JPH11297720A - Method and device for manufacturing electronic component device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the need for supplying a material for a long time without damaging an electronic component. SOLUTION: In this manufacturing method of an electronic component device, a wrap film 2 for preventing the fall and positional movement charge with the time passage of the electronic component 1a by keeping contact with the back surface of the electronic component 1a provided with an adhesion force smaller than the suction force at the sucking of the electronic component 1a is prepared, the wrap film 2 is fixed on a plane, the electronic component 1a is fixed on it and the electronic component 1a is chucked in a state of being tightly adhered to the wrap film 2. Thus, the electronic component 1a is carried into a manufacturing process simply through suction without the use of a thrust-up pin. For this reason, the electronic components 1a will not be damaged, and the need for the adjustment of the thrust-up pin is eliminated. Also the wrap film 2 is fixed to plural fixing plates 3 installed to a rotary base 4, and when all the electronic components 1a present on the fixing plate 3a at a prescribed position are supplied, another fixing plate 3b is rotated and moved to a prescribed position, and the electronic components 1b on the fixing plate 3b are supplied.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method and an apparatus for manufacturing an electronic component device.

[0002]

2. Description of the Related Art As is well known, in a process of handling an electronic component such as a manufacturing process of the electronic component, it is necessary to arrange the electronic components in a regular manner in order to recognize the shape of the electronic component and improve the transport efficiency. Are required in various cases.
For example, in the step of die-bonding a semiconductor element to a lead frame, the semiconductor elements are arranged on an adhesive sheet,
After being fixed, the quality of the semiconductor element was determined by a recognition camera, and only the non-defective product was transported and die-bonded.

Conventionally, as a method for fixing an electronic component, for example, as shown in FIG. 6, an electronic component 1c after dicing, which is attached to an adhesive sheet 32 fixed by a wafer ring 61, is pushed up by a push-up pin 62. At the same time as being pushed up from the back surface of the adhesive sheet 32, it is sucked and conveyed by the suction collet 6 and die-bonded to the die pad 9 of the lead frame 8. FIG. 7 is an enlarged sectional view of the electronic component at the time of suction.

By the way, as is well known, a substrate of an electronic component or a semiconductor element is usually made of, for example, silicon (Si).
Since it is made of a material that is relatively brittle and has not too high strength and rigidity, when the electronic component is pushed up using the push-up pins as described above, the function and shape of the electronic component are not impaired by the mechanical interference. As such, careful attention must be paid.

[0005] In addition, non-defective semiconductor elements that can be obtained from one wafer, the number of wafer rings that can be mounted on equipment,
In addition, since there is a limit to the number of electronic components to be stored in the tray, it is necessary for the operator to consider the timing of material supply. As described above, from the viewpoint of transporting the electronic components, it is desirable to minimize the mechanical pressure applied to the electronic components and eliminate the applied force. From the viewpoint of the material supply cycle time, it is desirable that the number of times of material supply be small.

[0006]

However, for example, in a fixing device of a type in which electronic components are fixed by a conventional wafer ring, the adhesive force of the adhesive sheet is larger than the vacuum suction force applied to the collet at the tip of the tool. Because it is powerful, it is necessary to adjust the push-up force, push-up amount, and pin shape of the push-up pin from the back of the electronic component for each type of electronic component, which takes time and effort and reduces productivity. Was. Also, if adjustments are not enough,
Electronic components were sometimes damaged by the mechanical pressure exerted by the push pins.

In many cases, the size of wafers and the number of trays stored are limited, and the number of electronic components that can be mounted per facility is also limited. It was also necessary to frequently supply rings and exchange trays. Therefore, an object of the present invention is to solve the above technical problem,
An object of the present invention is to provide a method and an apparatus for manufacturing an electronic component device which can improve productivity without damaging the electronic component and can eliminate the need for material supply for a long time.

[0008]

According to a first aspect of the present invention, there is provided a method of manufacturing an electronic component device, comprising: arranging electronic components on a plane; A method for manufacturing an electronic component device to be supplied to an intermediate setting position or a manufacturing process, wherein the electronic component is kept in contact with the back surface of the electronic component to prevent the electronic component from falling and moving over time and to attract the electronic component. Prepare a wrap film with an adhesive force smaller than the suction force at the time,
The wrap film is fixed on a flat surface, an electronic component is placed thereon, and the electronic component is sucked in a state of being in close contact with the wrap film.

As described above, by maintaining contact with the back surface of the electronic component, it is possible to prevent the electronic component from dropping and moving over time, and to provide a wrap film having an adhesive force smaller than a suction force at the time of sucking the electronic component. Prepare, fix this wrap film on a flat surface, place electronic components on it, and suck this electronic component in close contact with the wrap film, so there is no need to push up with a push-up pin as in the past. Also, the electronic component can be transported to the intermediate setting position or the manufacturing process only by suction. Therefore, the reliability can be improved without damaging the electronic components, and the productivity is improved because adjustment of the push-up pins is not required.

According to a second aspect of the present invention, there is provided a method of manufacturing an electronic component device according to the first aspect, wherein the wrap film is fixed to a plurality of fixing plates and disposed around a horizontal axis, and all the wrap films existing on the fixing plates at predetermined positions are provided. When the electronic components are sucked and transported,
The other fixing plate is rotated and moved to a predetermined position to suck and convey the electronic components on this fixing plate. In this way, the wrap film is fixed to the plurality of fixing plates and arranged around the horizontal axis, and when all the electronic components present on the fixing plate at the predetermined position are sucked and transported, the other fixing plates are moved to the predetermined position. Since the electronic components on the fixed plate are rotated and moved to be sucked and conveyed, the material supply cycle can be reduced, and there is no need to supply the electronic components for a certain period of time.

According to a third aspect of the present invention, in the method of the first aspect, the wrap film is made of polypropylene. Thus, by using polypropylene as the material of the wrap film, all types of electronic components can be fixed with one type of wrap film. Unlike the conventional transport using a carrier tape which must correspond to the size and shape of various electronic components as in the related art, electronic components of any size and shape can be fixed with a single type of wrap film, so that no labor is required.

According to a fourth aspect of the present invention, in the method for manufacturing an electronic component device, the electronic component is a semiconductor element. Since the electronic component is a semiconductor element, the above effects can be obtained in the method of manufacturing a semiconductor device. A manufacturing apparatus for an electronic component device according to claim 5, wherein the electronic component device arranged on a plane is sucked and transported and supplied to an intermediate setting position or a manufacturing process. A wrap film having an adhesive force smaller than a suction force at the time of sucking the electronic component is fixed on a flat surface by preventing the electronic component from falling and moving over time by maintaining contact with the back surface. .

In the above arrangement, the electronic component is placed on a wrap film, which keeps the electronic component in contact with the back surface of the electronic component to prevent the electronic component from dropping and moving over time, and to hold the electronic component. Since it has an adhesive force smaller than the suction force at the time of suction, the electronic component can be transported to the intermediate regulation position or the manufacturing process only by suction without having to be pushed up by a push-up pin as in the related art. Therefore, the reliability can be improved without damaging the electronic components, and the productivity is improved because adjustment of the push-up pins is not required.

According to a sixth aspect of the present invention, there is provided the electronic component device manufacturing apparatus according to the fifth aspect, further comprising a rotating table rotatable about a horizontal axis by a rotating mechanism, wherein the plurality of fixing plates to which the wrap film is fixed rotate. It is detachably attached to the table. In this way, the rotating mechanism has a rotating table that can be rotated around the horizontal axis, and a plurality of fixing plates to which the wrap film is fixed are detachably attached to the rotating table.
When all the electronic components existing on the fixed plate at the predetermined position are sucked and conveyed, the other fixed plates can be rotated to the predetermined position to suck and convey the electronic components on this fixed plate. For this reason, the material supply cycle can be reduced, and there is no need to supply electronic components for a certain period of time. In addition, it is possible to remove the fixing plate with no electronic components and install the fixing plate with electronic components while picking up and transporting electronic components. Will not be interrupted.

According to a seventh aspect of the present invention, in the fifth aspect, the wrap film is made of polypropylene. As described above, since the material of the wrap film is polypropylene, all types of electronic components can be fixed with one type of wrap film. Therefore, unlike the conventional carrier tape, it is not necessary to prepare them corresponding to the sizes and shapes of various electronic components.

According to another aspect of the present invention, there is provided an apparatus for manufacturing an electronic component device, comprising: a die bonding device for supplying an adhesive to a die pad portion of a lead frame to fix the electronic component to the die pad portion; Manufacturing of an electronic component device including a wire bonding device for connection, a sealing device for sealing an electronic component after wire bonding with resin, and a gate cutting device for cutting a gate generated in a resin supply groove during sealing In the apparatus, a continuous lead frame is wound on a supply reel, and from this supply reel, a die bonding apparatus, a wire bonding apparatus,
A lead frame is supplied to a supply path passing through each of the sealing device and the gate cutting device, and an unnecessary portion of the lead frame after the gate cutting is wound on another reel.

As described above, a continuous lead frame is wound on a supply reel, and the lead frame is supplied from the supply reel to a supply path passing through a die bonding device, a wire bonding device, a sealing device, and a gate cutting device. Since the unnecessary portion of the lead frame after the gate cut is wound on another reel, it is unnecessary to manually transport the device between each process for a long time.

According to a ninth aspect of the present invention, the electronic component is a semiconductor device according to the fifth, sixth, seventh, or eighth aspect. Since the electronic component is a semiconductor element, the above effects can be obtained in the manufacture of a semiconductor device.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of an electronic component device manufacturing apparatus according to this embodiment, and FIG. 2 is an enlarged cross-sectional view of the first embodiment when electronic components are attracted.
As shown in FIG. 1, the manufacturing apparatus for an electronic component device includes a fixing device 15 for arranging and fixing the electronic components 1a on a plane and adsorbing and transporting the electronic components 1a to an intermediate setting position or a manufacturing process. A supply device 16 for supplying the inside is provided. In addition, the electronic component referred to here is a semiconductor element or the like, but is not limited to this.The electronic component is intended to operate by electrical connection, and the target to which the electronic component is connected in the manufacturing process is: There is no particular limitation on the substrate or the lead frame.

In the fixing device 15, the wrap film 2 on which the electronic components 1 a to be fixed are mounted is fixed to the fixing plates 3, and each fixing plate 3 is set on the turntable 4. The wrap film 2 prevents the electronic component 1a from falling and moving over time by maintaining contact with the back surface of the electronic component 1a. The material of the fixing plate 3 is the electronic component 1.
The electronic component 1a is not particularly limited as long as it prevents electrostatic breakdown of the electronic component 1a and does not damage the electronic component 1a. In this embodiment, for example, a conductive acrylic plate is used. In the supply device 16, the electronic component 1a is sucked and conveyed by the collet 6 movable by rotating the ball screw 11. At this time, as shown in FIG. 2, the surface of the electronic component 1a is sucked by the suction pad 21 at the tip of the collet 6 by a vacuum suction force. Therefore, the material of the wrap film 2 on which the electronic component 1a is placed is such that the adhesive force with the back surface of the electronic component 1a is smaller than the vacuum attraction force, and the electronic component 1a is positioned vertically downward from the wrap film 2. Also, it is preferable that at least the electronic component 1a be able to secure an adhesive force that does not separate therefrom. Further, it is desirable that one type can correspond to the shape and size of all electronic components. In this embodiment, for example, polypropylene is used.

Next, a method of manufacturing the electronic component device will be described. The wrap film 2 is fixed to the fixing plate 3 as described above, and the electronic component 1a is placed thereon, and the electronic component 1a is sucked by the collet 6 in a state where the electronic component 1a is in close contact with the wrap film 2. At this time, since the adhesive force between the wrap film 2 and the electronic component 1a, which are in close contact with the fixing plate 3, is smaller than the vacuum suction force, no mechanical pressure due to the push-up of a push-up pin from the back surface of the electronic component 1a is required. . For example, when the electronic component 1a targets a semiconductor element, the lead frame 8 is sent onto the rail 7 in the manufacturing process, the electronic component 1a is sucked and transported by the collet 6, and is placed on the die pad portion 9. Die bonding.

As described above, according to this embodiment, the electronic component 1a can be attracted to the tip of the collet 6 only by the vacuum suction force of the collet 6 without pushing up the push-up pin. Is used in which the adhesive strength of the wrap film 2 on which the electronic component 1a is placed is lower than in the past, so that the push-up pins from the back surface of the electronic component 1a are not required, and the electronic component 1a is moved to the intermediate regulation position only by suction. Or it can be conveyed in a manufacturing process. Therefore, the reliability can be improved without damaging the electronic component 1a, and the adjustment of the push-up pin is not required, so that the productivity is improved. Although the rotary table 4 is provided as the fixing device 15 in FIG. 1, any structure may be used as long as the fixing plate 3 can be fixed on a plane.

FIG. 3 shows a modification of the first embodiment. As shown in FIG. 3, the wrap film 2 and the fixing plate 3
And the elastic body 31 is sandwiched between them so that they are in close contact with each other. With such a structure, the wrap film 2 more closely adheres to the concave and convex portions on the back surface of the electronic component 1a, and the bonding area increases, so that the electronic component 1a is less likely to fall. The material of the elastic body 31 is not particularly limited as long as it has elasticity. In this embodiment, for example, rubber is used. Other configurations are the same as those of the first embodiment,
The same members are denoted by the same reference numerals and description thereof will be omitted.

A second embodiment of the present invention will be described with reference to FIGS. FIG. 4 is a cross-sectional view of a fixing device having a rotation mechanism according to the second embodiment. As shown in FIGS. 1 and 4, a plurality of fixing plates 3 to which the wrap film 2 is fixed are detachably attached to the turntable 4 and are rotatable around a horizontal axis by a rotation mechanism. In this case, the fixing plate 3 that can be removed from the turntable 4 is fixed by fixing claws 41, and the turntable 4 is supported by a bracket 42 fixed to the gantry 43. The turntable 4 has a handle 10 and can be easily removed from the bracket 42. In the rotation mechanism, the turntable 4 can be rotated by a certain angle (for example, 90 degrees) using the motor 5 according to the judgment of the recognition camera (not shown).

Next, a method of manufacturing the electronic component device will be described. As described above, the wrap film 2 is fixed to the plurality of fixing plates 3 and disposed around the horizontal axis, and the surface of the electronic component 1 a of the fixing plates 3 installed on the turntable 4 is vertically upward. When all the electronic components 1a present on the fixed plate 3a at the position are connected, the recognition camera, the motor 5
Then, the other fixed plate 3b is rotated to a predetermined position, and the electronic component 1b on the fixed plate 3b is sucked and transported using the collet 6 as in the first embodiment, and is connected to the die pad portion 9. While the electronic component 1b on the fixed plate 3b is being sucked and transported, the fixed plate 3a is removed from the turntable 4, and the fixed plate on which the electronic component is located is set on the surface on which the fixed plate 3a is set. In this way, the supply of the electronic components and the driving of the turntable 4 are performed.

As described above, according to this embodiment, the material supply cycle can be reduced by using the rotatable turntable 4 on which a plurality of fixed plates 3 are installed,
For a certain period of time, there is no need to supply electronic components. A third embodiment of the present invention will be described with reference to FIG. FIG. 5 is a conceptual diagram showing an apparatus for manufacturing an electronic component device according to the third embodiment. The electronic component device is a semiconductor device as an example.
In FIG. 5, 51 is a supply reel, 52 is a die bonding device, 57 is a wire bonding device, 53 is a sealing device, 59 is a gate cutting device, and 60 is a take-up reel. The die bonding apparatus 52 is used for the lead frame 8.
An adhesive is supplied to the die pad portion to fix a semiconductor element as an electronic component to the die pad portion. The wire bonding device 57 connects the electrode part of the electronic component and the inner lead. The sealing device 53 seals the electronic component after the wire bonding with a resin. The gate cut device 59 cuts the gate generated in the resin supply groove at the time of sealing. Numeral 54 denotes a coupling heater, which controls the temperature to be optimal for curing the paste or cools the solder in the die bonding apparatus, and controls the optimal bonding temperature between the wire and the electrode portion of the electronic component in the wire bonding apparatus. 55 is a front conveyance mechanism, and 58 is a rear conveyance mechanism. 56 is a buffer,
The difference in the feed amount generated between the front transport mechanism 55 and the rear transport mechanism 58 can be absorbed by bending the lead frame 8. The slack amount of the buffer 56 is detected by a sensor, and when the slack amount reaches a predetermined length, the transport mechanisms 55 and 58 operate.

In the manufacturing apparatus configured as described above, a continuous lead frame 8 is wound on a supply reel 51, and from this supply reel 51, a die bonding device 52, a wire bonding device 57, a sealing device 53, and a gate cutting device 59. The lead frame 8 is supplied to the supply path 7 (FIG. 1) passing through each device, and the lead frame 8 after the gate is cut.
The unnecessary portion is wound on a take-up reel 60. Therefore, there is no need to operate equipment or supply materials until the lead frame 8 is completely wound up. In this embodiment,
It can be used in combination with the first and second embodiments,
This is particularly effective in terms of long-term non-stop of equipment.

[0028]

According to the method of manufacturing an electronic component device according to the first aspect of the present invention, the electronic component is prevented from dropping and moving over time by maintaining contact with the back surface of the electronic component. Prepare a wrap film having an adhesive force smaller than the suction force at the time of suction, fix this wrap film on a flat surface, and place an electronic component thereon,
Since the electronic component is sucked in close contact with the wrap film, the electronic component can be conveyed to the intermediate regulation position or the manufacturing process only by suction without having to be pushed up by a push-up pin as in the related art. Therefore, the reliability can be improved without damaging the electronic components, and the productivity is improved because adjustment of the push-up pins is not required.

According to a second aspect of the present invention, the wrap film is fixed to a plurality of fixing plates and arranged around a horizontal axis. When all the electronic components present on the fixing plate at a predetermined position are sucked and conveyed, another fixing plate is fixed. Is rotated to a predetermined position to suck and transport the electronic component on the fixed plate, so that the material supply cycle can be reduced, and the supply of the electronic component for a certain period of time becomes unnecessary.

According to the third aspect of the invention, the material of the wrap film is made of polypropylene, so that all kinds of electronic components can be fixed with one type of wrap film. Unlike the conventional transport using a carrier tape which must correspond to the size and shape of various electronic components as in the related art, electronic components of any size and shape can be fixed with a single type of wrap film, so that no labor is required.

According to the fourth aspect, since the electronic component is a semiconductor element, the above effects can be obtained in the method of manufacturing a semiconductor device. According to the manufacturing apparatus of the electronic component device according to the fifth aspect of the present invention, the electronic component is placed on the wrap film, and the wrap film keeps contact with the back surface of the electronic component, thereby causing the electronic component to fall and to be removed with time. Since it prevents position movement and has an adhesive force smaller than the suction force when sucking electronic components, the electronic components can be placed in the intermediate regulation position or manufacturing process only by suction without pushing up with the push-up pins as in the past. Can be conveyed inside. Therefore, the reliability can be improved without damaging the electronic components, and the productivity is improved because adjustment of the push-up pins is not required.

According to the present invention, a rotating table rotatable about a horizontal axis by a rotating mechanism is provided, and a plurality of fixing plates to which a wrap film is fixed are detachably mounted on the rotating table. When all the electronic components existing on the fixed plate are sucked and transported, the other fixed plates can be rotated to a predetermined position to suck and transport the electronic components on this fixed plate. For this reason, the material supply cycle can be reduced, and there is no need to supply electronic components for a certain period of time.
In addition, it is possible to remove the fixing plate with no electronic components and install the fixing plate with electronic components while picking up and transporting electronic components. Will not be interrupted.

According to claim 7, since the material of the wrap film is polypropylene, one type of wrap film can be used.
All kinds of electronic components can be fixed. Therefore, unlike the conventional carrier tape, it is not necessary to prepare them corresponding to the sizes and shapes of various electronic components. According to the apparatus for manufacturing an electronic component device according to claim 8 of the present invention, a continuous lead frame is wound on a supply reel, and a die bonding device, a wire bonding device, a sealing device, and a gate cutting device are wound from the supply reel. The lead frame is supplied to the supply path that passes through each device, and the unnecessary portion of the lead frame after gate cutting is wound up on another reel, so that human transport of the device between processes is not required for a long time. .

According to the ninth aspect, since the electronic component is a semiconductor element, the above effects can be obtained in the manufacture of a semiconductor device.

[Brief description of the drawings]

FIG. 1 is a perspective view of an apparatus for manufacturing an electronic component device according to an embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of the first embodiment of the present invention when electronic components are sucked.

FIG. 3 is an enlarged cross-sectional view of a modification of the first embodiment of the present invention when electronic components are sucked.

FIG. 4 is a front view of an electronic component fixing device according to a second embodiment of the present invention.

FIG. 5 is a conceptual diagram of an electronic component device manufacturing apparatus according to a third embodiment of the present invention.

FIG. 6 is a perspective view showing a supply mode of electronic components in a conventional example.

FIG. 7 is an enlarged sectional view of a conventional example at the time of electronic component suction.

[Explanation of symbols]

 1a, 1b, 1c Electronic component 2 Wrap film 3, 3a, 3b Fixing plate 4 Turntable 5 Motor 6 Nozzle 7 Lead frame supply path 8 Lead frame 9 Die pad part 10 Handle 11 Ball screw 21 Suction pad 31 Rubber 41 Fixing claw 42 Bracket 43 gantry 51 supply reel 60 take-up reel 52 die bonding device 53 sealing device 54 heater section 55 front transfer mechanism 56 buffer 57 wire bond device 58 rear transfer mechanism 59 gate cut device

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI H01L 21/68 H01L 21/68 N // H05K 13/04 H05K 13/04 A (72) Inventor Tsugio Murayama Takatsuki-shi, Osaka 1-1, Sachimachi Matsushita Electronics Co., Ltd. (72) Inventor Zenichiro Tabuchi 1-1, Sachimachi, Takatsuki-shi, Osaka Prefecture Matsushita Electronics Co., Ltd. No. 1 Matsushita Electronics Corporation

Claims (9)

[Claims] 1. A method of manufacturing an electronic component device, comprising: arranging electronic components on a flat surface, sucking and transporting the electronic components, and supplying the electronic components to an intermediate setting position or a manufacturing process. Prevent the electronic component from falling and moving over time by maintaining contact, and prepare a wrap film having an adhesive force smaller than the attraction force when sucking the electronic component, and place the wrap film on the flat surface. And mounting the electronic component on the electronic component and adsorbing the electronic component in close contact with the wrap film. 2. A wrap film is fixed to a plurality of fixing plates and disposed around a horizontal axis. When all electronic components present on the fixing plate at a predetermined position are sucked and conveyed, another fixing plate is moved to the predetermined position. 2. The method for manufacturing an electronic component device according to claim 1, wherein the electronic component on the fixed plate is sucked and conveyed by rotating to a position. 3. The method according to claim 1, wherein the material of the wrap film is polypropylene. 4. The electronic component according to claim 1, wherein the electronic component is a semiconductor device.
4. The method for manufacturing an electronic component device according to 2 or 3. 5. A manufacturing apparatus for an electronic component device, which sucks and transports electronic components arranged on a plane and supplies the electronic components to an intermediate setting position or a manufacturing process, by maintaining contact with the back surface of the electronic component. Manufacturing the electronic component device, wherein a wrap film that prevents the electronic component from dropping and moves over time and has an adhesive force smaller than a suction force at the time of sucking the electronic component is fixed on the flat surface. apparatus. 6. The electronic device according to claim 5, further comprising a turntable rotatable around a horizontal axis by a rotation mechanism, wherein a plurality of fixing plates to which a wrap film is fixed are detachably attached to the turntable. Equipment for manufacturing component devices. 7. The apparatus according to claim 5, wherein the material of the wrap film is polypropylene. 8. A die bonding device for supplying an adhesive to a die pad portion of a lead frame to fix an electronic component to the die pad portion, a wire bonding device for connecting an electrode portion of the electronic component to an inner lead, and a wire bonding device. A continuous lead frame is supplied to an electronic component device manufacturing apparatus including a sealing device for sealing a later electronic component with a resin and a gate cutting device for cutting a gate formed in a resin supply groove at the time of sealing. Wound on a reel, the die bonding apparatus from the supply reel,
Supplying a lead frame to a supply path passing through each of a wire bonding device, a sealing device, and a gate cutting device,
An apparatus for manufacturing an electronic component device, wherein an unnecessary portion of a lead frame after gate cutting is wound on another reel. 9. The electronic component is a semiconductor device.
9. An apparatus for manufacturing an electronic component device according to claim 6, 7, or 8.