KR20180131425A - Semiconductor manufacturing apparatus and method for manufacturing semiconductor device - Google Patents

Abstract

An object of the present invention is to provide a semiconductor manufacturing apparatus provided with a collet exchange unit capable of performing attachment and removal of collets having a plurality of outer sizes. The semiconductor manufacturing apparatus includes a collet holder holding and supporting a collet with a magnet, a head provided with the collet holder at a tip and adsorbing and picking up a die to the collet, the collet exchange unit exchanging the collet, and a control device controlling the head and the collet exchange unit. The collet exchange unit is provided with a collet clamp unit having an opening and closing arm having a hook structure and an opening and closing arm control device controlling the opening and closing arm. The collet holder is provided with a relief unit of a hook of the opening and closing arm. The control device lifts and lowers the head by opening and closing the opening and closing arm. As a result, the collet is attached to the collet holder and the collet is removed from the collet holder.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a semiconductor manufacturing apparatus and a manufacturing method of a semiconductor device,

The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable, for example, to a die bonder in which a magnet is embedded in a collet holder.

In a part of a step of mounting a semiconductor chip (hereinafter, simply referred to as a "die") on a wiring board or a lead frame (hereinafter simply referred to as a "substrate") and assembling the package in a part of the manufacturing process of the semiconductor device, (Hereinafter, simply referred to as a " wafer ") and a bonding step of mounting the divided die on the substrate. The semiconductor manufacturing apparatus used in the bonding process is a die bonding apparatus such as a die bonder.

In the bonding step, the dies divided from the wafer are peeled one by one from the dicing tape, and bonded onto the substrate using a suction jig called a collet.

In such a die bonder, it is necessary to increase the frequency of replacement of the collet in contact with the surface of the die in order to replace the collet in accordance with the type (die size) or to prevent surface flaw or contamination of the die (for example, Japanese Patent Application Laid-Open No. 2014-56978 (Patent Document 1)).

Japanese Patent Application Laid-Open No. 2014-56978

In the patent document 1, the collet holder is rotated using the claws of the collet exchanging part adapted to the collet size, and the magnet fixing collet is removed and attached. However, the magnet fixed collet has a plurality of external sizes and can not be removed and attached with the same structure.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor manufacturing apparatus provided with a collet exchanging section capable of attaching and removing collets of a plurality of external sizes.

Other tasks and novel features will be apparent from the description of the present specification and the accompanying drawings.

An outline of representative examples of the present disclosure will be briefly described below.

That is, the semiconductor manufacturing apparatus includes a collet holder for holding a collet with a magnet, a collet holder having a collet holder at a tip thereof, a pickup for picking up a die by the collet, a collet exchanging unit for exchanging the collet, And a controller for controlling the head and the collet exchange unit. The collet exchanging section includes a collet clamping section having an opening / closing arm having a hook structure and an opening / closing arm control device for controlling the opening / closing arm. The collet holder has a relief portion of a claw of the opening / closing arm. The control device causes the collet to be attached to the collet holder and to remove the collet from the collet holder by opening and closing the opening and closing arm to move the collet up and down.

According to the above semiconductor manufacturing apparatus, it is possible to attach and remove a plurality of external size collets.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view for explaining a configuration example of a die bonder. Fig.
Fig. 2 is a view for explaining a configuration of the die bonder of Fig. 1; Fig.
Fig. 3 is a view for explaining a configuration of the die supply section of Fig. 1; Fig.
Fig. 4 is a view for explaining a main part of the die supply unit of Fig. 3; Fig.
5 is a view for explaining a structure of a collet holder used in the die bonder of Fig. 1;
Fig. 6 is a view for explaining the structure of the collet holder of Fig. 5; Fig.
7 is a view for explaining a structure of a collet exchanging part provided in the die bonder of Fig. 1;
8 is a view for explaining the structure of the collet exchange unit in Fig. 7; Fig.
9 is a view for explaining a collet exchange method in the die bonder of Fig. 1; Fig.
10 is a view for explaining a collet exchange method in the die bonder of Fig. 1; Fig.
11 is a view for explaining a collet exchange method in the die bonder of Fig. 1;
12 is a view for explaining a collet exchange method in the die bonder of Fig. 1;
13 is a view for explaining a collet holder exchange method in the die bonder of Fig. 1;
14 is a flow chart showing a method for manufacturing a semiconductor device using the die bonder of Fig. 1;

Hereinafter, embodiments will be described with reference to the drawings. In the following description, the same constituent elements are denoted by the same reference numerals, and repeated explanation may be omitted. In addition, in order to make the explanation more clear, the drawings are schematically expressed in terms of the width, thickness, shape, etc. of each part in comparison with the actual form, but the interpretation of the present invention is not limited to .

<Examples>

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a top view showing a configuration example of a die bonder. Fig. Fig. 2 is a view showing the configuration when viewed in the direction of arrow A in Fig. 1. Fig.

The die bonder 10 includes a die supply unit (not shown) for supplying a die D mounted on a substrate S printed with a product area (hereinafter, referred to as &quot; package area P &quot; 1, the pickup 2, the intermediate stage 3, the bonding portion 4, the carry section 5, the substrate supply section 6, the substrate carry-out section 7, And a control device (8) for monitoring and controlling. The Y axis direction is the front and back direction of the die bonder 10, and the X axis direction is the left and right direction. The die feeder 1 is disposed in front of the die bonder 10 and the bonding portion 4 is disposed inward.

First, the die supply unit 1 supplies a die D mounted on the package area P of the substrate S. The die feeding section 1 has a wafer holding table 12 for holding a wafer 11 and a push-up unit 13 indicated by a dotted line for pushing the die D from the wafer 11. The die feeder 1 moves in the X and Y directions by driving means (not shown), and moves the pick-up die D to the position of the push-up unit 13.

The pick-up section 2 includes a pick-up head 21 for picking up a die D, a Y-drive section 23 of a pick-up head for moving the pick-up head 21 in the Y- (Not shown) for moving in the direction. The pick-up head 21 has a collet 22 (see also Fig. 2) for sucking and holding the push-up die D at its tip, and picks up the die D from the die feeder 1, Load. The pick-up head 21 has respective driving portions (not shown) for lifting, rotating, and moving the collet 22 in the X direction.

The intermediate stage portion 3 has an intermediate stage 31 for temporarily loading the die D and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31. [

The bonding section 4 picks up the die D from the intermediate stage 31 and bonds it onto the package area P of the substrate S to be transported or on the die already bonded to the package area P of the substrate S Bonding. The bonding section 4 includes a bonding head 41 having a collet 42 (see also Fig. 2) for sucking and holding the die D at its tip as in the case of the pick-up head 21, And a substrate recognition camera 44 for picking up a position recognition mark (not shown) of the package area P of the substrate S and recognizing the bonding position.

With this arrangement, the bonding head 41 corrects the pickup position / posture based on the image pickup data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, The die D is bonded to the package area P of the substrate S.

The transfer section 5 has a substrate transfer claw 51 for holding and transferring the substrate S and a transfer lane 52 on which the substrate S is moved. The substrate S is moved by driving a nut of a substrate transfer claw 51 provided on the transfer lane 52 by a ball screw (not shown) provided along the transfer lane 52. With this arrangement, the substrate S moves from the substrate supply unit 6 to the bonding position along the conveyance lane 52, moves to the substrate carry-out unit 7 after bonding, S.

The control device 8 has a memory for storing a program (software) for monitoring and controlling the operation of each part of the die bonder 10 and a central processing unit (CPU) for executing a program stored in the memory.

Next, the configuration of the die feeder 1 will be described with reference to Figs. 3 and 4. Fig. Fig. 3 is a view showing an external perspective view of the die supply unit of Fig. 1. Fig. Fig. 4 is a schematic sectional view showing a main part of the die supply portion of Fig. 3; Fig.

The die feeding section 1 includes a wafer holding base 12 moving in the horizontal direction (XY direction) and a lifting unit 13 moving in the vertical direction. The wafer holding support 12 includes an expanding ring 15 for holding the wafer ring 14 and a dicing tape 16 held by the wafer ring 14 to which a plurality of dies D are bonded horizontally And has a supporting ring 17 for positioning. The push-up unit 13 is disposed inside the support ring 17.

The die feeder 1 descends the expander ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held on the wafer ring 14 is extended so that the distance between the dies D is widened, the die D is pushed up from below the die D by the lifting unit 13, The pickup performance of D is improved. The adhesive for bonding the die to the substrate with the thinning becomes a film form from the liquid state and a film form called a die attach film (DAF) 18 is formed between the wafer 11 and the dicing tape 16 Is adhered. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling step, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16.

The pick-up head 21 has a suction hole 21a through which the adsorption air flows at the center and has a collet shank 21b connected to the collet holder 25 at the tip side and a collet shank 21b connected to the collet holder 25, And a collet fixing portion 21c for fixing the collet fixing portion 21c. The bonding head 41 is the same as the pickup head 21.

Next, the collet holder will be described with reference to Figs. 5 and 6. Fig. Figs. 5 and 6 are views for explaining a collet holder used in the die bonder of Fig. 1, Fig. 5 is a cross-sectional view of the pick-up head, collet holder and collet, and Fig. 6 is a top view of the collet holder.

The collet holder 25 has a suction hole 25a communicating with the suction hole 21a of the pickup head 21 at the center and a magnet 25b for fixing the collet 22 to the center. The collet holder 25 has a cutout (claw relief) 251c near the center of each of the four sides, so that the collet exchange jig can grip the collet. The opening of the collet holder 25 is formed into a wide taper shape toward the bottom so that the collet 22 can be attracted by the magnet 25b and the collet 22 can be attached.

The collet 22 is made of stainless steel (SUS (magnetic)) 22b on the back surface of an elastic body 22a such as a silicone rubber so as to be fixed by a magnet and holds four sides in the collet holder 25, (Not shown) communicating with the suction holes 251a for adsorbing the die D are provided. The surface of the elastic body 22a has a holding portion 22c which is held in contact with the die D. The holding portion 22c is integrally formed with the elastic body 22a and is of the same size as the die D.

Although the pickup head 21 has been described, the bonding head 41 is also the same.

Next, the collet exchanging unit will be described with reference to Figs. 7 is a top view of the collet exchanging part provided in the die bonder of Fig. 8 is a sectional view taken along the line A1-A2 in Fig.

The collet exchanging part 90 includes a collet clamping part 91 having an opening and closing arm 91a which clamps the side of the collet and which has a hook structure on the upper side and an arm control part 91b which controls opening and closing of the opening and closing arm 91a, A supply unit 92 for supplying an unused collet, and a waste unit 93 for discarding the used collet. The opening and closing arm 91a can be opened to match the maximum width of the collet. As shown in Fig. 8, when the opening and closing arm 91a is closed, the side of the collet can be clamped and, in a fixed state, the claws 91aa are disposed at two places on the upper left and right sides. The supply part 92 and the waste part 93 have openings 92k and 93k on the upper side. It is preferable that the supplying section 92 and the waste section 93 are disposed in a place where there is no influence on the pickup operation or the bonding operation and are out of the operable range of the pickup head 21 and the bonding head 41. The collet clamp portion 91, the supply portion 92 and the waste portion 93 are arranged on a straight line in the transverse direction, and the collet clamp portion 91 is moved in the lateral direction. Further, the collet clamping section 91 may be movable in the horizontal direction (X direction, Y direction) and vertical direction.

Next, a method of attaching and removing the collet 22 to the collet holder 25 in the collet exchanging unit 90 will be described with reference to Figs. 9 to 11. Fig. 9 (A) is a top view, and FIG. 9 (B) is a cross-sectional view, and FIG. 9 (C) is a cross-sectional view of the collet holder. Side view. 10 (A) is a top view, FIG. 10 (B) is a cross-sectional view, and FIG. 10 (C) shows a state in which the collet is held on a collet holder Side view. 11 (A) is a top view, and FIG. 11 (B) is a cross-sectional view, and FIG. 11 (C) shows a state where a collet is fixed to a collet holder, Side view.

First, a method of attaching the collet 22 to the collet holder 25 will be described. The control device 8 moves the collet clamping portion 91 to the upper side of the supply portion 92. [ The control device 8 raises the collet 22 in the supply portion 92 until it reaches the hook of the opening and closing arm 91a. The control device 8 clamps the raised collet 22 by the opening / closing arm 91a. 9, the control device 8 conveys the collet clamp portion 91 clamped by the collet 22 to the exchange position (above the intermediate stage 31). The control device 8 recognizes the position of the collet contour by the stage recognition camera 32. Barcode or the like.

As shown in Fig. 10, the control device 8 moves down the collet holder 25 in the state where no collet is present, and attaches the collet 22 thereto. The collet 22 is pulled up by the magnetic force of the magnet 251b by approaching the collet holder 25 so as not to tighten the accuracy of the collet clamp state As shown in Fig. As described above, the collet holder 25 has hooking reliefs 251C on its upper, lower, left, and right sides. As shown in Fig. 11, the control device 8 opens the opening / closing arm 91a and moves the collet clamping portion 91 to a predetermined position.

Next, a method of removing the collet 22 from the collet holder 25 will be described. As shown in Fig. 11, the control device 8 moves the collet clamp portion 91 to the removal position in a state in which the opening and closing arm 91a is opened. As shown in Fig. 10, the control device 8 clamps the collet 22 by the opening and closing arm 91a. 9, the control device 8 raises the collet holder 25 in a state in which the opening and closing arm 91a clamps the collet 22 and removes the collet 22 from the collet holder 25 do. The controller 8 transfers the collet 22 to which the opening / closing arm 91a is clamped (removed) to the upper side of the waste portion 93 to open the opening / closing arm 91a to drop the collet 22, (93).

Although the collet exchange of the pickup head 21 has been described, the collet exchange of the bonding head 41 is the same.

As shown in Fig. 7, the longitudinal collet (vertically long collet holder) has been described. However, as shown in Fig. 11, it is also applicable to a horizontal collet (transverse collet holder).

Next, a method of exchanging the collet holder will be described with reference to Fig. FIG. 13A is a top view, FIG. 13B is a cross-sectional view, and FIG. 13C is a side view. FIG. 13A is a top view of the collet holder. FIG.

When changing varieties, replace the collet holder. As in the case of the collet 22, the collet holder is clamped by the opening and closing arm 91a of the collet clamping portion 91, removed, and attached. A magnet is provided on the lower part of the collet shank 21b or on the collet holder 25 and the collet holder is fixed by a magnet to make the collet stronger than the collet.

The collet of the intermediate stage (collet type intermediate stage) when the intermediate stage is constituted by a collet can be clamped and removed by the opening and closing arm 91a of the collet clamping section 91 similarly to the collet 22 and attached.

In the embodiment, since the collet is exchanged by the opening / closing arm having the hook structure on the upper side by clamping the side of the collet, the collet can be applied to various sizes (variety (change in collet appearance) . As a result, manpower reduction and operation rate improvement can be performed.

Further, by moving the collet clamp section 91 above the intermediate stage, all of the collet, collet holder, and collet type intermediate stages can be exchanged (removed and attached) by one collet clamp section. Further, by moving the collet clamp portion 91 above the intermediate stage, both the collet of the bonding head and the collet of the pick-up head can be exchanged. That is, for each of the three uses of the collet (bonding head, pick-up head, intermediate stage), the collets corresponding to the respective varieties can be exchanged by one collet clamp unit. In addition, the mounting state of the collet can be confirmed by the stage recognition camera above the intermediate stage.

Next, a method for manufacturing a semiconductor device using a die bonder according to an embodiment will be described with reference to FIG. 14 is a flowchart showing a manufacturing method of a semiconductor device.

Step S11: The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is held is stored in the wafer cassette (not shown), and is carried into the die bonder 10. The control device 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply part 1. Further, the substrate S is prepared and carried into the die bonder 10. The control device 8 loads the substrate S onto the conveyance lane 52 in the substrate supply part 6. [

Step S12: The control device 8 picks up the die D from the dicing tape 16 held on the wafer ring 14. Then,

Step S13: The control device 8 stacks the picked-up die D on the die mounted on the package area P of the substrate S or on the die already bonded. More specifically, the control device 8 loads the die D picked up from the dicing tape 16 onto the intermediate stage 31, picks up the die D again from the intermediate stage 31 with the bonding head 41 , And bonded to the package area P of the substrate S that has been transported.

Step S14: The control device 8 transfers the substrate S to the substrate carry-out section 7 by moving the substrate S to the substrate carry-out section 7 with the substrate transfer claw 51 and transfers the substrate S from the die bonder 10 (Substrate unloading).

The present invention has been described in detail based on the embodiments. However, it is needless to say that the present invention is not limited to the above-described embodiments, but can be variously changed.

For example, in the embodiment, the collet clamp section 91, the supply section 92 and the waste section 93 are arranged on a straight line in the transverse direction, and the collet clamp section 91 moves in the lateral direction, The portion 91, the supply portion 92 and the waste portion 93 may be arranged on a straight line in the vertical direction and may move the collet clamp portion 91 in the vertical direction. Further, the arrangements of the supply part 92 and the waste part 93 may be reversed.

It is also possible to use a die bonder having a pickup section, a mounting section including an aligning section and a bonding section, and a die bonder having a plurality of feed lanes, a plurality of mounting sections including a pickup section, an alignment section and a bonding section, do.

Further, in the embodiment, an example of using a die attach film is described, but a die attach film may not be used by providing a preform section for applying an adhesive to a substrate.

Further, in the embodiment, the die bonder for picking up the die from the die supply unit to the pick-up head, loading the die on the intermediate stage, and bonding the die mounted on the intermediate stage to the substrate with the bonding head has been described. However, The present invention is applicable to a semiconductor manufacturing apparatus that picks up a die from a die supply section.

For example, it is applicable to a die bonder in which there is no intermediate stage and pick-up head, and a die of a die supply portion is bonded to a substrate by a bonding head.

The present invention is also applicable to a flip chip bonder having no intermediate stage, picking up a die from a die feeder and rotating the die pick-up head to transfer the die to the bonding head and bonding the substrate to the substrate with a bonding head.

Further, the present invention is applicable to a die sorter that does not have an intermediate stage and a bonding head, and mounts a die picked up by a pick-up head from a die feeder onto a tray or the like.

10: die bonder
1:
2: Pickup section
21: Pickup head
22: Collet
25: Collet holder
3: intermediate stage part
31: Intermediate stage
4:
41: bonding head
42: Collet
5:
51: substrate carrier hook
8: Control device
9: Collet exchange part
91: Collet clamp part
91a: opening / closing arm
91b: opening / closing arm control section
92:
93:
D: Die
S: substrate
P: package area

Claims (17)

A collet holder for holding the collet by a magnet,
A head having a collet holder at its tip and picking up the die by suction with the collet;
A collet exchange unit for exchanging the collet;
A controller for controlling the head and the collet exchanging unit
And,
The collet exchanging section includes a collet clamping section having an opening and closing arm having a hook structure and an opening and closing arm control device for controlling the opening and closing arm,
Wherein the collet holder includes a claw relief portion of the opening and closing arm,
Wherein the control device performs attachment of the collet to the collet holder and removal of the collet from the collet holder by opening and closing the opening and closing arm to move the head up and down. The method according to claim 1,
The collet exchange unit
A supply part for supplying a collet to be attached to the collet holder,
And a discarding unit for discarding the collet to be removed from the collet holder
Further comprising: a semiconductor substrate; 3. The method of claim 2,
The control device includes:
The collet supplied from the supply unit is clamped by the opening / closing arm,
The collet clamped by the opening / closing arm is moved to the lower side of the collet holder,
And the collet holder is lowered to attach the collet clamped to the opening / closing arm to the collet holder. The method of claim 3,
The control device causes the collet held by the opening / closing arm to suck the collet by the magnetic force of the magnet by approaching the collet holder to the collet clamped to the opening / closing arm, Device. 5. The method of claim 4,
The control device includes:
A collet fixed to the collet holder is clamped by the opening / closing arm,
Lifting the collet holder to remove the collet fixed to the collet holder from the collet holder,
The collet clamped by the opening / closing arm is moved to the upper side of the waste portion,
And the collet is discarded in the waste portion by opening the opening / closing arm. The method according to claim 1,
Wherein the control device performs the attachment of the collet holder to the head and the removal of the collet holder from the head by opening and closing the opening and closing arm to move the head up and down. The method according to claim 6,
The control device includes:
The collet holder is clamped by the opening / closing arm,
The collet holder clamped by the opening / closing arm is moved to the lower side of the head,
And the collet holder clamped to the opening / closing arm is attached to the head by lowering the head. 8. The method of claim 7,
Wherein the head has a magnet for attracting the collet holder with a magnetic force. 9. The method of claim 8,
The control device includes:
A collet holder fixed to the head is clamped by the opening / closing arm,
And lifts the head to remove the collet holder fixed to the head from the head. The method according to claim 1,
Further comprising a die supply portion having a wafer ring for holding a dicing tape to which a die is bonded,
Wherein the head is a pick-up head for picking up a die bonded to the dicing tape. 11. The method of claim 10,
An intermediate stage on which a die picked up by the pickup head is loaded,
A bonding head for bonding a die picked up from the intermediate stage onto a substrate or an already-
Further comprising:
Wherein the bonding head comprises the collet holder. 12. The method of claim 11,
The control device moves the collet clamp portion above the intermediate stage and exchanges the collet of the pick-up head and the collet of the bonding head. 13. The method of claim 12,
The intermediate stage is a collet type stage,
Wherein the control device opens and closes the opening / closing arm, attaches the collet to and from the intermediate stage, and removes the collet from the intermediate stage. The method according to claim 1,
Further comprising a die supply portion having a wafer ring for holding a dicing tape to which a die is bonded,
Wherein the head is a bonding head for picking up a die bonded to the dicing tape and bonding it onto a substrate or an already bonded die. (a) preparing a semiconductor manufacturing apparatus according to any one of claims 1 to 12;
(b) carrying a wafer ring holding a dicing tape to which a die is bonded;
(c) preparing and transporting a substrate,
(d) picking up the die,
(e) bonding the picked-up die onto the substrate or an already bonded die
And a step of forming the semiconductor device. 16. The method of claim 15,
In the step (d), a die bonded to the dicing tape is picked up by a bonding head,
(E) bonding the die picked up with the bonding head onto the substrate or the die already bonded. 17. The method of claim 16,
The step (d)
(d1) picking up a die bonded to the dicing tape with a pickup head,
(d2) a step of loading the die picked up by the pick-up head onto an intermediate stage
Lt; / RTI &
The step (e)
(e1) picking up a die loaded on the intermediate stage with a bonding head,
(e2) a step of loading the die picked up by the bonding head onto the substrate
And a step of forming the semiconductor device.

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