JP2648118B2 - Semiconductor chip pickup mechanism - Google Patents

Abstract

PURPOSE: To surely separate a chip from a suction nozzle without generating a microcrack, a crack or the like in the chip and to transfer the chip on a substrate. CONSTITUTION: A pickup mechanism is provided with a suction nozzle 3, which sucks a chip 17, and a chip press rod 4, which comes into contact with the chip 17 at the same time when the nozzle 4 sucks the chip 17 and applys a static press force to the chip 17, and after the nozzle 3 is separated from the chip 17, the rod 4 is separated from the chip 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip pickup mechanism for picking up a semiconductor chip from a stage, transporting the semiconductor chip, and transferring the semiconductor chip to a substrate.

[0002]

2. Description of the Related Art Conventionally, a semiconductor chip pickup mechanism of this type is attached to a main body as a part of a die mount device, for example, and sucks, holds, and transports a semiconductor chip (hereinafter simply referred to as a chip). This is a mechanism for transferring and bonding chips to a substrate or stem.

FIGS. 5A to 5D are views showing an example of a conventional semiconductor chip pickup mechanism in order of operation. The pickup mechanism of this semiconductor chip is
As shown in FIG. 5, a suction nozzle 3b was provided for bringing the tip of the chip 17 into contact with the surface thereof and evacuating the internal space 10 to suck and hold the chip 17.

Next, the operation of transferring a chip from a stage to a substrate by the semiconductor chip pickup mechanism will be described. First, as shown in FIG. 5A, the suction nozzle 3b descends in the direction of the arrow and the chip 17
Contact with. Then, the internal space 10 is evacuated and the chip 17 is sucked. Next, as shown in FIG. 5B, the suction nozzle 3b moves up after moving up
Stop on. Next, as shown in FIG. 5C, the suction nozzle 3b descends in the direction of the arrow to move the chip 17 to the substrate 20.
Contact. Next, as shown in FIG. 5D, the chip 17 is separated from the suction nozzle 3b by returning the internal space of the suction nozzle 3b to the atmosphere, and the suction nozzle 3b from which the chip 17 has been separated rises in the direction of the arrow. I do.

By repeating this operation, the stage 18
Are mounted on the substrate 20.

[0006]

In the above-described conventional semiconductor chip pickup mechanism, the vacuum in the internal space of the suction nozzle is returned to the atmosphere to remove the chip from the suction nozzle and the suction force is eliminated. The chip does not return to the atmosphere and the chip is sucked by the remaining suction pressure and cannot be detached.The chip moves to the stage with the chip attached to the suction nozzle, or the chip moves while the suction nozzle is moving. It could fall and damage the chip. For this reason, there has been a problem that the operation rate is lowered by stopping the apparatus and the operation rate is reduced, and the yield is reduced due to chip damage.

[0007] In order to more surely detach the chip from the suction nozzle, an attempt has been made to increase the pressure in the internal space and blow it off with air pressure. However, a small chip is scattered, and a large chip is scattered. If not, they only caused misalignment and other problems.

On the other hand, although the field is different, an example of solving this kind of problem is disclosed in Japanese Utility Model Laid-Open No. 63-161417. This is a device that attaches a magnetic head chip to a base.The magnetic head chip in the form of a magnet is magnetized and held by an electromagnetic collet, transported, transferred to the base, demagnetized, and demagnetized. The magnetic head chip is detached from the electromagnetic collet by projecting a non-magnetic chip pressing pin from the magnetic collet.

However, there are the following problems when this magnetic head chip attaching apparatus is applied. One problem is that a chip made of a semiconductor material such as silicon cannot be magnetized and held because of a non-magnetic material.

As for the second problem, there is no description of a mechanism for guaranteeing a position where the tip holding pin is pulled into the electromagnetic collet. This means that if the tip holding pins protrude from the lower end of the electromagnetic collet, there is a risk that the chips may fall due to vibration during conveyance. Further, when the chip holding pin is retracted into the electromagnetic collet, when the chip is detached from the electromagnetic collet, the chip holding pin is accelerated by the retracted distance to give an impact to the chip. As a result, in a semiconductor chip made of a brittle material such as gallium or arsenic, microcracks or cracks are generated on the chip surface by the dynamic pressing force.

Accordingly, it is an object of the present invention to provide a semiconductor chip pickup mechanism which can surely detach a chip from a suction nozzle and transfer it to a substrate without causing microcracks or cracks in the chip. .

[0012]

A feature of the present invention is that in a semiconductor chip pickup mechanism for picking up a semiconductor chip from a stage, transporting the semiconductor chip, and transferring the semiconductor chip to a substrate, the semiconductor chip surface is brought into contact with a front end portion and an internal portion is formed. A suction nozzle capable of vacuum-evacuating the space and sucking and holding the semiconductor chip, returning the internal space to the atmosphere and detaching the semiconductor chip from the tip, and the semiconductor chip and the tip sucked and held by the suction nozzle. After contacting and returning the internal space of the suction nozzle to the atmosphere, the tip in contact with the semiconductor chip is pressed with air pressure to detach the semiconductor chip from the suction nozzle and is disposed coaxially with the suction nozzle. A tip holding rod, and a tip end of the suction nozzle and a tip holding rod, which hold the semiconductor chip when sucking the semiconductor chip. A semiconductor chip pick-up mechanism and a mechanism located between the end portion in the same plane.

It is preferable that the tip holding rod is disposed outside the suction nozzle. Further, it is preferable that a projection amount adjusting mechanism for adjusting an amount of the tip of the tip holding rod projecting downward is provided.

[0014]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing an example of a semiconductor chip pickup mechanism of the present invention. As shown in FIG. 1, this semiconductor chip pickup mechanism 1
And the tip surface 21 are brought into contact with each other to evacuate the internal space 23 to suck and hold the chip 17 and return the internal space 23 to the atmosphere to release the chip 17, and a chip sucked and held by the suction nozzle 3. When the internal space 23 of the suction nozzle 3 is brought back into the atmosphere by contact with the tip 17 and the tip 22, the tip 22 in contact with the chip 17 is pressed with air pressure to release the tip 17 from the suction nozzle 3 and the suction nozzle 3.
And a stopper which is pushed up by a spring 15 coaxial with the tip end surface 21 of the suction nozzle 3 and the tip end surface 22 of the tip holding rod 4 when the tip 17 is sucked. 6 is provided.

Further, the amount of protrusion of the tip holding rod 4 is adjusted to be flush with the surface of the tip end surface 21 of the suction nozzle 3 and the tip end portion 22 of the tip holding rod 4, and the stopper 6 and the flange 9 are adjusted by screws. A mechanism is provided. That is, even if the tip 22 of the tip holding rod 4 is worn out by this adjustment mechanism, the tip face 21 of the suction nozzle 3 and the surface of the tip 22 of the tip holding rod 4 can always be kept flush with each other.

It will be described later that the tip 17 of the suction nozzle 3 is made flush with the surface of the tip end portion 22 of the tip holding rod 4, the upper surface of which is brought into contact with the stopper 6 by the spring 15. This is because, when the chip is pushed away from the chip 17, the chip 17 is detached by applying a static pressing force so as not to cause microcracks or cracks.

Internal empty space 2 for adsorbing chip 17
The evacuation of 3 is performed by a vacuum pump (not shown) through a flexible pipe connected to the vacuum joint 13 of the deaeration hole 11. An open / close valve (not shown) and a leak valve (not shown) for returning the internal space 23 to the atmosphere are attached between the flexible pipe and the vacuum pump.

On the other hand, a static pressing force applied to the tip holding rod 4 for detaching the tip 17 from the suction nozzle 3 is supplied from a compressor (not shown) through a high-pressure air joint 14 attached to the stopper 6 and a flexible pipe. Given by the compressed air supplied. Of course, although not shown in the drawings, a two-way electromagnetic valve is provided between the flexible pipe and the compressor to control the compressed air pressure and supply compressed air or leak compressed air in the flexible pipe. A valve is installed. Then, the regulator adjusts the value of 0.1 according to the strength of the chip 17.
It can be adjusted to an appropriate compressed air pressure in the range of 1 to 3 atmospheres.

A bracket 8 extending from the main body of the apparatus is held between a nut 2 and a flange 9 meshing with the screw of the suction nozzle 3 and is fastened by a fixed nut 7 meshing with a stopper 6 so as not to be loosened by vibration or the like.

FIGS. 2A to 2D are sectional views showing the operation of the semiconductor chip pickup mechanism of FIG. 1 in the order of operation. Next, the operation of the semiconductor chip pickup mechanism will be described. First, as shown in FIG. 2A, the pickup mechanism 1 descends as shown by an arrow, and the tip of the tip holding rod 4 and the tip of the suction nozzle 3 contact the tip 17 on the stage 18. At this time, the pressing force of the tip pressing rod 4 against the tip 17 is almost zero since the tip pressing rod 4 is pushed up by the spring 15 and is in contact with the stopper. The sensor detects this contact and opens the on-off valve to evacuate the internal space.

Next, as shown in FIG. 2B, the pickup mechanism 1 ascends and holds the chip 17 and moves up to the position above the substrate 20 as shown by an arrow. The adhesive 19 on the substrate 20 is brought into contact. Next, the on-off valve of the vacuum pump is closed, the leak valve is opened, and the vacuum in the internal space 23 is released to return to the atmosphere. Then, the vacuum switch detects the return to the atmosphere, the leak valve closes, and the two-way solenoid valve operates to supply compressed air.
Is pressed by the tip of the tip holding rod 4 with a pressing force of about 0.5 atm, for example, and is bonded. Then, when the pickup mechanism 1 moves up as shown by the arrow, the tip 17
Is detached from the suction nozzle 3 and is securely mounted on the substrate 20.

Then, as shown in FIG.
The pickup mechanism rises as shown by the arrow, and the lower surface of the flange of the tip holding rod 4 is pressed against the end face 10a of the pneumatic chamber of the suction nozzle 3, so that the amount of protrusion of the tip is constant. Then, when the pickup mechanism has finished ascending, the two-way solenoid valve is operated, the compressed air that has given the pressing force to the tip holding rod is released, and the tip holding rod 4 is raised by the repulsive force of the spring 15 and the tip end is attracted. It is flush with the tip end surface of the nozzle 3. Then, the pickup mechanism moves to the original position in the stage direction, and newly picks up another chip 17 as shown in FIG.

FIG. 3 is a sectional view showing another embodiment of the semiconductor chip pickup mechanism of the present invention. This semiconductor chip pickup mechanism 1a is different from the above-described embodiment in that the chip holding rod 4a is provided outside the suction nozzle 3a. Further, instead of directly applying a pressing force to the tip holding rod by pneumatic pressure as in the above-described embodiment, indirectly from the air cylinder 16 attached to the flange 9a for fixing the bracket 8 of the apparatus body in cooperation with the nut 2a. Has given to.

In addition, although the adjusting mechanism for adjusting the amount of protrusion of the tip holding rod 4a is different in size, the same screw feed mechanism as in the above-described embodiment is used and the fixing nut 5 is used for fixing.
Is used. In addition, the vacuum evacuation of the internal space 23a for adsorbing chips is performed by a vacuum pump through a vacuum joint and a flexible pipe as in the above-described embodiment. Further, a spring 1 for raising the suction nozzle 3a
5a, a piston rod at the stroke end of the air cylinder 16 is used as a stopper for determining the upper limit position.

FIG. 4 is a sectional view showing the operation of the semiconductor chip pickup mechanism of FIG. 3 in order of operation. First, as shown in FIG. 4A, the pickup mechanism 1a descends as shown by the arrow, and the tip holding rod 4
The leading end of the suction nozzle 3a contacts the tip 17 on the stage 18. At this time, the suction nozzle 3a descends downward against the repulsive force of the spring 15a, abuts the shoulder against the end face 10a, and the tip is flush with the tip of the tip holding rod 4a. Then, this contact is detected by a sensor, the opening / closing valve is opened, and the internal space 23a is evacuated to vacuum, and the suction nozzle 3a holds the chip 17 by suction.

Next, as shown in FIG.
The pick-up mechanism 1a, which has sucked and held the substrate 7, moves up and moves down again as shown by the arrow, and
9 and the chip 17 are brought into contact. At this time, the chip holding rod 4a also comes into contact with the chip 17, and the chip 17 is cut into the adhesive 19 layer and adhered to the substrate 20 by the suction nozzle 3a.

After a predetermined time has elapsed, the on-off valve of the vacuum pump is closed and the leak valve is opened, so that the internal space 23a returns to the atmosphere and, at the same time, the piston rod of the air cylinder 16 is turned off, as shown in FIG. The suction nozzle 3a moves away from the substrate 20 by the repulsive force of the spring 15a. But,
The tip holding rod 4a maintains the state where the tip 17 is held.

Next, as shown in FIG. 4 (d), when the suction nozzle 3a is completely raised and reaches the rod end of the air cylinder 16, the pickup mechanism 1a is raised, and as shown in FIG.
Return to the position shown in FIG. Then, the same operation is repeated to mount the chips 17 on the stage 18 on the respective substrates 20.

Here, the adjustment procedure when the tip of the suction nozzle 3a is not located on the same plane as the tip of the tip holding rod 4a due to wear or the like will be described with reference to FIG.

First, in a state where the piston rod of the air cylinder 16 projects most, a block having a flat surface is applied to the tip of the suction nozzle 3a instead of the chip 17. At this time, there is a gap between the tip of the tip holding rod 4a and the block. Then, the fixing nut 5 is loosened to adjust the screw portion of the tip holding rod 4a to eliminate the gap between the tip and the block. If there is no gap, fix it with the fixing nut 5 so that the screw part does not come loose.

The pickup mechanism in this embodiment is
Since the tip holding part is arranged outside the suction part,
There is an advantage that a portion for holding the chip can be stably held without tilting near the outer peripheral edge of the chip. In view of this, the pickup mechanism of this embodiment is effective for a relatively large chip. .

[0033]

As described above, according to the present invention, the tip holding rod is provided which comes into contact with the chip at the same time as the nozzle for sucking the chip and provides a static pressing force, and the tip holding rod is released after the nozzle is detached from the chip. Since the chips are separated, there is an effect that the chips can be surely separated from the nozzles and transferred to the substrate. In addition, it has a function to keep the tip of the tip holder and the tip of the nozzle in the same plane, and presses the tip with static pressure after it comes in contact with the tip, so incomplete suction to the chip that occurred during chip suction Also, there is an effect that microcracks and cracks do not occur in the chip.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of a semiconductor chip pickup mechanism of the present invention.

FIG. 2 is a sectional view illustrating an operation of a pickup mechanism of the semiconductor chip of FIG. 1 in order of operation.

FIG. 3 is a sectional view showing another embodiment of the semiconductor chip pickup mechanism of the present invention.

FIG. 4 is a cross-sectional view illustrating an operation of the semiconductor chip pickup mechanism of FIG. 3 in order of operation.

FIG. 5 is a view illustrating an example of a conventional semiconductor chip pickup mechanism in the order of operations for explaining the example.

[Explanation of symbols]

 1, 1a Pickup mechanism 2, 2a Nut 3, 3a, 3b Suction nozzle 4, 4a Tip holding rod 5, 7 Fixing nut 6 Stopper 8 Bracket 9, 9a Flange 10, 23, 23a Internal space 11 Deaeration hole 13, 13a Vacuum joint Reference Signs List 14 High-pressure air joint 15, 15a Spring 16 Air cylinder 17 Chip 18 Stage 19 Adhesive 20 Substrate 21 Tip surface 22 Tip

Claims (3)

(57) [Claims] 1. A semiconductor chip pickup mechanism for picking up a semiconductor chip from a stage, transporting the semiconductor chip to a substrate, and transferring the semiconductor chip to a substrate. A suction nozzle that can hold and return the internal space to the atmosphere and release the semiconductor chip from the tip, and contact the tip with the semiconductor chip sucked and held by the suction nozzle to reduce the internal space of the suction nozzle. After returning to the atmosphere, the tip in contact with the semiconductor chip is pressed with air pressure to separate the semiconductor chip from the suction nozzle and a chip holding rod disposed coaxially with the suction nozzle, and the semiconductor chip is A mechanism for positioning the tip of the suction nozzle and the tip of the tip holding rod in the same plane when sucking And a semiconductor chip pickup mechanism. 2. The semiconductor chip pickup mechanism according to claim 1, wherein said tip holding rod is disposed outside said suction nozzle. 3. The semiconductor chip pickup mechanism according to claim 1, further comprising: a protrusion amount adjusting mechanism for adjusting an amount by which a tip portion of the chip pressing rod projects downward.