JP7417472B2 - Adsorption condition determination method and adsorption device - Google Patents

Description

This specification discloses a method for determining adsorption conditions and an adsorption device.

Conventionally, in a pickup device that pushes up a chip pasted on a sheet from the back side of the sheet with a pin and picks it up (adsorption) with a nozzle having a vacuum suction hole, it is necessary to check the quality of the pickup operation (adsorption operation) conditions (pickup operation conditions). The determination method is known (for example, see Patent Document 1). The pickup device includes a flow rate measurement section that measures the flow rate of air that is vacuum-suctioned from the nozzle and exhausted by the evacuation section. The pick-up device detects an up-and-down pattern that shows the time-series up and down movement of the nozzle, a flow rate pattern that shows the time-series fluctuations in the flow rate measured by the flow rate measuring section, and a time-series change in the amount of pin thrust. Obtain the upthrust pattern shown. Then, the pickup device synchronizes the time axes of each pattern and displays it on the display unit as an operating condition analysis screen having a list view. The acceptability of the pickup operating conditions is determined based on the determination parameters determined by performing a trial run while changing the nozzle lowering height, pin thrusting height, nozzle lifting speed, and pin thrusting speed in the condition setting test. .

Japanese Patent Application Publication No. 2012-028364

Cited Document 1 describes the optimal pickup operating conditions (adsorption conditions) for the nozzle descending height, pin thrusting height, nozzle lifting speed, and pin thrusting speed, based on the flow rate of air exhausted from the nozzle by the vacuum exhaust section. What you are trying to set is described. However, since the flow rate measured by the flow rate sensor changes depending on the size of the nozzle used, this must be fully taken into consideration when determining the adsorption conditions.

The present disclosure mainly aims to provide a suction condition determining method and a suction device that can determine more appropriate suction conditions in a suction device that pushes up a die stuck to a sheet from the back side with a pin and suctions it with a nozzle. purpose.

The present disclosure has taken the following measures to achieve the above-mentioned main objective.

The method for determining adsorption conditions of the present disclosure includes:
In a suction device that suctions a die from a wafer that is divided into a plurality of dies and whose back side is attached to a sheet,
a head having a nozzle that is movable up and down and capable of sucking the die with negative pressure;
a peeling device having a sheet holding member capable of holding the sheet by negative pressure; and a pin movable up and down with respect to the sheet holding member;
When the die is taken out from the wafer by suction, the back side of the sheet is held by the sheet holding member, and the nozzle is lowered above the die to attract the die to the nozzle. control, pin push-up control in which the die is pushed up from the back side of the sheet with the pin, and nozzle lift control in which the nozzle that has attracted the die is raised, the head and the peeling device being controlled to sequentially execute. a control device that performs adsorption control;
An adsorption condition determining method applied to an adsorption device comprising:
measuring the tensile load necessary to peel off the die stuck to the sheet while holding the sheet on the sheet holding member and pushing up the pin from the back side of the sheet;
As one of the adsorption conditions, a nozzle size necessary for adsorbing the die to the nozzle with a predetermined negative pressure is determined based on the measured tensile load.
The gist is that.

The suction condition determination method of the present disclosure determines the suction conditions of a suction device that pushes up a die attached to a sheet from the back side with a pin and suctions it with a nozzle. The suction condition determination method involves measuring the tensile load required to peel off the die attached to the sheet while holding the sheet on a sheet holding member and pushing up a pin from the back side of the sheet. The suction condition determining method determines, as one of the suction conditions, a nozzle size required to suction the die to the nozzle with a predetermined negative pressure based on the measured tensile load. This makes it possible to select a nozzle of an appropriate size for peeling off the die stuck to the sheet. As a result, in a suction device in which a die stuck to a sheet is pushed up from the back side with a pin and suctioned with a nozzle, a suction condition determining method that can determine more appropriate suction conditions can be provided.

The adsorption device of the present disclosure includes:
A suction device that suctions a die from a wafer that is divided into a plurality of dies and whose back side is attached to a sheet,
a head having a nozzle that is movable up and down and capable of sucking the die with negative pressure;
a peeling device having a sheet holding member capable of holding the sheet by negative pressure; and a pin movable up and down with respect to the sheet holding member;
When the die is taken out from the wafer by suction, the back side of the sheet is held by the sheet holding member, and the nozzle is lowered above the die to attract the die to the nozzle. control, pin push-up control in which the die is pushed up from the back side of the sheet with the pin, and nozzle lift control in which the nozzle that has attracted the die is raised, the head and the peeling device being controlled to sequentially execute. a control means for performing adsorption control;
As one of the suction conditions for the suction control, the tensile load required to peel off the die stuck to the sheet with the nozzle is measured during the execution of the suction control, and the tensile load is applied to the measured tensile load. suction condition determining means for determining a nozzle size necessary for suctioning the die to the nozzle with a predetermined negative pressure based on the
The purpose is to have the following.

The suction device of the present disclosure includes a control means for performing suction control in which a die attached to a sheet is pushed up from the back side with a pin and suctioned by a nozzle, and a suction condition determining means for determining suction conditions for the suction control. Be prepared. The suction condition determining means measures, as one of the suction conditions, the tensile load necessary to peel off the die stuck to the sheet with the nozzle during the execution of suction control, and predetermines it based on the measured tensile load. Determine the nozzle size required to attract the die to the nozzle using the negative pressure generated. This makes it possible to select a nozzle of an appropriate size for peeling off the die stuck to the sheet. As a result, in a suction device that pushes up a die stuck to a sheet from the back side with a pin and suctions it with a nozzle, the suction device can determine more appropriate suction conditions.

1 is a schematic configuration diagram of a mounting system including a component mounting machine. FIG. 2 is a schematic configuration diagram of a die peeling device. FIG. 2 is a schematic configuration diagram of a negative pressure supply system. FIG. 2 is a schematic configuration diagram of a chuck for load measurement. FIG. 2 is a block diagram showing electrical connection relationships of the mounting system. 7 is a flowchart illustrating an example of adsorption condition determination processing. 7 is a flowchart illustrating an example of adsorption confirmation processing. FIG. 7 is an explanatory diagram showing how the heights of the suction nozzle, the pot, and the push-up pin change over time when performing the suction operation. It is a flowchart which shows an example of nozzle diameter determination processing. It is an explanatory view showing how a die is taken out using a chuck. FIG. 3 is an explanatory diagram showing an example of a condition list for pin push-up control. FIG. 3 is an explanatory diagram showing an example of a condition list for nozzle elevation control.

Next, embodiments for implementing the present disclosure will be described with reference to the drawings.

FIG. 1 is a schematic configuration diagram of a mounting system including a component mounting machine. FIG. 2 is a schematic configuration diagram of the die peeling device. FIG. 3 is a schematic diagram of the negative pressure supply system. FIG. 4 is a schematic configuration diagram of a chuck for load measurement. FIG. 5 is a block diagram showing the electrical connections of the mounting system. In FIG. 1, the left-right direction is the X-axis direction, the front-back direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

As shown in FIG. 1, the mounting system 10 is a system for mounting components onto a substrate S, and includes a plurality of component mounting machines 20 and a management device 80. The plurality of component mounting machines 20 are arranged and installed along the conveyance direction of the substrate S, thereby forming a mounting line. Note that the mounting system 10 actually includes a solder printing machine, an inspection machine, a reflow oven, etc. on the same mounting line as the plurality of component mounters 20.

The component mounting machine 20 includes a substrate transport device 21, a head 30, a head moving device 22, a parts camera 23, a mark camera 24, a tape supply device 25, a wafer supply device 40, and a control device 70. .

The head 30 is moved back and forth and left and right (XY axis directions) by a head moving device 22, picks up (adsorbs) components supplied from a tape supply device 25 and a wafer supply device 40, and carries them into the machine by a substrate transfer device 21. mounted on the printed board S. The head 30 includes a nozzle holder and a nozzle lifting device that moves the nozzle holder up and down. For example, the head 30 is configured as a rotary head having a rotating body. The rotary head includes a plurality of nozzle holders arranged in the circumferential direction and supported by a rotating body so as to be able to move up and down (in the Z-axis direction), and a nozzle holder located at a predetermined turning position among the plurality of nozzle holders. a nozzle elevating device for elevating and lowering the nozzle. A suction nozzle 31 is detachably attached to the tip (lower end) of the nozzle holder. A suction port communicating with the negative pressure supply system 60 is formed at the tip (lower end) of the suction nozzle 31 . The suction nozzle 31 can suction a component (including the die D) by bringing the suction port into contact with the surface of the component (including the die D) while the suction port is supplied with negative pressure from the negative pressure supply system 60 . The nozzle lifting device 32 includes a slider that moves up and down (in the Z-axis direction) guided by a guide rail, a motor that drives the slider, and a position sensor that detects the up-and-down (in the Z-axis direction) position of the slider. . The slider of the nozzle lifting device 32 is installed above the nozzle holder and is connected to a motor via, for example, a ball screw mechanism. The nozzle raising/lowering device 32 raises and lowers the nozzle holder together with the suction nozzle 31 by raising and lowering a slider using a motor.

The substrate transport device 21 carries the substrate S into the machine, positions it within the machine, and carries it out of the machine. The substrate conveyance device 21 includes a pair of conveyor belts that are spaced apart from each other in the front and back of FIG. 1 and spanned in the left-right direction. The substrate S is conveyed by this conveyor belt.

The head moving device 22 includes a slider that moves forward and backward and left and right (in the XY axis direction) guided by a guide rail, a motor that drives the slider, and a position sensor that detects the position of the slider in the front and back and left and right (in the XY axis direction). Be prepared. A head 30 is fixed to the slider and is connected to a motor via, for example, a ball screw mechanism. The head moving device 22 moves the head 30 back and forth and left and right (XY axis directions) by driving a slider with a motor.

The parts camera 23 is installed between the substrate transport device 21 and the tape supply device 25. When the suction nozzle 31 that has suctioned a component passes above the parts camera 23 , the parts camera 23 images the component suctioned by the suction nozzle 31 from below, and outputs the image to the control device 70 .

The mark camera 24 is installed on the head moving device 22 (slider) so as to be movable in the XY-axis directions. The mark camera 24 images a positioning reference mark provided on the substrate S from above in order to confirm the position of the substrate S carried into the machine, and outputs the image to the control device 70 .

The tape supply device 25 includes a reel wound with a tape containing a component, and supplies the component to a suction position of the head 30 (suction nozzle 31) by pulling out the tape from the reel.

The wafer supply device 40 supplies the wafer W divided into a plurality of dies D to the suction position of the head 30 (suction nozzle 31), and includes a wafer pallet 41, a magazine 42, and a die peeling device 50. Be prepared. As shown in FIG. 2, the wafer pallet 41 has an opening 41o, and a wafer sheet 43 to which a wafer W is attached is stretched and fixed around the periphery of the opening 41o. A plurality of wafer pallets 41 are housed in a magazine 42, and are pulled out from the magazine 42 by a pallet pull-out device 44 (see FIG. 5) when the head 30 (suction nozzle 31) sucks the die D. .

As shown in FIG. 2, the die peeling device 50 includes a pot 51, a pot moving device 52, a push-up pin 55, and a pin lifting device 56 (see FIG. 5). The pot 51 is installed below the wafer pallet 41 pulled out by the pallet pull-out device 44. A suction surface communicating with the negative pressure supply system 60 is formed on the upper surface of the pot 51 , and the pot 51 suction-supports the wafer sheet 43 using the negative pressure supplied from the negative pressure supply system 60 . The pot moving device 52 includes a slider that moves forward and backward and left and right (XY axis directions) guided by a guide rail, a motor that drives the slider, and a position sensor that detects the front and rear and left and right positions of the slider (XY axis directions). Equipped with The pot 51 is fixed to the slider of the pot moving device 52 via a pin lifting device 56, and is connected to a motor via, for example, a ball screw mechanism. The pot moving device 52 moves the pot 51 back and forth and left and right (XY axis directions) by driving a slider with a motor.

The push-up pin 55 is installed inside the pot 51 and is used to push up from the back side of the wafer sheet 43 the die D that is to be picked up (adsorbed) among the divided dies D of the wafer W stuck to the wafer sheet 43. be. The pin lifting device 56 includes a slider that is guided by a guide rail and moves in the Z-axis direction, a motor that drives the slider, and a position sensor that detects the vertical (Z-axis direction) position of the slider. The slider of the pin lifting device 56 is installed below a pin support that supports the base end of the push-up pin 55, and is connected to a motor via, for example, a ball screw mechanism. The pin raising/lowering device 56 is configured to be able to raise and lower the pot 51 together with the push-up pin 55. When the upper surface (suction surface) of the pot 51 comes close to a position where it almost contacts the wafer sheet 43, a stopper mechanism prevents the pot 51 from rising. After that, the push-up pin 55 protrudes from the upper surface of the pot 51 and pushes up the die D from the back side of the wafer sheet 43. The die peeling device 50 can push up only the die D to be picked up (adsorbed) and peel it from the wafer sheet 43 by pushing up the push-up pin 55 while the wafer sheet 43 is suction-supported on the upper surface of the pot 51. .

As shown in FIG. 3, the negative pressure supply system 60 includes a vacuum pump 61, a pump channel 62, a nozzle channel 63, a pot channel 64, on-off valves 65 and 66, and flow sensors 67 and 68. Equipped with Vacuum pump 61 is incorporated into pump channel 62 . The nozzle channel 63 branches from the pump channel 62 and communicates with the suction ports of the suction nozzles 31 attached to each nozzle holder. The pot channel 64 branches from the pump channel 62 and communicates with the suction surface of the pot 51 . The on-off valve 65 is installed in the nozzle flow path 63 and opens and closes to switch between communicating and blocking the pump flow path 62 and the suction port of the suction nozzle 31 . The on-off valve 66 is installed in the pot channel 64 and opens and closes to switch between communicating and blocking the pump channel 62 and the suction surface of the pot 51. The flow rate sensor 67 is installed in the nozzle flow path 63 and detects (measures) the flow rate (nozzle side flow rate Qn) of air flowing through the nozzle flow path 63 per unit time. The flow rate sensor 68 is installed in the pot flow path 64 and detects (measures) the flow rate (pot side flow rate Qp) of air flowing through the pot flow path 64 per unit time.

Furthermore, the component mounting machine 20 of this embodiment is configured to allow replacement of the head. As shown in FIG. 4, the component mounting machine 20 can be equipped with a head that includes a mechanical chuck (chuck) 100 that grips a component with a plurality of claws, and a chuck lifting device that lifts and lowers the chuck 100. In this embodiment, this head further includes a load sensor 101 and is used as a load measurement head for measuring the tensile load necessary to peel off the die D from the wafer sheet 43.

As shown in FIG. 5, the control device 70 includes a CPU 71, a ROM 72, a storage device such as an HDD 73 (storage device) or an SSD, a RAM 74, a timer 75, an input/output port, and the like. The control device 70 includes a position sensor of the head 30, a position sensor of the head moving device 22, a parts camera 23, a mark camera 24, a tape supply device 25, a pallet pull-out device 44, a position sensor of the die peeling device 50, and a negative pressure supply system 60. Signals from the flow rate sensors 67, 68, etc. are inputted through the input ports. Further, the control device 70 also inputs a signal from the load sensor 101 when the component mounting machine 20 is equipped with a head for measuring a load. Furthermore, the control device 70 controls the substrate transport device 21, the head 30 (nozzle lifting device 32), the parts camera 23, the mark camera 24, the tape supply device 25, the wafer supply device 40 (the pallet pull-out device 44, and the die peeling device 50). A control signal is output to the pot moving device 52, pin lifting device 56), and on-off valves 65 and 66 of the negative pressure supply system 60 via the output port.

As shown in FIG. 5, the management device 80 includes a CPU 81, a ROM 82, a storage device such as an HDD 83 (storage device) or an SSD, a RAM 84, an input/output port, and the like. An input device 85 such as a mouse and a keyboard, and a display device 86 are connected to the management device 80 . The management device 80 is communicably connected to the control device 70 of the component mounting machine 20, and transmits job information related to production instructions to the control device 70 and receives various information from the control device 70. The job information includes, for example, information such as the mounting order of components, the type of components to be mounted, suction conditions including the type of suction nozzle 31 to be used (nozzle diameter), the size of the substrate S to be produced, and the number of substrates to be produced. There is.

Next, a process for determining appropriate suction conditions for sucking the die D into the suction nozzle 31 and taking it out from the wafer sheet 43 in the component mounter 20 (suction device) will be described. Here, in this embodiment, the head 30, the wafer supply device 40, and the control device 70 correspond to a suction device.

FIG. 6 is a flowchart showing an example of the suction condition determination process executed by the CPU 71 of the control device 70. When the suction condition determination process is executed, the CPU 71 of the control device 70 first executes a nozzle diameter determination process to determine the required nozzle diameter of the suction nozzle 31 (step S100), and selects the suction nozzle 31 having the determined required nozzle diameter. A suction confirmation process is executed to check the suction state of die D using (step S110). Here, for convenience of explanation, the suction confirmation process will be explained first, and then the nozzle diameter determination process will be explained.

FIG. 7 is a flowchart illustrating an example of the suction confirmation process. The suction confirmation process will be described below with reference to FIG. In the suction confirmation process, the CPU 71 first executes sheet suction control to suction the wafer sheet 43 to the upper surface (suction surface) of the pot 51 (step S200). In the sheet suction control, the pot moving device 52 is controlled to move the pot 51 directly below the die D (target die) to be suctioned, and the on-off valve 66 is opened to apply a negative force to the top surface (suction surface) of the pot 51. This is done by supplying pressure and controlling the pin lifting device 56 to raise the pot 51 (t1 in FIG. 8).

Subsequently, the CPU 71 starts nozzle lowering control that lowers the suction nozzle 31 to attract the target die to the suction nozzle 31 (step S210). In the nozzle lowering control, the head moving device 22 is controlled to move the suction nozzle 31 directly above the target die, the on-off valve 65 is opened to supply negative pressure to the suction port of the suction nozzle 31, and the nozzle lifting device 32 to lower the suction nozzle 31. Next, the CPU 71 determines whether the vertical position Zn of the suction nozzle 31 (in the Z-axis direction) has reached the target lowering position (Zntag in FIG. 8) based on the detection signal from the position sensor of the nozzle lifting device 32. is determined (step S220). The target lowering position Zntag is a position where the suction port (lower end) of the suction nozzle 31 contacts the die D on the wafer sheet 43.

When the CPU 71 determines that the position Zn of the suction nozzle 31 has reached the target lowering position Zntag (t2 in FIG. 8), the CPU 71 inputs the nozzle side flow rate Qn measured by the flow rate sensor 67 (step S230); The nozzle side flow rate Qn is set to the flow rate Q1 immediately after the nozzle descends (step S240). Next, the CPU 71 starts measuring the timer t1 (step S250), and waits until the measured value of the timer t1 reaches the pre-pushing waiting time (tref1 in FIG. 8) (step S260). The pre-thrust waiting time tref1 is the waiting time after the suction nozzle 31 is lowered until the suction behavior of the suction nozzle 31 becomes stable.

When the CPU 71 determines that the measured value of the timer t1 has reached the pre-thrust waiting time tref1 (t3 in FIG. 8), the CPU 71 then starts pin push-up control to push up the target die from the back side with the push-up pin 55 (step S270). ). The pin push-up control is performed by controlling the push-up pin 55 to be pushed up by a predetermined push-up amount (target push-up amount) at a predetermined push-up speed (target push-up speed) by the pin lifting device 56. The suction nozzle 31 is controlled by the nozzle raising/lowering device 32 to rise in synchronization with the pushing up of the push-up pin 55 (with the same rising speed as the predetermined pushing up speed and the same rising amount as the predetermined pushing up amount). Note that the suction nozzle 31 is configured to be able to move up and down with respect to the nozzle holder, and to be biased downward by the biasing force of a spring, so as to rise (stroke) in synchronization with the pushing up of the push-up pin 55. You can. Then, the CPU 71 determines whether the amount of push-up of the push-up pin 55 has reached the target amount of push-up (α in FIG. 8) based on the detection signal from the position sensor of the pin lifting device 56 (step S280). The target push-up amount α is the push-up amount of the die D required to separate the die D from the wafer sheet 43.

When the CPU 71 determines that the push-up amount of the push-up pin 55 has reached the target push-up amount α (t4 in FIG. 8), the CPU 71 compares the nozzle side flow rate Qn measured by the flow rate sensor 67 and the pot side flow rate Qp measured by the flow rate sensor 68. is input internally (step S290), and the input nozzle side flow rate Qn and pot side flow rate Qp are set to the flow rates Q2 and Q3 immediately after pushing up, respectively (step S300). Next, the CPU 71 starts measuring the timer t2 (step S310), and waits until the measured value of the timer t2 reaches the nozzle pre-rise waiting time (tref2 in FIG. 8) (step S320). The nozzle pre-lift waiting time tref2 is the waiting time from when the push-up pin 55 is pushed up until the target die is peeled off from the wafer sheet 43 to some extent.

When the measured value of the timer t2 reaches the nozzle pre-lift waiting time tref2 (t5 in FIG. 8), the CPU 71 starts nozzle raising control to raise the suction nozzle 31 (step S330). The nozzle lift control is performed by controlling the suction nozzle 31 to rise at a predetermined lifting speed (target lifting speed) using the nozzle lifting device 32. Then, the CPU 71 determines whether the suction nozzle 31 has risen by a predetermined amount (β in FIG. 8) based on the detection signal from the position sensor of the nozzle lifting device 32 (step S340). The predetermined amount of rise β is the amount of rise of the suction nozzle 31 at which the target die is considered to be peeled off from the wafer sheet 43 and separated from the wafer sheet 43 if the target die is normally suctioned by the suction nozzle 31 .

When the CPU 71 determines that the suction nozzle 31 has risen by the predetermined rise amount β (t6 in FIG. 8), the CPU 71 inputs the nozzle side flow rate Qn measured by the flow rate sensor 67 (step S350), and inputs the input nozzle side flow rate Qn is set to the nozzle rising flow rate Q4 (step S360).

After setting the flow rate Q1 immediately after nozzle descent, the flow rate Q2, Q3 immediately after thrust up, and the flow rate Q4 during nozzle ascent, the CPU 71 determines whether each flow rate Q1, Q2, Q3, Q4 is within the appropriate flow rate range. (Step S370). If the CPU 71 determines that each of the flow rates Q1, Q2, Q3, and Q4 are within the appropriate flow rate range, it determines that the suction state is good (step S380), and ends the suction confirmation process. On the other hand, if the CPU 71 determines that any one of the flow rates Q1, Q2, Q3, and Q4 is not within the corresponding appropriate flow rate range, the CPU 71 determines that the suction state is poor (step S390), and performs suction confirmation processing. finish.

In such suction confirmation processing, the above-mentioned pre-upthrust waiting time tref1, target upthrust amount, target upthrust speed, pre-upward waiting time tref2, and target uplift speed are included in the adsorption conditions determined in the adsorption condition determination process. For these adsorption conditions, predetermined values are used in step S110 of the adsorption condition determination process.

Next, the nozzle diameter determination process will be explained. FIG. 9 is a flowchart illustrating an example of nozzle diameter determination processing. The nozzle diameter determination process is executed with a head having a chuck 100 and a chuck lifting device mounted on the component mounting machine 20. The nozzle diameter determination process will be described below with reference to FIG.

In the nozzle diameter determination process, the CPU 71 first executes sheet suction control similar to step S200 (step S400). Next, the CPU 71 controls the head moving device 22 to move the chuck 100 directly above the target die (see FIG. 10(a)), lowers the chuck 100 using the chuck lifting device, and then lowers the chuck 100. The side surface of the target die is grasped with the claw (step S410, see FIG. 10(b)).

Next, the CPU 71 executes pin push-up control similar to step S270 until the push-up amount of the push-up pin 55 reaches a predetermined target push-up amount (step S420, see FIG. 10(c)). Note that the CPU 71 checks whether the wafer sheet 43 is properly held on the upper surface of the pot 51 by monitoring the pot side flow rate Qp from the flow rate sensor 68 during execution of the pin push-up control. Good too. When the push-up amount of the push-up pin 55 reaches the target push-up amount (step S430), the CPU 71 waits for a predetermined pre-lift waiting time to elapse (step S440), and controls the chuck lifting device to lift the chuck 100. chuck raising control to raise the chuck is started (step S450, see FIG. 10(d)).

When the CPU 71 starts the chuck raising control, it initializes the peak load Fpeak to a value of 0 (step S460), and internally inputs the pot side flow rate Qp measured by the flow rate sensor 68 and the tensile load F measured by the load sensor 101. (Step S470). Then, the CPU 71 determines whether the input pot side flow rate Qp is less than the threshold value Qref (step S480). The threshold value Qref is a threshold value for determining whether there is no leakage of negative pressure from the pot 51, that is, whether the wafer sheet 43 is properly held on the upper surface (suction surface) of the pot 51. When the CPU 71 determines that the input pot side flow rate Qp is less than the threshold value Qref, the CPU 71 determines whether the input tensile load F is larger than the peak load Fpeak (step S500). If the CPU 71 determines that the input tensile load F is larger than the peak load Fpeak, it sets the input tensile load F to the peak load Fpeak (step S510), and if it determines that the input tensile load F is less than or equal to the peak load Fpeak, Skip step S510. Then, the CPU 71 determines whether or not the chuck 100 has risen by a predetermined amount (step S520). If the CPU 71 determines that the chuck 100 has not been raised by the predetermined amount, the CPU 71 returns to step S470 and repeats the process.

If the CPU 71 determines in step S480 that the pot side flow rate Qp is equal to or higher than the threshold value Qref, the CPU 71 determines that the wafer sheet 43 is away from the pot 51 and that peeling off of the target die has failed, and uses the flow rate Qp in the determination in step S430. After increasing the target thrust amount (step S490), the process returns to step S400 and the nozzle diameter determination process is restarted from the beginning.

If the CPU 71 determines in step S520 that the chuck 100 has risen by a predetermined amount without the pot side flow rate Qp exceeding the threshold value Qref, the CPU 71 determines that the target die has been successfully peeled off, and performs the necessary peeling based on the peak load Fpeak. The nozzle diameter is determined (step S530), and the nozzle diameter determination process ends. The suction force of the suction nozzle 31 is determined by the product of the pressure difference between the internal pressure of the suction nozzle 31 and atmospheric pressure and the cross-sectional area of the suction port, and needs to be set to be larger than the peak load Fpeak. The internal pressure of the suction nozzle 31 is negative pressure supplied from the negative pressure supply system 60 and can be determined in advance, so the required nozzle diameter of the suction nozzle 31 can be determined based on the peak load Fpeak.

Returning to the suction condition determination process in FIG. 6, the CPU 71 performs the nozzle diameter determination process and the suction confirmation process, and then sets other suction conditions to be executed this time from the condition list (step S120). FIG. 11 is an explanatory diagram showing an example of a condition list for pin push-up control. The pin push-up control condition list includes a pre-thrust waiting time tref1, a target push-up amount, and a target push-up speed. In this embodiment, the target thrust amount is set to the target thrust amount used when the target die is successfully peeled off by the chuck 100 in the nozzle diameter determination process described above. Furthermore, the condition list for the pin push-up control also includes the execution time when the pin push-up control is executed under each combination of conditions. FIG. 12 is an explanatory diagram showing an example of a condition list for nozzle elevation control. The nozzle rise control condition list includes the pre-rise waiting time tref2 and the target rise speed. The condition list for the nozzle rise control also includes the execution time when the nozzle rise control is executed under each combination of conditions. Note that some of the pin push-up control condition list and the nozzle rise control condition list (for example, nozzle rise speed) may be set to fixed values.

After setting the suction conditions to be executed this time from each condition list, the CPU 71 performs suction confirmation under the suction conditions set in step S120 using the suction nozzle 31 having the nozzle diameter determined in the nozzle diameter determination process described above ( Step S130). The confirmation process in step S130 is performed by the same process as step S110 except that the adsorption conditions are different.

When the CPU 71 performs the suction check, the CPU 71 stores the results of the suction check pass/fail judgment in association with the currently executed suction conditions in the HDD 73 (storage device) (step S140), and stores all combinations of suction conditions included in the condition list. It is determined whether or not suction confirmation has been performed for (step S150). If the CPU 71 determines that there remains a combination of suction conditions for which suction confirmation has not been performed, the process returns to step S120, sets another combination of suction conditions, and performs suction confirmation. On the other hand, if the CPU 71 determines that suction confirmation has been performed for all combinations of suction conditions, it sets the combination of suction conditions with the shortest cycle time as the optimal condition among the suction conditions that were determined to be good in the suction confirmation (step S160), the adsorption condition determination process ends. This process is performed by searching for a combination of suction conditions that provides the shortest sum of the execution time of the pin push-up control and the execution time of the nozzle elevation control. In addition, the adsorption conditions for which the cycle time is the shortest are the shortest time if it is the waiting time before thrusting tref1 or the waiting time before rising tref2, and the fastest speed if it is the target thrusting speed or the target rising speed. , the target thrust amount is the smallest amount. The optimal conditions are transmitted to the management device 80, and reflected in the adsorption conditions included in the job information in the management device 80.

Here, the correspondence between the main elements of this embodiment and the main elements of the invention described in the section of the disclosure of the invention will be explained. That is, the die D of this embodiment corresponds to a "die", the wafer sheet 43 corresponds to a "sheet", the suction nozzle 31 corresponds to a "nozzle", the head 30 corresponds to a "head", and the die peeling The device 50 corresponds to a "peeling device", the push-up pin 55 corresponds to a "pin", and the control device 70 corresponds to a "control device". Furthermore, the control device 70 that executes the suction condition determining process corresponds to the "suction condition determining means."

It goes without saying that the present invention is not limited to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of the present invention.

For example, in the embodiment described above, the target thrust amount is set to be the target thrust amount used when the target die is successfully peeled off by the chuck 100 in the nozzle diameter determination process. However, the target push-up amount may be set by executing the suction confirmation process while changing a plurality of target push-up amounts, and set the smallest target push-up amount among the target push-up amounts determined to be good in the suction confirmation process.

In the embodiment described above, in the component mounting machine 20 that mounts a head having a chuck 100 and a load sensor 101, the load detected by the load sensor 101 when the target die is gripped by the chuck 100 and peeled off from the wafer sheet 43. The required nozzle diameter was determined based on the peak value (peak load Fpeak). However, in a component mounting machine 20 equipped with a head 30 having a suction nozzle 31 and a load sensor, the peak value of the load detected by the load sensor when the target die is suctioned by the suction nozzle 31 and peeled off from the wafer sheet 43. The required nozzle diameter may be determined based on the following.

In the embodiment described above, the flow rate sensor 67 is installed in the nozzle flow path 63, and the CPU 71 calculates the nozzle side flow rate Qn detected by the flow rate sensor 67 (the flow rate immediately after the nozzle descends Q1, the flow rate immediately after pushing up Q2, and the flow rate during the nozzle rise). The adsorption state was determined based on Q4). However, a negative pressure sensor (nozzle side negative pressure sensor) that detects the negative pressure in the flow path is installed in the nozzle flow path 63, and the CPU 71 performs suction based on the negative pressure detected by the nozzle side negative pressure sensor. The state may also be determined. Further, a flow rate sensor 68 is installed in the pot flow path 64, and the CPU 71 determines the adsorption state based on the pot side flow rate (immediately after pushing up flow rate Q3) detected by the flow rate sensor 68. However, a negative pressure sensor (pot-side negative pressure sensor) is installed in the pot flow path 64 to detect negative pressure in the flow path, and the CPU 71 performs adsorption based on the negative pressure detected by the pot-side negative pressure sensor. The state may also be determined.

In the embodiment described above, the suction condition determination process is executed by the control device 70 of the component mounter 20. However, part of the suction condition determination process may be executed by the management device 80 or may be executed by the wafer supply device 40.

As described above, the suction condition determination method of the present disclosure uses a suction device that suctions a die from a wafer that is divided into a plurality of dies and whose back side is attached to a sheet, and that is movable up and down and that uses negative pressure. a peeling device having a head having a nozzle capable of sucking the die, a sheet holding member capable of holding the sheet by negative pressure, and a pin movable up and down with respect to the sheet holding member; and removing the die from the wafer. When sucking and taking out the sheet, the sheet holding control causes the sheet holding member to hold the back side of the sheet, the nozzle lowering control lowers the nozzle above the die to suck the die to the nozzle, and the pin control to perform adsorption control to control the head and the peeling device to sequentially execute pin push-up control to push up the die from the back side of the sheet and nozzle lift control to raise the nozzle that has attracted the die; A suction condition determining method for determining suction conditions for the suction control, which is applied to a suction device comprising: holding the sheet on the sheet holding member and pushing up the pin from the back side of the sheet; In this state, the tensile load necessary to peel off the die stuck to the sheet is measured, and as one of the adsorption conditions, the nozzle is heated at a predetermined negative pressure based on the measured tensile load. The gist is to determine the nozzle size necessary to attract the die.

The suction condition determination method of the present disclosure determines the suction conditions of a suction device that pushes up a die attached to a sheet from the back side with a pin and suctions it with a nozzle. The suction condition determination method involves measuring the tensile load required to peel off the die attached to the sheet while holding the sheet on a sheet holding member and pushing up a pin from the back side of the sheet. The suction condition determining method determines, as one of the suction conditions, a nozzle size required to suction the die to the nozzle with a predetermined negative pressure based on the measured tensile load. This makes it possible to select a nozzle of an appropriate size for peeling off the die stuck to the sheet. As a result, in a suction device in which a die stuck to a sheet is pushed up from the back side with a pin and suctioned with a nozzle, a suction condition determining method that can determine more appropriate suction conditions can be provided.

In such a suction condition determination method of the present disclosure, the state of negative pressure supplied to the sheet holding member is monitored during the measurement of the tensile load, and one of the suction conditions is determined based on the negative pressure supply state of the pin. It may also be used to determine the amount of push-up. In this case, when the negative pressure supply state reaches a leak state in which negative pressure leaks from the sheet holding member during the measurement of the tensile load, the amount of push-up of the pin is increased and the tensile load is remeasured. When the measurement of the tensile load is completed without the pressure supply state reaching the leak state, the amount of push-up at that time may be determined as the amount of push-up of the pin. In this way, the amount by which the pin is pushed up can be determined to be a more appropriate amount.

Further, in the suction condition determining method of the present disclosure, after determining the suction conditions, the suction control is executed, and during the execution of the suction control, the negative pressure supply state to the nozzle and the negative pressure to the sheet holding member are determined. The supply state may be monitored to confirm that each of the negative pressure supply states is in a predetermined appropriate state. In this way, it can be confirmed whether the determined adsorption conditions are appropriate.

Furthermore, in the suction condition determining method of the present disclosure, the suction control performs the sheet holding control and the nozzle lowering control, and when a first predetermined time elapses after the nozzle is lowered by the nozzle lowering control, the performing the pin push-up control to raise the pin at a first predetermined speed, and after a second predetermined time has elapsed after the pin is pushed up by the pin push-up control, the nozzle raise control to raise the nozzle at a second predetermined speed; The adsorption control is executed while changing at least one parameter among the first predetermined time, the second predetermined time, the first predetermined speed, and the second predetermined speed. The negative pressure supply state in each of the nozzle and the sheet holding member may be monitored during execution of the control, and a condition in which each negative pressure supply state is in a predetermined appropriate state may be determined as the adsorption condition. . In this case, the first predetermined time or the second predetermined time may be determined to be the shortest time within a time range in which each negative pressure supply state is in the appropriate state. Further, the first predetermined speed or the second predetermined speed may be determined to be the fastest speed within a speed range in which each negative pressure supply state is in the appropriate state. In this way, the cycle time can be further shortened while ensuring proper adsorption of the die.

Note that the present disclosure is not limited to the form of an adsorption condition determining method, but may be applied to an adsorption device.

INDUSTRIAL APPLICATION This invention can be utilized for the manufacturing industry of an adsorption device, etc.

1 mounting system, 20 component mounting machine, 21 substrate transport device, 22 head moving device, 23 parts camera, 24 mark camera, 25 tape supply device, 30 head, 31 suction nozzle, 32 nozzle lifting device, 40 wafer supply device, 41 Wafer pallet, 41o opening, 42 magazine, 43 wafer sheet, 44 pallet pull-out device, 50 die peeling device, 51 pot, 52 pot moving device, 55 push-up pin, 56 pin lifting device, 60 negative pressure supply system, 61 vacuum pump, 62 pump flow path, 63 nozzle flow path, 64 pot flow path, 65, 66 on-off valve, 67, 68 flow rate sensor, 70 control device, 71 CPU, 72 ROM, 73 HDD, 74 RAM, 75 timer, 80 management device, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 100 chuck, 101 load sensor, D die, S substrate, W wafer.

Claims (8)

In a suction device that suctions a die from a wafer that is divided into a plurality of dies and whose back side is attached to a sheet,
a head having a nozzle that is movable up and down and capable of sucking the die with negative pressure;
a peeling device having a sheet holding member capable of holding the sheet by negative pressure; and a pin movable up and down with respect to the sheet holding member;
When the die is taken out from the wafer by suction, the back side of the sheet is held by the sheet holding member, and the nozzle is lowered above the die to attract the die to the nozzle. control, pin push-up control in which the die is pushed up from the back side of the sheet with the pin, and nozzle lift control in which the nozzle that has attracted the die is raised, the head and the peeling device being controlled to sequentially execute. a control device that performs adsorption control;
An adsorption condition determining method applied to an adsorption device comprising:
measuring the tensile load necessary to peel off the die stuck to the sheet while holding the sheet on the sheet holding member and pushing up the pin from the back side of the sheet;
As one of the adsorption conditions, a nozzle size necessary for adsorbing the die to the nozzle with a predetermined negative pressure is determined based on the measured tensile load.
How to determine adsorption conditions. The method for determining adsorption conditions according to claim 1,
Monitoring the negative pressure supply state to the sheet holding member during the measurement of the tensile load,
As one of the adsorption conditions, an amount of pushing up of the pin is determined based on the negative pressure supply state.
How to determine adsorption conditions. The method for determining adsorption conditions according to claim 2,
During the measurement of the tensile load, if the negative pressure supply state reaches a leak state in which negative pressure leaks from the sheet holding member, the amount of push-up of the pin is increased and the tensile load is remeasured, and the negative pressure supply state is changed. When the measurement of the tensile load is completed without reaching the leak state, the amount of push-up at that time is determined as the amount of push-up of the pin;
How to determine adsorption conditions. The method for determining adsorption conditions according to any one of claims 1 to 3,
After determining the suction conditions, the suction control is executed, and during the execution of the suction control, the negative pressure supply state to the nozzle and the negative pressure supply state to the sheet holding member are monitored, and each of the negative pressures is Confirm that the supply status is in a predetermined appropriate state,
How to determine adsorption conditions. The method for determining adsorption conditions according to any one of claims 1 to 4,
The suction control performs the sheet holding control and the nozzle lowering control, and when a first predetermined time period elapses after the nozzle is lowered by the nozzle lowering control, the pin is raised at a first predetermined speed. After performing push-up control and pushing up the pin by the pin push-up control, when a second predetermined time period has elapsed, the nozzle lift control is performed to raise the nozzle at a second predetermined speed;
The adsorption control is executed while changing at least one parameter among the first predetermined time, the second predetermined time, the first predetermined speed, and the second predetermined speed, and the monitoring the negative pressure supply state in each of the nozzle and the sheet holding member, and determining a condition in which each negative pressure supply state is in a predetermined appropriate state as the adsorption condition;
How to determine adsorption conditions. The method for determining adsorption conditions according to claim 5,
determining, as the first predetermined time or the second predetermined time, the shortest time within a time range in which each of the negative pressure supply states is in the respective appropriate state;
How to determine adsorption conditions. The method for determining adsorption conditions according to claim 5 or 6,
determining, as the first predetermined speed or the second predetermined speed, the fastest speed within a speed range in which each negative pressure supply state is in the respective appropriate state;
How to determine adsorption conditions. A suction device that suctions a die from a wafer that is divided into a plurality of dies and whose back side is attached to a sheet,
a head having a nozzle that is movable up and down and capable of sucking the die with negative pressure;
a peeling device having a sheet holding member capable of holding the sheet by negative pressure; and a pin movable up and down with respect to the sheet holding member;
When the die is taken out from the wafer by suction, the back side of the sheet is held by the sheet holding member, and the nozzle is lowered above the die to attract the die to the nozzle. control, pin push-up control to push up the die from the back side of the sheet with the pin, and nozzle lift control to raise the nozzle that has attracted the die, and control the head and the peeling device to sequentially execute. a control means for performing adsorption control;
As one of the suction conditions for the suction control, the tensile load required to peel off the die stuck to the sheet with the nozzle is measured during the execution of the suction control, and the tensile load is applied to the measured tensile load. suction condition determining means for determining a nozzle size necessary for suctioning the die to the nozzle with a predetermined negative pressure based on the
An adsorption device comprising:

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