JP2004153270A - Method and equipment for separating semiconductor devices and method for mounting semiconductor devices - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and equipment for separating semiconductor devices in which a thin semiconductor wafer, which is stuck to an adhesive sheet, is cut into pieces of thin semiconductor devices, and the group of thin-semiconductor devices is taken off the adhesive sheet at a high speed, without being scratched or cracked, then a specified number of semiconductor devices are picked up and separated from the others of the group. <P>SOLUTION: This method includes a separation process for attaching a semiconductor wafer to an adhesive sheet of which circumference is secured to a frame, for cutting the semiconductor wafer into pieces of semiconductor devices, for positioning the group of semiconductor devices and holding it with a chuck 150 of cutting off the rim of the adhesive sheet around the group of semiconductor devices, and for peeling the adhesive sheet away from the group of semiconductor devices; and a receiving process for picking up a specified number of semiconductor devices from the group of semiconductor devices held by the chuck, and of receiving them in a tray 2. <P>COPYRIGHT: (C)2004,JPO

Description

  According to the present invention, a semiconductor wafer or an electronic component is cut into a unit of a semiconductor element (semiconductor chip) or an electronic component from a connected state, and the cut semiconductor element or the electronic component is picked up and mounted on a tray or a circuit board. The present invention relates to a method for mounting a semiconductor element or the like mounted on a substrate, a method for separating a semiconductor element or the like, an apparatus therefor, and a method for manufacturing an IC card.

For example, JP-A-6-295930 discloses a conventional technique in which a semiconductor wafer is stuck on an adhesive sheet and cut into units of semiconductor elements (semiconductor chips), and the cut semiconductor element is peeled off from the adhesive sheet and picked up. (Prior art 1),
And JP-A-6-97214 (prior art 2) are known.

  In prior art 1, the back surface of the adhesive sheet to which the semiconductor chip to be peeled is adhered is rubbed with a sliding pin to weaken the adhesive force with the semiconductor chip, and a push-up pin provided around the sliding pin is provided. It is described that the semiconductor chip having weakened adhesive strength is peeled off from the adhesive sheet by lifting the semiconductor chip together with the sliding pins to evenly lift the semiconductor chip.

  Further, in prior art 2, a pressure-sensitive adhesive sheet to which a large number of pellets are adhered is fixedly held with the pellets on the lower side, and the pressing surface of the pressure-sensitive adhesive sheet is formed in a spherical shape at the lower end of the needle unit. It is described that the pellet is peeled off from the adhesive sheet by pushing down a needle having a sharp tip from the unit, and vacuum-adsorbed by a collet located below.

By the way, as a conventional technique of cutting a semiconductor element (semiconductor chip) into units in a state where a semiconductor wafer is stuck on an adhesive sheet, Japanese Patent Application Laid-Open No. Hei 1-264236 (
Prior art 3) is known. In the prior art 3, the pressure-sensitive adhesive sheet adhered to the frame ring and the semi-full-cut wafer fixed by the pressure-sensitive adhesive sheet are moved from the back surface of the pressure-sensitive adhesive sheet by pressing a roller having a bulge at the center. Accordingly, a wafer break technique for separating a semiconductor element in a wafer state into element units is described.

JP-A-6-295930

JP-A-6-97214 JP-A-1-264236

  By the way, for example, a semiconductor chip mounted on an IC card or the like is required to be thinner in order to make the product such as the IC card thinner. As described above, when manufacturing a product such as an IC card by mounting a thin semiconductor chip on a circuit board (substrate to be mounted) that forms a product such as an IC card, the thin semiconductor chip is not damaged or broken. Need to do it.

  However, in the above-mentioned prior art 1, the push-up pins provided around the slide pins are lifted together with the slide pins to evenly lift the semiconductor chips, thereby separating the semiconductor chips from the adhesive sheet. In the case of a thin semiconductor chip having a small surface to be separated from the adhesive surface of the chip, it is highly likely that the semiconductor chip cannot be separated and is broken or damaged.

  Also, in the above prior art 2, since the pellet is peeled off from the adhesive sheet by pushing down a needle having a sharp tip, in the case of a thin semiconductor chip, it cannot be separated and is broken or damaged. It is likely to be attached.

  Further, Prior Art 3 relates to a wafer break technique for separating a semiconductor element in a wafer state into individual elements.

  As described above, in any of the above-described prior arts, the thin semiconductor wafer is cut into units of thin semiconductor elements (semiconductor chips) in a state where the thin semiconductor wafer is adhered to the adhesive sheet, and the thin semiconductor elements in the cut row state are cut. No consideration has been given to the point that the group is peeled off from the pressure-sensitive adhesive sheet at high speed without damaging each semiconductor element, and without breaking, and is separated from the pressure-sensitive adhesive sheet by a suction collet.

  An object of the present invention is to cut a thin semiconductor element (semiconductor chip) into thin semiconductor element units in a state where a thin semiconductor wafer is attached to an adhesive sheet in order to solve the above problem. Provided is a method of separating a semiconductor element and an apparatus for separating a semiconductor element from a separated semiconductor element group by picking up and separating the semiconductor element from the adhesive sheet at a high speed without damaging each semiconductor element and without breaking the semiconductor element. is there.

  Another object of the present invention is to cut a thin semiconductor element (semiconductor chip) into units in a state where a thin semiconductor wafer is stuck on an adhesive sheet, and cut the cut thin semiconductor element group into each semiconductor element. It is an object of the present invention to provide a method and an apparatus for separating a semiconductor element in which a semiconductor element can be picked up from a peeled semiconductor element group and stored in a tray without peeling off the adhesive sheet at a high speed without damaging the chip. .

  Another object of the present invention is to cut a thin semiconductor element (semiconductor chip) into units in a state where a thin semiconductor wafer is stuck on an adhesive sheet, and cut the cut thin semiconductor element group into each semiconductor element. A semiconductor element mounting method that allows a semiconductor element to be picked up from a peeled semiconductor element group and mounted on a tray or a substrate to be mounted, such as a circuit board, at a high speed without damaging the device and without breaking it. To provide.

  It is another object of the present invention to provide a method of manufacturing an IC card which enables efficient and inexpensive manufacture of a high-quality thin IC card.

  In order to achieve the above object, the present invention provides a semiconductor device group attached to an adhesive sheet in the form of a semiconductor wafer, and a semiconductor element group held on a chuck for an object cut in units of semiconductor elements. A separation step of peeling the pressure-sensitive adhesive sheet from the element group, and a tray storage step of picking up semiconductor elements in a desired unit from the semiconductor element group held in the chuck where the pressure-sensitive adhesive sheet is peeled off in the separation step and storing the semiconductor elements in a tray. A method for separating a semiconductor element, comprising the steps of:

  The present invention also provides a semiconductor wafer attached to an adhesive sheet having its periphery fixed to a frame in the form of a semiconductor wafer, positioning an object cut in units of semiconductor elements, and holding a semiconductor element group on a chuck, A separation step of cutting the pressure-sensitive adhesive sheet around the element group and peeling the cut pressure-sensitive adhesive sheet from the held semiconductor element group, and a step of separating the pressure-sensitive adhesive sheet from the semiconductor element group held by the chuck in the separation step. A tray storing step of picking up semiconductor elements in desired units and storing them in trays.

  Further, the present invention also provides a semiconductor device group which is attached to a pressure-sensitive adhesive sheet in a state of a semiconductor wafer and held on a chuck with respect to an object cut in units of semiconductor elements. A separation step of peeling off the adhesive sheet, and a pickup step of independently picking up semiconductor elements from a semiconductor element group held by a chuck in which the adhesive sheet has been peeled off in the separation step. is there.

  The present invention also provides a semiconductor wafer attached to an adhesive sheet having its periphery fixed to a frame in the form of a semiconductor wafer, positioning an object cut in units of semiconductor elements, and holding a semiconductor element group on a chuck, A separation step of cutting the pressure-sensitive adhesive sheet around the element group and peeling the cut pressure-sensitive adhesive sheet from the held semiconductor element group, and a step of separating the pressure-sensitive adhesive sheet from the semiconductor element group held by the chuck in the separation step. A pickup step of independently picking up the semiconductor elements.

  According to the present invention, in the method for separating a semiconductor element, the separating step and the pickup step are performed in parallel.

  Further, the present invention has an adhesive property in which a semiconductor element group is attached to a pressure-sensitive adhesive sheet having a periphery fixed to a frame in a state of a semiconductor wafer, and a semiconductor element group is positioned by positioning an object cut in units of semiconductor elements and held by a chuck. Each semiconductor element can be picked up by holding the semiconductor element group by sticking it on the temporary fixing sheet, cutting the adhesive sheet around the held semiconductor element group, and peeling the cut adhesive sheet from the semiconductor element group. A method for separating a semiconductor element, comprising obtaining an element group adhered to a temporary fixing sheet.

  The present invention also provides a semiconductor wafer attached to an adhesive sheet having its periphery fixed to a frame in the form of a semiconductor wafer, positioning an object cut in units of semiconductor elements, and holding a semiconductor element group on a chuck, While cutting the adhesive sheet around the element group and peeling the cut adhesive sheet from the held semiconductor element group, each semiconductor element can be picked up on the side of the semiconductor element group on which the adhesive sheet was stuck. A method for separating a semiconductor element, comprising: adhering an adhesive temporary fixing sheet to the substrate.

  The present invention also provides a chucking device for holding a semiconductor device group and a semiconductor device group held by the chucking device, which are attached to an adhesive sheet in a state of a semiconductor wafer and are cut into semiconductor device units. Separating means having a peeling means for peeling the pressure-sensitive adhesive sheet, the semiconductor element is picked up in a desired unit from the semiconductor element group which is peeled off by the peeling means of the separating means and held by the chuck means, and is placed on a tray. And a tray storage means for storing the semiconductor device.

  Further, the present invention provides a chucking means for holding a semiconductor element group by positioning an object cut in a semiconductor element unit and holding the semiconductor element group, which is affixed in a state of a semiconductor wafer to an adhesive sheet having a periphery fixed to a frame. Separating means having cutting means for cutting the adhesive sheet around the separated semiconductor element group, peeling means for peeling the adhesive sheet cut by the cutting means from the semiconductor element group held by the chuck means, and the separating means And a tray accommodating means for picking up semiconductor elements in a desired unit from the semiconductor element group held by the chuck means in a desired unit and accommodating the semiconductor elements in a tray. It is a separation device.

  The present invention also provides a chucking device for holding a semiconductor device group and a semiconductor device group held by the chucking device, which are attached to a pressure-sensitive adhesive sheet in a state of a semiconductor wafer and are cut into semiconductor device units. Separating means having a peeling means for peeling the pressure-sensitive adhesive sheet, and a pick-up means for independently picking up semiconductor elements from the semiconductor element group held by the chuck means, wherein the pressure-sensitive adhesive sheet is peeled off by the peeling means of the separating means. A semiconductor device separation device comprising:

Further, the present invention provides a chucking means for holding a semiconductor element group by positioning an object cut in a semiconductor element unit and holding the semiconductor element group, which is affixed in a state of a semiconductor wafer to an adhesive sheet having a periphery fixed to a frame. A separating unit having a cutting unit that cuts the adhesive sheet around the set of semiconductor elements and a peeling unit that peels the adhesive sheet cut by the cutting unit from the semiconductor element group held by the chuck unit; and A semiconductor device separating apparatus, comprising: a pickup device for independently picking up semiconductor devices from a semiconductor device group held by the chuck device after the adhesive sheet has been peeled off by a peeling device.

  Further, the present invention is configured such that in the semiconductor device separating apparatus, the chuck means can be rotated so that the peeling of the adhesive sheet from the semiconductor element group by the separating means and the pickup of the semiconductor element by the pickup means can be performed in parallel. It is characterized.

  Further, the present invention is characterized in that, in the separating device of the above-described semiconductor device separating apparatus, there is provided appearance detecting means for detecting the appearance of the semiconductor element group of the object.

  Further, according to the present invention, in the separating device of the semiconductor device separating device, the detecting device for detecting the address of the semiconductor device in the semiconductor device group based on a state in which the semiconductor device group of the object is held by the chucking device. It is characterized by having.

  Further, the present invention is characterized in that the semiconductor device separating apparatus further comprises a removing means for removing dust remaining on the chuck surface of the chuck means after being picked up by the pick-up means.

  In addition, the present invention is also applied to a pressure-sensitive adhesive sheet having a periphery fixed to a frame, in a state of a semiconductor wafer, positioning an object cut in units of semiconductor elements, and positioning a semiconductor element group on a temporary fixing sheet having adhesiveness. Chuck means for adhering and holding the temporary fixing sheet; cutting means for cutting the adhesive sheet around the semiconductor element group held by the chuck means via the temporary fixing sheet; and cutting means for cutting the adhesive sheet. Peeling means for peeling off the pressure-sensitive adhesive sheet from the semiconductor element group held by the chuck means via the temporary fixing sheet to obtain a semiconductor element group adhered on the temporary fixing sheet so that each semiconductor element can be picked up. And a semiconductor device separating device.

  Further, the present invention is a chuck means for attaching a semiconductor wafer to a pressure-sensitive adhesive sheet having a periphery fixed to a frame, positioning an object cut in units of semiconductor elements, and holding a semiconductor element group, and the chuck means. Cutting means for cutting the adhesive sheet around the held semiconductor element group, peeling means for peeling the adhesive sheet cut by the cutting means from the semiconductor element group held by the chuck means, and adhesive sheet by the peeling means On the side of the semiconductor element group from which the adhesive sheet was adhered, adhesive means for adhering a temporary fixing sheet having adhesiveness so that each semiconductor element could be picked up was provided. It is a separation device.

  Further, according to the present invention, a chuck unit for holding a semiconductor element group, and a semiconductor element group held by the chuck unit are attached to a pressure-sensitive adhesive sheet in a state of a semiconductor wafer, and the object cut in units of semiconductor elements. In the state, a tension mechanism that holds the edge of the pressure-sensitive adhesive sheet and pulls the pressure-sensitive adhesive sheet in a predetermined direction, and when the pressure-sensitive adhesive sheet is pulled by the pulling mechanism, the pressure-sensitive adhesive sheet moves in a predetermined direction while pressing the pressure-sensitive adhesive sheet. And a forming means for peeling off from the semiconductor element group.

  Further, the present invention is characterized in that in the above-mentioned semiconductor device separating apparatus, a pickup means for independently picking up semiconductor elements from the semiconductor element group in a state where the adhesive sheet has been peeled off is further provided.

  Further, the present invention is characterized in that the semiconductor device separating apparatus further comprises means for reducing a decrease in holding force of the semiconductor element group by the chuck means when the adhesive sheet is peeled from the semiconductor element group. I do.

  Further, the present invention provides a peeling means of the semiconductor device separating device, a pulling means for holding the edge of the pressure-sensitive adhesive sheet and pulling the pressure-sensitive adhesive sheet, and when the pressure-sensitive adhesive sheet is pulled by the pulling means, the pressure-sensitive adhesive sheet is held down. And a forming mechanism for forming a bent shape of the pressure-sensitive adhesive sheet are moved at least in a direction along a surface of the pressure-sensitive adhesive sheet.

  Further, the present invention also provides a semiconductor device group which is attached to a pressure-sensitive adhesive sheet in a state of a semiconductor wafer and held on a chuck with respect to an object cut in units of semiconductor elements. A transporting step of picking up semiconductor elements in a desired unit from a semiconductor element group held by a chuck and transporting the semiconductor elements to a mounting position, wherein the adhesive sheet is peeled off in the separating step, and a transporting step of transporting the semiconductor elements to the mounting position. And mounting the semiconductor element on a tray or a substrate to be mounted.

  The present invention also provides a semiconductor wafer attached to an adhesive sheet having its periphery fixed to a frame in the form of a semiconductor wafer, positioning an object cut in units of semiconductor elements, and holding a semiconductor element group on a chuck, A separation step of cutting the pressure-sensitive adhesive sheet around the element group and peeling the cut pressure-sensitive adhesive sheet from the held semiconductor element group, and a step of separating the pressure-sensitive adhesive sheet from the semiconductor element group held by the chuck in the separation step. A transport step of picking up semiconductor elements in a desired unit and transporting the semiconductor elements to a mounting position; and a mounting step of mounting the semiconductor elements transported by the transport step on a tray or a substrate to be mounted. This is a method for mounting a semiconductor element.

  As described above, according to the above configuration, a thin semiconductor wafer having a thickness of about 0.002 to 0.2 mm is cut into units of thin semiconductor elements (semiconductor chips) in a state where the thin semiconductor wafer is attached to the adhesive sheet. The separated thin semiconductor element group can be peeled off from the adhesive sheet at high speed without damaging each semiconductor element and without breaking, separated by a suction collet, and stored in a tray or mounted on a substrate (circuit board). .

Further, according to the above configuration, the electronic components are cut into units of electronic components in a state where the electronic components are held together on the adhesive sheet, and the cut electronic component group is not damaged to each electronic component, and the high-speed operation is performed. Then, the adhesive sheet is separated from the pressure-sensitive adhesive sheet, separated by a suction collet, and can be stored in a tray or mounted on a mounting substrate (circuit board) as it is.

  Further, according to the configuration, a high-quality thin IC card can be manufactured efficiently and at low cost.

  According to the present invention, a thin semiconductor wafer having a thickness of about 0.002 to 0.2 mm is cut into units of thin semiconductor elements (semiconductor chips) in a state of being adhered to an adhesive sheet, and the cut thin semiconductor element is cut. There is an effect that the group can be peeled off and separated from the adhesive sheet at a high speed without damaging the semiconductor element and without breaking the group.

  Further, according to the present invention, a thin semiconductor wafer having a thickness of about 0.002 to 0.2 mm is cut into units of thin semiconductor elements (semiconductor chips) in a state of being attached to the adhesive sheet, and the cut thin wafer is cut. The semiconductor element group can be obtained in a tray-packed state or a state close to it, which can be peeled off from the adhesive sheet at high speed without breaking the semiconductor element group and without breaking, and can be carried separately. .

  Further, according to the present invention, a thin semiconductor wafer having a thickness of about 0.002 to 0.2 mm is cut into units of thin semiconductor elements (semiconductor chips) in a state of being attached to the adhesive sheet, and the cut thin wafer is cut. The semiconductor element group is peeled off from the adhesive sheet at a high speed without damaging each semiconductor element and without breaking, and the peeled semiconductor element group is sequentially transported in a predetermined unit, and each semiconductor element is sequentially placed on a tray or a substrate (circuit). This has the effect of being able to be mounted on a substrate.

  Further, according to the present invention, there is an effect that a high-quality thin IC card can be efficiently and inexpensively manufactured.

  An embodiment according to the present invention will be described with reference to the drawings.

  FIG. 1 shows a dicing (cutting) of a thin semiconductor chip (semiconductor element) from a thin semiconductor wafer (semiconductor substrate) on a circuit board constituting an IC card or the like according to the present invention, and mounting (storing) on a tray or the like. FIG. 1 is a diagram showing a schematic configuration of a first embodiment of an entire system to be implemented. This system separates a thin semiconductor chip (semiconductor element) 10 of about 0.002 to 0.2 mm by dicing (cutting) from a state of a thin semiconductor wafer (semiconductor substrate) of about 0.002 to 0.2 mm. Then, a separating mechanism (separating means) 100 for adsorbing a group of thin semiconductor chips (semiconductor elements) 20 in a row to the suction collet 101 at once, and a thin semiconductor wafer (semiconductor substrate) formed by the separating mechanism 100 Is separated from the group of thin semiconductor chips (semiconductor elements) 20 in a line state, which are sucked into the suction collet 101, carried in, and placed, and are separated and inverted for each thin semiconductor chip. A separation conveyor unit (transporting means) 200 for sucking the separated thin semiconductor chip by the suction nozzle 216, and suction by the suction nozzle 216 on the separation conveyor unit 200 Mounting mechanism for reducing the thin semiconductor chip 10 which is carried by mounting the trays Te composed of (a Tray section) 300.. In addition to the semiconductor wafer, the present invention can be applied to a semiconductor device such as a chip size package formed by a large number of substrates or tapes.

  Next, a method of manufacturing the work 60 supplied and placed on the stage 61 of the separation mechanism unit 100 will be described with reference to FIG.

  In the thin semiconductor wafer 40, a semiconductor circuit is formed in a chip unit on a base material such as silicon by an ordinary semiconductor manufacturing method. In the inspection process, the thin semiconductor wafer 40 in which the semiconductor circuit is formed is separated into non-defective pellets and non-repairable defective pellets by an electrical characteristic test, appearance inspection, and the like. A mark is attached to the pellet, or the position coordinates of the defective pellet are stored in a recording medium or a storage device of the inspection device in accordance with the product number of the thin semiconductor wafer.

An adhesive sheet 50 larger than the outer shape is adhered to the back surface of the thin semiconductor wafer 40 inspected in this manner by a sheet adhesive process. The pressure-sensitive adhesive sheet 50 includes a sheet base material 51 formed of a thin film having a diameter larger than that of a wafer by using an elastic resin such as PVC (polyvinyl chloride) or PET (polyethylene terephthalate). A predetermined adhesive is applied to one surface of the sheet substrate 51 to form an adhesive layer 52. The pressure-sensitive adhesive is a polyimide-based material that has a property of being cured by irradiation with ultraviolet (UV) light and having a reduced adhesive strength. As the pressure-sensitive adhesive, it is possible to use an acrylic material having a property of being hardened by application of heat and having a reduced adhesive strength. Of course, when using this adhesive, heat is applied instead of UV irradiation.

  Next, in the jig mounting step, as shown in FIG. 2A, the outer peripheral portion of the adhesive sheet 50 in which the thin semiconductor wafer 40 is adhered to a metal frame (carrier ring) 55 of stainless steel or the like is stretched without loosening. It is attached and attached.

  The thin semiconductor wafer 40 adhered on the adhesive sheet 50 mounted on the metal frame (carrier ring) 55 is subjected to a thin semiconductor chip using a thin grindstone 61 as shown in FIG. Disconnected every time. The thin semiconductor wafer 40 can be diced because the pressure-sensitive adhesive sheet 50 is adhered with an adhesive force that can be sufficiently held during dicing. Further, since the adhesive sheet 50 is not cut by the dicing, the cut semiconductor chip group 20 is in a state of being adhered to the adhesive sheet 50 with adhesive force.

  Next, as shown in FIG. 2C, the region where the semiconductor chip 10 is adhered to the adhesive sheet 50 is irradiated with ultraviolet rays (UV) to cure the adhesive 52 in the adhesive sheet 50 and reduce the adhesive strength. Let it.

  The work 60 manufactured as described above is supplied to the separation mechanism unit 100 and mounted and fixed on a movable stage (transporting means) 170.

  Next, the principle of the separation mechanism 100 according to the present invention will be described with reference to FIGS.

First, the operation of the separating mechanism (separating means) 100 will be described with reference to FIG. FIG. 3 (
As shown in a), the work 60 is strongly held by a chuck 150 for holding the entire surface of the semiconductor chip on which the electrodes 11 of the cut semiconductor chip are formed. The chuck 150 includes a chuck surface member 151 in which a groove 152 for vacuum suction is formed on the surface corresponding to each semiconductor chip 10, and the groove 152 is connected to a vacuum source 153. In this manner, the adhesive sheet near the inner peripheral end of the metal frame 55 is cut by rotating the cutter 155 on the work 60 held strongly by the chuck 150, and the metal frame 55 is separated from the adhesive sheet 50.

  Incidentally, the chuck 150 does not necessarily need to be formed of a vacuum chuck, but may be any one that can strongly hold each semiconductor chip. For example, a magnetic chuck or a freezing chuck (a semiconductor chip is provided by a rapid freezing action of rapidly freezing moisture on the chuck surface). (A group is fixed and detached by a thawing action).

  Further, it is also possible to freely change the vacuum pressure of the vacuum source 153 to make the chucking force of the chuck 150 variable depending on the type (material) of the semiconductor chip. In this embodiment, as shown in FIG. 30, as a vacuum source 153, a proportional electromagnetic valve 153b capable of controlling a flow rate by changing a voltage is provided between a pipe 153a and a vacuum pump 153c. Therefore, the vacuum pressure of the chuck 150 can be freely changed by changing the voltage applied to the proportional electromagnetic valve 153b from outside. Further, by controlling the vacuum pressure of the chuck 150, as shown in FIGS. 12 to 14, the pressure applied to the pressing sheet (tape) 192 at the opening can be variably set.

  Next, as shown in FIG. 3B, the chuck 150 and the clamping means 160 composed of a pair of clamp rollers are relatively moved and approached, and one end of the adhesive sheet 50 from which the metal frame 55 has been cut is put in a pair. Is clamped by a clamping means (pulling means) 160 composed of a clamp roller.

Subsequently, while further moving the chuck 150 and the clamping means 160 relatively, the entire clamping means 160 is rotated by 180 degrees about the shaft 161 as shown by an arrow 162, as shown in FIG. Thus, one end of the adhesive sheet 50 is in a state of being lifted upward.

  Subsequently, by further moving the chuck 150 and the clamping means 160 relatively, as shown in FIG. 3D, an adhesive sheet adhered to the thin semiconductor chip group with the adhesive force significantly reduced by UV irradiation. 50 is pulled from the thin semiconductor chip group held in the chuck 150 by being pulled in the lateral direction without being cracked. Also in this embodiment, the adhesive sheet is peeled off from the thin semiconductor chip group by the pulling force acting on the adhesive sheet. Therefore, the adhesive sheet is peeled from one end to the other end of each semiconductor chip, and the semiconductor chip is held by the chuck 150. The adhesive sheet 50 can be peeled off without breaking and damaging all of the thin semiconductor chips. Further, when the direction of peeling the thin semiconductor chip 10 from the adhesive sheet 50 is set so as to be peeled from the corner of the semiconductor chip, the peeling can be performed with a smaller force.

That is, in this embodiment, when the semiconductor chip 10 is peeled off from the group of thin semiconductor chips 10 by the tensile force F acting on the adhesive sheet 50, the acting direction angle ψ of the tensile force F with respect to the adhesive surface of the semiconductor chip and the force acting on the semiconductor chip 10. FIG. 4 shows the relationship between Fx and Fy. Since the peeling force Fx is close to Fx = Fcosψ, a smaller peeling force gives a larger peeling force, and the adhesive sheet 50 can be easily peeled from the group of thin semiconductor chips 10. On the other hand, the force Fy that resists the holding force of the semiconductor chip 10 on the chuck 150 is smaller when ψ is smaller, so that it is not necessary to increase the holding force of the chuck 150 very much. Can be significantly reduced.

Incidentally, there is a relationship between the material of the pressure-sensitive adhesive sheet 50 and the characteristics (softness) of the pressure-sensitive adhesive, and the thinner and softer the pressure-sensitive adhesive sheet and the pressure-sensitive adhesive (pressure-sensitive adhesive), the smaller the peel angle with the semiconductor chip 10 (the smaller the radius of curvature). (Small), it is clear that it adheres to the angle fixing jig 165 and easily peels off.

Therefore, a wedge-shaped peeling angle fixing jig (forming mechanism) 165 as shown in FIGS. 5A and 5B is used in order to minimize the acting direction angle ψ of the pulling force F and secure the angle. The wedge-shaped peeling angle fixing jig 165 serves to secure the peeling angle ψ and to align the peeling position with the cut thin semiconductor chip group in a straight line so as to concentrate the peeling force. . The tip 165a of the wedge-shaped peeling angle fixing jig 165 has a predetermined curved surface (radius of about 0.1 to 20 mm) with respect to the adhesive sheet so that the peeling force is not concentrated on one point as shown in FIG. Is formed to prevent the semiconductor chip 10 from cracking. If the radius of the curved surface is small, the peeling force is concentrated and the peeling is easy. Naturally, if the thickness of the pressure-sensitive adhesive sheet is reduced, the radius of the curved surface is reduced and the peeling force is concentrated. Further, it can be seen that the peeling angle に お け る of the wedge-shaped peeling angle fixing jig 165 is preferably about 10 ° to 20 ° from the relationship shown in FIG. The peeling angle ψ may include a case where the posture of the peeling angle fixing jig 165 is mechanically changed. In this case, the angle of the tip of the peeling angle fixing jig 165 is naturally smaller than about 10 ° to 20 °. However, as a condition for moving the wedge-shaped peeling angle fixing jig 165, it is necessary to bring the peeling angle fixing jig 165 into contact with the adhesive sheet 50 as shown in FIGS. For this purpose, the peeling angle fixing jig 165 may be pressed against the pressure-sensitive adhesive sheet 50 by pressing means 168 formed of a spring member or the like. As described above, the peeling angle fixing jig 165 is moved while being pressed by the pressing means 168, thereby preventing the peeling force of the adhesive sheet from being concentrated on the front end portion 165a and preventing the peeling curvature from increasing, thereby reducing the thickness. The possibility of breaking the semiconductor chip 10 is significantly reduced, and the suction of the semiconductor chip 10 can be maintained. By moving the peeling angle fixing jig 165 while pressing with the pressing means 168, even if the thickness of the thin semiconductor chip 10 varies, the same peeling curvature can be secured against the variation to ensure smoothness. It can be peeled off.

  Since the peeling angle fixing jig 165 can be finely moved up and down by the pressing force of the pressing means 168, the peeling angle fixing jig 165 is placed on the upper surface of the adhesive sheet 50 shown in FIG. 5 and 8, projections 169 are provided at both ends of the peeling angle fixing jig 165, as shown in FIGS. The height h of the projection 169 is slightly smaller than the thickness of the semiconductor chip 10, and in a region where the semiconductor chip 10 does not exist, the projection 169 is configured to contact, for example, the upper surface around the chuck 150. The pressing force of the pressing means 168 is configured to be variable according to the type (eg, thickness) of the semiconductor chip 10. That is, when the thickness of the semiconductor chip 10 is thin, the pressing force by the pressing means 168 is reduced, and when the thickness of the semiconductor chip 10 is thick, the pressing force by the pressing means 168 is increased to break the semiconductor chip 10. The adhesive sheet can be peeled off smoothly.

Next, a separating mechanism (separating means) 100 using the wedge-shaped peeling angle fixing jig (forming mechanism) 165 will be described with reference to FIG. FIGS. 7A and 7B are basically the same as FIGS. 3A and 3B. Next, as shown in FIG. 7B, the peeling angle fixing jig 165 is pressed by the pressing means 168 so as to be in contact with the upper surface of the adhesive sheet 50 and positioned at the right end. Next, while moving the chuck 150 and the clamping means 160 relatively, the entire clamping means 160 is rotated by 180 degrees about the shaft 161 as shown by an arrow 162, as shown in FIG. Then, one end of the adhesive sheet 50 is lifted upward, and the adhesive sheet 50 is bent by the tip 165a of the peeling angle fixing jig 165 pressed by the pressing means 168. Next, a pulling force F is applied to the adhesive sheet 50 by the clamp means 160 while moving the entire clamp means (tensile means) 160 at a speed almost twice the moving speed of the peeling angle fixing jig 165, and peeling. By concentrating the peeling force of the adhesive sheet on the curved surface formed at the tip 165a of the angle fixing jig 165, the adhesive sheet 50 is smoothly peeled from the end of each semiconductor chip 10 sequentially. As described above, the output of the torque motor is connected to one of the rollers of the clamp means 160 and a desired rotational torque is applied to apply a pulling force F to the adhesive sheet 50. What is necessary is just to make the whole moving speed almost twice the moving speed of the peeling angle fixing jig 165. Note that the peeling angle fixing jig 165 may be set at a fixed position, and the chuck 150 may be moved in the direction of the arrow. When the peeling angle fixing jig 165 is returned to the original position, in order to avoid contact with the upper surface of the chuck 150, the peeling angle fixing jig 165 may be raised or the chuck 150 may be lowered. .

As described above, the peeling angle fixing jig (pressed by the pressing means 168)
By using the molding mechanism 165, the peeling angle ψ is secured, and the peeling force can be concentrated by aligning the peeling position with the cut thin semiconductor chip group in a straight line. The adhesive sheet 50 can be peeled off smoothly without breaking. In particular, when the tip 165a of the peeling angle fixing jig 165 starts peeling the adhesive sheet 50 from the right end of the semiconductor chip 10 as shown in FIG. Since the semiconductor chip 10 is pressed by the peeling angle fixing jig 165 by the means 168 to peel the adhesive sheet 50, the adhesive sheet can be smoothly peeled from the semiconductor chip sucked and held by the chuck 150.

  In particular, by reducing the frictional force on the surface of the peeling angle fixing jig 165, the curvature of the pressure-sensitive adhesive sheet at the distal end portion can be reduced, and the pressure-sensitive adhesive sheet 50 can be easily peeled from the semiconductor chip.

  By the way, as an embodiment of the chuck 150, a configuration shown in FIGS. 9 and 10 can be considered. That is, in the chuck 150a shown in FIG. 9A, grooves or holes 152 connected to the vacuum suction holes 157 are formed at predetermined intervals in the chuck surface member 151a, and a ceramic material is formed thereon as shown in FIG. In this configuration, a porous suction plate 156 formed by the above method is provided. In particular, since the porous suction plate 156 requires a plurality of suction holes for each semiconductor chip, the distribution of the suction holes needs to be uniform over the entire surface, and the ceramic material has this property. Have and be appropriate. According to the chuck 150a, there is no need to block the suction holes other than the semiconductor chip group, and it is not necessary to align the arrangement of the suction holes with the arrangement of the semiconductor chips 10. However, when the porous adsorption plate 156 is used, as the pressure-sensitive adhesive sheet 50 is peeled off, the adsorption force is rapidly and greatly reduced. Therefore, as will be described later, the peeling angle fixing jig 165 can be prevented (decreased) by covering it with, for example, a tape 192 so as to follow the peeling angle fixing jig 165.

  Further, the chuck 150b shown in FIG. 9B has a configuration in which a vacuum suction hole 157 is formed in the chuck surface member 151b so as to conform to the arrangement of the semiconductor chips. According to the chuck 150b, when the semiconductor chip group adhered to the adhesive sheet 50 with the metal frame 55 attached thereto is held by the chuck 150b, the semiconductor chips 10 can be sucked by the suction holes 157 even if a slight displacement occurs. The present invention can be applied to a semiconductor chip having a large size. By applying a fluororesin film to the suction surface, the suction force is secured, and the circuit surface on which the electrodes and the like of the semiconductor chip are formed is sucked while securing a certain holding force. It is possible to do so. However, since charges are charged on the surface of the fluororesin film, it is sometimes possible to neutralize by ion blowing by an ion emitting means (not shown) so that the semiconductor chip is not affected. .

Further, the chuck 150c shown in FIG. 9C has a structure in which minute vacuum suction holes 157 are randomly formed in the chuck surface member 151c at intervals smaller than the size of the semiconductor chip. Therefore, it has an adsorption characteristic close to that of the porous adsorption plate 156 shown in FIG. According to the chuck 150c, there is no need to block the suction holes other than the semiconductor chip group, and it is not necessary to align the arrangement of the suction holes with the arrangement of the semiconductor chips 10. However, when the chuck 150c is used, as the pressure-sensitive adhesive sheet 50 is peeled off, the attraction force decreases. Then, as described later, the peeling angle fixing jig 165 is covered with, for example, a tape 192 so as to follow the peeling angle fixing jig 165, so that a reduction in vacuum force can be prevented. By applying a fluororesin film to the suction surface, the suction force is secured, and the circuit surface on which the electrodes and the like of the semiconductor chip are formed is sucked while securing a certain holding force. It is possible to do so. However, since charges are charged on the surface of the fluororesin film, it is sometimes possible to neutralize by ion blowing by an ion emitting means (not shown) so that the semiconductor chip is not affected. .

The chuck 150d shown in FIGS.
d, a groove or hole 152 connected to the vacuum suction hole 157 is formed at predetermined intervals, and the suction hole is formed of a ceramic material or the like in which the suction hole is uniformly distributed, and a semiconductor chip unit is formed by a partition plate or an adhesive 159 or the like. Alternatively, a porous suction plate 156 ′ divided into about one to three rows along the tip 165 a of the peeling angle fixing jig 165 shown in FIG. 5 is provided, and a closing mechanism 70 for closing each vacuum suction hole 157 is provided. Is provided. The closing mechanism 70 includes a cylindrical driving source 71, an output member 72 which is an output of the driving source 71 and closes by contacting each vacuum suction hole 157, and a bellows or a vacuum seal for maintaining a vacuum in the vacuum chamber. 73. The closing mechanism 70 may be sequentially driven in accordance with a decrease in the vacuum pressure in the vacuum chamber or may be performed in accordance with the amount of movement of the peeling angle fixing jig 165. When the output member 72 is closed, a pore 72a for connecting the vacuum suction hole 157 and the vacuum chamber is formed when the output member 72 is closed, so that the semiconductor chip 10 can be held with a weak suction force. Further, instead of forming the fine holes 72a at the tip of the output member 72, a weak adhesive force may be provided between the upper surface of the porous suction plate 156 'and the semiconductor chip 10 instead.

  Therefore, if the vacuum suction holes at the locations where the semiconductor chips from which the adhesive sheet 50 has been completely peeled off are vacuum-sucked are sequentially closed by driving the mechanism 70 with the output member 72, this will occur with the peeling of the adhesive sheet 50. It is possible to prevent a reduction in vacuum suction force. However, the suction holding power of the semiconductor chip 10 at that location can be obtained through the fine holes 72a. In addition, the semiconductor chip can be held on the chuck by giving a weak adhesive force to the porous suction plate 156 '. In any case, when the porous suction plate 156 is used, when the pressure-sensitive adhesive sheet 50 starts to be peeled off, the vacuum suction force rapidly decreases, but the porous suction plate divided by the partition plate or the adhesive 159 or the like is used. By using the 156 'and the closing mechanism 70, a sharp decrease in the vacuum suction force can be significantly reduced.

  Then, after the peeling of the adhesive sheet 50 is completed, all the semiconductor chips 10 can be held with a strong suction force by opening all the vacuum suction holes by all the closing mechanisms 70 again. In addition, by providing a mechanism 70 for partitioning and closing the porous suction plate 156 'for each semiconductor chip, by operating the closing mechanism 70 for each semiconductor chip, the semiconductor chip can be picked up from the chuck 150d. Further, by providing a mechanism 70 for partitioning and closing the porous suction plate 156 'in units of rows, the semiconductor chip can also be picked up from the chuck 150d in units of rows by operating the closing mechanism 70 for units of row.

When the porous suction plate 156 is used as the chuck 150a as shown in FIGS. 5 and 9 (a), the diameter D of the porous suction plate 156 should be adjusted to the diameter of the semiconductor wafer as shown in FIG. As a result, the area of the suction surface can be reduced, and as a result, the rate of decrease in vacuum when the semiconductor wafer is suction-held can be suppressed low, and the capacity of the vacuum pump can be reduced. The holes 75 provided around the chuck surface member 151a shown in FIG. 11 are used for fitting and positioning by fitting into projections provided on the upper surface of the chuck body.

As shown in FIG. 7, the row of semiconductor chips from which the adhesive sheet 50 is being peeled is pressed by a pressing means 195 such as a spring so as to follow immediately after the tip 165a of the peeling angle fixing jig 165. Each semiconductor chip 10 is always pressed by any one of the peeling angle fixing jig 165 pressed by the pressing means and the pressing means 167 pressed by the pressing means 195. As a result, even if the chucking force of the chuck 150 is weak, the semiconductor chip group from which the adhesive sheet 50 has been peeled can be held by the chuck 150. That is, by making the gap H between the peeling angle fixing jig 165 and the pressing means 167 smaller than the size W of the semiconductor chip, each semiconductor chip 10 is always pressed against the peeling angle fixing jig 165. It is possible to press down by any means of the means 167. In particular, when the tip 165a of the peeling angle fixing jig 165 is located near the left end of the semiconductor chip, the effect of pressing the semiconductor chip 10 by the pressing means 167 can be exhibited. In this case, FIG.
7) from the state shown in FIG. 7 (c) to the state shown in FIG. 7 (c), lifting one end of the adhesive sheet 50 upward, bending it at the tip 165a of the peeling angle fixing jig 165, and then retracting the pressing means 167. Therefore, it is necessary to enter the jig 165 so as to follow immediately after the distal end portion 165a of the peeling angle fixing jig 165. In this case, the pressing means 167 is configured by attaching a long roller that rolls to the tip of the pressing mechanism, and the pressing means 167 is moved between the chuck 150 and the chuck 150 so as to follow immediately after the tip 165 a of the peeling angle fixing jig 165. You may move relatively.

Next, another method of providing a large number of porous suction plates 156 and minute vacuum suction holes on the chuck surface to prevent a decrease in vacuum suction force caused by peeling of the adhesive sheet 50 will be described. That is, as shown in FIG. 12, the entirety including the row of semiconductor chips from which the adhesive sheet 50 is being peeled off immediately after the tip 165 a of the peeling angle fixing jig 165 is released from the reel 191. By covering the adhesive sheet 50 with the tape 192, it is possible to prevent a decrease in the suction force of the chuck 150 and to maintain the suction force of the semiconductor chip, from which the adhesive sheet 50 is to be peeled off, on the chuck 150. That is, the tip 193 of the tape 192 is fixed to the chuck 150 by pressing means 194 such as a pusher, and the metal pressing means 167 pressed by the pressing means 195 such as a spring is relatively moved between the tape 150 and the chuck 150. By doing so, the tape 192 is released from the reel 191. This is schematically shown in FIG.
Here, the pressing force against the tape 192 by the pressing means 167 such as a spring via the pressing means 167 can be changed according to the thickness and material of the semiconductor chip 10.

  Incidentally, if the tape 192 is first unwound from the reel 191 after the tip of the tape 192 is fixed to the chuck 150, the tape 192 can be sucked by the suction force leaking from the chuck 150, and as a result, FIG. As shown in b), the entire tape including the row of semiconductor chips from which the adhesive sheet 50 is being peeled off is directly covered with the tape 192 so as to follow immediately after the tip 165a of the peeling angle fixing jig 165. It is possible to prevent the suction force of the semiconductor chip from peeling off the adhesive sheet 50 while maintaining the suction force of the semiconductor chip to be peeled off.

  In particular, as shown in FIG. 14, when the size of the semiconductor chip 10 is reduced, it is necessary to reduce the gap between the tip 165a of the peeling angle fixing jig 165 and the tape 192 to be followed. That is, it is necessary to satisfy the following equation (1).

W> t1 + t2 + R1 + R2 (Equation 1)
Here, W is the size of the semiconductor chip 10, t1 is the thickness of the adhesive sheet 50 (including the adhesive), t2 is the thickness of the tape 192, R1 is the radius of the tip 165a of the peeling angle fixing jig 165, R2 is the radius of the metal pressing means 167.

  Therefore, R1 and R2 are set to about 0.1 mm, t1 is set to about 0.065 mm, t2 is set to about 0.05 mm, and the gap H is set to 0.1 mm, so that the size W of the semiconductor chip becomes about 0.415 mm. The adhesive sheet 50 can be peeled off smoothly in a state where the chip 10 is sucked by vacuum. Further, by covering the semiconductor chip from which the adhesive sheet 50 has been peeled off with the tape 192, it is possible to prevent a decrease in the attraction force.

Further, the attraction force to each semiconductor chip 10 is proportional to the product of the attraction area to each semiconductor chip 10 and the degree of vacuum. On the other hand, the peeling force of each semiconductor chip 10 is proportional to the product of the size W of the semiconductor chip 10 and the adhesive force to the adhesive sheet 50. Therefore, as the size W of the semiconductor chip 10 increases, it is preferable to increase the degree of vacuum.

The direction in which the pressure-sensitive adhesive sheet 50 is peeled off from the cut semiconductor chip group is determined in the arrangement direction of the semiconductor chips as shown in FIG. 5A and the arrangement direction of the semiconductor chips as shown in FIG. There is a direction (for example, about 45 °) inclined in a plane with respect to the above. In the case shown in FIG. 5B, the pressure-sensitive adhesive sheet starts to be peeled off from the corners with respect to each semiconductor chip, and thus is more easily peeled off than in the case shown in FIG. 5A. In this case, the force acting on each semiconductor chip decreases at the center at the maximum toward the left and right ends, which is advantageous in holding the semiconductor chip by suction.

  As a method of peeling the adhesive sheet 50 from the semiconductor chip array using the peeling angle fixing jig 165, there is also a method shown in FIG. In this method, the peeling angle fixing jig 165 is pushed into the adhesive sheet 50 while the adhesive sheet 50 is pulled with a desired tension by the clamping means 160, so that the lower surface of the tip of the peeling angle fixing jig 165 is adhered. The adhesive sheet 50 is peeled off from the semiconductor chip array by forming a folded portion of the sheet 50. In this case, a gap slightly larger than the two adhesive sheets may be formed between the lower surface of the peeling angle fixing jig 165 and the upper surface of the semiconductor chip. It is not necessary to press downward as shown by. If the peeling angle fixing jig 165 is pressed downward as indicated by an arrow 76, it may be pressed with a very weak force. According to this method, the pressure-sensitive adhesive sheet 50 can be peeled from the semiconductor chip array with the peel angle of the pressure-sensitive adhesive sheet 50 minimized. Can be peeled from the array. Further, by minimizing the peeling angle of the pressure-sensitive adhesive sheet 50, the pressure-sensitive adhesive which has been cured by irradiation with ultraviolet rays and has reduced adhesive strength is easily broken and peeled off.

  By the way, as the number of semiconductor chips stuck to the adhesive sheet 50 decreases significantly as the pressure of the adhesive sheet 50 approaches the end of peeling of the semiconductor chip held by the chuck 150, the reaction force of the peeling force Fx In some cases, a large force acts to move the semiconductor chip held by the chuck 150 in the lateral direction and moves, so that the adhesive sheet cannot be peeled off from a few semiconductor chips. Even if the semiconductor chip is peeled off, the semiconductor chip is shifted laterally on the suction surface, and the semiconductor chip cannot be picked up, or the semiconductor chip comes into contact with the peeled chip to cause a crack or the like. Therefore, by temporarily fixing the end of the adhesive sheet 50 to the periphery (frame) of the chuck 150, lateral displacement of the semiconductor chip from the suction surface can be prevented.

  Next, a specific embodiment of the separating mechanism (separating means) 100 will be described with reference to FIG. The work 60 is supplied to a peeling station where the adhesive sheet is peeled by the transporting means 170 capable of retracting, with the adhesive sheet 50 facing upward, and the metal frame 55 is positioned and fixed.

  Two chucks 150 are provided on the index stage 172 so that the peeling of the adhesive sheet 50 and the pickup of the array of semiconductor chips from which the adhesive sheet 50 has been peeled off are performed in parallel. Each chuck 150 is mounted on each support member 171. Each of the support members 171 is provided on a base 175, and is supported by a drive source 173 so as to be able to move up and down with respect to an index stage 172 indexed by a drive force from the drive source 174. Therefore, in the peeling station, by raising the chuck 150 to apply the chucking force, the chuck 150 strongly applies the entire surface of the work 60 fixed to the support member 171 on which the electrode 11 of the semiconductor chip is formed. Will be retained. Then, by driving the drive source 182, the support member 179 that supports the rotary member 178 to which the cutter 155 is attached is lowered, and the drive source 180 is driven to rotate the rotary member 178, and the tip of the rotary member 178 is rotated. By cutting the periphery of the adhesive sheet with the cutter 155, the metal frame 55 is separated from the adhesive sheet 50. 181 is a member that supports the support member 179 so as to be able to move up and down.

Next, the cutter 155 is raised, the driving source 173 is driven, the chuck 150 is lowered, the conveying means 170 is retracted, the chuck 150 is raised again, and the starting end of the adhesive sheet 50 is clamped by a pair of clamps. At 160, a state in which clamping is possible is achieved. The clamping means 160 has a moving mechanism (constituted by a guide rail and a feed screw mechanism 184) having a drive source 181 for moving the clamp in the lateral direction.
And a rotation mechanism (not shown) having a drive source (not shown) for rotating by 180 degrees. Further, the peeling angle fixing jig 165 which is pressed by the pressing means 168 is supported so that it can be finely moved up and down, and the reel 191 which winds and stores the tape 192 is supported and pressed by the pressing means 195. A support member that supports the metal pressing means 167 so that it can be finely moved up and down is mounted on a moving mechanism (comprising a guide rail and a feed screw mechanism 187) having a driving source 186 that moves in the horizontal direction. ing. Therefore, as shown in FIG. 14, the peeling angle fixing jig 165 and the pressing means 167 can be moved in the lateral direction together with the predetermined interval H. The reel 191 and the pressing means 167 need to be retracted on the support member until the clamping means 160 clamps the starting end of the adhesive sheet and rotates it 180 degrees.

  Next, as described above, after the starting end of the adhesive sheet 50 is clamped by the clamping means 160, the adhesive sheet is bent by the tip 165a of the peeling angle fixing jig 165 pressed by the pressing means 168, and the peeling angle is further fixed. The tape 150 is released from the reel 191 by the pressing means 167 pressed by the pressing means 195 so as to follow the jig 165 to cover the semiconductor chip group from which the adhesive sheet has been peeled off, and the chuck 150, the clamping means 160, and the peeling angle By the relative operation of the fixing jig 165 and the pressing means 167, the adhesive sheet 50 is smoothly peeled off from the thin semiconductor chip group held by the chuck 150 without causing a decrease in the attraction force of the chuck 150, and the peeled adhesive is provided. The sheet is removed by suction by the suction means 176.

  Next, the thin semiconductor chip group from which the adhesive sheet 50 has been peeled off by rotating the index stage 172 is moved from the peeling station to the pickup station.

In the pickup station, the chucking force of the chuck 150 on the thin semiconductor chip group is weakened, the driving source 102 such as a cylinder is controlled to lower the moving block 105 and the suction collet 101, thereby compressing the spring member 106. Then, the tip of the suction collet 101 is separated from the pressure-sensitive adhesive sheet 50 and placed, for example, in contact with the thin semiconductor chip group 20 in one row unit, or with a slight gap. By adsorbing the semiconductor chip 20 and raising the suction collet 101 as the moving block 105 is raised, the thin semiconductor chip group 20 in one row unit is separated from the adhesive sheet 50, for example. That is, in order to pick up a semiconductor chip group composed of many rows from the indexed chuck 150 by the suction collet 101 in, for example, a row at the pickup station, the chuck 150 or the suction collet 101 is relatively viewed. It is necessary to provide a mechanism for vertical movement on the paper surface of No. 16. Thus, the suction collet 101 can sequentially pick up the thin semiconductor chip groups 20 in one-row units from the semiconductor chip group composed of many rows on the chuck 150.

  Further, the drive source 108 is driven to move the suction collet 101, which has sucked the thin semiconductor chips 20 in, for example, one row by the feed mechanism 109, to the separation conveyer 200 together with the support member 103 as shown in FIG. , A drive source 102 such as a cylinder is controlled to lower the moving block 105 and lower the suction collet 101, thereby compressing the spring member 106 and adsorbing the tip of the suction collet 101. By bringing the group 20 into contact with the conveyor and releasing the suction by the suction collet 101, the group 20 can be placed on the conveyor 201. As described above, for example, for each semiconductor chip group in one row, the surface opposite to the electrode surface can be sucked by the suction collet 101 and placed on the conveyor 201 with the electrode surface facing down.

Next, a thin semiconductor chip (
A first embodiment of an entire system in which a semiconductor element) is diced (cut) from a thin semiconductor wafer (semiconductor substrate) and packed in a tray or mounted on a circuit board constituting an IC card or the like will be described. The description of the separation mechanism 100 is omitted because it has already been given. The separation conveyor unit 200 is provided on a base 218, and conveys a group 20 of thin semiconductor chips (semiconductor elements) in a line state, which are carried in and placed by the suction collet 101 of the separation mechanism unit 100. Detecting a defective chip marked on a semiconductor chip conveyed by the conveyer 201 and securing a space for carrying a group 20 of thin semiconductor chips (semiconductor elements) conveyed by the conveyer 201 and held by the suction collet 101. , A sensor 203 that detects that the semiconductor chip has been transported by the conveyor 201 and has come to the separation position, and a sensor 203 that has detected that the defective semiconductor chip detected by the sensor 202 has come to the separation position. In this case, a chute 206 and a storage container 207 are provided to discharge the chips. Discharging means, means 250 for transferring non-defective semiconductor chips from conveyor 201 to conveyor 251, conveyor 251 for conveying non-defective semiconductor chips, and imaging means for measuring the outer shape of semiconductor chips 10 conveyed by conveyer 251 209 and a transport mechanism 230 for sucking the semiconductor chip 10 conveyed by the conveyor 251 by the suction nozzle 216 and conveying the semiconductor chip 10 to the tray filling section (mounting mechanism section) 300. In the case of this embodiment, as shown in FIG. 16, in the separation conveyor section (transporting means) 200, the thin semiconductor chip group 20 is placed on the conveyor 201 with the electrode surface facing down. The mechanism 208 becomes unnecessary.

The transport mechanism 230 has a moving unit 210 that moves along a guide 212, a driving source 211 for moving the moving unit 210 via a feed mechanism 213, and a suction nozzle 216. A block 215 with a suction nozzle is supported by the source 214 on the moving unit 210 so as to be able to move up and down. Further, the sensors 202 and 203, the imaging unit 209, the driving source for driving the conveyor 201, the driving sources 211 and 214 for the transport mechanism 230, and the like are connected to a control device (not shown). Then, the control device performs various driving sources 211 based on information obtained from the sensors 202 and 203 and the imaging unit 209 and the like.
, 214 are controlled.

Therefore, when it is detected by the sensor 202 that a space for mounting the group of thin semiconductor chips (semiconductor elements) 20 is secured, the group of thin semiconductor chips (semiconductor elements) is separated from the separation mechanism 100 by the suction collet 101. 20 is carried in and placed on the conveyor 201. Further, the defective semiconductor chip marked by the sensor 202 is detected. Then, when the sensor 203 detects each semiconductor chip that has been transported by the conveyor 201 and has come to the separation position, the nozzle of the transfer means 250 is extended, and the semiconductor chip of a non-defective product that comes down to the separation position is sucked. Transfer to conveyor 251. Then, the outer shape of the semiconductor chip conveyed by the conveyor 251 is measured by the imaging means 209 and input to the control device. Actually, the image pickup means 209 picks up an image of the side of the semiconductor chip on which the electrode 11 is not formed, so that only information on the outer shape is obtained. Based on this information, the semiconductor chip 10 sucks the suction nozzle 216. Will be done. That is, as shown in FIGS. 18C and 18D, position information (δx, δ) of the semiconductor chip 10 sucked by the suction nozzle 216 shown by the solid line with respect to the suction nozzle 216 shown by the chain line in FIG. δy) is obtained from information on only the outer shape measured by the imaging unit 209, and is input to the control device.

  Further, the chips transported by the conveyor 251 are sucked by the suction nozzles 216 of the transport mechanism 230 and transported to the mounting mechanism unit (tray packing unit) 300.

In the mounting mechanism unit (tray filling unit) 300, the semiconductor chip sucked by the suction nozzle 216 and conveyed by the conveyance mechanism 230 is simply moved down by the suction nozzle 216, and the X chip provided on the base 307. -It can be mounted on the circuit board 30 on which the tray 2 or IC card or the like which is placed on the Y stages 302 and 303 and positioned by the XY stages 302 and 303 is formed. 2 can be packed in a tray). In particular, when mounting the semiconductor chip on the circuit board 30, it is necessary to position and mount the electrodes 11 formed on the semiconductor chip and the electrodes formed on the circuit board 30. By the way, the image pickup means 306 is provided in a path on which the semiconductor chip sucked by the suction nozzle 216 is transferred by the transfer mechanism 230, and picks up an image of the side of the semiconductor chip on which the electrode 11 is formed, and sets each electrode (pad ) 11 position (d1x, d1y) (d2
x, d2y) are measured and input to the control device 80. To the last, the semiconductor chip 10 is transported by the transport mechanism 230 to the mounting mechanism 300 based on the suction nozzle 216 for a predetermined distance. On the other hand, the mounting mechanism unit 300 needs positional information of each electrode 11 formed on the semiconductor chip with reference to the suction nozzle 216. In the control device, the position information (d1x, d1y) (d2x, d2y) of each electrode (pad) 11 based on the outer shape imaged by the imaging unit 306 and the imaging information of the respective electrodes 11 are captured by the imaging unit 209. It is possible to calculate based on the external position information (δx, δy) based on the suction nozzle. The positional information of the electrodes formed on the circuit board connected to the electrodes 11 formed on the semiconductor chip in advance is input to the control device and stored in, for example, a storage device. Therefore, when the control device mounts the semiconductor chip on the circuit board 30, the position information of the electrodes formed on the circuit board and each of the electrodes 11 formed on the semiconductor chip with reference to the calculated suction nozzle 216 are used. The drive sources 304 and 305 for driving the XY stages 302 and 303 are controlled based on the positional information of the XY stages 302 and 303 to position the XY stages 302 and 303 so that the electrodes formed on the circuit board can be positioned. The electrodes formed on the semiconductor chip can be connected to each other by using a bonding material. In the case of mounting (storage) on the tray 2, since the positioning accuracy is not required, the control is simplified.

The case where the sensor 202 detects a defective semiconductor chip in the separation conveyor unit 200 has been described. However, as described above, in the state of the semiconductor wafer 40, the defective semiconductor chip is detected as shown in FIGS. Semiconductor wafer coordinates (
It is shown in FIG. Since the position information in (1) is detected by the inspection, if the position information is input to the control device, the defective semiconductor chip can be removed at the separation position by the discharge means 206 and 207.

  Next, a description will be given of an embodiment in which the separating mechanism 100 is formed in a vertical shape. FIG. 20 is a schematic diagram showing an embodiment in which the separation mechanism unit 100 has a vertical shape. It is necessary to add a mechanism capable of converting the vertical direction to the horizontal direction as an operation of transporting the suction collet 101a in the suction collet unit 120a, which is a transport mechanism, so that a large number of separation mechanism units 100 can be installed side by side. is there. When the separation mechanism unit 100 is made horizontal as described above, the transport operation of the suction collet 101 to the separation conveyor unit 200 shown by 130 in FIG. 1 requires a vertical direction and a horizontal direction. However, by making the separation mechanism unit 100 horizontal, it becomes possible to arrange a plurality of separation mechanism units 100 side by side, and it becomes possible to supply more semiconductor chip groups 20 in a row to the separation conveyor unit 200. .

Next, another embodiment of the suction collet unit 120 will be described with reference to FIG. That is, when the size of the semiconductor chip is reduced to about 0.4 to 0.5 mm, it becomes difficult to align the arrangement of the semiconductor chips held by the chuck 150 with the suction holes of the suction collet 101. As in the case of the chuck 150, the collet 101 is formed of a suction collet 101b having a suction surface provided with a porous suction plate 77 made of ceramics or the like, or a very minute suction hole is formed at a high density on the suction surface at random. With the use of the suction collet 101c described above, it is possible to pick up a semiconductor chip group in a row state (in units of rows or collectively on the entire surface) from the chuck 150.

  When the semiconductor chip group is sucked by the suction collet 101 from the chuck 150 all at once and mounted on the transport system 201, the suction nozzle 216 for picking up the semiconductor chip from the transport system 201 is caused to move two-dimensionally in x and y. It may be configured as follows.

  When the size of the semiconductor chip is large, a plurality of rows of semiconductor chip groups are picked up from the chuck 150 at a time by using the suction collet 101d, and when mounting the semiconductor chip group on the transport system 201, the mechanism 78 for closing the suction hole is selected. For example, it can be mounted in a single row by operating it in a row. In addition, the semiconductor wafer has a circular shape, and the suction collet is provided with a predetermined number of suction holes. Therefore, the suction collet is held at the end of the circular semiconductor chip group weakly held by the chuck 150. Since the semiconductor chip does not exist at a position opposing the suction hole when it is located at the position (2), a decrease in the suction force of the suction collet can be reduced by closing the suction hole with the mechanism 78 for closing the suction hole. Also, by selectively operating the mechanism 78 for closing the suction hole, it is possible to prevent a desired semiconductor chip from being picked up from the chuck 150.

  Further, if the suction collet 101e composed of a number of nozzles is used, it can be mounted on the transport system 201 in an arbitrary pattern.

Also, since the peeling station and the pick-up station are separated, it may be time-consuming to pick up the semiconductor chip 10 from the chuck 150. Therefore, the suction collet unit 120 and the separation conveyer unit 200 are eliminated and directly connected to the mounting mechanism unit 300. can do. That is, the semiconductor chips can be independently picked up from the chuck 150 of the pickup station by the suction nozzle 216. In this case, it is necessary to provide a mechanism for moving the moving unit 210 in two x and y directions, or provide a stage mechanism for moving the x and y two directions in the support member 171 that supports the chuck 150. .

  When the mounting mechanism unit 300 is directly connected to the separation mechanism unit 100, the speed of mounting on the tray 2 or the circuit board can be improved by using a plurality of suction nozzles 216. When the mounting mechanism unit 300 is directly connected to the separation mechanism unit 100 and the semiconductor chip needs to be inverted, the inversion mechanism 208 is disposed between the chuck 150 in the pickup station and the suction nozzle 216 of the mounting mechanism unit 300. Should be provided. If the tray 2 having a suction function is used, if two trays are used to invert one of the trays having the suction function and stored in the other tray, the semiconductor chip groups stored in the tray are collectively collected. Can be inverted.

Next, an embodiment in which the arrangement of the semiconductor chips on the chuck 150 is inverted and also functions as a tray will be described with reference to FIG. In this embodiment, as shown in FIG. 22A, a tape 192 'having a weak adhesive force on the lower surface is used as a tape covering the semiconductor chip group from which the adhesive sheet 50 has been peeled off, and the starting end of the tape 192' For example, the end is pressed against the frame 55 with a pressing roller 194 ′ and adhered (attached) again, and the end is cut with a cutter 81 such as a grindstone as shown in FIG. All of the semiconductor chip groups thus obtained are adhered again to the tape 192 ′ having a low adhesive strength, which is adhered to the frame 55 again. The semiconductor chip group adsorbed by the chuck 150 is adhered to the tape 192 ′ having a weak adhesive force by moving the pressing means 167 pressed by the pressing means 195. In addition, the adhesive sheet 50 covers the group of peeled semiconductor chips in a state where the tape 192 ′ follows the peeling angle fixing jig 165 pressed by the pressing means 168. It can also be prevented. However, in the case where the tape merely covers the tape, it is sufficient that the tape is long enough to cover the reel 191, but in the case of the tape 192 ′ having a weak adhesive strength, the tape 192 ′ has a predetermined length. Since the reel 191 is cut, it is necessary to store and supply a considerable amount of tape 192 ′ to the reel 191. The feeding roller 80 is used for feeding the tape 192 ′ from the reel 191 and fixing the starting end to the frame 55. Next, as shown in FIG. 22 (c), the semiconductor chips adhered to the tape 192 'having a weak adhesive force adhered to the frame 55 are weakened by the chuck 150 to reduce the suction force by the chuck 150 as shown by arrows. When the frame 55 is gripped and inverted by an inversion mechanism (not shown), the frame can be picked up by suction by the suction collet 101 or the suction nozzle 216. As a result, the semiconductor chip group can be inverted and sucked by the suction collet 101 or the suction nozzle 216.

In addition, the semiconductor chip array adhered to the tape 192 ′ having a weak adhesive force attached to the frame 55 can be carried as a tray by being carried. If it is difficult to carry it naked, it may be stored in a container such as a cassette. Then, a tape 192 having a weak adhesive strength attached to the frame 55
The semiconductor chip array adhered to the 'can be stored in a container and sold as a product. The user can set this in a mounting machine, pick up the semiconductor chip in the mounting machine, mount the semiconductor chip on a circuit board or the like, and mount it. Further, the semiconductor chip array adhered to the tape 192 ′ having a weak adhesive force attached to the frame 55 is set by a carrying machine installed at another place by carrying the semiconductor chip array using a carrier means. , A semiconductor chip can be picked up, mounted on a circuit board or the like, and mounted.

Next, another embodiment in which the arrangement of the semiconductor chips on the chuck 150 also serves as a tray will be described with reference to FIG. In this embodiment, as shown in FIG. 23, an adhesive sheet 86 having an adhesive layer 86a having a weak adhesive force on an upper surface of a chuck 150 is adsorbed on an upper surface of a chuck 150. When carrying the adhesive sheet 86, it is desirable that the adhesive sheet 86 be attached to, for example, a metal frame 85. The outer diameter of the metal frame 85 needs to be smaller than the inner diameter of the metal frame 55. As described above, the pressure-sensitive adhesive sheet 86 is previously adsorbed on the upper surface of the chuck 150, and the work 60 is placed on the pressure-sensitive adhesive sheet 86 to hold each semiconductor chip cut by the weak adhesive force of the pressure-sensitive adhesive sheet 86. Becomes possible. Next, the pressure-sensitive adhesive sheet 50 is bent and peeled off from the arrangement of the semiconductor chips held by the pressure-sensitive adhesive sheet 86 with a weak adhesive force by using the peeling angle fixing jig 165 pressed by the pressing means 168. However, since the holding force of the adhesive sheet 86 on the semiconductor chip is weak, as shown in FIG. 7, the pressing means 167 pressed by the pressing means 195 is moved backward by approaching the tip 165a of the peeling angle fixing jig 165. There is a need. Further, if the method shown in FIG. 15 is used, the adhesive sheet 50 can be peeled from the semiconductor chip array even if the holding force of the adhesive sheet 86 on the semiconductor chip is weak. As described above, the semiconductor chip arrangement in which the adhesive sheet 50 is peeled off and held on the adhesive sheet 86 can be obtained.

  First, since the holding force of the adhesive sheet 86 on the semiconductor chip is weak, it can be picked up by the suction collet 101 or the suction nozzle 216 as it is.

  Second, the suction force of the chuck 150 is weakened, and the semiconductor chip array adhered to the adhesive sheet 86 having a weak adhesive force attached to the frame 85 is carried, thereby serving as a tray. . If it is difficult to carry it naked, it may be stored in a container such as a cassette. Then, the semiconductor chip array adhered to the adhesive sheet 86 having a weak adhesive force attached to the frame 85 can be stored in a container and sold as a product. The user can set this in a mounting machine, pick up the semiconductor chip in the mounting machine, mount the semiconductor chip on a circuit board or the like, and mount it. In addition, the semiconductor chip array adhered to the adhesive sheet 86 having a weak adhesive force attached to the frame 85 is set by using a transporting means to a loading machine installed at another place by carrying it using a transporting means. , A semiconductor chip can be picked up, mounted on a circuit board or the like, and mounted.

In the embodiment described above, the thin semiconductor wafer is cut into units of thin semiconductor elements (semiconductor chips) with the thin semiconductor wafer attached to the adhesive sheet, and the cut thin semiconductor element group is peeled off from the adhesive sheet. The case where the peeled semiconductor element group is sequentially transported in a predetermined unit and each semiconductor element is sequentially packed in a tray or mounted on a mounted substrate (circuit board) and mounted is described, but not a thin semiconductor wafer. A semiconductor device such as a chip size package formed by a large number of substrates or tapes (electronic component: a size of about 0.3 to 20 mm, a thickness of 0.5 mm or less, for example, a thin object such as quartz (a thickness of about 50 μm or less) , Brittle objects, information equipment parts, etc.) on a pressure-sensitive adhesive sheet, and cut a flat substrate or tape to produce a semiconductor device (electronic component) unit The separated semiconductor device group is separated from the adhesive sheet, the separated semiconductor device group is sequentially transported in a predetermined unit, and each semiconductor device is sequentially packed in a tray or mounted on a substrate (circuit board) to be mounted. It is also possible to apply when implementing. That is, various forms can be considered as the state of sticking to the adhesive sheet.

  As described above, in a state where the electronic component is stuck to the adhesive sheet, the broken substrate or tape is cut to be separated into electronic component units, and the mounting surface of the separated electronic component group is held by the chuck so that the electronic component is held. Since the component group is peeled off from the batch adhesive sheet, the electronic component can be supplied to the mounting position at high speed without inverting the electronic component.

  Next, another embodiment of the above-described separating mechanism (separating means) 100 will be described with reference to FIGS.

FIG. 31 is a diagram schematically illustrating a group of the semiconductor chips 10 that are adhered to the adhesive sheet 50 stuck (attached) to the metal frame 55 and diced. For a group of semiconductor chips 10 diced from the state of the semiconductor wafer, an address called a map is designated to the separation mechanism (separation means) 100 as shown in FIG. That is, the bold frame extends along the x-axis along x1, x2,..., Y-axis with respect to the intersection of the x-axis and the y-axis with respect to the group of the semiconductor chips 10 diced into a predetermined shape. Along the lines y1, y2,... In this state, (x1, y1) and (x3, y3) are chips on which a test pattern used for testing a semiconductor chip is formed, and have a surface state different from that of a chip used in a normal product. Squeezed.

  In the wafer state, an address called a map (position coordinates of defective pellets) determined to be defective in the performance test (operation test) is stored in the recording medium (FD) or the storage device of the inspection apparatus, and It is designated and input to a control device (not shown) of the separation mechanism (separation means) 100 connected to the storage device via a network.

  FIG. 32 shows a positioning mechanism 320 that positions the group of the semiconductor chips 10 by abutting the reference end surface 55a of the metal frame 55 to which the adhesive sheet 50 on which the group of the semiconductor chips 10 is adhered to the reference positioning pins 322a and 322b. FIG. By providing this positioning mechanism 320 on, for example, the transporting means 170 shown in FIG. 16, the workpiece 60 can be supplied to the peeling station and positioned and fixed.

  FIG. 33 shows, based on the principle of the separating mechanism (separating means) 100 shown in FIG. 3, detecting (recognizing) the appearance of a damaged semiconductor chip before separating the adhesive sheet 50 from the metal frame (carrier ring) 55. FIG. 5 is a diagram showing a first embodiment in which the pickup of the defective semiconductor chip is stopped at the time of pickup to stop the semiconductor chip from being mounted on a mounting substrate (mounting substrate) or the tray 2. That is, as shown in FIG. 32 and FIG. 33A, the metal frame 55 to which the adhesive sheet 50 to which the group of the semiconductor chips 10 is adhered is pressed by the pusher 323, so that the reference end surface 55a of the metal frame 55 is pressed. Are brought into contact with reference positioning pins 322 a and 322 b provided on a reference plate 321 to position the group of semiconductor chips 10. Then, as shown in FIG. 33A, the position of the semiconductor chip in which a flaw or the like has occurred in the group of semiconductor chips is detected using the detection device 330 with reference to the positioning mechanism 320, that is, the chuck 150. The detection device 330 includes a device that optically detects a flaw or the like and a device that detects a flaw by ultrasonic waves. When optically detecting the appearance of a flaw or the like, the continuity of the flaw (flaw is determined based on an image signal obtained by receiving the scattered light due to the flaw or the like by the image sensor without receiving the specular reflected light (0th-order diffracted light). Continuity). In the case of flaw detection by ultrasonic waves, an ultrasonic pulse is incident on a group of semiconductor chips 10, and if there is a flaw in the semiconductor chip, a reflected wave reflected from the flaw is detected by a cathode ray tube or the like. The appearance such as a scratch can be detected.

  In order to detect the position coordinates (address) of the defective chip having a scratch from the group of the semiconductor chips 10 based on the positioning mechanism 320, the positioning mechanism 320 and the detection device 330 are relatively moved. Therefore, it is necessary to run on the group of the semiconductor chips 10.

As described above, in the process shown in FIG. 33A, the position coordinates (address) of the defective chip having the scratch is detected and stored in the storage device in the control device (not shown) provided in the separation mechanism unit 100. Will be remembered. Next, together with the positioning mechanism 320, the work 60 is transported onto the chuck 150 and positioned as shown in FIG. Thereafter, in the same manner as in FIGS. 3 (a) to 3 (d), the adhesive tape 50 with the group of semiconductor chips 10 adsorbed on the chuck 150 is shown in FIGS. 33 (b) to 33 (e). Is peeled off. Then, as shown in FIG. 33 (d), since the position coordinates (address) of the defective chip or the defective chip are stored in the storage device of the control device, the control device leaves the defective chip, the defective chip or the piece. In this state, only good semiconductor chips can be picked up by the suction collet 101 or the direct suction nozzle 216 and mounted on the tray 2 or the substrate.

FIG. 34 shows the principle of the separating mechanism (separating means) 100 shown in FIG. 3 by irradiating UV light or applying heat immediately before separating the adhesive sheet 50 from the metal frame (carrier ring) 55. FIG. 7 is a view showing a second embodiment in which the semiconductor chip is easily peeled off from the adhesive sheet 50 by curing the adhesive. That is, in FIG. 2C, before supplying the work 60 to the peeling station, the adhesive is cured by irradiating UV light or applying heat so that the semiconductor chip is easily peeled off from the adhesive sheet 50. As shown in FIG. 34 (a), after supplying the work 60 to the peeling station and positioning it, the adhesive is cured by irradiating UV light or applying heat to peel the semiconductor chip from the adhesive sheet 50. It may be easier. In the case of this embodiment, since the semiconductor chips were easily peeled off from the adhesive sheet 50 after supplying the work 60 to the peeling station, the semiconductor chip was removed from the adhesive tape while the work 60 with the metal frame was being transported or transported. The possibility of peeling can be reduced. 34B to 34E, the adhesive tape 50 is peeled off in a state where the group of the semiconductor chips 10 is attracted to the chuck 150 in the same manner as in FIGS. 3A to 3D. It is.

FIG. 35 shows a semiconductor chip that is attracted to the chuck 150 based on the positioning mechanism 320 immediately before the adhesive sheet 50 is separated from the metal frame (carrier ring) 55 in the principle of the separation mechanism section (separation means) 100 shown in FIG. A third embodiment in which the position coordinates of the group are detected (recognized), and non-defective semiconductor chips are directly picked up based on the detected position coordinates of the semiconductor chip group and mounted on a mounting substrate (mounting substrate) or the tray 2. It is a figure showing an example. That is, as shown in FIGS. 32 and 35 (a), the metal frame 55 to which the adhesive sheet 50 to which the group of the semiconductor chips 10 is adhered is positioned by the positioning mechanism 320 provided on the conveying means 170. You. Then, as shown in FIG. 35A, the semiconductor chip group positioned by the positioning mechanism 320 has an initial design specification in terms of external appearance or internal performance (pattern or the like), for example, like a Teg pattern. An image of a chip having different elements from the semiconductor chip (for example, indicated by (x1, y1) and (x3, y3) in FIG. 31) is used to travel X-
An image is picked up by an image pickup means 351 such as a TV camera provided on the Y-Θ stage 350, and the position coordinates of the semiconductor chip group are detected. Next, as shown in FIG. 35B, the semiconductor chip group is attracted to the chuck 150 while being positioned by the positioning mechanism 320. That is, the relative positional relationship between the chuck 150 and the coordinate system imaged by the imaging unit 351 provided by the positioning mechanism 320 is determined. In short, the coordinate system (address) imaged by the imaging means 351 is detected with reference to the chuck 150. Therefore, in the pickup process shown in FIG. 35G, the coordinate system (
Address), a good semiconductor chip is directly picked up by the suction collet 101 or the direct suction nozzle 216 and is mounted on the mounting substrate (mounting substrate) or the tray 2 in a state where the defective chip or the scrap is left from the chuck 150. It is possible to do. According to this method, there is no deviation from the map position recorded on the recording medium such as the FD. Further, it is possible to correspond to performance-divided data in a non-defective semiconductor chip provided on a recording medium such as an FD. 35 (c) to 35 (f)
) Are the same as in FIGS. 3A to 3D.

FIG. 36 shows a fourth embodiment provided with all the embodiments shown in FIGS. That is, FIG. 36A is the same as the process shown in FIG. FIG. 36B is the same as the process shown in FIG. FIGS. 36 (c) and (d) show FIG.
This is the same as the processes shown in a) and (b). FIGS. 36 (e) to 36 (h) correspond to FIG.
a) to FIG. 3 (d). FIG. 36 (i) shows FIG. 33 (f) and FIG.
Same as g).

  FIG. 37 shows an embodiment of a removing means for removing dust such as defective chips and chips left on the chuck. That is, by moving the conductive brush 371 for preventing static electricity and the rotating body to which the conductive brush 371 is attached, dust 372 such as a defective chip or a piece remaining on the chuck 150 is removed and put into the discharge container 373 to be removed. Will be. Further, the vacuum suction valve 374 is closed, and the valve 375 is opened to supply air for preventing static electricity (for example, ion blow) 376 so that the air is released from the chuck surface. May be easier to pay. By doing so, a new semiconductor chip group can be adsorbed on the chuck surface of the chuck 150 without any trouble.

Further, when the adhesive tape 50 is peeled off from the semiconductor chip group adsorbed by the chuck 150, dust such as cut pieces may be attached to the adhesive tape 50. In that case, the adhesive tape 50 cannot be discarded as it is, and it is necessary to separate dust and foreign matters such as cut pieces from the adhesive tape and discard them. Therefore, as shown in FIG. 38, for example, a blade attached to the tip of the suction port 381 while applying heat or light to the adhesive tape 50 peeled off by the peeling angle fixing jig 165 so as to be easily peeled off. The dust or foreign matter 383 such as a piece cut off the adhesive tape 50 by the brush-like brush 382 is removed, and the dust or the foreign matter 383 such as the piece is separated and collected from the adhesive tape 50 by suctioning with the suction port 381. It becomes possible. Naturally, it is necessary to move the suction port 381 in synchronization with the movement of the peeling angle fixing jig 165.

  Next, an embodiment of a configuration of an IC card which is a thin film electronic circuit component by mounting the semiconductor chip described above on a circuit board and a method of manufacturing the IC card will be described.

  First, the configuration of the IC card will be described with reference to FIGS. 24 is a plan view of the IC card, FIG. 25 is a sectional view taken along the line ABCD of FIG. 24, and FIG. 26 is an enlarged sectional view of a main part of FIG.

  As shown in FIG. 24, the IC card 400 includes a film 410, a conductor pattern 420 formed on the film 410, and electronic components 430 (such as an IC chip) connected to the conductor pattern 420 via connection terminals 432. 10). A part of the conductor pattern 420 forms a loop-shaped antenna coil 422, and the antenna coil 422 is connected to the electronic component 430 (10) by the conductor pattern. The number of turns of the antenna coil 422 is an arbitrary number of turns. The electronic component 430 is fixed to the film 410 with the temporary fixing liquid 440.

The width D1 of the IC card 400 is, for example, 54 mm, and the length L1 is, for example, 85.6 mm, which is the same size as a so-called credit card or telephone card. The electronic component 430 (10) uses, for example, a square having a width D2 of 3 mm. The width D3 of the antenna coil 422 and the width D4 of the conductor pattern 420 are, for example, 0.2 mm. The connection terminal 432 is, for example, 0.15 mm square, which is narrower than the width of the conductor pattern 420.

  Next, a cross-sectional configuration of the IC card will be described with reference to FIG. That is, the conductor pattern 420 and the antenna coil 422 are printed on the film 410 of the IC card 400. On the film 410, an electronic component 430 (10) such as an IC chip is fixed with a temporary fixing solution 440, and the connection terminals 432 of the electronic component 430 are directly bonded to the conductor pattern 420 to be electrically conductive. are doing. The film 410 and the cover film 460 are laminated and fixed using a glue 450 such as hot melt while sandwiching the conductive pattern 420 and the electronic component 430. On the film 410 and the cover film 460, printing surfaces 470 and 472 such as a picture are formed by printing.

  With the above configuration, the thickness H of the IC card 400 is reduced to about 0.25 mm, which is thin.

The structural features of such an IC card 400 are as follows. That is, the formation of the conductor patterns 420 and 422 using a conductor paste of Ag, Cu, or the like has a single-layer structure on only one surface of the film 410. A method that has been recently attempted eliminates the screen printing process and the subsequent drying process for forming a conductor pattern on one side of a film, in which a conductor pattern, particularly an antenna coil, is formed on both surfaces of the film. And the number of steps can be reduced. In addition, since the IC card has a single-layer structure, the IC card can be reduced in thickness to a thickness of about 0.25 mm.

  Next, a method of manufacturing an IC card will be described with reference to FIG.

  The method for manufacturing an IC card includes a printing step P10 of forming a conductor pattern 420 and an antenna coil 422 by printing a conductor paste such as Ag or Cu on a film 410 by, for example, a screen printing method, and the printed conductor pattern. The laser beam is linearly scanned and irradiated on the antenna 420 and the antenna coil 422, and the conductor pattern 420 and the antenna coil 422 are moved together with the film 410, thereby instantaneously evaporating the solvent of the conductor paste to form the conductor pattern. A drying step P20 of drying the antenna 420 and the antenna coil 422, a step P30 of printing or applying a temporary fixing agent 440 using a dispenser or the like at a position where the electronic component 430 (10) is to be mounted, and a step of printing the electronic component 430 ( 10) Mounting process P40 for mounting and heating Step P50 of performing laminating by pressurization and simultaneous connection of electronic components, cutting step P60 of cutting the sheet laminated in step P50 into a size for each IC card, and printing pictures 470 and 472 on both sides. The process includes a process P70, an inspection process P80 for performing read / write (R / W) inspection on electronic components and the like, and a process P90 for cutting the outer shape.

Here, as a material of the film 410, a plastic material such as transparent or white PET (polyethylene terephthalate), PVC (polyvinyl chloride), or polyimide is used, and the thickness thereof is, for example, about 75 μm to 100 μm. I do. The film is supplied to the IC card manufacturing apparatus from a roll having a width of, for example, 250 mm.

  In the printing step P10, a large number of conductor patterns 420 and antenna coils 422 are formed on a long film 410 by using a conductor paste such as Ag or Cu, for example, by a screen printing method so as to correspond to a large number of IC cards. This is the step of performing

  In the next drying step P20, since a transparent PET film has an absorption band at a wavelength of 9 to 10 μm, only a conductive paste such as Ag is dried by using a YAG laser having a wavelength of 1.06 μm as laser light. It is a process.

  The printed conductor pattern 420 and the antenna coil 422 are linearly scanned and irradiated with an energy beam such as a laser beam or a charged particle beam as described above, and the conductor pattern 420 and the antenna coil 422 are moved together with the film 410. By doing so, it is possible to dry the conductor patterns 420 and the antenna coils 422 arranged in a large number in a short time (1 minute or less).

  The next step P30 is a step of printing or applying the temporary fixing agent 440 to a position where the electronic component 430 (10) is to be mounted, using a dispenser or the like so that the application area is equal to or slightly larger than the electronic component size. As a material of the temporary fixing solution, a thermoplastic hot melt that softens at 100 ° C. to 130 ° C. is used. In addition, a UV curable resin or the like can be used instead of hot melt.

In the next mounting step P40, the terminal 432 of the electronic component 430 (10) such as a semiconductor chip, which has been divided and sucked by the suction nozzle 216 and conveyed as described above, is mounted on the XY stages 302 and 303. In this step, the electronic component 430 is positioned on a predetermined terminal portion of the conductor pattern 420 on the film circuit board as the mounting substrate 30 and the electronic component 430 is mounted on the conductor pattern 420. Since the temporary fixing solution 440 is applied on the film circuit board 410 in the process P30, the electronic component 430 is fixed on the film circuit board 410 by the temporary process solution 440. The connection terminals 432 of the electronic component 430 are formed by ball bonding, and the other portions are insulated by polyimide.

  Next, a process P50 of simultaneous lamination processing and electronic component connection by heating and pressing will be described with reference to FIGS. 28, a cover film 460 having the same material and the same thickness as the film 410 is used. That is, the cover film 460 is made of transparent or white PET, and has a thickness of about 75 to 100 μm. On one surface of the cover film 460, a glue 450 having a thickness of, for example, about 80 μm is laminated in advance. Here, a hot melt is used as a material of the glue 450. Note that an adhesive other than hot melt may be used.

  In step P50, the film 410 on which the electronic component 430 (10) is mounted and the cover film 460 on which the glue 450 is laminated are introduced between the hot rolls 481 and 482, and the hot rolls 481 and 482 are used to cover the film 410 and the cover. This is a step of laminating the film 460. As the hot rolls 481 and 482, steel rolls are used, and flattening is performed simultaneously with lamination.

  At this time, as shown in FIG. 28, at the same time, the terminals 432 of the electronic component 430 are cut into the conductor pattern 420 while being excluded from the temporary fixing solution 440, and the conductors are joined and electrically connected. Here, by setting the laminating pressure to, for example, about 20 kgf / cm 2 and the heating energy to, for example, 130 ° C., the connection between the terminal 432 of the electronic component 430 and the conductor pattern 420 simultaneously with the lamination of the film 410 and the cover film 460. Can also be done.

  By using a temporary fixing liquid 440 such as hot melt as an adhesive for temporarily fixing the electronic component 430, the material cost is lower and the connection of the electronic component can be shortened, for example, as compared with the case where an anisotropic conductive adhesive is used. This method has an advantage that it can be performed in a short time and high precision is not required for mounting precision of electronic components. In addition, for the lamination, a flat press can be used in addition to the method using a hot roll.

  Next, the sheet laminated in the cutting step P60 is cut to the size of each IC card, pictures 470 and 472 are printed on both sides in the step P70, and the antenna 422 is wirelessly connected to the antenna 422 by the communication inspection machine in the inspection step P80. The IC card 400 is completed by transmitting power, transmitting and receiving data wirelessly, reading and writing (R / W) the electronic component and the like, and cutting the outer shape in the process P90. .

In the above embodiment, the case where the conductor patterns 420 and 422 are formed by screen-printing the conductor paste has been described. However, the conductor patterns 420 and 422 may be formed by etching or wires. In this case, for example, an Sn / Bi-based low melting point solder (melting point: 100 ° C. to 150 ° C.) or a low melting point In alloy layer is formed on the conductor pattern 420. On the other hand, by applying Au plating to the surface of the connection terminal 432 formed by ball bonding of the electronic component 430, the bonding connection between the connection terminal 432 and the conductor pattern 420 is improved by the heating / pressing process P50. Becomes possible. Of course, when the ball bonding is Au, it is not necessary to apply Au plating.

  As described above, the thin IC card 400 can be manufactured with high efficiency and at low cost.

In addition, as described above, an adhesive tape to which a semiconductor wafer is attached is attached to a metal frame, and then diced into a group of semiconductor chips, which is adsorbed on a chuck, the adhesive tape is peeled off, and a semiconductor chip is picked up. Although the embodiment has been described, the present invention is also applicable to a case where an adhesive tape is applied as a BG tape to a semiconductor wafer in order to perform processing on a semiconductor wafer, and the adhesive tape as the BG tape is peeled off when the processing is completed. Is possible.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic configuration diagram showing an embodiment of an entire system according to the present invention for mounting a thin semiconductor chip by dicing a thin semiconductor wafer from a thin wafer state. It is a figure for explaining the manufacturing method of the work supplied to the separation mechanism part concerning the present invention. It is a figure for explaining the principle of the separation mechanism part of the thin semiconductor chip concerning the present invention. In the separation mechanism shown in FIG. 3, when the semiconductor chip is peeled off from the group of thin semiconductor chips by the tensile force F acting on the adhesive sheet, the acting direction angle ψ of the tensile force F with respect to the adhesive surface of the semiconductor chip, and the force Fx acting on the semiconductor chip, It is a figure showing the relation with Fy. FIG. 4 is a perspective view showing a state in which the adhesive sheet is peeled off from the semiconductor chip group using a wedge-shaped peeling angle fixing jig in the separation mechanism shown in FIG. 3. It is the figure which expanded and showed the state which formed the bending part of an adhesive sheet using a wedge-shaped peeling angle fixing jig, and peeled an adhesive sheet from a semiconductor chip. It is a figure for explaining an example of a separation mechanism part which separates an adhesive sheet from a semiconductor chip group using a peeling angle fixing jig concerning the present invention. FIG. 8 is a partial cross-sectional view of the separating mechanism shown in FIG. 7 when viewed from a side. It is a figure for explaining various forms of a chuck in a separation mechanism part. FIG. 10 is a diagram for explaining a form of a chuck different from FIG. 9. FIG. 4 is an explanatory diagram when a porous suction plate is used for a suction surface of a chuck. It is a figure for explaining other examples of a separation mechanism part which separates an adhesive sheet from a semiconductor chip group using a peeling angle fixing jig concerning the present invention. FIG. 13 is a view for explaining a form of a tape or the like following the peeling angle fixing jig shown in FIG. 12. FIG. 13 is a diagram for explaining a dimensional relationship in the separation mechanism shown in FIG. 12. It is a figure for explaining the example using the peeling angle fixing jig which minimizes the peeling angle of the adhesive tape in the separation mechanism unit according to the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a configuration diagram showing a separation mechanism in an embodiment of an entire system for dicing and mounting a thin semiconductor chip according to the present invention from a thin semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a configuration diagram showing a separation conveyor unit and a mounting mechanism in one embodiment of an entire system for dicing and mounting a thin semiconductor chip according to the present invention from a thin semiconductor wafer. FIG. 9 is an explanatory diagram for calculating the position of an electrode formed on a semiconductor chip with reference to a suction nozzle serving as a reference on the semiconductor chip side when the semiconductor chip is mounted on a mounting substrate or the like. FIG. 4 is a diagram illustrating a semiconductor chip that is defective in a coordinate system set on a semiconductor wafer in a work according to the present invention. It is a schematic structure figure showing an example when a separation mechanism part concerning the present invention is made into a vertical type. It is a figure which shows the concept until mounting when the suction collet is made into various forms. FIG. 10 is a diagram for explaining an embodiment in which the semiconductor chip arrangement is inverted on the chuck of the separation mechanism unit and can perform the same function as the tray. FIG. 11 is a view for explaining another embodiment in which the same function as a tray can be performed on the chuck of the separation mechanism. It is a top view showing the IC card concerning the present invention. FIG. 25 is a sectional view taken along the line ABCD of FIG. 24. FIG. 26 is an enlarged sectional view of a main part of FIG. 25. It is a figure showing the manufacturing process of the IC card concerning the present invention. It is a figure for demonstrating a lamination (heating and pressurization) and an electronic component simultaneous connection process. It is a figure for demonstrating a lamination (heating and pressurization) and an electronic component simultaneous connection process. FIG. 4 is a configuration diagram showing an embodiment in which the vacuum pressure of the vacuum source is freely changed to change the chucking force of the chuck according to the type (material) of the semiconductor chip. FIG. 4 is a diagram schematically showing a group of diced semiconductor chips adhered to an adhesive sheet attached (mounted) to a metal frame. FIG. 3 is a diagram showing a positioning mechanism for positioning a group of semiconductor chips. FIG. 4 is a view showing a first embodiment based on the principle of the separation mechanism (separation means) shown in FIG. 3. FIG. 4 is a view showing a second embodiment based on the principle of the separating mechanism (separating means) shown in FIG. 3. FIG. 4 is a view showing a third embodiment based on the principle of the separation mechanism (separation means) shown in FIG. 3. FIG. 14 is a view showing a fourth embodiment based on the principle of the separation mechanism (separation means) shown in FIG. 3. FIG. 4 is a diagram showing an embodiment of a removing unit for removing dust such as defective chips and chips left on the chuck. It is a figure showing an example which collects dirt and foreign substances, such as a piece, from an adhesive tape.

Explanation of reference numerals

Reference numeral 2: tray, 10: semiconductor chip (semiconductor element), 20: row of semiconductor chips, 40: semiconductor wafer, 50: adhesive sheet, 55: metal frame (carrier ring)
, 60... Work, 100... Separation mechanism (separation means), 101, 101 a to 101
e: suction collet, 102: drive source, 103: support member, 105: moving block, 108: drive source, 150, 150a to 150d: chuck, 152: groove, 155 ... cutter, 156: porous suction plate, 156 ' ... Partitioned porous suction plate, 157 ... Vacuum suction hole, 160 ... Clamp means, 165 ... Peel angle fixing jig, 167 ... Pressing means, 168 ... Pressing means, 191 ... Reel, 192 ... Tape, 192 ' .., Tape 195, pressing means, 213, feeding mechanism, 120, suction collet section, 200, separation conveyor section (transporting means), 201, conveyor, 202, 203, sensor, 208, Rotating member with nozzle, 209 imaging unit, 210 moving unit, 211, 214 driving source, 215 block, 2 6 suction nozzle, 250 transfer mechanism, 300 mounting mechanism (mounting means), 302, 303 XY stage, 304, 305 driving source, 306 imaging means, 320 positioning mechanism, 322, 322a, 322b ... Reference positioning pin, 323 ... Pusher, 330 ... Detector, 350 ... XY-− stage, 351 ... Imaging means, 371 ... Conductive brush, 373 ... Discharge container, 376 ... Electrostatic air (for example, ion blow), 381: suction port, 382: blade-shaped brush, 400: IC card, 410: film, 420: conductor pattern, 422: antenna coil, 430: electronic component (semiconductor chip), 432: connection terminal, 440: temporary process Liquid (hot melt), 450 paste (hot melt), 460
... cover film.

Claims (27)

A separation step in which the semiconductor element group is held on a chuck, and the adhesive sheet is peeled off from the held semiconductor element group, which is attached to the adhesive sheet in a state of a semiconductor wafer, and is cut into semiconductor elements.
A semiconductor element group picked up in a desired unit from a semiconductor element group held by a chuck after the adhesive sheet is peeled off in the separation step, and a tray storing step of storing the semiconductor elements in a tray. A semiconductor wafer is affixed in the form of a semiconductor wafer to an adhesive sheet having its periphery fixed to the frame, the object cut in units of semiconductor elements is positioned, and the semiconductor element group is held on a chuck, and the adhesive around the held semiconductor element group is held. A separation step of cutting the sheet and peeling the cut adhesive sheet from the semiconductor element group held above,
A semiconductor element group picked up in a desired unit from a semiconductor element group held by a chuck after the adhesive sheet is peeled off in the separation step, and a tray storing step of storing the semiconductor elements in a tray. A separation step in which the semiconductor element group is held on a chuck, and the adhesive sheet is peeled off from the held semiconductor element group, which is attached to the adhesive sheet in a state of a semiconductor wafer, and is cut into semiconductor elements.
A pickup step of independently picking up semiconductor elements from a group of semiconductor elements held by a chuck after the adhesive sheet has been peeled off in the separation step. A semiconductor wafer is affixed in the form of a semiconductor wafer to an adhesive sheet having its periphery fixed to the frame, the object cut in units of semiconductor elements is positioned, and the semiconductor element group is held on a chuck, and the adhesive around the held semiconductor element group is held. A separation step of cutting the sheet and peeling the cut adhesive sheet from the semiconductor element group held above,
A pickup step of independently picking up semiconductor elements from a group of semiconductor elements held by a chuck after the adhesive sheet has been peeled off in the separation step.   5. The method according to claim 3, wherein the separation step and the pickup step are performed in parallel.   A semiconductor wafer is stuck on a pressure-sensitive adhesive sheet whose periphery is fixed to the frame in the state of a semiconductor wafer, and the object cut in units of semiconductor elements is positioned, and the semiconductor element group is placed on an adhesive temporary fixing sheet held by a chuck. For holding the semiconductor element group temporarily, so that each semiconductor element can be picked up by cutting the adhesive sheet around the held semiconductor element group and peeling the cut adhesive sheet from the semiconductor element group. A method for separating a semiconductor element, comprising obtaining a substance adhered on a sheet.   A semiconductor wafer is affixed in the form of a semiconductor wafer to an adhesive sheet having its periphery fixed to the frame, the object cut in units of semiconductor elements is positioned, and the semiconductor element group is held on a chuck, and the adhesive around the held semiconductor element group is held. While the sheet is cut and the cut adhesive sheet is peeled off from the held semiconductor element group, a temporary adhesive sheet is provided on the side of the semiconductor element group where the adhesive sheet is attached so that each semiconductor element can be picked up. A method for separating a semiconductor element, comprising: adhering a fixing sheet. Chucking means for holding a semiconductor element group and peeling off the adhesive sheet from the semiconductor element group held by the chucking means for an object which is affixed in the form of a semiconductor wafer to an adhesive sheet and cut into semiconductor element units; Separation means having means;
A tray accommodating means for picking up semiconductor elements in a desired unit from a semiconductor element group held by the chuck means and for accommodating the semiconductor elements in a tray, wherein the adhesive sheet is peeled off by the peeling means of the separating means; Semiconductor device separation device. A chuck means for holding a semiconductor element group by positioning an object cut in a semiconductor element unit and holding the semiconductor element group, which is affixed in a state of a semiconductor wafer to an adhesive sheet having a periphery fixed to a frame, and a semiconductor element group held by the chuck means; Separating means having a cutting means for cutting the surrounding adhesive sheet and a peeling means for peeling the adhesive sheet cut by the cutting means from the semiconductor element group held by the chuck means,
A tray accommodating means for picking up semiconductor elements in a desired unit from a semiconductor element group held by the chuck means and for accommodating the semiconductor elements in a tray, wherein the adhesive sheet is peeled off by the peeling means of the separating means; Semiconductor device separation device. Chucking means for holding a semiconductor element group and peeling off the adhesive sheet from the semiconductor element group held by the chucking means for an object which is affixed to an adhesive sheet in the state of a semiconductor wafer and cut in units of semiconductor elements; Separation means having means;
A semiconductor device separating apparatus, comprising: a pick-up means for independently picking up semiconductor elements from the semiconductor element group held by the chuck means, wherein the adhesive sheet is peeled off by the peeling means of the separating means. A chuck means for holding a semiconductor element group by positioning an object cut in a semiconductor element unit and holding the semiconductor element group, which is affixed in a state of a semiconductor wafer to an adhesive sheet having a periphery fixed to a frame, and a semiconductor element group held by the chuck means; Separating means having a cutting means for cutting the surrounding adhesive sheet and a peeling means for peeling the adhesive sheet cut by the cutting means from the semiconductor element group held by the chuck means,
A semiconductor device separating apparatus, comprising: a pick-up means for independently picking up semiconductor elements from the semiconductor element group held by the chuck means, wherein the adhesive sheet is peeled off by the peeling means of the separating means.   12. The semiconductor device separating apparatus according to claim 10, wherein the chuck means can be rotated so that peeling of the adhesive sheet from the semiconductor element group by the separating means and pickup of the semiconductor element by the pickup means can be performed in parallel. An apparatus for separating a semiconductor element, comprising:   13. The separation device of the semiconductor device separation device according to claim 8, further comprising an appearance detection unit that detects an appearance of a semiconductor element group of an object.   13. The separating means in the apparatus for separating a semiconductor element according to claim 8, 9 or 10, or 11 or 12, wherein addresses of the semiconductor elements in the semiconductor element group are based on a state in which the semiconductor element group of the object is held by the chuck means. An apparatus for separating a semiconductor device, comprising: a detecting means for detecting a pressure.   13. The apparatus for separating a semiconductor device according to claim 8, further comprising removing means for removing dust left on the chuck surface of the chuck means after being picked up by the pick-up means. A semiconductor device separation device. A semiconductor wafer is stuck on a pressure-sensitive adhesive sheet whose periphery is fixed to the frame, and the object cut in units of semiconductor elements is positioned, and the semiconductor element group is adhered to a temporary fixing sheet having adhesiveness, thereby temporarily fixing the semiconductor element group. Chuck means for holding a sheet for use,
Cutting means for cutting the adhesive sheet around the semiconductor element group held via the temporary fixing sheet to the chuck means,
By peeling the adhesive sheet cut by the cutting means from the semiconductor element group held by the chuck means via the temporary fixing sheet, each semiconductor element can be picked up so that each semiconductor element can be picked up on the temporary fixing sheet. A separating device for a semiconductor element, comprising: a separating means for obtaining a semiconductor device. Chuck means which is attached in a state of a semiconductor wafer to an adhesive sheet having its periphery fixed to a frame, and which holds a semiconductor element group by positioning an object cut in units of semiconductor elements,
Cutting means for cutting the adhesive sheet around the semiconductor element group held by the chuck means,
Peeling means for peeling the adhesive sheet cut by the cutting means from the semiconductor element group held by the chuck means,
On the side of the semiconductor element group from which the adhesive sheet was peeled off by the peeling means, on the side where the adhesive sheet was stuck, an adhesive means for adhering a temporary fixing sheet having adhesiveness so that each semiconductor element could be picked up was provided. A semiconductor device separation device. Attached to the pressure-sensitive adhesive sheet in the state of a semiconductor wafer, for an object cut in units of semiconductor elements, chuck means for holding a semiconductor element group,
In a state where the semiconductor element group is held by the chuck means, a tension mechanism that holds the edge of the adhesive sheet and pulls the adhesive sheet in a predetermined direction,
A semiconductor device separating apparatus, comprising: a molding means for moving the adhesive sheet in a predetermined direction while pressing the adhesive sheet and peeling the adhesive sheet from the semiconductor element group when the adhesive sheet is pulled by the tension mechanism.   19. The apparatus for separating a semiconductor element according to claim 18, further comprising a pickup unit for independently picking up the semiconductor elements from the semiconductor element group in a state where the adhesive sheet has been peeled off. .   20. The apparatus for separating a semiconductor element according to claim 18 or 19, further comprising means for reducing a decrease in holding force of the semiconductor element group by the chuck means when the adhesive sheet is peeled from the semiconductor element group. Semiconductor device separation device.   A tensioning means for holding the edge of the pressure-sensitive adhesive sheet and pulling the pressure-sensitive adhesive sheet, and a bending shape of the pressure-sensitive adhesive sheet while holding down the pressure-sensitive adhesive sheet when the pressure-sensitive adhesive sheet is pulled by the tensioning means. And a molding mechanism configured to move at least a direction along a surface of the pressure-sensitive adhesive sheet.   22. The semiconductor device separating apparatus according to claim 21, further comprising means for reducing a decrease in holding force of the semiconductor element group by the chuck means when the adhesive sheet is peeled from the semiconductor element group. Device separation device.   20. The apparatus for separating semiconductor elements according to claim 18 or 19, further comprising appearance detection means for detecting the appearance of the semiconductor element group of the object.   20. The apparatus for separating a semiconductor element according to claim 18 or 19, further comprising a detection unit configured to detect an address of the semiconductor element in the semiconductor element group based on a state in which the semiconductor element group of the object is held by the chuck unit. An apparatus for separating a semiconductor element, comprising:   20. The apparatus for separating a semiconductor device according to claim 18, further comprising removing means for removing dust remaining on the chuck surface of the chuck means after being picked up by the pickup means. Separation device. A separation step in which the semiconductor element group is held on a chuck, and the adhesive sheet is peeled off from the held semiconductor element group, which is attached to the adhesive sheet in a state of a semiconductor wafer, and is cut into semiconductor elements.
A transporting step of picking up semiconductor elements in a desired unit from the semiconductor element group held by the chuck in which the adhesive sheet is peeled off in the separation step and transporting the semiconductor elements to a mounting position;
Mounting the semiconductor element transported in the transporting step on a tray or a substrate to be mounted. A semiconductor wafer is affixed in the form of a semiconductor wafer to an adhesive sheet having its periphery fixed to the frame, the object cut in units of semiconductor elements is positioned, and the semiconductor element group is held on a chuck, and the adhesive around the held semiconductor element group is held. A separation step of cutting the sheet and peeling the cut adhesive sheet from the semiconductor element group held above,
A transporting step of picking up semiconductor elements in a desired unit from the semiconductor element group held by the chuck in which the adhesive sheet is peeled off in the separation step and transporting the semiconductor elements to a mounting position;
Mounting the semiconductor element transported in the transporting step on a tray or a substrate to be mounted.

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