KR102112776B1 - Semiconductor manufacturing apparatus and method for manufacturing semiconductor device - Google Patents

Abstract

Disclosed is a semiconductor manufacturing apparatus having a collet exchange unit capable of attaching and removing a plurality of collet of an external size. The semiconductor manufacturing apparatus includes a collet holder for holding a collet with a magnet, a collet holder at the tip, a head for picking up a die by adsorbing the die with the collet, a collet exchanger for exchanging the collet, the head and It has a control device for controlling the collet exchange. The collet exchange part includes a collet clamp part having an opening / closing arm having a hook structure and an opening / closing arm control device for controlling the opening / closing arm. The collet holder is provided with a relief portion of the hook of the opening and closing arm. The control device opens and closes the opening / closing arm to raise and lower the head, thereby attaching the collet to the collet holder and removing the collet from the collet holder.

Description

A semiconductor manufacturing apparatus and a manufacturing method of a semiconductor device {SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE}

The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable to, for example, a die bonder in which a magnet is embedded in a collet holder.

In a part of the process of assembling a package by mounting a semiconductor chip (hereinafter simply referred to as a 'die') on a wiring board or a lead frame (hereinafter simply referred to as a 'substrate') in a part of the manufacturing process of a semiconductor device, a semiconductor wafer There is a process of dividing a die from (hereinafter simply referred to as a 'wafer') and a bonding process in which the divided die is mounted on a substrate. A semiconductor manufacturing apparatus used in the bonding process is a die bonding apparatus such as a die bonder.

In the bonding process, dies divided from wafers are peeled one by one from the dicing tape and bonded onto a substrate using an adsorptive jig called collet.

In such a die bonder, it is necessary to increase the frequency of exchange of collets contacting the surface of the die in order to exchange collets depending on the type (die size) or to prevent surface scratches and contamination of the die (for example, Japanese Patent Publication No. 2014-56978 (Patent Document 1)).

Japanese Patent Publication No. 2014-56978

In patent document 1, the magnet holder-type collet is removed and attached by rotating the collet holder using the hook of the collet exchanger configured to the collet size. However, the magnet-fixed collet has a plurality of external sizes, and cannot be removed and attached in the same structure.

An object of the present disclosure is to provide a semiconductor manufacturing apparatus having a collet exchange unit capable of attaching and removing a plurality of collet sizes.

Other problems and novel features will be revealed from the description of the present specification and the accompanying drawings.

Brief description of the representative ones of the present disclosure is as follows.

That is, the semiconductor manufacturing apparatus includes a collet holder for holding a collet with a magnet, a collet holder at the tip, a head for adsorbing and picking up dies with the collet, and a collet exchanger for exchanging the collets. It has a head and a control device for controlling the collet exchange. The collet exchange part includes a collet clamp part having an opening / closing arm having a hook structure and an opening / closing arm control device for controlling the opening / closing arm. The collet holder is provided with a relief portion of the hook of the opening and closing arm. The control device opens and closes the opening / closing arm to raise and lower the head, thereby attaching the collet to the collet holder and removing the collet from the collet holder.

According to the above-mentioned semiconductor manufacturing apparatus, it is possible to attach and remove a plurality of collet of outer size.

1 is a view for explaining a configuration example of a die bonder.
2 is a diagram for explaining the configuration of the die bonder in FIG. 1.
3 is a view for explaining the configuration of the die supply unit in FIG. 1.
4 is a diagram for explaining a main part of the die supply part of FIG. 3.
5 is a view for explaining the structure of a collet holder used in the die bonder of FIG. 1;
6 is a view for explaining the structure of the collet holder of FIG. 5;
7 is a view for explaining the structure of a collet exchange unit provided in the die bonder of FIG. 1.
8 is a view for explaining the structure of the collet exchanger in FIG. 7;
Fig. 9 is a diagram for explaining a collet exchange method in the die bonder of Fig. 1;
Fig. 10 is a diagram for explaining a collet exchange method in the die bonder of Fig. 1;
Fig. 11 is a diagram for explaining a collet exchange method in the die bonder of Fig. 1;
12 is a diagram for explaining a collet exchange method in the die bonder of FIG. 1.
Fig. 13 is a diagram for explaining a method for replacing a collet holder in the die bonder of Fig. 1;
14 is a flowchart showing a method of manufacturing a semiconductor device using the die bonder of FIG. 1.

Hereinafter, examples will be described with reference to the drawings. However, in the following description, the same components may be given the same reference numerals and repeated descriptions may be omitted. In addition, in order to make the description more clear, there are cases where the width, thickness, shape, etc. of each part are schematically expressed in comparison with the actual form, but the interpretation of the present invention is not limited by way of example only. .

<Example>

1 is a top view showing a configuration example of a die bonder. FIG. 2 is a view showing the configuration when viewed from the direction of arrow A in FIG. 1.

The die bonder 10 is largely distinguished, and a die supply unit for supplying a die D mounted on a substrate S on which a product area (hereinafter referred to as a 'package area P') consisting of one or several final 1 packages is printed ( 1), the pickup section 2, the intermediate stage section 3, the bonding section 4, the transfer section 5, the substrate supply section 6, the substrate transport section 7, and the operation of each section It has a control device 8 for monitoring and controlling. The Y-axis direction is the front-rear direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply part 1 is disposed in front of the die bonder 10, and the bonding part 4 is disposed inside.

First, the die supply unit 1 supplies the die D mounted on the package area P of the substrate S. The die supply unit 1 has a wafer holder 12 for holding the wafer 11 and a pushing unit 13 indicated by a dotted line pushing up the die D from the wafer 11. The die supply unit 1 moves in the XY direction by a driving means (not shown), and moves the picked up die D to the position of the pushing unit 13.

The pick-up section 2 lifts, rotates and rotates the pick-up head 21 for picking up the die D, the Y drive section 23 of the pick-up head for moving the pick-up head 21 in the Y direction, and the collet 22. It has each driving unit (not shown) that moves in the direction. The pick-up head 21 has a collet 22 (see FIG. 2) for adsorbing and holding the pushed-up die D at the tip, picking up the die D from the die supply section 1, and feeding it to the intermediate stage 31. Load. The pickup head 21 has respective driving parts (not shown) for moving the collet 22 up and down, rotating, and moving in the X direction.

The intermediate stage part 3 has an intermediate stage 31 for temporarily loading the die D, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

The bonding portion 4 is in the form of picking up the die D from the intermediate stage 31 and bonding it on the package area P of the substrate S to be conveyed, or stacking it on the die already bonded on the package area P of the substrate S. Bond. The bonding part 4, like the pickup head 21, Y the bonding head 41 provided with the collet 42 (refer FIG. 2) which adsorb | sucks and holds the die D at the front end, and the bonding head 41 Y It has a Y driver 43 moving in the direction, and a substrate recognition camera 44 that captures a position recognition mark (not shown) in the package area P of the substrate S and recognizes the bonding position.

With such a configuration, the bonding head 41 corrects the pickup position and posture based on the imaging data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and board recognition camera 44 ), Die D is bonded to the package area P of the substrate S based on the imaging data.

The conveying section 5 has a substrate conveying claw 51 for gripping and conveying the substrate S, and a conveying lane 52 to which the substrate S moves. The board | substrate S moves by driving the nut of the board | substrate conveyance hook 51 provided in the conveyance lane 52 with the ball screw (not shown) provided along the conveyance lane 52. With such a configuration, the substrate S moves from the substrate supply section 6 to the bonding position along the conveyance lane 52, and after bonding, moves to the substrate transport section 7 to transfer the substrate to the substrate transport section 7 Pass S.

The control device 8 includes a memory for storing a program (software) for monitoring and controlling the operation of each part of the die bonder 10, and a central processing unit (CPU) for executing a program stored in the memory.

Next, the configuration of the die supply unit 1 will be described with reference to FIGS. 3 and 4. 3 is a view showing an external perspective view of the die supply unit of FIG. 1. 4 is a schematic cross-sectional view showing a main part of the die supply part of FIG. 3.

The die supply unit 1 includes a wafer holder 12 that moves in the horizontal direction (XY direction) and a pushing unit 13 that moves in the vertical direction. The wafer holder 12 horizontally expands the expanding ring 15 holding the wafer ring 14 and the dicing tape 16 held by the wafer ring 14 and adhered to several dies D. It has a support ring (17) for positioning. The pushing unit 13 is disposed inside the support ring 17.

When the die D is pushed up, the die supply unit 1 lowers the expand ring 15 holding the wafer ring 14. As a result, the dicing tape 16 held on the wafer ring 14 is stretched all the way, and the gap between the dies D is widened, and the die D is pushed up from the bottom of the die D by the pushing unit 13, thereby The pickup property of D is improved. Moreover, the adhesive which bonds a die to a board | substrate with thinning becomes a film form from a liquid phase, and is a film shape called die attach film (DAF) 18 between the wafer 11 and the dicing tape 16. Adhesive material. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling step, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16.

The pick-up head 21 has an adsorption hole 21a through which adsorption air flows to the center, and a collet shank 21b connected to the collet holder 25 on the distal end side, and a collet holder 25 to the collet shank 21b. It is provided with a collet fixing portion (21c) fixed to. The bonding head 41 is the same as the pickup head 21.

Next, the collet holder will be described with reference to Figs. 5 and 6 are views for explaining the collet holder used in the die bonder of FIG. 1, FIG. 5 is a cross-sectional view of the pickup head, the collet holder and the collet, and FIG. 6 is a top view of the collet holder.

The collet holder 25 is provided with an adsorption hole 25a communicating with the adsorption hole 21a of the pickup head 21 at the center, and a magnet 25b fixing the collet 22. The collet holder 25 has a cutout (hook relief) 251c near each center of the four sides, so that the collet exchange jig can grip the collet. The opening of the collet holder 25 has a wider tapered shape so that the collet 22 can be attached by sucking the collet 22 by the magnet 25b.

The collet 22 is welded to stainless steel (SUS (magnetic)) 22b on the back surface of an elastic body 22a such as silicone rubber so that it can be fixed with a magnet, and holds the four sides in the collet holder 25, In order to adsorb the die D, a plurality of adsorption holes (not shown) communicating with the adsorption holes 251a are provided. The surface of the elastic body 22a has a holding portion 22c that holds and holds the die D. The holding portion 22c is formed integrally with the elastic body 22a, and is the same size as the die D.

The pickup head 21 has been described, but the bonding head 41 is the same.

Next, the collet exchange section will be described with reference to Figs. 7 is a top view of the collet exchanger provided in the die bonder of FIG. 1. 8 is a cross-sectional view taken along line A1-A2 in FIG. 7.

The collet exchange section 90 includes a collet clamp section 91 having a collet side clamp and an arm opening section 91a having a hook structure on the top and an arm control section 91b controlling opening and closing of the opening arm 91a, It has a supply part 92 for supplying unused collets, and a waste part 93 for discarding used collets. The opening / closing arm 91a can be opened to match the maximum width of the collet. As shown in Fig. 8, the opening and closing arms 91a can clamp the collet side surfaces when closed, and in the fixed state, the hooks 91aa are arranged at two places on the left and right of the upper part. The supply section 92 and the waste section 93 are provided with openings 92k and 93k on the upper side. The supply section 92 and the waste section 93 are disposed at a place where there is no influence on the pick-up operation or the bonding operation, and the pick-up head 21 and the bonding head 41 are preferably outside the operable range. The collet clamp part 91, the supply part 92, and the waste part 93 are disposed on a straight line in the horizontal direction, and the collet clamp part 91 moves in the horizontal direction. In addition, the collet clamp portion 91 may be movable in the horizontal direction (X direction, Y direction) and the vertical direction.

Next, in the collet exchanger 90, a method of attaching and removing the collet 22 to the collet holder 25 will be described with reference to Figs. 9 is a view showing a state in which the collet is gripped by the opening / closing arm and spaced apart from the collet holder, FIG. 9 (A) is a top view, FIG. 9 (B) is a sectional view, and FIG. 9 (C) is Side view. 10 is a view showing a state in which the collet is gripped by the opening and closing arm and fixed to the collet holder, FIG. 10 (A) is a top view, FIG. 10 (B) is a sectional view, and FIG. 10 (C) is Side view. FIG. 11 is a view showing a state in which the collet is fixed to the collet holder and the opening and closing arms are spaced apart, FIG. 11 (A) is a top view, FIG. 11 (B) is a cross-sectional view, and FIG. 11 (C) is Side view.

First, a method of attaching the collet 22 to the collet holder 25 will be described. The control device 8 moves the collet clamp part 91 upwards of the supply part 92. The control device 8 raises the collet 22 in the supply section 92 until it contacts the hook of the opening / closing arm 91a. The control device 8 clamps the raised collet 22 by the opening / closing arm 91a. 9, the control apparatus 8 conveys the collet clamp part 91 which clamped the collet 22 to the exchange position (above the intermediate stage 31). The control device 8 positions the collet appearance by the stage recognition camera 32. Variety determination may be performed using a barcode or the like.

As shown in Fig. 10, the control device 8 attaches the collet 22 by lowering the collet holder 25 in the absence of the collet. The precision (posture) of the collet clamp state is not strictly enforced, and the collet holder 25 is pulled by the magnetic force of the magnet 251b by approaching the collet holder 25, so that the collet 22 itself is a collet holder 25 ). As described above, the collet holder 25 has hook reliefs 251C on the top, bottom, left, and right. As shown in Fig. 11, the control device 8 opens the opening / closing arm 91a, and moves the collet clamp portion 91 to a predetermined position.

Next, a method of removing the collet 22 from the collet holder 25 will be described. As shown in FIG. 11, the control device 8 moves the collet clamp part 91 to the removal position in the state which opened and closed the arm 91a. As shown in Fig. 10, the control device 8 clamps the collet 22 by the opening / closing arm 91a. As shown in Fig. 9, the control device 8 raises the collet holder 25 in a state where the opening / closing arm 91a clamps the collet 22, thereby removing the collet 22 from the collet holder 25. do. The control device 8 transfers the collet 22 clamped (removed) by the opening / closing arm 91a to the upper portion of the discarding portion 93, opening the opening / closing arm 91a to drop the collet 22, thereby disposing the discarding portion (93).

Although the collet exchange of the pickup head 21 has been described, the collet exchange of the bonding head 41 is also the same.

As shown in Fig. 7, the longitudinal collet (vertical long collet holder) has been described, but as shown in Fig. 11, it can also be applied to a transverse collet (horizontal collet holder).

Next, a method of replacing the collet holder will be described with reference to FIG. 13. 13 is a view showing a state in which the collet holder is gripped by the opening / closing arm, FIG. 13 (A) is a top view, FIG. 13 (B) is a sectional view, and FIG. 13 (C) is a side view.

When changing varieties, replace the collet holder. Like the collet 22, the collet holder is removed by clamping it with the opening / closing arm 91a of the collet clamp portion 91, and then attached. A magnet is provided on the lower part of the collet shank 21b or the upper part of the collet holder 25, and the collet holder is also fixed by a magnet, so that it has a stronger fixing force than the collet.

In the case where the intermediate stage is formed of a collet (a collet-type intermediate stage), the collet can be removed by clamping it with the opening / closing arm 91a of the collet clamp portion 91 as well as the collet 22.

In the embodiment, since the collet is clamped and the collet is exchanged by an opening / closing arm having a hook structure on the top, it can be applied to various sizes (change of product type (collet appearance)) without replacing parts, so that attachment and removal are possible. I can do it. Thereby, it is possible to reduce the manpower and improve the operation rate.

In addition, by moving the collet clamp portion 91 above the intermediate stage, the entire collet, collet holder, and collet-type intermediate stage can be exchanged (removed and attached) in one collet clamp portion. Further, by moving the collet clamp portion 91 above the intermediate stage, both the collet of the bonding head and the collet of the pickup head can be exchanged. That is, for each of the three uses of the collet (bonding head, pickup head, intermediate stage), the collet of the number corresponding to each breed can be exchanged in one collet clamp part. In addition, the state of the collet can be checked with the stage recognition camera above the intermediate stage.

Next, a method for manufacturing a semiconductor device using a die bonder according to an embodiment will be described with reference to FIG. 14. 14 is a flowchart showing a method of manufacturing a semiconductor device.

Step S11: The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is adhered is stored in a wafer cassette (not shown), and carried into the die bonder 10. The control device 8 supplies the wafer ring 14 to the die supply unit 1 from the wafer cassette filled with the wafer ring 14. Further, the substrate S is prepared and carried into the die bonder 10. The control device 8 loads the substrate S on the conveyance lane 52 in the substrate supply part 6.

Step S12: The control device 8 picks up the die D from the dicing tape 16 held by the wafer ring 14.

Step S13: The control device 8 places the picked-up die D on the package area P of the substrate S, or stacks it on the die already bonded. More specifically, the control device 8 loads the die D picked up from the dicing tape 16 onto the intermediate stage 31, picks up the die D again from the intermediate stage 31 with the bonding head 41, and , Bonding to the package area P of the conveyed board | substrate S.

Step S14: The control device 8 moves the substrate S to the substrate carrying portion 7 with the substrate carrying claw 51 to transfer the substrate S to the substrate carrying portion 7 and carries the substrate S out of the die bonder 10 (Substrate unloading).

In the above, although the invention made by the present inventors has been specifically described based on Examples, the present invention is not limited to the above Examples, and of course various changes are possible.

For example, in the embodiment, the collet clamp portion 91, the supply portion 92, and the waste portion 93 are disposed on a straight line in the horizontal direction, and the collet clamp portion 91 moves in the horizontal direction, but the collet clamp The portion 91, the supply portion 92, and the waste portion 93 are disposed on a straight line in the vertical direction, and the collet clamp portion 91 may be moved in the vertical direction. In addition, the arrangement of the supply part 92 and the waste part 93 may be reversed.

In addition, a die bonder having a plurality of mounting portions and a transport lane including a pickup portion, an alignment portion and a bonding portion may be used, or a plurality of mounting portions including a pickup portion, an alignment portion and a bonding portion may be provided, and even one transport lane may be provided. do.

In addition, although the example using the die attach film was described in the Examples, it is not necessary to use the die attach film by providing a preform portion for applying an adhesive to the substrate.

Further, in the embodiment, the die bonder for picking up the die from the die supplying section with the pick-up head and loading the die on the intermediate stage and bonding the die loaded on the intermediate stage to the substrate with the bonding head is not limited to this. It is applicable to a semiconductor manufacturing apparatus for picking up a die from a die supply section.

For example, there is no intermediate stage and a pickup head, and it is applicable also to a die bonder that bonds the die of the die supply section to the substrate with a bonding head.

In addition, there is no intermediate stage, and it is applicable to a flip chip bonder that picks up a die from the die supplying part, rotates the die pickup head upwards to transfer the die to the bonding head, and bonds the substrate with the bonding head.

Further, there is no intermediate stage and a bonding head, and it is applicable to a die sorter for loading a die picked up from a die supply section to a pickup head on a tray or the like.

10: die bonder
1: die supply
2: pickup section
21: pickup head
22: Collet
25: collet holder
3: Middle stage section
31: intermediate stage
4: bonding
41: bonding head
42: Collet
5: conveying unit
51: substrate transfer hook
8: Control device
9: Collet exchange
91: collet clamp part
91a: opening and closing arm
91b: opening and closing arm control
92: supply
93: waste parts
D: die
S: Substrate
P: Package area

Claims (17)

Collet holder for holding the collet with a magnet,
A head having a corresponding collet holder at the tip, and picking up the die by adsorbing the die with the collet;
A collet exchange unit for exchanging the collets,
Control device for controlling the head and the collet exchange
Equipped with,
The collet exchange part includes a collet clamp part having an opening / closing arm having a hook structure and an opening / closing arm control device for controlling the opening / closing arm,
The collet holder is provided with a hook relief portion of the opening and closing arm,
When the opening and closing arms are closed, the side of the collet is clamped, and the hook structure is an upper part of the collet in a fixed state, and is disposed in two places on the left and right sides of the relief part,
The control device moves the collet clamp portion to an exchange position, opens and closes the opening arm, and moves the head up and down, so that the collet is attached to the collet holder, and the collet is removed from the collet holder. A semiconductor manufacturing apparatus constructed. According to claim 1,
The collet exchange unit,
And a supply unit for supplying the collet attached to the collet holder,
Discarding portion for discarding the collet removed from the collet holder
Further comprising, a semiconductor manufacturing apparatus. According to claim 2,
The control device,
The collet supplied from the supply part is clamped with the opening / closing arm,
The collet clamped with the opening / closing arm is moved downward of the collet holder,
And lowering the collet holder to attach the collet clamped to the opening / closing arm to the collet holder. According to claim 3,
The control device is configured to access the collet holder to the collet clamped to the opening / closing arm, so that the collet clamped to the opening / closing arm sucks the collet by the magnetic force of the magnet, is positioned within the collet holder, and is attached, Semiconductor manufacturing equipment. The method of claim 4,
The control device,
The collet fixed to the collet holder is clamped by the opening / closing arm,
By raising the collet holder, the collet fixed to the collet holder is removed from the collet holder,
The collet clamped by the opening / closing arm moves upwards of the waste portion,
A semiconductor manufacturing apparatus configured to open the opening / closing arm and discard the collet in the waste portion. According to claim 1,
The control device moves the collet clamp part to an exchange position, opens and closes the opening and closing arms, and moves the head up and down, so that the collet holder is attached to the head, and the collet holder is removed from the head. A semiconductor manufacturing apparatus constructed. The method of claim 6,
The control device,
The collet holder is clamped with the opening / closing arm,
The collet holder clamped by the opening / closing arm is moved downward of the head,
And a collet holder clamped to the opening / closing arm by lowering the head to be attached to the head. The method of claim 7,
The head has a magnet for attracting the collet holder magnetically, a semiconductor manufacturing apparatus. The method of claim 8,
The control device,
The collet holder fixed to the head is clamped by the opening / closing arm,
And lifting the head to remove the collet holder fixed to the head from the head. According to claim 1,
Further comprising a die supply portion having a wafer ring for holding a dicing tape to which the die is adhered,
The head is a pickup head for picking up a die adhered to the dicing tape, a semiconductor manufacturing apparatus. The method of claim 10,
An intermediate stage on which the die picked up by the pickup head is loaded,
A bonding head that bonds the die picked up from the intermediate stage onto a substrate or an already bonded die
Further comprising,
The bonding head is provided with the collet holder, a semiconductor manufacturing apparatus. The method of claim 11,
And the control device is configured to move the collet clamp part upward of the intermediate stage, which is the exchange position, and exchange the collet of the pickup head and the collet of the bonding head. The method of claim 12,
The intermediate stage is a collet-type stage,
The control device is configured to open and close the opening arm, move the intermediate stage up and down, attach a collet to the intermediate stage, and remove the collet from the intermediate stage. According to claim 1,
Further comprising a die supply portion having a wafer ring for holding a dicing tape to which the die is adhered,
The head is a bonding head for picking up a die adhered to the dicing tape and bonding it onto a substrate or an already bonded die. (a) a process for preparing the semiconductor manufacturing apparatus according to any one of items 1 to 12,
(b) carrying a wafer ring carrying a dicing tape to which the die is adhered;
(c) a process of preparing and bringing in a substrate,
(d) the process of picking up the die,
(e) a process of bonding the picked up die onto the substrate or an already bonded die.
A method of manufacturing a semiconductor device comprising: The method of claim 15,
In the step (d), a die adhered to the dicing tape is picked up by a bonding head,
The step (e) is a method of manufacturing a semiconductor device, wherein the die picked up by the bonding head is bonded onto the substrate or an already bonded die. The method of claim 16,
The step (d) is,
(d1) a process of picking up a die adhered to the dicing tape with a pickup head,
(d2) A process of loading the die picked up by the pickup head onto an intermediate stage
Have
The step (e) is,
(e1) a process of picking up the die mounted on the intermediate stage with a bonding head,
(e2) Process of loading the die picked up by the bonding head onto the substrate
A method of manufacturing a semiconductor device comprising:

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