KR20170038654A - Die bonder and manufacturing method of semiconductor device - Google Patents

Die bonder and manufacturing method of semiconductor device Download PDF

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KR20170038654A
KR20170038654A KR1020160106879A KR20160106879A KR20170038654A KR 20170038654 A KR20170038654 A KR 20170038654A KR 1020160106879 A KR1020160106879 A KR 1020160106879A KR 20160106879 A KR20160106879 A KR 20160106879A KR 20170038654 A KR20170038654 A KR 20170038654A
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South Korea
Prior art keywords
bonding
die
shaft
bonding head
inclined cam
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KR1020160106879A
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Korean (ko)
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KR101886923B1 (en
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류이찌 다까노
히로시 마끼
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파스포드 테크놀로지 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H01L21/4896—Mechanical treatment, e.g. cutting, bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Abstract

If a bonding head is subjected to a long stroke in a Y-axis direction, the accuracy of a Z-axis driving shaft cannot be increased. A die bonder includes a first driving shaft for moving the bonding head up and down in a first axis direction and a second driving shaft for moving the bonding head in a horizontal direction. The first driving shaft includes a servo motor, one ball screw rotated by the servo motor, a nut for receiving the ball screw, a first inclined cam installed in the nut, a second inclined cam installed in the nut to be separated from the first inclined cam at a preset distance, a first supporter which is connected to the first inclined cam, and a second supporter which is connected to the second inclined cam. Accordingly, the present invention can improve the precision of the driving shaft which moves the bonding head up and down.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a die bonder,

The present disclosure relates to a die bonder and is applicable to a die bonder having a die bond head that moves, for example, by a servo motor and a ball screw.

In the die bonder, the die is vacuum-adsorbed by the bonding head, and the die is raised at high speed, moved horizontally, and lowered to be mounted on the substrate. In this case, it is the elevation drive shaft (Z drive shaft) that raises and lowers, and the Y drive shaft that horizontally moves. The Z drive shaft is constituted by a drive motor and a ball screw provided in the vertical direction (Z direction) (for example, Japanese Patent Application Laid-Open No. 233578/1990 (patent document 1)).

Japanese Patent Application Laid-Open No. 2011-233578

In the mechanism of Patent Document 1, when the bonding head is subjected to long stroke in the Y-axis direction, the accuracy of the Z-axis drive shaft can not be increased.

The object of the present invention is to provide a die bonding technique capable of improving the precision of a drive shaft for lifting and lowering a bonding head.

Other tasks and novel features will become apparent from the description of the present specification and the accompanying drawings.

An outline of representative examples of the present disclosure will be briefly described below.

That is, the die bonder has a first drive shaft for moving the bonding head in the first axial direction and a second drive shaft for moving in the horizontal direction. The first drive shaft includes a servo motor, a ball screw rotated by the servo motor, a nut for receiving the ball screw, a first inclined cam provided on the nut, A first supporting member connected to the first inclined cam, and a second supporting member connected to the second inclined cam.

According to the die bonder, the precision of the drive shaft for lifting and lowering the bonding head can be improved.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic top view showing a configuration of a die bonder according to an embodiment; FIG.
Fig. 2 is an external perspective view showing the configuration of the die supply unit of Fig. 1; Fig.
3 is a schematic cross-sectional view showing the main part of the die supply portion of Fig.
Fig. 4 is a view for explaining a schematic configuration of the die bonder of Fig. 1 and its operation. Fig.
5 is a view for explaining the bonding head table of FIG.
6 is a side view showing a configuration of a ZY drive shaft of the bonding head table of FIG.
7 is a side view showing a configuration of a ZY drive shaft of a bonding head table according to Comparative Example 1. Fig.
8 is a side view showing a configuration of a ZY drive shaft of a bonding head table according to Comparative Example 2. Fig.
9 is a side view showing a configuration of a ZY drive shaft of a bonding head table according to a third comparative example.
10 is a schematic top view showing a configuration of a die bonder according to a modification.

There is a step of assembling a package by mounting a semiconductor chip (hereinafter simply referred to as a semiconductor chip) on a wiring board or a lead frame (hereinafter, simply referred to as a board) in a part of the manufacturing process of the semiconductor device, In part, there are a step of dividing a die from a semiconductor wafer (hereinafter simply referred to as a wafer) and a bonding step of mounting the divided die on a substrate. The manufacturing apparatus used in the bonding process is a die bonder.

The die bonder is a device for bonding (mounting and bonding) a die on a substrate or an already bonded die, using solder, gold plating, or resin as a bonding material. In a die bonder for bonding a die, for example, to a surface of a substrate, a die is picked up from a wafer by using a suction nozzle called a collet, and the die is carried on a substrate to give a pressing force, (Operation) for performing bonding is repeatedly performed. The collet has a suction hole, a suction port for sucking air and sucking and holding the die, and has the same size as the die.

The die bonder 10 according to the embodiment includes an intermediate stage BAS for loading a picked up die and a bonding head for bonding the die loaded on the intermediate stage BAS onto a substrate or a die already bonded to the substrate (BBH) for driving the bonding head, and a bonding head table (BHT) for driving the bonding head. The bonding head table BHT includes a first driving shaft 80 for moving the bonding head BBH in the first direction and a second driving shaft 70 for moving the bonding head BBH in the second direction, Respectively. The first drive shaft 80 includes a servo motor 84a, a single ball screw 84b rotated by the servo motor 84a, a nut 84d receiving the ball screw 84b, a nut 84d, A second inclined cam 84c provided on the nut 84d so as to be spaced apart from the first inclined cam by a predetermined distance and a second inclined cam 84c connected to the first inclined cam 84c, 1 support 85 and a second support 85 connected to the second slant cam 84c.

According to the embodiment, the accuracy of the first drive shaft can be increased.

Hereinafter, examples, comparative examples and modified examples will be described with reference to the drawings. In the following description, the same constituent elements are denoted by the same reference numerals, and repeated explanation may be omitted. In order to make the description more clear, the drawings are schematically shown in terms of width, thickness, shape, and the like of each part in comparison with the actual shape, but they are merely examples and do not limit the interpretation of the present invention.

[Example]

1 is a schematic top view of a die bonder according to an embodiment. The die bonder 10 includes the wafer feeding section 1, the pickup sections 2A and 2B, the alignment sections 3A and 3B, the bonding sections 4A and 4B, And a control device 8 (see Fig. 4). The wafer supply section 1 supplies a wafer ring 14 (see FIGS. 2 and 3) on which a die D to be mounted on a substrate P is mounted. The pick-up parts 2A and 2B pick up the dies D from the wafer supply part 1. The alignment portions 3A and 3B temporarily load the picked-up die D once. The bonding portions 4A and 4B pick up the dies D of the alignment portions 3A and 3B and bond them on the substrate P or on the die D already bonded. The carry section 5 conveys the substrate P to the mounting position. The control device 8 monitors and controls the operation of each part.

The wafer supply unit 1 includes a wafer cassette lifter WCL, a wafer correction chute WRA, a wafer ring holder (wafer support table) WRH, a die push-up unit WDE and a wafer recognition camera VSW. The wafer cassette lifter WCL moves the wafer cassettes in which the plurality of wafer rings 14 are stored up and down to the wafer transfer height. The wafer correcting chute WRA aligns the wafer ring 14 supplied from the wafer cassette lifter WCL. The wafer extractor (WRE) takes out the wafer ring 14 from the wafer cassette and houses it. The wafer ring holder WRH is moved in the X and Y directions by a driving means (not shown) to move the pick-up die D to the position of the die push-up unit WDE. The two-point broken line circle in Fig. 1 is a moving range of the wafer ring holder WRH. The die push-up unit WDE pushes up and peels from the wafer 11 mounted on the wafer tape (dicing tape) 16 in a die unit. The wafer recognition camera VSW picks up the die D of the wafer 11 supported by the wafer ring holder WRH and recognizes the position of the die D to be picked up.

Each of the pickup units 2A and 2B includes a pickup head BPH and a pickup head table BPT. The pick-up head BPH has a collet 22 (see Fig. 4) for sucking and holding the die D pushed up by the die push-up unit WDE at the front end, picks up the die D, (BAS). The pickup head table BPT moves the pickup head BPH in the Z direction, the X direction, and the Y direction. In the pick-up head BPH, it is also possible to add a function of rotating the die D in accordance with the angle of the die D. The pick-up is carried out based on the classification map showing the grades of the dies having different electrical characteristics of the wafers 11. The classification map is previously stored in the control device 8. [

Each of the alignment portions 3A and 3B includes a stage recognition camera VSA (see Fig. 4) for recognizing the intermediate stage BAS temporarily holding the die D and the die D on the intermediate stage BAS, Respectively. The die push-up unit WDE is located in the middle between the intermediate stage BAS of the alignment section 3A and the intermediate stage BAS of the alignment section 3B as seen in plan view and comprises a die push-up unit WDE, The intermediate stage BAS of the part 3A and the intermediate stage BAS of the alignment part 3B are arranged along the X direction.

Each of the bonding portions 4A and 4B includes a bonding head BBH and a collet 42 (see FIG. 4), a bonding head table BHT and a substrate recognition camera VSB (see FIG. 4). The bonding head BBH has the same structure as the pick-up head BPH and picks up the die D from the intermediate stage BAS and bonds to the substrate P that has been transported. The collet 42 is mounted on the tip of the bonding head BBH to hold the die D by suction. The bonding head table BHT moves the bonding head BBH in the Z direction, the X direction, and the Y direction. The substrate recognition camera VSB picks up a position recognition mark (not shown) of the transferred substrate P and recognizes the bonding position of the die D to be bonded.

With this configuration, the bonding head BBH corrects the pickup position / posture based on the image pickup data of the stage recognition camera VSA, picks up the die D from the intermediate stage BAS, (D) is bonded to the substrate (P) based on the imaging data of the substrate (VSB).

The transport section 5 includes a first transport lane 51 for transporting a magazine (five in Fig. 1) carrying a substrate P (18 in Fig. 1) to which the dies D are bonded in the X direction, And a second conveyance lane (52). The first conveyance lane 51 includes a first clean stage CS1, a first bonding stage BS1, and a second bonding stage BS2. 1, a magazine 91 is loaded on a first clean stage CS1, a magazine 92 is loaded on a first bonding stage BS1, and a magazine 93 is loaded on a second bonding stage BS2 have. The second conveyance lane 52 has a second clean stage CS2 and a third bonding stage BS3. In Fig. 1, the magazine 94 is mounted on the second clean stage CS2, and the magazine 95 is mounted on the third bonding stage BS3. In the pre-vision points PVP of the first clean stage CS1 and the second clean stage CS2, the recognition of the poor display of the substrate adhered to the substrate P and the cleaning for attracting the foreign substance on the substrate P are performed . Bonding is performed on the substrate P at the bonding points BP of the first bonding stage BS1, the second bonding stage BS2 and the third bonding stage BS3. A line connecting the intermediate stage BAS of the alignment section 3A, the bonding point BP of the first bonding stage BS1 and the bonding point BP of the third bonding stage BS3 is arranged along the Y direction The line connecting the intermediate stage BA of the alignment section 3B and the bonding point BP of the second bonding stage BS2 is arranged along the Y direction. The first conveyance lane 51 and the second conveyance lane 52 are respectively connected to the magazine loader IMH and the feeder chute FMT, the loader feeder FIG, the main feeder FMG1, the main feeder FMG2, (FMG3), an unloader feeder (FOG) and a magazine unloader (OMH). The magazine loader IMH moves the magazine in which the substrate P is stored up and down to the substrate transfer height so that the magazine is transferred when the substrate P is completely supplied by the pusher and the magazine And moved up and down to the substrate transport height. The feeder chute (FMT) opens and closes the substrate transfer section chute in accordance with the substrate width. The loader feeder (FIG) grips the supplied substrate P to the prevision point PVP. The main feeder FMG1 grips and feeds the substrate P gripped to the prevision point PVP until it is delivered to the main feeder FMG2. The main feeder FMG2 grips the substrate P until it receives the substrate P from the main feeder FMG1 and transfers it to the main feeder MFG3. The main feeder FMG3 receives the substrate P from the main feeder FMG2 and grips the substrate P to the unloading position. The unloader feeder FOG grips the substrate P gripped to the unloading position to the feeding position. The magazine unloader OMH moves the supplied empty magazine up and down to the substrate transfer height. When the magazine is filled with the transferred substrate, the magazine is transferred, and the empty magazine is moved up and down to the substrate transfer height.

Next, a detailed configuration of the wafer supply unit will be described with reference to Figs. 2 and 3. Fig. 2 is an external perspective view showing a main part of the wafer supply unit. 3 is a schematic cross-sectional view showing a main part of the wafer supply unit. A die attach film (DAF) 18 is attached to the back surface of the wafer 11, and a dicing tape 16 is attached to the back side of the wafer 11. The edge of the dicing tape 16 is attached to the wafer ring 14 and fixed to the expand ring 15 by being fitted thereto. That is, the wafer ring holder WRH includes an extender ring 15 holding the wafer ring 14, a die ring 14 held by the wafer ring 14 and having a plurality of dies D (wafers 11) And a support ring 17 for positioning the singe tape 16 horizontally. The wafer supply unit 1 has a die push-up unit WDE disposed inside the support ring 17 for pushing up the die D upward. The die push-up unit WDE is moved in the vertical direction by a driving mechanism (not shown), and the wafer ring holder WRH is moved in the horizontal direction. As described above, the adhesive for die bonding is changed from a liquid form to a film form along with the thinning of the die D, and the die attach film 18 is formed between the wafer 11 and the dicing tape 16 And a film-shaped adhesive material is adhered thereto. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Alternatively, the dicing tape 16 and the die attach film 18 may be integrated.

The wafer ring holder WRH lowers the expanding ring 15 holding the wafer ring 14 when the die D is pushed up. At this time, since the support ring 17 does not descend, the dicing tape 16 held on the wafer ring 14 is pulled out to enlarge the distance between the dies D, so that interference between the dies D · Prevent contact and make it easier for individual dies to be pushed apart. The die push-up unit WDE advances the peeling of the die D by pushing up the die D from below the die, and improves the pickup of the die D by the collet.

Fig. 4 is a schematic side view of the main part of the die bonder. Fig. The die bonder 10 has three bonding stages BS1, BS2 and BS3, which are described as bonding stages (BS) in Fig. The die bonder 10 mounts the die D picked up by the pick-up head BPH on the intermediate stage BAS once, picks up the loaded die D again with the bonding head BBH, And is mounted on the substrate P.

The die bonder 10 includes a wafer recognition camera VSW for recognizing the posture of the die D on the wafer 11 and a stage recognition camera for recognizing the posture of the die D loaded on the intermediate stage BAS VSA) and a substrate recognition camera (VSB) for recognizing the mounting position on the bonding stage (BS). In the present embodiment, it is necessary to perform the posture shift correction between the recognition cameras because the stage recognition camera (VSA) involved in the pickup by the bonding head (BBH) and the substrate (VSB).

The die bonder 10 further includes a swing drive device 25 provided in the intermediate stage BAS, an under vision camera CUV provided between the intermediate stage BAS and the bonding stage BS, A heating device 34 provided in a base station (BS), and a control device 8. The swiveling drive device 25 rotates the intermediate stage BAS on the plane parallel to the mounting scene having the mounting position to correct the rotation angle deviation or the like between the stage recognition camera VSA and the substrate recognition camera VSB. The under vision camera CUV observes the state of the die D on which the bonding head BBH is adsorbed while moving and the heating device 34 applies heat to the bonding stage BS).

The control device 8 has a CPU (Central Processor Unit) not shown, a memory for storing a control program, a memory for storing data, a control bus, and the like, and controls each element constituting the die bonder 10.

Hereinafter, the bonding head table BHT and the bonding head BBH of the bonding section 4A will be described. In addition, the bonding head table (first bonding head table) BHT and the bonding head (first bonding head) BBH of the bonding section 4A and the bonding head table ) BHT and the bonding head (second bonding head) BBH have the same construction. The second bonding head table may have a mirror-surface symmetrical configuration with the first bonding head table.

FIG. 5A is a side view for explaining the bonding head table of FIG. 1; FIG. FIG. 5B is a top view for explaining the bonding head table of FIG. 1; FIG. 6A is a side view showing the configuration of the ZY drive shaft of the bonding head table of FIG. 6 (B) is an arrow A of FIG. 6 (A).

The bonding head table BHT includes a ZY driving shaft 60 for moving the bonding head BBH upward in the Z direction and moving the bonding head BBH horizontally in the Y direction and an X drive shaft 60 for horizontally moving the bonding head BBH in the X direction, (Not shown). The ZY drive shaft 60 is connected to a Y drive shaft (second drive shaft) 70 that reciprocates the Y direction, that is, the bonding point BBH between the pickup position in the intermediate stage BAS and the bonding point BP in the bonding stage BS And a Z drive shaft (first drive shaft) 80 that lifts the die to pick up or bond the die from the intermediate stage BAS or to the substrate. The X drive shaft moves the entire ZY drive shaft 60 in the X direction, which is the direction in which the substrate P is transported. The Y drive shaft 70 is configured to drive the bonding head BBH with a linear motor and the Z drive shaft 80 drives the bonding head BBH by driving the ball screw with a servo motor. The X drive shaft may be configured to drive the ball screw by a servo motor, or may be driven by a linear motor. Here, let DY be the driving range of the Y driving shaft 70 (the moving range of the bonding head BBH in the Y direction), and set the driving range of the Z driving shaft 80 (moving range of the bonding head BBH in the Z direction) DZ, and the driving range of the X driving shaft (moving range of the bonding head BBH in the X direction) is DX, the relation of DY> DX> DZ is satisfied in the maximum driving range. The distance from the pick-up position in the intermediate stage BAS to the bonding point BP in the bonding stage BS1 is DA and the distance between the closest position and the farthest position of the bonding point BP is DB , DY = DA + DB, DB > DA. For example, in the operating range of normal operation, DX is 1 mm or less, DZ is 20 mm, DY is 180 to 280 mm (first conveyance lane), 500 to 600 mm (second conveyance lane), and DY> DZ> DX . In addition, the DY of this embodiment is larger than the DY (150 to 190 mm) in the case of one carrier lane and a substrate width of 100 mm. The maximum driving range of the X drive shaft is 30 mm.

6 (B), the ZY drive shaft 60 includes a Y drive shaft (second drive shaft) 70, a Z drive shaft (first drive shaft) 80, a Y drive shaft 70 A connecting portion 61 connecting the shaft movable portion 71 and the bonding head BBH, and a horizontal L-shaped supporting body 62 for supporting the whole. In order to facilitate understanding of the following description, the portion fixed to the support body 62 is an oblique line and a portion moving in unison with the Y-axis movable portion 71, the bonding head BBH, and the connecting portion 61 White. The support 62 also has an upper support 62a, a side support 62b and a triangular support 62c for supporting the upper support 62a and the side support 62b.

The Y drive shaft 70 has a U-shaped Y-axis fixing portion (second shaft fixing portion) having an upper and a lower fixed electromagnetic portion (not shown) in which a plurality of N-pole and S-pole electromagnets are alternately arranged in the Y- And a Y-axis movable portion (second axis moving portion) 72 having an N-pole and an S-pole electromagnet (not shown) in the arrangement direction and inserted in the concave portion in the C- A Y-axis linear guide 71 fixed to the connecting portion 61 and fixed to the connecting portion 61 to support the Y-axis movable portion 71; (73). The Y-axis fixing portion 72 is fixed to the upper support body 62a and the support body 63 so as to extend over substantially the entire Y-axis drive shaft 70 so that the Y-axis movable portion 71 can move within a predetermined range . The Y-axis linear guide 73 has two linear rails 73a extending in the Y direction and a linear slider 73b moving on the linear rails.

The Z drive shaft 80 includes a first Z axis movable part 81_1, a second Z axis movable part 81_2, a Z axis fixing part 82 fixed to the support body 63, a bonding head BBH, A Z-axis guide 83 provided between the pair of guide plates 61, and a drive unit 84. The Z-axis guide 83 has two rails 83a fixed to the connecting portion 61 and extending in the Z direction and a slider 83b fixed on the bonding head BBH and moving on the rail.

6A, the drive unit 84 includes a drive motor (servo motor) 84a fixed to the Z-axis fixing unit 82, a ball screw 84b extending in the Y direction, A first inclined cam 84c1, a second inclined cam 84c2, and a nut 84d. The first inclined cam 84c1 and the second inclined 84c2 are fixed to the nut 84d at a predetermined distance (at least a distance larger than the outer diameter of the nut 84d). The driving unit 84 rotates the circular motions with the Y direction of the driving motor 84a as the center of rotation by the ball screw 84b and the nut 84d in the Y axis direction of the first tilt cam 84c1 and the second tilt cam 84c (Horizontal motion). This linear motion in the Y direction is converted into a linear motion (up-and-down motion) in the Z direction of the first support body 85_1 and the first Z-axis movable portion 81_1 by the first inclined cam 84c1, and the second inclined cam 84c2 (Vertical movement) of the second support body 85_2 and the second Z-axis movable portion 81_2 in the Z direction. However, the first support 85_1 and the second support 85_2 of this embodiment are integrally formed.

One end of the first supporting body 85_1 is connected to the first inclined cam 84c1 and extends in the X direction. The upper portion of the first Z axis movable portion 81_1 is connected to the other end of the first support 85_1 and extends in the Z direction. The lower portion of the first Z axis movable part 81_1 is fixed to the Y direction guide 86. [ One end of the second support body 85_2 is connected to the second inclined cam 84c2 and extends in the X direction. The upper portion of the second Z axis movable portion 81_2 is connected to the other end of the second support member 85_2 and elongated in the Z direction. The lower portion of the second Z-axis movable portion 81_2 is fixed to the Y-direction guide 86. [

The Y-direction guide 86 moves up and down in accordance with the upward and downward movement of the first Z-axis movable portion 81_1 and the second Z-axis movable portion 81_2. As the length of the Y-direction guide 86 in the Y-direction becomes longer, the first Z-axis movable portion 81_1 and the second Z-axis movable portion 81_2 are extended by a predetermined distance, Maintain precision. The Y direction guide 86 has a rail 86a fixed to the first Z axis movable part 81_1 and the second Z axis movable part 81_2 and a slider 86b fixed to the bonding head BBH.

The bonding head BBH is connected to the Y-axis movable portion 71 via the connecting portion 61. When the Y-axis movable portion 71 moves in the Y-direction, the bonding head BBH also moves in the Y-direction . Then, the bonding head BBH is moved up and down at a predetermined position of the moving destination. The bonding head (BBH) is provided with a collet (42) for die adsorption at its tip end.

≪ Comparative Example 1 &

Fig. 7A is a side view in the X-direction showing the structure of the ZY drive shaft of the bonding head table according to Comparative Example 1. Fig. Fig. 7B is an arrow A in Fig. 7A.

The ZY drive shaft 60R includes a Y drive shaft 70R and a Z drive shaft 80R and a laterally L-shaped connecting portion 61R connecting the Y axis movable portion 71R and the bonding head BBH of the Y drive shaft 70R And a support 62 in the form of a horizontal L-letter shape for supporting all of these. The support 62 also has an upper support 62a, a side support 62b and a triangular support 62c for supporting the upper support 62a and the side support 62b.

The Y drive shaft 70R includes an inverted U-shaped Y-axis fixing portion 72R having left and right fixed electromagnets (not shown) in which a large number of N-pole and S-pole electromagnets are alternately arranged in the Y- A Y-axis movable portion 71R having an electromagnet (not shown) of at least one pair of N-poles and S-poles in the arrangement direction and inserted in the inverted U-shaped concave portion and moving in the concave portion, A Y-axis linear guide 73 which is fixed to the connecting portion 61R and is provided between the side supports 62b and a Y-axis linear guide 73 which is fixed to the upper support 62a, And a Y-axis linear guide 73R provided between the Y-axis linear guides 73R and 73R. The Y-axis fixing portion 72R is fixed to the support 63R fixed to the upper support 62a so as to extend over substantially the entire area of the Y drive shaft 70R so that the Y-axis movable portion 71R can move within a predetermined range . The Y-axis linear guide 73 has two linear rails 73a extending in the Y direction and a linear slider 73b moving on the linear rails. The Y-axis linear guide 73R has two linear rails 73aR extending in the Y direction and a linear slider 73bR moving on the linear rails.

The Z drive shaft 80R includes a first Z axis movable part 81_1R, a second Z axis movable part 81_2R, a Z axis fixing part 82R fixed to the Y axis fixing part 72R, a bonding head BBH A Z-axis guide 83, a first driving part 84_1R, and a second driving part 84_2R provided between the connecting part 61R and the connecting part 61R. The Z-axis guide 83 has two rails 83a fixed to the connecting portion 61R and extending in the Z direction and a slider 83b fixed on the bonding head BBH and moving on the rail.

The first driving portion 84_1R includes a first driving motor (servo motor) 84a1R fixed to the Z-axis fixing portion 82R, a first ball screw 84b1R extending in the Z direction, a first nut 84d1 . The circular motion in the Z direction of the first drive motor 84a1R as the center of rotation is transmitted to the first Z axis movable portion 81_1R in the Z direction by the first ball screw 84b1R and the first nut 84d1R Motion). The upper part of the first Z axis movable part 81_1R is connected to the first nut 84d1R and the lower part is fixed to the Y direction guide 86. [

The second driving portion 84_2R includes a second driving motor (servo motor) 84a2R fixed to the Z-axis fixing portion 82R, a second ball screw 84b2R extending in the Z direction, a first nut 84d2 . The circular motion in the Z direction of the second driving motor 84a2R as the center of rotation is performed by the second ball screw 84b2R and the second nut 84d2R in the Z direction of the second Z axis movable part 81_2R Motion). The upper part of the second Z axis movable part 81_2R is connected to the second nut 84d2R and the lower part is fixed to the Y direction guide 86. [

The Y-direction guide 86 moves up and down in accordance with the upward and downward movement of the first Z-axis movable portion 81_1R and the second Z-axis movable portion 81_2R. The Y direction guide 86 has a rail 86a connected to the first Z axis movable part 81_1R and the second Z axis movable part 81_2R and a slider 86b connected to the bonding head BBH.

In the first comparative example, there is a fear of synchronous operation of the first driver 84_1R and the second driver 84_2R.

≪ Comparative Example 2 &

8A is a side view in the X direction showing the structure of the ZY drive shaft of the bonding head table according to the second comparative example. 8 (B) is an arrow A of FIG. 8 (A).

The ZY driving shaft 60S includes a Y driving shaft 70S and a Z driving shaft 80S and a connecting portion 61 connecting the Y axis movable portion 71 and the bonding head BBH of the Y driving shaft 70S, Shaped support body 62 for supporting the L-shaped body. The Y drive shaft 70S has the same structure as the Y drive shaft 70 of the embodiment. That is, the ZY drive shaft 60S has the same configuration as the embodiment except for the Z drive shaft 80S.

The Z driving shaft 80S includes a first Z axis movable part 81_1, a second Z axis movable part 81_2, a Z axis fixing part 82 fixed to the supporting body 63, a bonding head BBH, A Z-axis guide 83, a first driving unit 84_1S, and a second driving unit 84_2S provided between the first and second driving units 61 and 62. [ The Z drive shaft 80S has the same configuration as the embodiment except for the first drive section 84_1S and the second drive section 84_2S.

The first driving part 84_1S includes a first driving motor (servo motor) 84a1 fixed to the Z-axis fixing part 82, a first ball screw 84b1S extending in the Y direction, A first nut 84d1S receiving the first nut 84d1S and a first inclined cam 84c1 fixed to the first nut 84d1S. The second driving portion 84_2S includes a second driving motor (servo motor) 84a2 fixed to the Z-axis fixing portion 82, a first ball screw 84b2S extending in the Y direction, A second nut 84d2S for receiving the first nut 84b2S and a second inclined cam 84c2 fixed to the second nut 84d2S.

The first drive unit 84_1S performs a circular motion in which the Y direction of the first drive motor 84a1 is the center of rotation by the first ball screw 84b1S and the first nut 84d1S to the first inclined cam 84c1 And the linear motion in the Y direction is converted by the first tilt cam 84c1 into the linear movement in the Z direction of the first support body 85_1 and the first Z axis movable part 81_1 Vertical motion). The second drive unit 84_2S is configured to move the circular motion with the Y direction of the second drive motor 84a2 as the center of rotation as the second ball screw 84b2S and the second nut 84d1S to the second inclined cam 84c2 And the linear motion in the Y direction is converted by the second tilt cam 84c2 into the linear motion in the Z direction of the second support body 85_2 and the second Z axis movable part 81_2 Vertical motion).

In Comparative Example 2, the height of the bonding head table can be made lower than that in Comparative Example 1, but there is a fear of synchronous operation of the two pairs of drivers 84S as in Comparative Example 1. [

≪ Comparative Example 3 &

9A is a side view in the X direction showing the structure of the ZY drive shaft of the bonding head table according to Comparative Example 3. Fig. 9 (B) is an arrow A in Fig. 9 (A).

The ZY drive shaft 60T includes a Y drive shaft 70T, a Z drive shaft 80T, a connecting portion 61 connecting the Y axis movable portion 71 and the bonding head BBH of the Y drive shaft 70T, Shaped support body 62 for supporting the L-shaped body. The Y drive shaft 70T has the same structure as the Y drive shaft 70 of the embodiment. That is, the ZY drive shaft 60T has the same configuration as that of the embodiment except for the Z drive shaft 80T.

The Z driving shaft 80T includes a first Z axis movable part 81_1, a second Z axis movable part 81_2, a Z axis fixing part 82 fixed to the supporting body 63, a bonding head BBH, A Z-axis guide 83 provided between the pair of guide plates 61, and a drive unit 84T. The Z drive shaft 80T has the same configuration as the embodiment except for the drive portion 84T.

The driving portion 84T includes a driving motor (servo motor) 84a fixed to the Z-axis fixing portion 82, a ball screw 84bT extending in the Y direction, a first nut A first nut 84d1S and a second nut 84d2S and a first inclined cam 84c1 fixed to the first nut 84d1S and a second inclined cam 84c2 fixed to the second nut 84d2S.

The driving unit 84T rotates the circular motion of the driving motor 84a with the Y direction as the center of rotation by the ball screw 84bT and the first nut 84d1S in the Y direction of the first oblique cam 84c1 And the linear motion in the Y direction is converted into a linear movement (vertical movement) in the Z direction between the support 85_1 and the first Z axis movable part 81_1 by the first inclined cam 84c1. The drive unit 84T rotates the circular motion of the drive motor 84a about the Y axis in the Y axis direction by the ball screw 84bT and the second nut 84d2S in the Y axis direction (Horizontal motion), and the linear motion in the Y direction is converted into a linear motion (up-and-down motion) in the Z direction of the second support body 85_2 and the second Z-axis movable portion 81_2 by the second inclined cam 84c2 do.

In Comparative Example 3, as in Comparative Example 2, the height of the bonding head table can be made lower than that of Comparative Example 1. However, there is a risk of occurrence of thread scuffing due to a change in distance between the two nuts.

<Modifications>

10 is a schematic top view showing a configuration of a die bonder according to a modification.

The die bonder 10U is roughly divided into a wafer supply section 1, pickup sections 2A and 2B, alignment sections 3A and 3B, bonding sections 4A and 4B, And a control device 8 are provided. The die bonder 10U has the same configuration as the embodiment except for the carry section 5U.

The carry section 5U has a transfer lane 51U for transferring a magazine (three in Fig. 10) carrying the substrate P (72 in Fig. 10) to which the die D is bonded in the X direction . The conveyance lane 51U includes a clean stage CSU, a first bonding stage BS1U, and a second bonding stage BS2U. In Fig. 10, the magazine 91U is mounted on the clean stage CSU, the magazine 92U is mounted on the first bonding stage BS1U, and the magazine 93U is mounted on the second bonding stage BS2U. The structure of the conveyance lane 51U is similar to that of the first conveyance lane of the embodiment except for the lane width. In addition, the conveyance lane 51U can carry a magazine capable of mounting a large number of substrates P in the Y direction (12 in Fig. 10).

In the die bonder according to the modified example, the bonding head table BHT and the bonding head BBH are configured in the same manner as in the embodiment, since the Y-axis long stroke of the bonding head is the same as in the embodiment.

When screws or nuts are arranged in two places as in the comparative example, problems are likely to occur due to differences in load and precision. On the other hand, in the present embodiment, one ball screw arranged in the Y direction and two inclined cams with one nut are operated to perform the Z-axis (vertical) operation. Thereby, two deviations can be eliminated, and the precision of the Z drive shaft can be increased.

Further, in the Z drive shaft by the linear motor, the weight and cost of the Z stator (magnet) are increased by the Y axis long stroke. On the other hand, in the present embodiment, since no linear motor is used for the Z drive shaft, the increase in weight and cost can be suppressed even by the Y-axis long stroke.

The invention made by the present inventors has been specifically described based on the embodiments, examples, comparative examples and modified examples. However, the present invention is not limited to the above-mentioned embodiments, examples, Of course.

For example, although two inclined cams are used in the embodiment, two revolving cams and link mechanisms may be operated by one ball screw.

10: die bonder
1: wafer supply section
D: Die
2A, 2B: Pickup section
3A, 3B: alignment part
BAS: Intermediate stage
4A and 4B:
BBH: Bonding head
42: Collet
BHT: bonding head table
60: ZY drive shaft
70: Y drive shaft
80: Z drive shaft
81_1: First Z axis movable part
81_2: Second Z-axis movable part
84:
84a: Servo motor
84b: Ball Screw
84c1: First inclined cam
84c2: 2nd inclined cam
84d: nut
85_1: first support
85_2: second support
90: X drive shaft
5:
BS: Bonding stage
P: substrate
8: Control device

Claims (19)

As die bonders,
An intermediate stage for loading the pickup die,
A bonding head for bonding the die loaded on the intermediate stage onto a substrate or a die already bonded to the substrate,
A bonding head table for driving the bonding head
And,
The bonding head table includes:
A first driving shaft for moving the bonding head in a first direction,
A second driving shaft for moving the bonding head in a horizontal direction in a second direction,
And,
The first drive shaft
A servo motor,
A ball screw rotated by the servomotor,
A nut for receiving the ball screw,
A first inclined cam provided on the nut,
A second inclined cam disposed on the nut at a predetermined distance from the first inclined cam,
A first first shaft movable part connected to the first inclined cam,
And a second first shaft movable part connected to the second slant cam
And a die bonder. The method according to claim 1,
Wherein the first drive shaft is configured to move a circular motion having the center of rotation as the center of rotation of the servo motor to the horizontal movement of the first inclined cam and the second inclined cam in the second direction by the ball screw and the nut And the horizontal movement in the second direction is transmitted to the first inclined cam and the second inclined cam respectively by upward and downward movement in the first direction of the first first shaft movable portion and the second first shaft movable portion, Converting, die bonder. 3. The method of claim 2,
The bonding head table also includes
A second direction guide connected to the bonding head,
A first support body having one end connected to the first inclined cam and the other end connected to the first first shaft movable part;
And the other end of which is connected to the second tilt cam;
And,
Wherein the first first shaft movable part and the second first shaft movable part fix the second direction guide and move the first shaft movable part and the second first shaft movable part in accordance with the up- And the second direction guide moves up and down. The method of claim 3,
The bonding head table also includes
A connection portion connecting the bonding head and the second drive shaft,
A rail fixed to the connection portion and extending in a first direction,
And a slider fixed on the bonding head to move on the rail,
And a die bonder. 5. The method of claim 4,
The second direction guide includes a rail connected to the first first movable shaft and the second movable shaft, and a slider connected to the bonding head,
And a die bonder. 6. The method of claim 5,
Wherein the distance between the nearest bonding point that is bondable from the die pick-up position of the intermediate stage and the farthest bonding point that can be bonded is longer than the distance from the die pick-up position to the closest bonding point that is bondable. The method according to claim 6,
And the second drive shaft drives the bonding head with a linear motor. 8. The method of claim 7,
The second drive shaft
A second shaft fixing part having a stationary magnet arranged in the second direction fixed to the support,
A second shaft movable part which is fixed to the connection part and inserted in the concave part of the second shaft fixed shaft and moves in the concave part,
And a die bonder. 9. The method of claim 8,
And the second drive shaft further comprises a second axial linear guide provided between the connecting portion and the support. 10. The method of claim 9,
The second linear linear guide includes a linear rail extending in a second direction,
A linear slider for moving the linear rail,
And a die bonder. A method of manufacturing a semiconductor device,
(a) preparing a cut wafer mounted on a dicing film,
(b) first and second pick heads for picking up a die pushed up from the wafer, first and second intermediate stages for loading the picked-up die, and first and second intermediate stages A first bonding head and a second bonding head for bonding the die to a substrate or a die already bonded to the substrate, and first and second bonding head tables for driving the first and second bonding heads, respectively, Each of the first and second bonding head tables includes a first drive shaft for driving the ball screw by a servo motor to move the first and second bonding heads in a first direction and a second drive shaft for driving the first and second bonding heads And a second drive shaft for moving the bonding head in a horizontal direction in a second direction, wherein the nearest bonding point that can be bonded from each of the die pick-up positions of the first and second intermediate stages, Its distance, the step of preparing a long, the die bonder than the distance to the nearest die-bonding point bondable from the pick-up position and,
(c) bonding the die in the wafer to the substrate or the die already bonded
And a step of forming the semiconductor device. 12. The method of claim 11,
The step (c)
(c1) alternately picking up dies in the wafer by the first pick-up head and the second pick-up head, respectively, and loading the dies in the first and second intermediate stages,
(c2) picking up the dies loaded in the first and second intermediate stages with the first and second bonding heads and bonding them onto the substrates or pre-bonded dies, respectively, mounted on the first and second bonding stages
And a step of forming the semiconductor device. 13. The method of claim 12,
Each of the first drive shafts of the first and second bonding head tables further includes:
A first inclined cam,
A second inclined cam,
A nut for receiving the ball screw,
A first first shaft movable part,
The second first axis moving part
And,
The circular motion of the servo motor with the second axial direction as the center of rotation is converted into the horizontal motion of the first inclined cam and the second inclined cam in the second direction by the ball screw and the nut,
The horizontal movement in the second direction is converted into the vertical movement of the first first movable portion in the first direction by the first inclined cam,
And the horizontal movement in the second direction is converted into the vertical movement in the first direction of the second first shaft movable part by the second inclined cam. 14. The method of claim 13,
Each of the first and second bonding head tables further includes:
A second direction guide connected to the bonding head,
A first support body having one end connected to the first inclined cam and the other end connected to the first first shaft movable part;
And the other end of which is connected to the second tilt cam;
And,
The first first shaft movable part and the second first shaft movable part fix the second direction guide,
And the second direction guide moves up and down in accordance with the upward and downward movement of the first first shaft movable portion and the second first shaft movable portion. The method according to claim 14,
Each of the first and second bonding head tables further includes:
A connecting portion connecting the first driving shaft and the second driving shaft,
A rail fixed to the connection portion and extending in the first direction,
And a slider fixed on the bonding head to move on the rail,
Wherein the semiconductor device is a semiconductor device. 16. The method of claim 15,
Wherein the second direction guide includes a rail connected to the second support and a slider connected to the first shaft movable part. 13. The method of claim 12,
The second drive shaft of each of the first and second bonding head tables,
A second shaft fixing part having a stationary magnet arranged in the second direction fixed to the support,
A second shaft movable part which is fixed to the connection part and inserted in the concave part of the second shaft fixed shaft and moves in the concave part,
Wherein the semiconductor device is a semiconductor device. 18. The method of claim 17,
And the second drive shaft further includes a second axial linear guide provided between the connecting portion and the support. 19. The method of claim 18,
The second linear linear guide includes a linear rail extending in a second direction,
A linear slider for moving the linear rail,
Wherein the semiconductor device is a semiconductor device.
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TWI613738B (en) 2018-02-01
TW201724287A (en) 2017-07-01
KR101886923B1 (en) 2018-08-08
CN106558524A (en) 2017-04-05
JP2017069418A (en) 2017-04-06

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