KR20140128517A - Semiconductor test handler having a exchangeable blade - Google Patents

Abstract

The present invention relates to a handler device for testing a semiconductor device, in which a blade for pressing or fixedly adsorbing a test semiconductor device can be conveniently replaced. In the handler device including the blade module for pressing or fixedly adsorbing a test semiconductor device, the blade module is configured such that a blade block and a blade are assembled by using magnetic force or in a rotational locking and unlocking manner, or a CCU block and a blade module are assembled in a latch manner, whereby a test can be performed quickly by replacing only a blade (module) prepared to have an appropriate size according to sizes of test semiconductor devices, improving operation efficiency.

Description

Technical Field The present invention relates to a handler device for testing a semiconductor device having a replaceable blade,

The present invention relates to a handler device for semiconductor device testing, and more particularly to a handler device for testing a semiconductor device that can conveniently replace a blade to be pressed or adsorbed on a test semiconductor device.

Generally, when a semiconductor device is intended for mass production, an automatic handler is used to test a large number of semiconductor devices in a short period of time.

For example, Japanese Laid-Open Patent Publication No. 10-2008-0033014 (published on Apr. 16, 2008) discloses a device connection device of a test handler, and a semiconductor device is transferred into a socket provided on a test board using a pusher robot The pusher robot performs a series of tests by transferring the tested semiconductor devices to the unloading stacker and classifying the tested semiconductor devices into the trays according to the test results.

The handler device is provided with a blade module for pressing or adsorbing a semiconductor device. The blade module pushes and holds the semiconductor device by driving the pusher, and vacuum adsorbs the semiconductor device.

As another example, Japanese Laid-Open Patent Application No. 10-2010-0070620 (published on June 28, 2010) discloses a vacuum adsorption picker, which includes an eject pin in a blade module to fix a semiconductor device by vacuum adsorption, And the semiconductor device is pushed downward by the eject pin when the semiconductor device is released, so that the semiconductor device and the vacuum pad can be easily separated from each other.

Meanwhile, in the conventional handler device, the blade module is replaced with a blade of an appropriate size according to the size of the test semiconductor device, and work is being performed.

To accomplish this, in the prior art, when a blade to be in direct contact with a test semiconductor device and a blade block to which the blade is assembled are assembled with a plurality of bolts to replace the blade, the bolts are loosened to separate the blades, The blade block and bolt are assembled and tested.

However, such a conventional blade block requires a plurality of bolts for each new semiconductor device test and requires bolts to be fastened after replacing the blades. Therefore, there is a problem that the work time is long and the working efficiency is low.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art, and it is an object of the present invention to provide a handler device having a blade capable of easily and promptly replacing a blade (module)

To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described herein, there is provided a handler device for testing semiconductor devices, comprising: a blade module for pressing or attracting a test semiconductor device; A blade block having a pick-up rod capable of being picked up by vacuum suction of the semiconductor device at the center of the recess; And a blade that is inserted into the recessed portion of the blade block to be in contact with the upper surface of the semiconductor device, the permanent magnets being provided in the recessed portion of the blade block and being fixed by the magnetic force with the blade .

Preferably, in the present invention, the permanent magnet is a samarium cobalt (SmCo) series.

Preferably, in the present invention, the side wall of the concave portion further includes a ball plunger elastically supported, and more preferably, a coupling groove is formed in the blade corresponding to the ball plunger so that the ball plunger can be inserted and fixed thereto do.

Preferably, in the present invention, the blade includes an assembling body inserted into the recessed portion of the blade block; And a contact body formed integrally with the assembly body and contacting the upper surface of the semiconductor device.

According to another aspect of the present invention, there is provided a handler device for testing a semiconductor device, the handler device comprising a blade module for pressing or attracting a test semiconductor device, the blade module comprising: A blade block having a guide protrusion formed on a side wall of the recess and having a pick-up rod capable of being picked up by vacuum suction of the semiconductor device at the center of the recess; And a guide groove formed in the guide groove for receiving the guide protrusion. The guide groove is formed in the guide groove so that the blade block and the locking / And includes a blade for locking.

On the other hand, a handler apparatus for testing a semiconductor device according to another aspect of the present invention includes a blade module to which a test semiconductor device is pressed or adsorbed and fixed, wherein the blade module has a cylindrical- A blade block provided with a recessed portion and having a pick-up rod capable of being picked up by vacuum suction of the semiconductor device at the center of the recessed portion; An annular body which is elastically supported and vertically inserted into the recessed portion so as to be movable, the clamp housing having a guide protrusion protruding from an inner side wall of the annular body; And a guide groove formed on the upper surface of the semiconductor device so as to be in contact with the upper surface of the semiconductor device. The guide groove is engaged with the guide protrusion, and the guide protrusion is moved along the guide groove And a blade guided and locked / unlocked with the clamp housing.

Preferably, in the present invention, an elastic body for elastically supporting the clamp housing is interposed in the blade block and the clamp housing, and the end of the fixing pin is screwed to the blade block.

Preferably, in the present invention, the blade includes: a cylindrical assembling body inserted into the recessed portion of the blade block and having the guide groove; And a contact body formed integrally with the assembly body and contacting the upper surface of the semiconductor device.

Preferably, in the present invention, the guide groove portion includes an inclined groove formed in an inclined shape in a spiral shape along the outer peripheral surface of the blade, and a fixing groove formed on a plane extending from the inclined groove and orthogonal to the rotation axis of the blade.

Preferably, in the present invention, the blade block and the blade further include an engaging member that is engaged with the contact surface so that the blade block and the blade can be assembled at a predetermined position.

On the other hand, according to another aspect of the present invention, there is provided a handler device for testing semiconductor devices, comprising: a plurality of CCU blocks pivotally mounted on a lower portion of a CCU plate; A pair of first and second latch portions provided on a side surface of the CCU block; And a pair of first and second latching jaws formed on the blade module so as to be able to be engaged with the first and second latching portions, respectively, wherein the first latching portion is elastically hinged on a side surface of the CCU block, The second latch portion being movable in a vertical direction on a side surface of the CCU block and being elastically supported upward so that the second latch portion can be fixed to the second latching jaw, And includes a locking projection.

Preferably, in the present invention, a pair of first brackets protruding from a side surface of the CCU block is provided, the first latch unit is rotatably assembled between the first brackets, And the second latch portion is inserted between the second brackets and is vertically movable by the fastening bolts, and is elastically supported by the second brackets And is pressed upward.

Preferably, in the present invention, the first latch portion and the second latch portion are provided in a side diagonal direction of a CCU block having a hexahedral shape as a whole.

Preferably, in the present invention, the CCU block and the blade module further include an engaging member which is engaged with the assembly surface so that the CCU block and the blade module can be assembled at a predetermined position. More preferably, in the present invention, Shaped protrusion and a groove into which the protrusion is inserted.

A handler device for testing a semiconductor device according to the present invention is a handler device comprising a blade module to press or adsorb and fix a test semiconductor device, wherein the blade module comprises a blade block having a permanent magnet, The test can be performed by replacing only the blades prepared in an appropriate size according to the size of the test semiconductor device including the detachable blades, thereby improving the working efficiency.

The handler device for testing a semiconductor device according to the present invention is a handler device including a blade module to which a test semiconductor device is pressed or adsorbed and fixed. The blade module includes a blade block, a locking / Since the test can be performed by replacing only the blades prepared in an appropriate size according to the size of the test semiconductor device including the blade for which unlocking is performed, the working efficiency can be improved.

The handler device for testing a semiconductor device according to the present invention includes a plurality of CCU blocks pivotally mounted on a lower portion of a CCU plate and a semiconductor module including a blade module assembled with each of the CCU blocks, In the handler device for device testing, the CCU block and the blade module can be easily locked / unlocked by a pair of latch members, so that only the blade module prepared in an appropriate size according to the size of the test semiconductor device is replaced The test for a new semiconductor device can be performed, so that the working efficiency can be improved.

1 is a perspective view showing a handler device for testing a semiconductor device according to a first embodiment of the present invention,
FIG. 2 is an exploded perspective view of a blade module, which is a main component of a handler device for testing semiconductor devices according to a first embodiment of the present invention,
3 is a perspective view of a blade in a handler device for testing semiconductor devices according to a first embodiment of the present invention,
4 is a perspective view showing a handler device for testing a semiconductor device according to a second embodiment of the present invention,
5 is an exploded perspective view of a blade module which is a main component of a handler device for testing semiconductor devices according to a second embodiment of the present invention,
6 is a sectional view of a blade module in a handler device for testing semiconductor devices according to a second embodiment of the present invention;
Fig. 7 is an enlarged view of Fig. 6A,
8 is a perspective view of a blade in a handler apparatus for testing semiconductor devices according to a second embodiment of the present invention,
9 is a front view of the blade in the handler device for testing semiconductor devices according to the second embodiment of the present invention;
10 is a view showing an example of using a blade module in a handler device for testing semiconductor devices according to a second embodiment of the present invention.
11 is a perspective view showing a handler device for testing a semiconductor device according to a third embodiment of the present invention,
12 is an exploded perspective view of a CCU block and a blade module, which are essential components in a handler device for testing semiconductor devices according to a third embodiment of the present invention,
13 is a view showing an assembly example of a CCU block and a blade module in a handler device for testing semiconductor devices according to a third embodiment of the present invention,
14A and 14B are enlarged views of the first latch portion and the second latch portion in the assembled state of the CCU block and the blade module in the handler device for testing semiconductor devices according to the third embodiment of the present invention, drawing.
15 is a view showing a assembled state of the CCU block and the blade module in the handler device for testing semiconductor devices according to the third embodiment of the present invention.

The specific structure or functional description presented in the embodiment of the present invention is merely illustrative for the purpose of illustrating an embodiment according to the concept of the present invention, and embodiments according to the concept of the present invention can be implemented in various forms. And should not be construed as limited to the embodiments described herein, but should be understood to include all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Meanwhile, in the present invention, the terms first and / or second etc. may be used to describe various components, but the components are not limited to the terms. The terms may be referred to as a second element only for the purpose of distinguishing one element from another, for example, to the extent that it does not depart from the scope of the invention in accordance with the concept of the present invention, Similarly, the second component may also be referred to as the first component.

Whenever an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but it should be understood that other elements may be present in between something to do. On the other hand, when it is mentioned that an element is "directly connected" or "directly contacted" to another element, it should be understood that there are no other elements in between. Other expressions for describing the relationship between components, such as "between" and "between" or "adjacent to" and "directly adjacent to" should also be interpreted.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. It will be further understood that the terms " comprises ", or "having ", and the like in the specification are intended to specify the presence of stated features, integers, But do not preclude the presence or addition of steps, operations, elements, parts, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

- First Embodiment -

1, a handler device for testing a semiconductor device includes a contact control unit (hereinafter referred to as a "CCU") plate 10 to which a plurality of CCUs A block 20 is provided and one blade module 100 is bolted to each of the CCU blocks 20 to test the test semiconductor device by each blade module 100, Since the test on the device is substantially the same as the conventional one, the description will focus on the blade module 100, which is a main component of the present invention.

2, the blade module 100 is formed with a recessed groove 111 formed at a center thereof and a pick-up rod 112 capable of picking up the semiconductor device by vacuum suctioning the semiconductor device at the center of the recessed portion 111 A blade block 110 having a plurality of blades; The blade block 110 includes a blade 120 through which the pick-up rod 112 penetrates and which is assembled in the recessed portion 111 of the blade block 110 and comes into contact with the upper surface of the semiconductor device. In the recessed portion 111 of the blade block 110, A magnet 130 is provided and fixed to the blade 120 by a magnetic force.

The blade block 110 is formed of a substantially hexahedral block and has a recessed recess 111 formed in a rectangular shape on one side thereof and a pickup rod 112 is provided at the center of the recessed recess 111. A vacuum cup 113 having elasticity may be added to the bottom of the pick-up rod 112.

Particularly, the recessed portion 111 of the blade block 110 is provided with a permanent magnet 130, and four permanent magnets 130 are shown at each corner of the recessed portion 111. However, The size, number, and arrangement of the blade may be appropriately determined in consideration of the magnitude of the magnetic force generated due to the material of the blade and the like.

Preferably, the size and number of the permanent magnets are determined within a range where the blade 120 can be separated when the blade 120 is separated from the blade block 110 by more than a predetermined operating force when the operator intends to replace the blade, (Not shown).

In the present invention, various known permanent magnets such as neodymium (NdFeB) series or ferrite, alico and the like may be used in the present invention, but preferably a samarium cobalt (SmCo) series permanent magnet having excellent heat resistance is preferable.

In the test process of a semiconductor device, a function test is performed not only at room temperature but also at a low temperature or a high temperature. Therefore, a SmCo series permanent magnet which exhibits a sufficiently strong magnetic force and exhibits excellent magnetic properties under high temperature conditions would be preferable. On the other hand, since the SmCo series permanent magnets have low mechanical strength and are easily peeled off or fragile at the corners, the permanent magnets are formed in the recessed portion 111 to form recesses for assembling the permanent magnets and inserted and fixed in the recessed portions, It is desirable to have a structure that does not become a problem.

The ball plunger 140 may include a ball plunger 140 elastically supported on a sidewall of the recessed portion 111 of the blade block 110. The ball plunger 140 presses the blade 120 fixed in the recessed portion 111, Fixed. The plurality of ball plungers 140 are disposed symmetrically with respect to the sidewalls of the recessed grooves 111 so as to fix the blade 120 on the side surface thereof to form a clearance between the blade block 110 and the blade 120 in the recessed portion 111. [ It is possible to prevent the blade 120 from flowing.

The blade 120 has a through hole 120a to allow the pick-up rod 112 to pass therethrough and is preferably inserted into the recess 111 of the blade block 110; And a contact body 122 integrally formed with the assembly body 121 and contacting the upper surface of the semiconductor device.

The assembly body 121 may be provided in an appropriate shape according to the shape of the recess 111. For example, the assembly body 121 may have the same (flat) shape as the recess 111, It may be desirable to have a minimum clearance so as not to generate a flow on the flat surface in the recessed groove 111 within a range in which the blade block 110 can be detached and attached easily.

The assembly body 121 may have a coupling groove 121a formed along the side surface thereof so as to correspond to the ball plunger 140 and allow the ball plunger 140 to be inserted therein.

The contact body 122 is formed integrally with the assembly body 121 to make contact with the upper surface of the semiconductor device, and the size (area, etc.) will be determined according to the size of the test semiconductor device.

3 is a perspective view of a blade in a handler device for testing semiconductor devices according to a first embodiment of the present invention.

In the present invention, only the assembly body 121 can be partially used for the magnetic material so that the blades can be fixed by the magnetic force of the blade block and the permanent magnet. On the other hand, in the assembly body 121, By fastening the bolt 121b, which is a steel material, the blade block and the blade can be fixed by the permanent magnet without limitation on the material of the blade or the assembly body.

The blade module of the present invention configured as described above can be tested for a new semiconductor device by replacing only the blades 120 when the blade is to be replaced according to a test semiconductor device.

- Second Embodiment -

4, a plurality of CCU blocks 20 are provided under a CCU plate 10 to be conveyed by an unillustrated conveying device, and each CCU block 20 is provided with a blade The module 200 is bolted to test the test semiconductor device in units of each blade module 200, which is similar to the first embodiment, and the following description will focus on the blade module 200, which is a main component of the present invention .

5, the blade module 200 is provided with a cylindrical recessed groove 211 formed at the center thereof and a pick-up rod 212 capable of being picked up by vacuum-sucking the semiconductor device in the center of the recessed portion 211, A blade block 210 having a plurality of blades; A clamp housing 220 having an annular body 221 elastically supported and inserted into the recess 211 so as to protrude from a side wall of the annular body 221 so as to protrude therefrom; The guide protrusion 222 is rotatably assembled inside the clamp housing 220 to be in contact with the upper surface of the semiconductor device and has a guide recessed portion 232 to be engaged with the guide protrusion 222, And a blade 230 which is guided along the guide groove 232 and is locked / unlocked with the clamp housing 220.

The blade block 210 is formed of a substantially hexahedral block and has a recessed groove 211 formed in a cylindrical shape on one side and a pickup rod 212 is provided at the center of the recessed groove 211.

A vacuum cup 212a having elasticity may be added to the tip of the pick-up rod 212. [

The clamp housing 220 is an annular body 221 which is elastically supported and inserted into the recess 211 in a vertical direction and a guide protrusion 222 is protruded from an inner side wall of the annular body 221. The clamp housing 220 is elastically supported in the recess 211 of the blade block 210 so as to be vertically movable.

6 is a sectional view of a blade module in a handler device for testing semiconductor devices according to a second embodiment of the present invention, and Fig. 7 is an enlarged view of Fig. 6A.

6 and 7, an elastic body 223 for elastically supporting the clamp housing 220 is interposed between the blade block 210 and the clamp housing 220 so that the end of the fixing pin 224 is connected to the blade block 220. [ 210 are screwed together.

Therefore, the clamp housing 220 is elastically supported by the elastic body 223 and can be moved within a predetermined distance d1 in the vertical direction.

The blade block 210 and the clamp housing 220 can be assembled by two or more fixing pins elastically supported by elastic members and the arrangement and number of the fixing pins can be appropriately adjusted within a range in which the clamp housing 220 can be smoothly operated .

When the clamp housing 220 is locked with the blade 230, the clamp housing 220 is separated from the blade block 210 and is separated from the blade 230 and the blade block 210 by the elastic body 223, And thus the thermal conduction from the blade block 210 to the blade 230 in the high temperature test process for the semiconductor device can be effectively performed.

Referring again to FIG. 5, the blade 230 has a through hole 230a formed therein so that the pick-up rod 212 penetrates and is rotatably assembled to the inside of the clamp housing 220 to be brought into contact with the upper surface of a semiconductor device And the guide protrusion 222 is engaged with the guide protrusion 222 so that the guide protrusion 222 is guided along the guide recessed and tapped portion 232 along the rotation direction so that the clamp housing 220 and the locking / Locking is done.

8 is a perspective view of a blade in a handler apparatus for testing semiconductor devices according to a second embodiment of the present invention, and FIG. 9 is a front view of a blade in a handler apparatus for testing semiconductor devices according to a second embodiment of the present invention .

8 and 9, the blade 230 includes a circular shaped assembly body 231 and a contact body 233 formed integrally with the assembly body 231 to make contact with the upper surface of the semiconductor device.

The assembly body 231 is formed in a circular shape so as to be inserted into the recessed portion of the blade block (that is, the inside of the clamp housing), and can be determined as an appropriate size within a range in which smooth rotation operation can be performed in consideration of the size of the recessed portion For example, the height of the assembly body 231 is approximately the same as the depth of the recessed portion of the blade block.

The guide recessed groove portion 232 preferably has an inclined recessed portion 232a formed in a spiral shape along the outer peripheral surface of the assembly body 231, And a fixing groove 232b extending from the inclined groove 232a and positioned on a plane orthogonal to the rotation axis of the assembly body 232. [

Therefore, when the blades 230 are assembled into the recessed grooves of the blade block, when the slanted grooves 232a of the blade 230 and the guide protrusions 222 of the clamp housing are fitted to rotate the blade 230, The blade 230 is rotated along the guide protrusion 222 and the guide protrusion 222 is positioned in the fixing groove 232b so that the blade 230 and the blade block (Locking) is performed. On the other hand, separation (unlocking) of the blade 230 and the blade block (clamp housing) can be performed by rotating the blade 230 in the reverse direction.

The contact body 233 is formed integrally with the assembly body 231 and is in contact with the upper surface of the semiconductor device. The size (area, etc.) of the contact body 233 will be determined according to the size of the test semiconductor device.

Preferably, the upper surface of the assembly body 231, which is in contact with the blade block, may further include at least one protrusion 231a protruding from the upper surface of the assembly body 231. When assembling the blade and the blade block, the fixing protrusion 231a (See FIG. 5) formed in the recessed groove portion of the blade block so that the blade block and the blade can be assembled at a predetermined position.

In the present embodiment, the fixing protrusions are formed on the blades and the coupling grooves are provided on the blade blocks. However, the grooves are formed on the blades and the fixing protrusions are formed on the blade blocks. Assembly may be done in place.

10 is a view showing an example of using a blade module in a handler device for testing semiconductor devices according to a second embodiment of the present invention.

The blade module 200 configured as described above can easily lock the blade block 210 and the blade 230 by rotating the blade block 210 with the blade 230 interposed therebetween. 230 can be conveniently separated (unlocked) by a reverse rotation operation at a slightly pulled out position (approximately by the fixing projection height).

Therefore, when the blade is replaced according to the size of the test semiconductor device, only the corresponding blade can be conveniently replaced and the semiconductor device can be tested.

Meanwhile, the clamp housing, which directly fixes the blade 230 when the blade block 210 and the blade 230 are separated, is elastically supported with respect to the blade block 210 to move up and down within a certain range, It is possible to prevent the guide protrusion or the guide groove portion from being damaged by unreasonable operation at the time of rotation separation of the guide protrusion 230 or 230. [

Although the clamping housing is provided in the blade block and the blade is locked by the guide protrusion of the clamp housing, the guide protrusion is provided on the side wall of the recess of the blade block without the clamping housing, And the locking / unlocking of the blade may be accomplished.

- Third Embodiment -

11, the handler device for testing a semiconductor device includes a plurality of CCU blocks 300 below a CCU plate 10 to be conveyed by an unillustrated conveying device, and each CCU block 300 has one The blade module 400 of each blade module 400 is assembled and tested for each test module.

A diaphragm cylinder 30 may be provided between the CCU plate 10 and the CCU block 300. The diaphragm cylinder 30 is installed on the CCU plate 10 and is controlled by a regulator The CCU block 300 is precisely operated up and down to adjust the pressing force to the test semiconductor device.

The CCU block 300 is composed of two blocks, and the lower block can flow in the forward, backward, left and right directions on the horizontal plane with respect to the upper block. Therefore, the blade module 400 assembled under the CCU block 300 descends, The CCU block 300 can move back and forth or in the left and right direction to absorb an error in the horizontal position that may occur when the blade module and the socket are assembled.

A plurality of guide bushes 401 may be provided under the blade module 400. The guide bushes 401 may be coupled with guide protrusions provided in the socket in which the test semiconductor device is placed, Thereby guiding the lowered position of the blade module 400. [ In the present embodiment, the guide bushes 401 are arranged at a lower portion of the blade module 400 at a pair of diagonal positions.

Particularly, in the present invention, the CCU block 300 and the blade module 400 are assembled by a pair of latches, so that the blade module 400 can be detached and attached easily.

Specifically, as illustrated in FIG. 12, the present invention includes a pair of first and second latch portions 310 and 320 provided on a side surface of the CCU block 300; And a pair of first and second latching protrusions 410 and 420 formed on the blade module 400 so as to be capable of being engaged with the first and second latching portions 310 and 320, respectively.

The first latch unit 310 includes a first latching protrusion 313 elastically hinged to a side surface of the CCU block 300 to be fixed to the first latching protrusion 410, Includes a second locking protrusion 321 which is slidable in the vertical direction on the side surface of the CCU block 300 and is elastically supported upward to be fixed to the second locking protrusion 420.

The first latch unit 310 includes a first latch body 312 having a hinge protrusion 311 protruded therefrom, a first latching protrusion 313 bent at a lower end of the first latch body 312, May be provided by a first elastic body 314 provided between the upper end of the one latch body 312 and the CCU block 300.

The first bracket 301 is formed with a hinge hole 301a so that the first bracket 301 and the first bracket 301 are spaced apart from each other at the side of the CCU block, The hinge protrusion 311 is assembled to the hinge hole 301a so that the first latch portion 310 is assembled to the CCU block 300 so as to be elastically rotatable.

On the other hand, in the second latch portion 320, the second latch body 322, in which the second latching protrusion 321 is bent at the lower end, is formed with a guide groove 322a having a long hole in the longitudinal direction, The second latch body 322 can be moved in the vertical direction while the upper and lower movable range of the second latch body 322 can be moved in the vertical direction by the fastening bolt 323, Can be determined by the length d2 of the guide groove 312a to be inserted.

The head 324 is horizontally bent at the upper end of the second latch body 322 and the head 324 is elastically supported by the two second elastic bodies 325.

2 shows that the spacer 326 is inserted into the fastening bolt 323 and assembled with the second latch body 322. Reference numeral 402 denotes a vacuum cup capable of picking up a semiconductor device by vacuum suction.

Preferably, a pair of second brackets 302 protruded from the side of the CCU block 300 are provided, and a second latch body 322 is positioned between the two second brackets 302 The upper portion of the second bracket 302 is positioned at the lower end of the second elastic body 325 so that the second latch portion 320 can be elastically supported upward with respect to the CCU block 300.

Next, the CCU block 300 and the blade module 400 may further include an engaging member that is engaged with the assembly surface so that the CCU block 300 and the blade module 400 can be assembled at a predetermined position.

In this embodiment, a groove 303 formed in the lower surface of the CCU block 300 as an engaging member and a conical protrusion 430 protruding from the upper surface of the blade module 400 and engaged with the groove 303 are shown as an example However, contrary to this, the CCU block may have protrusions and grooves may be formed in the blade module, and the number of these engaging members may be provided on the assembly surface.

In the present invention, the position of the first latch portion 310 and the second latch portion 320 is not particularly limited within a range where the first latch portion 310 and the second latch portion 320 are disposed at positions opposite to each other on the side surface of the CCU block 300, May be provided adjacent to the guide bushes 401 of the module 400.

As described above, the guide bush 401 guides the lowering position of the blade module 400 while being inserted into the guide protrusion to be provided in the socket. At this time, the guide bush 401 is moved along the position (horizontal direction) A reaction force may be generated between the blade module 400 and the guide protrusion so that a reaction force is generated in the process of assembling the blade module 400 and the socket by arranging the latch portion adjacent to the position of the guide bush 401, The blade module 300 and the blade module 400 can be firmly fixed. For example, in FIG. 12, guide bushes 401 are provided at two diagonal corners of the blade module 400, and the first and second latching parts 310 and 320 are also arranged in the same diagonal direction, 401). ≪ / RTI >

13 is a view showing an assembly example of a CCU block and a blade module in a handler device for testing semiconductor devices according to a third embodiment of the present invention.

The second latching protrusion 321 of the second latching portion 320 which can move up and down is fixed to the CCU block 300 and the second latching protrusion 420 of the blade module 400 is fixed to the second latching protrusion 321 of the blade module 400 The first latching protrusion 313 of the first latching portion 310 is caught and fixed to the first latching protrusion 311 so that the CCU block 300 and the blade module 400 are locked, The protrusions 430 protruding from the upper surface of the blade module 400 are inserted into the recesses 303 of the CCU block 300 so that the CCU block 300 and the blade module 400 can be assembled Assist.

14A and 14B are enlarged views of the first latch portion and the second latch portion in the assembled state of the CCU block and the blade module in the handler device for testing semiconductor devices according to the third embodiment of the present invention, 6A shows a first latch unit in a state in which a CCU block and a blade module are assembled, and FIG. 6B shows a second latch unit in a process of assembling the CCU block and the blade module.

The CCU block 300 and the blade module 400 are assembled such that the first latch portion 310 and the second latch portion 320 of the CCU block 300 are connected to the first latching jaws 410 of the blade module 400 The first elastic body 314 of the first latch part 310 is fixedly fixed to the CCU block and the blade module in the horizontal direction and the second latch part The CCU block and the blade module can be firmly fixed by closely fixing the CCU block and the blade module in the vertical direction.

Meanwhile, in the assembly process, the first elastic body 314 and the second elastic body 325 provided in the first latch portion 310 and the second latch portion 320 are compressed, and the compressed elastic body is compressed in the unlocking process, So that the first latch portion 310 and the second latch portion 320 can be returned to their original positions.

FIG. 15 is a view showing a state in which a CCU block and a blade module are assembled in a handler apparatus for testing a semiconductor device according to a third embodiment of the present invention. In this state, when the CCU block 300 and the blade module 400 are locked The lower end of the first latch portion 310 is opened and the first latch portion 310 and the blade module 310 are connected to each other by pushing the upper end of the first latch portion 310 resiliently supported by the first elastic body 314. [ The second latch portion 320 and the blade module 400 are released from the fixed state and the CCU block 300 and the blade module 400 are unlocked have.

Therefore, even if the equipment is changed in accordance with the size change of the test semiconductor device, the handler device of the present invention can be tested for a new semiconductor device by simply replacing only the blade module with the CCU module.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. It will be apparent to those of ordinary skill in the art.

20, 300: CCU block
100, 200, 400: Blade module
110, 210: a blade block
111, 211: recessed groove 112, 212: pick-up rod
120, 230: blades 121, 231: assembly body
122, 233: contact body 130: permanent magnet
140: Ball plunger 220: Clamp housing
221: Ring body 222: Guide projection
223: elastic body 224: fixing pin
232: guide groove portion 232a: inclined groove
232b: fixing groove 301: first bracket
302: second bracket 303: groove
310: first latch portion 311: hinge projection
312: first latch body 313: first latching protrusion
314: first elastic body 320: second latch portion
321: second latching protrusion 322: second latch body
322a: guide groove 323: fastening bolt
324: head 325: second elastic body
410: first jaw 420: second jaw
430: projection

Claims (16)

A handler device comprising a blade module adapted to pressurize or adsorb and fix a test semiconductor device,
The blade module includes:
A blade block having a recess formed at a center thereof and having a pick-up rod capable of being picked up by vacuum suction of the semiconductor device at the center of the recess;
Wherein the pick-up rod is penetrated and assembled in the recessed portion of the blade block to come into contact with the upper surface of the semiconductor device,
Wherein the permanent magnet is provided in the recessed portion of the blade block and fixed by the magnetic force with the blade. The handler apparatus for testing a semiconductor device according to claim 1, wherein the permanent magnet is a samarium cobalt (SmCo) series. The handler apparatus for testing semiconductor devices according to claim 1, further comprising a ball plunger elastically supported on a side wall of the recess. 4. The handler apparatus for testing semiconductor devices according to claim 3, wherein the ball corresponding to the ball plunger is formed with a coupling groove capable of inserting and fixing the ball plunger. The blade according to claim 1,
An assembly body inserted into the recessed portion of the blade block;
And a contact body formed integrally with the assembly body, wherein the contact body is in contact with the upper surface of the semiconductor device. A handler device comprising a blade module adapted to pressurize or adsorb and fix a test semiconductor device,
The blade module includes:
A blade block having a cylindrical recess formed at the center thereof and having a guide protrusion formed on a side wall of the recess and having a pickup rod capable of picking up the semiconductor device by vacuum suction at the center of the recess;
And a guide groove formed in the guide groove for receiving the guide protrusion. The guide groove is formed in the guide groove so that the blade block and the locking / A handler apparatus for testing a semiconductor device, comprising a blade for locking. A handler device comprising a blade module adapted to pressurize or adsorb and fix a test semiconductor device,
The blade module includes:
A blade block having a cylindrical recessed portion formed at the center thereof and having a pick-up rod capable of being picked up by vacuum suction of the semiconductor device at the center of the recessed portion;
An annular body which is elastically supported and vertically inserted into the recessed portion so as to be movable, the clamp housing having a guide protrusion protruding from an inner side wall of the annular body;
And a guide groove formed on the upper surface of the semiconductor device so as to be in contact with the upper surface of the semiconductor device. The guide groove is engaged with the guide protrusion, and the guide protrusion is moved along the guide groove And a blade guided and locked / unlocked with the clamp housing. 8. The handler apparatus for testing a semiconductor device according to claim 7, wherein the blade block and the clamp housing have an elastic body for elastically supporting the clamp housing, and the end of the fixing pin is screwed to the blade block. The blade according to claim 6 or 7,
A cylindrical assembly body inserted into the recessed portion of the blade block and having the guide groove;
And a contact body formed integrally with the assembly body, wherein the contact body is in contact with the upper surface of the semiconductor device. 8. The apparatus according to claim 6 or 7,
And a fixing groove formed on the plane orthogonal to the rotation axis of the blade so as to extend from the inclined groove. The handler according to claim 1, wherein the inclined groove is formed in a spiral shape along an outer circumferential surface of the blade. 8. The handler apparatus according to claim 6 or 7, further comprising an engaging member which is engaged with the contact surfaces so that the blade block and the blade can be assembled at a predetermined position. A handler apparatus for testing semiconductor devices, comprising: a plurality of CCU blocks pivotally mounted on a lower portion of a CCU plate; and a blade module assembled with each CCU block to press or attract the test semiconductor device,
A pair of first and second latch portions provided on a side surface of the CCU block;
And a pair of first and second latching jaws formed on the blade module so as to be capable of being engaged with the first and second latching portions, respectively,
Wherein the first latch portion includes a first latching protrusion that is elastically hinged to the side surface of the CCU block and can be fixed to the first latching jaw,
Wherein the second latch portion includes a second latching protrusion that is vertically movable on a side surface of the CCU block and is elastically supported upward to be fixed to the second latching jaw. 13. The CCU of claim 12, further comprising a pair of first brackets protruding from the side of the CCU block, the first brackets being rotatably assembled between the first brackets,
A pair of second brackets protruding from the side surface of the CCU block are formed and the second latch portion is inserted between the second brackets and is vertically movable by the fastening bolts, And is urged upward by an elastically supported elastic body. 14. The handler apparatus according to claim 12 or 13, wherein the first latch portion and the second latch portion are provided in a side diagonal direction of a CCU block having a hexahedral shape as a whole. 13. The handler apparatus for testing a semiconductor device according to claim 12, wherein the CCU block and the blade module further include an engaging member engaged with an assembling surface so as to be assembled in a predetermined position. 16. The handler device for testing semiconductor devices according to claim 15, wherein the engaging member is a conical protrusion and a groove into which the protrusion is inserted.

Images