WO2013171869A1 - Die peeling apparatus - Google Patents

Die peeling apparatus Download PDF

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Publication number
WO2013171869A1
WO2013171869A1 PCT/JP2012/062576 JP2012062576W WO2013171869A1 WO 2013171869 A1 WO2013171869 A1 WO 2013171869A1 JP 2012062576 W JP2012062576 W JP 2012062576W WO 2013171869 A1 WO2013171869 A1 WO 2013171869A1
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WO
WIPO (PCT)
Prior art keywords
suction
die
suction nozzle
adhesive sheet
peeling
Prior art date
Application number
PCT/JP2012/062576
Other languages
French (fr)
Japanese (ja)
Inventor
貴幸 水野
水谷　大輔
賢史 岩島
浩一朗 杉本
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2012/062576 priority Critical patent/WO2013171869A1/en
Priority to JP2014515419A priority patent/JP6021904B2/en
Publication of WO2013171869A1 publication Critical patent/WO2013171869A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Definitions

  • the present invention relates to a die peeling apparatus for peeling a die in a state of being attached to an adhesive sheet.
  • a die peeling apparatus for picking up a die cut out from a wafer and attached to an adhesive sheet (hereinafter abbreviated as a sheet) has been known.
  • the peeling device includes a suction nozzle that sucks the lower surface of the sheet at the position where the die to be peeled is attached, and a pin that pushes the lower surface of the sheet upward. The die peeled from the sheet due to the rising of the pin is sucked and held by the suction nozzle and conveyed.
  • the die tends to become thinner. For this reason, when a pin is pushed up and the die is peeled from the sheet, the die may be broken and damaged.
  • the present invention has been made to solve the above-described conventional problems, and an object of the present invention is to provide a die peeling apparatus that can prevent die breakage when peeling a die from an adhesive sheet. Is.
  • the die peeling apparatus which solves the above problem, is a die peeling apparatus for peeling a plurality of dies attached on an adhesive sheet from the adhesive sheet, and a holding unit for holding the adhesive sheet;
  • a suction nozzle having a suction surface formed at the upper end, a negative pressure source for generating a suction negative pressure on the suction surface, a pin mounted on the suction nozzle so as to protrude upward from the suction surface, and moving the pin up and down
  • a suction negative pressure adjusting unit that adjusts the suction negative pressure, and the suction negative pressure adjustment of the lower surface of the adhesive sheet held by the holding unit on the suction surface
  • the suction sheet is sucked with a negative suction pressure adjusted at a portion, the lower surface of the adhesive sheet sucked by the suction surface is pushed up by the pin by driving the push-up device, and the die is To peel.
  • the invention according to claim 2 has pin control means for pushing up the pin when the suction negative pressure reaches a certain level or more in claim 1.
  • the rotating mechanism that relatively rotates the holding portion and the suction nozzle, and the rotating mechanism is operated before the die is peeled from the adhesive sheet. Accordingly, the suction nozzle is rotated from a position relative to the holding portion at the time of peeling to a pre-peeling position that is relatively rotated around the axis of the suction nozzle by a predetermined angle, and the lower surface of the adhesive sheet is sucked by the suction nozzle.
  • pre-peeling execution means for pushing up the lower surface of the adhesive sheet with the pins.
  • the suction nozzle has a suction nozzle rotating mechanism that rotates the suction nozzle about the axis of the suction nozzle, and the lower surface of the adhesive sheet is sucked by the suction nozzle.
  • the suction nozzle rotating mechanism is operated to rotate the suction nozzle.
  • the invention according to claim 5 is the pressure-sensitive adhesive according to claim 1, further comprising a suction nozzle rotating mechanism that rotates the suction nozzle about an axis of the suction nozzle, and the pin is sucked by the suction surface.
  • suction nozzle rotation positioning means for positioning the suction nozzle by rotating the suction nozzle around the axis of the suction nozzle by operating a suction nozzle rotation mechanism.
  • the suction negative pressure adjusting unit adjusts the suction negative pressure on the suction surface.
  • the suction negative pressure adjustment unit reduces the suction negative pressure so that when the die is peeled from the adhesive sheet, the die is slowly removed from the adhesive sheet. Exfoliation prevents excessive stress from acting on the die during exfoliation. For this reason, when the die is peeled from the adhesive sheet, the die is prevented from being damaged.
  • the pin control means pushes up the pin when the suction negative pressure reaches a certain level. Therefore, it is possible to prevent the peeling failure from the pressure-sensitive adhesive sheet of the die due to the pin being pushed up with the suction negative pressure on the suction surface being small.
  • the pre-peeling execution means rotates the suction nozzle at a predetermined angle around the axis of the suction nozzle from the relative position to the holding portion at the time of peeling before the die is peeled from the adhesive sheet.
  • the pre-peeling position is rotated, and the lower surface of the adhesive sheet is pushed up with a pin while the lower surface of the adhesive sheet is sucked by the suction nozzle.
  • a position different from the position where the die is peeled from the pressure-sensitive adhesive sheet by the main peeling immediately before being sucked by the suction nozzle is peeled. For this reason, the area
  • the die is not sufficiently peeled from the pressure-sensitive adhesive sheet and the die is firmly adhered to the pressure-sensitive adhesive sheet. This can prevent the die from being damaged.
  • the die since the position where the die is peeled off from the adhesive sheet by the main peeling immediately before being sucked by the suction nozzle is peeled off, the die is sufficiently stuck even if the suction negative pressure on the suction surface is set small. It can be peeled from the sheet.
  • the suction negative pressure can be set small, it is possible to more reliably prevent the die from being damaged at the time of suction by the suction nozzle.
  • the rotation peeling means rotates the suction nozzle when the lower surface of the adhesive sheet is pushed up by the pin while the lower surface of the adhesive sheet is sucked by the suction nozzle.
  • the suction nozzle rotation positioning means positions the suction nozzle after rotating it around the axis of the suction nozzle. Accordingly, when the rotation position of the pin mounted on the suction nozzle with respect to the die is not appropriate, the suction nozzle is rotated around the axis of the suction nozzle so that the rotation position of the pin with respect to the die is an appropriate position. If the pin is pushed up on the lower surface of the adhesive sheet sucked on the suction surface after positioning, the die is properly pushed up by the pin, and the die is surely peeled off from the adhesive sheet. Can do.
  • A It is a time chart showing the relationship between the suction negative pressure of a suction nozzle (suction surface) and elapsed time in die peeling conveyance processing.
  • B It is the time chart showing the relationship between the position of the up-down direction of a pin and elapsed time in die peeling conveyance processing.
  • C It is a time chart showing the relationship between the suction negative pressure of the suction nozzle and the elapsed time in the die peeling conveyance process.
  • the die peeling apparatus 100 of this embodiment peels the die assembly 500 shown in FIG. 3 one by one.
  • the die assembly 500 includes a frame body 501 made of resin or the like, an adhesive sheet 502 attached to the inner peripheral side of the frame body and having an adhesive layer formed on the upper surface, and an adhesive sheet 502 And a die 503 which is a plurality of semiconductor elements attached to the substrate.
  • the die peeling apparatus 100 of the present embodiment mainly includes a base 10, a holding table 20, a push-up unit 30, an X direction moving device 40, a Y direction moving device 50, and a negative pressure source. 60 and a control unit 70.
  • the horizontal direction is the X direction
  • the vertical direction is the Y direction
  • the horizontal direction is the X direction
  • the vertical direction is the Z direction.
  • the holding table 20 holds the die assembly 500 on the base 10. As shown in FIGS. 1 and 2, the holding table 20 includes a base member 21 and a holding member 22. The base member 21 is attached on the base 10 by a bracket (not shown). The base member 21 is on a plate, and a circular through window 21a is formed as shown in FIG.
  • the holding member 22 is formed with a circular through window 22a.
  • a holding portion 22b for holding the die assembly 500 is recessed.
  • the shape of the holding portion 22 b is a shape corresponding to the shape of the frame body 501 of the die assembly 500.
  • the holding member 22 is slidably attached to the base member 21.
  • the holding member 22 is accommodated in the base member 21 adjacent to the base member 21 as shown by the solid line in FIG. 1 and the mounting position where the holding portion 22b is exposed, and as shown by the one-point diagonal line in FIG. Slide between holding positions.
  • the die assembly 500 is mounted on the holding portion 22b and the holding member 22 moves to the holding position in a state where the holding member 22 is in the mounting position, the die assembly 500 is held by the base member 21 and the holding member 22. .
  • the pushing-up unit 30 pushes up the lower surface of the die assembly 500 held by the holding table 20 while adsorbing it, and peels one of the dies 503 from the adhesive sheet 502.
  • the push-up unit 30 mainly includes a main body 31, a suction nozzle 32, a pin 33, a pin holding member 34, a push-up device 35, a rotation device 36, and a bracket 38.
  • the main body 31 has a cylindrical shape and is disposed below the holding table 20.
  • the suction nozzle 32 is detachably attached to the upper end of the main body 31 and has a bottomed cylindrical shape having a bottom at the top.
  • the upper surface of the suction nozzle 32 is a suction surface 32a.
  • a plurality of annular and radial grooves 32b are formed in the suction surface 32a.
  • a plurality of flow holes 32c communicating with the inside of the suction nozzle 32 are formed at the bottom of the groove 32b of the suction surface 32a.
  • a plurality of insertion holes 32d communicating with the inside of the suction nozzle 32 are formed at the bottom of the groove 32b of the suction surface 32a.
  • a pin holding member 34 is disposed so as to be movable in the vertical direction.
  • a plurality of pins 33 are attached to the upper portion of the pin holding member 34, and each of the plurality of pins 33 is inserted into the insertion hole 32 d of the suction nozzle 32.
  • the pin 33 is attached to the suction nozzle 32 so as to protrude upward from the suction surface 32a.
  • the inside of the suction nozzle 32 or the main body 31 is connected to the negative pressure source 60 via the pressure regulating valve 80.
  • the negative pressure source 60 is constituted by a vacuum pump or the like, and generates a suction negative pressure on the suction surface 32a by sucking the inside of the suction nozzle 32 or the main body 31.
  • the pressure regulating valve 80 adjusts the suction negative pressure at the suction surface 32a, and is a solenoid valve in this embodiment.
  • a pressure sensor 39 for detecting the negative pressure (suction negative pressure) inside the suction nozzle 32 is disposed.
  • the push-up device 35 moves the pin 33 up and down, is composed of an actuator or the like, and is attached to the main body 31.
  • the push-up device 35 and the pin holding member 34 are connected by a rod 37.
  • the bracket 38 supports the main body 31 in a rotatable manner.
  • the rotation device 36 rotates the suction nozzle 32 so that it can be positioned.
  • the rotation device 36 is a servo motor attached to the bracket 38 and having a rotation shaft 36a.
  • a gear member 36 b attached to the rotation shaft 36 a is engaged with a gear 31 a formed on the outer peripheral surface of the main body 31.
  • the X direction moving device 40 moves the push-up unit 30 in the X direction, and has an X slide 41, an X rail 42, and a moving device 43 as shown in FIGS.
  • the X rail 42 is mounted on the base 10 with its longitudinal direction as the X direction.
  • the X slide 41 is slidably attached to the X rail 42.
  • the moving device 43 is a servo motor or the like, and moves the X slide 41 to an arbitrary position on the X rail 42 by rotating a ball screw 44 that engages with the X slide 41.
  • the Y-direction moving device 50 moves the push-up unit 30 in the Y direction, and includes a Y slide 51, a Y rail 52, and a moving device 53 as shown in FIGS.
  • the Y rail 52 is attached to the X slide 42 with its longitudinal direction as the Y direction.
  • the Y slide 51 is slidably attached to the Y rail 52.
  • a bracket 38 of the push-up unit 30 is attached to the Y slide 51.
  • the moving device 53 is a servo motor or the like, and moves the Y slide 51 to an arbitrary position on the Y rail 52 by rotating a ball screw 54 that engages with the Y slide 51.
  • the control unit 70 performs overall control of the die peeling apparatus 100 and has an ECU.
  • the ECU includes “storage units” such as an input / output interface, a CPU, a RAM, a ROM, and a non-volatile memory connected to each other via a bus.
  • the CPU executes a program for controlling the die peeling apparatus 100.
  • the RAM temporarily stores variables necessary for execution of the program, and the “storage unit” stores the program.
  • the control unit 70 is communicably connected to the push-up device 35, the rotation device 36, the movement devices 43 and 53, the negative pressure source 60, and the pressure regulating valve 80, and controls them.
  • the control unit 70 is communicably connected to the pressure sensor 39, and receives a “suction negative pressure” detection signal detected by the pressure sensor 39.
  • an adsorption nozzle 600 that can be moved in any of X, Y, and Z directions by a moving device (not shown) is disposed on the die peeling device 100.
  • the suction nozzle 600 includes a cylindrical nozzle main body 601 and a cylindrical suction portion 602 attached to the lower end of the nozzle main body 601 so as to be movable in the vertical direction.
  • the suction portion 602 is biased downward by a biasing member (not shown), and the lower end surface thereof is a suction surface 602a.
  • the suction nozzle 600 is connected to a negative pressure source (both not shown) via a stop valve.
  • the “die peeling conveyance process” of the first embodiment for peeling the die 503 from the adhesive sheet 502 will be described below using the flowchart of FIG. 5, the explanatory diagram of FIG. 6, and the time chart of FIG. 7.
  • the negative pressure is a pressure lower than the atmospheric pressure, and the increase in the negative pressure means that the pressure decreases.
  • control unit 70 outputs a control signal to the moving devices 43 and 53 in S12 to move the suction nozzle 32 directly below the die 503 to be picked up, and in S13, the moving device of the suction nozzle 600 is moved.
  • the control signal By outputting the control signal, the suction surface 602a of the suction portion 602 is brought into contact with the die 503 after being moved directly above the die 503 (FIG. 6A).
  • S13 ends, the program proceeds to S21.
  • the control unit 70 determines “target suction negative pressure” based on the “strength information” acquired in S ⁇ b> 11, and outputs a control signal to the negative pressure source 60 and the pressure regulating valve 80, whereby the suction nozzle 32.
  • a “suction negative pressure” is generated inside ((1) in FIG. 7A). Then, the adhesive sheet 502 immediately below the die 503 to be picked up is sucked by the suction nozzle 32 on the suction surface 32a.
  • the “target suction negative pressure” is determined as a negative pressure at which the die 503 does not break depending on the ease of cracking of the die 503.
  • the control unit 70 feedback-controls the pressure regulating valve 80 so that the “suction negative pressure” becomes the “target suction negative pressure” based on the pressure detected by the pressure sensor 39.
  • the “suction negative pressure” in the suction surface 32a corresponds to the “suction negative pressure” in the suction nozzle 32 (for example, a proportional relationship).
  • the control unit 70 determines that there is an abnormality in the suction of the adhesive sheet 502 with the suction nozzle 32 (S91: YES)
  • the program proceeds to S92, and the suction of the adhesive sheet 502 with the suction nozzle 32 is performed. If it is determined that there is no abnormality (S91: NO), the program is returned to S21.
  • the abnormal suction of the adhesive sheet 502 by the suction nozzle 32 means that even if a predetermined “regulation error time” has elapsed from the start of the suction of the adhesive sheet 502 by the suction nozzle 32, the “negative suction pressure” is a predetermined value. This is a case where the pressure does not rise above the negative pressure ((2) in FIG. 7A), and the adhesive sheet 502 and the suction nozzle 32 are damaged, causing an air leak between the adhesive sheet 502 and the suction surface 32a. Occurs when.
  • control unit 70 stops picking up the die 503, notifies an abnormality in the suction of the adhesive sheet 502 with the suction nozzle 32 by a notifying device such as a display device or a speaker (not shown), and returns the program to S12. .
  • the control unit 70 outputs a control signal to the push-up device 35 to cause the pin 33 to protrude from the suction surface 32a ((1) in FIG. 7B). Then, as shown in FIG. 6B, the adhesive sheet 502 is sucked by the suction surface 32a of the suction nozzle 32, while the die 503 is pushed up to the information by the pins 33, so that the die 503 becomes the adhesive sheet. It is peeled off from 502. In addition, since the adsorption
  • control unit 70 outputs a control signal to the closing valve of the suction nozzle 600 to start suction on the suction surface 602a of the suction unit 602 ((1) in FIG. 7C).
  • the die 503 is conveyed to a desired position while being attracted by the suction surface 602a of the suction portion 602 ((C) in FIG. 6).
  • the control unit 70 When S13 ends, in S14, the control unit 70 outputs a control signal to the rotation device 36 to rotate the suction nozzle 32 to the “pre-peeling position”.
  • the “pre-peeling position” refers to a position around the axis of the suction nozzle 32 from the “peeling position” (shown in FIG. 9B), which is a relative position of the die 503 from the holding table 20 when the die 503 is peeled from the adhesive sheet 502. This is a position that is relatively rotated by a predetermined angle (shown in FIG. 9A).
  • the control unit 70 determines “target suction negative pressure” based on the “strength information” acquired in S ⁇ b> 11, and outputs a control signal to the negative pressure source 60 and the pressure regulating valve 80, whereby the suction nozzle 32. A “suction negative pressure” is generated inside. Based on the pressure detected by the pressure sensor 39, the control unit 70 feedback-controls the pressure regulating valve 80 so that the “suction negative pressure” becomes the “target suction negative pressure”. When S15 ends, the program proceeds to S16.
  • control unit 70 outputs a control signal to the push-up device 35, thereby causing the pin 33 to protrude from the suction surface 32a to execute “pre-peeling”.
  • pre-peeling a region indicated by hatching in FIG. 9A is peeled off.
  • control unit 70 rotates the suction nozzle 32 to the “peeling position” by outputting a control signal to the rotation device 36 (shown in FIG. 9B).
  • the program proceeds to S15.
  • the “pre-peeling operation” (S14, S15, S16) is performed before the “main peeling” for peeling the die 503 from the adhesive sheet 502. Running.
  • a position different from the region (shown in FIG. 9 (B)) peeled off by “main peeling” is peeled off (shown in FIG. 9 (A)). Therefore, as shown in FIG. An area where the die 503 is not peeled off from 502 hardly occurs.
  • the control unit 70 When S41 ends, in S42, the control unit 70 outputs a control signal to the rotation device 36 to rotate the suction nozzle 32 in one direction by a predetermined angle ((A) in FIG. 11). The operation of rotating the suction nozzle 32 by a predetermined angle in the opposite direction (FIG. 11B) is repeated. Then, since the position of the pin 33 moves with respect to the adhesive sheet 502 and the die 503, the die 503 is peeled from the adhesive sheet 502 in a wide range. Further, since the operation of rotating the suction nozzle 32 in one direction and then rotating in the opposite direction is repeated, vibration due to the operation is applied to the adhesive sheet 502, and the die 503 is more reliably attached to the adhesive sheet. Peel from 502. When S42 ends, the process proceeds to S51.
  • the control unit 70 acquires “strength information” of the die 503, and also acquires “shape information” and “posture information” of the die 503.
  • the “posture information” is information on the horizontal posture of the die 503 with respect to the suction nozzle 32 in a state where the die assembly 500 is held by the holding table 20, and as shown in FIG. Is information such as the longitudinal direction of the die 503 with respect to the suction nozzle 32 when the shape is a non-square shape such as a rectangle.
  • control unit 70 determines in S11 that the rotation position of the suction nozzle 32 relative to the die 503 is not appropriate based on the acquired “shape information” and “posture information” of the die 503. If so (S18: YES), the program proceeds to S19. If it is determined that the rotational position of the suction nozzle 32 relative to the die 503 is appropriate (S18: NO), the program proceeds to S21. Note that the control unit 70 may be configured such that when the horizontal position of the pin 33 protrudes from the die 503 as shown in FIG. 13A or when the pin 33 has a horizontal position as shown in FIG.
  • control unit 70 outputs a control signal to the rotation device 36 so that the rotation position of the suction nozzle 32 with respect to the die 503 becomes an appropriate position as shown in FIG.
  • the suction nozzle 32 is rotated and positioned.
  • the program proceeds to S21. It should be noted that the processes of S18 and S19 described above may be performed before the process of S12 for moving the suction nozzle 32.
  • the pressure regulating valve 80 (suction negative pressure adjusting unit) is operated by the “suction negative pressure” of the suction nozzle 32 in S21 of FIGS. 5, 8, 10, and 12 and S ⁇ b> 15 of FIG. 8. Is adjusted to adjust the “suction negative pressure” at the suction surface 32a.
  • the pressure reducing valve 80 reduces the “suction negative pressure” on the suction surface 32 a, so that the die 503 is pushed up by pushing up the pin 33.
  • the die 503 peels slowly from the pressure-sensitive adhesive sheet 502, and an excessive stress action on the die 503 is prevented at the time of peeling. For this reason, the die 503 is prevented from being damaged when the die 503 is peeled from the adhesive sheet 502.
  • the pressure regulating valve 80 is based on the “strength information” acquired in S11 in S21 of FIGS. 5, 8, 10 and 12 and S15 of FIG.
  • the tact time for peeling the die 503 from the adhesive sheet 502 can be shortened.
  • the control unit 70 determines that the “suction negative pressure” of the suction nozzle 32 has reached the “regular negative pressure” or more (YES in S31 of FIGS. 5, 8, 10, and 12). ), The pin 33 is pushed up (S41 in FIGS. 5, 8, 10, and 12). Accordingly, it is possible to prevent a peeling failure from the adhesive sheet 502 of the die 503 caused by the pin 33 being pushed up while the “suction negative pressure” on the suction surface 32a is small.
  • the “regulator negative pressure” is set to a predetermined negative pressure with respect to the “target suction negative pressure”, the “suction negative pressure” of the suction nozzle 32 is set to “target suction negative pressure”.
  • the pin 33 Before reaching the “pressure”, the pin 33 is pushed up ((1) in FIG. 7B). For this reason, the tact time for peeling the die 503 from the adhesive sheet 502 is shortened compared with pushing up the pin 33 after the “suction negative pressure” of the suction nozzle 32 reaches the “target suction negative pressure”. can do.
  • the control unit 70 pre-peeling execution unit sucks the suction nozzle 32 from the relative position with the holding table (holding unit) at the time of peeling before the die 503 is peeled from the adhesive sheet 502. It is rotated to a “pre-peeling position” (shown in FIG. 9A) that is relatively rotated by a predetermined angle around the axis of the nozzle 32, and the lower surface of the adhesive sheet 502 is sucked by the suction nozzle 32 in S15 and S16 of FIG. While performing “pre-peeling”, the pins 33 push up the lower surface of the adhesive sheet 502. As a result, as shown in FIG. 9A, a position different from the position (shown in FIG.
  • FIG. 9A a position different from the position (shown in FIG. 9B) where the die 503 is peeled from the adhesive sheet 502 by “main peeling” immediately before being sucked by the suction nozzle 600. Therefore, even if the “suction negative pressure” at the suction nozzle 32 is set small and the “suction negative pressure” at the suction surface 32a becomes small, the die 503 is sufficiently peeled from the adhesive sheet 502. Can do. For this reason, by setting the “suction negative pressure” to be small, it is possible to more reliably prevent the die 503 from being damaged during suction by the suction nozzle 32.
  • the rotation device 36 (rotation peeling unit) sucks the lower surface of the adhesive sheet 502 with the pin 33 while sucking the lower surface of the adhesive sheet 502 with the suction nozzle 32.
  • the nozzle 32 is rotated.
  • the horizontal position of the pin 33 moves relative to the adhesive sheet 502 and the die 503, so that the die 503 is peeled from the adhesive sheet 502 in a wide range.
  • the pins 33 that are in contact with the adhesive sheet 502 move in the horizontal direction, so that vibration is applied to the adhesive sheet 502, and the die 503 is more reliably peeled from the adhesive sheet 502.
  • the die 503 can be sufficiently separated from the adhesive sheet 502. As described above, since the “suction negative pressure” can be set small, it is possible to more reliably prevent the die 503 from being damaged at the time of suction by the suction nozzle 32.
  • control unit 70 determines that the rotation position of the pin 33 attached to the suction nozzle 32 with respect to the die 503 is not appropriate (state (A) of FIG. 13) (in S18 of FIG. 12).
  • the determination is YES, and the suction nozzle 32 is rotated around the axis of the suction nozzle 32 and positioned so that the rotation position of the pin 33 with respect to the die 503 is an appropriate position.
  • the die 503 is appropriately pushed up by the pin 33, and the die 503 can be reliably peeled off from the adhesive sheet 502.
  • the suction nozzle 32 rotates relative to the holding table 20 by rotating the suction nozzle 32 relative to the base 10.
  • the suction nozzle 32 is rotated with respect to the base 10, whereby the suction nozzle 32 is relatively rotated with respect to the holding table 20. Even if it is a form, it does not interfere.
  • the moving devices 43 and 53 are interlocked with the rotation of the holding table 20 so that the horizontal relative position (suction position and push-up position) of the suction nozzle 32 with respect to the holding table 20 does not change. As a result, the suction nozzle 32 is moved in the horizontal direction.
  • the “suction negative pressure” at the suction surface 32 a of the suction nozzle 32 is adjusted by the pressure regulating valve 80.
  • two channels a channel provided with a regulator 81 that restricts “suction negative pressure” and a channel not provided with the regulator 81, are connected to the negative pressure source 60,
  • a switching valve 82 for switching the flow path based on a command from the control unit 70 is provided in the flow path connected to the suction nozzle 32, and the flow path connected to the suction nozzle 32 by the switching valve 82 is provided in the flow where the regulator 81 is provided.
  • the control unit 70 rotates the suction nozzle 32 by the rotation device 36 based on the information of the die 503 to be peeled off from the adhesive sheet 502, the rotation angle, the number of rotations, There is no problem even if the rotation speed, the rotation time, and the like are appropriately changed. Further, when the suction nozzle 32 is rotated by the rotation device 36, the control unit 70 may be rotated only in the position direction, and the rotation angle is decreased, the number of rotations is increased, and the pin 33 is rotated. Therefore, the vibration may be more effectively applied to the adhesive sheet 502.
  • the rotation device 36 that rotates the suction nozzle 32 is a servo motor, but may be a cylinder or the like.
  • DESCRIPTION OF SYMBOLS 20 ... Holding table (holding part), 30 ... Push-up part, 32 ... Suction nozzle, 32a ... Suction surface, 33 ... Pin, 36 ... Turning apparatus (turning mechanism, suction nozzle turning mechanism), 70 ... Control part ( Pin control means, pre-peeling execution means, rotational peeling means) 80 ... pressure regulating valve (suction negative pressure adjusting section), DESCRIPTION OF SYMBOLS 100 ... Die peeling apparatus 500 ... Die assembly, 501 ... Frame, 502 ... Adhesive sheet, 503 ... Die

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Provided is a die peeling apparatus capable of preventing dies from breaking at the time of peeling the dies from an adhesive sheet. This die peeling apparatus has: a holding table (20) for holding an adhesive sheet having dies adhered thereto; a suction nozzle (32), which sucks, at a suction surface (32a) formed at an upper end of the suction nozzle, the lower surface of the adhesive sheet being held by the holding table (20); a pin (33), which is mounted in the suction nozzle (32) such that the pin can protrude upward from the suction surface (32a), and which peels the dies from the adhesive sheet by thrusting up the lower surface of the adhesive sheet that is being sucked at the suction surface (32a); and a pressure adjusting valve (80), which adjusts suction negative pressure at the suction surface (32a).

Description

ダイ剥離装置Die peeling device
　本発明は、粘着シートに貼り付けられた状態のダイを剥離するためのダイ剥離装置に関するものである。 The present invention relates to a die peeling apparatus for peeling a die in a state of being attached to an adhesive sheet.
　従来から、特許文献１に示されるように、ウエハから切り出され粘着シート（以下、シートと略す）に貼り付けられた状態のダイをピックアップするためのダイ剥離装置（以下、剥離装置と略す）がある。このよう剥離装置は、剥離対象のダイが貼り付けられている位置のシートの下面を吸引する吸引ノズルと、シートの下面を上方に押し上げるピンを備えている。ピンの上昇によりシートから剥離されたダイは、吸着ノズルによって吸着保持されて搬送される。 Conventionally, as shown in Patent Document 1, a die peeling apparatus (hereinafter, abbreviated as a peeling apparatus) for picking up a die cut out from a wafer and attached to an adhesive sheet (hereinafter abbreviated as a sheet) has been known. is there. In this manner, the peeling device includes a suction nozzle that sucks the lower surface of the sheet at the position where the die to be peeled is attached, and a pin that pushes the lower surface of the sheet upward. The die peeled from the sheet due to the rising of the pin is sucked and held by the suction nozzle and conveyed.
特開２００２－１８４８３６号公報（図２５参照）Japanese Patent Laid-Open No. 2002-184836 (see FIG. 25)
　近年、電子部品の小型化に伴って、ダイは薄型化する傾向にある。このため、ピンを押し上げて、シートからダイを剥離する際に、ダイが割れて破損してしまうおそれがある。 In recent years, with the miniaturization of electronic components, the die tends to become thinner. For this reason, when a pin is pushed up and the die is peeled from the sheet, the die may be broken and damaged.
　本発明は、上記した従来の問題点を解決するためになされたもので、ダイを粘着シートから剥離する際における、ダイの破損を防止することができるダイ剥離装置を提供することを目的とするものである。 The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to provide a die peeling apparatus that can prevent die breakage when peeling a die from an adhesive sheet. Is.
　上記課題を解決する請求項１に係るダイ剥離装置は、粘着シート上に貼り付けられた複数のダイを、粘着シートから引き剥がすダイ剥離装置であって、前記粘着シートを保持する保持部と、上端に吸引面が形成された吸引ノズルと、前記吸引面において吸引負圧を発生させる負圧源と、前記吸引面から上方に突出可能に前記吸引ノズルに装着されたピンと、前記ピンを上下動させる押し上げ装置と、前記吸引負圧を調整する吸引負圧調整部と、を有し、前記吸引面において、前記保持部で保持されている前記粘着シートの下面を、前記吸引前記吸引負圧調整部で調整された吸引負圧で吸引し、前記吸引面で吸引されている前記粘着シート下面を、前記押し上げ装置を駆動させることにより前記ピンで押し上げ、前記ダイを前記粘着シートから剥離させる。 The die peeling apparatus according to claim 1, which solves the above problem, is a die peeling apparatus for peeling a plurality of dies attached on an adhesive sheet from the adhesive sheet, and a holding unit for holding the adhesive sheet; A suction nozzle having a suction surface formed at the upper end, a negative pressure source for generating a suction negative pressure on the suction surface, a pin mounted on the suction nozzle so as to protrude upward from the suction surface, and moving the pin up and down And a suction negative pressure adjusting unit that adjusts the suction negative pressure, and the suction negative pressure adjustment of the lower surface of the adhesive sheet held by the holding unit on the suction surface The suction sheet is sucked with a negative suction pressure adjusted at a portion, the lower surface of the adhesive sheet sucked by the suction surface is pushed up by the pin by driving the push-up device, and the die is To peel.
　請求項２に係る発明は、請求項１において、前記吸引負圧が一定以上に達した場合に、前記ピンを押し上げるピン制御手段を有する。 The invention according to claim 2 has pin control means for pushing up the pin when the suction negative pressure reaches a certain level or more in claim 1.
　請求項３に係る発明は、請求項１において、前記保持部と前記吸引ノズルを相対回動させる回動機構と、前記ダイを前記粘着シートから剥離させる前に、前記回動機構を作動させることにより、前記吸引ノズルを前記剥離時における前記保持部との相対位置から前記吸引ノズルの軸線回りに所定角度相対回動したプレ剥離位置に回動させ、前記粘着シートの下面を前記吸引ノズルで吸引しつつ、前記ピンで前記粘着シートの下面を押し上げるプレ剥離実行手段を有する。 According to a third aspect of the present invention, in the first aspect, the rotating mechanism that relatively rotates the holding portion and the suction nozzle, and the rotating mechanism is operated before the die is peeled from the adhesive sheet. Accordingly, the suction nozzle is rotated from a position relative to the holding portion at the time of peeling to a pre-peeling position that is relatively rotated around the axis of the suction nozzle by a predetermined angle, and the lower surface of the adhesive sheet is sucked by the suction nozzle. However, it has pre-peeling execution means for pushing up the lower surface of the adhesive sheet with the pins.
　請求項４に係る発明は、請求項１において、前記吸引ノズルを、前記吸引ノズルの軸線回りに回動させる吸引ノズル回動機構を有し、前記吸引ノズルで前記粘着シートの下面を吸引しつつ、前記ピンで前記粘着シートの下面を押し上げている際に、前記吸引ノズル回動機構を作動させて、前記吸引ノズルを回動させる回動剥離手段を有する。 According to a fourth aspect of the present invention, in the first aspect, the suction nozzle has a suction nozzle rotating mechanism that rotates the suction nozzle about the axis of the suction nozzle, and the lower surface of the adhesive sheet is sucked by the suction nozzle. When the lower surface of the pressure-sensitive adhesive sheet is pushed up by the pin, the suction nozzle rotating mechanism is operated to rotate the suction nozzle.
　請求項５に係る発明は、請求項１において、前記吸引ノズルを、前記吸引ノズルの軸線回りに回動させる吸引ノズル回動機構を有し、前記ピンが前記吸引面において吸引されている前記粘着シート下面を押し上げる前に、吸引ノズル回動機構を作動させて、前記吸引ノズルを、前記吸引ノズルの軸線回りに回動させたうえで位置決めする吸引ノズル回動位置決め手段を有する。 The invention according to claim 5 is the pressure-sensitive adhesive according to claim 1, further comprising a suction nozzle rotating mechanism that rotates the suction nozzle about an axis of the suction nozzle, and the pin is sucked by the suction surface. Before pushing up the lower surface of the sheet, there is provided suction nozzle rotation positioning means for positioning the suction nozzle by rotating the suction nozzle around the axis of the suction nozzle by operating a suction nozzle rotation mechanism.
　請求項１に係る発明によれば、吸引負圧調整部は、吸引面における吸引負圧を調整する。これにより、破損しやすいダイを粘着シートから剥離する場合には、吸引負圧調整部によって、吸引負圧を小さくすることにより、ダイを粘着シートから剥離する際に、ダイが粘着シートから緩慢に剥離し、剥離時にダイへの過大な応力の作用が防止される。このため、ダイを粘着シートから剥離する際における、ダイの破損が防止される。 According to the first aspect of the present invention, the suction negative pressure adjusting unit adjusts the suction negative pressure on the suction surface. As a result, when a die that is easily damaged is peeled off from the adhesive sheet, the suction negative pressure adjustment unit reduces the suction negative pressure so that when the die is peeled from the adhesive sheet, the die is slowly removed from the adhesive sheet. Exfoliation prevents excessive stress from acting on the die during exfoliation. For this reason, when the die is peeled from the adhesive sheet, the die is prevented from being damaged.
　請求項２に係る発明によれば、ピン制御手段は、吸引負圧が一定以上に達した場合に、ピンを押し上げる。これにより、吸引面における吸引負圧が小さい状態で、ピンが押し上げられることに起因する、ダイの粘着シートから剥離不良を防止することができる。 According to the invention of claim 2, the pin control means pushes up the pin when the suction negative pressure reaches a certain level. Thereby, it is possible to prevent the peeling failure from the pressure-sensitive adhesive sheet of the die due to the pin being pushed up with the suction negative pressure on the suction surface being small.
　請求項３に係る発明によれば、プレ剥離実行手段が、ダイを粘着シートから剥離させる前に、吸引ノズルを剥離時における保持部との相対位置から吸引ノズルの軸線回りに所定角度相対回動したプレ剥離位置に回動させ、粘着シートの下面を吸引ノズルで吸引しつつ、ピンで粘着シートの下面を押し上げる。これにより、吸着ノズルで吸着する直前の本剥離によってダイが粘着シートから剥離される位置と、異なる位置が剥離される。このため、ダイが粘着シートから剥離されない領域を減少させることができる。よって、ダイが粘着シートから十分に剥離されておらず、ダイが粘着シートに強固に接着されていることに起因する、吸着ノズルでのダイの吸着ミスや、吸着ノズルでダイを吸着し搬送する際の、ダイの破損を防止することができる。また、吸着ノズルで吸着する直前の本剥離によってダイが粘着シートから剥離される位置と、異なる位置が剥離されるので、吸引面における吸引負圧を小さく設定したとしても、十分に、ダイを粘着シートから剥離させることができる。このように、吸引負圧を小さく設定することができるので、吸引ノズルでの吸引時におけるダイの破損を、より確実に、防止することができる。 According to the invention of claim 3, the pre-peeling execution means rotates the suction nozzle at a predetermined angle around the axis of the suction nozzle from the relative position to the holding portion at the time of peeling before the die is peeled from the adhesive sheet. The pre-peeling position is rotated, and the lower surface of the adhesive sheet is pushed up with a pin while the lower surface of the adhesive sheet is sucked by the suction nozzle. Thereby, a position different from the position where the die is peeled from the pressure-sensitive adhesive sheet by the main peeling immediately before being sucked by the suction nozzle is peeled. For this reason, the area | region where die | dye does not peel from an adhesive sheet can be reduced. Therefore, the die is not sufficiently peeled from the pressure-sensitive adhesive sheet and the die is firmly adhered to the pressure-sensitive adhesive sheet. This can prevent the die from being damaged. In addition, since the position where the die is peeled off from the adhesive sheet by the main peeling immediately before being sucked by the suction nozzle is peeled off, the die is sufficiently stuck even if the suction negative pressure on the suction surface is set small. It can be peeled from the sheet. Thus, since the suction negative pressure can be set small, it is possible to more reliably prevent the die from being damaged at the time of suction by the suction nozzle.
　請求項４に係る発明によれば、回動剥離手段は、吸引ノズルで粘着シートの下面を吸引しつつ、ピンで粘着シートの下面を押し上げている際に、吸引ノズルを回動させる。これにより、ピンの水平方向位置が、粘着シートやダイに対して移動するので、ダイが粘着シートから広範な範囲において剥離される。また、粘着シートと当接しているピンが水平方向に移動することにより、粘着シートに振動が付与され、より確実に、ダイが粘着シートから剥離される。このため、吸引面における吸引負圧を小さく設定したとしても、十分に、ダイを粘着シートから剥離させることができる。このように、吸引負圧を小さく設定することができるので、吸引ノズルでの吸引時におけるダイの破損を、より確実に、防止することができる。 According to the fourth aspect of the present invention, the rotation peeling means rotates the suction nozzle when the lower surface of the adhesive sheet is pushed up by the pin while the lower surface of the adhesive sheet is sucked by the suction nozzle. Thereby, since the horizontal direction position of a pin moves with respect to an adhesive sheet or die | dye, die | dye peels in the wide range from an adhesive sheet. Moreover, when the pin in contact with the adhesive sheet moves in the horizontal direction, vibration is applied to the adhesive sheet, and the die is more reliably peeled off from the adhesive sheet. For this reason, even if the suction negative pressure on the suction surface is set small, the die can be sufficiently peeled from the adhesive sheet. Thus, since the suction negative pressure can be set small, it is possible to more reliably prevent the die from being damaged at the time of suction by the suction nozzle.
　請求項５に係る発明によれば、吸引ノズル回動位置決め手段は、吸引ノズルを、吸引ノズルの軸線回りに回動させたうえで位置決めする。これにより、吸引ノズルに装着されているピンのダイに対する回動位置が適切で無い場合には、ピンのダイに対する回動位置が適切な位置となるように、吸引ノズルを、吸引ノズルの軸線回りに回動させたうえで位置決めしたうえで、ピンが吸引面において吸引されている粘着シート下面を押し上げることとすると、ダイがピンによって適切に押し上げられ、確実に、ダイを粘着シートから引き剥がすことができる。また、異形のダイの供給方向が変更された場合であっても、ダイの供給方向の変更に対応するようなピンが装着された吸引ノズルを新たに用意する必要が無く、吸引ノズルを回動させるだけで、ダイの供給方向の変更に対応することができる。 According to the invention of claim 5, the suction nozzle rotation positioning means positions the suction nozzle after rotating it around the axis of the suction nozzle. Accordingly, when the rotation position of the pin mounted on the suction nozzle with respect to the die is not appropriate, the suction nozzle is rotated around the axis of the suction nozzle so that the rotation position of the pin with respect to the die is an appropriate position. If the pin is pushed up on the lower surface of the adhesive sheet sucked on the suction surface after positioning, the die is properly pushed up by the pin, and the die is surely peeled off from the adhesive sheet. Can do. In addition, even if the supply direction of the odd-shaped die is changed, it is not necessary to prepare a new suction nozzle with a pin corresponding to the change in the supply direction of the die, and the suction nozzle is rotated. It is possible to cope with a change in the direction of supply of the die simply by making them.
本実施形態のダイ剥離装置の構成を示す上面図である。It is a top view which shows the structure of the die | dye peeling apparatus of this embodiment. 本実施形態のダイ剥離装置の構成を示す側面図である。It is a side view which shows the structure of the die peeling apparatus of this embodiment. ダイ集合体の上面図である。It is a top view of a die assembly. 吸着ノズルの上面図である。It is a top view of a suction nozzle. 図２の制御部７０で実行される第一の実施形態のダイ剥離搬送処理のフローチャートである。It is a flowchart of the die | dye peeling conveyance process of 1st embodiment performed by the control part 70 of FIG. 第一の実施形態のダイ剥離搬送処理の説明図であり、粘着シート、ダイ、吸引ノズル、及び吸着ノズルの側面を表した図である。It is explanatory drawing of the die | dye peeling conveyance process of 1st embodiment, and is the figure showing the adhesive sheet, die | dye, suction nozzle, and the side surface of an adsorption nozzle. （Ａ）ダイ剥離搬送処理における吸引ノズル（吸引面）の吸引負圧と経過時間との関係を表したタイムチャートである。（Ｂ）ダイ剥離搬送処理におけるピンの上下方向の位置と経過時間との関係を表したタイムチャートである。（Ｃ）ダイ剥離搬送処理における吸着ノズルの吸着負圧と経過時間との関係を表したタイムチャートである。(A) It is a time chart showing the relationship between the suction negative pressure of a suction nozzle (suction surface) and elapsed time in die peeling conveyance processing. (B) It is the time chart showing the relationship between the position of the up-down direction of a pin and elapsed time in die peeling conveyance processing. (C) It is a time chart showing the relationship between the suction negative pressure of the suction nozzle and the elapsed time in the die peeling conveyance process. 図２の制御部７０で実行される第二の実施形態のダイ剥離搬送処理のフローチャートである。It is a flowchart of the die | dye peeling conveyance process of 2nd embodiment performed by the control part 70 of FIG. （Ａ）プレ剥離で剥離される領域を示した説明図である。（Ｂ）本剥離で剥離される領域を示した説明図である。（Ｃ）プレ剥離及び剥離で剥離される領域を示した説明図である。(A) It is explanatory drawing which showed the area | region peeled by pre-peeling. (B) It is explanatory drawing which showed the area | region peeled by this peeling. (C) It is explanatory drawing which showed the area | region peeled by pre-peeling and peeling. 図２の制御部７０で実行される第三の実施形態のダイ剥離搬送処理のフローチャートである。It is a flowchart of the die | dye peeling conveyance process of 3rd embodiment performed by the control part 70 of FIG. 第三の実施形態における吸引ノズルの動作を表した説明図であり、吸着ノズルの上面図である。It is explanatory drawing showing operation | movement of the suction nozzle in 3rd embodiment, and is a top view of an adsorption nozzle. 図２の制御部７０で実行される第四の実施形態のダイ剥離搬送処理のフローチャートである。It is a flowchart of the die | dye peeling conveyance process of 4th embodiment performed by the control part 70 of FIG. 第四の実施形態における吸引ノズルの動作を表した説明図であり、吸着ノズルの上面図である。It is explanatory drawing showing operation | movement of the suction nozzle in 4th embodiment, and is a top view of an adsorption nozzle. 別の実施形態の説明図である。It is explanatory drawing of another embodiment.
（ダイ剥離装置の構成）
　以下に、本発明の実施形態を図面に基づいて説明する。本実施形態のダイ剥離装置１００は、図３に示すダイ集合体５００を１ずつ剥離するものである。ダイ集合体５００は、図３に示すように、樹脂等で構成された枠体５０１と、枠体の内周側に取り付けられ上面に粘着層が形成された粘着シート５０２と、粘着シート５０２上に貼り付けられた複数の半導体素子であるダイ５０３とから構成されている。 (Configuration of die peeling device)
Embodiments of the present invention will be described below with reference to the drawings. The die peeling apparatus 100 of this embodiment peels the die assembly 500 shown in FIG. 3 one by one. As shown in FIG. 3, the die assembly 500 includes a frame body 501 made of resin or the like, an adhesive sheet 502 attached to the inner peripheral side of the frame body and having an adhesive layer formed on the upper surface, and an adhesive sheet 502 And a die 503 which is a plurality of semiconductor elements attached to the substrate.
　本実施形態のダイ剥離装置１００は、図１、図２に示すように、主に、基台１０、保持テーブル２０、押し上げ部３０、Ｘ方向移動装置４０、Ｙ方向移動装置５０、負圧源６０、制御部７０とから構成されている。なお、図１において、左右方向をＸ方向とし、上下方向をＹ方向とし、図２において、左右方向をＸ方向とし、上下方向をＺ方向とし、以下説明する。 As shown in FIGS. 1 and 2, the die peeling apparatus 100 of the present embodiment mainly includes a base 10, a holding table 20, a push-up unit 30, an X direction moving device 40, a Y direction moving device 50, and a negative pressure source. 60 and a control unit 70. In FIG. 1, the horizontal direction is the X direction, the vertical direction is the Y direction, and in FIG. 2, the horizontal direction is the X direction, and the vertical direction is the Z direction.
　保持テーブル２０は、ダイ集合体５００を基台１０上で保持するものである。図１や図２に示すように、保持テーブル２０は、基部材２１と、保持部材２２とから構成されている。基部材２１は、図示しないブラケットによって、基台１０上に取り付けられている。基部材２１は、板上であり、図１に示すように、円形の貫通窓２１ａが形成されている。 The holding table 20 holds the die assembly 500 on the base 10. As shown in FIGS. 1 and 2, the holding table 20 includes a base member 21 and a holding member 22. The base member 21 is attached on the base 10 by a bracket (not shown). The base member 21 is on a plate, and a circular through window 21a is formed as shown in FIG.
　保持部材２２は、円形の貫通窓２２ａが形成されている。保持部材２２の上面の貫通窓２２ａの周囲には、ダイ集合体５００を保持するための保持部２２ｂが凹陥形成されている。保持部２２ｂの形状は、ダイ集合体５００の枠体５０１の形状に対応した形状となっている。保持部材２２は、基部材２１に、スライド可能に取り付けられている。保持部材２２は、図１の実線で示すように、基部材２１に隣接して、保持部２２ｂが露出した装着位置と、図１の一点斜線で示すように、基部材２１内に収納された保持位置との間をスライドする。保持部材２２が装着位置にある状態で、ダイ集合体５００が保持部２２ｂに装着され、保持部材２２が保持位置に移動すると、ダイ集合体５００は、基部材２１及び保持部材２２によって保持される。 The holding member 22 is formed with a circular through window 22a. Around the through window 22a on the upper surface of the holding member 22, a holding portion 22b for holding the die assembly 500 is recessed. The shape of the holding portion 22 b is a shape corresponding to the shape of the frame body 501 of the die assembly 500. The holding member 22 is slidably attached to the base member 21. The holding member 22 is accommodated in the base member 21 adjacent to the base member 21 as shown by the solid line in FIG. 1 and the mounting position where the holding portion 22b is exposed, and as shown by the one-point diagonal line in FIG. Slide between holding positions. When the die assembly 500 is mounted on the holding portion 22b and the holding member 22 moves to the holding position in a state where the holding member 22 is in the mounting position, the die assembly 500 is held by the base member 21 and the holding member 22. .
　押し上げ部３０は、保持テーブル２０で保持されているダイ集合体５００の下面を、吸着しつつ、押し上げて、ダイ５０３の１つを粘着シート５０２から剥離するものである。押し上げ部３０は、主に、本体３１、吸引ノズル３２、ピン３３、ピン保持部材３４、押し上げ装置３５、回動装置３６、ブラケット３８とから構成されている。 The pushing-up unit 30 pushes up the lower surface of the die assembly 500 held by the holding table 20 while adsorbing it, and peels one of the dies 503 from the adhesive sheet 502. The push-up unit 30 mainly includes a main body 31, a suction nozzle 32, a pin 33, a pin holding member 34, a push-up device 35, a rotation device 36, and a bracket 38.
　本体３１は、筒状であり、保持テーブル２０の下方に配設されている。吸引ノズル３２は、本体３１の上端に、着脱可能に取り付けられていて、上部に底部を有する有底筒状である。吸引ノズル３２の上面は、吸引面３２ａとなっている。図４に示すように、吸引面３２ａには、環状及び放射状の複数の溝３２ｂが凹陥形成されている。そして、吸引面３２ａの溝３２ｂの底部には、吸引ノズル３２の内部に連通する流通穴３２ｃが複数形成されている。また、吸引面３２ａの溝３２ｂの底部には、吸引ノズル３２の内部に連通する挿通穴３２ｄが複数形成されている。 The main body 31 has a cylindrical shape and is disposed below the holding table 20. The suction nozzle 32 is detachably attached to the upper end of the main body 31 and has a bottomed cylindrical shape having a bottom at the top. The upper surface of the suction nozzle 32 is a suction surface 32a. As shown in FIG. 4, a plurality of annular and radial grooves 32b are formed in the suction surface 32a. A plurality of flow holes 32c communicating with the inside of the suction nozzle 32 are formed at the bottom of the groove 32b of the suction surface 32a. A plurality of insertion holes 32d communicating with the inside of the suction nozzle 32 are formed at the bottom of the groove 32b of the suction surface 32a.
　吸引ノズル３２の内部には、ピン保持部材３４が上下方向に移動可能に配設されている。ピン保持部材３４の上部には、複数のピン３３が取り付けられ、当該複数のピン３３がそれぞれ、吸引ノズル３２の挿通穴３２ｄに挿通している。このような構造により、ピン３３は、吸引面３２ａから上方に突出可能に吸引ノズル３２に装着されている。 In the suction nozzle 32, a pin holding member 34 is disposed so as to be movable in the vertical direction. A plurality of pins 33 are attached to the upper portion of the pin holding member 34, and each of the plurality of pins 33 is inserted into the insertion hole 32 d of the suction nozzle 32. With such a structure, the pin 33 is attached to the suction nozzle 32 so as to protrude upward from the suction surface 32a.
　吸引ノズル３２又は本体３１の内部は、調圧弁８０を介して負圧源６０に接続されている。負圧源６０は、真空ポンプ等で構成され、吸引ノズル３２又は本体３１の内部を吸引することにより、吸引面３２ａにおいて吸引負圧を発生させる。調圧弁８０は、吸引面３２ａにおける吸引負圧を調整するものであり、本実施形態では、電磁弁である。 The inside of the suction nozzle 32 or the main body 31 is connected to the negative pressure source 60 via the pressure regulating valve 80. The negative pressure source 60 is constituted by a vacuum pump or the like, and generates a suction negative pressure on the suction surface 32a by sucking the inside of the suction nozzle 32 or the main body 31. The pressure regulating valve 80 adjusts the suction negative pressure at the suction surface 32a, and is a solenoid valve in this embodiment.
　吸引ノズル３２又は本体３１の内部には、吸引ノズル３２の内部の負圧（吸引負圧）を検出するための圧力センサ３９が配設されている。 In the suction nozzle 32 or the main body 31, a pressure sensor 39 for detecting the negative pressure (suction negative pressure) inside the suction nozzle 32 is disposed.
　押し上げ装置３５は、ピン３３を上下動させるものであり、アクチュエータ等で構成され、本体３１に取り付けられている。押し上げ装置３５と、ピン保持部材３４は、ロッド３７によって連結されている。 The push-up device 35 moves the pin 33 up and down, is composed of an actuator or the like, and is attached to the main body 31. The push-up device 35 and the pin holding member 34 are connected by a rod 37.
　ブラケット３８は、本体３１を回動可能に支持するものである。回動装置３６は、吸引ノズル３２を位置決め可能に回動させるものである。本実施形態では、回動装置３６は、ブラケット３８に取り付けられ、回転軸３６ａを有するサーボモータである。回転軸３６ａに取り付けられたギヤ部材３６ｂが、本体３１の外周面に形成されたギヤ３１ａと係合している。 The bracket 38 supports the main body 31 in a rotatable manner. The rotation device 36 rotates the suction nozzle 32 so that it can be positioned. In the present embodiment, the rotation device 36 is a servo motor attached to the bracket 38 and having a rotation shaft 36a. A gear member 36 b attached to the rotation shaft 36 a is engaged with a gear 31 a formed on the outer peripheral surface of the main body 31.
　Ｘ方向移動装置４０は、押し上げ部３０をＸ方向に移動させるものであり、図１や図２に示すように、Ｘスライド４１、Ｘレール４２、移動装置４３を有している。Ｘレール４２は、基台１０上に、その長手方向をＸ方向として、取り付けられている。Ｘスライド４１は、Ｘレール４２にスライド可能に取り付けられている。移動装置４３は、サーボモータ等であり、Ｘスライド４１と係合するボールネジ４４を回転させることにより、Ｘスライド４１を、Ｘレール４２上の任意の位置に移動させる。 The X direction moving device 40 moves the push-up unit 30 in the X direction, and has an X slide 41, an X rail 42, and a moving device 43 as shown in FIGS. The X rail 42 is mounted on the base 10 with its longitudinal direction as the X direction. The X slide 41 is slidably attached to the X rail 42. The moving device 43 is a servo motor or the like, and moves the X slide 41 to an arbitrary position on the X rail 42 by rotating a ball screw 44 that engages with the X slide 41.
　Ｙ方向移動装置５０は、押し上げ部３０をＹ方向に移動させるものであり、図１や図２に示すように、Ｙスライド５１、Ｙレール５２、移動装置５３を有している。Ｙレール５２は、その長手方向をＹ方向として、Ｘスライド４２に取り付けられている。Ｙスライド５１は、Ｙレール５２にスライド可能に取り付けられている。Ｙスライド５１には、押し上げ部３０のブラケット３８が取り付けられている。移動装置５３は、サーボモータ等であり、Ｙスライド５１と係合するボールネジ５４を回転させることにより、Ｙスライド５１を、Ｙレール５２上の任意の位置に移動させる。 The Y-direction moving device 50 moves the push-up unit 30 in the Y direction, and includes a Y slide 51, a Y rail 52, and a moving device 53 as shown in FIGS. The Y rail 52 is attached to the X slide 42 with its longitudinal direction as the Y direction. The Y slide 51 is slidably attached to the Y rail 52. A bracket 38 of the push-up unit 30 is attached to the Y slide 51. The moving device 53 is a servo motor or the like, and moves the Y slide 51 to an arbitrary position on the Y rail 52 by rotating a ball screw 54 that engages with the Y slide 51.
　制御部７０は、ダイ剥離装置１００を統括制御するものであり、ＥＣＵを有している。ＥＣＵは、バスを介してそれぞれ接続された入出力インターフェース、ＣＰＵ、ＲＡＭ、ＲＯＭ及び不揮発性メモリー等の「記憶部」を備えている。ＣＰＵは、ダイ剥離装置１００を制御するためのプログラムを実行する。ＲＡＭは同プログラムの実行に必要な変数を一時的に記憶するものであり、「記憶部」は前記プログラムを記憶している。 The control unit 70 performs overall control of the die peeling apparatus 100 and has an ECU. The ECU includes “storage units” such as an input / output interface, a CPU, a RAM, a ROM, and a non-volatile memory connected to each other via a bus. The CPU executes a program for controlling the die peeling apparatus 100. The RAM temporarily stores variables necessary for execution of the program, and the “storage unit” stores the program.
　制御部７０は、押し上げ装置３５、回動装置３６、移動装置４３、５３、負圧源６０、調圧弁８０と通信可能に接続され、これらを制御する。また、制御部７０は、圧力センサ３９と通信可能に接続され、圧力センサ３９で検出された「吸引負圧」の検出信号が入力される。 The control unit 70 is communicably connected to the push-up device 35, the rotation device 36, the movement devices 43 and 53, the negative pressure source 60, and the pressure regulating valve 80, and controls them. The control unit 70 is communicably connected to the pressure sensor 39, and receives a “suction negative pressure” detection signal detected by the pressure sensor 39.
　なお、図２に示すように、ダイ剥離装置１００上には、図示しない移動装置によって、Ｘ、Ｙ、Ｚのいずれの方向にも移動可能な吸着ノズル６００が配設されている。吸着ノズル６００は、筒状のノズル本体６０１と、当該ノズル本体６０１の下端に上下方向移動可能に取り付けられた筒状の吸着部６０２とから構成されている。吸着部６０２は、図示しない付勢部材によって、下方に付勢されていて、その下端面が吸着面６０２ａとなっている。吸着ノズル６００は、閉止弁を介して負圧源（いずれも不図示）に接続されている。 As shown in FIG. 2, an adsorption nozzle 600 that can be moved in any of X, Y, and Z directions by a moving device (not shown) is disposed on the die peeling device 100. The suction nozzle 600 includes a cylindrical nozzle main body 601 and a cylindrical suction portion 602 attached to the lower end of the nozzle main body 601 so as to be movable in the vertical direction. The suction portion 602 is biased downward by a biasing member (not shown), and the lower end surface thereof is a suction surface 602a. The suction nozzle 600 is connected to a negative pressure source (both not shown) via a stop valve.
　（第一の実施形態のダイ剥離搬送処理の説明）
　以下に、図５のフローチャート、図６の説明図、図７のタイムチャートを用いて、粘着シート５０２からダイ５０３を剥離する第一の実施形態の「ダイ剥離搬送処理」について説明する。なお、負圧とは、大気圧よりも低い圧力であり、負圧が大きくなるとは、圧力が低下することをいう。保持テーブル２０でダイ集合体５００が保持されると、第一の実施形態の「ダイ剥離搬送処理」が開始し、Ｓ１１において、制御部７０は、粘着シート５０２から剥離するダイ５０３の「強度情報」を取得する。「強度情報」は、ダイ５０３が粘着シート５０２から剥離される際の割れやすさの情報である。Ｓ１１が終了すると、プログラムは、Ｓ１２に進む。 (Description of die peeling conveyance process of the first embodiment)
The “die peeling conveyance process” of the first embodiment for peeling the die 503 from the adhesive sheet 502 will be described below using the flowchart of FIG. 5, the explanatory diagram of FIG. 6, and the time chart of FIG. 7. The negative pressure is a pressure lower than the atmospheric pressure, and the increase in the negative pressure means that the pressure decreases. When the die assembly 500 is held by the holding table 20, the “die peeling conveyance process” of the first embodiment is started, and in S11, the control unit 70 sets “strength information” of the die 503 to be peeled from the adhesive sheet 502. Is obtained. “Strength information” is information on the ease of cracking when the die 503 is peeled from the adhesive sheet 502. When S11 ends, the program proceeds to S12.
　次に、制御部７０は、Ｓ１２において、移動装置４３、５３に制御信号を出力することにより、吸引ノズル３２を、ピックアップするダイ５０３の直下に移動させ、Ｓ１３において、吸着ノズル６００の移動装置に制御信号を出力することにより、前記ダイ５０３の直上に移動させたうえで、吸着部６０２の吸着面６０２ａを前記ダイ５０３に当接させる（図６（Ａ））。Ｓ１３が終了すると、プログラムは、Ｓ２１に進む。 Next, the control unit 70 outputs a control signal to the moving devices 43 and 53 in S12 to move the suction nozzle 32 directly below the die 503 to be picked up, and in S13, the moving device of the suction nozzle 600 is moved. By outputting the control signal, the suction surface 602a of the suction portion 602 is brought into contact with the die 503 after being moved directly above the die 503 (FIG. 6A). When S13 ends, the program proceeds to S21.
　Ｓ２１において、制御部７０は、Ｓ１１で取得した「強度情報」に基づいて、「目標吸引負圧」を決定し、負圧源６０及び調圧弁８０に制御信号を出力することにより、吸引ノズル３２内に「吸引負圧」を発生させる（図７（Ａ）の（１））。すると、ピックアップするダイ５０３の直下の粘着シート５０２が、吸引面３２ａにおいて吸引ノズル３２で吸引される。なお、「目標吸引負圧」は、ダイ５０３の割れやすさに応じて、ダイ５０３が割れない負圧に決定される。Ｓ２１において、制御部７０は、圧力センサ３９によって検出され圧力に基づいて、「吸引負圧」が、「目標吸引負圧」となるように、調圧弁８０をフィードバック制御する。なお、吸引面３２ａにおける「吸引負圧」は、吸引ノズル３２内の「吸引負圧」に対応（例えば、比例関係）している。Ｓ２１が終了すると、プログラムは、Ｓ３１に進む。 In S <b> 21, the control unit 70 determines “target suction negative pressure” based on the “strength information” acquired in S <b> 11, and outputs a control signal to the negative pressure source 60 and the pressure regulating valve 80, whereby the suction nozzle 32. A “suction negative pressure” is generated inside ((1) in FIG. 7A). Then, the adhesive sheet 502 immediately below the die 503 to be picked up is sucked by the suction nozzle 32 on the suction surface 32a. The “target suction negative pressure” is determined as a negative pressure at which the die 503 does not break depending on the ease of cracking of the die 503. In S <b> 21, the control unit 70 feedback-controls the pressure regulating valve 80 so that the “suction negative pressure” becomes the “target suction negative pressure” based on the pressure detected by the pressure sensor 39. Note that the “suction negative pressure” in the suction surface 32a corresponds to the “suction negative pressure” in the suction nozzle 32 (for example, a proportional relationship). When S21 ends, the program proceeds to S31.
　Ｓ３１において、制御部７０は、「吸引負圧」が「規程負圧」以上となったと判断した場合には（Ｓ３１：ＹＥＳ）、プログラムをＳ４１に進め、「吸引負圧」が「規程負圧」に達していないと判断した場合には（Ｓ３１：ＮＯ）、プログラムをＳ９１に進める。なお、「規程負圧」とは、「目標吸引負圧」に対して所定の割合（例えば８０％）の負圧である。 In S31, when the control unit 70 determines that the “suction negative pressure” is equal to or higher than the “regulation negative pressure” (S31: YES), the program proceeds to S41, and the “suction negative pressure” is changed to the “regulation negative pressure”. "" Is not reached (S31: NO), the program proceeds to S91. The “regulated negative pressure” is a negative pressure at a predetermined ratio (for example, 80%) with respect to the “target suction negative pressure”.
　Ｓ９１において、制御部７０は、吸引ノズル３２での粘着シート５０２の吸引に異常があると判断した場合には（Ｓ９１：ＹＥＳ）、プログラムをＳ９２に進め、吸引ノズル３２での粘着シート５０２の吸引に異常がないと判断した場合には（Ｓ９１：ＮＯ）、プログラムをＳ２１に戻す。なお、吸引ノズル３２での粘着シート５０２の吸引の異常とは、吸引ノズル３２での粘着シート５０２の吸引開始から所定の「規程エラー時間」が経過しても、「吸引負圧」が所定の負圧よりも上がらない場合であり（図７（Ａ）の（２））、粘着シート５０２や吸引ノズル３２が破損して、粘着シート５０２と吸引面３２ａとの間にエア漏れが生じている場合に発生する。 In S91, when the control unit 70 determines that there is an abnormality in the suction of the adhesive sheet 502 with the suction nozzle 32 (S91: YES), the program proceeds to S92, and the suction of the adhesive sheet 502 with the suction nozzle 32 is performed. If it is determined that there is no abnormality (S91: NO), the program is returned to S21. The abnormal suction of the adhesive sheet 502 by the suction nozzle 32 means that even if a predetermined “regulation error time” has elapsed from the start of the suction of the adhesive sheet 502 by the suction nozzle 32, the “negative suction pressure” is a predetermined value. This is a case where the pressure does not rise above the negative pressure ((2) in FIG. 7A), and the adhesive sheet 502 and the suction nozzle 32 are damaged, causing an air leak between the adhesive sheet 502 and the suction surface 32a. Occurs when.
　Ｓ９２において、制御部７０は、ダイ５０３のピックアップを中止するとともに、図示しない表示装置やスピーカ等の報知装置で、吸引ノズル３２での粘着シート５０２の吸引の異常を報知し、プログラムをＳ１２に戻す。 In S92, the control unit 70 stops picking up the die 503, notifies an abnormality in the suction of the adhesive sheet 502 with the suction nozzle 32 by a notifying device such as a display device or a speaker (not shown), and returns the program to S12. .
　Ｓ４１において、制御部７０は、押し上げ装置３５に制御信号を出力することにより、ピン３３を吸引面３２ａから突出させる図７（Ｂ）の（１））。すると、図６の（Ｂ）に示すように、粘着シート５０２は、吸引ノズル３２の吸引面３２ａで吸引されている一方で、ダイ５０３はピン３３によって情報に突き上げられるので、ダイ５０３が粘着シート５０２から引き剥がされる。なお、吸着部６０２は、ノズル本体６０１に対して上下方向移動可能に取り付けられているので、上方に移動する。この状態では、吸着ノズル６００の付勢部材によって、ダイ５０３は、吸着部６０２の吸着面６０２ａで下方に押し付けられているので、ダイ５０３が吸着部６０２に対して水平方向がズレない。Ｓ４１が終了すると、プログラムは、Ｓ５１に進む。 In S41, the control unit 70 outputs a control signal to the push-up device 35 to cause the pin 33 to protrude from the suction surface 32a ((1) in FIG. 7B). Then, as shown in FIG. 6B, the adhesive sheet 502 is sucked by the suction surface 32a of the suction nozzle 32, while the die 503 is pushed up to the information by the pins 33, so that the die 503 becomes the adhesive sheet. It is peeled off from 502. In addition, since the adsorption | suction part 602 is attached with respect to the nozzle main body 601 so that an up-down direction movement is possible, it moves upwards. In this state, since the die 503 is pressed downward by the suction surface 602a of the suction portion 602 by the biasing member of the suction nozzle 600, the die 503 is not displaced in the horizontal direction with respect to the suction portion 602. When S41 ends, the program proceeds to S51.
　Ｓ５１において、制御部７０が、ピン３３の押し上げ開始から（図７（Ｂ）の（１））「規程吸引時間」が経過したと判断した場合には（Ｓ５１：ＹＥＳ）（図７（Ｂ）の（２））、プログラムをＳ６１に進め、吸引開始から「規程吸引時間」が経過していないと判断した場合には（Ｓ５１：ＮＯ）、Ｓ５１の処理を繰り返す。なお、「規程吸引時間」は、その経過時に、ダイ５０３が粘着シート５０２から十分に引き剥がされる時間に設定されている。 In S51, when the control unit 70 determines that the “regulated suction time” has elapsed since the push-up start of the pin 33 ((1) in FIG. 7B) (S51: YES) (FIG. 7B) (2)), the program proceeds to S61, and if it is determined that the “regulated suction time” has not elapsed since the start of suction (S51: NO), the process of S51 is repeated. The “regulation suction time” is set to a time during which the die 503 is sufficiently peeled off from the adhesive sheet 502.
　Ｓ６１において、制御部７０は、吸引ノズル６００の閉止弁に制御信号を出力することにより、吸着部６０２の吸着面６０２ａでの吸着を開始させ（図７（Ｃ）の（１））、吸着ノズル６００の移動装置に制御信号を出力することにより、ダイ５０３を吸着部６０２の吸着面６０２ａで吸着させた状態で、所望の位置に搬送する（図６の（Ｃ））。Ｓ６１が終了すると、Ｓ７１に進む。 In S61, the control unit 70 outputs a control signal to the closing valve of the suction nozzle 600 to start suction on the suction surface 602a of the suction unit 602 ((1) in FIG. 7C). By outputting a control signal to the moving device 600, the die 503 is conveyed to a desired position while being attracted by the suction surface 602a of the suction portion 602 ((C) in FIG. 6). When S61 ends, the process proceeds to S71.
　Ｓ７１において、制御部７０が、ダイ集合体５００の最後のダイ５０３の搬送が完了したと判断した場合には（Ｓ７１：ＹＥＳ）、「ダイ剥離搬送処理」が終了し、ダイ集合体５００の最後のダイ５０３の搬送が完了していないと判断した場合には（Ｓ７１：ＮＯ）、プログラムをＳ１２に戻す。 In S71, when the control unit 70 determines that the conveyance of the last die 503 of the die assembly 500 has been completed (S71: YES), the “die peeling conveyance process” is completed, and the last of the die assembly 500 is completed. If it is determined that the transfer of the die 503 has not been completed (S71: NO), the program is returned to S12.
（第二の実施形態のダイ剥離搬送処理）
　以下に、図８に示すフローチャート及び図９の説明図を用いて、第二の実施形態の「ダイ剥離搬送処理」について第一の実施形態と異なる点について説明する。なお、第二の実施形態の「ダイ剥離搬送処理」のＳ１１、Ｓ１２、Ｓ１３、Ｓ２１、Ｓ３１、Ｓ４１、Ｓ６１、Ｓ７１、Ｓ９１、Ｓ９２は、それぞれ、第一の実施形態のＳ１１、Ｓ１２、Ｓ１３、Ｓ２１、Ｓ３１、Ｓ４１、Ｓ６１、Ｓ７１、Ｓ９１、Ｓ９２と同一の処理であるので、その説明を省略する。 (Die peeling conveyance process of 2nd embodiment)
Hereinafter, with reference to the flowchart shown in FIG. 8 and the explanatory diagram of FIG. 9, the “die peeling conveyance process” of the second embodiment will be described with respect to differences from the first embodiment. Note that S11, S12, S13, S21, S31, S41, S61, S71, S91, and S92 of the “die peeling conveyance process” of the second embodiment are respectively S11, S12, S13, Since it is the same process as S21, S31, S41, S61, S71, S91, and S92, its description is omitted.
　Ｓ１３が終了すると、Ｓ１４において、制御部７０は、回動装置３６に制御信号を出力することにより、吸引ノズル３２を「プレ剥離位置」に回動させる。なお、「プレ剥離位置」とは、ダイ５０３の粘着シート５０２からの剥離時における保持テーブル２０との相対位置である「剥離位置」（図９（Ｂ）示）から吸引ノズル３２の軸線回りに所定角度相対回動した位置である（図９（Ａ）示）。Ｓ１４が終了すると、プログラムは、Ｓ１５に進む。 When S13 ends, in S14, the control unit 70 outputs a control signal to the rotation device 36 to rotate the suction nozzle 32 to the “pre-peeling position”. The “pre-peeling position” refers to a position around the axis of the suction nozzle 32 from the “peeling position” (shown in FIG. 9B), which is a relative position of the die 503 from the holding table 20 when the die 503 is peeled from the adhesive sheet 502. This is a position that is relatively rotated by a predetermined angle (shown in FIG. 9A). When S14 ends, the program proceeds to S15.
　Ｓ１５において、制御部７０は、Ｓ１１で取得した「強度情報」に基づいて、「目標吸引負圧」を決定し、負圧源６０及び調圧弁８０に制御信号を出力することにより、吸引ノズル３２内に「吸引負圧」を発生させる。制御部７０は、圧力センサ３９によって検出され圧力に基づいて、「吸引負圧」が、「目標吸引負圧」となるように、調圧弁８０をフィードバック制御する。Ｓ１５が終了すると、プログラムは、Ｓ１６に進む。 In S <b> 15, the control unit 70 determines “target suction negative pressure” based on the “strength information” acquired in S <b> 11, and outputs a control signal to the negative pressure source 60 and the pressure regulating valve 80, whereby the suction nozzle 32. A “suction negative pressure” is generated inside. Based on the pressure detected by the pressure sensor 39, the control unit 70 feedback-controls the pressure regulating valve 80 so that the “suction negative pressure” becomes the “target suction negative pressure”. When S15 ends, the program proceeds to S16.
　Ｓ１６において、制御部７０は、押し上げ装置３５に制御信号を出力することにより、ピン３３を吸引面３２ａから突出させて、「プレ剥離」を実行する。この「プレ剥離」によって、図９（Ａ）の斜線で示す領域が剥離される。Ｓ１６が終了すると、Ｓ１７に進む。 In S16, the control unit 70 outputs a control signal to the push-up device 35, thereby causing the pin 33 to protrude from the suction surface 32a to execute “pre-peeling”. By this “pre-peeling”, a region indicated by hatching in FIG. 9A is peeled off. When S16 ends, the process proceeds to S17.
　Ｓ１７において、制御部７０は、回動装置３６に制御信号を出力することにより、吸引ノズル３２を「剥離位置」に回動させる（図９（Ｂ）示）。Ｓ１４が終了すると、プログラムは、Ｓ１５に進む。 In S17, the control unit 70 rotates the suction nozzle 32 to the “peeling position” by outputting a control signal to the rotation device 36 (shown in FIG. 9B). When S14 ends, the program proceeds to S15.
　Ｓ４１において、ピン３３が上方に押し上げられ、「本剥離」が実行されると、図９（Ｂ）の斜線で示す領域が剥離される。 In S41, when the pin 33 is pushed upward and the “main peeling” is executed, the hatched area in FIG. 9B is peeled off.
　このように、第二の実施形態の「ダイ剥離搬送処理」では、ダイ５０３を粘着シート５０２から剥離する「本剥離」の前に、「プレ剥離動作」（Ｓ１４、Ｓ１５、Ｓ１６）の処理を実行している。これにより、「本剥離」によって剥離される領域（図９（Ｂ）示）と異なる位置が剥離される（図９（Ａ）示）ので、図９の（Ｃ）に示すように、粘着シート５０２からダイ５０３が剥離されない領域が殆ど発生しない。 Thus, in the “die peeling conveyance process” of the second embodiment, the “pre-peeling operation” (S14, S15, S16) is performed before the “main peeling” for peeling the die 503 from the adhesive sheet 502. Running. As a result, a position different from the region (shown in FIG. 9 (B)) peeled off by “main peeling” is peeled off (shown in FIG. 9 (A)). Therefore, as shown in FIG. An area where the die 503 is not peeled off from 502 hardly occurs.
（第三の実施形態のダイ剥離搬送処理）
　以下に、図１０のフローチャート及び図１１の説明図を用いて、第三の実施形態の「ダイ剥離搬送処理」について第一の実施形態と異なる点について説明する。なお、第三の実施形態の「ダイ剥離搬送処理」のＳ１１、Ｓ１２、Ｓ１３、Ｓ２１、Ｓ３１、Ｓ４１、Ｓ６１、Ｓ７１、Ｓ９１、Ｓ９２は、それぞれ、第一の実施形態のＳ１１、Ｓ１２、Ｓ１３、Ｓ２１、Ｓ３１、Ｓ４１、Ｓ６１、Ｓ７１、Ｓ９１、Ｓ９２と同一の処理であるので、その説明を省略する。 (Die peeling conveyance process of 3rd embodiment)
The difference between the “die peeling conveyance process” of the third embodiment and the first embodiment will be described below with reference to the flowchart of FIG. 10 and the explanatory diagram of FIG. In addition, S11, S12, S13, S21, S31, S41, S61, S71, S91, and S92 of the “die peeling conveyance process” of the third embodiment are respectively S11, S12, S13, and S11 of the first embodiment. Since it is the same process as S21, S31, S41, S61, S71, S91, and S92, its description is omitted.
　Ｓ４１が終了すると、Ｓ４２において、制御部７０は、回動装置３６に制御信号を出力することにより、吸引ノズル３２を一方向に所定角度回動させた後に（図１１の（Ａ））、これと反対方向に吸引ノズル３２を所定角度回動させる（図１１の（Ｂ））動作を繰り返す。すると、ピン３３の位置が、粘着シート５０２やダイ５０３に対して移動するので、ダイ５０３が粘着シート５０２から広範な範囲において剥離される。また、吸引ノズル３２が一方向に回動した後に、これと反対方向に回動するという動作が繰り返されるので、粘着シート５０２に当該動作による振動が付与され、より確実に、ダイ５０３が粘着シート５０２から剥離される。Ｓ４２が終了すると、Ｓ５１に進む。 When S41 ends, in S42, the control unit 70 outputs a control signal to the rotation device 36 to rotate the suction nozzle 32 in one direction by a predetermined angle ((A) in FIG. 11). The operation of rotating the suction nozzle 32 by a predetermined angle in the opposite direction (FIG. 11B) is repeated. Then, since the position of the pin 33 moves with respect to the adhesive sheet 502 and the die 503, the die 503 is peeled from the adhesive sheet 502 in a wide range. Further, since the operation of rotating the suction nozzle 32 in one direction and then rotating in the opposite direction is repeated, vibration due to the operation is applied to the adhesive sheet 502, and the die 503 is more reliably attached to the adhesive sheet. Peel from 502. When S42 ends, the process proceeds to S51.
　Ｓ５１において、制御部７０が、ピン３３の押し上げ開始から（図７（Ｂ）の（１））「規程吸引時間」が経過したと判断した場合には（Ｓ５１：ＹＥＳ）（図７（Ｂ）の（２））、プログラムをＳ６１に進め、吸引開始から「規程吸引時間」が経過していないと判断した場合には（Ｓ５１：ＮＯ）、プログラムをＳ４２に戻す。 In S51, when the control unit 70 determines that the “regulated suction time” has elapsed since the push-up start of the pin 33 ((1) in FIG. 7B) (S51: YES) (FIG. 7B) (2)), the program proceeds to S61, and if it is determined that the “regulated suction time” has not elapsed since the start of suction (S51: NO), the program is returned to S42.
（第四の実施形態のダイ剥離搬送処理）
　以下に、図１２のフローチャート及び図１３説明図を用いて、第四の実施形態の「ダイ剥離搬送処理」について第一の実施形態と異なる点について説明する。なお、第四の実施形態の「ダイ剥離搬送処理」のＳ１２、Ｓ１３、Ｓ２１、Ｓ３１、Ｓ４１、Ｓ６１、Ｓ７１、Ｓ９１、Ｓ９２は、それぞれ、第一の実施形態のＳ１２、Ｓ１３、Ｓ２１、Ｓ３１、Ｓ４１、Ｓ６１、Ｓ７１、Ｓ９１、Ｓ９２と同一の処理であるので、その説明を省略する。 (Die peeling conveyance process of the fourth embodiment)
The difference between the “die peeling conveyance process” of the fourth embodiment and the first embodiment will be described below using the flowchart of FIG. 12 and the explanatory diagram of FIG. 13. In addition, S12, S13, S21, S31, S41, S61, S71, S91, and S92 of the “die peeling conveyance process” of the fourth embodiment are respectively S12, S13, S21, S31, and S31 of the first embodiment. Since the process is the same as S41, S61, S71, S91, and S92, the description thereof is omitted.
　第四の実施形態の「ダイ剥離搬送処理」のＳ１１では、制御部７０は、ダイ５０３の「強度情報」を取得するとともに、ダイ５０３の「形状情報」や「姿勢情報」を取得する。なお、「姿勢情報」とは、ダイ集合体５００が保持テーブル２０で保持されている状態における、ダイ５０３の吸引ノズル３２に対する水平方向の姿勢の情報であり、図１３に示すように、ダイ５０３が長方形等の正方形で無い異形である場合に、吸引ノズル３２に対するダイ５０３の長手方向等の情報である。 In S11 of “die peeling conveyance process” of the fourth embodiment, the control unit 70 acquires “strength information” of the die 503, and also acquires “shape information” and “posture information” of the die 503. The “posture information” is information on the horizontal posture of the die 503 with respect to the suction nozzle 32 in a state where the die assembly 500 is held by the holding table 20, and as shown in FIG. Is information such as the longitudinal direction of the die 503 with respect to the suction nozzle 32 when the shape is a non-square shape such as a rectangle.
　Ｓ１３が終了すると、Ｓ１８において、制御部７０は、Ｓ１１において、取得したダイ５０３の「形状情報」や「姿勢情報」に基づいて、吸引ノズル３２のダイ５０３に対する回動位置が適切で無いと判断した場合には（Ｓ１８：ＹＥＳ）、プログラムをＳ１９に進め、吸引ノズル３２のダイ５０３に対する回動位置が適切であると判断した場合には（Ｓ１８：ＮＯ）、プログラムをＳ２１に進める。なお、制御部７０は、図１３の（Ａ）に示すように、ピン３３の水平位置が、ダイ５０３からはみ出してしまう場合や、図１３の（Ｂ）に示すように、例えば、ピン３３の配列の長手方向がダイ５０３の長手方向と一致しない等、ピン３３の配置位置がダイ５０３の水平方向の姿勢に対して適切で無く、適切にピン３３でダイ５０３を押圧できない場合には、吸引ノズル３２のダイ５０３に対する回動位置が適切で無いと判断する。 When S13 ends, in S18, the control unit 70 determines in S11 that the rotation position of the suction nozzle 32 relative to the die 503 is not appropriate based on the acquired “shape information” and “posture information” of the die 503. If so (S18: YES), the program proceeds to S19. If it is determined that the rotational position of the suction nozzle 32 relative to the die 503 is appropriate (S18: NO), the program proceeds to S21. Note that the control unit 70 may be configured such that when the horizontal position of the pin 33 protrudes from the die 503 as shown in FIG. 13A or when the pin 33 has a horizontal position as shown in FIG. If the arrangement position of the pins 33 is not appropriate for the horizontal orientation of the die 503 and the die 503 cannot be properly pressed by the pins 33, such as when the longitudinal direction of the array does not coincide with the longitudinal direction of the die 503, suction is performed. It is determined that the rotation position of the nozzle 32 with respect to the die 503 is not appropriate.
　Ｓ１９において、制御部７０は、回動装置３６に制御信号を出力することにより、図１３の（Ｃ）に示すように、吸引ノズル３２のダイ５０３に対する回動位置が適切な位置となるように、吸引ノズル３２を回動させて位置決めする。Ｓ１９が終了すると、プログラムは、Ｓ２１に進む。なお、上述したＳ１８及びＳ１９の処理は、吸引ノズル３２を移動させるＳ１２の処理の前に行うことにしても差し支え無い。 In S19, the control unit 70 outputs a control signal to the rotation device 36 so that the rotation position of the suction nozzle 32 with respect to the die 503 becomes an appropriate position as shown in FIG. The suction nozzle 32 is rotated and positioned. When S19 ends, the program proceeds to S21. It should be noted that the processes of S18 and S19 described above may be performed before the process of S12 for moving the suction nozzle 32.
（本実施形態の効果）
　上述した説明から明らかなように、図５、図８、図１０及び図１２のＳ２１、図８のＳ１５において、調圧弁８０（吸引負圧調整部）が、吸引ノズル３２の「吸引負圧」を調整することにより、吸引面３２ａにおける「吸引負圧」を調整する。これにより、破損しやすいダイ５０３を粘着シート５０２から剥離する場合には、調圧弁８０によって、吸引面３２ａにおける「吸引負圧」を小さくすることにより、ピン３３の押し上げによりダイ５０３が粘着シート５０２から剥離する際に、ダイ５０３が粘着シート５０２から緩慢に剥離し、剥離時にダイ５０３への過大な応力の作用が防止される。このため、ダイ５０３を粘着シート５０２から剥離する際における、ダイ５０３の破損が防止される。 (Effect of this embodiment)
As is apparent from the above description, the pressure regulating valve 80 (suction negative pressure adjusting unit) is operated by the “suction negative pressure” of the suction nozzle 32 in S21 of FIGS. 5, 8, 10, and 12 and S <b> 15 of FIG. 8. Is adjusted to adjust the “suction negative pressure” at the suction surface 32a. As a result, when the die 503 that is easily damaged is peeled off from the adhesive sheet 502, the pressure reducing valve 80 reduces the “suction negative pressure” on the suction surface 32 a, so that the die 503 is pushed up by pushing up the pin 33. When peeling from the die 503, the die 503 peels slowly from the pressure-sensitive adhesive sheet 502, and an excessive stress action on the die 503 is prevented at the time of peeling. For this reason, the die 503 is prevented from being damaged when the die 503 is peeled from the adhesive sheet 502.
　一方で、ダイ５０３の強度が十分な場合には、図５、図８、図１０及び図１２のＳ２１、図８のＳ１５において、Ｓ１１において取得された「強度情報」に基づいて、調圧弁８０が吸引ノズル３２の「吸引負圧」を大きくし、吸引面３２ａにおける「吸引負圧」を大きくすることにより、ダイ５０３を粘着シート５０２から剥離するためのタクトタイムを短縮することができる。 On the other hand, when the strength of the die 503 is sufficient, the pressure regulating valve 80 is based on the “strength information” acquired in S11 in S21 of FIGS. 5, 8, 10 and 12 and S15 of FIG. However, by increasing the “suction negative pressure” of the suction nozzle 32 and increasing the “suction negative pressure” at the suction surface 32a, the tact time for peeling the die 503 from the adhesive sheet 502 can be shortened.
　また、制御部７０は、吸引ノズル３２の「吸引負圧」が「規程負圧」以上に達したと判断した場合に（図５、図８、図１０、及び図１２のＳ３１でＹＥＳと判断）、ピン３３を押し上げる（図５、図８、図１０及び図１２のＳ４１）。これにより、吸引面３２ａにおける「吸引負圧」が小さい状態で、ピン３３が押し上げられることに起因する、ダイ５０３の粘着シート５０２から剥離不良を防止することができる。また、本実施形態では、「規程負圧」を、「目標吸引負圧」に対して所定の割合の負圧に設定しているので、吸引ノズル３２の「吸引負圧」が「目標吸引負圧」に達する前に、ピン３３が押し上げられる（図７（Ｂ）の（１））。このため、吸引ノズル３２の「吸引負圧」が「目標吸引負圧」に達するのを待ってピン３３を押し上げるのと比較して、ダイ５０３を粘着シート５０２から剥離するためのタクトタイムを短縮することができる。 In addition, when the control unit 70 determines that the “suction negative pressure” of the suction nozzle 32 has reached the “regular negative pressure” or more (YES in S31 of FIGS. 5, 8, 10, and 12). ), The pin 33 is pushed up (S41 in FIGS. 5, 8, 10, and 12). Accordingly, it is possible to prevent a peeling failure from the adhesive sheet 502 of the die 503 caused by the pin 33 being pushed up while the “suction negative pressure” on the suction surface 32a is small. In this embodiment, since the “regulator negative pressure” is set to a predetermined negative pressure with respect to the “target suction negative pressure”, the “suction negative pressure” of the suction nozzle 32 is set to “target suction negative pressure”. Before reaching the “pressure”, the pin 33 is pushed up ((1) in FIG. 7B). For this reason, the tact time for peeling the die 503 from the adhesive sheet 502 is shortened compared with pushing up the pin 33 after the “suction negative pressure” of the suction nozzle 32 reaches the “target suction negative pressure”. can do.
　また、図８のＳ１４において、制御部７０（プレ剥離実行手段）が、ダイ５０３を粘着シート５０２から剥離させる前に、吸引ノズル３２を剥離時における保持テーブル（保持部）との相対位置から吸引ノズル３２の軸線回りに所定角度相対回動した「プレ剥離位置」（図９（Ａ）示）に回動させ、図８のＳ１５及びＳ１６において、粘着シート５０２の下面を吸引ノズル３２で吸引しつつ、ピン３３で粘着シート５０２の下面を押し上げる「プレ剥離」を実行する。これにより、図９の（Ａ）に示すように、吸引ノズル３２で吸着する直前の「本剥離」によってダイ５０３が粘着シート５０２から剥離される位置（図９（Ｂ）示）と、異なる位置が剥離される。このため、図９の（Ｃ）に示すように、ダイ５０３が粘着シート５０２から剥離されない領域を減少させることができ、ダイ５０３が粘着シート５０２から剥離されない領域が殆ど生じない。よって、ダイ５０３が粘着シート５０２から十分に剥離されておらず、ダイ５０３が粘着シート５０２に強固に接着されていることに起因する、吸着ノズル６００でのダイ５０３の吸着ミスを防止することができる。また、吸着ノズル６００でダイ５０３を吸着し搬送する際における、ダイ５０３の破損を防止することができる。 Further, in S14 of FIG. 8, the control unit 70 (pre-peeling execution unit) sucks the suction nozzle 32 from the relative position with the holding table (holding unit) at the time of peeling before the die 503 is peeled from the adhesive sheet 502. It is rotated to a “pre-peeling position” (shown in FIG. 9A) that is relatively rotated by a predetermined angle around the axis of the nozzle 32, and the lower surface of the adhesive sheet 502 is sucked by the suction nozzle 32 in S15 and S16 of FIG. While performing “pre-peeling”, the pins 33 push up the lower surface of the adhesive sheet 502. As a result, as shown in FIG. 9A, a position different from the position (shown in FIG. 9B) where the die 503 is peeled off from the adhesive sheet 502 by “main peeling” immediately before being sucked by the suction nozzle 32. Is peeled off. For this reason, as shown to (C) of FIG. 9, the area | region where the die | dye 503 is not peeled from the adhesive sheet 502 can be reduced, and the area | region where the die | dye 503 is not peeled from the adhesive sheet 502 hardly arises. Therefore, the die 503 is not sufficiently peeled from the pressure-sensitive adhesive sheet 502, and the die 503 is prevented from being mistakenly sucked by the suction nozzle 600 due to the die 503 being firmly bonded to the pressure-sensitive adhesive sheet 502. it can. Further, the die 503 can be prevented from being damaged when the die 503 is sucked and conveyed by the suction nozzle 600.
　また、図９の（Ａ）に示すように、吸着ノズル６００で吸着する直前の「本剥離」によってダイ５０３が粘着シート５０２から剥離される位置（図９の（Ｂ）示）と、異なる位置が剥離されるので、吸引ノズル３２での「吸引負圧」を小さく設定し、吸引面３２ａにおける「吸引負圧」が小さくなったとしても、十分に、ダイ５０３を粘着シート５０２から剥離させることができる。このため、「吸引負圧」を小さく設定することにより、吸引ノズル３２での吸引時におけるダイ５０３の破損を、より確実に、防止することができる。 Further, as shown in FIG. 9A, a position different from the position (shown in FIG. 9B) where the die 503 is peeled from the adhesive sheet 502 by “main peeling” immediately before being sucked by the suction nozzle 600. Therefore, even if the “suction negative pressure” at the suction nozzle 32 is set small and the “suction negative pressure” at the suction surface 32a becomes small, the die 503 is sufficiently peeled from the adhesive sheet 502. Can do. For this reason, by setting the “suction negative pressure” to be small, it is possible to more reliably prevent the die 503 from being damaged during suction by the suction nozzle 32.
　また、図１０のＳ４２において、回動装置３６（回動剥離手段）は、吸引ノズル３２で粘着シート５０２の下面を吸引しつつ、ピン３３で粘着シート５０２の下面を押し上げている際に、吸引ノズル３２を回動させる。これにより、ピン３３の水平方向位置が、粘着シート５０２やダイ５０３に対して移動するので、ダイ５０３が粘着シート５０２から広範な範囲において剥離される。また、粘着シート５０２と当接しているピン３３が水平方向に移動することにより、粘着シート５０２に振動が付与され、より確実に、ダイ５０３が粘着シート５０２から剥離される。このため、吸引ノズル３２での「吸引負圧」を小さく設定したとしても、十分に、ダイ５０３を粘着シート５０２から剥離させることができる。このように、「吸引負圧」を小さく設定することができるので、吸引ノズル３２での吸引時におけるダイ５０３の破損を、より確実に、防止することができる。 Further, in S42 of FIG. 10, the rotation device 36 (rotation peeling unit) sucks the lower surface of the adhesive sheet 502 with the pin 33 while sucking the lower surface of the adhesive sheet 502 with the suction nozzle 32. The nozzle 32 is rotated. As a result, the horizontal position of the pin 33 moves relative to the adhesive sheet 502 and the die 503, so that the die 503 is peeled from the adhesive sheet 502 in a wide range. Further, the pins 33 that are in contact with the adhesive sheet 502 move in the horizontal direction, so that vibration is applied to the adhesive sheet 502, and the die 503 is more reliably peeled from the adhesive sheet 502. For this reason, even if the “suction negative pressure” at the suction nozzle 32 is set to be small, the die 503 can be sufficiently separated from the adhesive sheet 502. As described above, since the “suction negative pressure” can be set small, it is possible to more reliably prevent the die 503 from being damaged at the time of suction by the suction nozzle 32.
　また、制御部７０が、吸引ノズル３２に装着されているピン３３のダイ５０３に対する回動位置が適切で無い（図１３の（Ａ）の状態）と判断した場合には（図１２のＳ１８でＹＥＳと判断）、ピン３３のダイ５０３に対する回動位置が適切な位置となるように、吸引ノズル３２を、吸引ノズル３２の軸線回りに回動させたうえで位置決めする。これにより、図１２のＳ４１において、ダイ５０３がピン３３によって適切に押し上げられ、確実に、ダイ５０３を粘着シート５０２から引き剥がすことができる。また、異形のダイ５０３の供給方向が変更された場合であっても、ダイ５０３の供給方向の変更に対応するようなピン３３が装着された吸引ノズル３２を新たに用意する必要が無く、吸引ノズル３２を回動させるだけで、ダイ５０３の供給方向の変更に対応することができる。
　（別の実施形態） When the control unit 70 determines that the rotation position of the pin 33 attached to the suction nozzle 32 with respect to the die 503 is not appropriate (state (A) of FIG. 13) (in S18 of FIG. 12). The determination is YES, and the suction nozzle 32 is rotated around the axis of the suction nozzle 32 and positioned so that the rotation position of the pin 33 with respect to the die 503 is an appropriate position. Thereby, in S41 of FIG. 12, the die 503 is appropriately pushed up by the pin 33, and the die 503 can be reliably peeled off from the adhesive sheet 502. Further, even when the supply direction of the irregularly shaped die 503 is changed, there is no need to newly prepare the suction nozzle 32 to which the pin 33 corresponding to the change of the supply direction of the die 503 is provided. It is possible to cope with a change in the supply direction of the die 503 only by rotating the nozzle 32.
(Another embodiment)
　なお、以上説明した実施形態では、吸引ノズル３２が基台１０に対して回動することにより、吸引ノズル３２が保持テーブル２０に対して相対回動している。しかし、保持テーブル２０が、基台１０に対して回動することにより、吸引ノズル３２が基台１０に対して回動することにより、吸引ノズル３２が保持テーブル２０に対して相対回動する実施形態であっても差し支え無い。この実施形態の場合には、保持テーブル２０に対する吸引ノズル３２の水平方向の相対位置（吸引位置及び押し上げ位置）が変わらないように、保持テーブル２０の回動に連動して、移動装置４３、５３によって吸引ノズル３２が水平方向に移動される。 In the embodiment described above, the suction nozzle 32 rotates relative to the holding table 20 by rotating the suction nozzle 32 relative to the base 10. However, when the holding table 20 is rotated with respect to the base 10, the suction nozzle 32 is rotated with respect to the base 10, whereby the suction nozzle 32 is relatively rotated with respect to the holding table 20. Even if it is a form, it does not interfere. In this embodiment, the moving devices 43 and 53 are interlocked with the rotation of the holding table 20 so that the horizontal relative position (suction position and push-up position) of the suction nozzle 32 with respect to the holding table 20 does not change. As a result, the suction nozzle 32 is moved in the horizontal direction.
　また、以上説明した実施形態では、調圧弁８０によって、吸引ノズル３２の吸引面３２ａでの「吸引負圧」を調整している。しかし、図１４に示すように、「吸引負圧」を制限するレギュレータ８１が設けられた流路と、レギュレータ８１が設けられていない流路の二つの流路を負圧源６０に接続し、制御部７０からの指令に基づいて流路を切り替える切替バルブ８２を吸引ノズル３２に接続する流路に設け、切替バルブ８２によって、吸引ノズル３２に接続する流路を、レギュレータ８１が設けられた流路とレギュレータ８１が設けられていない流路のいずれかに切り替えて接続する実施形態であっても差し支え無い。 In the embodiment described above, the “suction negative pressure” at the suction surface 32 a of the suction nozzle 32 is adjusted by the pressure regulating valve 80. However, as shown in FIG. 14, two channels, a channel provided with a regulator 81 that restricts “suction negative pressure” and a channel not provided with the regulator 81, are connected to the negative pressure source 60, A switching valve 82 for switching the flow path based on a command from the control unit 70 is provided in the flow path connected to the suction nozzle 32, and the flow path connected to the suction nozzle 32 by the switching valve 82 is provided in the flow where the regulator 81 is provided. There is no problem even if it is an embodiment in which the connection is made by switching to any one of the flow path and the flow path not provided with the regulator 81.
　また、図１０のＳ４２において、制御部７０は、粘着シート５０２と剥離するダイ５０３の情報に基づいて、回動装置３６によって吸引ノズル３２を回動させる際において、回動角度、回動回数、回動速度、回動時間等を適宜変更することにしても差し支え無い。また、制御部７０は、回動装置３６によって吸引ノズル３２を回動させる際において、位置方向のみ回動させても差し支え無く、回動角度を小さくして、回動回数を増やして、ピン３３によって粘着シート５０２に振動をより効果的に付与することにしても差し支え無い。 In S42 of FIG. 10, the control unit 70 rotates the suction nozzle 32 by the rotation device 36 based on the information of the die 503 to be peeled off from the adhesive sheet 502, the rotation angle, the number of rotations, There is no problem even if the rotation speed, the rotation time, and the like are appropriately changed. Further, when the suction nozzle 32 is rotated by the rotation device 36, the control unit 70 may be rotated only in the position direction, and the rotation angle is decreased, the number of rotations is increased, and the pin 33 is rotated. Therefore, the vibration may be more effectively applied to the adhesive sheet 502.
　以上説明した実施形態では、吸引ノズル３２を回動させる回動装置３６は、サーボモータであるが、シリンダ等であっても差し支え無い。 In the embodiment described above, the rotation device 36 that rotates the suction nozzle 32 is a servo motor, but may be a cylinder or the like.
　２０…保持テーブル（保持部）、３０…押し上げ部、３２…吸引ノズル、３２ａ…吸着面、３３…ピン、３６…回動装置（回動機構、吸引ノズル回動機構）、７０…制御部（ピン制御手段、プレ剥離実行手段、回動剥離手段）８０…調圧弁（吸引負圧調整部）、
　１００…ダイ剥離装置
　５００…ダイ集合体、５０１…枠体、５０２…粘着シート、５０３…ダイ DESCRIPTION OF SYMBOLS 20 ... Holding table (holding part), 30 ... Push-up part, 32 ... Suction nozzle, 32a ... Suction surface, 33 ... Pin, 36 ... Turning apparatus (turning mechanism, suction nozzle turning mechanism), 70 ... Control part ( Pin control means, pre-peeling execution means, rotational peeling means) 80 ... pressure regulating valve (suction negative pressure adjusting section),
DESCRIPTION OF SYMBOLS 100 ... Die peeling apparatus 500 ... Die assembly, 501 ... Frame, 502 ... Adhesive sheet, 503 ... Die

Claims (5)

  1. 　粘着シート上に貼り付けられた複数のダイを、粘着シートから引き剥がすダイ剥離装置であって、
    　前記粘着シートを保持する保持部と、
    　上端に吸引面が形成された吸引ノズルと、
    　前記吸引面において吸引負圧を発生させる負圧源と、
    　前記吸引面から上方に突出可能に前記吸引ノズルに装着されたピンと、
    　前記ピンを上下動させる押し上げ装置と、
    　前記吸引負圧を調整する吸引負圧調整部と、を有し、
    　前記吸引面において、前記保持部で保持されている前記粘着シートの下面を、前記吸引前記吸引負圧調整部で調整された吸引負圧で吸引し、
    　前記吸引面で吸引されている前記粘着シート下面を、前記押し上げ装置を駆動させることにより前記ピンで押し上げ、前記ダイを前記粘着シートから剥離させるダイ剥離装置。     A die peeling device for peeling a plurality of dies pasted on an adhesive sheet from the adhesive sheet,
    A holding part for holding the adhesive sheet;
    A suction nozzle with a suction surface formed at the upper end;
    A negative pressure source for generating a negative suction pressure at the suction surface;
    A pin attached to the suction nozzle so as to protrude upward from the suction surface;
    A push-up device for moving the pin up and down;
    A suction negative pressure adjusting section for adjusting the suction negative pressure,
    At the suction surface, the lower surface of the pressure-sensitive adhesive sheet held by the holding unit is sucked with the suction negative pressure adjusted by the suction negative pressure adjusting unit,
    A die peeling device that pushes up the lower surface of the pressure-sensitive adhesive sheet sucked by the suction surface with the pins by driving the push-up device and peels the die from the pressure-sensitive adhesive sheet.
  2. 　請求項１において、
    　前記吸引負圧が一定以上に達した場合に、前記ピンを押し上げるピン制御手段を有するダイ剥離装置。     In claim 1,
    A die peeling apparatus comprising pin control means for pushing up the pin when the suction negative pressure reaches a certain level.
  3. 　請求項１において、
    　前記保持部と前記吸引ノズルを相対回動させる回動機構と、
    　前記ダイを前記粘着シートから剥離させる前に、前記回動機構を作動させることにより、前記吸引ノズルを前記剥離時における前記保持部との相対位置から前記吸引ノズルの軸線回りに所定角度相対回動したプレ剥離位置に回動させ、前記粘着シートの下面を前記吸引ノズルで吸引しつつ、前記ピンで前記粘着シートの下面を押し上げるプレ剥離実行手段を有するダイ剥離装置。     In claim 1,
    A rotation mechanism for relatively rotating the holding portion and the suction nozzle;
    Before the die is peeled from the adhesive sheet, the rotation mechanism is operated to rotate the suction nozzle at a predetermined angle around the axis of the suction nozzle from the relative position to the holding portion at the time of peeling. A die peeling apparatus comprising pre-peeling execution means for rotating to the pre-peeling position and sucking the lower surface of the pressure-sensitive adhesive sheet with the suction nozzle and pushing the lower surface of the pressure-sensitive adhesive sheet with the pin.
  4. 　請求項１において、
    　前記吸引ノズルを、前記吸引ノズルの軸線回りに回動させる吸引ノズル回動機構を有し、
    　前記吸引ノズルで前記粘着シートの下面を吸引しつつ、前記ピンで前記粘着シートの下面を押し上げている際に、前記吸引ノズル回動機構を作動させて、前記吸引ノズルを回動させる回動剥離手段を有するダイ剥離装置。     In claim 1,
    A suction nozzle rotating mechanism for rotating the suction nozzle about the axis of the suction nozzle;
    Rotation peeling that rotates the suction nozzle by operating the suction nozzle rotating mechanism while the suction nozzle sucks the lower surface of the adhesive sheet and pushes the lower surface of the adhesive sheet with the pin A die peeling apparatus having means.
  5. 　請求項１において、
    　前記吸引ノズルを、前記吸引ノズルの軸線回りに回動させる吸引ノズル回動機構を有し、前記ピンが前記吸引面において吸引されている前記粘着シート下面を押し上げる前に、吸引ノズル回動機構を作動させて、前記吸引ノズルを、前記吸引ノズルの軸線回りに回動させたうえで位置決めする吸引ノズル回動位置決め手段を有するダイ剥離装置。     In claim 1,
    A suction nozzle rotating mechanism for rotating the suction nozzle about the axis of the suction nozzle, and before the pin pushes up the lower surface of the adhesive sheet sucked by the suction surface, A die peeling apparatus comprising suction nozzle rotation positioning means that is operated to position the suction nozzle after rotating around the axis of the suction nozzle.
PCT/JP2012/062576 2012-05-17 2012-05-17 Die peeling apparatus WO2013171869A1 (en)

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