573337 A7 B7 五、發明説明（1 ) 【本發明之領域】 本發明係關於一種積體電路晶片固定裝置及方法，尤 才曰一種適用於液晶顯示裝置（L c d )面板周圍積體電路晶 片之固定裝置及方法。 【本發明之背景】 在薄膜電晶體液晶顯示裝置（TFT-LCD)製程當 中’接腳（bumps)間距微小化（Fin卜Pitch)以及高輸入/ 輸出（I/O)數是TFT-LCD模組廠玻璃-晶粒結合（c〇G, chip on glass)技術的未來趨勢。要在相同的晶片面積之 下達到此一目的’唯有藉著縮小接腳（b u m p)面積以增加 接腳數量。 然而以目前之異方向性導電膜覆晶技術而言，減少接 腳面積，必須面臨接腳攫取導電粒子數目不足之考量；另 外由於壓著時，導電粒子隨液化之導電膜流散於局部之導 電膜中，於減少接腳間距時，有接腳間短路之顧慮。 雖然目前可以增加導電膠（ACf，Anisotropic Conductive Film)中導電粒子數目來達成要求，但是此 種高導電粒子密度之ACF成本將以倍數增加，不適於量產 製程。 發明人爰因於此，本於積極發明之精神，虽思一種可 以解決上述問題之「積體電路晶片固定裝置及方法」，幾 經研究實驗終至完成此項嘉惠世人之發明。 _ 4 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公變1--"~ 一裝----.---訂-------. (請先閲讀背面之注意事項再填寫本頁各欄) 573337 A7 --—---------B7__ 五、發明説明" ' -~* 【本發明之概述】 本發明之主要目的係在提供一種積體電路晶片固定裝 置，俾能於壓著積體電路晶片於平面顯示裝置面板周圍 時，聚集導電粒子於積體電路晶片接腳下方，並可用添加 較少的導電粒子之導電膠確保接點之接觸阻抗，降低ACF 導電膠之成本。 — 本發明之主要目的係在提供一種積體電路晶片固定裝 置，俾能使甩低導電粒子密度之導電膠，降低接腳之間 距，增加接腳數目，並提高輸入或輸出接腳數、完成間距 微小化（F i n e - P i t c h )的效果。 本發明之另一目的係在提供一種積體電路晶片固定裝 置，以改善接腳高度所引起的壓痕不良。 本發明之主要目的係在提供一種積體電路晶片之組裝 方法，俾能聚集導電粒子於積體電路晶片接腳下方，可以 添加較少的導電粒子於導電膠並確保接點之接觸阻抗，降 低異方性導電膠（ACF)之成本。 本發明之主要目的係在提供一種積體電路晶片之組裝 方法，俾能使用低導電粒子密度之導電膠，降低接腳之間 距’增加接腳數目，並提高輸入或輸出接腳數、完成間距 微小化（F i n e - P i t c h )的效果。 為達成上述之目的，本發明在可玻璃-晶粒結合（COG) 本壓之支撐底座上相對於積體電路晶片（LSI)接腳處鑲嵌 磁性物質。在COG壓著過程中可增加該支撐底座之溫度使 導電膠成為液態，此時懸浮於導電膠中之導電粒子受磁力 __5__ 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐) ' ' ------------裝-----------訂------線 I (請先閲讀背面之注意事項再填寫本頁各欄) 573337 A7 B7 五、發明説明（3 ) - 影響聚集於接腳下方；接著LSI下壓，每一接聊即可以禮 取足夠的導電顆粒。 本發明積體電路晶片固定裝置，係配合至少一具有複 數個接腳之積體電路晶片以及一基板，主要包括·· ^少一 具有複數個磁性接點之支撐塊，其中該磁性接點之排列位 置係相對應於該積體電路晶片接腳之排列位置；至少一支 撐底座，以連接固定該支撐塊，並用以夾置、固定或支撐 該基板；以及至少一壓頭，位於該支撐塊之一側，以將該 積體電路晶片壓著於經該支撐底座夾置、固定或支撐之該 基板。 本發明積體電路晶片之組裝方法，主要包括以下步 驟··先提供至少一具有複數個接腳之積體電路晶片以及一 部分表面放置有導電膠之基板；隨之將該基板固置於至少 一具有複數個磁性接點之支撐塊上，其中該磁性接點之排 列位置係相對應於該積體電路晶片接腳之排列位置；將該 積體電路晶片置於該基板表面之導電膠上，並使該磁性接 點之排列位置相對應於該積體電路晶片接腳之排列位置； 將至少一熱壓頭對準並壓夾該積體電路晶片，使該積體電 路晶片壓著至該基板表面，且該磁性接點之排列位置相對 應於β積體電路晶片接聊之排列位置；以及釋放該熱壓頭 並取出該基板。 由於本發明確有增進功效，故依法申請發明專利。 【圖式簡單説明】 __6_ f紙張尺度適用中國國家標準（CNS) Α4規格（21GX297公變) 裝-----------訂------"^^線· (請先閲讀背面之注意事項再填寫本頁各攔) 第1圖係本發明第一實施例之分解示意圖。 第2圖係本發明第-實施例纟實施狀態示意圖。 第3圖係本發明第二實施例之支撐底座示意圖。 【圖號説明 積體電路晶片 11 接聊 支撐塊 21 磁性接點 基板 3 1 導電膠 支撐底座 41 凹槽 熱壓頭 6 支撐底座 61磁性接點 【較佳具體實施例之詳細説明】 本發明積體電路晶片固定裝置或方法適 為：何習：之基板，較佳為平面顯示基板。本發 月S"路曰日片固疋裝置或方法適用之 何習用之壓頭，較佳為敎懕U 艮制可為>573337 A7 B7 V. Description of the invention (1) [Field of the invention] The present invention relates to an integrated circuit chip fixing device and method, and more particularly, it is applicable to an integrated circuit chip around a liquid crystal display device (L cd) panel. Fixing device and method. [Background of the Invention] In the thin film transistor liquid crystal display device (TFT-LCD) manufacturing process, the 'bumps' pitch is miniaturized (Finbu Pitch) and the high input / output (I / O) number is the TFT-LCD mode. The future trend of chip-on-glass (COG) technology. To achieve this goal under the same chip area, the only way is to increase the number of pins by reducing the pin area. However, with the current flip-chip conductive film flip-chip technology, to reduce the pin area, it is necessary to consider the insufficient number of conductive particles on the pin; in addition, the conductive particles flow to the local conductive layer with the liquefied conductive film when pressed. In the film, when the pin pitch is reduced, there is a concern of a short circuit between the pins. Although the number of conductive particles in the conductive adhesive (ACf, Anisotropic Conductive Film) can be increased to meet the requirements, the ACF cost of such high conductive particle density will increase by multiples, which is not suitable for mass production processes. Because of this, the inventor, based on the spirit of active invention, thought about a "integrated circuit chip fixing device and method" that can solve the above problems. After several research experiments, he finally completed this invention that benefits the world. _ 4 This paper size applies to China National Standard (CNS) A4 specifications (210X297 public transformer 1-" ~ one pack ----.--- order -------. (Please read the note on the back first (Please fill in the columns on this page) 573337 A7 ----------- B7__ V. Description of the invention " '-~ * [Summary of the invention] The main purpose of the invention is to provide a product Circuit chip fixing device, when the integrated circuit chip is pressed around the panel of the flat display device, the conductive particles are gathered under the pins of the integrated circuit chip, and the conductive adhesive with less conductive particles can be used to ensure the contact of the contacts. Impedance, reducing the cost of ACF conductive adhesive. — The main purpose of the present invention is to provide an integrated circuit chip fixing device, which can reduce the conductive adhesive that reduces the density of conductive particles, reduce the distance between pins, increase the number of pins, and The effect of increasing the number of input or output pins and minimizing the pitch (Fine-Pitch). Another object of the present invention is to provide a chip assembly for integrated circuit chips to improve the indentation failure caused by the pin height. The main purpose of the present invention is to provide An assembling method of integrated circuit chip, which can gather conductive particles under the pins of integrated circuit chip, can add less conductive particles to the conductive adhesive and ensure the contact resistance of the contact, and reduce the anisotropic conductive adhesive (ACF) The main purpose of the present invention is to provide a method for assembling integrated circuit chips, which can use a conductive adhesive with a low density of conductive particles, reduce the distance between the pins, increase the number of pins, and increase the number of input or output pins. In order to achieve the effect of fine pitch (Fine-Pitch), in order to achieve the above-mentioned object, the present invention is relative to the integrated circuit chip (LSI) pin on the support base capable of glass-grain bonding (COG) pressure. Magnetic materials are embedded everywhere. During the COG pressing process, the temperature of the support base can be increased to make the conductive adhesive liquid. At this time, the conductive particles suspended in the conductive adhesive are subjected to magnetic force. __5__ This paper size applies to China National Standard (CNS) A4 specifications. (210X297mm) '' ------------ Install ----------- Order ------ Line I (Please read the precautions on the back before filling (Columns on this page) 573337 A7 B7 V. Description of the invention ( 3)-The influence is gathered under the pins; then the LSI is pushed down, and each conductive conversation can get enough conductive particles. The integrated circuit chip fixing device of the present invention is matched with at least one integrated circuit with a plurality of pins. A chip and a substrate mainly include a support block having a plurality of magnetic contacts, wherein the arrangement position of the magnetic contacts corresponds to the arrangement position of the pins of the integrated circuit chip; at least one support base, The support block is connected and fixed, and is used to clamp, fix or support the substrate; and at least one indenter is located on one side of the support block to press the integrated circuit chip to be clamped and fixed by the support base. Or support the substrate. The method for assembling an integrated circuit chip of the present invention mainly includes the following steps: first providing at least one integrated circuit chip having a plurality of pins and a substrate on which a conductive adhesive is placed on a part of the surface; On a support block having a plurality of magnetic contacts, the arrangement position of the magnetic contacts corresponds to the arrangement position of the pins of the integrated circuit chip; the integrated circuit chip is placed on a conductive adhesive on the surface of the substrate, Make the arrangement position of the magnetic contacts correspond to the arrangement position of the pins of the integrated circuit chip; align and press the at least one thermal indenter to the integrated circuit chip so that the integrated circuit chip is pressed to the integrated circuit chip; The surface of the substrate, and the arrangement position of the magnetic contacts corresponds to the arrangement position of the β integrated circuit chip chat; and the thermal head is released and the substrate is taken out. Since the present invention does have an enhanced effect, an invention patent is applied in accordance with the law. [Brief description of the drawing] __6_ f Paper size is applicable to Chinese National Standard (CNS) Α4 specification (21GX297 public transformer). ---------- Order ------ " ^^ 线 · ( (Please read the precautions on the back before filling in the blocks on this page.) Figure 1 is an exploded view of the first embodiment of the present invention. Fig. 2 is a schematic diagram of an implementation state of the first embodiment of the present invention. FIG. 3 is a schematic view of a supporting base according to a second embodiment of the present invention. [Figure number illustrates integrated circuit chip 11 contact support block 21 magnetic contact substrate 3 1 conductive adhesive support base 41 grooved thermal head 6 support base 61 magnetic contact [detailed description of preferred embodiments] The present invention The device or method for fixing a body circuit chip is suitable as follows: The substrate is preferably a flat display substrate. What is the customary indenter used in this month ’s S " Lu Yue Japanese film fixing device or method, it is preferred that the system is >
裝署+、 職為熱壓頭。本發明積體電路晶片I 適用之支撐_狀無限制，可為任何習用之」 2:狀’較佳為方形立方體。本發明積體電路晶片固； 以姑1法適狀切塊材料纽制，可4任何習用之j =料，較佳為陶完。本發明積體電路晶片固定㈣ :材Γΐ磁性接點材料無限制’可為任何習用之磁㈣ :佳為強磁性材料。本發明積體電路晶片固定絮 法中使用之磁性接點，其較佳可嵌人於該支撐塊中 磁性接點能切底絲合為— It。本發賴使用之 芬极iiTi國家標準TCNS) 573337 A7 B7 五、發明説明（5 ) 導電膠材料無限制，可為任何習用之導電膠材料，較佳為 異方向性導電膠。本發明積體電路晶片固定裝置或方法中 使用之支撐塊，其較佳可嵌入於該支撐底座中或該支撐塊 係與該支撐底座整合為一體。本發明積體電路晶片固定裝 置或方法中使用之磁性接點可為突出於該支撐塊表面，或 該磁性接點與該支撐塊之平面整合為一平面。 為能讓貴審查委員能更瞭解本發明之技術内容，特 舉平面顯示基板之組裝方法及裝置較佳具體實施例説明如 下。 請參見第1圖，本圖係本發明第一實施例之分解示意 圖。第1圖圖中係將一液晶顯示用玻璃基板3置入於一夾置 於複數個積體電路晶片1以及相對應之複數個支撐塊2之間 之位置，其中該玻璃基板3之部分上表面具有一層異方性 導電膠（ACF) 31，以提供該些積體電路晶片1固著於該 玻璃基板3之上。其中，該些積體電路晶片1具有複數個接 腳11，而該些支撐塊2朝向該些積體電路晶片1之表面具 有複數個相對應於該些接腳1 1位置之磁性接點2 1。該些 支撐塊2係位於一支撐底座4之凹槽4 1内。 接著請同時參見第1、2圖，此為本發明第一實施例之 實施狀態示意圖。實施方法步驟如下··提供至少一具有複 數個接腳之積體電路晶片丨以及一平面顯示玻璃基板3 ;將 該基板3固置於至少一具有複數個磁性接點2丨之支撐塊2 上，其中該磁性接點2 1之排列位置係相對應於該積體電路 晶片1之接腳1 1之排列位置；將該積體電路晶片1置於表 ____8 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐)" (請先閲讀背面之注意事項再填寫本頁各欄) 裝-----------訂------ 573337 A7 _____B7 五、發明説明（6 ) 面放有/、方性導電膠（Acf)31之該平面顯示玻璃基板3 表面上之積電路晶片欲接著位置，並使該磁性接點2 1之 排列位置相對應於該積體電路晶片丨之接腳丨丨之排列位 置；將至少一熱壓頭5對準並壓夾該積體電路晶片丨，使該 積體電路晶片1壓著至該平面顯示玻璃基板3表面上之積體 電路晶片欲接著位置；以及釋放該熱壓頭5並取出該平面 顯示基板3。 在本實施例之壓著過程中該導電膠3丨會呈現可流動 態，此時該導電膠31中之導電粒子會受到該些磁性接點 2 1之吸引，而流動聚集在對應於該積體電路晶片丨之接腳 1 1的位置，以增加該些接腳丨丨與導電膠3丨之間的導電 性，降低接腳11區域附近導電膠31導電粒子流失之機 率，並避免導電粒子逸出接腳丨丨區域外形成短路，同時減 少各接腳1 1之間導電粒子的數量，以減低該些接腳i 1間 短路的現象，因此可減低接腳u之間距而增加接腳丨丨之 數量。 最後請參見第3圖，此為本發明第2實施例之支撐底座 6之示意圖。在本第二實施例中實際操作程序均與第一實 施例中相同，且除了第一實施例中之該支撐底座4與該支 撐塊2在第二實施例中係整合為一支撐底座6，其表面對應 於該些積體電路晶片（圖中未示）接腳之位置設置有複數 個磁性接點61，以發揮如同該些支撐塊2之磁性接點以之 功能外，其餘結構均與第一實施例相同。 _ 9_ 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公复Y--'---- 裝-----------訂------ (請先閲讀背面之注意事項再填寫本頁各欄) 573337 A7 ____B7 五、發明説明（7 ) 本發明之積體電路晶片固定裝置，於壓著積體電路晶 片於平面顯示裝置面板時，由於異方性導電膠内之導電粒 子受到熱壓頭之加熱而變為更加具有流動性，且受到相對 應於該積體電路晶片之接腳之磁性粒子之吸引，導電粒子 會聚集於積體電路晶片接腳下方，所以可以避免於壓著 時，導電粒子隨液化之導電膜流散於局部之導電膜中，減 少導電短路之機率。且由於磁性粒子可吸引聚集接腳下方 之導電粒子，所以可以降低接腳之間距，增加接腳數目， 並提高輸入或輸出接腳數、達到間距微小化（F丨n e _ Pitch )的效果。此外，本發明之積體電路晶片固定裝置 因為磁性粒子之吸引，導電粒子聚集於積體電路晶片接腳 下方，故可使用添加較少的導電粒子之導電膠確保接點之 接觸阻抗，降低ACF導電膠之成本。 惟應注意的是，上述諸多實施例僅係為了便於説明而 舉例而已，本發明所主張之權利範圍自應以申請專利範圍 所述為準，而非僅限於上述實施例。 _ 10 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐y 裝-----------訂-------線— (請先閲讀背面之注意事項再填寫本頁各襴)Installed +, post as hot head. The support circuit shape of the integrated circuit wafer I of the present invention is not limited, and can be any conventional one. "2 shape" is preferably a square cube. The integrated circuit wafer of the present invention is solid; it is made of suitable dicing material and can be used for any conventional j = material, preferably ceramic finish. According to the present invention, the integrated circuit wafer fixing 材: material Γΐ magnetic contact material is unlimited 'can be any conventional magnetic ㈣: preferably a strong magnetic material. The magnetic contact used in the integrated circuit wafer fixing method of the present invention may preferably be embedded in the support block. The magnetic contact can be cut into the bottom wire to form it. The fenji iiTi national standard used in this report) 573337 A7 B7 V. Description of the invention (5) The conductive adhesive material is not limited, and can be any conventional conductive adhesive material, preferably anisotropic conductive adhesive. The support block used in the integrated circuit wafer fixing device or method of the present invention is preferably embedded in the support base or the support block is integrated with the support base. The magnetic contacts used in the integrated circuit wafer fixing device or method of the present invention may be protruding from the surface of the support block, or the magnetic contacts and the plane of the support block may be integrated into a plane. In order to make your reviewing committee better understand the technical content of the present invention, the preferred embodiments of the method and device for assembling a flat display substrate are described below. Please refer to Fig. 1, which is an exploded view of the first embodiment of the present invention. In the figure, a glass substrate 3 for liquid crystal display is placed in a position sandwiched between a plurality of integrated circuit wafers 1 and a corresponding plurality of support blocks 2, wherein a part of the glass substrate 3 is A layer of anisotropic conductive adhesive (ACF) 31 is provided on the surface to provide the integrated circuit wafers 1 fixed on the glass substrate 3. The integrated circuit chip 1 has a plurality of pins 11, and the surfaces of the support blocks 2 facing the integrated circuit chip 1 have a plurality of magnetic contacts 2 corresponding to the positions of the pins 11 1. 1. The supporting blocks 2 are located in a groove 41 of a supporting base 4. Please refer to Figs. 1 and 2 at the same time. This is a schematic diagram of the implementation state of the first embodiment of the present invention. The implementation method steps are as follows: Provide at least one integrated circuit wafer with a plurality of pins and a flat display glass substrate 3; the substrate 3 is fixed on at least one support block 2 with a plurality of magnetic contacts 2 , Where the arrangement position of the magnetic contact 21 is corresponding to the arrangement position of the pin 11 of the integrated circuit chip 1; the integrated circuit chip 1 is placed on the table ____8 This paper size applies to Chinese national standards ( CNS) A4 specification (210X297 mm) " (Please read the precautions on the back before filling in the columns on this page) Install ----------- Order ------ 573337 A7 _____B7 V. Description of the Invention (6) The planar display glass substrate 3 on which the planar conductive adhesive (Acf) 31 is placed on the surface is to be connected to the integrated circuit wafer on the surface, and the arrangement position of the magnetic contacts 21 corresponds to the Alignment position of the pins of the integrated circuit chip 丨; Align and press the at least one thermal head 5 on the integrated circuit chip 丨 so that the integrated circuit chip 1 is pressed to the surface of the flat display glass substrate 3 The integrated circuit chip on the desired position; and release the thermal head 5 and take out the flat 3 display substrate. During the pressing process of this embodiment, the conductive adhesive 3 丨 will exhibit flowable dynamics. At this time, the conductive particles in the conductive adhesive 31 will be attracted by the magnetic contacts 21, and the flow gathers in the area corresponding to the product. The position of the pin 1 1 of the body circuit chip 丨 to increase the conductivity between the pins 丨 丨 and the conductive adhesive 3 丨, reduce the probability of the conductive particles 31 of the conductive adhesive 31 in the vicinity of the pin 11 area, and avoid the conductive particles Escape pins 丨 丨 Short circuit is formed outside the area, and the number of conductive particles between each pin 1 1 is reduced to reduce the short circuit between these pins i 1, so the distance between pins u can be reduced to increase the number of pins丨 丨 the number. Finally, please refer to FIG. 3, which is a schematic diagram of the supporting base 6 according to the second embodiment of the present invention. In this second embodiment, the actual operating procedures are the same as those in the first embodiment, except that the support base 4 and the support block 2 in the first embodiment are integrated into a support base 6 in the second embodiment. A plurality of magnetic contacts 61 are provided on the surface corresponding to the pins of the integrated circuit chip (not shown), so as to play the same functions as the magnetic contacts of the support blocks 2. The first embodiment is the same. _ 9_ This paper size applies to China National Standard (CNS) A4 specifications (210X297 public copy Y --'---- installed ----------- order ------ (Please read the back first (Notes for filling in the columns on this page) 573337 A7 ____B7 V. Description of the invention (7) The integrated circuit chip fixing device of the present invention is pressed on the integrated circuit chip on the panel of the flat display device due to the anisotropic conductive adhesive The conductive particles inside are heated by the thermal head to become more fluid, and are attracted by the magnetic particles corresponding to the pins of the integrated circuit chip. The conductive particles will gather under the pins of the integrated circuit chip. Therefore, it is possible to avoid the conductive particles flowing in the local conductive film with the liquefied conductive film during compression, reducing the probability of conductive short circuit. And because the magnetic particles can attract the conductive particles under the pins, the distance between the pins can be reduced. , Increase the number of pins, and increase the number of input or output pins to achieve the effect of minimizing the pitch (F 丨 ne_Pitch). In addition, the integrated circuit chip fixing device of the present invention is attracted by magnetic particles because of the attraction of magnetic particles. Underneath the pins of the body circuit chip, a conductive adhesive with less conductive particles can be used to ensure the contact resistance of the contacts and reduce the cost of the ACF conductive adhesive. However, it should be noted that many of the above embodiments are just examples for convenience of illustration. However, the scope of the rights claimed by the present invention should be based on the scope of the patent application, rather than limited to the above-mentioned embodiments. _ 10 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm y Pack- --------- Order ------- Line— (Please read the notes on the back before filling in each page 襕)