JP7410826B2 - Pin misalignment measuring device and die feeding device - Google Patents

Description

This specification discloses a pin misalignment measuring device and a die feeding device.

Conventionally, in pellet separation devices that push up dies (pellets) on diced wafers using pins (needles) to separate them from sheets (tape), there are known ones that correct the pin push-up position (for example, patented pellets). (See Reference 1). This separation device images the cutting line on the diced wafer with a camera, recognizes the position of the cutting line, measures the wafer misalignment between the camera and the wafer based on the position information, and then Align with the predetermined position. Thereafter, the separation device measures the amount of offset between the camera and the pin by aligning the reticle in the field image installed on the camera with the predetermined position of the pin. Then, the separating device transmits information on the measured amount of deviation to the automatic offset means, and the automatic offset means moves the stage holding the wafer by the same amount as the amount of deviation, thereby aligning the die and the pins.

Japanese Unexamined Patent Publication No. 8-124994

However, the above-mentioned apparatus measures the positional deviation between the camera and the wafer, and then measures the positional deviation between the camera and the pins to align the die and the pins, and measurement errors may accumulate. Therefore, there is a possibility that the pin position deviation cannot be measured and corrected with sufficient accuracy.

The present disclosure mainly focuses on measuring the positional deviation of pins with good accuracy in a device that peels off and supplies dies by pushing up pins from the back side of a sheet attached to a wafer divided into a plurality of dies. purpose.

The present disclosure has taken the following measures to achieve the above-mentioned main objective.

The pin position deviation measuring device of the present disclosure includes:
A die supply device that peels and supplies dies from a sheet attached to a wafer divided into a plurality of dies includes a pot having a holding surface capable of holding the sheet on the upper surface, and a pot that holds the wafer and the pot horizontally. a moving device that relatively moves the pin in the direction, a pin housed in the pot, and an elevating device that raises and lowers the pin so that it appears and disappears from the holding surface of the pot, and the holding surface of the pot is placed on the back surface of the sheet. A pin position deviation measuring device used in a die supply device that peels the die from the sheet by bringing the pin into contact with the sheet and pushing the pin up from the back side of the sheet, and measuring the position deviation of the pin,
a transparent wafer jig with a recognition pattern attached thereto for recognizing the position of the die;
an imaging device that images the wafer jig placed in the die supply device from above;
a measurement unit that measures an amount of positional deviation of the pin based on the recognition pattern by the imaging device and a captured image of the pin taken through the wafer jig;
The purpose is to have the following.

The pin position deviation measurement device of the present disclosure includes a transparent wafer jig with a recognition pattern attached thereto for recognizing the position of a die, and an imaging device that images the wafer jig placed in a die supply device from above. and a measurement unit that measures the amount of positional deviation of the pin. The measurement unit measures the amount of positional deviation of the pin based on a recognition pattern by the imaging device and a captured image of the pin taken through the wafer jig. By using a transparent jig as the wafer jig, it is possible to simultaneously image both the recognition pattern attached to the wafer jig and the pins located on the back side of the wafer jig using the imaging device. This allows measurement errors to accumulate compared to a method in which the wafer is imaged with a camera and the positional deviation between the camera and the wafer is measured, and then the pin is imaged with the camera and the positional deviation between the camera and the pin is measured. Therefore, pin positional deviation can be measured with good accuracy.

The die supply device of the present disclosure includes:
A die supply device that peels and supplies dies from a sheet attached to a wafer divided into a plurality of dies includes a pot having a holding surface capable of holding the sheet on the upper surface, and a pot that holds the wafer and the pot horizontally. a moving device that relatively moves the pin in the direction, a pin housed in the pot, and an elevating device that raises and lowers the pin so that it appears and disappears from the holding surface of the pot, and the holding surface of the pot is placed on the back surface of the sheet. A die supply device that peels the die from the sheet by bringing the die into contact with the sheet and pushing the pin up from the back side of the sheet,
a transparent wafer jig with a recognition pattern attached thereto for recognizing the position of the die;
an imaging device that images the wafer jig placed in the die supply device from above;
a measurement unit that measures an amount of positional deviation of the pin based on the recognition pattern by the imaging device and a captured image of the pin taken through the wafer jig;
The purpose is to have the following.

The die supply device of the present disclosure includes a wafer jig, an imaging device, and a measuring section similar to the pin positional deviation measurement device of the present disclosure described above. Therefore, similarly to the positional deviation measuring device of the present disclosure, the positional deviation of the pin can be measured with good accuracy.

1 is a schematic configuration diagram of a mounting system including a component mounting machine. FIG. 2 is a schematic configuration diagram of a peeling device. It is a partial sectional view of a pot and a pin. FIG. 2 is a block diagram showing electrical connection relationships of the mounting system. 7 is a flowchart illustrating an example of pin position deviation determination processing. FIG. 2 is a schematic configuration diagram of a wafer jig. FIG. 2 is an explanatory diagram showing a captured image of a pot seen through a wafer jig. FIG. 3 is an explanatory diagram showing how the amount of positional deviation of a pin is measured. It is an explanatory view showing an example of the statistical value of the amount of positional deviation. 7 is a flowchart illustrating an example of a positional deviation correction value setting process.

Next, embodiments for implementing the present disclosure will be described with reference to the drawings.

FIG. 1 is a schematic configuration diagram of a mounting system including a component mounting machine. FIG. 2 is a schematic diagram of the peeling device. FIG. 3 is a partial cross-sectional view of the pot and pin. FIG. 4 is a block diagram showing the electrical connections of the mounting system. In FIG. 1, the left-right direction is the X-axis direction, the front-back direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

As shown in FIG. 1, the mounting system 10 is a system for mounting components onto a board B, and includes a plurality of component mounting machines 20 and a management device 90. The plurality of component mounting machines 20 are arranged and installed along the conveyance direction of the board B, thereby forming a mounting line. Note that the mounting system 10 actually includes a solder printing machine, an inspection machine, a reflow oven, etc. on the same mounting line as the plurality of component mounters 20.

The component mounting machine 20 includes a substrate transport device 21, a head 30, a head moving device 22, a parts camera 23, a mark camera 24, a tape supply device 25, a die supply device 40, and a control device 70. .

The head 30 is moved back and forth and left and right (XY axis directions) by the head moving device 22, picks up (adsorbs) components supplied from the tape supply device 25 and die supply device 40, and mounts the picked up components onto the board B. do. The head 30 includes a nozzle holder and a nozzle lifting device 32 that moves the nozzle holder up and down. For example, the head 30 is configured as a rotary head having a rotating body. The rotary head includes a plurality of nozzle holders arranged in the circumferential direction and supported by a rotating body so as to be able to move up and down (in the Z-axis direction), and a nozzle holder located at a predetermined turning position among the plurality of nozzle holders. a nozzle elevating device for elevating and lowering the nozzle. A suction nozzle 31 is detachably attached to the tip (lower end) of the nozzle holder. A suction port communicating with a negative pressure source is formed at the tip (lower end) of the suction nozzle 31 . The suction nozzle 31 can suction a component by bringing the suction port into contact with the surface of the component while the suction port is supplied with negative pressure from a negative pressure source. The nozzle lifting device 32 includes a slider that moves up and down (in the Z-axis direction) guided by a guide rail, a motor that drives the slider, and a position sensor that detects the up-and-down (in the Z-axis direction) position of the slider. . The slider of the nozzle lifting device 32 is installed above the nozzle holder and is connected to a motor via, for example, a ball screw mechanism. The nozzle raising/lowering device 32 raises and lowers the nozzle holder together with the suction nozzle 31 by raising and lowering a slider using a motor.

The substrate transport device 21 carries the substrate B into the machine, positions it within the machine, and carries it out of the machine. The substrate conveyance device 21 includes a pair of conveyor belts that are spaced apart from each other in the front and back of FIG. 1 and spanned in the left-right direction. Substrate B is conveyed by this conveyor belt.

The head moving device 22 includes a slider that moves forward and backward and left and right (in the XY axis direction) guided by a guide rail, a motor that drives the slider, and a position sensor that detects the position of the slider in the front and back and left and right (in the XY axis direction). Be prepared. A head 30 is fixed to the slider and is connected to a motor via, for example, a ball screw mechanism. The head moving device 22 moves the head 30 back and forth and left and right (XY axis directions) by driving a slider with a motor.

The parts camera 23 is installed between the substrate transport device 21 and the tape supply device 25. When the suction nozzle 31 that has suctioned a component passes above the parts camera 23 , the parts camera 23 images the component suctioned by the suction nozzle 31 from below, and outputs the image to the control device 70 .

The mark camera 24 is installed on the head moving device 22 (slider) so as to be movable in the XY-axis directions. The mark camera 24 captures an image from above of a positioning reference mark provided on the substrate B in order to confirm the position of the substrate B carried into the machine, and captures an image of the wafer W installed in the die supply device 40 or the wafer jig 100. is imaged from above, and these images are output to the control device 70.

The tape supply device 25 includes a reel wound with a tape containing a component, and supplies the component to a suction position of the head 30 (suction nozzle 31) by pulling out the tape from the reel.

The die supply device 40 is for peeling off the die D from the wafer sheet S to which the wafer W divided into a plurality of dies D is attached and delivering it to the head 30 (suction nozzle 31), and a wafer pallet 41, It includes a magazine 42 and a peeling device 50. As shown in FIG. 2, the wafer pallet 41 has an opening 41o, and a wafer sheet S having a wafer W attached thereto is fixed in a stretched state around the periphery of the opening 41o. A plurality of wafer pallets 41 are housed in a magazine 42, and are pulled out from the magazine 42 by a pallet pull-out device 44 (see FIG. 5) when the head 30 (suction nozzle 31) sucks the die D.

The pallet pull-out device 44 moves the wafer pallet 41 back and forth (in the Y-axis direction). The pallet pulling device 44 includes a Y-axis slider that moves back and forth guided by a Y-axis guide rail extending in the Y-axis direction, a motor that drives the Y-axis slider, and a Y-axis slider that moves forward and backward (in the Y-axis direction) of the Y-axis slider. A position sensor that detects a position.

As shown in FIG. 2, the peeling device 50 includes a pot 51, a pot moving device 60, a push-up pin 55, and a pin lifting device 59 (see FIG. 5). The pot 51 is installed below the wafer pallet 41 pulled out by the pallet pull-out device 44. As shown in FIG. 3, a suction surface 52 communicating with a negative pressure source (not shown) is formed on the upper surface of the pot 51, and the pot 51 uses the negative pressure supplied from the negative pressure source to absorb the wafer sheet. Suction and support S.

The pot moving device 60 includes an X-axis feeding device 61 that moves the pot 51 left and right (X-axis direction), and a Z-axis feeding device 65 that moves the pot 51 up and down (Z-axis direction). The X-axis feed device 61 includes an X-axis guide rail 62 extending in the X-axis direction, an X-axis slider 63 that moves left and right guided by the X-axis guide rail 62, and a motor 64 that drives the X-axis slider 63. , and a position sensor (not shown) that detects the left and right (X-axis direction) positions of the X-axis slider. The pot 51 and the wafer pallet 41 (wafer W) are moved back and forth and left and right (XY-axis direction) by a pot moving device 60 that moves the pot 51 in the X-axis direction and a pallet pull-out device 44 that moves the wafer pallet 41 in the Y-axis direction. Move relative to. The Z-axis feed device 65 includes a Z-axis guide rail 66 that is fixed to the X-axis slider 63 and extends in the Z-axis direction, a Z-axis slider 67 that is guided by the Z-axis guide rail 66 and moves up and down, and a Z-axis It includes a motor (not shown) that drives the slider 67 and a position sensor (not shown) that detects the vertical position (Z-axis direction) of the Z-axis slider 67. A pot 51 is fixed to the Z-axis slider 67, and the pot 51 moves up and down together with the Z-axis slider 67.

As shown in FIG. 3, the push-up pin 55 is installed inside the pot 51, and selects a die D to be picked up by the suction nozzle 31 from among the divided dice D of the wafer W attached to the wafer sheet S. This is to push up the sheet S from the back side. Although not shown, the pin lifting device 59 includes a Z-axis slider that moves up and down guided by a Z-axis guide rail extending in the Z-axis direction, a motor that drives the Z-axis slider, and a motor that moves the Z-axis slider up and down (Z a position sensor that detects the position in the axial direction). A pin support 56 that supports the base end of the push-up pin 55 is fixed to the Z-axis slider of the pin lifting device 59 . The peeling device 50 picks up (adsorbs) the pot 51 by raising the pot 51 using the Z-axis feed device 65 of the pot moving device 60 and pushing up the push-up pin 55 while the wafer sheet S is suction-supported by the suction surface 52. Only the die D can be pushed up and separated from the wafer sheet S.

As shown in FIG. 4, the control device 70 includes a CPU 71, a ROM 72, a storage device 73 such as an HDD or an SSD, a RAM 74, an input/output port, and the like. The control device 70 inputs detection signals from each position sensor of the head 30, head moving device 22, pallet pull-out device 44, and peeling device 50, and inputs image signals from the parts camera 23 and mark camera 24. . The control device 70 also outputs control signals to the substrate transport device 21, parts camera 23, mark camera 24, tape supply device 25, nozzle lifting device 32, pallet pulling device 44, pot moving device 60, pin lifting device 59, etc. do.

As shown in FIG. 4, the management device 90 includes a CPU 81, a ROM 82, a storage device 83 such as an HDD or an SSD, a RAM 84, an input/output port, and the like. An input device 85 such as a mouse and a keyboard, and a display device 86 are connected to the management device 90 . The management device 90 is communicably connected to the control device 70 of the component mounting machine 20, and transmits job information related to production instructions to the control device 70 and receives various information from the control device 70.

Next, a description will be given of an operation for supplying the die D by the die supplying device 40 to deliver the die D to the suction nozzle 31. The CPU 71 of the control device 70 first executes sheet suction control to cause the wafer sheet S to be suctioned onto the suction surface 52 of the pot 51 . The sheet adsorption control is performed by setting the center position of the die D to be adsorbed (target die) in the XY-axis direction to a target position (Xtag, Ytag), and moving the tip of the push-up pin 55 to the target position (Xtag, Ytag). This is done by controlling the pallet pulling device 44 and the pot moving device 60, and controlling the pin lifting device 59 so that the pot 51 is raised. Subsequently, the CPU 71 executes nozzle lowering control to lower the suction nozzle 31 and cause the target die to be attracted to the suction nozzle 31 . The nozzle lowering control is performed by controlling the head moving device 22 so that the center position of the target die matches the tip of the suction nozzle 31 in the XY-axis directions, and controlling the nozzle lifting device 32 so that the suction nozzle 31 descends. It is done. Next, the CPU 71 executes pin push-up control to control the pin lifting device 59 so that the push-up pin 55 is pushed up. As a result, the target die is pushed up from the back side by the push-up pin 55. The suction nozzle 31 is controlled by the nozzle lifting device 32 to rise in synchronization with the pushing up of the push-up pin 55. Note that the suction nozzle 31 is configured to be able to move up and down with respect to the nozzle holder, and to be biased downward by the biasing force of a spring, so as to rise (stroke) in synchronization with the pushing up of the push-up pin 55. It's okay. Then, the CPU 71 waits for a predetermined period of time to elapse and then executes nozzle raising control that controls the nozzle lifting device 32 to raise the suction nozzle 31. Thereby, the target die is sucked by the suction nozzle 31 and taken out from the wafer W.

Here, when pushing up the push-up pin 55, if the push-up pin 55 is misaligned with respect to the target die, the die D cannot be normally peeled off from the wafer sheet S, and there is a possibility that a suction error may occur. Therefore, in this embodiment, the amount of displacement of the push-up pins 55 is measured in advance using a wafer jig 100, which will be described later, and it is determined whether the push-up accuracy of the push-up pins 55 is good or not based on the measured amount of displacement. are doing. Here, in this embodiment, the wafer jig 100, the mark camera 24, and the control device 70 correspond to a pin positional deviation measuring device.

FIG. 5 is a flowchart illustrating an example of a pin position deviation determination process executed by the CPU 71 of the control device 70. The positional deviation determination process is performed with the wafer jig 100 installed on the wafer pallet 41 of the die supply device 40 instead of the normal wafer W. The wafer jig 100 is a plate member made of a transparent material and formed to have approximately the same external shape as the wafer W, and has lattice-like lines (lattice lines) 101 as shown in FIG. One frame (square) in the grid line 101 corresponds to the outer shape of the die D. Further, since the wafer jig 100 is made of a transparent material, the push-up pins 55 can be visually recognized from above through the wafer jig 100, as shown in FIG.

When the pin position deviation determination process is executed, the CPU 71 first initializes the number of measurements N to the value 1 (step S100). Subsequently, the CPU 71 sets a target position in the XY axis direction at the center of one square (object frame) of the grid line 101 in the wafer jig 100 (step S110). Next, the CPU 71 controls the pallet pull-out device 44 and the pot moving device 60 so that the tip of the push-up pin 55 moves to the set target position (step S120). Then, the CPU 71 controls the pin lifting device 59 so that the push-up pin 55 is pushed up from the target position (step S130). In this embodiment, this process controls the pin lifting device 59 so that the push-up pin 55 is pushed up with the back surface of the wafer jig 100 and the suction surface 52 of the pot 51 separated by the amount of push-up of the push-up pin 55. It is done by doing.

Next, the CPU 71 controls the head moving device 22 so that the mark camera 24 moves above the wafer jig 100, and controls the mark camera 24 so that the wafer jig 100 is imaged (step S140). After capturing an image of the wafer jig 100, the CPU 71 processes the captured image, recognizes the target frame from the captured image, and calculates the center position (x0, y0) of the target frame (step S150). The center position (x0, y0) is the intersection of the diagonals of the target frame, and is the ideal position (target position) of the push-up pin 55 when pushing the push-up pin 55 up against the die D. Subsequently, the CPU 71 recognizes the push-up pin 55 seen through the wafer jig 100 from the captured image, and calculates the pin position (xp, yp) that is the position of the push-up pin 55 (step S160). Then, as shown in FIG. 8, the CPU 71 determines the amount of pin position deviation (ΔX, ΔY) based on the difference between the center position (x0, y0) and the pin position (xp, yp) in each of the X-axis direction and the Y-axis direction. is calculated (step S170), and the calculated pin position deviation amount (ΔX, ΔY) is stored in the storage device 73 (step S180). Here, one frame (square) of the grid line 101 formed on the wafer jig 100 corresponds to the outer shape of the die D. Further, in the captured image of the transparent wafer jig 100, the push-up pins 55 are visible through the wafer jig 100. Therefore, by moving the push-up pin 55 to the target position with the center of one frame (object frame) of the wafer jig 100 as the target position and pushing up the push-up pin 55, the wafer jig 100 is imaged from above. , the target frame corresponding to the outer shape of the die D and the push-up pin 55 can be imaged at the same time. Then, by taking the difference between the center position (x0, y0) of the target frame specified from the captured image and the pin position (xp, yp), the position of the push-up pin 55 in the XY axis direction with respect to the target frame, that is, the die D is determined. The amount of deviation can be measured.

After measuring the positional deviation of the push-up pin 55 in this manner, the CPU 71 determines whether the measured number N has reached a predetermined number (for example, 50 or 100) (step S190). If the CPU 71 determines that the number of measurements N has not reached the predetermined value, it increments the number of measurements N by the value 1 (step S200), returns to step S100, and repeats the measurement of the positional deviation of the push-up pin 55. On the other hand, when the CPU 71 determines that the number of measurements N has reached the predetermined number, the CPU 71 calculates the statistical values of the pin position deviation amounts (ΔX, ΔY) calculated so far and stores them in the storage device 73 (step S210). In this embodiment, this process is performed by calculating the average value, standard deviation (for example, 3σ), maximum value, minimum value, etc. as statistical values, as shown in FIG. After calculating the statistical value, the CPU 71 determines whether the calculated statistical value is within a predetermined appropriate range (step S220). If the CPU 71 determines that the statistical value is within the appropriate range, the CPU 71 determines that the displacement of the push-up pin 55 is small and that the push-up accuracy of the push-up pin 55 is appropriate (step S230). On the other hand, if the CPU 71 determines that the statistical value is not within the appropriate range, the CPU 71 determines that the positional deviation of the push-up pin 55 is large and that the push-up accuracy of the push-up pin 55 is inappropriate (step S240). Then, the CPU 71 notifies the determination result (step S230), and ends the pin position deviation determination process. This process is performed, for example, by transmitting the determination result to the management device 80 and displaying the received determination result by the CPU 81 of the management device 80 on the display device 86. Note that when the peeling device 50 includes a plurality of types of pots depending on the types of wafers W, the CPU 71 measures the amount of positional deviation of the push-up pins 55 for each pot, and determines whether the push-up accuracy of the push-up pins 55 is good or bad. You can do it like this. In addition, a plurality of types of wafer jigs 100 are prepared according to the types of wafers W, and the amount of positional deviation of the push-up pins 55 is measured for each wafer jig 100 to determine whether the push-up accuracy of the push-up pins 55 is good or bad. You may also do so.

Next, a process for setting a correction value for correcting the positional deviation of the push-up pin 55 will be described. FIG. 10 is a flowchart illustrating an example of positional deviation correction value setting processing. When the positional deviation correction value setting process is executed, the CPU 71 first reads the average value (ΔXave, ΔYave) of the positional deviation amount calculated in step S210 of the pin positional deviation measurement process from the storage device 73 (step S300). Subsequently, the CPU 71 sets positional deviation correction values (Xc, Yc) based on the read average values (ΔXave, ΔYave) (step S310). In this embodiment, this process may be performed by reversing the sign of the average value (ΔXave, ΔYave) and setting it as the positional deviation correction value (Xc, Yc), or by setting the average value (ΔXave, ΔYave) The positional deviation correction value (Xc, Yc) may be set by inverting the positive and negative signs of and then multiplying by a predetermined coefficient. Then, the CPU 71 registers the set positional deviation correction value (Xc, Yx) in the storage device 73 (step S320), and ends the positional deviation correction value setting process. The positional deviation correction value (Xc, Yx) is obtained by offsetting the target position (Xtag, Ytag) of the push-up pin 55 in the XY axis direction by the positional deviation correction value (Xc, Yx) in the die feeding operation described above. It becomes possible to position the push-up pin 55 more accurately at the center position of the die D. As a result, the die D can be stably separated from the wafer sheet S, and the occurrence of suction failures can be suppressed.

Here, the correspondence between the main elements of this embodiment and the main elements of the invention described in the section of the disclosure of the invention will be explained. That is, the die D of this embodiment corresponds to a "die," the wafer sheet S corresponds to a "sheet," the pot moving device 60 and the pallet pulling device 44 correspond to a "moving device," and the pin lifting device 59 corresponds to a "moving device." corresponds to the "elevating device", the die supply device 40 corresponds to the "die supply device", the grid line 101 corresponds to the "recognition pattern", the wafer jig 100 corresponds to the "wafer jig", and the mark The camera 24 corresponds to an "imaging device," and the CPU 71 of the control device 70, which executes steps S100 to S180 of the pin position deviation determination process, corresponds to a "measuring unit." Further, the CPU 71 of the control device 70 that executes steps S190 to S200 of the pin position deviation determination process corresponds to the "determination unit". Further, the CPU 71 of the control device 70 that executes the positional deviation correction value setting process corresponds to a "setting section".

It goes without saying that the present invention is not limited to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of the present invention.

For example, in the embodiment described above, the wafer jig 100 is provided with the grid lines 101 corresponding to the outer shape of the die D. However, the wafer jig 100 may have any recognition pattern, such as a grid-like dot, as long as the position of the die D (ideal position of the push-up pin 55 with respect to the die D) can be recognized with a camera. good.

In the embodiment described above, the mark camera 24 captures an image of the wafer jig 100, and the positional deviation of the push-up pins 55 is measured based on the captured image. However, the camera that images the wafer jig 100 is not limited to the mark camera 24 included in the component mounting machine 20, and for example, a camera included in the wafer supply device 40 may be used.

In the embodiment described above, the pot moving device 60 is configured to move the pot 51 in the X-axis direction so that the pot 51 and the wafer W move relative to each other in the XY-axis direction (horizontal direction), and the pallet pull-out device 44 is configured to move the pot 51 in the X-axis direction (horizontal direction), and the pallet pull-out device 44 The pallet 41 is configured to move in the Y-axis direction. However, the pot moving device may be configured to move the pot 51 in the XY axis direction (horizontal direction). Alternatively, the pallet pull-out device may be configured to move the wafer pallet 41 in the XY axis directions (horizontal direction).

In the embodiment described above, the control device 70 (CPU 71) of the component mounting machine 20 determines the positional deviation of the push-up pin 55 and sets the positional deviation correction value. However, the determination of the positional deviation of the push-up pin 55 and the setting of the positional deviation correction value may be performed by the control device of the die supply device 40, or may be performed by the management device 80.

As described above, the pin positional deviation measurement device of the present disclosure is provided in a die supply device that peels and supplies a die from a sheet attached to a wafer divided into a plurality of dies. A pot having a holding surface that can be held, a moving device that moves the wafer and the pot relative to each other in a horizontal direction, a pin housed in the pot, and an elevating device that moves the pin up and down so that it appears and disappears from the holding surface of the pot. and a device for peeling the die from the sheet by bringing the holding surface of the pot into contact with the back surface of the sheet and pushing up the pin from the back side of the sheet, A pin positional deviation measurement device for measuring positional deviation, comprising: a transparent wafer jig having a recognition pattern for recognizing the position of the die; and the wafer jig placed in the die supply device. The present invention further comprises: an imaging device that captures an image from above; and a measurement unit that measures the amount of positional deviation of the pin based on the recognition pattern by the imaging device and the captured image of the pin taken through the wafer jig. shall be.

The pin position deviation measurement device of the present disclosure includes a transparent wafer jig with a recognition pattern attached thereto for recognizing the position of a die, and an imaging device that images the wafer jig placed in a die supply device from above. and a measurement unit that measures the amount of positional deviation of the pin. The measurement unit measures the amount of positional deviation of the pin based on a recognition pattern by the imaging device and a captured image of the pin taken through the wafer jig. By using a transparent jig as the wafer jig, it is possible to simultaneously image both the recognition pattern attached to the wafer jig and the pins located on the back side of the wafer jig using the imaging device. This allows measurement errors to accumulate compared to a method in which the wafer is imaged with a camera and the positional deviation between the camera and the wafer is measured, and then the pin is imaged with the camera and the positional deviation between the camera and the pin is measured. Therefore, pin positional deviation can be measured with good accuracy.

In such a pin position deviation measuring device of the present disclosure, the measuring unit is configured to detect a difference between an ideal position of the pin specified from the image of the recognition pattern and an actual position of the pin specified from the image of the pin. The amount of positional deviation of the pin may be measured based on. In this way, the amount of positional deviation of the pin can be determined by simple calculation.

Further, the pin positional deviation measuring device of the present disclosure may include a determining unit that determines whether the pin thrusting accuracy is good or bad based on the amount of positional deviation of the pin measured by the measuring unit. In this case, the measuring unit measures the amount of positional deviation of the pin multiple times, and the determining unit calculates the statistical value of the positional deviation amount of the pin measured multiple times by the measuring unit, and calculates the statistical value of the positional deviation amount of the pin measured multiple times by the measuring unit. The accuracy of pushing up the pin may be determined based on the above. In this way, it is possible to more accurately determine whether the pin thrusting accuracy is good or bad.

Furthermore, the pin positional deviation measuring device of the present disclosure includes a setting unit that sets a correction value for correcting the movement amount of the moving device based on the positional deviation amount of the pin measured by the measuring unit. Good too. In this way, it is possible to suppress the occurrence of defective die supply.

Note that the present disclosure is not limited to the form of a pin misalignment measurement device, but may be applied to a form of a die supply device.

INDUSTRIAL APPLICATION This invention can be utilized for the manufacturing industry of a component mounting machine and a die supply apparatus, etc.

10 mounting system, 20 component mounting machine, 21 board transport device, 22 head moving device, 23 parts camera, 24 mark camera, 25 tape supply device, 30 head, 31 suction nozzle, 32 nozzle lifting device, 40 die supply device, 41 Wafer pallet, 41o opening, 42 magazine, 44 pallet pull-out device, 50 peeling device, 51 pot, 52 suction surface, 55 push-up pin, 56 pin support, 59 pin lifting device, 60 pot moving device, 61 X-axis feeding device, 62 X-axis guide rail, 63 X-axis slider, 64 motor, 65 Z-axis feeder, 66 Z-axis guide rail, 67 Z-axis slider, 70 control device, 71 CPU, 72 ROM, 73 storage device, 74 RAM, 75 timer , 80 management device, 81 CPU, 82 ROM, 83 storage device, 84 RAM, 85 input device, 86 display device, 100 wafer jig, 101 line, B substrate, D die, W wafer, S wafer sheet.

Claims (6)

A die supply device that peels and supplies dies from a sheet attached to a wafer divided into a plurality of dies includes a pot having a holding surface capable of holding the sheet on the upper surface, and a pot that holds the wafer and the pot horizontally. a moving device that relatively moves the pin in the direction, a pin housed in the pot, and an elevating device that raises and lowers the pin so that it appears and disappears from the holding surface of the pot, and the holding surface of the pot is placed on the back surface of the sheet. A pin position deviation measuring device used in a die supply device that peels the die from the sheet by bringing the pin into contact with the sheet and pushing the pin up from the back side of the sheet, and measuring the position deviation of the pin,
a transparent wafer jig with a recognition pattern attached thereto for recognizing the position of the die;
an imaging device that images the wafer jig placed in the die supply device from above;
a measurement unit that measures an amount of positional deviation of the pin based on the recognition pattern by the imaging device and a captured image of the pin taken through the wafer jig;
A pin position deviation measuring device comprising: The pin positional deviation measuring device according to claim 1,
The measurement unit measures the amount of positional deviation of the pin based on the difference between the ideal position of the pin specified from the image of the recognition pattern and the actual position of the pin specified from the image of the pin. ,
Pin position deviation measuring device. The pin positional deviation measuring device according to claim 1 or 2,
comprising a determination unit that determines whether the pin thrust accuracy is good or bad based on the amount of positional deviation of the pin measured by the measurement unit;
Pin position deviation measuring device. The pin positional deviation measuring device according to claim 3,
The measurement unit measures the amount of positional deviation of the pin multiple times,
The determining unit calculates a statistical value of the amount of positional deviation of the pin measured multiple times by the measuring unit, and determines whether the pushing-up accuracy of the pin is good or bad based on the statistical value.
Pin position deviation measuring device. The pin positional deviation measuring device according to any one of claims 1 to 4,
a setting unit configured to set a correction value for correcting the movement amount of the moving device based on the positional deviation amount of the pin measured by the measurement unit;
Pin position deviation measuring device. A die supply device that peels and supplies dies from a sheet attached to a wafer divided into a plurality of dies includes a pot having a holding surface capable of holding the sheet on the upper surface, and a pot that holds the wafer and the pot horizontally. a moving device that relatively moves the pin in the direction, a pin housed in the pot, and an elevating device that raises and lowers the pin so that it appears and disappears from the holding surface of the pot, and the holding surface of the pot is placed on the back surface of the sheet. A die supply device that peels the die from the sheet by bringing the die into contact with the sheet and pushing the pin up from the back side of the sheet,
a transparent wafer jig with a recognition pattern attached thereto for recognizing the position of the die;
an imaging device that images the wafer jig placed in the die supply device from above;
a measurement unit that measures an amount of positional deviation of the pin based on the recognition pattern by the imaging device and a captured image of the pin taken through the wafer jig;
A die supply device comprising:

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