TW201936044A - Mounting device and method for manufacturing semiconductor device capable of preventing poor positioning accuracy of a mounting device - Google Patents

Abstract

An object of the present invention is to solve the problem that a beam to which a mounting head is slidably mounted is bent due to the weight of the beam and the mounting head, resulting in poor positioning accuracy of the mounting position. The solution is to provide a mounting device comprising a mount on which a mounting rack is mounted; a beam extending across the mount in a first direction and having two ends freely and movably supported on the mount in a second direction; and a mounting head freely and movably supported on the beam in the first direction. The beam comprises a correction member located inside the beam and extending in the first direction, and a bending correction means for pushing the correction member in the bending direction of the beam so that a force in a direction opposite to the bending direction can be generated by means of the opposing force.

Description

Mounting device and manufacturing method of semiconductor device

This description is about a mounting device, for example, it can be applied to a mounting device provided with a beam.

Conventionally, as one of the component mounting devices, there is a component mounting machine that holds a component from a component supply unit with respect to a fixed substrate, transports the component above the substrate, and lowers the component and mounts the component on the substrate. It is necessary for this mounting machine to accurately reproduce the position of the held components in the XY direction (in the horizontal plane). On the other hand, in order to improve the productivity of the mounting substrate, there are also cases where components are moved from the component supply unit to the substrate, and the speed in the XY direction to the positioning is accelerated as much as possible, or after the components are installed, they are returned to the component supply unit. Necessity of speed etc.

To this end, the component mounting machine includes a Y beam extending and fixed to the substrate in the Y-axis direction, an X beam arranged to extend in the X-axis direction that can be slidably mounted with respect to the Y beam, and an X beam that can be disposed relative to the X beam. Structure of the slide-mounted mounting head. Thereby, a component can be conveyed accurately and at high speed (for example, Japanese Patent Laid-Open No. 2011-210895).

[Prior technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2011-210895

[Problems to be Solved by the Invention]

In the mounting device described in Patent Document 1, a beam caused by the weight of the beam and the mounting head may be bent on the beam on which the mounting head is slidably mounted, resulting in poor positioning accuracy of the mounting position.
The subject of this description is to provide a mounting device capable of reducing the bending of a beam.
Other problems and novel features will be made clear from the description of this specification and the accompanying drawings.

[Means for solving problems]

The brief description of the representative in this description is as follows.
That is, the mounting device includes: a mounting platform on which a mounting frame is mounted; a beam that is supported on the mounting platform and extends across the mounting platform in a first direction and has both ends freely moved in the second direction; and toward the first The mounting head is supported movably in the direction of the beam. The beam includes a correction member located in the beam and extending in the first direction, and a bend that presses the correction member toward a bending direction of the beam to generate a force in the bending direction and an opposite direction by a reverse force thereof. Means of correction.

[Inventive effect]

With the above mounting device, the bending of the beam can be reduced.

Hereinafter, a comparative example, an embodiment, a modification, and an Example are demonstrated using figure. However, in the following description, the same constituent elements are assigned the same reference numerals, and redundant descriptions are omitted. In addition, in order to make the description clearer, the width, thickness, and shape of each part may be represented by patterns in comparison with the actual situation. However, this is only an example, and the explanation of the present invention is not limited thereto.

＜ Comparative example ＞
First, the mounting device of the comparative example will be described using FIGS. 1 to 3. Fig. 1 is a front view schematically showing a mounting device of a comparative example. Fig. 2 is a top view schematically showing the mounting device of Fig. 1; Fig. 3 is a side view schematically showing the mounting device of Fig. 1;

The mounting device 100R of the comparative example is a device that transfers the component 300 from the component supply unit (not shown) above the workpiece 200, and mounts (installs) the transferred component 300 on the workpiece 200. The mounting device 100 includes: a gantry 110; a mounting bracket 120 supported on the gantry 110; an X support base 131 provided on the gantry 110; a Y beam 140R supported on the X support base 131; and a mounting head supported on the Y beam 140R 150; and a driving section 160 that drives the mounting head 150 in the Y-axis direction and the Z-axis direction. In addition, the X-axis direction and the Y-axis direction are directions orthogonal to each other on a horizontal plane. In this comparative example, as shown in FIG. 2, the direction in which the Y beam 140R extends is the Y-axis direction (first direction) so as to be orthogonal to this. The description will be given with the X-axis direction (second direction). The Z-axis direction (third direction) is a vertical direction perpendicular to the XY plane.

The mounting head 150 is a device having a holding means for freely holding the component 300, and is mounted on the Y beam 140R so as to freely move back and forth in the Y-axis direction.

In the case of this comparative example, three mounting heads 150 are provided, and each mounting head 150 is provided with the holding | maintenance means 151 of the nozzle which holds the component 300 by vacuum adsorption. In addition, the driving unit 160 can individually raise and lower the mounting head 150 in the Z-axis direction. The mounting head 150 has a function of holding and carrying the component 300 and mounting the component 300 on the workpiece 200 that is suction-fixed to the mounting frame 120.

The guide 132 provided on the X support table 131 is a member that guides the Y beam 140R to slide freely in the X-axis direction. In the present comparative example, two X support bases 131 are arranged in parallel, and each X support base 131 is fixed to the base 110 in a state extending in the X-axis direction. The X support stand 131 may be formed integrally with the stand 110.

As shown in FIGS. 1 and 3, a slider 143 that is freely movable in the X-axis direction is attached to the guide 132. Further, on each of the sliders 143 of the two guides 132, each leg portion 142 of the Y beam 140R is attached. That is, the main beam portion 141 of the Y beam 140R extends across the mounting frame 120 and extends in the Y-axis direction. Each leg portion 142 at both ends is attached to the slider 143 and is freely provided by the guide member 132 attached to the X support base 131. It is movably supported in the X-axis direction. In addition, since the bottom surface of the main beam portion 141 and the bottom surface of the leg portion 142 (the upper surface of the slider 143) are located on the same surface, the main beam portion 141 is provided at a position not high from the X support base 131.

As shown in FIG. 3, the Y-beam 140R is a rod-shaped member, and is a member arranged to extend in the Y-axis direction. The shape of the XZ cross section of the Y beam 140R is a ladder shape having a rectangular shape and a right triangle shape.

The Y beam 140R is a member that guides the mounting head 150 to move back and forth in the Y-axis direction. When the mounting head 150 that moves back and forth vibrates, problems such as dropping the held component 300 may occur, and in order to carry the component 300 to the correct position, It is necessary to suppress bending and the like as much as possible. Therefore, it is necessary for the Y beam 140R to have sufficient structural strength. On the other hand, the Y beam 140R is a member that moves back and forth in a straight line along the X support table 131 together with the mounting head 150, and the lighter the weight, the higher the speed at which the component 300 can be transported.

Next, the bending and twisting of the beam will be described using FIG. 4. FIG. 4 (A) is a diagram illustrating the bending of the beam, and FIG. 4 (B) is a diagram illustrating a cross section of the beam. Fig. 5 is a schematic front view illustrating the problem of the mounting device of Fig. 1. Fig. 6 is a schematic side view illustrating the problem of the mounting device of Fig. 1.

As shown in FIG. 4 (A), the amount of bending (d) increases in proportion to the third power of the beam length (L). Furthermore, when the beam becomes longer, it becomes easy to twist even if the beam has the same rigidity. The quadratic moment of the section that imparts rigidity is proportional to the width (W) of the beam section shown in FIG. 4 (B) and proportional to the cube of the height (H).

Back to the comparative example. As shown in FIG. 5, the weight of the main beam portion 141 and the mounting head 150 causes the main beam portion 141 to bend (first problem). As a result, tilting the mounting head 150 affects the tilting of the mounting position (adhesion position) and components (for example, wafers).

As shown in FIG. 6, the main beam portion 141 is twisted due to the weight of the main beam portion 141 and the mounting head 150 (second problem). As a result, tilting the mounting head 150 affects the tilting of the mounting position (adhesion position) and components (for example, wafers).

In order to suppress the bending, it is necessary to increase the rigidity of the Y beam 140R in proportion to the bending. However, simply increasing the width (W) or height (H) of the cross section of the beam will increase the weight. Therefore, while maintaining light weight, Necessary for high rigidity and improved accuracy of installation position. For example, in order to reduce the positional accuracy to less than several μm, it is necessary to suppress the amount of deformation to about 1 μm. However, when the length of the main beam portion 141 is, for example, 500 mm or more, especially the length of 750 mm or more, the amount of deformation caused by bending or twisting due to its own weight is required. Difficulty of suppression.

<First Embodiment>
Next, a first embodiment for solving the above-mentioned first problem will be described using FIGS. 7 and 8. Fig. 7 is a front view schematically showing the mounting apparatus of the first embodiment. Fig. 8 is a diagram schematically showing a Y beam of the first embodiment, Fig. 8 (A) is a diagram schematically showing a state in which the Y beam is bent, and Fig. 8 (B) is a diagram schematically showing a state in which the bending of the Y beam is corrected Illustration. 8 (A) and 8 (B) are each a front view on the left side and a side view on the right side, and a part of the internal structure is seen through perspective.

As shown in FIG. 7, the mounting device 100 according to the first embodiment is the same as the mounting device 100R of the comparative example except for the Y beam 140.

As shown in FIG. 8, the Y beam 140 of the first embodiment includes: a correction member 144 extending from the inside of one leg portion 142 through the inside of the main beam portion 141 to the inside of the other leg portion 142; A support member 145 that highly supports the end of the correction member 144; an internally threaded member 146 provided at a center portion of the correction member 144 in the Y-axis direction; an externally threaded member 147 inserted into the internally threaded member 146; Actuator 148. The correction member 144, the support member 145, the internally threaded member 146, and the externally threaded member 147 are positioned inside the Y beam 140, and the actuator 148 is fixed on the main beam portion 141. The correction member 144 is, for example, a quadrangular prism, and is formed of a lightweight and highly rigid raw material (for example, Carbon Fiber Reinforced Plastic (CFRP)), and has a torsion bar function. The actuator 148 is a motor or the like.

The correction member 144 provided in the Y beam 140 is capable of correcting the bending of the main beam portion 141, and the actuator 148 is rotatably inserted into the externally threaded member 147 of the internally threaded member 146 provided in the correction member 144, thereby allowing the correction member to be corrected. The central part of the Y-axis direction of 144 is pushed in the vertical direction. Changing the feed amount (pressing amount) of the externally threaded member 147 can control the pressing amount of the correction member 144.

As shown in FIG. 8 (A), in a state where the main beam portion 141 is bent, the correction member 144 is not bent. As shown in FIG. 8 (B), pressing the correcting member 144 generates a force in the main beam portion 141 in a direction opposite to the bending direction of the main beam portion 141 (upward pushing direction), thereby eliminating the bending. Thereby, the inclination of the mounting head 150 can be kept flat.

Next, the feed amount of the adjustment screw member according to the position of the mounting head will be described using FIG. 9. Fig. 9 (A) is a schematic front view when the mounting head is located near the center, and Fig. 9 (B) is a schematic front view when the mounting head is near the end. Fig. 9 shows a part of the internal structure which is seen through perspective.

The amount of bending of the main beam portion 141 varies depending on the position of the mounting head 150. When the mounting head 150 is located near the center in the Y-axis direction of the main beam portion 141, the amount of bending becomes large, and when it is located near the end, the amount of bending becomes small. As a result, as shown in FIG. 9 (A), when the mounting head 150 is positioned near the center of the main beam portion 141, the feed amount of the externally threaded member 147 increases. As shown in FIG. 9 (B), the mounting head 150 is positioned at When the end of the main beam portion 141 is near, the feed amount of the male screw member 147 decreases.

The male screw member 147 is rotated by an actuator 148 such as a motor. Therefore, the feed amount (pushing amount, rotation position) of the male screw member 147 can be automatically controlled by controlling the actuator 148 with a control device (not shown). Adjustment. Therefore, the amount of pressing the correction member 144 corresponding to the position of the mounting head 150 can control the bending of the main beam portion 141.

In addition, a detection sensor such as a rotation sensor, a level detection sensor, and a beam displacement sensor is provided in the beam 140 and the mounting head 150. The control device may control the actuator based on the signal of the sensor. 148. Thereby, the control is returned to the sensor signal position without the bending state, so that the non-bending state can be constantly maintained.

According to the first embodiment, the beam structure is not configured with high rigidity (high weight), and can be reinforced according to the bending deformation of a lightweight (low rigidity) member. Deformation and vibration due to the movement of the beam can be suppressed to a minimum limit.

<Modification of First Embodiment>
Hereinafter, a few examples of the representative modification of the first embodiment will be described. In the following description of the modification, the same symbols as those of the above-mentioned embodiment may be used for portions having the same structure and function as those described in the above-mentioned embodiment. In addition, regarding the description of the relevant parts, the description in the above-mentioned embodiment is appropriately referred to within a technically non-conflicting range. In addition, a part of the above-mentioned embodiment and all or a part of the plural modification examples can be appropriately combined and used within a range that does not conflict technically.

Although the first embodiment has described an example in which the correction member 144 is pushed using the internally threaded member 146 and the externally threaded member 147, it is not limited to this, as long as the correction member built in the Y beam 140 is pushed from the upper side of the main beam portion 141 144. A mechanism (bending correction means) for pushing up the main beam portion 141 by its reverse force is sufficient.

(First Modification)
The first modification is a wedge-shaped flat cam member provided on the correction member. The Y beam of the first modification will be described with reference to FIG. 10. Fig. 10 (A) is a diagram schematically showing a state in which the Y beam is bent. Fig. 10 (B) is a diagram schematically showing a state after the bending of the Y beam is corrected. In addition, Fig. 10 shows a part of the internal structure which is seen through perspective.

As shown in FIG. 10, the Y beam 140A according to the first modification includes: a correction member 144 extending from one leg portion 142 to the other leg portion 142 through the main beam portion 141; Support member 145 at the end; cylindrical rotating member 149 provided at the center of the Y-axis direction of the correction member 144; wedge-shaped flat cam member 14A; receiving member 146A provided at the end of the flat cam member 14A; transmission A member 147A; and an actuator 148A that drives the transmission member 147A. The receiving member 146A, the transmission member 147A, the actuator 148A, and the flat cam member 14A are positioned above the correction member 144, and the rotating member 149 is fixed to the upper portion of the main beam portion 141.

The transmission member 147A is transmitted to the receiving member 146A provided on the correction member 144 by the actuator 148A, and the flat cam member 14A is moved in the Y direction under the rotation member 149. Thereby, similarly to the first embodiment, the correction member 144 can be pressed in the vertical direction.

As shown in FIG. 10 (A), in a state where the main beam portion 141 is bent, the correction member 144 is not bent. As shown in FIG. 10 (B), when the correction member 144 is pushed, a force in a direction opposite to the bending direction of the main beam portion 141 (upward pushing direction) is generated inside the main beam portion 141, thereby eliminating the bending.

According to the first modification, actuators such as a motor for a heavy object can be provided on the leg portions on both sides with less influence of bending.

(Second Modification)
The second modification is a wedge member provided on the Y beam. The Y beam of the second modification will be described using FIG. 11. Fig. 11 is a diagram schematically showing a Y beam of a second modification, and Fig. 11 (A) is a diagram schematically showing a state after the Y beam is bent. Fig. 11 (B) is a diagram schematically showing a state after the bending correction of the Y beam. In addition, Figs. 11 (A) and 11 (B) show a part of the internal structure that can be seen through perspective.

As shown in FIG. 11, the Y beam 140B according to the second modification includes a correction member 144 extending from one leg portion 142 to the other leg portion 142 via the main beam portion 141, and a support member 144 that supports the correction member 144 at a predetermined height. A support member 145 at the end; a rotating member 149B provided at the center of the Y-axis direction of the correction member 144; a flat cam member 14AB; a receiving member 146B provided at the flat cam member 14AB; a transmission member 147B; and a transmission member 147B Actuator 148B. The receiving member 146B, the transmission member 147B, the actuator 148B, and the planar cam member 14AB are positioned above the main beam portion 141, and the rotating member 149B is fixed to the correction member 144.

The transmission member 147B is transmitted to the receiving member 146B provided on the main beam portion 141 by the actuator 148B, and the flat cam member 14AB is moved in the Y direction above the rotating member 149B. Thereby, similarly to the first embodiment, the correction member 144 can be pressed in the vertical direction.

As shown in FIG. 11 (A), in a state where the main beam portion 141 is bent, the correction member 144 is not bent. As shown in FIG. 11 (B), when the correcting member 144 is pushed, a force in a direction opposite to the bending direction of the main beam portion 141 (upward pushing direction) is generated inside the main beam portion 141, and the bending can be eliminated.

(Third Modification)
A third modification is an eccentric cam member in which a circular plate on which a shaft is mounted is provided at a position deviated from the center above the Y beam. The Y beam of the third modification will be described using FIG. 12. Fig. 12 is a diagram schematically showing a Y beam of a third modified example, Fig. 12 (A) is a diagram schematically showing a state after the Y beam is bent, and Fig. 12 (B) is a diagram showing the Y beam bending after the correction Figure 12 (A) is a front view, and Figure 12 (B) is a side view, showing a part of which the internal structure can be seen through perspective.

As shown in FIG. 12, the Y beam 140C according to the third modification includes a correction member 144 extending from one leg portion 142 to the other leg portion 142 via the main beam portion 141, and a support member 144 that supports the correction member 144 at a predetermined height. A support member 145 at the end; a rotation member 149C provided at a central portion in the Y-axis direction of the correction member 144; an eccentric cam member 14B; and an actuator 148C that rotates the shaft of the eccentric cam member 14B. The actuator 148C and the eccentric cam member 14B are positioned above the main beam portion 141, and the rotation member 149C is fixed above the correction member 144.

The shaft of the eccentric cam member 14B provided above the main beam portion 141 is rotated by the actuator 148C, so that the eccentric cam member 14B is rotated above the rotating member 149C. Thereby, similarly to the first embodiment, the correction member 144 can be pressed in the vertical direction.

As shown in FIG. 12, when the correcting member 144 is pushed, a force in a direction opposite to the bending direction of the main beam portion 141 (upward direction) is generated inside the main beam portion 141, and the bending can be eliminated.

<Second Embodiment>
Next, a second embodiment for solving the above-mentioned second problem will be described using FIG. 13. Fig. 13 is a view schematically showing a Y-beam of the second embodiment. The mode is a view showing a state after the Y-beam is bent. Fig. 13 (A) is a front view, and Fig. 13 (B) is a side view, showing a part of the perspective. The ground can see the internal structure.

As shown in FIG. 13, the Y beam 140D of the second embodiment includes a correction member 144D extending from one leg portion 142 to the other leg portion 142 through the main beam portion 141, and a support member 144D that supports the correction member 144D at a predetermined height. An end support member 145D and an internally threaded member 146D provided at a central portion in the Y direction of the correction member 144; the internally threaded member 146D and the externally threaded member 147; and an actuator 148 that rotates the externally threaded member 147. The correction member 144D, the support member 145D, the internally threaded member 146D, and the externally threaded member 147 are positioned inside the Y-beam 140D, and the actuator 148 is fixed on the main beam portion 141. The correction member 144D is formed of, for example, a lightweight and high-rigidity raw material (for example, Carbon Fiber Reinforced Plastic: CFRP).

The length of the correction member 144D in the depth direction (X direction) is longer than that of the correction member 144 of the first embodiment, and the internally threaded member 146D is also more fixed on the deep side (positive side of the X axis) than the internally threaded member 146 of the first embodiment. .

The externally threaded member 147 provided in the internally threaded member 146D of the correction member 144D is rotatably inserted by the actuator 148, whereby the correction member 144D can be pressed in the vertical direction. By changing the feed amount (pressing amount) of the male screw member 147, the pressing amount of the correction member 144D can be controlled.

As shown in FIG. 13 (B), when the correcting member 144D is pushed, a force in a direction opposite to the twisting direction (upward pushing direction) of the main beam portion 141 is generated inside the main beam portion 141, and the twist can be eliminated. In other words, by pushing the driving mechanism at the deviation from the center of the correction member 144D, the deviation from the rotation center of the torsion of the correction member 144D is pushed to generate a torsional moment, and the weight of the correction member 144D and the mounting head 150 is offset. The direction of the torsional component pushes the correction member 144D, thereby eliminating the torsion that generates a torsional moment.

As in the first embodiment, the amount of position-control pressing correction member 144D corresponding to the Y direction of the mounting head 150 keeps the twist of the main beam portion 141 and the tilt of the mounting head 150 flat. The amount of twisting varies according to the position of the mounting head 150. Therefore, the amount of torsional torque that is eliminated corresponding to the position of the mounting head 150D is controlled by the amount of pushing.

In addition, similar to the first embodiment, the beam 140 and the mounting head 150 are provided with an angle detection sensor such as a rotation sensor or a level detection sensor, and the control device may perform control based on a signal from the sensor. Actuator 148. Thereby, the sensor signal position is constantly controlled to return to the non-twisted state, so that the non-twisted state can be constantly maintained.

<Modification of Second Embodiment>
Hereinafter, a few examples of the representative modification of the second embodiment will be described. In the description of the following modifications, the same symbols as those in the first and second embodiments may be used for parts having the same structure and functions as those described in the first and second embodiments. In addition, regarding the description of the relevant parts, the descriptions in the first embodiment and the second embodiment are appropriately referred to within a technically non-conflicting range. In addition, a part of the first embodiment and the second embodiment, and all or a part of the plural modifications can be appropriately combined and used within a range that does not conflict technically.

Although the second embodiment has described an example in which the correction member 144D is pushed using the internally-threaded member 146D and the externally-threaded member 147, it is not limited to this, as long as the component that is twisted by weight is offset, a torque is generated to eliminate the twist. Mechanism (reversing correction means).

(Fourth Modification)
The mounting device according to the fourth modification will be described with reference to FIGS. 14 to 18. Fig. 14 is a perspective view schematically showing a mounting device according to a fourth modification. Fig. 15 is a perspective view schematically showing a Y beam according to a fourth modification. Fig. 16 is a schematic diagram illustrating the torsional correction of the Y beam of Fig. 15. Fig. 16 (A) is a side view showing a state before torsion, and Fig. 16 (B) is a side view showing a state after torsion. Fig. 16 (C) is a schematic side view showing a state after torsional correction. Fig. 17 is a schematic diagram illustrating the amount of twisting according to the position of the mounting head. Fig. 17 (A) is a side view showing a case where the mounting head is on the leg side, and Fig. 17 (B) is a view showing the mounting head FIG. 17 (C) is a side view of a case where the leg portion is located between the leg portion side and the center portion side, and is a side view showing a case where a head is mounted on the center portion. FIG. 18 is a schematic diagram illustrating how the amount of the shims for adjustment is changed according to the position of the mounting head. FIG. 18 (A) is a side view showing the case where the mounting head is positioned on the leg side, and FIG. 18 (B) FIG. 18 (C) is a side view showing a case where the mounting head is located between the leg portion and the center portion side, and FIG. 18 (C) is a side view showing the case where the mounting head is located at the center portion.

The implementation device 100E of the fourth modification is different in the structure of the mounting device 100 and the Y-beam from the embodiment, but the other structures are the same. The Y beam 140E of the fourth modification is positioned below the bottom surface of the main beam portion 141 and the bottom surface of the leg portion 142 (the upper surface of the slider 143). Further, a warpage correction plate 14C is mounted on the back surface of the Y beam 140E (the surface opposite to the surface of the mounting head 150 on which the main beam portion 141E is mounted) through the adjustment shim (gap adjustment plate) 14D. The gap adjusting sheet 14D is a thin steel sheet for adjusting the gap. For example, a plurality of predetermined thicknesses are prepared in advance, and then they are appropriately selected and incorporated.

As shown in FIGS. 16 (A) and 16 (B), the main beam portion 141E is twisted according to the weight of the mounting head 150 and the main beam portion 141E. For this reason, as shown in FIG. 16 (C), an adjustment shim 14D for correcting the amount of twist is added to the lower side of the central portion in the Y-axis direction of the main beam portion 141E. That is, a plate having a high torsional rigidity for correcting warpage is mounted on the back surface of the main beam portion 141E so that the mounting head 150 and the like are twisted in the opposite direction due to their own weight. Force to offset and reduce the amount of twist. Thereby, even if the weight of the main beam portion 141E is reduced due to the reduction in rigidity, the structure can be offset, and both the weight and the accuracy can be achieved.

As shown in FIG. 17 (A), when the mounting head 150 is located on the end portion side (the leg portion 142E side) of the main beam portion 141E, the support portion is close to the support portion of the main beam portion 141E and is not easily twisted. As shown in FIG. 17 (B) and FIG. 17 (C), the more the mounting head 150 moves toward the center portion of the main beam portion 141E, the more it is easily twisted due to the rigidity of the main beam portion 141E.

For this reason, as shown in FIG. 18 (A), the adjustment shim 14D is not inserted into the end portion side (leg portion 142E side) of the main beam portion 141E, as shown in FIGS. 18 (B) and 18 (C). It is shown that the closer to the center portion of the main beam portion 141E, the more the adjustment shim 14D is inserted. Thereby, as the reverse force of the central portion warpage correcting plate 14C becomes larger, a force to which the main beam portion 141E is twisted in the opposite direction according to the amount of twist can be offset and reduced.

(Fifth Modification)
A fifth modification is a mechanism that generates a reverse force toward the warpage correction plate. The Y beam of the fifth modification will be described using FIG. 19. Fig. 19 is a view schematically showing a Y beam of a fifth modification. Fig. 19 (A) is a side view showing a case where the mounting head is on the foot side, and Fig. 19 (B) is a view showing the mounting head on the foot. FIG. 19 (C) is a side view of the case where the part is located between the center side and the center part side, and is a side view showing a case where the mounting head is positioned at the center part.

As shown in FIG. 19 (A), the Y beam 140E of the fourth modification includes a transmission member 147F in the main beam portion 141E, and an actuator 148F that transmits the transmission member 147F.

The actuator 148A is used to drive the transmission member 147F in the X-axis direction, thereby pushing the lower portion of the warpage correction plate 14C in the X-direction.

Similar to the fourth modification, as shown in FIG. 17 (A), when the mounting head 150 is located on the end side (leg portion 142E side) of the main beam portion 141E, the support portion near the main beam portion 141E is difficult to twist. As shown in FIG. 17 (B) and FIG. 17 (C), the more the mounting head 150 moves toward the center portion of the main beam portion 141E, the more it is easily twisted due to the rigidity of the main beam portion 141E.

Therefore, as shown in FIG. 19 (A), when the mounting head 150 is located on the end side of the main beam portion 141E, the transmission member 147F is not pushed, as shown in FIGS. 19 (B) and 19 (C). As the mounting head 150 approaches the central portion of the main beam portion 141E, the amount by which the transmission member 147F is pressed becomes larger. As a result, as in the fourth modification, as the reverse force of the central portion warpage correction plate 14C becomes larger, a reverse force can be applied to the main beam portion 141E in the opposite direction in accordance with the amount of twist to offset and reduce the amount of twist. .

In addition, a correction table or calculation is used to control the pressing amount corresponding to the positioning position of the mounting head, thereby automatically performing torsional correction of the beam. In this case, it is possible to follow the change in head weight such as head type change and replacement, and to more easily perform twist correction.

(Sixth Modification)
Although the first embodiment has been described as an example of correcting the bending of the beam and the second embodiment is an example of correcting the torsion of the beam, FIG. 20 is used for an example (sixth modification) of both the bending of the beam and the torsion of the beam Instructions. Fig. 20 is a view schematically showing a Y beam of a sixth modification, and Fig. 20 (A) is a side view schematically showing a structure in a case where the bending is large and the twist is small, and Fig. 20 (B) is a mode showing a small bending and Side view of the structure where the twist is large.

Although the Y beam 140G of the sixth modification has the same structure as the Y beam 140D of the second embodiment, the position of the X-axis direction of the internally threaded member 146D, the externally threaded member 147, and the actuator 148 can be changed to correspond to the actual machine. To adjust the pressing position of the correction member 144D.

When the bending of the Y beam 140G is large and the twist is small, as shown in FIG. 20 (A), the position of the pressing correction member 144D is adjusted to be near the center in the X-axis direction. By pressing the vicinity of the center of the correction member 144D, it is possible to reduce the twist of the Y beam 140G by the same effect as that of the first embodiment and by the bending of the Y beam 140G and the second embodiment.

When the bending of the Y beam 140G is small and the twist is large, as shown in FIG. 20 (B), the position of the pressing correction member 144D is adjusted to be near the outer side in the X-axis direction. By pressing the end portion of the correction member 144D, it is possible to reduce the bending of the Y beam 140G by the same effect as that of the second embodiment and by the twist of the Y beam 140G and the same effect of the first embodiment.

Therefore, by adjusting the position of the pressing correction member 144D from the center to the end, both the bending and twisting of the Y beam 140G can be reduced.

In the following, an example of a flip chip bonding machine that uses the Y beam of the above embodiment as an example of a mounting device is described, but it is not limited to this, and can also be applied to a wafer mounting machine that mounts a packaged semiconductor device or the like on a substrate Surface mounter) or a wafer bonding machine that adheres a semiconductor wafer (wafer) to a substrate or the like. In addition, the flip-chip bonding machine is, for example, a Fan Out Wafer Level Package (FOWLP) used for forming a package for forming a redistribution layer over a wide area over a wafer area.

[Example 1]

Fig. 21 is a top view showing the outline of a flip chip bonding machine of the first embodiment. FIG. 22 is a diagram illustrating the operations of the pick-and-place flip head, the transfer head, and the bonding head when viewed from the direction of arrow A in FIG. 21.

The flip-chip bonding machine 10 roughly includes a wafer supply section 1, a pick and place section 2, a transfer section 8, an intermediate stage section 3, a bonding section 4, a transfer section 5, a substrate supply section 6K, a substrate carry-out section 6H, and various monitoring and control sections. The control device 7 of the operation.

First, the wafer supply unit 1 is a wafer D that supplies a substrate P mounted on a substrate or the like. The wafer supply unit 1 includes a wafer holding table 12 that holds the divided wafer 11, an ejection unit 13 indicated by a dotted line that lifts the wafer D from the wafer 11, and a wafer supply unit 18. The wafer supply unit 1 is moved in the XY direction by a driving means (not shown), and the picked-up wafer D is moved toward the unit 13. The dicing wafer supply unit 18 includes a wafer cassette that stores diced wafers, sequentially supplies the diced wafers to the wafer supply unit 1, and replaces the diced wafers with new ones. The wafer supply unit 1 moves the dicing wafer at a pick-and-place point so that a predetermined wafer can be picked and set from the dicing wafer. The dicing wafer is a holder on which the wafer can be mounted on the wafer supply unit 1.

The pick-and-place unit 2 includes a pick-and-place reversing head 21 which is reversed after picking up the wafer D, and drive units (not shown) which raise, lower, rotate, reverse, and move the chuck 22 in the X direction. With the above configuration, the pick-and-place reversing head 21 picks up the wafer, rotates the pick-and-place reversing head 21 by 180 degrees, reverses the buffering of the wafer D to the lower side, and forms the wafer D into the transfer transfer head 81 posture.

The transfer unit 8 receives the inverted wafer D from the pick-and-place reversing head 21, and places the wafer D on the intermediate stage 31. The transfer unit 8 includes a transfer head 81 that includes a chuck 82 that holds and holds the wafer D on the front end, and a Y driving unit 83 that moves the transfer head 81 in the Y direction, similarly to the pick-and-place flip head 21.

The intermediate stage unit 3 includes an intermediate stage 31 on which the wafer D is temporarily placed, and a stage identification camera 34. The intermediate stage 31 is movable in the Y direction by a driving unit (not shown).

The adhering section 4 picks up the wafer D from the intermediate stage 31, and then picks up the transferred substrate P. The adhering section 4 includes an adhering head 41 that includes a chuck 42 that holds and holds the wafer D on the front end in the same manner as the pick-and-place reversing head 21: a Y beam 43 that moves the adhering head 41 in the Y direction; and a position identification mark for the imaging substrate P (Not shown), a substrate recognition camera 44 that recognizes a subsequent position, and an X support table 45.
With the above configuration, the next head 41 picks up the wafer D from the intermediate stage 31, and then attaches the wafer D to the substrate P based on the imaging data of the substrate recognition camera 44.

The transfer unit 5 includes transfer rails 51 and 52 that move the substrate P in the X direction. The conveyance rails 51 and 52 are provided in parallel. With the configuration described above, the substrate P is carried out from the substrate supply unit 6K, moved to the next position along the conveyance rails 51 and 52, and then moved to the substrate carry-out unit 6H, and the substrate P is transferred to the substrate carry-out unit 6H. After the wafer D is bonded to the substrate P, the substrate supply unit 6K unloads a new substrate P and waits on the transfer rails 51 and 52.

Fig. 23 is a schematic cross-sectional view showing a main part of the wafer supply unit of Fig. 21. As shown in FIG. 23, the wafer supply unit 1 includes: an expansion ring 15 that holds the dicing wafer 14; a support ring 17 that holds the dicing wafer 16 to which the dicing wafer 16 having a plurality of wafers D is horizontally held; and a wafer D that is pushed upward. Jacking unit In order to pick up a predetermined wafer D, the jacking unit 13 is moved in a vertical direction by a driving mechanism (not shown), and the wafer supply unit 1 is moved in a horizontal direction.

The following description will be given with reference to FIGS. 7 and 24 while referring to the embodiment. FIG. 24 is a schematic side view showing a main part of the bonding part 4. Some of the constituent elements are shown in perspective. The side view of FIG. 24 is a front view of FIG. 7.

The adhering section 4 includes a following stage BS (mounting bracket 120) supported on the gantry 53 (gantry 110), an X support base 451 (X support base 131) provided near the conveyance rails 51 and 52, and supported by X Y beam 43 (Y beam 140) on the supporting table 451; a bonding head 41 (mounting head 150) supported on the Y beam 43; and a driving portion 46 (driving portion) that drives the bonding head 41 in the Y-axis direction and the Z-axis direction 160).

Next, the head 41 is a device having a chuck 42 (holding means 151) that can freely hold the wafer D (component 300), and is mounted on the Y beam 43 in a freely reciprocating manner in the Y-axis direction.

In the present embodiment, one bonding head 41 is provided, and the bonding head 41 is provided with a chuck 42 for holding the wafer D by vacuum suction. The driving unit 46 can raise and lower the bonding head 41 in the Z-axis direction. Next, the head 41 has a function of holding the picked-up wafer D from the intermediate stage 31 for conveyance, and mounting the wafer D on the substrate P (workpiece 200) that is suction-fixed to the subsequent stage BS.

The guide 132 provided on the X support base 451 is a member that can slide the Y beam 43 in the X-axis direction so as to freely slide. In the present embodiment, two X-supporting tables 451 are arranged in parallel, and each X-supporting table 451 is fixed to the transport rails 52 and 53 in a state of extending in the X-axis direction. The X support table 451 may be integrated with the conveyance rails 52 and 53.

As shown in FIGS. 21 and 24, a slider 433 that is freely movable in the X-axis direction is mounted on the guide 452. Furthermore, both ends of the Y beam 43 are mounted on the sliders 433 of the two guides 452, respectively. That is, the Y beam 43 extends in the Y-axis direction across the stage BS, and both ends are supported by the guide 452 mounted on the slider 433 and the X-supporting table 451 so as to be free in the X-axis direction. mobile. In addition, since the bottom surface of the Y beam 43 and the upper surface of the slider 433 are located on the same surface, the Y beam 43 is not disposed at a higher position from the X support base 451.

The Y beam 43 of the first embodiment has substantially the same structure as the Y beam 140 of the first embodiment. However, the Y beam 43 has a larger extension to the right than the support 451 on the right in the drawing. This is because the head 41 can then pick up the wafer D from the intermediate stage 31. Then, when the head 41 moves further to the right than the support table 451, the head 41 rises so that the chuck 42 becomes higher than the guide 452.

Next, a bonding method (a method for manufacturing a semiconductor device) performed in the flip-chip bonding machine according to the first embodiment will be described with reference to FIG. 25. Fig. 25 is a flowchart showing a bonding method implemented by the flip-chip bonding machine of Example 1.

Step S1: The control device 7 moves the wafer holding table 12 so that the picked-up wafer D is positioned directly above the jacking unit 13, and positions the peeling target wafer on the jacking unit 13 and the chuck 22. The jacking unit 13 is moved so that the upper surface of the jacking unit 13 contacts the inner surface of the cutting blade 16. At this time, the control device 7 adsorbs the cutting sheet 16 on the upper surface of the jacking unit 13. The control device 7 descends while sucking the chuck 22 in a vacuum, lands on the wafer D to be peeled, and sucks the wafer D. The control device 7 raises the chuck 22 and peels the wafer D from the dicing sheet 16. Thereby, the wafer D is picked up by the pick-and-place flip head 21.

Step S2: The control device 7 moves the pick-and-place turning head 21.

Step S3: The control device 7 rotates the pick-and-place flip head 21 by 180 degrees, so that the buffer surface (surface) of the wafer D is turned downward, and the buffer (surface) of the wafer D is turned downward, so that the wafer D forms a transfer transfer head. 81 pose.

Step S4: The control device 7 picks up the wafer D from the chuck 22 of the pick-up reversing head 21 by the chuck 82 of the transfer head 81, and sends and receives the wafer D.

Step S5: The control device 7 reverses the pick-and-place flip head 21 so that the suction side of the chuck 22 faces downward.

Step S6: Before or in parallel with step S5, the control device 7 moves the transfer head 81 toward the intermediate stage 31.

Step S7: The control device 7 places the wafer D held on the transfer head 81 on the intermediate stage 31.

Step S8: The control device 7 moves the transfer head 81 to the delivery position of the wafer D.

Step S9: After or in parallel with step S8, the control device 7 moves the intermediate stage 31 to the delivery position following the head 41.

Step SA: The control device 7 picks up the wafer D from the intermediate placing table 31 by the chuck following the head 41, and sends and receives the wafer D.

Step SB: The control device 7 moves the intermediate stage 31 to the feeding position with the transfer head 81.

Step SC: The control device 7 moves the wafer D held by the chuck 42 of the head 41 onto the substrate P.

Step SD: The control device 7 places the wafer D picked up by the chuck 42 following the head 41 from the intermediate stage 31 on the substrate P.

Step SE: The control device 7 moves the bonding head 41 to a feeding position with the intermediate placing table 31.

[Example 2]

Fig. 26 is a top view schematically showing a flip-chip bonding machine according to the second embodiment.

The flip chip bonding machine 10A roughly includes a wafer supply section 1, a pick and place section 2, a transfer section 8A, 8B, an intermediate stage section 3, a bonding section 4A, 4B, a transport section 5, a substrate supply section 6K, a substrate carry-out section 6H, and A control device 7 that monitors and controls the operation of each unit.

The wafer supply unit 1 is the same as the first embodiment. The pick-and-place section 2 is the same as the first embodiment. The pick and place reversing head 21 picks up the wafer, rotates the pick and place reversing head 21 by 180 degrees, reverses the buffering of the wafer D, and then moves the wafer D downward to form the transfer transfer heads 81A and 81B.

The transfer sections 8A and 8B are wafers D that have been received from the pick and place reversing head 21 and placed on the intermediate stages 31A and 31B. The transfer sections 8A and 8B include the transfer heads 81A and 81B that hold the wafer D on the front end of the chucks 82A and 82B as well as the pick-and-place flip head 21, and an X drive section that moves the transfer heads 81A and 81B in the X-axis direction. 83A, 83B.

The intermediate stage sections 3A and 3B include intermediate stages 31A and 31B on which the wafer D is temporarily placed and stage identification cameras 34A and 34B. The intermediate stages 31A and 31B are movable in the Y-axis direction by a driving unit (not shown).

The following sections 4A and 4B pick up the wafer D from the intermediate stages 31A and 31B, and then pick up the transferred substrate P. The bonding sections 4A and 4B include the bonding heads 41A and 41B provided with the chucks 42A and 42B for holding and holding the wafer D to the front end, similar to the pick-and-turn head 21, and a Y beam that moves the bonding heads 41A and 41B in the Y-axis direction. 43A, 43B; position identification marks (not shown) of the imaging substrate P, substrate identification cameras 44A, 44B that identify subsequent positions, and an X support table 45.
With the above configuration, the heads 41A and 41B pick up the wafer D from the intermediate stages 31A and 31B, and then attach the wafer D to the substrate P based on the imaging data of the substrate recognition cameras 44A and 44B.

The transfer unit 5 includes transfer rails 51 and 52 that move the substrate P in the X direction. The conveyance rails 51 and 52 are provided in parallel. With the configuration described above, the substrate P is carried out from the substrate supply unit 6K, moved to the next position along the conveyance rails 51 and 52, and then moved to the substrate carry-out unit 6H, and the substrate P is transferred to the substrate carry-out unit 6H. After the wafer D is bonded to the substrate P, the substrate supply unit 6K unloads a new substrate P and waits on the transfer rails 51 and 52.

The Y beam 43A is the same as the Y beam 43 of the first embodiment, and the Y beam 43B has a structure symmetrical to the Y beam 43A.

As mentioned above, although the invention invented by the present inventors has been specifically described based on the embodiments, modifications, and examples, the present invention is not limited to the above-mentioned embodiments, modifications, and examples, and of course, various changes can be made.

For example, although the embodiment is an example of using a lightweight and high-rigidity material (CFRP) for the correction member, it is not limited to this. A shape memory alloy may also be used for the correction member so that a reverse force acts on the bending of the beam when the shape is restored. Or twisted shape, you can control the shape memory temperature and control the amount of bending and twisting. Alternatively, a magnetic shape memory alloy may be used. Alternatively, a bimetal can be used to adjust the counterforce at a linear temperature.

In addition, although the first embodiment and the second embodiment have been described as installing an angle detection sensor such as a rotation sensor or a level detection sensor in the beam 140 and the mounting head 150, the signal of the sensor is used to control the signal. An example of the actuator 148, but as described below, the sensor output signal of the sampled sensor is stored in the memory portion of the control device when it is operated by the installation action program of the product installed in advance, and the sensor stored in the memory portion is calculated in advance. Matters related to signal output and actuator output for correcting bending and twisting are stored in the memory section. According to the related matters memorized and the signal of the sensor, the control to eliminate bending or twisting can be implemented in accordance with the program (prescription: sequence of movement of each product) of each mounted product, and the bending and twisting can be removed well.

In the first and second embodiments, an example using the Y beam of the first embodiment has been described, but the invention is not limited to this. One of the second embodiment and one of the first to sixth modifications may be used. Or combined Y beam.

In addition, although an example of one bonding head (mounting head) has been described in the first and second embodiments, the present invention is not limited to this, and a plurality of bonding heads similar to the embodiment may be used.

In the first and second embodiments, an example has been described in which the reversing mechanism is provided on the pick-and-place reversing head, and the transfer head receives the wafer from the pick-and-place reversing head to place the wafer on the intermediate stage and transfer the intermediate stage. However, the present invention is not limited to this, and the pick-and-place flip head that is reversed after picking up the wafer may be moved, and the picked-up wafer D may be placed on a stage unit inside and outside the rotatable wafer, and the stage unit may be moved.

100‧‧‧Installation device

110‧‧‧stand

120‧‧‧Mounting frame

131‧‧‧X support table

132‧‧‧Guide

140‧‧‧Y Beam

141‧‧‧Main beam section

142‧‧‧foot

143‧‧‧ slider

150‧‧‧Mounting head

160‧‧‧Driver

200‧‧‧ Workpiece

300‧‧‧Parts

Fig. 1 is a front view schematically showing a mounting device of a comparative example.

Fig. 2 is a top view schematically showing the mounting device of Fig. 1;

Fig. 3 is a side view schematically showing the mounting device of Fig. 1;

Fig. 4 is a diagram explaining the bending and twisting of the beam.

Fig. 5 is a schematic front view illustrating the problem of the mounting device of Fig. 1.

Fig. 6 is a schematic side view illustrating the problem of the mounting device of Fig. 1.

Fig. 7 is a front view schematically showing the mounting apparatus of the first embodiment.

Fig. 8 is a view schematically showing a Y beam of the first embodiment.

Fig. 9 is a schematic front view illustrating the adjustment of the feed amount of the feed screw by the position of the mounting head.

Fig. 10 is a view schematically showing a Y beam according to a first modification.

Fig. 11 is a view schematically showing a Y beam according to a second modification.

Fig. 12 is a view schematically showing a Y beam according to a third modification.

Fig. 13 is a view schematically showing a Y beam of the second embodiment.

Fig. 14 is a perspective view schematically showing a mounting device according to a fourth modification.

Fig. 15 is a perspective view schematically showing a Y beam according to a fourth modification.

FIG. 16 is a schematic diagram illustrating torsional correction of the Y beam of FIG. 15.

Fig. 17 is a schematic diagram illustrating a difference in the amount of twisting according to the position of the mounting head.

FIG. 18 is a schematic diagram illustrating a change in the amount of the shims for adjustment according to the position of the mounting head.

Fig. 19 is a view schematically showing a Y beam according to a fifth modification.

Fig. 20 is a view schematically showing a Y beam according to a sixth modification.

Fig. 21 is a top view showing the outline of a flip chip bonding machine of the first embodiment.

FIG. 22 is a diagram illustrating the operations of the pick-and-place flip head, the transfer head, and the bonding head when viewed from the direction of arrow A in FIG. 21.

Fig. 23 is a schematic cross-sectional view showing a main part of the wafer supply unit of Fig. 21.

Fig. 24 is a schematic side view showing a main portion of a bonding portion of Fig. 21;

FIG. 25 is a flowchart showing a bonding method performed by the flip chip bonding machine of Example 1. FIG.

Fig. 26 is a top view schematically showing a flip-chip bonding machine according to the second embodiment.

Claims (22)

A mounting device having: Stand, with a mounting bracket; A beam that extends above the pedestal in the first direction and has its two ends supported on the pedestal in a freely movable manner in the second direction, respectively; and The mounting head is supported by the beam in a freely movable manner in the first direction, The beam includes a correction member located in the beam and extending in the first direction, and a pressing member that presses the correction member in a bending direction of the beam and generates a force in the bending direction and an opposite direction with a reverse force. Means of bending correction. The mounting device according to item 1 of the scope of patent application, wherein the amount of pressing of the correction member is controlled in accordance with the position of the mounting head. According to the mounting device described in claim 2 of the patent application scope, the bending correction means is capable of pressing the correction member in the bending direction by a rotation operation of a screw member, and the amount of pressing the correction member can be changed. The mounting device according to item 3 of the scope of patent application, wherein the bending correction means includes: An externally threaded member extending in the bending direction; An actuator fixed at the center of the beam in the first direction on the beam to rotate the externally threaded member; and The internally threaded member inserted into the externally threaded member, the correction member fixed to the inside of the beam, By rotating the externally threaded member by the actuator, the correcting member can be pushed in the bending direction, and the amount of pressing the correcting member can be changed. For example, in the mounting device described in claim 2 of the patent application scope, the bending correction means can push the correction member toward the bending direction by a movement of the wedge-shaped flat cam member in the first direction, and the pressing can be changed. Correct the amount of the component. The mounting device according to item 5 of the scope of patent application, wherein the bending correction means includes: A receiving member connected to the planar cam member provided on the correction member; A transmission member extending in the first direction; An actuator that is fixed to the end of the correction member in the first direction on the correction member and moves the transmission member in the first direction; and A rotating member fixed at a center of the beam in the first direction above the correction member and abutting the planar cam member, The actuator can push the correction member in the bending direction by moving the transmission member, and the amount of pressing the correction member can be changed. The mounting device according to item 5 of the scope of patent application, wherein the bending correction means includes: A receiving member connected to the planar cam member provided on the beam; A transmission member extending in the first direction; An actuator fixed at the end of the beam in the first direction on the beam to move the transmission member in the first direction; and A rotation member fixed to the correction member at a center of the correction member in the first direction and abutting the planar cam member, The actuator can push the correction member in the bending direction by moving the transmission member, and the amount of pressing the correction member can be changed. According to the mounting device described in the second item of the patent application scope, the bending correction means is capable of pressing the correction member in the bending direction by a rotation operation of an eccentric cam member, and the amount of pressing the correction member can be changed. The mounting device according to item 8 of the scope of patent application, wherein the bending correction means includes: An actuator fixed at the center of the beam in the first direction on the beam, and rotating an axis of the eccentric cam member provided on the beam, and A rotation member fixed to the correction member at the center of the correction member in the first direction and abutting the eccentric cam member, The actuator can push the correction member in the bending direction by rotating the eccentric cam member, and the amount of pressing the correction member can be changed. A mounting device having: Stand, with a mounting bracket; A beam that extends above the pedestal in the first direction and has its two ends supported on the pedestal in a freely movable manner in the second direction, respectively; and The mounting head is supported by the beam in a freely movable manner in the first direction, The beam includes a correction member extending in the first direction, and a twist correction means that generates a force in a direction opposite to the twist direction at a position deviated from the correction member from the torsional rotation center of the beam. According to the mounting device described in claim 10, the force corresponding to the position of the mounting head is controlled in a direction opposite to the twisting direction. The mounting device according to item 11 of the scope of patent application, wherein the correction member is located inside the beam, The torsional correction means is capable of pressing the deviation of the rotation center of the torsion of the correction member in a downward direction from the rotation operation of the screw member, and the amount of pressing of the correction member can be changed. The mounting device according to item 12 of the scope of patent application, wherein the torsional correction means includes: An externally threaded member extending in the above downward direction; An actuator that rotates the externally threaded member at a center of the beam in the first direction at a position deviated from the torsional rotation center; and The internally threaded member inserted into the externally threaded member, the correction member fixed to the inside of the beam, By rotating the externally threaded member by the actuator, the correcting member can be pressed in the downward direction, and the amount of pressing the correcting member can be changed. The mounting device according to item 11 of the patent application scope, wherein the correction member is a plate mounted on a side surface of the beam opposite to the mounting head, The torsional correction means is provided with a gap between the beam and the lower side of the correction member, and the amount of the gap can be changed. For example, in the mounting device according to item 14 of the scope of the patent application, the gap is formed by a shim, and the force in the direction opposite to the twist direction is adjusted by the position and number of the shim. The mounting device according to item 14 of the scope of patent application, wherein the torsional correction means includes a transmission member that abuts the correction member and an actuator that transmits the transmission member. Forces in opposite directions. The mounting device according to item 11 of the patent application scope, wherein the beam further includes a bending correction means that presses the correction member in a bending direction of the beam and generates a force in a direction opposite to the bending direction by a reverse force thereof. . For example, the mounting device according to item 17 of the scope of patent application, wherein the bending correction means and the twist correction means are common and include: A downwardly extending male threaded member; An actuator that rotates the externally threaded member at a center of the beam in the first direction at a position deviated from the torsional rotation center; and The internally threaded member inserted into the externally threaded member, the correction member fixed to the inside of the beam, By rotating the externally threaded member by the actuator, the correcting member can be pressed in the downward direction, and the amount of pressing the correcting member can be changed. For example, the installation device described in any one of the 4, 6, 7, 9, 13, 18 patent application scopes further includes a control device, The beam and the mounting head are respectively provided with a rotation sensor or a level detection sensor or a beam displacement sensor, The control device controls the actuator based on a sensor output signal from the rotation sensor, the level detection sensor, or the beam displacement sensor. For example, the installation device described in item 19 of the patent application scope, wherein the control device is provided with a memory section that memorizes matters related to the output of the actuator, and is used to correct the installation action program of the product to be installed. The pre-sensor output signal of the above-mentioned rotation sensor or the above-mentioned level detection sensor or the above-mentioned displacement sensor of the beam and the bending or twisting, The actuator is controlled according to the sensor output signal and the related matters. The mounting device according to any one of claims 1 to 18, wherein the mounting head picks up and picks up a reversed wafer from a wafer supply, and places the wafer on a substrate on the mounting rack. A method for manufacturing a semiconductor device includes: Steps to prepare for installation of the device as described in any one of the claims 1 to 18; Steps to prepare the dicing wafer to keep the diced wafer; Steps for preparing a substrate; A step of picking up a wafer from the wafer; A step of reversing the above-mentioned wafer after picking up; and A step of picking up the inverted wafer and placing it on the substrate by the mounting head.