JP6103745B2 - Thrust height measurement system - Google Patents

Description

  The present invention measures the push-up height when picking up a die from the dicing sheet by pushing up the expandable dicing sheet with the wafer diced so as to be divided into a plurality of dies, with the push-up pin of the push-up pot The invention relates to a push-up height measuring system.

  In recent years, as described in Patent Document 1 (Japanese Patent Laid-Open No. 2010-129949), a die supply device that supplies a die is set in a component mounter, and the die is mounted on a circuit board by the component mounter. There is something that was made. The die supply apparatus includes a wafer pallet on which an expandable dicing sheet to which a diced wafer is attached, and a push-up pot disposed below the dicing sheet, and a suction nozzle or component mounting of the die supply apparatus When picking up and picking up the die on the dicing sheet by lowering the suction nozzle of the machine, the push-up pot is raised to a predetermined sheet suction position in contact with or close to the lower surface of the dicing sheet, and the dicing sheet is lifted up. A sticking portion of the die to be sucked out of the dicing sheet is performed by performing a push-up operation in which the push-up pin in the push-up pot protrudes upward from the top surface of the push-up pot in a state of being sucked on the upper surface of the pot. The sticking part of the die is pushed up from the dicing sheet by pushing up with the push-up pin While manner was peeled, and as to pick up from the dicing sheet adsorbs the die in the adsorption nozzles.

JP 2010-129949 A

  By the way, when the suction nozzle is lowered and the die on the dicing sheet is sucked, if the push-up height position of the push-up pin of the push-up pot (the height position of the upper end) becomes too high, the lower end of the suction nozzle is placed on the dicing sheet. There is a possibility that the die will be damaged too much and the die may be damaged or cracked. On the contrary, if the push-up pot (push-up pin) push-up height position is too low, the die is stably sucked by the suction nozzle. Can not. Therefore, in order to stably adsorb the die without damaging the die, it is necessary to strictly manage the push-up height position of the push-up pot (push-up pin).

  However, the push-up height position of the push-up pin is affected by the assembling accuracy of each component of the push-up unit and how the push-up pin is attached, and it is difficult to ensure the required push-up height position accuracy. Therefore, before starting production, it is necessary to measure the push-up height position of the push-up pin and measure it again by reassembling the parts if it is found that the amount of misalignment exceeds the allowable range. However, at that time, since the operator manually measures the push-up height position of the push-up pin of the push-up pot, a lot of time may be spent.

  Therefore, in order to automate the work of measuring the push-up height position of the push-up pin, the present inventors set the height position of the upper end of the push-up pin during the push-up operation from the upper side of a non-contact type height such as a laser sensor. We are researching and developing a measurement system with a height sensor, but the upper end of the push pin is very thin and round, so the height position of the upper end of the push pin should be measured directly with a non-contact type height sensor. It is difficult.

  In addition, it is conceivable to measure the height position of the upper surface of the push-up pot during the push-up operation from above with a non-contact type height measuring sensor such as a laser sensor. Since many suction holes for adsorbing the dicing sheet are formed, it is difficult to stably and automatically measure the height position of the upper surface of the push-up pot without being affected by the many suction holes.

  Therefore, the problem to be solved by the present invention is a push-up height measuring system that can automatically and stably measure the push-up height position (upper end height position) of the push-up pot and push-up pin during the push-up operation. Is to provide.

In order to solve the above-mentioned problem, the invention according to claim 1 is the height position measurement for measuring the height position of the upper end surface of the measurement object in the case where the die supply device for supplying the die is set in the component mounter. means slidably mounted in front Symbol mounter vertically, and a top and bottom end surfaces are formed on a horizontal flat surface measurement jig, the upper thrust-up pot wafer pallet is not set In the state, the measurement jig is positioned above the push-up pin, the push-up pin is pushed up, and the measurement jig is pushed up at the upper end of the push-up pin, and the measurement control is performed by the height position measuring means. The height position of the upper end surface of the tool is measured, and the height position of the upper end of the push-up pin is obtained based on the measured value of the height position of the upper end surface of the measuring jig.

Even if the upper end of the push-up pin is very thin and rounded, the push-up pin is pushed up and the measurement jig is pushed up by the upper end of the push-up pin. Since the height position of the upper end surface is measured, the height position of the upper end surface of the measuring jig can be measured with high accuracy, and the measurement control is performed from the measured value of the height position of the upper end surface of the measuring jig. By subtracting the tool height dimension, the height position of the upper end of the push-up pin (push-up height position) can be stably and automatically measured.
In the invention according to claim 1, the measuring jig is assembled to the component mounter so as to be slidable in the vertical direction. Instead, the measuring jig is attached to the die supply device as in claim 2. As the means for moving the measuring jig to the suction head that supports the suction nozzle of the die feeding apparatus in a vertical direction through a support member, a moving mechanism for moving the suction head of the die supply device is used. Also good. In this way, the measuring jig can be moved above the push-up pot (push-up pin) using the moving mechanism that moves the suction head of the die supply device, and it is necessary to provide a moving mechanism dedicated to the measuring jig. There is no.

In the inventions according to the first and second aspects, the height position of the upper end of the push-up pin during the push-up operation is measured. However, in the inventions according to claims 3 and 4 , the wafer pallet is set above the push-up pot. In a state where the measuring jig is positioned above the push-up pot without being pushed, the push-up pot is pushed up, and the measurement jig is pushed up on the upper surface of the push-up pot, and the measurement control is performed by the height position measuring means. The height position of the upper end surface of the tool may be measured, and the height position of the upper surface of the push-up pot may be obtained based on the measured value of the height position of the upper end surface of the measuring jig. In this way, even if a large number of suction holes for adsorbing the dicing sheet are formed in the entire upper surface of the push-up pot, the height position of the upper surface of the push-up pot can be automatically and stably measured. it can.

Further, as in claim 5 , it is preferable to provide an urging means for urging the measuring jig downward. In this way, when measuring the push-up height position, the lower end surface of the measuring jig can be reliably brought into contact with the upper end of the push-up pot (push-up pin), and the measurement jig is lifted from the push-up pot (push-up pin). It is possible to prevent the push-up height position from being measured in the state of being pushed.

Also, as in claim 6, as a means for moving the height position measuring means, it may be to use a moving mechanism for moving the suction nozzle of the mounter. In this way, the height position measuring means can be moved above the measuring jig using the moving mechanism for moving the suction nozzle of the component mounting machine, and a moving mechanism dedicated to the height position measuring means is provided. There is no need.

In this case, as in claim 7, as the height position measuring means may be used a laser sensor for measuring the height position of the upper surface of the circuit board for mounting the die. In this way, the push-up height position can be measured using the laser sensor that detects the height position of the upper surface of the circuit board, and there is no need to provide a height measurement sensor dedicated to the measurement jig.

FIG. 1 is an external perspective view showing a state in which a die supply apparatus according to an embodiment of the present invention is set on a component mounter. FIG. 2 is a side view showing the configuration of the push-up height measurement system. FIG. 3 is an external perspective view of the wafer pallet. FIG. 4 is a partially broken enlarged view showing a state in which the push-up pot is raised to the sheet suction position during the push-up operation. FIG. 4 is a partially broken enlarged view showing a state in which the push-up pin is protruded from the push-up pot during the push-up operation.

Hereinafter, an embodiment embodying a mode for carrying out the present invention will be described.
First, the overall configuration will be described with reference to FIGS.

A die supply device 12 is detachably set on the component mounter 11.
The component mounter 11 is provided with an XY movement mechanism 14 (XY robot) that moves the mounting head 13 in the XY directions (left and right and front and rear directions). The XY moving mechanism 14 is supported by a Y slide 16 that slides in the Y direction (direction perpendicular to the circuit board transport direction), and is slidable in the X direction (circuit board transport direction) by the Y slide 16. An X slide 17, and a mounting head 13 is supported on the X slide 17 via a Z moving mechanism 18. The Z moving mechanism 18 moves the mounting head 13 in the Z direction (vertical direction). ing.

  The mounting head 13 of the component mounter 11 picks up a pick-up nozzle (not shown) for picking up electronic components such as a die to be mounted on the circuit board, and an image pickup object such as a reference mark on the circuit board and a mounting part from above. An image pickup apparatus (not shown) that performs this operation and a non-contact type height measurement sensor 21 (height position measurement means) such as a laser sensor that measures the height position of the upper surface of the circuit board are provided.

  On the other hand, the die supply device 12 is provided with an XY movement mechanism 24 (XY robot) that moves the suction head 23 in the XY directions (left and right and front and rear directions). The XY moving mechanism 24 includes a Y slide 26 that slides in the Y direction and an X slide 27 that is supported by the Y slide 26 so as to be slidable in the X direction. The suction head 23 is turned upside down on the X slide 27. One or a plurality of suction nozzles 28 are supported by the suction head 23 so as to be movable up and down. The suction head 23 of the die supply device 12 sucks the die 34 (see FIGS. 4 and 5) to the suction nozzle 28 and then reverses up and down by the upside down mechanism 29 so that the die 34 faces upward. It is comprised so that it may deliver to a suction nozzle.

  The die supply device 12 is provided with a push-up unit 32 that moves the push-up pot 31 up and down. The push-up unit 32 is configured to be movable in the XY direction in a space area below the wafer pallet 33 (see FIG. 3) set in the die supply device 12. The wafer pallet 33 is mounted with an expandable dicing sheet 35 on which a wafer diced so as to be divided into a large number of dies 34 is expanded in a dicing frame 36 having a circular opening. 36 is attached to the pallet body 37 by screwing or the like.

  As shown in FIGS. 4 and 5, a plurality of suction holes 38 for adsorbing the dicing sheet 35 are formed in the upper surface portion of the push-up pot 31, and the push-up pins 39 protrude upward in the push-up pot 31. It is provided as possible. The push-up pin 39 has an upper end formed in a tapered shape and is very thin and round. During the push-up operation, the dicing sheet 35 is adsorbed on the upper surface of the push-up pot 31, and the push-up pin 39 in the push-up pot 31 is pushed upward from the upper surface of the push-up pot 31, thereby performing the dicing sheet. The adhering portion of the die 34 to be adsorbed of the die 35 is pushed up by the push-up pin 39 and the adhering portion of the die 34 is partially peeled from the dicing sheet 35, while the adsorbing nozzle 28 of the die supply device 12. Thus, the die 34 is adsorbed and picked up from the dicing sheet 35.

  The push-up unit 32 is configured such that the push-up unit 32 as a whole moves up and down using a servo motor (not shown) as a drive source. At the time of the die pick-up operation, the push-up unit 32 rises, and when the upper surface of the push-up pot 31 rises to a predetermined sheet suction position in contact with or close to the dicing sheet 35 of the wafer pallet 33, the push-up unit 32 is driven by a stopper mechanism (not shown). When the upward movement is stopped and the upward movement is continued, the push-up pin 39 protrudes upward from the upper surface of the push-up pot 31 and pushes up the sticking portion of the die 34 to be picked up in the dicing sheet 35. Yes. In this case, the push-up height position (push-up amount) of the push-up pin 39 can be adjusted by adjusting the rotation amount of the servo motor serving as the drive source.

  As shown in FIG. 2, a shaft-shaped measuring jig 41 extending in the vertical direction is assembled to the suction head 23 of the die supply apparatus 12 through the support members 42 and 43 so as to be slidable in the vertical direction. The jig 41 is urged downward with a light force by an urging means (not shown) such as a spring. The measuring jig 41 is formed so that both upper and lower end surfaces thereof are horizontal flat surfaces, and the size of the lower end surface is larger than the size of the suction hole 38 on the upper surface of the push-up pot 31. Stoppers 44 and 45 for determining the limit position of the vertical stroke of the measuring jig 41 are provided on the side and the lower side.

Next, an operation for automatically measuring the height position (push-up height position) of the upper end of the push-up pin 39 during the push-up operation will be described.
While the wafer pallet 33 is not set in the die supply device 12, the suction head 23 and / or the push-up unit 32 of the die supply device 12 are appropriately moved to position the measurement jig 41 above the push-up pins 39. Then, the mounting head 13 of the component mounter 11 is moved so that the height measuring sensor 21 is positioned above the measuring jig 41.

In this state, the push-up pot 31 is raised to the sheet adsorbing position, and a push-up operation for causing the push-up pin 39 in the push-up pot 31 to protrude upward from the upper surface of the push-up pot 31 is performed. In the middle of this push-up operation, the upper end of the push-up pin 39 comes into contact with the lower end surface of the measurement jig 41, and the measurement jig 41 is pushed up by the upper end of the push-up pin 39. After the push-up operation is completed, the height position of the upper end surface of the measuring jig 41 is measured by the height measuring sensor 21, and the measuring jig 41 is calculated from the measured value Z 1 of the upper end face of the measuring jig 41. The height Z2 is subtracted to obtain the measured value Z3 of the height position of the upper end of the push-up pin 39.
Z3 = Z1 -Z2

  Using the measured value Z3 of the height position of the upper end of the push-up pin 39 during the push-up operation measured as described above, the push-up amount of the push-up pin 39 is adjusted, or the lowering amount of the suction nozzle 28 during the die suction operation. Adjust. Thereby, the die 34 on the dicing sheet 35 can be stably sucked by the suction nozzle 28.

  In addition, the height position of the upper end of the push-up pin 39 during the push-up operation is periodically measured, and the state of the upper end of the push-up pin 39 (wear, bending, breakage, etc.) is inspected from the history of the measured values. Also good. As a result, it is possible to detect breakage of the push-up pin 39 and changes over time, and it is possible to improve work efficiency and to expect effects such as minimizing the production of defective products.

  When a plurality of push-up pins 39 are provided in the push-up pot 31, the height measurement operation described above may be performed for each push-up pin 39. From the measured value of the height position of the upper end of each push-up pin 39, the variation in the height position of the upper end of each push-up pin 39 may be inspected, or the presence / absence of each push-up pin 39 may be inspected.

  On the other hand, when automatically measuring the height position of the upper surface of the push-up pot 31 during the push-up operation, the lower limit position of the lower end of the measuring jig 41 is previously set higher than the height position of the upper surface of the push-up pot 31 during the push-up operation. Set to lower. Then, in a state where the wafer pallet 33 is not set in the die supply device 12, the measurement jig 41 is positioned above the position of the upper surface of the push-up pot 31 that is out of the push-up pins 39, and the measurement jig 41 It is assumed that the height measurement sensor 21 is positioned above.

In this state, the push-up pot 31 is pushed up. In the middle of this push-up operation, the upper surface of the push-up pot 31 comes into contact with the lower end surface of the measurement jig 41, and the measurement jig 41 is pushed up by the upper surface of the push-up pot 31. After the push-up operation is completed, the height position of the upper end surface of the measuring jig 41 is measured by the height measuring sensor 21, and the measuring jig 41 is calculated from the measured value Z 4 of the upper end surface of the measuring jig 41. The measured height value Z6 of the upper surface of the push-up pot 31 is obtained by subtracting the height dimension Z5.
Z4 = Z5 -Z6

  According to the embodiment described above, the push-up pin 39 is pushed up and the measurement jig 41 is pushed up by the upper end of the push-up pin 39, and the height measurement sensor 21 causes the upper end surface of the measurement jig 41 to move. The height position is measured, and the measurement value of the height position of the upper end of the push-up pin 39 is obtained by subtracting the height dimension of the measurement jig 41 from the measurement value of the height position of the upper end surface of the measurement jig 41. Since the upper end of the push-up pin 39 is very thin and rounded, the height position of the upper end of the push-up pin 39 (push-up height is obtained from the measured value of the height position of the upper end surface of the measuring jig 41. Position) can be automatically measured stably and accurately.

  Further, the height position of the upper end surface of the measuring jig 41 is measured by the height measuring sensor 21 in a state where the pushing pot 31 is pushed up and the measuring jig 41 is pushed up on the upper surface of the pushing pot 31. Then, even if a large number of suction holes 38 for adsorbing the dicing sheet 35 are formed in the entire upper surface of the push-up pot 31, the push-up pot 31 can be calculated from the measured value of the height position of the upper end surface of the measuring jig 41. It is possible to automatically measure the height position of the upper surface of the surface stably and accurately.

  In this embodiment, the XY movement mechanism 24 that moves the suction head 23 of the die supply device 12 is used as the means for moving the measurement jig 41. Therefore, the XY movement mechanism 24 of the die supply device 12 is used. Thus, the measurement jig 41 can be moved above the push-up pot 31 (push-up pin 39), and there is no need to provide a movement mechanism dedicated to the measurement jig 41. However, in the present invention, a moving mechanism dedicated to the measuring jig 41 may be provided. Further, the measuring jig 41 may be provided on the component mounter 11 side.

  Further, in this embodiment, the biasing means for biasing the measurement jig 41 downward is provided, so that the lower end surface of the measurement jig 41 is pushed up when the push-up height position is measured, and the push-up pot 31 (push-up pin 39). The upper end of the measuring jig 41 can be reliably brought into contact with each other, and measurement can be prevented in a state where the measuring jig 41 is lifted from the push-up pot 31 (push-up pin 39).

  In the present embodiment, the height measurement sensor 21 provided in the component mounter 11 for measuring the height position of the upper surface of the circuit board is used to measure the height position of the upper end surface of the measurement jig 41. Since it is used as the height position measuring means, the height measurement sensor 21 for measuring the circuit board height of the component mounting machine 11 can be used to measure the push-up height position, and the height dedicated to the measuring jig 41 can be measured. There is no need to provide a measurement sensor. However, in the present invention, a height measuring sensor dedicated to the measuring jig 41 may be provided.

  Note that the height measurement sensor 21 (height position measurement means) that measures the height position of the upper end surface of the measurement jig 41 is not limited to a laser sensor, but an ultrasonic height measurement sensor and an LED height measurement. A non-contact type height measuring sensor such as a sensor may be used. Alternatively, a contact-type height measurement sensor such as a touch sensor is attached to the mounting head 13 of the component mounter 11, and the mounting head 13 is moved until the contact-type height measurement sensor contacts the upper end surface of the measuring jig 41. The lowering amount may be measured by the count value of the encoder of the drive motor of the Z moving mechanism 18.

  In this embodiment, the suction head 23 of the die supply device 12 is turned upside down during the die pickup operation so that the die 34 faces upward and is delivered to the suction nozzle of the component mounter 11. For example, the die 34 on the dicing sheet 35 is directly sucked by the suction nozzle of the component mounting machine 11 or the die 34 sucked by the suction nozzle 28 of the die supply device 12 is received by the shuttle mechanism. Then, it may be transferred to a predetermined die suction position and delivered to the suction nozzle of the component mounting machine 11 at this die suction position.

  In this embodiment, the height of the measuring jig 41 is subtracted from the measured value of the height position of the upper end surface of the measuring jig 41 to obtain the upper end height position of the push-up pin 39 or the upper surface of the push-up pot 31. The height measurement sensor 21 outputs a signal obtained by offsetting (subtracting) the measurement value signal output from the height measurement sensor 21 by an amount corresponding to the height dimension of the measurement jig 41. Alternatively, the height position of the upper end of the push-up pin 39 or the height position of the upper surface of the push-up pot 31 may be directly detected from the output signal 21. Alternatively, the relationship between the measurement value of the height measurement sensor 21 (the height position of the upper end surface of the measuring jig 41) and the height position of the upper end of the push-up pin 39 or the height position of the upper surface of the push-up pot 31 is previously determined. A prescribed table is created, and the height position of the upper end of the push-up pin 39 or the height position of the upper surface of the push-up pot 31 corresponding to the measurement value of the height measuring sensor 21 is obtained with reference to this table. Also good.

  In addition, it goes without saying that the present invention can be implemented with various modifications within a range not departing from the gist, such as changing the shape and support structure of the measuring jig 41 or changing the configuration of the component mounting machine 11. .

  DESCRIPTION OF SYMBOLS 11 ... Component mounting machine, 12 ... Die supply apparatus, 13 ... Mounting head, 14 ... XY moving mechanism, 18 ... Z moving mechanism, 21 ... Height measuring sensor (height position measuring means), 23 ... Suction head, 24 ... XY moving mechanism, 28 ... suction nozzle, 31 ... push-up pot, 32 ... push-up unit, 33 ... wafer pallet, 34 ... die, 35 ... dicing sheet, 36 ... dicing frame, 39 ... push-up pin, 41 ... measuring jig

Claims (7)

Component mounting a die supply apparatus comprising a wafer pallet mounted with an expandable dicing sheet to which a wafer diced so as to be divided into a plurality of dies is attached, and a push-up pot disposed below the wafer pallet When the suction nozzle of the die feeding device or the suction nozzle of the component mounting machine is lowered to suck the die on the dicing sheet, the push pot of the die feeding device is placed on the lower surface of the dicing sheet. A push-up operation in which the push-up pin in the push-up pot protrudes upward from the upper surface of the push-up pot in a state where the dicing sheet is adsorbed to the upper surface of the push-up pot by being raised to a predetermined sheet adsorbing position in contact with or close to By doing so, the sticking portion of the die to be adsorbed in the dicing sheet is Choke lower pin is peeled adhered portion of the die from the dicing sheet, in which the pickup from the dicing sheet adsorbs the die in the adsorption nozzle,
A height position measuring means for measuring the height position of the upper end surface of the measurement object;
Slidably mounted in the vertical direction before Symbol mounter, and a top and bottom end faces measurement jig formed on a horizontal flat surface,
With the wafer pallet not set above the push-up pot, the measurement jig is positioned above the push-up pin, the push-up pin is pushed up, and the measurement jig is moved at the upper end of the push-up pin. In the pushed-up state, the height position measuring means measures the height position of the upper end surface of the measuring jig, and based on the measured value of the height position of the upper end surface of the measuring jig, A push-up height measurement system characterized by finding the height position. Component mounting a die supply apparatus comprising a wafer pallet mounted with an expandable dicing sheet to which a wafer diced so as to be divided into a plurality of dies is attached, and a push-up pot disposed below the wafer pallet When the suction nozzle of the die feeding device or the suction nozzle of the component mounting machine is lowered to suck the die on the dicing sheet, the push pot of the die feeding device is placed on the lower surface of the dicing sheet. A push-up operation in which the push-up pin in the push-up pot protrudes upward from the upper surface of the push-up pot in a state where the dicing sheet is adsorbed to the upper surface of the push-up pot by being raised to a predetermined sheet adsorbing position in contact with or close to By doing so, the sticking portion of the die to be adsorbed in the dicing sheet is Choke lower pin is peeled adhered portion of the die from the dicing sheet, in which the pickup from the dicing sheet adsorbs the die in the adsorption nozzle,
A height position measuring means for measuring the height position of the upper end surface of the measurement object;
A suction jig that supports the suction nozzle of the die supply device , and a measurement jig that is slidably mounted in the vertical direction via a support member, and that has both upper and lower end surfaces formed on a horizontal flat surface;
The means for moving the measuring jig is a moving mechanism for moving the suction head of the die supply device,
With the wafer pallet not set above the push-up pot, the measurement jig is positioned above the push-up pin, the push-up pin is pushed up, and the measurement jig is moved at the upper end of the push-up pin. In the pushed-up state, the height position measuring means measures the height position of the upper end surface of the measuring jig, and based on the measured value of the height position of the upper end surface of the measuring jig, A push-up height measurement system characterized by finding the height position. Component mounting a die supply apparatus comprising a wafer pallet mounted with an expandable dicing sheet to which a wafer diced so as to be divided into a plurality of dies is attached, and a push-up pot disposed below the wafer pallet When the suction nozzle of the die feeding device or the suction nozzle of the component mounting machine is lowered to suck the die on the dicing sheet, the push pot of the die feeding device is placed on the lower surface of the dicing sheet. A push-up operation in which the push-up pin in the push-up pot protrudes upward from the upper surface of the push-up pot in a state where the dicing sheet is adsorbed to the upper surface of the push-up pot by being raised to a predetermined sheet adsorbing position in contact with or close to By doing so, the sticking portion of the die to be adsorbed in the dicing sheet is Choke lower pin is peeled adhered portion of the die from the dicing sheet, in which the pickup from the dicing sheet adsorbs the die in the adsorption nozzle,
A height position measuring means for measuring the height position of the upper end surface of the measurement object;
Slidably mounted in the vertical direction before Symbol mounter, and a top and bottom end faces measurement jig formed on a horizontal flat surface,
When the wafer pallet is not set above the push-up pot, the measurement jig is positioned above the push-up pot, the push-up pot is pushed up, and the measurement jig is placed on the upper surface of the push-up pot. In the pushed-up state, the height position of the upper end surface of the measuring jig is measured by the height position measuring means, and the upper surface of the push-up pot is measured based on the measured value of the height position of the upper end surface of the measuring jig. A push-up height measurement system characterized by finding the height position. Component mounting a die supply apparatus comprising a wafer pallet mounted with an expandable dicing sheet to which a wafer diced so as to be divided into a plurality of dies is attached, and a push-up pot disposed below the wafer pallet When the suction nozzle of the die feeding device or the suction nozzle of the component mounting machine is lowered to suck the die on the dicing sheet, the push pot of the die feeding device is placed on the lower surface of the dicing sheet. A push-up operation in which the push-up pin in the push-up pot protrudes upward from the upper surface of the push-up pot in a state where the dicing sheet is adsorbed to the upper surface of the push-up pot by being raised to a predetermined sheet adsorbing position in contact with or close to By doing so, the sticking portion of the die to be adsorbed in the dicing sheet is Choke lower pin is peeled adhered portion of the die from the dicing sheet, in which the pickup from the dicing sheet adsorbs the die in the adsorption nozzle,
A height position measuring means for measuring the height position of the upper end surface of the measurement object;
A suction jig that supports the suction nozzle of the die supply device , and a measurement jig that is slidably mounted in the vertical direction via a support member, and that has both upper and lower end surfaces formed on a horizontal flat surface;
The means for moving the measuring jig is a moving mechanism for moving the suction head of the die supply device,
When the wafer pallet is not set above the push-up pot, the measurement jig is positioned above the push-up pot, the push-up pot is pushed up, and the measurement jig is placed on the upper surface of the push-up pot. In the pushed-up state, the height position of the upper end surface of the measuring jig is measured by the height position measuring means, and the upper surface of the push-up pot is measured based on the measured value of the height position of the upper end surface of the measuring jig. A push-up height measurement system characterized by finding the height position. Height measuring system push-up according to any one of claims 1 to 4, characterized in that biasing means for biasing the measurement jig downward. Said means for moving the height position measuring means, the height measuring system push-up according to any one of claims 1 to 5, characterized in that a moving mechanism for moving the suction nozzle of the mounter. The height position measuring means, the height measuring system push-up according to any one of claims 1 to 6, characterized in that the laser sensor for detecting the height position of the upper surface of the circuit board for mounting the die is used.

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