TW201936044A - Mounting device and method for manufacturing semiconductor device capable of preventing poor positioning accuracy of a mounting device - Google Patents
Mounting device and method for manufacturing semiconductor device capable of preventing poor positioning accuracy of a mounting device Download PDFInfo
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- TW201936044A TW201936044A TW108103202A TW108103202A TW201936044A TW 201936044 A TW201936044 A TW 201936044A TW 108103202 A TW108103202 A TW 108103202A TW 108103202 A TW108103202 A TW 108103202A TW 201936044 A TW201936044 A TW 201936044A
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- 238000000034 method Methods 0.000 title claims description 6
- 239000004065 semiconductor Substances 0.000 title claims description 5
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- 238000012937 correction Methods 0.000 claims abstract description 126
- 238000005452 bending Methods 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims description 46
- 238000003825 pressing Methods 0.000 claims description 29
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- 238000001514 detection method Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 7
- 238000006073 displacement reaction Methods 0.000 claims description 4
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 4
- 235000012431 wafers Nutrition 0.000 description 91
- 230000004048 modification Effects 0.000 description 50
- 238000012986 modification Methods 0.000 description 50
- 238000012546 transfer Methods 0.000 description 32
- 238000010586 diagram Methods 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 6
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
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Abstract
Description
本說明是關於安裝裝置,例如可運用於具備樑的安裝裝置。This description is about a mounting device, for example, it can be applied to a mounting device provided with a beam.
以往,作為零組件安裝裝置之一有相對於所固定的基板,從零組件供應部保持著零組件,將零組件搬運至基板上方,使零組件下降安裝於基板的零組件安裝機。該安裝機有將保持之零組件的XY方向(水平面內)的位置正確重現的必要。另一方面,為提升安裝基板的生產性,也有將零組件從零組件供應部搬運至基板上方,盡可能加快XY方向至定位為止的速度,或在安裝零組件之後返回至零組件供應部的速度等的必要。Conventionally, as one of the component mounting devices, there is a component mounting machine that holds a component from a component supply unit with respect to a fixed substrate, transports the component above the substrate, and lowers the component and mounts the component on the substrate. It is necessary for this mounting machine to accurately reproduce the position of the held components in the XY direction (in the horizontal plane). On the other hand, in order to improve the productivity of the mounting substrate, there are also cases where components are moved from the component supply unit to the substrate, and the speed in the XY direction to the positioning is accelerated as much as possible, or after the components are installed, they are returned to the component supply unit. Necessity of speed etc.
為此,零組件安裝機,具備:朝Y軸方向延伸固定於基板的Y樑;朝著可相對於上述Y樑滑動安裝的X軸方向延伸所配置的X樑;及可相對於上述X樑滑動安裝的安裝頭的構造。藉此,可正確且高速地搬運零組件(例如,日本專利特開2011-210895號公報)。
[先前技術文獻]
[專利文獻]To this end, the component mounting machine includes a Y beam extending and fixed to the substrate in the Y-axis direction, an X beam arranged to extend in the X-axis direction that can be slidably mounted with respect to the Y beam, and an X beam that can be disposed relative to the X beam. Structure of the slide-mounted mounting head. Thereby, a component can be conveyed accurately and at high speed (for example, Japanese Patent Laid-Open No. 2011-210895).
[Prior technical literature]
[Patent Literature]
[專利文獻1] 日本特開2011-210895號公報[Patent Document 1] Japanese Patent Laid-Open No. 2011-210895
[發明所欲解決之課題][Problems to be Solved by the Invention]
如專利文獻1記載的安裝裝置中,在可滑動地安裝有安裝頭的樑上,會有起因於樑及安裝頭的重量的彎曲產生,導致安裝位置定位精度不良。
本說明的課題是提供可降低樑的彎曲的安裝裝置。
其他的課題與新穎的特徵則可從本說明書的記載及添附圖示得以明確。
[用於解決課題的手段]In the mounting device described in Patent Document 1, a beam caused by the weight of the beam and the mounting head may be bent on the beam on which the mounting head is slidably mounted, resulting in poor positioning accuracy of the mounting position.
The subject of this description is to provide a mounting device capable of reducing the bending of a beam.
Other problems and novel features will be made clear from the description of this specification and the accompanying drawings.
[Means for solving problems]
本說明之中簡單說明代表性的概要有如下述。
亦即,安裝裝置,具備:安裝有安裝架的架台;跨上述架台上朝第一方向延伸並使其兩端分別朝第二方向自由移動地支撐於上述架台上的樑;及朝上述第一方向自由移動地支撐於上述樑的安裝頭。上述樑,具備:位在該樑內部朝上述第一方向延伸的矯正構件,及將上述矯正構件朝著上述樑的彎曲方向推壓以其反向力產生上述彎曲方向與相反方向的力的彎曲矯正手段。
[發明效果]The brief description of the representative in this description is as follows.
That is, the mounting device includes: a mounting platform on which a mounting frame is mounted; a beam that is supported on the mounting platform and extends across the mounting platform in a first direction and has both ends freely moved in the second direction; and toward the first The mounting head is supported movably in the direction of the beam. The beam includes a correction member located in the beam and extending in the first direction, and a bend that presses the correction member toward a bending direction of the beam to generate a force in the bending direction and an opposite direction by a reverse force thereof. Means of correction.
[Inventive effect]
藉由上述安裝裝置,可減少樑的彎曲。With the above mounting device, the bending of the beam can be reduced.
以下,針對比較例、實施形態、變形例及實施例,使用圖示說明。但是,以下的說明中,對相同構成元件賦予相同符號併省略重複的說明。並且,圖示為了更明確說明,與實際的樣態比較,會有針對各部的寬、厚度、形狀等以模式表示的場合,但亦僅為一例,不以此限定本發明的解釋。Hereinafter, a comparative example, an embodiment, a modification, and an Example are demonstrated using figure. However, in the following description, the same constituent elements are assigned the same reference numerals, and redundant descriptions are omitted. In addition, in order to make the description clearer, the width, thickness, and shape of each part may be represented by patterns in comparison with the actual situation. However, this is only an example, and the explanation of the present invention is not limited thereto.
<比較例>
首先,針對比較例的安裝裝置使用第1~3圖說明。第1圖是模式表示比較例之安裝裝置的正面圖。第2圖是模式表示第1圖之安裝裝置的上面圖。第3圖是模式表示第1圖之安裝裝置的側面圖。< Comparative example >
First, the mounting device of the comparative example will be described using FIGS. 1 to 3. Fig. 1 is a front view schematically showing a mounting device of a comparative example. Fig. 2 is a top view schematically showing the mounting device of Fig. 1; Fig. 3 is a side view schematically showing the mounting device of Fig. 1;
比較例的安裝裝置100R是將零組件300從零組件供應部(未圖示)搬運至工件200的上方,將搬運的零組件300裝設(安裝)於工件200的裝置。安裝裝置100,具備:架台110;支撐在架台110上的安裝架120;設置在架台110上的X支撐台131;支撐在X支撐台131上的Y樑140R;支撐於Y樑140R的安裝頭150;及朝Y軸方向及Z軸方向驅動安裝頭150的驅動部160。並且,X軸方向、Y軸方向是在水平面上彼此正交的方向,本比較例是如第2圖表示以Y樑140R延伸的方向為Y軸方向(第一方向),以和此正交的方向為X軸方向(第二方向)進行說明。並且,Z軸方向(第三方向)是與XY面垂直的上下方向。The mounting device 100R of the comparative example is a device that transfers the component 300 from the component supply unit (not shown) above the workpiece 200, and mounts (installs) the transferred component 300 on the workpiece 200. The mounting device 100 includes: a gantry 110; a mounting bracket 120 supported on the gantry 110; an X support base 131 provided on the gantry 110; a Y beam 140R supported on the X support base 131; and a mounting head supported on the Y beam 140R 150; and a driving section 160 that drives the mounting head 150 in the Y-axis direction and the Z-axis direction. In addition, the X-axis direction and the Y-axis direction are directions orthogonal to each other on a horizontal plane. In this comparative example, as shown in FIG. 2, the direction in which the Y beam 140R extends is the Y-axis direction (first direction) so as to be orthogonal to this. The description will be given with the X-axis direction (second direction). The Z-axis direction (third direction) is a vertical direction perpendicular to the XY plane.
安裝頭150是具有自由脫著保持零組件300之保持手段的裝置,在Y軸方向自由往返移動地安裝於Y樑140R。The mounting head 150 is a device having a holding means for freely holding the component 300, and is mounted on the Y beam 140R so as to freely move back and forth in the Y-axis direction.
本比較例的場合,具備3支安裝頭150,各安裝頭150具備有藉真空吸附保持零組件300的管嘴的保持手段151。又,驅動部160可分別使安裝頭150獨立地在Z軸方向升降。安裝頭150具備保持著零組件300搬運,將零組件300安裝在吸附固定於安裝架120之工件200上的功能。In the case of this comparative example, three mounting heads 150 are provided, and each mounting head 150 is provided with the holding | maintenance means 151 of the nozzle which holds the component 300 by vacuum adsorption. In addition, the driving unit 160 can individually raise and lower the mounting head 150 in the Z-axis direction. The mounting head 150 has a function of holding and carrying the component 300 and mounting the component 300 on the workpiece 200 that is suction-fixed to the mounting frame 120.
設置在X支撐台131上的導件132是引導Y樑140R在X軸方向自由滑動的構件。本比較例的場合,平行配置有2支的X支撐台131,各X支撐台131是以在X軸方向延伸的狀態固定於架台110。X支撐台131也可與架台110一體形成。The guide 132 provided on the X support table 131 is a member that guides the Y beam 140R to slide freely in the X-axis direction. In the present comparative example, two X support bases 131 are arranged in parallel, and each X support base 131 is fixed to the base 110 in a state extending in the X-axis direction. The X support stand 131 may be formed integrally with the stand 110.
如第1圖、第3圖表示,在導件132上安裝有在X軸方向自由移動的滑塊143。並且,在兩個導件132的各滑塊143之上,分別安裝有Y樑140R的各腳部142。亦即,Y樑140R的主樑部141是跨於安裝架120之上朝著Y軸方向延伸,兩端的各腳部142是安裝於滑塊143藉安裝於X支撐台131的導件132自由移動地支撐在X軸方向。並且,主樑部141的底面與腳部142的底面(滑塊143的上面)是位在同一面上,因此主樑部141是設置在從X支撐台131並非較高的位置。As shown in FIGS. 1 and 3, a slider 143 that is freely movable in the X-axis direction is attached to the guide 132. Further, on each of the sliders 143 of the two guides 132, each leg portion 142 of the Y beam 140R is attached. That is, the main beam portion 141 of the Y beam 140R extends across the mounting frame 120 and extends in the Y-axis direction. Each leg portion 142 at both ends is attached to the slider 143 and is freely provided by the guide member 132 attached to the X support base 131. It is movably supported in the X-axis direction. In addition, since the bottom surface of the main beam portion 141 and the bottom surface of the leg portion 142 (the upper surface of the slider 143) are located on the same surface, the main beam portion 141 is provided at a position not high from the X support base 131.
如第3圖表示,Y樑140R為棒形狀的構件,朝Y軸方向延伸配置的構件。Y樑140R的XZ剖面的形狀是具有配合四角形與直角三角形的梯形狀。As shown in FIG. 3, the Y-beam 140R is a rod-shaped member, and is a member arranged to extend in the Y-axis direction. The shape of the XZ cross section of the Y beam 140R is a ladder shape having a rectangular shape and a right triangle shape.
Y樑140R是引導安裝頭150在Y軸方向往返移動的構件,當往返移動的安裝頭150振動時會有使保持的零組件300落下等問題的產生,並且,為了將零組件300搬運到正確的位置而有盡可能抑制彎曲等的必要。因此,Y樑140R有具備充分之構造強度的必要。另一方面,Y樑140R是與安裝頭150一起沿著X支撐台131成直線往返移動的構件,越輕量越是可以高速搬運零組件300。The Y beam 140R is a member that guides the mounting head 150 to move back and forth in the Y-axis direction. When the mounting head 150 that moves back and forth vibrates, problems such as dropping the held component 300 may occur, and in order to carry the component 300 to the correct position, It is necessary to suppress bending and the like as much as possible. Therefore, it is necessary for the Y beam 140R to have sufficient structural strength. On the other hand, the Y beam 140R is a member that moves back and forth in a straight line along the X support table 131 together with the mounting head 150, and the lighter the weight, the higher the speed at which the component 300 can be transported.
接著,針對樑的彎曲與扭轉使用第4圖說明。第4(A)圖是說明樑的彎曲的圖,第4(B)圖是表示樑的剖面的圖。第5圖是說明第1圖的安裝裝置之課題的模式正面圖。第6圖是說明第1圖的安裝裝置之課題的模式側面圖。Next, the bending and twisting of the beam will be described using FIG. 4. FIG. 4 (A) is a diagram illustrating the bending of the beam, and FIG. 4 (B) is a diagram illustrating a cross section of the beam. Fig. 5 is a schematic front view illustrating the problem of the mounting device of Fig. 1. Fig. 6 is a schematic side view illustrating the problem of the mounting device of Fig. 1.
如第4(A)圖表示,彎曲量(d)是與樑長度(L)的三次方成比例地增大。並且,樑變長時,即使樑為相同的剛性也變得容易扭轉。又,賦予剛性的剖面二次方力矩是與第4(B)圖表示的樑剖面的寬(W)成比例,與高度(H)的三次方成比例。As shown in FIG. 4 (A), the amount of bending (d) increases in proportion to the third power of the beam length (L). Furthermore, when the beam becomes longer, it becomes easy to twist even if the beam has the same rigidity. The quadratic moment of the section that imparts rigidity is proportional to the width (W) of the beam section shown in FIG. 4 (B) and proportional to the cube of the height (H).
回到比較例說明。如第5圖表示,因主樑部141及安裝頭150的重量會使得主樑部141彎曲(第一課題)。其結果,使安裝頭150傾斜,會影響安裝位置(接著位置)、零組件(例如晶片)的傾斜。Back to the comparative example. As shown in FIG. 5, the weight of the main beam portion 141 and the mounting head 150 causes the main beam portion 141 to bend (first problem). As a result, tilting the mounting head 150 affects the tilting of the mounting position (adhesion position) and components (for example, wafers).
又,如第6圖表示,會因主樑部141及安裝頭150的重量使主樑部141扭轉(第二課題)。其結果,使安裝頭150傾斜,會影響安裝位置(接著位置)、零組件(例如晶片)的傾斜。As shown in FIG. 6, the main beam portion 141 is twisted due to the weight of the main beam portion 141 and the mounting head 150 (second problem). As a result, tilting the mounting head 150 affects the tilting of the mounting position (adhesion position) and components (for example, wafers).
在抑制彎曲上,有與彎曲成比例來提升Y樑140R的剛性的必要,但僅單純增加樑的剖面的寬(W)或高度(H)時會使得重量增加,因此有一邊維持輕量、高剛性並提升安裝位置之精度的必要。例如,為使位置精度小於數μm程度有將變形量有抑制在1μm程度的必要,但主樑部141的長度例如成為500mm以上時尤其是750mm以上的長度會因自重導致彎曲或扭轉之變形量抑制的困難。In order to suppress the bending, it is necessary to increase the rigidity of the Y beam 140R in proportion to the bending. However, simply increasing the width (W) or height (H) of the cross section of the beam will increase the weight. Therefore, while maintaining light weight, Necessary for high rigidity and improved accuracy of installation position. For example, in order to reduce the positional accuracy to less than several μm, it is necessary to suppress the amount of deformation to about 1 μm. However, when the length of the main beam portion 141 is, for example, 500 mm or more, especially the length of 750 mm or more, the amount of deformation caused by bending or twisting due to its own weight is required. Difficulty of suppression.
<第一實施形態>
接著,針對解決上述第一課題的第一實施形態使用第7圖、第8圖說明。第7圖是模式表示第一實施形態之安裝裝置的正面圖。第8圖是模式表示第一實施形態之Y樑的圖,第8(A)圖是模式表示使Y樑彎曲的狀態的圖,第8(B)圖是模式表示矯正Y樑的彎曲的狀態的圖。並且,第8(A)圖、第8(B)圖的各個左側是正面圖,右側是側面圖,顯示一部分透視地可看見內部構造。<First Embodiment>
Next, a first embodiment for solving the above-mentioned first problem will be described using FIGS. 7 and 8. Fig. 7 is a front view schematically showing the mounting apparatus of the first embodiment. Fig. 8 is a diagram schematically showing a Y beam of the first embodiment, Fig. 8 (A) is a diagram schematically showing a state in which the Y beam is bent, and Fig. 8 (B) is a diagram schematically showing a state in which the bending of the Y beam is corrected Illustration. 8 (A) and 8 (B) are each a front view on the left side and a side view on the right side, and a part of the internal structure is seen through perspective.
如第7圖表示,第一實施形態的安裝裝置100除了Y樑140之外與比較例的安裝裝置100R相同。As shown in FIG. 7, the mounting device 100 according to the first embodiment is the same as the mounting device 100R of the comparative example except for the Y beam 140.
如第8圖表示,第一實施形態的Y樑140,具備:從一方的腳部142的內部經由主樑部141的內部延伸至另一方的腳部142之內部的矯正構件144;以預定的高度支撐矯正構件144的端部的支撐構件145;設置在矯正構件144之Y軸方向的中央部的內螺紋構件146;插入內螺紋構件146的外螺紋構件147;及使外螺紋構件147旋轉的致動器148。矯正構件144、支撐構件145、內螺紋構件146及外螺紋構件147是位在Y樑140的內部,致動器148是固定於主樑部141之上。矯正構件144是例如四角柱狀,以輕量高剛性原料材(例如,碳纖維強化樹脂(Carbon Fiber Reinforced Plastic:CFRP)所形成,具有扭力桿功能。致動器148是以馬達等構成。As shown in FIG. 8, the Y beam 140 of the first embodiment includes: a correction member 144 extending from the inside of one leg portion 142 through the inside of the main beam portion 141 to the inside of the other leg portion 142; A support member 145 that highly supports the end of the correction member 144; an internally threaded member 146 provided at a center portion of the correction member 144 in the Y-axis direction; an externally threaded member 147 inserted into the internally threaded member 146; Actuator 148. The correction member 144, the support member 145, the internally threaded member 146, and the externally threaded member 147 are positioned inside the Y beam 140, and the actuator 148 is fixed on the main beam portion 141. The correction member 144 is, for example, a quadrangular prism, and is formed of a lightweight and highly rigid raw material (for example, Carbon Fiber Reinforced Plastic (CFRP)), and has a torsion bar function. The actuator 148 is a motor or the like.
設置在Y樑140內的矯正構件144是可矯正主樑部141的彎曲,藉著致動器148旋轉插入設置在矯正構件144的內螺紋構件146的外螺紋構件147,可藉此將矯正構件144的Y軸方向的中央部朝垂直方向推壓。變更外螺紋構件147的進給量(推壓量)可控制矯正構件144的推壓量。The correction member 144 provided in the Y beam 140 is capable of correcting the bending of the main beam portion 141, and the actuator 148 is rotatably inserted into the externally threaded member 147 of the internally threaded member 146 provided in the correction member 144, thereby allowing the correction member to be corrected. The central part of the Y-axis direction of 144 is pushed in the vertical direction. Changing the feed amount (pressing amount) of the externally threaded member 147 can control the pressing amount of the correction member 144.
如第8(A)圖表示,在主樑部141彎曲的狀態下,矯正構件144並非彎曲。如第8(B)圖表示,推壓矯正構件144,在主樑部141的內部產生與主樑部141之彎曲方向相反的方向(上推的方向)的力,可消除彎曲。藉此,可將安裝頭150的傾斜保持為平坦。As shown in FIG. 8 (A), in a state where the main beam portion 141 is bent, the correction member 144 is not bent. As shown in FIG. 8 (B), pressing the correcting member 144 generates a force in the main beam portion 141 in a direction opposite to the bending direction of the main beam portion 141 (upward pushing direction), thereby eliminating the bending. Thereby, the inclination of the mounting head 150 can be kept flat.
接著,根據安裝頭的位置針對調整螺紋構件的進給量使用第9圖說明。第9(A)圖為安裝頭位於中央附近時的模式正面圖,第9(B)圖為安裝頭位於端附近時的模式正面圖。第9圖是顯示一部分透視地可看見內部構造。Next, the feed amount of the adjustment screw member according to the position of the mounting head will be described using FIG. 9. Fig. 9 (A) is a schematic front view when the mounting head is located near the center, and Fig. 9 (B) is a schematic front view when the mounting head is near the end. Fig. 9 shows a part of the internal structure which is seen through perspective.
根據安裝頭150的位置使得主樑部141的彎曲量不同,在安裝頭150位於主樑部141的Y軸方向的中央附近時彎曲量變大,位於端附近時彎曲量變小。藉此,如第9(A)圖表示,安裝頭150位在主樑部141的中央附近時外螺紋構件147的進給量增大,如第9(B)圖表示,安裝頭150位在主樑部141的端附近時則外螺紋構件147的進給量減小。The amount of bending of the main beam portion 141 varies depending on the position of the mounting head 150. When the mounting head 150 is located near the center in the Y-axis direction of the main beam portion 141, the amount of bending becomes large, and when it is located near the end, the amount of bending becomes small. As a result, as shown in FIG. 9 (A), when the mounting head 150 is positioned near the center of the main beam portion 141, the feed amount of the externally threaded member 147 increases. As shown in FIG. 9 (B), the mounting head 150 is positioned at When the end of the main beam portion 141 is near, the feed amount of the male screw member 147 decreases.
外螺紋構件147是以馬達等的致動器148旋轉,因此外螺紋構件147的進給量(推壓量、旋轉位置)是藉著控制裝置(未圖示)控制致動器148而可自動調整。因此,對應安裝頭150的位置控制推壓矯正構件144的量可控制主樑部141的彎曲。The male screw member 147 is rotated by an actuator 148 such as a motor. Therefore, the feed amount (pushing amount, rotation position) of the male screw member 147 can be automatically controlled by controlling the actuator 148 with a control device (not shown). Adjustment. Therefore, the amount of pressing the correction member 144 corresponding to the position of the mounting head 150 can control the bending of the main beam portion 141.
又,在樑140及安裝頭150設置旋轉感測器、水平檢測感測器、樑的位移感測器等的檢測感測器,控制裝置也可以此感測器的訊號為基礎控制致動器148。藉此,控制回到不具彎曲狀態的感測器訊號位置,可藉以經常維持不彎曲的狀態。In addition, a detection sensor such as a rotation sensor, a level detection sensor, and a beam displacement sensor is provided in the beam 140 and the mounting head 150. The control device may control the actuator based on the signal of the sensor. 148. Thereby, the control is returned to the sensor signal position without the bending state, so that the non-bending state can be constantly maintained.
根據第一實施形態樑構造不以高剛性(高重量)構成,可進行對應根據輕量(低剛性)之構件的彎曲變形來進行強化,起因於樑的動作的變形、振動也可抑制在最小限。According to the first embodiment, the beam structure is not configured with high rigidity (high weight), and can be reinforced according to the bending deformation of a lightweight (low rigidity) member. Deformation and vibration due to the movement of the beam can be suppressed to a minimum limit.
<第一實施形態的變形例>
以下,針對第一實施形態的代表性變形例,進行數個例示。以下的變形例的說明中,相對於具有和上述實施形態說明的相同的構造及功能的部分,可使用與上述實施形態相同的符號。並且,針對相關部分的說明,在技術上不衝突的範圍內,適當援用上述實施形態中的說明。並且,上述實施形態的一部分,及複數變形例的全部或一部分在技術上不衝突的範圍內,可適當複合地運用。<Modification of First Embodiment>
Hereinafter, a few examples of the representative modification of the first embodiment will be described. In the following description of the modification, the same symbols as those of the above-mentioned embodiment may be used for portions having the same structure and function as those described in the above-mentioned embodiment. In addition, regarding the description of the relevant parts, the description in the above-mentioned embodiment is appropriately referred to within a technically non-conflicting range. In addition, a part of the above-mentioned embodiment and all or a part of the plural modification examples can be appropriately combined and used within a range that does not conflict technically.
第一實施形態雖已說明使用內螺紋構件146與外螺紋構件147推壓矯正構件144的例,但不限於此,只要是從主樑部141的上部側推壓內置於Y樑140的矯正構件144,可以其反向力將主樑部141上推的機構(彎曲矯正手段)即可。Although the first embodiment has described an example in which the correction member 144 is pushed using the internally threaded member 146 and the externally threaded member 147, it is not limited to this, as long as the correction member built in the Y beam 140 is pushed from the upper side of the main beam portion 141 144. A mechanism (bending correction means) for pushing up the main beam portion 141 by its reverse force is sufficient.
(第一變形例)
第一變形例是在矯正構件之上設置楔形的平面凸輪構件。針對第一變形例的Y樑使用第10圖說明。第10(A)圖是模式表示Y樑彎曲的狀態的圖。第10(B)圖是模式表示Y樑之彎曲矯正後的狀態的圖。並且,第10圖是顯示一部分透視地可看見內部構造。(First Modification)
The first modification is a wedge-shaped flat cam member provided on the correction member. The Y beam of the first modification will be described with reference to FIG. 10. Fig. 10 (A) is a diagram schematically showing a state in which the Y beam is bent. Fig. 10 (B) is a diagram schematically showing a state after the bending of the Y beam is corrected. In addition, Fig. 10 shows a part of the internal structure which is seen through perspective.
如第10圖表示,第一變形例的Y樑140A,具備:從一方的腳部142經由主樑部141延伸至另一方的腳部142的矯正構件144;以預定的高度支撐矯正構件144的端部的支撐構件145;設置在矯正構件144之Y軸方向的中央部的圓筒狀的旋轉構件149;楔形的平面凸輪構件14A;設置在平面凸輪構件14A的端部的承接構件146A;傳動構件147A;及傳動傳動構件147A的致動器148A。承接構件146A、傳動構件147A、致動器148A及平面凸輪構件14A是位在矯正構件144之上,旋轉構件149是固定於主樑部141的上部。As shown in FIG. 10, the Y beam 140A according to the first modification includes: a correction member 144 extending from one leg portion 142 to the other leg portion 142 through the main beam portion 141; Support member 145 at the end; cylindrical rotating member 149 provided at the center of the Y-axis direction of the correction member 144; wedge-shaped flat cam member 14A; receiving member 146A provided at the end of the flat cam member 14A; transmission A member 147A; and an actuator 148A that drives the transmission member 147A. The receiving member 146A, the transmission member 147A, the actuator 148A, and the flat cam member 14A are positioned above the correction member 144, and the rotating member 149 is fixed to the upper portion of the main beam portion 141.
將傳動構件147A藉致動器148A傳動至設置在矯正構件144之上的承接構件146A進行運送,藉以使平面凸輪構件14A在旋轉構件149之下朝著Y方向移動。藉此,與第一實施形態同樣地,可朝著垂直方向推壓矯正構件144。The transmission member 147A is transmitted to the receiving member 146A provided on the correction member 144 by the actuator 148A, and the flat cam member 14A is moved in the Y direction under the rotation member 149. Thereby, similarly to the first embodiment, the correction member 144 can be pressed in the vertical direction.
如第10(A)圖表示,在主樑部141彎曲的狀態,矯正構件144不彎曲。如第10(B)圖表示,推壓矯正構件144,在主樑部141的內部產生與主樑部141的彎曲方向相反方向(上推方向)的力,可消除彎曲。As shown in FIG. 10 (A), in a state where the main beam portion 141 is bent, the correction member 144 is not bent. As shown in FIG. 10 (B), when the correction member 144 is pushed, a force in a direction opposite to the bending direction of the main beam portion 141 (upward pushing direction) is generated inside the main beam portion 141, thereby eliminating the bending.
根據第一變形例,可以將重量物的馬達等的致動器設置在彎曲影響少的兩側的腳部。According to the first modification, actuators such as a motor for a heavy object can be provided on the leg portions on both sides with less influence of bending.
(第二變形例)
第二變形例是在Y樑之上設置楔構件。針對第二變形例的Y樑使用第11圖說明。第11圖是模式表示第二變形例之Y樑的圖,第11(A)圖是模式表示Y樑彎曲後的狀態的圖。第11(B)圖是模式表示Y樑的彎曲矯正後的狀態的圖。並且,第11(A)圖、第11(B)圖是顯示一部分透視地可看見內部構造。(Second Modification)
The second modification is a wedge member provided on the Y beam. The Y beam of the second modification will be described using FIG. 11. Fig. 11 is a diagram schematically showing a Y beam of a second modification, and Fig. 11 (A) is a diagram schematically showing a state after the Y beam is bent. Fig. 11 (B) is a diagram schematically showing a state after the bending correction of the Y beam. In addition, Figs. 11 (A) and 11 (B) show a part of the internal structure that can be seen through perspective.
如第11圖表示,第二變形例的Y樑140B,具備:從一方的腳部142經由主樑部141延伸至另一方的腳部142的矯正構件144;以預定的高度支撐矯正構件144的端部的支撐構件145;設置在矯正構件144之Y軸方向的中央部的旋轉構件149B;平面凸輪構件14AB;設置在平面凸輪構件14AB的承接構件146B;傳動構件147B;及傳動傳動構件147B的致動器148B。承接構件146B、傳動構件147B、致動器148B及平面凸輪構件14AB是位在主樑部141之上,旋轉構件149B是固定於矯正構件144之上。As shown in FIG. 11, the Y beam 140B according to the second modification includes a correction member 144 extending from one leg portion 142 to the other leg portion 142 via the main beam portion 141, and a support member 144 that supports the correction member 144 at a predetermined height. A support member 145 at the end; a rotating member 149B provided at the center of the Y-axis direction of the correction member 144; a flat cam member 14AB; a receiving member 146B provided at the flat cam member 14AB; a transmission member 147B; and a transmission member 147B Actuator 148B. The receiving member 146B, the transmission member 147B, the actuator 148B, and the planar cam member 14AB are positioned above the main beam portion 141, and the rotating member 149B is fixed to the correction member 144.
將傳動構件147B藉致動器148B傳動至設置在主樑部141之上的承接構件146B進行運送,藉以使平面凸輪構件14AB在旋轉構件149B之上朝著Y方向移動。藉此,與第一實施形態同樣地,可朝著垂直方向推壓矯正構件144。The transmission member 147B is transmitted to the receiving member 146B provided on the main beam portion 141 by the actuator 148B, and the flat cam member 14AB is moved in the Y direction above the rotating member 149B. Thereby, similarly to the first embodiment, the correction member 144 can be pressed in the vertical direction.
如第11(A)圖表示,在主樑部141彎曲的狀態,矯正構件144不彎曲。如第11(B)圖表示,推壓矯正構件144,在主樑部141的內部產生與主樑部141的彎曲方向相反方向(上推方向)的力,可消除彎曲。As shown in FIG. 11 (A), in a state where the main beam portion 141 is bent, the correction member 144 is not bent. As shown in FIG. 11 (B), when the correcting member 144 is pushed, a force in a direction opposite to the bending direction of the main beam portion 141 (upward pushing direction) is generated inside the main beam portion 141, and the bending can be eliminated.
(第三變形例)
第三變形例是在Y樑之上從中心偏離的位置設置安裝有軸之圓板的偏心凸輪構件。針對第三變形例的Y樑使用第12圖說明。第12圖是模式表示第三變形例之Y樑的圖,第12(A)圖是模式表示Y樑彎曲後的狀態的圖,第12(B)圖是模式表示Y樑之彎曲矯正後的狀態的圖,第12(A)圖為正面圖,第12(B)圖為側面圖,顯示一部分透視地可看見內部構造。(Third Modification)
A third modification is an eccentric cam member in which a circular plate on which a shaft is mounted is provided at a position deviated from the center above the Y beam. The Y beam of the third modification will be described using FIG. 12. Fig. 12 is a diagram schematically showing a Y beam of a third modified example, Fig. 12 (A) is a diagram schematically showing a state after the Y beam is bent, and Fig. 12 (B) is a diagram showing the Y beam bending after the correction Figure 12 (A) is a front view, and Figure 12 (B) is a side view, showing a part of which the internal structure can be seen through perspective.
如第12圖表示,第三變形例的Y樑140C,具備:從一方的腳部142經由主樑部141延伸至另一方的腳部142的矯正構件144;以預定的高度支撐矯正構件144的端部的支撐構件145;設置在矯正構件144之Y軸方向的中央部的旋轉構件149C;偏心凸輪構件14B;及使偏心凸輪構件14B的軸旋轉的致動器148C。致動器148C及偏心凸輪構件14B是位在主樑部141之上,旋轉構件149C是固定於矯正構件144之上。As shown in FIG. 12, the Y beam 140C according to the third modification includes a correction member 144 extending from one leg portion 142 to the other leg portion 142 via the main beam portion 141, and a support member 144 that supports the correction member 144 at a predetermined height. A support member 145 at the end; a rotation member 149C provided at a central portion in the Y-axis direction of the correction member 144; an eccentric cam member 14B; and an actuator 148C that rotates the shaft of the eccentric cam member 14B. The actuator 148C and the eccentric cam member 14B are positioned above the main beam portion 141, and the rotation member 149C is fixed above the correction member 144.
藉著致動器148C旋轉設置在主樑部141之上的偏心凸輪構件14B的軸,藉以使偏心凸輪構件14B在旋轉構件149C之上旋轉。藉此,與第一實施形態同樣地,可朝著垂直方向推壓矯正構件144。The shaft of the eccentric cam member 14B provided above the main beam portion 141 is rotated by the actuator 148C, so that the eccentric cam member 14B is rotated above the rotating member 149C. Thereby, similarly to the first embodiment, the correction member 144 can be pressed in the vertical direction.
如第12圖表示,推壓矯正構件144,在主樑部141的內部產生與主樑部141的彎曲方向相反方向(上推方向)的力,可消除彎曲。As shown in FIG. 12, when the correcting member 144 is pushed, a force in a direction opposite to the bending direction of the main beam portion 141 (upward direction) is generated inside the main beam portion 141, and the bending can be eliminated.
<第二實施形態>
接著,針對解決上述第二課題的第二實施形態使用第13圖說明。第13圖是模式表示第二實施形態之Y樑的圖,模式表示Y樑彎曲後之狀態的圖,第13(A)圖為正面圖,第13(B)圖為側面圖,顯示一部分透視地可看見內部構造。<Second Embodiment>
Next, a second embodiment for solving the above-mentioned second problem will be described using FIG. 13. Fig. 13 is a view schematically showing a Y-beam of the second embodiment. The mode is a view showing a state after the Y-beam is bent. Fig. 13 (A) is a front view, and Fig. 13 (B) is a side view, showing a part of the perspective. The ground can see the internal structure.
如第13圖表示,第二實施形態的Y樑140D,具備:從一方的腳部142經由主樑部141延伸至另一方的腳部142的矯正構件144D;以預定的高度支撐矯正構件144D的端部的支撐構件145D及設置在矯正構件144的Y方向之中央部的內螺紋構件146D;內螺紋構件146D與外螺紋構件147;及使外螺紋構件147旋轉的致動器148。矯正構件144D、支撐構件145D、內螺紋構件146D及外螺紋構件147是位在Y樑140D的內部,致動器148是固定於主樑部141之上。矯正構件144D是例如以輕量高剛性原料材(例如,碳纖維強化樹脂(Carbon Fiber Reinforced Plastic:CFRP)所形成。As shown in FIG. 13, the Y beam 140D of the second embodiment includes a correction member 144D extending from one leg portion 142 to the other leg portion 142 through the main beam portion 141, and a support member 144D that supports the correction member 144D at a predetermined height. An end support member 145D and an internally threaded member 146D provided at a central portion in the Y direction of the correction member 144; the internally threaded member 146D and the externally threaded member 147; and an actuator 148 that rotates the externally threaded member 147. The correction member 144D, the support member 145D, the internally threaded member 146D, and the externally threaded member 147 are positioned inside the Y-beam 140D, and the actuator 148 is fixed on the main beam portion 141. The correction member 144D is formed of, for example, a lightweight and high-rigidity raw material (for example, Carbon Fiber Reinforced Plastic: CFRP).
矯正構件144D在縱深方向(X方向)的長度比第一實施形態的矯正構件144長,內螺紋構件146D也比第一實施形態的內螺紋構件146更固定在深側(X軸正方向側)。The length of the correction member 144D in the depth direction (X direction) is longer than that of the correction member 144 of the first embodiment, and the internally threaded member 146D is also more fixed on the deep side (positive side of the X axis) than the internally threaded member 146 of the first embodiment. .
藉著致動器148旋轉插入設置於矯正構件144D之內螺紋構件146D的外螺紋構件147,藉此可朝著垂直方向推壓矯正構件144D。藉著變更外螺紋構件147的進給量(推壓量)可控制矯正構件144D的推壓量。The externally threaded member 147 provided in the internally threaded member 146D of the correction member 144D is rotatably inserted by the actuator 148, whereby the correction member 144D can be pressed in the vertical direction. By changing the feed amount (pressing amount) of the male screw member 147, the pressing amount of the correction member 144D can be controlled.
如第13(B)圖表示,推壓矯正構件144D,在主樑部141的內部產生與主樑部141的扭轉方向相反方向(上推方向)的力,可消除扭轉。換言之,藉著推壓從矯正構件144D的中心偏離處的驅動機構,推壓從矯正構件144D的扭轉之旋轉中心的偏離處以產生扭轉力矩,朝著抵銷因矯正構件144D及安裝頭150的重量扭轉之成分的方向推壓矯正構件144D,消除產生扭轉力矩的扭轉。As shown in FIG. 13 (B), when the correcting member 144D is pushed, a force in a direction opposite to the twisting direction (upward pushing direction) of the main beam portion 141 is generated inside the main beam portion 141, and the twist can be eliminated. In other words, by pushing the driving mechanism at the deviation from the center of the correction member 144D, the deviation from the rotation center of the torsion of the correction member 144D is pushed to generate a torsional moment, and the weight of the correction member 144D and the mounting head 150 is offset. The direction of the torsional component pushes the correction member 144D, thereby eliminating the torsion that generates a torsional moment.
與第一實施形態同樣,對應安裝頭150之Y方向的位置控制推壓矯正構件144D的量將主樑部141的扭轉及安裝頭150的傾斜保持為平坦。扭轉量是根據安裝頭150的位置而變動,因此藉推壓量控制對應安裝頭150D的位置而消除的扭轉力矩量。As in the first embodiment, the amount of position-control pressing correction member 144D corresponding to the Y direction of the mounting head 150 keeps the twist of the main beam portion 141 and the tilt of the mounting head 150 flat. The amount of twisting varies according to the position of the mounting head 150. Therefore, the amount of torsional torque that is eliminated corresponding to the position of the mounting head 150D is controlled by the amount of pushing.
又,與第一實施形態同樣地,在樑140及安裝頭150設置旋轉感測器或水平檢測感測器等的角度檢測感測器等,控制裝置也可以此感測器的訊號為基礎控制致動器148。藉此,經常地控制回到不具扭轉狀態的感測器訊號位置,可藉此經常維持不扭轉的狀態。In addition, similar to the first embodiment, the beam 140 and the mounting head 150 are provided with an angle detection sensor such as a rotation sensor or a level detection sensor, and the control device may perform control based on a signal from the sensor. Actuator 148. Thereby, the sensor signal position is constantly controlled to return to the non-twisted state, so that the non-twisted state can be constantly maintained.
<第二實施形態的變形例>
以下,針對第二實施形態的代表性變形例,進行數個例示。以下的變形例的說明中,相對於具有和上述第一實施形態及第二實施形態說明的相同的構造及功能的部分,可使用與上述第一實施形態及第二實施形態相同的符號。並且,針對相關部分的說明,在技術上不衝突的範圍內,適當援用上述第一實施形態及第二實施形態中的說明。並且,上述第一實施形態及第二實施形態的一部分,及複數變形例的全部或一部分在技術上不衝突的範圍內,可適當複合地運用。<Modification of Second Embodiment>
Hereinafter, a few examples of the representative modification of the second embodiment will be described. In the description of the following modifications, the same symbols as those in the first and second embodiments may be used for parts having the same structure and functions as those described in the first and second embodiments. In addition, regarding the description of the relevant parts, the descriptions in the first embodiment and the second embodiment are appropriately referred to within a technically non-conflicting range. In addition, a part of the first embodiment and the second embodiment, and all or a part of the plural modifications can be appropriately combined and used within a range that does not conflict technically.
第二實施形態雖已說明使用內螺紋構件146D與外螺紋構件147推壓矯正構件144D的例,但不限於此,只要是在抵銷因重量扭轉的成分的方向,產生扭轉力矩以消除扭轉的機構(扭轉矯正手段)即可。Although the second embodiment has described an example in which the correction member 144D is pushed using the internally-threaded member 146D and the externally-threaded member 147, it is not limited to this, as long as the component that is twisted by weight is offset, a torque is generated to eliminate the twist. Mechanism (reversing correction means).
(第四變形例)
針對第四變形例的安裝裝置使用第14~18圖說明。第14圖是模式表示第四變形例之安裝裝置的透視圖。第15圖是模式表示第四變形例之Y樑的透視圖。第16圖是說明第15圖之Y樑的扭轉矯正的模式圖,第16(A)圖是表示扭轉前的狀態的側面圖,第16(B)圖是表示扭轉後的狀態的側面圖,第16(C)圖是表示扭轉矯正後的狀態的模式側面圖。第17圖是說明根據安裝頭的位置之扭轉量不同的模式圖,第17(A)圖是表示安裝頭位在腳部側的場合的側面圖,第17(B)圖是表示安裝頭位在腳部側與中央部側之間的場合的側面圖,第17(C)圖是表示安裝頭位在中央部的場合的側面圖。第18圖是說明根據安裝頭的位置變更調整用填隙片之安裝量的模式圖,第18(A)圖是表示安裝頭位在腳部側的場合的側面圖,第18(B)圖是表示安裝頭位在腳部側與中央部側之間的場合的側面圖,第18(C)圖是表示安裝頭位在中央部的場合的側面圖。(Fourth Modification)
The mounting device according to the fourth modification will be described with reference to FIGS. 14 to 18. Fig. 14 is a perspective view schematically showing a mounting device according to a fourth modification. Fig. 15 is a perspective view schematically showing a Y beam according to a fourth modification. Fig. 16 is a schematic diagram illustrating the torsional correction of the Y beam of Fig. 15. Fig. 16 (A) is a side view showing a state before torsion, and Fig. 16 (B) is a side view showing a state after torsion. Fig. 16 (C) is a schematic side view showing a state after torsional correction. Fig. 17 is a schematic diagram illustrating the amount of twisting according to the position of the mounting head. Fig. 17 (A) is a side view showing a case where the mounting head is on the leg side, and Fig. 17 (B) is a view showing the mounting head FIG. 17 (C) is a side view of a case where the leg portion is located between the leg portion side and the center portion side, and is a side view showing a case where a head is mounted on the center portion. FIG. 18 is a schematic diagram illustrating how the amount of the shims for adjustment is changed according to the position of the mounting head. FIG. 18 (A) is a side view showing the case where the mounting head is positioned on the leg side, and FIG. 18 (B) FIG. 18 (C) is a side view showing a case where the mounting head is located between the leg portion and the center portion side, and FIG. 18 (C) is a side view showing the case where the mounting head is located at the center portion.
第四變形例的實施裝置100E是實施形態的安裝裝置100與Y樑的構造不同,但其他的構造相同。第四變形例的Y樑140E是比主樑部141的底面與腳部142的底面(滑塊143的上面)更位在下方。並且,在Y樑140E的背面(在與安裝有主樑部141E的安裝頭150的面相反側的面),透過調整用填隙片(間隙調整板)14D安裝翹曲矯正板14C所構成。調整填隙片14D是調整間隙的薄鋼板,例如預先準備數種預定的厚度,適當選擇此後組入。The implementation device 100E of the fourth modification is different in the structure of the mounting device 100 and the Y-beam from the embodiment, but the other structures are the same. The Y beam 140E of the fourth modification is positioned below the bottom surface of the main beam portion 141 and the bottom surface of the leg portion 142 (the upper surface of the slider 143). Further, a warpage correction plate 14C is mounted on the back surface of the Y beam 140E (the surface opposite to the surface of the mounting head 150 on which the main beam portion 141E is mounted) through the adjustment shim (gap adjustment plate) 14D. The gap adjusting sheet 14D is a thin steel sheet for adjusting the gap. For example, a plurality of predetermined thicknesses are prepared in advance, and then they are appropriately selected and incorporated.
如第16(A)圖、第16(B)圖表示,根據安裝頭150及主樑部141E的重量使主樑部141E扭轉。為此,如第16(C)圖表示,在主樑部141E的Y軸方向之中央部的下部側追加矯正扭轉量的調整用填隙片14D。亦即,在主樑部141E的背面以將安裝頭150等因自重而產生扭轉的相反方向的方式安裝矯正翹曲之扭轉剛性高的板,對應扭轉的量賦予主樑部141E相反方向扭轉的力來抵銷、降低扭轉量。藉此,即使主樑部141E輕量化致剛性降低仍可成為抵銷其量的構造,兼具輕量化與高精度。As shown in FIGS. 16 (A) and 16 (B), the main beam portion 141E is twisted according to the weight of the mounting head 150 and the main beam portion 141E. For this reason, as shown in FIG. 16 (C), an adjustment shim 14D for correcting the amount of twist is added to the lower side of the central portion in the Y-axis direction of the main beam portion 141E. That is, a plate having a high torsional rigidity for correcting warpage is mounted on the back surface of the main beam portion 141E so that the mounting head 150 and the like are twisted in the opposite direction due to their own weight. Force to offset and reduce the amount of twist. Thereby, even if the weight of the main beam portion 141E is reduced due to the reduction in rigidity, the structure can be offset, and both the weight and the accuracy can be achieved.
如第17(A)圖表示,在安裝頭150位於主樑部141E的端部側(腳部142E側)的場合,接近主樑部141E的支撐部而不易扭轉。如第17(B)圖、第17(C)圖表示,安裝頭150越是移朝主樑部141E的中央部移動,越是會因主樑部141E的剛性而容易扭轉。As shown in FIG. 17 (A), when the mounting head 150 is located on the end portion side (the leg portion 142E side) of the main beam portion 141E, the support portion is close to the support portion of the main beam portion 141E and is not easily twisted. As shown in FIG. 17 (B) and FIG. 17 (C), the more the mounting head 150 moves toward the center portion of the main beam portion 141E, the more it is easily twisted due to the rigidity of the main beam portion 141E.
為此,如第18(A)圖表示,在主樑部141E的端部側(腳部142E側)不插入調整用填隙片14D,如第18(B)圖、第18(C)圖表示,越是接近主樑部141E的中央部插入越多的調整用填隙片14D。藉此,越是中央部翹曲矯正板14C的反向力變得越大,可對應扭轉的量賦予主樑部141E相反方向扭轉的力來抵銷、降低扭轉量。For this reason, as shown in FIG. 18 (A), the adjustment shim 14D is not inserted into the end portion side (leg portion 142E side) of the main beam portion 141E, as shown in FIGS. 18 (B) and 18 (C). It is shown that the closer to the center portion of the main beam portion 141E, the more the adjustment shim 14D is inserted. Thereby, as the reverse force of the central portion warpage correcting plate 14C becomes larger, a force to which the main beam portion 141E is twisted in the opposite direction according to the amount of twist can be offset and reduced.
(第五變形例)
第五變形例是設置朝翹曲矯正板產生反向力的機構。針對第五變形例的Y樑使用第19圖說明。第19圖是模式表示第五變形例之Y樑的圖,第19(A)圖是表示安裝頭位在腳部側的場合的側面圖,第19(B)圖是表示安裝頭位在腳部側與中央部側之間的場合的側面圖,第19(C)圖是表示安裝頭位在中央部的場合的側面圖。(Fifth Modification)
A fifth modification is a mechanism that generates a reverse force toward the warpage correction plate. The Y beam of the fifth modification will be described using FIG. 19. Fig. 19 is a view schematically showing a Y beam of a fifth modification. Fig. 19 (A) is a side view showing a case where the mounting head is on the foot side, and Fig. 19 (B) is a view showing the mounting head on the foot. FIG. 19 (C) is a side view of the case where the part is located between the center side and the center part side, and is a side view showing a case where the mounting head is positioned at the center part.
如第19(A)圖表示,第四變形例的Y樑140E具備:在主樑部141E內的傳動構件147F,及傳動傳動構件147F的致動器148F。As shown in FIG. 19 (A), the Y beam 140E of the fourth modification includes a transmission member 147F in the main beam portion 141E, and an actuator 148F that transmits the transmission member 147F.
藉致動器148A將傳動構件147F朝著X軸方向傳動,可藉此將翹曲矯正板14C的下部朝著X方向推壓。The actuator 148A is used to drive the transmission member 147F in the X-axis direction, thereby pushing the lower portion of the warpage correction plate 14C in the X-direction.
與第四變形例同樣,如第17(A)圖表示,在安裝頭150位於主樑部141E的端部側(腳部142E側)的場合,接近主樑部141E的支撐部而不易扭轉。如第17(B)圖、第17(C)圖表示,安裝頭150越是朝主樑部141E的中央部移動,越是會因主樑部141E的剛性而容易扭轉。Similar to the fourth modification, as shown in FIG. 17 (A), when the mounting head 150 is located on the end side (leg portion 142E side) of the main beam portion 141E, the support portion near the main beam portion 141E is difficult to twist. As shown in FIG. 17 (B) and FIG. 17 (C), the more the mounting head 150 moves toward the center portion of the main beam portion 141E, the more it is easily twisted due to the rigidity of the main beam portion 141E.
為此,如第19(A)圖表示,在安裝頭150位於主樑部141E的端部側的場合,不推壓傳動構件147F,如第19(B)圖、第19(C)圖表示,安裝頭150越是接近主樑部141E的中央部推壓傳動構件147F的量變得越多。藉此,與第四變形例同樣,越是中央部翹曲矯正板14C的反向力變得越大,可對應扭轉的量賦予主樑部141E相反方向扭轉的力來抵銷、降低扭轉量。Therefore, as shown in FIG. 19 (A), when the mounting head 150 is located on the end side of the main beam portion 141E, the transmission member 147F is not pushed, as shown in FIGS. 19 (B) and 19 (C). As the mounting head 150 approaches the central portion of the main beam portion 141E, the amount by which the transmission member 147F is pressed becomes larger. As a result, as in the fourth modification, as the reverse force of the central portion warpage correction plate 14C becomes larger, a reverse force can be applied to the main beam portion 141E in the opposite direction in accordance with the amount of twist to offset and reduce the amount of twist. .
又,對應安裝頭的定位位置以校正台或計算來控制推壓量,可藉此自動進行樑的扭轉校正。此時,也可追隨著頭種類變更、組換等的頭重量變化,可更簡便地進行扭轉校正。In addition, a correction table or calculation is used to control the pressing amount corresponding to the positioning position of the mounting head, thereby automatically performing torsional correction of the beam. In this case, it is possible to follow the change in head weight such as head type change and replacement, and to more easily perform twist correction.
(第六變形例)
雖已說明第一實施形態為矯正樑的彎曲的例,第二實施形態為矯正樑的扭轉的例,但針對矯正樑的彎曲及樑的扭轉雙方的例(第六變形例)使用第20圖說明。第20圖是模式表示第六變形例之Y樑的圖,第20(A)圖是模式表示彎曲大而扭轉小的場合之構造的側面圖,第20(B)圖是模式表示彎曲小而扭轉大的場合之構造的側面圖。(Sixth Modification)
Although the first embodiment has been described as an example of correcting the bending of the beam and the second embodiment is an example of correcting the torsion of the beam, FIG. 20 is used for an example (sixth modification) of both the bending of the beam and the torsion of the beam Instructions. Fig. 20 is a view schematically showing a Y beam of a sixth modification, and Fig. 20 (A) is a side view schematically showing a structure in a case where the bending is large and the twist is small, and Fig. 20 (B) is a mode showing a small bending and Side view of the structure where the twist is large.
第六變形例的Y樑140G雖是與第二實施形態的Y樑140D相同的構造,但可變更內螺紋構件146D、外螺紋構件147及致動器148之X軸方向的位置可對應實機的狀態來調整矯正構件144D的推壓位置。Although the Y beam 140G of the sixth modification has the same structure as the Y beam 140D of the second embodiment, the position of the X-axis direction of the internally threaded member 146D, the externally threaded member 147, and the actuator 148 can be changed to correspond to the actual machine. To adjust the pressing position of the correction member 144D.
Y樑140G的彎曲大而扭轉小的場合,如第20(A)圖表示,將推壓矯正構件144D的位置調整至X軸方向的中央附近。推壓矯正構件144D的中央附近,藉此可以和第一實施形態相同的作用以和Y樑140G的彎曲及第二實施形態相同的作用來降低Y樑140G的扭轉。When the bending of the Y beam 140G is large and the twist is small, as shown in FIG. 20 (A), the position of the pressing correction member 144D is adjusted to be near the center in the X-axis direction. By pressing the vicinity of the center of the correction member 144D, it is possible to reduce the twist of the Y beam 140G by the same effect as that of the first embodiment and by the bending of the Y beam 140G and the second embodiment.
Y樑140G的彎曲小,扭轉大的場合,如第20(B)圖表示,將推壓矯正構件144D的位置調整至X軸方向的外側附近。推壓矯正構件144D的端部,藉此可以和第二實施形態相同的作用以和Y樑140G的扭轉及第一實施形態相同的作用來降低Y樑140G的彎曲。When the bending of the Y beam 140G is small and the twist is large, as shown in FIG. 20 (B), the position of the pressing correction member 144D is adjusted to be near the outer side in the X-axis direction. By pressing the end portion of the correction member 144D, it is possible to reduce the bending of the Y beam 140G by the same effect as that of the second embodiment and by the twist of the Y beam 140G and the same effect of the first embodiment.
因此,藉著在從中央到端部之間調整推壓矯正構件144D的位置,可降低Y樑140G的彎曲及扭轉的雙方。Therefore, by adjusting the position of the pressing correction member 144D from the center to the end, both the bending and twisting of the Y beam 140G can be reduced.
以下,針對將上述的實施形態的Y樑運用於安裝裝置的一例之覆晶接著機的例說明,但不限於此,也可運用於將封裝後的半導體裝置等安裝於基板的晶片安裝機(表面安裝機)或將半導體晶片(晶片)黏著於基板等的晶片接著機。並且,覆晶接著機是例如使用於在超過晶片面積的寬廣區域形成再配線層之封裝的散出型晶圓級封裝(Fan Out Wafer Level Package:FOWLP)等的製造。
[實施例1]In the following, an example of a flip chip bonding machine that uses the Y beam of the above embodiment as an example of a mounting device is described, but it is not limited to this, and can also be applied to a wafer mounting machine that mounts a packaged semiconductor device or the like on a substrate Surface mounter) or a wafer bonding machine that adheres a semiconductor wafer (wafer) to a substrate or the like. In addition, the flip-chip bonding machine is, for example, a Fan Out Wafer Level Package (FOWLP) used for forming a package for forming a redistribution layer over a wide area over a wafer area.
[Example 1]
第21圖是表示實施例1之覆晶接著機的概略的上面圖。第22圖是說明在第21圖中從箭頭A方向看時,拾放翻轉頭、轉移頭及接著頭的動作的圖。Fig. 21 is a top view showing the outline of a flip chip bonding machine of the first embodiment. FIG. 22 is a diagram illustrating the operations of the pick-and-place flip head, the transfer head, and the bonding head when viewed from the direction of arrow A in FIG. 21.
覆晶接著機10大致具有:晶片供應部1、拾放部2、轉移部8、中間載台部3、接著部4、搬運部5、基板供應部6K、基板搬出部6H及監視並控制各部的動作的控制裝置7。The flip-chip bonding machine 10 roughly includes a wafer supply section 1, a pick and place section 2, a transfer section 8, an intermediate stage section 3, a bonding section 4, a transfer section 5, a substrate supply section 6K, a substrate carry-out section 6H, and various monitoring and control sections. The control device 7 of the operation.
首先,晶片供應部1是供應安裝於基板等之基板P的晶片D。晶片供應部1具有:保持分割後之晶圓11的晶圓保持台12;以從晶圓11頂起晶片D的點線表示的頂起單元13;及切晶片供應部18。晶片供應部1是藉著未圖示的驅動手段朝XY方向移動,頂起拾取的晶片D朝向單元13的位置移動。切晶片供應部18具有收納切晶片的晶片匣,依序將切晶片供應至晶片供應部1,更換新的切晶片。晶片供應部1是以可從切晶片拾放預定晶片的方式,在拾放點移動切晶片。切晶片是固定晶片可安裝於晶片供應部1的支架。First, the wafer supply unit 1 is a wafer D that supplies a substrate P mounted on a substrate or the like. The wafer supply unit 1 includes a wafer holding table 12 that holds the divided wafer 11, an ejection unit 13 indicated by a dotted line that lifts the wafer D from the wafer 11, and a wafer supply unit 18. The wafer supply unit 1 is moved in the XY direction by a driving means (not shown), and the picked-up wafer D is moved toward the unit 13. The dicing wafer supply unit 18 includes a wafer cassette that stores diced wafers, sequentially supplies the diced wafers to the wafer supply unit 1, and replaces the diced wafers with new ones. The wafer supply unit 1 moves the dicing wafer at a pick-and-place point so that a predetermined wafer can be picked and set from the dicing wafer. The dicing wafer is a holder on which the wafer can be mounted on the wafer supply unit 1.
拾放部2具有:拾取晶片D後反轉的拾放翻轉頭21,及使夾頭22升降、旋轉、反轉及X方向移動之未圖示的各驅動部。藉由以上的構成,拾放翻轉頭21拾取晶片,將拾放翻轉頭21旋轉180度,反轉晶片D的緩衝後向下面,將晶片D形成傳遞轉移頭81的姿勢。The pick-and-place unit 2 includes a pick-and-place reversing head 21 which is reversed after picking up the wafer D, and drive units (not shown) which raise, lower, rotate, reverse, and move the chuck 22 in the X direction. With the above configuration, the pick-and-place reversing head 21 picks up the wafer, rotates the pick-and-place reversing head 21 by 180 degrees, reverses the buffering of the wafer D to the lower side, and forms the wafer D into the transfer transfer head 81 posture.
轉移部8是從拾放翻轉頭21接受反轉後的晶片D,載放於中間載台31。轉移部8具有:與拾放翻轉頭21同樣具備將晶片D吸附保持於前端之夾頭82的轉移頭81,及將轉移頭81朝著Y方向移動的Y驅動部83。The transfer unit 8 receives the inverted wafer D from the pick-and-place reversing head 21, and places the wafer D on the intermediate stage 31. The transfer unit 8 includes a transfer head 81 that includes a chuck 82 that holds and holds the wafer D on the front end, and a Y driving unit 83 that moves the transfer head 81 in the Y direction, similarly to the pick-and-place flip head 21.
中間載台部3具有暫時載放晶片D的中間載台31及載台辨識攝影機34。中間載台31是可藉未圖示的驅動部在Y方向移動。The intermediate stage unit 3 includes an intermediate stage 31 on which the wafer D is temporarily placed, and a stage identification camera 34. The intermediate stage 31 is movable in the Y direction by a driving unit (not shown).
接著部4是從中間載台31拾取晶片D,接著於搬運來的基板P上。接著部4具有:與拾放翻轉頭21同樣具備將晶片D吸附保持於前端之夾頭42的接著頭41:將接著頭41朝著Y方向移動的Y樑43;攝影基板P的位置辨識標記(未圖示),辨識接著位置的基板辨識攝影機44;及X支撐台45。
藉由以上的構成,接著頭41從中間載台31拾取晶片D,根據基板辨識攝影機44的攝影數據將晶片D接著於基板P。The adhering section 4 picks up the wafer D from the intermediate stage 31, and then picks up the transferred substrate P. The adhering section 4 includes an adhering head 41 that includes a chuck 42 that holds and holds the wafer D on the front end in the same manner as the pick-and-place reversing head 21: a Y beam 43 that moves the adhering head 41 in the Y direction; and a position identification mark for the imaging substrate P (Not shown), a substrate recognition camera 44 that recognizes a subsequent position, and an X support table 45.
With the above configuration, the next head 41 picks up the wafer D from the intermediate stage 31, and then attaches the wafer D to the substrate P based on the imaging data of the substrate recognition camera 44.
搬運部5具備基板P朝X方向移動的搬運軌道51、52。搬運軌道51、52是設置成平行。藉由如以上的構成,從基板供應部6K搬出基板P,沿著搬運軌道51、52移動至接著位置,在接著後移動至基板搬出部6H,朝基板搬出部6H傳遞基板P。在將晶片D接著於基板P中,基板供應部6K搬出新的基板P,在搬運軌道51、52上待機。The transfer unit 5 includes transfer rails 51 and 52 that move the substrate P in the X direction. The conveyance rails 51 and 52 are provided in parallel. With the configuration described above, the substrate P is carried out from the substrate supply unit 6K, moved to the next position along the conveyance rails 51 and 52, and then moved to the substrate carry-out unit 6H, and the substrate P is transferred to the substrate carry-out unit 6H. After the wafer D is bonded to the substrate P, the substrate supply unit 6K unloads a new substrate P and waits on the transfer rails 51 and 52.
第23圖是表示第21圖的晶片供應部之主要部的概略剖面圖。如第23圖表示,晶片供應部1具有:保持切晶片14的伸縮環15;保持於切晶片14將黏著有複數晶片D的切割片16水平定位的支撐環17;及將晶片D向上方頂起用的頂起單元13。為拾取預定的晶片D,頂起單元13藉著未圖示的驅動機構朝上下方向移動,晶片供應部1是朝水平方向移動。Fig. 23 is a schematic cross-sectional view showing a main part of the wafer supply unit of Fig. 21. As shown in FIG. 23, the wafer supply unit 1 includes: an expansion ring 15 that holds the dicing wafer 14; a support ring 17 that holds the dicing wafer 16 to which the dicing wafer 16 having a plurality of wafers D is horizontally held; and a wafer D that is pushed upward. Jacking unit In order to pick up a predetermined wafer D, the jacking unit 13 is moved in a vertical direction by a driving mechanism (not shown), and the wafer supply unit 1 is moved in a horizontal direction.
針對接著部一邊參閱實施形態一邊使用第7圖、第24圖說明。第24圖是表示接著部4之主要部的概略側面圖。一部分的構成元件是以透視表示。並且,第24圖的側面圖為第7圖的正面圖。The following description will be given with reference to FIGS. 7 and 24 while referring to the embodiment. FIG. 24 is a schematic side view showing a main part of the bonding part 4. Some of the constituent elements are shown in perspective. The side view of FIG. 24 is a front view of FIG. 7.
接著部4具備:支撐於架台53(架台110)之上的接著載台BS(安裝架120);設置在搬運軌道51、52的附近的X支撐台451(X支撐台131);支撐於X支撐台451之上的Y樑43(Y樑140);支撐於Y樑43的接著頭41(安裝頭150);及在Y軸方向及Z軸方向驅動接著頭41的驅動部46(驅動部160)。The adhering section 4 includes a following stage BS (mounting bracket 120) supported on the gantry 53 (gantry 110), an X support base 451 (X support base 131) provided near the conveyance rails 51 and 52, and supported by X Y beam 43 (Y beam 140) on the supporting table 451; a bonding head 41 (mounting head 150) supported on the Y beam 43; and a driving portion 46 (driving portion) that drives the bonding head 41 in the Y-axis direction and the Z-axis direction 160).
接著頭41是具有可自由脫著地保持晶片D(零組件300)之夾頭42(保持手段151)的裝置,在Y軸方向自由往返移動地安裝於Y樑43。Next, the head 41 is a device having a chuck 42 (holding means 151) that can freely hold the wafer D (component 300), and is mounted on the Y beam 43 in a freely reciprocating manner in the Y-axis direction.
本實施例的場合,具備一個接著頭41,接著頭41具備藉真空吸附保持晶片D的夾頭42。又,驅動部46可以使接著頭41在Z軸方向升降。接著頭41具備從中間載台31保持拾取後的晶片D進行搬運,將晶片D安裝於吸附固定在接著載台BS之基板P(工件200)上的功能。In the present embodiment, one bonding head 41 is provided, and the bonding head 41 is provided with a chuck 42 for holding the wafer D by vacuum suction. The driving unit 46 can raise and lower the bonding head 41 in the Z-axis direction. Next, the head 41 has a function of holding the picked-up wafer D from the intermediate stage 31 for conveyance, and mounting the wafer D on the substrate P (workpiece 200) that is suction-fixed to the subsequent stage BS.
設置於X支撐台451之上的導件132是可在X軸方向自由滑動引導Y樑43的構件。本實施例的場合,將兩個X支撐台451平行配置,各X支撐台451是以朝X軸方向延伸的狀態固定在搬運軌道52、53上。X支撐台451也可以和搬運軌道52、53形成為一體。The guide 132 provided on the X support base 451 is a member that can slide the Y beam 43 in the X-axis direction so as to freely slide. In the present embodiment, two X-supporting tables 451 are arranged in parallel, and each X-supporting table 451 is fixed to the transport rails 52 and 53 in a state of extending in the X-axis direction. The X support table 451 may be integrated with the conveyance rails 52 and 53.
如第21圖、第24圖表示,在導件452之上安裝有在X軸方向自由移動的滑塊433。並且,在兩個導件452的各滑塊433之上,分別安裝著Y樑43的兩端部。亦即,Y樑43是跨接著載台BS之上地朝Y軸方向延伸,兩端部是藉安裝於滑塊433並安裝於X支撐台451的導件452支撐成可在X軸方向自由移動。並且,Y樑43的底面與滑塊433的上面是位在同一面上,因此Y樑43從X支撐台451並未設置在較高的位置。As shown in FIGS. 21 and 24, a slider 433 that is freely movable in the X-axis direction is mounted on the guide 452. Furthermore, both ends of the Y beam 43 are mounted on the sliders 433 of the two guides 452, respectively. That is, the Y beam 43 extends in the Y-axis direction across the stage BS, and both ends are supported by the guide 452 mounted on the slider 433 and the X-supporting table 451 so as to be free in the X-axis direction. mobile. In addition, since the bottom surface of the Y beam 43 and the upper surface of the slider 433 are located on the same surface, the Y beam 43 is not disposed at a higher position from the X support base 451.
實施例1的Y樑43與第一實施形態的Y樑140基本上為相同的構成。但是,Y樑43是比圖面上右側的支撐台451更向右側形成大的延伸。這是由於接著頭41可從中間載台31拾取晶片D。並且,接著頭41較支撐台451更向右側移動時接著頭41上升以使得夾頭42成為比導件452更高。The Y beam 43 of the first embodiment has substantially the same structure as the Y beam 140 of the first embodiment. However, the Y beam 43 has a larger extension to the right than the support 451 on the right in the drawing. This is because the head 41 can then pick up the wafer D from the intermediate stage 31. Then, when the head 41 moves further to the right than the support table 451, the head 41 rises so that the chuck 42 becomes higher than the guide 452.
接著,使用第25圖說明在實施例1之覆晶接著機中實施的接著方法(半導體裝置的製造方法)。第25圖是表示以實施例1之覆晶接著機實施之接著方法的流程。Next, a bonding method (a method for manufacturing a semiconductor device) performed in the flip-chip bonding machine according to the first embodiment will be described with reference to FIG. 25. Fig. 25 is a flowchart showing a bonding method implemented by the flip-chip bonding machine of Example 1.
步驟S1:控制裝置7移動晶圓保持台12使拾取的晶片D位在頂起單元13的正上方,將剝離對象晶片定位在頂起單元13與夾頭22。移動頂起單元13使頂起單元13的上面接觸於切割片16的內面。此時,控制裝置7將切割片16吸附於頂起單元13的上面。控制裝置7一邊真空吸引夾頭22一邊下降,著落於剝離對象的晶片D之上,吸附晶片D。控制裝置7使夾頭22上升,將晶片D從切割片16剝離。藉此,晶片D被拾放翻轉頭21所拾取。Step S1: The control device 7 moves the wafer holding table 12 so that the picked-up wafer D is positioned directly above the jacking unit 13, and positions the peeling target wafer on the jacking unit 13 and the chuck 22. The jacking unit 13 is moved so that the upper surface of the jacking unit 13 contacts the inner surface of the cutting blade 16. At this time, the control device 7 adsorbs the cutting sheet 16 on the upper surface of the jacking unit 13. The control device 7 descends while sucking the chuck 22 in a vacuum, lands on the wafer D to be peeled, and sucks the wafer D. The control device 7 raises the chuck 22 and peels the wafer D from the dicing sheet 16. Thereby, the wafer D is picked up by the pick-and-place flip head 21.
步驟S2:控制裝置7移動拾放翻轉頭21。Step S2: The control device 7 moves the pick-and-place turning head 21.
步驟S3:控制裝置7將拾放翻轉頭21旋轉180度,使晶片D的緩衝面(表面)反轉朝下面,使晶片D的緩衝(表面)反轉朝下面,將晶片D形成傳遞轉移頭81的姿勢。Step S3: The control device 7 rotates the pick-and-place flip head 21 by 180 degrees, so that the buffer surface (surface) of the wafer D is turned downward, and the buffer (surface) of the wafer D is turned downward, so that the wafer D forms a transfer transfer head. 81 pose.
步驟S4:控制裝置7從拾放翻轉頭21的夾頭22藉轉移頭81的夾頭82拾取晶片D,進行晶片D的收送。Step S4: The control device 7 picks up the wafer D from the chuck 22 of the pick-up reversing head 21 by the chuck 82 of the transfer head 81, and sends and receives the wafer D.
步驟S5:控制裝置7將拾放翻轉頭21反轉,使夾頭22的吸附面向下。Step S5: The control device 7 reverses the pick-and-place flip head 21 so that the suction side of the chuck 22 faces downward.
步驟S6:在步驟S5之前或並行,控制裝置7使轉移頭81向中間載台31移動。Step S6: Before or in parallel with step S5, the control device 7 moves the transfer head 81 toward the intermediate stage 31.
步驟S7:控制裝置7將保持在轉移頭81的晶片D載放於中間載台31。Step S7: The control device 7 places the wafer D held on the transfer head 81 on the intermediate stage 31.
步驟S8:控制裝置7將轉移頭81移動至晶片D的收送位置。Step S8: The control device 7 moves the transfer head 81 to the delivery position of the wafer D.
步驟S9:在步驟S8之後或並行,控制裝置7將中間載台31移動至與接著頭41的收送位置。Step S9: After or in parallel with step S8, the control device 7 moves the intermediate stage 31 to the delivery position following the head 41.
步驟SA:控制裝置7從中間載放台31藉著接著頭41的夾頭拾取晶片D,進行晶片D的收送。Step SA: The control device 7 picks up the wafer D from the intermediate placing table 31 by the chuck following the head 41, and sends and receives the wafer D.
步驟SB:控制裝置7將中間載台31移動至與轉移頭81的收送位置。Step SB: The control device 7 moves the intermediate stage 31 to the feeding position with the transfer head 81.
步驟SC:控制裝置7將接著頭41之夾頭42保持的晶片D移動至基板P上。Step SC: The control device 7 moves the wafer D held by the chuck 42 of the head 41 onto the substrate P.
步驟SD:控制裝置7從中間載放台31將以接著頭41的夾頭42拾取後的晶片D載放在基板P上。Step SD: The control device 7 places the wafer D picked up by the chuck 42 following the head 41 from the intermediate stage 31 on the substrate P.
步驟SE:控制裝置7將接著頭41移動至與中間載放台31的收送位置。
[實施例2]Step SE: The control device 7 moves the bonding head 41 to a feeding position with the intermediate placing table 31.
[Example 2]
第26圖是表示實施例2的覆晶接著機之概略的上面圖。Fig. 26 is a top view schematically showing a flip-chip bonding machine according to the second embodiment.
覆晶接著機10A大致具有:晶片供應部1、拾放部2、轉移部8A、8B、中間載台部3、接著部4A、4B、搬運部5、基板供應部6K、基板搬出部6H及監視並控制各部的動作的控制裝置7。The flip chip bonding machine 10A roughly includes a wafer supply section 1, a pick and place section 2, a transfer section 8A, 8B, an intermediate stage section 3, a bonding section 4A, 4B, a transport section 5, a substrate supply section 6K, a substrate carry-out section 6H, and A control device 7 that monitors and controls the operation of each unit.
晶片供應部1是與實施例1相同。拾放部2是與實施例1相同。拾放翻轉頭21拾取晶片,將拾放翻轉頭21旋轉180度,反轉晶片D的緩衝後向下面,將晶片D形成傳遞轉移頭81A、81B的姿勢。The wafer supply unit 1 is the same as the first embodiment. The pick-and-place section 2 is the same as the first embodiment. The pick and place reversing head 21 picks up the wafer, rotates the pick and place reversing head 21 by 180 degrees, reverses the buffering of the wafer D, and then moves the wafer D downward to form the transfer transfer heads 81A and 81B.
轉移部8A、8B是從拾放翻轉頭21接受反轉後的晶片D,載放於中間載台31A、31B。轉移部8A、8B與拾放翻轉頭21同樣具備將晶片D吸附保持於前端之夾頭82A、82B的轉移頭81A、81B,及將轉移頭81A、81B朝著X軸方向移動的X驅動部83A、83B。The transfer sections 8A and 8B are wafers D that have been received from the pick and place reversing head 21 and placed on the intermediate stages 31A and 31B. The transfer sections 8A and 8B include the transfer heads 81A and 81B that hold the wafer D on the front end of the chucks 82A and 82B as well as the pick-and-place flip head 21, and an X drive section that moves the transfer heads 81A and 81B in the X-axis direction. 83A, 83B.
中間載台部3A、3B具有暫時載放晶片D的中間載台31A、31B及載台辨識攝影機34A、34B。中間載台31A、31B是可藉未圖示的驅動部在Y軸方向移動。The intermediate stage sections 3A and 3B include intermediate stages 31A and 31B on which the wafer D is temporarily placed and stage identification cameras 34A and 34B. The intermediate stages 31A and 31B are movable in the Y-axis direction by a driving unit (not shown).
接著部4A、4B是從中間載台31A、31B拾取晶片D,接著於搬運來的基板P上。接著部4A、4B具有:與拾放翻轉頭21同樣具備將晶片D吸附保持於前端之夾頭42A、42B的接著頭41A、41B:將接著頭41A、41B朝著Y軸方向移動的Y樑43A、43B;攝影基板P的位置辨識標記(未圖示),辨識接著位置的基板辨識攝影機44A、44B;及X支撐台45。
藉由以上的構成,接著頭41A、41B從中間載台31A、31B拾取晶片D,根據基板辨識攝影機44A、44B的攝影數據將晶片D接著於基板P。The following sections 4A and 4B pick up the wafer D from the intermediate stages 31A and 31B, and then pick up the transferred substrate P. The bonding sections 4A and 4B include the bonding heads 41A and 41B provided with the chucks 42A and 42B for holding and holding the wafer D to the front end, similar to the pick-and-turn head 21, and a Y beam that moves the bonding heads 41A and 41B in the Y-axis direction. 43A, 43B; position identification marks (not shown) of the imaging substrate P, substrate identification cameras 44A, 44B that identify subsequent positions, and an X support table 45.
With the above configuration, the heads 41A and 41B pick up the wafer D from the intermediate stages 31A and 31B, and then attach the wafer D to the substrate P based on the imaging data of the substrate recognition cameras 44A and 44B.
搬運部5具備基板P朝X方向移動的搬運軌道51、52。搬運軌道51、52是設置成平行。藉由如以上的構成,從基板供應部6K搬出基板P,沿著搬運軌道51、52移動至接著位置,在接著後移動至基板搬出部6H,朝基板搬出部6H傳遞基板P。在將晶片D接著於基板P中,基板供應部6K搬出新的基板P,在搬運軌道51、52上待機。The transfer unit 5 includes transfer rails 51 and 52 that move the substrate P in the X direction. The conveyance rails 51 and 52 are provided in parallel. With the configuration described above, the substrate P is carried out from the substrate supply unit 6K, moved to the next position along the conveyance rails 51 and 52, and then moved to the substrate carry-out unit 6H, and the substrate P is transferred to the substrate carry-out unit 6H. After the wafer D is bonded to the substrate P, the substrate supply unit 6K unloads a new substrate P and waits on the transfer rails 51 and 52.
Y樑43A是與實施例1的Y樑43相同,Y樑43B是與Y樑43A成對稱的構造。The Y beam 43A is the same as the Y beam 43 of the first embodiment, and the Y beam 43B has a structure symmetrical to the Y beam 43A.
以上,雖根據實施形態、變形例及實施例已具體說明本發明人所研創的發明,但本發明不限於上述實施形態、變形例及實施例,當然可進行種種變更。As mentioned above, although the invention invented by the present inventors has been specifically described based on the embodiments, modifications, and examples, the present invention is not limited to the above-mentioned embodiments, modifications, and examples, and of course, various changes can be made.
例如,實施形態雖是在矯正構件使用輕量高剛性原料材(CFRP)的例說明,但不限於此,矯正構件也可使用形狀記憶合金,以在恢復形狀時反向力作用於樑的彎曲或扭轉的形狀,可控制形狀記憶溫度並控制彎曲量及扭轉量。並且,也可以使用磁性形狀記憶合金。另外,也可使用雙金屬以線性溫度調整反向力。For example, although the embodiment is an example of using a lightweight and high-rigidity material (CFRP) for the correction member, it is not limited to this. A shape memory alloy may also be used for the correction member so that a reverse force acts on the bending of the beam when the shape is restored. Or twisted shape, you can control the shape memory temperature and control the amount of bending and twisting. Alternatively, a magnetic shape memory alloy may be used. Alternatively, a bimetal can be used to adjust the counterforce at a linear temperature.
又,第一實施形態及第二實施形態雖已說明在樑140及安裝頭150設置旋轉感測器或水平檢測感測器等的角度檢測感測器等,以此感測器的訊號控制致動器148的例,但也可如下述,在以事先安裝之製品的安裝動作程式動作時將採樣的感測器輸出訊號記憶在控制裝置的記憶部,事先算出記憶在記憶部的感測器訊號輸出與矯正彎曲與扭轉用之致動器輸出的相關事項記憶於記憶部。也可根據其記憶的相關事項及感測器的訊號,對應各安裝製品的程式(處方:各製品的動作順序)實施消除彎曲或扭轉的控制,可反應良好地除去彎曲與扭轉。In addition, although the first embodiment and the second embodiment have been described as installing an angle detection sensor such as a rotation sensor or a level detection sensor in the beam 140 and the mounting head 150, the signal of the sensor is used to control the signal. An example of the actuator 148, but as described below, the sensor output signal of the sampled sensor is stored in the memory portion of the control device when it is operated by the installation action program of the product installed in advance, and the sensor stored in the memory portion is calculated in advance. Matters related to signal output and actuator output for correcting bending and twisting are stored in the memory section. According to the related matters memorized and the signal of the sensor, the control to eliminate bending or twisting can be implemented in accordance with the program (prescription: sequence of movement of each product) of each mounted product, and the bending and twisting can be removed well.
又,實施例1、實施例2雖已說明使用第一實施形態之Y樑的例,但不限於此,也可使用第二實施形態、從第一變形例至第六變形例的其中之一或組合的Y樑。In the first and second embodiments, an example using the Y beam of the first embodiment has been described, but the invention is not limited to this. One of the second embodiment and one of the first to sixth modifications may be used. Or combined Y beam.
又,實施例1、實施例2中雖已說明接著頭(安裝頭)一個的例,但不限於此,也可以和實施形態相同的複數的接著頭。In addition, although an example of one bonding head (mounting head) has been described in the first and second embodiments, the present invention is not limited to this, and a plurality of bonding heads similar to the embodiment may be used.
又,實施例1、實施例2中,雖已說明將反轉機構設置在拾放翻轉頭,以轉移頭從拾放翻轉頭接受晶片載放於中間載台,移載中間載台的例,但不限於此,也可以將拾取晶片後反轉的拾放翻轉頭移動,在可旋轉晶片的內外的載台單元載放拾取後的晶片D,移動載台單元。In the first and second embodiments, an example has been described in which the reversing mechanism is provided on the pick-and-place reversing head, and the transfer head receives the wafer from the pick-and-place reversing head to place the wafer on the intermediate stage and transfer the intermediate stage. However, the present invention is not limited to this, and the pick-and-place flip head that is reversed after picking up the wafer may be moved, and the picked-up wafer D may be placed on a stage unit inside and outside the rotatable wafer, and the stage unit may be moved.
100‧‧‧安裝裝置100‧‧‧Installation device
110‧‧‧架台 110‧‧‧stand
120‧‧‧安裝架 120‧‧‧Mounting frame
131‧‧‧X支撐台 131‧‧‧X support table
132‧‧‧導件 132‧‧‧Guide
140‧‧‧Y樑 140‧‧‧Y Beam
141‧‧‧主樑部 141‧‧‧Main beam section
142‧‧‧腳部 142‧‧‧foot
143‧‧‧滑塊 143‧‧‧ slider
150‧‧‧安裝頭 150‧‧‧Mounting head
160‧‧‧驅動部 160‧‧‧Driver
200‧‧‧工件 200‧‧‧ Workpiece
300‧‧‧零組件 300‧‧‧Parts
第1圖是模式表示比較例之安裝裝置的正面圖。Fig. 1 is a front view schematically showing a mounting device of a comparative example.
第2圖是模式表示第1圖之安裝裝置的上面圖。 Fig. 2 is a top view schematically showing the mounting device of Fig. 1;
第3圖是模式表示第1圖之安裝裝置的側面圖。 Fig. 3 is a side view schematically showing the mounting device of Fig. 1;
第4圖是針對樑的彎曲與扭轉說明的圖。 Fig. 4 is a diagram explaining the bending and twisting of the beam.
第5圖是說明第1圖的安裝裝置之課題的模式正面圖。 Fig. 5 is a schematic front view illustrating the problem of the mounting device of Fig. 1.
第6圖是說明第1圖的安裝裝置之課題的模式側面圖。 Fig. 6 is a schematic side view illustrating the problem of the mounting device of Fig. 1.
第7圖是模式表示第一實施形態之安裝裝置的正面圖。 Fig. 7 is a front view schematically showing the mounting apparatus of the first embodiment.
第8圖是模式表示第一實施形態之Y樑的圖。 Fig. 8 is a view schematically showing a Y beam of the first embodiment.
第9圖是說明藉安裝頭的位置調整進給螺絲之進給量的模式正面圖。 Fig. 9 is a schematic front view illustrating the adjustment of the feed amount of the feed screw by the position of the mounting head.
第10圖是模式表示第一變形例之Y樑的圖。 Fig. 10 is a view schematically showing a Y beam according to a first modification.
第11圖是模式表示第二變形例之Y樑的圖。 Fig. 11 is a view schematically showing a Y beam according to a second modification.
第12圖是模式表示第三變形例之Y樑的圖。 Fig. 12 is a view schematically showing a Y beam according to a third modification.
第13圖是模式表示第二實施形態之Y樑的圖。 Fig. 13 is a view schematically showing a Y beam of the second embodiment.
第14圖是模式表示第四變形例之安裝裝置的透視圖。 Fig. 14 is a perspective view schematically showing a mounting device according to a fourth modification.
第15圖是模式表示第四變形例之Y樑的透視圖。 Fig. 15 is a perspective view schematically showing a Y beam according to a fourth modification.
第16圖是說明第15圖之Y樑的扭轉矯正的模式圖。 FIG. 16 is a schematic diagram illustrating torsional correction of the Y beam of FIG. 15.
第17圖是說明根據安裝頭的位置之扭轉量不同的模式圖。 Fig. 17 is a schematic diagram illustrating a difference in the amount of twisting according to the position of the mounting head.
第18圖是說明根據安裝頭的位置變更調整用填隙片之安裝量的模式圖。 FIG. 18 is a schematic diagram illustrating a change in the amount of the shims for adjustment according to the position of the mounting head.
第19圖是模式表示第五變形例之Y樑的圖。 Fig. 19 is a view schematically showing a Y beam according to a fifth modification.
第20圖是模式表示第六變形例之Y樑的圖。 Fig. 20 is a view schematically showing a Y beam according to a sixth modification.
第21圖是表示實施例1之覆晶接著機的概略的上面圖。 Fig. 21 is a top view showing the outline of a flip chip bonding machine of the first embodiment.
第22圖是說明在第21圖中從箭頭A方向看時,拾放翻轉頭、轉移頭及接著頭的動作的圖。 FIG. 22 is a diagram illustrating the operations of the pick-and-place flip head, the transfer head, and the bonding head when viewed from the direction of arrow A in FIG. 21.
第23圖是表示第21圖的晶片供應部之主要部的概略剖面圖。 Fig. 23 is a schematic cross-sectional view showing a main part of the wafer supply unit of Fig. 21.
第24圖是表示第21圖之接著部的主要部的概略側面圖。 Fig. 24 is a schematic side view showing a main portion of a bonding portion of Fig. 21;
第25圖是表示以實施例1之覆晶接著機實施的接著方法的流程。 FIG. 25 is a flowchart showing a bonding method performed by the flip chip bonding machine of Example 1. FIG.
第26圖是表示實施例2的覆晶接著機之概略的上面圖。 Fig. 26 is a top view schematically showing a flip-chip bonding machine according to the second embodiment.
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