KR102150542B1 - Mounting device and manufacturing method of semiconductor device - Google Patents

Abstract

In the beam to which the mounting head is slidably mounted, warpage due to the weight of the beam and the mounting head occurs, and the mounting position alignment accuracy may be deteriorated.
The mounting apparatus includes a mount on which a mounting stage is mounted, a beam extending in a first direction so as to cross the mount and supported on the mount freely at both ends of the mount being moved in a second direction, respectively, in the first direction. It has a mounting head supported by the beam freely to move. The beam includes a correction member positioned inside the beam and extending in the first direction, and a bending correction means for pressing the correction member in the bending direction of the beam and generating a force in a direction opposite to the bending direction by a reaction force thereof. .

Description

A mounting device, and a manufacturing method of a semiconductor device TECHNICAL FIELD

The present disclosure relates to a mounting device, and is applicable to, for example, a mounting device having a beam.

BACKGROUND ART Conventionally, as one of the component mounting apparatuses, there is a component mounting machine that holds a component from a component supply unit to a fixed substrate, transports the component to the upper side of the substrate, and lowers the component and mounts it on the substrate. The mounting machine needs to accurately reproduce the position of the held component in the XY direction (in the horizontal plane). On the other hand, in order to improve the productivity of the mounting board, the speed from the part supplying part to the upper part of the board and positioning in the XY direction, or the speed of returning to the part supply part after mounting the part, etc. You also need to do it quickly.

Therefore, the component mounter includes a Y beam that is extended and fixed to the base in the Y-axis direction, an X-beam that is slidably mounted with respect to the Y-beam, and is slidable with respect to the X-beam. It has a structure with a head to be mounted. This makes it possible to convey parts accurately and at high speed (for example, Japanese Unexamined Patent Publication No. 2011-210895).

Japanese Patent Publication No. 2011-210895

In the mounting apparatus described in Patent Literature 1, warping due to the weight of the beam and the mounting head occurs in the beam to which the mounting head is slidably mounted, and the mounting position alignment accuracy is sometimes deteriorated.

An object of the present disclosure is to provide a mounting device that reduces the deflection of a beam.

Other problems and novel features will be revealed from the description of the present specification and the accompanying drawings.

A brief overview of representative ones of the present disclosure is as follows.

In other words, the mounting apparatus includes a mount on which a mounting stage is mounted, a beam extending in a first direction so as to cross the mount and supporting the mount on the mount freely at both ends of the mount moving in a second direction, and the first And a mounting head supported by the beam to be freely moved in a direction. The beam includes a correction member positioned inside the beam and extending in the first direction, and a bending correction means for pressing the correction member in the bending direction of the beam and generating a force in a direction opposite to the bending direction by a reaction force thereof. .

According to the mounting device, the bending of the beam can be reduced.

1 is a front view schematically showing a mounting device of a comparative example.
FIG. 2 is a top view schematically showing the mounting device of FIG. 1.
3 is a side view schematically showing the mounting device of FIG. 1.
4 is a diagram explaining the bending and twisting of the beam.
5 is a schematic front view illustrating a problem of the mounting device of FIG. 1.
6 is a schematic side view illustrating a problem of the mounting device of FIG. 1.
7 is a front view schematically showing a mounting device according to the first embodiment.
8 is a diagram schematically illustrating a Y beam according to the first embodiment.
Fig. 9 is a schematic front view for explaining adjustment of the feed amount of the feed screw according to the position of the mounting head.
10 is a diagram schematically showing a Y beam of a first modification.
11 is a diagram schematically showing a Y beam of a second modification.
12 is a diagram schematically showing a Y beam of a third modified example.
13 is a diagram schematically showing a Y beam according to a second embodiment.
14 is a perspective view schematically showing a mounting device of a fourth modified example.
15 is a perspective view schematically showing a Y beam of a fourth modification.
16 is a schematic diagram for explaining torsion correction of the Y beam of FIG. 15.
Fig. 17 is a schematic diagram explaining that the amount of torsion is different depending on the position of the mounting head.
Fig. 18 is a schematic diagram for explaining changing the mounting amount of an adjustment shim according to the position of the mounting head.
19 is a diagram schematically illustrating a Y beam of a fifth modification.
20 is a diagram schematically showing a Y beam of a sixth modification.
Fig. 21 is a top view schematically showing a flip chip bonder according to the first embodiment.
FIG. 22 is a view for explaining operations of the pickup flip head, transfer head, and bonding head when viewed from the direction of arrow A in FIG.
23 is a schematic cross-sectional view showing an essential part of the die supply portion of FIG. 21.
24 is a schematic side view showing a main part of the bonding portion of FIG. 21.
25 is a flowchart showing a bonding method performed in the flip chip bonder of the first embodiment.
26 is a top view schematically showing a flip chip bonder according to the second embodiment.

Hereinafter, comparative examples, embodiments, modifications, and examples will be described with reference to the drawings. However, in the following description, the same components are denoted by the same reference numerals, and repeated explanations may be omitted. In addition, in the drawings, in order to clarify the description, the width, thickness, shape, etc. of each part may be schematically expressed as compared to the actual mode, but it is only an example and does not limit the interpretation of the present invention.

<Comparative Example>

First, a mounting apparatus of a comparative example will be described with reference to FIGS. 1 to 3. 1 is a front view schematically showing a mounting device of a comparative example. FIG. 2 is a top view schematically showing the mounting apparatus of FIG. 1. 3 is a side view schematically showing the mounting apparatus of FIG. 1.

The mounting apparatus 100R of the comparative example conveys the component 300 to the upper side of the work 200 from the component supply unit (not shown), and attaches the conveyed component 300 to the work 200 (mounting ) Device. The mounting apparatus 100 includes a mount 110, a mounting stage 120 supported on the mount 110, an X support 131 provided on the mount 110, and an X support 131 A supported Y beam 140R, a mounting head 150 supported by the Y beam 140R, and a driving unit 160 for driving the mounting head 150 in the Y-axis and Z-axis directions are provided. In addition, the X-axis direction and the Y-axis direction are directions orthogonal to each other on the horizontal plane, and in this comparative example, as shown in FIG. 2, the direction in which the Y beam 140R is extended is the Y-axis direction (first direction), The direction is described as the X-axis direction (second direction). In addition, the Z-axis direction (third direction) is a vertical direction perpendicular to the XY plane.

The mounting head 150 is a device having a holding means for holding the component 300 freely detachably, and is mounted on the Y beam 140R freely reciprocating in the Y-axis direction.

In the case of this comparative example, three mounting heads 150 are provided, and each mounting head 150 is provided with a holding means 151 having a nozzle that holds the part 300 by vacuum adsorption. . In addition, the driving unit 160 may independently lift the mounting head 150 in the Z-axis direction. The mounting head 150 has a function of holding and conveying the component 300 to mount the component 300 on the work 200 adsorbed and fixed to the mounting stage 120.

The guide 132 provided on the X support 131 is a member for freely guiding the Y beam 140R in the X-axis direction by sliding. In this comparative example, two X supports 131 are arranged in parallel, and each of the X supports 131 is fixed to the mount 110 in a state extended in the X-axis direction. The X support 131 may be formed integrally with the mount 110.

As shown in Figs. 1 and 3, the slider 143 is mounted on the guide 132 so as to be freely moved in the X-axis direction. Further, each leg portion 142 of the Y beam 140R is mounted on each slider 143 of the two guides 132. That is, the main beam portion 141 of the Y beam 140R extends in the Y-axis direction so as to cross the mounting stage 120, and each leg portion 142 at both ends is mounted on the slider 143 and is mounted on the X support. Movement in the X-axis direction is freely supported by a guide 132 mounted on 131. In addition, since the bottom surface of the main beam part 141 and the bottom surface of the leg part 142 (the upper surface of the slider 143) are located on the same plane, the main beam part 141 is provided at a not very high position from the X support 131 have.

As shown in Fig. 3, the Y-beam 140R is a rod-shaped member, and is a member extending and disposed in the Y-axis direction. The shape of the XZ cross section of the Y beam 140R has a trapezoidal shape in which a square and a right triangle are combined.

The Y beam 140R is a member that guides the reciprocating movement of the mounting head 150 in the Y-axis direction, and when the reciprocating mounting head 150 vibrates, a defect such as dropping the held component 300 occurs. In addition, in order to transport the part 300 to an accurate position, it is necessary to suppress warpage as much as possible. Therefore, the Y beam 140R needs to have sufficient structural strength. On the other hand, the Y-beam 140R is a member that linearly reciprocates along the X support 131 together with the mounting head 150, and the lighter the weight, the higher the speed of the component 300 can be conveyed.

Next, the bending and twisting of the beam will be described with reference to FIG. 4. Fig. 4A is a diagram illustrating the bending of the beam, and Fig. 4B is a diagram showing a cross section of the beam. 5 is a schematic front view illustrating the problem of the mounting device of FIG. 1. 6 is a schematic side view illustrating the problem of the mounting device of FIG. 1.

As shown in Fig. 4A, the amount of deflection (d) increases in proportion to the cube of the length of the beam (L). Also, as the beam becomes longer, the beam tends to be twisted even with the same rigidity. In addition, the cross-sectional secondary moment contributing to the rigidity is proportional to the width (W) of the cross section of the beam shown in Fig. 4B and is proportional to the cube of the height (H).

It returns to the comparative example and demonstrates. 5, the main beam part 141 is bent due to the weight of the main beam part 141 and the mounting head 150 (first task). As a result, the mounting head 150 is inclined, affecting the mounting position (bond position) and the inclination of the component (eg, die).

In addition, as shown in Fig. 6, the main beam portion 141 is twisted due to the weight of the main beam portion 141 and the mounting head 150 (second task). As a result, the mounting head 150 is inclined, affecting the mounting position (bond position) and the inclination of the component (eg, die).

In order to suppress bending, it is necessary to increase the rigidity of the Y beam 140R in proportion to the bending, but simply increasing the width (W) or height (H) of the cross section of the beam increases the weight, so it is mounted while maintaining light weight and high rigidity. There is a need to improve the precision of the position. For example, in order to make the positional accuracy smaller than about several μm, the amount of deformation needs to be suppressed to about 1 μm, but when the length of the main beam part 141 is, for example, 500 mm or more, in particular, the length of 750 mm or more is It is difficult to suppress the amount of deformation caused by warpage or torsion.

<First embodiment>

Next, a first embodiment for solving the first problem will be described with reference to FIGS. 7 and 8. 7 is a front view schematically showing a mounting device according to the first embodiment. FIG. 8 is a diagram schematically showing a Y beam according to the first embodiment, FIG. 8A is a diagram schematically showing a state in which the Y beam is bent, and FIG. 8B is a Y It is a diagram schematically showing a state in which the deflection of the beam is corrected. In addition, the left side of each of Figs. 8A and 8B is a front view, and the right side is a side view, and the internal structure is partially seen and shown.

As shown in FIG. 7, the mounting device 100 of the first embodiment is the same as the mounting device 100R of the comparative example except for the Y beam 140.

As shown in FIG. 8, the Y beam 140 of the first embodiment extends from the inside of the one leg portion 142 to the inside of the other leg portion 142 via the inside of the main beam portion 141 The correction member 144 to be formed, the support member 145 for supporting the end of the correction member 144 at a predetermined height, the female screw member 146 provided in the central portion of the Y-axis direction of the correction member 144, and a female screw A male screw member 147 inserted into the member 146 and an actuator 148 for rotating the male screw member 147 are provided. The correction member 144, the support member 145, the female screw member 146, and the male screw member 147 are located inside the Y beam 140, and the actuator 148 is fixed on the main beam part 141. . The correction member 144 is, for example, a square column shape, is formed of a lightweight high rigidity material (for example, carbon fiber reinforced plastic (CFRP)) and has a function of a torsion bar. The actuator 148 is composed of a motor or the like.

The correction member 144 provided in the Y beam 140 is to correct the bending of the main beam part 141, and the male screw member 147 inserted into the female screw member 146 provided in the correction member 144 is an actuator 148 ), it is possible to press the central portion of the correction member 144 in the Y-axis direction in the vertical direction. By changing the feed amount (press amount) of the male screw member 147, the amount of pressing of the correction member 144 can be controlled.

As shown in Fig. 8A, when the main beam part 141 is bent, the correction member 144 is not bent. As shown in (B) of FIG. 8, by pressing the correction member 144, a force in the bending direction and the opposite direction (lifting direction) of the main beam part 141 is generated inside the main beam part 141 to prevent bending. You can cancel it. In this way, the inclination of the mounting head 150 can be kept flat.

Next, adjustment of the feed amount of the screw member according to the position of the mounting head will be described with reference to FIG. 9. Fig. 9(A) is a schematic front view when the mounting head is located near the center, and Fig. 9(B) is a schematic front view when the mounting head is located near the end. In FIG. 9, a partial perspective view is shown so that the internal structure is visible.

Depending on the position of the mounting head 150, the amount of deflection of the main beam part 141 is different, and when the mounting head 150 is located near the center of the Y-axis direction of the main beam part 141, the amount of deflection is large, and is located near the end. When doing, the amount of warpage is small. Therefore, as shown in (A) of FIG. 9, when the mounting head 150 is located near the center of the main beam part 141, the amount of transfer of the male screw member 147 is increased, and shown in (B) of FIG. As described above, when the mounting head 150 is positioned near the end of the main beam part 141, the amount of transfer of the male screw member 147 is reduced.

Since the male screw member 147 rotates by an actuator 148 such as a motor, the feed amount (press amount, rotation position) of the male screw member 147 is automatically controlled by controlling the actuator 148 by a control device (not shown). Can be adjusted with Therefore, it is possible to control the bending of the main beam part 141 by controlling the amount of pressing the correction member 144 according to the position of the mounting head 150.

Further, detection sensors such as a gyro sensor, a horizontal detection sensor, and a beam displacement sensor may be provided on the beam 140 and the mounting head 150, and the control device may control the actuator 148 based on the signal from the sensor. In this way, by controlling to return to the position of the sensor signal in a state in which there is no deflection, the state in which there is no deflection can always be maintained.

According to the first embodiment, the beam structure itself can be reinforced by bending deformation by a light weight (low rigidity) member without constituting a high rigidity (high weight), and deformation and vibration caused by the operation of the beam are minimized. You can stop at.

<Modified example of the first embodiment>

Hereinafter, some examples of typical modifications of the first embodiment will be given. In the description of the following modified example, it is assumed that the same reference numerals as those of the above-described embodiment can be used for portions having the same configuration and function as those described in the above-described embodiment. And for the description of such a part, it is assumed that the description in the above-described embodiment can be appropriately used within a range not technically contradictory. In addition, a part of the above-described embodiment and all or part of a plurality of modified examples may be appropriately and complexly applied within a range not technically contradictory.

In the first embodiment, an example of pressing the correction member 144 using the female screw member 146 and the male screw member 147 has been described, but the present invention is not limited thereto, and the correction member 144 incorporated in the Y beam 140 is described. A mechanism (bending correction means) capable of lifting the main beam part 141 by pressing it from the upper side of the main beam part 141 may be sufficient.

(1st modification)

In the first modification, a wedge-shaped flat cam member is provided on the correction member. The Y beam of the first modified example will be described with reference to FIG. 10. Fig. 10A is a diagram schematically showing a state in which the Y beam is bent, and Fig. 10B is a diagram schematically showing a state in which the deflection of the Y beam is corrected. In addition, FIG. 10 is a partial perspective view showing the internal structure.

As shown in Fig. 10, the Y beam 140A of the first modified example includes a straightening member 144 extending from one leg portion 142 to the other leg portion 142 via the main beam portion 141, and , A support member 145 for supporting the end of the correction member 144 at a predetermined height, a cylindrical rotating member 149 provided in the center of the Y-axis direction of the correction member 144, and a wedge-shaped flat cam member 14A, a receiving member 146A provided at an end portion of the flat cam member 14A, a transfer member 147A, and an actuator 148A for transferring the transfer member 147A are provided. The receiving member 146A, the conveying member 147A, the actuator 148A, and the flat cam member 14A are located on the calibration member 144, and the rotating member 149 is fixed to the upper part of the main beam part 141. have.

By transferring the transfer member 147A to the receiving member 146A provided on the correction member 144 by the actuator 148A, the flat cam member 14A moves under the rotation member 149 in the Y direction. Thereby, it is possible to press the correction member 144 in the vertical direction similarly to the first embodiment.

As shown in Fig. 10A, when the main beam part 141 is bent, the correction member 144 is not bent. As shown in (B) of FIG. 10, by pressing the correction member 144, bending is prevented by generating a force in the bending direction and the opposite direction (lifting direction) of the main beam part 141 inside the main beam part 141. You can cancel it.

According to the first modification, an actuator such as a motor, which is a heavy object, can be installed on the legs of both sides with little influence of bending.

(2nd modification)

In the second modification, a wedge member is provided on the Y beam. The Y beam of the second modified example will be described with reference to FIG. 11. FIG. 11 is a diagram schematically showing a Y beam of a second modified example, FIG. 11A is a diagram schematically showing a state in which the Y beam is bent, and FIG. 11B is It is a diagram schematically showing a state in which warpage is corrected. In addition, FIG. 11(A) and FIG. 11(B) are shown partially through perspective so that the internal structure is visible.

As shown in Fig. 11, the Y beam 140B of the second modified example includes a straightening member 144 extending from one leg portion 142 to the other leg portion 142 via the main beam portion 141, and , A support member 145 supporting the end of the correction member 144 at a predetermined height, a rotation member 149B provided in the central portion of the correction member 144 in the Y-axis direction, and a flat cam member 14AB, A receiving member 146B provided in the flat cam member 14AB, a conveying member 147B, and an actuator 148B for conveying the conveying member 147B are provided. The receiving member 146B, the conveying member 147B, the actuator 148B and the flat cam member 14AB are located on the main beam part 141, and the rotating member 149B is fixed on the correction member 144. .

By transferring the transfer member 147B to the receiving member 146B provided on the main beam part 141 by the actuator 148B, the flat cam member 14AB moves on the rotation member 149B in the Y direction. Thereby, it is possible to press the correction member 144 in the vertical direction similarly to the first embodiment.

As shown in Fig. 11A, when the main beam part 141 is bent, the correction member 144 is not bent. As shown in (B) of FIG. 11, by pressing the correction member 144, a force in the bending direction and the opposite direction (lifting direction) of the main beam part 141 is generated inside the main beam part 141 to prevent bending. You can cancel it.

(3rd modification)

In the third modification, an eccentric cam member, which is a disc having a shaft mounted at a position shifted from the center, is provided on the Y beam. The Y beam of the second modified example will be described with reference to FIG. 12. FIG. 12 is a diagram schematically showing a Y beam of a third modification, FIG. 12A is a diagram schematically showing a state in which the Y beam is bent, and FIG. 12B is a It is a diagram schematically showing a state in which the warpage has been corrected, and FIG. 12A is a front view, and FIG. 12B is a side view, and the internal structure is partially seen and shown.

As shown in Fig. 12, the Y beam 140C of the third modified example includes a straightening member 144 extending from one leg portion 142 to the other leg portion 142 via the main beam portion 141, and , A support member 145 supporting an end of the correction member 144 at a predetermined height, a rotation member 149C provided in the central portion of the correction member 144 in the Y-axis direction, and an eccentric cam member 14B, An actuator 148C for rotating the axis of the eccentric cam member 14B is provided. The actuator 148C and the eccentric cam member 14B are located on the main beam portion 141, and the rotating member 149C is fixed on the calibration member 144.

The eccentric cam member 14B rotates on the rotation member 149C by rotating the axis of the eccentric cam member 14B provided on the main beam part 141 by the actuator 148C. Thereby, it is possible to press the correction member 144 in the vertical direction similarly to the first embodiment.

As shown in FIG. 12, by pressing the correction member 144, it is possible to cancel the bending by generating a force in the bending direction and the opposite direction (lifting direction) of the main beam part 141 inside the main beam part 141. .

<2nd embodiment>

Next, a second embodiment for solving the second problem will be described with reference to FIG. 13. FIG. 13 is a diagram schematically showing a Y beam of a second embodiment, schematically showing a state in which the Y beam is bent, FIG. 13A is a front view, and FIG. 13B Is a side view, and is partially transparent so that the internal structure is visible.

As shown in Fig. 13, the Y beam 140D of the second embodiment is a straightening member 144D extending from one leg portion 142 to the other leg portion 142 via the main beam portion 141 Wow, a support member 145D for supporting the end of the correction member 144D at a predetermined height, a female screw member 146D provided in the center of the Y direction of the correction member 144, a male screw member 147, and a male screw. It has an actuator 148 that rotates the member 147. The correction member 144D, the support member 145D, the female screw member 146D, and the male screw member 147 are located inside the Y beam 140D, and the actuator 148 is fixed on the main beam part 141. . The correction member 144D is formed of a lightweight high-rigidity material (eg, Carbon Fiber Reinforced Plastic (CFRP)).

The straightening member 144D has a length in the inner direction (X direction) that is longer than that of the straightening member 144 of the first embodiment, and the female screw member 146D is also inside the female screw member 146 of the first embodiment (X-axis It is fixed on the forward side).

By rotating the male screw member 147 inserted into the female screw member 146D provided in the correction member 144D by the actuator 148, it is possible to press the correction member 144D in the vertical direction. By changing the feed amount (press amount) of the male screw member 147, the amount of pressing of the correction member 144D can be controlled.

As shown in (B) of FIG. 13, by pressing the correction member 144D, the main beam part 141 is twisted by generating a force in the twisting direction and the opposite direction (lifting direction) of the main beam part 141 Can be canceled. In other words, a torsional moment is generated by pressing the position offset from the center of rotation of the orthodontic member 144D by the drive mechanism for pressing the position offset from the center of the correction member 144D. With the weight of the correction member 144D and the mounting head 150, the correction member 144D is pressed in a direction in which a twisting component is removed to generate a twisting moment to cancel twisting.

As in the first embodiment, by controlling the amount of pressing the correction member 144D according to the position of the mounting head 150 in the Y direction, the twist of the main beam part 141 and the inclination of the mounting head 150 are kept flat. do. Since the amount of torsion varies according to the position of the mounting head 150, the amount of torsion moment to be canceled according to the position of the mounting head 150D is controlled by the amount of pressing.

Further, as in the first embodiment, an angle detection sensor such as a gyro sensor or a horizontal detection sensor is provided on the beam 140 and the mounting head 150, and the control device controls the actuator 148 based on the signal from the sensor. You may control it. Thereby, by controlling to return to the position of the sensor signal in a state where there is no distortion at all times, the state in which there is no distortion can always be maintained.

<Modified example of the second embodiment>

Hereinafter, several exemplary modifications of the second embodiment are illustrated. In the description of the following modified examples, parts having the same configuration and function as those described in the first and second embodiments are referenced the same as those in the first and second embodiments described above. It is assumed that can be used. And, as for the description of such a part, it is assumed that the description in the first embodiment and the second embodiment described above can be appropriately used within a range not technically contradictory. In addition, a part of the first and second embodiments described above, and all or part of a plurality of modified examples may be appropriately and complexly applied within a range not technically contradictory.

In the second embodiment, an example of pressing the correction member 144D using the female screw member 146D and the male screw member 147 has been described, but the present invention is not limited thereto, and the torsion moment is measured in the direction of removing the twisting component by weight. Any mechanism (torsion correcting means) capable of generating and canceling torsion may be sufficient.

(4th modified example)

The mounting apparatus of the fourth modification will be described with reference to Figs. 14 to 18. 14 is a perspective view schematically showing a mounting device of a fourth modified example. 15 is a perspective view schematically showing a Y beam of a fourth modification. FIG. 16 is a schematic diagram explaining torsion correction of the Y-beam of FIG. 15, FIG. 16(A) is a side view showing a state before twisting, and FIG. 16(B) is a view showing a twisted state. It is a side view, and FIG. 16(C) is a schematic side view showing a state in which torsion is corrected. Fig. 17 is a schematic diagram explaining that the amount of torsion is different depending on the position of the mounting head, Fig. 17(A) is a side view showing a case where the mounting head is located on the leg side, and Fig. 17(B) Is a side view showing a case where the mounting head is located between the leg side and the central side, and Fig. 17C is a side view showing a case where the mounting head is located at the center. Fig. 18 is a schematic diagram for explaining changing the mounting amount of the adjustment shim depending on the position of the mounting head, Fig. 18(A) is a side view showing a case where the mounting head is positioned on the leg side, and Fig. 18 (B) is a side view showing a case where the mounting head is located between the leg side and the center side, and Fig. 18C is a side view showing a case where the mounting head is located in the center.

The mounting device 100E of the fourth modified example differs from the mounting device 100 of the embodiment in the structure of the Y-beam, but the other structures are the same. The Y-beam 140E of the fourth modification is located below the bottom surface of the main beam part 141 and the bottom surface of the leg part 142 (the upper surface of the slider 143). Further, on the rear surface of the Y-beam 140E (on the surface opposite to the surface on which the mounting head 150 of the main beam portion 141E is mounted), a bending correction plate 14C and an adjustment shim (gap adjustment plate) 14D are attached. It is configured by mounting it interposed. The adjustment shim 14D is a thin steel plate that adjusts the gap, and, for example, several kinds of predetermined thicknesses are prepared and appropriately selected and incorporated.

As shown in Figs. 16A and 16B, the main beam part 141E is twisted by the weight of the mounting head 150 and the main beam part 141E. Therefore, as shown in Fig. 16C, an adjustment shim 14D for correcting the amount of twist is added to the lower side of the central portion in the Y-axis direction of the main beam portion 141E. That is, a plate having high torsional rigidity for correcting the warpage is mounted on the rear surface of the main beam part 141E in a form that twists in a direction opposite to the torsion due to its own weight of the mounting head 150, and in the reverse direction according to the amount of twist. By applying a twisting force to the main beam part 141E, the amount of twisting is canceled and reduced. In this way, even if the main beam portion 141E is reduced in weight and rigidity is reduced, the structure is compensated for, thereby making it possible to achieve both weight reduction and high accuracy.

As shown in Fig. 17A, when the mounting head 150 is located on the end side of the main beam part 141E (the leg part 142E side), it is close to the support part of the main beam part 141E and twists. It is difficult. As shown in Figs. 17B and 17C, as the mounting head 150 moves toward the center of the main beam part 141E, it is more likely to be twisted depending on the rigidity of the main beam part 141E.

Therefore, as shown in Fig. 18A, the adjustment shim 14D is not inserted at the end side of the main beam part 141E (the leg part 142E side), and Figs. 18B and 18 As shown in (C) of, the closer to the center portion of the main beam portion 141E, the more shims 14D for adjustment are inserted. Thereby, the reaction force of the warpage correction plate 14C increases as the center portion increases, and the amount of twist can be offset and reduced by applying a force twisting in the reverse direction according to the amount of twist to the main beam portion 141E.

(Fifth modification)

In the fifth modified example, a mechanism for generating a reaction force toward the bending correction plate is provided. The Y beam of the fifth modified example will be described with reference to FIG. 19. Fig. 19 is a diagram schematically showing a Y beam of a fifth modified example, Fig. 19A is a side view showing a case where the mounting head is positioned on the leg side, and Fig. 19B is a mounting head It is a side view showing the case where it is located between the leg part side and the center part side, and FIG. 19(C) is a side view showing the case where the mounting head is located in the center part.

As shown in Fig. 19A, the Y beam 140E of the fourth modified example includes a transfer member 147F and an actuator 148F for transferring the transfer member 147F in the main beam portion 141E. .

By transferring the transfer member 147F in the X-axis direction by the actuator 148A, the lower portion of the bending correction plate 14C can be pressed in the X direction.

As in the fourth modification, as shown in Fig. 17A, when the mounting head 150 is located on the end side (leg portion 142E side) of the main beam portion 141E, the main beam portion 141E It is close to the support of ), so it is difficult to twist. As shown in Figs. 17B and 17C, as the mounting head 150 moves toward the center of the main beam part 141E, it is more likely to be twisted depending on the rigidity of the main beam part 141E.

Therefore, as shown in (A) of Fig. 19, when the mounting head 150 is located on the end side of the main beam portion 141E, without pressing the transfer member 147F, Fig. 19 (B), Fig. As shown in (C) of 19, the closer the mounting head 150 is to the central portion of the main beam portion 141E, the greater the amount of pressing the transfer member 147F. Accordingly, as in the fourth modified example, the reaction force of the bending correction plate 14C increases as the central portion increases, and the amount of twist can be canceled or reduced by applying a twisting force in the reverse direction to the main beam portion 141E according to the amount of twisting. have.

In addition, by controlling the amount of pressing using a correction table or calculation according to the positioning position of the mounting head, it is possible to automatically correct the distortion of the beam. In this case, it becomes possible to follow changes in head weight due to change of head type, recombination, etc., and torsion correction becomes possible more easily.

(6th modified example)

An example of correcting the deflection of the beam in the first embodiment, and an example of correcting the distortion of the beam in the second embodiment have been described, but an example of correcting both the deflection of the beam and the distortion of the beam (6th modified example) is illustrated. Explain using 20. Fig. 20 is a diagram schematically showing a Y beam of a sixth modified example, Fig. 20 (A) is a side view schematically showing a structure in a case where the warp is large and the torsion is small, and Fig. 20 (B) Is a side view schematically showing the structure in the case where the warp is small and the torsion is large.

The Y beam 140G of the sixth modified example has the same structure as the Y beam 140D of the second embodiment, but the female screw member 146D and the male screw member so that the position to which the correction member 144D is pressed can be adjusted according to the actual condition. The positions of the 147 and the actuator 148 in the X-axis direction can be changed.

When the warp of the Y beam 140G is large and the torsion is small, as shown in Fig. 20A, the position at which the correction member 144D is pressed is adjusted near the center of the X-axis direction. By pressing the vicinity of the center of the correction member 144D, it is possible to reduce the warpage of the Y beam 140G by the same action as in the first embodiment, and the twist of the Y beam 140G by the action similar to the second embodiment. have.

When the warp of the Y-beam 140G is small and the torsion is large, as shown in Fig. 20B, the position at which the correction member 144D is pressed is adjusted to the outer vicinity of the X-axis direction. By pressing the end portion of the correction member 144D, it is possible to reduce the twist of the Y beam 140G with the same action as in the second embodiment, and the warp of the Y beam 140G with the same action as the first embodiment.

Therefore, both the deflection and twist of the Y beam 140G can be reduced by adjusting the position at which the correction member 144D is pressed between the center and the end.

Hereinafter, an example in which the Y beam of the above-described embodiment is applied to a flip chip bonder as an example of a mounting device will be described, but the present invention is not limited thereto, and a chip mounter (surface mounter) or a semiconductor for mounting a packaged semiconductor device or the like on a substrate It can also be applied to a die bonder that bonds a chip (die) to a substrate or the like. In addition, the flip chip bonder is used for manufacturing, for example, a fan-out wafer level package (FOWLP), which is a package in which a redistribution layer is formed in a large area exceeding the chip area.

Example 1

21 is a top view schematically showing a flip chip bonder according to the first embodiment. FIG. 22 is a view for explaining the operation of the pickup flip head, transfer head, and bonding head when viewed from the arrow A direction in FIG. 21.

The flip chip bonder 10 is largely divided into a die supply unit 1, a pickup unit 2, a transfer unit 8, an intermediate stage unit 3, a bonding unit 4, a transfer unit 5, and a substrate supply unit. It has 6K, the board|substrate carrying part 6H, and the control device 7 which monitors and controls the operation|movement of each part.

First, the die supply unit 1 supplies a die D to be mounted on a substrate P such as a substrate. The die supply unit 1 includes a wafer holder 12 for holding the divided wafer 11, a pushing unit 13 indicated by a dotted line for pushing up the die D from the wafer 11, and a wafer ring supply unit Has (18). The die supply unit 1 moves in the XY direction by a driving means (not shown), and moves the pick-up die D to the position of the pushing unit 13. The wafer ring supply unit 18 has a wafer cassette in which the wafer ring is accommodated, and sequentially supplies the wafer ring to the die supply unit 1 to exchange a new wafer ring. The die supply unit 1 moves the wafer ring to a pickup point so that a desired die can be picked up from the wafer ring. The wafer ring is a jig in which a wafer is fixed and attachable to the die supply unit 1.

The pickup section 2 has a pickup flip head 21 that picks up and reverses the die D, and respective driving sections (not shown) that lift, rotate, reverse, and move the collet 22 in the X direction. With this configuration, the pick-up flip head 21 picks up the die, rotates the pick-up flip head 21 180 degrees to invert the bump of the die D to face the lower surface, and transfer the die D to the transfer head 81. Try to turn over.

The transfer unit 8 receives the inverted die D from the pickup flip head 21 and mounts it on the intermediate stage 31. The transfer unit 8 includes a transfer head 81 including a collet 82 for adsorbing and holding a die D at the tip, similar to the pickup flip head 21, and a Y for moving the transfer head 81 in the Y direction. It has a driving part 83.

The intermediate stage portion 3 has an intermediate stage 31 for temporarily loading the die D and a stage recognition camera 34. The intermediate stage 31 is movable in the Y direction by a driving unit (not shown).

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds the die D onto the conveyed substrate P. The bonding unit 4 includes a bonding head 41 including a collet 42 for adsorbing and holding die D at the tip end, similar to the pickup flip head 21, and a Y for moving the bonding head 41 in the Y direction. A substrate recognition camera 44 for recognizing a bonding position by imaging a beam 43, a position recognition mark (not shown) of the substrate P, and an X supporter 45 are provided.

With such a configuration, the bonding head 41 picks up the die D from the intermediate stage 31, and bonds the die D to the substrate P based on the imaging data of the substrate recognition camera 44.

The transport unit 5 includes transport rails 51 and 52 through which the substrate P moves in the X direction. The conveyance rails 51 and 52 are provided in parallel. With such a configuration, the substrate P is taken out from the substrate supply unit 6K, and is moved to the bonding position along the transport rails 51 and 52, and then moved to the substrate carrying section 6H after bonding, and the substrate carrying section 6H Pass the substrate P to. While bonding the die D to the substrate P, the substrate supply unit 6K carries out the new substrate P, and waits on the transfer rails 51 and 52.

23 is a schematic cross-sectional view showing an essential part of the die supply section of FIG. 21. As shown in Fig. 23, the die supply unit 1 includes an expand ring 15 holding a wafer ring 14, a die held by the wafer ring 14, and a plurality of die D adhered thereto. It has a support ring 17 for horizontally positioning the sinking tape 16, and a pushing unit 13 for pushing up the die D upwards. In order to pick up a predetermined die D, the pushing unit 13 moves in the vertical direction by a drive mechanism not shown, and the die supply unit 1 moves in the horizontal direction.

A bonding unit will be described with reference to Figs. 7 and 24, referring to the embodiment. 24 is a schematic side view showing a main part of the bonding portion 4. Some components are shown in perspective. In addition, the side view of FIG. 24 corresponds to the front view of FIG. 7.

The bonding unit 4 includes a bonding stage BS (mounting stage 120) supported on the mount 53 (mounting frame 110), and an X support 451 provided in the vicinity of the transfer rails 51 and 52 (X support 131), a Y beam 43 (Y beam 140) supported on the X support 451, and a bonding head 41 supported by the Y beam 43 (mounting head 150 )) and a driving unit 46 (driving unit 160) for driving the bonding head 41 in the Y-axis direction and the Z-axis direction.

The bonding head 41 is a device having a collet 42 (holding and supporting means 151) for freely holding and detaching the die D (part 300), and the Y beam 43 is freely reciprocated in the Y-axis direction. ).

In the case of this embodiment, one bonding head 41 is provided, and the bonding head 41 is provided with a collet 42 that holds the die D by vacuum suction. In addition, the driving unit 46 may lift the bonding head 41 in the Z-axis direction. The bonding head 41 has a function of holding and transporting the die D picked up from the intermediate stage 31, and mounting the die D on the substrate P (work 200) that is suction-fixed to the bonding stage BS. .

The guide 132 provided on the X support 451 is a member for freely guiding the Y beam 43 by sliding in the X-axis direction. In the case of this embodiment, two X supports 451 are arranged in parallel, and each of the X supports 451 is fixed on the conveyance rails 52 and 53 in a state extending in the X-axis direction. The X support 451 may be formed integrally with the conveyance rails 52 and 53.

21 and 24, a slider 433 is mounted on the guide 452 so as to be freely moved in the X-axis direction. In addition, both ends of the Y beam 43 are mounted on each slider 433 of the two guides 452. That is, the Y beam 43 is extended in the Y-axis direction so as to cross the bonding stage BS, and both ends are mounted on the slider 433 and in the X-axis direction by the guide 452 mounted on the X support 451 The movement is supported freely. Further, since the bottom surface of the Y beam 43 and the upper surface of the slider 433 are located on the same surface, the Y beam 43 is provided at a position not so high from the X support 451.

The Y beam 43 of the first embodiment has a configuration basically the same as that of the Y beam 140 of the first embodiment. However, the Y beam 43 is extended to the right side larger than the right support stand 451 in the drawing. This is to enable the bonding head 41 to pick up the die D from the intermediate stage 31. In addition, when the bonding head 41 moves to the right of the support base 451, the bonding head 41 is raised so that the collet 42 is higher than the guide 452.

Next, a bonding method (a method of manufacturing a semiconductor device) performed in the flip chip bonder of the first embodiment will be described with reference to FIG. 25. 25 is a flowchart showing a bonding method performed in the flip chip bonder of the first embodiment.

Step S1: The control device 7 moves the wafer holding stand 12 so that the die D to be picked up is positioned directly above the pushing unit 13, and the peeling target die is pushed up by the unit 13 and the collet 22. To determine the location. The push-up unit 13 is moved so that the upper surface of the push-up unit 13 contacts the back surface of the dicing tape 16. At this time, the control device 7 adsorbs the dicing tape 16 on the upper surface of the pushing unit 13. The control device 7 lowers the collet 22 while vacuuming, lands on the die D to be peeled, and adsorbs the die D. The control device 7 lifts the collet 22 to peel the die D from the dicing tape 16. Thereby, the die D is picked up by the pick-up flip head 21.

Step S2: The control device 7 moves the pickup flip head 21.

Step S3: The control device 7 rotates the pickup flip head 21 180 degrees to invert the bump surface (surface) of the die D to face the lower surface, and reverse the bump (surface) of the die D to face the lower surface. , The die D is transferred to the transfer head 81 in a posture.

Step S4: The control device 7 picks up the die D from the collet 22 of the pickup flip head 21 by the collet 82 of the transfer head 81, and transfers the die D.

Step S5: The control device 7 reverses the pickup flip head 21 to make the suction surface of the collet 22 face down.

Step S6: Before or in parallel with step S5, the control device 7 moves the transfer head 81 to the intermediate stage 31.

Step S7: The control device 7 loads the die D held by the transfer head 81 onto the intermediate stage 31.

Step S8: The control device 7 moves the transfer head 81 to the delivery position of the die D.

Step S9: After or in parallel with step S8, the control device 7 moves the intermediate stage 31 to the transfer position with the bonding head 41.

Step SA: The control device 7 picks up the die D from the intermediate stage 31 by the collet of the bonding head 41, and transfers the die D.

Step SB: The control device 7 moves the intermediate stage 31 to the transfer position with the transfer head 81.

Step SC: The control device 7 moves the die D held by the collet 42 of the bonding head 41 onto the substrate P.

Step SD: The control device 7 loads the die D picked up from the intermediate stage 31 into the collet 42 of the bonding head 41 on the substrate P.

Step SE: The control device 7 moves the bonding head 41 to the transfer position with the intermediate stage 31.

Example 2

26 is a top view schematically showing a flip chip bonder according to the second embodiment.

The flip chip bonder 10A is largely divided, and the die supply unit 1, the pickup unit 2, the transfer units 8A and 8B, the intermediate stage unit 3, the bonding units 4A and 4B, and the transfer unit 5 ), a substrate supply unit 6K, a substrate carrying unit 6H, and a control device 7 for monitoring and controlling the operation of each unit.

The die supply unit 1 is the same as in the first embodiment. The pickup part 2 is the same as in the first embodiment, and the pickup flip head 21 picks up the die, rotates the pickup flip head 21 180 degrees to invert the bump of the die D to face the lower surface, and the die D To the transfer heads 81A and 81B.

The transfer units 8A and 8B receive the inverted die D from the pickup flip head 21 and mount it on the intermediate stages 31A and 31B. The transfer portions 8A and 8B include transfer heads 81A and 81B provided with collets 82A and 82B for adsorbing and holding die D at the tip, similar to the pickup flip head 21, and transfer heads 81A and 81B. ) To move in the X-axis direction (83A, 83B).

The intermediate stage portions 3A and 3B have intermediate stages 31A and 31B for temporarily loading die D, and stage recognition cameras 34A and 34B. The intermediate stages 31A and 31B can be moved in the Y-axis direction by a driving unit (not shown).

The bonding portions 4A and 4B pick up the die D from the intermediate stages 31A and 31B, and bond them onto the conveyed substrate P. The bonding portions 4A and 4B include bonding heads 41A and 41B including collets 42A and 42B for adsorbing and holding die D at the tip end, similar to the pickup flip head 21, and bonding heads 41A and 41B. Y beams 43A and 43B moving in the Y-axis direction, substrate recognition cameras 44A and 44B for recognizing the bonding position by photographing the position recognition mark (not shown) of the substrate P, and the X support 45 ).

With this configuration, the bonding heads 41A and 41B pick up the die D from the intermediate stages 31A and 31B, and bond the die D to the substrate P based on the imaging data of the substrate recognition cameras 44A and 44B. .

The transport unit 5 includes transport rails 51 and 52 through which the substrate P moves in the X direction. The conveyance rails 51 and 52 are provided in parallel. With such a configuration, the substrate P is taken out from the substrate supply unit 6K, and is moved to the bonding position along the transport rails 51 and 52, and then moved to the substrate carrying section 6H after bonding, and the substrate carrying section 6H Pass the substrate P to. While bonding the die D to the substrate P, the substrate supply unit 6K unloads the new substrate P and waits on the transfer rails 51 and 52.

The Y beam 43A is the same as the Y beam 43 of the first embodiment, and the Y beam 43B has a configuration symmetrical to the Y beam 43A.

As described above, the invention made by the present inventors has been described in detail based on the embodiments, modifications and examples, but the present invention is not limited to the above embodiments, modifications and examples, and can be variously changed.

For example, in the embodiment, an example of using a lightweight high-rigidity material (CFRP) for the correction member has been described, but is not limited thereto, and a shape memory alloy is used for the correction member, and the beam is warped or twisted when the shape returns. It is also possible to control the amount of warpage or the amount of twist by controlling the shape memory temperature and controlling the shape memory temperature. Further, a magnetic shape memory alloy may be used. In addition, bimetal may be used so that the reaction force can be adjusted linearly with temperature.

Further, in the first and second embodiments, an angle detection sensor such as a gyro sensor or a horizontal detection sensor is provided on the beam 140 and the mounting head 150, and the actuator 148 is based on the signal from the sensor. Although an example of controlling is described, it may be as follows. The sensor output signal that was sampled when operated by the mounting operation program of the product to be mounted in advance is stored in the memory of the control device, and the correlation between the sensor signal output stored in the memory and the actuator output for correcting warpage or twisting It is calculated in advance and stored in the memory unit. Control for canceling warping or twisting based on the stored correlation and the sensor signal may be performed according to a program for each mounted product (recipe: operation sequence for each product) to eliminate warping or twisting with a high response.

In addition, in Examples 1 and 2, an example using the Y beam of the first embodiment is described, but the present invention is not limited thereto, and any one of the second embodiment, the first to sixth modifications, or a combined Y beam is used. You can use it.

In the first and second embodiments, an example in which one bonding head (mounting head) is used is described, but the present invention is not limited thereto, and a plurality of bonding heads may be used as in the embodiment.

In addition, in Examples 1 and 2, an example in which a reversing mechanism is provided in the pickup flip head, a die is received from the pickup flip head by the transfer head, is loaded onto the intermediate stage, and the intermediate stage is moved, but is not limited thereto. The picked-up die D may be placed on a stage unit capable of rotating the front and back of the die, and the stage unit may be moved.

100: mounting device
110: trestle
120: mounting stage
131: X support
132: guide
140: Y beam
141: main beam part
142: leg
143: slider
150: mounting head
160: drive unit
200: work
300: parts

Claims (22)

A mount on which the mounting stage is mounted,
A beam extended in a first direction so as to cross the mount and supported on the mount freely at both ends thereof being free to move in a second direction;
Mounting head supported by the beam freely to move in the first direction
And,
The beam is provided with a correction member positioned inside the beam and extending in the first direction, and a bending correction means for pressing the correction member in the bending direction of the beam and generating a force in a direction opposite to the bending direction by a reaction force thereof. and,
The bending correction means, a mounting apparatus for controlling an amount of pressing the correction member according to the position of the mounting head. delete The method of claim 1,
The deflection correction means is capable of pressing the correction member in the bending direction by a rotational motion of the screw member, so that the amount of pressing the correction member can be changed. The method of claim 3,
The warpage correction means,
A male screw member extending in the bending direction,
An actuator that is a center of the beam in the first direction and is fixed on the beam to rotate the male screw member,
A female screw member fixed to the correction member fixed inside the beam and into which the male screw member is inserted
And,
The actuator is capable of pressing the correction member in the bending direction by rotating the male screw member, so that the amount of pressing the correction member can be changed. The method of claim 1,
The bending correction means is capable of pressing the straightening member in the bending direction by a movement motion of the wedge-shaped flat cam member in the first direction, and is capable of changing an amount of pressing the straightening member. The method of claim 5,
The warpage correction means,
A receiving member connected to the flat cam member provided on the correction member,
A transfer member extending in the first direction,
An actuator that is an end of the calibration member in the first direction and is fixed on the calibration member, and moves the transfer member in the first direction,
A rotating member that is a center of the beam in the first direction and is fixed above the correction member, and abuts the flat cam member
And,
The actuator is capable of pressing the correction member in the bending direction by moving the transfer member, so that the amount of pressing the correction member can be changed. The method of claim 5,
The warpage correction means,
A receiving member connected to the flat cam member provided on the beam,
A transfer member extending in the first direction,
An actuator that is an end of the beam in the first direction and is fixed on the beam, and moves the transfer member in the first direction,
A rotation member that is a center of the calibration member in the first direction and is fixed on the calibration member, and abuts the flat cam member
And,
The actuator is capable of pressing the correction member in the bending direction by moving the transfer member, so that the amount of pressing the correction member can be changed. The method of claim 1,
The deflection correction means is capable of pressing the correction member in the bending direction by a rotational motion of an eccentric cam member, so that the amount of pressing the correction member can be changed. The method of claim 8,
The warpage correction means,
An actuator that is a center of the beam in the first direction and is fixed on the beam, and rotates an axis of the eccentric cam member provided on the beam,
A rotating member that is a center of the correction member in the first direction and is fixed on the correction member, and abuts the eccentric cam member
And,
The actuator is capable of pressing the correction member in the bending direction by rotating the eccentric cam member, so that the amount of pressing the correction member can be changed. A mount on which the mounting stage is mounted,
A beam extended in a first direction so as to cross the mount and supported on the mount freely at both ends thereof being free to move in a second direction;
Mounting head supported by the beam freely to move in the first direction
And,
The beam is provided with a straightening member extending in the first direction, and a torsion straightening means for generating a force in a direction opposite to the twisting direction in the straightening member at a position shifted from the torsional rotation center of the beam. The method of claim 10,
A mounting device for controlling the force in the twisting direction and the reverse direction according to the position of the mounting head. The method of claim 11,
The correction member is located inside the beam,
The torsion correcting means is capable of pressing the position shifted from the torsional rotation center of the correcting member in a downward direction by a rotational motion of the screw member, and is capable of changing the amount of pressing the correcting member. The method of claim 12,
The torsion correction means,
A male screw member extending in the downward direction,
An actuator that is fixed on the beam at a center of the first direction of the beam and a position shifted from the torsional rotation center to rotate the male screw member;
A female screw member fixed to the correction member fixed inside the beam and into which the male screw member is inserted
And,
The actuator is capable of pressing the straightening member in the downward direction by rotating the male screw member, so that the amount of pressing the straightening member can be changed. The method of claim 11,
The correction member is a plate mounted on a side surface of the beam opposite to the mounting head,
The torsion correcting means provides a gap at a lower side between the beam and the correcting member, and is capable of changing the amount of the gap. The method of claim 14,
The gap is formed by a shim, and the torsion direction and the reverse force are adjusted according to the position and number of shims. The method of claim 14,
The torsion correcting means has a conveying member in contact with the correcting member and an actuator that conveys the conveying member, and adjusts the force in the twisting direction and the reverse direction according to the conveying amount of the conveying member. The method of claim 11,
The beam further comprises a bending correction means for pressing the correction member in the bending direction of the beam and generating a force in a direction opposite to the bending direction by a reaction force thereof. The method of claim 17,
The warpage correction means and the torsion correction means are common means,
A male screw member extending in a downward direction,
An actuator that is fixed on the beam at a center of the first direction of the beam and a position shifted from the torsional rotation center to rotate the male screw member;
A female screw member fixed to the correction member fixed inside the beam and into which the male screw member is inserted
And,
The actuator is capable of pressing the straightening member in the downward direction by rotating the male screw member, so that the amount of pressing the straightening member can be changed. The method according to any one of claims 4, 6, 7, 9, 13 and 18,
Further comprising a control device,
The beam and the mounting head each have a gyro sensor or a horizontal detection sensor or a displacement sensor of the beam,
The control device controls the actuator based on a sensor output signal from the gyro sensor, the horizontal detection sensor, or the displacement sensor of the beam. The method of claim 19,
The control device,
Stores the correlation between the pre-sensor output signal from the gyro sensor, the horizontal detection sensor, or the displacement sensor of the beam, sampled when operated with the mounting operation program of the product to be mounted, and the actuator output for correcting warpage or twist. Having a storage unit,
A mounting device that controls the actuator based on the sensor output signal and the correlation. The method according to any one of claims 1 and 3 to 18,
Wherein the mounting head is picked up from a die supply and picks up an inverted die to load the die on a substrate on the mounting stage. A step of preparing the mounting device according to any one of claims 1 and 3 to 18, and
A process of preparing a wafer ring for holding the divided wafers, and
The process of preparing the substrate,
A step of picking up a die from the wafer, and
A step of inverting the picked up die;
The process of picking up the inverted die by the mounting head and loading it onto the substrate
A method for manufacturing a semiconductor device comprising a.

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