US20080301931A1 - Method And Apparatus For Mounting Semiconductor Chips - Google Patents
Method And Apparatus For Mounting Semiconductor Chips Download PDFInfo
- Publication number
- US20080301931A1 US20080301931A1 US12/193,658 US19365808A US2008301931A1 US 20080301931 A1 US20080301931 A1 US 20080301931A1 US 19365808 A US19365808 A US 19365808A US 2008301931 A1 US2008301931 A1 US 2008301931A1
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- substrate
- die ejector
- semiconductor chips
- semiconductor chip
- pick
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 230000004308 accommodation Effects 0.000 claims description 2
- 239000011888 foil Substances 0.000 abstract description 9
- 230000032258 transport Effects 0.000 description 28
- 235000012431 wafers Nutrition 0.000 description 26
- 238000010276 construction Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
Definitions
- the invention concerns a method and an apparatus for mounting semiconductor chips onto a substrate.
- Different types of automatic assembly machines are known for mounting semiconductor chips onto a substrate.
- Die Bonders that are used in order to mount semiconductor chips onto a substrate at high speed and with great accuracy.
- Die Bonders are known for example from the patent U.S. Pat. No. 6,185,815, and the patent publications EP 991 11 0, US 2005-0011067 and US 2004-0246794.
- the semiconductor chips are presented on a wafer table.
- the substrates to be equipped are supplied one after the other in cycles whereby one substrate at a time is fixed to a substrate table and presented for equipping with semiconductor chips. Mounting of the semiconductor chips is done by means of a bondhead driven by a pick and place device.
- Die Bonders marketed by the applicant contain a pick and place device with a first fast axis that enables the transport of the semiconductor chips from the wafer table to the substrate at high speed and with a second axis running orthogonally to the first axis that allows shifting of the semiconductor chip in the range of several tens of micrometers so that any deviation of the actual position from the set position can be corrected.
- This concept enables a simple and favourable method of construction however limits the Die Bonder to the effect that each time only one specific semiconductor chip can be mounted onto the substrate.
- automatic placement machines that have two fast axes running orthogonally to each other that cover a large working area.
- the advantage of this concept is that several different types of semiconductors as well as other components can be mounted one after the other onto the same substrate.
- the disadvantage is that the assembly time is much greater than with a Die Bonder.
- the substrates are pushed forward in cycles by a transport device and, with substrates having several substrate places lying next to each other in columns, are processed column by column.
- the substrate is only pushed forward when a column is fully equipped with semiconductor chips.
- Die Bonders have been developed with which the substrate table can be shifted in transport direction together with the substrate fixed to the substrate table so that the columns of a block can be equipped without having to release the fixing of the substrate to the substrate table.
- the object of the invention is to improve a Die Bonder in such a way that several adjacent columns of substrate places can be processed without the substrate having to be pushed forward after processing each column and without the substrate table having to be moveable in transport direction.
- the invention is based on the knowledge that in principle it is possible to build a pick and place device with two fast axes with which both axes cover a working area of several centimetres but that such a construction becomes very complex when both axes have to be moved for the equipping of each semiconductor chip.
- the invention therefore proposes to equip the pick and place device with an axis running parallel to the transport direction of the substrate that covers a working area of several centimetres and, on the other hand, also equipping the die ejector that supports the detachment of the semiconductor chips from the foil with a motorised axis running parallel to the transport direction of the substrate that covers the same working area.
- this construction enables moving both the pick and place device as well as the die ejector parallel to the transport direction of the substrate so that several columns can be equipped without having to move the substrate and that during equipping of the substrate places that belong to the same column the bondhead only has to carry out possible correction movements in the transport direction of the substrate that are small in comparison with the distance between adjacent columns so that a permanent back and forth movement of the bondhead over comparatively large distances parallel to the transport direction of the substrate is omitted.
- the invention accepts an enlargement of the semiconductor mounting apparatus as the pick and place device has a two-dimensional working area.
- the movement range of the wafer table in the transport direction of the substrate has to be enlarged by the working area of the die ejector in order that the semiconductor chips situated at the edge of the wafer can also be positioned above the die ejector in every possible position of the die ejector and picked up by the bondhead of the pick and place device.
- the invention therefore concerns a method for mounting semiconductor chips onto a substrate having at least two substrate places for accepting semiconductor chips arranged next to each other in a column, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it on the substrate place to be equipped.
- the method is characterised by the following steps:
- the wafer table is moved in order to present the next semiconductor chip above the die ejector
- the pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate place to be equipped
- steps a and b are repeated until all substrate places of the column are equipped.
- An apparatus for mounting semiconductor chips suitable for executing this method comprises a rigidly arranged substrate table with a support surface for supporting a substrate, a transport device for transporting the substrate along a predetermined transport direction, a wafer table for presenting a semiconductor chip, a die ejector for supporting detachment of the semiconductor chip from the wafer table and a pick and place device with a bondhead for picking the semiconductor chip presented above the die ejector and placing the picked semiconductor chip onto the substrate.
- FIG. 1 shows a schematic plan view of a semiconductor mounting apparatus
- FIG. 2-4 show different snapshots during equipping of a substrate with semiconductor chips that has substrate places arranged in columns.
- FIG. 1 shows a schematic plan view of such a semiconductor mounting apparatus.
- the semiconductor mounting apparatus comprises a rigidly arranged substrate table 1 with a support surface for the substrate 2 , a transport device 3 for transporting the substrate 2 along a predetermined transport direction designated as x direction, a wafer table 4 with the semiconductor chips 5 to be mounted, a die ejector 6 to support detachment of the next semiconductor chip 5 to be mounted from the wafer table 4 , a pick and place device 7 with a bondhead 8 that picks the semiconductor chip presented above the die ejector 6 and places it onto the substrate 2 , and a control device 9 .
- the pick and place device 7 enables movements of the bondhead 8 along two directions running orthogonally to each other designated as x and y.
- the pick and place device 7 contains a first, stationary arranged guide 10 on which a first shuttle 11 bears that is moveable back and forth in x direction.
- the first shuttle 11 contains a second guide 12 on which a second shuttle 13 bears that is moveable back and forth in y direction.
- the bondhead 8 is located on the second shuttle 13 .
- Each of the two shuttles 11 and 13 is driven by a drive 14 and 15 .
- the two shuttles 11 and 13 therefore enable movements of the bondhead 8 in x and y direction.
- the die ejector 6 bears on a third guide 16 and is moveable in x direction, ie, parallel to the transport direction of the substrate 2 , by means of a further drive 17 . From a middle position designated as x 0 , the first shuttle 11 as well as the die ejector 6 can be moved back and forth in x direction within a predetermined working area [x 0 -d, x+d]. The distance d amounts for example to 40 millimetres.
- the transport device 3 comprises for example a guide 18 for guiding at least one moveable clamp 19 . The transport device 3 transports the substrates 2 one after the other to the bonding location where the pick and place device 7 deposits each semiconductor chip onto a respective substrate place.
- the four guides 10 , 12 , 16 and 18 are presented symbolically with arrows that illustrate the moving area of the shuttles 11 and 13 , the die ejector 6 as well as the clamp 19 .
- the semiconductor chips 5 adhere to a foil 20 clamped in a frame (known in the trade as blue tape).
- the wafer table 4 accommodates the frame. With the semiconductor mounting apparatus in accordance with prior art, the die ejector 6 is arranged stationary.
- the wafer table 4 is moveable parallel and orthogonal to the transport direction of the substrate 2 , ie, in x direction and in y direction, so that one semiconductor chip 5 after the other can be positioned above the die ejector 6 from where it can be picked by the bondhead 8 and mounted on the presented substrate 2 .
- the movement area D W of the wafer table 4 in x direction therefore amounts to P+d 0 , whereby P designates the diameter of the largest wafer for acceptance of which the wafer table 4 is designed or specified.
- the control device 9 is arranged to synchronously move the pick and place device 7 and the die ejector 6 parallel to the transport direction of the substrate 2 so that substrates with which at least two substrate places for accepting semiconductor chips are arranged next to each other in a column can be equipped column by column with semiconductor chips without the bondhead 8 having to be moved parallel to the transport direction of the substrate 2 except for comparatively small correction movements.
- the position of the semiconductor chip presented above the die ejector 6 and the position of the substrate place are measured with appropriate cameras and converted into motion signals for the pick and place device.
- FIGS. 2 to 4 give a representative illustration of such a method for mounting semiconductor chips onto a substrate with which four substrate places 21 for accepting semiconductor chips are arranged next to each other in a column and with which three successive columns 22 , 23 and 24 form a block 25 .
- Equipping of the substrate places of such a block 25 takes place in accordance with the following process steps:
- Steps a and b are repeated until all substrate places 21 of the first column 22 are equipped.
- the middle column 23 is then equipped with semiconductor chips. Therefore, to equip the second, middle column 23 ,
- Steps a and b are repeated until all substrate places 21 of the middle column 23 are equipped.
- the third column 24 is then equipped with semiconductor chips. Therefore, to equip the third column 24 ,
- Steps a and b are repeated until all substrate places 21 of the third column 24 are equipped.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises:
-
- Forward feeding the substrate along a transport direction designated as x direction,
- Equipping a predetermined number of columns with semiconductor chips in accordance with the steps:
- Moving the pick and place device to an x position corresponding to the column to be equipped,
- Moving the die ejector to this x position, and
- Equipping the substrate places of the column.
Description
- The present application is a divisional of U.S. patent application Ser. No. 11/173,396, filed Jul. 1, 2005, which claims priority under 35 U.S.C § 119 based upon European Patent Application No. 04103158.4 filed on Jul. 2, 2004.
- The invention concerns a method and an apparatus for mounting semiconductor chips onto a substrate.
- Different types of automatic assembly machines are known for mounting semiconductor chips onto a substrate. At one end of the spectrum one finds the so-called Die Bonders that are used in order to mount semiconductor chips onto a substrate at high speed and with great accuracy. Such Die Bonders are known for example from the patent U.S. Pat. No. 6,185,815, and the patent publications EP 991 11 0, US 2005-0011067 and US 2004-0246794. The semiconductor chips are presented on a wafer table. The substrates to be equipped are supplied one after the other in cycles whereby one substrate at a time is fixed to a substrate table and presented for equipping with semiconductor chips. Mounting of the semiconductor chips is done by means of a bondhead driven by a pick and place device. Die Bonders marketed by the applicant contain a pick and place device with a first fast axis that enables the transport of the semiconductor chips from the wafer table to the substrate at high speed and with a second axis running orthogonally to the first axis that allows shifting of the semiconductor chip in the range of several tens of micrometers so that any deviation of the actual position from the set position can be corrected. This concept enables a simple and favourable method of construction however limits the Die Bonder to the effect that each time only one specific semiconductor chip can be mounted onto the substrate. At the other end of the spectrum one finds so-called automatic placement machines that have two fast axes running orthogonally to each other that cover a large working area. The advantage of this concept is that several different types of semiconductors as well as other components can be mounted one after the other onto the same substrate. The disadvantage is that the assembly time is much greater than with a Die Bonder.
- With the Die Bonder, the substrates are pushed forward in cycles by a transport device and, with substrates having several substrate places lying next to each other in columns, are processed column by column. The substrate is only pushed forward when a column is fully equipped with semiconductor chips. There are also applications with which several columns are combined into a block. Because the forward feed with the transport device during equipping of a block for various reasons is often undesired, Die Bonders have been developed with which the substrate table can be shifted in transport direction together with the substrate fixed to the substrate table so that the columns of a block can be equipped without having to release the fixing of the substrate to the substrate table.
- From U.S. Pat. No. 6,519,840 a semiconductor mounting apparatus is known with which the position of the semiconductor chip presented on the wafer table is measured by a camera before it is picked and a correction of any positional deviation of the semiconductor chip from its set position is done in that the foil is held by the die ejector by means of vacuum and then at least the upper surface of the die ejector facing towards the foil is shifted in the plane running parallel to the underside of the foil. The movement range of this die ejector is comparatively small, as it only has to enable small correction movements.
- From U.S. Pat. No. 6,149,047 a semiconductor mounting apparatus is known with which the wafer table, the pick and place device and the die ejector can be moved in two horizontal directions so that the semiconductor mounting apparatus has room in the smallest possible space despite the increasing size of the wafers. The disadvantage is the distinct slowing down of the assembly process.
- The object of the invention is to improve a Die Bonder in such a way that several adjacent columns of substrate places can be processed without the substrate having to be pushed forward after processing each column and without the substrate table having to be moveable in transport direction.
- The invention is based on the knowledge that in principle it is possible to build a pick and place device with two fast axes with which both axes cover a working area of several centimetres but that such a construction becomes very complex when both axes have to be moved for the equipping of each semiconductor chip. On the one hand, the invention therefore proposes to equip the pick and place device with an axis running parallel to the transport direction of the substrate that covers a working area of several centimetres and, on the other hand, also equipping the die ejector that supports the detachment of the semiconductor chips from the foil with a motorised axis running parallel to the transport direction of the substrate that covers the same working area. Once a column has been completely equipped with semiconductor chips and the next column is to be equipped with semiconductor chips, this construction enables moving both the pick and place device as well as the die ejector parallel to the transport direction of the substrate so that several columns can be equipped without having to move the substrate and that during equipping of the substrate places that belong to the same column the bondhead only has to carry out possible correction movements in the transport direction of the substrate that are small in comparison with the distance between adjacent columns so that a permanent back and forth movement of the bondhead over comparatively large distances parallel to the transport direction of the substrate is omitted.
- With this solution, the invention accepts an enlargement of the semiconductor mounting apparatus as the pick and place device has a two-dimensional working area. The movement range of the wafer table in the transport direction of the substrate has to be enlarged by the working area of the die ejector in order that the semiconductor chips situated at the edge of the wafer can also be positioned above the die ejector in every possible position of the die ejector and picked up by the bondhead of the pick and place device.
- The invention therefore concerns a method for mounting semiconductor chips onto a substrate having at least two substrate places for accepting semiconductor chips arranged next to each other in a column, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it on the substrate place to be equipped. The method is characterised by the following steps:
- Forward feeding the substrate along a transport direction designated as x direction,
- Equipping a predetermined number of columns with semiconductor chips in accordance with the steps:
- Moving the pick and place device in the transport direction to an x position corresponding to the column to be equipped,
- Moving the die ejector to this x position,
- Equipping the substrate places of the column with semiconductor chips in that
- a) the wafer table is moved in order to present the next semiconductor chip above the die ejector, and
- b) the pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate place to be equipped,
- whereby steps a and b are repeated until all substrate places of the column are equipped.
- An apparatus for mounting semiconductor chips suitable for executing this method comprises a rigidly arranged substrate table with a support surface for supporting a substrate, a transport device for transporting the substrate along a predetermined transport direction, a wafer table for presenting a semiconductor chip, a die ejector for supporting detachment of the semiconductor chip from the wafer table and a pick and place device with a bondhead for picking the semiconductor chip presented above the die ejector and placing the picked semiconductor chip onto the substrate. The die ejector is moveable by a predetermined distance d0 parallel to the transport direction of the substrate by means of a drive and the wafer table is moveable by a predetermined distance DW=P+d0 parallel to the transport direction, whereby the quantity P designates the diameter of the largest wafer for the accommodation of which the wafer table (and the apparatus) are designed.
- The accompanying drawings, which are incorporated into and constitute a part of this specification, illustrate one or more embodiments of the present invention and, together with the detailed description, serve to explain the principles and implementations of the invention. The figures are not to scale. In the drawings:
-
FIG. 1 shows a schematic plan view of a semiconductor mounting apparatus, -
FIG. 2-4 show different snapshots during equipping of a substrate with semiconductor chips that has substrate places arranged in columns. - The invention concerns a semiconductor mounting apparatus that is known in the trade as a Die Bonder.
FIG. 1 shows a schematic plan view of such a semiconductor mounting apparatus. The semiconductor mounting apparatus comprises a rigidly arranged substrate table 1 with a support surface for thesubstrate 2, atransport device 3 for transporting thesubstrate 2 along a predetermined transport direction designated as x direction, a wafer table 4 with thesemiconductor chips 5 to be mounted, adie ejector 6 to support detachment of thenext semiconductor chip 5 to be mounted from the wafer table 4, a pick andplace device 7 with abondhead 8 that picks the semiconductor chip presented above thedie ejector 6 and places it onto thesubstrate 2, and acontrol device 9. The pick andplace device 7 enables movements of thebondhead 8 along two directions running orthogonally to each other designated as x and y. The pick andplace device 7 contains a first, stationary arrangedguide 10 on which afirst shuttle 11 bears that is moveable back and forth in x direction. Thefirst shuttle 11 contains asecond guide 12 on which asecond shuttle 13 bears that is moveable back and forth in y direction. Thebondhead 8 is located on thesecond shuttle 13. Each of the twoshuttles drive shuttles bondhead 8 in x and y direction. The dieejector 6 bears on athird guide 16 and is moveable in x direction, ie, parallel to the transport direction of thesubstrate 2, by means of afurther drive 17. From a middle position designated as x0, thefirst shuttle 11 as well as thedie ejector 6 can be moved back and forth in x direction within a predetermined working area [x0-d, x+d]. The distance d amounts for example to 40 millimetres. Thetransport device 3 comprises for example aguide 18 for guiding at least onemoveable clamp 19. Thetransport device 3 transports thesubstrates 2 one after the other to the bonding location where the pick andplace device 7 deposits each semiconductor chip onto a respective substrate place. In the figure, the four guides 10, 12, 16 and 18 are presented symbolically with arrows that illustrate the moving area of theshuttles die ejector 6 as well as theclamp 19. - The semiconductor chips 5 adhere to a
foil 20 clamped in a frame (known in the trade as blue tape). The wafer table 4 accommodates the frame. With the semiconductor mounting apparatus in accordance with prior art, thedie ejector 6 is arranged stationary. The wafer table 4 is moveable parallel and orthogonal to the transport direction of thesubstrate 2, ie, in x direction and in y direction, so that onesemiconductor chip 5 after the other can be positioned above thedie ejector 6 from where it can be picked by thebondhead 8 and mounted on the presentedsubstrate 2. The movement range Dw of the wafer table 4 in x direction has to be enlarged by the distance d0=2d whereby the distance d, as given above, characterises the working area [x0-d, x0+d] of thedie ejector 6, so that, in every possible x position of thedie ejector 6, thesemiconductor chips 5 situated at the edge of the wafer can also be positioned above thedie ejector 6 and picked up by thebondhead 8 of the pick andplace device 7. The movement area DW of the wafer table 4 in x direction therefore amounts to P+d0, whereby P designates the diameter of the largest wafer for acceptance of which the wafer table 4 is designed or specified. - The
control device 9 is arranged to synchronously move the pick andplace device 7 and thedie ejector 6 parallel to the transport direction of thesubstrate 2 so that substrates with which at least two substrate places for accepting semiconductor chips are arranged next to each other in a column can be equipped column by column with semiconductor chips without thebondhead 8 having to be moved parallel to the transport direction of thesubstrate 2 except for comparatively small correction movements. - In order that the
semiconductor chips 5 can be placed with great positional accuracy onto the substrate places, the position of the semiconductor chip presented above thedie ejector 6 and the position of the substrate place are measured with appropriate cameras and converted into motion signals for the pick and place device. -
FIGS. 2 to 4 give a representative illustration of such a method for mounting semiconductor chips onto a substrate with which foursubstrate places 21 for accepting semiconductor chips are arranged next to each other in a column and with which threesuccessive columns block 25. Equipping of the substrate places of such ablock 25 takes place in accordance with the following process steps: -
- The
substrate 2 is pushed forward in x direction by thetransport device 3 until themiddle column 23 assumes the x position x0. The x position of thefirst column 22 is designated as x1, the x position of thethird column 24 is designated as x2. The positions x1 and x2 result from the position x0 corresponding to the distance D between two adjacent columns of theblock 25. - The pick and
place device 7 is brought into the x position x1 in which its y axis is centred above thefirst column 22. - The
die ejector 6 is also brought into the x position x1.
This condition is presented inFIG. 2 . - The substrate places 21 of the
first column 22 are equipped one after the other in that - a) the wafer table 4 is moved in order to present the
next semiconductor chip 5 above thedie ejector 6, and- b) the pick and
place device 7 picks thesemiconductor chip 5 presented above thedie ejector 6 and deposits it onto thesubstrate place 21 to be equipped. With this process, the bondhead 8 (FIG. 1 ) of the pick andplace device 7 covers a comparatively large distance in y direction. However, in x direction thebondhead 8 only carries out a comparatively small correction movement Δx in order to eliminate any wrong positioning of the semiconductor chip. “Small” correction movement means that Ax is very small in comparison with the distance D between adjacent columns.
- b) the pick and
- The
- Steps a and b are repeated until all substrate places 21 of the
first column 22 are equipped. - The
middle column 23 is then equipped with semiconductor chips. Therefore, to equip the second,middle column 23, -
- the pick and
place device 7 is brought into the x position x0 in which its y axis is centred above themiddle column 23. - The
die ejector 6 is brought into the x position x0.
This condition is presented inFIG. 3 . - The substrate places 21 of the
middle column 23 are now equipped one after the other in that a) the wafer table 4 is moved in order to present thenext semiconductor chip 5 above thedie ejector 6, and - b) the pick and
place device 7 picks thesemiconductor chip 5 presented above thedie ejector 6 and deposits it onto the substrate place to be equipped, whereby thebondhead 8 only carries out a comparatively small correction movement in x direction.
- the pick and
- Steps a and b are repeated until all substrate places 21 of the
middle column 23 are equipped. - The
third column 24 is then equipped with semiconductor chips. Therefore, to equip thethird column 24, -
- the pick and
place device 7 is brought into the x position x2 in which its y axis is centred above thethird column 24. - The
die ejector 6 is brought into the x position x2.
This condition is presented inFIG. 4 . - The substrate places 21 of the
third column 24 are now equipped one after the other in that- a) the wafer table 4 is moved in order to present the
next semiconductor chip 5 above thedie ejector 6, and - b) the pick and
place device 7 picks thesemiconductor chip 5 presented above thedie ejector 6 and deposits it onto the substrate place to be equipped, whereby thebondhead 8 only carries out a comparatively small correction movement in x direction.
- a) the wafer table 4 is moved in order to present the
- the pick and
- Steps a and b are repeated until all substrate places 21 of the
third column 24 are equipped. - All three
columns same block 25 are now equipped. To equip the next block, thesubstrate 2 is now pushed forward correspondingly by thetransport device 3 until the middle column of the next block assumes the position x0. The three columns are then equipped withsemiconductor chips 5 as described above. - While embodiments and applications of this invention have been shown and described, it would be apparent to those skilled in the art having the benefit of this disclosure that many more modifications than mentioned above are possible without departing from the inventive concepts herein. The invention, therefore, is not to be restricted except in the spirit of the appended claims and their equivalents.
Claims (1)
1. An apparatus for mounting semiconductor chips onto a substrate, the apparatus comprising
a rigidly arranged substrate table with a support surface for supporting a substrate,
a transport device for transporting the substrate along a predetermined transport direction,
a wafer table for presenting a semiconductor chip,
a die ejector for supporting detachment of the semiconductor chip from the wafer table,
a Pick and Place device with a bondhead for picking the semiconductor chip presented above the die ejector and placing the picked semiconductor chip onto the substrate, wherein the die ejector is moveable by a predetermined distance d0 parallel to the transport direction of the substrate by means of a drive and wherein the wafer table is moveable by a predetermined distance DW=P+d0 parallel to the transport direction, whereby P designates a diameter of a largest wafer for the accommodation of which the wafer table is designed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/193,658 US20080301931A1 (en) | 2004-07-02 | 2008-08-18 | Method And Apparatus For Mounting Semiconductor Chips |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04103158.4 | 2004-07-02 | ||
EP04103158A EP1612843A1 (en) | 2004-07-02 | 2004-07-02 | Method and apparatus for mounting semiconductors |
US11/173,396 US7415759B2 (en) | 2004-07-02 | 2005-07-01 | Method and apparatus for mounting semiconductor chips |
US12/193,658 US20080301931A1 (en) | 2004-07-02 | 2008-08-18 | Method And Apparatus For Mounting Semiconductor Chips |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/173,396 Division US7415759B2 (en) | 2004-07-02 | 2005-07-01 | Method and apparatus for mounting semiconductor chips |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080301931A1 true US20080301931A1 (en) | 2008-12-11 |
Family
ID=34929289
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/173,396 Expired - Fee Related US7415759B2 (en) | 2004-07-02 | 2005-07-01 | Method and apparatus for mounting semiconductor chips |
US12/193,658 Abandoned US20080301931A1 (en) | 2004-07-02 | 2008-08-18 | Method And Apparatus For Mounting Semiconductor Chips |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/173,396 Expired - Fee Related US7415759B2 (en) | 2004-07-02 | 2005-07-01 | Method and apparatus for mounting semiconductor chips |
Country Status (7)
Country | Link |
---|---|
US (2) | US7415759B2 (en) |
EP (1) | EP1612843A1 (en) |
KR (1) | KR20060049659A (en) |
CN (1) | CN100449718C (en) |
CH (1) | CH695199A5 (en) |
DE (1) | DE102005029136B4 (en) |
TW (1) | TWI287841B (en) |
Cited By (1)
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US20120056228A1 (en) * | 2010-09-07 | 2012-03-08 | Phostek, Inc. | Led chip modules, method for packaging the led chip modules, and moving fixture thereof |
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CN101379896B (en) * | 2006-02-09 | 2011-11-23 | 松下电器产业株式会社 | Method for determining pickup order of component |
KR20080022483A (en) * | 2006-09-06 | 2008-03-11 | 한미반도체 주식회사 | Flip over picker of pick and place system for semiconductor production |
US8702649B2 (en) * | 2006-11-28 | 2014-04-22 | Bayer Medical Care Inc. | Multiple lumen diffusion catheter |
WO2009047214A2 (en) * | 2007-10-09 | 2009-04-16 | Oerlikon Assembly Equipment Ag, Steinhausen | Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate |
CH698334B1 (en) | 2007-10-09 | 2011-07-29 | Esec Ag | A process for the removal and installation of a wafer table provided on the semiconductor chip on a substrate. |
CN103596786B (en) | 2011-05-30 | 2016-05-25 | 麦格纳覆盖件有限公司 | Car door and door module |
JP5936847B2 (en) * | 2011-11-18 | 2016-06-22 | 富士機械製造株式会社 | Wafer-related data management method and wafer-related data creation apparatus |
CN103801787B (en) * | 2014-02-28 | 2016-05-25 | 成都先进功率半导体股份有限公司 | A kind of Soldering lug machine device and weld tabs method thereof |
DE102014117026B3 (en) * | 2014-11-20 | 2015-12-03 | Strothmann Machines & Handling GmbH | transfer device |
US10290118B2 (en) * | 2015-08-06 | 2019-05-14 | Cognex Corporation | System and method for tying together machine vision coordinate spaces in a guided assembly environment |
JP6584234B2 (en) * | 2015-08-31 | 2019-10-02 | ファスフォードテクノロジ株式会社 | Die bonder, bonding method and semiconductor device manufacturing method |
DE102016123362B3 (en) * | 2016-12-02 | 2018-03-08 | Asm Assembly Systems Gmbh & Co. Kg | Picking machine with a displacement device for moving a receiving device for a carrier with Bestückmedium and a method for loading |
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- 2005-06-29 CN CNB2005100823014A patent/CN100449718C/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
CN1725461A (en) | 2006-01-25 |
US7415759B2 (en) | 2008-08-26 |
DE102005029136B4 (en) | 2008-03-27 |
KR20060049659A (en) | 2006-05-19 |
DE102005029136A1 (en) | 2006-01-26 |
US20060000082A1 (en) | 2006-01-05 |
CH695199A5 (en) | 2006-01-13 |
TW200612502A (en) | 2006-04-16 |
CN100449718C (en) | 2009-01-07 |
TWI287841B (en) | 2007-10-01 |
EP1612843A1 (en) | 2006-01-04 |
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