WO2018061103A1 - Wafer feeding apparatus and component mounting apparatus - Google Patents

Wafer feeding apparatus and component mounting apparatus Download PDF

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Publication number
WO2018061103A1
WO2018061103A1 PCT/JP2016/078585 JP2016078585W WO2018061103A1 WO 2018061103 A1 WO2018061103 A1 WO 2018061103A1 JP 2016078585 W JP2016078585 W JP 2016078585W WO 2018061103 A1 WO2018061103 A1 WO 2018061103A1
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WO
WIPO (PCT)
Prior art keywords
push
nozzle
load
lifting
component
Prior art date
Application number
PCT/JP2016/078585
Other languages
French (fr)
Japanese (ja)
Inventor
浩二 河口
繁人 市川
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2018541770A priority Critical patent/JP6898936B2/en
Priority to EP16917656.7A priority patent/EP3522207B1/en
Priority to PCT/JP2016/078585 priority patent/WO2018061103A1/en
Publication of WO2018061103A1 publication Critical patent/WO2018061103A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Definitions

  • the present invention relates to a wafer supply apparatus and a component mounting apparatus.
  • a pellet (die) attached to an adhesive sheet is adsorbed while being pressed from the pellet side by an adsorption nozzle and bonded to the substrate, and the pellet is formed by pushing up from the back surface of the adhesive sheet using a push-up pin.
  • a component mounting system including a pellet pushing-up unit that peels a sheet from an adhesive sheet (for example, see Patent Document 1).
  • the pellet push-up unit includes a pin support that supports the push-up pin and rises as the cam rotates, a motor that drives the cam, and a load measuring device provided on the pin support, and push-up operation of the push-up pin Accordingly, the thrust load acting on the pellet is measured by a load measuring device.
  • the bonding head adjusts the pickup load acting on the pellet by feedback control in accordance with the pellet suction operation by the suction nozzle based on the measurement result of the thrust load.
  • the main object of the present invention is to peel parts from a sheet at high speed and with high accuracy.
  • the present invention adopts the following means in order to achieve the main object described above.
  • a wafer supply apparatus is a wafer supply apparatus used in a component mounting apparatus that picks up a component from a sheet on which a wafer divided into a plurality of components is attached with a nozzle and mounts the component on an object.
  • a second pushing-up / lowering device that raises / lowers the pushing-up portion relative to the above.
  • the wafer supply apparatus includes a push-up unit that pushes up a component to be picked up by a nozzle from the back side of the sheet, a first lift unit that lifts and lowers the lift member, and a lift member that is lifted and lowered by the first push-up lift unit. And a second push-up / lift device that raises and lowers the push-up portion relative to the lift member.
  • the wafer supply apparatus can move the push-up portion at high speed by the first push-up lift device, and can move the push-up portion with high accuracy by the second push-up lift device.
  • the component can be peeled from the sheet at high speed and with high accuracy.
  • a load measuring unit for measuring a load acting on the push-up unit, and the push-up unit based on a load measured by the load measuring unit when the part is picked up by the nozzle
  • a control unit that controls the first push-up lift device and the second push-up lift device so as to be pushed up.
  • the control unit controls the first push-up / lowering device so that the push-up portion is pushed up to a predetermined push-up position, and the component is pushed up by the push-up portion. It is good also as what controls the said 2nd raising / lowering apparatus so that the load measured by the said load measurement part in a state is hold
  • control unit is configured so that the load measured by the load measurement unit is held at a target load while the component is pushed up by the push-up unit.
  • the push-up device is controlled, and the target load may be changed according to the push-up amount or push-up position of the push-up portion. In this way, the push-up load can be changed according to the progress of peeling of the component, so that the occurrence of breakage when pushing up the component can be more reliably suppressed.
  • a first component mounting apparatus is a component mounting apparatus that picks up a component from a sheet on which a wafer divided into a plurality of components is attached with a nozzle and mounts the component on an object.
  • a nozzle lifting device that lifts and lowers the nozzle relative to the head, a push-up portion for pushing up a component to be picked up by the nozzle from the back side of the sheet, a first push-up lifting device that lifts and lowers the lifting member,
  • a second raising / lowering device that is raised / lowered together with the raising / lowering member by the first pushing-up / lowering device to raise / lower the raising portion relative to the raising / lowering member; and a load measuring unit that measures a load acting on the raising portion And the nozzle lifting and lowering device and the first push-up and lowering so that the nozzle is lowered to a predetermined nozzle position and the push-up portion is pushed up to a predetermined push-up position.
  • the first component mounting apparatus of the present invention includes a head, a nozzle, and a nozzle lifting / lowering device that lifts and lowers the nozzle with respect to the head.
  • the first component mounting apparatus is moved up and down by a push-up unit for pushing up a component to be picked up by the nozzle from the back side of the sheet, a first push-up unit lifting unit that lifts and lowers the lifting member, and a first push-up unit lifting unit.
  • a second push-up device that lifts and lowers the push-up portion relative to the lift member, and a load measurement unit that measures a load acting on the push-up portion.
  • a second component mounting apparatus of the present invention is a component mounting apparatus that picks up a component from a sheet on which a wafer divided into a plurality of components is attached by means of a nozzle and mounts it on an object.
  • a first nozzle lifting device that lifts and lowers the lifting member with respect to the head, a second nozzle lifting device that moves up and down together with the lifting member and moves the nozzle relative to the lifting member, and the nozzle picks up
  • the first nozzle lifting device and the lifting portion lifting and lowering device are controlled so that the lifting portion is pushed up to a predetermined lifting position.
  • Control for controlling the second nozzle lifting / lowering device so that the load measured by the load measuring unit is held within a predetermined push-up load range in a state where the part is in contact with the part and the part is pushed up by the push-up unit. And a section.
  • the second component mounting apparatus includes a head, a nozzle, a first nozzle lifting / lowering device that lifts and lowers the lifting member with respect to the head, and lifts and lowers the nozzle relative to the lifting member.
  • the second component mounting apparatus includes a push-up unit for pushing up a component to be picked up by the nozzle from the back side of the sheet, a push-up unit lifting device for raising and lowering the push-up unit, and load measurement for measuring a load acting on the nozzle.
  • the second component mounting apparatus controls the first nozzle lifting device and the lifting unit lifting device so that the nozzle is lowered to a predetermined nozzle position and the raising portion is pushed up to a predetermined lifting position, and the nozzle hits the component.
  • the second nozzle lifting device is controlled so that the load measured by the load measuring unit is held within a predetermined push-up load range in a state where the component is pushed up by the push-up portion.
  • the second component mounting apparatus can operate the nozzle at high speed by the first nozzle lifting apparatus, and can operate the nozzle with high accuracy by the second nozzle lifting apparatus.
  • the second component mounting apparatus can peel the component from the sheet at high speed and with high accuracy and pick it up with the nozzle.
  • the control unit controls the first nozzle lifting device so that the nozzle is lowered to the predetermined nozzle position, the nozzle abuts on the component and the load.
  • the second nozzle lifting device is controlled so that the load measured by the measuring unit is within a predetermined contact load range
  • the push-up device lifting device is controlled so that the component is pushed up by the pushing-up portion
  • the nozzle is The second nozzle lifting device is controlled so that the load measured by the load measuring unit is held within a predetermined push-up load range when the component is in contact with the component and the component is pushed up by the push-up unit. It is good. If it carries out like this, when a nozzle contact
  • FIG. 1 is a configuration diagram showing an outline of the configuration of a component mounting system 10.
  • FIG. 3 is a top view illustrating a schematic configuration of a die peeling apparatus 50.
  • FIG. 2 is a side view showing an outline of a configuration of a die peeling apparatus 50.
  • FIG. It is a flowchart which shows an example of a pick-up process. It is a flowchart which shows an example of die
  • FIG. It is explanatory drawing which shows a mode that the die
  • FIG. It is a block diagram which shows the outline of a structure of the mounting head 122 of a modification. It is a block diagram which shows the electrical connection relation of the component mounting system 110 using the mounting head 122 of the modification. It is a flowchart which shows the pick-up process of a modification. It is a flowchart which shows the die
  • FIG. 1 is a configuration diagram showing an outline of the configuration of the component mounting system 10
  • FIG. 2 is a top view showing an outline of the configuration of the die peeling apparatus 50
  • FIG. 3 is an outline of the configuration of the die peeling apparatus 50
  • 4 is a block diagram showing an outline of the configuration of the lifting device 60
  • FIG. 5 is a block diagram showing an electrical connection relationship of the component mounting system 10.
  • the left-right direction is the X-axis direction
  • the front-rear direction is the Y-axis direction
  • the up-down direction is the Z-axis direction.
  • the component mounting system 10 is a system for mounting a component such as a die D obtained by dividing a wafer W on an object (substrate S, other components, etc.). And a computer (PC) 80.
  • a plurality of component mounting apparatuses 20 that mount components on a substrate S are arranged from upstream to downstream.
  • the component mounting system 10 may include a solder printer, an inspection machine, a reflow furnace, and the like on the same mounting line as the component mounting apparatus 20.
  • the component mounting apparatus 20 includes a substrate transfer device 21, a mounting head 22, a head moving device 23, a suction nozzle 24, a parts camera 25, a mark camera 26, a tape supply device 28, a wafer supply device 40, And a control device 29.
  • the substrate transport device 21 carries in, transports, fixes and unloads the substrate S at the mounting position.
  • the substrate transport device 21 has a pair of conveyor belts provided at intervals in the front and rear direction of FIG. The board
  • the mounting head 22 is a head that picks up the components supplied from the die D and the tape supply device 28 supplied from the wafer supply device 40 and mounts them on the substrate S fixed to the substrate transfer device 21. Thus, it can be moved in the XY-axis direction.
  • the head moving device 23 includes a slider that is guided by a guide rail and moves in the XY axis direction, a motor that drives the slider, and a position sensor that detects the position of the slider in the XY axis direction.
  • One or more nozzle holders are attached to the mounting head 22, and a suction nozzle 24 is detachably attached to the lower surface of the nozzle holder.
  • the suction nozzle 24 has a suction port communicating with a negative pressure source and a positive pressure source via a switching valve 36 (electromagnetic valve), and driving the switching valve 36 causes a negative pressure to act on the suction port.
  • the component can be sucked or the suction of the component can be released by applying a positive pressure to the suction port.
  • the mounting head 22 has a built-in lifting device 31, and the height of the suction nozzle 24 can be adjusted along the Z axis by the lifting device 31.
  • the lifting device 31 includes a slider that moves in the Z-axis direction, a motor that drives the slider, and a Z-axis position sensor 32 that detects the position of the slider in the Z-axis direction.
  • the mounting head 22 has a built-in rotating device 33 and can adjust the angle of the component sucked by the suction nozzle 24 by the lifting device 31.
  • the rotation device 33 includes a motor that rotates a nozzle holder that holds the suction nozzle 24 and a rotation position sensor that detects a rotation position of the motor.
  • the parts camera 25 is provided between the substrate transport device 21 and the tape supply device 28.
  • the suction nozzle 24 that sucks a part passes above the part camera 25, the parts camera 25 captures the part sucked by the suction nozzle 24 from below and outputs the image to the control device 29.
  • the mark camera 26 is provided in the head moving device 23 so as to be movable in the XY axis directions.
  • the mark camera 26 images from above the positioning reference mark provided on the substrate S in order to confirm the position of the substrate S when the substrate S is transported, and outputs the image to the control device 29. Further, the mark camera 26 images the wafer W including the die D to be picked up by the mounting head 22 from above, and outputs the image to the control device 29.
  • the tape supply device 28 includes a reel on which a tape containing a component is wound, and supplies the component to the component mounting device 20 by pulling out the tape from the reel.
  • the wafer supply device 40 is a device that supplies the die D obtained by dividing the wafer W to the suction position of the mounting head 22, and includes a wafer pallet 41, a magazine 42, and a die peeling device 50.
  • the wafer pallet 41 is fixed in a state where the die sheet 43 to which the wafer W is adhered is stretched.
  • a plurality of wafer pallets 41 are accommodated in the magazine 42 and are pulled out from the magazine 42 by the pallet pulling device 44 when the mounting head 22 sucks the die D.
  • the die peeling device 50 includes a pot 51, a pot moving device 52, a push-up pin 71 (see FIG. 4), and a lifting device 60.
  • the pot 51 is arranged below the wafer pallet 41 drawn by the pallet drawing device 44 and can be moved in the XY-axis direction by the pot moving device 52.
  • the pot moving device 52 includes a slider that is guided by a guide rail and moves in the XY axis direction, a motor that drives the slider, and a position sensor that detects the position of the slider in the XY axis direction.
  • the push-up pins 71 are disposed inside the pot 51 and push up the die D to be picked up from the back side of the die sheet 43 among the divided dies D of the wafer W adhered to the die sheet 43.
  • a lower end portion of the push-up pin 71 is supported by a pin support body 73.
  • the push-up pin 71 is attached to the pin support 73 so as to be movable in the vertical direction (Z-axis direction).
  • the pin support 73 incorporates a compression coil spring (not shown), and the push-up pin 71 is urged downward with respect to the pin support 73 by the urging force of the compression coil spring. Further, a plurality of types of push-up pins 71 having different thicknesses and numbers depending on the size of the die D are provided.
  • the die peeling apparatus 50 includes a plurality of pots 51 having different types of push-up pins 71, and can select one of the pots 51 depending on the size of the die D to push up the die D.
  • a suction port is provided on the upper surface of the pot 51, and the die peeling device 50 pushes up only the die D to be picked up by pushing up the push-up pin 71 with the die sheet 43 supported by suction on the upper surface of the pot 51. Can be peeled off from the die sheet 43.
  • the lifting device 60 includes a first lifting device 61, a second lifting device 65, and a load cell 69 (load measurement unit).
  • the raising and lowering device 60 is configured to be able to raise and lower the pot 51 together with the push-up pin 71.
  • the raising of the pot 51 is stopped by a stopper mechanism (not shown).
  • the push-up pin 71 protrudes from the upper surface of the pot 51 and pushes up the die D from the back side of the die sheet 43.
  • the first lifting device 61 detects the first linear motor 62, the first Z-axis slider 63 that can be lifted and lowered in the Z-axis direction by driving the first linear motor 62, and the position of the first Z-axis slider 63 in the Z-axis direction.
  • the first Z-axis slider 63 is formed with a first engaging portion 63 a that can be engaged (contacted) with a horizontal portion 74 provided on a pin support 73 that supports the push-up pin 71. As a result, the push-up pin 71 can be raised and lowered as the first Z-axis slider 63 is raised and lowered.
  • the second elevating device 65 includes a second linear motor 66 attached to the first Z-axis slider 63 of the first elevating device 61, a second Z-axis slider 67 capable of moving up and down in the Z-axis direction by driving the second linear motor 66, And a second Z-axis position sensor 68 that detects the position of the second Z-axis slider 67 in the Z-axis direction.
  • the second Z-axis slider 67 is formed with a second engagement portion 67a that can be engaged (contacted) with the lower surface of the flange portion 72 extending in the radial direction below the push-up pin 71. As a result, the push-up pin 71 can be moved up and down as the second Z-axis slider 67 moves up and down.
  • the stroke distance of the second Z-axis slider 67 by the second lifting device 65 is shorter than the stroke distance of the first Z-axis slider 63 by the first lifting device 61.
  • the lifting device 60 can finely adjust the Z-axis position of the push-up pin 71 by the second lifting device 65 after roughly adjusting the Z-axis position of the push-up pin 71 by the first lifting device 61.
  • the second Z-axis slider 67 is provided with a load cell 69 for detecting a load F acting on the push-up pin 71 when the push-up pin 71 pushes up the die D.
  • the control device 29 is configured as a microprocessor centered on a CPU, and includes a ROM, a RAM, an input / output port, and the like. As shown in FIG. 3, the control device 29 includes a mounting head 22 (Z position sensor 32 and rotational position sensor), a head moving device 23 (position sensor), a parts camera 25, a mark camera 26, a tape supply device 28, a pallet. Signals from the drawing device 44 and the die peeling device 50 (the first Z-axis position sensor 64, the second Z-axis position sensor 68, and the load cell 69) are input via the input port.
  • control device 29 includes a substrate transport device 21 and a mounting head 22 (elevating device 31 and rotating device 33, switching valve 36), parts camera 25, mark camera 26, tape supply device 28, pallet drawing device 64, die peeling device.
  • a signal is output to 50 (the pot moving device 52, the first lifting device 61, the second lifting device 65) via the output port.
  • the management PC 80 is communicably connected to the control device 29 of the component mounting apparatus 20 and manages job information and the like.
  • the job information includes, for example, information such as the mounting order of components, the type and size of components to be mounted, the device to be used, the size of the substrate S, and the number of products to be produced.
  • FIG. 6 is a flowchart illustrating an example of the pickup process
  • FIG. 7 is a flowchart illustrating an example of the die peeling process.
  • the pick-up process and the die peeling process are executed in parallel by the control device 29 when a production command including job information is received from the management PC 80.
  • the pick-up process and the die peeling process are executed by the same control device 29, but may be executed by different control devices capable of exchanging signals with each other.
  • the control device 29 first drives and controls the head moving device 23 to move the suction nozzle 24 directly above the die D (target die) to be picked up (step S100).
  • the control device 29 drives and controls the lifting device 31 to lower the suction nozzle 24 (step S105), and determines whether or not the position of the suction nozzle 24 in the Z-axis direction has reached the target position P1 (Ste S110).
  • the target position P ⁇ b> 1 is a position where the suction nozzle 24 picks up the die D, and is set to a position corresponding to the position of the die D when the die D is peeled from the die sheet 43 by the die peeling device 50.
  • step S115 the drive of the lifting / lowering device 31 is stopped (step S115), and the switching valve 36 is driven and supplied to the suction port of the suction nozzle 24 (step S120).
  • step S125 the die peeling device 50 to complete pushing up of the target die by the push-up pin 71 (step S125), and drives and controls the lifting device 31 to raise the suction nozzle 24 (step S130). ), The pickup process is terminated.
  • step S125 is performed based on the determination result of step S235 of the die peeling process.
  • the control device 29 first drives and controls the pot moving device 52 to move the pot 51 directly below the target die (step S200).
  • the control device 29 drives and controls the first lifting device 61 to raise the push-up pin 71 at a high speed (step S205).
  • the control device 29 determines whether or not the position of the push-up pin 71 specified based on the signals from the first Z-axis position sensor 64 and the second Z-axis position sensor 68 has reached the specified position. (Step S210).
  • the specified position is determined as a position that is a predetermined distance before the position where the push-up pin 71 contacts the die sheet 43.
  • control device 29 determines that the position of the push-up pin 71 has not reached the specified position, the control device 29 continues to raise the push-up pin 71 by the first lifting device 61 and determines that the position of the push-up pin 71 has reached the specified position. Then, the driving of the first elevating device 61 is stopped (step S215), and the second elevating device 65 is driven and controlled to further raise the push-up pin 71 at a low speed (step S220). Next, the control device 29 determines whether or not the push-up pin 71 has started to push up the target die (step S225). This process can be performed, for example, by determining whether or not the load F acting on the push-up pin 71 detected by the load cell 69 exceeds a predetermined load.
  • the control device 29 determines that the push-up pin 71 has not started to push up the target die, the control device 29 continues to raise the push-up pin 71. If the control device 29 determines that the push-up pin 71 has started pushing up the target die, the control device 29 The second elevating device 65 is driven and controlled using feedback control so that the acting load F is held at the target load F * (step S230).
  • the target load F * is changed stepwise so as to become smaller as the amount of pushing up the target die by the push-up pin 72 becomes larger (the push-up position becomes higher). I was supposed to.
  • the control device 29 changes the target load F * so as to become smaller as the push-up amount of the push-up pin 71 becomes larger, thereby giving an appropriate push-up load according to the progress of the separation of the die D, and damaging the die D. It can peel from the die sheet 43, without making it.
  • the control device 29 may stop the second lifting device 65 and temporarily stop the raising of the push-up pin 71 when changing the target load F *. . Then, the control device 29 determines whether or not the push-up pin 71 has been pushed up (step S235).
  • This process is a process for determining whether or not the upper surface of the target die is in contact with the tip of the suction nozzle 24, and is specified based on signals from the first Z-axis position sensor 64 and the second Z-axis position sensor 68. This is performed by determining whether or not the position of the push-up pin 71 in the Z-axis direction has reached the target position P2 corresponding to the target position P1 of the suction nozzle 24.
  • the control device 29 determines that the push-up pin 71 has been pushed up, the control device 29 stops driving the second lifting device 65 (step S240) and ends the die peeling process.
  • FIG. 9 is an explanatory view showing a state in which the die D adhered to the die sheet 43 is picked up by the suction nozzle 24 while being peeled off from the die sheet 43.
  • the control device 29 drives and controls the elevating device 31 to lower the suction nozzle 24 from right above the die D to be picked up to a target position (pickup position), and drives and controls the elevating device 60 to control the suction nozzle 24.
  • the push-up pin 71 is raised so as to push up the die D to be picked up (see FIGS. 9A to 9C).
  • the control device 29 raises the push-up pin 71 at a high speed by the first lifting / lowering device 61 until the push-up pin 71 contacts the die sheet 43, and when the push-up pin 71 contacts the die sheet 43, the second lift / lowering is performed.
  • the push-up pin 71 is raised at a low speed by the device 65.
  • the control device 29 drives the second lifting device 65 using feedback control so that the load F acting on the push-up pin 71 becomes the target load F *. Control.
  • the die D can be appropriately peeled from the die sheet 43 without damaging the die D (see FIGS. 9D and 9E).
  • the control device 29 raises the suction nozzle 24 and picks up the die D peeled off from the die sheet 43 (see FIG. 9F).
  • the push-up pin 71 corresponds to “push-up”
  • the first lifting device 61 corresponds to “first push-up device”
  • the second lifting device 65 corresponds to “second push-up device”.
  • the load cell 69 corresponds to a “load measuring unit”
  • the control device 29 corresponds to a “control unit”.
  • the mounting head 23 corresponds to a “head”
  • the suction nozzle 24 corresponds to a “nozzle”
  • the lifting device 31 corresponds to a “nozzle lifting device”.
  • the die separation device 50 for peeling the die D to be picked up from the die sheet 43 is provided.
  • the die peeling device 50 includes a push-up pin 71, a first lift device 61 that lifts and lowers the first Z-axis slider 63, and a second lift that lifts and lowers the push-up pin 71 relative to the first Z-axis slider 63 together with the first Z-axis slider 63. And an elevator device 65.
  • the wafer supply apparatus 40 (die peeling apparatus 50) can raise the push-up pins 71 at a high speed by the first elevating apparatus 61, and can raise it at a low speed by the second elevating apparatus 65 thereafter.
  • the wafer supply apparatus 40 die peeling apparatus 50
  • the wafer supply apparatus 40 can raise the push-up pins 71 at a high speed by the first elevating apparatus 61, and can raise it at a low speed by the second elevating apparatus 65 thereafter.
  • the second lifting device 65 when the second lifting device 65 is driven and the target die is pushed up by the push-up pins 71, the load F acting on the push-up pins 71 is held at the target load F *.
  • the second elevating device 65 is driven and controlled using feedback control. Thereby, it is possible to prevent excessive stress from acting on the target die due to the push-up pins 71 being pushed up, and to effectively prevent damage to the target die.
  • the control device 29 lowers the suction nozzle 24 to the target position P1 in the pickup process of FIG. 6 and then moves the suction nozzle 24 to the target position P1 until the die D is pushed up by the push-up pin 71. It was supposed to be on standby. However, in the pickup process, the control device 29 lowers the suction nozzle 24 until it contacts the die D before the die D is pushed up, and raises the suction nozzle 24 as the die D is pushed up by the push-up pin 71. Also good.
  • control device 29 causes the push-up pin 71 to follow the ascent of the suction nozzle 24 so that the load F becomes the target load F * based on the load F acting on the push-up pin 71. Also good.
  • the target load F * when the die D is pushed up by the push-up pin 71 is changed according to the push-up amount (push-up position) of the push-up pin 71.
  • the die D is pushed by the push-up pin 71.
  • a constant load may be set as the target load F *.
  • the lifting device 60 is provided with the load cell 169 for measuring the load F acting on the push-up pin 71, but the push-up is performed by detecting or estimating the load current of the second linear motor 166.
  • the load acting on the pin 71 may be measured.
  • the first linear motor 62 is used as the actuator of the first lifting device 61.
  • a voice coil motor, a ball screw mechanism, or the like may be used.
  • the 2nd linear motor 66 was used as an actuator of the 2nd raising / lowering apparatus 65, it is good also as a thing using a voice coil motor etc.
  • the lifting device 60 of the die peeling device 50 is configured by the first lifting device 61 and the second lifting device 65, but the mounting head lifting device is configured by the first lifting device and the second lifting device. May be.
  • FIG. 10 is a block diagram showing an outline of the configuration of the mounting head 122 according to the modification.
  • FIG. 11 is a block diagram showing the electrical connection relationship of the component mounting system 110 using the mounting head 122 according to the modification. .
  • the mounting head 122 includes a head main body 122 a, a suction nozzle 24, a rotating device 133, and a lifting device 160.
  • One or more nozzle holders 173 are attached to the mounting head 122, and the suction nozzle 24 is detachably attached to the lower end of the nozzle holder 173.
  • the suction nozzle 24 is attached to the nozzle holder 173 so as to be movable in the vertical direction (Z-axis direction).
  • the nozzle holder 173 includes a compression coil spring (not shown), and the suction nozzle 24 is urged upward with respect to the nozzle holder 173 by the urging force of the compression coil spring.
  • the rotating device 133 includes a rotating motor 133a provided with a gear 133b on a rotating shaft.
  • a gear 176 that meshes with the gear 133 is provided at the upper end of the nozzle holder 173 so that the nozzle holder 173 can move in the Z-axis direction with respect to the gear 133.
  • the mounting head 122 can adjust the nozzle holder 42 to an arbitrary angle by driving the rotary motor 133a. Since the suction nozzle 24 is attached to the nozzle holder 42, the mounting head 122 can adjust the angle of the die D sucked by the suction nozzle 24 by adjusting the angle of the nozzle holder 42.
  • the lifting device 160 includes a first lifting device 161, a second lifting device 165, and a load cell 169 (load measurement unit).
  • the first elevating device 161 detects the first linear motor 162, the first Z-axis slider 163 that can be moved up and down in the Z-axis direction by driving the first linear motor 162, and the position of the first Z-axis slider 163 in the Z-axis direction.
  • the first Z-axis slider 163 is formed with a first engaging portion 163 a that can be engaged (contacted) with a horizontal portion 174 provided in the nozzle holder 173.
  • the second lifting device 165 includes a second linear motor 166 attached to the first Z-axis slider 163 of the first lifting device 161, a second Z-axis slider 167 capable of moving up and down in the Z-axis direction by driving the second linear motor 166, and .
  • the second Z-axis slider 167 is formed with a second engagement portion 167 a that can be engaged (contacted) with the upper surface of the flange portion 172 that extends in the radial direction above the suction nozzle 24.
  • the suction nozzle 24 can be moved up and down as the second Z-axis slider 167 moves up and down.
  • the stroke distance of the second Z-axis slider 167 by the second lifting device 165 is shorter than the stroke distance of the first Z-axis slider 163 by the first lifting device 161.
  • the lifting device 160 roughly adjusts the Z-axis position of the suction nozzle 24 by the first lifting device 161 and then finely adjusts the Z-axis position of the suction nozzle 24 by the second lifting device 165.
  • the second Z-axis slider 167 is provided with a load cell 169 for detecting a load F acting on the suction nozzle 24 when the suction nozzle 24 picks up and picks up the die D.
  • the die peeling device 150 includes one lifting device 131 that lifts and lowers the push-up pin 71 and a Z-axis position sensor 132 that detects the Z-axis position of the push-up pin 71.
  • the lifting device 131 includes a linear motor and a slider that can be moved in the Z-axis direction by the linear motor, and the push-up pin 71 can be lifted and lowered by the slider moving in the Z-axis direction.
  • FIG. 12 is a flowchart showing a modification pickup process
  • FIG. 13 is a flowchart showing a modification die peeling process.
  • the control device 29 of the component mounting apparatus 20 first drives and controls the head moving device 23 to move the suction nozzle 24 directly above the target die to be picked up (step S300).
  • the control device 29 drives and controls the first lifting / lowering device 161 to lower the suction nozzle 24 at a high speed (step S305).
  • the control device 29 determines whether or not the position of the suction nozzle 24 specified based on the signals from the first Z-axis position sensor 164 and the second Z-axis position sensor 168 has reached the specified position. (Step S310).
  • the specified position is determined as a position that is a predetermined distance before the position where the suction nozzle 24 contacts the die D.
  • the controller 29 determines that the position of the suction nozzle 24 has not reached the specified position
  • the controller 29 continues to lower the suction nozzle 24 by the first lifting device 161 and determines that the position of the suction nozzle 24 has reached the specified position. Then, the driving of the first lifting device 161 is stopped (step S315), and the second lifting device 165 is driven and controlled to further lower the suction nozzle 24 at a low speed (step S320). And the control apparatus 29 determines whether the suction nozzle 24 contacted the object die
  • the control device 29 determines that the suction nozzle 24 is not in contact with the target die, the control device 29 continues to lower the suction nozzle 24.
  • the control device 29 drives and controls the switching valve 36.
  • a negative pressure is supplied to the suction port of the suction nozzle 24 (step S330), and the second elevating device 165 is driven and controlled using feedback control so that the load F acting on the suction nozzle 24 is held at the target load F1 (step S330).
  • the target load F1 is a load for maintaining the state in which the suction nozzle 24 is in contact with the target die, and is determined within a range in which excessive stress does not act on the target die.
  • the control device 29 determines whether or not the push-up pin 71 has started to push up the target die (step S340). This process can be performed, for example, by determining whether or not the load F acting on the suction nozzle 24 exceeds a threshold value. If the control device 29 determines that the push-up pin 71 has not started to push up the target die, the control device 29 returns to step S340 to continue the feedback control of the second lifting device 165 using the target load F1. If it is determined that the die has been pushed up, the second lifting device 165 is driven and controlled using feedback control so that the load acting on the suction nozzle 24 is held at the target load F2 (step S345).
  • the target load F2 can determine a load equivalent to the target load F * described above.
  • the control device 29 may change the target load F2 so as to decrease as the push-up amount of the push-up pin 71 increases. Then, the control device 29 determines whether or not the push-up pin 71 has been pushed up (step S350). This process can be determined based on the determination result in step S415 of the die peeling process in FIG. 13 (whether the push-up pin 71 has reached the target position P2). If the control device 29 determines that the push-up pin 71 has not been pushed up, the control device 29 returns to step S345 to continue the feedback control of the second lifting device 165 using the target load F2, and the push-up pin 71 has been pushed up. If it is determined, the first elevating device 161 and the second elevating device 165 are driven and controlled to raise the suction nozzle 24 (step S355), and the pickup process is terminated. Thereby, the target die is picked up by the suction nozzle 24.
  • the control device 29 first drives and controls the pot moving device 52 to move the pot 51 directly below the target die (step S400). Next, the control device 29 waits until the suction nozzle 24 contacts the target die (step S405). This process can be performed based on the determination result of step S325 of the pickup process.
  • the control device 29 determines that the suction nozzle 24 has contacted the target die
  • the control device 29 drives and controls the lifting device 131 to raise the push-up pin 71 (step S410), and the push-up pin is based on the signal from the Z-axis position sensor 132. It is determined whether or not the position of 71 in the Z-axis direction has reached the target position P2 (step S415).
  • the target position P ⁇ b> 2 is the position of the push-up pin 71 corresponding to the pickup position of the suction nozzle 24. If the control device 29 determines that the position of the push-up pin 71 has not reached the target position, the control device 29 continues to raise the push-up pin 71 by the lifting device 131 and determines that the position of the push-up pin 71 has reached the target position P2. Then, the driving of the lifting device 131 is stopped (step S420), and the die peeling process is finished.
  • the mounting head 122 includes the first lifting / lowering device 161, the second lifting / lowering device 165, and the load cell 169. Therefore, for example, the component mounting apparatus 20 can lower the suction nozzle 24 at a high speed by the first lifting device 161 before the suction nozzle 24 contacts the target die, and thereafter the suction nozzle 24 by the second lifting device 165. By lowering 24 at a low speed, the impact when the suction nozzle 24 contacts the target die can be reduced. Further, after the target die comes into contact with the suction nozzle 24, the component mounting apparatus 20 drives and controls the second lifting device 165 using feedback control so that the load F acting on the suction nozzle 24 is held at the target load F1. To do.
  • the suction nozzle 24 can be pressed against the target die with an appropriate load, and the state where the suction nozzle 24 is in contact with the target die can be maintained. Further, when the target die is pushed up by the push-up pin 71, the component mounting apparatus 20 drives and controls the second lifting device 165 using feedback control so that the load F acting on the suction nozzle 24 is held at the target load F2. . Thereby, it is possible to prevent excessive stress from acting on the target die due to the push-up pins 71 being pushed up, and to effectively prevent damage to the target die.
  • the first lifting device 161 corresponds to a “first nozzle lifting device”
  • the second lifting device 165 corresponds to a “second nozzle lifting device”
  • the lifting device 131 is “push-up”.
  • the load cell 169 corresponds to a “load measuring unit”.
  • the load cell 169 for measuring the load F acting on the suction nozzle 24 is provided in the mounting head 122.
  • the suction nozzle 24 is detected by detecting or estimating the load current of the second linear motor 166. It is good also as what measures the load which acts on.
  • this invention is not limited to the Example mentioned above at all, and as long as it belongs to the technical scope of this invention, it cannot be overemphasized that it can implement with a various aspect.
  • the present invention can be used in the manufacturing industry of wafer supply devices and component mounting systems.

Abstract

This wafer feeding apparatus is provided with a die release device that releases a die D to be picked up from a die sheet by pushing up the lower surface of the die sheet by a push-up pin 71 when a component mounting apparatus picks up the die D from the die sheet to which a wafer W has been attached. The die release device is configured by being provided with: the push-up pin 71; a first lifting device 61 that lifts a first Z-axis slider 63; and a second lifting device 65 that lifts the push-up pin 71 with respect to the first Z-axis slider 63 and that is lifted together with the first Z-axis slider 63.

Description

ウエハ供給装置および部品実装装置Wafer supply apparatus and component mounting apparatus
　本発明は、ウエハ供給装置および部品実装装置に関する。 The present invention relates to a wafer supply apparatus and a component mounting apparatus.
　従来より、粘着シートに貼着されたペレット（ダイ）をペレット側から吸着ノズルにより押圧しながら吸着して基板にボンディングするボンディングヘッドと、粘着シートの裏面から突き上げピンを用いて突き上げることにより当該ペレットを粘着シートから剥離させるペレット突き上げユニットとを備える部品実装システムが提案されている（例えば、特許文献１参照）。ペレット突き上げユニットは、突き上げピンを支持しカムの回転に伴って上昇するピン支持体と、カムを駆動するモータと、ピン支持体に設けられた荷重測定器と、を備え、突き上げピンの突き上げ動作に伴いペレットに作用する突き上げ荷重を荷重測定器により測定する。一方、ボンディングヘッドは、突き上げ荷重の測定結果に基づいて吸着ノズルによるペレットの吸着動作に伴いペレットに作用するピックアップ荷重をフィードバック制御により調整する。 Conventionally, a pellet (die) attached to an adhesive sheet is adsorbed while being pressed from the pellet side by an adsorption nozzle and bonded to the substrate, and the pellet is formed by pushing up from the back surface of the adhesive sheet using a push-up pin. There has been proposed a component mounting system including a pellet pushing-up unit that peels a sheet from an adhesive sheet (for example, see Patent Document 1). The pellet push-up unit includes a pin support that supports the push-up pin and rises as the cam rotates, a motor that drives the cam, and a load measuring device provided on the pin support, and push-up operation of the push-up pin Accordingly, the thrust load acting on the pellet is measured by a load measuring device. On the other hand, the bonding head adjusts the pickup load acting on the pellet by feedback control in accordance with the pellet suction operation by the suction nozzle based on the measurement result of the thrust load.
特開２００４－２７３９１０号公報JP 2004-273910 A
　しかしながら、特許文献１記載のシステムでは、常に突き上げ荷重を測定しながらモータによりカムを回転させて突き上げピンを上昇させているため、ペレット（ダイ）の押し上げ動作に時間を要してしまう。 However, in the system described in Patent Document 1, since the push pin is raised by rotating the cam by the motor while always measuring the push load, it takes time to push up the pellet (die).
　本発明は、高速かつ高精度に部品をシートから剥離させることを主目的とする。 The main object of the present invention is to peel parts from a sheet at high speed and with high accuracy.
　本発明は、上述の主目的を達成するために以下の手段を採った。 The present invention adopts the following means in order to achieve the main object described above.
　本発明のウエハ供給装置は、複数の部品に分割されたウエハが貼着されたシートから部品をノズルによりピックアップして対象物に実装する部品実装装置に用いられるウエハ供給装置であって、前記ノズルがピックアップしようとする部品を前記シートの裏側から押し上げるための押上部と、昇降部材を昇降させる第１押上部昇降装置と、前記第１押上部昇降装置により前記昇降部材と共に昇降され、該昇降部材に対して相対的に前記押上部を昇降させる第２押上部昇降装置と、を備えることを要旨とする。 A wafer supply apparatus according to the present invention is a wafer supply apparatus used in a component mounting apparatus that picks up a component from a sheet on which a wafer divided into a plurality of components is attached with a nozzle and mounts the component on an object. A push-up portion for pushing up a component to be picked up from the back side of the sheet, a first push-up lift device that lifts and lowers the lift member, and the lift member is lifted and lowered together with the lift member by the first push-up lift device. And a second pushing-up / lowering device that raises / lowers the pushing-up portion relative to the above.
　この本発明のウエハ供給装置は、ノズルがピックアップしようとする部品をシートの裏側から押し上げる押上部と、昇降部材を昇降させる第１昇降装置と、第１押上部昇降装置により昇降部材と共に昇降されて昇降部材に対して相対的に押上部を昇降させる第２押上部昇降装置と、を備えて構成される。これにより、ウエハ供給装置は、第１押上部昇降装置により押上部を高速に動作させることができる一方、第２押上部昇降装置により押上部を高精度に動作させることができる。この結果、高速かつ高精度に部品をシートから剥離させることができる。 The wafer supply apparatus according to the present invention includes a push-up unit that pushes up a component to be picked up by a nozzle from the back side of the sheet, a first lift unit that lifts and lowers the lift member, and a lift member that is lifted and lowered by the first push-up lift unit. And a second push-up / lift device that raises and lowers the push-up portion relative to the lift member. As a result, the wafer supply apparatus can move the push-up portion at high speed by the first push-up lift device, and can move the push-up portion with high accuracy by the second push-up lift device. As a result, the component can be peeled from the sheet at high speed and with high accuracy.
　こうした本発明のウエハ供給装置において、前記押上部に作用する荷重を測定する荷重測定部と、前記ノズルにより前記部品がピックアップされる際に前記荷重測定部により測定される荷重に基づいて前記押上部が押し上げられるよう前記第１押上部昇降装置および前記第２押上部昇降装置を制御する制御部と、を備えるものとしてもよい。 In such a wafer supply apparatus of the present invention, a load measuring unit for measuring a load acting on the push-up unit, and the push-up unit based on a load measured by the load measuring unit when the part is picked up by the nozzle And a control unit that controls the first push-up lift device and the second push-up lift device so as to be pushed up.
　この態様の本発明のウエハ供給装置において、前記制御部は、前記押上部が所定の押上位置まで押し上げられるよう前記第１押上部昇降装置を制御し、前記押上部で前記部品が押し上げられている状態で前記荷重測定部により測定される荷重が所定の押上荷重範囲内に保持されるよう前記第２押上部昇降装置を制御するものとしてもよい。こうすれば、ウエハ供給装置は、適切な荷重を付与して部品に破損を生じさせることなく部品をシートから剥離させることができる。 In this aspect of the wafer supply apparatus of the present invention, the control unit controls the first push-up / lowering device so that the push-up portion is pushed up to a predetermined push-up position, and the component is pushed up by the push-up portion. It is good also as what controls the said 2nd raising / lowering apparatus so that the load measured by the said load measurement part in a state is hold | maintained in the predetermined | prescribed raising load range. In this way, the wafer supply apparatus can peel the component from the sheet without applying an appropriate load and causing the component to be damaged.
　さらにこの態様の本発明のウエハ供給装置において、前記制御部は、前記押上部で前記部品が押し上げられている状態で前記荷重測定部により測定される荷重が目標荷重に保持されるよう前記第２押上部昇降装置を制御するものであり、前記押上部の押し上げ量または押し上げ位置に応じて前記目標荷重を変化させるものとしてもよい。こうすれば、部品の剥離の進行状況に応じて押し上げ荷重を変化させることができるため、部品を押し上げる際の破損の発生をより確実に抑制することができる。 Furthermore, in the wafer supply apparatus of the present invention according to this aspect, the control unit is configured so that the load measured by the load measurement unit is held at a target load while the component is pushed up by the push-up unit. The push-up device is controlled, and the target load may be changed according to the push-up amount or push-up position of the push-up portion. In this way, the push-up load can be changed according to the progress of peeling of the component, so that the occurrence of breakage when pushing up the component can be more reliably suppressed.
　本発明の第１の部品実装装置は、複数の部品に分割されたウエハが貼着されたシートから部品をノズルによりピックアップして対象物に実装する部品実装装置であって、ヘッドと、ノズルと、前記ヘッドに対して前記ノズルを昇降させるノズル昇降装置と、前記ノズルがピックアップしようとする部品を前記シートの裏側から押し上げるための押上部と、昇降部材を昇降させる第１押上部昇降装置と、前記第１押上部昇降装置により前記昇降部材と共に昇降され該昇降部材に対して相対的に前記押上部を昇降させる第２押上部昇降装置と、前記押上部に作用する荷重を測定する荷重測定部と、前記ノズルが所定のノズル位置まで下降すると共に前記押上部が所定の押上位置まで押し上げられるよう前記ノズル昇降装置と前記第１押上部昇降装置を制御し、前記押上部で前記部品が押し上げられている状態で前記荷重測定部により測定される荷重が所定の押上荷重範囲内に保持されるよう前記第２押上部昇降装置を制御する制御部と、を備えることを要旨とする。 A first component mounting apparatus according to the present invention is a component mounting apparatus that picks up a component from a sheet on which a wafer divided into a plurality of components is attached with a nozzle and mounts the component on an object. A nozzle lifting device that lifts and lowers the nozzle relative to the head, a push-up portion for pushing up a component to be picked up by the nozzle from the back side of the sheet, a first push-up lifting device that lifts and lowers the lifting member, A second raising / lowering device that is raised / lowered together with the raising / lowering member by the first pushing-up / lowering device to raise / lower the raising portion relative to the raising / lowering member; and a load measuring unit that measures a load acting on the raising portion And the nozzle lifting and lowering device and the first push-up and lowering so that the nozzle is lowered to a predetermined nozzle position and the push-up portion is pushed up to a predetermined push-up position. Control for controlling the second push-up lift device so that the load measured by the load measuring unit is held within a predetermined push-up load range in a state where the component is pushed up by the push-up portion And a section.
　この本発明の第１の部品実装装置は、ヘッドと、ノズルと、ヘッドに対してノズルを昇降させるノズル昇降装置と、を備える。また、第１の部品実装装置は、ノズルがピックアップしようとする部品をシートの裏側から押し上げるための押上部と、昇降部材を昇降させる第１押上部昇降装置と、第１押上部昇降装置により昇降部材と共に昇降され昇降部材に対して相対的に押上部を昇降させる第２押上部昇降装置と、押上部に作用する荷重を測定する荷重測定部と、を備える。そして、第１の部品実装装置は、ノズルが所定のノズル位置まで下降すると共に押上部が所定の押上位置まで押し上げられるようノズル昇降装置と第１押上部昇降装置を制御し、押上部で部品が押し上げられている状態で荷重測定部により測定される荷重が所定の押上荷重範囲内に保持されるよう第２押上部昇降装置を制御する。これにより、第１の部品実装装置は、第１押上部昇降装置により押上部を高速に動作させることができる一方、第２押上部昇降装置により押上部を高精度に動作させることができる。この結果、第１の部品実装装置は、高速かつ高精度に部品をシートから剥離させることができる。 The first component mounting apparatus of the present invention includes a head, a nozzle, and a nozzle lifting / lowering device that lifts and lowers the nozzle with respect to the head. In addition, the first component mounting apparatus is moved up and down by a push-up unit for pushing up a component to be picked up by the nozzle from the back side of the sheet, a first push-up unit lifting unit that lifts and lowers the lifting member, and a first push-up unit lifting unit. A second push-up device that lifts and lowers the push-up portion relative to the lift member, and a load measurement unit that measures a load acting on the push-up portion. The first component mounting device controls the nozzle lifting device and the first lifting device so that the nozzle is lowered to the predetermined nozzle position and the lifting portion is pushed up to the predetermined lifting position. The second lifting / lowering device is controlled so that the load measured by the load measuring unit is held within a predetermined lifting load range while being pushed up. As a result, the first component mounting apparatus can move the push-up portion at high speed by the first push-up lift device, and can move the push-up portion with high accuracy by the second push-up lift device. As a result, the first component mounting apparatus can peel the component from the sheet at high speed and with high accuracy.
　本発明の第２の部品実装装置は、複数の部品に分割されたウエハが貼着されたシートから部品をノズルによりピックアップして対象物に実装する部品実装装置であって、ヘッドと、ノズルと、前記ヘッドに対して昇降部材を昇降させる第１ノズル昇降装置と、前記昇降部材と共に昇降され、前記昇降部材に対して前記ノズルを相対的に昇降させる第２ノズル昇降装置と、前記ノズルがピックアップしようとする部品を前記シートの裏側から押し上げるための押上部と、前記押上部を昇降させる押上部昇降装置と、前記ノズルに作用する荷重を測定する荷重測定部と、前記ノズルが所定のノズル位置まで下降すると共に前記押上部が所定の押上位置まで押し上げられるよう前記第１ノズル昇降装置と前記押上部昇降装置を制御し、前記ノズルが前記部品に当接すると共に前記押上部で該部品が押し上げられている状態で前記荷重測定部により測定される荷重が所定の押上荷重範囲内に保持されるよう前記第２ノズル昇降装置を制御する制御部と、を備えることを要旨とする。 A second component mounting apparatus of the present invention is a component mounting apparatus that picks up a component from a sheet on which a wafer divided into a plurality of components is attached by means of a nozzle and mounts it on an object. A first nozzle lifting device that lifts and lowers the lifting member with respect to the head, a second nozzle lifting device that moves up and down together with the lifting member and moves the nozzle relative to the lifting member, and the nozzle picks up A push-up unit for pushing up the component to be pushed from the back side of the sheet, a push-up unit for raising and lowering the push-up unit, a load measuring unit for measuring a load acting on the nozzle, and the nozzle at a predetermined nozzle position The first nozzle lifting device and the lifting portion lifting and lowering device are controlled so that the lifting portion is pushed up to a predetermined lifting position. Control for controlling the second nozzle lifting / lowering device so that the load measured by the load measuring unit is held within a predetermined push-up load range in a state where the part is in contact with the part and the part is pushed up by the push-up unit. And a section.
　この本発明の第２の部品実装装置は、ヘッドと、ノズルと、ヘッドに対して昇降部材を昇降させる第１ノズル昇降装置と、昇降部材と共に昇降され昇降部材に対してノズルを相対的に昇降させる第２ノズル昇降装置と、を備える。また、第２部品実装装置は、ノズルがピックアップしようとする部品を前記シートの裏側から押し上げるための押上部と、押上部を昇降させる押上部昇降装置と、ノズルに作用する荷重を測定する荷重測定部と、を備える。そして、第２の部品実装装置は、ノズルが所定のノズル位置まで下降すると共に押上部が所定の押上位置まで押し上げられるよう第１ノズル昇降装置と押上部昇降装置を制御し、ノズルが部品に当接すると共に押上部で部品が押し上げられている状態で荷重測定部により測定される荷重が所定の押上荷重範囲内に保持されるよう第２ノズル昇降装置を制御する。これにより、第２の部品実装装置は、第１ノズル昇降装置によりノズルを高速に動作させることができる一方、第２ノズル昇降装置によりノズルを高精度に動作させることができる。この結果、第２の部品実装装置は、高速かつ高精度に部品をシートから剥離させてノズルでピックアップすることができる。 The second component mounting apparatus according to the present invention includes a head, a nozzle, a first nozzle lifting / lowering device that lifts and lowers the lifting member with respect to the head, and lifts and lowers the nozzle relative to the lifting member. A second nozzle lifting / lowering device. In addition, the second component mounting apparatus includes a push-up unit for pushing up a component to be picked up by the nozzle from the back side of the sheet, a push-up unit lifting device for raising and lowering the push-up unit, and load measurement for measuring a load acting on the nozzle. A section. Then, the second component mounting apparatus controls the first nozzle lifting device and the lifting unit lifting device so that the nozzle is lowered to a predetermined nozzle position and the raising portion is pushed up to a predetermined lifting position, and the nozzle hits the component. The second nozzle lifting device is controlled so that the load measured by the load measuring unit is held within a predetermined push-up load range in a state where the component is pushed up by the push-up portion. Thereby, the second component mounting apparatus can operate the nozzle at high speed by the first nozzle lifting apparatus, and can operate the nozzle with high accuracy by the second nozzle lifting apparatus. As a result, the second component mounting apparatus can peel the component from the sheet at high speed and with high accuracy and pick it up with the nozzle.
　こうした本発明の第２の部品実装装置において、前記制御部は、前記ノズルが前記所定のノズル位置まで下降するよう前記第１ノズル昇降装置を制御し、該ノズルが前記部品に当接すると共に前記荷重測定部により測定される荷重が所定の当接荷重範囲内となるよう前記第２ノズル昇降装置を制御し、前記押上部により前記部品が押し上げられるよう前記押上部昇降装置を制御し、前記ノズルが前記部品に当接すると共に前記押上部で該部品が押し上げられている状態で前記荷重測定部により測定される荷重が所定の押上荷重範囲内に保持されるよう前記第２ノズル昇降装置を制御するものとしてもよい。こうすれば、ノズルが部品に当接する際に当該部品に過大な荷重が作用するのを抑制して部品の破損をより確実に抑制することができる。 In such a second component mounting apparatus of the present invention, the control unit controls the first nozzle lifting device so that the nozzle is lowered to the predetermined nozzle position, the nozzle abuts on the component and the load. The second nozzle lifting device is controlled so that the load measured by the measuring unit is within a predetermined contact load range, the push-up device lifting device is controlled so that the component is pushed up by the pushing-up portion, and the nozzle is The second nozzle lifting device is controlled so that the load measured by the load measuring unit is held within a predetermined push-up load range when the component is in contact with the component and the component is pushed up by the push-up unit. It is good. If it carries out like this, when a nozzle contact | abuts to components, it can suppress that an excessive load acts on the said components, and can suppress damage of components more reliably.
部品実装システム１０の構成の概略を示す構成図である。1 is a configuration diagram showing an outline of the configuration of a component mounting system 10. FIG. ダイ剥離装置５０の構成の概略を示す上面図である。3 is a top view illustrating a schematic configuration of a die peeling apparatus 50. FIG. ダイ剥離装置５０の構成の概略を示す側面図である。2 is a side view showing an outline of a configuration of a die peeling apparatus 50. FIG. 昇降装置６０の構成の概略を示す構成図である。FIG. 3 is a configuration diagram showing an outline of the configuration of the lifting device 60. 部品実装システム１０の電気的な接続関係を示すブロック図である。2 is a block diagram showing an electrical connection relationship of the component mounting system 10. FIG. ピックアップ処理の一例を示すフローチャートである。It is a flowchart which shows an example of a pick-up process. ダイ剥離処理の一例を示すフローチャートである。It is a flowchart which shows an example of die | dye peeling process. 目標荷重Ｆ＊と押上ピン７１の押し上げ量との関係を示す説明図である。It is explanatory drawing which shows the relationship between the target load F * and the pushing-up amount of the raising pin 71. FIG. ダイシート４３に貼着されたダイＤをダイシート４３から剥離しながら吸着ノズル２４でピックアップする様子を示す説明図である。It is explanatory drawing which shows a mode that the die | dye D stuck to the die sheet 43 is picked up with the adsorption nozzle 24, peeling from the die sheet 43. FIG. 変形例の実装ヘッド１２２の構成の概略を示す構成図である。It is a block diagram which shows the outline of a structure of the mounting head 122 of a modification. 変形例の実装ヘッド１２２を用いた部品実装システム１１０の電気的な接続関係を示すブロック図である。It is a block diagram which shows the electrical connection relation of the component mounting system 110 using the mounting head 122 of the modification. 変形例のピックアップ処理を示すフローチャートである。It is a flowchart which shows the pick-up process of a modification. 変形例のダイ剥離処理を示すフローチャートである。It is a flowchart which shows the die | dye peeling process of a modification.
　次に、本発明の実施形態を図面を参照しながら説明する。 Next, an embodiment of the present invention will be described with reference to the drawings.
　図１は、部品実装システム１０の構成の概略を示す構成図であり、図２は、ダイ剥離装置５０の構成の概略を示す上面図であり、図３は、ダイ剥離装置５０の構成の概略を示す側面図であり、図４は、昇降装置６０の構成の概略を示す構成図であり、図５は、部品実装システム１０の電気的な接続関係を示すブロック図である。なお、図１中、左右方向はＸ軸方向であり、前後方向はＹ軸方向であり、上下方向はＺ軸方向である。 FIG. 1 is a configuration diagram showing an outline of the configuration of the component mounting system 10, FIG. 2 is a top view showing an outline of the configuration of the die peeling apparatus 50, and FIG. 3 is an outline of the configuration of the die peeling apparatus 50. 4 is a block diagram showing an outline of the configuration of the lifting device 60, and FIG. 5 is a block diagram showing an electrical connection relationship of the component mounting system 10. As shown in FIG. In FIG. 1, the left-right direction is the X-axis direction, the front-rear direction is the Y-axis direction, and the up-down direction is the Z-axis direction.
　部品実装システム１０は、図１に示すように、ウエハＷを分割したダイＤなどの部品を対象物（基板Ｓや他の部品など）上に実装するシステムであり、部品実装装置２０と、管理コンピュータ（ＰＣ）８０とを備える。部品実装システム１０は、部品を基板Ｓに実装する複数台の部品実装装置２０が上流から下流に配置されている。図１では、説明の便宜のため部品実装装置２０を１台のみ示している。なお、部品実装システム１０は、部品実装装置２０と同じ実装ライン上に半田印刷機や検査機、リフロー炉などを備えるものとしてもよい。 As shown in FIG. 1, the component mounting system 10 is a system for mounting a component such as a die D obtained by dividing a wafer W on an object (substrate S, other components, etc.). And a computer (PC) 80. In the component mounting system 10, a plurality of component mounting apparatuses 20 that mount components on a substrate S are arranged from upstream to downstream. In FIG. 1, only one component mounting apparatus 20 is shown for convenience of explanation. The component mounting system 10 may include a solder printer, an inspection machine, a reflow furnace, and the like on the same mounting line as the component mounting apparatus 20.
　部品実装装置２０は、基板搬送装置２１と、実装ヘッド２２と、ヘッド移動装置２３と、吸着ノズル２４と、パーツカメラ２５と、マークカメラ２６と、テープ供給装置２８と、ウエハ供給装置４０と、制御装置２９とを備える。基板搬送装置２１は、基板Ｓの搬入、搬送、実装位置での固定、搬出を行なう。基板搬送装置２１は、図１の前後に間隔を開けて設けられ左右方向に架け渡された１対のコンベアベルトを有している。基板Ｓはこのコンベアベルトにより搬送される。 The component mounting apparatus 20 includes a substrate transfer device 21, a mounting head 22, a head moving device 23, a suction nozzle 24, a parts camera 25, a mark camera 26, a tape supply device 28, a wafer supply device 40, And a control device 29. The substrate transport device 21 carries in, transports, fixes and unloads the substrate S at the mounting position. The substrate transport device 21 has a pair of conveyor belts provided at intervals in the front and rear direction of FIG. The board | substrate S is conveyed by this conveyor belt.
　実装ヘッド２２は、ウエハ供給装置４０から供給されるダイＤやテープ供給装置２８から供給される部品をピックアップし、基板搬送装置２１に固定された基板Ｓへ実装するヘッドであり、ヘッド移動装置２３によってＸＹ軸方向に移動可能となっている。ヘッド移動装置２３は、ガイドレールに導かれてＸＹ軸方向へ移動するスライダと、スライダを駆動するモータと、スライダのＸＹ軸方向の位置を検出する位置センサとを備える。実装ヘッド２２には１以上のノズルホルダが取り付けられ、ノズルホルダの下面には吸着ノズル２４が取り外し可能に取り付けられている。吸着ノズル２４は、その吸着口が切替弁３６（電磁弁）を介して負圧源と正圧源とに連通しており、切替弁３６を駆動することにより吸着口に負圧を作用させて部品を吸着したり吸着口に正圧を作用させて部品の吸着を解除したりすることができるようになっている。また、実装ヘッド２２は、昇降装置３１を内蔵しており、昇降装置３１によってＺ軸に沿って吸着ノズル２４の高さを調整可能となっている。昇降装置３１は、Ｚ軸方向へ移動するスライダと、スライダを駆動するモータと、スライダのＺ軸方向の位置を検出するＺ軸位置センサ３２とを備える。また、実装ヘッド２２は、回転装置３３を内蔵しており、昇降装置３１によって吸着ノズル２４に吸着された部品の角度を調整可能となっている。回転装置３３は、吸着ノズル２４を保持するノズルホルダを回転させるモータと、モータの回転位置を検出する回転位置センサとを備える。 The mounting head 22 is a head that picks up the components supplied from the die D and the tape supply device 28 supplied from the wafer supply device 40 and mounts them on the substrate S fixed to the substrate transfer device 21. Thus, it can be moved in the XY-axis direction. The head moving device 23 includes a slider that is guided by a guide rail and moves in the XY axis direction, a motor that drives the slider, and a position sensor that detects the position of the slider in the XY axis direction. One or more nozzle holders are attached to the mounting head 22, and a suction nozzle 24 is detachably attached to the lower surface of the nozzle holder. The suction nozzle 24 has a suction port communicating with a negative pressure source and a positive pressure source via a switching valve 36 (electromagnetic valve), and driving the switching valve 36 causes a negative pressure to act on the suction port. The component can be sucked or the suction of the component can be released by applying a positive pressure to the suction port. The mounting head 22 has a built-in lifting device 31, and the height of the suction nozzle 24 can be adjusted along the Z axis by the lifting device 31. The lifting device 31 includes a slider that moves in the Z-axis direction, a motor that drives the slider, and a Z-axis position sensor 32 that detects the position of the slider in the Z-axis direction. Further, the mounting head 22 has a built-in rotating device 33 and can adjust the angle of the component sucked by the suction nozzle 24 by the lifting device 31. The rotation device 33 includes a motor that rotates a nozzle holder that holds the suction nozzle 24 and a rotation position sensor that detects a rotation position of the motor.
　パーツカメラ２５は、基板搬送装置２１とテープ供給装置２８との間に設けられている。パーツカメラ２５は、部品を吸着した吸着ノズル２４がパーツカメラ２５の上方を通過する際、吸着ノズル２４に吸着された部品を下方から撮像し、その画像を制御装置２９へ出力する。 The parts camera 25 is provided between the substrate transport device 21 and the tape supply device 28. When the suction nozzle 24 that sucks a part passes above the part camera 25, the parts camera 25 captures the part sucked by the suction nozzle 24 from below and outputs the image to the control device 29.
　マークカメラ２６は、ＸＹ軸方向に移動可能にヘッド移動装置２３に設けられている。マークカメラ２６は、基板Ｓが搬送されたときに基板Ｓの位置を確認するために基板Ｓに設けられた位置決め基準マークを上方から撮像し、その画像を制御装置２９へ出力する。また、マークカメラ２６は、実装ヘッド２２がピックアップしようとするダイＤを含むウエハＷを上方から撮像し、その画像を制御装置２９へ出力する。 The mark camera 26 is provided in the head moving device 23 so as to be movable in the XY axis directions. The mark camera 26 images from above the positioning reference mark provided on the substrate S in order to confirm the position of the substrate S when the substrate S is transported, and outputs the image to the control device 29. Further, the mark camera 26 images the wafer W including the die D to be picked up by the mounting head 22 from above, and outputs the image to the control device 29.
　テープ供給装置２８は、部品が収容されたテープが巻回されたリールを備え、リールからテープを引き出すことにより部品を部品実装装置２０へ供給する。 The tape supply device 28 includes a reel on which a tape containing a component is wound, and supplies the component to the component mounting device 20 by pulling out the tape from the reel.
　ウエハ供給装置４０は、ウエハＷを分割したダイＤを実装ヘッド２２の吸着位置に供給する装置であり、ウエハパレット４１と、マガジン４２と、ダイ剥離装置５０と、を備える。ウエハパレット４１は、ウエハＷが貼着されたダイシート４３が張った状態で固定されたものである。このウエハパレット４１は、マガジン４２に複数収容されており、実装ヘッド２２がダイＤを吸着する際にパレット引出装置４４によってマガジン４２から引き出される。 The wafer supply device 40 is a device that supplies the die D obtained by dividing the wafer W to the suction position of the mounting head 22, and includes a wafer pallet 41, a magazine 42, and a die peeling device 50. The wafer pallet 41 is fixed in a state where the die sheet 43 to which the wafer W is adhered is stretched. A plurality of wafer pallets 41 are accommodated in the magazine 42 and are pulled out from the magazine 42 by the pallet pulling device 44 when the mounting head 22 sucks the die D.
　ダイ剥離装置５０は、図２および図３に示すように、ポット５１と、ポット移動装置５２と、押上ピン７１（図４参照）と、昇降装置６０とを備える。ポット５１は、パレット引出装置４４により引き出されたウエハパレット４１の下方に配置され、ポット移動装置５２によってＸＹ軸方向に移動可能となっている。ポット移動装置５２は、ガイドレールに導かれてＸＹ軸方向へ移動するスライダと、スライダを駆動するモータと、スライダのＸＹ軸方向の位置を検出する位置センサとを備える。押上ピン７１は、ポット５１の内部に配置され、ダイシート４３に貼着されたウエハＷの分割されたダイＤのうちピックアップしようとするダイＤをダイシート４３の裏側から押し上げるものである。押上ピン７１の下端部は、ピン支持体７３によって支持されている。押上ピン７１は、ピン支持体７３に対して上下方向（Ｚ軸方向）に移動可能に取り付けられている。ピン支持体７３には図示しない圧縮コイルスプリングが内蔵されており、押上ピン７１は、圧縮コイルスプリングの付勢力によりピン支持体７３に対して下方向に付勢されている。また、押上ピン７１は、ダイＤのサイズに応じて太さや本数などが異なるものが複数種類設けられる。ダイ剥離装置５０は、種類の異なる押上ピン７１を有するポット５１を複数備えており、ダイＤのサイズに応じていずれかのポット５１を選択してダイＤを押し上げることができる。ポット５１の上面には吸引口が設けられており、ダイ剥離装置５０は、ポット５１の上面でダイシート４３を吸引支持させた状態で押上ピン７１を突き上げることにより、ピックアップしようするダイＤだけを押し上げてダイシート４３から剥離させることができる。 2 and 3, the die peeling device 50 includes a pot 51, a pot moving device 52, a push-up pin 71 (see FIG. 4), and a lifting device 60. The pot 51 is arranged below the wafer pallet 41 drawn by the pallet drawing device 44 and can be moved in the XY-axis direction by the pot moving device 52. The pot moving device 52 includes a slider that is guided by a guide rail and moves in the XY axis direction, a motor that drives the slider, and a position sensor that detects the position of the slider in the XY axis direction. The push-up pins 71 are disposed inside the pot 51 and push up the die D to be picked up from the back side of the die sheet 43 among the divided dies D of the wafer W adhered to the die sheet 43. A lower end portion of the push-up pin 71 is supported by a pin support body 73. The push-up pin 71 is attached to the pin support 73 so as to be movable in the vertical direction (Z-axis direction). The pin support 73 incorporates a compression coil spring (not shown), and the push-up pin 71 is urged downward with respect to the pin support 73 by the urging force of the compression coil spring. Further, a plurality of types of push-up pins 71 having different thicknesses and numbers depending on the size of the die D are provided. The die peeling apparatus 50 includes a plurality of pots 51 having different types of push-up pins 71, and can select one of the pots 51 depending on the size of the die D to push up the die D. A suction port is provided on the upper surface of the pot 51, and the die peeling device 50 pushes up only the die D to be picked up by pushing up the push-up pin 71 with the die sheet 43 supported by suction on the upper surface of the pot 51. Can be peeled off from the die sheet 43.
　昇降装置６０は、図４に示すように、第１昇降装置６１と、第２昇降装置６５と、ロードセル６９（荷重計測部）とを備える。昇降装置６０は、押上ピン７１と共にポット５１を昇降可能に構成されており、ポット５１の上面がダイシート４３にほぼ接触する位置まで近接すると、図示しないストッパ機構によってポット５１の上昇が止まり、その後、押上ピン７１がポット５１の上面から突出して、ダイＤをダイシート４３の裏側から押し上げるようになっている。 As shown in FIG. 4, the lifting device 60 includes a first lifting device 61, a second lifting device 65, and a load cell 69 (load measurement unit). The raising and lowering device 60 is configured to be able to raise and lower the pot 51 together with the push-up pin 71. When the upper surface of the pot 51 comes close to a position where it substantially contacts the die sheet 43, the raising of the pot 51 is stopped by a stopper mechanism (not shown). The push-up pin 71 protrudes from the upper surface of the pot 51 and pushes up the die D from the back side of the die sheet 43.
　第１昇降装置６１は、第１リニアモータ６２と、第１リニアモータ６２の駆動によりＺ軸方向に昇降可能な第１Ｚ軸スライダ６３と、第１Ｚ軸スライダ６３のＺ軸方向の位置を検出する第１Ｚ軸位置センサ６４と、を備える。第１Ｚ軸スライダ６３には押上ピン７１を支持するピン支持体７３に設けられた水平部７４に係合（当接）可能な第１係合部６３ａが形成されている。これにより、押上ピン７１は、第１Ｚ軸スライダ６３の昇降に伴って昇降可能となっている。 The first lifting device 61 detects the first linear motor 62, the first Z-axis slider 63 that can be lifted and lowered in the Z-axis direction by driving the first linear motor 62, and the position of the first Z-axis slider 63 in the Z-axis direction. A first Z-axis position sensor 64. The first Z-axis slider 63 is formed with a first engaging portion 63 a that can be engaged (contacted) with a horizontal portion 74 provided on a pin support 73 that supports the push-up pin 71. As a result, the push-up pin 71 can be raised and lowered as the first Z-axis slider 63 is raised and lowered.
　第２昇降装置６５は、第１昇降装置６１の第１Ｚ軸スライダ６３に取り付けられた第２リニアモータ６６と、第２リニアモータ６６の駆動によりＺ軸方向に昇降可能な第２Ｚ軸スライダ６７と、第２Ｚ軸スライダ６７のＺ軸方向の位置を検出する第２Ｚ軸位置センサ６８と、を備える。第２Ｚ軸スライダ６７には、押上ピン７１の下部で径方向に延びるフランジ部７２の下面に係合（当接）可能な第２係合部６７ａが形成されている。これにより、押上ピン７１は、第２Ｚ軸スライダ６７の昇降に伴って昇降可能となっている。本実施形態では、第２昇降装置６５による第２Ｚ軸スライダ６７のストローク距離は、第１昇降装置６１による第１Ｚ軸スライダ６３のストローク距離よりも短くなっている。昇降装置６０は、第１昇降装置６１によって押上ピン７１のＺ軸位置を大まかに調整した後、第２昇降装置６５によって押上ピン７１のＺ軸位置を細かく調整することができる。また、第２Ｚ軸スライダ６７には、押上ピン７１がダイＤを押し上げる際に押上ピン７１に作用する荷重Ｆを検出するためのロードセル６９が設けられている。 The second elevating device 65 includes a second linear motor 66 attached to the first Z-axis slider 63 of the first elevating device 61, a second Z-axis slider 67 capable of moving up and down in the Z-axis direction by driving the second linear motor 66, And a second Z-axis position sensor 68 that detects the position of the second Z-axis slider 67 in the Z-axis direction. The second Z-axis slider 67 is formed with a second engagement portion 67a that can be engaged (contacted) with the lower surface of the flange portion 72 extending in the radial direction below the push-up pin 71. As a result, the push-up pin 71 can be moved up and down as the second Z-axis slider 67 moves up and down. In the present embodiment, the stroke distance of the second Z-axis slider 67 by the second lifting device 65 is shorter than the stroke distance of the first Z-axis slider 63 by the first lifting device 61. The lifting device 60 can finely adjust the Z-axis position of the push-up pin 71 by the second lifting device 65 after roughly adjusting the Z-axis position of the push-up pin 71 by the first lifting device 61. The second Z-axis slider 67 is provided with a load cell 69 for detecting a load F acting on the push-up pin 71 when the push-up pin 71 pushes up the die D.
　制御装置２９は、ＣＰＵを中心とするマイクロプロセッサとして構成されており、ＲＯＭやＲＡＭ、入出力ポートなどを備える。図３に示すように、制御装置２９は、実装ヘッド２２（Ｚ位置センサ３２や回転位置センサ）や、ヘッド移動装置２３（位置センサ）、パーツカメラ２５、マークカメラ２６、テープ供給装置２８、パレット引出装置４４、ダイ剥離装置５０（第１Ｚ軸位置センサ６４や第２Ｚ軸位置センサ６８、ロードセル６９）からの信号を入力ポートを介して入力する。また、制御装置２９は、基板搬送装置２１や実装ヘッド２２（昇降装置３１や回転装置３３、切替弁３６）、パーツカメラ２５、マークカメラ２６、テープ供給装置２８、パレット引出装置６４、ダイ剥離装置５０（ポット移動装置５２や第１昇降装置６１、第２昇降装置６５）へ信号を出力ポートを介して出力する。 The control device 29 is configured as a microprocessor centered on a CPU, and includes a ROM, a RAM, an input / output port, and the like. As shown in FIG. 3, the control device 29 includes a mounting head 22 (Z position sensor 32 and rotational position sensor), a head moving device 23 (position sensor), a parts camera 25, a mark camera 26, a tape supply device 28, a pallet. Signals from the drawing device 44 and the die peeling device 50 (the first Z-axis position sensor 64, the second Z-axis position sensor 68, and the load cell 69) are input via the input port. Further, the control device 29 includes a substrate transport device 21 and a mounting head 22 (elevating device 31 and rotating device 33, switching valve 36), parts camera 25, mark camera 26, tape supply device 28, pallet drawing device 64, die peeling device. A signal is output to 50 (the pot moving device 52, the first lifting device 61, the second lifting device 65) via the output port.
　管理ＰＣ８０は、部品実装装置２０の制御装置２９と通信可能に接続され、ジョブ情報などを管理する。ジョブ情報には、例えば、部品の実装順、実装する部品の種別、サイズ、用いる装置、基板Ｓのサイズ、生産枚数などの情報が含まれている。 The management PC 80 is communicably connected to the control device 29 of the component mounting apparatus 20 and manages job information and the like. The job information includes, for example, information such as the mounting order of components, the type and size of components to be mounted, the device to be used, the size of the substrate S, and the number of products to be produced.
　次に、こうして構成された本実施形態の部品実装システム１０の動作、特に、ダイシート４３に貼着されたダイＤをダイシート４３から剥離しながらピックアップする動作について説明する。図６は、ピックアップ処理の一例を示すフローチャートであり、図７は、ダイ剥離処理の一例を示すフローチャートである。ピックアップ処理およびダイ剥離処理は、本実施形態では、管理ＰＣ８０からジョブ情報を含む生産指令を受信したときに制御装置２９により並行して実行される。なお、本実施形態では、ピックアップ処理およびダイ剥離処理は、同じ制御装置２９により実行されるものとしたが、互いに信号のやり取りが可能な異なる制御装置により実行されるものとしてもよい。 Next, the operation of the component mounting system 10 of the present embodiment configured as described above, particularly, the operation of picking up the die D attached to the die sheet 43 while peeling from the die sheet 43 will be described. FIG. 6 is a flowchart illustrating an example of the pickup process, and FIG. 7 is a flowchart illustrating an example of the die peeling process. In this embodiment, the pick-up process and the die peeling process are executed in parallel by the control device 29 when a production command including job information is received from the management PC 80. In the present embodiment, the pick-up process and the die peeling process are executed by the same control device 29, but may be executed by different control devices capable of exchanging signals with each other.
　ピックアップ処理では、制御装置２９は、まず、ヘッド移動装置２３を駆動制御して吸着ノズル２４をピックアップしようとするダイＤ（対象ダイ）の真上に移動させる（ステップＳ１００）。次に、制御装置２９は、昇降装置３１を駆動制御して吸着ノズル２４を下降させ（ステップＳ１０５）、吸着ノズル２４のＺ軸方向の位置が目標位置Ｐ１に到達したか否かを判定する（ステップＳ１１０）。ここで、目標位置Ｐ１は、吸着ノズル２４がダイＤをピックアップする位置であり、ダイ剥離装置５０によりダイシート４３からダイＤを剥離する際のダイＤの位置に対応する位置に定められる。制御装置２９は、吸着ノズル２４の位置が目標位置Ｐ１に到達していないと判定すると、昇降装置３１により吸着ノズル２４の下降を継続させ、吸着ノズル２４の位置が目標位置Ｐ１に到達したと判定すると、昇降装置３１の駆動を停止すると共に（ステップＳ１１５）、切替弁３６を駆動制御して吸着ノズル２４の吸着口に負圧を供給する（ステップＳ１２０）。そして、制御装置２９は、ダイ剥離装置５０において押上ピン７１による対象ダイの押し上げが完了するのを待って（ステップＳ１２５）、昇降装置３１を駆動制御して吸着ノズル２４を上昇させて（ステップＳ１３０）、ピックアップ処理を終了する。なお、ステップＳ１２５の処理は、ダイ剥離処理のステップＳ２３５の判定結果に基づいて行なわれる。 In the pick-up process, the control device 29 first drives and controls the head moving device 23 to move the suction nozzle 24 directly above the die D (target die) to be picked up (step S100). Next, the control device 29 drives and controls the lifting device 31 to lower the suction nozzle 24 (step S105), and determines whether or not the position of the suction nozzle 24 in the Z-axis direction has reached the target position P1 ( Step S110). Here, the target position P <b> 1 is a position where the suction nozzle 24 picks up the die D, and is set to a position corresponding to the position of the die D when the die D is peeled from the die sheet 43 by the die peeling device 50. When the controller 29 determines that the position of the suction nozzle 24 has not reached the target position P1, the controller 29 continues the lowering of the suction nozzle 24 by the lifting device 31, and determines that the position of the suction nozzle 24 has reached the target position P1. Then, the drive of the lifting / lowering device 31 is stopped (step S115), and the switching valve 36 is driven and supplied to the suction port of the suction nozzle 24 (step S120). Then, the control device 29 waits for the die peeling device 50 to complete pushing up of the target die by the push-up pin 71 (step S125), and drives and controls the lifting device 31 to raise the suction nozzle 24 (step S130). ), The pickup process is terminated. The process of step S125 is performed based on the determination result of step S235 of the die peeling process.
　一方、ダイ剥離処理では、制御装置２９は、まず、ポット移動装置５２を駆動制御して対象ダイの真下にポット５１を移動させる（ステップＳ２００）。次に、制御装置２９は、第１昇降装置６１を駆動制御して押上ピン７１を高速で上昇させる（ステップＳ２０５）。そして、制御装置２９は、第１Ｚ軸位置センサ６４および第２Ｚ軸位置センサ６８からの信号に基づいて特定される押上ピン７１のＺ軸方向の位置が規定位置に到達したか否かを判定する（ステップＳ２１０）。ここで、規定位置は、押上ピン７１がダイシート４３と接触する位置よりも所定距離だけ手前の位置として定められている。制御装置２９は、押上ピン７１の位置が規定位置に到達していないと判定すると、第１昇降装置６１による押上ピン７１の上昇を継続させ、押上ピン７１の位置が規定位置に到達したと判定すると、第１昇降装置６１の駆動を停止すると共に（ステップＳ２１５）、第２昇降装置６５を駆動制御して押上ピン７１を低速で更に上昇させる（ステップＳ２２０）。次に、制御装置２９は、押上ピン７１が対象ダイの押し上げを開始したか否かを判定する（ステップＳ２２５）。この処理は、例えば、ロードセル６９により検出される押上ピン７１に作用する荷重Ｆが所定荷重を超えたか否かを判定することにより行なうことができる。制御装置２９は、押上ピン７１による対象ダイの押し上げが開始されていないと判定すると、押上ピン７１の上昇を継続させ、押上ピン７１による対象ダイの押し上げが開始されたと判定すると、押上ピン７１に作用する荷重Ｆが目標荷重Ｆ＊に保持されるようフィードバック制御を用いて第２昇降装置６５を駆動制御する（ステップＳ２３０）。ここで、目標荷重Ｆ＊は、本実施形態では、図８に例示するように、押上ピン７２による対象ダイの押し上げ量が大きくなる（押し上げ位置が高くなる）につれて小さくなるよう段階的に変化させるものとした。ダイＤは下面全面がダイシート４３に貼着されているため、ダイＤをダイシート４３の裏側から押し上げてダイシート４３から剥離させるには比較的高い初期荷重をもって押上ピン７１を押し上げる必要がある。ダイＤは、押上ピン７２により押し上げられると、最初は外周縁からゆっくりと剥離していく。そして、ダイＤは、剥離が進むにつれて、ダイシート４３との貼着面積が小さくなるため、剥離の速度が速くなり、必要な荷重も小さくなる。制御装置２９は、押上ピン７１の押し上げ量が大きくなるにつれて小さくなるよう目標荷重Ｆ＊を変化させることにより、ダイＤの剥離の進行状況に応じた適切な押し上げ荷重を付与し、ダイＤを破損させることなくダイシート４３から剥離させることができる。ここで、制御装置２９は、制御性を向上させるため、目標荷重Ｆ＊を変化させる際には、第２昇降装置６５を停止して押上ピン７１の上昇を一時的に停止させるものとしてもよい。そして、制御装置２９は、押上ピン７１の押し上げが完了したか否かを判定する（ステップＳ２３５）。この処理は、対象ダイの上面が吸着ノズル２４の先端と接触したか否かを判定するための処理であり、第１Ｚ軸位置センサ６４および第２Ｚ軸位置センサ６８からの信号に基づいて特定される押上ピン７１のＺ軸方向の位置が吸着ノズル２４の目標位置Ｐ１に対応する目標位置Ｐ２に到達したか否かを判定することにより行なわれる。そして、制御装置２９は、押上ピン７１の押し上げが完了したと判定すると、第２昇降装置６５の駆動を停止して（ステップＳ２４０）、ダイ剥離処理を終了する。 On the other hand, in the die peeling process, the control device 29 first drives and controls the pot moving device 52 to move the pot 51 directly below the target die (step S200). Next, the control device 29 drives and controls the first lifting device 61 to raise the push-up pin 71 at a high speed (step S205). Then, the control device 29 determines whether or not the position of the push-up pin 71 specified based on the signals from the first Z-axis position sensor 64 and the second Z-axis position sensor 68 has reached the specified position. (Step S210). Here, the specified position is determined as a position that is a predetermined distance before the position where the push-up pin 71 contacts the die sheet 43. If the control device 29 determines that the position of the push-up pin 71 has not reached the specified position, the control device 29 continues to raise the push-up pin 71 by the first lifting device 61 and determines that the position of the push-up pin 71 has reached the specified position. Then, the driving of the first elevating device 61 is stopped (step S215), and the second elevating device 65 is driven and controlled to further raise the push-up pin 71 at a low speed (step S220). Next, the control device 29 determines whether or not the push-up pin 71 has started to push up the target die (step S225). This process can be performed, for example, by determining whether or not the load F acting on the push-up pin 71 detected by the load cell 69 exceeds a predetermined load. If the control device 29 determines that the push-up pin 71 has not started to push up the target die, the control device 29 continues to raise the push-up pin 71. If the control device 29 determines that the push-up pin 71 has started pushing up the target die, the control device 29 The second elevating device 65 is driven and controlled using feedback control so that the acting load F is held at the target load F * (step S230). Here, in this embodiment, as shown in FIG. 8, the target load F * is changed stepwise so as to become smaller as the amount of pushing up the target die by the push-up pin 72 becomes larger (the push-up position becomes higher). I was supposed to. Since the entire lower surface of the die D is adhered to the die sheet 43, it is necessary to push up the push-up pin 71 with a relatively high initial load in order to push the die D from the back side of the die sheet 43 and peel it from the die sheet 43. When the die D is pushed up by the push-up pin 72, the die D is slowly peeled off from the outer peripheral edge at first. And as die | dye D progresses, since the sticking area with die sheet | seat 43 becomes small as peeling progresses, the speed | rate of peeling becomes quick and a required load also becomes small. The control device 29 changes the target load F * so as to become smaller as the push-up amount of the push-up pin 71 becomes larger, thereby giving an appropriate push-up load according to the progress of the separation of the die D, and damaging the die D. It can peel from the die sheet 43, without making it. Here, in order to improve controllability, the control device 29 may stop the second lifting device 65 and temporarily stop the raising of the push-up pin 71 when changing the target load F *. . Then, the control device 29 determines whether or not the push-up pin 71 has been pushed up (step S235). This process is a process for determining whether or not the upper surface of the target die is in contact with the tip of the suction nozzle 24, and is specified based on signals from the first Z-axis position sensor 64 and the second Z-axis position sensor 68. This is performed by determining whether or not the position of the push-up pin 71 in the Z-axis direction has reached the target position P2 corresponding to the target position P1 of the suction nozzle 24. When the control device 29 determines that the push-up pin 71 has been pushed up, the control device 29 stops driving the second lifting device 65 (step S240) and ends the die peeling process.
　図９はダイシート４３に貼着されたダイＤをダイシート４３から剥離しながら吸着ノズル２４でピックアップする様子を示す説明図である。制御装置２９は、昇降装置３１を駆動制御してピックアップしようとするダイＤの真上から目標位置（ピックアップ位置）まで吸着ノズル２４を下降させると共に、昇降装置６０を駆動制御して吸着ノズル２４がピックアップしようとするダイＤを押し上げるよう押上ピン７１を上昇させる（図９（ａ）～（ｃ）参照）。具体的には、制御装置２９は、押上ピン７１がダイシート４３に接触するまでは、第１昇降装置６１によって押上ピン７１を高速で上昇させ、押上ピン７１がダイシート４３に接触すると、第２昇降装置６５によって押上ピン７１を低速で上昇させる。そして、制御装置２９は、押上ピン７１によりダイＤの押し上げが開始されると、押上ピン７１に作用する荷重Ｆが目標荷重Ｆ＊となるようにフィードバック制御を用いて第２昇降装置６５を駆動制御する。これにより、ダイＤを破損させることなく、ダイＤをダイシート４３から適切に剥離させることができる（図９（ｄ），（ｅ）参照）。制御装置２９は、押上ピン７１によるダイＤの押し上げが完了すると、吸着ノズル２４を上昇させてダイシート４３から剥離されたダイＤをピックアップする（図９（ｆ）参照）。 FIG. 9 is an explanatory view showing a state in which the die D adhered to the die sheet 43 is picked up by the suction nozzle 24 while being peeled off from the die sheet 43. The control device 29 drives and controls the elevating device 31 to lower the suction nozzle 24 from right above the die D to be picked up to a target position (pickup position), and drives and controls the elevating device 60 to control the suction nozzle 24. The push-up pin 71 is raised so as to push up the die D to be picked up (see FIGS. 9A to 9C). Specifically, the control device 29 raises the push-up pin 71 at a high speed by the first lifting / lowering device 61 until the push-up pin 71 contacts the die sheet 43, and when the push-up pin 71 contacts the die sheet 43, the second lift / lowering is performed. The push-up pin 71 is raised at a low speed by the device 65. When the push-up pin 71 starts to push up the die D, the control device 29 drives the second lifting device 65 using feedback control so that the load F acting on the push-up pin 71 becomes the target load F *. Control. Thereby, the die D can be appropriately peeled from the die sheet 43 without damaging the die D (see FIGS. 9D and 9E). When the pushing up of the die D by the push-up pin 71 is completed, the control device 29 raises the suction nozzle 24 and picks up the die D peeled off from the die sheet 43 (see FIG. 9F).
　ここで、本実施形態の主要な要素と発明の開示の欄に記載した発明の主要な要素との対応関係について説明する。即ち、押上ピン７１が「押上部」に相当し、第１昇降装置６１が「第１押上部昇降装置」に相当し、第２昇降装置６５が「第２押上部昇降装置」に相当する。また、ロードセル６９が「荷重測定部」に相当し、制御装置２９が「制御部」に相当する。また、実装ヘッド２３が「ヘッド」に相当し、吸着ノズル２４が「ノズル」に相当し、昇降装置３１が「ノズル昇降装置」に相当する。 Here, the correspondence between the main elements of the present embodiment and the main elements of the invention described in the disclosure section of the invention will be described. That is, the push-up pin 71 corresponds to “push-up”, the first lifting device 61 corresponds to “first push-up device”, and the second lifting device 65 corresponds to “second push-up device”. Further, the load cell 69 corresponds to a “load measuring unit”, and the control device 29 corresponds to a “control unit”. Further, the mounting head 23 corresponds to a “head”, the suction nozzle 24 corresponds to a “nozzle”, and the lifting device 31 corresponds to a “nozzle lifting device”.
　以上説明した本実施形態のウエハ供給装置４０は、実装ヘッド２２が、ウエハＷが貼着されたダイシート４３からダイＤをピックアップする際に、ダイＤをダイシート４３の裏側から押上ピン７１により押し上げることで、ピックアップしようとするダイＤをダイシート４３から剥離させるダイ隔離装置５０を備える。ダイ剥離装置５０は、押上ピン７１と、第１Ｚ軸スライダ６３を昇降させる第１昇降装置６１と、第１Ｚ軸スライダ６３と共に昇降され第１Ｚ軸スライダ６３に対して押上ピン７１を昇降させる第２昇降装置６５とを備えて構成される。これにより、ウエハ供給装置４０（ダイ剥離装置５０）は、第１昇降装置６１により押上ピン７１を高速で上昇させることができ、それ以降は第２昇降装置６５により低速で上昇させることができる。この結果、ダイＤを押上ピン７１で押し上げる際にダイＤに過大な応力が作用するのを抑制し、ダイＤを破損させることなく、ダイＤの剥離動作を素早く実行することができる。 In the wafer supply apparatus 40 according to the present embodiment described above, when the mounting head 22 picks up the die D from the die sheet 43 to which the wafer W is adhered, the die D is pushed up from the back side of the die sheet 43 by the push-up pins 71. The die separation device 50 for peeling the die D to be picked up from the die sheet 43 is provided. The die peeling device 50 includes a push-up pin 71, a first lift device 61 that lifts and lowers the first Z-axis slider 63, and a second lift that lifts and lowers the push-up pin 71 relative to the first Z-axis slider 63 together with the first Z-axis slider 63. And an elevator device 65. Thereby, the wafer supply apparatus 40 (die peeling apparatus 50) can raise the push-up pins 71 at a high speed by the first elevating apparatus 61, and can raise it at a low speed by the second elevating apparatus 65 thereafter. As a result, when the die D is pushed up by the push-up pin 71, it is possible to suppress excessive stress from acting on the die D, and to quickly execute the peeling operation of the die D without damaging the die D.
　また、本実施形態のウエハ供給装置４０は、第２昇降装置６５を駆動して押上ピン７１により対象ダイを押し上げる際には押上ピン７１に作用する荷重Ｆが目標荷重Ｆ＊に保持されるようにフィードバック制御を用いて第２昇降装置６５を駆動制御する。これにより、押上ピン７１の押し上げによって対象ダイに過大な応力が作用するのを防止し、対象ダイの破損を効果的に抑制することができる。 Further, in the wafer supply apparatus 40 of the present embodiment, when the second lifting device 65 is driven and the target die is pushed up by the push-up pins 71, the load F acting on the push-up pins 71 is held at the target load F *. The second elevating device 65 is driven and controlled using feedback control. Thereby, it is possible to prevent excessive stress from acting on the target die due to the push-up pins 71 being pushed up, and to effectively prevent damage to the target die.
　なお、本発明は上述した実施形態に何ら限定されることはなく、本発明の技術的範囲に属する限り種々の態様で実施し得ることはいうまでもない。 It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.
　例えば、上述した実施形態では、制御装置２９は、図６のピックアップ処理において、吸着ノズル２４を目標位置Ｐ１まで下降させた後、押上ピン７１によってダイＤが押し上げられるまで吸着ノズル２４を目標位置Ｐ１で待機させるものとした。しかし、制御装置２９は、ピックアップ処理において、ダイＤが押し上げられる前に吸着ノズル２４をダイＤに接触するまで下降させ、押上ピン７１によるダイＤの押し上げに伴って吸着ノズル２４を上昇させるものとしてもよい。この場合、制御装置２９は、ダイ剥離処理において、押上ピン７１に作用する荷重Ｆに基づいて当該荷重Ｆが目標荷重Ｆ＊となるように吸着ノズル２４の上昇に押上ピン７１を追従させるものとしてもよい。 For example, in the above-described embodiment, the control device 29 lowers the suction nozzle 24 to the target position P1 in the pickup process of FIG. 6 and then moves the suction nozzle 24 to the target position P1 until the die D is pushed up by the push-up pin 71. It was supposed to be on standby. However, in the pickup process, the control device 29 lowers the suction nozzle 24 until it contacts the die D before the die D is pushed up, and raises the suction nozzle 24 as the die D is pushed up by the push-up pin 71. Also good. In this case, in the die peeling process, the control device 29 causes the push-up pin 71 to follow the ascent of the suction nozzle 24 so that the load F becomes the target load F * based on the load F acting on the push-up pin 71. Also good.
　また、上述した実施形態では、押上ピン７１でダイＤを押し上げる際の目標荷重Ｆ＊を押上ピン７１の押し上げ量（押し上げ位置）に応じて変化させるものとしたが、押上ピン７１でダイＤを押し上げている間、目標荷重Ｆ＊として一定荷重を設定するものとしてもよい。 In the above-described embodiment, the target load F * when the die D is pushed up by the push-up pin 71 is changed according to the push-up amount (push-up position) of the push-up pin 71. However, the die D is pushed by the push-up pin 71. While pushing up, a constant load may be set as the target load F *.
　また、上述した実施形態では、昇降装置６０に押上ピン７１に作用する荷重Ｆを測定するためのロードセル１６９を備えるものとしたが、第２リニアモータ１６６の負荷電流を検出または推定することにより押上ピン７１に作用する荷重を測定するものとしてもよい。 In the above-described embodiment, the lifting device 60 is provided with the load cell 169 for measuring the load F acting on the push-up pin 71, but the push-up is performed by detecting or estimating the load current of the second linear motor 166. The load acting on the pin 71 may be measured.
　また、上述した実施形態では、第１昇降装置６１のアクチュエータとして第１リニアモータ６２を用いるものとしたが、ボイスコイルモータやボールねじ機構等を用いるものとしてもよい。また、第２昇降装置６５のアクチュエータとして第２リニアモータ６６を用いるものとしたが、ボイスコイルモータ等を用いるものとしてもよい。 In the above-described embodiment, the first linear motor 62 is used as the actuator of the first lifting device 61. However, a voice coil motor, a ball screw mechanism, or the like may be used. Moreover, although the 2nd linear motor 66 was used as an actuator of the 2nd raising / lowering apparatus 65, it is good also as a thing using a voice coil motor etc.
　また、上述した実施形態では、ダイ剥離装置５０の昇降装置６０を第１昇降装置６１および第２昇降装置６５により構成したが、実装ヘッドの昇降装置を第１昇降装置および第２昇降装置により構成してもよい。図１０は、変形例の実装ヘッド１２２の構成の概略を示す構成図であり、図１１は、変形例の実装ヘッド１２２を用いた部品実装システム１１０の電気的な接続関係を示すブロック図である。 In the above-described embodiment, the lifting device 60 of the die peeling device 50 is configured by the first lifting device 61 and the second lifting device 65, but the mounting head lifting device is configured by the first lifting device and the second lifting device. May be. FIG. 10 is a block diagram showing an outline of the configuration of the mounting head 122 according to the modification. FIG. 11 is a block diagram showing the electrical connection relationship of the component mounting system 110 using the mounting head 122 according to the modification. .
　変形例の実装ヘッド１２２は、図１０に示すように、ヘッド本体１２２ａと、吸着ノズル２４と、回転装置１３３と、昇降装置１６０と、を備える。実装ヘッド１２２には１以上のノズルホルダ１７３が取り付けられ、ノズルホルダ１７３の下端部には吸着ノズル２４が着脱可能に取り付けられる。吸着ノズル２４は、ノズルホルダ１７３に対して上下方向（Ｚ軸方向）に移動可能に取り付けられている。ノズルホルダ１７３には図示しない圧縮コイルスプリングが内蔵されており、吸着ノズル２４は、圧縮コイルスプリングの付勢力によりノズルホルダ１７３に対して上方向に付勢されている。回転装置１３３は、回転軸にギヤ１３３ｂが設けられた回転モータ１３３ａを備える。ノズルホルダ１７３の上端部にはギヤ１３３と噛み合うギヤ１７６が、ギヤ１３３に対してノズルホルダ１７３がＺ軸方向に移動可能に設けられている。実装ヘッド１２２は、回転モータ１３３ａを駆動することで、ノズルホルダ４２を任意の角度に調整することができる。ノズルホルダ４２には吸着ノズル２４が取り付けられるから、実装ヘッド１２２は、ノズルホルダ４２を角度を調整することで、吸着ノズル２４に吸着されたダイＤの角度を調整することができる。昇降装置１６０は、第１昇降装置１６１と、第２昇降装置１６５と、ロードセル１６９（荷重測定部）とを備える。第１昇降装置１６１は、第１リニアモータ１６２と、第１リニアモータ１６２の駆動によりＺ軸方向に昇降可能な第１Ｚ軸スライダ１６３と、第１Ｚ軸スライダ１６３のＺ軸方向の位置を検出する第１Ｚ軸位置センサ１６４と、を備える。第１Ｚ軸スライダ１６３にはノズルホルダ１７３に設けられた水平部１７４に係合（当接）可能な第１係合部１６３ａが形成されている。これにより、ノズルホルダ１７３に取り付けられる吸着ノズル２４は、第１Ｚ軸スライダ１６３の昇降に伴って昇降可能となっている。第２昇降装置１６５は、第１昇降装置１６１の第１Ｚ軸スライダ１６３に取り付けられた第２リニアモータ１６６と、第２リニアモータ１６６の駆動によりＺ軸方向に昇降可能な第２Ｚ軸スライダ１６７と、を備える。第２Ｚ軸スライダ１６７には、吸着ノズル２４の上部で径方向に延びるフランジ部１７２の上面に係合（当接）可能な第２係合部１６７ａが形成されている。これにより、吸着ノズル２４は、第２Ｚ軸スライダ１６７の昇降に伴って昇降可能となっている。本実施形態では、第２昇降装置１６５による第２Ｚ軸スライダ１６７のストローク距離は、第１昇降装置１６１による第１Ｚ軸スライダ１６３のストローク距離よりも短くなっている。昇降装置１６０は、第１昇降装置１６１によって吸着ノズル２４のＺ軸位置を大まかに調整した後、第２昇降装置１６５によって吸着ノズル２４のＺ軸位置を細かく調整する。また、第２Ｚ軸スライダ１６７には、吸着ノズル２４がダイＤを吸着してピックアップする際に吸着ノズル２４に作用する荷重Ｆを検出するためのロードセル１６９が設けられている。 As shown in FIG. 10, the mounting head 122 according to the modification includes a head main body 122 a, a suction nozzle 24, a rotating device 133, and a lifting device 160. One or more nozzle holders 173 are attached to the mounting head 122, and the suction nozzle 24 is detachably attached to the lower end of the nozzle holder 173. The suction nozzle 24 is attached to the nozzle holder 173 so as to be movable in the vertical direction (Z-axis direction). The nozzle holder 173 includes a compression coil spring (not shown), and the suction nozzle 24 is urged upward with respect to the nozzle holder 173 by the urging force of the compression coil spring. The rotating device 133 includes a rotating motor 133a provided with a gear 133b on a rotating shaft. A gear 176 that meshes with the gear 133 is provided at the upper end of the nozzle holder 173 so that the nozzle holder 173 can move in the Z-axis direction with respect to the gear 133. The mounting head 122 can adjust the nozzle holder 42 to an arbitrary angle by driving the rotary motor 133a. Since the suction nozzle 24 is attached to the nozzle holder 42, the mounting head 122 can adjust the angle of the die D sucked by the suction nozzle 24 by adjusting the angle of the nozzle holder 42. The lifting device 160 includes a first lifting device 161, a second lifting device 165, and a load cell 169 (load measurement unit). The first elevating device 161 detects the first linear motor 162, the first Z-axis slider 163 that can be moved up and down in the Z-axis direction by driving the first linear motor 162, and the position of the first Z-axis slider 163 in the Z-axis direction. A first Z-axis position sensor 164. The first Z-axis slider 163 is formed with a first engaging portion 163 a that can be engaged (contacted) with a horizontal portion 174 provided in the nozzle holder 173. Thereby, the suction nozzle 24 attached to the nozzle holder 173 can be moved up and down as the first Z-axis slider 163 is moved up and down. The second lifting device 165 includes a second linear motor 166 attached to the first Z-axis slider 163 of the first lifting device 161, a second Z-axis slider 167 capable of moving up and down in the Z-axis direction by driving the second linear motor 166, and . The second Z-axis slider 167 is formed with a second engagement portion 167 a that can be engaged (contacted) with the upper surface of the flange portion 172 that extends in the radial direction above the suction nozzle 24. Thereby, the suction nozzle 24 can be moved up and down as the second Z-axis slider 167 moves up and down. In the present embodiment, the stroke distance of the second Z-axis slider 167 by the second lifting device 165 is shorter than the stroke distance of the first Z-axis slider 163 by the first lifting device 161. The lifting device 160 roughly adjusts the Z-axis position of the suction nozzle 24 by the first lifting device 161 and then finely adjusts the Z-axis position of the suction nozzle 24 by the second lifting device 165. The second Z-axis slider 167 is provided with a load cell 169 for detecting a load F acting on the suction nozzle 24 when the suction nozzle 24 picks up and picks up the die D.
　ダイ剥離装置１５０は、押上ピン７１を昇降させる１の昇降装置１３１と、押上ピン７１のＺ軸位置を検出するＺ軸位置センサ１３２と、を備える。なお、昇降装置１３１は、リニアモータと、リニアモータによりＺ軸方向に移動可能なスライダと、を備え、スライダがＺ軸方向に移動することで、押上ピン７１を昇降可能となっている。 The die peeling device 150 includes one lifting device 131 that lifts and lowers the push-up pin 71 and a Z-axis position sensor 132 that detects the Z-axis position of the push-up pin 71. The lifting device 131 includes a linear motor and a slider that can be moved in the Z-axis direction by the linear motor, and the push-up pin 71 can be lifted and lowered by the slider moving in the Z-axis direction.
　次に、こうして構成された変形例の部品実装システム１１０の動作につい説明する。図１２は、変形例のピックアップ処理を示すフローチャートであり、図１３は、変形例のダイ剥離処理を示すフローチャートである。 Next, the operation of the modified component mounting system 110 configured as described above will be described. FIG. 12 is a flowchart showing a modification pickup process, and FIG. 13 is a flowchart showing a modification die peeling process.
　ピックアップ処理では、部品実装装置２０の制御装置２９は、まず、ヘッド移動装置２３を駆動制御して吸着ノズル２４をピックアップしようとする対象ダイの真上に移動させる（ステップＳ３００）。次に、制御装置２９は、第１昇降装置１６１を駆動制御して吸着ノズル２４を高速で下降させる（ステップＳ３０５）。そして、制御装置２９は、第１Ｚ軸位置センサ１６４および第２Ｚ軸位置センサ１６８からの信号に基づいて特定される吸着ノズル２４のＺ軸方向の位置が規定位置に到達したか否かを判定する（ステップＳ３１０）。ここで、規定位置は、吸着ノズル２４がダイＤに接触する位置よりも所定距離だけ手前の位置として定められている。制御装置２９は、吸着ノズル２４の位置が規定位置に到達していないと判定すると、第１昇降装置１６１による吸着ノズル２４の下降を継続させ、吸着ノズル２４の位置が規定位置に到達したと判定すると、第１昇降装置１６１の駆動を停止すると共に（ステップＳ３１５）、第２昇降装置１６５を駆動制御して吸着ノズル２４を低速で更に下降させる（ステップＳ３２０）。そして、制御装置２９は、吸着ノズル２４が対象ダイに接触したか否かを判定する（ステップＳ３２５）。この処理は、例えば、ロードセル１６９により検出される吸着ノズル２４に作用する荷重Ｆが閾値を超えたか否かを判定することにより行なうことができる。制御装置２９は、吸着ノズル２４が対象ダイに接触していないと判定すると、吸着ノズル２４の下降を継続させ、吸着ノズル２４が対象ダイに接触したと判定すると、切替弁３６を駆動制御して吸着ノズル２４の吸着口に負圧を供給し（ステップＳ３３０）、吸着ノズル２４に作用する荷重Ｆが目標荷重Ｆ１に保持されるようフィードバック制御を用いて第２昇降装置１６５を駆動制御する（ステップＳ３３５）。目標荷重Ｆ１は、吸着ノズル２４が対象ダイに接触した状態を維持するための荷重であり、対象ダイに過大な応力が作用しない範囲内で定められる。次に、制御装置２９は、押上ピン７１が対象ダイの押し上げを開始したか否かを判定する（ステップＳ３４０）。この処理は、例えば、吸着ノズル２４に作用する荷重Ｆが閾値を超えたか否かを判定することにより行なうことができる。制御装置２９は、押上ピン７１が対象ダイの押し上げを開始していないと判定すると、ステップＳ３４０に戻って目標荷重Ｆ１を用いた第２昇降装置１６５のフィードバック制御を継続させ、押上ピン７１が対象ダイの押し上げを開始したと判定すると、吸着ノズル２４に作用する荷重が目標荷重Ｆ２に保持されるようフィードバック制御を用いて第２昇降装置１６５を駆動制御する（ステップＳ３４５）。ここで、目標荷重Ｆ２は、上述した目標荷重Ｆ＊と同等の荷重を定めることができる。制御装置２９は、目標荷重Ｆ＊と同じように、押上ピン７１の押し上げ量が大きくなるにつれて小さくなるよう目標荷重Ｆ２を変化させてもよい。そして、制御装置２９は、押上ピン７１の押し上げが完了したか否かを判定する（ステップＳ３５０）。この処理は、図１３のダイ剥離処理のステップＳ４１５の判定結果（押上ピン７１が目標位置Ｐ２に到達したか否か）に基づいて判定することができる。制御装置２９は、押上ピン７１の押し上げが完了していないと判定すると、ステップＳ３４５に戻って目標荷重Ｆ２を用いた第２昇降装置１６５のフィードバック制御を継続させ、押上ピン７１の押し上げが完了したと判定すると、第１昇降装置１６１および第２昇降装置１６５を駆動制御して吸着ノズル２４を上昇させて（ステップＳ３５５）、ピックアップ処理を終了する。これにより、対象ダイは、吸着ノズル２４によってピックアップされることになる。 In the pickup process, the control device 29 of the component mounting apparatus 20 first drives and controls the head moving device 23 to move the suction nozzle 24 directly above the target die to be picked up (step S300). Next, the control device 29 drives and controls the first lifting / lowering device 161 to lower the suction nozzle 24 at a high speed (step S305). Then, the control device 29 determines whether or not the position of the suction nozzle 24 specified based on the signals from the first Z-axis position sensor 164 and the second Z-axis position sensor 168 has reached the specified position. (Step S310). Here, the specified position is determined as a position that is a predetermined distance before the position where the suction nozzle 24 contacts the die D. When the control device 29 determines that the position of the suction nozzle 24 has not reached the specified position, the controller 29 continues to lower the suction nozzle 24 by the first lifting device 161 and determines that the position of the suction nozzle 24 has reached the specified position. Then, the driving of the first lifting device 161 is stopped (step S315), and the second lifting device 165 is driven and controlled to further lower the suction nozzle 24 at a low speed (step S320). And the control apparatus 29 determines whether the suction nozzle 24 contacted the object die | dye (step S325). This process can be performed, for example, by determining whether or not the load F acting on the suction nozzle 24 detected by the load cell 169 exceeds a threshold value. When the control device 29 determines that the suction nozzle 24 is not in contact with the target die, the control device 29 continues to lower the suction nozzle 24. When the control device 29 determines that the suction nozzle 24 has contacted the target die, the control device 29 drives and controls the switching valve 36. A negative pressure is supplied to the suction port of the suction nozzle 24 (step S330), and the second elevating device 165 is driven and controlled using feedback control so that the load F acting on the suction nozzle 24 is held at the target load F1 (step S330). S335). The target load F1 is a load for maintaining the state in which the suction nozzle 24 is in contact with the target die, and is determined within a range in which excessive stress does not act on the target die. Next, the control device 29 determines whether or not the push-up pin 71 has started to push up the target die (step S340). This process can be performed, for example, by determining whether or not the load F acting on the suction nozzle 24 exceeds a threshold value. If the control device 29 determines that the push-up pin 71 has not started to push up the target die, the control device 29 returns to step S340 to continue the feedback control of the second lifting device 165 using the target load F1. If it is determined that the die has been pushed up, the second lifting device 165 is driven and controlled using feedback control so that the load acting on the suction nozzle 24 is held at the target load F2 (step S345). Here, the target load F2 can determine a load equivalent to the target load F * described above. Similarly to the target load F *, the control device 29 may change the target load F2 so as to decrease as the push-up amount of the push-up pin 71 increases. Then, the control device 29 determines whether or not the push-up pin 71 has been pushed up (step S350). This process can be determined based on the determination result in step S415 of the die peeling process in FIG. 13 (whether the push-up pin 71 has reached the target position P2). If the control device 29 determines that the push-up pin 71 has not been pushed up, the control device 29 returns to step S345 to continue the feedback control of the second lifting device 165 using the target load F2, and the push-up pin 71 has been pushed up. If it is determined, the first elevating device 161 and the second elevating device 165 are driven and controlled to raise the suction nozzle 24 (step S355), and the pickup process is terminated. Thereby, the target die is picked up by the suction nozzle 24.
　一方、ダイ剥離処理では、制御装置２９は、まず、ポット移動装置５２を駆動制御して対象ダイの真下にポット５１を移動させる（ステップＳ４００）。次に、制御装置２９は、吸着ノズル２４が対象ダイに接触するまで待機する（ステップＳ４０５）。この処理は、ピックアップ処理のステップＳ３２５の判定結果に基づいて行なうことができる。制御装置２９は、吸着ノズル２４が対象ダイに接触したと判定すると、昇降装置１３１を駆動制御して押上ピン７１を上昇させ（ステップＳ４１０）、Ｚ軸位置センサ１３２からの信号に基づいて押上ピン７１のＺ軸方向の位置が目標位置Ｐ２に到達したか否かを判定する（ステップＳ４１５）。ここで、目標位置Ｐ２は、吸着ノズル２４のピックアップ位置に対応する押上ピン７１の位置である。制御装置２９は、押上ピン７１の位置が目標位置に到達していないと判定すると、昇降装置１３１による押上ピン７１の上昇を継続させ、押上ピン７１の位置が目標位置Ｐ２に到達したと判定すると、昇降装置１３１の駆動を停止して（ステップＳ４２０）、ダイ剥離処理を終了する。 On the other hand, in the die peeling process, the control device 29 first drives and controls the pot moving device 52 to move the pot 51 directly below the target die (step S400). Next, the control device 29 waits until the suction nozzle 24 contacts the target die (step S405). This process can be performed based on the determination result of step S325 of the pickup process. When the control device 29 determines that the suction nozzle 24 has contacted the target die, the control device 29 drives and controls the lifting device 131 to raise the push-up pin 71 (step S410), and the push-up pin is based on the signal from the Z-axis position sensor 132. It is determined whether or not the position of 71 in the Z-axis direction has reached the target position P2 (step S415). Here, the target position P <b> 2 is the position of the push-up pin 71 corresponding to the pickup position of the suction nozzle 24. If the control device 29 determines that the position of the push-up pin 71 has not reached the target position, the control device 29 continues to raise the push-up pin 71 by the lifting device 131 and determines that the position of the push-up pin 71 has reached the target position P2. Then, the driving of the lifting device 131 is stopped (step S420), and the die peeling process is finished.
　このように、変形例の部品実装装置２０では、実装ヘッド１２２は、第１昇降装置１６１と、第２昇降装置１６５と、ロードセル１６９とを備えて構成される。したがって、部品実装装置２０は、例えば、吸着ノズル２４が対象ダイに接触する前は第１昇降装置１６１により吸着ノズル２４を高速で下降させることができ、それ以降は第２昇降装置１６５により吸着ノズル２４を低速で下降させることにより、吸着ノズル２４が対象ダイに接触する際の衝撃を緩和することができる。また、部品実装装置２０は、吸着ノズル２４に対象ダイが接触した後は、吸着ノズル２４に作用する荷重Ｆが目標荷重Ｆ１に保持されるようフィードバック制御を用いて第２昇降装置１６５を駆動制御する。これにより、対象ダイに対して吸着ノズル２４を適切な荷重で押し当てることができ、吸着ノズル２４が対象ダイに接触した状態を維持することができる。さらに、部品実装装置２０は、押上ピン７１により対象ダイが押し上げられると、吸着ノズル２４に作用する荷重Ｆが目標荷重Ｆ２に保持されるようフィードバック制御を用いて第２昇降装置１６５を駆動制御する。これにより、押上ピン７１の押し上げによって対象ダイに過大な応力が作用するのを防止し、対象ダイの破損を効果的に抑制することができる。 As described above, in the component mounting apparatus 20 according to the modified example, the mounting head 122 includes the first lifting / lowering device 161, the second lifting / lowering device 165, and the load cell 169. Therefore, for example, the component mounting apparatus 20 can lower the suction nozzle 24 at a high speed by the first lifting device 161 before the suction nozzle 24 contacts the target die, and thereafter the suction nozzle 24 by the second lifting device 165. By lowering 24 at a low speed, the impact when the suction nozzle 24 contacts the target die can be reduced. Further, after the target die comes into contact with the suction nozzle 24, the component mounting apparatus 20 drives and controls the second lifting device 165 using feedback control so that the load F acting on the suction nozzle 24 is held at the target load F1. To do. Thereby, the suction nozzle 24 can be pressed against the target die with an appropriate load, and the state where the suction nozzle 24 is in contact with the target die can be maintained. Further, when the target die is pushed up by the push-up pin 71, the component mounting apparatus 20 drives and controls the second lifting device 165 using feedback control so that the load F acting on the suction nozzle 24 is held at the target load F2. . Thereby, it is possible to prevent excessive stress from acting on the target die due to the push-up pins 71 being pushed up, and to effectively prevent damage to the target die.
　ここで、上述した変形例において、第１昇降装置１６１が「第１ノズル昇降装置」に相当し、第２昇降装置１６５が「第２ノズル昇降装置」に相当し、昇降装置１３１が「押上部昇降装置」に相当し、ロードセル１６９が「荷重測定部」に相当する。 Here, in the above-described modification, the first lifting device 161 corresponds to a “first nozzle lifting device”, the second lifting device 165 corresponds to a “second nozzle lifting device”, and the lifting device 131 is “push-up”. The load cell 169 corresponds to a “load measuring unit”.
　上述した変形例では、実装ヘッド１２２に吸着ノズル２４に作用する荷重Ｆを測定するためのロードセル１６９を備えるものとしたが、第２リニアモータ１６６の負荷電流を検出または推定することにより吸着ノズル２４に作用する荷重を測定するものとしてもよい。 In the modified example described above, the load cell 169 for measuring the load F acting on the suction nozzle 24 is provided in the mounting head 122. However, the suction nozzle 24 is detected by detecting or estimating the load current of the second linear motor 166. It is good also as what measures the load which acts on.
　なお、本発明は上述した実施例に何ら限定されることはなく、本発明の技術的範囲に属する限り種々の態様で実施し得ることはいうまでもない。 In addition, this invention is not limited to the Example mentioned above at all, and as long as it belongs to the technical scope of this invention, it cannot be overemphasized that it can implement with a various aspect.
　本発明は、ウエハ供給装置や部品実装システムの製造産業などに利用可能である。 The present invention can be used in the manufacturing industry of wafer supply devices and component mounting systems.
　１０，１１０　部品実装システム、２０　部品実装装置、２１　基板搬送装置、２２，１２２　実装ヘッド、２３　ヘッド移動装置、２４　吸着ノズル、２５　パーツカメラ、２６　マークカメラ、２８　テープ供給装置、３１，１３１　昇降装置、３２　Ｚ軸位置センサ、３３，１３３　回転装置、４０，１４０　ウエハ供給装置、４１　ウエハパレット、４２　マガジン、４３　ダイシート、４４　パレット引出装置、５０　ダイ剥離装置、５１　ポット、５２　ポット移動装置、６０，１６０　昇降装置、６１，１６１　第１昇降装置、６２，１６２　第１リニアモータ、６３，１６３　第１Ｚ軸スライダ、６３ａ，１６３ａ　第１係合部、６４，１６４　第１Ｚ軸位置センサ、６５，１６５　第２昇降装置、６６，１６６　第２リニアモータ、６７，１６７　第２Ｚ軸スライダ、６７ａ，１６７ａ　第２係合部、６８，１６８　第２Ｚ軸位置センサ、６９，１６９　ロードセル、７１　押上ピン、７２　フランジ部、７３　ピン支持体、７４　水平部、８０　管理コンピュータ（ＰＣ）、１２２ａ　ヘッド本体、１３３ａ　回転モータ、１３３ｂ　ギヤ、１７２　フランジ部、１７３　ノズルホルダ、１７４　水平部、１７６　ギヤ、Ｄ　ダイ、Ｓ　基板、Ｗ　ウエハ。 10, 110 component mounting system, 20 component mounting device, 21 board transport device, 22, 122 mounting head, 23 head moving device, 24 suction nozzle, 25 parts camera, 26 mark camera, 28 tape supply device, 31, 131 lifting device , 32 Z-axis position sensor, 33, 133 rotating device, 40, 140 wafer supply device, 41 wafer pallet, 42 magazine, 43 die sheet, 44 pallet pulling device, 50 die peeling device, 51 pot, 52 pot moving device, 60, 160 Elevator, 61,161 First Elevator, 62,162 First Linear Motor, 63,163 First Z Axis Slider, 63a, 163a First Engagement Section, 64,164 First Z Axis Position Sensor, 65,165 First 2 lifting device, 66,166 second Amotor, 67, 167, second Z-axis slider, 67a, 167a, second engaging portion, 68, 168, second Z-axis position sensor, 69, 169, load cell, 71, push-up pin, 72 flange portion, 73 pin support, 74 horizontal portion, 80 management computer (PC), 122a head body, 133a rotation motor, 133b gear, 172 flange part, 173 nozzle holder, 174 horizontal part, 176 gear, D die, S substrate, W wafer.

Claims (7)

  1. 　複数の部品に分割されたウエハが貼着されたシートから部品をノズルによりピックアップして対象物に実装する部品実装装置に用いられるウエハ供給装置であって、
    　前記ノズルがピックアップしようとする部品を前記シートの裏側から押し上げるための押上部と、
    　昇降部材を昇降させる第１押上部昇降装置と、
    　前記第１押上部昇降装置により前記昇降部材と共に昇降され、該昇降部材に対して相対的に前記押上部を昇降させる第２押上部昇降装置と、
    　を備えることを特徴とするウエハ供給装置。     A wafer supply device used in a component mounting apparatus that picks up a component from a sheet on which a wafer divided into a plurality of components is attached by means of a nozzle and mounts it on an object,
    A push-up portion for pushing up a component to be picked up by the nozzle from the back side of the sheet;
    A first push-up lifting device that lifts and lowers the lifting member;
    A second raising and lowering device that is raised and lowered together with the raising and lowering member by the first raising and lowering device, and raises and lowers the raising portion relative to the raising and lowering member;
    A wafer supply apparatus comprising:
  2. 　請求項１記載のウエハ供給装置であって、
    　前記押上部に作用する荷重を測定する荷重測定部と、
    　前記ノズルにより前記部品がピックアップされる際に前記荷重測定部により測定される荷重に基づいて前記押上部が押し上げられるよう前記第１押上部昇降装置および前記第２押上部昇降装置を制御する制御部と、
    　を備えることを特徴とするウエハ供給装置。     The wafer supply apparatus according to claim 1,
    A load measuring unit for measuring a load acting on the push-up portion;
    A control unit for controlling the first lifting unit lifting device and the second lifting unit lifting device so that the lifting unit is pushed up based on a load measured by the load measuring unit when the component is picked up by the nozzle. When,
    A wafer supply apparatus comprising:
  3. 　請求項２記載のウエハ供給装置であって、
    　前記制御部は、前記押上部が所定の押上位置まで押し上げられるよう前記第１押上部昇降装置を制御し、前記押上部で前記部品が押し上げられている状態で前記荷重測定部により測定される荷重が所定の押上荷重範囲内に保持されるよう前記第２押上部昇降装置を制御する、
    　ことを特徴とするウエハ供給装置。     The wafer supply apparatus according to claim 2,
    The control unit controls the first lifting unit lifting device so that the lifting unit is pushed up to a predetermined lifting position, and the load is measured by the load measuring unit in a state where the component is pushed up by the lifting unit. Controlling the second push-up / lifting device so that is held within a predetermined push-up load range,
    A wafer supply apparatus.
  4. 　請求項３記載のウエハ供給装置であって、
    　前記制御部は、前記押上部で前記部品が押し上げられている状態で前記荷重測定部により測定される荷重が目標荷重に保持されるよう前記第２押上部昇降装置を制御するものであり、前記押上部の押し上げ量または押し上げ位置に応じて前記目標荷重を変化させる、
    　ことを特徴とするウエハ供給装置。     The wafer supply apparatus according to claim 3,
    The control unit controls the second push-up / lifting device so that a load measured by the load measurement unit is held at a target load in a state where the component is pushed up by the push-up unit, The target load is changed according to the push-up amount or push-up position of the push-up unit,
    A wafer supply apparatus.
  5. 　複数の部品に分割されたウエハが貼着されたシートから部品をノズルによりピックアップして対象物に実装する部品実装装置であって、
    　ヘッドと、
    　ノズルと、
    　前記ヘッドに対して前記ノズルを昇降させるノズル昇降装置と、
    　前記ノズルがピックアップしようとする部品を前記シートの裏側から押し上げるための押上部と、
    　昇降部材を昇降させる第１押上部昇降装置と、
    　前記第１押上部昇降装置により前記昇降部材と共に昇降され該昇降部材に対して相対的に前記押上部を昇降させる第２押上部昇降装置と、
    　前記押上部に作用する荷重を測定する荷重測定部と、
    　前記ノズルが所定のノズル位置まで下降すると共に前記押上部が所定の押上位置まで押し上げられるよう前記ノズル昇降装置と前記第１押上部昇降装置を制御し、前記押上部で前記部品が押し上げられている状態で前記荷重測定部により測定される荷重が所定の押上荷重範囲内に保持されるよう前記第２押上部昇降装置を制御する制御部と、
    　を備えることを特徴とする部品実装装置。     A component mounting apparatus that picks up a component from a sheet on which a wafer divided into a plurality of components is attached by means of a nozzle and mounts it on an object,
    Head,
    A nozzle,
    A nozzle lifting and lowering device for lifting and lowering the nozzle relative to the head;
    A push-up portion for pushing up a component to be picked up by the nozzle from the back side of the sheet;
    A first push-up lifting device that lifts and lowers the lifting member;
    A second push-up lifting device that is lifted and lowered together with the lifting member by the first push-up lifting device to raise and lower the push-up portion relative to the lifting member;
    A load measuring unit for measuring a load acting on the push-up portion;
    The nozzle lifting device and the first lifting device are controlled so that the nozzle is lowered to a predetermined nozzle position and the push-up portion is pushed up to a predetermined push-up position, and the component is pushed up by the push-up portion. A control unit for controlling the second push-up / lifting device so that the load measured by the load measurement unit in a state is maintained within a predetermined push-up load range;
    A component mounting apparatus comprising:
  6. 　複数の部品に分割されたウエハが貼着されたシートから部品をノズルによりピックアップして対象物に実装する部品実装装置であって、
    　ヘッドと、
    　ノズルと、
    　前記ヘッドに対して昇降部材を昇降させる第１ノズル昇降装置と、
    　前記昇降部材と共に昇降され、前記昇降部材に対して前記ノズルを相対的に昇降させる第２ノズル昇降装置と、
    　前記ノズルがピックアップしようとする部品を前記シートの裏側から押し上げるための押上部と、
    　前記押上部を昇降させる押上部昇降装置と、
    　前記ノズルに作用する荷重を測定する荷重測定部と、
    　前記ノズルが所定のノズル位置まで下降すると共に前記押上部が所定の押上位置まで押し上げられるよう前記第１ノズル昇降装置と前記押上部昇降装置を制御し、前記ノズルが前記部品に当接すると共に前記押上部で該部品が押し上げられている状態で前記荷重測定部により測定される荷重が所定の押上荷重範囲内に保持されるよう前記第２ノズル昇降装置を制御する制御部と、
    　を備えることを特徴とする部品実装装置。     A component mounting apparatus that picks up a component from a sheet on which a wafer divided into a plurality of components is attached by means of a nozzle and mounts it on an object,
    Head,
    A nozzle,
    A first nozzle lifting device that lifts and lowers the lifting member with respect to the head;
    A second nozzle lifting device that is lifted and lowered together with the lifting member and moves the nozzle relative to the lifting member;
    A push-up portion for pushing up a component to be picked up by the nozzle from the back side of the sheet;
    A push-up device for raising and lowering the push-up unit;
    A load measuring unit for measuring a load acting on the nozzle;
    The first nozzle elevating device and the elevating device elevating device are controlled so that the nozzle is lowered to a predetermined nozzle position and the push-up portion is pushed up to a predetermined push-up position. A control unit for controlling the second nozzle lifting device so that the load measured by the load measuring unit is held within a predetermined push-up load range in a state where the component is pushed up by the unit;
    A component mounting apparatus comprising:
  7. 　請求項６記載の部品実装装置であって、
    　前記制御部は、前記ノズルが前記所定のノズル位置まで下降するよう前記第１ノズル昇降装置を制御し、該ノズルが前記部品に当接して前記荷重測定部により測定される荷重が所定の当接荷重範囲内となるよう前記第２ノズル昇降装置を制御し、前記押上部により前記部品が押し上げられるよう前記押上部昇降装置を制御し、前記ノズルが前記部品に当接すると共に前記押上部で該部品が押し上げられている状態で前記荷重測定部により測定される荷重が所定の押上荷重範囲内に保持されるよう前記第２ノズル昇降装置を制御する、
    　ことを特徴とする部品実装装置。     The component mounting apparatus according to claim 6,
    The control unit controls the first nozzle lifting device so that the nozzle is lowered to the predetermined nozzle position, and the load is measured by the load measuring unit when the nozzle contacts the component. The second nozzle lifting device is controlled so as to be within a load range, the push-up device is controlled so that the component is pushed up by the push-up portion, and the nozzle abuts on the component and the component is pushed by the push-up portion. The second nozzle lifting device is controlled so that the load measured by the load measuring unit is held within a predetermined lifting load range in a state where the
    A component mounting apparatus characterized by that.
PCT/JP2016/078585 2016-09-28 2016-09-28 Wafer feeding apparatus and component mounting apparatus WO2018061103A1 (en)

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