WO2015037081A1

WO2015037081A1 - Pickup apparatus

Info

Publication number: WO2015037081A1
Application number: PCT/JP2013/074535
Authority: WO
Inventors: 茂人大山; 伊藤　利也; 早川　昌志
Original assignee: 富士機械製造株式会社
Priority date: 2013-09-11
Filing date: 2013-09-11
Publication date: 2015-03-19
Also published as: JP6033965B2; JPWO2015037081A1

Abstract

A pickup apparatus (2) picks up a semiconductor chip (22) through which light can be transmitted. The pickup apparatus (2) is provided with: a thrust-up pin (4), which vertically extends below the semiconductor chip (22), and which is capable of thrusting up the semiconductor chip (22) upward; and a light emitting section (5) that is disposed at a position predetermined with respect to the thrust-up pin (4), said position being below the semiconductor chip (22). The pickup apparatus (2) is also provided with: an image pickup apparatus (6) that is capable of picking up, from above, an image of the semiconductor chip (22) through which light from the light emitting section (5) has been transmitted; and an arithmetic apparatus (8) that calculates a position of the thrust-up pin (4) with respect to the semiconductor chip (22) on the basis of a position of an image of the light emitted from the light emitting section (5), said image having been picked up by means of the image pickup apparatus (6).

Description

Pickup device

This specification relates to a pickup device that picks up a semiconductor chip.

In order to manufacture a semiconductor device, it is required to accurately pick up a semiconductor chip. Japanese Patent Application Laid-Open No. 2010-045296 discloses a device for picking up a semiconductor chip. The apparatus disclosed in Patent Document 1 includes a push-up pin that pushes the semiconductor chip upward, and a light emitting unit that is disposed below the semiconductor chip. In the apparatus of Patent Document 1, a dicing line around a semiconductor chip is illuminated by light from a light emitting unit.

In an apparatus for picking up a semiconductor chip, it is required to match the position of the semiconductor chip to be picked up with the position of the push-up pin. If the positions of the semiconductor chip and the push-up pin are shifted from each other, the semiconductor chip may tilt when the push-up pin pushes up the semiconductor chip. Alternatively, the push-up pin may not be able to push up the semiconductor chip. Therefore, it is required to recognize the positional relationship between the semiconductor chip and the push-up pin.

Therefore, an object of the present specification is to provide a pickup device that can accurately recognize the position of the push-up pin with respect to the semiconductor chip.

A pickup device disclosed in the present specification is a pickup device that picks up a semiconductor chip that can transmit light. The pickup device extends vertically below the semiconductor chip and can push the semiconductor chip upward. And a light emitting portion arranged at a predetermined position with respect to the push-up pin below. In addition, the pickup device is configured such that the position of the push-up pin with respect to the semiconductor chip is based on the imaging device capable of imaging from above the semiconductor chip through which light from the light emitting unit has been transmitted, and the position of the light image of the light emitting unit captured by the imaging device. And an arithmetic device for calculating

According to such a configuration, when the imaging device captures an image of the semiconductor chip from above, an image of the light of the light emitting unit that has passed through the semiconductor chip is captured. The light emitting unit is arranged at a predetermined position with respect to the push-up pin. Therefore, the calculation device can calculate the position of the push-up pin with respect to the semiconductor chip based on the position of the light image of the light emitting unit. The calculation method is not particularly limited. The calculation device can use a known method for calculating the position based on the image. Thereby, even when the push-up pin is located behind the semiconductor chip, the position of the push-up pin can be obtained using the light of the light emitting unit, and the position of the push-up pin with respect to the semiconductor chip can be accurately recognized.

In the above-described pickup device, it is preferable that the calculation device calculates the position of the push-up pin with respect to the semiconductor chip based on the position of the image of the semiconductor chip imaged by the imaging device and the position of the light image of the light emitting unit.

According to such a configuration, the position of the push-up pin with respect to the semiconductor chip can be accurately recognized even if the position of the imaging device with respect to the semiconductor chip is not constant.

The above-described pickup device may further include a moving device that relatively moves the semiconductor chip and the push-up pin based on the position calculated by the calculation device.

In the above-described pickup device, the light emitting unit may be arranged in a ring around the push-up pin.

The above-described pickup device may further include a pin holder that holds the push-up pin below the semiconductor chip. In this pickup device, the light emitting unit may be disposed on the pin holder.

In the above pickup apparatus, the push-up pin may be formed of a light transmissive material. In this pickup device, it is preferable that the light emitting portion is disposed below the push-up pin, and the push-up pin emits light by light from the light emitting portion.

In the above-described pickup device, the push-up pin may be formed with a light guide that extends in the vertical direction and guides light from the light emitting unit.

In the above pickup device, the push-up pin may be formed of a light-impermeable material. In this pickup device, it is preferable that the light emitting unit is disposed around the push-up pin.

The above-described pickup device may further include a positioning pin arranged at a predetermined position with respect to the push-up pin below the semiconductor chip. In this pickup device, the positioning pin may be formed of a light transmissive material. Moreover, the light emitting part is disposed below the positioning pin, and it is preferable that the positioning pin emits light by the light from the light emitting part.

It is a perspective view showing appearance of a pickup device concerning an embodiment. It is a perspective view of a semiconductor wafer. It is a perspective view of a pin holder. It is a top view of a pin holder. It is sectional drawing which shows the principal part of the pick-up apparatus which concerns on embodiment (1). It is sectional drawing which shows the principal part of the pick-up apparatus which concerns on embodiment (2). It is a figure which shows the image acquired by the imaging device. It is sectional drawing which shows the principal part of the pick-up apparatus which concerns on other embodiment. It is sectional drawing which shows the principal part of the pick-up apparatus which concerns on other embodiment. It is sectional drawing which shows the principal part of the pick-up apparatus which concerns on other embodiment. It is sectional drawing which shows the principal part of the pick-up apparatus which concerns on other embodiment. It is sectional drawing which shows the principal part of the pick-up apparatus which concerns on other embodiment.

Hereinafter, embodiments will be described with reference to the accompanying drawings. The pickup device according to the embodiment is a device for picking up a target semiconductor chip from a plurality of semiconductor chips. As shown in FIG. 1, the pickup device 2 includes a pin holder 3 disposed below the semiconductor wafer 21, and an imaging device 6 and a chip holder 7 disposed above the semiconductor wafer 21. The pickup device 2 includes a moving device 9 that moves the pin holder 3.

As shown in FIG. 2, the semiconductor wafer 21 is diced and cut into a plurality of semiconductor chips 22. The semiconductor wafer 21 is disposed on the dicing sheet 23. The semiconductor chip 22 is, for example, an IGBT or a MOSFET obtained by processing a semiconductor wafer 21 such as silicon. The semiconductor chip 22 is light transmissive, and light is transmitted from the lower surface side to the upper surface side of the semiconductor chip 22. It is preferable to reduce the thickness of the semiconductor chip 22 so that light passes through the semiconductor chip 22. Alternatively, it is also possible to use a glass wafer or a transparent wafer as the semiconductor wafer 21 so that light passes through the semiconductor chip 22. The plurality of semiconductor chips 22 are arranged on the dicing sheet 23 in an array when diced. The dicing sheet 23 is made of a thermoplastic resin such as PET. The dicing sheet 23 is supported by a support member (not shown) arranged around the dicing sheet 23. The dicing sheet 23 is light transmissive, and light is transmitted from the lower surface side to the upper surface side of the dicing sheet 23. The upper surface of the dicing sheet 23 has adhesiveness, and the semiconductor chip 22 is attached to the upper surface.

As shown in FIG. 3, the pin holder 3 is formed in a cylindrical shape, and a push-up pin 4 is accommodated therein. The pin holder 3 holds the push-up pin 4. As shown in FIGS. 4 and 5, a plurality of pin holes 41 are formed in the upper portion of the pin holder 3. The push-up pin 4 protrudes from the pin hole 41. In the present embodiment, the push-up pin 4 is arranged coaxially with the pin hole 41 at the center of the pin holder 3. The upper part of the pin holder 3 faces the semiconductor chip 22 to be picked up, and approaches the semiconductor chip 22 when picking up the semiconductor chip 22. A light emitting unit 5 is fixed to the upper peripheral edge of the pin holder 3.

The push-up pin 4 extends in the vertical direction (z direction) below the semiconductor chip 22. The push-up pin 4 is a generally bar-shaped member and extends toward the semiconductor chip 22. The push-up pin 4 is located below the semiconductor chip 22 to be picked up. The push-up pin 4 can be moved up and down and moved up and down by the operation of a driving device (not shown). As shown in FIG. 6, the push-up pin 4 pushes the semiconductor chip 22 to be picked up upward when raised. The semiconductor chip 22 to be picked up is pushed upward by the push-up pins 4 and peeled off from the dicing sheet 23. The push-up pins 4 press and lift the semiconductor chip 22 from the lower surface side. The push-up pin 4 is arranged coaxially with the pin hole 41 of the pin holder 3, and moves up and down through the pin hole 41. In this embodiment, one push-up pin 4 is used, but a plurality of push-up pins 4 may be used. When a plurality of push-up pins 4 are used, the push-up pins 4 are arranged coaxially in the plurality of pin holes 41, respectively.

The light emitting unit 5 is arranged in an annular shape around the push-up pin 4. The light emitting unit 5 is disposed below the semiconductor chip 22. A push-up pin 4 is disposed at the center of the annular light emitting unit 5. In plan view, the distance R between the push-up pin 4 and the light emitting unit 5 (the radius of the annular light emitting unit 5) is predetermined. Thus, the light emitting unit 5 is disposed at a predetermined position with respect to the push-up pin 4 below the semiconductor chip 22. The reference | standard of the position of the push-up pin 4 and the light emission part 5 is not specifically limited. For example, the distance between the center of the push-up pin 4 and the center of the light emitting unit 5 can be set in advance. Light emitted from the light emitting unit 5 is projected onto the semiconductor chip 22. The light from the light emitting unit 5 passes through the semiconductor chip 22 from the lower surface side to the upper surface side. In this embodiment, the light emission part 5 is comprised from several LED. A plurality of LEDs are arranged in an annular shape on the peripheral edge of the pin holder 3 to form an annular light emitting portion 5. When the plurality of LEDs arranged in an annular shape emit light, the light emitting portion 5 appears to emit light in an annular shape.

The imaging device 6 is configured to be able to image the semiconductor chip 22 from above. As the imaging device 6, for example, a known CCD camera can be used. The imaging device 6 captures the entire image of the semiconductor chip 22 to be picked up and acquires the image. The entire semiconductor chip 22 is within the imaging range of the imaging device 6. The semiconductor chip 22 is imaged in a state where light from the light emitting unit 5 is transmitted. In the image picked up by the image pickup device 6, an image of the semiconductor chip 22 and a light image of the light emitting unit 5 are projected. The imaging device 6 can move in the x, y, and z directions, respectively, and moves by the operation of a driving device (not shown). The imaging device 6 is disposed above the semiconductor chip 22 when imaging the semiconductor chip 22. Further, the imaging device 6 can be retracted from above the semiconductor chip 22 when the semiconductor chip 22 is not imaged.

Further, the pickup device 2 includes a calculation device 8 that calculates the position of the push-up pin 4 with respect to the semiconductor chip 22 based on the image picked up by the image pickup device 6. The calculation device 8 calculates the position of the push-up pin 4 with respect to the semiconductor chip 22 based on the position of the image of the semiconductor chip 22 imaged by the imaging device 6 and the position of the image of the light emitting unit 5. Specifically, for example, the arithmetic device 8 in the embodiment first calculates the position of the light emitting unit 5 with respect to the semiconductor chip 22 from the coordinates of the contour of the image of the semiconductor chip 22 and the coordinates of the contour of the image of the light emitting unit 5. Subsequently, the calculation device 8 calculates the position of the push-up pin 4 with respect to the semiconductor chip 22 based on a predetermined positional relationship between the light emitting unit 5 and the push-up pin 4. That is, since the position of the light emitting unit 5 with respect to the push-up pin 4 is determined in advance, when the position of the light-emitting unit 5 with respect to the semiconductor chip 22 is calculated, the position of the push-up pin 4 with respect to the semiconductor chip 22 is calculated from the calculation result. The The calculation method in the calculation device 8 is not particularly limited as long as the position of the push-up pin 4 with respect to the semiconductor chip 22 can be calculated. For example, the calculation may be performed using the coordinates of the vertices in the imaged semiconductor chip 22 or the coordinates of the center point in the image of the light emitting unit 5. Information on the calculation result by the calculation device 8 is sent to the moving device 9.

As shown in FIG. 1, the moving device 9 includes a base 91, an x-direction moving table 92 disposed on the base 91, and a y-direction moving table 93 disposed on the x-direction moving table 92. ing. An x-direction rail 911 extending in the x direction is fixed on the base 91. The x-direction rail 911 guides the x-direction moving table 92 in the x direction. A y-direction rail 921 extending in the y direction is fixed on the x-direction moving table 92. The y-direction rail 921 guides the y-direction moving table 93 in the y direction. The x-direction moving table 92 moves in the x direction along the x-direction rail 911 on the base 91 by the operation of a driving device (not shown). The y-direction moving table 93 moves in the x-direction along the y-direction rail 921 on the x-direction moving table 92 by the operation of a driving device (not shown). The pin holder 3 is fixed on the y-direction moving table 93. As the moving device 9 moves in the y direction and the x direction, the pin holder 3 moves relative to the semiconductor chip 22. Thereby, the push-up pin 4 moves with respect to the semiconductor chip 22.

Further, the moving device 9 moves the pin holder 3 based on the position calculated by the calculating device 8. Specifically, for example, when the position of the push-up pin 4 with respect to the semiconductor chip 22 calculated by the calculation device 8 is shifted, the moving device 9 moves the pin holder 3. More specifically, for example, when the position of the push-up pin 4 is deviated from the center portion of the semiconductor chip 22, the moving device 9 is configured so that the push-up pin 4 is positioned below the center portion of the semiconductor chip 22. The holder 3 is moved. The moving device 9 moves the pin holder 3 back and forth and right and left by moving the x direction moving table 92 and the y direction moving table 93. Thereby, the moving device 9 moves the push-up pin 4 with respect to the semiconductor chip 22. As described above, the moving device 9 can adjust the position of the push-up pin 4 with respect to the semiconductor chip 22 based on the position calculated by the calculation device 8.

The chip holder 7 may be a known collet, for example. The chip holder 7 holds the semiconductor chip 22 by a suction force when sucking air. The chip holder 7 holds the semiconductor chip 22 pushed upward by the push-up pins 4 from above. The chip holder 7 is movable in the x, y, and z directions, and is moved by the operation of a driving device (not shown). The chip holder 7 is disposed above the semiconductor chip 22 when holding the semiconductor chip 22. The chip holder 7 can be retracted from above the semiconductor chip 22 when the semiconductor chip 22 is not held.

Next, the operation of the pickup device 2 having the above configuration will be described. In the pickup device 2 described above, the imaging device 6 is disposed above the semiconductor chip 22, the pin holder 3 is disposed below, and the light emitting unit 5 is caused to emit light. Then, an image of the semiconductor chip 22 is acquired. In the acquired image, as shown in FIG. 7, an image 61 of the semiconductor chip 22 and a light image 62 of the light emitting unit 5 are projected. The acquired image information is sent to the arithmetic unit 8.

The imaging device 6 retracts from above the semiconductor chip 22 after imaging the semiconductor chip 22. Instead of the imaging device 6, the chip holder 7 moves and the chip holder 7 is disposed above the semiconductor chip 22.

The calculation device 8 calculates the position of the push-up pin 4 with respect to the semiconductor chip 22 based on the acquired image information. For example, the calculation device 8 first calculates the positional relationship between the image 61 of the semiconductor chip 22 imaged by the imaging device 6 and the light image 62 of the light emitting unit 5. Specifically, the position of the light emitting unit 5 with respect to the semiconductor chip 22 is calculated based on the coordinates of the contours of the captured

images

61 and 45. Subsequently, the arithmetic device 8 determines the position of the push-up pin 4 with respect to the semiconductor chip 22 based on the predetermined positional relationship of the light-emitting portion 5 with respect to the push-up pin 4 and the positional relationship between the light-emitting portion 5 and the push-up pin 4. Calculate.

As is clear from the above description, the pickup device 2 according to the embodiment images the semiconductor chip 22 through which the light of the light emitting unit 5 at a position determined with respect to the push-up pin 4 is transmitted, and the captured light emission The position of the push-up pin 4 with respect to the semiconductor chip 22 is calculated based on the position of the light image of the part 5. Thereby, even when the push-up pin 4 is located behind the semiconductor chip 22, the position of the push-up pin 4 can be obtained using the light of the light emitting unit 5, and the position of the push-up pin 4 with respect to the semiconductor chip 22 can be accurately determined. Can be recognized.

The pickup device 2 calculates the position of the push-up pin 4 based on the position of the image 61 of the semiconductor chip 22 and the position of the light image 62 of the light emitting unit 5. According to such a configuration, even if the position of the imaging device 6 with respect to the semiconductor chip 22 is not constant, the position of the push-up pin 4 can be more accurately based on the positional relationship of the semiconductor chip 22, the light emitting unit 5, and the push-up pin 4. Can be recognized. Moreover, since the light emission part 5 is arrange | positioned cyclically | annularly around the push-up pin 4, it can grasp | ascertain the position of the center part of the imaged image easily, and recognizes the position of the push-up pin 4 more correctly. Can do.

Further, the pickup device 2 can move the push-up pin 4 by the moving device 9 when the position of the push-up pin 4 with respect to the semiconductor chip 22 is shifted as a result of the calculation by the calculation device 8. For example, when the push-up pin 4 is not located below the central portion of the semiconductor chip 22, the x-direction moving table 92 and the y-direction moving table 93 of the moving device 9 are moved in the x and y directions, respectively. As a result, the pickup device 2 moves the push-up pin 4 so that the position of the push-up pin 4 with respect to the semiconductor chip 22 is set to an appropriate position. As described above, the pickup device 2 includes the moving device 9, whereby the push-up pin 4 can be disposed at an appropriate position with respect to the semiconductor chip 22.

The pickup apparatus 2 raises the push-up pin 4 and pushes up the semiconductor chip 22 in a state where the push-up pin 4 is disposed at an appropriate position with respect to the semiconductor chip 22. That is, after the push-up pin 4 is moved by the moving device 9, a drive device (not shown) is operated, so that the push-up pin 4 moves upward and protrudes upward from the upper end portion of the pin holder 3. The semiconductor chip 22 to be picked up is pushed up by the protruding push-up pins 4. The semiconductor chip 22 pushed up is held by the chip holder 7 above the semiconductor chip 22 as shown in FIG.

As mentioned above, although one embodiment was described, a specific mode is not limited to the above-mentioned embodiment. For example, in the above embodiment, the light emitting unit 5 is arranged in an annular shape, but the arrangement of the light emitting unit 5 is not limited to a circular annular shape, and may be a polygonal annular shape such as a quadrangle or a pentagon. Good.

Further, the configuration of the light emitting unit 5 is not limited to the above embodiment. As a configuration of the light emitting unit, various configurations can be used for projecting light onto the semiconductor chip 22. For example, the light emitting unit may include a light source such as an LED and a light guide member such as an optical fiber (both not shown). According to such a configuration, light from the light source is projected onto the semiconductor chip through the light guide member. In addition, the number of light emitting units is not particularly limited, and one or a plurality of light emitting units can be used. For example, a single LED light source may be used as the light emitting unit.

Further, the arrangement position of the light emitting section 5 is not particularly limited as long as it is arranged at a position set in advance with respect to the push-up pin 4. For example, as illustrated in FIG. 8, the light emitting unit 5 may be disposed inside the pin holder 3. The light emitting unit 5 is disposed around the push-up pin 4. The position of the light emitting unit 5 with respect to the push-up pin 4 is determined in advance. In addition, the light emitting unit 5 is disposed below the pin hole 41. The light from the light emitting unit 5 is projected onto the semiconductor chip 22 through the plurality of pin holes 41. Even with such a configuration, the position of the push-up pin 4 can be obtained using the light of the light emitting unit 5. Further, since the light emitting unit 5 is disposed on the pin holder 3, the light of the light emitting unit 5 can be reliably projected onto the semiconductor chip 22 when the upper part of the pin holder 3 approaches the semiconductor chip 22. .

Further, as shown in FIG. 9, the light emitting unit 5 may be disposed below the push-up pin 4. The light emitting unit 5 is fixed to the push-up pin 4. Thereby, the position of the light emission part 5 with respect to the push-up pin 4 is predetermined. The push-up pin 4 extends in the vertical direction above the light emitting unit 5. Further, the push-up pin 4 is made of a light transmissive material. As the light transmissive material, for example, an optical fiber or glass can be used. The push-up pin 4 emits light by the light from the light emitting unit 5. The light from the light emitting unit 5 enters from the lower end of the push-up pin 4 and passes to the upper end. Light from the light emitting unit 5 is projected onto the semiconductor chip 22 through the push-up pins 4. According to such a configuration, since the push-up pin 4 emits light, the position of the push-up pin 4 can be accurately obtained when calculating the position of the push-up pin 4 based on the position of the light image.

Further, the configuration of the push-up pin 4 is not limited to the above embodiment. As shown in FIG. 10, the push-up pin 4 may be formed with a light guide path 51 that guides light from the light emitting unit 5. The light guide 51 extends in the vertical direction at the center of the push-up pin 4 and penetrates from the upper end to the lower end of the push-up pin 4. The light emitting unit 5 is disposed inside the light guide path 51. Thereby, the position of the light emission part 5 with respect to the push-up pin 4 is predetermined. The light from the light emitting unit 5 is projected onto the semiconductor chip 22 through the light guide path 51. According to such a configuration, since the position of the light of the light emitting unit 5 corresponds to the position of the light guide path 51 in the push-up pin 4, when calculating the position of the push-up pin 4 based on the position of the light image, The position of the push-up pin 4 can be accurately obtained.

Further, the push-up pin 4 may be formed of a light impermeable material. As the light-impermeable material, for example, a thermoplastic resin colored white or black can be used. As shown in FIG. 11, the light emitting unit 5 is disposed around the push-up pin 4 and surrounds the push-up pin 4. When the light emitting unit 5 emits light, light is projected onto the semiconductor chip 22, but no light is projected onto a portion corresponding to the light-impermeable push-up pin 4. Therefore, the shadow of the push-up pin 4 is projected onto the semiconductor chip 22. According to such a configuration, since the light of the light emitting unit 5 is projected onto the semiconductor chip 22 and the shadow of the push-up pin 4 is projected, the position of the push-up pin 4 is calculated based on the position of the light image. Sometimes, the position of the push-up pin 4 can be accurately obtained.

As shown in FIG. 12, the pickup device 2 may further include one or a plurality of positioning pins 45 in addition to the push-up pins 4. In the present embodiment, a plurality (two) of positioning pins 45 are used. The positioning pin 45 extends in the vertical direction (z direction) below the semiconductor chip 22 to be picked up. The positioning pins 45 are generally rod-shaped members and extend toward the semiconductor chip 22. The positioning pin 45 can be moved up and down through the pin hole 41 of the pin holder 3. The positioning pin 45 is disposed at a predetermined position with respect to the push-up pin 4. That is, the distance L between the positioning pin 45 and the push-up pin 4 is predetermined. The positioning pin 45 is made of a light transmissive material. As the light transmissive material, for example, an optical fiber or glass can be used. The positioning pin 45 extends in the vertical direction above the light emitting unit 5. The light emitting unit 5 is disposed below the positioning pin 45. The positioning pin 45 emits light by the light from the light emitting unit 5. The distance L between the positioning pin 45 and the push-up pin 4 is determined in advance, and the light emitting unit 5 is disposed below the positioning pin 45, whereby the position of the light emitting unit 5 with respect to the push-up pin 4 is determined in advance. The light of the light emitting unit 5 enters from the lower end of the positioning pin 45 and is transmitted to the upper end. Light from the light emitting unit 5 is projected onto the semiconductor chip 22 through the positioning pins 45. According to such a configuration, the light of the light emitting unit 5 can be projected to the semiconductor chip 22 through the positioning pins 45 at a pinpoint. Since the light image of the light emitting unit 5 to be imaged becomes clear by the pinpoint projection, the position of the push-up pin 4 is accurately obtained when calculating the position of the push-up pin 4 based on the position of the light image. be able to.

Moreover, although the said embodiment is the structure which moves the pin 4 with respect to the semiconductor chip 22 by moving the pin holder 3 with the moving apparatus 9, the structure which the semiconductor chip 22 and the push-up pin 4 can move relatively. If it is, it will not specifically limit. For example, the semiconductor chip 22 may be moved with respect to the push-up pins 4 by separately installing a wafer moving device for moving the semiconductor wafer 21 and moving the semiconductor wafer 21 by the wafer moving device. Also with such a configuration, the semiconductor chip 22 and the push-up pin 4 can be moved relative to each other, and the position of the push-up pin 4 with respect to the semiconductor chip 22 can be adjusted.

In addition, when the thickness of the semiconductor chip 22 is thin and the lower part of the semiconductor chip 22 can be seen through, the pickup device 2 may use an object disposed below the semiconductor chip 22 instead of the light emitting unit 5. In this case, it is not necessary to operate the light emitting unit 5, and the imaging device 6 images an object seen through the semiconductor chip 22 instead of the light emitting unit 5. The position of the semiconductor chip 22 and the object that can be seen through the semiconductor chip 22 can be calculated from the position of the semiconductor chip 22 and the object, and the position of the push-up pin 4 with respect to the semiconductor chip 22 based on the calculated positional relationship. Can be calculated.

Although specific examples of the present invention have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology exemplified in this specification or the drawings can achieve a plurality of objects at the same time, and has technical usefulness by achieving one of the objects.

2; Pickup device 3; Pin holder 4; Push-up pin 5; Light emitting unit 6; Imaging device 7; Chip holder 8; Arithmetic device 9; 45; positioning pin 91; base 92; x-direction moving table 93; y-direction moving table

Claims

A pickup device for picking up a semiconductor chip that can transmit light,
A push-up pin extending vertically below the semiconductor chip and capable of pushing the semiconductor chip upward;
A light emitting unit disposed at a predetermined position with respect to the push-up pin below the semiconductor chip;
An imaging device capable of imaging from above the semiconductor chip through which light from the light emitting unit has been transmitted;
A pickup device comprising: an arithmetic device that calculates a position of a push-up pin with respect to a semiconductor chip based on a position of a light image of a light emitting unit imaged by an imaging device.
2. The pickup device according to claim 1, wherein the computing device computes the position of the push-up pin with respect to the semiconductor chip based on the position of the image of the semiconductor chip imaged by the imaging device and the position of the light image of the light emitting unit.
The pickup device according to claim 1, further comprising a moving device that relatively moves the semiconductor chip and the push-up pin based on the position calculated by the calculation device.
4. The pickup device according to any one of claims 1 to 3, wherein the light emitting section is arranged in an annular shape around the push-up pin.
A pin holder for holding the push-up pin below the semiconductor chip;
The pickup device according to claim 1, wherein the light emitting unit is disposed on the pin holder.
The push-up pin is made of a light transmissive material,
4. The pickup device according to claim 1, wherein the light emitting unit is disposed below the push-up pin, and the push-up pin emits light by light from the light emitting unit.
The pickup device according to any one of claims 1 to 3, wherein the push-up pin is formed with a light guide path that extends in a vertical direction and guides light from the light emitting unit.
The push pin is made of a light-impermeable material,
The pickup device according to claim 1, wherein the light emitting unit is disposed around the push-up pin.
A positioning pin arranged at a predetermined position with respect to the push-up pin below the semiconductor chip;
The positioning pin is made of a light transmissive material,
4. The pickup device according to claim 1, wherein the light emitting unit is disposed below the positioning pin, and the positioning pin emits light by light from the light emitting unit. 5.