JP5702157B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that controls pressure applied by a suction nozzle.

A conventional electronic component mounting apparatus includes a collet (nozzle) that adsorbs an electronic component, a rotation mechanism that rotates the collet, a housing that incorporates a rotation mechanism, and a guide that supports the housing in a vertically movable manner. A ball screw mechanism that moves the housing up and down is mounted on the head, and the rotation mechanism and the collet are supported so as to move up and down inside the housing, and through a protrusion that extends horizontally from the rotation mechanism. The load cell detects the pressure applied to the electronic component when the collet is lowered (see, for example, Patent Document 1).
Such an electronic component mounting apparatus uses a ball screw mechanism to lower a collet that is attracted to an electronic component, and when the tip of the collet comes into contact with a lower substrate via the electronic component, the collet and a rotation mechanism Rises, the load cell is pressed through the protrusion, and the pressure applied to the substrate at the tip of the collet is detected. When a predetermined pressure is detected in advance, the electronic component is released from the collet and the descent is stopped to raise the collet. Thus, the electronic component is mounted on the substrate with a predetermined pressure.

In addition, another electronic component mounting apparatus supports a suction nozzle that sucks an electronic component, a nozzle holder that holds the suction nozzle while allowing the suction nozzle to move up and down, and supports the nozzle holder so as to be rotatable around the suction nozzle. A support frame, a main body frame that supports the support frame so as to move up and down, a ball screw mechanism that moves the support frame up and down, and a spline shaft that is fixedly installed at the upper end of the nozzle holder, A rotation mechanism that imparts a rotation operation, a load cell that is provided on the nozzle holder and detects the pressure applied above the suction nozzle, and a voice that is provided on the support frame and moves the suction nozzle up and down via a spline shaft A coil motor (see, for example, Patent Document 2).
In this electronic component mounting apparatus, the suction nozzle in the suction state of the electronic component is lowered by the ball screw mechanism, and when the tip of the suction nozzle comes into contact with the lower substrate via the electronic component, the suction nozzle rises and the load cell The pressure applied to the substrate at the tip of the suction nozzle is detected. Then, the voice coil motor is controlled so as to maintain a predetermined pressure applied for a predetermined time, and then the electronic component is released from the suction nozzle and the suction nozzle is raised by the ball screw mechanism. Thus, the electronic component is mounted on the substrate with a predetermined pressure.

JP 2001-127081 A JP 2004-158743 A

However, in the electronic component mounting apparatus of Patent Document 1, since the collet is lowered together with the rotation mechanism, the responsiveness is reduced by increasing the total weight, and the pressure control of the electronic component on the substrate is controlled. There was a problem that became difficult.
In addition, this electronic component mounting apparatus cannot be extended upward because the upper end of the collet enters the inside of the rotating mechanism, and an air hose is extended from the upper end of the collet to the side for suction. Connected to the source. And since the hose was extended to the side in this way, the problem that the rotation range of a collet was restricted also occurred.

In addition, the electronic component mounting apparatus disclosed in Patent Document 2 uses a spline shaft to separate the rotation mechanism from the suction nozzle, and raises only the suction nozzle and the nozzle holder during pressurization control, thereby reducing the movable weight. However, since the load detector is arranged at the upper end of the suction nozzle and the rotation mechanism is arranged above and concentric with the suction nozzle, the suction nozzle It could not be pulled out to the upper end. Therefore, a hose for connecting to the suction nozzle to the suction source is extended to the side, and the rotation range of the suction nozzle is limited as in Patent Document 1.
In addition, since the wiring of the load cell mounted on the nozzle holder is also drawn out of the nozzle holder, this wiring also causes the rotation range of the suction nozzle to be limited.

  An object of the present invention is to improve the responsiveness when the suction nozzle moves up and down, and to make the suction nozzle rotatable in a wider range.

According to a first aspect of the present invention, there is provided an electronic packaging in which an electronic component is sucked by a suction nozzle provided in a head movable between an electronic component supply unit and a substrate holding unit, and the electronic component is mounted on the substrate. In the apparatus, a main body fixed to the head, an elevating body supported to be movable up and down with respect to the main body, an elevating mechanism for giving an elevating operation to the elevating body, a drive source for the elevating mechanism, A transmission member that transmits a lifting operation from a driving source to the lifting body, a hollow nozzle shaft that holds the suction nozzle at a lower end portion, and an upper end portion that is connected to an intake source, and a spline groove is formed in the nozzle shaft. A rotation mechanism that applies a rotation operation to the nozzle shaft via a spline nut, a load detection unit that detects an upward load received by the suction nozzle, and the load detection unit. An operation control unit that performs control to lower the lifting body and detect electronic components from the supply unit until a predetermined load is detected, and the lifting mechanism and the rotation mechanism are supported by the main body unit. The upper end of the nozzle shaft is provided in a state of protruding from the upper part of the main body, and the load detecting unit is supported by the elevating body or the main body.

Further, the invention according to claim 1 is characterized in that the load detection unit is provided in the lifting body, and holds a hollow holding portion rotatably in a state of passing through the nozzle shaft, and the lifting and lowering the hollow holding portion. It has the connection part connected with a body, and the distortion detection element which detects the distortion of the said connection part, It is characterized by the above-mentioned.

According to a second aspect of the present invention, there is provided an electronic packaging in which an electronic component is sucked by a suction nozzle provided in a head movable between an electronic component supply unit and a substrate holding unit and the electronic component is mounted on the substrate In the apparatus, a main body fixed to the head, an elevating body supported so as to be movable up and down with respect to the main body, an elevating mechanism for giving an elevating operation to the elevating body, and holding the suction nozzle at a lower end A hollow nozzle shaft having an upper end connected to an intake source, a spline groove formed in the nozzle shaft, and a rotation mechanism for applying a rotation operation to the nozzle shaft via a spline nut; A load detection unit that detects an upward load received by the nozzle, and lowers the lifting body until the load detection unit detects a predetermined load, and sucks an electronic component from the supply unit An operation control unit that performs control, wherein the lifting mechanism and the rotation mechanism are supported by the main body, and the upper end portion of the nozzle shaft projects from the upper portion of the main body, and the load While the detection unit is supported by the elevating body or the main body unit, the driving unit of the elevating mechanism and a transmission member that transmits the elevating operation from the driving source to the elevating body, the load detection unit, It has a distortion detection element for detecting distortion of a portion that supports the driving source of the elevating mechanism or the transmission member .

In the first aspect of the present invention, since the lifting mechanism and the rotating mechanism are both supported by the main body, the weight can be reduced as compared with the case where the rotating mechanism is mounted on the lifting body. The addition control of the load of the electronic component by the lowering of the nozzle becomes easy, and the load can be applied with high accuracy.
In addition, since the nozzle shaft is hollow and is equipped with its upper end protruding from the top of the main body, the upper end of the nozzle shaft can be connected to the intake source, and a connection tube etc. There is no need to extend the rotation, the rotation of the suction nozzle is not limited, and the rotatable angle can be increased.
Furthermore, since the load detection unit is supported by the lifting body or the main body unit, the load detection unit does not rotate when the adsorption nozzle rotates, and therefore the rotation of the adsorption nozzle is limited by the wiring of the load detection unit. Thus, the pivotable angle can be increased from such a surface. Moreover, it is possible to eliminate the need for a movable contact structure for transmitting the wiring current of the load detection unit.

Further, in the first aspect of the present invention, since the load detection unit detects the distortion of the connection unit connected to the hollow holding unit through which the nozzle shaft is penetrated, the main body unit may be disposed vertically through the nozzle shaft. The load detection unit does not hinder, and furthermore, since load detection is performed around the nozzle shaft, the load applied to the suction nozzle and the nozzle shaft can be detected more accurately.

In the invention according to claim 2, since the load detection unit detects distortion of the drive source of the elevating mechanism or the support part of the transmission member, the load detection unit can be arranged away from the nozzle shaft, and the nozzle shaft is the main body unit. Even if it is arranged so as to penetrate vertically, the load detection part does not hinder, and further, since the load detection part is provided in the main body part, it does not rotate or move up and down with the nozzle shaft, so the wiring is Therefore, it is possible to eliminate the need for the wiring structure corresponding to the lifting operation.

It is a perspective view of the electronic component mounting apparatus in 1st embodiment. It is a sectional side view of the nozzle drive device of the adsorption nozzle in a first embodiment. It is sectional drawing along the centerline of the load detection part. FIG. 4A is a plan view showing only the load cell portion in the load detection unit, and FIG. 4B is a perspective view. It is a block diagram which shows the control system of an electronic component mounting apparatus. It is a flowchart which shows the drive control of the suction nozzle when an electronic component is mounted in a board | substrate. It is a timing chart which shows drive control of the suction nozzle when an electronic component is mounted in a board | substrate. It is a fragmentary sectional view of the other example of the nozzle drive device in a first embodiment. It is a fragmentary sectional view of the further another example of the nozzle drive device in 1st embodiment. It is a sectional side view of the nozzle drive device in 2nd embodiment. It is a top view of a load detection part. It is a sectional side view of the other example of the nozzle drive device in 3rd embodiment. It is a sectional side view of the nozzle drive device in a third embodiment. FIG. 14A is an enlarged cross-sectional view of the load detection unit, FIG. 14A shows a state in which the connection parts are close to each other, and FIG. 14B shows a state in which the connection parts are separated from each other. It is a diagram which shows the relationship between the detection amount of the load detection part in 3rd embodiment, and the adsorption nozzle fall amount. It is an expanded sectional view of other examples of a load detection part in a third embodiment. It is an expanded sectional view of the further another example of the load detection part in 3rd embodiment. It is a sectional side view of the nozzle drive device in 4th embodiment. It is a perspective view of the load detection part in 4th embodiment. It is a sectional side view of the other example of the nozzle drive device in 4th embodiment.

(First embodiment: overall configuration)
A first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of the electronic component mounting apparatus 100. Hereinafter, as shown in the drawing, two directions orthogonal to each other in the horizontal plane are respectively referred to as an X-axis direction (substrate transport direction) and a Y-axis direction (a direction orthogonal to the substrate transport direction), and a vertical direction orthogonal to these is referred to as a Z-axis direction. Shall.
The electronic component mounting apparatus 100 mounts various electronic components on a board. As shown in FIG. 1, the electronic component mounting apparatus 100 includes a plurality of electronic component feeders 101 and a plurality of electronic component feeders 101 that supply electronic components to be mounted. Electronic component mounting on a substrate provided in the middle of a substrate transfer path by the substrate transfer means 103, and a substrate transfer means 103 for transferring a substrate in the X-axis direction, and a pair of component supply sections composed of feeder banks 102 held side by side A substrate holding unit 104 for performing work, a nozzle driving device 10 that holds a plurality (three in this example) of suction nozzles 12 so as to be movable up and down, and each nozzle driving device 10 is fixed to hold electronic components. And a head for driving and transporting the head 106 to an arbitrary position in a work area including the two sets of the component supply unit and the substrate holding unit 104. An X-Y gantry 107 as a moving mechanism, a plurality of (three in this example) imaging device 108 that is mounted on the head 106 and images a substrate, and vertically above the feeder bank 102 A component recognition camera 120 that captures an image of the electronic component C sucked by the suction nozzle 12 from the lower side with a line of sight is provided, and an operation control means 70 that performs operation control of each of the above components.

  The operation control means 70 of the electronic component mounting apparatus 100 sucks the electronic components from the electronic component delivery unit 101 a of the electronic component feeder 101 to each suction nozzle 12. Further, the operation control means 70 performs image processing from captured image data obtained by imaging the electronic component sucked by each suction nozzle 12 by the component recognition camera 120, and positions the electronic component relative to the nozzle tip and the nozzle position. The angle (orientation) about the center line is obtained, the positioning of the suction nozzle 12 with respect to the substrate is corrected, the angle of the electronic component is corrected by rotating the suction nozzle 12, and the mounting control of the electronic component is performed.

(Suction nozzle nozzle drive device)
FIG. 2 is a side sectional view of the nozzle driving device 10 of the suction nozzle 12. As shown in this figure, the nozzle drive device 10 for the suction nozzle 12 includes a main body frame 60 as a main body fixedly supported by a head 106, and a nozzle that holds the suction nozzle 12 that sucks the electronic component C at its tip. A holder 31, a nozzle shaft 30 that holds the suction nozzle 12 at the lower end via the nozzle holder 31, a movable bracket 14 that is supported by a main body frame 60 so as to be movable up and down, and a movable bracket 14 that moves up and down Elevating mechanism 20 driven in the direction, load detecting unit 40 for detecting the load applied to the suction nozzle 12, and a rotation mechanism 50 for adjusting the rotation angle of the suction nozzle 12 around the center line along the Z-axis direction. And an operation control means 70 (see FIG. 5) for controlling the operation of each of the above components. Each part is described in detail below.

(Body frame)
The main body frame 60 includes a back plate 61 fixed to the head 106, first and second extending support portions 62 and 63 extending from the upper portion of the back plate 61 along the Y-axis direction, and the back plate 61. And a slide guide 64 that slidably supports the movable bracket 14 along the Z-axis direction.

The back plate 61 is a flat plate along the XZ plane, one surface of which is fixed to the head 106, and the first and second extending support portions 62 and 63 and the linear guide 64 are provided on the other surface. ing.
The first extending part 62 has a plate shape along the XY plane and supports the lifting mechanism 20.
The second extending portion 63 has a plate shape along the XY plane and supports the rotation mechanism 50. In addition, the second extending portion 63 is located immediately below the first extending portion 62.

(Movable bracket)
The movable bracket 14 is supported so as to be slidable up and down via a movable block 14 a with respect to a linear guide 64 provided at a lower portion of the back plate 61. The movable bracket 14 is driven in the vertical direction by an elevating mechanism 20 provided in the first extending portion 62.

(Elevating mechanism)
The elevating mechanism 20 includes a rotary drive type Z-axis motor 21 (elevating drive source) disposed in a state where the output shaft is directed downward in the first extending support portion 62 of the main body frame 60, and a rotation angle amount thereof. As a transmission member connected to the output shaft of the Z-axis motor 21 via a coupling 26 and rotatably supported by the main body frame 60 along the vertical direction. A ball screw shaft 23 and a ball screw nut 24 to which vertical movement is imparted by the ball screw shaft 23 are provided.
The ball screw shaft 23 is concentrically connected to the output shaft of the Z-axis motor 21, is suspended downward along the Z-axis direction, and is rotatably supported by the second extending support portion 63 via the bearing 25. Has been.
The ball screw nut 24 is fixed to the movable bracket 14, and the movable bracket 14 is moved up and down in accordance with the rotation angle amount by the rotational drive of the Z-axis motor 21 and is positioned in the Z-axis direction. Further, the encoder 22 outputs a detection signal to the operation control means 70, and the operation control means 70 can recognize the current position of the movable bracket 14 based on this and control the operation of the Z-axis motor 21. It is said.

(Nozzle shaft)
The suction nozzle 12 is a tubular body having a tapered lower end portion, and suction holding is performed with the tip portion facing the electronic component C.
The nozzle shaft 30 has a nozzle holder 31 at the lower end, and holds the suction nozzle 12 via the nozzle holder 31. The nozzle shaft 30 is hollow throughout the entire length, and a hose joint 32 is provided at the upper end of the nozzle shaft 30 for connection to a suction pump, an ejector or the like serving as a suction source. . That is, the nozzle shaft 30 enables suction by the suction nozzle 12 provided at the lower end when suction is performed by the suction source from the hose joint 32 at the upper end.

The nozzle shaft 30 has a spline groove formed on the outer peripheral surface of the upper portion thereof, and the upper portion of the nozzle shaft 30 is rotatably supported by first and second extending support portions 62 and 63, which will be described later. The spline nut 55 is fitted through the spline nut 55.
The lower portion of the nozzle shaft 30 is supported by the load detection unit 40 attached to the movable bracket 14 so as to be rotatable about the Z axis with respect to the movable bracket 14. The support state of the nozzle shaft 30 by the load detection unit 40 will be described in detail later.
With this structure, the nozzle shaft 30 moves up and down together with the movable bracket 14, but since the upper portion is supported by the spline nut 55, the vertical movement is not hindered.
The nozzle shaft 30 is actually an internal hollow spline shaft whose upper half is formed with spline grooves on its outer peripheral surface, and its lower half is an internal hollow tubular body having no spline grooves. The coupling 35 is integrally connected.

  Further, the upper end portion of the nozzle shaft 30 is attached so as to protrude above the upper end surface of the main body frame 60 even when the movable bracket 14 is lowered to the lowest position in the movable range. As a result, the hose attached to the joint 32 at the upper end of the nozzle shaft 30 is always kept above the main body frame 60, and even if the nozzle shaft 30 rotates, the hose rotates accordingly. The possibility of the hose interfering with other surrounding structures is sufficiently reduced, eliminating the need to limit the pivot angle range of the suction nozzle 12.

(Rotating mechanism)
The rotation mechanism 50 includes a θ-axis motor 51 (rotation drive source) disposed with the output shaft facing upward in the second extension support portion 63, and an origin for detecting the origin position of the rotation angle. The sensor 52 (refer FIG. 5) and the spline nut 55 connected via the timing belt 54 from the pulley 53 provided in the output shaft of (theta) axis | shaft motor 51 are provided.
As described above, the spline nut 55 is supported so as to be rotatable around the Z axis between the first extension support portion 62 and the second extension support portion 63, and the nozzle shaft 30 is inserted therein. Then, the mutual spline grooves are fitted, and these rotate simultaneously around the Z axis.
Further, the outer peripheral surface of the spline nut 55 is a pulley of the timing belt 54, and is rotated by driving the θ-axis motor 51 and transmits the rotation to the nozzle shaft 30.
That is, when the nozzle shaft 30 is rotated by the rotation mechanism 50, the rotation is allowed by the load detection unit 40, and when the nozzle shaft 30 is moved up and down by the elevating mechanism 20, the spline nut 55 is used. Vertical movement is allowed. Thereby, the nozzle shaft 30 is also supported by the movable bracket 14 and can be rotated while moving up and down.

  The origin sensor 52 outputs the origin position of the output shaft of the θ-axis motor 51 to the operation control means 70 when searching for the origin. Based on this, the operation control means 70 causes the θ-axis motor 51 to rotate by a predetermined angle amount. Thus, it is possible to perform rotational drive control. As a result, the suction nozzle 12 is rotationally driven from the output shaft of the θ-axis motor 51 via the spline nut 55 and the nozzle shaft 30 to adjust the direction of the electronic component C sucked and held at the tip of the suction nozzle 12. It is possible.

(Load detection part)
The support state of the nozzle shaft 30 in the load detection unit 40 and the movable bracket 14 will be described.
3 is a cross-sectional view taken along the center line of the load detection unit 40, FIG. 4A is a plan view showing only the load cell portion in the load detection unit 40, and FIG. 4B is a perspective view. The load detection unit 40 includes a cylindrical hollow holding part 41 rotatably held by an internal bearing 47 in a state where the nozzle shaft 30 is penetrated, and a plurality of connecting parts for connecting the hollow holding part 41 to the movable bracket 14. A load cell 44 including a connecting arm portion 42 and a strain gauge 43 as a strain detecting element for detecting strain of the connecting arm portion 42, and a stopper 46 provided on the upper side of the load cell 44 via a spacer 45. Yes.

On the other hand, in the nozzle shaft 30, a flange-shaped step portion 33 provided at a substantially intermediate position in the longitudinal direction comes into contact with the inner ring of the bearing 47 from below, and the coupling 35 is connected via a cylindrical collar 34. The inner ring of the bearing 47 is fastened from above. Thus, the nozzle shaft 30 forms a state in which the bearing 47 is sandwiched vertically, and is held in a fixed state in the Z-axis direction while allowing rotation about the Z-axis with respect to the load cell 44.
The nozzle shaft 30 is supported by the movable bracket 14 by the stroke rotary bearing 36 below the load cell 44, and rotates around the Z axis with respect to the movable bracket 14 and linearly moves along the Z axis direction. Is in an allowed state.

Two connecting arm portions 42 of the load cell 44 are provided in the hollow holding portion 41, and each connecting arm portion 42 extends one by one in the vertical direction in FIG. 4A around the hollow holding portion 41. Yes. Each connecting arm portion 42 is fixed to the upper surface of the movable bracket 14 together with the spacer 45 and the stopper 46 at its extended end portion by a set screw (not shown).
Each of the connecting arm portions 42 is formed integrally with the hollow holding portion 41, and the bending of each connecting arm portion 42 causes the hollow holding portion 41 to move in the Z-axis direction (up and down) with respect to the movable bracket 14. Oscillating in the direction).
In addition, each connecting arm portion 42 is provided with two strain gauges 43 attached to the upper surface of the intermediate position of the extending portion, and each strain gauge 43 has the hollow holding portion 41 swinging along the Z-axis direction. When it is moved, a detection output corresponding to the amount of movement is sent to the movement control means 70.

The stopper 46 is formed of a material having a rigidity higher than that of the connecting arm portion 42, and is provided away from the upper end surface of the hollow holding portion 41 by a distance corresponding to the thickness of the spacer 45.
When the suction nozzle 12 and the nozzle shaft 30 are pushed upward, the upper end surface of the hollow holding portion 41 comes into contact with the stopper 46 and restricts further upward movement.
That is, in this electronic component mounting apparatus 100, the maximum pressing load applied to the substrate by the electronic component C by the suction nozzle 12 is set to 50N, and the hollow holding portion is pressed when the suction nozzle 12 is pressed downward by the maximum pressing load 50N. The thickness of the spacer 45 is set so as to be equal to the amount of upward movement occurring at 41.
As a result, the stopper 46 restricts each connecting arm portion 42 so as to generate only a deflection amount corresponding to the maximum pressing load, thereby preventing an excessive load from being generated on each strain gauge. Further, the stopper 46 can restrict excessive bending of each connecting arm portion 42 and prevent destruction.

(Control system for electronic component mounting equipment)
FIG. 5 is a block diagram showing a control system of the electronic component mounting apparatus 100. As shown in FIG. 5, the electronic component mounting apparatus 100 includes an operation control unit 70 that controls the operation of each unit of the electronic component mounting apparatus 100, and the operation control unit 70 includes the head 106 in the X axis direction and the Y axis. X-axis motor 121 and Y-axis motor 122 of XY gantry 107 moved in the direction, Z-axis motor 21 that moves suction nozzle 12 up and down, and θ-axis motor 51 that rotates suction nozzle 12 respectively. The drive circuits 121a, 122a, 21a, and 51a are connected to each other.
Further, the operation control means 70 is connected to the encoder 22 of the Z-axis motor 21, the origin sensor 52 of the θ-axis motor 51, the strain gauge 43 of the load detection unit 40, the board recognition camera 108, and components via the interface 71. An image recognition device 123 is connected to recognize the position of the board and the electronic component from the captured image of the recognition camera 120.
Although a plurality of Z-axis motors 21, θ-axis motors, encoders 22, origin sensors 52, and strain gauges 43 are actually mounted, only one is shown in FIG.

  The operation control means 70 stores a ROM 72 that stores a control program for performing various controls to be described later for the nozzle driving device 10 of the suction nozzle 12, a CPU 73 that centrally controls various configurations in accordance with the control program, and processing data of the CPU 73. A RAM 74 that functions as a work area and a data memory 75 that stores processing data and setting data are provided.

(Suction nozzle drive control method)
Subsequently, the drive control method of the suction nozzle 12 executed by the CPU 73 when the electronic component C is mounted on the substrate will be described with reference to the flowchart of FIG. 6 and the timing chart of FIG. This is a process performed by the CPU 73 executing a predetermined program stored in the ROM 72.
Here, the suction nozzle 12 picks up the electronic component C, the orientation of the electronic component C at the tip of the suction nozzle 12 is already adjusted by the θ-axis motor 51, and the head 106 is transported to the mounting position of the substrate. It is assumed that it is in the state. Moreover, this control is drive control with respect to one adsorption nozzle 12, and when performing several adsorption | suction, the following control is performed in order for every adsorption nozzle 12. FIG.

  First, the CPU 73 drives the Z-axis motor 21 so that the tip of the suction nozzle 12 is at a height close to the substrate upper surface (hereinafter referred to as a mounting surface) from the height Z4 (FIG. 7 (1)) when the head 106 is conveyed. It is lowered to Z3 at high speed (step S1: FIG. 7 (2)). The height Z3 is a height close to the mounting surface Z0, but is set to a height at which the lower end portion of the suction nozzle 12 does not reach the electronic component C. Further, the load detected by the strain gauge 43 in such a state is L0.

Then, after waiting for the operation of the suction nozzle 12 to stabilize (FIG. 7 (3)), the gain of the Z-axis motor 21 is switched to the low-speed load control mode and the low-speed descent is started (step S3: FIG. 7 ( Four)).
Then, the CPU 73 monitors whether or not the detection load by the strain gauge 43 increases from L0 when the electronic component C sucked by the suction nozzle 12 reaches the mounting surface (step S5: FIG. 7 (5)). .
When the arrival of the electronic component C on the mounting surface is detected (FIG. 7 (6), height Z1 (height when the electronic component C contacts the mounting surface)), the descent continues ( Further, it is monitored whether the detected load has reached the target load (strain gauge output L1) (step S9).

When it is detected that the detected load has reached the target load (strain gauge output L1), the Z-axis motor 21 is stopped, the movable bracket 14 is maintained at that height, and a predetermined pressurization time is started. (Step S11: FIGS. 7 (7) and 7 (8)).
Then, when the passage of the preset pressurizing time T1 is detected (step S13: FIGS. 7 (9) and 7 (10)), the Z-axis motor 21 is driven to move the suction nozzle 12 to the height Z2. (Step S15: FIG. 7 (11)).
The height Z2 is a position slightly above the mounting surface Z0 and lower than the height Z3, but may be the same height as Z3.

  After the Z-axis motor 21 is temporarily stopped, the gain of the Z-axis motor 21 is switched to the high-speed normal mode to increase the speed to the height Z4 (step S17: FIG. 7 (12)), and the suction nozzle drive control is finished. To do.

(Effect in the first embodiment)
The electronic component mounting apparatus 100 is configured to perform an elevating operation, unlike the case where the rotating mechanism 50 is mounted on the movable bracket 14 because the elevating mechanism 20 and the rotating mechanism 50 are both supported by the main body frame 60. The weight of the electronic component C can be easily controlled by the lowering of the suction nozzle 12, and the load can be applied with high accuracy.

In addition, since the nozzle shaft 30 is hollow and the upper end of the nozzle shaft 30 is provided so as to protrude from the upper part of the main body frame 60, a pipe such as a tube connected to the intake source rotates together with the nozzle shaft 30. However, it is easy to avoid interference with the surroundings, and the rotation angle of the suction nozzle 12 can be increased.
Further, since the load detection unit 40 is provided on the movable bracket 14, the load detection unit 40 does not rotate when the suction nozzle 12 rotates, and the rotation of the suction nozzle 12 is restricted by the wiring of the strain gauge 43. Thus, the pivotable angle can be increased from such a surface.

  Further, since the load detection unit 40 includes a strain gauge 43 that detects the strain of the connecting arm unit 42 connected to the hollow holding unit 41 that penetrates the nozzle shaft 30, the nozzle shaft 30 extends to above the main body frame 60. When taking out, the load detection part 40 does not become obstructed, and since load detection is performed around the nozzle shaft 30, the load applied to the suction nozzle 12 and the nozzle shaft 30 can be detected more accurately. .

(Other examples of the first embodiment)
In the electronic component mounting apparatus 100 described above, the case where the load detection unit 40 is mounted on the upper portion of the movable bracket 14 is exemplified, but the arrangement is not limited to this. For example, as shown in FIG. 8, the load detection unit 40 may be provided in the lower part of the movable bracket 14. The load detector 40 has the same structure as the load detector 40 described above. In this case, the step portion 33 of the nozzle shaft 30 is formed in the vicinity of the lower end portion, thereby holding the bearing 47 of the load detecting portion 40. Further, the collar and the coupling for holding the bearing 47 from above are not shown.

  Further, in the electronic component mounting apparatus 100 described above, the nozzle shaft 30 is disposed in the vicinity of the head 106 and the elevating mechanism 20 is disposed far from the head 106. However, the present invention is not limited to this, as shown in FIG. The nozzle shaft 30 may be remote from the head 106, and the lifting mechanism 20 may be disposed near the head 106 (only the ball screw shaft 23 and the ball screw nut 24 of the lifting mechanism 20 are shown in FIG. 9). Similarly, the arrangement of the rotation mechanism 50 may be changed.

  In the electronic component mounting apparatus 100, the nozzle shaft 30 is supported by the rotary rotary bracket 36 in the movable bracket 14 so that the nozzle shaft 30 can be rotated and moved up and down. When the displacement is sufficiently small, instead of the stroke rotary bearing 36, the nozzle shaft 30 is supported by a normal ball bearing, and the displacement of the nozzle shaft 30 in the Z-axis direction is allowed by the play of the inner and outer rings. Also good.

(Second embodiment)
A nozzle drive device 10A according to a second embodiment of the present invention will be described with reference to the drawings. The second embodiment is characterized by the nozzle driving device 10A, and the other configuration is the same as that of the electronic component mounting device 100 described above. Therefore, the nozzle driving device 10A will be mainly described. Further, the same components as those of the nozzle driving device 10 described above are denoted by the same reference numerals, and redundant description is omitted.

FIG. 10 is a side sectional view of the nozzle drive device 10A, and FIG. 11 is a plan view of the load detection unit 40A.
This nozzle driving device 10A is different from the nozzle driving device 10 in that the load detection unit 40A is provided not on the movable bracket 14A but on the main body frame 60.
That is, in the second extending support portion 63 of the main body frame 60, through holes 41A are formed in a substantially fan shape at four locations around the bearing 25, so that the four portions that support the periphery of the bearing 25 from four directions are formed. One beam structure part 42A is formed, and the upper and lower surfaces of each beam structure part 42A and a strain gauge 43A are attached to each other to constitute a load detection part 40A.

  In addition, since the load detector 40A is provided on the main body frame 60 side, the movable bracket 14A does not need to support the nozzle shaft 30 so as to be swingable in the Z-axis direction. It is supported by ball bearings 36A and 36A, and does not swing in the Z-axis direction, but is supported so as to be rotatable around the Z-axis.

With the above configuration, the nozzle drive device 10A lowers the suction nozzle 12 toward the substrate while the electronic component C is sucked, and when the electronic component C reaches the substrate, the reaction force causes the nozzle shaft 30 and the movable bracket to move. 14A, the ball screw nut 24, and the ball screw shaft 23, the bearing 25 and the surrounding support portion of the second extension support portion 63 are pressed upward. Thereby, each beam structure 42A is distorted, and the pressure load on the substrate can be obtained by detection of each strain gauge 43A.
Further, the operation control for the nozzle drive device 10A can be executed by the same process as the process based on the flowchart of FIG. 6 and the timing chart of FIG.

(Effect in 2nd embodiment)
The nozzle drive device 10A has the same effect as the nozzle drive device 10 described above, and the load detection unit 40A detects the distortion of the support part of the ball screw shaft 23 of the lifting mechanism 20, so that the load detection unit 40A is used as the nozzle shaft. When the nozzle shaft 30 is arranged so as to penetrate the main body frame 60 up and down, the load detection unit 40A does not hinder the arrangement.
Furthermore, since the load detection unit 40A is provided on the main body frame 60, the load detection unit 40A does not rotate or move up and down with the nozzle shaft 30, so that the wiring of each strain gauge 43A of the load detection unit 40A hinders the lifting operation of the lifting body. In addition, it is possible to eliminate the need for a wiring structure corresponding to the lifting operation.

(Another example of the second embodiment)
In the nozzle drive device 10A described above, the load detection unit 40A is provided around the bearing 25 in the second extension support unit 63. However, the arrangement is not limited to this. For example, as shown in FIG. 12, a load detection unit 40 </ b> A may be provided at a position closer to the base side (back plate 61 side) in the second extension support part 63 than the bearing 25.
For example, a part of the base side of the second extended support portion 63 relative to the bearing 25 has a through-hole 41A in the X-axis direction so that the thickness in the Z-axis direction is thinned to make the beam thin. The load detection unit 40A may be configured by forming the structure unit 42A and attaching the strain gauges 43A to the upper and lower surfaces of the structure unit 42A.

  Further, in the case of a support structure in which the second extending support portion 63 does not support the ball screw shaft 23 and the reaction force at the time of pressurization is transmitted to the Z-axis motor 21, it is the same as FIG. 11 at the position of S1 in FIG. A load detecting unit 40A having a structure may be formed. Alternatively, a load detection unit 40A having the same structure as that of FIG. 12 may be formed at a position S2 on the base side (back plate 61 side) of the first extension support unit 62 relative to the Z-axis motor 21.

(Third embodiment)
A nozzle drive device 10B according to a third embodiment of the present invention will be described with reference to the drawings. The third embodiment has a feature in the nozzle driving device 10B, and the other configuration is the same as that of the electronic component mounting device 100 described above. Therefore, the nozzle driving device 10B will be mainly described. Further, the same components as those of the nozzle driving device 10 described above are denoted by the same reference numerals, and redundant description is omitted.

FIG. 13 is a side sectional view of the nozzle driving device 10B, and FIG. 14 is an enlarged sectional view of the load detecting unit 40B.
In this nozzle drive device 10B, the movable bracket 14B is divided into a lift operation input portion 141B from the lift mechanism 20 and a support portion 142B of the nozzle shaft 30, and the support portion 142B is connected to the lift operation input portion 141B at the connecting portion. A tension spring 143B is provided as an elastic body that is disposed above and attracts the opposing portions of the support portion 142B and the lifting operation input portion 141B to each other, and the load detection portion 40B is provided between the opposing portions. Features.

  Based on the above premise, the movable bracket 14B is divided into two parts, that is, a lifting / lowering operation input part 141B and a support part 142B of the nozzle shaft 30. The nozzle shaft 30 is equipped with two ball bearings 36B, 36B so as to be rotatable around the Z axis.

Furthermore, as shown in FIG. 14, the raising / lowering operation input portion 141B and the connecting portions 144B and 145B of the support portion 142B are arranged so as to overlap with each other in the Z-axis direction, and opposing surfaces are formed.
And the connection part 144B of the raising / lowering operation input part 141B is arrange | positioned under the connection part 145B of the support part 142B.
Each of the connecting portions 144B and 145B is equipped with connecting pins 146B and 147B extending in the Z-axis direction toward the other side, and each of the connecting portions 144B and 145B has a connecting pin on the other side. Thrust collars 148B and 149B into which 147B and 146B can be inserted are provided.
Thereby, the connection part 144B of the raising / lowering operation input part 141B and the connection part 145B of the support part 142B can be relatively moved along the Z-axis direction.
Further, as described above, the connecting portion 144B of the lifting / lowering operation input portion 141B and the connecting portion 145B of the support portion 142B are connected by the tension spring 143B, and are subjected to tension in a direction in which the opposing surfaces are always close to each other. Is in a state of being.

A load cell (pressure detection element) as a load detection unit 40B that detects a contact pressure with the facing surface on the connecting portion 144B side is mounted on the facing surface on the connecting portion 145B side of the support portion 142B, and is movable. In a state in which no external force is applied to the bracket 14B, a constant pressure is constantly received by the tension spring and this is detected (FIG. 14A).
Here, when the maximum set load applied to the electronic component C by the suction nozzle 12 is 50 N, the tension spring 143B is used that generates a pressing load slightly larger than the maximum set load (for example, 60 N).

  When the electronic component C is pressed against the substrate by the lowering of the suction nozzle 12, the connecting portion 144B and the connecting portion 145B act against the tension spring 143B in a direction away from each other. As shown in FIG. 15, the detection output by the load detector 40B gradually decreases from 60 N, which is the load of the tension spring 143B. When the suction nozzle 12 is pushed in until the load exceeds the load of the tension spring 143B, the connecting portion 144B and the connecting portion 145B are separated from each other as shown in FIG. Since 143B is selected with a tensile load larger than the maximum set load, such a situation does not occur during a normal electronic component mounting operation.

  The operation control for the nozzle driving device 10B can be executed by the same process as the process based on the flowchart of FIG. 6 and the timing chart of FIG.

(Effect in the third embodiment)
The nozzle drive device 10B has the same effect as the nozzle drive device 10 described above, and the load detection unit 40B is disposed between the lifting operation input unit 141B and the support unit 142B. When the electronic component C comes into contact with the substrate, the support portion 142B is lifted, and the interval between the lifting operation input portion 141B and the support portion 142B is opened, and the load at the time of contact becomes excessive, so that the load detection portion 40B. Can be effectively avoided.

(Another example of the third embodiment)
In addition, as shown in FIG. 16 (A), the lifting / lowering operation input portion 141B of the movable bracket 14B and the connecting portions 144B and 145B of the support portion 142B are rotated by a hinge 150B by an axis along the X-axis direction. It is good also as a structure which provides the tension | pulling spring 143B so that it may connect and a mutually opposing surface pulls. And then. You may equip either one of the opposing surfaces which can be contacted / separated with the load detection part 40B toward the other opposing surface. In this case, as shown in FIG. 16 (B), the load detection unit 40B and the other facing surface are not separated even when pressure is applied with the maximum set load so that the load detection unit 40B is not separated from the other facing surface. It is necessary to select the tension spring 143B for the load.

  Further, as shown in FIG. 17 (A), the above-described raising / lowering operation input portion 141B of the movable bracket 14B and the connecting portions 144B and 145B of the support portion 142B are two parallel and the same length constituting the four-bar linkage mechanism. It is good also as a structure which provides the tension | pulling spring 143B so that it may connect with link body 151B and 152B, and a mutual opposing surface may pull. And then. You may equip either one of the opposing surfaces which can be contacted / separated with the load detection part 40B toward the other opposing surface. Also in this case, as shown in FIG. 17B, the load detection unit 40B is separated from the other opposing surface even when the pressure is applied with the maximum set load so that the load detection unit 40B is not separated from the other opposing surface. It is necessary to select a tension spring 143B having no load.

(Fourth embodiment)
A nozzle drive device 10C according to a fourth embodiment of the present invention will be described with reference to the drawings. The fourth embodiment is characterized by the nozzle driving device 10C, and the other configuration is the same as that of the electronic component mounting device 100 described above, and therefore the nozzle driving device 10C will be mainly described. Further, the same components as those of the nozzle driving device 10 described above are denoted by the same reference numerals, and redundant description is omitted.

18 is a side sectional view of the nozzle drive device 10C, and FIG. 19 is a plan view of the load detection unit 40C.
In this nozzle drive device 10C, the movable bracket 14C is divided into a lift operation input portion 141C from the lift mechanism 20 and a support portion 142C of the nozzle shaft 30, and the support portion 142C is disposed below the lift operation input portion 141C. A load detection unit 40B is provided between the opposing portions of the support unit 142C and the lifting operation input unit 141C, and the lifting operation input unit 141C and the support unit 142C are connected by the load detection unit 40C.

Based on the above premise, the movable bracket 14C is divided into a lifting / lowering operation input portion 141C and a support portion 142C of the nozzle shaft 30, and the lifting / lowering motion input portion 141C is equipped with the ball screw nut 24 of the lifting mechanism 20, and the support portion 142C. The nozzle shaft 30 is equipped with two ball bearings 36C and 36C so as to be rotatable around the Z axis.
In addition, the nozzle shaft 30 is simultaneously disposed through through holes formed concentrically in the support portion 142C and the lifting operation input portion 141C.

Furthermore, the lower surface of the lifting operation input unit 141C and the upper surface of the support unit 142C are opposed to each other, and the opposed surfaces are attached so that the load detection unit 40C is connected.
The load detector 40C has a substantially rectangular parallelepiped-shaped strain body 41C and a through-hole formed in the strain body 41C along the X-axis direction so that the upper surface portion and the lower surface portion are in a thin state. This is a load cell composed of two strain gauges 43C provided on the object along the Y-axis direction in the thin-walled portion. In the strain body 41C, an insertion hole 44C of the nozzle shaft 30 penetrating to the lower surface is formed at the center of the upper surface.
When the load detection unit 40C receives a load in the direction along the Z-axis direction from the central portion of the upper surface, each strain gauge 43C can perform detection output corresponding to the load and detect the load.
The upper surface center portion of the strain generating body 41C is fixedly mounted on the lower surface of the lifting operation input portion 141C, and the lower surface center portion of the strain generating body 41C is fixedly mounted on the upper surface of the support portion 142C, and the lifting operation input portion 141C and the support portion are mounted. 142C is connected.
Thereby, when the suction nozzle 12 descends the state where the electronic component C is sucked and pressurizes the substrate, the strain generating body 41C is pressurized between the lifting operation input portion 141C and the support portion 142C, and the pressure load is increased. Accordingly, each strain gauge 43C outputs a detection, and the pressure load applied by the electronic component C can be detected.

  The operation control for the nozzle drive device 10C can be executed by the same process as the process based on the flowchart of FIG. 6 and the timing chart of FIG.

(Effect in the fourth embodiment)
The nozzle drive device 10C has the same effect as the nozzle drive device 10 described above, and the load detection unit 40C detects the applied pressure between the opposing portions of the lifting operation input unit 141C and the support unit 142C. It is possible to detect the load by inserting the strain body 41C of the load detection unit 40C between the lifting operation input unit 141C and the support unit 142C, and it is possible to simplify the structure and reduce the number of components. Become.
In addition, the strain body 41C is formed with an insertion hole 44C at the center in the XY plane, and the load detection unit 40C is disposed between the lifting operation input unit 141C and the support unit 142C through the nozzle shaft 30. As a result, the load applied to the suction nozzle 12 can be detected at a position directly above the load, and detection with a higher system becomes possible.

(Another example of the fourth embodiment)
In addition, although the load detection part 40C mentioned above is provided in the arrangement | positioning which the nozzle shaft 30 penetrates between the raising / lowering operation input part 141C and the support part 142C, it is not restricted to this, As shown in FIG. It is good also as an arrangement between the input part 141C and the support part 142C and avoiding the nozzle shaft 30.
In that case, it is not necessary to provide the insertion hole 44C in the strain generating body 41C, and it is not necessary to position the load detection unit 40C in accordance with the center line of the nozzle shaft 30, and the configuration can be simplified and produced. It is possible to improve the performance.

10, 10A, 10B, 10C Nozzle driving device 12 Adsorption nozzles 14, 14A, 14B, 14C Movable bracket (lifting body)
20 Lifting mechanism 23 Ball screw shaft (transmission member)
24 Ball screw nut 30 Nozzle shaft 40, 40A, 40C Load detection unit 40B Load detection unit (pressure detection element)
41 hollow holding part 41A through hole 41C strain body 42 connecting arm part (connecting part)
42A Beam structure 43, 43A Strain gauge (strain detection element)
43C strain gauge (pressure detection element)
44 Load cell 50 Rotating mechanism 55 Spline nut 60 Body frame (body frame)
70 Operation Control Unit 100 Electronic Component Mounting Device 106 Heads 141B, 141C Elevating Operation Input Units 142B, 142C Support Unit 143B Spring (elastic body)
144B, 145B Connecting part C Electronic component

Claims (2)

In an electronic mounting apparatus that sucks an electronic component by a suction nozzle provided in a head movable between the electronic component supply unit and the substrate holding unit, and mounts the electronic component on the substrate,
A main body fixed to the head;
An elevating body supported to be movable up and down with respect to the main body,
An elevating mechanism for applying an elevating operation to the elevating body;
A drive source for the lift mechanism and a transmission member for transmitting a lift operation from the drive source to the lift body;
A hollow nozzle shaft that holds the suction nozzle at the lower end and the upper end is connected to an intake source;
A rotation mechanism in which a spline groove is formed in the nozzle shaft and a rotation operation is imparted to the nozzle shaft via a spline nut;
A load detector for detecting an upward load received by the suction nozzle;
An operation control unit that performs control for lowering the elevating body until the load detection unit detects a predetermined load that is determined in advance and sucking an electronic component from the supply unit;
The lifting mechanism and the rotating mechanism are supported by the main body,
Equipped with the upper end of the nozzle shaft protruding from the upper part of the main body,
While the load detection unit is supported by the lifting body or the main body ,
The load detector is
A hollow holding portion that is provided in the lifting body and that is rotatably held in a state where the nozzle shaft is penetrated, a connecting portion that connects the hollow holding portion to the lifting body, and detects distortion of the connecting portion. An electronic component mounting apparatus comprising a strain detection element. In an electronic mounting apparatus that sucks an electronic component by a suction nozzle provided in a head movable between the electronic component supply unit and the substrate holding unit, and mounts the electronic component on the substrate,
A main body fixed to the head;
An elevating body supported to be movable up and down with respect to the main body,
An elevating mechanism for applying an elevating operation to the elevating body;
A hollow nozzle shaft that holds the suction nozzle at the lower end and the upper end is connected to an intake source;
A rotation mechanism in which a spline groove is formed in the nozzle shaft and a rotation operation is imparted to the nozzle shaft via a spline nut;
A load detector for detecting an upward load received by the suction nozzle;
An operation control unit that performs control for lowering the elevating body until the load detection unit detects a predetermined load that is determined in advance and sucking an electronic component from the supply unit;
The lifting mechanism and the rotating mechanism are supported by the main body,
Equipped with the upper end of the nozzle shaft protruding from the upper part of the main body,
While the load detection unit is supported by the lifting body or the main body ,
A drive source for the lift mechanism and a transmission member for transmitting a lift operation from the drive source to the lift body;
The electronic component mounting apparatus, wherein the load detection unit includes a strain detection element that detects a strain of a portion that supports a driving source of the elevating mechanism or the transmission member.

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