前記開閉用部材は、前記吸着面(1
b)部分の開口径より大径な球状の開閉用球体(14)
であり、該開閉用球体は、前記エア源からの空気圧によ
り吸着面への接触時に該吸着面からの空気の吹き出しを
遮断するとともに、前記電子デバイス(W)を押し出す
よう該吸着面から所定量突出自在に構成してもよい。
Further, the opening / closing member is provided on the suction surface (1).
b) A spherical opening / closing sphere having a diameter larger than the opening diameter of the portion (14)
The opening / closing sphere blocks air blowing from the suction surface when contacting the suction surface by air pressure from the air source, and a predetermined amount from the suction surface so as to push out the electronic device (W). You may comprise so that it may protrude freely.

【0012】上記構成の作用を図1記載の離脱用ピン4
を用いた例で説明する。搬送用ヘッド1の先端部の吸着
面1bは、電子デバイスWを吸着自在であり、吸着状態
で搬送用ヘッド1を移動させ電子デバイスWを搬送す
る。搬送用ヘッド1の内部に開口形成された吸着用開口
部3は、単一の空路を介してエア源に接続され、正、負
の空気圧を吸着面1bに伝えて電子デバイスWを吸着
し、真空吸着で電子デバイスWを吸着面1bで保持す
る。この吸着時、離脱用ピン4が吸着用開口部3内で移
動するが、抜け止め部材5で移動が規制される。一方、
真空破壊で吸着面1bから電子デバイスWが離脱する。
この際、離脱用ピン4の移動によって、係合部4aが段
差部1cに接触して吸着面1bから吹き出す空気を遮断
し、吹き出し量を少なくできる。同時に、離脱用ピン4
が吸着面1bから突出し電子デバイスWを確実に離脱さ
せる。
The operation of the above-described structure is explained by using the release pin 4 shown in FIG.
This will be described by using an example. The suction surface 1b at the distal end of the transfer head 1 is capable of sucking the electronic device W, and moves the transfer head 1 in the suction state to transfer the electronic device W. The suction opening 3 formed inside the transport head 1 is connected to an air source through a single air path, and transmits positive and negative air pressure to the suction surface 1b to suck the electronic device W, The electronic device W is held on the suction surface 1b by vacuum suction. During this suction, the detachment pin 4 moves within the suction opening 3, but the movement is regulated by the retaining member 5. on the other hand,
The electronic device W is separated from the suction surface 1b by the vacuum break.
At this time, the movement of the detachment pin 4 causes the engagement portion 4a to contact the step portion 1c to shut off the air blown out from the suction surface 1b, thereby reducing the blowout amount. At the same time, release pin 4
Protrudes from the suction surface 1b and reliably detaches the electronic device W.

【0013】[0013]

【発明の実施の形態】(第1実施形態)図1は、本発明
の電子デバイス搬送装置の要部である搬送ヘッドの第1
実施形態を示す一部裁断正面図である。電子デバイス搬
送装置は、電子デバイスの検査装置等に設けられ、搬送
ヘッド1を移動機構(不図示)により移動自在に構成さ
れている。この搬送ヘッド1は、移動機構により電子デ
バイスを待機箇所から1個ずつ測定箇所へ搬送させる。
また、測定後に排出箇所へ搬送させる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) FIG. 1 shows a first embodiment of a transport head which is a main part of an electronic device transport apparatus of the present invention.
It is a partially cut front view showing an embodiment. The electronic device transport device is provided in an electronic device inspection device or the like, and is configured such that the transport head 1 is movable by a moving mechanism (not shown). The transport head 1 transports electronic devices one by one from a standby location to a measurement location by a moving mechanism.
After the measurement, it is transported to the discharge location.

【0014】図示の搬送ヘッド1は、中空円筒状に形成
され、内部には供給/排出用の空気路口2が開口形成さ
れている。空気路口2の上端部2aには継手を介してエ
ア源に接続される(不図示)。エア源は、この1カ所の
空気路口2を介して正、負の空気圧(真空破壊及び真空
吸引)を印加する。
The illustrated transport head 1 is formed in a hollow cylindrical shape, and has an air passage opening 2 for supply / discharge formed therein. The upper end 2a of the air passage 2 is connected to an air source via a joint (not shown). The air source applies positive and negative air pressure (vacuum break and vacuum suction) through the one air passage 2.

【0015】搬送ヘッド1の先端部1aは小径に形成さ
れており、吸着面1bにて電子デバイスを吸着保持す
る。対応して搬送ヘッド1の内部において先端部1aの
内部には段差部1cが形成され、所定長さで小径な吸着
用開口部3が形成されている。この吸着用開口部3に
は、吸着用開口部3を閉塞あるいは開放する開閉用部材
としての離脱用ピン4が設けられている。
The distal end portion 1a of the transport head 1 is formed to have a small diameter, and sucks and holds the electronic device on the suction surface 1b. Correspondingly, a step portion 1c is formed inside the front end portion 1a inside the transport head 1, and a small-diameter suction opening 3 having a predetermined length is formed. The suction opening 3 is provided with a detachment pin 4 as an opening / closing member for closing or opening the suction opening 3.

【0016】離脱用ピン4は、吸着用開口部3の長さL
1より長い長さL2に形成される。また、吸着用開口部
3の開口径より小径に形成され、吸着用開口部3と離脱
用ピン4との間には隙間が形成される。離脱用ピン4の
上部には、吸着用開口部3より大径な係合部4aが設け
られている。図示のように、離脱用ピン4は、係合部4
aが段差部1cに当接した状態で、先端(下端部)4b
が吸着面1bから所定長さ突出する。
The detaching pin 4 has a length L of the suction opening 3.
It is formed to have a length L2 longer than 1. The suction opening 3 is formed to have a smaller diameter than the opening diameter, and a gap is formed between the suction opening 3 and the detachment pin 4. An engaging portion 4 a having a diameter larger than that of the suction opening 3 is provided above the detachment pin 4. As shown in FIG.
a is in contact with the step 1c, and the tip (lower end) 4b
Project from the suction surface 1b by a predetermined length.

【0017】この離脱用ピン4は、小型軽量に形成され
ており、エア源による正、負の空気圧の印加に連動して
図中上下方向に移動自在である。なお、内部の空気路口
2には、抜け止め部材5が突出して設けられる。図示の
抜け止め部材5は、段差部1cから所定長さL3離れた
1カ所に圧入されたピンで構成されている。離脱用ピン
4は、エア源による吸引時の吸引力で上方に移動した際
において、係合部4aが抜け止め部材5に当接して離脱
用ピン4の移動を規制する。この際、下端部4bが吸着
用開口部3内に留まり、この後の真空破壊時に、図示
(吸着用開口部3内に離脱用ピン4が位置する)の状態
に復帰できるようになっている。
The detachment pin 4 is formed small and lightweight, and is movable up and down in the figure in conjunction with the application of positive and negative air pressures by an air source. In addition, a retaining member 5 is provided to protrude from the internal air passage 2. The illustrated retaining member 5 is composed of a pin that is press-fitted at one location a predetermined length L3 away from the step portion 1c. When the detachment pin 4 moves upward by the suction force at the time of suction by the air source, the engaging portion 4a contacts the retaining member 5 to regulate the movement of the detachment pin 4. At this time, the lower end portion 4b stays in the suction opening 3, and can be returned to the state shown in the drawing (the detachment pin 4 is located in the suction opening 3) when the vacuum is broken. .

【0018】抜け止め部材5は、圧入に限らずネジ込む
構成にできる。また、この抜け止め部材5は、1カ所に
限らず、搬送用ヘッド1の円周上に複数個設ける構成と
してもよい。
The retaining member 5 is not limited to press-fitting but can be screwed. The retaining member 5 is not limited to one location, and may be provided in plural on the circumference of the transport head 1.

【0019】次に、上記構成の搬送用ヘッド1の吸着動
作を図2の動作図を用いて説明する。なお、図中空気路
2内の矢印は、搬送用ヘッド1の上下移動を示すもので
はなく、エア源の圧力方向である。まず、図2(a)に
示すように、搬送用ヘッド1を電子デバイスWの待機箇
所まで移動させた後、エア源で吸引力を発生させる。こ
の際の吸引力により離脱用ピン4は上方に移動し、吸着
用開口部3は吸着面1b部分が開放される。この際、離
脱用ピン4の係合部4aが抜け止め部材5に当接して離
脱用ピン4の移動を規制している。
Next, the suction operation of the transport head 1 having the above configuration will be described with reference to the operation diagram of FIG. It should be noted that the arrows in the air passage 2 in the figure do not indicate the vertical movement of the transport head 1, but indicate the pressure direction of the air source. First, as shown in FIG. 2A, after moving the transport head 1 to the standby position of the electronic device W, a suction force is generated by an air source. At this time, the detachment pin 4 is moved upward by the suction force, and the suction opening 3 is opened at the suction surface 1b. At this time, the engaging portion 4a of the detachment pin 4 abuts on the retaining member 5 to restrict the movement of the detachment pin 4.

【0020】次に、図2(b)に示すように、搬送用ヘ
ッド1を下降させて吸着面1bに電子デバイスWを吸着
させる。この際、搬送用ヘッド1内部(空気路口2及び
吸着用開口部3)は、真空状態となり、離脱用ピン4の
係合部4aが抜け止め部材5より離れる。そして、吸着
用開口部3の長さより長い離脱用ピン4は、図示のよう
に、電子デバイスWの吸着によって長さの差の分だけ、
係合部4a部分が段差部1cから離れる。これにより、
電子デバイスWの吸着状態を保持する。
Next, as shown in FIG. 2 (b), the transport head 1 is lowered to suck the electronic device W on the suction surface 1b. At this time, the inside of the transport head 1 (the air passage opening 2 and the suction opening 3) is in a vacuum state, and the engaging portion 4a of the detaching pin 4 is separated from the retaining member 5. Then, the detachment pin 4 longer than the length of the suction opening 3 is, as shown in FIG.
The engaging portion 4a is separated from the step portion 1c. This allows
The suction state of the electronic device W is maintained.

【0021】次に、図2(c)に示すように、電子デバ
イスWを吸着させた状態で搬送用ヘッド1を移動機構に
より上昇させ、待機箇所から測定箇所まで搬送させる。
Next, as shown in FIG. 2C, the transport head 1 is raised by the moving mechanism while the electronic device W is attracted, and transported from the standby position to the measurement position.

【0022】次に、搬送用ヘッド1を電子デバイスWの
測定箇所まで移動させた後、この搬送用ヘッド1を測定
箇所に下降させる(図2(b)と同じ状態)。この後、
エア源によって真空破壊を行うと、図2(d)に示すよ
うに、真空破壊によって吸着用開口部3から外部に空気
路口2内部の空気が吹き出され、この吹き出しによって
離脱用ピン4は吸着面1bから突出する。この際の突出
長さL4は、図1に示すように、離脱用ピン4の長さL
2−吸着用開口部3の長さL1である。
Next, after moving the transport head 1 to the measurement location of the electronic device W, the transport head 1 is lowered to the measurement location (the same state as in FIG. 2B). After this,
When the vacuum break is performed by the air source, as shown in FIG. 2D, the air inside the air passage opening 2 is blown out from the suction opening 3 to the outside by the vacuum break, and the release pin 4 causes the suction pin 4 to move to the suction surface. 1b. The protrusion length L4 at this time is, as shown in FIG.
2-Length L1 of the suction opening 3.

【0023】離脱用ピン4が吸着面1bから突出するこ
とにより、電子デバイスWを容易に離脱できる。また、
真空破壊によって空気路口2内部の空気が吹き出された
際、離脱用ピン4は、上端の係合部4a部分が段差部1
c部分に接触して、空気路口2と吸着用開口部3との間
の空気路の連通を遮断(閉塞)する。これにより、真空
破壊時に吸着用開口部3から、瞬間的にのみ空気が吹き
出され、係合部4aによって吸着用開口部3からの空気
の吹き出し量を最小にすることができるようになる。
Since the detachment pin 4 projects from the suction surface 1b, the electronic device W can be easily detached. Also,
When the air inside the air passage opening 2 is blown out by the vacuum break, the detaching pin 4 has the upper end engaging portion 4 a at the stepped portion 1.
By contacting the portion c, the communication of the air passage between the air passage opening 2 and the suction opening 3 is blocked (closed). Thereby, air is blown out only momentarily from the suction opening 3 at the time of vacuum breakage, and the amount of air blown out from the suction opening 3 can be minimized by the engagement portion 4a.

【0024】電子デバイスWの測定後には、測定箇所か
ら排出箇所に電子デバイスWを搬送させる。この際、測
定箇所(図2(a))〜排出箇所(図2(d))までの
間で上記同様に電子デバイスWを吸着、搬送させる。こ
の際、排出箇所では、図2(d)に示す状態となるた
め、吸着用開口部3から吹き出す空気を少なくでき、測
定終了し、排出箇所周辺に既に排出されている電子デバ
イスWを吹き飛ばすことがない。
After the measurement of the electronic device W, the electronic device W is transported from the measurement location to the discharge location. At this time, the electronic device W is sucked and conveyed in the same manner as described above between the measurement point (FIG. 2A) and the discharge point (FIG. 2D). At this time, since the state at the discharge location is as shown in FIG. 2D, the amount of air blown out from the suction opening 3 can be reduced, the measurement is completed, and the electronic device W already discharged around the discharge location is blown off. There is no.

【0025】(第2実施形態)次に、図3は、本発明の
電子デバイス搬送装置の要部である搬送ヘッドの第2実
施形態を示す一部拡大断面図である。この第2実施形態
では、開閉用部材として吸着用開口部3部分には、第1
実施形態の離脱用ピン4に代えて開閉用球体14が設け
られる。
(Second Embodiment) Next, FIG. 3 is a partially enlarged sectional view showing a second embodiment of a transport head which is a main part of the electronic device transport apparatus of the present invention. In the second embodiment, the opening / closing member is provided with the first opening 3 in the suction opening portion.
An opening / closing sphere 14 is provided instead of the detachment pin 4 of the embodiment.

【0026】搬送用ヘッド1の吸着面1bには、開閉用
球体14より小さな開口径を有する開口部1baが開口
形成され、内側には、開口部1baに向けて円錐状に傾
斜するテーパー面3aが形成されている。
An opening 1ba having an opening diameter smaller than that of the opening / closing sphere 14 is formed on the suction surface 1b of the transport head 1, and a tapered surface 3a conically inclined toward the opening 1ba is formed inside the opening 1ba. Are formed.

【0027】上記構成によれば、図3(a)に示す状態
(図2(a)相当)において、エア源からの吸引力によ
り、開閉用球体14が開口部1ba部分から上方に離
れ、開口部1baを開放して電子デバイスWを吸引でき
る。この際、開閉用球体14は、抜け止め部材5により
所定距離上方で移動を規制される。電子デバイスWが吸
引されると、吸着用開口部3は真空状態となり、開閉用
球体14は抜け止め部材5より離れる。
According to the above configuration, in the state shown in FIG. 3A (corresponding to FIG. 2A), the opening / closing sphere 14 is separated upward from the opening 1ba by the suction force from the air source, and The electronic device W can be sucked by opening the portion 1ba. At this time, the movement of the opening / closing sphere 14 is restricted by a predetermined distance upward by the retaining member 5. When the electronic device W is sucked, the suction opening 3 is in a vacuum state, and the opening / closing sphere 14 is separated from the retaining member 5.

【0028】以降、搬送用ヘッド1を測定箇所まで移動
させ、下降した後、図3(b)に示す状態(図2(d)
相当)で、エア源による真空破壊を行うと、開口部1b
aから外部に空気が吹き出され、この吹き出しによって
開閉用球体14は吸着面1bから一部が所定量突出す
る。この突出により、電子デバイスWを容易に離脱で
き、同時に、内部の空気が吹き出された際、開閉用球体
14が開口部1ba(テーパー面3a)部分に接触し、
開口部1baを閉塞し空気の吹き出しを止める。
Thereafter, the transport head 1 is moved to the measurement position and lowered, and then the state shown in FIG. 3B (FIG. 2D)
And the air source breaks the vacuum, the opening 1b
Air is blown out to the outside from a, and the blowing sphere causes a part of the opening / closing sphere 14 to project from the suction surface 1b by a predetermined amount. Due to this protrusion, the electronic device W can be easily detached, and at the same time, when the internal air is blown out, the opening / closing sphere 14 comes into contact with the opening 1ba (tapered surface 3a),
The opening 1ba is closed to stop blowing air.

【0029】これにより、第1実施形態同様に真空破壊
時における開口部1baからの空気の吹き出しを最小に
でき、特に排出箇所にて他の電子デバイスWの吹き飛ば
しを防止できるようになる。
Thus, similarly to the first embodiment, the blowing of air from the opening 1ba at the time of vacuum break can be minimized, and the blowing of another electronic device W can be particularly prevented at the discharge location.

【0030】上記各実施形態では、搬送用ヘッド1の吸
着面1bを開閉自在な開閉用部材として棒状の離脱用ピ
ン4、あるいは球状の開閉用球体14を設ける構成とし
たが、これらの形状に限ることなく、各種形状の蓋部材
を用い上記各実施形態の如く開閉の再現性を有する構成
であれば同様に適用することができる。
In each of the above embodiments, the stick-shaped detaching pin 4 or the spherical opening / closing sphere 14 is provided as an opening / closing member capable of opening and closing the suction surface 1b of the transport head 1; The present invention is not limited to the above, and can be similarly applied as long as the configuration has a reproducibility of opening and closing as in the above-described embodiments using lid members of various shapes.

【0031】また、搬送用ヘッド1内部においてこれら
離脱用ピン4、開閉用球体14の移動を規制するために
規制用部材5を設ける構成としたが、離脱用ピン4、開
閉用球体14が、搬送用ヘッド1内部の空気路口2ある
いは吸着用開口部3に対して移動規制されるよう互いに
係合する構成としてもよく、この場合、規制用部材5を
不用にできる。
In addition, although the regulating member 5 is provided to regulate the movement of the release pin 4 and the opening / closing sphere 14 inside the transport head 1, the releasing pin 4 and the opening / closing sphere 14 are It may be configured to engage with each other so as to be restricted from moving with respect to the air passage opening 2 or the suction opening 3 inside the transport head 1, and in this case, the regulating member 5 can be unnecessary.

【0032】また、上記各実施形態では、エア源からの
空路、及び搬送用ヘッド1の空気路口2を単一に構成し
て正、負の空気圧を印加する構成とした。この構成によ
れば、最小の部品点数と接続構成で空路を形成できる。
これに限らず、正圧、負圧を別経路として搬送用ヘッド
1に設けた2カ所の空気路口2にそれぞれ供給する構成
としても良い。
In each of the above-described embodiments, the air path from the air source and the air path port 2 of the transfer head 1 are configured as a single unit to apply positive and negative air pressures. According to this configuration, an air path can be formed with a minimum number of components and a connection configuration.
However, the present invention is not limited to this, and a configuration may be adopted in which the positive pressure and the negative pressure are supplied to the two air passage openings 2 provided in the transport head 1 as separate paths.

【0033】また、本発明は、エア源による正、負の空
気圧により電子デバイスを吸着させたり、離脱させる構
成としたが、搬送用ヘッドを不完全な密閉状態にし、エ
ア源からの負の空気圧を強くすることにより、電子デバ
イスを吸着させることができ、エア源からの負の空気圧
の供給を止めたと同時に不完全な密閉状態なので電子デ
バイスを開閉用部材の自重によって離脱させることもで
きる。この構成によれば、正の空気圧を必要としない。
In the present invention, the electronic device is attracted or desorbed by the positive and negative air pressures of the air source. However, the transfer head is incompletely sealed, and the negative air pressure from the air source is reduced. By increasing the pressure, the electronic device can be adsorbed, the supply of the negative air pressure from the air source is stopped, and at the same time, the electronic device can be detached by the weight of the opening / closing member due to the incompletely closed state. According to this configuration, no positive air pressure is required.

【0034】[0034]

【発明の効果】本発明によれば、開閉用部材がエア源に
より印加される正、負の空気圧によって吸着用開口部内
で移動し、電子デバイスの吸着面を閉塞あるいは開放自
在に構成したので、電子デバイスの離脱時に吸着面から
吹き出される空気を少なくでき、周囲の電子デバイスの
吹き飛ばしを防止できるようになる。これにより電子デ
バイスの搬送を円滑に行え、検査の自動化を推進でき
る。また、吸着用開口部を単一の空路を介して前記エア
源に接続し、真空吸着あるいは真空破壊で前記電子デバ
イスを吸着あるいは離脱させる構成なので、空気圧の印
加の系統数を最小にでき、少ない構成部品で簡単なエア
制御により電子デバイスを吸着搬送できるようになる。
また、搬送ヘッドを小型軽量化でき移動機能を簡単に構
成できるようになる。
According to the present invention, since the opening / closing member is moved within the suction opening by the positive and negative air pressures applied by the air source, the suction surface of the electronic device can be closed or opened freely. It is possible to reduce the amount of air blown from the suction surface when the electronic device is detached, and to prevent the surrounding electronic devices from being blown off. As a result, the electronic device can be transported smoothly, and the automation of the inspection can be promoted. Also, since the suction opening is connected to the air source through a single air path to suck or release the electronic device by vacuum suction or vacuum breakage, the number of systems for applying air pressure can be minimized, and The electronic device can be sucked and conveyed by simple air control using the component parts.
In addition, the transport head can be reduced in size and weight, and the moving function can be easily configured.

【0035】また、吸着用開口部に開閉用部材の移動を
規制する抜け止め部を設けることにより、エア源で加え
られる空気圧で移動する開閉用部材を抜け止めでき、吸
着面の閉塞及び開放の再現性を得ることができ、上記電
子デバイスの吸着、離脱、及びエアの吹き出しの防止効
果を定常化できるようになる。また、吸着用開口部内に
離脱用ピンを設けた構成によれば、電子デバイスの離脱
時には、係合部が段差部に接触してエアの吹き出しを防
止し、かつ吸着面から先端が突出して電子デバイスの離
脱を確実に行えるようになる。
Further, by providing a retaining portion for restricting the movement of the opening / closing member at the suction opening, the opening / closing member moving by the air pressure applied by the air source can be prevented from falling off, and the closing and opening of the suction surface can be prevented. The reproducibility can be obtained, and the effects of preventing the electronic device from being attracted, desorbed, and blown out of air can be stabilized. Further, according to the configuration in which the detachment pin is provided in the suction opening, when the electronic device is detached, the engaging portion contacts the step portion to prevent air from being blown out, and the tip protrudes from the suction surface to prevent the electronic device from being blown out. The device can be reliably detached.

【0036】また、吸着用開口部内に開閉用球体を設け
た構成においても、同様に、電子デバイスの離脱時に
は、開閉用球体が吸着面を閉塞してエアの吹き出しを防
止し、かつ吸着面から球体の一部が突出して電子デバイ
スの離脱を確実に行えるようになる。
Also, in the structure in which the opening / closing sphere is provided in the suction opening, similarly, when the electronic device is separated, the opening / closing sphere closes the suction surface to prevent air from being blown out, and to prevent the air from being blown out. A part of the sphere projects so that the electronic device can be reliably detached.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の電子デバイス搬送装置の第1実施形態
を示す搬送用ヘッドの構成を示す一部裁断正面図。
FIG. 1 is a partially cut front view showing a configuration of a transport head showing a first embodiment of an electronic device transport apparatus of the present invention.

【図2】同搬送用ヘッドの動作図。FIG. 2 is an operation diagram of the transport head.

【図3】第2実施形態の搬送用ヘッドを示す図。FIG. 3 is a diagram illustrating a transport head according to a second embodiment.

【図4】従来の電子デバイス搬送装置の搬送用ヘッドを
示す断面図。
FIG. 4 is a sectional view showing a transfer head of a conventional electronic device transfer device.

【図5】従来の電子デバイス搬送装置の搬送用ヘッドを
示す断面図。
FIG. 5 is a sectional view showing a transfer head of a conventional electronic device transfer device.

【符号の説明】[Explanation of symbols]

1…搬送用ヘッド、1b…吸着面、1ba…開口部、1
c…段差部、2…空気路口、3…吸着用開口部、3a…
テーパー面、4…離脱用ピン、4a…係合部、5…抜け
止め部材、14…開閉用球体。
DESCRIPTION OF SYMBOLS 1 ... Transfer head, 1b ... Suction surface, 1ba ... Opening, 1
c: stepped portion, 2: air passage opening, 3: suction opening, 3a ...
Taper surface, 4 ... detachment pin, 4a ... engagement part, 5 ... retaining member, 14 ... opening / closing sphere.

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 3C007 AS01 AS08 CY03 CY36 DS01 FS01 FT04 NS09 NS14 NS17 5F031 CA01 CA13 GA23 GA24 GA26 MA33 PA08  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3C007 AS01 AS08 CY03 CY36 DS01 FS01 FT04 NS09 NS14 NS17 5F031 CA01 CA13 GA23 GA24 GA26 MA33 PA08

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 筒状の搬送用ヘッド(1)にて電子デバ
イス(W)を空気圧によって吸着させ、前記搬送用ヘッ
ドを移動させることにより前記電子デバイスを搬送する
電子デバイス搬送装置において、 前記筒状の搬送用ヘッドは、 一端部に電子デバイスを吸着するための吸着面(1b)
と、 前記吸着面に開口し、前記開口から他端部まで単一の空
気路を形成してエア源と接続され、前記エア源による正
または負の空気圧を前記吸着面に吸着される前記電子デ
バイスに伝えるための吸着用開口部(3)と、 前記エア源により印加される正または負の空気圧によっ
て前記吸着用開口部内で移動し、前記正の空気圧のとき
は前記吸着用開口部内を閉塞させ前記電子デバイスを離
脱させ、前記負の空気圧のときは前記吸着用開口部内を
開放させ前記電子デバイスを吸着させる開閉用部材
(4,14)と、を備えたことを特徴とする電子デバイ
ス搬送装置。
An electronic device transport apparatus for transporting said electronic device by adsorbing an electronic device (W) by pneumatic pressure with a cylindrical transport head (1) and moving said transport head. The suction head (1b) for adsorbing an electronic device at one end thereof
The electron that is opened to the suction surface, forms a single air path from the opening to the other end, is connected to an air source, and absorbs positive or negative air pressure from the air source on the suction surface. A suction opening (3) for transmitting to the device; and a positive or negative air pressure applied by the air source moves in the suction opening, and when the positive air pressure is applied, closes the suction opening. And an opening / closing member (4, 14) for opening the inside of the suction opening and sucking the electronic device when the negative air pressure is applied. apparatus.
【請求項2】 前記吸着用開口部(3)内には、 前記エア源による負の空気圧の印加時に前記開閉用部材
(4,14)の移動を規制する抜け止め部(5)と、 前記吸着面と前記抜け止め部との間に段差部(1c)と
を備え、 前記開閉用部材は、所定長さ(L2)を有する棒状に形
成され、前記吸着用開口部(3)内で移動する離脱用ピ
ン(4)であり、 該離脱用ピンは、前記吸着面と前記段差部との長さ(L
1)より長く(L2)形成され、前記エア源による正の
空気圧の印加時に前記段差部に接触して前記吸着面(1
b)からの空気の吹き出しを遮断する係合部(4a)を
有し、前記吸着用開口部の閉塞時に前記電子デバイス
(W)を押し出すよう所定長さ(L4)だけ前記吸着面
から先端(4b)が突出するように構成された請求項1
記載の電子デバイス搬送装置。
2. A retaining portion (5) in the suction opening (3) for restricting movement of the opening / closing member (4, 14) when a negative air pressure is applied by the air source; A step (1c) is provided between the suction surface and the retaining portion, and the opening / closing member is formed in a rod shape having a predetermined length (L2) and moves within the suction opening (3). A detaching pin (4), the detaching pin having a length (L) between the suction surface and the step portion.
1) is formed longer (L2) and contacts the step portion when the positive air pressure is applied by the air source to contact the suction surface (1).
b) has an engaging portion (4a) for blocking air from being blown out, and a predetermined length (L4) from the suction surface to push the electronic device (W) when the suction opening is closed. 4. The method of claim 1, wherein 4b) is configured to protrude.
The electronic device transport apparatus according to claim 1.
【請求項3】 前記開閉用部材は、前記吸着面(1b)
部分の開口径より大径な球状の開閉用球体(14)であ
り、 該開閉用球体は、前記エア源からの空気圧により吸着面
への接触時に該吸着面からの空気の吹き出しを遮断する
とともに、前記電子デバイス(W)を押し出すよう該吸
着面から所定量突出自在に構成された請求項1記載の電
子デバイス搬送装置。
3. The opening / closing member includes the suction surface (1b).
A spherical opening / closing sphere (14) having a diameter larger than the opening diameter of the portion, wherein the opening / closing sphere blocks air blowing from the suction surface when contacting the suction surface by air pressure from the air source; 2. The electronic device transport apparatus according to claim 1, wherein the electronic device is configured to be able to protrude by a predetermined amount from the suction surface so as to push out the electronic device.
JP2001119864A 2001-04-18 2001-04-18 Electronic device transport device Pending JP2002313883A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001119864A JP2002313883A (en) 2001-04-18 2001-04-18 Electronic device transport device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001119864A JP2002313883A (en) 2001-04-18 2001-04-18 Electronic device transport device

Publications (1)

Publication Number Publication Date
JP2002313883A true JP2002313883A (en) 2002-10-25

Family

ID=18970008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001119864A Pending JP2002313883A (en) 2001-04-18 2001-04-18 Electronic device transport device

Country Status (1)

Country Link
JP (1) JP2002313883A (en)

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JP2009524379A (en) * 2005-12-30 2009-06-25 ザ ジレット カンパニー High speed assembly actuator
JP2010099733A (en) * 2008-10-27 2010-05-06 Disco Abrasive Syst Ltd Laser beam machining apparatus
JP2013066988A (en) * 2011-09-26 2013-04-18 New Japan Radio Co Ltd Semiconductor element transport head
JP2014236012A (en) * 2013-05-30 2014-12-15 三星ダイヤモンド工業株式会社 Conveyance head of fragile material substrate
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JP2017141115A (en) * 2017-03-29 2017-08-17 三星ダイヤモンド工業株式会社 Carrier head for brittle material substrate
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JP2010099733A (en) * 2008-10-27 2010-05-06 Disco Abrasive Syst Ltd Laser beam machining apparatus
JP2013066988A (en) * 2011-09-26 2013-04-18 New Japan Radio Co Ltd Semiconductor element transport head
JP2014236012A (en) * 2013-05-30 2014-12-15 三星ダイヤモンド工業株式会社 Conveyance head of fragile material substrate
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JPWO2016056115A1 (en) * 2014-10-10 2017-07-20 富士機械製造株式会社 Suction nozzle
US10040205B2 (en) 2014-10-10 2018-08-07 Fuji Machine Mfg. Co., Ltd. Suction nozzle
JP2017141115A (en) * 2017-03-29 2017-08-17 三星ダイヤモンド工業株式会社 Carrier head for brittle material substrate
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