JP2024008490A - Arrival determination device and arrival determination method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To disclose an arrival determination device and an arrival determination method, capable of reducing a requirement time required for lowering a lifting part.

SOLUTION: An arrival determination device comprises a lifting part, a tip end part, an energization part, a detection part, and a determination part. The lifting part is provided at a head main part so as to be capable of lifting up and down. The tip end part is held at the lifting part so as to be relatively movable in a vertical direction. The energization part energizes the tip end part downward against the lifting part. The detection part detects that the lifting part and the tip end part are relatively moved by contact of the tip end part or a component held by the tip end part with an object by lowering of the lifting part. The determination part determines an arrival of the tip end part or the component held by the tip end part at the object in the case where the contact is detected by the detection part at the timing when the lifting part is lowered down to an object position previously calculated so that the tip end part or the component held by the tip end part comes into contact with the object, and determines an unarrival of the tip end part or the component held by the tip end part at the object in the case where the contact is not detected by the detection part.

SELECTED DRAWING: Figure 5

COPYRIGHT: (C)2024,JPO&INPIT

Description

This specification discloses a technique related to an arrival determination device and an arrival determination method.

The electronic component mounting apparatus described in Patent Document 1 includes a contact detection means that detects relative movement between the suction head and the nozzle body due to the electronic component coming into contact with the substrate due to the lowering of the elevating member. The electronic component mounting apparatus described in Patent Document 1 controls the descending speed of the elevating member based on the detection signal of the contact detection means.

Japanese Patent Application Publication No. 2006-196618

However, if the elevating member is lowered while checking the detection signal of the contact detection means, the time required for lowering the elevating member may increase.

In view of these circumstances, this specification discloses an arrival determination device and an arrival determination method that can shorten the time required for lowering the elevating section.

This specification discloses a reaching determination device including an elevating section, a tip end, an urging section, a detecting section, and a determining section. The elevating section is provided in the head main body section so as to be movable up and down. The tip portion is held so as to be movable relative to the elevating portion in the vertical direction. The biasing portion biases the tip portion downward with respect to the elevating portion. The detecting section detects relative movement between the elevating section and the distal end section when the distal end section or a component held by the distal end section comes into contact with a target due to the lowering of the elevating section. The determination unit is configured to determine whether the contact is detected by the detection unit at a timing when the elevating unit descends to a target position calculated in advance such that the tip or the component held by the tip comes into contact with the target. If detected, it is determined that the tip or the component held by the tip has reached the target, and if the detection unit does not detect the contact, the tip or the component held by the tip is determined to have reached the target. It is determined whether the part held by the part has not reached the target object.

Further, this specification discloses a reaching determination method that is applied to a head that includes an elevating section, a tip section, a biasing section, and a detecting section, and that includes a determining step. The elevating section is provided in the head main body section so as to be movable up and down. The tip portion is held so as to be movable relative to the elevating portion in the vertical direction. The biasing portion biases the tip portion downward with respect to the elevating portion. The detecting section detects relative movement between the elevating section and the distal end section when the distal end section or a component held by the distal end section comes into contact with a target due to the lowering of the elevating section. In the determination step, the detection unit determines that the contact is detected at a timing when the elevating unit descends to a target position calculated in advance so that the tip or the component held by the tip comes into contact with the target. If detected, it is determined that the tip or the component held by the tip has reached the target, and if the detection unit does not detect the contact, the tip or the component held by the tip is determined to have reached the target. It is determined whether the part held by the part has not reached the target object.

Note that in this specification, in claim 6 of the claims first attached to the application (hereinafter referred to as original claims), "the attainment determination device according to claim 1" is replaced with " A technical idea modified to "the arrival determination device according to any one of claims 1 to 5" is disclosed. In addition, in claim 7 of the original claims, the present specification replaces "the arrival determination device according to claim 1" with "the arrival determination device according to any one of claims 1 to 6." ” is disclosed. Further, in the present specification, in claim 8 of the original claims, "the arrival determination device according to claim 1" is replaced with "the arrival determination device according to any one of claims 1 to 7. ” is disclosed.

According to the above-mentioned arrival determination device, the elevating section first descends to the target position. Then, the arrival determination device determines whether the tip end or the component held by the tip end has reached or not reached the target object, based on the detection result by the detection section at the timing when the elevating section has descended to the target position. Therefore, the arrival determination device can shorten the time required for lowering the elevating and lowering section compared to the case where the elevating and lowering section is lowered while checking the detection result by the detection section. What has been described above regarding the arrival determination device also applies to the arrival determination method.

FIG. 2 is a plan view showing a configuration example of a component mounting machine. FIG. 3 is an explanatory diagram illustrating the positional relationship between a head and a coating agent supply unit. FIG. 7 is a front view showing an example of the state of the head when contact is not detected by the detection unit. FIG. 6 is a front view showing an example of the state of the head when contact is detected by the detection unit. FIG. 2 is a block diagram showing an example of a control block of the arrival determination device. 3 is a flowchart illustrating an example of control by the arrival determination device. It is an explanatory view explaining the dipping operation which dips a coating agent in the lower end of a pin member. FIG. 6 is an explanatory diagram illustrating a transfer operation of transferring a coating agent dipped at the lower end of a pin member to a substrate. FIG. 3 is a front view showing an example of warpage of a substrate. It is an explanatory view explaining the holding operation which makes a tip part hold a component. FIG. 3 is an explanatory diagram illustrating a mounting operation for mounting a component held by the tip onto a board.

1. Embodiment 1-1. Configuration Example of Component Mounting Machine 10 The component mounting machine 10 mounts a plurality of components 80 onto a board 90. As shown in FIG. 1, the component mounting machine 10 of the embodiment includes a board transport device 11, a component supply device 12, a component transfer device 13, a component camera 14, a board camera 15, and a control device 16.

The substrate transport device 11 is configured by, for example, a belt conveyor, and transports the substrate 90 in the transport direction (X-axis direction). The substrate 90 is a circuit board on which various circuits such as electronic circuits, electric circuits, magnetic circuits, etc. are formed. The board transport device 11 carries the board 90 into the component mounting machine 10, positions the board 90 at a predetermined position in the machine, and clamps the board 90. After the component mounting machine 10 finishes mounting the plurality of components 80, the board transport device 11 unclamps the board 90 and carries the board 90 out of the component mounting machine 10.

The component supply device 12 supplies a plurality of components 80 to be mounted on the board 90. The component supply device 12 includes a plurality of feeders 12a provided along the conveyance direction (X-axis direction) of the substrate 90. Each of the plurality of feeders 12a pitch-feeds a carrier tape containing a plurality of parts 80, and supplies the parts 80 so that they can be collected at a supply position located on the tip side of the feeder 12a. Further, the component supply device 12 can also include a tray feeder that supplies a plurality of components 80 arranged on a tray. The plurality of feeders 12a and tray feeders are removably (replaceably) provided on the pallet member DP0. Moreover, the component supply device 12 can also use a tray unit that supplies the components 80 using a relatively large tray instead of the pallet member DP0.

The component transfer device 13 includes a head drive device 13a and a moving table 13b. The head drive device 13a is configured to be able to move the movable table 13b in the X-axis direction and the Y-axis direction (direction orthogonal to the X-axis direction in the horizontal plane) using a linear motion mechanism. A head 20 is removably (replaceably) provided on the movable table 13b using a clamp member. For example, the head 20 uses at least one holding member 30 to pick up and hold the component 80 supplied by the component supply device 12, and mounts the component 80 on the substrate 90 positioned by the substrate transfer device 11. For example, a suction nozzle, a chuck, etc. can be used as the holding member 30.

As the component camera 14 and the board camera 15, known imaging devices can be used. The component camera 14 is fixed to the base of the component mounting machine 10 so that its optical axis faces upward in the vertical direction (Z-axis direction perpendicular to the X-axis direction and the Y-axis direction). The component camera 14 can image the component 80 held by the holding member 30 from below. The board camera 15 is provided on the movable table 13b of the component transfer device 13 so that its optical axis points downward in the vertical direction (Z-axis direction). The board camera 15 can image the board 90 from above.

The component camera 14 and the board camera 15 perform imaging based on control signals sent from the control device 16. Image data of images captured by the component camera 14 and the board camera 15 are transmitted to the control device 16. The control device 16 includes a known arithmetic unit and a storage device, and constitutes a control circuit. Information, image data, etc. output from various sensors provided in the component mounting machine 10 are input to the control device 16. The control device 16 sends control signals to each device based on a control program and predetermined mounting conditions set in advance.

For example, the control device 16 causes the substrate camera 15 to image the substrate 90 positioned by the substrate transport device 11. The control device 16 processes the image captured by the board camera 15 and recognizes the positioning state of the board 90. The control device 16 also drives and controls the head 20 to collect and hold the component 80 supplied by the component supply device 12 on the holding member 30 (corresponding to a holding operation described later), and holds the component 80 on the holding member 30. The component camera 14 is caused to take an image of the component 80 being displayed. The control device 16 processes the image captured by the component camera 14 and recognizes the holding posture of the component 80.

The control device 16 drives and controls the head 20 to move the holding member 30 above a scheduled mounting position that is preset by a control program or the like. Further, the control device 16 corrects the scheduled mounting position based on the positioning state of the board 90, the holding posture of the component 80, etc., and sets the mounting position where the component 80 is actually mounted. The scheduled mounting position and the mounting position include the rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate).

The control device 16 corrects the target position (X-axis coordinate and Y-axis coordinate) and rotation angle of the holding member 30 according to the mounting position. The control device 16 drives and controls the head 20 to lower the holding member 30 at the corrected target position at the corrected rotation angle, and mounts the component 80 on the board 90 (corresponding to a mounting operation described later). . The control device 16 executes the mounting process of mounting the plurality of components 80 on the board 90 by repeating the above pick-and-place cycle.

1-2. Dipping and Transferring Coating Agent 40p The component mounting machine 10 of the embodiment has the coating agent supply unit 40 mounted on the component supplying device 12, so that the component 80 held by the holding member 30 is dipped in the coating agent 40p and then transferred to the substrate. 90. In addition, the component mounting machine 10 of the embodiment has a pin member 50 mounted on the head 20, and by dipping the tip of the pin member 50 in the coating agent 40p, the coating agent 40p is applied to the substrate 90. It becomes possible to transcribe.

The coating agent supply unit 40 forms a thin film of a coating agent 40p such as solder paste and supplies the coating agent 40p. Specifically, as shown in FIGS. 1 and 2, the coating agent supply unit 40 includes a container 41 and a storage tank 42. The container 41 accommodates the coating agent 40p. The container 41 of the embodiment is formed into a cylindrical shape with a bottom. The coating agent supply unit 40 periodically rotates the container 41 so that the coating agent 40p does not locally decrease in the container 41. Further, the coating agent supply unit 40 detects the remaining amount of the coating agent 40p while the container 41 is rotating. The coating agent supply unit 40 replenishes the coating agent 40p from the storage tank 42 in which the coating agent 40p is stored to the container 41 when the remaining amount of the coating agent 40p becomes less than a predetermined amount. Moreover, the coating agent supply unit 40 can also adjust the film thickness 40h of the coating agent 40p.

The coating agent supply unit 40 is removably (replaceably) provided in the pallet member DP0. As shown in FIG. 1, the pallet member DP0 can be equipped with a plurality of feeders 12a and a coating agent supply unit 40 at the same time. The pallet member DP0 can also be equipped with a tray feeder and the coating agent supply unit 40 at the same time. Moreover, the coating agent supply unit 40 can also be installed in a tray unit used instead of the pallet member DP0. In this manner, in the embodiment, the coating agent supply unit 40 including the container 41 is provided so as to be replaceable with the component supply device 12 that supplies the component 80. Therefore, it is easier to downsize the component mounting machine 10 compared to the case where an installation space for the coating agent supply unit 40 is provided separately. Furthermore, maintenance of the coating agent supply unit 40 is easy.

As shown in FIG. 2, the head 20 is provided with at least one holding member 30 that is removably (replaceable) with at least one pin member 50. The pin member 50 may take various forms as long as it can hold the coating agent 40p and transfer it to the substrate 90. Similarly to the holding member 30, the pin member 50 provided on the head 20 is moved by the head 20 in the horizontal direction (X-axis direction and Y-axis direction) and is raised and lowered in the vertical direction (Z-axis direction). Note that, as described above, the substrate 90 is positioned by the substrate transport device 11. The pin member 50 provided in the head 20 is moved in the horizontal direction (X-axis direction and Y-axis direction) and raised and lowered in the vertical direction (Z-axis direction) between the container 41 and the positioned substrate 90. Ru.

The control device 16 drives and controls the head 20 to dip the pin member 50 provided on the head 20 into the coating agent 40p contained in the container 41 (corresponding to a dipping operation described later). Specifically, the control device 16 drives and controls the head 20 to move the pin member 50 above the container 41, lower the pin member 50, and dip the coating agent 40p into the lower end of the pin member 50. do. Next, the control device 16 drives and controls the head 20 to move the pin member 50 to a predetermined location on the board 90 (for example, a location where the component 80 is attached).

Then, the control device 16 drives and controls the head 20 to transfer the coating agent 40p dipped at the lower end of the pin member 50 to a predetermined portion of the substrate 90 (corresponding to a transfer operation described later). By repeating the drive control of the head 20 described above, the control device 16 can apply the coating agent 40p to a plurality of predetermined portions of the substrate 90 (for example, a plurality of mounting portions of the component 80). Note that the dipping work and the transfer work may be performed in the same component mounting machine 10 that performs the holding work and the mounting work of the component 80 as in the embodiment, or the holding work and the mounting work of the component 80 are The process may be performed in a component placement machine 10 different from the component placement machine 10 that performs the process.

1-3. Configuration example of head 20 The head 20 moves at least one of the holding member 30 and the pin member 50 in the horizontal direction (X-axis direction and Y-axis direction) and moves up and down in the vertical direction (Z-axis direction). It is sufficient if it can be done, and it can take various forms. The head 20 of the embodiment includes a head main body part 21 , an elevating part 22 , a tip part 23 , an urging part 24 , and a detection part 25 . As shown in FIG. 1, the head main body part 21 is provided on a moving table 13b, and the head 20 can be moved in the horizontal direction (X-axis direction and Y-axis direction).

The elevating section 22 is provided in the head main body section 21 so as to be movable up and down. The elevating section 22 only needs to be able to move up and down with respect to the head main body section 21, and can take various forms. For example, the elevating section 22 can be provided on the head body section 21 so as to be movable up and down using a known elevating mechanism such as a ball screw mechanism. The ball screw mechanism is driven by, for example, a servo motor, and raises and lowers the elevating section 22 in the vertical direction (Z-axis direction). The tip portion 23 is held movably relative to the elevating portion 22 in the vertical direction (Z-axis direction). Further, the biasing section 24 biases the distal end section 23 downward with respect to the elevating section 22 .

The tip portion 23 may be any portion that can be held as described above, and may take various forms. Further, the biasing portion 24 may take various forms as long as it can bias the distal end portion 23 downward with respect to the elevating portion 22. As shown in FIGS. 2 to 4, the tip portion 23 includes the lower end of the pin member 50, for example. Further, the tip portion 23 includes the lower end of the holding member 30. As shown in FIGS. 3 and 4, for example, the pin member 50 is urged downward in the vertical direction (Z-axis direction) by an elastic member (such as a spring member) that is the urging section 24. There is.

The pin member 50 moves up and down in the vertical direction (Z-axis direction) in accordance with the up and down movement of the elevating section 22 until the lower end of the pin member 50 comes into contact with the target object 70 . As the elevating section 22 descends, the lower end of the pin member 50 comes into contact with the target 70, and when the elevating section 22 further descends, the pin member 50 moves relative to the elevating section 22 against the elastic force of the elastic member. . 3 shows a state before the pin member 50 moves relative to the elevating part 22, and FIG. 4 shows a state after the pin member 50 moves relative to the elevating part 22.

Note that the head 20 shown in FIGS. 3 and 4 includes a plurality of pin members 50. Specifically, the head 20 includes a tip unit 23u. A pin member module 23m including a plurality of pin members 50 is removably provided in the tip unit 23u. The tip unit 23u moves up and down similarly to the pin member 50 described above, and moves relative to the elevating section 22 similarly to the pin member 50 described above. The tip unit 23u of the embodiment includes a module fixing part 23a and a light shielding part 23b.

The module fixing portion 23a detachably fixes the pin member module 23m. The module fixing portion 23a can fix the pin member module 23m from the side by, for example, screwing. The light blocking section 23b blocks the detection light of the detection section 25 when the pin member 50 moves relative to the elevating section 22. Note that the above description regarding the relative movement of the pin member 50 also applies to the relative movement of the holding member 30. Furthermore, what has been described above regarding the relative movement of the pin member 50 also applies to the relative movement of the component 80 held by the tip portion 23 (lower end of the holding member 30).

The detection unit 25 detects relative movement between the elevating portion 22 and the distal end portion 23 when the distal end portion 23 or the component 80 held by the distal end portion 23 comes into contact with the target object 70 due to the lowering of the elevating portion 22 . The detection unit 25 only needs to be able to detect the above-mentioned relative movement, and can take various forms. For example, the detection section 25 can use an optical sensor 25s that transmits or blocks detection light depending on whether or not the distal end section 23 moves relative to the elevating section 22.

As shown in FIGS. 3 and 4, the optical sensor 25s includes a light projector 25a and a light receiver 25b. The light projector 25a includes a light projecting port 25a1, and the light receiver 25b includes a light receiving port 25b1. As shown in FIG. 3, when the distal end portion 23 is not moving relative to the elevating portion 22, the detection light emitted from the light projection port 25a1 (indicated by the solid line arrow in the figure) is blocked by the light blocking portion 23b. be done. In this case, the detection light does not reach the light receiving port 25b1, as indicated by the broken line in the figure, so the detection unit 25 detects that the tip 23 or the component 80 held by the tip 23 comes into contact with the target 70. Therefore, it is detected that the elevating portion 22 and the tip portion 23 are not moving relative to each other.

As shown in FIG. 4, when the distal end portion 23 moves relative to the elevating portion 22, the detection light emitted from the light projection port 25a1 (indicated by a solid arrow in the figure) is blocked by the light blocking portion 23b. The light passes through the tip unit 23u without any problem and reaches the light receiving port 25b1. In this case, the detection unit 25 detects that the tip portion 23 or the component 80 held by the tip portion 23 has come into contact with the target object 70, and the elevating portion 22 and the tip portion 23 have moved relative to each other. Note that the optical sensor 25s can be applied to any form of the arrival determination device 60 shown below. In addition to the transmission type optical sensor 25s described above, the detection unit 25 can use various known detectors such as a reflection type optical sensor.

1-4. Configuration Example of Arrival Determination Device 60 A case is assumed in which the elevating unit 22 is lowered while checking the detection signal of the detecting unit 25. In this case, the control device 16 may, for example, lower the elevating portion 22 to a predetermined height position at a first speed, and lower the elevating portion 22 from the predetermined height position at a second speed lower than the first speed. Conceivable. In this case, the time required for lowering the elevating section 22 may increase. Therefore, in the embodiment, an arrival determination device 60 is provided.

According to the arrival determination device 60, the elevating section 22 first descends to the target position 71. Then, the arrival determination device 60 determines whether the distal end 23 or the component 80 held by the distal end 23 has reached the target 70 at the timing when the elevating section 22 has descended to the target position 71, according to the detection result by the detecting section 25. Or determine if it has not been reached. Therefore, the arrival determination device 60 can shorten the time required for lowering the elevating and lowering section 22 compared to the case where the elevating and lowering section 22 is lowered while checking the detection result by the detection section 25.

Specifically, the reaching determination device 60 includes an elevating section 22 , a tip section 23 , an urging section 24 , a detecting section 25 , and a determining section 61 . The arrival determination device 60 can also include a control section 62. As described above, the elevating section 22, the tip section 23, the biasing section 24, and the detecting section 25 can be provided in the head 20. The determination unit 61 and the control unit 62 can be provided in various control devices.

For example, at least one of the determination section 61 and the control section 62 can be provided in the control device 16 of the component mounting machine 10. At least one of the determination section 61 and the control section 62 may be provided in a control device, a management device, etc. above the component mounting machine 10. At least one of the determination unit 61 and the control unit 62 can also be formed on the cloud. As shown in FIG. 5, the arrival determination device 60 of the embodiment includes both a determination section 61 and a control section 62. Further, the determination section 61 and the control section 62 are provided in the control device 16 of the component mounting machine 10.

Furthermore, the arrival determination device 60 of the embodiment executes control according to the flowchart shown in FIG. The determination unit 61 performs the determination and processing shown in steps S12 to S14. The control unit 62 performs the process shown in step S15. Note that the control device 16 performs the process shown in step S11.

1-4-1. Judgment unit 61
The control device 16 drives and controls the head 20 to lower the elevating section 22 to the target position 71 (step S11 shown in FIG. 6). Then, the determining unit 61 determines whether the distal end 23 or the component 80 held by the distal end 23 has reached the target object 70 or It is determined whether the destination has not been reached (steps S12 to S14 shown in FIG. 6).

Specifically, the determination unit 61 detects the detection unit at the timing when the elevating unit 22 descends to a target position 71 calculated in advance such that the tip 23 or the component 80 held by the tip 23 comes into contact with the target 70. 25, it is determined whether the tip 23 or the component 80 held by the tip 23 has reached the target 70. Further, the determination unit 61 determines that the detection unit 25 uses the above-mentioned If contact is not detected, it is determined that the tip 23 or the component 80 held by the tip 23 has not reached the target 70 .

For example, assume that the tip portion 23 is the lower end of the pin member 50 and the target object 70 is the coating agent supply unit 40 that supplies the coating agent 40p by forming a thin film thereon. In this case, the head 20 including the elevating part 22, the tip part 23, the urging part 24, and the detecting part 25 can perform a dipping operation of dipping the coating agent 40p onto the lower end of the pin member 50.

As shown in FIG. 7, the distance from the lower end of the pin member 50 to the bottom surface of the container 41 is defined as a distance L11. As described above, the lower end of the pin member 50 comes into contact with the target object 70 (in this case, the coating agent supply unit 40, in detail, the bottom surface of the container 41) due to the lowering of the elevating part 22, and then When the portion 22 descends, the pin member 50 moves relative to the elevating portion 22 against the elastic force of the elastic member. In this way, the distance by which the tip portion 23 moves relative to each other is defined as the distance L20 (the same applies hereinafter). In this case, the target position 71 is a position (height) that is the sum of the distance L11 and the distance L20. Further, the elevating section 22 is provided with a known position detector such as an encoder, and the control device 16 can recognize the position (height) of the elevating section 22.

The determining unit 61 determines that the detecting unit 25 detects that the tip portion 23 (the lower end of the pin member 50) and the target object 70 (the coating agent supply unit 40) are in contact with each other at the timing when the elevating unit 22 descends to the target position 71. If detected, it is determined whether the tip 23 has reached the target 70. Furthermore, if the detection unit 25 does not detect the above contact at the timing when the elevating unit 22 descends to the target position 71, the determination unit 61 determines that the tip portion 23 has not reached the target object 70. to decide.

Next, assume that the tip end 23 is the lower end of the pin member 50 and the target object 70 is a substrate 90 onto which the coating material 40p is transferred. In this case, the head 20 including the elevating part 22, the tip part 23, the biasing part 24, and the detecting part 25 can perform a transfer operation of transferring the coating material 40p dipped on the lower end of the pin member 50 to the substrate 90. . As shown in FIG. 8, the distance from the lower end of the pin member 50 to the substrate 90 is defined as a distance L12. Since the distance over which the tip portion 23 relatively moves is the distance L20, in this case, the target position 71 is a position (height) that is the sum of the distance L12 and the distance L20.

The determining unit 61 determines that the detecting unit 25 detects that the tip 23 (the lower end of the pin member 50) and the target object 70 (substrate 90) are in contact with each other at the timing when the elevating unit 22 descends to the target position 71. In this case, it is determined whether the tip portion 23 has reached the target object 70. Further, the determination unit 61 determines that the tip portion 23 has not reached the target object 70 when the detection unit 25 does not detect the contact at the timing when the elevating unit 22 descends to the target position 71. to decide.

The head 20, which includes the elevating part 22, the tip part 23, the urging part 24, and the detecting part 25, can also perform both dipping work and transfer work. In this case, the determination unit 61 can similarly determine whether the tip 23 (lower end of the pin member 50) has reached or not reached the target 70 (coating agent supply unit 40), It can be determined whether the lower end of the pin member 50 has reached the target object 70 (substrate 90) or not. In this way, the head 20 including the elevating section 22, the tip section 23, the urging section 24, and the detecting section 25 can perform at least one of the dipping operation and the transfer operation.

Note that, as shown in FIG. 9, the substrate 90 may be warped. The substrate 90 shown in the figure is warped so as to protrude downward in the vertical direction (Z-axis direction). In this case, the determination unit 61 may continue to determine whether the tip portion 23 (lower end of the pin member 50) has not reached the target object 70 (substrate 90) as the warpage of the substrate 90 increases.

Therefore, the arrival determination device 60 is preferably equipped with a known distance measuring sensor 60s that can detect the warped state of the substrate 90. As shown in FIG. 9, the distance measuring sensor 60s, for example, irradiates a laser beam from above the substrate 90 to a plurality of positions on the upper surface of the substrate 90, and measures the relative distances to each of the positions on the upper surface of the substrate 90. , the state of warpage of the substrate 90 can be detected based on the measurement results. In the same figure, the distance measurement sensor 60s shown in a solid line moves horizontally above the board 90 and sequentially measures the relative distance to the board 90 using the distance measurement sensor 60s shown in a broken line. There is. Note that at least one distance measurement sensor 60s can also measure the relative distance to the substrate 90 at a plurality of positions on the upper surface of the substrate 90, without horizontally moving during measurement. What has been described above regarding the distance measuring sensor 60s also applies to the distance measuring sensor 60s shown in FIG.

The arrival determination device 60 increases or decreases the distance L12, which is the distance from the lower end of the pin member 50 to the substrate 90, according to the detection result of the distance measurement sensor 60s. Specifically, as shown in the figure, when the board 90 is warped so as to protrude downward in the vertical direction (Z-axis direction), the arrival determination device 60 determines that the board 90 The distance obtained by adding the amount of warpage is set as distance L12. Further, when the board 90 is warped so as to protrude upward in the vertical direction (Z-axis direction), the reach determination device 60 calculates the distance L12 by subtracting the amount of warp of the board 90 from the distance L12, which is the design value. shall be.

Note that if the reaching determination device 60 does not include the distance measuring sensor 60s, for example, an operator or the like may measure the amount of warpage of the board 90 in advance and input the amount of warping of the board 90 to the reaching determining device 60. can. In this case, the reach determination device 60 can increase or decrease the distance L12 according to the amount of warpage of the board 90 input by the operator or the like.

Next, assume that the tip 23 is the lower end of the holding member 30 and the target object 70 is a component 80 to be held by the tip 23. In this case, the head 20 including the elevating section 22, the distal end section 23, the urging section 24, and the detecting section 25 can perform a holding operation in which the distal end section 23 holds the component 80. As shown in FIG. 10, the distance from the lower end of the holding member 30 to the component 80 is defined as a distance L13. Since the distance over which the tip portion 23 relatively moves is the distance L20, in this case, the target position 71 is a position (height) that is the sum of the distance L13 and the distance L20.

The determining unit 61 determines that the detecting unit 25 detects that the tip 23 (lower end of the holding member 30) and the target object 70 (component 80) are in contact with each other at the timing when the elevating unit 22 descends to the target position 71. In this case, it is determined whether the tip portion 23 has reached the target object 70. Further, the determination unit 61 determines that the tip portion 23 has not reached the target object 70 when the detection unit 25 does not detect the contact at the timing when the elevating unit 22 descends to the target position 71. to decide.

Next, consider a case where the tip 23 (lower end of the holding member 30) holds a component 80 and the target object 70 is a substrate 90 (specifically, the substrate 90 on which the component 80 held by the tip 23 is mounted). Suppose. In this case, the head 20 including the elevating section 22, the distal end section 23, the urging section 24, and the detecting section 25 can perform a mounting operation for mounting the component 80 held by the distal end section 23 onto the substrate 90. As shown in FIG. 11, the distance from the lower end of the component 80 held by the tip portion 23 (lower end of the holding member 30) to the substrate 90 is defined as a distance L14. Since the distance over which the tip portion 23 relatively moves is the distance L20, in this case, the target position 71 is the position (height) obtained by adding the distance L20 to the distance L14.

The determining unit 61 determines, at the timing when the elevating unit 22 descends to the target position 71, the detecting unit 25 detects the contact between the component 80 held by the tip portion 23 (lower end of the holding member 30) and the target object 70 (substrate 90). If contact is detected, it is determined whether the component 80 held by the tip portion 23 has reached the target object 70. Further, the determination unit 61 determines that when the detection unit 25 does not detect the contact at the timing when the elevating unit 22 descends to the target position 71, the target 70 of the component 80 held by the tip end 23 is detected. Determine if the target has not been reached.

Note that the above description regarding the warping of the substrate 90 also applies to the case where the head 20 performs the mounting operation. In other words, the arrival determination device 60 can include a known distance measuring sensor 60s that can detect the warped state of the substrate 90. In this case, the arrival determination device 60 increases or decreases the distance L14, which is the distance from the lower end of the component 80 held by the tip portion 23 (lower end of the holding member 30) to the substrate 90, according to the detection result of the distance measuring sensor 60s. be able to. Furthermore, if the reach determination device 60 does not include the distance measurement sensor 60s, for example, an operator or the like may measure the amount of warpage of the board 90 in advance and input the amount of warp of the board 90 to the reach determination device 60. can. In this case, the reach determination device 60 can increase or decrease the distance L14 according to the amount of warpage of the board 90 input by the operator or the like.

The head 20, which includes the elevating part 22, the tip part 23, the urging part 24, and the detecting part 25, can also perform both the holding work and the mounting work. In this case, the determination unit 61 can similarly determine whether the tip portion 23 (lower end of the holding member 30) has reached the target object 70 (component 80) or not. It can be determined whether the component 80 held by the lower end of the target object 70 (substrate 90) has reached or not reached the target object 70 (substrate 90). In this way, the head 20 including the elevating part 22, the tip part 23, the urging part 24, and the detecting part 25 can perform at least one of the holding work and the mounting work. Further, the head 20 including the elevating section 22, the tip section 23, the urging section 24, and the detecting section 25 can also perform at least one of a dipping operation, a transfer operation, a holding operation, and a mounting operation.

The determination unit 61 can determine whether the tip 23 or the component 80 held by the tip 23 has reached or not reached the target 70 in any operation of the head 20 . However, for example, the detection unit 25 requires a predetermined time to detect the presence or absence of relative movement of the tip end 23 with respect to the elevating unit 22, resulting in some delay in takt time. Therefore, the determination unit 61 can also make the above determination in the work of the head 20 that emphasizes the quality of the substrate product (the work is not limited, for example, transfer work, etc.). Note that what has already been described about the work performed by the determination unit 61 and the head 20 can also be applied to the control unit 62 described below as appropriate.

1-4-2. Control unit 62
If the determining unit 61 determines that the tip 23 or the component 80 held by the tip 23 has arrived, the component mounting machine 10 can continue production using the head 20. On the other hand, if the determining unit 61 determines that the tip 23 or the component 80 held by the tip 23 has not arrived, the component mounting machine 10 continues production using the head 20 without dealing with the problem. It is not desirable to do so.

Therefore, when the determining unit 61 determines that the distal end 23 or the component 80 held by the distal end 23 has not arrived, the control unit 62 controls the elevating unit 22, the distal end 23, the urging unit 24, and the detecting unit 25. Production using the prepared head 20 is stopped (step S15 shown in FIG. 6). In this case, the control unit 62 can, for example, inform the operator that production using the head 20 is being stopped due to the above-described non-arrival. For example, the control unit 62 provides the above-mentioned guidance on a display device provided in the component mounting machine 10. Thereby, the operator can check the status of the problem and can deal with the problem.

For example, due to the warpage of the substrate 90 as shown in FIG. When it is determined that the component 80 held by the component 23 has not arrived, the operator can provide the component mounting machine 10 with a support member that supports the board 90 . Further, when the determination unit 61 determines that the tip 23 or the component 80 held by the tip 23 has not reached the board 90 due to the warpage of the substrate 90, the operator The number can be increased and the arrangement of the support members can be changed.

The control unit 62 can also further lower the elevating unit 22 with respect to the target position 71 when the determining unit 61 determines that the distal end 23 or the component 80 held by the distal end 23 has not reached the target position 71 (see FIG. 6). Thereby, it is possible that the problem can be improved without stopping production using the head 20. Specifically, the control unit 62 moves the elevating unit 22 to the target position 71 until a predetermined amount or until the determination unit 61 determines that the tip 23 or the component 80 held by the tip 23 has arrived. However, it can be lowered further.

The above specified amount can be obtained in advance by, for example, simulation or verification using an actual machine. The above specified amount can also be increased or decreased depending on the type of substrate 90 (easiness of bending of substrate 90). Further, the control for further lowering the elevating section 22 with respect to the target position 71 can be applied when the head 20 performs any of the dipping work, the transfer work, the holding work, and the mounting work. If the problem is caused by the aforementioned warping of the board 90 (the case where the board 90 is warped so as to protrude downward in the vertical direction (Z-axis direction)), move the lifting section 22 to the target position 71. Further lowering control is preferably applied when the head 20 performs at least one of the transfer work and the mounting work.

Note that if the head 20 performs a mounting operation when the board 90 is warped so as to protrude upward in the vertical direction (Z-axis direction), the load applied to the component 80 may increase. Therefore, the control section 62 further lowers the elevating section 22 relative to the target position 71 for a predetermined component that allows an expected increase in load when the elevating section 22 further descends relative to the target position 71. You can also do that. In this case, the target object 70 is a substrate 90 on which the component 80 is mounted, and more specifically, the target object 70 is the substrate 90 on which the component 80 held by the tip portion 23 (lower end of the holding member 30) is mounted.

For example, the operator may obtain the amount of increase in load applied to the component 80 in advance through simulation, verification using an actual machine, etc., and select the component 80 that allows the amount of increase in load as the above-mentioned predetermined component. can. For example, BGA (Ball Grid Array) parts and the like tend to have a higher load capacity than wafer parts and are therefore more likely to be included in predetermined parts. Further, the larger the external dimensions of the component 80, the higher the load capacity and the easier it is to be included in a predetermined component.

2. Reach Determination Method What has already been stated regarding the arrival determination device 60 can be similarly applied to the arrival determination method. Specifically, the reaching determination method is applied to the head 20 including the elevating section 22, the tip section 23, the urging section 24, and the detecting section 25, and includes a determining step. The determination process corresponds to control performed by the determination unit 61. The arrival determination method can also include a control step. The control process corresponds to the control performed by the control unit 62.

3. Example of Effect of Embodiment According to the arrival determination device 60, first, the elevating section 22 descends to the target position 71. Then, the arrival determination device 60 determines whether the distal end 23 or the component 80 held by the distal end 23 has reached the target 70 at the timing when the elevating section 22 has descended to the target position 71, according to the detection result by the detecting section 25. Or determine if it has not been reached. Therefore, the arrival determination device 60 can shorten the time required for lowering the elevating and lowering section 22 compared to the case where the elevating and lowering section 22 is lowered while checking the detection result by the detection section 25. What has been described above regarding the arrival determination device 60 also applies to the arrival determination method.

20: Head, 21: Head main body, 22: Lifting section, 23: Tip section, 24: Biasing section,
25: detection unit, 25s: optical sensor, 40: coating agent supply unit, 40p: coating agent,
50: pin member, 60: arrival determination device, 61: determination section, 62: control section,
70: target object, 71: target position, 80: component, 90: board.

Claims (9)

an elevating section provided in the head main body so as to be movable up and down;
a tip portion that is held movable relative to the elevating portion in a vertical direction;
a biasing portion that biases the tip portion downward with respect to the elevating portion;
a detection unit that detects relative movement between the lifting unit and the tip when the tip or a component held by the tip comes into contact with a target due to the lowering of the lifting unit;
When the contact is detected by the detection unit at the timing when the elevating unit descends to a target position calculated in advance so that the tip or the component held by the tip comes into contact with the target; , determines whether the tip or the component held by the tip reaches the target, and if the detection unit does not detect the contact, the tip or the component held by the tip reaches the target; a determination unit that determines whether the component has not reached the target object;
An arrival determination device comprising: Production using a head including the elevating section, the distal end, the urging section, and the detecting section when the determining section determines that the distal end or the component held by the distal end has not reached the destination. The arrival determination device according to claim 1, further comprising a control unit that stops the arrival determination device. 2. The control unit according to claim 1, further comprising a control unit that further lowers the elevating unit with respect to the target position when the determining unit determines that the distal end portion or the component held by the distal end portion has not reached the target position. arrival determination device. The control unit further controls the elevating unit relative to the target position until the reaching of the distal end or the component held by the distal end is determined by a predetermined amount or the determination unit. The arrival determination device according to claim 3, wherein the device is lowered. The target object is a board on which the component is mounted,
The control unit further lowers the elevating portion relative to the target position for a predetermined component that allows an expected increase in load when the elevating portion further descends relative to the target position. The arrival determination device according to claim 3 or claim 4. The arrival determination device according to claim 1, wherein the detection section is an optical sensor through which detection light is transmitted or blocked depending on whether or not there is a relative movement of the tip with respect to the elevating section. The tip portion is the lower end of the pin member,
The target object is a coating agent supply unit that forms and supplies a coating agent in a thin film, or a substrate that transfers the coating agent,
The head including the elevating part, the tip part, the biasing part, and the detecting part performs a dipping operation of dipping the coating agent on the lower end of the pin member, and the coating agent dipped in the lower end of the pin member. The arrival determination device according to claim 1, wherein the arrival determination device performs at least one of the transfer operations of transferring the image to the substrate. The target object is the component held by the tip or a board on which the component held by the tip is mounted,
The head including the elevating section, the tip section, the urging section, and the detection section performs a holding operation in which the tip section holds the component, and a mounting operation in which the component held by the tip section is attached to the substrate. The arrival determination device according to claim 1, which performs at least one of the tasks. an elevating section provided in the head main body so as to be movable up and down;
a tip portion that is held movable relative to the elevating portion in a vertical direction;
a biasing portion that biases the tip portion downward with respect to the elevating portion;
a detection unit that detects relative movement between the lifting unit and the tip when the tip or a component held by the tip comes into contact with a target due to the lowering of the lifting unit;
Applies to heads with
When the contact is detected by the detection unit at the timing when the elevating unit descends to a target position calculated in advance so that the tip or the component held by the tip comes into contact with the target; , determines whether the tip or the component held by the tip reaches the target, and if the detection unit does not detect the contact, the tip or the component held by the tip reaches the target; An arrival determination method comprising a determination step of determining whether a component has not reached the target object.

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