TW201740476A - Electronic component mounting device and mounting method, and method for manufacturing package component - Google Patents

Abstract

This mounting device (1) is provided with: a stage unit (20) for moving a stage (21) on which a support substrate (W) is placed so that a plurality of mounting regions of the support substrate (W) are positioned in sequence in fixed mounting positions; a mounting unit (50) for individually moving, to a mounting position, a first and second mounting head for respectively holding and mounting an electronic component in a mounting region; a first recognition unit (22) for recognizing the overall position of the support substrate (W) on the stage (21); and a second recognition unit for recognizing the position of the electronic component held in the first or second mounting head, the movement of the stage (21) and the first and second mounting heads being controlled on the basis of the correction data for the moving position error of the stage (21) caused by the movement mechanism, the support substrate (W) position data, and the electronic component position data.

Description

Mounting device and mounting method for electronic parts, and manufacturing method of package parts

Embodiments of the present invention relate to an electronic component mounting device, a mounting method, and a method of manufacturing a package component.

From the prior art, a manufacturing process of a semiconductor package using a general interposer (relay substrate) such as a CSP (Chip Size Package) or a BGA (Ball Grid Array) is known. In addition, a manufacturing process called Wafer Level Package (WLP), in which the interposer is not used and is not divided into wafers of the respective semiconductor wafers, is used. I know. Since the WLP does not use an interposer substrate, it has the advantage of being able to achieve a thinner semiconductor package and a reduction in manufacturing cost.

In the WLP, a so-called fan-in wafer level package in which a rewiring layer including I/O terminals of a semiconductor package is formed on a semiconductor wafer without exceeding a region of the semiconductor wafer on which the electrode pads are formed ( Fan in-WLP: FI-WLP) is well known. Moreover, in recent years, there has been proposed a so-called fan-out wafer level package (fan out-) that extends beyond the area of the semiconductor wafer to form a rewiring layer including the I/O terminals of the semiconductor package. WLP: FO-WLP). In the case of the FO-WLP, a multi-chip package (Multi Chip Package) in which a plurality of types of electronic components such as a semiconductor chip such as a RAM, a flash memory, and a CPU, or a diode or a capacitor are mounted in one package is used. :MCP) is applicable, so it is attracting attention.

Here, the MCP is generally mounted as a plurality of types of electronic components in one package. In such an MCP, the offset of the individual mounting positions of the electronic components mounted in the same package affects the electrical characteristics of the package, and therefore, the mounting of each electronic component is required. High position accuracy. In the manufacturing process of the semiconductor package using the interposer substrate described above, since the alignment marks for position identification are provided at the respective mounting areas on the interposer, each of the mounting areas is applied by The manner in which the alignment mark is recognized and the electronic component is positioned in the mounting area and mounted (hereinafter, referred to as the partial identification method) is to achieve installation with high positional accuracy.

In the manufacturing process of the FO-WLP, a plurality of semiconductor wafers are first mounted in a matrix on a support substrate in a spaced apart state, and then the spaces between the semiconductor wafers are sealed by a resin to be plural. The semiconductor wafer is integrated, thereby forming a pseudo wafer that is generally formed as a wafer formed by a semiconductor fabrication process. On this pseudo-wafer, a rewiring layer for setting I/O terminals is formed. After the plurality of semiconductor wafers are resin-sealed and integrated, the support substrate is peeled off and removed. However, I want to make it by FO-WLP. In the case of the MCP, the support substrate is not provided with a pattern that can be used for image recognition as well as position recognition for each of the mounting regions in which the semiconductor wafer is mounted. For example, the general local identification method for the interposer substrate lacks practicality.

In the case where local identification is not possible, it is possible to recognize the entire position of the support substrate by recognizing the alignment mark representing the position of the support substrate or the position of the entire substrate, and to support the entire position of the substrate. A method of mounting a semiconductor wafer on each mounting region on a support substrate (hereinafter referred to as a global identification method). Further, the offset of the mounting position of the semiconductor wafer in the MCP is, for example, a case where a diameter (20 μm) having a standard electrode pad and a semiconductor wafer having a pitch (35 μm) are considered. The contact area between the terminals of the wafer and the terminals formed in the wiring layer and the contact between the adjacent terminals are prevented from being suppressed to ±5 μm or less.

However, an attempt is made to apply a global identification method to a mounting device for mounting a semiconductor wafer with a substrate having a registration mark for each of the mounting regions of the interposer or the like, and to directly use the FO-WLP. After the manufacturing process, the result is an installation error of more than ±5 μm in mounting accuracy, and the semiconductor wafer cannot be mounted with good precision at each of the mounting areas. Set on the support substrate with the alignment mark. Therefore, in the manufacturing process of the FO-WLP to which the global identification method is applied, there is no such that it can be ±5 μm. The following positional accuracy is used to mount the semiconductor wafer mounting device.

If it is only necessary to improve the mounting accuracy, it is conceivable to preliminarily set the alignment mark corresponding to each mounting area for the support substrate used in the manufacturing process of the FO-WLP, and to apply the partial identification method. However, the support substrate of the FO-WLP is peeled off and removed from the pseudo wafer after forming the pseudo wafer, and is not used as an article. In order to provide such a support substrate with equipment for forming marks and engineering, it is not only an increase in the number of projects, but also in the installation process, it is necessary to identify the local marks each time the semiconductor wafer is mounted. The operation time of one semiconductor wafer is also increased. According to this point, the application of the local identification method increases the manufacturing cost of the semiconductor package and is detrimental to the advantages of the WLP.

Moreover, in order to take measures against the mounting error of the semiconductor wafer, a technique for forming a rewiring layer in consideration of a mounting error of the semiconductor wafer has been proposed. This technique is used to pre-exposure the mounting errors of the semiconductor wafers on the wafer (position offset from the ideal position) before exposure to the circuit pattern of the rewiring layer for the pseudo-wafer. The ground is measured, and when the laser light for exposure is scanned for each of the semiconductor wafers, the position information of each circuit pattern included in the drawing material is corrected based on the mounting error of the semiconductor wafer to be exposed. By. This technique is applicable to a single crystal package in which one semiconductor wafer is incorporated in one semiconductor package. However, in the case of the MCP, the data of the circuit pattern is sealed. The unit is fabricated. Therefore, when the positional displacement between the semiconductor wafers in the same package is generated, it is not possible to correct only by correcting the position information of the drawn circuit pattern. correspond.

Further, it is required for the mounting device used in the manufacturing process of the FO-WLP to shorten the mounting time of the semiconductor wafer. In other words, the formation of the rewiring layer on the wafer is usually performed in batches for one pseudo wafer, whereas the mounting process for the semiconductor wafer supporting the substrate is one. One semiconductor wafer is implemented separately. In consideration of such processing time, it is required to be able to shorten the mounting time of the semiconductor wafer because the mounting process of the semiconductor wafer takes longer than the formation of the rewiring layer. If it is only necessary to shorten the installation time, it is conceivable to apply a mounting device having a plurality of mounting heads. However, if only a plurality of mounting heads are simply applied, the mounting accuracy of the semiconductor wafer is further lowered due to the influence of the movement error generated at each of the mounting heads. In this way, for the mounting device used in the manufacturing process of the FO-WLP, it is required to simultaneously achieve the improvement of the mounting accuracy of the electronic components such as the semiconductor wafer and the shortening of the mounting time.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-041976

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-259917

[Patent Document 3] International Publication No. 2007/072714

[Patent Document 4] Japanese Patent Laid-Open Publication No. 2013-058520

The problem to be solved by the present invention is to provide a support substrate in which a pattern such as a mark for position detection is not formed in each of the mounting regions. A mounting device and mounting method for an electronic component in which an electronic component such as a semiconductor wafer is mounted with good precision and good efficiency, and a manufacturing method of a package component to which the mounting method is applied.

The mounting device for an electronic component according to the embodiment includes a platform portion having a platform on which a support substrate having a plurality of mounting regions for mounting electronic components is mounted, and a plurality of mounting regions are sequentially arranged a platform moving mechanism that moves the platform at a fixed mounting position; and a mounting portion that includes first and second mounting heads that respectively hold the electronic components and are mounted on the mounting area of the support substrate And a mounting head moving mechanism that moves the first and second mounting heads that hold the electronic component to the mounting position; and the first identifying unit is configured to support the support substrate placed on the platform The entire position is identified; and the second identification unit identifies the position of the electronic component held by the first or second mounting head; and the memory unit memorizes the movement of the platform by the platform a correction data for correcting a movement position error of the platform; and a control unit based on the support base identified by the first identification unit The location The data and the positional data of the electronic component identified by the second identification unit and the correction data are used to control movement of the platform and the first and second mounting heads.

The method of mounting an electronic component according to the embodiment includes: obtaining a movement position error of a platform on which a support substrate having a plurality of mounting regions for mounting the electronic component is mounted, and causing the memory portion to memorize the movement position error And a project for modifying the correction data; and the supporting substrate is placed on the platform, and the entire position of the support substrate placed on the platform is recognized; and one side is based on the support substrate Positioning data of the support substrate obtained by the position recognition project and the correction data are used to correct the movement of the platform while the plurality of mounting areas are sequentially positioned at a certain mounting position to move the platform And receiving the electronic component by the first and second mounting heads, and identifying the position of the electronic component held at the first or second mounting head, and based on the identification The position information of the aforementioned electronic component is corrected for the movement of the first and second mounting heads The first and second mounting heads are alternately moved to the mounting position, and the electronic components are alternately mounted to the mounting area sequentially positioned at the mounting position by the first and second mounting heads. Engineering.

The mounting method of the package component of the embodiment includes: a project of mounting the electronic component on each of the plurality of mounting regions at the support substrate having a plurality of mounting regions; and by being mounted on the plural The aforementioned electronic parts at the installation area are densely packed in batches Sealing to form a pseudo-wafer-like project; and fabricating a packaged component by forming a rewiring layer on the aforementioned electronic component of the pseudo-wafer. In the method of manufacturing a packaged component according to the embodiment, the mounting of the electronic component includes: obtaining a movement position error of a platform on which the support substrate is placed, and causing the memory unit to correct the movement position error. Correcting the engineering of the data; and placing the support substrate on the platform and identifying the entire position of the support substrate placed on the platform; and using one side based on the position of the support substrate The position data of the support substrate obtained by the engineering and the correction data are used to correct the movement of the platform, and the plurality of installation areas are sequentially positioned at a certain installation position to move the platform; And receiving the electronic component by the first and second mounting heads, and identifying the position of the electronic component held at the first or second mounting head, and based on the recognized electronic component The positional data of the parts is corrected for the movement of the first and second mounting heads described above. And the second mounting head is alternately moved to the mounting position, and the electronic components are alternately mounted to the aforementioned mounting area at the aforementioned mounting position by the first and second mounting heads described above. .

1‧‧‧Installation device

10‧‧‧Parts Supply Department

11‧‧‧ wafer ring

12‧‧‧ wafer ring holder

13‧‧‧1st camera

20‧‧‧ Platform Department

21‧‧‧ platform

22‧‧‧2nd camera

23‧‧‧4th camera

30‧‧‧Substrate transport department

40, 40A, 40B‧‧‧Transportation Department

43‧‧‧Reversal mechanism

44‧‧‧Adsorption nozzle

47‧‧‧Reverse arm

50, 50A, 50B‧‧‧ Installation Department

51‧‧‧Support box

52‧‧‧X direction moving block

53‧‧‧Y direction mobile device

55‧‧‧Installation head

56‧‧‧Installation tools

60‧‧‧Control Department

61‧‧‧Memory Department

W‧‧‧Support substrate

t‧‧‧Semiconductor wafer

Fig. 1 is a plan view showing the mounting device of the embodiment.

Fig. 2 is a front view showing the mounting device of the embodiment.

Fig. 3 is a right side view showing the mounting device of the embodiment.

FIG. 4 is a plan view showing a part of the mounting apparatus according to the embodiment by a two-dot chain line, and is a view for explaining the loading and unloading state of the support substrate.

Fig. 5 is a front view showing a part of the mounting device of the embodiment omitted, and is a view for explaining the position recognition state of the electronic component.

Fig. 6 is a block diagram showing the mounting device of the embodiment.

Fig. 7A is a plan view showing a wafer ring for supplying a semiconductor wafer to the mounting device of the embodiment.

Fig. 7B is a cross-sectional view of the wafer ring taken along the line X-X of Fig. 7A.

Fig. 8 is a view showing a preparation work for a calibration project of a substrate platform in the mounting device of the embodiment.

Fig. 9 is a view showing a calibration process of a substrate platform in the mounting apparatus of the embodiment.

Fig. 10 is a view for explaining a method of correcting a movement position error of a substrate platform in the mounting apparatus of the embodiment.

Fig. 11 is a view for explaining a method of correcting the positional deviation of the substrate stage in the mounting apparatus of the embodiment.

Fig. 12 is a plan view showing an example of an electronic component mounted in one mounting region using the mounting device of the embodiment.

Fig. 13 is a plan view showing a support substrate on which a semiconductor wafer is mounted using the mounting devices of the first embodiment and the comparative example 1.

Fig. 14 is a flow chart showing the manufacturing process of the packaged component of the embodiment.

Hereinafter, the mounting device and the mounting method of the electronic component according to the embodiment will be described with reference to the drawings. The drawings are for illustrative purposes, and the relationship between the thickness and the plane size, the ratio of the thickness of each part, etc., may be different from the actual one. In the case where the direction of the upper and lower directions in the description is not particularly indicated, the direction of the relative position when the mounting surface of the electronic component of the support substrate described later is set is the direction of the left and right directions. The terminology, when not specifically stated, refers to the direction in which the front view of Figure 2 is used as a reference.

[Composition of mounting device]

1 is a plan view showing a configuration of an electronic component mounting device according to an embodiment, and FIG. 2 is a front view of the mounting device shown in FIG. 1, and FIG. 3 is a view of FIG. The right side view of the mounting device is shown. In FIG. 1 and FIG. 2, it is disposed on the left and right of the mounting device 1. The transfer portions 40A and 40B at the same position and the mounting portions 50A and 50B disposed at the left and right are similarly displayed on the left side transfer portion 40A and the mounting portion 50A by a two-dot chain line, and the right side is shifted. The carrier portion 40B and the mounting portion 50B are shown in solid lines. 4 is a view showing a state in which the mounting portions 50A and 50B on the left and right sides are displayed as a two-dot chain line in the same plan view as that of FIG. 1, and the loading and unloading state of the support substrate W is described. Fig. 5 is a view similar to Fig. 2, in which the illustration of the transfer portion 40A on the left side and the attachment portion 50A is omitted, and the state of the recognition camera is explained. Fig. 6 is a block diagram showing the configuration of the mounting device by the embodiment. 7A and 7B are diagrams showing a wafer ring for supplying a semiconductor wafer as an electronic component. In the meantime, the left-right direction is the X direction with respect to the mounting device 1, and the front-rear direction is the Y direction, and the vertical direction is the Z direction.

The mounting device 1 shown in FIGS. 1 to 6 includes a component supply unit 10 that supplies electronic components such as a semiconductor wafer t, a platform portion 20 including a stage 21 on which the support substrate W is placed, and a platform. 21, the substrate transfer unit 30 for loading and unloading the support substrate W, and the transfer unit 40 for taking out one of the semiconductor wafers t from the component supply unit 10, and the semiconductor wafer taken out by the pair of transfer units 40 And a pair of mounting portions 50 mounted on the support substrate W placed on the stage 21, and a control unit 60 for controlling the operation of each unit.

The component supply unit 10 includes a wafer ring 11 (FIGS. 7A and 7B) for holding a resin sheet S on which a semiconductor wafer T of a semiconductor wafer t is diced, and a wafer ring 11 Free loading and unloading The wafer ring holder 12 that can be moved in the XY direction by an XY moving mechanism (not shown) and the first camera 13 that images the semiconductor wafer t that is attached to the wafer ring 11 And an upper protrusion mechanism (not shown) that protrudes from the lower side of the wafer ring 11 when the semiconductor wafer t is taken out by the transfer unit 40.

The upper protruding mechanism is fixedly disposed at the take-out position of the semiconductor wafer t caused by the transfer portion 40. Each of the semiconductor wafers t on the wafer ring 11 is sequentially positioned at the take-out position by the wafer ring holder 12. The first camera 13 is disposed directly above the take-out position and is used to recognize the position of the wafer for imaging the semiconductor wafer t positioned at the take-out position.

The component supply unit 10 further includes an exchange device including a wafer ring 11 (not shown). The exchange device is provided with a housing portion (a groove portion for accommodating the wafer ring 11 in a vertical direction, which is also called a magazine), and a wafer ring provided on the front surface side of the mounting device 1 Transport department. In the switching device, the unused wafer ring 11 is supplied to the wafer ring holder 12, and the wafer ring 11 from which the semiconductor wafer is taken out is accommodated in the housing portion, and a new wafer ring is supplied thereto. The wafer ring holder 12 is located.

The electronic component mounted on the support substrate is not limited to one type of semiconductor wafer t, and may be a plurality of types of semiconductor wafers, and may be a semiconductor wafer, a diode, a capacitor, or the like. In the mounting device 1 of the embodiment, a plurality of types of electronic components including a semiconductor wafer, a diode, a capacitor, and the like are mounted on a support substrate W and manufactured. In the case of MCP, it can be used as appropriate. Examples of the configuration of the MCP include those having a plurality of types of semiconductor wafers, one type of semiconductor wafer, a diode, a capacitor, and the like, and a plurality of types of semiconductor wafers, diodes, and capacitors. And so on.

The component supply unit 10 is not limited to the wafer supply mechanism using the wafer ring 11 to which the sliced semiconductor wafer T is attached. At the component supply unit 10, for example, a wafer supply mechanism using a tape feeder or a tray can be applied. The tape feeder is a semiconductor housed in each pocket of a carrier tape (also referred to as an embossed carrier tape) in which a concave (embossed) pocket is continuously formed on a strip-shaped resin sheet. The wafers t are supplied one by one as suppliers. The carrier tape is housed in a state in which a pocket in which the semiconductor wafer t is housed is covered by a cover tape and wound up on a reel. Further, the carrier tape is sent out from the reel and the cover tape is peeled off while the pockets are sequentially positioned at the take-out position of the semiconductor wafer t.

In the case of using such a tape feeder, it is possible to alternately pick up the semiconductor wafer t by the left and right transfer portions 40A and 40B from one tape feeder, or to Two belt feeders are arranged side by side, and the semiconductor wafer t is picked up from the belt feeder on the left side by the transfer portion 40A on the left side, and is taken from the right side by the transfer portion 401B on the right side. The semiconductor wafer t is picked up by the feeder. Further, it is also possible to configure a tape feeder that accommodates semiconductor wafers t of different types into a plurality of types of equipment, and to selectively supply a plurality of types of semiconductor wafers t. This kind of composition, for one branch It is effective when a plurality of types of semiconductor wafers t are mounted while holding the substrate W.

Further, both the supply of the semiconductor wafer t by the wafer ring 11 and the supply of the semiconductor wafer t by the tape feeder may be provided. Specifically, a belt feeder for the transfer unit 40A on the left side is disposed on the left side of the wafer ring holder 12, and a belt feeder for the transfer unit 40B on the right side is disposed on the right side. When the XY moving device is provided in each of the transfer portions 40A and 40B, the transfer nozzles of the transfer portions 40A and 40B can be moved to the take-out position and the tape take-out position of the semiconductor wafer t from the wafer ring 11. It is preferable that the feeder takes out the removal position of the semiconductor wafer.

The platform unit 20 includes a stage 21 on which a support substrate W having a plurality of mounting areas is placed, and an XY moving mechanism (not shown) that moves the stage 21 in the XY direction. The XY moving mechanism moves the stage 21 such that each mounting area of the support substrate W placed on the stage 21 is sequentially positioned at a predetermined mounting position as described later in detail. The stage 21 is configured to be capable of holding and holding the supported support substrate W by a suction suction mechanism (not shown). Above the stage 21, a second camera 22 for imaging the support substrate W is disposed. The second camera 22 is, for example, a person who images the entire mark provided on the support substrate W and recognizes the entire position of the support substrate W, and functions as the first identification unit. The entire position of the support substrate W may be configured to be imaged and recognized by the second camera 22 in addition to the support substrate W.

The support substrate W placed on the stage 21 is, for example, a substrate for forming a wafer to be used in the manufacture of the FO-WLP, and is formed of a metal substrate such as a glass substrate, a germanium substrate, or a stainless steel. . The pseudo-wafer is a flat state in which electronic components such as a plurality of semiconductor wafers to be sliced are planarly arranged, and the electronic components are sealed by resin and formed into a single plate shape. Things. Therefore, the shape of the support substrate W used in the formation of the pseudo-wafer is not limited to a circular shape, but may be a square shape or a polygonal shape other than the polygonal shape, an elliptical shape, or the like, and the shape thereof is not particularly limited. Limited. The support substrate W is preferably a substrate used when the MCP is manufactured in the FO-WLP process as described above, that is, a plurality of semiconductor wafers and capacitors are mounted at each mounting region. A substrate for electronic parts.

The support substrate W is provided with a plurality of mounting regions in which electronic components such as semiconductor wafers t are mounted. However, the plurality of mounting regions are imaginarily set on the support substrate W, and marks or patterns representing the respective mounting regions are not formed. The support substrate W may have a alignment mark for global identification that represents the position of the entire substrate. However, the alignment mark for local identification of the position of each of the mounting regions is not provided. The global identification method refers to a method of mounting electronic components on a plurality of mounting areas on the substrate by detecting the position of the substrate once when the electronic components are mounted in a plurality of mounting areas of the supporting substrate. The so-called local identification method means that when the electronic components are separately mounted at a plurality of mounting areas of the supporting substrate, the mounting area of the electronic components is performed once and for all when the electronic components are mounted. The way the position is detected.

The substrate transport unit 30 includes a carry-in conveyor 31 and a carry-out conveyor 32, and a first delivery unit 33 that carries the support substrate W between the transport conveyor 31 and the platform 21, and the platform 21 and the carry-out The second delivery unit 34 that supports the delivery of the support substrate W between the conveyor belts 32 and the arrangement position from the placement position of the transport conveyance belt 31 to the position where the transport conveyance belt 32 is carried out is set and the first and second delivery are performed. The portions 33, 34 are movably supported as guides 35. Each of the first and second delivery units 33 and 34 is configured to be movable along the guide unit 35 by a timing belt (none of which is shown) driven by a rotary motor. However, the driving of the delivery units 33 and 34 is not limited to the timing belt, but may be implemented by another driving device such as a linear motor.

The first and second delivery units 33 and 34 have the same configuration, and include movable portions 33a and 34a that move along the guide portion 35, and are movable up and down at the movable portions 33a and 34a. The horizontal arms 33b and 34b are provided, and four adsorption nozzles 33c and 34c are provided at the horizontal arms 33b and 34b so as to attract and hold the support substrate W from the upper side. The adsorption nozzles 33c and 34c are fixed to the horizontal arms 33b and 34b so as to be capable of adsorbing the vacant portion of the outer edge portion of the support substrate W to which the semiconductor wafer t is not attached.

In the pair of transfer units 40, the two transfer units 40A and 40B are arranged in a left-right reversed state, and the two transfer units 40A and 40B are not limited to each other. , in order to have the same composition. Referring to Figure 1, Figure 2 and Figure 3, for the transfer part on the right side The composition of 40B is explained. The transfer unit 40B includes an elevating device 41, an arm body 42 supported by the elevating device 41 so as to be movable up and down, and an inverting mechanism 43 provided at an end portion of the arm body 42 and The adsorption nozzle (transfer nozzle) 44 is provided at the reversing mechanism 43. The lifting device 41 is provided with a rotary motor 45, and the arm body 42 is moved up and down by a ball screw mechanism (not shown).

The reversing mechanism 43 is fixed to the side surface of the front side of the apparatus at the front end of the arm body 42, and is provided with a rotation driving unit 46 that is provided to allow the rotating shaft extending in the Y direction to pass through the arm body 42. And an inversion arm 47 coupled to the rotating shaft of the driving portion 46. The reverse arm 47 is formed such that the trajectory of the circular arc is drawn on the upper side between the horizontal state in which the front end portion faces the left direction of the device and the horizontal state in the right direction, and is reversed by 180 degrees. The adsorption nozzle 44 is attached to the reverse arm 47 so that the adsorption surface for vacuum-adsorbing the semiconductor wafer t faces downward in a state where the reverse arm 47 is horizontally oriented in the left direction. The transfer unit 40A on the left side has the same configuration except that the arrangement of the respective units is reversed left and right.

The left and right transfer portions 40A and 40B are arranged such that the adsorption surface of the adsorption nozzle 44 is positioned in the upper protrusion mechanism when the reverse rotation arm 47 is rotated so that the adsorption surface of the adsorption nozzle 44 faces downward. The general positional relationship at the top (removal position). Therefore, if the adsorption nozzles 44 of the two transfer portions 40A and 40B are simultaneously placed at the take-out position, the adsorption nozzles 44 (the reverse arms 47) collide with each other. Therefore, the adsorption nozzle 44 will be used for adsorption. The state in which the face is facing upward is reversed as a standby state, and is controlled in such a manner that it moves from the standby state to the take-out position interactively.

In the same manner as the pair of transfer portions 40, the pair of attachment portions 50 are arranged such that the attachment portions 50A and 50B having the same configuration are reversed left and right. The configuration of the attachment portion 50B on the right side will be described with reference to Figs. 1, 2, and 3. The mounting portion 50B is provided with a support frame 51 having a gate shape when viewed from the side, and an X-direction moving block 52 supported by the support frame 51 so as to be movable in the X direction, and is disposed at the X. The Y-direction moving means 53 at the side of the left side of the direction moving block 52, and the movable body 54 which is disposed in the Y-direction moving means 53 so as to be movable in the Y direction, and the movable body 54 are movable toward the upper and lower sides A mounting head 55 that is disposed in a direction to move. At the lower end of the mounting head 55, a mounting tool 56 is provided, which is provided with a holding surface of the semiconductor wafer t below. The mounting tool 56 is configured to be interchangeable in accordance with the type (especially size) of the semiconductor wafer t. The mounting portion 50B may be provided with an automatic exchanger having an attachment tool 56.

In the frame material of the mounting portion 50, a metal material such as aluminum is generally used. However, there is a possibility that an offset occurs in the moving position of the mounting head 55 due to thermal expansion of aluminum or the like due to heat generation of the driving portion. In order to reduce such a positional displacement caused by thermal expansion as much as possible, it is preferable to use a composite material between a metal material such as aluminum and a ceramic. Specifically, it is desirable to move the block in the X direction. The body of the 52 and Y-direction moving device 53 is constituted by a composite material between aluminum and ceramics or the like. As a composite material between aluminum and ceramics, for example, a composite material between aluminum and tantalum carbide (SiC) can be cited. If such a composite material is used, for example, the coefficient of thermal expansion can be reduced to about 60% compared to aluminum.

Further, the amount of thermal expansion of the frame material caused by the movement of the device may be measured in advance, and the amount of thermal expansion may be considered in the correction data of the mounting head 55. The correction data caused by the thermal expansion of the frame material of the mounting portion 50 is generally obtained, for example, as follows. First, a target (not shown) for confirming the position of the mounting tool 56 is provided in the vicinity of the mounting tool 56 of the mounting head 55, and is positioned on the semiconductor wafer by a third camera 57, which will be described later. The position of the target at the receiving location is identified. Next, the mounting head 55 is moved all the way to the mounting position, and the position of the target at this time is recognized by the second camera 22. After the mounting head 55 is moved a certain number of times from the mounting position toward the mounting position, the position recognition of the target is performed again. By such an operation, the amount of positional displacement of the mounting head 55 caused by the thermal expansion of the frame material accompanying the movement of the device is obtained. The correction data obtained based on the positional shift amount of the mounting head 55 is considered in the position correction of the mounting head 55 to be described later.

The X-direction moving block 52 is attached to the support frame 51 via the X-direction guide member 52a, and is movable in the X direction by a ball screw mechanism (not shown) driven by a motor. The Y-direction moving device 53 is provided to move the movable body 54 freely in the Y direction. The Y-direction guide member 53a supported by the ground and the ball screw mechanism (not shown) driven by the motor can move the movable body 54 in the Y-axis direction. Although not shown, the mounting portion 50B is provided with a moving device that moves the mounting head 55 in the vertical direction (Z direction). As the moving means (moving means for moving) in the up and down direction, for example, a linear movement guide (LM guide) and a cross roller guide are known, and any of these may be used. Among them, when the cross roller guide is used as a guide means for the up and down direction, compared with the case where the LM guide is used, there is a level when the ground is lowered to the same height. The reproducibility of the position of the direction is high, that is, it is difficult to cause a positional shift in the horizontal direction. Further, the mounting head 55 is provided with a correction mechanism having a rotation direction (θ direction) not shown. The mounting portion 50A on the left side has the same configuration except that the arrangement of the respective portions is reversed left and right.

The mounting portion 50B receives the semiconductor wafer t taken out from the component supply unit 10 by the transfer unit 40B from the adsorption nozzle 44, and mounts the received semiconductor wafer t on the support placed on the stage 21. On the substrate W. Similarly, the mounting portion 50A receives the semiconductor wafer t taken out from the component supply unit 10 by the transfer unit 40A from the adsorption nozzle 44, and mounts the received semiconductor wafer t on the platform. 21 on the support substrate W. The mounting position at the position where the mounting tool 56 mounts the semiconductor wafer t with respect to the support substrate W on the stage 21 is set at a fixed position. Therefore, the platform 21 is moved and controlled so that the mounting areas on the support substrate W are sequentially positioned at the mounting position. Here, the so-called position, for example, is It is set as the center of the range in which the platform 21 can move toward the XY direction. The second camera 22 described above is disposed, for example, directly above the mounting position. In addition, in Fig. 1, the position of the stage 21 is displayed at the loading/unloading position where the support substrate W is carried in and out by the substrate transport unit 30. Therefore, the stage 21 exists in the movable range. The center is at a position that is slightly offset toward the rear side of the device.

The mounting position is not limited to the position at which the mounting tool 56 of the mounting portion 50B on the right side mounts the semiconductor wafer t on the support substrate W, and is also disposed at the mounting portion 50A on the left side and the mounting portion 50B on the right side. The same position. In other words, the position at which the semiconductor wafer t is mounted on the support substrate W by the mounting portion 50A on the left side is the same as the position at which the semiconductor wafer t is mounted on the support substrate W by the mounting portion 50B on the right side, and The semiconductor wafer t is alternately mounted by a pair of mounting portions 50A, 50B at the same mounting position.

The mounting areas of the support substrate W are sequentially positioned at a certain mounting position by the XY moving mechanism of the platform portion 20, so that the mounting tools 56 of the left and right mounting portions 50A, 50B are respectively received from the receiving position. It is moved all the way to a certain mounting position, which is the position at which the semiconductor wafer t is received from the adsorption nozzles 44 of the transfer portions 40A, 40B. Below the moving path of the mounting tool 56, a third camera 57 for imaging the semiconductor wafer t adsorbed and held by the mounting tool 56 from the lower side is disposed. 3rd photo The camera 57 is disposed at a lower level than the moving path of the mounting tool 56 and at a higher level than the wafer ring holder 12. The third camera 57 is provided at each of the moving path of the mounting tool 56 of the mounting portion 50A on the left side and the moving path of the mounting tool 56 of the mounting portion 50B on the right side. The third camera 57 functions as a second recognition unit.

The mounting device 1 of the embodiment is provided with a control unit 60 as shown in FIG. The control unit 60 controls the operations of the component supply unit 10, the platform unit 20, the substrate transport unit 30, the transfer unit 40, and the mounting unit 50 based on the information stored in the storage unit 61, and includes the semiconductor wafer. The electronic components of t are sequentially mounted to the respective mounting areas of the support substrate W. At the memory unit 61, the data of the movement position error of the platform 21 obtained by the acquisition of the movement position error of the platform 21 described later is also stored. Based on the correction data, the movement of the platform 21 is made. control.

[Operation of Mounting Device (Installation of Electronic Parts)]

Next, an installation work of an electronic component using a semiconductor wafer t or the like having the mounting device 1 will be described. When the electronic component such as the semiconductor wafer t is mounted on each of the mounting regions of the support substrate W, when only the global identification method is applied, since the position identification system of the mounting region is not performed, for each mounting The positioning accuracy of the semiconductor wafer t in the region is determined by the identification accuracy of the global mark or the like of the support substrate W and the machining accuracy of the XY moving mechanism of the stage 21. Of course However, from the viewpoint of metal working, it is impossible to complete the processing by guiding the guide rail or the like for guiding the movement of the stage 21 to a desired length and with an accuracy of ±5 μm or less. . Needless to say, it is less likely that a guide rail having a desired length is assembled in a metal frame or the like with a linearity and a degree of undulation of ±5 μm or less. Therefore, the movement position error of the stage 21 is measured, and the data (correction) for correcting the movement of the stage 21 is obtained.

{Getting the movement position error (correction data) of platform 21 (correction project)}

The data for correcting the movement position error of the stage 21 is obtained by using the correction substrate 71 as shown in Fig. 8. The correction substrate 71 is, for example, a dot-shaped dot 72 for position recognition on a glass substrate, which is arranged in a matrix at a predetermined interval. The dot mark 72 of the correction substrate 71 is provided, for example, in a range of 300 mm in length × 300 mm in width and at intervals of 3 mm. The dot mark 72 is formed by a metal thin film or the like, and can be formed by a film forming technique such as etching or sputtering. The diameter of the dot mark is, for example, 0.2 mm. This correction substrate 71 is correctly placed on the stage 21. The method of arranging the correction substrate 71 is not particularly limited, but is carried out, for example, by a general method as shown below. Here, the correction substrate 71 is provided in the same size as the support substrate W, and the range in which the dot marks are provided is set to be the same as the range including all the mounting regions on the support substrate W.

(Placement of correction substrate 71)

The calibration substrate 71 as described above is placed on the stage 21 by manual operation by an operator. The arrangement of the correction substrate 71 is performed by placing the correction substrate 71 on the stage 21, and performing parallel adjustment of the correction substrate 71 (adjusting the side-by-side direction of the dot marks 72 in alignment with the XY direction). The parallel adjustment is performed by the second camera 22 used for imaging the entire mark of the support substrate W. First, on the correction substrate 71 placed on the stage 21, for example, as shown in FIG. 8, the dot mark 72 at the corner of the left front side of the correction substrate 71 becomes the second camera 22. The position of the platform 21 is adjusted by the way of capturing the center of the field of view 22a.

From this state, the platform 21 is moved toward the left side in the X direction at a low speed (the point mark 72 is slowly moved in the field of view 22a of the camera 22 to a normal speed). At this time, the operator monitors the image of the second camera 22 by the monitor, and the position of the point mark 72 imaged by the second camera 22 is directed toward the upper side or the lower side with respect to the imaging field of view 22a. The offset causes the movement of the stage 21 to be stopped, and the inclination of the correction substrate 71 is manually adjusted to adjust the direction in which the offset is eliminated. The imaging field of view 22a of FIG. 8 is an example of a state in which the position of the dot mark 72 appearing in the imaging field of view 22a is gradually shifted toward the lower side with the movement of the stage 21.

If the inclination of the correction substrate 71 is adjusted, the platform is adjusted so that the point mark 72 at the corner of the left front portion becomes the center of the imaging field of view 22a of the second camera 22. The position of 21 moves the platform 21 to the left in the X direction at a low speed. The operator also monitors whether the position of the dot mark 72 is gradually shifted by the monitor. Thereafter, if the position is shifted, the movement of the stage 21 is stopped, and the inclination of the correction substrate 71 is adjusted. This operation is repeated until the dot mark 72 at the corner of the right front side of the correction substrate 71 is displayed on the monitor screen without being missed. If it is possible to adjust the dot mark 72 from the dot mark 72 in the left front corner to the dot mark 72 in the right front corner, the dot mark 72 can be introduced in the field of view 22a of the camera 22, and the placement of the correction substrate 71 is completed. The movement of the platform 21 by the operator is performed by the operation of the touch panel and the joystick.

(Acquisition of the movement position error of the platform 21 (correction data))

Next, by moving the position of the dot mark 72 of the correction substrate 71 placed on the stage 21 in the same manner as the above-described general method, the movement position error and the correction data obtained based thereon are obtained. The imaging of the dot mark 72 on the correction substrate 71 is, for example, as shown in FIG. 9, and the dot mark 72 positioned at the center of the correction substrate 71 is used as the dot mark (first dot mark) 72a which is initially imaged, and From this point mark 72a, it moves in a spiral shape to the outer side in order to reach the last dot mark 72n.

First, the operator moves the correction substrate 71 while operating the stage 21 while observing the monitor so that the first dot symbol 72a becomes the center of the field of view of the camera 22. Central The dot mark 72a is provided so as to be distinguishable from other dot marks 72, and is provided adjacent to the dot mark 72a to be provided with a mark for identification. In Fig. 9, instead of displaying for adjacent symbols, the dot mark 72a is indicated by a cross circle. If the first dot mark 72a is positioned so as to become the center of the field of view of the camera 22, the detection operation of the dot mark 72 is started. From this stage, first, it is performed by automatic control by the control unit 60. The detection operation system starts by causing the operator to press (touch) the start key of the detection operation displayed on the touch panel.

When the detection operation of the dot mark 72 is started, the first dot symbol 72a is first imaged. The image of the first dot mark 72a that has been imaged is processed using a known image recognition technique, and the positional deviation of the dot mark 72 with respect to the center of the field of view of the camera 22 is detected. The detected positional shift is stored in the memory unit 61 as information paired with the moving position (XY coordinates) of the stage 21. When the position detection of the center point mark 72a is completed, the platform 21 is moved in such a manner that the next (second) point mark 72 is positioned within the field of view of the camera in accordance with the order of introduction. In the example of Fig. 9, since the second dot symbol 72 is located on the left side of the first dot symbol 72a, the platform 21 is moved 3 mm toward the right side in the X direction.

The movement of the platform 21 is based on the read value of the linear encoder disposed at the XY moving mechanism of the platform 21. At the scale of the linear encoder, as a countermeasure against heat, it is preferable to use a glass ruler having a small thermal expansion coefficient. If the movement of the platform 21 is over, then the system and the Similarly to the one dot symbol 72a, the positional shift of the second dot symbol 72 is detected, and is stored in the memory unit 61 as information paired with the XY coordinates of the platform 21 at this time. The imaging of the dot mark 72 is performed after waiting for the time when the vibration generated by the stop of the platform 21 is converged after the platform 21 is stopped. This operation is performed on all the dot marks 72 on the correction substrate 71, and the movement position shift data of the dot marks 72 corresponding to the respective positions are acquired, and are stored in the memory unit 61 as correction data.

(Acquisition of correction data accompanying thermal expansion of the support substrate W)

In order to improve the bondability of the die-bonding film used in the bonding of the semiconductor wafer t, there is a case where a heater is provided on the stage 21 and the support substrate is heated. In this case, since the temperature of the support substrate W changes (rises) before and after being placed on the stage 21, the support substrate W is thermally expanded corresponding thereto. If the support substrate W is thermally expanded, even if the stage 21 and the mounting head 55 are moved with good precision, the mounting position is offset by an amount corresponding to the amount of extension of the support substrate W.

Therefore, it is preferable to grasp the amount of thermal expansion of the support substrate W caused by the heating of the heater by measurement or the like in advance, and multiply the correction data when the semiconductor wafer t is mounted on the support substrate W. The coefficient (%) corresponding to the amount of thermal expansion previously grasped is controlled for the movement of the stage 21. At this time, the support substrate is caused by factors such as the shape and arrangement of the heater, the configuration of the stage 21, and the like. The W system does not necessarily uniformly expand thermally, and therefore, it can be configured to also grasp the distribution of thermal expansion. For example, the region on the support substrate W may be divided into a plurality of lattice-shaped regions of 10 rows×10 columns, and the amount of thermal expansion may be measured for each of the divided regions (each measurement) The point is caused by the displacement due to thermal expansion). Thereafter, for each of the regions, the coefficients multiplied by the correction data on the platform 21 are switched.

Further, the support substrate W may be placed on the stage 21 first, and then, during a period until the thermal expansion of the support substrate W is saturated with respect to the temperature of the stage 21, at each specific elapsed time On the other hand, the amount of thermal expansion of the support substrate W is measured, and a coefficient corresponding to the amount of thermal expansion at each specific elapsed time is extracted in advance. At this time, it is also possible to extract a coefficient corresponding to the amount of thermal expansion for each of the regions after the support substrate W is divided into a plurality of regions. Thereafter, at the time of mounting the semiconductor wafer t, the coefficient corresponding to the elapsed time is switched from the elapsed time from the mounting of the support substrate W on the stage 21, and the correction data is multiplied. This coefficient causes the platform 21 to move. With such a configuration, it is possible to efficiently mount the semiconductor wafer t with respect to the support substrate W without waiting for the thermal expansion of the substrate W to be saturated with respect to the temperature of the stage 21. Installation of semiconductor wafer t.

(correction of the moving position of the platform 21)

When moving the platform 21, reference is made to the moving position by the platform 21. The correction data obtained by the engineering acquisition is used to correct the moving position of the platform 21. First, in order to position the mounting region where the semiconductor wafer t is initially mounted on the support substrate W at the mounting position, the stage 21 is moved. At this time, the control unit 60 selects the position information (XY coordinates) of the first mounting area stored in the storage unit 61 and the above-described correction data, and selects the need to position the initial mounting area at the mounting position. Corrected value. The amount of movement of the platform 21 when the initial mounting area is positioned at the mounting position is corrected for the amount corresponding to the selected correction value. In the case where the stage 21 is provided with a heater, it is preferable to multiply the coefficient obtained by the above-described thermal expansion amount of the support substrate W by the correction data of the stage 21.

In Fig. 10, an example is shown for moving the mounting area (xi, yi) MA to the mounting position P. If the mounting area MA is directly moved to the mounting position P, when a positional shift (Δni, Δmi) is generated based on the machining accuracy or the like, the positional offset is obtained based on the correction data ( Δni, Δmi), and the table 21 is moved by adding a correction value (-Δni, -Δmi) which offsets the positional offset to the amount of movement of the stage 21. In this manner, the mounting areas on the support substrate W are sequentially positioned at the mounting position P. In the above example, since the correction data is acquired at intervals of 3 mm, the installation area does not necessarily coincide with the position at which the correction data is obtained. Therefore, when the mounting area is between the positions where the position offset of the dot mark 72 is obtained, linearly interpolating the data of the adjacent two position offsets and conforming to the mounting area is performed. The information of the positional offset is approximately calculated It is used as a correction value.

The acquisition of the movement position error (correction data) of the above-described stage 21 is basically performed as long as the installation apparatus 1 starts to operate, and the movement of the stage 21 may be controlled based on the measurement result. However, at the stage 21 or the mounting head 55, there is a case where a heater or the like which assists in mounting the semiconductor wafer t is incorporated, and the temperature of each part of the apparatus rises and causes mechanical precision due to thermal expansion. Reduce the embarrassment. Further, with the progress of the mounting process of the semiconductor wafer t by the mounting device 1, the heat generated by the motor or the like that moves the mounting head 55 may cause a decrease in the mechanical accuracy of each part of the device. In the case where such a movement error due to an increase in temperature is taken into consideration, it is not limited to one time when the apparatus starts to operate, but the acquisition of the movement position error (correction data) is periodically performed. Thereby, the positioning accuracy of the semiconductor wafer t or the like can be further improved.

{Electrical parts installation engineering}

After the movement position error (correction data) of the above-described platform 21 is obtained and the correction data is stored in the memory unit 61, the mounting process of the support substrate W of the electronic component such as the semiconductor wafer t is performed.

(1) Transferring of wafer ring 11

First, the unused wafer ring 11 is carried into the wafer ring holder 12 from a housing portion (not shown), and the wafer ring 11 is fixed to the wafer ring holder 12.

(2) Supporting the placement of the substrate W (2-1: Support for the supply of the substrate W)

The support substrate W that has been carried into the transporting belt 31 is sucked and held by the first delivery unit 33, and placed on the stage 21 positioned at the loading/unloading position. The support substrate W is delivered to the first delivery unit 33 at the stage 21, and is moved to the position where the transport belt 31 is carried in and stands by. In this operation, the second delivery unit 34 stands by at the position where the conveyor belt 32 is carried out. The project (2) can be carried out in parallel with the project (1) or can be carried out individually.

At the loading conveyor 31, the support substrate W is carried in a loader (not shown). In the same manner as the wafer ring supply unit, the loader is provided with a cabin that can accommodate the support substrate W with a gap in the vertical direction, and is positioned by a pusher. The support substrate W at the same height as the transport height of the carry-in conveyor 31 is pushed out or extracted by a jig, and is supplied to the carry-in belt 31. An unloader having the same configuration as that of the loader is disposed on the side of the carry-out conveyor 32, and the support substrate W (the support substrate W on which the semiconductor wafer t is mounted) is sequentially stored from the carry-out conveyor 32. In the cabin.

(2-2: Detection of global marks)

The global mark of the support substrate W placed on the stage 21 is detected, and the position of the support substrate W is recognized. For example, as in Figure 11 As shown in the above, in general, the second camera 22 is sequentially moved downward and imaged for the global symbols A, B, and C at the corners of the three corners of the support substrate W. The movement of the support substrate W is performed by the platform 21. Based on each of the imaging images captured by the second camera 22, the positions of the three global symbols A, B, and C are detected, and based on the positions of the three global symbols A, B, and C detected. The positional shift in the XY direction of the support substrate W and the positional shift in the θ direction are taken out. The positional deviation of the support substrate W can be obtained by various well-known methods, and the method is not particularly limited. Hereinafter, an example of the method of detecting the positional shift will be described.

In Fig. 11, the solid line represents the support substrate W actually placed on the stage 21, and the two-point chain line represents the support substrate W in a state where the positional deviation has not occurred on the stage 21. . The support substrate W described by the two-dot chain line is in an ideal position state. At this time, the center of the support substrate W coincides with the center position O (x0, y0) of the stage 21.

First, the position of the three symbols A, B, and C provided at the support substrate W is detected using a known image recognition technique, and the inclination of the line segment AB connecting the marks A and B with respect to the X direction is used. The average value of both θ1 and the inclination θ2 of the line segment BC connecting the marks B and C with respect to the Y direction is used to obtain the inclination θ (= (θ1 + θ2)/2) of the support substrate W. Next, the center position O of the stage 21 is used as the center of rotation, and the support substrate W is imaginarily rotated so that the inclination θ disappears. This state is shown by a dotted line in FIG. Ask for removal At this time, the movement amount (Δx1, Δy1) of the point M1 (x1, y1) among the marks A and C at the opposite corners. After that, the value of the movement amount (Δx1, Δy1) taken out and the difference (Δx2, Δy2) between the point M2 (x2, y2) and the coordinate O after the movement (Δ) is added. X1 + Δx2, Δy1 + Δy2) is taken out as a positional shift in the XY direction of the support substrate W.

If the positional deviation of the support substrate W on the stage 21 is calculated, the mounting position of the semiconductor wafer t on which the semiconductor wafer t is initially mounted on the support substrate W is positioned at the mounting position while correcting the positional deviation. The platform 21 is moved in a manner. At this time, the movement of the stage 21 for positioning the respective mounting areas at the mounting position is based on the correction data based on the correction of the positional deviation of the support substrate W and the movement position error of the above-mentioned platform 21. And was corrected. When the moving mechanism of the stage 21 as in the present embodiment does not have the θ table, the tilt of the support substrate W is supported by the θ adjusting mechanism provided in the mounting head 55 for the mounted semiconductor wafer t. The tilt is adjusted and corrected.

(3) Transfer of semiconductor wafer t (3-1: Position detection of semiconductor wafer t)

If the wafer ring 11 is fixed to the wafer ring holder 12, the semiconductor wafer t initially taken out on the wafer ring 11 is positioned at the take-out position. The order in which the semiconductor wafer t on the wafer ring 11 is taken out is stored in the memory unit 61 in advance, so that the control unit 60 is The movement of the wafer ring holder 12 is controlled in this order. Therefore, after the first semiconductor wafer t is taken out, the pitch movement of the wafer ring holder 12 is performed based on the order stored in the memory unit 16. In general, as shown by the arrows in Fig. 7A, the movement is performed with a trajectory that switches at each line for the moving direction.

When the semiconductor wafer t is positioned at the take-out position, the first camera 13 captures two alignment marks of the semiconductor wafer t. The imaging of the two alignment marks can be performed once or twice, as long as the two alignment marks can be simultaneously introduced into the imaging field of view of the first camera 13. The position of the semiconductor wafer t is detected based on the position of the alignment mark obtained by the image pickup image. When the position of the semiconductor wafer t is shifted with respect to the take-out position, the wafer ring holder 12 is moved in such a manner as to correct the position thereof. The transfer process (3) of the semiconductor wafer t can be performed in parallel with the placement process (2) of the support substrate W, or can be performed individually.

The detection of the positional deviation of the semiconductor wafer t positioned at the take-out position is not particularly limited, and can be carried out according to various known methods. For example, the position of each registration mark can be detected using a known image recognition technique based on an image of the alignment mark of two alignment marks provided at diagonal positions on the semiconductor wafer t. Based on the position of the symbol to be extracted, the inclination of the line segment connecting the two symbols is obtained, and the inclination is compared with the case where the position is not stored in the memory unit 61 in advance. a line connecting the marks at the semiconductor wafer t The inclination of the segments is compared, and the difference between the two is detected as the tilt deviation of the semiconductor wafer t. Further, the position of the midpoint between the actual alignment marks and the position of the dot between the alignment marks of the semiconductor wafer t which is stored in the memory unit 61 and which are not positionally displaced are between The difference is obtained as the positional shift of the semiconductor wafer t in the XY direction.

(3-2: Removal of semiconductor wafer t)

The reversing mechanism 43 of the transfer unit 40A of one of the (for example, the left side) is driven, and the adsorption nozzle 44 in the standby state is reversely moved to the take-out position. Next, the lifting device 41 is driven to lower the adsorption nozzle 44 together with the arm body 42, and the adsorption surface of the adsorption nozzle 44 is brought into contact with the upper surface (electrode forming surface) of the semiconductor wafer t. When the adsorption nozzle 44 is in contact with the semiconductor wafer t, the semiconductor wafer t is adsorbed and held by the adsorption nozzle 44. The timing at which the adsorption force is applied to the adsorption nozzle 44 may be before or after the adsorption nozzle 44 is brought into contact with the semiconductor wafer t, or may be set to an appropriate timing after the contact. Just fine.

If the adsorption nozzle 44 adsorbs and holds the semiconductor wafer t, the adsorption nozzle 44 is raised all the way to the original height. At this time, in conjunction with the rise of the adsorption nozzle 44, the overhanging mechanism (not shown) is operated to assist the peeling of the semiconductor wafer t from the resin sheet S. When the adsorption nozzle 44 that adsorbs and holds the semiconductor wafer t is raised to the original height, the reverse arm 47 is reversed and the adsorption nozzle 44 is returned to the standby state. In this state, the semiconductor wafer t is The lower side (the surface on the opposite side to the electrode forming surface) is placed on the upper side and stands by.

(3-3: Submission of semiconductor wafer t)

One of the mounting tools 56 on the left side is moved to a position directly above the adsorption nozzle 44 that holds the semiconductor wafer t and is in a standby state, that is, at a receiving position. If the mounting tool 56 is positioned at the receiving position, the lifting device 41 is driven to raise the arm body 42 and the semiconductor wafer t held at the suction nozzle 44 is delivered to the holding surface of the mounting tool 56. The adsorption nozzle 44 is lowered to the original height after the semiconductor wafer t is delivered to the mounting tool 56, and is in a standby state. At the time of the delivery, the timing at which the suction force is applied to the mounting tool 56 may be before or after the semiconductor wafer t is brought into contact with the mounting tool 56, or may be after the abutment ( However, it is only necessary to set the timing to be suitable before the adsorption nozzle 44 starts to descend. The suction adsorption force of the adsorption nozzle 44 is released from the time when the semiconductor wafer t is delivered to the mounting tool 56 until the adsorption nozzle 44 starts to descend.

(4) Installation of semiconductor wafer t (4-1: Movement and position detection of semiconductor wafer t)

The mounting tool 56 that has received the semiconductor wafer t is moved toward the mounting position by a movement trajectory preset at the memory unit 61. The semiconductor wafer t is such that the electrode forming surface (upper wafer surface) faces downward The state is maintained at the installation tool 56. In the middle of moving the mounting tool 56 holding the semiconductor wafer t toward the mounting position, it passes over the third camera 57. At this time, the movement of the attachment tool 56 is temporarily stopped above the third camera 57, and the alignment marks of the semiconductor wafer t are imaged by the third camera 57. The position of each registration mark is detected based on the captured image, and the positional deviation of the semiconductor wafer t with respect to the mounting tool 57 is extracted based on the detected position. If the imaging is finished, the movement of the installation tool 56 is started again.

(4-2: Installation of semiconductor wafer t)

After imaging the semiconductor wafer t held at the mounting tool 56, the mounting tool 56 is moved to the mounting position, and the semiconductor wafer t is mounted for the mounting area on the support substrate W positioned at the mounting position. At this time, when the semiconductor wafer t is displaced with respect to the mounting tool 56 as a result of the position detection of the semiconductor wafer t by the third camera 57, it is offset with respect to the detected position. The correction is made to correct the movement of the installation tool 56 and to position the installation tool 56 at the installation location. Further, when the inclination θ of the support substrate W is detected in the item (2-2), the inclination θ is also corrected by the attachment tool 56. Thereafter, the mounting tool 56 is lowered, and the semiconductor wafer t is pressed against a specific mounting region of the support substrate W to be mounted.

For the bonding of the semiconductor wafer t supporting the substrate W, The adhesion is performed by a bonding force of a die attach film (DAF) which is previously attached to the surface of the support substrate W or under the semiconductor wafer t. The bonding of the semiconductor wafer t may be performed by previously providing a heater on the stage 21 and pressurizing the semiconductor wafer t against the heated support substrate W. The heater can also be built into the installation tool 56. When the semiconductor wafer t is pressurized for a predetermined time, the adsorption of the semiconductor wafer t is released, and the mounting tool 56 is raised to the original height. The installed installation tool 56 is moved toward the receiving position.

In parallel with the operation of the above-described mounting process of the semiconductor wafer t, the pitch feeding of the semiconductor wafer t held on the wafer ring 11 at the wafer ring holder 12 is performed (the next taken semiconductor wafer is taken out) Positioning detection at the take-out position), position detection of the semiconductor wafer t (the same operation as (3-1) in the item (3)), and adsorption nozzle of the transfer unit 40B by the other (right side) The semiconductor wafer t is removed by 44 (the same operation as (3-2) in the item (3)), and the semiconductor wafer t is caused by the mounting tool 56 of the other (right) mounting portion 50B. Receive (the same action as (3-3) in project (3)).

In parallel with the movement of the mounting tool 56 of the mounting portion 50A that has finished mounting toward the receiving position, the mounting position of the mounting tool 56 of the other mounting portion 50B that receives the semiconductor wafer t at the receiving position is moved toward the mounting position. Start. The platform 21 starts the pitch movement in order to position the next mounting area at the mounting position. Being positioned The mounting tool 56 of the mounting portion 50B at the mounting position performs the same operation as the mounting portion 50A (the same operation as (4-1) and (4-2) in the engineering (4)). The semiconductor wafer t is mounted by pressurizing a specific mounting region of the support substrate W. The installed installation tool 56 is moved toward the receiving position.

The above-described receiving operation and mounting operation of the semiconductor wafer t by the mounting tool 56 of the mounting portion 50A, and the receiving operation and mounting operation of the semiconductor wafer t by the mounting tool 56 of the mounting portion 50B are alternately repeated. Until the semiconductor wafer t of the wafer ring 11 is exhausted. That is, the adsorption nozzles 44 of the left and right transfer portions 40A and 40B alternately take out the semiconductor wafer t, and the mounting tools 56 of the left and right mounting portions 50A and 50B exchange and mount the semiconductor wafer t. In this manner, the mounting of the semiconductor wafer t is alternately performed by the two mounting portions 50A and 50B until the semiconductor wafer t of the wafer ring 11 is exhausted.

In addition, as shown in FIG. 12 which will be described later, when a plurality of semiconductor wafers t1 to t3 are mounted in one mounting region MA, the first semiconductor wafer t1 is ended as described above. After the mounting, the wafer ring 11 on which the second semiconductor wafer t2 is mounted is placed in the component supply unit 10, and the semiconductor wafer t1 to which the first semiconductor wafer is mounted is placed at the loader of the substrate transfer unit 30. Support substrate W. Then, by performing the same operation as the above-described operation, the second semiconductor wafer t2 is sequentially mounted on each of the mounting regions MA on which the first semiconductor wafer t1 is mounted. So, if it is the second The semiconductor wafers t2 are mounted on all of the mounting areas MA to which t1 is mounted, and the wafer ring 11 on which the third semiconductor wafer t3 is mounted is placed in the component supply unit 10, and is placed in the substrate transfer unit. At the loader of 30, the support substrate W on which the semiconductor wafers t1 and t2 are mounted is placed, and the third semiconductor wafer t3 is mounted by the same operation. In this manner, a plurality of semiconductor wafers t1 to t3 are mounted at the respective mounting regions MA of the support substrate W.

When a plurality of semiconductor wafers t1 to t3 are mounted in one mounting area MA, it is not limited to the mounting of all the supporting substrates W of the first semiconductor wafer t1 as described above. Then, the method of mounting the second semiconductor wafer t2 is switched. For example, if the mounting of the first semiconductor wafer t1 is completed for one support substrate W, the second semiconductor wafer t2 may be switched. In the case of the semiconductor wafer t3 of the third semiconductor wafer t3, the semiconductor wafer t2 of the third semiconductor wafer t2 is replaced by the mounting of the second semiconductor wafer t2. In other words, it is also possible to configure a plurality of semiconductor wafers t to be mounted in units of the support substrate W. In this case, since the support substrate W is not detached from the stage 21 until the mounting of the semiconductor wafer t of all the types of the support substrate W is completed, it is possible to make a plurality of types. The mounting accuracy of the semiconductor wafer t is further improved.

In the above method of mounting the semiconductor wafer 1 of each type on all the support substrates W, the semiconductor of the first type is terminated. The support substrate W to which the wafer t1 is mounted is temporarily carried out from the stage 21, and is again placed on the stage 21 when the semiconductor wafer t2 of the second type is mounted. Therefore, when the semiconductor wafer t1 of the first type is mounted and when the semiconductor wafer t2 of the second type is mounted, an offset occurs in the position of the support substrate W on the stage 21, that is, a position is generated. Offset. Even in the case where there are occasional positions on the platform 21, the situation will be offset in the general case. Although the position of the support substrate W is identified by global identification, there is still a possibility that an offset occurs in the identification position of the support substrate W due to a factor of identification error or the like. Therefore, it can be inferred that, correspondingly, the relative positional accuracy between the first variety and the second variety is lowered. On the other hand, when the semiconductor wafer t1 of the first type and the semiconductor wafer t2 of the second type are successively attached without removing the support substrate W from the stage 21, it is possible to prevent the occurrence of the identification error. The resulting positional offset. Therefore, the relative positional accuracy between the first type and the second type can be improved.

The semiconductor wafer t attached to each of the plurality of mounting regions supporting the substrate W is not limited to one type. It is also possible to divide one support substrate W into a plurality of regions, and to mount semiconductor wafers t of different types in each region. For example, the semiconductor wafer ta of the A type may be mounted in the first region of one half of the support substrate W, and the semiconductor wafer tb of the B type may be mounted in the second region of the remaining half. A semiconductor package of the A type is manufactured from the first region of the semiconductor wafer ta to which the A type is mounted. From being installed with half of the B variety In the region of the conductor wafer tb, a B-type semiconductor package is manufactured.

In this case, in the semiconductor wafer tb of the semiconductor wafer of the A type and the semiconductor wafer tb of the B type, since the circuit pattern of the rewiring layer formed in the subsequent process is different, the exposure pattern for rewiring formation becomes Different. Therefore, it can be inferred that it is more difficult to correct the mounting errors of the semiconductor wafers ta and tb by exposure engineering. In the case where the mounting device and the mounting method of the embodiment are applied, it is possible to mount the semiconductor wafer ta of the A type and the semiconductor wafer tb of the B type with high relative positional accuracy. Therefore, it is possible to collectively perform the exposure processing for the region in which the semiconductor wafer ta of the A type is mounted and the exposure processing for the region in which the semiconductor wafer tb of the B type is mounted. Increased production efficiency.

When the semiconductor wafer ta of the A type is mounted in the first region and the semiconductor wafer tb of the B type is mounted in the second region, there is also a size between the semiconductor wafer ta of the A type and the semiconductor wafer tb of the B type. The installation pitch of the A variety and the installation pitch of the B type are different for different situations. In this case, when the semiconductor wafer ta of the A type is mounted, and when the semiconductor wafer tb of the B type is mounted, by switching the amount of feed to the stage 21, it is possible to convert a plurality of semiconductor wafers ta, tb. It is well mounted at a plurality of areas of the support substrate W. Similarly, a combination of a C-type and a D-type semiconductor wafer constituting the first multi-chip package may be mounted in the first region of the support substrate W, and the second multi-chip package may be mounted in the second region. A combination of a packaged E-type and a F-type semiconductor wafer. In any of these installations, the semiconductor wafers of one type can be mounted at a time to be mounted on a plurality of support substrates W, or can be configured as a unit supporting the substrate W. To install a variety of semiconductor wafers. The specific installation works of these are as described above.

In this case as well, the identification of the global mark of the support substrate W may be performed once in the first place, and the area in which the semiconductor wafer t is mounted may be moved from the first region to the first region. In the case of the 2 area, it is not necessary to re-identify the global mark of the support substrate W. Further, when a heater or the like is provided on the stage 21 and the support substrate W is heated, it may be configured as a second region that can be mounted first and after the semiconductor wafer t is first mounted. At the same time, the correction data of the platform 21 is switched. With this configuration, even when the semiconductor wafer ta of the A type is being mounted for the first region, the amount of thermal expansion of the portion corresponding to the second region at the support substrate W is enlarged. It is also possible to take countermeasures against this, and therefore, it is possible to maintain the mounting accuracy of the semiconductor wafer t(tb) with high accuracy. In the case where a plurality of types of semiconductor wafers t are mounted in units of the support substrate W as described above, the wafer supply mechanism by the tape feeder is used as the component supply unit 10, and is equipped with a plurality of varieties. It is ideal for a corresponding multi-feeder.

Finishing one of the above-mentioned semiconductor wafers t or a plurality of types of semiconductor wafers t1, t2, t3 or semiconductor wafers ta, tb The mounted support substrate W is sent to a subsequent process as described below, and a packaged component such as a semiconductor package is fabricated therefrom. That is, the support substrate W that has finished the mounting of the semiconductor wafer is sequentially sent to the sealing engineering and the formation of the rewiring layer. In the sealing process, a resin is filled in a space between semiconductor wafers mounted on a support substrate W, thereby forming a pseudo wafer. The pseudo-wafer is sent to the formation of the rewiring layer. In the formation of the rewiring layer, the formation of a circuit in the manufacturing process of the semiconductor wafer, that is, the coating process of the photosensitive material such as a photoresist material, the exposure of the photosensitive material, and the development project are performed. The etching process, the ion implantation process, the stripping process of the photoresist, and the like, by which the rewiring layer is formed on the wafer-like semiconductor wafer. The pseudo-wafer formed with the rewiring layer is sent to the cutting engineering office where the pseudo-wafer is sliced, thereby producing a packaged component like a semiconductor package.

As described above, the mounting method of the packaged component of the embodiment is as shown in FIG. 14 and includes: an installation process S1 in which the electronic component is mounted on each of the plurality of mounting areas of the support substrate W; The electronic components mounted at the plurality of mounting areas are sealed in batches to form a wafer-like sealing process S2; and a rewiring process S3 for forming a rewiring layer on the electronic components of the pseudo-wafer, and The wafer is cut to produce a cutting part S4 of the packaged part. The re-wiring layer forming process S3 is as follows, and is provided with a coating process S31 of a photosensitive material, exposure and development of a photosensitive material S32, etching process S33, ion implantation engineering S34, and stripping work of a photoresist. S35 and so on. The mounting process of the electronic component in the method of manufacturing a package component according to the embodiment is carried out based on the mounting method of the electronic component according to the embodiment. In the method of manufacturing a package component according to the embodiment, the electronic component mounted on each mounting region of the support substrate W may be one semiconductor wafer t as described above, or may be a plurality of semiconductor wafers. Or a plurality of semiconductor wafers of the same variety. The variety and quantity of electronic parts are not specifically limited.

In the mounting device 1 of the embodiment, the movement of the mounting tool 56 of the two mounting portions 50A and 50B is a fixed path from the receiving position of the semiconductor wafer t to the mounting position, and two paths are provided. The mounting position by the mounting tool 56 of the mounting portions 50A, 50B is set to a fixed position. Further, each of the mounting regions of the support substrate W is sequentially positioned at the mounting position by the XY moving mechanism of the platform portion 20. At this time, the movement of the stage 21 by the XY moving mechanism of the platform unit 20 is corrected by using the correction data obtained based on the movement position error of the platform 21 obtained in advance. Therefore, it is possible to reduce the mounting error of the semiconductor wafer t due to the movement error of the two mounting portions 50A, 50B and the movement position error of the stage 21 as much as possible. In this way, it is possible to simultaneously achieve the mounting time of the semiconductor wafer t due to the use of the two mounting portions 50A, 50B (the tact time required for mounting the semiconductor wafer t as one of the mounting devices 1) (tact time)) The purpose of lowering and improving the mounting accuracy of the semiconductor wafer t.

That is, the installation tools of the two mounting portions 50A, 50B 56, since the movement is only on a certain path from the receiving position of the semiconductor wafer t to the mounting position, even if a movement error occurs, the adjustment can be performed by one adjustment (correction). The position of the installation location is corrected. Further, since the two mounting portions 50A and 50B are attached to the same mounting position and the mounting operation is performed, the mounting accuracy can be improved as compared with the case where the mounting is performed at the respective mounting positions. The adjustment (correction) of the movement position of the mounting head can be performed in a short time.

Further, since the correction data is used to correct the movement position error of the stage 21, it is possible to move with good precision with a pitch set in advance, whereby each of the support substrates W can be supported. The positioning accuracy of the mounting area for the mounting position is increased. Therefore, the mounting accuracy of ±5 μm or less and the tact time of 0.6 second or less can be achieved at the same time. As a result, it is possible to set the electronic component including the semiconductor wafer t to the support substrate W in which the mark for position detection is not provided in each of the mounting regions, so that the mutual intervals are set in advance. The interval is mounted with good precision, and the electronic component including the semiconductor wafer t can be mounted on the support substrate W with good productivity. In other words, by the mutual mounting by the two mounting portions 50A and 50B, it is possible to shorten the tact time required for mounting the semiconductor wafer t, and by performing at a certain common position. The installation and the correction of the movement error of the platform 21 can achieve the effect of improving the installation accuracy and preventing the decrease in productivity.

For example, a case in which two semiconductor mounting heads are mounted at different positions at different positions is considered. In this case, it is necessary to perform adjustment (correction) of the movement position of the two mounting heads toward the fixed position. Usually, such adjustment is performed using a camera that is disposed at a certain position. If there is an error in making the coordinates between the cameras coincide with each other, the error will appear as an installation error between the two mounting heads.

Further, when the semiconductor wafer is mounted at a predetermined position by the two mounting heads, the position at which the semiconductor wafer is mounted on the supporting substrate is two places. Since the movement error varies depending on the location, it is necessary to measure the movement error at two locations. In the measurement of the movement error of one place, for example, it takes about 3 hours. Specifically, in the case of measuring a movement error with respect to a measurement substrate set to a matrix shape at intervals of 3 mm for a support substrate of 300 mm × 300 mm, the number of measurement points on the substrate is a longitudinal direction: 300 mm / 3mm = 100 points, horizontal direction: 300mm / 3mm = 100 points, and a total of 100 points × 100 points = 10000 points. If it takes 2 seconds to measure at one point, it is 10000 points × 2 seconds = 20,000 seconds = about 5 hours and 33 minutes. In addition, the reason why it takes 2 seconds to measure at one point is that it is estimated that a waiting time of more than one second is required in order to converge the vibration generated when the platform is stopped. Therefore, when the mounting heads of the two mounting heads are mounted at different positions, the mounting apparatus 1 of the embodiment consumes an unnecessary preparation time of about 5 hours and 30 minutes. Production volume A reduction corresponding to the amount of this time is produced.

In addition, when two cameras are used to simultaneously measure in two places in parallel, it is possible to make the measurement time slightly equal to that in one place. However, it is necessary to perform correction for making the coordinates of the two cameras match each other. In this case, there is a possibility of error. This is an important reason for reducing positional accuracy. Also, since two cameras are required, the cost is also increased.

Further, in consideration of a configuration in which the mounting head is moved to the respective mounting regions without moving the platform 21 of the support substrate W, and the correction data is created on the mounting head side, it is compared with the substrate platform. In the case of making corrections on the side, it will become a huge amount of correction data, and the time required for correction will increase. That is, the mounting head is different from the substrate platform, and since the semiconductor wafer is mounted on the substrate, it is necessary to have a vertical movement mechanism. Therefore, in addition to the movement error caused by the fluctuation of the XY moving device of the mounting head, it is necessary to consider the positional shift in the XY direction caused by the movement of the mounting head up and down.

Specifically, even if the frame supporting the mounting head (for example, the Y-axis moving device) is located at the same position in the left-right direction, when the movable body supporting the mounting head is rocked toward the right side and shaken toward the left side, In this case, a large difference occurs in the horizontal position of the front end of the mounting head when it is lowered to the position where the height of the semiconductor wafer t is mounted on the support substrate W on the stage 21. Therefore, it is not only necessary to consider the X-direction movement of the mounting head or Y Snakes in the direction of movement also need to consider the rocking action of the movable body supporting the mounting head as an important factor in the displacement of the mounting position. Therefore, even if it is a side of the platform 21 that does not have a large movement error, the movement of the pitch of the point mark 72 of the correction substrate 71 that is less than the above is 3 mm, and at the mounting head side, There is a large movement error (for example, 5 μm or more) at the installation tool.

Therefore, when the correction data is created at the mounting head side, it is conceivable that the movement position shift needs to be measured at a shorter interval of 3 mm, for example, every 1 mm pitch. Assuming that the displacement of the moving position is measured at a pitch of 300 mm × 300 mm with a pitch of 300 mm × 300 mm, it is necessary to measure 300 points × 300 points = 90000 points, compared to the measurement with a pitch of 3 mm. In the case of the case of a 3 mm pitch, it is 10,000 points, and the measurement location is nine times the number. Therefore, the measurement time is also 9 times, and it takes 5 hours and 33 minutes × 9 = 49 hours and 30 minutes. As a result, there is a lack of practicality.

Further, when there is a undulation in the vertical direction on the substrate platform side in addition to the shaking of the movable body, when the semiconductor wafer is mounted on the support substrate, the height position becomes a place depending on the support substrate. And it is different. If the movable body of the mounting head is inclined, and the direction in which the mounting head moves up and down is inclined with respect to the vertical direction, the mounting position is in the horizontal direction due to the difference in the height of the mounting surface (substrate surface). There is some offset. If this situation is also considered, the measurement of the revised data will become more complicated. It will take more time to work on the middle of the data. Also, there is a flaw in the accuracy of the correction itself.

From the above viewpoints, it can be seen that the mounting position of the two mounting portions 50A and 50B is set at the same predetermined position, and the platform 21 on which the support substrate W is placed is moved, and each mounting region is placed. The mounting device 1 which is positioned at the mounting position and which uses the correction data to correct the movement error of the platform 21 is capable of achieving both the improvement of the mounting accuracy and the shortening of the tact time, and is highly productive. The language is valid.

The mounting device 1 of the embodiment is as shown in FIG. 12, when a plurality of types of semiconductor wafers t1, t2, t3, etc. are mounted in one mounting area MA, or when one type or plural is used. It is effective when a semiconductor wafer t of a type and a diode or a capacitor are mounted. As in the case of the above, when a plurality of types of electronic components are mounted in one mounting area, there is a positional shift of the relative position of the plurality of electronic components generated in one mounting area (package). In other words, it is not possible to apply a technique of "correcting the mounting error at the time of exposure" which can be applied to a single crystal package in which one semiconductor wafer is incorporated in one mounting region (package). Therefore, it is necessary to improve the positional accuracy of the mounting of a plurality of electronic components. In this regard, in the mounting device 1 of the embodiment, since the individual mounting accuracy of the electronic component including the semiconductor wafer t can be improved, even when a plurality of electronic components are mounted in one mounting region, At the same time, it becomes a plurality of electricity that can be placed in one installation area. The relative positional accuracy of the sub-parts is increased.

{Position offset correction caused by a pair of mounting portions 50}

When two mounting portions 50A and 50B are used, there is a possibility of a relative positional shift between the mounting tools 56 of the mounting portions 50A and 50B. In response to this, the camera is disposed below the mounting position, and the positions of the mounting tools 56 positioned at the mounting position are respectively detected, and the offset of the relative positions of the mounting tools 56 is detected and corrected. , is valid. In the detection of the relative positional deviation between the two mounting tools 56, the fourth camera shown in Fig. 4 is used. The fourth camera 23 is attached to the front side of the platform 21 and is mounted upward. The fourth camera 23 images the mounting tool 56 positioned at the mounting position from below. At the time of imaging by the fourth camera 23, the fourth camera 23 is moved right below the mounting position by the movement of the stage 21. The fourth camera 23 is a member that functions as a third recognition unit.

The detection of the movement positional deviation of the two mounting tools 56 is performed while holding the semiconductor wafer t at the mounting tool 56. In addition, for the detection of the positional deviation, it is also possible to use a dummy semiconductor wafer which is fabricated for correction. Further, the positional deviation of the mounting tool 56 can be detected by using the suction hole of the mounting tool 56 or the mark formed on the holding surface of the mounting tool 56 without using the semiconductor wafer. First, the semiconductor wafer t is held at the mounting tool 56 by the operation of the above-mentioned work (3), and the movement of (4-1) of the engineering (4) is performed. To detect the positional shift of the semiconductor wafer t, and to correct the detected positional offset, the mounting tool 56 is positioned at the mounting position (4-2). The semiconductor wafer t held by the mounting tool 56 positioned at the mounting position is imaged by the fourth camera 23. The control unit 60 detects the position of the semiconductor wafer t based on the imaged image of the fourth camera 23, and compares the position data with the correct position previously stored in the memory unit 61 to detect the semiconductor wafer t. Position offset. If there is no positional offset at the mounting tool 56, the semiconductor wafer t is positioned at the mounting position without a positional offset. When a positional shift occurs, the positional shift becomes the shifting position of the mounting head 55.

The detection of the imaging and positional shift of the semiconductor wafer t positioned at the mounting position described above is performed for the mounting tools 56 of the left and right mounting portions 50A, 50B, respectively. When the difference in the movement position of the mounting tools 56 is compared between the two, the mounting tool 56 of one of the mounting portions 50A is used as a reference, and the mounting tool 56 of the other mounting portion 50B is used. Move the position and make a correction for the amount that will cause the gap to be taken out to disappear. With such a configuration, it is possible to eliminate the occurrence of mounting errors caused by the use of the two mounting portions 50A and 50B.

The correction of the positional deviation of the mounting tool 56 is not limited to the above-described method of matching the moving position of the mounting tool 56 of the other mounting portion 50B with the moving position of the mounting tool 56 of one of the mounting portions 50A. . For example, it can also be used for left and right installation tools. 56, and both are corrected in such a manner that the moving positions are matched with respect to the mounting position of the reference base determined in advance. In the case of adopting such a configuration, it is more able to improve the alignment accuracy. In this case, when the moving position of the other mounting tool 56 is matched with the moving position of one of the mounting tools 56, the moving position of the mounting tool 56 which is one of the reference points becomes Contains a certain amount of deviation. Even if it seems to move to the same position, due to mechanical errors or the like, an offset such as 1 μm or 2 μm is generated. When the other mounting tool 56 is aligned with such a position including the deviation, it is difficult to adjust the mounting tool of the other one by more than the deviation of the moving position of the mounting tool 56. The moving position of 56 is aligned. The positioning accuracy of the mounting tool 56 with respect to the other of the mounting positions may be worse than the mounting tool 56 of one of the other. On the other hand, when the moving position of the mounting tool 56 is aligned with respect to the reference mounting position, there is no possibility of including the positional deviation in the reference mounting position itself. It is possible to align the mounting tools 56 of both sides with the same degree of precision with respect to the mounting position.

The detection of the displacement of the movement position of the mounting head 55 (the mounting tool 56) may be performed, for example, when the posture of the mounting head 55 is deformed due to heat generation of the motor or the like. Thereafter, the presence or absence of the shift of the movement position of the mounting head 55 is detected at each set timing (the set time or the set number of installations). Thereby, the mounting accuracy of the semiconductor wafer t can be made more Further improvement. As in the foregoing, in the case of using a heater having an auxiliary for mounting (joining) of the semiconductor wafer t, thermal expansion (thermal deformation) due to heating by the heater is generated at the mounting head 55. The case of moving position error. In this regard, similarly, the project of imaging the semiconductor wafer t held by the mounting tool 56 and detecting the positional deviation by the fourth camera 23 is performed at each predetermined timing. , is valid.

In the above-described embodiment, the mounting tool 56 of each of the mounting regions of the support substrate W and the mounting portions 50A and 50B of the left and right sides is positioned at a certain mounting position at a certain mounting position, and is described. . The predetermined mounting position may be the same position that does not change constantly in the mounting device 1, or may be a position that can be changed according to conditions such as the size of the support substrate W, as long as it is It may be held at a constant position at least until the installation is completed from the start of mounting of the electronic component to be mounted. In addition, when a certain mounting position is configured to be a position at which the setting can be changed, the correction data for correcting the movement error of the stage 21 is separately acquired for each set position, and is performed for the mounting position. When the setting is changed, it is preferable to switch the correction data used for the correction of the movement error of the stage 21 to the correction data corresponding to the installation position after the setting change.

Moreover, the correction data for correcting the movement error of the platform 21 can be obtained in the entire area of the movable range of the platform 21 as long as it is configured at least when the mounting areas on the support substrate W are to be mounted. The positioning may be performed within a range in which the platform 21 is positioned at the installation position. Further, for the correction data for correcting the movement position error of the platform 21, the measured value itself of the movement error position of the platform 21 may be used, or the measured value may be processed using a correction value such as offsetting the movement position error. As long as it is used to correct the movement error of the platform 21, it is sufficient.

In the above-described embodiment, the electrode forming surface (upper surface) of the semiconductor wafer t is directed downward, that is, the so-called face-down bonding is performed in a state of being opposed to the upper surface of the support substrate W. Although the example is described, the mounting device and the mounting method of the embodiment are not limited thereto. The manufacturing method of the package component of the embodiment is also the same. The mounting device and the mounting method of the embodiment, and the method of manufacturing the package component, may be such that the electrode forming surface of the semiconductor wafer t faces upward, that is, the lower surface of the semiconductor wafer t (opposite to the electrode forming surface) The side surface) is mounted on the upper surface of the support substrate W and is applied upwards. Further, the mounting device of the embodiment may be a combined device that is joined face up and face down.

When the application surface is joined upward, a transfer platform for temporarily mounting the semiconductor wafer t is provided between the transfer unit 40 and the mounting portion 50. This is because the semiconductor wafer t is supported on the wafer ring 11 in a state in which the electrode forming surface faces upward. The transfer nozzle 44 of the transfer unit 40 that adsorbs and holds the semiconductor wafer t is required to deliver the semiconductor wafer t to the mounting portion 50 with the electrode forming surface facing upward, but due to the transfer Nozzle 44 is a semiconductor crystal The electrode forming surface of the sheet t is adsorbed and held, and therefore, the semiconductor wafer t cannot be directly delivered to the mounting tool 56 of the mounting portion 50.

When the application surface is joined upward, the reversing mechanism 43 of the transfer unit 40 is unnecessary. Instead of this, the transfer nozzle 44 is provided as an XY moving mechanism that can move in the XY direction, and the transfer is performed. The nozzle 44 is configured to be movable between the take-out position and the delivery platform. The delivery platform is provided separately for the left and right transfer units 40A and 40B. In the case of a combination device in which the face-up engagement and the face-down engagement are applied, it is assumed that the reversing mechanism 43 of the transfer unit 40 is maintained and the delivery platform is provided and the transfer nozzle 44 is enabled in the XY. The composition of the XY moving mechanism that moves in the direction. When the face-down bonding is performed, the semiconductor wafer t is mounted by the same operation as the embodiment without using the landing platform.

In the case of face-up bonding, after the semiconductor wafer t is taken out by the transfer nozzle 44, the transfer nozzle 44 is not reversed by the reversing mechanism 43 and is moved by the XY moving mechanism. The transfer nozzle 44 is moved to the delivery platform. The semiconductor wafer t is placed on the delivery platform by the moving transfer nozzle 44. Thereafter, the mounting tool 56 of the mounting portion 50 is moved to the delivery platform, and the semiconductor wafer t on the delivery platform is adsorbed and held. Since the semiconductor wafer t is placed on the delivery platform with the electrode formation surface facing upward, the mounting tool 56 of the attachment portion 50 adsorbs the upper surface (electrode formation surface) of the semiconductor wafer t. And mounting the lower surface of the semiconductor wafer t (the surface opposite to the surface on which the electrode is formed) on the support substrate W surface. The specific mounting process of the semiconductor wafer t is the same as that of the above embodiment.

[Examples]

Next, an embodiment of the present invention and evaluation results thereof will be described.

(Example 1)

With the mounting device 1 of the above-described embodiment, the mounting of the semiconductor wafer was actually performed on the support substrate by the following conditions. In FIG. 13, a state in which the semiconductor wafer t is mounted on the support substrate W is shown. In addition, the target mounting accuracy is set to within ±5 μm, and the target tact time is set to within 0.6 seconds.

<Installation conditions>

‧Semiconductor wafer t size: 4mm × 4mm

‧Installation pitch (vertical × horizontal): 36mm × 36mm

‧Installation quantity (vertical × horizontal): 5 × 5 (total 25)

As shown in FIG. 13, the upper left is used as the starting point, and the odd-numbered semiconductor wafers t are mounted by the mounting portion 50A on the left side in the order of the numbers attached to the semiconductor wafer t, and will be mounted. An even number of semiconductor wafers t are mounted by the mounting portion 50B on the right side, and are mounted interactively. The elapsed time from the time when the first semiconductor wafer t is taken out from the component supply unit 10 until the last (25th) semiconductor wafer t is completed is 14.5 seconds. So this In general, the mounting position of the semiconductor wafer t mounted on the support substrate W was measured using an inspection device. The results are shown in Table 1. In Table 1, the mounting area number corresponds to the number of the semiconductor wafer t of FIG. The ○ mark in the column of the installation head is used to represent the mounting head used in the installation. For example, at the installation area number "1", the installation is performed using the mounting head 55 on the left side. The column of the positional shift represents the positional shift amount of the semiconductor wafer t in the X direction and the Y direction at each mounting region. Further, the unit is micrometer [μm].

As shown in Table 1, the maximum value of the positional shift of the semiconductor wafer t in the X direction is 3.0 μm at the position of the mounting area number 15, and the minimum value is at the position of the mounting area number 10. -1.8μm. Further, the maximum value of the positional shift in the Y direction is 2.0 μm at the position of the mounting area number 7, and the minimum value is -0.8 μm at the position of the mounting area number 19. It was confirmed that the mounting accuracy of the 25 semiconductor wafers t was within ±5 μm of the target. The time required for the mounting was 14.5 seconds, so the time required for mounting one semiconductor wafer t was 14.5 seconds / 25 = 0.58 seconds. Therefore, the beat time is 0.58 seconds, and the target can be achieved within 0.6 seconds. In addition, the time required for the mounting is the first to receive the first adsorption nozzle 44 from the left transfer unit 40A that has been picked up by the component supply unit 10 from the first semiconductor wafer t. The mounting tool 56 of the mounting portion 50A on the left side of the semiconductor wafer t moves to the position immediately above the mounting position and starts to descend, until "the mounting tool 56 of the mounting portion 50A on the left side will be the last (25th) The time until the semiconductor wafer t is mounted on the support substrate W and continues to rise to the original height to complete the operation. By dividing this time by the number (25) of semiconductor wafers mounted during this period, it is possible to extract the tact time.

(Comparative Example 1)

The semiconductor crystal was subjected to the same conditions as in Example 1 except that the movement correction data of the stage on which the support substrate W was placed was not used. The sheet t is mounted on the support substrate W. The mounting position of the semiconductor wafer t mounted on the support substrate W was measured using an inspection device. The results are shown in Table 2.

As shown in Table 2, the maximum value of the positional shift of the semiconductor wafer t in the X direction is 19.5 μm at the position of the mounting area number 21, and the minimum value is at the position of the mounting area number 10. -24.4μm. Further, the maximum value of the positional shift in the Y direction is 11.8 μm at the position of the mounting area number 3, and the minimum value is -11.7 μm at the position of the mounting area number 16. Therefore, it was confirmed that the mounting accuracy of the semiconductor wafer t was not within ±5 μm of the target. In addition, the time required for mounting one semiconductor wafer t was 0.58 seconds, which was the same as in the first embodiment.

(Example 2)

With the mounting device 1 of the above-described embodiment, the mounting of the semiconductor wafer was actually performed on the support substrate by the following conditions. In addition, the target mounting accuracy is set to within ±5 μm.

<Installation conditions>

‧Semiconductor wafer t size: 4mm × 4mm

‧Installation quantity (vertical × horizontal): 20 × 20 (total 400)

‧Installation pitch (vertical and horizontal): 6mm

In the same manner as in the first embodiment, the upper left mounting region is used as the starting point, and the odd-numbered semiconductor wafers t are mounted by the left mounting portion 50A in the order of the number of the semiconductor wafer t, and the even number is added. The semiconductor wafers t are mounted by the mounting portion 50B on the right side and are alternately mounted. So in this way, from mounting on the support substrate 48 semiconductor wafers t were taken out from 400 semiconductor wafers t at W, and the mounting position offsets were measured using an inspection device. The results are shown in Table 3 in the same manner as in Example 1.

(Example 3)

With the mounting device 1 of the above-described embodiment, the mounting of the semiconductor wafer was actually performed on the support substrate by the following conditions. In addition, the target mounting accuracy is set to within ±5 μm.

<Installation conditions>

‧Semiconductor wafer t size: 1mm × 1mm

‧Installation quantity (vertical × horizontal): 40 × 51 (total 2040)

‧Installation pitch (vertical and horizontal): 3mm

In the same manner as in the first embodiment, the upper left mounting region is used as the starting point, and the odd-numbered semiconductor wafers t are mounted by the left mounting portion 50A in the order of the number of the semiconductor wafer t, and the even number is added. The semiconductor wafers t are mounted by the mounting portion 50B on the right side and are alternately mounted. In this manner, 48 semiconductor wafers t were taken out from 2040 semiconductor wafers t mounted on the support substrate W, and the mounting positional deviations were measured using an inspection apparatus. The results are shown in Table 4 in the same manner as in Example 1.

(Example 4)

With the mounting device 1 of the above-described embodiment, the first semiconductor wafer and the second semiconductor wafer are actually mounted on the respective mounting regions of the support substrate by the following conditions. In addition, the target mounting accuracy is set to within ±5 μm.

<Installation conditions>

‧ Size of the first semiconductor wafer t: 4mm × 4mm

‧ Size of the second semiconductor wafer t: 1mm × 1mm

‧ The number of installations of the first semiconductor wafer t (vertical × horizontal): 5 × 5 (total 25)

‧The number of installations of the second semiconductor wafer t (vertical × horizontal): 5 × 5 (total 25)

‧Installation pitch of the first semiconductor wafer (vertical and horizontal): 36mm

‧ Interval between the first semiconductor wafer and the second semiconductor wafer: 0.5 mm

In the same manner as in the first embodiment, the upper left mounting region is used as the starting point, and the odd-numbered semiconductor wafers t are carried out by the left mounting portion 50A in the order of the number of the first semiconductor wafer (wafer A) t. The mounting and the even number of semiconductor wafers t are mounted by the mounting portion 50B on the right side, and are alternately mounted. Next, in the order of the number of the second semiconductor wafer (wafer B) t, the odd-numbered semiconductor wafers t are mounted by the mounting portion 50A on the left side, and The even-numbered semiconductor wafers t are mounted by the mounting portion 50B on the right side and are alternately mounted. In this manner, the mounting position of the total of 50 (first semiconductor wafer: 25, second semiconductor wafer: 25) mounted on the support substrate W was measured using an inspection device. The mounting position shift is measured for the respective positional shifts of the first and second semiconductor wafers (wafers A, B) and the relative positions of the first and second semiconductor wafers (wafers A, B). The results of these are shown in Table 5.

In the above-described embodiment, the support substrate W is not provided with a mark for position detection in each of the mounting regions, and is removed during the manufacturing process of the package component. It is explained, but it is not limited to this. According to the mounting apparatus and the mounting method of the embodiment, it is a matter of course that, for example, there is a mark for position detection in each of the mounting regions, and the substrate is used as a part of the package component. It is also possible to mount a semiconductor wafer (electronic component) with good precision and good efficiency without relying on the mark for position detection.

In addition, although the embodiments of the present invention have been described, the embodiments are not intended to limit the scope of the present invention. The present invention may be embodied in various other forms, and various omissions, substitutions and changes may be made without departing from the scope of the invention. The invention or its modifications are intended to be included within the scope of the invention and the scope of the invention.

1‧‧‧Installation device

10‧‧‧Parts Supply Department

11‧‧‧ wafer ring

12‧‧‧ wafer ring holder

13‧‧‧1st camera

20‧‧‧ Platform Department

21‧‧‧ platform

22‧‧‧2nd camera

30‧‧‧Substrate transport department

31‧‧‧ moving into the conveyor belt

33‧‧‧1st submission

33a, 33b‧‧‧ movable department

35‧‧‧Guidance

40, 40A, 40B‧‧‧Transportation Department

41‧‧‧ lifting device

42‧‧‧Body

43‧‧‧Reversal mechanism

45‧‧‧Rotary motor

46‧‧‧Rotary drive department

47‧‧‧Reverse arm

50, 50A, 50B‧‧‧ Installation Department

51‧‧‧Support box

52‧‧‧X direction moving block

52a‧‧‧X direction guiding member

53‧‧‧Y direction mobile device

53a‧‧‧Y direction guiding member

54‧‧‧ movable body

55‧‧‧Installation head

W‧‧‧Support substrate

Claims (11)

An apparatus for mounting an electronic component, comprising: a platform portion having a platform on which a support substrate having a plurality of mounting regions for mounting electronic components is mounted, and a plurality of mounting regions a platform moving mechanism for moving the platform in a manner of being positioned at a predetermined mounting position; and a mounting portion having first and second portions respectively holding the electronic component and being mounted on the mounting area of the support substrate a mounting head and a mounting head moving mechanism that alternately moves the first and second mounting heads holding the electronic component to the mounting position; and the first identifying unit is configured to be placed on the platform The entire position of the support substrate is recognized; and the second identification unit recognizes the position of the electronic component held by the first or second mounting head; and the memory unit is stored by the platform moving mechanism. Correction data for correcting the movement position error of the platform; and the control unit based on the aforementioned branch identified by the first identification unit Position information by the position of the substrate and the second identification unit identified in the electronic part and the correction data information to the mobile platform and to the first and second mounting heads for the control. The mounting device according to the first aspect of the invention, wherein the mounting portion mounts the plurality of electronic components in the mounting region of one of the support substrates. The mounting device according to the first or second aspect of the invention, wherein the third identification unit further includes a position of the first and second mounting heads positioned at the mounting position. The control unit is configured to identify the position between the first mounting head and the second mounting head based on the position data of the first and second mounting heads recognized by the third identifying unit. The position offset is corrected. The mounting device according to the third aspect of the invention, wherein the control unit performs the positional data of the first and second mounting heads caused by the third identifying unit based on a preset timing. Identification. The mounting device according to any one of claims 1 to 4, further comprising: a component supply unit that supplies the electronic component; and a transfer unit that is provided separately from the component The supply unit receives the electronic component and delivers the electronic component to the first and second transfer nozzles at the first or second mounting head, and the first and second mounting heads are from the first and second 2 The transfer position of the aforementioned electronic component caused by the transfer nozzle is moved to the aforementioned mounting position, and is moved by a certain path. The mounting device according to the fifth aspect of the invention, wherein the second identification unit is provided in the first and the first 2 A pair of cameras on the moving path of the mounting head. A method of mounting an electronic component, comprising: obtaining a movement position error of a platform on which a support substrate having a plurality of mounting regions for mounting an electronic component is mounted, and causing the memory portion to memorize the movement a project for correcting the correction of the position error; and mounting the support substrate on the platform and identifying the entire position of the support substrate placed on the platform; and Supporting the position data of the support substrate obtained by the position recognition project of the substrate and the correction data to correct the movement of the platform, and the plurality of mounting regions are sequentially positioned at a certain mounting position, so that the foregoing a project of moving the platform; and receiving the electronic component by the first and second mounting heads, and identifying the position of the electronic component held at the first or second mounting head, and based on Correcting the positional data of the aforementioned electronic component to correct the movement of the first and second mounting heads The first and second mounting heads are alternately moved to the mounting position, and the electronic components are alternately mounted to the aforementioned mounting position by the first and second mounting heads. Works at the installation area. The mounting method according to claim 7, wherein the mounting process includes a process of mounting a plurality of the electronic components in the mounting area of one of the support substrates. If the installer is listed in item 7 or item 8 of the patent application scope Further, the method further includes: recognizing the positions of the first and second mounting heads positioned at the mounting position, and identifying the positions of the first and second mounting heads based on the identification The data is used to correct the positional deviation between the first mounting head and the second mounting head. A mounting method of a package component, characterized in that: a project for mounting an electronic component on each of the plurality of mounting regions at a support substrate having a plurality of mounting regions; and by being mounted on The foregoing electronic components at the plurality of mounting regions are sealed in batches to form a pseudo-wafer-like project; and a process of manufacturing a packaged component by forming a rewiring layer on the aforementioned electronic components of the pseudo-wafer, The mounting process of the electronic component includes: obtaining a movement position error of a platform on which the support substrate is placed, and causing the memory unit to memorize the correction data for correcting the movement position error; and mounting the support substrate And the above-mentioned platform, and the identification of the entire position of the support substrate placed on the platform; and the position information of the support substrate obtained by the position recognition process by the support substrate and the foregoing Correcting the data to correct the movement of the aforementioned platform while sequentially positioning the plurality of installation areas The mounting position of a certain way, to make the movement of the platform projects; and Receiving the electronic component by the first and second mounting heads, and identifying the position of the electronic component held at the first or second mounting head, and based on the identified electronic component The position data is used to correct the movement of the first and second mounting heads, and the first and second mounting heads are alternately moved to the mounting position, and the first and second mounting heads are used to The electronic components are interactively mounted to a project that is sequentially positioned at the aforementioned mounting area at the aforementioned mounting location. The method of manufacturing a packaged component according to claim 10, wherein the mounting of the electronic component includes a process of mounting a plurality of the electronic components in the mounting region of one of the support substrates.