JP2005309573A - Manufacturing method of ic tag-mounted sheet, manufacturing method of ic tag, manufacturing device of ic tag, ic chip feeding method and ic chip feeding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC tag-mounted sheet having a microscopic IC chip on a substrate, and for improving productivity and reducing a production cost. <P>SOLUTION: The method for manufacturing an IC tag-mounted sheet is provided with; a process in which a wafer 53 with a adhesive sheet is prepared by bonding a diced wafer 51 comprising many IC chips 15 to an adhesive sheet 52; and a process in which the IC chips 15 are exfoliated from the adhesive sheet 52 by applying ultrasonic waves to the adhesive sheet 52 of the wafer 53 with an adhesive sheet and the exfoliated IC chips are fed into a part feeder 30. The IC chips 15 in the part feeder 30 move up above the substrate 2 while being lined up. Then, the IC chips 15 moved by the part feeder 30 are mounted on the substrate 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a manufacturing method of a sheet with an IC tag, a manufacturing method of an IC tag, an IC tag manufacturing device, an IC chip supply method, and an IC chip supply device, and in particular, a mounting for mounting a fine IC chip on a substrate. Regarding technology.

  The IC tag is an IC chip mounted on a base material, and includes a so-called interposer.

  In the conventional manufacturing method of manufacturing an IC tag by mounting the IC tag on a base material, conventionally, first, a silicon wafer formed on a dicing tape and having a surface functioning as an electrode surface is cut into a predetermined shape. The cut silicon wafer functions as an IC chip, and this IC chip is pushed up by a member having a pointed tip (for example, a needle) from below, and the IC chip cut into a predetermined shape is picked up by a pickup device. Pick up. Next, the picked-up IC chip is reversed, and the surface opposite to the electrode surface is picked up by another pick-up device. Finally, the picked-up IC chip is mounted on a base material to manufacture an IC tag.

  Further, the production amount in the manufacture of IC tags by the pickup device is 1 piece / second to 2 pieces / second.

  IC chips in recent years have been miniaturized, and the pick-up of IC chips by current pick-up devices has reached its limit.

  In addition, the manufacturing cost of the IC tag using the pickup device is high.

  In addition, with the recent development of IC chips, the demand for IC tags has increased, and the need to improve productivity has arisen.

  The present invention has been made in consideration of such points, and improves productivity and lowers manufacturing costs. In particular, the present invention provides a sheet with an IC tag that can mount a fine IC chip on a substrate. An object is to provide a manufacturing method, an IC tag manufacturing method, an IC tag manufacturing apparatus, an IC chip supply method, and an IC chip supply apparatus.

  The present invention relates to a method for producing a sheet with an IC tag by mounting an IC chip on a base material to produce a sheet with an IC tag, and by adhering and fixing a diced wafer comprising a large number of IC chips on the adhesive sheet A step of preparing a wafer with adhesive, a step of applying ultrasonic waves to a portion corresponding to the entire area of the wafer from the pressure-sensitive adhesive sheet side to the wafer with the pressure-sensitive adhesive sheet, peeling off individual IC chips from the pressure-sensitive adhesive sheet at once, and putting them into the parts feeder; An IC chip aligning / moving step of moving the IC chip in the parts feeder to the upper part of the substrate while aligning by vibration, and an IC chip mounting step of mounting the IC chip moved by the parts feeder on the substrate; A method for producing a sheet with an IC tag, comprising:

  The present invention is the method for manufacturing a sheet with an IC tag, wherein the IC chip is picked up by suction and mounted on the substrate.

  In this way, even a fine IC chip can be easily mounted on a base material and a sheet with an IC tag can be manufactured.

  The present invention provides an IC tag manufacturing method for manufacturing an IC tag by mounting an IC chip on a base material, and preparing a wafer with an adhesive sheet by adhesively fixing a diced wafer composed of a large number of IC chips on the adhesive sheet A step of applying ultrasonic waves to a portion corresponding to the entire area of the wafer from the pressure-sensitive adhesive sheet side to the wafer with the pressure-sensitive adhesive sheet, peeling individual IC chips from the pressure-sensitive adhesive sheet at once, and placing them in the parts feeder, IC chip aligning / moving step of moving the IC chip to the upper part of the base material while aligning by vibration, an IC chip mounting step of mounting the IC chip moved by the parts feeder on the base material, and the base material An IC tag manufacturing method comprising: a sheet cutting step for cutting into a predetermined shape.

  In the present invention, the base material includes a sheet and a pair of conductors arranged side by side with a predetermined interval on the sheet and having a conductive adhesive or a non-conductive adhesive at an end. In the IC chip mounting step, the IC chip is disposed between a pair of conductors of the base material, and an electrode of the IC chip is connected to the conductor via a conductive adhesive. It is a manufacturing method of an IC tag.

  In this way, even a fine IC chip can be easily mounted on a substrate and an IC tag can be manufactured.

  The IC chip is picked up by suction and mounted on the substrate.

  In this way, even if it is a fine IC chip, an IC tag can be easily mounted on a substrate to manufacture an IC tag.

  According to the present invention, the alignment / movement step of the IC chip is aligned when the determination step determines whether or not the orientation of the IC chip is normal and when the determination result is determined to be not normal. And a defective IC chip excluding step of excluding the IC chip determined to be abnormal from the IC chip row.

  In this way, it is possible to exclude defective IC chips whose IC chip is not properly mounted in the process of aligning and moving the IC chips, thereby preventing the occurrence of defective IC tags due to defective IC chip orientation. it can.

  The present invention relates to an IC tag manufacturing apparatus that mounts an IC chip on a base material and cuts the IC chip into a predetermined shape to manufacture the IC tag. And a wafer holding part with an adhesive sheet for holding the wafer with the adhesive sheet obtained by adhesively fixing a diced wafer consisting of a large number of IC chips on the adhesive sheet, and with an adhesive sheet Apply ultrasonic waves to the part corresponding to the entire area of the wafer from the adhesive sheet side to the wafer with the adhesive sheet held by the wafer holder, and peel off individual IC chips from the adhesive sheet at a time and put them into the parts feeder. IC chip for mounting an IC chip on the substrate by an ultrasonic irradiation unit and an IC chip moved by the parts feeder And instrumentation unit, a manufacturing apparatus of an IC tag comprising the.

  According to the present invention, the parts feeder includes an accommodating portion main body for accommodating an IC chip, a passage connected to the accommodating portion main body for aligning the IC chips, and an IC chip aligned with the accommodating portion main body and the passage. A groove formed for causing the IC chip to move along the groove to an upper portion of the base material, a vibration means for vibrating the housing main body and the passage, and the IC chip An IC tag manufacturing apparatus comprising: a defective IC chip removing unit for discriminating front and back surfaces and orientation and removing a defective IC chip from the passage.

  The present invention provides a process for preparing a wafer with an adhesive sheet obtained by adhesively fixing a diced wafer comprising a large number of IC chips on an adhesive sheet, and the wafer with an adhesive sheet corresponds to the entire area of the wafer from the adhesive sheet side. A method of supplying an IC chip, comprising a step of applying ultrasonic waves to a part to separate individual IC chips from an adhesive sheet at a time and placing them in a parts feeder.

  The present invention relates to a wafer with an adhesive sheet that is disposed on a parts feeder and holds a wafer with an adhesive sheet obtained by adhesively fixing a diced wafer comprising a large number of IC chips on the adhesive sheet so that the wafer faces downward. Apply ultrasonic waves to the part corresponding to the entire area of the wafer from the pressure-sensitive adhesive sheet side to the wafer with the pressure-sensitive adhesive sheet held by the holding part and the wafer holding part with the pressure-sensitive adhesive sheet, and peel off individual IC chips from the pressure-sensitive adhesive sheet at once. An IC chip supply device comprising an ultrasonic irradiation unit to be put into a parts feeder.

  In this way, even if it is a fine IC chip, an IC tag can be easily mounted on a substrate to manufacture an IC tag. Moreover, by using a parts feeder, manufacturing cost can be reduced and productivity can be improved.

  According to this invention, even if it is a fine IC chip, an IC chip can be easily mounted on a base material and a sheet with an IC tag and an IC tag can be manufactured. Moreover, by using a parts feeder, the manufacturing cost can be reduced and the productivity can be improved.

  Hereinafter, the manufacturing method of the IC tag of this application is explained in full detail. FIG. 1 shows an IC tag, in which FIG. 1A is a plan view of the IC tag, FIG. 1B is a structural diagram of the IC tag, and FIGS. 2A and 2B are manufacturing the IC tag. FIG. 3 is a diagram showing a state in which an IC chip is mounted on a substrate, and FIGS. 4A and 4B are diagrams showing an IC chip supply method. Among these, FIG.2 (b) is the A section enlarged view of Fig.2 (a).

  As shown in FIG. 1, the IC tag 10 is obtained by mounting an IC chip 15 on the substrate 2.

  A fine chip is used as the IC chip 15. Specifically, the size of the IC chip 15 is about 0.2 to 0.4 mm square. The shape is preferably rectangular.

  The substrate 2 includes a sheet 4 and conductors 3 and 3 that are arranged side by side with a predetermined interval S provided on the sheet 4. An IC chip 15 is disposed between the pair of conductors 3 and 3 of the substrate 2.

  The IC chip 15 has an electrode surface on one surface, and electrodes 15a and 15a are provided on this electrode surface. The electrodes 15a are preferably provided, for example, diagonally or in the vicinity of both ends. The IC chip 15 is mounted on the substrate 2 by bonding the electrodes 15 a and 15 a of the IC chip 15 to the end of the conductor 3. Further, an antenna surface may be formed on the conductor 3 so that the substrate 2 functions as an antenna.

  Further, the predetermined interval S between the conductors 3 and 3 is, for example, about 0.1 mm. The spacing S may be as long as the left and right conductors 3 in the figure are not electrically connected. For example, the two conductors 3 and 3 may be formed with a slit in the center of one conductor.

  The conductors 3 and 3 are made of conductive foil such as A1 or Cu having conductivity, conductive ink, or the like, and the sheet 4 is formed into a sheet shape using a plastic film or paper material.

  A conductive adhesive 6 is applied to the end of the conductor 3. Further, the portion where the conductor 3 and the sheet 4 are in contact is bonded by the adhesive 7. For example, a solvent type or hot melt type adhesive is used as the adhesive, but the type is not particularly limited. Further, the adhesive 7 may be a non-conductive adhesive or conductive.

  As described above, the IC tag 10 includes the base material 2 in which the sheet 4 is laminated on the conductors 3 and 3 arranged side by side with a predetermined gap S, and the electrodes 15 a and 15 a are the ends of the conductors 3 and 3. And an IC chip 15 bonded to the portion via a conductive adhesive 6.

  A manufacturing apparatus for manufacturing an IC tag will be described in detail with reference to FIGS.

  A manufacturing apparatus 100 for manufacturing an IC tag includes a base material forming apparatus (not shown) for forming the base material 2, a transport device 23 for transporting the base material 2, and a plurality of IC chips 15, 15. .., 15 are vibrated so that the IC chip 15 is moved to a predetermined position while being aligned, and the IC chip 15 is picked up and conveyed onto the base material 2 and the IC chip 15 is transferred to the base material 2. An IC chip mounting device 35 for positioning and mounting on the conductors 3 and 3 of the base material 2 and a cutting device 95 for cutting the base material 2 into a predetermined shape. ing.

  The base material 2 is formed by laminating a sheet 4 and two conductors 3 arranged side by side at a predetermined interval S on the sheet 4 by a base material forming apparatus (not shown).

  The transport device 23 includes, for example, guide rollers 60 and 60 that are spaced apart from each other by a predetermined distance, and the base material 2 is transported between the guide rollers 60.

  The parts feeder 30 has a housing portion main body 31 for housing the IC chip 15, a passage 33 connected to the housing portion main body 31 for aligning the IC chips 15, and the housing portion main body 31 and the passage 33. And a vibration device 32 for applying vibration in the direction.

  The container main body 31 is circular in the drawing, but may be rectangular. A groove 34 is formed in the accommodating body 31 in the vibration direction of the vibration device 32. For example, in the case where the groove 34 is a circular housing part main body 31, the groove 34 is provided so as to draw a circle from the center of the housing part main body 31 in the outer peripheral direction. The groove 34 is provided for aligning the IC chip 15 by vibration.

  For example, a plurality of vibration devices 32 are arranged in a predetermined portion of the housing portion main body 31 so as to vibrate in a circle in the outer circumferential direction from the center of the housing portion main body 31 along the groove 34. In this way, since the IC chip 15 also moves while vibrating in the vibrating direction, the overlapping IC chips 15 are scattered during the movement. Further, since the groove 34 is provided in the vibration direction, the IC chip 15 moves while being fitted in the groove 34.

  The passage 33 has a width that allows one IC chip 15 to pass therethrough. The passage 33 is provided with a groove (not shown) for aligning the IC chips 15. In addition, this groove is preferably connected to a groove 34 provided in the housing main body 31. A vibration device 32 is also provided in the passage 33. The vibration device 32 is provided so as to vibrate in the distal direction of the passage 33.

  In this way, the IC chips 15 can be aligned while being moved in a predetermined direction. Specifically, the IC chips 15 are aligned while moving from the inside of the housing main body 31 to the tip of the passage 33.

  An inspection device 90 a for inspecting the direction of the IC chip 15 is provided in the middle of the passage 33. The inspection of the orientation of the IC chip 15 is an inspection of whether or not the surface of the electrode 15 is directed downward (base material side). The inspection device 90a includes an imaging device 91 that images the IC chip 15 and a control device 92 that determines the orientation of the IC chip 15 from the captured image. As the imaging device 91, a CCD camera or the like is used. The passage 33 is provided with an extrusion device 93 for pushing out (removing) the IC chip determined by the control device 92 (hereinafter referred to as “defective IC chip”) from the passage 33.

  As described above, when the control device 92 determines whether or not the orientation of the IC chip 15 is normal based on the video imaged by the imaging device 91, and when the control device 92 determines that the control device 92 is not normal (defective), The IC chip 15 is removed from the aligned passages 33 by the pushing means 53. Specifically, the IC chip 15 is pushed out from the passage 33. The pushed IC chip 15 is returned to the housing main body 31 again.

  In this way, since the defective IC chip 15 can be removed and only normal IC chips can be mounted on the base material, it is possible to prevent the generation of defective IC tags due to the defect of the IC chip 15.

  The IC chips 15 aligned by the parts feeder 30 are mounted on the base material 2 by the IC chip mounting device 35. The IC chip mounting apparatus 35 transports the IC chip 15 aligned by the parts feeder 30 onto the base material 2 while picking up the IC chip 15 by suction, and mounts the IC chip 15 between the pair of conductors 3 and 3 of the base material 2. And mounted on the substrate 2. Specifically, the IC chip 15 is picked up by a hollow cylindrical pickup body 36. For example, one end (lower end) of the pickup body 36 has an opening 36a for picking up the IC chip 15 by suction, and the other end is airtightly connected to a suction device (not shown) having a suction pump. In addition, for example, a plurality of pickup bodies 36 are provided in the circumferential direction of a circular support (not shown). A first drive unit (not shown) such as a motor for rotating the support body is connected to the support body, and a second drive unit (not shown) for driving in the vertical direction is connected to the pickup body 36. (Not shown) are connected. The suction device and the first and second drive units are connected to the control device.

  The control device operates the suction device to control the suction to pick up the IC chip 15 from the opening 36a of the pickup body 36. In addition, the first drive unit is operated to rotate the support so that the pickup body 36 is transported to the upper part of the substrate 2.

  Further, the IC chip 15 conveyed to the upper part of the substrate 2 is positioned by the positioning device 45 as shown in FIG. The positioning device 45 includes pressing devices 45a, 45a, 45a, 45a for pressing the IC chip 15 from four sides of the IC chip 15 to position the IC chip 15 at a predetermined position. The pressing device 45a is driven by air, a solenoid or the like, and the pressing device 45a is connected to a control device.

  In this way, since the IC chip 15 can be positioned with high precision when mounted on the base material 2, even the fine IC chip 15 can be mounted at a predetermined position on the base material 2.

  In addition, the control device performs control to operate the pressing device 45 a in order to position the IC chip 15 transported to the upper part of the base material 2. Further, the control device operates the second drive unit to drive the pickup body 36 downward, stops suction by the suction device, and mounts the IC chip 15 between the pair of conductors 3 and 3 of the base 2. Control.

  In this way, the IC chip mounting device 35 operates each device by the control device, and sucks and picks up the IC chips 15 aligned by the parts feeder 30 by the pickup body 36, and conveys them to the upper part of the substrate 2. The conveyed IC chip 15 is positioned on the pair of conductors 3 and 3 of the substrate 2, and the positioned IC chip 15 is mounted on the substrate 2.

  Further, when the IC chip 15 is mounted on the base member 2, air may be discharged from the opening 36 a of the pickup body 36 and the IC chip 15 may be pressed onto the base member 2 by air pressure to be mounted. In this way, even the fine IC chip 15 can be reliably mounted on the substrate 2.

  Further, an inspection device 96 for inspecting the defect of the IC chip 15 (for example, whether or not there is a crack on the electrode surface) is installed during the conveyance of the IC chip 15 to the substrate 2. The inspection device 96 includes an imaging device 97 that images the IC chip 15 and a control device (not shown) that determines a defect of the IC chip 15 from the captured image. As the imaging device 97, a CCD camera or the like is used. If the control device determines that the defective IC chip is defective, the control device stops sucking from the pickup body 36 picking up the defective IC chip 15 and before the defective IC chip is transported to the upper part of the substrate 2. To remove. The removed defective IC chip is discharged (discarded).

  In this way, since the defective IC chip 15 can be removed and only the normal IC chip 15 can be mounted on the substrate 2, it is possible to prevent the generation of a defective IC tag due to the defect of the IC chip 15.

  Further, the cutting device 95 is installed on the downstream side in the transport direction of the transport device 23. The cutting device 95 includes a blade, punching (punch), and the like. Thereby, the base material 2 on which the IC chip 15 is mounted is cut into a predetermined shape and formed as the IC tag 10.

  Further, a pressing device 70 for pressing the substrate 2 on which the IC chip 15 is mounted may be provided between the IC chip mounting device 35 and the cutting device 95. The pressing device 70 has a pair of pressing bodies (an upper pressing body 71 and a lower pressing body 72) sandwiching the base material 2 above and below the base material 2. The upper pressing body 71 is driven in the vertical direction by the control device and presses the substrate 2 on which the IC chip 15 is mounted with a predetermined pressure. Thereby, the IC chip 15 can be reliably mounted on the substrate 2.

  The IC chip mounting device 35 functions as an IC chip mounting means for mounting the IC chips 15 aligned by the parts feeder 30 on the substrate 2, and the vibration device 32 has the IC chip 15 along the groove 34. It functions as a vibration means for vibrating the container main body 31 and the passage 33 in order to move to the upper part. Further, the transport device 23 functions as a transport unit for transporting the base material 2, and the cutting device 95 functions as a cutting unit for cutting the base material 2 into a predetermined shape. In addition, the imaging device 91, the control device 92, and the extrusion device 93 function as defective IC chip removal means. The inspection device 96 functions as a defective IC chip removing unit.

  As described above, the manufacturing apparatus for manufacturing a sheet with an IC tag of the present invention is an apparatus for manufacturing a sheet with an IC tag that manufactures a sheet with an IC tag by mounting the IC chip 15 on the substrate 2. Then, the parts feeder 30 for aligning the IC chips 15 by vibration and the IC chip 15 are picked up and transported to the upper part of the base material 2, and the IC chip 15 is positioned on the base material 2. And an IC chip mounting device 35 for mounting on the substrate 2.

  Further, in the middle of transporting the IC chip 15 to the base material 2, an image pickup device 91, a control device 92, an extrusion device 93, and a device for judging a failure of the IC chip 15 and removing the IC chip 15 judged to be defective An inspection device 96 may be provided. The parts feeder 30 includes an accommodating part main body 31 for accommodating the IC chip 15, a passage 33 connected to the accommodating part main body 31 for aligning the IC chips 15, and an IC chip in the accommodating part main body 31 and the passage 33. A groove 34 formed for aligning 15, a vibration device 32 for vibrating housing part 31 and passage 33 for aligning IC chip 15 on passage 33 along groove 34, and IC chip 15 and an inspection device 50 for removing the defective IC chip from the passage by discriminating the front and back sides and the orientation of the fifteen.

  In this way, even a fine IC chip 15 can be reliably mounted on the substrate 2 to produce a sheet with an IC tag. Further, since the defective IC chip can be removed and only the normal IC chip can be mounted on the base material, it is possible to prevent the occurrence of a sheet with a defective IC tag due to the defect of the IC chip.

  The IC tag manufacturing apparatus 100 according to the present invention is an IC tag manufacturing apparatus 100 for manufacturing the IC tag 10 by mounting the IC chip 15 on the base material 2, and for aligning the IC chips 15 by vibration. To pick up the part feeder 30 and the IC chip 15 and transport them to the upper part of the substrate 2, position the IC chip 15 on the substrate 2, and place and mount the positioned IC chip 15 on the substrate 2. IC chip mounting device 35 and a cutting device 95 for cutting the substrate 2 into a predetermined shape.

  In this way, even the fine IC chip 15 can be reliably mounted on the substrate 2 to manufacture the IC tag 10.

  The manufacturing apparatus 100 for manufacturing the IC tag further includes an IC chip supply device 55 as shown in FIGS.

  As shown in FIG. 4A, the IC chip supply device 55 is disposed on the parts feeder 30 and has an adhesive sheet-attached wafer holder 55a for holding the adhesive sheet-attached wafer 53, and an adhesive sheet-attached wafer holder 55a. And an ultrasonic irradiation unit 56 that applies ultrasonic waves to the wafer 55 with an adhesive sheet held on the adhesive sheet.

  Among these, the wafer 53 with the adhesive sheet held by the wafer holding part 55a with the adhesive sheet has the adhesive sheet 52 and the diced wafer 51 bonded and fixed on the adhesive sheet 52 via the adhesive 54, The diced wafer 51 is composed of a large number of IC chips 15 that are diced and separated into individual IC chips 15.

  In this case, the adhesive sheet 52 of the wafer 53 with the adhesive sheet slightly protrudes outward from the diced wafer 51, and the wafer holding part 55 a with adhesive sheet holds the peripheral edge of the adhesive sheet 52 that goes out of the diced wafer 51. doing.

  In addition, the ultrasonic irradiation unit 56 irradiates ultrasonic waves to the portion corresponding to the entire area of the wafer 54 from the adhesive sheet 52 side of the adhesive sheet-attached wafer 53, and from the adhesive sheet 52 by such ultrasonic irradiation. The individual IC chips 15 are peeled off at a time and put into the housing portion main body 31 of the parts feeder 30.

  Next, an IC tag manufacturing method will be described. First, as shown in FIGS. 4A and 4B, a wafer 53 with an adhesive sheet is manufactured by adhesively fixing a diced wafer 51 composed of a large number of IC chips 15 on an adhesive sheet 52 via an adhesive 54. (FIG. 4B).

  Next, the peripheral part of the adhesive sheet 52 of the wafer 53 with adhesive sheet is held by the wafer holding part 55a with adhesive sheet.

  Thereafter, an ultrasonic wave is applied from the ultrasonic irradiation unit 56 to the portion corresponding to the entire area of the wafer 51 from the pressure-sensitive adhesive sheet 52 side to the wafer 53 with the pressure-sensitive adhesive sheet held by the wafer holding portion with pressure-sensitive adhesive sheet 55a. By applying ultrasonic waves to the pressure-sensitive adhesive sheet 52 in this way, the individual IC chips 15 are peeled from the pressure-sensitive adhesive sheet 52 at a time, and the IC chips 15 peeled from the pressure-sensitive adhesive sheet 52 are supplied into the housing portion main body 31 of the parts feeder 30. Is done.

  Next, the vibration device 32 applies vibration in a predetermined direction to the housing main body 31 and the passage 33. Thereby, the IC chip 15 moves to a predetermined position while being aligned on the passage.

  Further, while the IC chips 15 are aligned on the passage, the aligned IC chips are imaged by the imaging device 91, and it is determined whether the orientation of the IC chip 15 is normal. If it is determined as an abnormality (defective IC chip) as a result of the determination, the pushing device 93 is driven by the control device 92 and removed from the line of the aligned IC chips 15. Specifically, the defective IC chip is pushed out of the passage 33 by the pushing device 93. The defective IC chip 15 is returned to the housing main body 31.

  Next, the IC chip 15 is picked up by the pickup body 36 at the tip of the passage 33.

  Next, the first drive unit is driven by the control device, and the picked-up IC chip 15 is transported to the upper part of the substrate 2.

  Further, while the IC chip 15 is being transported to the base material, the IC chip being transported is imaged by the imaging device 91 to determine whether the IC chip 15 is defective. As a result of the determination, if it is determined that the chip is a defective IC chip, the control device stops the suction of the IC chip 15 by the pickup and causes the defective IC chip to be detached from the pickup body 36. This defective IC chip is discarded.

  Next, the IC chip 15 is positioned by the positioning device 45 in order to be mounted on the substrate 2. Thereby, even if it is a case where a fine IC chip is mounted in the predetermined position of a base material, the IC chip 15 can be mounted on the base material 2 correctly and reliably.

  Next, the pickup body 36 is driven downward by the control device, the electrode 15 a of the IC chip 15 is adhered to the end of the conductor 3 of the base 2 by the conductive adhesive 6, and the IC chip 15 is attached to the base 2. Implement. Thereby, a sheet with an IC tag is formed.

  Next, the base material 2 on which the IC chip 15 is mounted is transported by the transport device 23, and the base material 2 is cut into a predetermined shape by the cutting device 95, and the process ends. Thereby, the IC tag 10 is formed.

  As described above, the method for manufacturing a sheet with an IC tag according to the present invention is a method for manufacturing a sheet with an IC tag, in which an IC chip 15 is mounted on a substrate 2 to manufacture a sheet with an IC tag, An IC chip aligning step for aligning the IC chips 15 by the above, a pick-up step for picking up the aligned IC chips 15, and an IC chip transporting step for transporting the picked-up IC chips 15 onto the substrate 2; And an IC chip positioning step for positioning the IC chip 15 on the substrate 2 and an IC chip mounting step for mounting the IC chip 15 on the substrate 2. In addition, an IC chip removing step for determining whether the IC chip 15 is defective and removing the IC chip determined to be defective is provided.

  In this way, even a fine IC chip 15 can be reliably mounted on the substrate 2 to produce a sheet with an IC tag. Further, since the defective IC chip can be removed and only the normal IC chip can be mounted on the base material, it is possible to prevent the occurrence of a sheet with a defective IC tag due to the defect of the IC chip.

  Also, the IC tag manufacturing method of the present invention is an IC tag manufacturing method for manufacturing an IC tag by mounting the IC chip 15 on the base material 2, and the IC chip alignment for aligning the IC chip 15 by vibration. A process, a pick-up process for picking up the aligned IC chips 15, an IC chip transporting process for transporting the picked-up IC chip 15 onto the base material 2, and mounting the IC chip 15 on the base material 2 An IC chip positioning step for positioning, an IC chip mounting step for mounting the IC chip 15 on the base material 2, and a base material cutting step for cutting the base material 2 into a predetermined shape. ing.

  In this way, even a fine IC chip 15 can be reliably mounted on the substrate 2 to manufacture an IC tag.

  In addition, this embodiment is one form, Comprising: It is not limited to this shape.

  For example, the size, shape, and the like of the IC chip to be used are not limited to the above embodiment, and may be implemented in various modes.

The figure which shows an IC tag. The figure which shows the state which manufactures an IC tag. The figure which shows the state which has mounted the IC chip in the base material. The figure which shows the supply method of IC chip.

Explanation of symbols

2 Base material 3 Conductor 4 Sheet 15 IC chip 15a Electrode 30 Parts feeder 31 Housing part main body 32 Vibration means (vibration device)
33 passage 34 groove 35 IC chip mounting means (IC chip mounting apparatus)
45 Positioning means (positioning device)
DESCRIPTION OF SYMBOLS 51 Dicing wafer 52 Adhesive sheet 53 Wafer with an adhesive sheet 55 IC chip supply apparatus 55a Wafer holding part with an adhesive sheet 56 Ultrasonic irradiation part 91 Defective IC chip removal means (imaging apparatus)
92 Defective IC chip removal means (control device)
93 Defect IC chip removal means (extrusion device)
95 Defect IC chip removal means (cutting device)
96 Defect IC chip removal means (inspection device)
100 IC tag manufacturing equipment

Claims (10)

In the method of manufacturing a sheet with an IC tag in which an IC chip is mounted on a substrate to manufacture a sheet with an IC tag,
Preparing a wafer with an adhesive sheet by adhesively fixing a diced wafer consisting of a number of IC chips on the adhesive sheet;
Applying ultrasonic waves to the wafer sheet with the pressure sensitive adhesive sheet from the pressure sensitive adhesive sheet to the entire area of the wafer, peeling the individual IC chips from the pressure sensitive adhesive sheet at once, and placing them in the parts feeder;
IC chip alignment / moving process for moving the IC chip in the parts feeder to the upper part of the substrate while aligning by vibration,
An IC chip mounting step for mounting an IC chip moved by the parts feeder on the base material.   2. The method of manufacturing a sheet with an IC tag according to claim 1, wherein the IC chip is picked up by suction and mounted on the substrate. In an IC tag manufacturing method for manufacturing an IC tag by mounting an IC chip on a substrate,
Preparing a wafer with an adhesive sheet by adhesively fixing a diced wafer consisting of a number of IC chips on the adhesive sheet;
Applying ultrasonic waves to the wafer sheet with the adhesive sheet from the adhesive sheet side to the part corresponding to the entire area of the wafer, peeling the individual IC chips from the adhesive sheet at a time and placing them in the parts feeder; IC chips in the parts feeder IC chip aligning / moving process for moving to the top of the substrate while aligning by vibration,
An IC chip mounting step of mounting the IC chip moved by the parts feeder on the substrate;
A sheet cutting step of cutting the substrate into a predetermined shape;
A method for manufacturing an IC tag, comprising: The base material has a sheet and a pair of conductors arranged side by side with a predetermined interval on the sheet, and having a conductive adhesive or a non-conductive adhesive at an end,
In the IC chip mounting step, the IC chip is disposed between a pair of conductors of the base material, and an electrode of the IC chip is connected to the conductor via a conductive adhesive. Item 4. A method for producing an IC tag according to Item 3.   5. The method of manufacturing an IC tag according to claim 3, wherein the IC chip is picked up by suction and mounted on the substrate. The IC chip alignment / movement process includes:
A determination step of determining whether the orientation of the IC chip is normal;
When it is determined that the determination result is not normal, a defective IC chip exclusion step for excluding the IC chip determined to be abnormal from the line of aligned IC chips;
5. The method of manufacturing an IC tag according to claim 3, wherein: In an IC tag manufacturing apparatus for manufacturing an IC tag by mounting an IC chip on a base material and cutting it into a predetermined shape,
A parts feeder for moving IC chips while aligning them by vibration;
Placed on the parts feeder, and an adhesive sheet having wafer holder a number of wafers more resulting adhesive wafer with sheet to dicing wafers made of IC chips sticking fixed on the adhesive sheet is held to face downward ,
Apply ultrasonic waves to the part corresponding to the entire area of the wafer from the adhesive sheet side to the wafer with the adhesive sheet held in the wafer holding part with the adhesive sheet, and peel off individual IC chips from the adhesive sheet at a time in the parts feeder. An ultrasonic irradiation unit to be put into
IC chip mounting means for mounting the IC chip moved by the parts feeder on the substrate;
An apparatus for manufacturing an IC tag, comprising:   The parts feeder is formed to accommodate an IC chip in an accommodating portion main body, a passage connected to the accommodating portion main body and aligning the IC chip, and the accommodating portion main body and the passage. Grooves, vibration means for vibrating the housing main body and the passage, so that the IC chip moves along the groove to the upper part of the base material, and the front and back sides and the direction of the IC chip. 8. The IC tag manufacturing apparatus according to claim 7, further comprising: a defective IC chip removing means for determining and removing a defective IC chip from the passage. Preparing a wafer with an adhesive sheet obtained by adhesively fixing a diced wafer comprising a large number of IC chips on the adhesive sheet;
A process of applying ultrasonic waves to the wafer sheet with a pressure-sensitive adhesive sheet from the pressure-sensitive adhesive sheet side to the entire area of the wafer, peeling the individual IC chips from the pressure-sensitive adhesive sheet at a time, and placing them in the parts feeder. IC chip supply method. A wafer holding unit with an adhesive sheet that is disposed on the parts feeder and holds the wafer with the adhesive sheet obtained by adhesively fixing a diced wafer comprising a large number of IC chips on the adhesive sheet so that the wafer faces downward;
Apply ultrasonic waves to the part corresponding to the entire area of the wafer from the adhesive sheet side to the wafer with the adhesive sheet held in the wafer holding part with the adhesive sheet, and peel off individual IC chips from the adhesive sheet at a time in the parts feeder. An IC chip supply device comprising an ultrasonic irradiation unit to be put into the IC.

Images