TW202025334A - Semiconductor manufacturing apparatus push-up jig and method for manufacturing semiconductor device - Google Patents

Abstract

Provided is a semiconductor manufacturing apparatus capable of operating a push-up jig with simple composition. The semiconductor manufacturing apparatus includes a push-up unit pushing a die up from the bottom of dicing tape. The push-up unit includes: a block part moved up and down, and including a main block located in the center thereof and a plurality of blocks located outside the main block; a bottom base moving the block part up and down based on the vertical movement of a push-up shaft; and a tool converting the vertical movement of the bottom base into the vertical movement of the outermost one of the plurality of blocks. As the push-up shaft is pushed upwards, the bottom base, the main block and the plurality of blocks are pushed up and then, as the push-up shaft is pushed up further, the bottom base is pushed up to enable the tool to pull the outermost block down.

Description

Semiconductor manufacturing device, ejector jig and manufacturing method of semiconductor device

The present disclosure relates to semiconductor manufacturing equipment, and can be applied to, for example, semiconductor manufacturing equipment provided with ejector units.

In a die bonder that mounts a semiconductor wafer called a die on the surface of, for example, a wiring board or a lead frame (hereinafter, collectively referred to as a substrate), the following actions (work) are repeated: A collet or the like sucks nozzles, transfers the die to the substrate, applies a pressing force and heats the bonding material, thereby performing bonding.

Among the die bonding processes performed by semiconductor manufacturing equipment such as die bonders, there is a peeling process for peeling the divided die from a semiconductor wafer (hereinafter referred to as a wafer). In the peeling process, the die is ejected from the back of the dicing tape by ejector pins or blocks, and the dicing tape is peeled one by one from the dicing tape held in the die supply part, and the collet is used for adsorption The nozzle is transported to the substrate.

As a method of picking up the die from the dicing tape, for example, the following method is proposed: in a state where the dicing sheet is adsorbed to a disc-shaped ejector cap and the semiconductor die is adsorbed to the collet, the tube After the clamps and the surrounding, middle, and central ejector blocks rise to a predetermined height higher than the surface of the ejector top cover, the height of the collet is maintained at this height, and the ejector blocks around the The sequence of ejecting the block is such that the ejecting block is lowered to a position below the surface of the ejecting top cover, thereby peeling the dicing sheet from the semiconductor die (for example, the prior art of Patent Document 1). [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Publication No. 2015-179813

[Problem to be solved by the present invention]

The subject of the present disclosure is to provide a semiconductor manufacturing device that can implement an ejection jig with a simple configuration, and the ejection jig implements the picking method described in the prior art. Other topics and novel features are clearly known from the description of this manual and the attached drawings. [Means to solve the problem]

The outline of the representative ones in this disclosure is briefly described as follows. That is, the semiconductor manufacturing apparatus is provided with: a wafer holding table for holding a dicing tape with die; and an ejection unit for ejecting the die from below the dicing tape. The aforementioned ejection unit is provided with: a cylindrical dome; a block part with a columnar main block located in the center and a plurality of ring-shaped blocks located on the outer side of the main block, and moves up and down The bottom base, based on the up and down movement of the ejector shaft, makes the block part move up and down; and a mechanism that transforms the up and down movement of the bottom base into the up and down movement of the outermost block of the plurality of blocks. It is constructed in the following manner: by pushing up the ejection shaft, the bottom base, the central block and the plurality of blocks are pushed up, and the ejection shaft is further pushed up. By pushing, the bottom base is stacked, and the outermost block is pulled down by the mechanism. [Effects of Invention]

According to the above semiconductor manufacturing apparatus, the structure of the ejector jig becomes simple.

Hereinafter, the embodiment will be described with reference to the drawings. However, in the following description, the same reference numerals are attached to the same components, and repeated descriptions are omitted. In addition, the drawings are shown schematically for the width, thickness, shape, etc. of each part compared with the actual form in order to make the description clearer, but they are always an example and do not limit the interpretation of the present invention.

Fig. 1 is a top view schematically showing the die bonder of the embodiment. Fig. 2 is a diagram illustrating the actions of the pickup head and the bonding head when viewed from the direction of arrow A in Fig. 1.

The die bonder 10 generally has: a die supply part 1 which supplies die D mounted on a substrate S, and the substrate S is printed with one or more product areas (hereinafter referred to as the final package) It is the packaging area P.); the pickup part 2, the intermediate platform part 3; the joining part 4; the conveying part 5, the substrate supply part 6; the substrate conveying part 7; and the control part 8, which monitors and controls the actions of each part. The Y-axis direction is the front-rear direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply part 1 is arranged on the front side of the die bonder 10, and the bonding part 4 is arranged on the rear side.

First, the die supply unit 1 supplies the die D mounted on the package area P of the substrate S. The die supply unit 1 has: a wafer holding table 12 holding the wafer 11; and an ejection unit 13 that ejects the die D from the wafer 11 as shown by dotted lines. The die supply unit 1 is moved along the XY axis direction by a driving device not shown, and the picked die D is moved to the position of the ejection unit 13.

The pick-up unit 2 has: a pick-up head 21 to pick up the die D; a Y-drive part 23 of the pick-up head to move the pick-up head 21 along the Y-axis direction; and various drive parts not shown to lift and rotate the collet 22 And move along the X axis. The pickup head 21 has a collet 22 (see also FIG. 2), and picks up the die D from the die supply part 1 and places it on the intermediate platform 31. The collet 22 absorbs the ejected die D Keep it at the front end. The pick-up head 21 is equipped with each drive part not shown in figure, and raises and lowers, rotates, and moves the collet 22 along the X-axis direction.

The intermediate platform portion 3 has: an intermediate platform 31 for temporarily placing the die D; and a platform identification camera 32 for identifying the die D on the intermediate platform 31.

The bonding part 4 picks up the die D from the intermediate platform 31 and joins it on the package area P of the substrate S being transported, or is laminated on the die that has been bonded to the package area P of the substrate S Form to join. The bonding part 4 has: a bonding head 41, which is provided with a collet 42 (see also FIG. 2) for sucking and holding the die D at the front end in the same manner as the picking head 21; and a Y driving part 43 that makes the bonding head 41 along the Y axis Direction movement; and the substrate recognition camera 44, which photographs the position recognition mark (not shown) of the package area P of the substrate S, and recognizes the bonding position. With such a configuration, the bonding head 41 recognizes the imaging data of the camera 32 based on the platform, corrects the pickup position and posture, and picks up the die D from the intermediate platform 31, and recognizes the die D from the imaging data of the camera 44 based on the substrate. Bonded to the substrate.

The conveying unit 5 has: a substrate conveying claw 51 that grips and conveys the substrate S; and a conveyance path 52 that moves the substrate S. The substrate S is moved by "a ball screw (not shown) provided along the transport path 52 drives a nut (not shown) of the substrate transport pawl 51 provided on the transport path 52)". With such a configuration, the substrate S is moved from the substrate supply section 6 to the bonding position along the conveyance path 52, and after bonding, it moves to the substrate unloading section 7 and transfers the substrate S to the substrate unloading section 7.

The control unit 8 is equipped with: a memory, which stores a program (software), which monitors and controls the actions of each part of the die bonder 10; and a central processing unit (CPU), whose execution is stored in the memory Program.

Next, the structure of the crystal grain supply unit 1 will be described using FIGS. 3 and 4. Fig. 3 is a diagram showing an external perspective view of the die supply part of Fig. 1. Fig. 4 is a schematic cross-sectional view showing the main part of the crystal grain supply part of Fig. 1.

The die supply unit 1 is provided with: a wafer holding table 12 that moves in the horizontal direction (XY axis direction); and an ejection unit 13 that moves in the vertical direction. The wafer holding table 12 has an expansion ring 15 to hold the wafer ring 14 and a support ring 17 which is held on the wafer ring 14 and horizontally positions the dicing tape 16 with a plurality of die D attached thereto. The ejection unit 13 is arranged inside the support ring 17.

The die supply unit 1 lowers the expansion ring 15 holding the wafer ring 14 when the die D is ejected. As a result, the dicing tape 16 held in the wafer ring 14 is elongated, and the interval of the die D is enlarged. The push-up unit 13 pushes the die D up from below the die D, so that the pick-up of the die D is improved. . In addition, the adhesive for attaching the die to the substrate is changed from a liquid state to a film, and a film-like adhesive called a die attach film (DAF) 18 is attached to between the wafer 11 and the dicing tape 16. between. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling process, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16. In addition, in the following, the peeling process is described regardless of the existence of the die attach film 18.

Next, the structure of the ejector jig will be explained using FIGS. 5 and 6. Figure 5 is a top view of the ejector jig shown in Figure 4. Fig. 6 is a cross-sectional view of A-A of the ejector fixture of Fig. 5.

The ejection unit 13 generally has an ejection jig 101 and a driving mechanism not shown in the figure. As shown in Figure 5, the ejection jig 101 has a main block 102, blocks 102a~102c, and a main drive block. The drive part of the body 102 and the blocks 102a to 102c, the cylindrical dome 104 that holds these, and the dome plate 104a that covers the dome 104.

The dome plate 104a has an opening that allows the main block 102 and the blocks 102a to 102c to move up and down. At its periphery, a plurality of suction ports (not shown) and a plurality of grooves (not shown) are provided . When the inside of the suction port and the groove are raised and the top surface of the ejector tool 101 is brought into contact with the back of the cutting tape 16, the pressure is reduced by a suction mechanism not shown, so that the back of the cutting tape 16 It is closely attached to the upper surface of the dome plate 104a.

At the center of the ejector jig 101A, four blocks 102, 102a to 102c are assembled to eject the cutting tape 16 upward. The four blocks 102, 102a~102c are arranged on the inner side of the outermost ring-shaped block 102a with a ring-shaped block 102b, and on the inner side there is a ring-shaped block 102c, and further A columnar main block 102 is arranged inside.

A gap G is provided between the periphery of the dome plate 104a and the outer block 102a and between the four blocks 102, 102a to 102c. The inside of these gaps G is decompressed by a suction mechanism not shown. When the back of the cutting tape 16 contacts the upper surface of the ejection jig 101, the cutting tape 16 is attracted to the bottom and is in close contact with the block. The upper part of body 102, 102a~102c.

In contact with the lower surfaces of the four blocks 102, 102a to 102c, a main block base 105, ring-shaped block bases 103a to 103c such as a ring are respectively provided, and below the main block base 105 is provided The bottom base 106. The main block base 105 has a columnar main shaft 105a such as a cylinder, so that the central part of the dome 104 extends in the vertical direction; a disc-shaped base 105b, which faces horizontally below the main shaft 105a And a pair of cylindrical secondary shaft portions 105c, 105d, extending upward from the base portion 105b. A pair of pinion gears 105e, 105f are provided on the upper part of each of the pair of countershaft portions 105c, 105d, and protrusions 105g, 105h, 105i are provided on the side surface of the main shaft portion 105a.

The bottom base 106 has a disc-shaped bottom portion 106a extending in the horizontal direction; and a pair of columnar driving portions 106b, 106c extending upward from the upper end of the bottom portion 106a. The driving parts 106b and 106c have grooves that mesh with the teeth of the pinion gears 105e and 105f.

The main block 102 and the blocks 102a~102c are screwed and fixed to the upper end of the main block base 103 and the block base 103a~103c, respectively, and the dome plate 104a is screwed and fixed to the upper end of the dome 104 . Thereby, the main block 102, the blocks 102a to 102c, and the dome plate 104a can be replaced according to the type. Even if the size of the planar shape of the die is different depending on the type of the die, it is not necessary to prepare the ejection jig 101 for each type. In the case of not changing according to the type, the main block 102, blocks 102a~102c, and dome plate 104a can also be integrated with the main block base 105, block bases 103a~103c and the dome 104, respectively .

The main block base 105 and the block bases 103a to 103c are parts connected to the driving part described below and move up and down in conjunction with the ejection shaft 110. The ejection shaft 110 is driven by The vertical movement is performed by a drive mechanism composed of a motor and a cam not shown. (a) The fifth compression coil spring 108e interposed between the block base 103a and the block base 103b (b) The fourth compression coil spring 108d interposed between the block base 103b and the block base 103c (c) The third compression coil spring 108c interposed between the block base 103a and the main block base 105 (d) The second compression coil spring 108b interposed between the protrusion 104b and the main block base 105, and the protrusion 104b is provided on the inner wall of the dome 104 (e) The first compression coil spring 108a interposed between the bottom base 106 and the main block base 105 and having a spring constant greater than that of the second compression coil spring 108d (f) Pinions 105e, 105f interposed between the block base 103a and the bottom base 106 (g) Abutting on the bottom base 106 of the ejector shaft In addition, the protrusions 105g~105i provided on the main block base 105 refer to the stoppers set to make the upper surface of the block 102a~102c not higher than the upper surface of the block 102, and also mean that the block 102b is not made. 102c Stopper for excessive descent. Thereby, in the initial state, the heights of the upper surfaces of the four blocks 102, 102a to 102c are equal to each other.

The shape of the block 102a in plan view is the same rectangle as the crystal grain D to be peeled off, and its size is slightly smaller than the size of the crystal grain D. In the case where the size of the block 102a is too small compared with the size of the die D, even if the back of the dicing tape 16 is pushed out by the blocks 102a to 102d, the outer peripheral portion of the die D is difficult to peel off from the dicing tape 16. This is because the crystal grain D is thinner than the thickness of the dicing tape 16 such as 90 μm or less, and the rigidity of the crystal grain D is extremely low, and the crystal grain D may be in a bent state and the crystal grain D may be broken. On the other hand, when the size of the block 102a is equal to or greater than the size of the crystal grain D, there is a possibility that other crystal grains D adjacent to the crystal grain D to be peeled may be lifted up at the same time. Therefore, in this embodiment, the preferable distance from the outer periphery of the die D to the outer periphery of the block 102a is set to be 0.5 mm to 0.75 mm, for example.

The size of the block 102b arranged in the inner side of the block 102a in a frame shape in a plan view is about 1 mm to 3 mm smaller than the size of the block 102a. In addition, the size of the block 102c arranged inside the block 102b is about 1 mm to 3 mm smaller than the block 102b. In addition, the size of the block 102d arranged inside the block 102c is about 1 mm to 3 mm smaller than the block 102c. In addition, the width of the main block 102 is greater than any width (the length between the outer side and the inner side) of the blocks 102a to 102c. In this embodiment, the shapes of the blocks 102, 102a to 102c are rectangular in consideration of ease of processing, etc., but it is not limited to this, and for example, it may be elliptical.

The heights of the upper surfaces of the four blocks 102, 102a~102c mentioned above are equal to each other in the initial state (when the blocks 102, 102a~102c are not in motion), and are slightly lower than the ejection jig 101 The height of the upper peripheral part (dome plate 104a).

Next, a method will be described in which the die D is peeled from the dicing tape 16 using the ejector jig 101 provided with the blocks 102, 102a to 102c as described above. Fig. 7 is a diagram illustrating the action of the ejection jig of Fig. 6; Fig. 7(A) is a cross-sectional view showing the initial state; Fig. 7(B) is a cross-sectional view showing the state where all blocks are ejected . Fig. 8 is a diagram illustrating the action of the ejection jig in Fig. 6; Fig. 8(A) is a cross-sectional view showing the state after the outermost block is pulled down; Fig. 8(B) is a view showing the movement from the outside A cross-sectional view of the state after the second block has been pulled down. Fig. 9 is a diagram illustrating the operation of the ejector jig of Fig. 6, and is a cross-sectional view of a state where the third block from the outside has been pulled down.

First, the dicing tape 16 positioned on the wafer holding table 12 shown in FIGS. 3 and 4 is irradiated with ultraviolet rays. Thereby, since the adhesive applied to the dicing tape 16 is hardened and its adhesiveness is reduced, the interface between the dicing tape 16 and the die attach film 18 is easily peeled off.

Next, the expansion ring 15 of the wafer holding table 12 is lowered, whereby the wafer ring 14 attached to the peripheral portion of the dicing tape 16 is pressed downward. In this way, the cutting tape 16 receives a strong tension from the center portion toward the peripheral portion and stretches in the horizontal direction without slack.

Next, as shown in FIG. 4, the center part of the ejector jig 101 (blocks 102, 102a to 102c) is located at one die D (the die D located in the center of the same figure) that is the target of peeling The method directly below the wafer holding table 12 moves and the collet 22 moves above the die D. The bottom surface of the collet 22 supported by the pickup head 21 is provided with a suction port (not shown) whose inside is decompressed, and only one die D to be peeled off can be selectively suctioned and held.

Here, the main block 102 and the main block base 105 are combined as the central block 107, the block 102a and the block base 103a are combined as the first block 107a, and the block 102b and the block base The seat 103b is combined as the second block 107b, and the block 102c and the block base 103c are combined with the third block 107c.

Next, as shown in FIG. 7(A), the upper surfaces of the central block 107, the first block 107a, the second block 107b, and the third block 107c are set to the same height, and set to be higher than the dome plate 104a. The upper surface is slightly lowered (initial state), and the ejector jig 101 is raised so that the upper surface contacts the back of the cutting tape 16, and the suction port, groove and gap G of the dome plate 104a are decompressed . Thereby, the dicing tape 16 below the crystal grain D which becomes the object of peeling will adhere closely to the upper surface of the block body 102, 102a-102c. In addition, the dicing tape 16 below the other die D adjacent to the die D is in close contact with the dome plate 104a. On the other hand, the collet 22 and the ejection jig 101 are raised and lowered approximately at the same time, and the bottom surface of the collet 22 is brought into contact with the upper surface of the die D to be peeled off, thereby adsorbing the die D and gently Press down.

Next, as shown in FIG. 7(B), the four central blocks 107, the first block 107a, the second block 107b and the third block 107c are simultaneously ejected upward, and the back of the cutting tape 16 A load is applied, and the die D is pushed up together with the dicing tape 16.

In order to eject the four central blocks 107, the first block 107a, the second block 107b and the third block 107c upward at the same time, the ejection shaft 110 shown in Figure 7(B) is moved upward Push, thereby pushing up the bottom base 106 connected to the ejector shaft 110. Thereby, the central block 107 is pushed up by the spring force of the first compression coil spring 108a, and the first compression coil spring 108a is interposed between the bottom base 106 and the central block 107. Also, in parallel with this, the first block 107a is pushed up by the spring force of the third compression coil spring 108c, which is interposed between the central block 107 and the first block 107a between. In parallel with this, the second block 107b is pushed up by the spring force of the fourth compression coil spring 108d. The fourth compression coil spring 108d is interposed between the first block 107a and the second block. Between 107b. Also, in parallel with this, the third block 107c is pushed up by the spring force of the fifth compression coil spring 108e. The fifth compression coil spring 108e is interposed between the second block 107b and the third block. Between 107c. With these, the four central blocks 107, the first block 107a, the second block 107b, and the third block 107c are simultaneously pushed up. Moreover, a part of the central block 107 comes into contact with the protrusion 104c provided on the inner wall of the dome 104, whereby the central block 107, the first block 107a, the second block 107b, and the third block 107c The ascent stops.

The ejection amount of the central block 107, the first block 107a, the second block 107b, and the third block 107c is preferably increased or decreased according to the size of the die D. That is, when the size of the die D is large, since the contact area with the die attach film 18 is large, the adhesive force is also large, and therefore, the ejection amount must be increased. On the other hand, when the size of the die D is small, since the contact area with the die attach film 18 is small, the adhesive force is also small, so even if the ejection amount is reduced, peeling is easy. In addition, since the pressure-sensitive adhesive applied to the dicing tape 16 has different adhesive strengths depending on the manufacturer or type, even if the size of the die D is the same, it must be adapted to the pressure-sensitive adhesive. The adhesive force changes the ejection amount of the central block 107, the first block 107a, the second block 107b, and the third block 107c.

Next, as shown in FIG. 8(A), when the first block 107a arranged on the outermost side is pulled down, peeling of the die attach film 18 and the dicing tape 16 starts. At this time, the dicing tape 16 below the other die D adjacent to the die D to be peeled is drawn downward, and the tool is closely attached to the dome plate 104a, thereby preventing the peeling of the other die D.

In order to pull the first block 107a downward, the ejector shaft 110 shown in FIG. 8(A) is further pushed up, whereby the bottom base 106 connected to the ejector shaft 110 is pushed up. At this time, since the central block 107 is in contact with the protrusion 104c, the central block 107 will not be pushed up, the pinion 105e is rotated clockwise by the drive portion 106b of the bottom base 106, and the pinion 105f is borrowed The drive unit 106c rotates counterclockwise. The first block 107a has grooves that mesh with the gears of the pinions 105e and 105f, and is pulled down by the rotation of the pinions 105e and 105f. At this time, the upper surface of the first block 107a is located higher than the upper surface of the dome plate 104a.

When the first block 107a is pulled down, the gap G between the central block 107, the first block 107a, the second block 107b, and the third block 107c is used to promote the peeling of the crystal grains D. The pressure is reduced inside, and thereby, the dicing tape 16 below the die D is sucked downward in advance. Furthermore, the inside of the groove of the dome plate 104a is reduced in pressure, and the cutting tape 16 in contact with the dome plate 104a is brought into close contact with the upper surface of the dome plate 104a in advance.

Next, as shown in FIG. 8(B), when the second block 107b arranged second from the outermost side is pulled down, the die attach film 18 and the dicing tape 16 are peeled off to the crystal The particle D travels in the center direction.

In order to pull the second block 107b downward, the ejection shaft 110 shown in FIG. 8(B) is further pushed up, whereby the bottom base 106 connected to the ejection shaft 110 is pushed up. At this time, the pinion gear 105e is rotated clockwise by the drive portion 106b of the bottom base 106, and the pinion gear 105f is rotated counterclockwise by the drive portion 106c. The first block 107a is further pulled down by the rotation of the pinions 105e and 105f. Thereby, there is no gap 109b, the first block 107a abuts on the second block 107b, and the second block 107b is pulled down. The first block 107a is lowered only by the gap 109b relative to the second block 107b. At this time, although the upper surface of the first block 107a is located lower than the upper surface of the dome plate 104a, the upper surface of the second block 107b is located higher than the upper surface of the dome plate 104a.

Next, as shown in FIG. 9, when the third block 107c arranged third from the outermost side is pulled down, the die attach film 18 and the dicing tape 16 are peeled further toward the die D Travel in the center direction.

In order to pull the third block 107c downward, the ejection shaft 110 shown in FIG. 9 is further pushed up, whereby the bottom base 106 connected to the ejection shaft 110 is pushed up. At this time, the pinion gear 105e is rotated clockwise by the drive portion 106b of the bottom base 106, and the pinion gear 105f is rotated counterclockwise by the drive portion 106c. The first block 107a is further pulled down by the rotation of the pinions 105e and 105f, and the second block 107b is further pulled down. Thereby, there is no gap 109c, the second block 107b abuts on the third block 107c, and the third block 107c is pulled down. The second block 107b only lowers the gap 109c relative to the third block 107c.

Then, when the third compression coil spring 108c is fully contracted, the lowering of the first block 107a, the second block 107b, and the third block 107c stops. At this time, the upper surfaces of the first block 107a, the second block 107b, and the third block 107c are located lower than the upper surface of the dome plate 104a.

Then, the central block 107 is pulled down and the collet 22 is lifted up, whereby the die attach film 18 is completely peeled off from the dicing tape 16.

In addition, when the upper surface of the central block 107 is pulled down, the area must be reduced in advance to the die attach film 18 peeled from the dicing tape 16 by the suction force of the collet 22 degree. When the area of the upper surface of the central block 107 is larger, the contact area between the die attach film 18 and the dicing tape 16 also becomes larger and the adhesion between the two becomes larger. Therefore, the collet 22 attracts the die D , It is impossible to peel the die attach film 18 from the dicing tape 16. On the other hand, when the area of the upper surface of the central block 107 is reduced, the strong load is concentrated on the narrow area (central part) of the crystal grain D. Therefore, in extreme cases, the crystal grain D is broken. The fear.

When the die becomes thinner, the rigidity of the die becomes extremely low compared with the adhesive force of the dicing tape. Therefore, in order to pick up thin crystal grains of 20 μm, for example, it is necessary to reduce (lower stress) the stress applied to the crystal grains. The ejector block is composed of a plurality of blocks. After all the blocks of the plurality of blocks are ejected, each block is sequentially pulled down, and transferred to the crystal grains when the outer block is pulled down. The bending stress depends on the area where the adhesive force is generated by the cutting tape, that is, the overhang (OH) caused by the width of the block. The width of the outer block is narrow and by increasing the number of blocks, the block area of the crystal grain holding part is gradually reduced, so that the crystal grains can be peeled from the dicing tape. Thereby, the stress on the crystal grains can be reduced.

Also, when the central block 107 is pulled down while the collet 22 is pressing the die D downward, the collet 22 moves downward, so that the die D collides with the central block 107 and breaks. The fear. Therefore, when the central block 107 is pulled down, it is preferable to fix the collet 22 in advance so that the collet 22 is lifted or at least not moved downward.

In order to pull the central block 107 downward, the ejector shaft 110 shown in FIG. 9 is pulled down, whereby the bottom base 106 is lowered by the spring force of the first compression coil spring 108a. At this time, since the spring force of the first compression coil spring 108a is stronger than the spring force of the second compression coil spring 108b, the position of the central block 107 is maintained.

At this time, the pinion gear 105e is rotated counterclockwise by the drive portion 106c of the bottom base 106, and the pinion gear 105f is rotated clockwise by the drive portion 106d. The first block 107a is pushed up by the rotation of the pinions 105e, 105f and the spring force of the third compression coil spring 108c.

When the lowering of the bottom base 106 caused by the first compression coil spring 108a stops, the central block 107 is lowered by the spring force of the second compression coil spring 108b. In parallel with this, the second block 107b is pushed up by the spring force of the fourth compression coil spring 108d. In addition, the third block 107c is pushed up by the spring force of the fifth compression coil spring 108e.

In addition, the central block 107, the first block 107a, the second block 107b, and the third block 107c are returned to the initial state.

Next, referring to FIG. 10, a method of manufacturing a semiconductor device using the die bonder of the embodiment will be described. FIG. 10 is a flowchart showing a method of manufacturing a semiconductor device using the die bonder of FIG. 1.

Step S11: The wafer ring 14 holding the dicing tape 16 is stored in a cassette (not shown) and carried into the die bonder 10. The dicing tape 16 is attached to the wafer 11的晶粒 D. The control unit 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply unit 1. In addition, the substrate S is prepared and carried into the die bonder 10. The control unit 8 mounts the substrate S on the substrate transport claw 51 by the substrate supply unit 6.

Step S12: The control unit 8 peels the die D as described above, and picks up the peeled die D from the wafer 11. In this way, the die D peeled from the dicing tape 16 is sucked and held by the collet 22 together with the die attach film 18, and is transported to the next process (step S13). Moreover, when the collet 22 that transports the die D to the next process returns to the die supply unit 1, the next die D is peeled off from the dicing tape 16 according to the above-mentioned procedure, and thereafter, in accordance with the same procedure, The dicing tape 16 peels off the die D one by one.

Step S13: The control unit 8 mounts the picked-up die on the substrate S or stacks it on the bonded die. The control unit 8 places the die D picked up from the wafer 11 on the intermediate platform 31, and the die D is picked up again from the intermediate platform 31 by the bonding head 41 and bonded to the transferred substrate S.

Step S14: The control unit 8 takes out the substrate S to which the die D is bonded from the substrate conveying claw 51 using the substrate conveying unit 7. The substrate S is carried out from the die bonder 10.

As described above, the die D is mounted on the substrate S via the die attach film 18 and carried out from the die bonder. Thereafter, in a wire bonding process, the electrodes are electrically connected to the electrodes of the substrate S via Au wires. Next, the substrate S on which the die D is mounted is carried into the die bonder, and the second die D is laminated on the die D mounted on the substrate S via the die attach film 18, and the die is bonded from the die. After the device is carried out, in the wire bonding process, it is electrically connected to the electrode of the substrate S via the Au wire. The second die D is separated from the dicing tape 16 by the above-mentioned method, and then transferred to the chip packaging process and laminated on the die D. After repeating the above-mentioned process a predetermined number of times, the substrate S is transported to the compression molding process, and a plurality of die D and Au leads are packaged with a compression molding resin (not shown), thereby completing the laminated package.

As described above, when assembling a multilayer package in which a plurality of dies are three-dimensionally mounted on a substrate, in order to prevent an increase in the thickness of the package, the thickness of the die is required to be thinned to 20 μm or less. On the other hand, since the thickness of the dicing tape is about 100μm, the thickness of the dicing tape is also 4 to 5 times the thickness of the crystal grain.

When such a thin die is to be peeled from the dicing tape, the deformation of the die following the deformation of the dicing tape tends to become more significant, but in the die bonder of this embodiment, the system can be reduced Die damage when picking up the die from the dicing tape.

<Modifications> Hereinafter, some representative modified examples of the embodiment are illustrated. In the description of the following modification examples, parts having the same configuration and function as those described in the above-mentioned embodiment can be given the same reference numerals as in the above-mentioned embodiment. In addition, regarding the description of this part, the description of the above-mentioned embodiment may be appropriately cited within the scope of technically not contradictory. In addition, within the scope of not being technically contradictory, part of the above-mentioned embodiment and all or part of a plurality of modified examples can be appropriately combined and applied.

(First modification) In the embodiment, although the pinion gear 105e, 105f is used to rotate when the outermost block base 103a is pulled downward, a rod-shaped or bar-shaped lever may also be used.

Fig. 11 is a cross-sectional view of the ejection jig of the first modification. The upper part of one of the main block base 105 of the ejection jig 101A of the first modification example and the auxiliary shaft portions 105c, 105d are provided with levers 105j, 105k. The ejector shaft 110 is pushed up further, whereby the bottom base 106 connected with the ejector shaft 110 is pushed up. At this time, since the main block base 105 is in contact with the protrusion 104c, the main block base 105 will not be pushed up but the driving parts 106b, 106c of the bottom base 106 will be pushed up and connected to it One side of the lever 105j, 105k will be pushed up. Therefore, the fulcrum of the lever 105j, 105k connected to the countershaft 105c, 105d is connected to the drive of the outermost block base 103a connected to the other end Ministry will be pulled down. Hereinafter, the other blocks also operate in the same manner as the embodiment.

(Second modification) In the embodiment, when the outermost block base 103a is pulled down, although the rotation of the pinions 105e and 105f is used, a ball screw or a nut lock can also be used.

Fig. 12 is a cross-sectional view of the ejector jig of the second modification. A nut 106d is provided below the bottom 106a of the bottom base 106, and a nut 106e is formed above the driving parts 106b and 106c. The ejector shaft 110 is formed by a ball screw. When the outermost block base 103a is pulled down, the driving part 106b, 106c of the bottom base 106 connected to the nut 106d at the front end can be rotated along with the rise of the ejector shaft 110, and The screw part 103aa provided in the driving part connected to the outermost block base 103a is rotated, and the nut 106e provided in the driving parts 106b, 106c of the bottom base 106 is rotated, thereby pulling down. Hereinafter, the other blocks also operate in the same manner as the embodiment.

As mentioned above, although the invention developed by the present inventors has been specifically explained based on the embodiment and the modification, the present invention is not limited to the above-mentioned embodiment and the modification, and various changes can be made without redundancy.

For example, in the embodiment, although an example is described in which the ejector block is composed of the main block and the first to third blocks, it is not limited to this, and it may be a plurality of blocks. Block body. For example, in the case of two blocks, it is composed of the main block and the first block, and in the case of three blocks, it is composed of the main block, the first block and the second block. , In the case of five or more blocks, it is constituted by adding blocks between the third block and the main block.

In addition, in the embodiment, although the outermost block base 103a is pulled down, the pinion gear 105e, 105f is used to rotate, but it can also be connected to the drive part 106b of the bottom base 106 The hydraulic cylinder or the like changes the power of raising to lowering, and lowers the driving part connected to the outermost block base 103a.

In addition, in the embodiment, although an example of using a die attach film is described, it is also possible to provide an adhesive applied to the preformed portion of the substrate without using the die attach film.

In addition, in the embodiment, although it is explained that "the die is picked up from the die supply part with a pickup head and placed on the intermediate platform, and the die placed on the intermediate platform is bonded to the substrate with the bonding head" The die bonder is not limited to this, and can be applied to a semiconductor manufacturing device that picks up die from a die supply part. For example, it can also be applied to a die bonder that uses a bonding head to bond the die of the die supply portion to the substrate without an intermediate platform and a pick-up head. In addition, it can be applied to flip chip bonding of "without an intermediate platform, picking up the die from the die supply part, rotating the die picking head to the top to transfer the die to the bonding head, and using the bonding head to bond to the substrate" Device. In addition, it can be applied to a die sorting machine that "does not have an intermediate platform and a bonding head, and places the die picked up from the die supply part with the pickup head on a tray, etc.".

1: Die supply part 11: Wafer 13: ejection unit 101: ejection fixture 102: Block 102a: block 102b: block 102c: block 103a: Block base 103b: Block base 103c: Block base 107: Central Block 107a: The first block 107b: The second block 107c: The third block 16: cutting tape 2: Pickup 21: Pickup head 3: Intermediate platform 31: Intermediate platform 4: Joint 41: Joint head 8: Control Department 10: Die Bonder D: grain S: substrate

[Fig. 1] A schematic top view showing the die bonder of the embodiment. [Fig. 2] A diagram explaining the actions of the pickup head and the bonding head when viewed from the direction of arrow A in Fig. 1. [Fig. [Fig. 3] A diagram showing an external perspective view of the die supply part of Fig. 1. [Fig. [Fig. 4] A schematic cross-sectional view showing the main part of the crystal grain supply part of Fig. 1. [Fig. [Figure 5] Illustrates the top view of the ejector fixture of Figure 4; [Fig. 6] A-A sectional view of the ejector jig in Fig. 5. [Fig. 7] A diagram explaining the operation of the ejector jig shown in Fig. 6. [Fig. 8] A diagram explaining the operation of the ejector jig shown in Fig. 6. [Fig. 9] A diagram explaining the operation of the ejector jig shown in Fig. 6. [FIG. 10] A flowchart showing a method of manufacturing a semiconductor device using the die bonder of FIG. 1. [Fig. 11] A cross-sectional view illustrating the ejection jig of the first modification. [Fig. 12] A cross-sectional view illustrating the ejector jig of the second modification.

101: ejection fixture

102: main block

102a: block

102b: block

102c: block

104a: dome board

G: gap

Claims (23)

A semiconductor manufacturing device characterized by: Wafer holding table, holding dicing tape with dies; and The ejection unit ejects the aforementioned crystal grains from below the aforementioned dicing tape, The aforementioned ejector unit has: Cylindrical dome The block part has a columnar main block located in the center and a plurality of ring-shaped blocks located on the outer side of the aforementioned main block, and moves up and down; The bottom base, based on the up and down movement of the ejector shaft, causes the aforementioned block to move up and down; and The mechanism transforms the up and down movement of the bottom base into the up and down movement of the outermost block of the plurality of blocks, And is constructed in the following way: By pushing the ejector shaft upward, the bottom base, the central block and the plurality of blocks are pushed up, By further pushing the ejector shaft up, the bottom base is stacked, and the outermost block is pulled down by the mechanism. For example, the semiconductor manufacturing device of item 1 in the scope of patent application, in which, The aforementioned mechanism is a gear. For example, the semiconductor manufacturing device of item 1 in the scope of patent application, in which, The aforementioned mechanism is a bar-shaped lever. For example, the semiconductor manufacturing device of item 1 in the scope of patent application, in which, The above-mentioned plural blocks have respective upper abutting parts of the outer block and the inner block, and are pulled down by the respective outer blocks being pulled down. For example, the semiconductor manufacturing device of item 4 of the scope of patent application, in which, The aforementioned mechanism is installed on the central block and arranged between the bottom base and the outermost block. For example, the semiconductor manufacturing device of item 1 in the scope of patent application, in which, The aforementioned dome has a first protrusion on its inner wall, The aforementioned ejector units are further equipped with: The first compression coil spring is interposed between the bottom base and the central block; The second compression coil spring is interposed between the central block and the first protrusion; The third compression coil spring is interposed between the central block and the outermost block; and The fourth compression coil spring is interposed between the outermost block and the inner block adjacent to the outermost block. For example, the semiconductor manufacturing device of item 1 in the scope of patent application, in which, The aforementioned dome has a second protrusion on its inner wall, By the way the central block abuts against the second protrusion, the ascent of the central block and the plurality of blocks stops. For example, the semiconductor manufacturing device of any one of items 1 to 3 in the scope of patent application, where: The die is further provided with a die attach film between the die and the dicing tape. For example, the semiconductor manufacturing device of any one of items 1 to 3 in the scope of patent application, which has: The pickup head is equipped with a collet for adsorbing the aforementioned crystal grains. For example, the semiconductor manufacturing device of item 9 of the scope of patent application, which has: The intermediate platform is loaded with the crystal grains picked up by the aforementioned pickup head; and The bonding head bonds the die placed on the aforementioned intermediate platform to the substrate or the bonded die. For example, the semiconductor manufacturing device of any one of items 1 to 3 in the scope of patent application, which has: The bonding head is equipped with a collet for adsorbing the aforementioned crystal grains. An ejector jig, which is used in an ejector unit that ejects the die from below the dicing tape. The ejector unit is characterized by: A round dome with a first protrusion on the inner wall; The dome plate has an opening and is set on the top of the aforementioned dome; The block part has a first block and a central block located inside the first block, and moves up and down in the opening; The bottom base, based on the up and down movement of the ejector shaft, causes the aforementioned block to move up and down; The first compression coil spring is interposed between the bottom base and the central block; The second compression coil spring is interposed between the central block and the first protrusion; The third compression coil spring is interposed between the central block and the first block; and Mechanism to transform the upward movement of the bottom base into the downward movement of the first block, Push the ejector shaft upward, thereby, the bottom base is pushed up, and the central block is pushed up by the spring force of the first compression coil spring, and by the third compression The spring force of the coil spring pushes up the aforementioned first block, By further pushing up the ejector shaft, the bottom base is stacked, and the mechanism is configured such that the first block is pulled down. For example, the ejector fixture in item 12 of the scope of patent application, of which, The aforementioned mechanism is a gear. For example, the ejector fixture in item 12 of the scope of patent application, of which, The ejector fixture is a bar-shaped lever. For example, the ejector fixture of any one of items 12 to 14 in the scope of patent application, of which, The block portion is further provided with a second block between the first block and the central block, Furthermore, it is provided with a fourth compression coil spring interposed between the first block and the second block, By the way the first block is pushed up, the second block is pushed up by the spring force of the fourth compression coil spring, By the way the first block is pulled down, the first block abuts the second block and the second block is pulled down. For example, the ejector fixture in item 15 of the scope of patent application, of which, The block portion is further provided with a third block between the second block and the central block, Furthermore, it is provided with a fifth compression coil spring interposed between the second block and the third block, By the way the second block is pushed up, the third block is pushed up by the spring force of the fifth compression coil spring, By the way the second block is pulled down, the second block abuts the third block and the third block is pulled down. For example, the ejector fixture of any one of items 12 to 14 in the scope of patent application, of which, The aforementioned round tube dome has a second protrusion on its inner wall, As the central block abuts against the second protrusion, the ascent of the central block and the first block is stopped. For example, the ejector fixture in item 17 of the scope of patent application, of which, The aforementioned mechanism is installed on the central block and arranged between the bottom base and the first block. For example, the ejector fixture in item 16 of the scope of patent application, of which, The central block has: a main block part that abuts against the cutting tape; and a main base block part that is connected to the main block part and abuts the first compression coil spring, The first block has: a first block that abuts on the cutting tape; and a first base block that is connected to the first block and abuts on the third compression coil spring, The second block has: a second block that abuts against the cutting tape; and a second base block that is connected to the second block and abuts the fourth compression coil spring, The third block body has: a third block body portion abutting on the cutting tape; and a third base block portion connected to the third block body and abutting on the fifth compression coil spring. For example, the ejector fixture in item 19 of the scope of patent application, of which, The dome plate is screwed and fixed to the dome, the main block part is screwed and fixed to the main base block, and the first block part is screwed and fixed to the first base block. Part, the second block part is screwed and fixed to the second base block part, the third block part is screwed and fixed to the third base block part, The dome plate, the first block, the second block, and the third block can be replaced according to the type of die. A method of manufacturing a semiconductor device, characterized by: (a) Prepare the process of semiconductor manufacturing equipment as in any one of items 1 to 7 of the scope of patent application; (b) The process of preparing a wafer ring for holding a dicing tape, which has dies; (c) The process of preparing the substrate; and (d) The process of ejecting the aforementioned die with the aforementioned ejection unit and picking up the aforementioned die with a collet, The aforementioned (d) project has: (d1) The process of pushing the aforementioned central block and the aforementioned plural blocks to the aforementioned cutting belt; and (d2) The process of pulling down in order from the outermost block to the innermost block of the aforementioned plural blocks. For example, the method of manufacturing a semiconductor device in the 21st patent application scope, which includes: (e) The process of bonding the aforementioned die to the substrate or the bonded die. For example, the method of manufacturing a semiconductor device in the 21st patent application, in which, The aforementioned (d) process is a process of placing the picked up crystal grains on the intermediate platform. The aforementioned (e) process further has the process of picking up the aforementioned crystal grains from the aforementioned intermediate platform.

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