TW201911449A - Semiconductor manufacturing device and method of manufacturing semiconductor device - Google Patents

Semiconductor manufacturing device and method of manufacturing semiconductor device Download PDF

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Publication number
TW201911449A
TW201911449A TW107115701A TW107115701A TW201911449A TW 201911449 A TW201911449 A TW 201911449A TW 107115701 A TW107115701 A TW 107115701A TW 107115701 A TW107115701 A TW 107115701A TW 201911449 A TW201911449 A TW 201911449A
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chuck
head
opening
closing arm
die
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TW107115701A
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Chinese (zh)
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TWI676226B (en
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牧浩
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日商捷進科技有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Abstract

To provide a semiconductor manufacturing device including a collet replacement part allowing mounting and dismounting of a collet having a plurality of external sizes. A semiconductor manufacturing device comprises a collet holder for holding a collet by a magnet, a head including the collet holder at a tip of the head and for absorbing and picking up a die by the collet, a collet replacement part for collet replacement, and a control device for controlling the head and the collect replacement part. The collet replacement part comprises a collet clamp part including an opening and closing arm having a claw structure and an opening and closing arm control device for controlling the opening and closing arm. The collet holder includes a claw relief part of the opening and closing arm. The control device mounts and dismounts the collet on and from the collet holder by moving up and down the head by opening and closing the opening and closing arm.

Description

半導體製造裝置及半導體裝置的製造方法Semiconductor manufacturing device and method for manufacturing semiconductor device

本案是有關半導體製造裝置，例如，可適用於將磁石內藏於夾頭夾具的黏晶機(die bonder)。This case relates to a semiconductor manufacturing apparatus, and is applicable to, for example, a die bonder in which a magnet is built in a chuck.

在半導體裝置的製造工程的一部分，將半導體晶片(以下簡稱晶粒)搭載於配線基板或導線架等(以下簡稱基板)而組合封裝的工程的一部分，有從半導體晶圓(以下簡稱晶圓)分割晶粒的工程，及將分割後的晶粒搭載於基板上的接合工程。被使用於接合工程的半導體製造裝置為黏晶機等的黏晶裝置。 　　接合工程是從切割膠帶來一個一個剝離從晶圓分割的晶粒，使用被稱為夾頭的吸附治具來接合於基板上。 　　如此的黏晶機是按照品種(晶粒大小)來更換夾頭，或為了防止晶粒的表面的傷或污染，而須提高接觸於晶粒的表面的夾頭的更換頻率。(例如日本特開2014-56978號公報(專利文獻1))。 [先前技術文獻] [專利文獻]As part of the manufacturing process of semiconductor devices, a part of the process of mounting a semiconductor wafer (hereinafter referred to as a die) on a wiring board, a lead frame, etc. (hereinafter referred to as a substrate) and combining packages includes a semiconductor wafer (hereinafter referred to as a wafer). A process of dividing the crystal grains and a joining process of mounting the divided crystal grains on a substrate. The semiconductor manufacturing apparatus used in the bonding process is a die bonding apparatus such as a die bonding machine. The bonding process is to peel the dies separated from the wafer one by one from the dicing tape, and use a suction jig called a chuck to bond to the substrate. In this type of die attacher, the chuck is replaced according to the type (grain size), or the frequency of replacement of the chuck in contact with the surface of the die must be increased in order to prevent injury or contamination of the surface of the die. (For example, Japanese Patent Application Laid-Open No. 2014-56978 (Patent Document 1)). [Prior Art Literature] [Patent Literature]

[專利文獻1]日本特開2014-56978號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-56978

(發明所欲解決的課題)(Problems to be solved by the invention)

專利文獻1是利用配合夾頭大小而構成的夾頭更換部的爪來旋轉夾頭夾具而進行磁石固定式的夾頭的卸下及安裝。但，在磁石固定式夾頭是有複數的外形尺寸，無法以同樣的構造來進行卸下及安裝。 　　本案的課題是在於提供一種具備可進行複數的外形尺寸的夾頭的安裝及卸下的夾頭更換部之半導體製造裝置。 　　其他的課題及新穎的特徵是可由本說明書的記述及附圖明確得知。 (用以解決課題的手段)Patent Document 1 uses a claw of a chuck replacement part configured to fit the size of a chuck to rotate a chuck jig to remove and attach a magnet-fixed chuck. However, the magnet fixed chuck has a plurality of external dimensions, and cannot be removed and attached with the same structure. The object of the present application is to provide a semiconductor manufacturing apparatus including a chuck replacement unit that can mount and remove chucks in a plurality of external dimensions. Other problems and novel features can be clearly understood from the description of this specification and the drawings. (Means for solving problems)

本案之中代表者的概要簡單說明如下。 　　亦即，半導體製造裝置係具備： 　　夾頭夾具，其係以磁石來保持夾頭； 　　頭，其係於前端具備該夾頭夾具，以前述夾頭來吸附拾取晶粒； 　　夾頭更換部，其係更換前述夾頭；及 　　控制裝置，其係控制前述頭及前述夾頭更換部。 　　前述夾頭更換部係具備夾頭夾鉗部，其係具有：具有爪構造的開閉臂，及控制前述開閉臂的開閉臂控制裝置。 　　前述夾頭夾具係具備前述開閉臂的爪的逃避部。 　　前述控制裝置係使前述開閉臂開閉，使前述頭上下，藉此進行前述夾頭之朝前述夾頭夾具的安裝，及前述夾頭之從前述夾頭夾具的卸下。 [發明的效果]The summary of the representatives in this case is briefly explained as follows. That is, the semiconductor manufacturing apparatus includes: (1) a chuck clamp, which holds the chuck with a magnet; a chuck, which is provided with the chuck clamp at the front end, and uses the aforementioned chuck to adsorb and pick up crystal grains; (ii) a chuck replacement section, which The chuck is replaced; and the control device controls the chuck and the chuck replacement section. The chuck replacement unit includes a chuck clamp unit, which includes an opening / closing arm having a claw structure, and an opening / closing arm control device which controls the opening / closing arm. The chuck jig is an escape portion including the claws of the opening / closing arm. The control device opens and closes the opening-closing arm, moves the head up and down, thereby mounting the chuck to the chuck and removing the chuck from the chuck. [Effect of the invention]

若根據上述半導體製造裝置，則可進行複數的外形尺寸的夾頭的安裝及卸下。According to the semiconductor manufacturing apparatus described above, attachment and detachment of a plurality of external chucks can be performed.

以下，利用圖面來說明有關實施例。但，在以下的說明中，對同一構成要素是附上同一符號，省略重複的說明。另外，為了使說明更明確，圖面相較於實際的形態，有時模式性地表示有關各部的寬度、厚度、形狀等，但終究是其一例，不是限定本發明的解釋者。 [實施例]Hereinafter, the embodiments will be described using drawings. However, in the following description, the same components are denoted by the same reference numerals, and redundant descriptions are omitted. In addition, in order to clarify the description, the drawing may be schematically shown in terms of the width, thickness, shape, and the like of each part compared with the actual form, but it is an example after all, and it is not an interpreter to limit the present invention. [Example]

圖1是表示黏晶機的構成例的俯視圖。圖2是表示在圖1中由箭號A方向來看時的構成的圖。FIG. 1 is a plan view showing a configuration example of a die bonder. FIG. 2 is a diagram showing a configuration when viewed from an arrow A direction in FIG. 1.

黏晶機10是大致區別具有：供給安裝於基板S的晶粒D的晶粒供給部1、拾取部2、中間平台部3、接合部4、搬送部5、基板供給部6、基板搬出部7及監視控制各部的動作的控制裝置8，該基板S是印刷一個或複數個的成為最終1封裝的製品區域(以下稱為封裝區域P)。Y軸方向為黏晶機10的前後方向，X軸方向為左右方向。晶粒供給部1會被配置於黏晶機10的前面側，接合部4會被配置於後面側。The die attacher 10 is roughly distinguished from a die supply unit 1, a pick-up unit 2, an intermediate stage portion 3, a bonding unit 4, a transfer unit 5, a substrate supply unit 6, and a substrate carry-out unit that supply die D mounted on a substrate S. 7 and a control device 8 that monitors and controls the operation of each unit, and the substrate S is printed with one or a plurality of product areas (hereinafter referred to as a package area P) to be a final package. The Y-axis direction is the front-back direction of the die attach machine 10, and the X-axis direction is the left-right direction. The die supply section 1 is arranged on the front side of the die attacher 10, and the bonding section 4 is arranged on the rear side.

首先，晶粒供給部1是供給安裝於基板S的封裝區域P的晶粒D。晶粒供給部1是具有：保持晶圓11的晶圓保持台12，及從晶圓11頂起晶粒D之以虛線所示的頂起單元13。晶粒供給部1是藉由未圖示的驅動手段來移動於XY方向，使拾取的晶粒D移動至頂起單元13的位置。First, the die supply unit 1 is a die D that supplies a package region P mounted on a substrate S. The die supply unit 1 includes a wafer holding table 12 that holds a wafer 11, and an ejection unit 13 shown by a broken line in which the die D is ejected from the wafer 11. The die supply unit 1 is moved in the XY direction by a driving means (not shown), and the picked-up die D is moved to the position of the jack unit 13.

拾取部2是具有： 　　拾取晶粒D的拾取頭21； 　　使拾取頭21移動於Y方向的拾取頭的Y驅動部23；及 　　使夾頭22昇降、旋轉及X方向移動之未圖示的各驅動部。 　　拾取頭21是具有將被頂起的晶粒D吸附保持於前端的夾頭22(圖2也參照)，從晶粒供給部1拾取晶粒D，載置於中間平台31。拾取頭21是具有使夾頭22昇降、旋轉及X方向移動之未圖示的各驅動部。The pick-up section 2 includes: (i) a pick-up head 21 that picks up the die D; (ii) a Y-driving section 23 that picks up the pick-up head 21 in the Y direction; and (not shown) each of the chuck 22 that moves up, down, and rotates the chuck 22. Drive section. The pick-up head 21 is a chuck 22 (see also FIG. 2) that holds and holds the jacked-up crystal grains D at the front end, picks up the crystal grains D from the crystal grain supply unit 1, and places them on the intermediate stage 31. The pick-up head 21 includes drive units (not shown) for raising, lowering, rotating, and moving the chuck 22 in the X direction.

中間平台部3是具有：暫時性地載置晶粒D的中間平台31，及用以識別中間平台31上的晶粒D的平台識別攝影機32。The intermediate stage unit 3 includes an intermediate stage 31 on which the die D is temporarily placed, and a stage identification camera 32 for identifying the die D on the intermediate stage 31.

接合部4是從中間平台31拾取晶粒D，接合於被搬送來的基板S的封裝區域P上，或以層疊於已被接合於基板S的封裝區域P上的晶粒上的形式接合。 　　接合部4是具有： 　　具備與拾取頭21同樣將晶粒D吸附保持於前端的夾頭42(圖2也參照)的接合頭41； 　　使接合頭41移動於Y方向的Y驅動部43；及 　　攝取基板S的封裝區域P的位置識別標記(未圖示)，識別接合位置的基板識別攝影機44。 　　藉由如此的構成，接合頭41是根據平台識別攝影機32的攝像資料來修正拾取位置･姿勢，從中間平台31拾取晶粒D，根據基板識別攝影機44的攝像資料來將晶粒D接合於基板S的封裝區域P。The bonding portion 4 picks up the die D from the intermediate stage 31 and is bonded to the package area P of the transferred substrate S, or is bonded to the die stacked on the package area P of the substrate S. The joint portion 4 includes: a joint head 41 provided with a chuck 42 (also referred to in FIG. 2) for holding and holding the crystal grain D on the front end similarly to the pickup head 21; ； a Y drive portion 43 which moves the joint head 41 in the Y direction; and A substrate identification camera 44 that picks up a position identification mark (not shown) of the package area P of the substrate S and recognizes the bonding position. With this configuration, the bonding head 41 corrects the pickup position and posture based on the imaging data of the platform recognition camera 32, picks up the die D from the intermediate platform 31, and bonds the die D to the substrate based on the imaging data of the substrate recognition camera 44. The package area P of S.

搬送部5是抓住基板S搬送的基板搬送爪51，及基板S移動的搬送道52。基板S是以沿著搬送道52而設之未圖示的滾珠螺桿來驅動被設在搬送道52的基板搬送爪51的螺帽，藉此移動。藉由如此的構成，基板S是從基板供給部6沿著搬送道52來移動至接合位置，接合後，移動至基板搬出部7，將基板S交給基板搬出部7。The transfer unit 5 is a substrate transfer claw 51 that holds the substrate S and a transfer path 52 that moves the substrate S. The substrate S is moved by driving a nut of a substrate transfer claw 51 provided on the transfer path 52 with a ball screw (not shown) provided along the transfer path 52. With such a configuration, the substrate S is moved from the substrate supply section 6 to the bonding position along the conveyance path 52, and after the bonding, the substrate S is moved to the substrate carrying-out section 7 and the substrate S is handed over to the substrate carrying-out section 7.

控制裝置8是具備： 　　儲存監視控制黏晶機10的各部的動作的程式(軟體)的記憶體；及 　　實行被儲存於記憶體的程式的中央處理裝置(CPU)。The control device 8 is provided with: (i) a memory that stores a program (software) that monitors and controls the operation of each unit of the die attacher 10; and (ii) a central processing unit (CPU) that executes the program stored in the memory.

其次，利用圖3及圖4來說明有關晶粒供給部1的構成。圖3是表示圖1的晶粒供給部的外觀立體圖的圖。圖4是表示圖3的晶粒供給部的主要部的概略剖面圖。Next, the structure of the crystal grain supply part 1 is demonstrated using FIG.3 and FIG.4. FIG. 3 is a diagram showing an external perspective view of the die supply unit of FIG. 1. FIG. 4 is a schematic cross-sectional view showing a main part of the crystal grain supply unit of FIG. 3.

晶粒供給部1是具備：移動於水平方向(XY方向)的晶圓保持台12，及移動於上下方向的頂起單元13。晶圓保持台12是具有：保持晶圓環14的擴張環15，及被保持於晶圓環14，將黏著有複數的晶粒D的切割膠帶16定位於水平的支撐環17。頂起單元13是被配置於支撐環17的內側。The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY direction), and a jacking unit 13 that moves in the vertical direction. The wafer holding table 12 includes an expansion ring 15 that holds the wafer ring 14 and a support ring 17 that is held by the wafer ring 14 and positions a dicing tape 16 to which a plurality of dies D are adhered. The jacking unit 13 is arranged inside the support ring 17.

晶粒供給部1是在晶粒D的頂起時，使保持晶圓環14的擴張環15下降。其結果，被保持於晶圓環14的切割膠帶16會被拉伸，晶粒D的間隔會擴大，藉由頂起單元13從晶粒D下方頂起晶粒D，使晶粒D的拾取性提升。另外，隨著薄型化，將晶粒黏著於基板的黏著劑是由液狀成為薄膜狀，在晶圓11與切割膠帶16之間貼附被稱為晶粒黏結薄膜(die attach film)(DAF)18的薄膜狀的黏著材料。在具有晶粒黏結薄膜18的晶圓11中，切割是對於晶圓11與晶粒黏結薄膜18進行。因此，剝離工程是從切割膠帶16剝離晶圓11與晶粒黏結薄膜18。The die supply unit 1 lowers the expansion ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held by the wafer ring 14 will be stretched, and the interval between the crystal grains D will be enlarged. Sexual improvement. In addition, as the thickness becomes thinner, the adhesive that adheres the crystal grains to the substrate changes from a liquid state to a thin film state, and is called a die attach film (DAF) between the wafer 11 and the dicing tape 16. ) 18 film-like adhesive material. In the wafer 11 having the die-bonding film 18, dicing is performed on the wafer 11 and the die-bonding film 18. Therefore, in the peeling process, the wafer 11 and the die bonding film 18 are peeled from the dicing tape 16.

拾取頭21是具有吸附空氣流動於中心的吸附孔21a，具備：在前端側連接至夾頭夾具25的夾頭柄21b，及將夾頭夾具25固定於夾頭柄21b的夾頭固定部21c。接合頭41是與拾取頭21同樣。The pick-up head 21 has a suction hole 21a that sucks air flowing in the center, and includes a chuck handle 21b connected to the chuck holder 25 at the front end side, and a chuck fixing portion 21c that fixes the chuck holder 25 to the chuck handle 21b. . The bonding head 41 is the same as the pickup head 21.

其次，利用圖5、6來說明有關夾頭夾具。圖5、6是用以說明在圖1的黏晶機使用的夾頭夾具的圖，圖5是拾取頭、夾頭夾具及夾頭的剖面圖，圖6是夾頭夾具的俯視圖。Next, the chuck fixture will be described with reference to FIGS. 5 and 6. 5 and 6 are diagrams for explaining a chuck jig used in the die attacher of FIG. 1, FIG. 5 is a cross-sectional view of a pickup head, a chuck jig, and a chuck, and FIG. 6 is a plan view of the chuck jig.

夾頭夾具25是具備：在中心連通至拾取頭21的吸附孔21a的吸附孔25a，及固定夾頭22的磁石25b。夾頭夾具25是在四邊的各中央附近具有缺口(退爪槽)251c，使形成夾頭更換治具可把持夾頭。以藉由磁石25b來吸引夾頭22而可安裝夾頭22的方式，夾頭夾具25的開口部是形成越下方越寬的錐狀。The chuck jig 25 is provided with a suction hole 25 a that communicates with the suction hole 21 a of the pickup head 21 at the center, and a magnet 25 b that fixes the chuck 22. The chuck jig 25 has notches (claw-retracting grooves) 251c near the centers of the four sides, so that the chuck can be held by forming a chuck replacement jig. The chuck 22 can be attached by attracting the chuck 22 by the magnet 25b, and the opening of the chuck jig 25 is formed in a tapered shape that widens downward.

夾頭22是能以磁石固定的方式，在矽橡膠等的彈性體22a的背面熔敷不鏽鋼(SUS(磁性))22b，將4邊保持於夾頭夾具25，為了吸附晶粒D，而具備連通至吸附孔251a的複數的吸附孔(未圖示)。在彈性體22a的表面是具有與晶粒D接觸而保持的保持部22c。保持部22c是與彈性體22a一體形成，與晶粒D同程度的大小。The chuck 22 can be magnet-fixed, and a stainless steel (SUS (magnetic)) 22b can be welded on the back surface of an elastic body 22a such as silicone rubber. The chuck 22 is held on the chuck holder 25 by four sides. A plurality of suction holes (not shown) communicated with the suction holes 251a. The surface of the elastic body 22a includes a holding portion 22c that is held in contact with the crystal grains D and held. The holding portion 22c is formed integrally with the elastic body 22a and has the same size as that of the crystal grain D.

雖針對拾取頭21進行說明，但接合頭41也同樣。Although the pickup head 21 is described, the same is true of the bonding head 41.

其次，利用圖7、8來說明有關夾頭更換部。圖7是在圖1的黏晶機所具備的夾頭更換部的俯視圖。圖8是圖7的A1-A2線剖面圖。Next, the chuck replacement part will be described using FIGS. 7 and 8. FIG. 7 is a plan view of a chuck replacement portion included in the die attacher of FIG. 1. FIG. 8 is a sectional view taken along the line A1-A2 in FIG. 7.

夾頭更換部90是具備： 　　夾頭夾鉗部91，其係具有：夾鉗夾頭側面，在上部持有爪構造的開閉臂91a，及控制開閉臂91a的開閉的臂控制部91b； 　　供給部92，其係供給未使用的夾頭；及 　　廢棄部93，其係廢棄使用完了的夾頭。 　　開閉臂91a是可配合夾頭的最大寬度來打開。如圖8所示般，開閉臂91a是若閉合，則可夾鉗固定夾頭側面，固定後的狀態是爪91aa會被配置於上部的左右2處。供給部92與廢棄部93是在上側具備開口部92k、93k。供給部92及廢棄部93是被配置於不影響拾取動作或接合動作的場所，拾取頭21及接合頭41的動作可能範圍以外為理想。夾頭夾鉗部91、供給部92及廢棄部93是被配置於橫方向的一直線上、夾頭夾鉗部91是移動於橫方向。另外、夾頭夾鉗部91是亦可設為移動於水平方向(X方向、Y方向)及垂直方向。The chuck replacement unit 90 is provided with: (1) a chuck clamp portion 91, which includes: an opening and closing arm 91a holding a claw structure on the side of the clamping chuck, and an arm control portion 91b that controls opening and closing of the opening and closing arm 91a; The part 92 is for supplying an unused collet, and the discarding part 93 is for discarding the used collet. The opening and closing arm 91a can be opened in accordance with the maximum width of the chuck. As shown in FIG. 8, when the opening / closing arm 91 a is closed, the side of the chuck can be fixed by clamps. After the fixing state, the claws 91 aa are arranged at the left and right two places. The supply part 92 and the waste part 93 are provided with opening parts 92k and 93k on the upper side. The supply unit 92 and the discarding unit 93 are disposed in a place that does not affect the pickup operation or the joining operation, and it is preferable that the pickup head 21 and the joining head 41 operate outside the possible range. The chuck jaw section 91, the supply section 92, and the discard section 93 are arranged on a straight line in the horizontal direction, and the chuck jaw section 91 moves in the horizontal direction. The chuck jaw portion 91 may be moved in the horizontal direction (X direction, Y direction) and the vertical direction.

其次，利用圖9~圖11來說明有關在夾頭更換部90中，將夾頭22安裝於夾頭夾具25的方法及卸下的方法。圖9是表示夾頭被把持於開閉臂，從夾頭夾具分離的狀態的圖，圖9(A)是俯視圖，圖9(B)是剖面圖，圖9(C)是側面圖。圖10是表示夾頭被把持於開閉臂，被固定於夾頭夾具的狀態的圖，圖10(A)是俯視圖，圖10(B)是剖面圖，圖10(C)是側面圖。圖11是表示夾頭被固定於夾頭夾具，開閉臂分離的狀態的圖，圖11(A)是俯視圖，圖11(B)是剖面圖，圖11(C)是側面圖。Next, a method of attaching and removing the chuck 22 to the chuck jig 25 in the chuck replacement unit 90 will be described with reference to FIGS. 9 to 11. FIG. 9 is a view showing a state in which the chuck is held by the opening-closing arm and separated from the chuck jig, FIG. 9 (A) is a plan view, FIG. 9 (B) is a cross-sectional view, and FIG. 9 (C) is a side view. FIG. 10 is a view showing a state in which the chuck is held by the opening-closing arm and fixed to the chuck jig, FIG. 10 (A) is a plan view, FIG. 10 (B) is a cross-sectional view, and FIG. 10 (C) is a side view. FIG. 11 is a view showing a state where the chuck is fixed to the chuck and the opening and closing arms are separated; FIG. 11 (A) is a plan view; FIG. 11 (B) is a cross-sectional view; and FIG. 11 (C) is a side view.

首先，說明有關將夾頭22安裝於夾頭夾具25的方法。控制裝置8是使夾頭夾鉗部91移動至供給部92的上方。控制裝置8是使供給部92內的夾頭22上昇至碰觸到開閉臂91a的爪為止。控制裝置8是藉由開閉臂91a來夾鉗上昇後的夾頭22。如圖9所示般，控制裝置8是將夾鉗夾頭22後的夾頭夾鉗部91搬送至更換位置(中間平台31的上方)。控制裝置8是藉由平台識別攝影機32來對夾頭外形進行位置識別。亦可用條碼等來進行品種判定。First, a method for attaching the chuck 22 to the chuck jig 25 will be described. The control device 8 moves the chuck jaw portion 91 above the supply portion 92. The control device 8 raises the collet 22 in the supply part 92 until it hits the claw of the opening-closing arm 91a. The control device 8 clamps the raised chuck 22 by the opening / closing arm 91a. As shown in FIG. 9, the control device 8 transfers the chuck jaw portion 91 behind the chuck jaw 22 to the replacement position (above the intermediate platform 31). The control device 8 recognizes the shape of the chuck by the platform recognition camera 32. It is also possible to use a bar code or the like to determine the variety.

如圖10所示般、控制裝置8是使無夾頭的狀態的夾頭夾具25下降來安裝夾頭22。有關夾頭夾鉗狀態的精度(姿勢)是不嚴格，使夾頭夾具25接近，以磁石251b的磁力來吸起夾頭夾具25，藉此夾頭22是自己被定位安裝於夾頭夾具25內。如上述般，夾頭夾具25是在上下左右具有退爪槽251C。如圖11所示般，控制裝置8是開放開閉臂91a，使夾頭夾鉗部91移動至預定的位置。As shown in FIG. 10, the control device 8 attaches the chuck 22 by lowering the chuck jig 25 in a chuckless state. The accuracy (posture) of the state of the chuck clamp is not strict. The chuck clamp 25 is approached, and the chuck clamp 25 is attracted by the magnetic force of the magnet 251b, whereby the chuck 22 is positioned and installed on the chuck clamp 25 by itself. Inside. As described above, the chuck jig 25 has the withdrawal claw grooves 251C at the upper, lower, left, and right sides. As shown in FIG. 11, the control device 8 opens the opening / closing arm 91a, and moves the chuck | clamp part 91 to a predetermined position.

其次，說明有關從夾頭夾具25卸下夾頭22的方法。如圖11所示般，控制裝置8是在開放開閉臂91a的狀態下使夾頭夾鉗部91移動至卸下位置。如圖10所示般，控制裝置8是藉由開閉臂91a來夾鉗夾頭22。如圖9所示般，控制裝置8是在開閉臂91a夾鉗夾頭22的狀態下使夾頭夾具25上昇，從夾頭夾具25卸下夾頭22。控制裝置8是開閉臂91a所夾鉗的(卸下後的)夾頭22移送至廢棄部93的上方，開放開閉臂91a而使夾頭22落下，收納於廢棄部93。Next, a method for removing the chuck 22 from the chuck jig 25 will be described. As shown in FIG. 11, the control device 8 moves the chuck clamp portion 91 to the unloading position in a state where the opening-closing arm 91 a is opened. As shown in FIG. 10, the control device 8 clamps the chuck 22 by the opening / closing arm 91a. As shown in FIG. 9, the control device 8 raises the chuck jig 25 in a state where the opening / closing arm 91 a clamps the chuck 22, and removes the chuck 22 from the chuck jig 25. The control device 8 transfers (removed) the chuck 22 clamped by the opening / closing arm 91 a to the upper portion of the discarding section 93, opens the opening / closing arm 91 a to drop the chuck 22, and stores it in the discarding section 93.

雖說明有關拾取頭21的夾頭的更換，但接合頭41的夾頭的更換也同樣。Although the replacement of the chuck of the pickup head 21 will be described, the same applies to the replacement of the chuck of the joint head 41.

如圖7所示般，說明有關縱長夾頭(縱長夾頭夾具)，但如圖11所示般，在橫長夾頭(橫長夾頭夾具)也可適用。As shown in FIG. 7, the longitudinal collet (longitudinal collet jig) will be described, but as shown in FIG. 11, the horizontally long collet (horizontal collet jig) may be applied.

其次，利用圖13來說明有關夾頭夾具的更換方法。圖13是表示夾頭夾具被把持於開閉臂的狀態的圖，圖13(A)是俯視圖，圖13(B)是剖面圖，圖13(C)是側面圖。Next, a method of replacing the chuck fixture will be described with reference to FIG. 13. FIG. 13 is a view showing a state in which the chuck jig is held by the open-close arm, FIG. 13 (A) is a plan view, FIG. 13 (B) is a cross-sectional view, and FIG. 13 (C) is a side view.

在品種變更時是夾頭夾具也更換。與夾頭22同樣，將夾頭夾具以夾頭夾鉗部91的開閉臂91a來夾鉗而卸下、安裝。在夾頭柄21b的下部或夾頭夾具25的上部設置磁石，夾頭夾具也設為藉由磁石的固定，設為比夾頭還強的固定力。When the type is changed, the chuck fixture is also replaced. Similar to the chuck 22, the chuck jig is clamped by the opening / closing arm 91a of the chuck jaw portion 91, removed, and attached. A magnet is provided at the lower part of the chuck handle 21b or the upper part of the chuck jig 25. The chuck jig is also fixed by the magnet, and has a stronger fixing force than the chuck.

以夾頭來構成中間平台時(夾頭型的中間平台)的夾頭也與夾頭22同樣，可用夾頭夾鉗部91的開閉臂91a來夾鉗而卸下、安裝。When the chuck is used to form the intermediate platform (chuck-type intermediate platform), the chuck is similar to the chuck 22, and can be detached and attached by using the opening / closing arm 91a of the chuck clamp portion 91.

實施例是藉由夾鉗夾頭側面且在上部持有爪構造的開閉臂來更換夾頭，因此不用更換零件，可適用於各種尺寸(品種(夾頭外形)變更)，可進行安裝及卸下。藉此，可進行省人化及運轉率改善。In the embodiment, the chuck is replaced by the opening and closing arm of the side of the chuck and the claw structure is held on the upper part. Therefore, it is applicable to various sizes (variations (chuck shape) change) without replacing parts, and can be installed and removed. under. This can save labor and improve the operating rate.

又，藉由在中間平台上方移動夾頭夾鉗部91，可用一個的夾頭夾鉗部來更換(卸下及安裝)夾頭、夾頭夾具、夾頭型的中間平台的全部。又，藉由在中間平台上方移動夾頭夾鉗部91，可更換接合頭的夾頭與拾取頭的夾頭的雙方。亦即，可分別針對夾頭的3用途(接合頭、拾取頭、中間平台)以一個的夾頭夾鉗部來更換各品種對應數的夾頭。又，可用中間平台的上方的平台識別攝影機來確認夾頭的安裝狀態。In addition, by moving the chuck jaw portion 91 above the intermediate platform, one chuck jaw portion can be used to replace (remove and install) all of the chuck, chuck fixture, and chuck-type intermediate platform. Moreover, by moving the chuck jaw portion 91 above the intermediate platform, both the chuck of the joint head and the chuck of the pickup head can be replaced. That is, it is possible to replace the number of chucks corresponding to each type with a single chuck clamping portion for each of the three uses of the chuck (bonding head, pick-up head, and intermediate platform). In addition, the platform identification camera above the intermediate platform can be used to confirm the mounting state of the chuck.

其次，利用圖14來說明有關使用實施例的黏晶機的半導體裝置的製造方法。圖14是表示半導體裝置的製造方法的流程圖。Next, a method for manufacturing a semiconductor device using the die bonder of the embodiment will be described with reference to FIG. 14. FIG. 14 is a flowchart showing a method of manufacturing a semiconductor device.

步驟S11：將保持貼附有從晶圓11分割的晶粒D的切割膠帶16的晶圓環14儲存於晶圓盒(未圖示)，搬入至黏晶機10。控制裝置8是從充填有晶圓環14的晶圓盒供給晶圓環14至晶粒供給部1。並且，準備基板S，搬入至黏晶機10。控制裝置8是以基板供給部6來將基板S載置於搬送道52。Step S11: The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is attached is stored in a wafer cassette (not shown), and is transferred to the die attacher 10. The control device 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply unit 1. Then, the substrate S is prepared and carried into the die attacher 10. The control device 8 places the substrate S on the conveyance path 52 with the substrate supply unit 6.

步驟S12：控制裝置8是從被保持於晶圓環14的切割膠帶16拾取晶粒D。Step S12: The control device 8 picks up the die D from the dicing tape 16 held by the wafer ring 14.

步驟S13：控制裝置8是將拾取後的晶粒D搭載於基板S的封裝區域P上或層疊於已接合的晶粒上。更具體而言，控制裝置8是將從切割膠帶16拾取後的晶粒D載置於中間平台31，以接合頭41來從中間平台31再度拾取晶粒D，接合於被搬送來的基板S的封裝區域P。Step S13: The control device 8 mounts the picked-up die D on the package area P of the substrate S or laminates the bonded die. More specifically, the control device 8 places the die D picked up from the dicing tape 16 on the intermediate stage 31, picks up the die D again from the intermediate stage 31 with the bonding head 41, and joins the transferred substrate S Encapsulation area P.

步驟S14：控制裝置8是以基板搬送爪51來將基板S移動至基板搬出部7，將基板S交給基板搬出部7，從黏晶機10搬出基板S(基板卸載)。Step S14: The control device 8 uses the substrate transfer claw 51 to move the substrate S to the substrate carry-out section 7, passes the substrate S to the substrate carry-out section 7, and carries the substrate S from the die attacher 10 (substrate unloading).

以上，根據實施例具體說明本發明者所研發的發明，但本發明是不限於上述實施例，當然可實施各種變更。The inventions developed by the present inventors have been specifically described above based on the embodiments, but the invention is not limited to the embodiments described above, and various modifications can be implemented.

例如，在實施例中，夾頭夾鉗部91、供給部92及廢棄部93是被配置於橫方向的一直線上，夾頭夾鉗部91是移動於橫方向，但亦可為夾頭夾鉗部91、供給部92及廢棄部93是被配置於縱方向的一直線上，使夾頭夾鉗部91移動於縱方向。並且，供給部92與廢棄部93的排列是亦可為相反。For example, in the embodiment, the chuck jaw portion 91, the supply portion 92, and the discard portion 93 are arranged on a straight line in the horizontal direction, and the chuck jaw portion 91 is moved in the horizontal direction. The jaw part 91, the supply part 92, and the waste part 93 are arrange | positioned on the straight line of a longitudinal direction, and the chuck jaw part 91 is moved to a longitudinal direction. The arrangement of the supply unit 92 and the disposal unit 93 may be reversed.

又，亦可為具備複數組包括拾取部、對準部及接合部的安裝部及搬送道之黏晶機，或亦可具備複數組包括拾取部、對準部及接合部的安裝部，搬送道則是具備一個。Alternatively, it may be a die attacher equipped with a mounting unit including a pick-up unit, an alignment unit, and a joint unit, and a transport path, or a mounting unit including a pick-up unit, an alignment unit, and a joint unit. The Tao has one.

又，實施例是說明使用晶粒黏結薄膜的例子，但亦可設置：在基板塗佈黏著劑的預先形成(preform)部，而不使用晶粒黏結薄膜。In addition, the embodiment is an example in which a die-bonding film is used, but it may be provided that the substrate is coated with a preform portion without using a die-bonding film.

又，實施例是說明有關以拾取頭來從晶粒供給部拾取晶粒而載置於中間平台，以接合頭來將被載置於中間平台的晶粒接合於接合頭的黏晶機，但不限於此，可適用於從晶粒供給部拾取晶粒的半導體製造裝置。 　　例如，無中間平台與拾取頭，以接合頭來將晶粒供給部的晶粒接合於基板的黏晶機也可適用。 　　又，可適用於無中間平台，從晶粒供給部拾取晶粒，將晶粒拾取頭旋轉至上面，而將晶粒交給接合頭，以接合頭來接合於基板的覆晶機(Flip Chip Bonder)。 　　又，可適用於無中間平台與接合頭，將從晶粒供給部以拾取頭拾取後的晶粒載置於托盤等的晶粒分選機。In addition, the embodiment describes a die bonder that picks up a die from a die supply unit by a pick-up head and places it on an intermediate stage, and uses a bonding head to bond the die placed on the intermediate stage to a bonding head. It is not limited to this, and can be applied to a semiconductor manufacturing apparatus that picks up a die from a die supply unit. For example, a die bonder that does not have an intermediate stage and a pick-up head and uses a bonding head to bond the die of the die supply section to the substrate can also be applied. In addition, it can be applied to a flip chip (Flip Chip) that has no intermediate platform, picks up the die from the die supply unit, rotates the die picking head to the top, and hands the die to the bonding head, and the bonding head is bonded to the substrate. Bonder). In addition, it can be applied to a grain sorting machine that does not have an intermediate platform and a bonding head, and places the grains picked up by the picking head from the grain supply section on a tray.

10‧‧‧黏晶機10‧‧‧ Sticky Crystal Machine

1‧‧‧晶粒供給部1‧‧‧Crystal Supply Department

2‧‧‧拾取部2‧‧‧Pick up department

21‧‧‧拾取頭21‧‧‧Pickup head

22‧‧‧夾頭22‧‧‧ chuck

25‧‧‧夾頭夾具25‧‧‧Chuck fixture

3‧‧‧中間平台部3‧‧‧Middle Platform Department

31‧‧‧中間平台31‧‧‧ intermediate platform

4‧‧‧接合部4‧‧‧ Junction

41‧‧‧接合頭41‧‧‧Joint head

42‧‧‧夾頭42‧‧‧Chuck

5‧‧‧搬送部5‧‧‧Transportation Department

51‧‧‧基板搬送爪51‧‧‧ substrate transfer claw

8‧‧‧控制裝置8‧‧‧Control device

9‧‧‧夾頭更換部9‧‧‧ Chuck Replacement Department

91‧‧‧夾頭夾鉗部91‧‧‧Chuck & Clamp

91a‧‧‧開閉臂91a‧‧‧ open and close arm

91b‧‧‧開閉臂控制部91b‧‧‧Open / close arm control unit

92‧‧‧供給部92‧‧‧ Supply Department

93‧‧‧廢棄部93‧‧‧Abandoned Department

D‧‧‧晶粒D‧‧‧ Grain

S‧‧‧基板S‧‧‧ substrate

P‧‧‧封裝區域P‧‧‧Packing area

圖1是說明黏晶機的構成例的圖。 　　圖2是說明圖1的黏晶機的構成的圖。 　　圖3是說明圖1的晶粒供給部的構成的圖。 　　圖4是說明圖3的晶粒供給部的主要部的圖。 　　圖5是說明在圖1的黏晶機使用的夾頭夾具的構造的圖。 　　圖6是說明圖5的夾頭夾具的構造的圖。 　　圖7是說明具備圖1的黏晶機的夾頭更換部的構造的圖。 　　圖8是說明圖7的夾頭更換部的構造的圖。 　　圖9是說明圖1的黏晶機的夾頭更換方法的圖。 　　圖10是說明圖1的黏晶機的夾頭更換方法的圖。 　　圖11是說明圖1的黏晶機的夾頭更換方法的圖。 　　圖12是說明圖1的黏晶機的夾頭更換方法的圖。 　　圖13是說明圖1的黏晶機的夾頭夾具更換方法的圖。 　　圖14是表示使用圖1的黏晶機的半導體裝置的製造方法的流程圖。FIG. 1 is a diagram illustrating a configuration example of a die bonder. FIG. 2 is a diagram illustrating the configuration of the die bonder of FIG. 1. FIG. 3 is a diagram illustrating the configuration of the crystal grain supply unit in FIG. 1. FIG. 4 is a diagram illustrating a main part of the crystal grain supply section of FIG. 3. FIG. 5 is a diagram illustrating a structure of a chuck jig used in the die attacher of FIG. 1. FIG. 6 is a diagram illustrating the structure of the chuck jig of FIG. 5. FIG. 7 is a diagram illustrating a structure of a chuck replacement section including the die attacher of FIG. 1. FIG. 8 is a diagram illustrating the structure of the chuck replacement section of FIG. 7. FIG. 9 is a diagram illustrating a chuck replacement method of the die attacher of FIG. 1. FIG. 10 is a diagram illustrating a chuck replacement method of the die attacher of FIG. 1. FIG. 11 is a diagram illustrating a chuck replacement method of the die attacher of FIG. 1. FIG. 12 is a diagram illustrating a chuck replacement method of the die attacher of FIG. 1. FIG. 13 is a diagram illustrating a method of replacing a chuck of the die attacher of FIG. 1. FIG. 14 is a flowchart showing a method of manufacturing a semiconductor device using the die bonder of FIG. 1.

Claims (17)

一種半導體製造裝置，其特徵係具備： 　　夾頭夾具，其係以磁石來保持夾頭； 　　頭，其係於前端具備該夾頭夾具，以前述夾頭來吸附拾取晶粒； 　　夾頭更換部，其係更換前述夾頭；及 　　控制裝置，其係控制前述頭及前述夾頭更換部， 　　前述夾頭更換部係具備夾頭夾鉗部，其係具有：具有爪構造的開閉臂，及控制前述開閉臂的開閉臂控制裝置， 　　前述夾頭夾具係具備前述開閉臂的爪的逃避部； 　　前述控制裝置係使前述開閉臂開閉，使前述頭上下，藉此進行前述夾頭之朝前述夾頭夾具的安裝，及前述夾頭之從前述夾頭夾具的卸下。A semiconductor manufacturing device is characterized by: (1) a chuck clamp, which holds a chuck with a magnet; a chuck, which is provided with the chuck clamp at the front end, and uses the aforementioned chuck to adsorb and pick up crystal grains; It is for replacing the aforementioned chuck; and a control device for controlling the aforementioned head and the aforementioned chuck replacement part, The aforementioned chuck replacement part is provided with a chuck clamp part, which includes: an opening and closing arm having a claw structure, and controlling the aforementioned The opening / closing arm control device of the opening / closing arm, the chuck fixture is provided with an escape portion of the claw of the opening / closing arm; the control device is used to open and close the opening and closing arm, and to raise and lower the head, thereby performing the chuck toward the chuck And the removal of the chuck from the chuck clamp. 如申請專利範圍第1項之半導體製造裝置，其中，前述夾頭更換部更具備： 　　供給部，其係供給安裝於前述夾頭夾具的夾頭；及 　　廢棄部，其係廢棄從前述夾頭夾具卸下的夾頭。For example, the semiconductor manufacturing device of the scope of application for a patent, wherein the chuck replacement section further includes: (1) a supply section for supplying a chuck mounted on the chuck fixture; and a waste section for discarding the chuck fixture from the chuck fixture Removed chuck. 如申請專利範圍第2項之半導體製造裝置，其中，前述控制裝置為： 　　以前述開閉臂來夾鉗從前述供給部供給的夾頭， 　　將以前述開閉臂所夾鉗後的夾頭移動至前述夾頭夾具的下方， 　　使前述夾頭夾具下降，將被夾鉗於前述開閉臂的夾頭安裝於前述夾頭夾具。For example, the semiconductor manufacturing device according to item 2 of the patent application range, wherein the control device is: The chuck supplied from the supply unit is clamped by the opening and closing arm, and the chuck clamped by the opening and closing arm is moved to the foregoing Below the chuck clamp, the chuck clamp is lowered, and the chuck clamped to the opening and closing arm is mounted on the chuck clamp. 如申請專利範圍第3項之半導體製造裝置，其中，前述控制裝置係使前述夾頭夾具接近被夾鉗於前述開閉臂的夾頭，藉此被夾鉗於前述開閉臂的夾頭係以前述磁石的磁力來吸起夾頭，在前述夾頭夾具內定位安裝。For example, in the semiconductor manufacturing apparatus of claim 3, wherein the control device brings the chuck close to the chuck clamped to the opening and closing arm, and the chuck clamped to the opening and closing arm is based on the foregoing The magnetic force of the magnet is used to suck up the chuck and position and install it in the chuck clamp. 如申請專利範圍第4項之半導體製造裝置，其中，前述控制裝置為： 　　藉由前述開閉臂來夾鉗被固定於前述夾頭夾具的夾頭， 　　將前述夾頭夾具上昇而從前述夾頭夾具卸下被固定於前述夾頭夾具的夾頭， 　　將藉由前述開閉臂而被夾鉗的夾頭移動至前述廢棄部的上方， 　　開放前述開閉臂，將夾頭廢棄至前述廢棄部。For example, the semiconductor manufacturing device of the fourth scope of the application for a patent, wherein the control device is: 夹 the chuck fixed to the chuck is clamped by the opening and closing arm, the chuck is raised from the chuck Remove the chuck fixed to the chuck clamp, move the chuck clamped by the opening / closing arm to the waste section, open the opening and closing arm, and discard the chuck to the waste section. 如申請專利範圍第1項之半導體製造裝置，其中，前述控制裝置係使前述開閉臂開閉，使前述頭上下，藉此進行前述夾頭夾具之朝前述頭的安裝，及前述夾頭夾具之從前述頭的卸下。For example, the semiconductor manufacturing device of the scope of application for a patent, wherein the control device opens and closes the opening-closing arm and makes the head up and down, thereby mounting the chuck fixture toward the head, and following the chuck fixture. Removal of the aforementioned head. 如申請專利範圍第6項之半導體製造裝置，其中，前述控制裝置為： 　　以前述開閉臂來夾鉗前述夾頭夾具， 　　將藉由前述開閉臂而被夾鉗的夾頭夾具移動至前述頭的下方， 　　使前述頭下降，將被夾鉗於前述開閉臂的夾頭夾具安裝於前述頭。For example, the semiconductor manufacturing device of the sixth scope of the application for patent, wherein the control device is: clamping the chuck with the opening and closing arm, 移动 moving the chuck that is clamped by the opening and closing arm to the head Below, the head is lowered, and a chuck clamp clamped to the opening and closing arm is attached to the head. 如申請專利範圍第7項之半導體製造裝置，其中，前述頭係具有以磁力來吸引夾頭夾具的磁石。For example, the semiconductor manufacturing apparatus according to claim 7 in which the aforementioned head is a magnet having a magnetic force to attract the chuck jig. 如申請專利範圍第8項之半導體製造裝置，其中，前述控制裝置為： 　　藉由前述開閉臂來夾鉗被固定於前述頭的夾頭夾具， 　　將前述頭上昇而從前述頭卸下被固定於前述頭的夾頭夾具。For example, the semiconductor manufacturing device according to the eighth aspect of the patent application, wherein the control device is: a chuck clamp which is fixed to the head by the opening / closing arm, the head is raised and removed from the head and fixed to the head Chuck fixture for the aforementioned head. 如申請專利範圍第1項之半導體製造裝置，其中，更具備晶粒供給部，其係具有保持貼附有晶粒的切割膠帶的晶圓環， 　　前述頭為拾取被貼附於前述切割膠帶的晶粒的拾取頭。For example, the semiconductor manufacturing device according to the first patent application scope further includes a die supply unit, which is a wafer ring having a dicing tape to which the die is attached, and the head is a device for picking up the dicing tape attached to the die. Grain pickup head. 如申請專利範圍第10項之半導體製造裝置，其中，更具備︰ 　　中間平台，其係載置以前述拾取頭所拾取後的晶粒；及 　　接合頭，其係將從前述中間平台拾取後的晶粒接合於基板或已被接合的晶粒上， 　　前述接合頭係具備前述夾頭夾具。For example, the semiconductor manufacturing device under the scope of patent application No. 10, which further includes: (1) an intermediate platform for mounting the crystal grains picked up by the aforementioned picking head; and a bonding head for the crystal chips picked up from the aforementioned intermediate stage. The particles are bonded to a substrate or a bonded die, and the bonding head is provided with the chuck jig. 如申請專利範圍第11項之半導體製造裝置，其中，前述控制裝置係使前述夾頭夾鉗部移動至前述中間平台的上方，更換前述拾取頭的夾頭及前述接合頭的夾頭。For example, the semiconductor manufacturing device according to claim 11 of the application, wherein the control device moves the chuck clamp portion above the intermediate platform, and replaces the chuck of the pickup head and the chuck of the joint head. 如申請專利範圍第12項之半導體製造裝置，其中，前述中間平台為夾頭型的平台， 　　前述控制裝置係開閉前述開閉臂，使前述中間平台上下，將夾頭安裝於前述中間平台，及從前述中間平台卸下夾頭。For example, the semiconductor manufacturing device of the scope of application for patent No. 12, wherein the intermediate platform is a chuck-type platform, the control device opens and closes the opening and closing arm, makes the intermediate platform up and down, installs the chuck on the intermediate platform, and Remove the chuck from the aforementioned intermediate platform. 如申請專利範圍第1項之半導體製造裝置，其中，更具備晶粒供給部，其係具有保持貼附有晶粒的切割膠帶的晶圓環， 　　前述頭為拾取被貼附於前述切割膠帶的晶粒，接合於基板或已被接合的晶粒上的接合頭。For example, the semiconductor manufacturing device according to the first patent application scope further includes a die supply unit, which is a wafer ring having a dicing tape to which the die is attached, and the head is a device for picking up the dicing tape attached to the die. Die, a bonding head bonded to a substrate or a die that has already been bonded. 一種半導體裝置的製造方法，其特徵係具備： 　　(a)準備如申請專利範圍第1至12項中的任一項所記載的半導體製造裝置之工程； 　　(b)將保持貼附有晶粒的切割膠帶的晶圓環搬入之工程； 　　(c)準備搬入基板之工程； 　　(d)拾取晶粒之工程；及 　　(e)將前述拾取後的晶粒接合於前述基板或已被接合的晶粒上之工程。A method for manufacturing a semiconductor device, comprising: (a) preparing a semiconductor manufacturing device as described in any one of claims 1 to 12 in the scope of the patent application; (b) maintaining a die attached The process of moving the wafer ring of dicing tape; (c) the process of preparing to move into the substrate; (d) the process of picking up the dies; and (e) bonding the picked up dies to the aforementioned substrate or the bonded dies On the project. 如申請專利範圍第15項之半導體裝置的製造方法，其中， 　　前述(d)工程係以接合頭來拾取被貼附於前述切割膠帶的晶粒， 　　前述(e)工程係將以前述接合頭所拾取後的晶粒接合於前述基板或已被接合的晶粒上。For example, the method of manufacturing a semiconductor device according to item 15 of the patent application, wherein: (d) the above process uses a bonding head to pick up the dies attached to the cutting tape, and (d) the above (e) project uses the above bonding head. The picked-up dies are bonded to the aforementioned substrate or the bonded dies. 如申請專利範圍第16項之半導體裝置的製造方法，其中，前述(d)工程係具有： 　　(d1)以拾取頭來拾取被貼附於前述切割膠帶的晶粒之工程；及 　　(d2)將以前述拾取頭所拾取後的晶粒載置於中間平台之工程， 　　前述(e)工程係具備： 　　(e1)以接合頭來拾取被載置於前述中間平台的晶粒之工程；及 　　(e2)將以前述接合頭所拾取後的晶粒載置於前述基板之工程。For example, the method for manufacturing a semiconductor device according to item 16 of the patent application, wherein the aforementioned (d) process includes: (d1) a process of picking up a die attached to the aforementioned dicing tape with a pick-up head; and (d2) The process of placing the grains picked up by the pick-up head on the intermediate platform, (i) The aforementioned project (e) includes: (e1) a process of picking up the grains placed on the intermediate platform by a bonding head; and (e2 ) The process of placing the dies picked up by the aforementioned bonding head on the aforementioned substrate.
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