WO2017168498A1

WO2017168498A1 - Component supply apparatus, mounting apparatus, and component supply method

Info

Publication number: WO2017168498A1
Application number: PCT/JP2016/059840
Authority: WO
Inventors: 繁人市川; 山▲崎▼　敏彦
Original assignee: 富士機械製造株式会社
Priority date: 2016-03-28
Filing date: 2016-03-28
Publication date: 2017-10-05
Also published as: JP6634149B2; JPWO2017168498A1

Abstract

A wafer supply unit 30 is an apparatus to be used in a mounting apparatus 11 that performs mounting by picking up a component P by means of a mounting unit 13, and disposing the picked up component P on a base material. The wafer supply unit 30 pushes up, by means of a push-up pin 34 (push-up unit), the component P (die) formed by dividing a wafer W, measures a load at the time of pushing up the component P, said load being measured by means of a load cell 36 (load measuring unit) provided to the push-up pin 34, and sets an execution operation amount of the push-up pin 34 on the basis of the load thus measured.

Description

Component supply apparatus, mounting apparatus, and component supply method

The present invention relates to a component supply device, a mounting device, and a component supply method.

Conventionally, as a mounting apparatus for mounting a component on a substrate, a die is collected from a sheet on which a wafer divided into a plurality of dies is attached. An apparatus has been proposed in which the height at which the die can be collected by the suction nozzle is determined as an appropriate push-up height (for example, see Patent Document 1). In addition, as a mounting device that mounts components on a substrate, the height of the upper end of the push-up pin during the push-up operation is automatically determined when a die is collected from a sheet on which a wafer divided into a plurality of dies is attached. What is measured automatically has been proposed (see, for example, Patent Document 2).

JP 2012-064752 A JP 2013-247314 A

However, in the mounting apparatuses described in Patent Documents 1 and 2, the height of the push-up pin is taken into consideration, but the extraction of the components is not sufficient yet, and the attached components are more reliably collected. Was demanded.

The present invention has been made in view of such a problem, and a main object of the present invention is to provide a component supply device, a mounting device, and a component supply method capable of collecting the attached components more reliably.

The present invention adopts the following means in order to achieve the main object described above.

The component supply apparatus of the present invention is
A component supply device used in a mounting apparatus that performs a mounting process of collecting a component by a collecting unit and arranging the collected component on a base material,
A push-up unit that pushes up the component when the component is collected from a wafer that is divided into a plurality of components and attached;
A load measuring unit that is disposed on the push-up unit and measures a load when pushing up the component;
A control unit configured to set an amount of movement of the push-up portion based on the measured load;
It is equipped with.

Generally, a part (die) obtained by dividing a wafer is attached to a sheet, and sampling is performed by pushing up from below. At this time, when a sufficient load is not applied by pushing up from below, it is possible that the stuck parts are not peeled off and cannot be collected. In this device, when picking up a part from a wafer that has been divided into a plurality of parts and stuck, the part is pushed up by the push-up part, and the load when the part is pushed up is measured by a load measuring unit arranged on the push-up part. Based on the measured load, the execution amount of the push-up unit is set. In this apparatus, since a sufficient load can be applied by the measurement of the load measuring unit, the attached parts can be collected more reliably.

FIG. 4 is a schematic explanatory diagram illustrating an example of a schematic configuration of the mounting apparatus 11. 4 is an explanatory diagram illustrating an example of a sheet database 44 stored in a storage unit. FIG. The flowchart showing an example of a condition setting process routine. Explanatory drawing which represents the outline of a condition setting process typically. The flowchart showing an example of a component supply process routine. Explanatory drawing which represents typically the process which changes the operation amount at the time of components supply.

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram illustrating an example of a schematic configuration of the mounting apparatus 11 of the mounting system 10. FIG. 2 is an explanatory diagram illustrating an example of the sheet database 44 stored in the storage unit 42 of the control unit 40. For example, as shown in FIG. 1, the mounting system 10 is a system that executes a mounting process in which a component P, which is a die obtained by dividing a wafer W, is arranged on a base material (substrate S, other components, etc.). The mounting system 10 includes a mounting device 11 and a management computer (PC) 50. In the mounting system 10, a plurality of mounting apparatuses 11 that perform a mounting process for mounting the component P on the substrate S are arranged from upstream to downstream. In FIG. 1, only one mounting apparatus 11 is shown for convenience of explanation. The management PC 50 manages mounting job information including processing conditions in the mounting apparatus 11. The mounting job information includes, for example, information such as the mounting order of the components P, the type and size of the components P to be mounted, the unit to be used, the size of the board S, and the number of produced products. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG.

The mounting apparatus 11 includes a substrate transfer unit 12, a mounting unit 13, a component supply unit 14, a parts camera 15, a wafer supply unit 30, and a control unit 40. The substrate transport unit 12 is a unit that carries in, transports, fixes and unloads the substrate S at the mounting position. The substrate transport unit 12 has a pair of conveyor belts provided in the front-rear direction of FIG. The board | substrate S is conveyed by this conveyor belt.

The mounting unit 13 is a sampling unit that samples components from the component supply unit 14 or the wafer supply unit 30 and places them on the substrate S fixed to the substrate transfer unit 12. The mounting unit 13 includes a head moving unit 20, a mounting head 22, and a suction nozzle 24. The head moving unit 20 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider. The mounting head 22 is detachably mounted on the slider and is moved in the XY direction by the head moving unit 20. One or more suction nozzles 24 are detachably mounted on the lower surface of the mounting head 22. The suction nozzle 24 is a collection member that collects the component P using pressure, and is detachably attached to the mounting head 22. The mounting head 22 incorporates a Z-axis motor, and the height of the suction nozzle 24 is adjusted along the Z-axis by the Z-axis motor. The mounting head 22 includes a rotating device that rotates (spins) the suction nozzle 24 by a drive motor (not shown), and can adjust the angle of the component P sucked by the suction nozzle 24. The mounting head 22 is equipped with one or more suction nozzles 24. The component supply unit 14 has a plurality of feeders provided with reels, and supplies electronic components other than the die to the mounting unit 13.

The parts camera 15 is disposed between the board transfer unit 12 and the component supply unit 14. The imaging range of the parts camera 15 is above the parts camera 15. When the suction nozzle 24 that sucks the part P passes above the part camera 15, the parts camera 15 captures the part P sucked by the suction nozzle 24 from below and outputs the image to the control unit 40.

The wafer supply unit 30 is a device that supplies a part P (die) obtained by dividing the wafer W to the sampling position of the mounting head 22, and includes a wafer pallet 31, a magazine portion 32, a push-up pin 34 (push-up portion), a pot 35 and a load cell 36 (load measuring unit). The wafer pallet 31 is a member that fixes a die sheet 38 that is an attaching member to which the component P is attached. A plurality of wafer pallets 31 are accommodated in the magazine section 32. The wafer pallet 31 is pulled out from the magazine portion 32 when the mounting head 22 collects the component P. The push-up pin 34 is a push-up portion that pushes up the component P from below when the component P is collected from the wafer W divided into a plurality of pieces and attached to the die sheet 38. The push-up pin 34 is accommodated in a pot 35 disposed below the pulled-out wafer pallet 31. There are a plurality of types of the push-up pins 34 having different tip shapes such as the thickness thereof, and the push-up pins 34 are selectively used according to the size of the component P. The wafer supply unit 30 includes five pots 35 having different types of push-up pins 34, and one of the pots 35 is selected according to the component P and used for component supply. The pot 35 is provided with a suction port on the upper surface thereof. The pot 35 sucks and supports the die sheet 38 from the lower surface side, and pushes up the push-up pin 34 at that time, whereby only the part P to be collected is peeled from the die sheet 38. The load cell 36 is disposed on the push-up pin 34 and is a load measuring unit that measures a load when the component P is pushed up. The load cell 36 is attached to the pot 35 so as to be replaceable.

The control unit 40 is configured as a microprocessor centered on the CPU 41, and includes a storage unit 42 that stores a processing program. The control unit 40 outputs control signals to the substrate transport unit 12, the mounting unit 13, the component supply unit 14, the parts camera 15, and the wafer supply unit 30, and the mounting unit 13, the component supply unit 14, the parts camera 15, and the wafer supply. A signal from the unit 30 is input. The storage unit 42 stores a sheet database (DB) 44 and a setting program 46. As shown in FIG. 2, the sheet DB 44 associates the type of the die sheet 38, the size of the part P, the type of the push-up pin 34, and a predetermined sampling load for separating the part P from the die sheet 38 so that the part P can be collected. The correspondence information 45 is included in a plurality according to the type of the die sheet 38. The sampling load is included in the correspondence information 45 as a range of an upper limit value (for example, 15N) and a lower limit value (for example, 10N). For this sampling load, for example, the relationship between the movement amount (movement amount, movement speed, etc.) of the push-up pin 34 and the load is obtained empirically, and at least a part of the part is peeled off from the die sheet 38 without causing any abnormality such as breakage. Alternatively, it may be determined within a range of loads that can be collected by the suction nozzle 24. The setting program 46 sets the operation amount of the push-up pin 34 based on the sheet DB 44, as will be described in detail later. The control unit 40 executes the setting program 46 using the sheet DB 44 to set the amount of movement (movement amount, movement speed, etc.) of the push-up pin 34 based on the load measured by the load cell 36.

Next, the operation of the mounting system 10 of the present embodiment configured as described above, first, the processing for setting the operating condition of the wafer supply unit 30 in advance before the mounting processing of the component P will be described. FIG. 3 is a flowchart illustrating an example of a condition setting process routine executed by the CPU 41 of the control unit 40. FIG. 4 is an explanatory diagram showing an outline of the condition setting process. The condition setting processing routine is executed in response to an instruction to start the setting program 46 by the operator.

When this routine is started, the CPU 41 of the control unit 40 first acquires the mounting conditions (step S100). The mounting condition may be two or more of the type of the die sheet 38, the type of the push-up pin 34 used for the mounting process, and the size of the component P. The acquisition of the mounting conditions may be acquired, for example, by an operator input, or may be obtained from mounting job information. Next, the CPU 41 selects correspondence information 45 used for condition setting from the sheet DB 44 stored in the storage unit 42 (step S110). In the wafer supply unit 30, a plurality of types of die sheets 38 having different thicknesses and adhesive forces are used. The sheet DB 44 includes a range of sampling loads according to the types of the die sheet 38 and the push-up pins 34. Here, the CPU 41 selects the correspondence information 45 corresponding to the die sheet 38 and the push-up pins 34 used in the mounting process based on the information acquired in step S100. The CPU 41 can determine the range of the sampling load based on the selected correspondence information 45. The CPU 41 may select the correspondence information 45 input by the worker, or may adopt the sampling load input by the worker.

Next, the CPU 41 sets the component P to be pushed up in the wafer W, and moves the relative position of the wafer pallet 31 and the push-up pin 34 so that the push-up pin 34 is arranged below the part P (step S120). For example, the setting of the component P may be determined in order from the upper left to the right of the wafer W, from the upper stage to the lower stage, and finally to the lower right. Next, the CPU 41 sets a movement amount as an operation amount for pushing up the push-up pin 34 (step S130). This amount of movement may be set to a predetermined initial value or may be set to an input value of the operator. In the initial setting of the movement amount, the lower limit value of the processing operation range in which the operation is permitted when the push-up pin 34 is pushed up may be set.

Next, it is determined whether or not the set movement amount of the push-up pin 34 is within the processing operation range (step S140). When the movement amount of the push-up pin 34 is within the processing operation range, the CPU 41 sets A process of pushing up the push-up pin 34 by the amount of movement is executed, and the push-up load is measured by the load cell 36 (step S150). Note that the CPU 41 uses a predetermined initial value empirically determined in advance so that the production cycle of the mounting process does not decrease as the moving speed of the push-up pin 34 here. Subsequently, the CPU 41 determines whether or not the measured load is within a predetermined sampling load range corresponding to the correspondence information 45 selected in step S110 (step S160). When the measured load does not reach the collection load (when it is less), the CPU 41 performs the processing after step S120. That is, in step S120, the CPU 41 sets the next part and moves the push-up pin 34 downward, sets a larger movement amount in step S130, and pushes up in step S150 to measure the load. Here, in step S130, for example, the CPU 41 is assumed to increase by a predetermined amount that is a length obtained by dividing the processing operation range into a large number. This process is repeated until the measured load reaches the sampling load within a range not exceeding the processing operation range in the determination in step S140.

On the other hand, when the measured load exceeds the sampling load at step S160 (when it exceeds the sampling load at the first time), or when the set operation amount exceeds the processing operation range at step S140 (maximum). If the sampling load has not been reached even when the operation is performed, the CPU 41 determines that the selection of the sheet DB 44 is not appropriate, and executes the processing after step S110. Specifically, the correspondence information 45 different from the current one is selected in step S110, the next component P is set in step S120, the push-up pin 34 is moved below, and a push-up operation amount is newly set in step S130. , Push up and load measurement repeatedly. In the reselection in the sheet DB 44 in step S110, the CPU 41 may select, for example, the correspondence information 45 of the die sheet 38 having higher adhesive strength and strength. The CPU 41 may display a message and allow the operator to select new correspondence information 45.

On the other hand, when the measured load is within the range of the sampling load in step S160, the CPU 41 sucks the pushed-up component P with the suction nozzle 24 and images with the parts camera 15 (step S170). Next, the CPU 41 determines whether or not the component P collected based on the captured image is normal, that is, there is no damage (step S180). For example, when the component P is stuck on the die sheet 38 having a strong adhesive force, if the component P is pushed up with a large moving amount and a large moving speed, a part of the component P may be damaged. Here, for example, the CPU 41 determines such breakage by performing matching between the image P of the captured image and the image of the normal component P. When the component P is normal, the CPU 41 sets the current operation amount (movement amount and movement speed) as the execution operation amount used for the mounting process, and stores it in the execution condition of the execution job information (step S190). End the routine. The CPU 41 sets the obtained movement amount as the execution movement amount, and sets the obtained movement speed as the execution movement speed.

On the other hand, if the component is not normal in step S180, that is, if there is an abnormality in the component, the CPU 41 sets the push-up movement speed by decreasing a predetermined amount (step S200), sets the next component P to be pushed up, and below it. The relative positions of the wafer pallet 31 and the push-up pins 34 are moved so that the push-up pins 34 are arranged (step S210). The process of step S210 is the same as that of step S120. Subsequently, the CPU 41 executes processing after step S180. That is, the CPU 41 gradually decreases the push-up movement speed and repeats the process of picking up a new part P and collecting it until it is determined in step S180 that the part P is normal. If it is determined in step S180 that the component P is normal, in step S190, the current operation amount (movement amount and movement speed) is set as the execution operation amount used for the mounting process, and the execution condition of the execution job information is set. This routine is terminated.

FIG. 4 is an explanatory diagram schematically showing an outline of the condition setting process. In steps S100 and S110, the CPU 41 selects the correspondence information 45 of the sheet DB 44, and acquires the range of the sampling load at which the component P is peeled from the die sheet 38 so as to be sampled. Next, the CPU 41 sets the movement amount of the push-up, pushes up the component P with the push-up pin 34, and measures the load at that time with the load cell 36 (the leftmost side in FIG. 4). When the measured load does not reach the sampling load, a process of setting a larger movement amount and pushing up the next part P is repeated (second and third from the left in FIG. 4). When the measured load falls within the range of the sampling load, it is determined whether or not the part P is normal (step S180). When the part P is not normal, the moving speed is gradually decreased and the part P is damaged. The moving amount and moving speed of the push-up pin 34 that can be collected in a state where there is no mark are obtained (fourth and fifth from the left in FIG. 4). As described above, in the mounting apparatus 11, the CPU 41 automatically obtains the condition of the execution operation amount of the wafer supply unit 30.

Next, processing for supplying the component P using the execution conditions of the wafer supply unit 30 set in this way will be described. FIG. 5 is a flowchart illustrating an example of a component supply processing routine executed by the CPU 41 of the control unit 40. This routine is stored in the storage unit 42 of the control unit 40, and is executed by a start instruction from the operator. When this routine is started, the CPU 41 of the control unit 40 first reads and acquires the mounting job information updated in the above-described condition setting process (step S300). Next, the component P used for the mounting process is set, and the relative positions of the wafer pallet 31 and the push-up pin 34 are moved so that the push-up pin 34 is disposed below the component P (step S310).

Next, the CPU 41 acquires the set execution operation amount of the push-up pin 34 from the mounting job information (step S320), and executes the push-up process of the push-up pin 34 with the operation amount (step S320). While the push-up process is continuing, the CPU 41 measures the load by the load cell 36 (step S330), and whether the load measured when the push-up pin 34 moves to the set movement amount is within the range of the sampling load. It is determined whether or not (step S340). When the measured load is not within the range of the sampling load, the CPU 41 changes the push-up movement amount, continues the push-up process (step S350), and executes the processes after step S330. That is, the CPU 41 continues such processing until the measured load falls within the range of the sampling load.

FIG. 6 is an explanatory diagram schematically showing a process of changing the operation amount at the time of component supply. The die sheet 38 may have different adhesive strength depending on the location. As shown in FIG. 6, when the measured load is less than the sampling load when the push-up pin 34 is pushed up by the execution operation amount, the CPU 41 adds a predetermined movement amount while measuring the load, The push-up pin 34 is further pushed up. Alternatively, when the measured load exceeds the upper limit of the sampling load, the CPU 41 decreases the predetermined movement amount as it is while measuring the load and lowers the push-up pin 34 by a small amount. The CPU 41 continues such a process until the measured load enters the range of the sampling load. The CPU 41 may reflect the result that is specifically outside the sampling load in the subsequent execution amount. Since the measured load should be within the range of the sampling load by the condition setting process in advance, the current measured load may be unique. For this reason, the CPU 41 may reflect the contents of the current change in the subsequent execution operation amount when the determination that the load is outside the sampling load is continued a predetermined number of times.

On the other hand, when the measured load is within the sampling load range in step S340, the CPU 41 executes the suction process of the suction nozzle 24 so as to collect the pushed-up component P (step S360). Is captured by the parts camera 15, and the captured image is acquired (step S370). Subsequently, the CPU 41 determines whether or not the component P is normal by the same process as step S180 (step S380). When the component P is not normal, the CPU 41 changes the moving speed of pushing up the push-up pin 34 and stores it in the storage unit 42. The CPU 41 may push up the push-up pin 34 at the moving speed changed when the push-up pin 34 is pushed up next time. Since the condition of the part P should not be damaged by the condition setting process in advance, the damage of the part P this time may be specific. Therefore, the push-up pin 34 may be pushed up at the changed moving speed after the state where the component P is not normal continues for a predetermined number of times (for example, three times or five times).

On the other hand, when the component P is normal in step S380, it is determined based on the progress of the mounting process whether the supply process of the component P is completed (step S400). When the supply process of the component P is not completed, the CPU 41 repeatedly executes the processes after step S310. On the other hand, when the supply process of the component P is completed, this routine is ended as it is.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The push-up pin 34 of the present embodiment corresponds to the push-up portion of the present invention, the load cell 36 corresponds to the load measuring unit, the control unit 40 corresponds to the control unit, the correspondence information 45 corresponds to the correspondence information, and the mounting unit 13 Corresponds to the collection part. In the present embodiment, an example of the component supply method of the present invention is also clarified by describing the operation of the wafer supply unit 30.

In the wafer supply unit 30 of the embodiment described above, the load cell in which the component P (die) obtained by dividing the wafer W is pushed up by the push-up pin 34 (push-up portion) and the load when the component P is pushed up is disposed on the push-up pin 34. The measurement is performed by 36 (load measurement unit), and the amount of operation of the push-up pin 34 is set based on the measured load. Generally, the die obtained by dividing the wafer W is stuck to the die sheet 38, and sampling is performed by pushing up from below. At this time, when a sufficient load is not applied by pushing up from below, it is possible that the stuck component P does not peel off and cannot be collected. In this wafer supply unit 30, a sufficient load can be applied by measurement of the load cell 36, so that the stuck part P can be collected more reliably.

Further, the control unit 40 sets a larger execution amount of the push-up pin 34 when the load measured by the load cell 36 does not reach a predetermined sampling load required to peel off the component P so that the component P can be extracted. A predetermined sampling load can be reached when pushing up. The sampling load is included in the correspondence information 45 associated with at least one of the type of the push-up pin 34 and the die sheet 38 (sticking member), and the control unit 40 acquires the sampling load from the correspondence information 45. . Furthermore, when the load measured by the load cell 36 exceeds the upper limit of the sampling load, the control unit 40 sets a smaller execution operation amount of the push-up pin 34. It can be suppressed more.

Furthermore, the control unit 40 sets a larger operation amount when the measured load does not reach the sampling load in the prior condition setting process performed before the mounting process of the component P, and this setting is performed for the next component P. The process of controlling the push-up pin 34 with the amount of movement performed is repeated, and a series of processes such as measuring the load when the part P is pushed up is repeated, and the amount of movement in which the measured load satisfies the sampling load is set as the execution movement amount. To do. In this apparatus, since an appropriate execution operation amount can be set before the mounting process, it is possible to prepare in advance conditions for more reliably collecting the component P adhered to the die sheet 38. Furthermore, in the mounting process of the component P, when the component P is pushed up by the set execution operation amount and the measured load does not reach the sampling load, the control unit 40 uses the measured load as the sampling load. The amount of movement (movement amount) of the push-up pin 34 is further increased until it is satisfied, and the amount of movement in which the measured load satisfies the sampling load is set as the execution amount of parts sampling after the next time. In this apparatus, since an appropriate amount of execution operation can be set during the mounting process, it is possible to collect the attached components more reliably continuously during the mounting process.

Furthermore, the control unit 40 sets the execution movement amount of the push-up pin 34 as an execution operation amount based on the measured load, and the state of the component P after being pushed up by the push-up pin 34 and collected by the mounting unit 13 Based on the above, the execution movement speed of the push-up pin 34 as the execution operation amount is set. In this apparatus, by setting the amount of movement based on the load, it is possible to collect the attached part P more reliably, and by setting the moving speed based on the state of the part P, Damage and the like can be further suppressed. And the control part 40 is a plurality of the correspondence information 45 in which one or more of the types of the push-up pins 34 and the types of the die sheets 38 (sticking members) to which the parts P are attached are associated with the sampling load. One is selected based on the load measured when the component P is pushed up by the execution motion amount. In this apparatus, since the correspondence information 45 is appropriately selected, the burden on the operator can be further reduced.

Moreover, in the mounting apparatus 11, since the control unit 40 automatically sets the execution amount of the push-up pin 34, troublesome work such as manual setting by the operator is eliminated, and productivity can be further improved.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the pre-condition setting process performed before the mounting process and the execution operation amount of the push-up pin 34 are set during the mounting process, but either one may be omitted. Good. For example, the worker may perform pre-processing, and the control unit 40 may automatically correct during the mounting process. In this apparatus, the component P can be more reliably collected during the mounting process. On the other hand, the control unit 40 may perform pre-processing, and when the operation amount of the push-up pin 34 is not appropriate during the mounting process, the operator may adjust the execution operation amount. In this apparatus, basically, the stuck part P can be more reliably collected according to conditions set in advance.

In the above-described embodiment, the control unit 40 has been described as setting the movement amount and the movement speed as the execution operation amount of the push-up pin 34. However, the present invention is not particularly limited to this, and either one is omitted. Also good. Alternatively, if the movement amount of the push-up pin 34 is set using a load measured by the load cell 36, parameters other than the movement amount and the movement speed may be set. Also in this apparatus, the stuck part P can be collected more reliably.

In the above-described embodiment, the control unit 40 selects the correspondence information 45 based on the mounting job information. However, the present invention is not particularly limited thereto, and selects the correspondence information 45 based on an input from the worker. It may be a thing. The control unit 40 reselects the correspondence information 45 after steps S140 and S160, but may notify the operator of an error. Although the correspondence information 45 has been described as being included in the sheet DB 44, the present invention is not particularly limited thereto, and the correspondence information 45 may exist without being included in the sheet DB 44.

In the above-described embodiment, the execution operation amount is set by the control unit 40 included in the mounting apparatus 11, but the embodiment is not particularly limited thereto. For example, the control unit disposed in the wafer supply unit 30 may set the execution operation amount, or the control unit of the management computer 50 may measure the execution operation amount.

In the above-described embodiment, the present invention has been described as the mounting apparatus 11. However, for example, the wafer supply unit 30 or a component supply method may be used, or a program that a computer executes the above-described processing may be used.

The present invention can be used for an apparatus for performing a mounting process in which components are arranged on a substrate.

10 mounting system, 11 mounting device, 12 substrate transport unit, 13 mounting unit, 14 component supply unit, 15 parts camera, 20 head moving unit, 22 mounting head, 24 suction nozzle, 30 wafer supply unit, 31 wafer pallet, 32 magazine Part, 34 push-up pin (push-up part), 35 pot, 36 load cell (load measurement part), 38 die sheet, 40 control part, 41 CPU, 42 storage part, 44 sheet database (DB), 45 correspondence information, 46 setting program, 50 Management computer (PC), P component, S substrate, W wafer.

Claims

A component supply device used in a mounting apparatus that performs a mounting process of collecting a component by a collecting unit and arranging the collected component on a base material,
A push-up unit that pushes up the component when the component is collected from a wafer that has been divided and adhered to a plurality of components;
A load measuring unit that is disposed on the push-up unit and measures a load when pushing up the component;
A control unit configured to set an amount of movement of the push-up portion based on the measured load;
A component supply device comprising:
2. The component according to claim 1, wherein the control unit sets a larger execution amount of the push-up portion when the measured load does not reach a predetermined sampling load required to peel the component so that the component can be collected. Feeding device.
The said control part sets the execution operation amount of the said raising part smaller when the said measured load exceeds the upper limit of the predetermined | prescribed sampling load required in order to peel off the said components so that extraction is possible. The component supply apparatus described in 1.
In the pre-processing performed before the mounting process of the component, the control unit performs a larger operation of the push-up portion when the measured load does not reach a predetermined sampling load required to peel off the component so that the component can be extracted. A series of processes of setting the amount and controlling the push-up portion with the set operation amount in the next part and measuring the load when pushing up the part is repeated, and the measured load determines the sampling load. The component supply device according to any one of claims 1 to 3, wherein the operation amount to be satisfied is set to the execution operation amount.
In the mounting process of the component, when the component is pushed up by a set execution operation amount, the measured load does not reach a predetermined sampling load that allows the component to be extracted. The operation amount of the push-up portion is further increased until the measured load satisfies the sampling load, and the operation amount at which the measured load satisfies the sampling load is set as an execution operation amount for the subsequent part sampling. The component supply device according to any one of claims 1 to 4.
The control unit sets an execution movement amount of the push-up unit as the execution operation amount based on the measured load, and is based on a state of a part after being pushed up by the push-up unit and sampled by the sampling unit 6. The component supply device according to claim 1, wherein an execution movement speed of the push-up unit is set as the execution operation amount.
The control unit associates one or more of the push-up type and the type of the sticking member for sticking the part with a predetermined sampling load required to peel the part so that the part can be picked up. The component supply apparatus according to any one of claims 1 to 6, wherein one of a plurality of pieces of information is selected based on a load measured when the component is pushed up by the execution operation amount.
The component supply device according to any one of claims 1 to 7,
A sampling unit that samples the component supplied from the component supply device and places the sampled component on a substrate;
Mounting device.
A component supply method used for a mounting process in which a component is sampled by a sampling unit and the collected component is arranged on a substrate.
(A) a step of pushing up the part by a push-up unit when the part is collected from a wafer divided and stuck into a plurality of parts;
(B) a step of measuring a load at the time of pushing up the component by a load measuring unit disposed on the push-up portion;
(C) setting an execution movement amount of the push-up portion based on the measured load;
A part supply method including: