KR20230039542A - Mounting device and manufacturing method of semiconductor device - Google Patents

Abstract

The present invention is to provide a technique for improving mounting position alignment accuracy. A mounting device includes: a mount on which a mounting stage is installed; a beam extended in a first direction so as to span the mount and supported on the mount so as to be movable at both ends in a second direction; a mounting head unit supported by the beam so as to be movable in the first direction; a reference member spaced apart from the beam, extending in the first direction, and supported at both ends; and a detection head provided in the mounting head unit to face the reference member. The detection head is configured to detect a positional relationship with the reference member.

Description

Manufacturing method of mounting device and semiconductor device {MOUNTING DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE}

The present disclosure relates to a mounting device, and is applicable to a mounting device having a beam, for example.

[0002] Conventionally, as one component mounting apparatus, there is a component mounting machine that holds components from a component supply unit with respect to a fixed board, conveys the components to an upper side of the board, and lowers the components to install them on the board. The mounting machine needs to accurately reproduce the position of the held component in the XY direction (inside the horizontal plane). On the other hand, in order to improve the productivity of the mounted board, the speed at which the components are transported from the component supply section to the upper side of the board until positioning in the XY direction is performed, the speed at which the components are mounted and returned to the component supply section, etc. also needs to be done as quickly as possible.

Therefore, a component mounting machine as a mounting device includes an X beam that is stretched and fixed to the base in the X-axis direction, a Y-beam that is installed to be slidably installed in the Y-axis direction that is installed to be slidable with respect to the X-beam, and is slidable with respect to the Y-beam. It has a structure having a mounting head installed in such a way. This makes it possible to convey the parts accurately and at high speed.

Japanese Unexamined Patent Publication No. 2019-145607

In the mounting device as described above, the Y beam on which the mounting head is slidably installed may warp due to the weight or thermal deformation of the Y beam and the mounting head, resulting in poor mounting alignment accuracy.

An object of the present disclosure is to provide a technique for improving mounting alignment accuracy. Other problems and novel features will become clear from the description of the present specification and accompanying drawings.

A brief outline of representative ones of the present disclosure is as follows.

That is, the mounting apparatus includes a mount on which a mounting stage is installed, a beam extended in a first direction so as to span the mount and supported on the mount so that both ends thereof are movable in a second direction, respectively, and a beam supported on the mount in the first direction. A mounting head movably supported by the beam, a reference member spaced apart from the beam, extending in the first direction and supported at both ends, and a detection head provided on the mounting head facing the reference member. to provide The detection head is configured to detect a positional relationship with the reference member.

According to the present disclosure, the mounting position alignment accuracy can be improved.

1 is a top view schematically showing a mounting device in a comparative example.
Fig. 2 is a front view schematically showing the mounting device shown in Fig. 1;
Fig. 3 is a side view schematically showing the mounting device shown in Fig. 1;
Fig. 4 is a schematic front view illustrating problems of the mounting device shown in Fig. 1;
Fig. 5 is a schematic side view illustrating problems of the mounting device shown in Fig. 1;
Fig. 6 is a schematic top view illustrating problems of the mounting device shown in Fig. 1;
Fig. 7 is a top view schematically showing the mounting device in the first embodiment.
FIG. 8 is a diagram schematically showing a cross section along line AA shown in FIG. 7 .
Fig. 9 is a front view schematically showing the mounting device shown in Fig. 7;
Fig. 10 is a front view showing a bent state of the main beam part shown in Fig. 7;
Fig. 11 is a front view showing a state in which the mounting head shown in Fig. 10 is located on the right side.
Fig. 12 is a sectional view of a mounting device in a first modified example along a cross section corresponding to line AA shown in Fig. 7 .
Fig. 13 is a cross-sectional view showing a twisted state of the main beam part in the mounting device shown in Fig. 12;
Fig. 14 is a top view schematically showing a mounting device in the second embodiment.
Fig. 15 is a front view schematically showing the mounting device shown in Fig. 14;
Fig. 16 is a cross-sectional view along line AA shown in Fig. 14 .
Fig. 17 is a cross-sectional view showing a twisted state of the main beam part in the mounting device shown in Fig. 16;
Fig. 18 is a diagram explaining the linear scale in the second embodiment.
Fig. 19 is a top view schematically showing a mounting device in a second modified example.
Fig. 20 is a top view showing a bent state of the main beam part shown in Fig. 19;
Fig. 21 is a top view schematically showing a mounting device in a third embodiment.
Fig. 22 is a front view schematically showing the mounting device shown in Fig. 21;
Fig. 23 is a cross-sectional view taken along line AA shown in Fig. 21 .
Fig. 24 is a front view showing a bent state of the main beam part shown in Fig. 22;
Fig. 25 is a cross-sectional view showing a twisted state of the main beam portion shown in Fig. 23;
Fig. 26 is a front view schematically showing a mounting device in a third modified example.
27 is a cross-sectional view at a position corresponding to line AA shown in FIG. 21 .
Fig. 28 is a front view schematically showing a mounting device in a fourth modified example.
Fig. 29 is a cross-sectional view at a position corresponding to line AA shown in Fig. 21 .
30 is a front view schematically showing a mounting device in a fifth modified example.
Fig. 31 is a cross-sectional view at a position corresponding to line AA shown in Fig. 21;
Fig. 32 is a top view schematically showing a mounting device in a fourth embodiment.
Fig. 33 is a front view schematically showing the mounting device shown in Fig. 32;
FIG. 34 is a diagram showing a state in which the mounting head or the like of the mounting device shown in FIG. 8 has collapsed.
Fig. 35 is a diagram showing a method of fixing a reference bar by a support member;
Fig. 36 is a schematic top view of a flip chip bonder of an embodiment.
Fig. 37 is a diagram explaining the operation of the pickup flip head, transfer head and bonding head when viewed from the direction of arrow A in Fig. 36;
Fig. 38 is a schematic sectional view showing a main part of the die supply section in Fig. 36;
Fig. 39 is a schematic side view showing a main part of the bonding part of Fig. 36;
Fig. 40 is a flowchart showing a bonding method performed in the flip chip bonder shown in Fig. 36;

Hereinafter, comparative examples, embodiments, modified examples, and examples will be described using drawings. However, in the following description, the same reference numerals are assigned to the same components, and repeated explanations are omitted in some cases. In addition, in order to make explanation clearer, although the width, thickness, shape, etc. of each part may be schematically expressed compared with an actual aspect, it is only an example and does not limit the interpretation of this disclosure. .

First, a mounting device in a comparative example will be described using FIGS. 1 to 3 . 1 is a top view schematically showing a mounting device in a comparative example. Fig. 2 is a front view schematically showing the mounting device of Fig. 1; Fig. 3 is a side view schematically showing the mounting device of Fig. 1;

The mounting apparatus 100R in the comparative example conveys the components 300 from a component supply unit (not shown) to the upper side of the work 200, and installs the conveyed components 300 on the work 200 ( mounted) device. The mounting apparatus 100 includes a mount 110, a mounting stage 120 supported on the mount 110, an X support 131 provided on the mount 110, and a Y supported on the X support 131. A beam 140 and a mounting head 150 supported by the Y beam 140 are provided. In addition, the X-axis direction and the Y-axis direction are directions orthogonal to each other on a horizontal plane, and in this comparative example, the direction in which the Y beam 140 is stretched is the Y-axis direction (first direction), and the direction orthogonal thereto is the X-axis direction. It demonstrates as a direction (second direction). Further, the Z-axis direction (third direction) is a vertical direction perpendicular to the XY plane. The Y-beam 140 is provided with a linear scale 161 extending along the Y-axis direction.

The mounting head 150 includes a mounting head 151 having a holding means for detachably holding the component 300 and a driving unit 152 for driving the mounting head 150 in the Z-axis direction. do. The driving unit 152 is installed on the Y-beam 140 to be reciprocating in the Y-axis direction. A detection head 162 is provided above the driving unit 152 of the mounting head unit 150 so as to face the linear scale 161 .

In the case of this comparative example, the mounting head unit 150 includes three mounting heads 151, and each mounting head 151 has a nozzle holding the component 300 by vacuum adsorption. A means 151a is provided. In addition, the driving unit 152 may independently move the mounting heads 151 in the Z-axis direction. The mounting head 151 has a function of holding and transporting the component 300 and placing the component 300 on the workpiece 200 adsorbed and fixed to the mounting stage 120 .

The guide 132 provided on the X support 131 is a member that guides the Y beam 140 in an X-axis direction so as to be slidable. In the case of this comparative example, two X supports 131 are arranged in parallel, and each X support 131 is fixed to the mount 110 in an extended state in the X-axis direction. The X support stand 131 may be integrally formed with the mount 110 .

A slider 143 is installed on the guide 132 so as to be movable in the X-axis direction. And on each slider 143 of the two guides 132, each leg part 142 of the Y beam 140 is provided, respectively. That is, the main beam part 141 of the Y beam 140 is extended in the Y-axis direction so as to straddle the mounting stage 120, and each leg part 142 at both ends is installed on the slider 143 to support the X support ( 131) is supported so as to be movable in the X-axis direction by a guide 132 installed. In addition, since the bottom surface of the main beam part 141 and the bottom surface of the leg part 142 (upper surface of the slider 143) are located on the same plane, the main beam part 141 is provided at a position not too high from the X support 131 .

The Y beam 140 is a rod-shaped member, and is a member that is extended and disposed in the Y-axis direction. The shape of the XZ cross section of the Y beam 140 has a trapezoidal shape obtained by adding a quadrangle and a right triangle.

The Y beam 140 is a member that guides the reciprocating motion of the mounting head 150 in the Y-axis direction, and when the reciprocating mounting head 150 vibrates, there is a problem such as dropping the part 300 being held. occurs, and in order to transport the part 300 to an accurate position, it is necessary to suppress bending as much as possible. Therefore, the Y beam 140 needs to have sufficient structural strength. On the other hand, the Y beam 140 is a member that linearly reciprocates along the X support 131 together with the mounting head 150, and the lighter the weight, the faster the component 300 can be transported.

Next, problems of the mounting device in the comparative example will be described using FIGS. 4 to 6 . Fig. 4 is a schematic front view illustrating problems of a mounting device in a comparative example. Fig. 5 is a schematic side view illustrating problems of a mounting device in a comparative example. Fig. 6 is a schematic top view illustrating a problem of a mounting device in a comparative example.

As shown in FIG. 4 , the main beam part 141 is bent due to the weight of the main beam part 141 and the mounting head part 150 or thermal expansion of the main beam part 141 (first problem). As a result, the mounting head 150 tilts, affecting the mounting position (bond position) and the tilt of the component (eg, die).

Also, as shown in FIG. 5 , the main beam part 141 is twisted by the weight of the main beam part 141 and the mounting head part 150 or the thermal expansion of the main beam part 141 (second problem). As a result, the mounting head 150 tilts, affecting the mounting position (bond position) and the tilt of the component (eg, die).

Moreover, as shown in FIG. 6, the main beam part 141 is bent by the thermal expansion of the main beam part 141 (a 3rd problem). As a result, the mounting head 150 tilts, affecting the mounting position (bond position) and the tilt of the component (eg, die). Since the linear scale 161 provided in the main beam unit 141 is also affected by the deformation, the detection head 162 cannot capture the effect of the deformation of the main beam unit 141 and cannot correct it.

In the mounting apparatus according to the present disclosure, in order to solve at least one of the problems described above, a reference member (for example, a bar-shaped member) serving as a reference for position measurement of the mounting head is prepared. It is preferable that the material of the reference member is not easily affected by heat and is lightweight and has high rigidity. In addition, the standard member is held at a position away from the main beam unit in a state where it is not affected by heat, weight or deformation of the main beam unit. Then, a sensor for detecting the position of the mounting head is provided in the mounting head. The measurement target of the sensor is the reference member itself, or the measurement target of the sensor is arranged on the reference member.

Hereinafter, some examples will be given of typical embodiments and modifications thereof. In the description of the embodiments and modified examples below, the same reference numerals as those in the above-described comparative example can be used for parts having the same configuration and function as those described in the above-described comparative example. Incidentally, for the description of these parts, it is assumed that the explanation in the above-described comparative example can be appropriately used within a range that is not technically contradictory. In addition, all or part of the comparative example, all or part of the plurality of embodiments, and all or part of the plurality of modified examples can be applied in a complex manner as appropriate within a range that is not technically contradictory.

<First Embodiment>

In the first embodiment, a displacement sensor is used as a sensor for detecting the position of the mounting head, and the reference member itself is used as the measurement target of the sensor.

The configuration of the mounting device in the first embodiment will be described using FIGS. 7 to 9 . Fig. 7 is a top view schematically showing the mounting device in the first embodiment. Fig. 8 is a cross-sectional view along line A-A shown in Fig. 7; Fig. 9 is a front view schematically showing the mounting device shown in Fig. 7; Fig. 35 is a diagram showing a method of fixing a reference bar by a support member; 8 and 9, the mounting head 151 is omitted.

The mounting device 100 in the first embodiment has the same configuration as the mounting device 100R in the comparative example. However, the mounting device 100 in the first embodiment further includes a reference bar 171 as a reference member, support members 172 and 173 supporting the reference bar 171, and a detection head 174. .

The reference bar 171 is below the main beam part 141 of the Y beam 140, and is provided parallel to the main beam part 141 at a position spaced apart from the main beam part 141. The reference bar 171 is preferably formed of a material that is, for example, a rectangular columnar shape, is less susceptible to heat (has a small coefficient of thermal expansion), and is lightweight and has high rigidity. The reference bar 171 may be formed of, for example, ceramic, silicon carbide (SiC), carbon fiber reinforced plastic (CFRP), ceramic impregnated aluminum alloy, invar alloy, quartz glass (SiO ₂ ), or the like. there is. The reference bar 171 is supported by a pair of support members 172 and 173 .

The support members 172 and 173 are crank-shaped when viewed from the front, and include a first extension section and a second extension section extending along the Y-axis direction, and a first extension section and a second extension section extending in the vertical direction. It has a 3rd extension part to connect. The first extension part is fixed between the leg part 142 and the slider 143 . The second extending section is located below the first extending section and supports the reference bar from the lower side.

The reference bar 171 is deformed in the Y-axis direction of the mount 110 by expansion of the Y-beam 140 or the like. Also, the support members 172 and 173 may move together with deformation of the mount. The reference bar 171 is preferably supported by the support members 172 and 173 so as not to be affected by movement of the support members 172 and 173 . For example, one end of the reference bar 171 is fixed to the supporting member 172 as a reference, and the other end of the reference bar 171 is left free in the supporting member 173.

Specifically, the end of the reference bar 171 within the dotted line ellipse A in FIG. 9 is fixed in the linear direction (Y-axis direction) and in the rotational direction (X-axis direction) with screws or the like, so that the reference bar 171 Based on installation. As shown at B1 and B2 in FIG. 9, the end of the reference bar 171 within the dotted line ellipse B in FIG. A groove 173a is provided. Here, B2 of FIG. 9 is a cross-sectional view along the line C-C indicated at B1. As a result, the rotation direction of the reference bar 171 is fixed and the linear direction is movable. In this way, if one end of the reference bar 171 is fixed and the other end is supported by the rotation direction restraint and slide mechanism, it is less affected by the overall twist. In addition, when there is no concern about the load on the reference bar 171 depending on the structure or operation accuracy, fixing to the support member 172 with screws or the like is a simple structure and low cost. As shown in FIG. 35 , an end of the reference bar 171 within the dotted line ellipse A in FIG. 9 may be fixed to the support member 172 by a fixing member 176 so as to be rotatable within the XY plane. This makes it difficult for force to be applied to the reference bar 171 when the parallelism of the support members 172 and 173 cannot be maintained.

As shown in FIG. 8 , the detection head 174 is installed below the main beam part 141 and below the driving part 152 . The detection head 174 has a sensor (displacement sensor) that measures the distance d with the reference bar 171 . The mounting device 100 includes a control device that monitors and controls the operation of each unit. The control device controls the driving unit for driving the Y beam 140 in the X-axis direction and the driving unit for driving the mounting head unit 150 in the Y-axis direction based on the position measured by the detection head 174 to control the mounting head unit. Correct the position of (150). Details are described later.

Here, the displacement sensor will be described. A displacement sensor is mounted on the mounting head, and the distance to the standard bar is measured in each direction. When the reference bar is positioned below the displacement sensor as in the present embodiment, the distance in the Z direction can be measured. When the reference bar is located on the side of the displacement sensor, the distance in the X direction or the Y direction can be measured. It is assumed that the standard bar is not deformed, and when the measured value fluctuates, it can be judged that an error has occurred in positioning. As the displacement sensor, an optical (triangulation/coaxial confocal) type is used, for example. The coaxial confocal method has advantages of high precision and space saving. However, if it is out of focus, it will not be detected, but if it is within the focal length, light can be received stably even if the target is tilted. In the case of the triangulation method, by using a CMOS or CCD sensor for a light-receiving element, it is difficult to be affected by uneven color or surface condition of an object.

Subsequently, position correction of the mounting head 150 will be described using FIGS. 10 and 11 . Fig. 10 is a front view showing a bent state of the main beam part shown in Fig. 7; Fig. 11 is a front view showing a state in which the mounting head shown in Fig. 10 is located on the right side.

As shown in FIG. 10, when the main beam part 141 is bent, the height of the mounting head part 150 changes. The control device determines the height of the mounting head 151 based on the deflection amount of the main beam part 141 by measuring the distance d between the detection head 174 provided in the mounting head 150 and the reference bar 171. can be corrected

In addition, the control device calculates the beam deflection from the change in the height of each position of the mounting head 150 in the Y-axis direction. Here, the position of the mounting head 150 in the Y-axis direction is based on data read by the detection head 162 provided on the mounting head 150 from the linear scale 161 provided on the main beam 141. is calculated Then, as shown in FIG. 11 , the control device calculates the amount θ of the mounting head 150 toppling over, and corrects the positioning error Δy of the work 200 to the target point.

(First modified example)

The mounting device in the first modified example will be described using FIGS. 12 and 13 . Fig. 12 is a cross-sectional view of a mounting device according to a first modified example taken along the line A-A shown in Fig. 7; Fig. 13 is a cross-sectional view showing a twisted state of the main beam part in the mounting device shown in Fig. 12;

In the first embodiment, as shown in Fig. 5, when the main beam part 141 is twisted, the position of the mounting head part 150 cannot be measured. So, in the first modification, a detection head 175 having a displacement sensor is added.

The mounting head 150 is provided so that the detection head 174 is spaced apart from the upper surface of the reference bar 171 in the Z direction. The detection head 175 is provided on the mounting head 150 to be spaced apart from the side of the reference bar 171 in the X direction. The distance in the Z direction can be measured by the detection head 174, and the distance in the X direction can be measured by the detection head 175.

As shown in FIG. 13, when the main beam part 141 is twisted, the detection head 175 and the reference bar 171 come closer, and the detection head 174 and the reference bar 171 move away. That is, the distance between the detection head 175 and the reference bar 171 in the X direction becomes shorter, and the distance between the detection head 174 and the reference bar 171 in the Z direction becomes longer. Based on this, the control device calculates the twist amount of the mounting head 150 and corrects the positioning error Δx of the work 200 to the target point.

<Second Embodiment>

In the second embodiment, a position reading sensor is used as a sensor for detecting the position of the mounting head, and a linear scale provided on a reference member is used as a measurement target of the sensor.

Next, a mounting device in the second embodiment will be described using FIGS. 14 to 17 . Fig. 14 is a top view schematically showing a mounting device in the second embodiment. Fig. 15 is a front view schematically showing the mounting device shown in Fig. 14; Fig. 16 is a cross-sectional view along line A-A shown in Fig. 14; Fig. 17 is a cross-sectional view showing a twisted state of the main beam part in the mounting device shown in Fig. 16; 15 to 17, the mounting head 151 is omitted.

The mounting device 100 in the second embodiment has the same configuration as the mounting device 100 in the first embodiment. However, the mounting device 100 in the second embodiment includes, instead of the reference bar 171, a reference bar 271 having a linear scale 261 on its upper surface, and instead of the detection head 174 A detection head 274 having a sensor for reading the same position as the detection head 162 is provided. Moreover, the linear scale 161 and detection head 162 in 1st Embodiment are not provided.

The reference bar 271 has the same configuration as the reference bar 171 except that the linear scale 261 is provided on the upper surface side. Like the reference bar 171, the reference bar 271 is supported by a pair of support members 172 and 173 so as not to be affected by movement of the support members 172 and 173.

The linear scale 261 will be described using FIG. 18 . Fig. 18 is a diagram explaining the linear scale in the second embodiment.

The linear scale 261 is composed of a scale 261a having a pattern capable of reading the position in the Y-axis direction and a scale 261b having a pattern capable of reading the position in the X-axis direction. The scale 261a is arranged so as to extend along the Y-axis direction. The scale 261b is disposed adjacent to the X-axis direction and extends along the Y-axis direction.

The detection head 274 has sensors 274a and 274b that read the scale 261a and a sensor 274c that reads the scale 261b. The sensor 274a is arranged so that its optical axis is perpendicular to the scale 261a. The sensor 274c is arranged such that its optical axis is perpendicular to the scale 261b. The position in the X-axis direction is read by the sensor 274a, and the position in the X-axis direction is read by the sensor 274c.

The sensor 274b is adjacent to the sensor 274a in the Y-axis direction, and the optical axis is tilted with respect to the scale 261a. When the height of the detection head 274 changes, the position where the optical axis of the sensor 274b intersects the scale 261a changes, so the position in the Y-axis direction read by the sensor 274b changes. Therefore, the controller calculates a difference (dy) between the position where the sensor 274b reads the scale 261a and the position where the sensor 274a reads the scale 261a. The difference dy is changed by the height of the detection head 274. Then, the control device calculates the change dz of the position in the Z direction based on the change in the difference dy, and calculates the position in the Z direction.

This makes it possible to detect the posture of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction with one detection head 274 . Therefore, as shown in FIG. 4 (FIG. 11), when the main beam part 141 is bent, the positioning error in the Y-axis direction (Δy) based on the positions of the mounting head 150 in the Y-axis direction and the Z-axis direction ) can be corrected. In addition, as shown in FIG. 6, when the main beam part 141 is bent, the positioning error Δx in the X-axis direction is corrected based on the positions of the mounting head 150 in the X-axis direction and the Y-axis direction. it becomes possible In addition, as shown in FIG. 17, when the main beam part 141 is twisted, based on the position (dx) of the mounting head 150 in the X-axis direction and the position (d) in the Z-axis direction, the X-axis direction Correction of the positioning error Δx becomes possible.

(Second modified example)

The mounting device in the second modified example will be described using FIGS. 19 and 20 . Fig. 19 is a top view schematically showing a mounting device in a second modified example. Fig. 20 is a top view showing a bent state of the main beam part shown in Fig. 19;

The mounting apparatus 100 in the second modification replaces the reference bar 271, the support members 172 and 173 for supporting the reference bar 271, and the detection head 274 in the second embodiment. , a reference bar 371, support members 372 and 373 supporting the reference bar 371, and a detection head 374.

The reference bar 371 is a side of the main beam part 141 of the Y beam 140, and is provided parallel to the main beam part 141 at a position spaced apart from the main beam part 141. The standard bar 371 is formed of the same shape and material as the standard bar 171 . Like the reference bar 171, the reference bar 371 is supported by a pair of support members 372 and 373 so as not to be affected by movement of the support members 372 and 373.

The support members 372 and 373 have the same structure as the support members 172 and 173 . That is, the support members 372 and 373 have a crank shape when viewed from the top, and the first and second extension parts extend along the Y-axis direction, and the first extension part and the second extension part extend in the X direction. It has a 3rd extension part which connects the extension part. The first extension part is fixed to the leg part 142 . The 2nd extension part is located farther away from the main beam part 141 in the X direction than the 1st extension part, and supports the reference bar 371 from the side.

The reference bar 371 has the same linear scale as the reference bar 271 at a position facing the detection head 374 . In addition, the detection head 374 is provided in the same position as the detection head 162 in 1st Embodiment, and is equipped with the same sensor as the detection head 274.

The detection head 374 disposed on the mounting head 150 reads the linear scale provided on the reference bar 371 disposed apart from the main beam 141 in the X direction, and reads the position of the mounting head 150. to measure The reference bar 371 is not affected by the deformation of the main beam part 141, and the positional relationship with the sensor of the detection head 374 fluctuates.

Thus, the posture of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction can be detected by one detection head 374 . Therefore, as shown in FIG. 4 (FIG. 11), when the main beam part 141 is bent, correction of positioning error in the Y-axis direction based on the positions of the mounting head 150 in the Y-axis direction and the Z-axis direction this becomes possible Further, as shown in FIG. 20 , when the main beam part 141 is bent, positioning errors in the X-axis direction can be corrected based on the positions of the mounting head 150 in the X-axis direction and the Y-axis direction. In addition, as shown in FIG. 17, when the main beam part 141 is twisted, it is possible to correct the positioning error in the X-axis direction based on the positions of the mounting head 150 in the X-axis direction and the Z-axis direction. .

<Third Embodiment>

In the third embodiment, a position reading sensor is used as a sensor for detecting the position of the mounting head, two reference members are used, and a linear scale provided on each reference member is used as a measurement target of the sensor.

The configuration of the mounting device in the third embodiment will be described using FIGS. 21 to 23 . Fig. 21 is a top view schematically showing a mounting device in a third embodiment. Fig. 22 is a front view schematically showing the mounting device shown in Fig. 21; Fig. 23 is a cross-sectional view along the line A-A shown in Fig. 21; 22 and 23, the mounting head 151 is omitted.

The mounting device 100 in the third embodiment has the same configuration as the mounting device 100 in the second embodiment. However, the mounting device 100 in the third embodiment includes support members 472 and 473 instead of the support members 172 and 173, and the mounting device 100 in the third embodiment, A reference bar 471 and a detection head 474 are further provided.

The reference bar 471 has the same configuration as the reference bar 271 . However, the reference bar 471 has a linear scale 261 on the lower surface side. Like the reference bar 171, the reference bars 271 and 471 are supported by a pair of support members 472 and 473 so as not to be affected by the movement of the support members 472 and 473.

The supporting members 472 and 473, when viewed from the front, have a first extension section, a second extension section, and a fourth extension section that extend along the Y-axis direction, and a first extension section and a second extension section while extending in the vertical direction. It has a third extension section connecting the bride and the fourth extension section. The first extension part is fixed between the leg part 142 and the slider 143 . The second extension section is located below the first extension section and supports the reference bar 271 from below. The fourth extension section is located above the first extension section and supports the standard bar 471 from below.

The detection head 474 is located above the main beam unit 141 and below the standard bar 471, and is installed above the driving unit 152. The detection head 474 has the same configuration as the detection head 274 .

The detection heads 274 and 474 disposed on the mounting head unit 150 read the linear scale provided on the reference bars 271 and 471 disposed apart from the main beam unit 141 in the Z direction, and the mounting head unit ( 150) is measured. The reference bars 271 and 471 are not affected by the deformation of the main beam part 141, and the positional relationship with the sensors of the detection heads 274 and 474 fluctuates.

Subsequently, position correction of the mounting head 150 will be described using FIGS. 24 and 25 . Fig. 24 is a front view showing a bent state of the main beam part shown in Fig. 22; Fig. 25 is a cross-sectional view showing a twisted state of the main beam portion shown in Fig. 23;

The detection heads 274 and 474 can detect the posture of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction. Therefore, as shown in FIG. 24, when the main beam part 141 is bent, based on the position dy of the detection heads 274 and 474 in the Y-axis direction and the position dz in the Z-axis direction, the Y-axis direction Correction of the positioning error Δy becomes possible. In addition, as shown in FIG. 6, when the main beam part 141 is bent, positioning errors in the X-axis direction can be corrected based on the positions of the detection heads 274 and 474 in the X-axis direction and the Y-axis direction. . 25, when the main beam part 141 is twisted, based on the positions dx in the X-axis direction and the positions dz in the Z-axis direction of the detection heads 274 and 474 in the X-axis direction It becomes possible to correct the positioning error (Δx) of

(3rd modified example)

The configuration of the mounting device in the third modified example will be described using FIGS. 26 and 27 . Fig. 26 is a front view schematically showing a mounting device in a third modified example. Fig. 27 is a cross-sectional view at a position corresponding to the line A-A shown in Fig. 21; 26 and 27, the mounting head 151 is omitted.

The mounting device 100 in the third modification has the same configuration as the mounting device 100 in the third embodiment. However, the mounting device 100 in the third modification includes the support members 172 and 173 in the second embodiment instead of the support members 472 and 473, and instead of the standard bar 471. A reference bar 571 is provided.

The reference bar 571 has the same configuration as the reference bar 271 . However, the reference bar 571 has a linear scale 261 on the lower surface side. Like the reference bar 271, the reference bar 571 is supported on the upper surface side of the pair of legs 142 so as not to be affected by the movement of the legs 142.

The detection heads 274, 474 arranged on the mounting head 150 in this modified example are reference bars 271, 471 arranged apart from the main beam section 141 in the Z direction, as in the third embodiment. ) is read, and the position of the mounting head 150 is measured. The reference bars 271 and 471 are not affected by the deformation of the main beam part 141, and the positional relationship with the sensors of the detection heads 274 and 474 fluctuates. In addition, the detection heads 274 and 474 can detect the posture of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction. Therefore, in this modified example, correction of positioning errors (Δx, Δy) is possible as in the third embodiment.

(Fourth modified example)

The configuration of the mounting device in the fourth modified example will be described using FIGS. 28 and 29 . Fig. 28 is a front view schematically showing a mounting device in a fourth modified example. Fig. 29 is a cross-sectional view at a position corresponding to the line A-A shown in Fig. 21; 28 and 29, the mounting head 151 is omitted.

The mounting device 100 in the fourth modification has the same configuration as the mounting device 100 in the third modification. However, the mounting apparatus 100 in the fourth modified example includes a reference bar 671 instead of the support members 172 and 173 and the reference bar 271, and instead of the detection head 274, the detection head ( 674).

The reference bar 671 has the same configuration as the reference bar 571 . However, like the reference bar 571, the reference bar 671 is supported on the lower side of the pair of leg parts 142 so as not to be affected by the movement of the leg part 142.

The detection head 674 is located below the main beam part 141 and the standard bar 671, and is installed below the driving part 152. The detection head 674 has the same configuration as the detection head 274, but is installed so as to read a linear scale provided on the reference bar 671 above.

The detection heads 674, 474 arranged on the mounting head 150 in this modified example are reference bars 671, 571 arranged apart from the main beam section 141 in the Z direction, similarly to the third embodiment. ) is read, and the position of the mounting head 150 is measured. The reference bars 671 and 571 are not affected by the deformation of the main beam unit 141, and the positional relationship with the sensors of the detection heads 674 and 474 fluctuates. In addition, the detection heads 674 and 474 can detect the posture of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction. Therefore, in this modified example, correction of positioning errors (Δx, Δy) is possible as in the third embodiment.

(Fifth modified example)

The configuration of the mounting device in the fifth modified example will be described using FIGS. 30 and 31 . 30 is a front view schematically showing a mounting device in a fifth modified example. Fig. 31 is a sectional view at a position corresponding to the line A-A shown in Fig. 21; 30 and 31, the mounting head 151 is omitted.

The mounting device 100 in the fifth modified example has the same configuration as the mounting device 100 in the third modified example. However, the mounting apparatus 100 in the fifth modified example includes support members 772 and 773 and reference bar 771 instead of support members 172 and 173 and reference bar 271, and the detection head A detection head 774 is provided instead of 274, and a reference bar 871 and detection head 874 are provided instead of reference bar 571 and detection head 474.

The reference bar 771 has the same configuration as the reference bar 271 . However, the reference bar 771 has a linear scale 261 on its side. Like the reference bar 271, the reference bar 771 is supported by a pair of support members 772 and 773 so as not to be affected by the movement of the support members 772 and 773.

The reference bar 871 has the same configuration as the reference bar 571 . However, the reference bar 871 has a linear scale 261 on its side. Like the reference bar 571, the reference bar 871 is supported from the upper surface side of the pair of leg parts 142 so as not to be affected by the movement of the leg part 142.

Like the support members 172 and 173, the support members 772 and 773 have a crank shape when viewed from the front, and have a first extension section and a second extension section extending along the Y-axis direction, and extending in the vertical direction. It has a third extension section connecting the first extension section and the second extension section together. The first extension part is fixed between the leg part 142 and the slider 143 . The second extending section is located below the first extending section and supports the reference bar from the lower side. However, the 3rd extension part in this modified example is comprised shorter than the 3rd extension part in the support members 172 and 173.

The detection head 774 is positioned below the main beam part 141 and is installed below the driving part 152 so as to face the side surface of the reference bar 771 . The detection head 674 has the same configuration as the detection head 274, but is installed so as to read a linear scale provided on the reference bar 771 on the side.

The detection head 874 is positioned above the main beam part 141 and is installed above the driving part 152 so as to face the side surface of the reference bar 871 . The detection head 874 has the same configuration as the detection head 274, but is provided so as to read a linear scale provided on the reference bar 871 on the side.

The detection heads 774, 874 disposed on the mounting head 150 in this modified example are reference bars 771, 871 disposed apart from the main beam unit 141 in the Z direction, similarly to the third embodiment. ) is read, and the position of the mounting head 150 is measured. The reference bars 771 and 871 are not affected by the deformation of the main beam portion 141, and the positional relationship with the sensors of the detection heads 774 and 874 is changed. In addition, the detection heads 774 and 874 can detect the posture of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction. Therefore, in this modified example, correction of positioning errors (Δx, Δy) is possible as in the third embodiment.

<Fourth Embodiment>

A mounting device in the fourth embodiment will be described using FIGS. 32 to 34 . Fig. 32 is a top view schematically showing a mounting device in a fourth embodiment. Fig. 33 is a front view schematically showing the mounting device shown in Fig. 32; FIG. 34 is a diagram showing a state in which the mounting head or the like of the mounting device shown in FIG. 8 has collapsed. 32 to 34, the mounting head 151 is omitted.

In the first embodiment, as shown in FIG. 34, when the X support 131 is deformed by thermal expansion or the like, the guide 132 is also deformed, and the beam 140 moving in the X direction over the guide 132, The mounting head 150, the reference bar 171, and the supporting members 172 and 173 fall down. In this case, since the positional relationship between the detection head 174 disposed on the mounting head 150 and the reference bar 171 does not fluctuate, rotation (falling) of the mounting head 150 with the Y-axis as the rotation axis can be grasped. can't

Therefore, as shown in FIG. 33 , the mounting device 100 in the fourth embodiment has reference bars 971 and 972 and reference bars 971 relative to the mounting device 100 in the first embodiment. , 972 are further provided with fixing members 973 and 974 and detection heads 975 and 976.

As shown in FIG. 32 , reference bars 971 and 972 are arranged so as to extend along the X direction, and are fixed on mount 110 by fixing members 973 and 974 . The reference bars 971 and 972 are parallel to the direction in which the guide 132 is stretched, and are disposed at positions that do not interfere with the reference bar 171, the support members 172 and 173, and the mounting head 151. The reference bars 971 and 972 have the same configuration as the reference bar 271 except for the linear scale provided on the upper surface side.

As shown in FIG. 33 , detection heads 975 and 976 are provided on support members 172 and 173 so as to be spaced apart from each other above reference bars 971 and 972 . The detection heads 975 and 976 are obtained by removing the sensor 274c for reading the scale 261b from the detection head 274. However, the sensor 274b is disposed adjacent to the X-axis direction of the sensor 274a and tilts its optical axis with respect to the scale 261a.

When the heights of the detection heads 975 and 976 change, the position where the optical axis of the sensor 274b intersects the scale 261a changes, so the position in the X-axis direction read by the sensor 274b changes. Therefore, the controller calculates a difference (dx) between the position where the sensor 274b reads the scale 261a and the position where the sensor 274a reads the scale 261a. The difference dx changes according to the height of the detection head 274. Then, the control device calculates a position change dz in the Z direction based on the change in the difference dx, and calculates the position in the Z direction.

This enables the detection heads 975 and 976 to detect the attitude of the reference bar 171 (mounting head 150) in two directions, the X-axis direction and the Z-axis direction. Therefore, as shown in FIG. 39 , when the mounting head 150 is knocked down, the X-axis direction based on the position dx of the mounting head 150 in the X-axis direction and the position d in the Z-axis direction of the mounting head 150. Correction of the positioning error Δx becomes possible.

Note that the reference bars 971 and 972 may have the same configuration as the reference bars 171, and the detection heads 975 and 976 may have the same configuration as the detection head 174.

Hereinafter, an example in which the Y beam of the above-described embodiment is applied to a flip chip bonder, which is an example of a mounting device, will be described, but it is not limited to this, and a chip mounter (surface mounting machine) for mounting a packaged semiconductor device or the like on a substrate. It can also be applied to a die bonder that bonds a semiconductor chip (die) to a substrate or the like. In addition, the flip chip bonder is used to manufacture a fan out wafer level package (FOWLP), which is a package in which a redistribution layer is formed in a wide area exceeding the chip area, for example.

[Example]

Fig. 36 is a schematic top view of a flip chip bonder of an embodiment. Fig. 37 is a diagram explaining the operation of the pickup flip head, transfer head and bonding head when viewed from the direction of arrow A in Fig. 36;

The flip chip bonder 10 is largely divided into a die supply unit 1, a pick-up unit 2, a transfer unit 8, an intermediate stage unit 3, a bonding unit 4, and a transfer unit ( 5), a substrate supply unit 6K, a substrate carrying unit 6H, and a control device 7 that monitors and controls the operation of each unit.

First, the die supply unit 1 supplies the die D to be mounted on the substrate P. The die supply unit 1 includes a wafer holder 12 for holding the divided wafer 11, a lifting unit 13 indicated by a dotted line for pushing up the die D from the wafer 11, and a wafer ring supply unit ( 18). The die supply unit 1 is moved in the XY direction by a driving unit (not shown) to move the die D to be picked up to the position of the lifting unit 13 . The wafer ring supply unit 18 has a wafer cassette in which wafer rings are stored, and sequentially supplies the wafer rings to the die supply unit 1 to exchange them for new wafer rings. The die supply unit 1 moves the wafer ring to the pick-up point so that desired dies can be picked up from the wafer ring. The wafer ring is a jig to which a wafer is fixed and which can be installed in the die supply unit 1 .

The pickup unit 2 has a pickup flip head 21 that picks up and reverses the die D, and drive units (not shown) that lift, rotate, reverse, and move the collet 22 in the X direction. With this configuration, the pick-up flip head 21 picks up the die, rotates the pick-up flip head 21 180 degrees, inverts the bump of the die D to face the lower surface, and moves the die D to the transfer head 81 ) in a forwarding posture.

The transfer unit 8 receives the inverted die D from the pick-up flip head 21 and places it on the intermediate stage 31 . Like the pick-up flip head 21, the transfer unit 8 includes a transfer head 81 having a collet 82 that adsorbs and holds the die D at its tip, and a Y drive unit that moves the transfer head 81 in the Y direction. (83).

The intermediate stage section 3 has an intermediate stage 31 on which the die D is temporarily loaded and a stage recognition camera 34. The intermediate stage 31 is movable in the Y direction by a driving unit not shown.

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it onto the transported substrate P. The bonding unit 4 includes a bonding head 41 equipped with a collet 42 for adsorbing and holding the die D at its tip, similar to the pickup flip head 21, and a Y beam for moving the bonding head 41 in the Y direction. 43, a substrate recognition camera 44 for capturing an image of a position recognition mark (not shown) on the substrate P and recognizing a bonding position, and an X support stand 45. With this configuration, the bonding head 41 picks up the die D from the intermediate stage 31 and bonds the die D to the substrate P based on the imaging data of the substrate recognizing camera 44 .

The transport unit 5 includes transport rails 51 and 52 on which the substrate P moves in the X direction. The transport rails 51 and 52 are provided in parallel. With such a structure, the substrate P is carried out from the substrate supply unit 6K, moved along the conveyance rails 51 and 52 to the bonding position, moved to the substrate carrying out unit 6H after bonding, and the substrate carrying out unit 6H ) to transfer the substrate P. During bonding of the die D to the substrate P, the substrate supply unit 6K carries out a new substrate P and waits on the transport rails 51 and 52.

The control device 7 includes a memory for storing a program (software) for monitoring and controlling the operation of each unit of the flip chip bonder 10, and a central processing unit (CPU) for executing the program stored in the memory.

Fig. 38 is a schematic sectional view showing a main part of the die supply section in Fig. 36; The die supply unit 1 horizontally positions an expander ring 15 holding the wafer ring 14 and a dicing tape 16 held by the wafer ring 14 and having a plurality of dies D adhered thereto. It has a supporting ring 17 for determining and a lifting unit 13 for pushing the die D upward. In order to pick up the predetermined die D, the lifting unit 13 is moved in the vertical direction by a drive mechanism (not shown), and the die supply unit 1 is moved in the horizontal direction.

About the bonding part, it demonstrates using FIGS. 2, 15, and 39, referring a comparative example and 2nd Embodiment. Fig. 39 is a schematic side view showing a main part of the bonding section 4. Some components are shown in perspective. The side view of FIG. 39 corresponds to the front view of FIGS. 2 and 15 . However, in Fig. 39, the support members 172 and 173, the reference bar 271 and the detection head 274 are omitted.

The bonding unit 4 includes a bonding stage BS (mounting stage 120) supported on a mount 53 (mount 110), and an X support 451 provided near the transport rails 52 and 53 ( X support 131), Y beam 43 (Y beam 140) supported on the X support 451, and bonding head 41 (mounting head 151) supported on the Y beam 43 And, a drive unit 46 (drive unit 152) for driving the bonding head 41 in the Y-axis direction and the Z-axis direction, and a drive unit (not shown) for driving the Y beam 43 in the X-axis direction. are doing

The bonding head 41 is a device having a collet 42 (holding means 151a) for detachably holding the die D (part 300), and a Y beam 43 capable of reciprocating in the Y-axis direction. ) is installed.

In the case of this embodiment, one bonding head 41 is provided, and the bonding head 41 is provided with a collet 42 that holds the die D by vacuum adsorption. In addition, the driving unit 46 can move the bonding head 41 up and down in the Z-axis direction. The bonding head 41 has a function of holding and transporting the die D picked up from the intermediate stage 31 and placing the die D on the substrate P (work 200) adsorbed and fixed to the bonding stage BS.

The guide 132 provided on the X support 451 is a member that guides the Y beam 43 in an X-axis direction so that sliding is possible. In the case of this embodiment, two X supporters 451 are arranged in parallel, and each X supporter 451 is fixed on the transport rails 52 and 53 in an extended state in the X-axis direction. The X support stand 451 may be integrally formed with the transport rails 52 and 53 .

36 and 39, a slider 433 is provided on the guide 452 so as to be movable in the X-axis direction. And on each slider 433 of the two guides 452, the both ends of the Y beam 43 are provided, respectively. That is, the Y beam 43 is extended in the Y-axis direction so as to span over the bonding stage BS, and both ends are moved in the X-axis direction by guides 452 installed on the slider 433 and installed on the X support 451 possibly supported. In addition, since the lower surface of the Y beam 43 and the upper surface of the slider 433 are located on the same plane, the Y beam 43 is provided at a position not too high from the X support 451.

The Y beam 43 of the embodiment has a configuration basically the same as that of the Y beam 140 of the second embodiment. However, the Y beam 43 extends to the right more than the support 451 on the right side in the drawing. This is to enable the bonding head 41 to pick up the die D from the intermediate stage 31 . Moreover, when the bonding head 41 moves to the right side rather than the support stand 451, the bonding head 41 raises so that the collet 42 may become higher than the guide 452.

Next, a bonding method (manufacturing method of a semiconductor device) performed in the flip chip bonder of the embodiment will be described with reference to FIG. 40 . Fig. 40 is a flowchart showing a bonding method performed in the flip chip bonder shown in Fig. 36;

The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is attached is stored in a wafer cassette (not shown) and carried into the flip chip bonder 10 . The control device 7 supplies the wafer ring 14 to the die supply unit 1 from the wafer cassette filled with the wafer ring 14 . Further, a substrate P is prepared and carried into the flip chip bonder 10 . The control device 7 mounts the substrate P on the substrate transport claw in the substrate supply unit 6K.

(Step S1: Wafer Die Pickup)

The controller 7 moves the wafer holding table 12 so that the die D to be picked up is located directly above the lifting unit 13, and positions the die to be peeled between the lifting unit 13 and the collet 22. do. The lifting unit 13 is moved so that the upper surface of the lifting unit 13 comes into contact with the back surface of the dicing tape 16 . At this time, the control device 7 adsorbs the dicing tape 16 to the upper surface of the lifting unit 13 . The controller 7 lowers the collet 22 while evacuating, makes it land on the die D to be peeled, and adsorbs the die D. The control device 7 raises the collet 22 to peel the die D from the dicing tape 16. Thereby, die D is picked up by the pickup flip head 21 .

(Step S2: Moving the pickup flip head)

The control device 7 moves the pickup flip head 21.

(Step S3: Reversing the pickup flip head)

The control device 7 rotates the pick-up flip head 21 by 180 degrees to invert the bump face (surface) of die D to face the lower face, reverse the bump face (surface) of die D face the lower face, and It is set as the attitude which transmits D to the transfer head 81.

(Step S4: Transmission of the transfer head)

The control device 7 picks up the die D from the collet 22 of the pickup flip head 21 by the collet 82 of the transfer head 81, and the die D is transferred.

(Step S5: Reversing the pickup flip head)

The control device 7 inverts the pick-up flip head 21 so that the suction surface of the collet 22 faces downward.

(Step S6: Move the transfer head)

Before or in parallel with step S5, the control device 7 moves the transfer head 81 to the intermediate stage 31.

(Step S7: Loading the intermediate stage)

The control device 7 loads the die D held by the transfer head 81 onto the intermediate stage 31 .

(Step S8: transfer head movement)

The control device 7 moves the transfer head 81 to the transfer position of the die D.

(Step S9: Move intermediate stage position)

After step S8 or in parallel, the control device 7 moves the intermediate stage 31 to the transfer position with the bonding head 41 .

(Step SA: Transfer of bonding head)

The control device 7 picks up the die D from the intermediate stage 31 with the collet of the bonding head 41, and transfers the die D.

(Step SB: move intermediate stage position)

The control device 7 moves the intermediate stage 31 to a transfer position with the transfer head 81.

(Step SC: Moving the bonding head)

The control device 7 moves the die D held by the collet 42 of the bonding head 41 onto the substrate P. At that time, the control device 7 corrects the position of the bonding head 41 by controlling the drive unit 46 and the drive unit that drives the Y beam 43 based on the positional relationship with the reference bar detected by the detection head.

(Step SD: Bonding)

The control device 7 loads the die D picked up from the intermediate stage 31 with the collet 42 of the bonding head 41 onto the substrate P.

(Step SE: Moving the bonding head)

The control device 7 moves the bonding head 41 to the transfer position with the intermediate stage 31 .

After all the dies D are bonded to the substrate P, the control device 7 conveys the substrate P to the substrate carrying out section 6H. The control device 7 takes out the substrate S to which the die D is bonded from the substrate carrying claw in the substrate carrying out section 6H. The substrate P is taken out of the flip chip bonder 10.

In the above, the disclosure made by the present inventor has been specifically described based on the embodiments, modifications, and examples, but the present invention is not limited to the above embodiments, modifications, and examples, and various changes are possible. Of course.

For example, in the embodiment, an example using the Y-beam of the second embodiment has been described, but it is not limited to this, and any one of the first embodiment, the third embodiment, and their modifications, or a combination of Y-beams You can use it.

In addition, although the example with one bonding head (mounting head) was demonstrated in the Example, a plurality of bonding heads may be sufficient as in embodiment.

Further, in the embodiment, an example in which each of the transfer part, the intermediate stage part and the bonding part is described has been described, but there may be plural of each.

Further, in the embodiment, an example has been described in which a reversing mechanism is provided in the pick-up flip head, dies are received from the pick-up flip head by the transfer head, loaded on the intermediate stage, and the intermediate stage is moved. The flip head may be moved, or the stage unit may be moved by placing the picked-up die D on a stage unit capable of rotating the front and back of the die.

100: mounting device
110: trestle
120: mounting stage
140: Y-beam
150: mounting head
171: standard bar (standard member)
174: detection head

Claims (16)

A pedestal on which a mounting stage is installed;
a beam extending in a first direction so as to span the mount and supported on the mount so that both ends thereof are movable in a second direction;
a mounting head supported by the beam to be movable in the first direction;
A reference member spaced apart from the beam, extending in the first direction and supported at both ends;
A detection head provided in the mounting head unit to face the reference member.
to provide,
wherein the detection head is configured to detect a positional relationship with the reference member. The method of claim 1, further comprising a pair of support members for supporting the reference member,
One of the support members fixes one end of the reference member, and the other of the support members is configured to movably support the other end of the reference member. The mounting device according to claim 1, wherein the detection head has a displacement sensor located above the reference member and measuring a distance to the reference member. 4. The mounting device according to claim 3, further comprising a detection head that is located on a side of the reference member and has a displacement sensor that measures a distance to the reference member. The method of claim 1, wherein the reference member has a linear scale,
The mounting device according to claim 1, wherein the detection head has a sensor for reading the scale of the linear scale. The method of claim 5, wherein the reference member has a first linear scale for detecting a position in the first direction and a second linear scale for detecting a position in the second direction,
The detection head comprises: a first sensor for reading a scale in a direction perpendicular to the first linear scale; a second sensor for reading a scale in an oblique direction with respect to the first linear scale; A mounting device having a third sensor that reads a scale from a direction perpendicular to the other. The method of claim 5, wherein the reference member is located below the beam,
The mounting device, wherein the detection head is provided in the mounting head portion so as to face an upper surface of the reference member. The method of claim 5, wherein the reference member is located on a side opposite to the mounting head portion with the beam interposed therebetween,
The mounting device, wherein the detection head is provided in the mounting head portion to face a side surface of the reference member. The method of claim 5, A second reference member spaced apart from the beam, extending in the first direction and supported at both ends;
A second detection head provided in the mounting head unit to face the second reference member.
Mounting device further comprising. The method of claim 9, wherein the reference member is located below the beam,
The detection head is provided in the mounting head part so as to face the upper surface of the reference member,
The second reference member is located above the beam,
The mounting device, wherein the second detection head is provided in the mounting head portion to face a lower surface of the second reference member. The method of claim 9, wherein the reference member is located below the beam,
The detection head is provided in the mounting head portion to face the lower surface of the reference member,
The second reference member is located above the beam,
The mounting device, wherein the second detection head is provided in the mounting head portion to face a lower surface of the second reference member. The method of claim 9, wherein the reference member is located below the beam,
The detection head is provided in the mounting head portion to face a side surface of the reference member,
The second reference member is located above the beam,
The mounting device, wherein the second detection head is provided in the mounting head portion to face a side surface of the second reference member. The method of claim 1, comprising: a pair of support members supporting the reference member;
a second reference member extended in the second direction and provided on the mount;
A second detection head provided on the support member to face the second reference member.
more provided,
wherein the second detection head is configured to detect a positional relationship with the second reference member. The mounting apparatus according to claim 2, wherein one of the support members is configured to rotatably fix one end of the reference member. A mount on which a mounting stage is installed, a beam extending in a first direction so as to span the mount and supported on the mount so that both ends thereof can move in a second direction, respectively, and a beam movable in the first direction. a mounting head to be supported, a reference member spaced apart from the beam, extending in the first direction and supported at both ends, and a detection head provided on the mounting head to face the reference member; A step of carrying a board into a mounting device configured to detect a positional relationship between the head and the reference member;
A process of picking up a die from a wafer held in a wafer ring
A method of manufacturing a semiconductor device comprising: 16. The method of claim 15, comprising the steps of inverting the picked-up die;
Picking up the inverted die by the mounting head and loading it on the board
Further comprising a method of manufacturing a semiconductor device.

Images